Display device

Abstract

A display device includes a display panel including a display area, a back plate disposed below the display panel, a heat dissipation plate disposed to be spaced apart from the back plate, and a reflectivity reducing stack structure disposed between the back plate and the heat dissipation plate.

Description

Technical Field

[0001] This disclosure relates to a display device. Background Technology

[0002] Display devices are used in various electronic devices such as televisions, mobile phones, laptops, and tablets. Therefore, research is underway to develop thinner, lighter, and lower-power display devices.

[0003] Examples of display devices include liquid crystal display (LCD), plasma display panel (PDP), field emission display (FED), electrowetting display (EWD), and organic light-emitting display (OLED).

[0004] In display devices that display various information as images, organic light-emitting display devices (OLEDs) include multiple pixel regions arranged in a display area where images are displayed, and organic light-emitting elements arranged corresponding to the multiple pixel regions. Because organic light-emitting elements are self-emissive, OLEDs offer higher response times, greater luminous efficiency, brightness, and viewing angles, and superior contrast and color reproduction compared to liquid crystal displays. Summary of the Invention

[0005] The embodiments of this disclosure are intended to provide a display device disposed inside a vehicle in the form of a curved surface, providing various information and images, and having improved durability.

[0006] The embodiments of this disclosure are intended to provide a display device that can reduce the reflectivity of a heat sink that dissipates heat generated by the display panel to the outside.

[0007] The embodiments disclosed herein are intended to improve the reliability of vehicle display devices that are exposed to high temperatures or high temperature and high humidity environments for extended periods.

[0008] Therefore, the aim is to build environmentally friendly products by improving vehicle display devices to extend their lifespan and thus delaying the replacement time of vehicle display devices.

[0009] The purposes of this disclosure are not limited to those described above. Other purposes and advantages not mentioned in this disclosure may be understood based on the following description and may be more clearly understood based on embodiments according to this disclosure. Furthermore, it will be readily understood that the purposes and advantages of this disclosure can be achieved using the means or combinations thereof shown in the claims.

[0010] The display device according to an embodiment of the present disclosure includes: a display panel including a display area; a back plate disposed below the display panel; a heat sink disposed spaced apart from the back plate; and a reflectivity reduction stack structure disposed between the back plate and the heat sink.

[0011] According to embodiments of this disclosure, by providing a reflectivity-reducing stacked structure between the back panel and the heat sink of the display device, high interfacial adhesion can be achieved while reducing the reflectivity of the heat sink, thereby improving the reliability of the product.

[0012] According to embodiments of this disclosure, by providing a reflectivity-reducing stacked structure between the back panel and the heat sink of the display device, the reliability of vehicle display devices exposed to high temperature or high temperature and high humidity environments for extended periods can be improved, thereby increasing the service life of the device.

[0013] According to embodiments of this disclosure, by constructing a reflectivity-reducing stack structure including a reflectivity-reducing layer and an adhesion-enhancing layer, and preventing the reflectivity-reducing layer from directly contacting the heat sink, the interfacial adhesion force can be increased to prevent peeling defects.

[0014] According to embodiments of this disclosure, by allowing the adhesives of the reflectivity-reducing layer and the adhesion-enhancing layer of the reflectivity-reducing stacked structure to have the same base adhesive material, interfacial adhesion can be increased to prevent peeling defects.

[0015] Therefore, environmentally friendly products can be built by improving vehicle display devices to have an increased lifespan and delaying the replacement time of vehicle display devices.

[0016] The effects of this disclosure are not limited to those described above, and those skilled in the art will clearly understand other effects not mentioned below based on the following description.

[0017] In addition to the effects described above, the specific effects of this disclosure are also described in conjunction with the specific details for implementing this disclosure. Attached Figure Description

[0018] Figure 1 This is a diagram illustrating an example of an electronic device having a display device according to an embodiment of the present disclosure.

[0019] Figure 2 This is a plan view of a display panel in a display device according to an embodiment of the present disclosure.

[0020] Figure 3 This indicates that it corresponds to Figure 1 An example diagram of a cross-section of a portion of the display area.

[0021] Figure 4 It is intercepted along line I-I' Figure 2 A cross-sectional view of the display device in the image.

[0022] Figures 5 to 7 It is used to explain by Figure 4 A diagram showing the defects caused by the reflectivity-reducing layer in the image.

[0023] Figure 8This is a cross-sectional schematic diagram of a display device according to another embodiment of the present disclosure.

[0024] Figure 9 and Figure 10 This is a diagram used to illustrate the interfacial delamination phenomenon of various types of adhesives in stacked structures with reduced reflectivity.

[0025] Figure 11 This is a table showing the results of evaluating the peel strength and reliability of the stacked structure due to reduced reflectivity.

[0026] Figures 12 to 14 This is a diagram illustrating the thickness variation of a reflectivity-reducing stacked structure in a display device according to another embodiment of the present disclosure.

[0027] Figure 15 and Figure 16 This is a view illustrating a method for manufacturing a reflectivity-reducing stacked structure in a display device according to another embodiment of the present disclosure.

[0028] Figure 17 This is a view illustrating a display device including a reflectivity-reducing stacked structure according to yet another embodiment of the present disclosure. Detailed Implementation

[0029] The advantages and features of this disclosure, as well as the methods for achieving these advantages and features, will become apparent from the following detailed description of the embodiments and accompanying drawings. However, this disclosure is not limited to the embodiments disclosed below, but can be implemented in various different forms. Therefore, these embodiments are merely provided to complete this disclosure and to fully inform those skilled in the art to which this disclosure pertains.

[0030] For simplicity and clarity, the elements in the accompanying drawings are not necessarily drawn to scale. The same reference numerals in different drawings denote the same or similar elements and therefore perform similar functions. Furthermore, for the sake of simplicity, descriptions and details of well-known steps and elements have been omitted. In addition, numerous specific details are set forth in the following detailed description of this disclosure to provide a thorough understanding of the disclosure. However, it should be understood that this disclosure can be practiced without these specific details. In other examples, well-known methods, processes, components, and circuits have not been described in detail so as not to unnecessarily obscure aspects of this disclosure. Examples of various embodiments are further shown and described below. It should be understood that the description herein is not intended to limit the claims to the specific embodiments described. Rather, it is intended to cover substitutions, modifications, and equivalents that may include within the spirit and scope of this disclosure as defined by the appended claims.

[0031] To illustrate embodiments of this disclosure, the shapes, dimensions, scales, angles, quantities, etc., disclosed in the accompanying drawings are illustrative, and this disclosure is not limited thereto. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this disclosure. As used herein, the singular constructs “a” and “an” are also intended to include the plural constructs, unless the context clearly indicates otherwise. It will be further understood that the terms “comprising,” “including,” “containing,” and “comprise” as used in this disclosure specify the presence of a feature, integer, operation, element, and / or component, but do not exclude the presence or addition of one or more other features, integers, operations, elements, components, and / or portions thereof. As used herein, the term “and / or” includes any and all combinations of one or more associated listed items. When preceding a list of elements, expressions such as “at least one” may modify the entire list of elements without modifying individual elements of the list.

