Display panel, display module and display device

Abstract

The invention provides a display panel, a display module and a display device. The problem that in the prior art, OLED display products are low in reliability is solved. The display panel comprises a display area and a bonding area located on at least one side of the display area. The display panel includes: a substrate; the plurality of first conductive structures are located on one side of the substrate and located in the bonding area; the plurality of protection layers are sequentially stacked on the side, away from the substrate, of the first conductive structure; the protective layer comprises a plurality of covering parts, each covering part comprises an opening, and the opening exposes a part of the first conductive structure; the orthographic projection of the covering part on the substrate at least covers the edge area of the orthographic projection of the first conductive structure on the substrate; at least part of the protection layer further comprises a connecting part which is located between the adjacent first conductive structures and is connected with the adjacent covering parts.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display panel, display module, and display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) are considered the next generation of flat panel display technology after liquid crystal displays (LCDs), and are favored by users for their superior color and image quality. However, the reliability of OLED display products still needs improvement. Summary of the Invention

[0003] In view of this, embodiments of this application provide a display panel, a display module, and a display device, which solve the problem of low reliability of OLED display products in the prior art.

[0004] A first aspect of this application provides a display panel including a display area and a bonding area located on at least one side of the display area; the display panel includes: a substrate; a plurality of first conductive structures located on one side of the substrate and in the bonding area; and a plurality of protective layers sequentially stacked on the side of the first conductive structures facing away from the substrate; the protective layers include a plurality of covering portions, each covering portion including an opening that exposes a portion of the first conductive structure; the orthographic projection of the covering portion onto the substrate at least covers the edge region of the orthographic projection of the first conductive structure onto the substrate; at least a portion of the protective layer also includes a connecting portion located between adjacent first conductive structures and connecting adjacent covering portions.

[0005] In conjunction with the first aspect, in some possible implementations, the material of the protective layer corresponding to the connecting part is an inorganic material; preferably, the width of the edge region is greater than or equal to 0.5 micrometers and less than or equal to 6 micrometers.

[0006] In conjunction with the first aspect, in some possible implementations, the multiple protective layers include a first protective layer, which does not include a connecting portion, and the material of the first protective layer is an organic material; preferably, the display panel further includes a planarization layer located in the display area; the planarization layer and the first protective layer are disposed in the same layer; preferably, the planarization layer and the first protective layer are made of the same material.

[0007] In conjunction with the first aspect, in some possible implementations, the multiple protective layers further include a second protective layer located on the side of the first protective layer away from the substrate, and the second protective layer includes a connecting portion; preferably, the second protective layer covers the sidewall of the first protective layer that encloses the opening; preferably, the display panel further includes a touch insulating layer located in the display area; the touch insulating layer and the second protective layer are disposed in the same layer; preferably, the touch insulating layer and the second protective layer are made of the same material.

[0008] In conjunction with the first aspect, in some possible implementations, the first conductive structure includes at least one stacked conductive layer; the display panel further includes at least one sequentially stacked metal layer located in the display area; the conductive layer and the metal layer correspond to each other, and the corresponding conductive layer and metal layer are disposed in the same layer; preferably, at least one of the conductive layers includes a plurality of sequentially stacked conductive layers, and at least one of the metal layers includes a plurality of sequentially stacked metal layers; preferably, the conductive layer and the metal layer are made of the same material; preferably, the plurality of conductive layers includes a first conductive layer; preferably, the plurality of conductive layers further includes a second conductive layer, the first conductive layer is located on the side of the second conductive layer near the substrate, and the second conductive layer at least covers the surface of the first conductive layer away from the substrate and the sidewall of the first conductive layer; preferably, the plurality of conductive layers further includes a third conductive layer, the third conductive layer is located on the side of the second conductive layer away from the substrate, and the third conductive layer at least covers the surface of the second conductive layer away from the substrate and the sidewall of the second conductive layer; preferably, any one of the first conductive layer, the second conductive layer, and the third conductive layer is a titanium-aluminum-titanium stacked structure; preferably, at least a portion of the conductive layer is an ITO / Ag / ITO stacked structure.

[0009] In conjunction with the first aspect, in some possible implementations, the multiple protective layers include a third protective layer and a fourth protective layer, with the fourth protective layer located on the side of the third protective layer away from the substrate; both the third and fourth protective layers include a connecting portion; preferably, the fourth protective layer covers the sidewall of the third protective layer that encloses the opening; preferably, the display panel further includes a pixel definition layer, which is disposed in the same layer as the third protective layer; preferably, the pixel definition layer and the third protective layer are made of the same material; preferably, the display panel further includes a touch insulating layer, which is disposed in the same layer as the fourth protective layer; preferably, the touch insulating layer and the fourth protective layer are made of the same material.

[0010] In conjunction with the first aspect, in some possible implementations, the first conductive structure includes multiple stacked conductive layers; the display panel also includes multiple sequentially stacked metal layers located in the display area; at least some conductive layers and metal layers correspond to each other, and the corresponding conductive layers and metal layers are disposed in the same layer; preferably, the corresponding conductive layers and metal layers are made of the same material.

[0011] In conjunction with the first aspect, in some possible implementations, the plurality of conductive layers includes a first conductive layer; preferably, the plurality of conductive layers further includes a second conductive layer, the first conductive layer being located on the side of the second conductive layer closer to the substrate, and the second conductive layer at least covering the surface of the first conductive layer away from the substrate and the sidewalls of the first conductive layer; preferably, the plurality of conductive layers further includes a third conductive layer located on the side of the second conductive layer away from the substrate; the third conductive layer at least covers the surface of the second conductive layer away from the substrate and the sidewalls of the second conductive layer; preferably, the first conductive layer, the second conductive layer, and the third conductive layer are each in the same layer and made of the same material as a metal layer; preferably, at least one of the first conductive layer, the second conductive layer, and the third conductive layer is a titanium-aluminum-titanium stacked structure.

[0012] In conjunction with the first aspect, in some possible implementations, the plurality of conductive layers further includes a fourth conductive layer located on the side of the third conductive layer away from the substrate; the display panel further includes a first electrode located in the display area; the first electrode and the fourth conductive layer are of the same layer and material; preferably, the fourth conductive layer at least covers the sidewalls of the third conductive layer; preferably, the fourth conductive layer extends to the side of the third conductive layer away from the substrate; preferably, the fourth conductive layer at least covers the sidewalls of the third conductive layer and the surface of the third conductive layer away from the substrate; preferably, the fourth conductive layer is an ITO / Ag / ITO stacked structure.

