Display panel, display device and preparation method of display panel

Abstract

The invention discloses a display panel, a display device and a preparation method of the display panel. The display panel comprises a display area and a binding area. The display panel further comprises a first conductive layer and a pixel definition layer, and the first conductive layer comprises a first conductive part located in the binding area. The first conductive part comprises a first branch part and a second branch part, the first branch part is sunken towards the substrate side, and when a packaging material and an electrode material are subsequently prepared, the film layer thickness of the packaging material and the electrode material near the contact position of the first inclined part and the first flat part is relatively thin. A part of the pixel limiting part is arranged on one side of the first inclined part and covers at least a part of the first inclined part so as to protect at least a part of the first inclined part, so that the problems that the packaging material and the electrode material in the region are etched subsequently, the over-etching is easy to occur and the first conductive part in the region is damaged by etching can be solved; therefore, the problems that holes are formed in the first conductive part and the overlapping performance is reduced are solved, and the use performance of the display panel is improved.

Description

Technical Field

[0001] This application relates to the field of displays, specifically to a display panel, a display device, and a method for manufacturing the display panel. Background Technology

[0002] Organic light-emitting diodes (OLEDs) and flat panel displays based on light-emitting diodes (LEDs) are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide range of applications, becoming the mainstream of display devices.

[0003] However, the performance of current OLED display products needs to be improved. Summary of the Invention

[0004] This application provides a display panel, a display device, and a method for manufacturing the display panel, aiming to improve the performance of the display panel.

[0005] A first aspect of this application provides a display panel, the display panel including a display area and a bonding area located on one side of the display area, the display panel further including: a substrate; a first conductive layer located on one side of the substrate, the first conductive layer including a first conductive portion located in the bonding area, the first conductive portion including a first portion recessed toward the substrate and a second portion located around the periphery of the first portion, the first portion including a first flat portion and a first inclined portion located between the first flat portion and the second portion; a pixel defining layer located on one side of the substrate, the pixel defining layer including a pixel defining portion and a pixel opening formed by the pixel defining portion and located in the display area; wherein at least a portion of the first inclined portion is projected onto the substrate within the projection of the pixel defining portion onto the substrate.

[0006] According to an embodiment of the first aspect of this application, the pixel limiting portion surrounds and forms an overlapping hole, and at least a portion of the first flat portion is exposed through the overlapping hole.

[0007] According to any of the foregoing embodiments of the first aspect of this application, the pixel defining portion extends from one side of the first inclined portion to one side of the first flat portion to cover the first inclined portion and a portion of the first flat portion.

[0008] According to any of the foregoing embodiments of the first aspect of this application, the minimum distance between the orthographic projection of the pixel limiting portion toward the overlapping hole onto the substrate and the orthographic projection of the first inclined portion onto the substrate is greater than or equal to 0.5 μm.

[0009] According to any of the foregoing embodiments of the first aspect of this application, the width of the overlapping hole is greater than or equal to 3 μm.

[0010] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the second portion on the substrate is located within the orthographic projection of the pixel limiting portion on the substrate.

[0011] According to any of the foregoing embodiments of the first aspect of this application, the pixel limiting portion covers the sidewall of the second portion away from the first portion.

[0012] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes: a second conductive layer located between the substrate and the first conductive layer, the second conductive layer including a second conductive portion located in the bonding region, and at least a portion of the second conductive portion having its orthographic projection on the substrate located within the orthographic projection of the first conductive portion on the substrate.

[0013] According to any of the foregoing embodiments of the first aspect of this application, the first conductive portion is disposed to cover the sidewall of the second conductive portion.

[0014] According to any of the foregoing embodiments of the first aspect of this application, the second conductive portion includes a third portion and a fourth portion located around the third portion. The third portion includes a second flat portion and a second inclined portion located between the second flat portion and the fourth portion. The first flat portion is located on the side of the second flat portion away from the substrate.

[0015] According to any of the foregoing embodiments of the first aspect of this application, the first inclined portion is located on the side of the second inclined portion away from the substrate.

[0016] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes: a third conductive layer located between the substrate and the second conductive layer, the third conductive layer including a third conductive portion located in the bonding region, and the second conductive portion and the third conductive portion being electrically connected.

[0017] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes: an insulating layer located between the third conductive layer and the second conductive layer, wherein the second conductive portion and the third conductive portion are electrically connected through a via on the insulating layer.

[0018] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the first flat portion on the insulating layer is located within the via.

[0019] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes: an isolation structure located on the substrate and in the display area, the isolation structure enclosing and forming a plurality of isolation openings, the isolation openings communicating with pixel openings.

[0020] According to any of the foregoing embodiments of the first aspect of this application, the isolation structure includes a first layer and a second layer, the second layer being located on the side of the first layer away from the substrate, and the orthographic projection of the first layer onto the substrate being located within the orthographic projection of the second layer onto the substrate.

[0021] According to any of the foregoing embodiments of the first aspect of this application, the first layer includes a conductive material.

[0022] According to any of the foregoing embodiments of the first aspect of this application, the second layer includes a conductive material or an insulating material.

[0023] According to any of the foregoing embodiments of the first aspect of this application, both the first layer and the second layer comprise metallic materials, and the materials of the first layer and the second layer are different.

[0024] According to any of the foregoing embodiments of the first aspect of this application, the isolation structure further includes a third layer located on the side of the first layer facing the substrate, wherein the orthographic projection of the first layer on the substrate is located within the orthographic projection of the third layer on the substrate.

[0025] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes: a light-emitting layer located on a substrate, the light-emitting layer including a plurality of light-emitting units located in the display area, the light-emitting units being located within pixel openings.

[0026] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes: a first electrode layer located on the side of the light-emitting layer away from the substrate, the first electrode layer including a first electrode located in the isolation opening, the first electrode being electrically connected to the isolation structure.

[0027] According to any of the foregoing embodiments of the first aspect of this application, the orthographic projection of the light-emitting unit on the substrate is located within the orthographic projection of the first electrode on the substrate.

[0028] According to any of the foregoing embodiments of the first aspect of this application, the light-emitting unit and the isolation structure are arranged at intervals.

[0029] According to any of the foregoing embodiments of the first aspect of this application, the display panel further includes a second electrode, which is located between the substrate and the pixel definition layer and is exposed through a pixel opening.

[0030] A second aspect of this application provides a display panel, the display panel including a display area and a bonding area located on one side of the display area, the display panel further including: a substrate; a first conductive layer located on one side of the substrate, the first conductive layer including a first conductive portion located in the bonding area, the first conductive portion including a first portion recessed toward the substrate and a second portion located around the first portion, the first portion including a first flat portion and a first inclined portion located between the first flat portion and the second portion; a pixel defining layer located on one side of the substrate, the pixel defining layer including a pixel defining portion and a pixel opening formed by the pixel defining portion and located in the display area, the pixel defining portion covering a portion of the first flat portion; wherein, the orthographic projections of the second portion and the first inclined portion onto the substrate are located within the orthographic projection of the pixel defining portion onto the substrate, and the minimum distance between the edge of the orthographic projection of the pixel defining portion onto the substrate near the first inclined portion and the orthographic projection of the first inclined portion onto the substrate is greater than or equal to 0.5 μm.