[0032] In the interpretation of numerical values, errors or tolerances may occur even when there is no explicit description.

[0033] Furthermore, it should be understood that when a first element or layer is referred to as existing "on" a second element or layer, the first element may be directly disposed on the second element or may be indirectly disposed on the second element, wherein a third element or layer is disposed between the first element or layer and the second element or layer. It should be understood that when a first element or layer is referred to as being "connected to" or "coupled to" a second element or layer, the first element may be directly connected to or coupled to the second element or layer, or one or more intermediate elements or layers may exist therebetween. Furthermore, it should be understood that when an element or layer is referred to as being "between" two elements or layers, it may be the only element or layer between the two elements or layers, or one or more intermediate elements or layers may also exist therebetween.

[0034] Furthermore, as used herein, when a layer, membrane, region, plate, etc., is disposed "above" or "top" of another layer, membrane, region, plate, etc., the former can directly contact the latter, or the other layer, membrane, region, plate, etc., can be disposed between the former and the latter. As used herein, when a layer, membrane, region, plate, etc., is directly disposed "above" or "top" of another layer, membrane, region, plate, etc., the former directly contacts the latter, and no other layer, membrane, region, plate, etc., is disposed between the former and the latter. Furthermore, as used herein, when a layer, membrane, region, plate, etc., is disposed "below" or "below" another layer, membrane, region, plate, etc., the former can directly contact the latter, or the other layer, membrane, region, plate, etc., can be disposed between the former and the latter. As used herein, when a layer, membrane, region, plate, etc., is directly disposed "below" or "below" another layer, membrane, region, plate, etc., the former directly contacts the latter, and no other layer, membrane, region, plate, etc., is disposed between the former and the latter.

[0035] In descriptions of temporal relationships, such as temporal precedence relationships between two events, such as "after," "following," "before," etc., unless otherwise indicated as "directly after," "directly following," or "directly before," another event may occur in between. When an embodiment can be implemented differently, the functions or operations specified in a particular box may occur in a different order than those specified in the flowchart. For example, two consecutive blocks may actually execute substantially simultaneously, or the two blocks may execute in reverse order depending on the functions or operations involved.

[0036] It should be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, regions, layers, and / or time periods, these elements, components, regions, layers, and / or time periods should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, or segment from another element, component, region, layer, or segment. Therefore, without departing from the spirit and scope of this disclosure, a first element, component, region, layer, or segment as described below may be referred to as a second element, component, region, layer, or segment.

[0037] When embodiments can be implemented differently, the functions or operations specified within a particular block can be executed in an order different from that specified in the flowchart. For example, two consecutive blocks can be executed substantially simultaneously, or blocks can be executed in reverse order based on the associated functions or operations.

[0038] Features of the various embodiments of this disclosure can be combined partially or completely with each other, and can be technically related to or operable on each other. Embodiments can be implemented independently of each other, or can be implemented together in an associated relationship.

[0039] When interpreting numerical values, the value is interpreted to include a range of error, unless otherwise explicitly described. Unless otherwise defined, all terms used herein, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It should also be understood that terms such as those defined in common dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant field, and will not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0040] As used herein, terms such as “example,” “example,” and “aspect” should not be construed as making any described aspect or design superior to or better than other aspects or designs. Furthermore, the term “or” means “inclusive or” rather than “exclusive or.” That is, unless otherwise stated or clear from the context, the expression “x uses a or b” indicates one of the naturally inclusive permutations and combinations.

[0041] The terms used in the following description are chosen to be general and common in the relevant art. However, depending on technological development and / or changes, conventions, the preferences of those skilled in the art, etc., other terms may exist besides these. Therefore, the terms used in the description set forth below should not be construed as limiting the technical ideas, but should be understood as examples of terms used to illustrate embodiments. Furthermore, in certain cases, terms may be arbitrarily chosen by the applicant, in which case their detailed meanings will be described in the corresponding descriptive context. Therefore, the terms used in the description set forth below should be understood not only based on the name of the term, but also on the meaning of the term and its content throughout the detailed description.

[0042] In the description of signal flow, for example, when a signal is passed from node A to node B, this may include cases where the signal is passed from node A to node B via another node, unless the phrase "immediately passed" or "directly passed" is used. In this disclosure, unless otherwise stated, "A and / or B" means A, B, or A and B, and unless otherwise stated, "C to D" means inclusive C to inclusive D.

[0043] As used herein, the first direction, the second direction, and the third direction, or the X-axis direction, the Y-axis direction, and the Z-axis direction, should not be interpreted merely as having a geometric relationship between each other in which the first direction, the second direction, and the third direction are perpendicular to each other or the X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other, but can be interpreted as having a geometric relationship between each other in which the first direction, the second direction, and the third direction intersect each other at an angle other than 90 degrees or the X-axis direction, the Y-axis direction, and the Z-axis direction intersect each other at an angle other than 90 degrees, to the extent that the configuration of this disclosure can be functionally operable.

[0044] The display device provided in the embodiments of this disclosure will now be described with reference to the accompanying drawings.

[0045] Figure 1 This is a diagram illustrating an example of an electronic device having a display device according to an embodiment of the present disclosure. Figure 2 This is a plan view of a display panel in a display device according to an embodiment of the present disclosure. Figure 3 This indicates that it corresponds to Figure 1 An example diagram of a cross-section of a portion of the display area. Figure 4 for Figure 2 A cross-sectional view of the display device along line I-I'. Although for ease of description... Figure 2 The display panel 300 is shown in a quadrilateral shape, but the display panel 300 may have a curved shape.

[0046] refer to Figure 1 and Figure 2According to embodiments of the present disclosure, the display device DA can be an automotive display mounted on the front surface of a dashboard inside a vehicle. The applicability widens as the shape of the display panel changes. Therefore, the display device DA can be mounted on a dashboard located behind a handle H inside a vehicle. For example, the vehicle display device DA may include a digital dashboard DA1 displaying various driving information, a vehicle information guide display center information display (CID) DA2, and a passenger seat display DA3.

[0047] The vehicle display device DA can provide a display surface with a shape corresponding to the shape of the front surface of the dashboard to prevent aesthetic degradation of the vehicle interior. For example, the vehicle display device DA can be implemented in the form of a curved surface that includes bending, so that it can be easily set on the front surface of the dashboard in the shape of a curved surface that includes bending in all directions.

[0048] The vehicle display device DA, which includes curved surfaces, includes a curved display panel 300. Since the application range of bending stress varies for each curved surface shape, the impact of bending stress on the display panel 300 may increase as various curved surface shapes are included.

[0049] Reference Figure 2 The display panel 300 may include a first substrate 100, which includes a display area AA and a non-display area NAA located outside the display area AA. The first substrate 100 may be made of an insulating material. For example, the first substrate 100 may be made of glass or resin. Alternatively, the first substrate 100 may be made of a flexible plastic material, such as polyimide.

