Display device with light emitting device

Abstract

A display apparatus including a light emitting device is provided. The light emitting device is disposed between the device substrate and the package substrate, and is covered by a package adhesive layer joining the substrates together. The light emitting device may be covered by an encapsulation adhesive layer. A cover insulating layer is disposed between the light emitting device and the encapsulation adhesive layer. An oxygen barrier layer is disposed between the cover insulating layer and the encapsulation adhesive layer. The oxygen barrier layer includes a metal that rapidly reacts with oxygen atoms and oxygen molecules. This configuration reduces the risk of damage to the light emitting device due to permeation of external moisture and oxygen. Therefore, the efficiency and lifetime of the light emitting device can be improved.

Description

[0001] Cross-references to related applications

[0002] This application claims the benefit of Korean Patent Application No. 10-2024-0114204, filed on August 26, 2024, which is incorporated herein by reference as if fully set forth herein. Technical Field

[0003] This disclosure relates to a display device in which the light-emitting device is disposed between a device substrate and a packaging substrate.

[0004] Discussion of related technologies

[0005] Typically, a display device provides images to a user. For example, a display device may include at least one light-emitting device. The light-emitting device can emit light that displays a specific color. For example, the light-emitting device may include a light-emitting unit disposed between a first electrode and a second electrode.

[0006] The light-emitting device can be disposed between the device substrate and the encapsulation substrate. The encapsulation substrate can be coupled to the device substrate via an encapsulation adhesive layer. The light-emitting device can be covered by the encapsulation adhesive layer. The encapsulation substrate can be harder than the device substrate. Therefore, in a display device, damage to the light-emitting device due to external impacts and moisture can be prevented. Summary of the Invention

[0007] This disclosure relates to a display device that substantially eliminates one or more technical problems caused by limitations and disadvantages of related technologies. For example, this disclosure describes a display device that provides improved moisture and oxygen protection for light-emitting devices. The device includes an oxygen barrier layer made of a metal that reacts more readily with oxygen than the encapsulation substrate. This layer is disposed between a covering insulating layer and an encapsulation adhesive layer, and its upper surface is intentionally roughened to enhance adhesion and reduce the likelihood of separation under external forces. The oxygen barrier layer may include different regions, some of which transform into transparent or discolored metal oxides upon exposure to moisture or oxygen, thereby allowing visual inspection of penetration.

[0008] The encapsulating adhesive layer comprises moisture-absorbing particles and color-changing particles that alter their appearance upon contact with oxygen. This combination enhances environmental resistance and enables real-time monitoring of degradation. Multiple oxygen-barrier layers can be used to further reinforce the structure. Their thickness and placement are designed to provide additional protection for vulnerable areas such as the bezel region. These structural features collectively contribute to maintaining display performance, extending lifespan, improving heat dissipation, and achieving reduced power consumption.

[0009] Various embodiments of this disclosure provide display devices capable of preventing damage to light-emitting devices due to the penetration of external moisture and oxygen.

[0010] Various embodiments of this disclosure provide a display device capable of easily inspecting the permeation of external moisture and oxygen.

[0011] Additional advantages and features of this disclosure will be set forth in part in the description which follows, and in part will become apparent to those skilled in the art upon examination of the following, or may be learned from practice of this disclosure. The purposes and other advantages of this disclosure may be realized and obtained by means of structures particularly pointed out in the written specification, its claims, and the accompanying drawings.

[0012] To achieve these benefits and other advantages, as embodied and broadly described herein, a display device including a device substrate is provided. A light-emitting device is disposed on a display area of ​​the device substrate. A cover insulating layer is disposed on a second electrode of the light-emitting device. An encapsulating adhesive layer is disposed on the cover insulating layer. The encapsulating adhesive layer extends over a border area of ​​the device substrate. An encapsulating substrate is disposed on the encapsulating adhesive layer. The encapsulating substrate overlaps with the display area and the border area. An oxygen barrier layer is disposed between the cover insulating layer and the encapsulating adhesive layer. The oxygen barrier layer comprises metal. The oxygen barrier layer includes a first surface and a second surface. The first surface of the oxygen barrier layer faces the encapsulating adhesive layer. The second surface of the oxygen barrier layer faces the first surface of the oxygen barrier layer. The average surface roughness of the first surface is greater than the average surface roughness of the second surface.

[0013] The thermal conductivity of the packaging substrate can be greater than that of the oxygen barrier layer.

[0014] The oxygen barrier layer may include a region that contacts the border region of the device substrate.

[0015] The encapsulation adhesive layer can contact the edge area of ​​the device substrate outside the oxygen barrier layer.

[0016] The encapsulating adhesive layer may include multiple hygroscopic particles and multiple color-changing particles. Each of the multiple color-changing particles may include a material that reacts with oxygen atoms and oxygen molecules to change color.

[0017] The thickness of the oxygen barrier layer overlapping the border area can be greater than the thickness of the oxygen barrier layer overlapping the display area.

[0018] The oxygen barrier layer may include a first barrier region and a second barrier region. The second barrier region may have a higher transmittance than the first barrier region. The second barrier region may be disposed between the first barrier region and a side surface of the device substrate.

[0019] The second blocking region of the oxygen blocking layer can be made of metal oxide semiconductor.

[0020] In another embodiment, a display device is provided that includes a light-emitting device on an emitting region of a device substrate. The light-emitting device is disposed on the device substrate. A second electrode of the light-emitting device is covered by a covering insulating layer. The light-emitting device and the covering insulating layer are covered by an encapsulating adhesive layer. An encapsulating substrate is disposed on the encapsulating adhesive layer. The encapsulating substrate comprises metal. A first oxygen barrier layer is disposed between the covering insulating layer and the encapsulating adhesive layer. The first oxygen barrier layer comprises a metal that oxidizes faster than the encapsulating substrate.

[0021] The side surface of the first oxygen barrier layer, which is disposed near the side surface of the device substrate, may be continuous with the side surface of the encapsulating adhesive layer, which is disposed near the side surface of the device substrate.

[0022] The second oxygen barrier layer can be disposed between the encapsulation adhesive layer and the encapsulation substrate. The second oxygen barrier layer may include a metal that oxidizes faster than the encapsulation substrate.

[0023] The thermal conductivity of the second oxygen barrier layer can be less than that of the packaging substrate.

[0024] The second oxygen barrier layer may include a different material than the first oxygen barrier layer.

[0025] The thermal conductivity of the first oxygen barrier layer can be less than that of the second oxygen barrier layer.