[0013] In conjunction with the first aspect, in some possible implementations, the display panel further includes a plurality of second conductive structures located on the side of the first conductive structure away from the substrate, with at least a portion of the second conductive structure located within an opening; preferably, at least a portion of the second conductive structure extends from the opening to the protective layer on the side away from the substrate; preferably, the display panel further includes a touch metal layer located in the display area; the touch metal layer and the second conductive structure are of the same layer and material.

[0014] In conjunction with the first aspect, in some possible implementations, the display panel further includes a plurality of metal layers stacked sequentially, the plurality of metal layers including signal lines extending from the display area to the bonding area and electrically connected to the first conductive structure; preferably, the signal lines include at least one of power signal lines, data signal lines, and initialization signal lines.

[0015] In conjunction with the first aspect, in some possible implementations, the display panel further includes an isolation structure and a light-emitting device located at least in the display area; the isolation structure is located on one side of the substrate, and the isolation structure encloses an isolation opening, with at least a portion of the light-emitting device located within the isolation opening; preferably, the light-emitting device includes a stacked first electrode and a light-emitting layer, with the first electrode located on the side of the light-emitting layer closer to the substrate; the isolation opening exposes at least a portion of the first electrode, and the light-emitting layer is located within the isolation opening; preferably, the light-emitting device further includes a second electrode located on the side of the light-emitting layer away from the substrate, and the second electrode overlaps with the isolation structure.

[0016] In conjunction with the first aspect, in some possible implementations, the isolation structure includes a first part and a second part stacked together, the first part being located on the side of the second part closer to the substrate; the orthographic projection of the side of the first part away from the substrate onto the substrate is within the orthographic projection range of the second part onto the substrate; preferably, the isolation structure further includes a third part located on the side of the first part closer to the substrate; the orthographic projection of the first part onto the substrate is within the orthographic projection range of the third part onto the substrate; preferably, the first part includes a conductive part.

[0017] In conjunction with the first aspect, in some possible implementations, the display panel further includes an encapsulation structure located on the side of the light-emitting device away from the substrate; the encapsulation structure includes an encapsulation portion, the orthographic projection of the encapsulation portion on the substrate covering the orthographic projection of the light-emitting device on the substrate; preferably, the encapsulation portion extends from within the isolation opening to the side of the isolation structure away from the substrate; preferably, adjacent encapsulation portions are disconnected on the side of the isolation structure away from the substrate; preferably, the encapsulation structure further includes an organic encapsulation layer, at least partially located on the side of the encapsulation portion and the isolation structure away from the substrate; preferably, the encapsulation structure further includes an inorganic encapsulation layer, located on the side of the organic encapsulation layer away from the substrate, the orthographic projection of the inorganic encapsulation layer on the substrate covering the orthographic projection of the organic encapsulation layer on the substrate.

[0018] In conjunction with the first aspect, in some possible implementations, the display panel also includes a touch layer located on the side of the encapsulation structure away from the substrate and in the display area; the touch layer includes a first touch metal layer, a touch insulating layer and a second touch metal layer stacked sequentially.

[0019] A second aspect of this application provides another display panel, including a display area and a bonding area located on one side of the display area; the display panel includes: a substrate; a plurality of first conductive structures located on one side of the substrate and in the bonding area; and a plurality of protective layers, sequentially stacked on the side of the first conductive structures facing away from the substrate; the protective layers include a plurality of covers, each cover including an opening that exposes a portion of the first conductive structure, the openings of the covers of different protective layers being interconnected; the orthographic projection of the cover onto the substrate at least covers the edge region of the orthographic projection of the first conductive structure onto the substrate; and adjacent covers of at least some of the protective layers are disconnected between adjacent first conductive structures.

[0020] In conjunction with the second aspect, in some possible implementations, the material of the protective layer where adjacent coverings are disconnected is an organic material.

[0021] In conjunction with the second aspect, in some possible implementations, at least part of the protective layer further includes a connecting portion located between adjacent first conductive structures and connecting adjacent covering portions.

[0022] A third aspect of this application provides a display module, including: a display panel provided in any of the above embodiments; and a flexible circuit board electrically connected to a first conductive structure.

[0023] A fourth aspect of this application provides a display device, including the display panel or display module provided in any of the above embodiments. Attached Figure Description

[0024] Figure 1a This is a top view of a display panel provided in an embodiment of this application.

[0025] Figure 1b for Figure 1a A magnified view of a portion of the display panel shown.

[0026] Figure 2 Provided for the first embodiment of this application Figure 1a The diagram shows a cross-sectional view of the display panel along line N1N2.

[0027] Figure 3 Provided for an embodiment of this application Figure 1a The diagram shows a cross-sectional view of the display panel along line N3N4.

[0028] Figure 4 Provided for the second embodiment of this application Figure 1a The diagram shows a cross-sectional view of the display panel along line N1N2.

[0029] Figure 5 Provided for the third embodiment of this application Figure 1a The diagram shows a cross-sectional view of the display panel along line N1N2.

[0030] Figure 6 Provided for the fourth embodiment of this application Figure 1a The diagram shows a cross-sectional view of the display panel along line N1N2.

[0031] Figure 7 Provided for the fifth embodiment of this application Figure 1a The diagram shows a cross-sectional view of the display panel along line N1N2.

[0032] Figure 8 This is a schematic diagram of the structure of a display module provided in an embodiment of this application.

[0033] Figure 9 This is a schematic diagram of the structure of a display device provided in an embodiment of this application. Detailed Implementation

[0034] As mentioned in the background section, the reliability of OLED display products still needs improvement. One reason affecting the reliability of OLED display products is that the bonding area between the display panel and the flexible circuit board is prone to problems such as film separation and bulging, resulting in lower reliability of the display module.

[0035] In view of this, embodiments of this application provide a display panel, a display module, and a display device. By optimizing the structure of the bonding area of ​​the OLED display panel, the risk of problems such as film separation and bulging in the bonding area is reduced, thereby improving the reliability of the display product.

[0036] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0037] In the accompanying drawings, the dimensions of layers and regions may be exaggerated for clarity. It is understood that when a structure is referred to as being "on" or "below" another structure, the structure may be directly on or below the other structure, or there may be intermediate structures. The same reference numerals always indicate the same structure. Structures referred to herein include any of the following: membrane, element, device, component, assembly.

[0038] When a structure is referred to as being “connected” to another structure, it can be directly connected to the other structure or indirectly connected to the other structure by means of one or more intermediate structures placed between them.