[0050] The display area AA can be an area where an image is displayed. The non-display area NAA can be an area where no image is displayed. The non-display area NAA can be located in the peripheral area (or edge area) of the first substrate 100, but this disclosure is not limited thereto. For example, the area on the display area AA other than the light-emitting area that emits light to the outside can be called the non-display area NAA.

[0051] Multiple pixels P can be disposed in the display area AA. An image can be displayed in the display area AA through the multiple pixels P. Various lines, circuits, etc., used to operate the multiple pixels P in the display area AA can be disposed in the non-display area NAA. For example, a drive circuit including a gate drive circuit and a data drive circuit can be disposed in the non-display area NAA. Multiple drivers 101 used to drive the display area AA can be disposed in the non-display area NAA. For example, the drivers 101 may include a gate driver, a data driver, a touch controller, etc., but this disclosure is not limited to these.

[0052] Flexible printed circuit board 102 and printed circuit board 104 may be disposed at the edge of at least one edge of the non-display area NAA. One side of flexible printed circuit board 102 may be attached to the first substrate 100, and the other side may be attached to printed circuit board 104. Flexible printed circuit board 102 may include a flexible film. A driver integrated circuit chip 103 may be disposed on flexible printed circuit board 102. Driver integrated circuit chip 103 may include a gate driver and a data driver.

[0053] Printed circuit board 104 can be electrically connected to one or more flexible printed circuit boards 102 and can provide signals to driver integrated circuit chip 103. Components 105 for providing various signals to driver integrated circuit chip 103 can be disposed on printed circuit board 104. For example, component 105 may include timing controller, power supply, memory, processor, etc.

[0054] Each of the multiple pixels P in the display area AA can be composed of multiple sub-pixels SP1, SP2, and SP3. The multiple sub-pixels SP1, SP2, and SP3 can be arrayed on the display area AA. For example, the multiple sub-pixels SP1, SP2, and SP3 can be spaced apart from each other in a first direction X and a second direction Y intersecting the first direction X in the display area AA to form a matrix arrangement. The first direction can be the X-axis direction or a horizontal direction, and the second direction can be the Y-axis direction or a vertical direction. However, this disclosure is not limited to this; the arrangement order and direction of the sub-pixels SP1, SP2, and SP3 can be changed.

[0055] A light-emitting element can be disposed in each of a plurality of sub-pixels SP1, SP2, and SP3. Each of the plurality of sub-pixels SP1, SP2, and SP3 can be connected to at least one transistor disposed on substrate 401. Referring below... Figure 3 This will be described.

[0056] Reference Figure 3 The transistor TR can be disposed on the first substrate 100 of the display panel 300. On the first substrate 100, a driving circuit including various signal lines, transistors, capacitors, etc. can be provided for each sub-pixel SP1, SP2, and SP3. The signal lines may include gate lines, data lines, power lines, and reference lines, and the transistor TR may include switching transistors and driving transistors.

[0057] The switching transistor switches in response to a gate signal provided to the gate line and supplies a data voltage from the data line to the driving transistor, selecting sub-pixels SP1, SP2, and SP3. The driving transistor drives the light-emitting element by supplying power to the sub-pixels SP1, SP2, and SP3 selected from the switching transistor.

[0058] A capacitor is used to hold the data voltage supplied to the driving transistor for one frame. The electrodes of the capacitor can be electrically connected to the driving transistor.

[0059] The transistor TR may include a semiconductor layer 203, a gate electrode 207, and source / drain electrodes 213 and 211. A gate insulating layer 205 may be disposed between the semiconductor layer 203 and the gate electrode 207. A buffer insulating layer 201 may also be included between the substrate 100 and the semiconductor layer 203 to reduce or prevent the penetration of moisture or impurities.

[0060] Semiconductor layer 203 can be made of oxide semiconductor or silicon-based semiconductor materials. For example, semiconductor layer 203 may include transparent oxide semiconductor materials, such as indium gallium zinc oxide (IGZO) or indium zinc oxide (IZO). In another example, semiconductor layer 203 may include polycrystalline silicon semiconductor material.

[0061] The semiconductor layer 203 may include a channel region, a source region, and a drain region. The gate insulating layer 205 may be composed of a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (Sinx).

[0062] The gate electrode 207 can be disposed on the gate insulating layer 205. The region of the semiconductor layer 203 that overlaps with the gate electrode 207 in the vertical direction can be a channel region. The source region and the drain region can be located on opposite sides of the channel region.

[0063] A first insulating layer 209 may be disposed on the gate electrode 207. Source / drain electrodes 213 and 211 extending through the first insulating layer 209 and the gate insulating layer 205 may be configured such that the gate electrode 207 is situated therebetween. Source / drain electrodes 213 and 211 may include a source electrode 213 and a drain electrode 211. Source electrode 213 and drain electrode 211 may be connected to the source region and drain region of the semiconductor layer 203, respectively.

[0064] The second insulating layer 215 may be disposed on the source / drain electrodes 213 and 211. The second insulating layer 215 may be a passivation layer protecting the source / drain electrodes 213 and 211. The second insulating layer 215 may include an inorganic insulating film. For example, the second insulating layer 215 may be composed of a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (Sinx).

[0065] A protective layer 220 may be disposed on the second insulating layer 215. The protective layer 220 is used to planarize the steps created by the lower circuit elements, including the transistor TR. The protective layer 220 may include an organic insulating film. The protective layer 220 may have a multilayer structure. The protective layer 220 may also be referred to as a planarization layer.

[0066] The protective layer 220 may include a contact via that exposes a portion of the surface of the source / drain electrodes 213 and 211 of the transistor TR. The contact via may extend through the protective layer 220.

[0067] The first electrode 230 may be disposed on the protective layer 220. The first electrode 230 may comprise a transparent conductive oxide (TCO), such as indium tin oxide (ITO) or indium zinc oxide (IZO). Optionally, the first electrode 230 may have a single-layer or multi-layer structure, including a reflective metal film made of silver (Ag), aluminum (Al), gold (Au), nickel (Ni), chromium (Cr), and their compounds. However, embodiments of this disclosure are not limited to such materials. The first electrode 230 may also be referred to as an anode electrode or a pixel electrode. In an example, a portion of the first electrode 230 may form a contact via and be electrically connected to the transistor TR.

[0068] A partition 235 may be disposed on the protective layer 220 and the first electrode 230. The partition 235 may be configured to surround the edge of the first electrode 230. The partition 235 may separate adjacent sub-pixels from each other and define the light-emitting area.

[0069] The light-emitting layer 240 may be disposed on the first electrode 230. In an example, the light-emitting layer 240 may include an organic material that emits white light, but this disclosure is not limited thereto.

[0070] The light-emitting layer 240 may include a stacked structure comprising a hole transport layer (HTL), an emissive material layer (EML), an electron transport layer (ETL), a hole blocking layer (HBL), a hole injection layer (HIL), an electron blocking layer (EBL), and an electron injection layer (EIL). In the example, the light-emitting layer 240 may have a multilayer stacked structure in which at least two layers are stacked, but this disclosure is not limited thereto.