[0026] The first oxygen barrier layer includes a first barrier region and a second barrier region. The second barrier region may display a different color than the first barrier region. The second barrier region may be disposed between the first barrier region and the side surface of the device substrate. Attached Figure Description

[0027] The accompanying drawings are included to provide a further understanding of this disclosure and are incorporated in and constitute a part of this application. The drawings illustrate embodiments of the disclosure and, together with the specification, serve to explain the principles of the disclosure. In the drawings:

[0028] Figure 1 This is a schematic view illustrating a display device according to an embodiment of the present disclosure;

[0029] Figure 2 This is a view showing the circuitry of a pixel region in a display device according to an embodiment of the present disclosure;

[0030] Figure 3 This is a view schematically illustrating a cross-sectional view of a pixel region in a display device according to an embodiment of the present disclosure;

[0031] Figure 4 It is along Figure 1 The view captured by I-I';

[0032] Figure 5 This is a planar view that partially shows the oxygen barrier layer in a display device according to an embodiment of the present disclosure;

[0033] Figure 6 and Figure 7 This is a view showing how the oxygen barrier layer in a display device according to an embodiment of the present disclosure changes due to the permeation of external moisture or oxygen; and

[0034] Figures 8 to 11 This is a view showing a display device according to another embodiment of the present disclosure. Detailed Implementation

[0035] In the following detailed description, with reference to the accompanying drawings illustrating some embodiments of this disclosure, the details relating to the above-mentioned objectives, technical configurations, and operational effects of the embodiments of this disclosure will be clearly understood. Embodiments of this disclosure are provided herein to satisfactorily convey the technical spirit of this disclosure to those skilled in the art, and therefore this disclosure may be embodied in other forms and is not limited to the embodiments described below.

[0036] The shapes, sizes, dimensional parameters (e.g., length, width, height, thickness, radius, diameter, area, etc.), scales, angles, number of elements, etc. shown in the accompanying drawings for the purpose of describing embodiments of this disclosure are merely examples, and this disclosure is not limited thereto.

[0037] The dimensions shown in the figures, including the size and thickness of each component, are for ease of description and this disclosure is not limited to the size and thickness of the components shown in the figures; however, it should be noted that the relative dimensions of the components shown in the accompanying figures, including relative size, position and thickness, are part of this disclosure.

[0038] It will be understood that when the first element is referred to as being "on" the second element, although the first element may be positioned on the second element to contact the second element, a third element may also be inserted between the first element and the second element.

[0039] Here, terms such as “first” and “second” may be used to distinguish one element from another. However, without departing from the technical spirit of this disclosure, the first element and the second element may be named arbitrarily as is convenient for those skilled in the art.

[0040] The terminology used in this disclosure is for the purpose of describing particular embodiments only and is not intended to limit the scope of this disclosure. For example, elements described in the singular are intended to include multiple elements unless the context clearly indicates otherwise. Furthermore, it will be further understood in this disclosure that the terms “comprising” and “including” specify the presence of the stated features, integers, steps, operations, elements, components, and / or combinations thereof, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or combinations thereof.

[0041] Moreover, unless “direct” is used, the terms “connection” and “coupling” can include two components being “connected” or “coupled” through one or more other components located between the two components.

[0042] For further clarification, as used herein, the term "connection" is intended to have the broadest possible meaning. Specifically, the expression "A connected to B" includes both direct connections (i.e., no intermediate parts or elements exist between A and B) and indirect connections (i.e., one or more intermediate parts or elements exist between A and B). In other words, "A connected to B" includes both direct physical or electrical coupling and indirect coupling achieved through one or more intermediate parts. Unless otherwise explicitly stated, these terms do not require direct physical or electrical contact. The terms "coupled" and "contact" should be interpreted in the same manner.

[0043] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which the exemplary embodiments pertain. It will be further understood that terms such as those defined in common dictionaries should be interpreted as having the same meaning as their meaning in the context of the relevant field, and should not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0044] (Implementation Method)

[0045] Figure 1 This is a schematic view of a display device according to an embodiment of the present disclosure. Figure 2 This is a view showing the circuitry of a pixel region in a display device according to an embodiment of the present disclosure. Figure 3 This is a view schematically illustrating a cross-sectional view of a pixel region in a display device according to an embodiment of the present disclosure.

[0046] Reference Figures 1 to 3The display device according to embodiments of the present disclosure may include a display panel DP. The display panel DP can generate an image provided to a user. For example, the display panel DP may include multiple pixel regions PA. Various signals may be applied to each pixel region PA through signal wiring GL, DL, and PL. For example, signal wiring GL, DL, and PL may include a gate line GL for applying a gate signal, a data line DL for applying a data signal, and a power supply line PL for supplying power voltage.

[0047] Each pixel region PA can achieve a specific color. For example, a light-emitting device 300 can be provided in each pixel region PA. The light-emitting device 300 can emit light that displays a specific color. For example, the light-emitting device 300 may include a first electrode 310, a light-emitting unit 320, and a second electrode 330 stacked sequentially.

[0048] The first electrode 310 and the second electrode 330 may include conductive materials. The second electrode 330 may include a material different from that of the first electrode 310. For example, the reflectivity of the second electrode 330 may be greater than that of the first electrode 310. The first electrode 310 may have a higher transmittance than the second electrode 330. For example, the first electrode 310 may be a transparent electrode made of a transparent conductive material such as ITO and IZO, and the second electrode 330 may be a reflective electrode including metals such as aluminum (Al) and silver (Ag). The second electrode 330 may have a smaller work function than the first electrode 310. For example, the first electrode 310 may be used as an anode electrode, and the second electrode 330 may be used as a cathode electrode.

[0049] The light-emitting unit 320 can generate light with a brightness corresponding to the voltage difference between the first electrode 310 and the second electrode 330. For example, the light-emitting unit 320 may include at least one emissive material layer (EML). The emissive material layer may include an organic emissive material, an inorganic emissive material, or a hybrid emissive material. For example, the display device according to embodiments of this disclosure may be an organic light-emitting display device including an organic emissive material.

[0050] The light-emitting unit 320 may include at least one functional layer. The functional layer may be disposed between the first electrode 310 and the emitting material layer, and / or between the emitting material layer and the second electrode 330. Holes and electrons can move smoothly through the functional layer. For example, the functional layer may be one of a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer (EIL). Therefore, in the display device according to the embodiments of the present disclosure, the efficiency of the light-emitting unit 320 can be improved.

[0051] A driving circuit DC can be provided in each pixel region PA to control the operation of the light-emitting device 300. The driving circuit DC of each pixel region PA can be electrically connected to the light-emitting device 300 of the corresponding pixel region PA. The driving circuit DC of each pixel region PA can be electrically connected to signal lines GL, DL, and PL. For example, the driving circuit DC of each pixel region PA can be electrically connected to one of the gate lines GL, one of the data lines DL, and one of the power supply lines PL. The driving circuit DC of each pixel region PA can supply a driving current corresponding to the data signal to the light-emitting device 300 of the corresponding pixel region PA according to the gate signal of a frame. For example, the driving circuit DC of each pixel region PA may include a first thin-film transistor TR1, a second thin-film transistor TR2, and a storage capacitor Cst.

[0052] The first thin-film transistor TR1 of each pixel region PA can transmit a data signal to the second thin-film transistor TR2 of the corresponding pixel region PA according to the gate signal. For example, the first thin-film transistor TR1 of each pixel region PA can be used as a switching thin-film transistor. The first thin-film transistor TR1 of each pixel region PA may include a first semiconductor pattern, a first gate electrode, a first drain electrode, and a first source electrode. For example, the first gate electrode of each pixel region PA can be electrically connected to the corresponding gate line GL, and the first drain electrode of each pixel region PA can be electrically connected to the corresponding data line DL.