[0039] The first aspect of this application provides a display panel. Figure 1a This is a top view of a display panel provided in an embodiment of this application. Figure 1b for Figure 1a A magnified view of a portion of the display panel shown. Figure 2 Provided for the first embodiment of this application Figure 1a The diagram shows a cross-sectional view of the display panel along line N1N2. (Combined with...) Figure 1a , Figure 1b and Figure 2 As shown, the display panel includes a display area AA and a bonding area BA located on at least one side of the display area AA.

[0040] Specifically, the display panel includes a substrate 11, a plurality of first conductive structures 121, and a plurality of protective layers 13. The plurality of first conductive structures 121 are located on one side of the substrate 11 and are situated in the bonding region BA. The plurality of protective layers 13 are sequentially stacked on the side of the first conductive structures 121 facing away from the substrate 11. Each protective layer 13 includes a plurality of covering portions 131, each covering portion having an opening that exposes a portion of the first conductive structure 121. The openings of the covering portions 131 of different protective layers 13 are interconnected. The orthographic projection of the covering portion 131 onto the substrate 11 at least covers the edge region of the orthographic projection of the first conductive structure 121 onto the substrate 11. At least a portion of the protective layer 13 also includes a connecting portion 132 located between adjacent first conductive structures 121 and connecting adjacent covering portions 131. The orthographic projection of the connecting portion 132 onto the substrate lies between the orthographic projections of adjacent first conductive structures 121 onto the substrate 11, and the connecting portion 132 connects to adjacent covering portions 131, such that the connecting portion 132 and the covering portion 131 form an integral structure. For example, the material of the protective layer 13 corresponding to the connecting part 132 is an inorganic material.

[0041] The substrate 11 may be a glass substrate. In some embodiments, the substrate 11 may include an organic resin material such as epoxy resin, triazine, silicone resin, or polyimide. For example, the substrate 11 may be an FR4 type printed circuit board (PCB), or a flexible PCB that is easily deformable. In some embodiments, the substrate 11 may include a ceramic material such as silicon nitride, aluminum nitride, or aluminum oxide, or may include a metal or metal compound.

[0042] In one embodiment, the orthographic projection of the cover portion 131 onto the substrate 11 at least covers the edge region of the orthographic projection of the first conductive structure 121 onto the substrate 11. The width of this edge region is greater than or equal to 0.5 micrometers and less than or equal to 6 micrometers. Here, the width refers to the length in the direction from the centroid of the first conductive structure 121 towards the edge. For example, the width of the edge region can be 1 micrometer, 1.5 micrometers, 2 micrometers, 2.5 micrometers, 3 micrometers, 3.5 micrometers, 4 micrometers, 4.5 micrometers, 5 micrometers, 5.5 micrometers, etc.

[0043] The first conductive structure 121 is also called a conductive pad or solder pad. The first conductive structure 121 serves as an external terminal of the display panel, electrically connected to the external circuit structure of the display panel to receive electrical signals from the external circuit structure, or to transmit internal electrical signals of the display panel.

[0044] The protective layer 13 is used to provide protection for the first conductive structure 121. For example, some protective layers 13 are used to protect the first conductive structure 121 from etching damage during the fabrication of the display panel. Each protective layer 13 includes a plurality of covers 131, each cover 131 corresponding to a first conductive structure 121. Each cover 131 includes an opening that exposes a portion of the first conductive structure 121. The openings of the covers 131 of different protective layers 13 are interconnected to form a window on the side of the first conductive structure 121 facing away from the substrate, thereby exposing a portion of the first conductive structure 121.

[0045] Depending on the material, the multiple protective layers 13 may include organic and inorganic protective layers; that is, some protective layers 13 are made of organic materials, while others are made of inorganic materials. In the organic protective layer, adjacent covering portions 131 are disconnected between adjacent first conductive structures 121, while the inorganic protective layer, in addition to the covering portions 131, also includes connecting portions 132 located between adjacent first conductive structures 121, connecting the adjacent covering portions 131. In other words, no organic protective layer is provided between adjacent first conductive structures 121, but an inorganic protective layer can be provided.

[0046] For example, such as Figure 2 As shown, the plurality of protective layers 13 includes a first protective layer 1301. The first protective layer 1301 does not include the connecting portion 132, and the material of the first protective layer 1301 is an organic material. That is, the first protective layer 1301 made of organic material is provided around the periphery of the first conductive structure 121, and the portion of the area between the first conductive structures 121 is not provided with the first protective layer 1301 made of organic material. For example, the first protective layer 1301 is the protective layer 13 closest to the substrate 11 among the plurality of protective layers 13, and the first protective layer 1301 is in contact with the first conductive structure 121.

[0047] For example, such as Figure 2 As shown, the plurality of protective layers 13 also includes a second protective layer 1302, which is located on the side of the first protective layer 1301 away from the substrate 11. The second protective layer 1302 includes a connecting portion 132, and the material of the second protective layer 1302 is an inorganic material. Exemplarily, the second protective layer 1302 covers the sidewall of the opening formed by the first protective layer 1301. In this way, the second protective layer 1302 can provide protection for the sidewall of the first protective layer 1301.

[0048] Figure 3 Provided for an embodiment of this application Figure 1a The diagram shows a cross-sectional view of the display panel along line N3N4. (Combined with...) Figure 3 and Figure 2As shown, the display panel includes a planarization layer 36, which is located in the display area AA. The planarization layer 36 and the first protective layer 1301 are disposed in the same layer and / or made of the same material.

[0049] It should be noted that the display panel may include multiple planarization layers 36, and the first protective layer 1301 may be of the same layer and material as any of the planarization layers 36.

[0050] The display panel also includes a touch insulating layer 342 located in the display area AA. The touch insulating layer 342 is disposed in the same layer as the second protective layer 1302 and / or made of the same material.

[0051] The first conductive structure 121 includes at least one conductive layer. The display panel also includes at least one metal layer located in the display area AA. The conductive layer and the metal layer correspond to each other, and the corresponding conductive layer and metal layer are disposed in the same layer and / or made of the same material.

[0052] For example, the first conductive structure 121 includes a plurality of conductive layers stacked sequentially. The display panel also includes a plurality of metal layers stacked sequentially. For example, the display panel includes a first metal layer M1, a second metal layer M2, a third metal layer M3, a fourth metal layer M4, and a fifth metal layer M5 stacked sequentially in a direction away from the substrate 11. The first conductive structure 121 includes a first conductive layer 1211, a second conductive layer 1212, and a third conductive layer 1213 stacked sequentially. The first conductive layer 1211 and the third metal layer M3 are in the same layer and made of the same material, the second conductive layer 1212 and the fourth metal layer M4 are in the same layer and made of the same material, and the third conductive layer 1213 and the fifth metal layer M5 are in the same layer and made of the same material.