[0031] According to an embodiment of the second aspect of this application, the pixel limiting portion surrounds and forms an overlapping hole, and at least a portion of the first flat portion is exposed through the overlapping hole.

[0032] According to any of the foregoing embodiments of the second aspect of this application, the width of the overlapping hole is greater than or equal to 3 μm.

[0033] According to any of the foregoing embodiments of the second aspect of this application, the pixel limiting portion covers the sidewall of the second portion away from the first portion.

[0034] According to any of the foregoing embodiments of the second aspect of this application, the display panel further includes: a second conductive layer located between the substrate and the first conductive layer, the second conductive layer including a second conductive portion located in the bonding region, and at least a portion of the second conductive portion having its orthographic projection on the substrate located within the orthographic projection of the first conductive portion on the substrate.

[0035] According to any of the foregoing embodiments of the second aspect of this application, the first conductive portion is disposed to cover the sidewall of the second conductive portion.

[0036] According to any of the foregoing embodiments of the second aspect of this application, the second conductive portion includes a third portion and a fourth portion located around the third portion. The third portion includes a second flat portion and a second inclined portion located between the second flat portion and the fourth portion. The first flat portion is located on the side of the second flat portion away from the substrate.

[0037] According to any of the foregoing embodiments of the second aspect of this application, the first inclined portion is located on the side of the second inclined portion away from the substrate.

[0038] According to any of the foregoing embodiments of the second aspect of this application, the display panel further includes: a third conductive layer located between the substrate and the second conductive layer, the third conductive layer including a third conductive portion located in the bonding region, and the second conductive portion and the third conductive portion being electrically connected.

[0039] According to any of the foregoing embodiments of the second aspect of this application, the display panel further includes: an insulating layer located between the third conductive layer and the second conductive layer, wherein the second conductive portion and the third conductive portion are electrically connected through a via on the insulating layer.

[0040] According to any of the foregoing embodiments of the second aspect of this application, the orthographic projection of the first flat portion on the insulating layer is located within the via.

[0041] According to any of the foregoing embodiments of the second aspect of this application, the display panel further includes: an isolation structure located on the substrate and in the display area, the isolation structure enclosing and forming a plurality of isolation openings.

[0042] An embodiment of the third aspect of this application provides a display device that includes a display panel of any of the above embodiments.

[0043] An embodiment of the fourth aspect of this application provides a method for manufacturing a display panel, the display panel including a display area and a bonding area located on one side of the display area, the method comprising:

[0044] A first conductive layer is prepared on a substrate. The first conductive layer includes a first conductive portion located in a bonding region. The first conductive portion includes a first portion recessed toward the substrate and a second portion located around the periphery of the first portion. The first portion includes a first flat portion and a first inclined portion located between the first flat portion and the second portion.

[0045] A pixel definition layer is prepared on the side of the first conductive layer away from the substrate. The pixel definition layer includes a pixel defining portion and a pixel opening formed by the pixel defining portion and located in the display area. At least a portion of the first inclined portion is projected onto the substrate within the projection of the pixel defining portion onto the substrate.

[0046] The fifth aspect of this application provides another method for manufacturing a display panel, the display panel including a display area and a bonding area located on one side of the display area, the method comprising:

[0047] A first conductive layer is prepared on a substrate. The first conductive layer includes a first conductive portion located in a bonding region. The first conductive portion includes a first portion recessed toward the substrate and a second portion located around the periphery of the first portion. The first portion includes a first flat portion and a first inclined portion located between the first flat portion and the second portion.

[0048] A pixel definition layer is prepared on the side of the first conductive layer away from the substrate. The pixel definition layer includes a pixel defining portion and a pixel opening formed by the pixel defining portion and located in the display area. The pixel defining portion covers a first flat portion. The orthographic projections of the second portion and the first inclined portion onto the substrate are located within the orthographic projection of the pixel defining portion onto the substrate. The distance between the edge of the orthographic projection of the pixel defining portion onto the substrate near the first inclined portion and the orthographic projection of the first inclined portion onto the substrate is greater than or equal to 0.5 μm.

[0049] According to an embodiment of this application, the display panel includes a display area and a bonding area. The display area is used to realize the light emission display of the display panel, and the bonding area is used to bond and electrically connect the display panel with other structures to realize signal transmission between the display panel and other structures. The display panel also includes a first conductive layer and a pixel definition layer. The first conductive layer includes a first conductive portion located in the bonding area. The first conductive portion serves as a bonding connection structure between other structures and the display panel. The first conductive portion includes a first portion and a second portion. The first portion is recessed towards the substrate side. When the encapsulation material and electrode material are subsequently prepared, the film thickness of the encapsulation material and electrode material is relatively thin near the contact position of the first inclined portion and the first flat portion. Therefore, by setting a portion of the pixel definition portion on one side of the first inclined portion and covering at least a portion of the first inclined portion, at least a portion of the first inclined portion is protected, and the etching damage to the first inclined portion is reduced. This can improve the problem that subsequent etching of the encapsulation material and electrode material in this area is prone to over-etching and etching damage to the first conductive portion in this area, resulting in holes in the first conductive portion and a decrease in bonding performance, thereby improving the performance of the display panel. Attached Figure Description

[0050] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals denote the same or similar features, and the drawings are not drawn to scale.

[0051] Figure 1 This is a top view schematic diagram of a display panel provided in an embodiment of this application;

[0052] Figure 2 yes Figure 1 A partial sectional view of the middle binding area;

[0053] Figure 3 This is a partial cross-sectional view of the binding area in another embodiment;

[0054] Figure 4 This is a partial cross-sectional view of the binding area in yet another embodiment;

[0055] Figure 5 This is a partial cross-sectional view of the binding area in another embodiment;

[0056] Figure 6 yes Figure 1 A partial sectional view of the central display area;

[0057] Figure 7 This is a partial cross-sectional view of the display area in another embodiment;

[0058] Figure 8 This is a schematic flowchart of a method for manufacturing a display panel provided in an embodiment of this application;

[0059] Figure 9 This is a schematic diagram of another method for manufacturing a display panel provided in an embodiment of this application.