[0071] The light-emitting layer 240 can be disposed on the entire surface of the first substrate 100. Therefore, the light-emitting layer 240 can have a shape that extends continuously based on the shape of the side surface and the top surface of the partition 235.

[0072] The second electrode 250 can be disposed on the light-emitting layer 240. The second electrode 250 can be a common layer formed on multiple sub-pixels. The second electrode 250 can also be referred to as a cathode electrode or a common electrode. The second electrode 250 can include materials with transmissive or semi-transmissive properties. When the second electrode 250 has transmissive properties, it can include a transparent conductive oxide. For example, it can include indium tin oxide (ITO), indium zinc oxide (IZO), etc. When the second electrode 250 has semi-transmissive properties, it can include metallic materials such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag).

[0073] A light-emitting element (EL) including a first electrode 230, a light-emitting layer 240, and a second electrode 250 can be realized. A display device according to embodiments of this disclosure may include an organic light-emitting element.

[0074] A sealing structure 265 may be disposed on the second electrode 250. The sealing structure 265 prevents moisture or oxygen from penetrating into the transistor TR and the light-emitting element EL located below the transistor TR. The sealing structure 265 may be a multilayer structure consisting of inorganic and organic insulating layers. The sealing structure 265 may include at least one inorganic insulating layer or at least one organic insulating layer. For example, the sealing structure 265 may include a first encapsulation layer 260, a second encapsulation layer 261, and a third encapsulation layer 263.

[0075] Each of the first encapsulation layer 260 and the third encapsulation layer 263 may include an inorganic insulating material. For example, the inorganic insulating material may be selected from silicon nitride, aluminum nitride, zirconium nitride, titanium nitride, hafnium nitride, tantalum nitride, silicon oxide, aluminum oxide, titanium oxide, etc. The second encapsulation layer 261 may planarize the steps caused by the light-emitting element EL and the barrier 235, and may prevent foreign matter from penetrating into the light-emitting element EL. The second encapsulation layer 261 may include an organic insulating material. For example, the organic insulating material may be polyimide, photoresist, or photoacrylic resin, but this disclosure is not limited to these.

[0076] The polarization layer 270 can be disposed on the top of the display panel 300 and on the sealing structure 265. The polarization layer 270 can suppress the reflection of external light and change the polarization state of the light emitted from the light-emitting element EL. The polarization layer 270 can be bonded to the display panel 300 by an adhesive.

[0077] The light control film 273 can be disposed on the polarization layer 270. The light control film 273 can be bonded to the polarization layer 270 via a first adhesive layer 271. The first adhesive layer 271 may include an optically clear adhesive film (OCA).

[0078] The light control film 273 can be a film used to adjust the directionality of light. The light control film 273 can control the directionality of light so that the screen provided from the display panel 300 does not reflect light onto the windshield of the vehicle.

[0079] The second substrate 280 may be disposed on top of the light control film 273. The second substrate 280 may cover the display panel 300 including the first substrate 100 to protect the transistors TR, light-emitting elements EL, and circuit elements on the first substrate 100. The second substrate 280 transmits light emitted from the display panel 300 to allow the image to be viewed from the outside. The second substrate 280 may be referred to as a cover window, a window cover, or a cover glass.

[0080] The second substrate 280 may include a glass substrate. A second adhesive layer 275 may also be included between the second substrate 280 and the light control film 273. The second adhesive layer 275 may include an optically transparent adhesive film (OCA).

[0081] In one example, the display panel 300 may also include a touch panel capable of inputting information via touch operation. For example, the touch panel may be disposed between the second substrate 280 and the sealing structure 265.

[0082] The front surface of the display panel 300 can be a light-emitting surface, through which light emitted from the light-emitting element EL is emitted to the outside via the second substrate 280. Users can view videos or images emitted from the front surface of the display panel 300 and displayed via the front surface of the second substrate 280 in the display area AA.

[0083] The rear surface opposite the front surface of the display panel 300 can be a light-incident surface onto which light emitted from the light-emitting element EL is incident. A light-shielding pattern 285 can be disposed on the rear surface of the second substrate 280 on the non-display area NAA. The light-shielding pattern 285 can prevent circuit patterns disposed on the non-display area NAA from being visually recognized by the user. For example, circuit patterns disposed on the non-display area NAA may include metal lines, pad electrodes, integrated circuit chips, flexible circuit boards, or printed circuit boards.

[0084] Reference Figure 4 For example, the light-shielding pattern 285 may have a closed-loop shape around the four edges of the rear surface of the second substrate 280. For example, the light-shielding pattern 285 may be configured to include an upper edge region, a lower edge region, a left edge region, and a right edge region. The light-shielding pattern 285 may include a film mixed with an opaque pigment. For example, the opaque pigment may include carbon black or titanium black, but this disclosure is not limited thereto.

[0085] The back panel 310 can be disposed on the rear surface of the display panel 300. (Reference) Figure 4 The backplate 310 can be disposed below the display surface 300. The backplate 310 is used to enhance the rigidity of the display panel 300. For example, the backplate 310 may include a polymer film such as polyethylene terephthalate (PET) or polyimide. The thickness of the backplate 310 can be from 50 μm to 200 μm to reinforce the first substrate 100 of the display panel 300.

[0086] A heat sink 330 may be disposed below a back plate 310 and spaced apart from the back plate 310. The heat sink 330 can enhance the rigidity of the display panel 300. When the light-emitting elements are operated externally, the heat sink 330 can dissipate heat generated inside the display panel 300. The heat sink 330 may include a material with high thermal conductivity. Furthermore, the heat sink 330 may include a metallic material to serve as a grounding member for circuit elements disposed on the display panel 300. For example, the heat sink 330 may include aluminum (Al), copper (Cu), or stainless steel (SUS), but this disclosure is not limited to these. The thickness of the heat sink 330 may be from 18 μm to 700 μm.

[0087] On the heat sink 330 according to an embodiment of the present disclosure, a reflectivity reduction layer 320 may be provided between the heat sink 330 and the back plate 310. The reflectivity reduction layer 320 may be in contact with at least one surface of the back plate 310. The reflectivity reduction layer 320 may have an area size at least the same as that of the heat sink 330.

[0088] The reflectivity-reducing layer 320 may include a material with adhesive properties. Furthermore, the reflectivity-reducing layer 320 may include the function of preventing or reducing the reflection of external light by the heat sink 330, which includes a metallic material. For example, the reflectivity-reducing layer 320 may be an opaque adhesive component. For example, the reflectivity-reducing layer 320 may include a pressure-sensitive adhesive (PSA) made of an opaque material. The reflectivity-reducing layer 320 may be made of a material that includes opaque pigment particles in a base adhesive material. For example, the base adhesive material may include a base resin, acrylic resin, rubber, or silicone resin material. The opaque pigment particles may include a material having a light density value greater than 0.9 in the visible light range to block external light. For example, the opaque pigment particles may be made of carbon black, nickel black, or copper chromite black.