[0053] The second thin-film transistor TR2 of each pixel region PA can generate a drive current corresponding to the data signal. For example, the second thin-film transistor TR2 of each pixel region PA can be used as a driving thin-film transistor. The second thin-film transistor TR2 of each pixel region PA may include a second semiconductor pattern 221, a second gate electrode 223, a second drain electrode 225, and a second source electrode 227. For example, the second gate electrode 223 of each pixel region PA can be electrically connected to the first source electrode of the corresponding pixel region PA, and the second drain electrode 225 of each pixel region PA can be electrically connected to the corresponding power supply line PL. The light-emitting device 300 of each pixel region PA can be electrically connected to the second source electrode 227 of the corresponding pixel region PA.

[0054] The second semiconductor pattern 221 may include a semiconductor material. For example, the second semiconductor pattern 221 may include amorphous silicon (a-Si), polycrystalline silicon (poly-Si), or oxide semiconductors such as IGZO. The second semiconductor pattern 221 may include a drain region, a channel region, and a source region. The channel region may be disposed between the drain region and the source region. The drain region and the source region may have a lower resistance than the channel region. For example, the drain region and the source region may include conductive regions of an oxide semiconductor. The channel region may be a non-conductive region of an oxide semiconductor.

[0055] The second semiconductor pattern 221 may include the same material as the first semiconductor pattern. The second semiconductor pattern 221 may be disposed on the same layer as the first semiconductor pattern. The second semiconductor pattern 221 may be formed using the same process as the first semiconductor pattern. For example, the second semiconductor pattern 221 may be formed simultaneously with the first semiconductor pattern.

[0056] The second gate electrode 223 may be disposed on a portion of the second semiconductor pattern 221. For example, the second gate electrode 223 may overlap with the channel region of the second semiconductor pattern 221. The drain and source regions of the second semiconductor pattern 221 may be disposed outside the second gate electrode 223. The second gate electrode 223 may include a conductive material. For example, the second gate electrode 223 may include metals such as aluminum (Al), chromium (Cr), copper (Cu), molybdenum (Mo), titanium (Ti), and tungsten (W). The second gate electrode 223 may be spaced apart from the second semiconductor pattern 221. The second gate electrode 223 may be insulated from the second semiconductor pattern 221. For example, the channel region of the second semiconductor pattern 221 may have a conductivity corresponding to the voltage of the signal applied to the second gate electrode 223.

[0057] The second gate electrode 223 may include the same material as the first gate electrode. The second gate electrode 223 may be disposed on the same layer as the first gate electrode. The second gate electrode 223 may be formed using the same process as the first gate electrode. For example, the second gate electrode 223 may be formed simultaneously with the first gate electrode.

[0058] The second drain electrode 225 can be electrically connected to the drain region of the second semiconductor pattern 221. The second drain electrode 225 can include a conductive material. For example, the second drain electrode 225 can include metals such as aluminum (Al), chromium (Cr), copper (Cu), molybdenum (Mo), titanium (Ti), and tungsten (W). The second drain electrode 225 can include a different material than the second gate electrode 223. The second drain electrode 225 can be insulated from the second gate electrode 223. For example, the second drain electrode 225 can be disposed on a different layer than the second gate electrode 223.

[0059] The second drain electrode 225 may include the same material as the first drain electrode. The second drain electrode 225 may be disposed on the same layer as the first drain electrode. The second drain electrode 225 may be formed using the same process as the first drain electrode. For example, the second drain electrode 225 may be formed simultaneously with the first drain electrode.

[0060] The second source electrode 227 can be electrically connected to the source region of the second semiconductor pattern 221. The second source electrode 227 can include a conductive material. For example, the second source electrode 227 can include metals such as aluminum (Al), chromium (Cr), copper (Cu), molybdenum (Mo), titanium (Ti), and tungsten (W). The second source electrode 227 can include a different material than the second gate electrode 223. The second source electrode 227 can be insulated from the second gate electrode 223. For example, the second source electrode 227 can be disposed on a different layer than the second gate electrode 223. The second source electrode 227 can be disposed on the same layer as the second drain electrode 225. The second source electrode 227 can include the same material as the second drain electrode 225. The second source electrode 227 can be formed using the same process as the second drain electrode 225. For example, the second source electrode 227 can be formed simultaneously with the second drain electrode 225. The second source electrode 227 can be spaced apart from the second drain electrode 225.

[0061] The second source electrode 227 may include the same material as the first source electrode. The second source electrode 227 may be disposed on the same layer as the first source electrode. The second source electrode 227 may be formed using the same process as the first source electrode. For example, the second source electrode 227 may be formed simultaneously with the first source electrode. Therefore, in the display device according to embodiments of the present disclosure, process efficiency can be improved.

[0062] The storage capacitor Cst of each pixel region PA can maintain the signal applied to the second gate electrode 223 of the corresponding pixel region PA within one frame. For example, the storage capacitor Cst of each pixel region PA can be electrically connected to the second gate electrode 223 and the second source electrode 227 of the corresponding pixel region PA. The storage capacitor Cst of each pixel region PA can be formed using the process of forming the first thin-film transistor TR1 and the second thin-film transistor TR2 of the corresponding pixel region PA. The storage capacitor Cst of each pixel region PA can have a stacked structure of capacitor electrodes. The storage capacitor Cst of each pixel region PA may include a first capacitor electrode disposed on the same layer as the second gate electrode 233 of the corresponding pixel region PA and a second capacitor electrode disposed on the same layer as the second source electrode 227 of the corresponding pixel region PA. Therefore, in the display device according to the embodiments of the present disclosure, the process of forming the driving circuit DC of each pixel region PA can be simplified.

[0063] The driving circuit DC and the light-emitting device 300 of each pixel region PA can be disposed on the device substrate 100. For example, the first thin-film transistor TR1, the second thin-film transistor TR2, and the storage capacitor Cst of each pixel region PA can be supported by the device substrate 100. The device substrate 100 may include an insulating material. The device substrate 100 may include a transparent material. For example, the device substrate 100 may include glass or plastic. Multiple insulating layers 110, 120, 130, 140, 150, and 160 for preventing unwanted electrical connections can be disposed on the device substrate 100. For example, a buffer insulating layer 110, a gate insulating layer 120, an interlayer insulating layer 130, a device passivation layer 140, a planarization layer 150, and a dam insulating layer 160 can be stacked on the device substrate 100.

[0064] A buffer insulating layer 110 may be disposed close to the device substrate 100. The buffer insulating layer 110 can prevent contamination caused by the device substrate 100 during the process of forming the drive circuit DC of each pixel region PA. For example, the upper surface of the device substrate 100 facing the drive circuit DC of each pixel region PA may be covered by the buffer insulating layer 110. A first thin-film transistor TR1, a second thin-film transistor TR2, and a storage capacitor Cst for each pixel region PA may be disposed on the buffer insulating layer 110. The buffer insulating layer 110 may include an insulating material. For example, the buffer insulating layer 110 may be an inorganic insulating layer made of an inorganic insulating material such as silicon oxide (SiOx) and silicon nitride (SiNx). The buffer insulating layer 110 may have a multilayer structure. For example, the buffer insulating layer 110 may have a stacked structure of inorganic insulating layers made of silicon oxide (SiOx) and inorganic insulating layers made of silicon nitride (SiNx).