[0060] Explanation of reference numerals in the attached figures:

[0061] 10. Display panel; 11. Display area; 12. Binding area;

[0062] 100. Substrate;

[0063] 200. Isolation structure; 210. First layer; 220. Second layer; 230. Third layer; 240. Isolation opening;

[0064] 300, Light-emitting layer; 310, Light-emitting unit;

[0065] 400, First electrode layer; 410, First electrode;

[0066] 500, Pixel definition layer; 510, Pixel limiting part; 520, Pixel opening; 530, Second electrode; 540, Overlap hole;

[0067] 600, First conductive layer; 610, First conductive portion; 620, First subdivision; 621, First inclined portion; 622, First flat portion; 630, Second subdivision;

[0068] 700, Second conductive layer; 710, Second conductive portion; 720, Third portion; 721, Second inclined portion; 722, Second flat portion; 730, Fourth portion;

[0069] 800, Third conductive layer; 810, Third conductive part;

[0070] 900, Insulation layer; 910, Via. Detailed Implementation

[0071] The features and exemplary embodiments of various aspects of this application will now be described in detail. To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain this application and are not configured to limit this application. For those skilled in the art, this application can be implemented without some of these specific details. The following description of the embodiments is merely to provide a better understanding of this application by illustrating examples of this application.

[0072] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes said element.

[0073] It should be understood that when describing the structure of a component, when referring to a layer or region as being "above" or "on top of" another layer or region, it can mean that it is directly above the other layer or region, or that it contains other layers or regions between it and the other layer or region. Furthermore, if the component is flipped over, that layer or region will be located "below" or "under" the other layer or region.

[0074] This application provides a display panel, a display device, and a method for manufacturing a display panel. The following description, in conjunction with the accompanying drawings, will illustrate various embodiments of the display panel, the display device, and the method for manufacturing a display panel.

[0075] This application provides a display panel, which may be an organic light-emitting diode (OLED) display panel.

[0076] Please refer to the following: Figure 1 , Figure 2 and Figure 6 , Figure 1 This is a top view schematic diagram of a display panel provided in an embodiment of this application; Figure 2 yes Figure 1 A partial sectional view of the middle binding area; Figure 6 yes Figure 1 A partial sectional view of the central display area.

[0077] like Figure 1 , Figure 2 and Figure 6As shown, a first aspect embodiment of this application provides a display panel 10, which includes a display area 11 and a bonding area 12 located on one side of the display area 11. The display panel 10 further includes: a substrate 100; a first conductive layer 600 located on one side of the substrate 100, the first conductive layer 600 including a first conductive portion 610 located in the bonding area 12, the first conductive portion 610 including a first portion 620 recessed toward the substrate 100 and a second portion 630 located around the first portion 620, the first portion 620 including a first flat portion 622 and a first inclined portion 621 located between the first flat portion 622 and the second portion 630; a pixel defining layer 500 located on one side of the substrate 100, the pixel defining layer 500 including a pixel limiting portion 510 and a pixel opening 520 formed by the pixel limiting portion 510 and located in the display area 11; wherein at least a portion of the first inclined portion 621 is projected onto the substrate 100 within the projection of the pixel limiting portion 510 onto the substrate 100.

[0078] According to an embodiment of this application, the display panel 10 includes a display area 11 and a bonding area 12. The display area 11 is used to realize the light emission display of the display panel 10. The display panel 10 is bonded and electrically connected to other structures in the bonding area 12 to realize signal transmission between the display panel 10 and other structures. For example, other structures include flexible circuit boards or integrated circuits. The display panel 10 also includes a first conductive layer 600 and a pixel definition layer 500. The first conductive layer 600 includes a first conductive portion 610 located in the bonding area 12. The first conductive portion 610 serves as a bonding connection structure between other structures and the display panel 10. The first conductive portion 610 includes a first portion 620 and a second portion 630. The first portion 620 is recessed towards the substrate 100. When the encapsulation material and electrode material are subsequently prepared, the film thickness of the encapsulation material and electrode material is relatively thin near the contact position of the first inclined portion 621 and the first flat portion 622. Therefore, by setting a portion of the pixel limiting portion 510 on one side of the first tilted portion 621 and covering at least a portion of the first tilted portion 621, the first tilted portion 621 is protected, reducing the etching damage to the first tilted portion 621. This improves the subsequent etching of the packaging material and electrode material in this area, which is prone to over-etching and etching damage to the first conductive portion 610 in this area, resulting in holes in the first conductive portion 610 and reduced bonding performance, thereby improving the performance of the display panel 10.

[0079] like Figure 2 As shown, in some optional embodiments, the pixel defining portion 510 surrounds and forms an overlap hole 540, and at least a portion of the first flat portion 622 is exposed through the overlap hole 540, that is, the orthographic projection of the overlap hole 540 on the substrate 100 and the orthographic projection of the first flat portion 622 on the substrate 100 at least partially overlap.

[0080] In these alternative embodiments, at least a portion of the first flat portion 622 can be exposed through the overlap hole 540, thereby enabling the flexible circuit board or integrated circuit to be electrically connected to the first conductive portion 610 within the overlap hole 540, realizing the electrical connection and signal transmission between the flexible circuit board or integrated circuit and the display panel 10.

[0081] Please see Figure 3 , Figure 3 This is a partial cross-sectional view of the binding area in another embodiment.

[0082] like Figure 3 As shown, in some alternative embodiments, the pixel defining portion 510 extends from one side of the first inclined portion 621 to one side of the first flat portion 622 to cover the first inclined portion 621 and a portion of the first flat portion 622.

[0083] In these optional embodiments, the pixel limiting portion 510 is provided to cover the first tilted portion 621 and a portion of the first flat portion 622 to protect the first tilted portion 621 and the portion of the first flat portion 622, reduce the etching damage to the first tilted portion 621 and the portion of the first flat portion 622, and improve the subsequent etching of the packaging material and electrode material in this area. This can prevent over-etching and etching damage to the first conductive portion 610 in this area, which can lead to holes in the first conductive portion 610 and reduced bonding performance, thereby improving the performance of the display panel 10.

[0084] In some alternative embodiments, the minimum distance between the edge of the pixel defining portion 510 toward the overlapping hole 540 in the orthographic projection on the substrate 100 and the first inclined portion 621 in the orthographic projection on the substrate 100 is greater than or equal to 0.5 μm, for example, a distance of 0.5 μm, 0.6 μm, 0.8 μm or 1 μm.

[0085] In these optional embodiments, a minimum distance greater than or equal to 0.5 μm can improve the problem that the minimum distance between the edge of the pixel limiting portion 510 facing the overlapping hole 540 on the substrate 100 and the first inclined portion 621 on the substrate 100 is too small, resulting in the pixel limiting portion 510 covering a small area near the contact position of the first inclined portion 621 and the first flat portion 622. This makes it easy for subsequent etching of the encapsulation material and electrode material in this area to cause over-etching and etching damage to the first conductive portion 610 in this area, resulting in holes in the first conductive portion 610 and a decrease in overlapping performance, thereby improving the performance of the display panel 10.