[0089] In one example, a method could be considered that involves coating a heat sink with black ink on its surface and attaching the black ink-coated heat sink to the backplate 310 via a transparent adhesive member. However, it may be difficult to coat the heat sink with black ink evenly, and defects may occur during the coating process, reducing yield.

[0090] Therefore, in embodiments of this disclosure, the heat sink 330 may be attached to the back plate 310 via the reflectivity reduction layer 320 instead of a heat sink with a surface coated with black ink.

[0091] The reflectivity reduction layer 320 can be uniformly disposed between the heat sink 330 and the back plate 310, and can reduce the external light reflectivity of the heat sink 330 because it is a material that includes opaque pigments in the base adhesive material.

[0092] Figures 5 to 7 It is used to explain by Figure 4 A diagram showing the defects caused by the reflectivity-reducing layer in the image. Figure 5 The phenomenon of the display device being raised is shown. Figure 6 This is a table showing the creep and recovery characteristics of the reflectivity-reducing layer. Figure 7 The cause of the irregular spots is shown.

[0093] Because the vehicle display device DA (see Figure 1 Since the vehicle display device (DA) is exposed to the outside environment for most of the time, the evaluation standards for heat resistance and moisture resistance (which do not cause physical changes at high temperatures) are higher than those for general display devices. Furthermore, because the vehicle display device DA is implemented as a curved display panel 300, the heat sink 330 attached to the display panel 300 is also curved along the shape of the curved display panel 300. Therefore, in order to maintain the force that holds the heat sink 330 fixed to the curved display panel 300, high adhesion of the reflectivity reduction layer 320 is required.

[0094] The reflectivity-reducing layer 320 can be a material in which opaque pigment particles are added to the base adhesive material. The opaque pigment particles may not increase the crosslinking density of the base adhesive material, and with the addition of opaque pigment particles, the crosslinking density and entanglement of the base adhesive material can be reduced. When the reflectivity-reducing layer 320 is exposed to a high-temperature environment for an extended period in this state, it may cause the base adhesive material to deteriorate and reduce its adhesion, potentially leading to a defect of separation from the heat sink 330.

[0095] refer to Figure 6 Creep and recovery properties were measured using a 180-degree peel strength measuring device. Comparative Example 1 and Comparative Example 2 were measured using samples with an 8 mm radius and a 1 mm thickness for each material.

[0096] The creep properties were measured under pressure conditions of 10000 Pa and 600 seconds, and the recovery properties were measured under pressure conditions of 0 Pa and 600 seconds. The creep property is the strain rate at which each material of Comparative Example 1 and Comparative Example 2 deforms from its original shape when pressure is applied under the above measurement conditions, and the recovery property is the rate at which it recovers to its original shape when the pressure is removed.

[0097] Comparative Example 1 is a pressure-sensitive adhesive made of a transparent material, and Comparative Example 2 is a pressure-sensitive adhesive made of an opaque material including black pigment.

[0098] Reference Figure 6As can be seen, in Comparative Example 1, the recovery rate at room temperature (25°C) and high temperature (95°C) is 90% or higher, while in Comparative Example 2, the recovery rate at room temperature (25°C) is 90% or higher, but the recovery rate at high temperature (95°C) is only 22%. Therefore, it can be seen that the pressure-sensitive adhesive made of an opaque material including black pigment has a lower recovery rate at high temperatures than the pressure-sensitive adhesive made of a transparent material. It is understandable that the pressure-sensitive adhesive made of an opaque material including black pigment reduces the cohesive force of the black particles that become unstable at high temperatures, thus reducing its resilience.

[0099] Furthermore, when the reflectivity-reducing layer 320 is in direct contact with the surface of the heat sink 330, defects such as irregular spots may appear on the heat sink 330. For example, see reference... Figure 7 Opaque pigment particles 320a added to the base adhesive material may protrude from the surface of the reflectivity-reducing layer 320 to create surface irregularities. Figure 7 (a)). During the process of bonding the reflectivity-reducing layer 320 with surface irregularities to the heat sink 330, fine air bubbles 320b may be generated between the reflectivity-reducing layer 320 and the heat sink 330 (see (a)). Figure 7 (b)). Since the heat sink 330 is relatively rigid compared to the polymer film with flexible properties, fine bubbles 320b can be generated, and therefore the surface irregularities of the reflectivity-reducing layer 320 are not covered. In addition, when the fine bubbles 320b are generated and exposed to a high-temperature environment, the fine bubbles 320b can expand at high temperatures, and visually identifiable irregular spots of the expanded fine bubbles 320b can occur. Figure 7 (c) in the middle.

[0100] Therefore, it may include components that can maintain a fixing force with the heat sink while reducing the external light reflectivity of the heat sink.

[0101] Figure 8 This is a cross-sectional schematic diagram of a display device according to another embodiment of the present disclosure. Figure 8 In the diagram, the same reference numerals will be assigned to the same reference numerals. Figure 3 and Figure 4 The components described herein are the same as those in the previous section, and their descriptions will be either omitted or simply presented.

[0102] Reference Figure 8The backplate 310 can be disposed on the bottom surface of the display panel 300. The polarizing layer 270, the light control film 273, and the second substrate 280 can be disposed on the upper surface of the display panel 300. The polarizing layer 270 and the light control film 273 can be bonded to each other via a first adhesive layer 271, and the second substrate 280 can be bonded to the lower structure via a second adhesive layer 275. In one example, the display panel 300 may also include a touch panel capable of inputting information via touch operation. For example, the touch panel may be disposed between the second substrate 280 and the sealing structure 265.

[0103] The heat sink 330 can be spaced apart from the back plate 310. The heat sink 330 can enhance the rigidity of the display panel 300 and dissipate heat generated inside the display panel 300 to the outside. For this purpose, the heat sink 330 can include a metallic material with high thermal conductivity, but this disclosure is not limited to this. For example, the heat sink 330 can include aluminum (Al), copper (Cu), or stainless steel (SUS). The thickness of the heat sink 330 can be from 18 μm to 700 μm. When the thickness of the heat sink 330 is less than 18 μm, pinholes may occur, leading to defects. Furthermore, when the thickness of the heat sink 330 is greater than 700 μm, repulsive forces are generated due to the thickness of the heat sink 330, making it difficult to achieve a curved display panel.

[0104] The reflectivity-reducing stack structure 345 can be disposed between the backplate 310 and the heat sink 330.

[0105] The reflectivity reduction stack structure 345 may include a reflectivity reduction layer 320 and an adhesion enhancement layer 340. The reflectivity reduction layer 320 may be disposed below the backplate 310, with one surface of the reflectivity reduction layer 320 in contact with one surface of the backplate 310. One surface of the adhesion enhancement layer 340 may be disposed on top of the heat sink 330 and in contact with one surface of the heat sink 330. Furthermore, the other surfaces of the reflectivity reduction layer 320 and the other surface of the adhesion enhancement layer 340 may be configured to contact each other.