[0065] A gate insulating layer 120 may be disposed on a buffer insulating layer 110. The second gate electrode 223 of each pixel region PA can be insulated from the second semiconductor pattern 221 of the corresponding pixel region PA through the gate insulating layer 120. For example, the gate insulating layer 120 may cover the first semiconductor pattern and the second semiconductor pattern 221 of each pixel region PA. The first gate electrode and the second gate electrode 223 of each pixel region PA may be disposed on the gate insulating layer 120. The gate insulating layer 120 may include an insulating material. For example, the gate insulating layer 120 may be an inorganic insulating layer made of an inorganic insulating material.

[0066] An interlayer insulating layer 130 may be disposed on the gate insulating layer 120. The second drain electrode 225 and the second source electrode 227 of each pixel region PA can be insulated from the second gate electrode 223 of the corresponding pixel region PA through the interlayer insulating layer 130. For example, the interlayer insulating layer 130 may cover the first gate electrode and the second gate electrode 223 of each pixel region PA. The first drain electrode, the first source electrode, the second drain electrode 225, and the second source electrode 227 of each pixel region PA may be disposed on the interlayer insulating layer 130. The interlayer insulating layer 130 may include an insulating material. For example, the interlayer insulating layer 130 may be an inorganic insulating layer made of an inorganic insulating material.

[0067] A device passivation layer 140 may be disposed on the interlayer insulating layer 130. The device passivation layer 140 can prevent damage to the drive circuit DC in each pixel region PA due to external impact and moisture. For example, the first drain electrode, first source electrode, second drain electrode 225, and second source electrode 227 of each pixel region PA may be covered by the device passivation layer 140. The device passivation layer 140 may include an insulating material. For example, the device passivation layer 140 may be an inorganic insulating layer made of an inorganic insulating material.

[0068] Planarization layer 150 may be disposed on device passivation layer 140. Planarization layer 150 can eliminate thickness differences caused by the driving circuit DC of each pixel region PA. For example, the upper surface of planarization layer 150 opposite to device substrate 100 may be flat. The upper surface of planarization layer 150 may be parallel to the upper surface of device substrate 100. Planarization layer 150 may include an insulating material. Planarization layer 150 may include a material different from device passivation layer 140. Planarization layer 150 may include a material with relatively high fluidity. For example, planarization layer 150 may be an organic insulating layer made of organic insulating material.

[0069] The light-emitting device 300 of each pixel region PA can be disposed on the planarization layer 150. For example, the first electrode 310, the light-emitting unit 320, and the second electrode 330 of each pixel region PA can be sequentially stacked on the upper surface of the planarization layer 150 in the corresponding pixel region PA. The light-emitting device 300 of each pixel region PA can be controlled independently of the light-emitting devices 300 of adjacent pixel regions PA. For example, the first electrode 310 of each pixel region PA can be insulated from the first electrode 310 of adjacent pixel regions PA by a dike insulating layer 160. The dike insulating layer 160 may include an insulating material. For example, the dike insulating layer 160 may be an organic insulating layer made of an organic insulating material. The dike insulating layer 160 may include a material different from the planarization layer 150.

[0070] A dam insulating layer 160 may be disposed on the planarization layer 150. The dam insulating layer 160 may partially expose the first electrode 310 of each pixel region PA. For example, the edge of the first electrode 310 in each pixel region PA may be covered by the dam insulating layer 160. The light-emitting unit 320 and the second electrode 330 of each pixel region PA may be stacked on the central portion of the corresponding first electrode 310 exposed by the dam insulating layer 160. Therefore, in the display device according to the embodiments of the present disclosure, an emission region EA can be defined in each pixel region PA by the dam insulating layer 160. For example, light cannot be generated and emitted in the portion of each pixel region PA that overlaps with the dam insulating layer 160. The first electrode 310 of each pixel region PA may be electrically connected to a driving circuit DC outside the emission region EA defined in the corresponding pixel region PA. Therefore, in the display device according to the embodiments of the present disclosure, brightness deviations depending on the generation position of light emitted from the light-emitting device 300 of each pixel region PA can be prevented.

[0071] Light generated by the light-emitting unit 320 of each pixel region PA can be emitted to the outside through the first electrode 310 of the corresponding pixel region PA and the device substrate 100. The driving circuit DC of each pixel region PA can be disposed outside the emission region EA defined in the corresponding pixel region PA. For example, the first thin-film transistor TR1, the second thin-film transistor TR2, and the storage capacitor Cst of each pixel region PA cannot overlap with the emission region EA of the corresponding pixel region PA. Therefore, in the display device according to the embodiment of the present disclosure, the light emitted from the light-emitting device 300 of each pixel region PA cannot be blocked by the driving circuit DC of the corresponding pixel region PA. Therefore, in the display device according to the embodiment of the present disclosure, the light extraction efficiency of each pixel region PA can be improved. Furthermore, in the display device according to the embodiment of the present disclosure, the efficiency of the light-emitting device 300 on each pixel region PA can be improved.

[0072] The signal applied to the second electrode 330 of each pixel region PA can be the same as the signal applied to the second electrode 330 of adjacent pixel regions PA. For example, the second electrode 330 of each pixel region PA can be electrically connected to the second electrode 330 of adjacent pixel regions PA. The second electrode 330 of each pixel region PA can include the same material as the second electrode 330 of adjacent pixel regions PA. The second electrode 330 of each pixel region PA can be formed by the same process as the second electrode of adjacent pixel regions PA. For example, the second electrode 330 of each pixel region PA can be formed simultaneously with the second electrode 330 of adjacent pixel regions PA. The second electrode 330 of each pixel region PA can be in direct contact with the second electrode 330 of adjacent pixel regions PA. Therefore, in the display device according to the embodiments of the present disclosure, the process of forming the second electrode 330 in each pixel region PA can be simplified.

[0073] The light emitted from the light-emitting device 300 in each pixel region PA can display the same color as the light emitted from the light-emitting device 300 in adjacent pixel regions PA. For example, the light-emitting device 300 in each pixel region PA can emit white light. The light-emitting unit 320 in each pixel region PA can have the same stacked structure as the light-emitting units 320 in adjacent pixel regions PA. The light-emitting unit 320 in each pixel region PA can be formed using the same process as the light-emitting units 320 in adjacent pixel regions PA. For example, the light-emitting unit 320 in each pixel region PA can be formed simultaneously with the light-emitting units 320 in adjacent pixel regions PA. Therefore, in the display device according to the embodiments of the present disclosure, the process of forming the light-emitting unit 320 in each pixel region PA can be simplified.