[0053] In one embodiment, the second conductive layer 1212 at least covers the surface of the first conductive layer 1211 away from the substrate 11 and the sidewalls of the first conductive layer 1211.

[0054] In one embodiment, the third conductive layer 1213 at least covers the surface of the second conductive layer 1212 away from the substrate 11 and the sidewalls of the second conductive layer 1212.

[0055] In one embodiment, at least one of the first conductive layer, the second conductive layer, and the third conductive layer is a titanium-aluminum-titanium stacked structure.

[0056] In one embodiment, at least a portion of the conductive layer is an ITO / Ag / ITO stacked structure. For example, the first conductive layer 1211, the second conductive layer 1212, and the third conductive layer 1213 are all ITO / Ag / ITO stacked structures.

[0057] According to the display panel provided in this embodiment, at least one protective layer is provided to surround the first conductive structure, thereby protecting the first conductive structure and preventing side etching during the display panel manufacturing process. Furthermore, by using an inorganic material for the protective layer corresponding to the connection portion, meaning that at least a portion of the area between adjacent first conductive structures 121 lacks an organic protective layer, problems such as water absorption, bulging, and film separation of the organic protective layer between adjacent first conductive structures 121 are avoided during display panel manufacturing processes, such as cleaning, exposure, development, dry etching, wet etching, and glass etching, thus improving the reliability of the display panel.

[0058] Figure 4 Provided for the second embodiment of this application Figure 1a The diagram shows a cross-sectional view of the display panel along line N1N2. Figure 3 The display panel shown and Figure 2 The difference in the display panel shown is that, in this embodiment, the display panel further includes a plurality of second conductive structures 122. The second conductive structures 122 are located on the side of the first conductive structure 121 facing away from the substrate 11, and at least a portion of the second conductive structures 122 are located within the opening. The second conductive structures 122 and the first conductive structures 121 correspond one-to-one, and the corresponding second conductive structures 122 and the first conductive structures 121 constitute conductive pads or solder pads.

[0059] For example, at least a portion of the second conductive structure 122 extends from the opening to the protective layer 13 on the side away from the substrate 11. This increases the area of ​​the second conductive structure 122, facilitating subsequent bonding with external circuit structures.

[0060] According to the display panel provided in this embodiment, the entire first conductive structure 121 and the second conductive structure 122 are used as conductive pads 12 or solder pads, which increases the thickness of the conductive pads and solder pads, thereby reducing resistance and reducing electrical signal loss.

[0061] In one embodiment, combined Figure 3 and Figure 4 As shown, Figure 4The fabrication process of the display panel shown includes: growing and patterning a semiconductor material on a substrate 11, and forming a first semiconductor layer in the display area AA. The first semiconductor layer can be a silicon semiconductor layer or an oxide semiconductor layer. A first insulating layer is fabricated on the side of the first semiconductor layer away from the substrate 11. A metal material is deposited and patterned on the side of the first insulating layer away from the substrate 11, forming a first metal layer M1 in the display area AA. A second insulating layer is fabricated on the side of the first metal layer M1 away from the substrate 11. A metal material is deposited and patterned on the side of the second insulating layer away from the substrate 11, forming a second metal layer M2 in the display area AA. A third insulating layer is fabricated on the side of the second metal layer M2 away from the substrate 11. A second semiconductor layer is fabricated on the side of the third insulating layer away from the substrate 11 in the display area AA. The second semiconductor layer can be a silicon semiconductor layer or an oxide semiconductor material layer. A fourth insulating layer is fabricated on the side of the second semiconductor layer away from the substrate 11. A metal material is deposited and patterned on the side of the fourth insulating layer away from the substrate, forming a third metal layer M3 in the display area AA, while a first conductive layer 1211 of a first conductive structure 12 is formed in the bonding area BA. A fifth insulating layer is formed on the side of the third metal layer M3 facing away from the substrate 11. Metal material is deposited and patterned on the side of the fifth insulating layer facing away from the substrate 11, forming a fourth metal layer M4 in the display area AA, and simultaneously forming a second conductive layer 1212 of the first conductive structure 12 in the bonding area BA. A planarization material is coated and patterned on the side of the fourth metal layer M4 facing away from the substrate 11, forming a first planarization layer in the display area AA. Metal material is deposited and patterned on the side of the first planarization layer facing away from the substrate 11, forming a fifth metal layer M5 in the display area AA, and simultaneously forming a third conductive layer 1213 of the first conductive structure 12 in the bonding area BA. A planarization material is coated and patterned on the side of the fifth metal layer M5 facing away from the substrate 11, forming a second planarization layer in the display area AA, and simultaneously forming a first protective layer 1301 in the bonding area BA. The first protective layer 1301 includes a cover portion 131 but does not include a connecting portion 132. Electrode material is evaporated and patterned on the side of the second planarization layer away from the substrate 11, forming a first electrode Ad in the display area AA. A pixel definition material is deposited and patterned on the side of the first electrode Ad away from the substrate 11 to form a pixel definition layer 35 located in the display area AA. An isolation structure 31 is fabricated in the display area AA on the side of the pixel definition layer 35 away from the substrate 11. A light-emitting layer Eml and a second electrode Cth are fabricated within the isolation opening enclosed by the isolation structure 31. An encapsulation portion 331 is fabricated on the side of the second electrode Cth away from the substrate 11. An organic encapsulation layer 332 is fabricated on the side of the encapsulation portion 331 and the isolation structure 31 away from the substrate 11. The organic encapsulation layer 332 extends out of the display area AA and terminates between the display area AA and the bonding area BA. An inorganic encapsulation layer 333 is fabricated on the side of the organic encapsulation layer 332 away from the substrate 11. The inorganic encapsulation layer extends out of the display area AA and terminates between the display area AA and the bonding area BA, and covers the organic encapsulation layer 332.Metal material is deposited and patterned on the side of the inorganic encapsulation layer 333 away from the substrate 11 to form a first touch metal layer 341 located in the display area AA. An insulating material is deposited and patterned on the side of the first touch metal layer 341 away from the substrate 11 to form a touch insulating layer 342 located in the display area AA and a second protective layer 1302 located in the bonding area BA. Metal material is deposited and patterned on the side of the touch insulating layer 342 away from the substrate 11 to form a second touch metal layer 343 located in the display area AA and a second conductive structure 122 located in the bonding area BA.