[0106] The reflectivity-reducing layer 320 can prevent or reduce the reflection of external light by the heat sink 330. The reflectivity-reducing layer 320 may include a pressure-sensitive adhesive (PSA) made of an opaque material. The reflectivity-reducing layer 320 may be made of a material that includes opaque pigment particles in a base adhesive material.

[0107] One surface of the adhesion enhancement layer 340 may contact one surface of the heat sink 330. The adhesion enhancement layer 340 can increase the adhesion between the heat sink 330 and the reflectivity reduction stack structure 345 to prevent the heat sink 330 from being peeled off. For example, the adhesion enhancement layer 340 can prevent the reflectivity reduction layer 320 from directly contacting the heat sink 330 and causing irregular spots on the surface of the heat sink 330, or prevent defects such as lifting of the reflectivity reduction layer 320.

[0108] The adhesion enhancement layer 340 may include a pressure-sensitive adhesive (PSA) made of a transparent material. For example, the base adhesive material of the adhesion enhancement layer 340 may include a base resin, acrylic resin, rubber, or silicone material.

[0109] To increase adhesion, the reflectivity-reducing layer 320 and the adhesion-enhancing layer 340 have a cross-linked structure, wherein the base adhesive material of the adhesive in the reflectivity-reducing layer 320 constituting the cross-linked structure is the same as the base adhesive material of the adhesive in the adhesion-enhancing layer 340 constituting the cross-linked structure. This will... Figure 9 and Figure 10 This will be described later.

[0110] In a display device according to another embodiment of the present disclosure, a reflectivity reduction stack structure 345 may be disposed between a back plate 310 and a heat sink 330, thereby reducing the reflectivity of the heat sink 330 and improving the reliability of the vehicle display device exposed to high temperature or high temperature and high humidity environments.

[0111] Figure 9 and Figure 10 This is a diagram used to illustrate the interfacial delamination phenomenon of corresponding types of adhesives in stacked structures with reduced reflectivity. Figure 11 This is a table showing the results of evaluating the peel strength and reliability of stacked structures affected by reduced reflectivity. Figure 9 and Figure 10 For ease of description, only the backplate 310, reflectivity-reducing layer 320, adhesion-enhancing layer 340, and heat sink 330 are shown. Figure 11 In the diagram, the letter "I" indicates the peeling result at the interface.

[0112] refer to Figure 9 One surface of the backplate 310 may be configured to contact the reflectivity reduction layer 320 of the reflectivity reduction stack structure 345, and one surface of the heat sink 330 may be configured to contact the adhesion enhancement layer 340 of the reflectivity reduction stack structure 345.

[0113] The base adhesive material of the adhesive constituting the reflectivity-reducing layer 320 of the cross-linked structure is the same as the base adhesive material of the adhesive constituting the adhesion-reinforcing layer 340 of the cross-linked structure. For example, the base adhesive material may include a base resin, acrylic resin, rubber, or silicone material. In this respect, when the base adhesive material of the reflectivity-reducing layer 320 is an acrylic resin material, the base adhesive material of the adhesion-reinforcing layer 340 may be the same acrylic resin material.

[0114] Therefore, at each of the first interface 400a where the reflectivity-reducing layer 320 contacts the backplate 310 and the second interface 400b where the adhesion-enhancing layer 340 contacts the heat sink 330, the layers and the plate can be attached to each other via a base adhesive material comprising the same adhesive.

[0115] refer to Figure 10 The base adhesive materials for the reflectivity-reducing layer 320 and the adhesion-enhancing layer 340 can have adhesives made of different materials that participate in cross-linking structures. For example, when the base adhesive material for the reflectivity-reducing layer 320 is an acrylic resin material, the base adhesive material for the adhesion-enhancing layer 340 can be a silicone material with an adhesive that is different from the adhesive of the reflectivity-reducing layer 320.

[0116] Therefore, at each of the first interface 400a where the reflectivity-reducing layer 320 contacts the backplate 310 and the second interface 410b where the adhesion-enhancing layer 340 contacts the heat sink 330, the layers and the plate can be attached to each other via a base adhesive material comprising different adhesives.

[0117] exist Figure 11 In this study, the peel strength and reliability of the reflectivity-reducing stack structure were evaluated. Adhesion force was measured using a 180° peel strength meter at a speed of 5 mm / s. Each of the reflectivity-reducing layer 320 and the adhesion-enhancing layer 340 was positioned with a width of 1 inch. 180° peel strength measurements were performed at the first interface between the backplate and the reflectivity-reducing layer, and at the second interface between the adhesion-enhancing layer and the heat sink. Furthermore, the reflectivity-reducing stack structure was positioned between the backplate and the heat sink, and measurements were performed after one day or after an autoclave test. 180° peel strength was measured under three conditions: a first condition of 25°C to measure room temperature adhesion, a second condition of 100°C to measure high-temperature adhesion, and a third condition of 85°C and 85% RH to measure high-temperature and high-humidity adhesion.

[0118] Reference Figure 11In Example 1, the reflectivity-reducing layer 320 and the adhesion-enhancing layer 340 of the reflectivity-reducing stacked structure 345 according to an embodiment of the present disclosure have the same adhesive as their base adhesive materials. Comparative Example 1 shows the reflectivity-reducing layer 320 and the adhesion-enhancing layer 340 of the reflectivity-reducing stacked structure 345 using different adhesives. Furthermore, Comparative Example 2 shows the case where only a single layer of reflectivity-reducing layer 320 is formed.

[0119] As can be seen, in Example 1, the reflectivity-reducing layer 320 and the adhesion-enhancing layer 340 exhibit adhesion to the backplate 310 and the heat sink 330 respectively, at high temperatures equal to or greater than 0.5 kgf / inch, and at high temperature and high humidity equal to or greater than 0.2 kgf / inch. Furthermore, it can be seen that they do not peel off even during a 250-hour reliability test under conditions of bending to 800R. Here, 800R represents the degree of bending of a circle with a radius of 800 mm.

[0120] In contrast, it can be seen that in Comparative Example 1, peeling occurred under room temperature, high temperature, and high temperature and high humidity conditions (I). Furthermore, it can be seen that a defect occurred in the reliability test. Additionally, in Comparative Example 2, it can be seen that the adhesion under high temperature conditions was less than 0.01 kgf / inch, and a defect occurred in the reliability test. Therefore, it can be seen that in Comparative Example 2, peeling occurred even when a force of less than 10 g was applied.

[0121] Therefore, when a reflectivity-reducing stack structure 345 comprising a reflectivity-reducing layer 320 and an adhesion-enhancing layer 340 containing the same adhesive material is provided between the backplate 310 and the heat sink 330, high interfacial adhesion can be achieved while reducing the reflectivity of the heat sink 330, thereby improving the reliability of the product.

[0122] Figures 12 to 14 This is a diagram illustrating the thickness variation of a reflectivity-reducing stacked structure in a display device according to another embodiment of the present disclosure.

[0123] refer to Figures 12 to 14 In another embodiment of the display device according to the present disclosure, the optical properties and adhesive properties may vary depending on the component ratio in the total thickness of the reflectivity-reducing stacked structure.