[0074] The color achieved by each pixel region PA can be different from the color achieved by adjacent pixel regions PA. For example, a color filter 400 can be provided on each pixel region PA. The color filter 400 of each pixel region PA can achieve a specific color by using light emitted from the light-emitting device 300 of the corresponding pixel region PA. The color filter 400 of each pixel region PA can include a different material than the color filters 400 of adjacent pixel regions PA. The color filter 400 of each pixel region PA can be positioned in the path of light emitted from the light-emitting device 300 of the corresponding pixel region PA. For example, the color filter 400 of each pixel region PA can be positioned between the device passivation layer 140 and the planarization layer 150. The thickness difference caused by the color filter 400 of each pixel region PA can be eliminated by the planarization layer 150. Therefore, in the display device according to the embodiments of the present disclosure, the image provided to the user can include a variety of colors.

[0075] An insulating layer 500 can be provided on the light-emitting device 300 of each pixel region PA. The insulating layer 500 can prevent damage to the light-emitting device 300 on each pixel region PA due to external moisture. For example, the second electrode 330 of each pixel region PA can be covered by the insulating layer 500. The insulating layer 500 can include an insulating material. For example, the insulating layer 500 can be an inorganic insulating layer made of an inorganic insulating material.

[0076] An encapsulation adhesive layer 600 and an encapsulation substrate 700 can be disposed on the insulating layer 500. The encapsulation substrate 700 can be coupled to the device substrate 100 on which the light-emitting device 300 is formed through the encapsulation adhesive layer 600. The encapsulation adhesive layer 600 may include an adhesive material. For example, the encapsulation adhesive layer 600 may include a curable resin such as epoxy resin and olefin. The encapsulation adhesive layer 600 can prevent damage to the light-emitting device 300 on each pixel area PA due to the penetration of external moisture. For example, the encapsulation adhesive layer 600 may include a plurality of moisture-absorbing particles 600p. Each of the moisture-absorbing particles 600p may include a material capable of capturing moisture. For example, each of the moisture-absorbing particles 600p may include at least one of metal powder, metal oxide, and metal salt.

[0077] The encapsulating adhesive layer 600 can have a multilayer structure. For example, the encapsulating adhesive layer 600 can have a stacked structure of a first encapsulating layer 610 and a second encapsulating layer 620. The first encapsulating layer 610 can be disposed between the covering insulating layer 500 and the second encapsulating layer 620. The lower surface of the second encapsulating layer 620 facing the device substrate 100 can be in direct contact with the upper surface of the first encapsulating layer 610 facing the encapsulating substrate 700. A plurality of moisture-absorbing particles 600p can be dispersed in the second encapsulating layer 620. Each of the moisture-absorbing particles 600p can expand by capturing moisture. Therefore, in the display device according to the embodiments of the present disclosure, the stress applied to the light-emitting device 300 of each pixel area PA due to the expansion of each moisture-absorbing particle 600p can be reduced by the first encapsulating layer 610. The first encapsulating layer 610 can include a different material than the second encapsulating layer 620. Therefore, in the display device according to the embodiments of the present disclosure, damage to the light-emitting device 300 on each pixel area PA due to the penetration of external moisture can be effectively prevented.

[0078] The encapsulation substrate 700 can mitigate external impacts applied to the light-emitting device 300 in each pixel region PA. For example, the encapsulation substrate 700 may include a material harder than the device substrate 100. The encapsulation substrate 700 may include a material having a higher thermal conductivity than the device substrate 100. For example, the encapsulation substrate 700 may include metals such as aluminum (Al), iron (Fe), and nickel (Ni). Therefore, in the display device according to the embodiments of the present disclosure, the heat generated by the driving circuit DC and the operation of the light-emitting device 300 in each pixel region PA can be dissipated to the outside through the encapsulation substrate 700. Therefore, in the display device according to the embodiments of the present disclosure, deterioration of the light-emitting device 300 in each pixel region PA can be prevented.

[0079] An oxygen barrier layer 800 may be provided between the insulating layer 500 and the first encapsulation layer 610. The oxygen barrier layer 800 may comprise a material highly reactive with oxygen atoms and molecules. For example, the oxygen barrier layer 800 may comprise a metal. Typically, moisture can consist of hydrogen atoms and oxygen molecules. Therefore, in the display device according to an embodiment of the present disclosure, external moisture and oxygen permeating through the encapsulating adhesive layer 600 can react with the oxygen barrier layer 800. That is, in the display device according to an embodiment of the present disclosure, the oxygen barrier layer 800 may be oxidized by moisture and oxygen not captured by the plurality of hygroscopic particles 600p. Therefore, in the display device according to an embodiment of the present disclosure, damage to the light-emitting device 300 on each pixel area PA due to the permeation of external moisture and oxygen can be prevented.

[0080] The oxygen barrier layer 800 may comprise a material different from that of the encapsulation substrate 700. The thermal conductivity of the oxygen barrier layer 800 may be lower than that of the encapsulation substrate 700. Therefore, in the display device according to the embodiments of the present disclosure, heat generated by the operation of the driving circuit DC and the light-emitting device 300 in each pixel region PA can be rapidly transferred to the encapsulation substrate 700 through the oxygen barrier layer 800. Therefore, heat dissipation efficiency can be improved in the display device according to the embodiments of the present disclosure. Furthermore, in the display device according to the embodiments of the present disclosure, degradation of the light-emitting device 300 in each pixel region PA can be effectively prevented.

[0081] The oxygen barrier layer 800 may include a metal that oxidizes faster than the encapsulation substrate 700. For example, the oxygen barrier layer 800 may include at least one of indium (In), zinc (Zn), gallium (Ga), and titanium (Ti). Therefore, in the display device according to the embodiments of the present disclosure, external moisture and oxygen permeating through the encapsulation adhesive layer 600 can move towards the oxygen barrier layer 800 instead of towards the encapsulation substrate 700. That is, in the display device according to the embodiments of the present disclosure, oxidation of the encapsulation substrate 700 due to the permeation of external moisture and oxygen can be prevented. Therefore, in the display device according to the embodiments of the present disclosure, a decrease in heat dissipation efficiency due to corrosion of the encapsulation substrate 700 can be prevented.

[0082] Therefore, the display device according to the embodiments of the present disclosure may include: a covering insulating layer 500 disposed on the light-emitting device 300 in each pixel region PA, an encapsulation adhesive layer 600 disposed on the covering insulating layer 500, an encapsulation substrate 700 disposed on the encapsulation adhesive layer 600, and an oxygen barrier layer 800 disposed between the covering insulating layer 500 and the encapsulation adhesive layer 600, wherein the oxygen barrier layer 800 may include a metal that oxidizes faster than the encapsulation substrate 600. Therefore, in the display device according to the embodiments of the present disclosure, damage to the light-emitting device 300 in each pixel region PA due to the penetration of external moisture and oxygen can be prevented. Furthermore, in the display device according to the embodiments of the present disclosure, a decrease in heat dissipation efficiency due to the penetration of external moisture and oxygen can be prevented. Therefore, in the display device according to the embodiments of the present disclosure, the efficiency and lifespan of the light-emitting device 300 in each pixel region PA can be improved. In other words, in the display device according to the embodiments of the present disclosure, low-power operation is feasible, and power consumption can be reduced.