[0062] Figure 5 Provided for the third embodiment of this application Figure 1a The diagram shows a cross-sectional view of the display panel along line N1N2. Figure 5 As shown, in this embodiment, the plurality of protective layers 13 include a third protective layer 1303 and a fourth protective layer 1304, with the fourth protective layer 1304 located on the side of the third protective layer 1303 away from the substrate 11. Both the third protective layer 1303 and the fourth protective layer 1304 include connecting portions 132. That is, the third protective layer 1303 includes a plurality of covering portions 131 and connecting portions 132 connecting adjacent covering portions 131, and the fourth protective layer 1304 includes a plurality of covering portions 131 and connecting portions 132 connecting adjacent covering portions 131. Accordingly, the materials of the third protective layer 1303 and the fourth protective layer 1304 are both inorganic materials.

[0063] It should be noted that the numbering of protective layers 13 is only for differentiation and does not constitute a limitation on the number of protective layers 13. For example, the third protective layer 1303 mentioned in this embodiment is not limited to being the third protective layer, and the fourth protective layer 1304 is not limited to being the fourth protective layer. For example, Figure 5 The display panel shown includes only two protective layers, namely the third protective layer 1303 and the fourth protective layer 1304.

[0064] In one embodiment, the fourth protective layer 1304 covers the sidewall of the opening enclosed by the third protective layer 1303, that is, the fourth protective layer 1304 covers the sidewall of the opening corresponding to the third protective layer 1303.

[0065] In one embodiment, combined Figure 5 and Figure 3 As shown, the display panel also includes a pixel definition layer 35, which is disposed on the same layer as the third protective layer 1303 and / or made of the same material.

[0066] In one embodiment, combined Figure 5 and Figure 3 As shown, the display panel also includes a touch insulating layer 342, which is disposed in the same layer as the fourth protective layer 1304 and / or made of the same material.

[0067] Combination Figure 5 and Figure 3 As shown, the first conductive structure 121 includes multiple stacked conductive layers. The display panel also includes multiple sequentially stacked metal layers located in the display area AA. At least some of the conductive layers and metal layers correspond to each other, and the corresponding conductive layers and metal layers are disposed in the same layer and / or made of the same material.

[0068] In one embodiment, the plurality of conductive layers includes a first conductive layer 1211.

[0069] In one embodiment, the plurality of conductive layers further includes a second conductive layer 1212, and a first conductive layer 1211 is located on the side of the second conductive layer 1212 close to the substrate 11. The second conductive layer 1212 at least covers the surface of the first conductive layer 1211 away from the substrate 11 and the sidewalls of the first conductive layer 1211.

[0070] In one embodiment, the plurality of conductive layers further includes a third conductive layer 1213, wherein the second conductive layer 1212 is located on the side of the third conductive layer 1213 near the substrate 11, that is, the third conductive layer 1213 is located on the side of the second conductive layer 1212 away from the substrate 11. The third conductive layer 1213 at least covers the surface of the second conductive layer 1212 away from the substrate 11 and the sidewalls of the second conductive layer 1212.

[0071] For example, the display panel includes a first metal layer M1, a second metal layer M2, a third metal layer M3, a fourth metal layer M4, and a fifth metal layer M5 stacked sequentially in a direction away from the substrate 11. The first conductive layer 1211 and the third metal layer M3 are in the same layer and made of the same material, the second conductive layer 1212 and the fourth metal layer M4 are in the same layer and made of the same material, and the third conductive layer 1213 and the fifth metal layer M5 are in the same layer and made of the same material.

[0072] In one embodiment, at least one of the first conductive layer 1211, the second conductive layer 1212, and the third conductive layer 1213 is a titanium-aluminum-titanium stacked structure. For example, the first conductive layer 1211, the second conductive layer 1212, and the third conductive layer 1213 are all titanium-aluminum-titanium stacked structures.

[0073] In one embodiment, combined Figure 3 and Figure 5 As shown, Figure 5 The manufacturing process of the display panel shown is as follows: Figure 4 The difference in the manufacturing process of the display panels shown is as follows:

[0074] First, in the step of coating and patterning a planarization material on the side of the fifth metal layer M5 away from the substrate 11, a second planarization layer is formed in the display area AA, and all the planarization material in the bonding area BA is removed.

[0075] Second, in the step of depositing and patterning pixel definition material on the side of the first electrode Ad away from the substrate 11, a pixel definition layer 35 is formed in the display area AA, and a third protective layer 1303 is formed in the bonding area BA.

[0076] Third, an insulating material is deposited and patterned on the side of the first touch metal layer 341 away from the substrate 11 to form a touch insulating layer 342 located in the display area AA and a fourth protective layer 1304 located in the bonding area BA.

[0077] Figure 6 Provided for the fourth embodiment of this application Figure 1a The diagram shows a cross-sectional view of the display panel along line N1N2. Figure 6 The display panel shown and Figure 5 The difference in the display panel shown is that, in this embodiment, the plurality of conductive layers further includes a fourth conductive layer 1214, located on the side of the third conductive layer 1213 away from the substrate 11. The display panel also includes a first electrode Ad, located in the display area AA. The first electrode Ad and the fourth conductive layer 1214 are of the same layer and material. For example, the fourth conductive layer 1214 at least covers the sidewalls of the third conductive layer 1213.

[0078] In one embodiment, the fourth conductive layer 1214 extends from the sidewall of the third conductive layer 1213 to the side of the third conductive layer 1213 away from the substrate 11.

[0079] In one embodiment, the fourth conductive layer 1214 is an ITO / Ag / ITO stacked structure.

[0080] Figure 7 Provided for the fifth embodiment of this application Figure 1a The diagram shows a cross-sectional view of the display panel along line N1N2. Figure 7 The display panel shown and Figure 6 The difference in the display panel shown is that, in this embodiment, the fourth conductive layer 1214 at least covers the sidewalls of the third conductive layer 1213 and the surface of the third conductive layer 1213 away from the substrate 11. This configuration also allows the fourth conductive layer 1214 to protect the third conductive layer 1213 from etching damage, thereby improving the reliability of the display panel.

[0081] In one embodiment, combined Figure 3 , Figure 6 and Figure 7 As shown, Figure 6 and Figure 7 The manufacturing process of the display panel shown is as follows: Figure 5 The difference in the manufacturing process of the display panels shown is as follows:

[0082] In the step of depositing electrode material and patterning the second planarization layer on the side away from the substrate 11, while the first electrode Ad is formed in the display area AA, the fourth conductive layer 1214 is formed in the bonding area BA.