[0086] In some optional embodiments, the width of the overlap hole 540 is greater than or equal to 3 μm. The width of the overlap hole 540 refers to the cross-sectional dimension of the overlap hole 540 in the direction parallel to the plane of the substrate 100. For example, the width of the overlap hole 540 is 3 μm, 4 μm, 5 μm or 6 μm.

[0087] In these optional embodiments, the width of the overlap hole 540 is greater than or equal to 3μm, which can improve the problem that the first conductive part 610 exposed through the overlap hole 540 is too small due to the width of the overlap hole 540 being too small, resulting in a small overlap area for subsequent bonding of the first conductive part 610 to the flexible circuit board or integrated circuit, and reduced overlap performance.

[0088] Please see Figure 4 and Figure 5 , Figure 4 This is a partial cross-sectional view of the binding area in yet another embodiment; Figure 5 This is a partial cross-sectional view of the binding area in another embodiment.

[0089] like Figure 4 and Figure 5 As shown, in some optional embodiments, the orthographic projection of the second portion 630 onto the substrate 100 is located within the orthographic projection of the pixel limiting portion 510 onto the substrate 100.

[0090] In these optional embodiments, the pixel limiting portion 510 covers the second portion 630, the first inclined portion 621, and part of the first flat portion 622, thereby increasing the coverage area of ​​the pixel limiting portion 510 on the first conductive portion 610, increasing the protection range of the pixel limiting portion 510 on the first conductive portion 610, further reducing the area of ​​the first conductive portion 610 that is susceptible to etching damage, reducing the possibility of the first conductive portion 610 generating holes through etching, thereby improving the bonding performance between the first conductive portion 610 and the flexible circuit board or integrated circuit.

[0091] Optionally, the pixel limiting portion 510 covers the sidewall of the second portion 630 away from the first portion 620. The pixel limiting portion 510 covers and protects the sidewall of the second portion 630, which can improve the problem of side etching of the sidewall of the second portion 630 by the subsequent etching process, avoid the problem of the side etching of the sidewall of the second portion 630 causing the subsequent film layer preparation to be interrupted at the sidewall position of the second portion 630, and ensure the film layer continuity of the side of the second portion 630 away from the substrate 100 at that position.

[0092] like Figure 4 and Figure 5As shown, in some optional embodiments, the display panel 10 further includes a second conductive layer 700 located between the substrate 100 and the first conductive layer 600. The second conductive layer 700 includes a second conductive portion 710 located in the bonding region 12. At least a portion of the second conductive portion 710 is projected onto the substrate 100 within the projection of the first conductive portion 610 onto the substrate 100.

[0093] In these optional embodiments, the first conductive layer 600 and the second conductive layer 700 are stacked in the bonding area 12. When the first conductive part 610 is bonded and electrically connected to the flexible circuit board or integrated circuit, the electrical signal of the flexible circuit board or integrated circuit can be transmitted from the first conductive part 610 to the second conductive part 710, thereby realizing the signal transmission between the flexible circuit board or integrated circuit and the display panel 10, and thus realizing the control of the display panel 10 by the flexible circuit board or integrated circuit.

[0094] Optionally, the first conductive layer 600 includes power supply voltage signal lines, reference voltage signal lines, data signal lines, etc.

[0095] Optionally, the second conductive layer 700 includes the source and drain of the driving circuit.

[0096] Optionally, the first conductive portion 610 covers the sidewall of the second conductive portion 710. The first conductive portion 610 covers and protects the sidewall of the second conductive portion 710, which can improve the problem of side etching of the sidewall of the second conductive portion 710 by the subsequent etching process. It avoids the problem of the side etching of the sidewall of the second conductive portion 710 causing a depression, which would lead to the break in the subsequent film preparation at the sidewall position of the second conductive portion 710. This ensures the film continuity of the side of the second conductive portion 710 away from the substrate 100 at that position.

[0097] like Figure 4 and Figure 5 As shown, in some optional embodiments, the second conductive portion 710 includes a third portion 720 and a fourth portion 730 located around the third portion 720. The third portion 720 includes a second flat portion 722 and a second inclined portion 721 located between the second flat portion 722 and the fourth portion 730. The first flat portion 622 is located on the side of the second flat portion 722 away from the substrate 100.

[0098] In these alternative embodiments, the second conductive portion 710 has a fourth portion 730 and a third portion 720 recessed toward the substrate 100 relative to the fourth portion 730. The second flat portion 722 of the third portion 720 and the first flat portion 622 of the first conductive portion 610 are correspondingly disposed, such that the portion of the third portion 720 facing away from the substrate 100 is recessed toward the substrate 100, and the first conductive portion 610 has good flatness when a film is formed on one side of the second flat portion 722.

[0099] Optionally, the first inclined portion 621 is located on the side of the second inclined portion 721 away from the substrate 100. A first conductive portion 610 with the first inclined portion 621 is formed on the side of the second inclined portion 721 away from the substrate 100. The first inclined portion 621 and the second inclined portion 721 have the same slope, so that the first portion 620 of the first conductive portion 610 can be recessed relative to the second portion 630 toward the substrate 100, which facilitates the subsequent electrical connection between the first conductive portion 610 and the flexible circuit board or integrated circuit.

[0100] In some optional embodiments, the display panel 10 further includes a third conductive layer 800 located between the substrate 100 and the second conductive layer 700. The third conductive layer 800 includes a third conductive portion 810 located in the bonding region 12, and the second conductive portion 710 and the third conductive portion 810 are electrically connected.

[0101] In these optional embodiments, the first conductive layer 600, the second conductive layer 700, and the third conductive layer 800 are stacked in the bonding area 12. When the first conductive part 610 is bonded and electrically connected to the flexible circuit board or integrated circuit, the electrical signals of the flexible circuit board or integrated circuit can be transmitted from the first conductive part 610 and the second conductive part 710 to the third conductive part 810, thereby realizing the signal transmission between the flexible circuit board or integrated circuit and the display panel 10, and thus realizing the control of the display panel 10 by the flexible circuit board or integrated circuit.

[0102] Optionally, the third conductive layer 800 includes the active layer of the driving circuit.

[0103] In some optional embodiments, the display panel 10 further includes an insulating layer 900 located between the third conductive layer 800 and the second conductive layer 700, wherein the second conductive portion 710 and the third conductive portion 810 are electrically connected through a via 910 on the insulating layer 900.

[0104] In these alternative embodiments, the insulating layer 900 is provided such that the second conductive layer 700 and the third conductive layer 800 are insulated from other locations. A through-hole 910 is formed in the insulating layer 900, and the second conductive portion 710 and the third conductive portion 810 are electrically connected in contact within the through-hole 910. Due to the presence of the through-hole 910, the second conductive portion 710 and the first conductive portion 610 are recessed toward the substrate 100 in this region.