[0083] Figure 4 It is along Figure 1 The view obtained by I-I' in the middle. Figure 5 This is a planar view that partially shows the oxygen barrier layer 800 in a display device according to an embodiment of the present disclosure.

[0084] Reference Figure 1 and Figures 3 to 5In a display device according to an embodiment of the present disclosure, the display panel DP may include a display area AA (i.e., an active area AA) having pixel areas PA and a bezel area BZ disposed outside the active area AA. For example, the active area AA may be surrounded by the bezel area BZ. A gate driver GD electrically connected to a gate line GL, a data driver DD electrically connected to a data line DL, a power supply unit PU electrically connected to a power supply line PL, and a timing controller TC controlling the gate driver GD and the data driver DD may be disposed outside the display area AA. For example, each of the signal lines GL, DL, and PL may extend on the bezel area BZ. At least one of the gate driver GD, the data driver DD, the power supply unit PU, and the timing controller TC may be disposed on the bezel area BZ. For example, the display device according to an embodiment of the present disclosure may be a GIP (Gate In-Panel) type display device in which the gate driver GD is formed on the bezel area BZ.

[0085] The buffer insulating layer 110, gate insulating layer 120, interlayer insulating layer 130, device passivation layer 140, planarization layer 150, dam insulating layer 160, and cover insulating layer 500 can extend onto the border region BZ. The wiring constituting the gate driver GD can be formed using the same process used to form the driving circuit DC of each pixel region PA. For example, some of the wiring GW constituting the gate driver GD can be positioned between the device passivation layer 140 and the interlayer insulating layer 130 in the border region BZ.

[0086] Each of the buffer insulating layer 110, gate insulating layer 120, interlayer insulating layer 130, device passivation layer 140, planarization layer 150, dam insulating layer 160, and cover insulating layer 500 may include an end disposed on the border region BZ. The encapsulation adhesive layer 600, the encapsulation substrate 700, and the oxygen barrier layer 800 may extend onto the border region BZ. For example, the ends of the buffer insulating layer 110, the gate insulating layer 120, the interlayer insulating layer 130, the device passivation layer 140, the planarization layer 150, the dam insulating layer 160, and the cover insulating layer 500 disposed on the border region BZ may be covered by the oxygen barrier layer 800. Therefore, in the display device according to the embodiments of the present disclosure, the oxygen barrier layer 800 can block the penetration of external moisture and oxygen through the boundary between the buffer insulating layer 110, the gate insulating layer 120, the interlayer insulating layer 130, the device passivation layer 140, the planarization layer 150 and the dam insulating layer 160.

[0087] The oxygen barrier layer 800 may extend along the border region BZ of the device substrate 100 and the first encapsulation layer 610. The oxygen barrier layer 800 may include an area in direct contact with the border region BZ of the device substrate 100. For example, a side surface of the oxygen barrier layer 800 disposed near the side surface 100s of the device substrate 100 may be continuous with a side surface of the encapsulation adhesive layer 600 disposed near the side surface 100s of the device substrate 100. Therefore, in the display device according to an embodiment of the present disclosure, the penetration of external moisture and oxygen through the encapsulation adhesive layer 600 can be effectively blocked.

[0088] The oxygen barrier layer 800 overlapping the border region BZ outside the buffer insulating layer 110 can be thicker than the oxygen barrier layer 800 overlapping the buffer insulating layer 110. For example, the second thickness t2 of the oxygen barrier layer 800 overlapping the border region BZ can be greater than the first thickness t1 of the oxygen barrier layer 800 overlapping the display region AA. Therefore, in the display device according to the embodiment of the present disclosure, the amount of moisture and oxygen captured by the oxygen barrier layer 800 on the border region BZ can be greater than the amount of moisture and oxygen captured by the oxygen barrier layer 800 on the display region AA. Therefore, in the display device according to the embodiment of the present disclosure, the impact of moisture and oxygen captured by the oxygen barrier layer 800 on the light-emitting device 300 of each pixel region PA can be minimized.

[0089] The oxygen barrier layer 800 can be formed by a deoxidation process using hydrogen plasma. For example, the process of forming the oxygen barrier layer 800 may include the steps of forming a metal oxide layer, such as ITO, IZO, and IGZO, on the entire surface of the device substrate 100 on which the covering insulating layer 500 is formed, and the step of deoxidizing the metal oxide layer using hydrogen plasma. Therefore, in the display device according to embodiments of the present disclosure, the upper surface of the oxygen barrier layer 800 facing the encapsulation adhesive layer 600 can become roughened, such as… Figure 5 As shown. For example, the upper surface of the oxygen barrier layer 800 may have a larger average surface roughness than the lower surface of the oxygen barrier layer 800 facing the device substrate 100. That is, in the display device according to the embodiments of the present disclosure, the contact area between the oxygen barrier layer 800 and the first encapsulation layer 610 can be increased. Therefore, in the display device according to the embodiments of the present disclosure, the adhesive force between the oxygen barrier layer 800 and the encapsulation adhesive layer 600 can be increased. Furthermore, in the display device according to the embodiments of the present disclosure, interface separation between the oxygen barrier layer 800 and the encapsulation adhesive layer 600 due to external impact can be prevented. In addition, in the display device according to the embodiments of the present disclosure, external moisture and oxygen that permeate through the encapsulation adhesive layer 600 can be quickly captured by the oxygen barrier layer 800.

[0090] In the display device according to embodiments of the present disclosure, a portion of the oxygen barrier layer 800 may be oxidized by the permeation of external moisture or oxygen. The portion of the oxygen barrier layer 800 oxidized by moisture or oxygen may have different characteristics than the portion of the oxygen barrier layer 800 not oxidized by moisture and oxygen. For example, in the display device according to embodiments of the present disclosure, such as... Figure 6 As shown, due to the penetration of external moisture or oxygen, the oxygen barrier layer 800 on the display area AA may include a first barrier region 810 and a second barrier region 820 disposed on the first barrier region 810. The second barrier region 820 may be in direct contact with the upper surface of the first barrier region 810 facing the encapsulation substrate 700. For example, the first barrier region 810 may be disposed between the covering insulating layer 500 and the second barrier region 820.

[0091] The first blocking region 810 may be a region that is not oxidized by moisture and oxygen, and the second blocking region 820 may be a region that is oxidized by the penetration of external moisture or oxygen. For example, when the first blocking region 810 may include indium (In), gallium (Ga), and zinc (Zn), the second blocking region 820 may be made of a metal oxide semiconductor such as IGZO. When the first blocking region 810 may include indium (In) and titanium (Ti), the second blocking region 820 may be made of a transparent conductive metal oxide such as ITO. Therefore, in the display device according to the embodiments of the present disclosure, the second blocking region 820 may have a higher transmittance than the first blocking region 810. Furthermore, in the display device according to the embodiments of the present disclosure, the second blocking region 820 may display a different color than the first blocking region 810. Therefore, in the display device according to the embodiments of the present disclosure, the amount of moisture and oxygen penetrating into the display area AA can be easily checked by the transmittance and / or color change of the oxygen blocking layer 800.