[0124] refer to Figures 12 to 14Each reflectivity-reducing stack structure may include an adhesion enhancement layer 340 and a reflectivity-reducing layer 320. One surface of the adhesion enhancement layer 340 may be attached to a heat sink 330, and one surface of the reflectivity-reducing layer 320 may be attached to a backplate 310. The total thickness of the reflectivity-reducing stack structure may be from 25 μm to 200 μm, for example, 50 μm. Within the total thickness of the reflectivity-reducing stack structure, the reflectivity-reducing layer 320 may have a first thickness of at least greater than 10 μm, and the adhesion enhancement layer 340 may have a second thickness of at least greater than 10 μm.

[0125] refer to Figure 12 The adhesion enhancement layer 340 may have a first thickness 340-t1, and the reflectivity reduction layer 320 may have a second thickness 320-t1 that is less than the first thickness 340-t1. For example, in the total thickness of the reflectivity reduction stack structure, the first thickness 340-t1 may be 40 μm, and the second thickness 320-t1 may be 10 μm.

[0126] refer to Figure 13 The adhesion enhancement layer 340 may have a first thickness 340-t2, and the reflectivity reduction layer 320 may have a second thickness 320-t2 equal to the first thickness 340-t2. For example, in the total thickness of the reflectivity reduction stack structure, each of the first thickness 340-t2 and the second thickness 320-t2 may be 25 μm.

[0127] refer to Figure 14 The adhesion enhancement layer 340 may have a first thickness 340-t3, and the reflectivity reduction layer 320 may have a second thickness 320-t3 greater than the first thickness 340-t3. For example, in the total thickness of the reflectivity reduction stack structure, the first thickness 340-t1 may be 10 μm, and the second thickness 320-t1 may be 40 μm.

[0128] As the thickness of the adhesion enhancement layer 340 increases, the adhesion to the heat sink 330 can be enhanced. As the thickness of the reflectivity reduction layer 320 increases, the optical density (OD) value can increase, thereby reducing the reflectivity of the heat sink 330.

[0129] The reflectivity of the heat sink 330 can be reduced only when the optical density (OD) value is greater than 0.9. However, when the thickness of the reflectivity reduction layer 320 is less than 10 μm, the optical density (OD) value becomes less than 0.9. Therefore, preferably, the thickness of the reflectivity reduction layer 320 is greater than 10 μm.

[0130] In addition, when the thickness of the adhesion enhancement layer 340 is less than 10 μm, the adhesion to the heat sink 330 decreases rapidly. Therefore, it is preferable that the thickness of the adhesion enhancement layer 340 is greater than 10 μm.

[0131] Depending on the method used to manufacture the components of the reduced reflectivity stacked structure, peeling defects may occur. This is explained below with reference to the accompanying drawings.

[0132] Figure 15 and Figure 16 This is a view illustrating a method for manufacturing a reflectivity-reducing stacked structure in a display device according to another embodiment of the present disclosure.

[0133] As one method for bonding the reflectivity-reducing layer 320 and the adhesion-enhancing layer 340 to each other, there is a method of performing thermosetting and / or UV curing on each of the reflectivity-reducing layer 320 and the adhesion-enhancing layer 340 and then bonding them together.

[0134] For example, such as Figure 15 As shown, a reflectivity-reducing layer 320 and an adhesion-enhancing layer 340, both heat-cured and / or UV-cured, are prepared. Here, a release film 350 is attached to both surfaces of each of the reflectivity-reducing layer 320 and the adhesion-enhancing layer 340.

[0135] When the reflectivity-reducing layer 320 and the adhesion-enhancing layer 340 undergo a curing process, the reflectivity-reducing layer 320 and the adhesion-enhancing layer 340 are in a cross-linked state through cross-linking agents CL1 and CL2 in the adhesives BD1 and BD2, respectively. Adhesives BD1 and BD2 can also be referred to as base adhesive materials.

[0136] Subsequently, the release film 350 is removed from one surface of each of the reflectivity reducing layer 320 and the adhesion enhancing layer 340. Furthermore, the surfaces of the reflectivity reducing layer 320 and the adhesion enhancing layer 340 without the release film 350 are positioned facing each other and then bonded together in a roll-to-roll manner.

[0137] Then, since the interiors of the reflectivity reduction layer 320 and the adhesion enhancement layer 340 are already chemically bonded by crosslinking agents CL1 and CL2, no further chemical bonding occurs at the interface where the reflectivity reduction layer 320 and the adhesion enhancement layer 340 come into contact with each other.

[0138] Therefore, the adhesion between the reflectivity reduction layer 320 and the adhesion enhancement layer 340 may be reduced, and thus separation defects (DF) may easily occur due to external environment (e.g., high temperature and high humidity environment).

[0139] Therefore, in embodiments of this disclosure, a process method capable of preventing separation at the interface between the reflectivity-reducing layer 320 and the adhesion-enhancing layer 340 of the reflectivity-reducing stack structure can be used.

[0140] For example, refer to Figure 16The reinforced structure can be formed by performing a roll-to-roll bonding followed by thermosetting and / or UV curing. For this purpose, firstly, a reflectivity-reducing layer 320 and an adhesion-reinforcing layer 340 are prepared. A release film 350 is attached to one surface of each of the reflectivity-reducing layer 320 and the adhesion-reinforcing layer 340. Preferably, the reflectivity-reducing layer 320 and the adhesion-reinforcing layer 340 comprise an adhesive BD of the same material.

[0141] Next, the surfaces of the reflectivity-reducing layer 320 and the unattached release film 350 of the adhesion-enhancing layer 340 are positioned facing each other and then bonded together in a roll-to-roll manner. Furthermore, curing is performed using thermal and / or UV methods.

[0142] Then, at the interface where the reflectivity-reducing layer 320 and the adhesion-enhancing layer 340, which are composed of the same material as the adhesive BD, are in contact with each other, chemical bonding can occur between the adhesive BD and the crosslinking agent, thereby improving the interfacial adhesion.

[0143] In one example, a structure may be included to improve the adhesion between the backing plate 310 and the reflectivity-reducing layer 430.

[0144] Figure 17 This is a view illustrating a display device including a reflectivity-reducing stacked structure according to another embodiment of the present disclosure. Figure 17 For ease of description, only the backplate 310, the reflectivity reduction layer 320, the adhesion enhancement layer 340, and the heat sink 330 are shown.

[0145] refer to Figure 17 Multiple pattern structures 310-t can be disposed in one surface of the back plate 310. The multiple pattern structures 310-t can be recessed in the thickness direction of the back plate 310. Adjacent pattern structures 310-t can be arranged to be spaced apart from each other. The multiple pattern structures 310-t can have a shape extending in the longitudinal direction of the back plate 310, but this disclosure is not limited thereto.

[0146] In addition, for ease of description, Figure 17 The cross-section shown has a triangular shape, but this disclosure is not limited thereto. For example, the cross-section may include trapezoidal and quadrilateral shapes.