[0105] Optionally, the orthographic projection of the first flat portion 622 on the insulating layer 900 is located within the via 910, that is, the orthographic projection of the first flat portion 622 on the substrate 100 is located within the orthographic projection of the via 910 on the substrate 100, and the first conductive portion 610 is recessed toward the substrate 100 at the location of the via 910, thereby forming the first inclined portion 621 and the first flat portion 622 whose orthographic projection is located within the orthographic projection of the via 910 on the substrate 100.

[0106] Optionally, the first conductive layer 600 may comprise a Ti / Al / Ti (titanium / aluminum / titanium) or Ti / Al / Mo (titanium / aluminum / molybdenum) three-layer metal composite material.

[0107] Optionally, the second conductive layer 700 includes a Ti / Al / Ti (titanium / aluminum / titanium) or Ti / Al / Mo (titanium / aluminum / molybdenum) three-layer metal composite material.

[0108] Optionally, the third conductive layer 800 may include a Ti / Al / Ti (titanium / aluminum / titanium) or Ti / Al / Mo (titanium / aluminum / molybdenum) three-layer metal composite material.

[0109] like Figure 6 As shown, in some optional embodiments, the display panel 10 further includes an isolation structure 200 located on the substrate 100 and in the display area 11. The isolation structure 200 encloses and forms a plurality of isolation openings 240, which are connected to the pixel openings 520.

[0110] In these optional embodiments, the isolation structure 200 is disposed on the substrate 100 and surrounds a plurality of isolation openings 240 to isolate the light-emitting layer 300 to form mutually disconnected light-emitting units 310, thereby reducing crosstalk of charge carriers in the light-emitting layer 300, improving the display effect of the display panel 10, and the fabrication of the light-emitting unit 310 does not require the use of a precision mask, which can reduce the development and use of precision masks and reduce the manufacturing cost.

[0111] In some alternative embodiments, the isolation structure 200 includes a first layer 210 and a second layer 220 located on the side of the first layer 210 opposite to the substrate 100, wherein the orthographic projection of the first layer 210 onto the substrate 100 is within the orthographic projection of the second layer 220 onto the substrate 100.

[0112] In these optional embodiments, the first layer 210 and the second layer 220 are stacked to form the isolation structure 200. The orthographic projection of the first layer 210, which is disposed close to the substrate 100, lies within the orthographic projection of the second layer 220 on the substrate 100. The orthographic projection area of ​​the second layer 220 is larger than that of the first layer 210. The second layer 220 covers the surface of the first layer 210 that is close to the second layer 220. At this time, the first layer 210 is recessed relative to the second layer 220 in a direction away from the isolation opening 240. When the light-emitting layer 300 is fabricated, the light-emitting layer 300 has a large drop at the edge of the isolation structure 200, and the first layer 210 is recessed relative to the second layer 220. The light-emitting layer 300 is difficult to connect at the edge of the isolation structure 200, resulting in breakage. The breakage of the light-emitting layer 300 forms mutually disconnected light-emitting units 310.

[0113] Optionally, the first layer 210 includes a conductive material, such as a non-metallic conductive material or a metallic conductive material, to achieve an electrical connection between the isolation structure 200 and the first electrode 410.

[0114] In some alternative embodiments, the second layer 220 includes a conductive material or an insulating material, wherein the insulating material may be at least one of silicon nitride or silicon oxide.

[0115] In these alternative embodiments, the second layer 220 includes a conductive material, such as a non-metallic conductive material or a metallic conductive material. When the second layer 220 is a non-metallic conductive material or an insulating material, it is difficult to etch the second layer 220 during the wet etching process of the first layer 210 with an etching solution, thereby making it easier for the first layer 210 to be recessed relative to the second layer 220.

[0116] In some alternative embodiments, the first layer 210 and the second layer 220 comprise metallic materials, and the materials of the first layer 210 and the second layer 220 are different.

[0117] In these optional embodiments, when both the first layer 210 and the second layer 220 are made of metallic materials, the first layer 210 can be wet-etched using an etching solution. By adjusting the etching solution, the etching rate of the second layer 220 can be made lower than that of the first layer 210. Because the etching rate of the first layer 210 is higher, even if the second layer 220 is etched to some extent during wet etching, the first layer 210 is etched faster, thus making the first layer 210 recessed relative to the second layer 220.

[0118] Please see Figure 7 , Figure 7 This is a partial cross-sectional view of the display area in another embodiment.

[0119] like Figure 7As shown, in some optional embodiments, the isolation structure 200 further includes a third layer 230 located on the side of the first layer 210 facing the substrate 100, wherein the orthographic projection of the first layer 210 onto the substrate 100 lies within the orthographic projection of the third layer 230 onto the substrate 100.

[0120] In these optional embodiments, to obtain the recessed first layer 210, the first layer 210 has a faster etching rate than the second layer 220 and the third layer 230 during the etching process, thus forming the recessed first layer 210. Because the first layer 210 has a faster etching rate, more etching waste is generated and can easily enter other parts of the display panel 10, causing adverse effects. After the third layer 230 is formed, the first layer 210 can adhere better to the third layer 230, and the generated etching waste falls onto the third layer 230, making it easier to clean.

[0121] Optionally, the second layer 220 is made of titanium (Ti) or molybdenum (Mo), the first layer 210 is made of aluminum (Al), silver (Ag) or copper (Cu), and the third layer 230 is made of titanium (Ti) or molybdenum (Mo). For example, the isolation structure 200 is a Ti / Al / Ti (titanium / aluminum / titanium) or Ti / Al / Mo (titanium / aluminum / molybdenum) three-layer metal composite material.

[0122] The composition and preparation of the isolation structure 200 are further described in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, and PCT / CN2024 / 099072 for reference.

[0123] Optionally, the display panel 10 further includes: a light-emitting layer 300 located on the substrate 100, the light-emitting layer 300 including a plurality of light-emitting units 310 located in the display area 11, the light-emitting units 310 being located within the pixel opening 520, thereby realizing the light-emitting display of the display panel 10.

[0124] In some optional embodiments, the display panel 10 further includes: a first electrode layer 400 located on the side of the light-emitting layer 300 away from the substrate 100, the first electrode layer 400 including a first electrode 410 located in the isolation opening 240, the first electrode 410 being electrically connected to the isolation structure 200.

[0125] In these optional embodiments, the isolation structure 200 isolates the first electrode layer 400 to form mutually spaced first electrodes 410. The mutually spaced first electrodes 410 are electrically connected through the isolation structure 200 to form a full-surface electrode, ensuring the normal light emission of the light-emitting unit 310.