[0083] It should be noted that, Figure 6 and Figure 7 The manufacturing process of the display panel shown is as follows: Figure 5 The same steps are used in the fabrication of the display panel shown, and will not be repeated here. For relevant details, please refer to [link to relevant documentation]. Figure 5 The manufacturing process of the display panel is shown.

[0084] The display area AA structure of the display panel provided in any of the above embodiments can be the same. The following is in conjunction with... Figure 3 The structure of the display area AA will be explained in detail.

[0085] like Figure 3 As shown, the display panel also includes multiple metal layers stacked sequentially. The multiple metal layers include signal lines that extend from the display area AA to the bonding area BA and are electrically connected to the first conductive structure 121.

[0086] For example, the display panel includes a first metal layer M1, a second metal layer M2, a third metal layer M3, a fourth metal layer M4, and a fifth metal layer M5 stacked sequentially in a direction away from the substrate 11. The fifth metal layer M5 includes signal lines that extend to the bonding region BA and are electrically connected to the first conductive structure 121.

[0087] For example, the signal line includes at least one of a power signal line, a data signal line, and an initialization signal line.

[0088] The multiple metal layers also include pixel circuitry 20. Pixel circuitry 20 can be a 7T1C pixel circuit, an 8T1C pixel circuit, etc. Pixel circuitry 20 is electrically connected to signal lines, which are used to transmit external electrical signals to pixel circuitry 20.

[0089] like Figure 3 As shown, the display panel also includes an isolation structure 31 and a light-emitting device 32 located at least in the display area AA. The isolation structure 31 is located on one side of the substrate 11. The isolation structure 31 encloses an isolation opening, and at least a portion of the light-emitting device 32 is located within the isolation opening.

[0090] The light-emitting device 32 can be an organic light-emitting diode (OLED), a micro light-emitting diode (Micro LED), a quantum dot light-emitting diode (QLED), etc. The light-emitting device 32 can be a light-emitting device of various colors, such as a red light-emitting device R, a green light-emitting device G, a blue light-emitting device B, etc.

[0091] The light-emitting device 32 includes a first electrode Ad and a light-emitting layer Eml stacked together, with the first electrode Ad located on the side of the light-emitting layer Eml closer to the substrate 11. An isolation opening exposes at least a portion of the first electrode Ad, and the light-emitting layer Eml is located within the isolation opening. The light-emitting device 32 also includes a second electrode Cth located on the side of the light-emitting layer Eml away from the substrate 11, and the second electrode Cth overlaps with the isolation structure 31. Exemplarily, the first electrode Ad is an anode, and the second electrode Cth is a cathode. Exemplarily, the light-emitting device 32 may further include at least one of a hole injection layer, a hole transport layer, and an electron blocking layer located between the anode and the light-emitting layer Eml, and at least one of an electron injection layer, an electron transport layer, and a hole blocking layer located between the cathode and the light-emitting layer Eml.

[0092] The isolation structure 31 serves to isolate the film layer above it. In this embodiment, the isolation structure 31 includes a first part 311 and a second part 312 stacked together. The first part 311 is located on the side of the second part 312 closer to the substrate 11, and the orthographic projection of the side of the first part 311 away from the substrate 11 onto the substrate 11 is within the orthographic projection range of the second part 312 onto the substrate 11. In this case, the cross-sectional shape of the isolation structure 31 is an inverted trapezoid. Exemplarily, the first part 311 can be designed as an independent film layer, that is, there is no physical interface inside the first part 311, and each part is made of the same material. Alternatively, the first part 311 can be designed as being composed of at least two film layers stacked together. For example, the first part 311 is formed by stacking two conductive film layers. The materials of the two conductive film layers can be molybdenum and aluminum, respectively, and the conductive film layer made of molybdenum is located between the substrate 11 and the conductive film layer made of aluminum. The material of the second part 312 can be an organic material, an inorganic material, or a metallic material. If the second part 312 is a metallic material, the material of the second part 312 can be titanium. In one embodiment, the first part 311 includes a conductive part. For example, the first part 311 may be an entirely conductive structure or a portion thereof.

[0093] For example, the cross-sectional shape of the isolation structure 31 can also be an inverted trapezoid. The isolation structure 31 can be an independent membrane layer, that is, there is no physical interface inside the isolation structure 31, and all parts are made of the same material.

[0094] For example, the isolation structure 31 may further include a third portion 313 located on the side of the first portion 311 closer to the substrate 11. The orthographic projection of the first portion 311 onto the substrate 11 lies within the orthographic projection range of the third portion 313 onto the substrate 11. For example, the cross-sectional shape of the isolation structure 31 is I-shaped. For example, the material of the third portion 313 may be molybdenum.

[0095] The composition and preparation of the isolation structure 31 are further described in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, and PCT / CN2024 / 099072, the contents of which are incorporated herein by reference.

[0096] like Figure 3 As shown, the display panel also includes an encapsulation structure 33 located on the side of the light-emitting device 32 away from the substrate 11. The encapsulation structure 33 includes an encapsulation portion 331, the orthographic projection of the encapsulation portion 331 on the substrate 11 covering the orthographic projection of the light-emitting device 32 on the substrate 11. Exemplarily, the material of the encapsulation portion 331 is an inorganic material.

[0097] In one embodiment, the encapsulation portion 331 extends from the isolation opening to the side of the isolation structure 31 opposite to the substrate 11.

[0098] In one embodiment, the adjacent package portion 331 is disconnected on the side of the isolation structure 31 away from the substrate 11.

[0099] In one embodiment, the encapsulation structure 33 further includes an organic encapsulation layer 332, which is at least partially located on the side of the encapsulation portion 331 and the isolation structure 31 away from the substrate 11.

[0100] In one embodiment, the encapsulation structure 33 further includes an inorganic encapsulation layer 333 located on the side of the organic encapsulation layer 332 away from the substrate 11, and the orthogonal projection of the inorganic encapsulation layer 333 on the substrate 11 covers the orthogonal projection of the organic encapsulation layer 332 on the substrate 11.

[0101] like Figure 3 As shown, the display panel also includes a touch layer 34, located on the side of the encapsulation structure 33 away from the substrate 11, and located in the display area AA. The touch layer 34 includes a first touch metal layer 341, a touch insulating layer 342, and a second touch metal layer 343 stacked sequentially.

[0102] like Figure 3As shown, the display panel may further include a pixel definition layer 35 located on the side of the isolation structure 31 near the substrate 11. The pixel definition layer 35 encloses a pixel opening, which is connected to the isolation opening. The pixel opening exposes at least a portion of the first electrode Ad.