[0147] The reflectivity-reducing layer 320 can be configured to contact the surface of the backplate 310 having a plurality of patterned structures 310-t. The reflectivity-reducing layer 320 can fill the plurality of patterned structures 310-t having recessed shapes. Therefore, the reflectivity-reducing layer 320 can include a first region and a second region, the first region having a surface contacting the flat surface of the backplate 310, and the second region having a plurality of protruding patterns 320p protruding beyond the flat surface, while also being filled with the plurality of patterned structures 310-t. Because the surface area of ​​the interface between the reflectivity-reducing layer 320 and the backplate 310 is increased by the plurality of patterned structures 310-t, adhesion can be improved by 10% or more.

[0148] Furthermore, the area in the back panel 310 where the multiple pattern structures 310-t are provided can have a first thickness, and the area where the multiple pattern structures 310-t are not provided can have a second thickness, the first thickness being less than the second thickness. In the area with the first thickness, the interface stress caused by the bending or flexing shape of the display panel can be reduced. Therefore, defects caused by interface stress in the display device can be prevented, thereby maintaining the reliability of the product.

[0149] The display apparatus according to various aspects and embodiments of this disclosure can be described as follows.

[0150] According to one aspect of this disclosure, a display device is provided, comprising: a display panel including a display area; a back plate disposed below the display panel; a heat sink disposed spaced apart from the back plate; and a reflectivity reduction stack structure disposed between the back plate and the heat sink.

[0151] In some embodiments of the display device, the reflectivity reduction stack structure includes a reflectivity reduction layer that is in contact with at least one surface of the backplane.

[0152] In some embodiments of the display device, the reflectivity reduction stack structure further includes an adhesion enhancement layer disposed below the reflectivity reduction layer, one surface of the reflectivity reduction layer being in contact with one surface of the backplate, and one surface of the adhesion enhancement layer being in contact with one surface of the heat sink.

[0153] In some embodiments of the display device, the display device further includes: a first substrate having transistors and light-emitting elements disposed thereon, the transistors and light-emitting elements being configured to output light for displaying an image in a display area; a polarization layer disposed on top of the display panel; a light control film disposed on top of the polarization layer; and a second substrate disposed on top of the light control film.

[0154] In some embodiments of the display device, the reflectivity reduction layer comprises a pressure-sensitive adhesive made of an opaque material.

[0155] In some embodiments of the display device, the pressure-sensitive adhesive made of an opaque material includes a base adhesive material and opaque pigment particles dispersed in the base adhesive material.

[0156] In some embodiments of the display device, the opaque pigment particles are made of carbon black, nickel black, or copper chromite black.

[0157] In some embodiments of the display device, the reflectivity reduction layer and the adhesion enhancement layer have a cross-linked structure, wherein the base adhesive material of the adhesive of the reflectivity reduction layer constituting the cross-linked structure is the same as the base adhesive material of the adhesive of the adhesion enhancement layer constituting the cross-linked structure.

[0158] In some embodiments of the display device, the total thickness of the reflectivity-reducing stack structure is in the range of 25 μm to 200 μm.

[0159] In some embodiments of the display device, the reflectivity reduction layer has a first thickness of at least 10 μm in the total thickness of the reflectivity reduction stack structure.

[0160] In some embodiments of the display device, the adhesion enhancement layer has a second thickness of at least 10 μm in the total thickness of the reflectivity-reducing stack structure.

[0161] In some embodiments of the display device, the back panel further includes a plurality of patterned structures recessed in the thickness direction on one surface of the back panel.

[0162] In some embodiments of the display device, the reflectivity-reducing layer includes: a first region in contact with a flat surface of a back panel; and a second region including multiple protruding patterns extending beyond the flat surface while filling multiple patterned structures.

[0163] In some embodiments of the display device, the backplate has a first thickness in a first region where multiple patterned structures are provided, and a second thickness in a second region where multiple patterned structures are not provided, wherein the first thickness is less than the second thickness.

[0164] Although some embodiments of the present disclosure have been described above with reference to the accompanying drawings, the present disclosure is not limited to these embodiments and can be implemented in various different forms. Those skilled in the art to which this disclosure pertains will understand that the present disclosure can be implemented in other specific forms without altering the technical concept or essential characteristics of the present disclosure. Therefore, it should be understood that the embodiments described above are not limiting but illustrative in all respects.

Claims

1. A display device, comprising: The display panel, including the display area; The back panel is located below the display panel; A heat sink spaced apart from the back plate; as well as A reflectivity-reducing stack structure is disposed between the back plate and the heat sink.

2. The display device according to claim 1, wherein, The reflectivity-reducing stack structure includes a reflectivity-reducing layer that is in contact with at least one surface of the backplate.

3. The display device according to claim 2, wherein, The reflectivity-reducing stack structure further includes an adhesion-enhancing layer disposed beneath the reflectivity-reducing layer. One surface of the reflectivity-reducing layer is in contact with one surface of the backplate. One surface of the adhesion enhancement layer is in contact with one surface of the heat sink.

4. The display device according to claim 1, further comprising: A first substrate, on which transistors and light-emitting elements are disposed, the light-emitting elements being configured to output light for displaying an image in the display area; A polarizing layer disposed on the top of the display panel; A light control film disposed on top of the polarization layer; as well as A second substrate is disposed on top of the light control film.

5. The display device according to claim 2, wherein, The reflectivity-reducing layer comprises a pressure-sensitive adhesive made of an opaque material.

6. The display device according to claim 5, wherein, The pressure-sensitive adhesive made from the opaque material comprises a base adhesive material and opaque pigment particles dispersed in the base adhesive material.

7. The display device according to claim 6, wherein, The opaque pigment particles are made of carbon black, nickel black, or copper chromite black.

8. The display device according to claim 3, wherein, The reflectivity-reducing layer and the adhesion-enhancing layer have a cross-linked structure, wherein the base adhesive material of the adhesive of the reflectivity-reducing layer constituting the cross-linked structure is the same as the base adhesive material of the adhesive of the adhesion-enhancing layer constituting the cross-linked structure.

9. The display device according to claim 3, wherein, The total thickness of the reflectivity-reducing stacked structure is in the range of 25 μm to 200 μm.

10. The display device according to claim 9, wherein, In the total thickness of the reflectivity-reducing stacked structure, the reflectivity-reducing layer has a first thickness of at least 10 μm.

11. The display device according to claim 9, wherein, In the total thickness of the reflectivity-reducing stacked structure, the adhesion enhancement layer has a second thickness of at least 10 μm.

12. The display device according to claim 3, wherein, The backplate further includes a plurality of patterned structures recessed in the thickness direction on one of its surfaces.

13. The display device according to claim 12, wherein, The reflectivity reduction layer includes: A first region, the first region being in contact with a flat surface of the back plate; and The second region includes multiple protruding patterns that extend beyond the flat surface while filling the plurality of patterned structures.

14. The display device according to claim 12, wherein, The backplate has a first thickness in a first region where the plurality of patterned structures are provided, and a second thickness in a second region where the plurality of patterned structures are not provided. Wherein, the first thickness is less than the second thickness.

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