[0092] In the display device according to the embodiments of this disclosure, such as Figure 7As shown, the portion of the second blocking region 820 disposed near the side surface of the device substrate 100 may be relatively thicker than another portion of the second blocking region 820. For example, the portion of the oxygen barrier layer 800 disposed near the side surface of the device substrate 100 may consist solely of the second blocking region 820. The end of the first blocking region 810 on the frame region BZ may be surrounded by the device substrate 100 and the second blocking region 820. For example, the second blocking region 820 on the frame region BZ may be in direct contact with the upper surface of the device substrate 100 outside the first blocking region 810. A portion of the second blocking region 820 may be disposed between the first blocking region 810 and the side surface of the device substrate 100 in a direction parallel to the upper surface of the device substrate 100. Therefore, in the display device according to the embodiments of the present disclosure, the location of external moisture and oxygen penetration can be easily inspected by the second blocking region 820 formed on the frame region BZ. Furthermore, in the display device according to the embodiments of the present disclosure, the degree of penetration of external moisture and oxygen can be easily checked by the horizontal length and / or area of ​​the second blocking region 820. That is, in the display device according to the embodiments of the present disclosure, the penetration paths of moisture and oxygen can be identified without damaging the light-emitting devices 300 on each pixel area PA. Therefore, in the display device according to the embodiments of the present disclosure, areas where moisture and / or oxygen have penetrated can be quickly repaired without damaging the light-emitting devices 300. For example, in the display device according to the embodiments of the present disclosure, the encapsulating adhesive layer 600 can be quickly replaced before moisture and oxygen penetrate into the display area AA.

[0093] The display device according to an embodiment of the present disclosure is described as having a driving circuit DC for each pixel region PA consisting of a first thin-film transistor TR1, a second thin-film transistor TR2, and a storage capacitor Cst. However, in another embodiment of the display device according to the present disclosure, the driving circuit DC for each pixel region PA may include a driving thin-film transistor and at least one switching thin-film transistor. For example, in another embodiment of the display device according to the present disclosure, the driving circuit DC for each pixel region PA may further include a third thin-film transistor for initializing the storage capacitor Cst of the corresponding pixel region PA according to a gate signal. The third thin-film transistor of each pixel region PA may include a third semiconductor pattern, a third gate electrode, a third drain electrode, and a third source electrode. The third semiconductor pattern of each pixel region PA may include a semiconductor pattern. The third gate electrode of each pixel region PA may be electrically connected to one of the gate lines GL. The third drain electrode of each pixel region PA may be electrically connected to an initial line to which an initial signal is applied. The third source electrode of each pixel region PA may be electrically connected to the storage capacitor Cst of the corresponding pixel region PA. Therefore, in another embodiment of the display device according to the present disclosure, the degree of freedom in configuring the driving circuit DC in each pixel region PA can be increased.

[0094] In a display device according to an embodiment of the present disclosure, the positions and electrical connections of the first drain electrode, the first source electrode, the second drain electrode 225, and the second source electrode 227 in each driving circuit DC can vary depending on the configuration of the corresponding driving circuit DC and / or the type of the corresponding thin-film transistors TR1 and TR2. For example, in a display device according to another embodiment of the present disclosure, the second gate electrode 223 of each driving circuit DC can be electrically connected to the first drain electrode of the corresponding driving circuit DC. Therefore, in a display device according to another embodiment of the present disclosure, the degree of freedom in the configuration of each driving circuit DC and the type of each thin-film transistor TR1 and TR2 can be increased.

[0095] The display device according to an embodiment of the present disclosure is described as having an oxygen barrier layer 800 disposed only between the covering insulating layer 500 and the encapsulating adhesive layer 600. However, a display device according to another embodiment of the present disclosure may include multiple oxygen barrier layers 800. For example, in a display device according to another embodiment of the present disclosure, a first oxygen barrier layer 910 may be disposed between the covering insulating layer 500 and the first encapsulating layer 610, and may be disposed as follows: Figure 8 and Figure 9A second oxygen barrier layer 920 is disposed between the second encapsulation layer 620 and the encapsulation substrate 700. The first oxygen barrier layer 910 and the second oxygen barrier layer 920 may comprise metals that oxidize faster than the encapsulation substrate 700. Therefore, in a display device according to another embodiment of the present disclosure, moisture and oxygen not captured by the plurality of hygroscopic particles 600p can react with the first oxygen barrier layer 910 or the second oxygen barrier layer 920. Therefore, in a display device according to an embodiment of the present disclosure, damage to the light-emitting device 300 on each pixel area PA due to the penetration of external moisture and oxygen can be effectively prevented.

[0096] The first oxygen barrier layer 910 and the second oxygen barrier layer 920 may have a lower thermal conductivity than the encapsulation substrate 700. The second oxygen barrier layer 920 may comprise a different material than the first oxygen barrier layer 910. For example, the thermal conductivity of the first oxygen barrier layer 910 may be lower than that of the second oxygen barrier layer 920. The upper surface of the second oxygen barrier layer 920 opposite to the device substrate 100 may be in direct contact with the encapsulation substrate 700. Therefore, in a display device according to another embodiment of the present disclosure, the heat generated by the driving circuit DC in each pixel region PA and the operation of the light-emitting device 300 can be rapidly transferred to the encapsulation substrate 700 through the first oxygen barrier layer 910 and the second oxygen barrier layer 920. Therefore, in a display device according to another embodiment of the present disclosure, heat dissipation efficiency can be improved.

[0097] The surface of the second oxygen barrier layer 920 facing the second encapsulation layer 620 can have a larger average surface roughness than the surface of the second oxygen barrier layer 920 facing the encapsulation substrate 700. For example, the process of forming the second oxygen barrier layer 920 may include the step of forming a metal oxide layer on the surface of the encapsulation substrate 700, and the step of deoxidizing the metal oxide layer using hydrogen plasma. Therefore, in a display device according to another embodiment of the present disclosure, the contact area between the second encapsulation layer 620 and the second oxygen barrier layer 920 can be increased. That is, in a display device according to another embodiment of the present disclosure, the adhesive force between the encapsulation adhesive layer 600 and the second oxygen barrier layer 920 can be increased. Therefore, in a display device according to another embodiment of the present disclosure, interface separation between the encapsulation adhesive layer 600 and the second oxygen barrier layer 920 due to external impact can be prevented.

[0098] The display device according to an embodiment of the present disclosure is described as having only a plurality of moisture-absorbing particles 600p dispersed in an encapsulating adhesive layer 600. However, in another embodiment of the display device according to the present disclosure, various types of particles can be dispersed in the encapsulating adhesive layer 600. For example, in another embodiment of the display device according to the present disclosure, the encapsulating adhesive layer 600 may include a plurality of moisture-absorbing particles 600p and a plurality of color-changing particles 600v, such as... Figure 10 and Figure 11 As shown. Each of the color-changing particles 600v may include a material that reacts with oxygen atoms and / or oxygen molecules to change color. For example, each of the color-changing particles 600v may include colorless methylene blue (LMB) that displays blue by reacting with oxygen. Multiple color-changing particles 600v may be dispersed in the first encapsulation layer 610 and the second encapsulation layer 620. Therefore, in a display device according to another embodiment of the present disclosure, the location of moisture and oxygen penetration can be easily checked by the color change of the encapsulation adhesive layer 600. Furthermore, in a display device according to another embodiment of the present disclosure, the degree of moisture and oxygen penetration can be easily checked by the color change of the encapsulation adhesive layer 600. Therefore, in a display device according to another embodiment of the present disclosure, areas of moisture and / or oxygen penetration can be quickly repaired before the light-emitting device 300 is damaged.