[0103] The second aspect of this application provides an alternative display panel. See [link / reference] Figures 1a-7 At least one of the following is true: the display panel includes a display area AA and a bonding area BA located on one side of the display area. The display panel includes: a substrate 11, a plurality of first conductive structures 121, and a plurality of protective layers 13. The first conductive structures 121 are located on one side of the substrate 11 and in the bonding area BA. The plurality of protective layers 13 are sequentially stacked on the side of the first conductive structures 121 facing away from the substrate 11. Each protective layer 13 includes a plurality of covering portions 131, each covering portion 131 including an opening that exposes a portion of the first conductive structure 121, and the openings of the covering portions 131 of different protective layers 13 are connected. The orthographic projection of the covering portion 131 onto the substrate 11 at least covers the edge region of the orthographic projection of the first conductive structure 121 onto the substrate 11. At least some adjacent covering portions 131 of the protective layers 13 are disconnected between adjacent first conductive structures 121.

[0104] In one embodiment, the material of the protective layer 13 that is disconnected from the adjacent cover 131 is an organic material.

[0105] In one embodiment, at least a portion of the protective layer 13 further includes a connecting portion 132 located between adjacent first conductive structures 121 and connected to adjacent covering portions 131. Related technical details of this embodiment can be found in the display panel provided in any of the above embodiments.

[0106] It should be noted that the display panel provided in this embodiment and the display panels provided in any of the above embodiments belong to the same inventive concept. The display panel provided in this embodiment is intended to protect the same inventive concept from a different perspective than the display panels provided in any of the above embodiments. Technical details not described in this embodiment can be found in the relevant embodiments described above, and will not be repeated here.

[0107] A third aspect of this application provides a display module. Figure 8 This is a schematic diagram of the structure of a display module provided in one embodiment of this application. Figure 8 As shown, the display module includes a display panel 10 and a flexible circuit board 40 provided in any of the above embodiments. The flexible circuit board 40 is electrically connected to the first conductive structure 121 in the display panel 10.

[0108] The flexible circuit board 40 is bonded to the first conductive structure 121. The flexible circuit board 40 is used to transmit external electrical signals to the display panel to drive the display panel 10 to display.

[0109] In one embodiment, the display panel further includes a second conductive structure 122 located on the side of the first conductive structure 121 away from the substrate 11. At least a portion of the second conductive structure 122 is located within an opening to contact the first conductive structure 121. In this case, the flexible circuit board 40 contacts the second conductive structure 122 to establish an electrical connection between the flexible circuit board 40 and the first conductive structure 121.

[0110] The fourth aspect of this application provides a display device. Figure 9 This is a schematic diagram of the structure of a display device provided in an embodiment of this application. Figure 9 As shown, the display device 900 includes the display panel or display module provided in any of the above embodiments.

[0111] Display device 900 is a product with image display capabilities. For example, display device 900 can be used to display static images, such as pictures or photographs. Display device 900 can also be used to display moving images, such as videos.

[0112] Display device 900 can be a laptop, mobile phone, handheld or portable computer, camera, camcorder, in-vehicle smart central control screen, calculator, smartwatch, GPS navigator, electronic photo, electronic billboard or sign, projector, etc.

[0113] In addition, the display device 900 can also perform functions such as taking photos, recording videos, fingerprint recognition, and facial recognition. Accordingly, the display device 900 also includes at least one functional module for implementing the above functions, such as an under-display camera or an under-display fingerprint recognition sensor.

[0114] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0115] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A display panel, characterized in that, The display panel includes a display area and a bonding area located on at least one side of the display area; the display panel includes: Substrate; A plurality of first conductive structures are located on one side of the substrate and in the bonding region; and Multiple protective layers are stacked sequentially on the side of the first conductive structure facing away from the substrate; each protective layer includes multiple covering portions, each covering portion including an opening that exposes a portion of the first conductive structure; the orthographic projection of the covering portion on the substrate at least covers the edge region of the orthographic projection of the first conductive structure on the substrate; at least a portion of the protective layer also includes connecting portions located between adjacent first conductive structures and connecting adjacent covering portions.

2. The display panel according to claim 1, characterized in that, The material of the protective layer corresponding to the connecting part is an inorganic material; Preferably, the width of the edge region is greater than or equal to 0.5 micrometers and less than or equal to 6 micrometers.

3. The display panel according to claim 1, characterized in that, The plurality of protective layers include a first protective layer, the first protective layer not including the connecting portion, and the material of the first protective layer is an organic material; Preferably, the display panel further includes a planarization layer, which is located in the display area; the planarization layer and the first protective layer are disposed on the same layer. Preferably, the planarization layer and the first protective layer are made of the same material.

4. The display panel according to claim 3, characterized in that, The plurality of protective layers further include a second protective layer located on the side of the first protective layer away from the substrate, and the second protective layer includes the connecting portion; Preferably, the second protective layer covers the sidewall of the opening enclosed by the first protective layer; Preferably, the display panel further includes a touch insulating layer located in the display area; the touch insulating layer and the second protective layer are disposed in the same layer; Preferably, the touch insulating layer and the second protective layer are made of the same material.

5. The display panel according to claim 3 or 4, characterized in that, The first conductive structure includes at least one conductive layer; the display panel further includes at least one metal layer located in the display area; the conductive layer and the metal layer are disposed in the same layer. Preferably, at least one of the conductive layers comprises a plurality of conductive layers stacked sequentially, and at least one of the metal layers comprises a plurality of metal layers stacked sequentially; Preferably, the conductive layer and the metal layer are made of the same material; Preferably, the plurality of conductive layers include a first conductive layer; Preferably, the plurality of conductive layers further includes a second conductive layer, wherein the first conductive layer is located on the side of the second conductive layer closer to the substrate, and the second conductive layer at least covers the surface of the first conductive layer away from the substrate and the sidewall of the first conductive layer; Preferably, the plurality of conductive layers further includes a third conductive layer, the third conductive layer being located on the side of the second conductive layer away from the substrate, the third conductive layer at least covering the surface of the second conductive layer away from the substrate and the sidewalls of the second conductive layer; Preferably, at least one of the first conductive layer, the second conductive layer, and the third conductive layer is a titanium-aluminum-titanium stacked structure; Preferably, at least a portion of the conductive layer is an ITO / Ag / ITO stacked structure.