[0126] Optionally, the orthographic projection of the light-emitting unit 310 onto the substrate 100 is located within the orthographic projection of the first electrode 410 onto the substrate 100. That is, the first electrode 410 covers the light-emitting unit 310 and serves as the electrode of the light-emitting unit 310, ensuring normal light emission of the light-emitting unit 310 and improving the display effect of the display panel 10. In some optional embodiments, the light-emitting unit 310 and the isolation structure 200 are spaced apart.

[0127] Optionally, the light-emitting unit 310 and the isolation structure 200 are spaced apart, that is, each light-emitting unit 310 is spaced apart from each other, which reduces the crosstalk of charge carriers between each light-emitting unit 310 and improves the color crosstalk problem of the light-emitting unit 310.

[0128] Optionally, the display panel 10 further includes a second electrode 530, which is located between the substrate 100 and the pixel definition layer 500, and is exposed through the pixel opening 520. One of the second electrode 530 and the first electrode 410 serves as the anode of the light-emitting unit 310, and the other serves as the cathode of the light-emitting unit 310. This embodiment uses the second electrode 530 as the anode of the light-emitting unit 310 and the first electrode 410 as the cathode for illustrative purposes.

[0129] In some optional embodiments, the display panel 10 further includes a first encapsulation layer located on the side of the first electrode layer 400 facing away from the substrate 100.

[0130] Optionally, the material of the first encapsulation layer may include inorganic materials.

[0131] In these optional embodiments, the first encapsulation layer comprises an inorganic material with good density and good barrier properties against moisture and oxygen. During the fabrication of the first encapsulation layer and the first electrode 410 within each isolation opening 240, the first encapsulation layer and the first electrode 410 within other isolation openings 240 and the bonding area 12 are etched. Since the first encapsulation layer and the first electrode 410 in the bonding area 12 have a thinner film thickness near the contact position between the first inclined portion 621 and the first flat portion 622, a portion of the pixel limiting portion 510 is disposed on one side of the first inclined portion 621 and covers at least a portion of the first inclined portion 621 to protect at least a portion of the first inclined portion 621, reducing etching damage to the first inclined portion 621. This improves the subsequent etching of the encapsulation material and electrode material in this area, preventing over-etching and etching damage to the first conductive portion 610 in this area, which can lead to holes in the first conductive portion 610 and decreased bonding performance, thus improving the performance of the display panel 10.

[0132] Optionally, the display panel 10 further includes: a second encapsulation layer located on the side of the first encapsulation layer facing away from the substrate 100, the second encapsulation layer being in contact with the isolation structure 200; and a third encapsulation layer located on the side of the second encapsulation layer facing away from the substrate 100. The display panel 10 employs a three-layer encapsulation, which provides better encapsulation performance and reduces the possibility of water and oxygen intrusion.

[0133] Optionally, the material of the second encapsulation layer may include organic materials.

[0134] Optionally, the material of the third encapsulation layer may include inorganic materials. The first, second, and third encapsulation layers are encapsulated using inorganic, organic, and inorganic materials, respectively, to form a TFE (Thin Film Encapsulation) encapsulation structure, further improving encapsulation performance.

[0135] Optionally, the light-emitting layer 300 includes an electron injection layer (EIL), an electron transport layer (ETL), a light-emitting material layer, a hole injection layer (HIL), and a hole transport layer (HTL).

[0136] A second aspect of this application provides a display panel 10, which includes a display area 11 and a bonding area 12 located on one side of the display area 11. The display panel 10 also includes: a substrate 100; a first conductive layer 600 located on one side of the substrate 100, the first conductive layer 600 including a first conductive portion 610 located in the bonding area 12, the first conductive portion 610 including a first portion 620 recessed toward the substrate 100 and a second portion 630 located around the first portion 620, the first portion 620 including a first flat portion 622 and a first inclined portion 621 located between the first flat portion 622 and the second portion 630; A pixel definition layer 500 is located on one side of the substrate 100. The pixel definition layer 500 includes a pixel defining portion 510 and a pixel opening 520 formed by the pixel defining portion 510 and located in the display area 11. The pixel defining portion 510 covers a first flat portion 622. The orthographic projection of the second portion 630 and the first inclined portion 621 on the substrate 100 is located within the orthographic projection of the pixel defining portion 510 on the substrate 100. The minimum distance between the edge of the orthographic projection of the pixel defining portion 510 on the substrate 100 near the first inclined portion 621 and the orthographic projection of the first inclined portion 621 on the substrate 100 is greater than or equal to 0.5 μm.

[0137] According to an embodiment of this application, the display panel 10 includes a display area 11 and a bonding area 12. The display area 11 is used to realize the light emission display of the display panel 10. The bonding area 12 is used to bond and electrically connect the display panel 10 with other structures to realize signal transmission between the display panel 10 and other structures. The display panel 10 also includes a first conductive layer 600 and a pixel definition layer 500. The first conductive layer 600 includes a first conductive portion 610 located in the bonding area 12. The first conductive portion 610 serves as a bonding connection structure between other structures and the display panel 10. The pixel definition portion 510 covers the second portion 630, the first inclined portion 621, and part of the first flat portion 622, increasing the coverage area of ​​the pixel definition portion 510 on the first conductive portion 610, increasing the protection range of the pixel definition portion 510 on the first conductive portion 610, further reducing the area of ​​the first conductive portion 610 that is susceptible to etching damage, reducing the possibility of etching holes in the first conductive portion 610, thereby improving the bonding performance between the first conductive portion 610 and the flexible circuit board or integrated circuit. The minimum distance between the edge of the pixel limiting portion 510 near the first inclined portion 621 in the orthographic projection of the pixel limiting portion 510 onto the substrate 100 and the orthographic projection of the first inclined portion 621 onto the substrate 100 is greater than or equal to 0.5 μm. This can improve the problem that the minimum distance between the edge of the pixel limiting portion 510 toward the overlapping hole 540 in the orthographic projection of the pixel limiting portion 510 onto the substrate 100 and the orthographic projection of the first inclined portion 621 onto the substrate 100 is too small, resulting in the pixel limiting portion 510 covering a small area near the contact position of the first inclined portion 621 and the first flat portion 622. This makes it easy for subsequent etching of the encapsulation material and electrode material in this area to cause over-etching and etching damage to the first conductive portion 610 in this area, resulting in holes in the first conductive portion 610 and a decrease in overlapping performance, thereby improving the performance of the display panel 10.

[0138] The structural design in this embodiment can be applied to other display panels 10. The specific choice can be made according to the actual situation, and this application does not impose any specific restrictions on it.

[0139] The third aspect of this application also provides a display device including the display panel 10 of any of the above embodiments. Since the display device provided in the third aspect of this application includes the display panel 10 of any of the above embodiments, it has the beneficial effects of the display panel 10 of any of the above embodiments, which will not be elaborated further here.