[0099] In another embodiment of the display device according to the present disclosure, the oxygen barrier layer 800 may be covered by the encapsulating adhesive layer 600. For example, the side surface of the encapsulating adhesive layer 600 may be disposed between the side surface of the device substrate 100 and the side surface of the oxygen barrier layer 800. The encapsulating adhesive layer 600 may be in direct contact with the frame region BZ of the device substrate 100 outside the oxygen barrier layer 800. Therefore, in the display device according to another embodiment of the present disclosure, peeling of the encapsulating adhesive layer 600 and the oxygen barrier layer 800 due to external impact can be effectively prevented. Furthermore, in the display device according to another embodiment of the present disclosure, damage to the oxygen barrier layer 800 due to external impact can be prevented. Therefore, in the display device according to another embodiment of the present disclosure, damage to the light-emitting device 300 on each pixel region PA due to the penetration of external moisture and oxygen can be effectively prevented. In addition, in the display device according to another embodiment of the present disclosure, the penetration path of external moisture and oxygen can be easily inspected. In other words, in a display device according to another embodiment of the present disclosure, areas affected by external moisture and / or oxygen penetration can be quickly repaired.

[0100] Therefore, the display device according to embodiments of the present disclosure may include a covering insulating layer on the light-emitting device, an oxygen barrier layer on the covering insulating layer, an encapsulating adhesive layer on the oxygen barrier layer, and an encapsulation substrate on the encapsulating adhesive layer, wherein the oxygen barrier layer includes a metal that reacts with oxygen faster than the encapsulation substrate. Therefore, in the display device according to embodiments of the present disclosure, the penetration of external moisture and oxygen not captured by the encapsulating adhesive layer can be blocked by the oxygen barrier layer. That is, in the display device according to embodiments of the present disclosure, damage to the light-emitting device due to external moisture and oxygen can be effectively prevented. Therefore, in the display device according to embodiments of the present disclosure, the efficiency and lifespan of the light-emitting device can be improved. Furthermore, in the display device according to embodiments of the present disclosure, low-power operation is possible, and power consumption can be reduced.

[0101] The various embodiments described above can be combined to provide further embodiments. Various modifications can be made to these embodiments based on the detailed description above. Generally, the terminology used in the appended claims should not be construed as limiting the claims to the specific embodiments disclosed in the specification and claims, but should be interpreted to cover all possible embodiments and the full scope of equivalents to which the claim is entitled. Therefore, the claims are not limited by this disclosure.

Claims

1. A display device, comprising: A device substrate having a display area and a border area; A light-emitting device on the display area of ​​the device substrate, the light-emitting device including electrodes; An insulating layer is applied to the electrodes of the light-emitting device; An encapsulation adhesive layer is applied over the insulating layer, the encapsulation adhesive layer extending over the border region of the device substrate; An encapsulation substrate on the encapsulation adhesive layer, the encapsulation substrate overlapping the display area and the border area; as well as An oxygen barrier layer, comprising a metal, is disposed between the overlay insulating layer and the encapsulating adhesive layer. The oxygen barrier layer has a first surface and a second surface opposite to the first surface. The first surface of the oxygen barrier layer facing the encapsulating adhesive layer has a greater average surface roughness than the second surface of the oxygen barrier layer.

2. The display device according to claim 1, wherein, The thermal conductivity of the packaging substrate is greater than that of the oxygen barrier layer.

3. The display device according to claim 1, wherein, The oxygen barrier layer includes a region that contacts the border region of the device substrate.

4. The display device according to claim 3, wherein, The encapsulation adhesive layer contacts the border region of the device substrate outside the oxygen barrier layer.

5. The display device according to claim 1, wherein, The encapsulating adhesive layer comprises multiple moisture-absorbing particles and multiple color-changing particles, and Each of the plurality of color-changing particles comprises a material that reacts with oxygen atoms and / or oxygen molecules to change color.

6. The display device according to claim 1, wherein, The thickness of the oxygen barrier layer overlapping the border area is greater than the thickness of the oxygen barrier layer overlapping the display area.

7. The display device according to claim 1, wherein, The oxygen barrier layer includes a first barrier region and a second barrier region, wherein the second barrier region has a higher transmittance than the first barrier region, and The second blocking region is disposed between the first blocking region and the side surface of the device substrate in a direction parallel to the upper surface of the device substrate.

8. The display device according to claim 7, wherein, The second barrier region of the oxygen barrier layer is made of metal oxide semiconductor.

9. The display device according to claim 7, wherein, The thickness of the second blocking region at the side surface near the device substrate is greater than the thickness at the center of the display area.

10. A display device, comprising: Device substrate; A light-emitting device on the device substrate, the light-emitting device having electrodes; An insulating layer covering the electrodes of the light-emitting device; An encapsulating adhesive layer covering the light-emitting device and the insulating layer; An encapsulation substrate on the encapsulation adhesive layer, the encapsulation substrate comprising metal; and A first oxygen barrier layer is disposed between the covering insulating layer and the encapsulating adhesive layer. The first oxygen barrier layer comprises a metal that oxidizes faster than the packaging substrate.

11. The display device according to claim 10, wherein, The side surface of the first oxygen barrier layer, which is configured to be close to the side surface of the device substrate, is continuous with the side surface of the encapsulating adhesive layer, which is configured to be close to the side surface of the device substrate.

12. The display device according to claim 10, further comprising a second oxygen barrier layer disposed between the encapsulation adhesive layer and the encapsulation substrate. in, The second oxygen barrier layer comprises a metal that oxidizes faster than the packaging substrate.

13. The display device according to claim 12, wherein, The thermal conductivity of the second oxygen barrier layer is less than that of the packaging substrate.

14. The display device according to claim 12, wherein, The second oxygen barrier layer comprises a different material than the first oxygen barrier layer.

15. The display device according to claim 14, wherein, The thermal conductivity of the first oxygen barrier layer is less than that of the second oxygen barrier layer.

16. The display device according to claim 10, wherein, The first oxygen barrier layer includes a first barrier region and a second barrier region, wherein the second barrier region displays a different color than the first barrier region, and The second blocking area is disposed between the first blocking area and the covering insulation layer.

17. The display device according to claim 12, wherein, The first oxygen barrier layer or the second oxygen barrier layer is formed by using a deoxygenation process with hydrogen plasma.

18. The display device according to claim 12, wherein, The surface of the second oxygen barrier layer facing the encapsulation adhesive layer has a greater average surface roughness than the surface of the second oxygen barrier layer facing the encapsulation substrate.

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