6. The display panel according to claim 1, characterized in that, The plurality of protective layers include a third protective layer and a fourth protective layer, wherein the fourth protective layer is located on the side of the third protective layer away from the substrate; both the third and fourth protective layers include the connecting portion; Preferably, the fourth protective layer covers the sidewall of the opening enclosed by the third protective layer; Preferably, the display panel further includes a pixel definition layer, and the pixel definition layer and the third protective layer are disposed on the same layer; Preferably, the pixel definition layer and the third protective layer are made of the same material; Preferably, the display panel further includes a touch insulating layer, and the touch insulating layer and the fourth protective layer are disposed in the same layer; Preferably, the touch insulating layer and the fourth protective layer are made of the same material.

7. The display panel according to claim 6, characterized in that, The first conductive structure includes multiple conductive layers stacked on top of each other; the display panel also includes multiple metal layers stacked on top of each other in sequence, the metal layers being located in the display area; at least some of the conductive layers and the metal layers correspond to each other, and the corresponding conductive layers and the metal layers are disposed in the same layer; Preferably, the corresponding conductive layer and the corresponding metal layer are made of the same material.

8. The display panel according to claim 7, characterized in that, The plurality of conductive layers include a first conductive layer; Preferably, the plurality of conductive layers further includes a second conductive layer, wherein the first conductive layer is located on the side of the second conductive layer closer to the substrate, and the second conductive layer at least covers the surface of the first conductive layer away from the substrate and the sidewall of the first conductive layer; Preferably, the plurality of conductive layers further includes a third conductive layer located on the side of the second conductive layer away from the substrate; the third conductive layer at least covers the surface of the second conductive layer away from the substrate and the sidewalls of the second conductive layer; Preferably, the first conductive layer, the second conductive layer, and the third conductive layer are each made of the same material as the metal layer. Preferably, at least one of the first conductive layer, the second conductive layer, and the third conductive layer is a titanium-aluminum-titanium stacked structure.

9. The display panel according to claim 8, characterized in that, The plurality of conductive layers further include a fourth conductive layer located on the side of the third conductive layer away from the substrate; the display panel further includes a first electrode located in the display area; the first electrode and the fourth conductive layer are of the same layer and material; Preferably, the fourth conductive layer at least covers the sidewalls of the third conductive layer; Preferably, the fourth conductive layer extends to the side of the third conductive layer away from the substrate; Preferably, the fourth conductive layer at least covers the sidewalls of the third conductive layer and the surface of the third conductive layer away from the substrate; Preferably, the fourth conductive layer is an ITO / Ag / ITO stacked structure.

10. The display panel according to claim 1, characterized in that, It also includes a plurality of second conductive structures, the second conductive structures being located on the side of the first conductive structure away from the substrate, and at least a portion of the second conductive structures being located within the opening; Preferably, at least a portion of the second conductive structure extends from the opening to the protective layer on the side away from the substrate; Preferably, the display panel further includes a touch metal layer located in the display area; the touch metal layer and the second conductive structure are of the same layer and material.

11. The display panel according to claim 1, characterized in that, The display panel further includes a plurality of metal layers stacked sequentially, the plurality of metal layers including signal lines, the signal lines extending from the display area to the bonding area and electrically connected to the first conductive structure; Preferably, the signal line includes at least one of a power signal line, a data signal line, and an initialization signal line.

12. The display panel according to claim 1, characterized in that, It also includes at least an isolation structure and a light-emitting device located in the display area; the isolation structure is located on one side of the substrate, the isolation structure encloses an isolation opening, and at least a portion of the light-emitting device is located within the isolation opening; Preferably, the light-emitting device includes a first electrode and a light-emitting layer stacked together, wherein the first electrode is located on the side of the light-emitting layer closer to the substrate; The isolation opening exposes at least a portion of the first electrode, and the light-emitting layer is located within the isolation opening; Preferably, the light-emitting device further includes a second electrode located on the side of the light-emitting layer away from the substrate, and the second electrode overlaps with the isolation structure.

13. The display panel according to claim 12, characterized in that, The isolation structure includes a first part and a second part stacked together, the first part being located on the side of the second part closer to the substrate; the orthographic projection of the side of the first part away from the substrate onto the substrate is within the orthographic projection range of the second part onto the substrate; Preferably, the isolation structure further includes a third part located on the side of the first part closer to the substrate; the orthographic projection of the first part on the substrate is within the orthographic projection range of the third part on the substrate; Preferably, the first part includes a conductive part.

14. The display panel according to claim 12 or 13, characterized in that, It also includes a packaging structure located on the side of the light-emitting device away from the substrate; the packaging structure includes a packaging portion, the orthographic projection of the packaging portion on the substrate covering the orthographic projection of the light-emitting device on the substrate; Preferably, the encapsulation portion extends from within the isolation opening to the side of the isolation structure opposite to the substrate; Preferably, adjacent encapsulation portions are disconnected on the side of the isolation structure away from the substrate; Preferably, the packaging structure further includes an organic packaging layer, at least partially located on the side of the packaging portion and the isolation structure away from the substrate; Preferably, the encapsulation structure further includes an inorganic encapsulation layer located on the side of the organic encapsulation layer away from the substrate, wherein the orthographic projection of the inorganic encapsulation layer on the substrate covers the orthographic projection of the organic encapsulation layer on the substrate.

15. The display panel according to claim 14, characterized in that, It also includes a touch layer located on the side of the packaging structure away from the substrate and in the display area; the touch layer includes a first touch metal layer, a touch insulating layer and a second touch metal layer stacked in sequence.

16. A display panel, characterized in that, The display panel includes a display area and a bonding area located on one side of the display area; the display panel includes: Substrate; A plurality of first conductive structures are located on one side of the substrate and in the bonding region; and Multiple protective layers are stacked sequentially on the side of the first conductive structure facing away from the substrate; each protective layer includes multiple covering portions, each covering portion including an opening that exposes a portion of the first conductive structure; the orthographic projection of the covering portion on the substrate at least covers the edge region of the orthographic projection of the first conductive structure on the substrate; at least a portion of the protective layer is disconnected between adjacent covering portions of adjacent first conductive structures.

17. The display panel according to claim 16, characterized in that, The material of the protective layer where adjacent coverings are disconnected is an organic material.

18. The display panel according to claim 16 or 17, characterized in that, At least a portion of the protective layer also includes a connecting portion located between adjacent first conductive structures and connecting adjacent covering portions.

19. A display module, characterized in that, include: The display panel according to any one of claims 1-18; and The flexible circuit board is electrically connected to the first conductive structure.

20. A display device, characterized in that, It includes the display panel according to any one of claims 1-18, or the display module according to claim 19.

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