[0140] The display devices in this application include, but are not limited to, mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, control consoles, and other devices with display functions.

[0141] Please see Figure 8 , Figure 8 This is a schematic diagram of a method for manufacturing a display panel according to an embodiment of this application.

[0142] The fourth aspect of this application also provides a method for manufacturing a display panel 10. The display panel 10 can be any of the display panels 10 provided in the above embodiments. Please refer to the embodiments for further details. Figures 1 to 7 The display panel 10 includes a display area 11 and a bonding area 12 located on one side of the display area 11. The manufacturing method includes:

[0143] Step S01: A first conductive layer is prepared on the substrate. The first conductive layer includes a first conductive portion located in the bonding region. The first conductive portion includes a first portion recessed toward the substrate and a second portion located around the periphery of the first portion. The first portion includes a first flat portion and a first inclined portion located between the first flat portion and the second portion.

[0144] Step S02: A pixel definition layer is prepared on the side of the first conductive layer away from the substrate. The pixel definition layer includes a pixel defining portion and a pixel opening formed by the pixel defining portion and located in the display area. At least a portion of the first inclined portion is projected onto the substrate within the projection of the pixel defining portion onto the substrate.

[0145] According to the fabrication method of the fourth aspect of this application, a first conductive layer 600 is fabricated in step S01. The first conductive layer 600 includes a first conductive portion 610 located in the bonding region 12, which serves as a bonding connection structure between other structures and the display panel 10. The first conductive portion 610 includes a first portion 620 and a second portion 630. The first portion 620 is recessed towards the substrate 100. When the encapsulation material and electrode material are subsequently fabricated, the encapsulation material and electrode material have a thinner film thickness near the contact position between the first inclined portion 621 and the first flat portion 622. A pixel definition layer 500 is fabricated in step S02. By setting a portion of the pixel limiting portion 510 on one side of the first tilted portion 621 and covering at least a portion of the first tilted portion 621, the first tilted portion 621 is protected, reducing the etching damage to the first tilted portion 621. This improves the subsequent etching of the packaging material and electrode material in this area, which is prone to over-etching and etching damage to the first conductive portion 610 in this area, resulting in holes in the first conductive portion 610 and reduced bonding performance, thereby improving the performance of the display panel 10.

[0146] Please see Figure 9 , Figure 9 This is a schematic diagram of another method for manufacturing a display panel provided in an embodiment of this application.

[0147] The fifth aspect of this application also provides a method for manufacturing a display panel 10. The display panel 10 can be any of the display panels 10 provided in the above embodiments. Please refer to both embodiments. Figures 1 to 7 The display panel 10 includes a display area 11 and a bonding area 12 located on one side of the display area 11. The manufacturing method includes:

[0148] Step S1: Prepare a first conductive layer on the substrate. The first conductive layer includes a first conductive portion located in the bonding region. The first conductive portion includes a first portion recessed toward the substrate and a second portion located around the periphery of the first portion. The first portion includes a first flat portion and a first inclined portion located between the first flat portion and the second portion.

[0149] Step S2: A pixel definition layer is prepared on the side of the first conductive layer away from the substrate. The pixel definition layer includes a pixel defining portion and a pixel opening formed by the pixel defining portion and located in the display area. The pixel defining portion covers the first flat portion. The second portion and the first inclined portion are projected onto the substrate within the projection of the pixel defining portion onto the substrate. The distance between the edge of the projection of the pixel defining portion onto the substrate near the first inclined portion and the projection of the first inclined portion onto the substrate is greater than or equal to 0.5 μm.

[0150] According to the fabrication method of the fifth aspect embodiment of this application, a first conductive layer 600 is fabricated in step S1. The first conductive layer 600 includes a first conductive portion 610 located in the bonding region 12, which serves as a bonding connection structure between other structures and the display panel 10. The first conductive portion 610 includes a first portion 620 and a second portion 630. The first portion 620 is recessed towards the substrate 100. When the encapsulation material and electrode material are subsequently fabricated, the encapsulation material and electrode material have a thinner film thickness near the contact position between the first inclined portion 621 and the first flat portion 622. A pixel definition layer 500 is fabricated in step S2. The pixel limiting portion 510 covers the second portion 630, the first inclined portion 621, and part of the first flat portion 622, thereby increasing the coverage area of ​​the pixel limiting portion 510 on the first conductive portion 610, increasing the protection range of the pixel limiting portion 510 on the first conductive portion 610, further reducing the area of ​​the first conductive portion 610 that is susceptible to etching damage, reducing the possibility of etching holes in the first conductive portion 610, and thus improving the bonding performance between the first conductive portion 610 and the flexible circuit board or integrated circuit. The minimum distance between the edge of the pixel limiting portion 510 near the first inclined portion 621 in the orthographic projection of the pixel limiting portion 510 onto the substrate 100 and the orthographic projection of the first inclined portion 621 onto the substrate 100 is greater than or equal to 0.5 μm. This can improve the problem that the minimum distance between the edge of the pixel limiting portion 510 toward the overlapping hole 540 in the orthographic projection of the pixel limiting portion 510 onto the substrate 100 and the orthographic projection of the first inclined portion 621 onto the substrate 100 is too small, resulting in the pixel limiting portion 510 covering a small area near the contact position of the first inclined portion 621 and the first flat portion 622. This makes it easy for subsequent etching of the encapsulation material and electrode material in this area to cause over-etching and etching damage to the first conductive portion 610 in this area, resulting in holes in the first conductive portion 610 and a decrease in overlapping performance, thereby improving the performance of the display panel 10.

[0151] The embodiments described above are not exhaustive, nor do they limit the invention to the specific embodiments described. Clearly, many modifications and variations can be made based on the above description. These embodiments are selected and specifically described in this specification to better explain the principles and practical applications of this application, thereby enabling those skilled in the art to effectively utilize this application and its modifications. This application is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that, The display panel includes a display area and a bonding area located on one side of the display area, and the display panel further includes: substrate; A first conductive layer is located on one side of the substrate. The first conductive layer includes a first conductive portion located in the bonding area. The first conductive portion includes a first portion recessed toward the substrate and a second portion located around the periphery of the first portion. The first portion includes a first flat portion and a first inclined portion located between the first flat portion and the second portion. A pixel definition layer is located on one side of the substrate. The pixel definition layer includes a pixel defining portion and a pixel opening formed by the pixel defining portion and located in the display area. Wherein, at least a portion of the first inclined portion is projected onto the substrate in a projection that falls within the projection of the pixel defining portion onto the substrate.

2. The display panel according to claim 1, characterized in that, The pixel-defined portion encloses to form an overlap hole, and at least a portion of the first flat portion is exposed through the overlap hole.

3. The display panel according to claim 2, characterized in that, The pixel defining portion extends from one side of the first inclined portion to one side of the first flat portion to cover the first inclined portion and a portion of the first flat portion.

4. The display panel according to claim 3, characterized in that, The minimum distance between the edge of the pixel defining portion facing the overlapping hole and the orthographic projection on the substrate and the orthographic projection of the first inclined portion on the substrate is greater than or equal to 0.5 μm.

5. The display panel according to claim 2, characterized in that, The width of the overlapping hole is greater than or equal to 3μm.

6. The display panel according to claim 1, characterized in that, The second portion is projected onto the substrate in a positive projection, and the pixel defining portion is located within the positive projection of the substrate.

7. The display panel according to claim 1, characterized in that, The pixel-defined portion covers the sidewall of the second portion away from the first portion.

8. The display panel according to claim 1, characterized in that, The display panel also includes: A second conductive layer is located between the substrate and the first conductive layer. The second conductive layer includes a second conductive portion located in the bonding region. At least a portion of the second conductive portion is projected onto the substrate in the orthographic projection of the first conductive portion onto the substrate. Preferably, the first conductive portion covers the sidewall of the second conductive portion; Preferably, the second conductive portion includes a third portion and a fourth portion located around the third portion. The third portion includes a second flat portion and a second inclined portion located between the second flat portion and the fourth portion. The first flat portion is located on the side of the second flat portion away from the substrate. Preferably, the first inclined portion is located on the side of the second inclined portion away from the substrate.

9. The display panel according to claim 8, characterized in that, The display panel also includes: A third conductive layer is located between the substrate and the second conductive layer. The third conductive layer includes a third conductive portion located in the bonding region. The second conductive portion and the third conductive portion are electrically connected. Preferably, the display panel further includes: An insulating layer is located between the third conductive layer and the second conductive layer, and the second conductive portion and the third conductive portion are electrically connected through vias in the insulating layer; Preferably, the orthographic projection of the first flat portion onto the insulating layer is located within the via.

10. The display panel according to claim 1, characterized in that, The display panel also includes: An isolation structure is located on the substrate and in the display area, the isolation structure enclosing and forming a plurality of isolation openings, the isolation openings being in communication with the pixel openings; Preferably, the isolation structure includes a first layer and a second layer, the second layer being located on the side of the first layer facing away from the substrate, and the orthographic projection of the first layer on the substrate being located within the orthographic projection of the second layer on the substrate; Preferably, the first layer comprises a conductive material; Preferably, the second layer comprises a conductive material or an insulating material; Preferably, both the first layer and the second layer comprise metallic materials, and the materials of the first layer and the second layer are different; Preferably, the isolation structure further includes a third layer located on the side of the first layer facing the substrate, wherein the orthographic projection of the first layer on the substrate is located within the orthographic projection of the third layer on the substrate; Preferably, the display panel further includes: A light-emitting layer is located on the substrate, and the light-emitting layer includes a plurality of light-emitting units located in the display area, and the light-emitting units are located within the pixel opening; Preferably, the display panel further includes: A first electrode layer is located on the side of the light-emitting layer opposite to the substrate. The first electrode layer includes a first electrode located at the isolation opening, and the first electrode is electrically connected to the isolation structure. Preferably, the orthographic projection of the light-emitting unit onto the substrate is located within the orthographic projection of the first electrode onto the substrate; Preferably, the light-emitting unit and the isolation structure are spaced apart; Preferably, the display panel further includes a second electrode located between the substrate and the pixel definition layer, and the second electrode is exposed through the pixel opening.

11. A display panel, characterized in that, The display panel includes a display area and a bonding area located on one side of the display area, and the display panel further includes: substrate; A first conductive layer is located on one side of the substrate. The first conductive layer includes a first conductive portion located in the bonding area. The first conductive portion includes a first portion recessed toward the substrate and a second portion located around the periphery of the first portion. The first portion includes a first flat portion and a first inclined portion located between the first flat portion and the second portion. A pixel definition layer is located on one side of the substrate. The pixel definition layer includes a pixel defining portion and a pixel opening formed by the pixel defining portion and located in the display area. The pixel defining portion covers a portion of the first flat portion. Wherein, the second portion and the first inclined portion are projected onto the substrate in the orthographic projection of the pixel defining portion onto the substrate, and the minimum distance between the edge of the pixel defining portion near the first inclined portion in the orthographic projection of the substrate and the first inclined portion in the orthographic projection of the substrate is greater than or equal to 0.5 μm.

12. The display panel according to claim 11, characterized in that, The pixel-defined portion encloses to form an overlap hole, and at least a portion of the first flat portion is exposed through the overlap hole.

13. The display panel according to claim 12, characterized in that, The width of the overlapping hole is greater than or equal to 3μm.

14. The display panel according to claim 11, characterized in that, The pixel-defined portion covers the sidewall of the second portion away from the first portion.

15. The display panel according to claim 11, characterized in that, The display panel also includes: A second conductive layer is located between the substrate and the first conductive layer. The second conductive layer includes a second conductive portion located in the bonding region. At least a portion of the second conductive portion is projected onto the substrate in the orthographic projection of the first conductive portion onto the substrate. Preferably, the first conductive portion covers the sidewall of the second conductive portion; Preferably, the second conductive portion includes a third portion and a fourth portion located around the third portion. The third portion includes a second flat portion and a second inclined portion located between the second flat portion and the fourth portion. The first flat portion is located on the side of the second flat portion away from the substrate. Preferably, the first inclined portion is located on the side of the second inclined portion away from the substrate.

16. The display panel according to claim 15, characterized in that, The display panel also includes: A third conductive layer is located between the substrate and the second conductive layer. The third conductive layer includes a third conductive portion located in the bonding region. The second conductive portion and the third conductive portion are electrically connected. Preferably, the display panel further includes: An insulating layer is located between the third conductive layer and the second conductive layer, and the second conductive portion and the third conductive portion are electrically connected through vias in the insulating layer; Preferably, the orthographic projection of the first flat portion onto the insulating layer is located within the via.

17. The display panel according to claim 11, characterized in that, The display panel also includes: An isolation structure is located on the substrate and in the display area, and the isolation structure encloses and forms a plurality of isolation openings.

18. A display device, characterized in that, Includes the display panel as described in any one of claims 1-17.

19. A method for manufacturing a display panel, characterized in that, The display panel includes a display area and a binding area located on one side of the display area, and the method includes: A first conductive layer is prepared on a substrate. The first conductive layer includes a first conductive portion located in the bonding region. The first conductive portion includes a first portion recessed toward the substrate and a second portion located around the periphery of the first portion. The first portion includes a first flat portion and a first inclined portion located between the first flat portion and the second portion. A pixel definition layer is prepared on the side of the first conductive layer away from the substrate. The pixel definition layer includes a pixel defining portion and a pixel opening formed by the pixel defining portion and located in the display area. At least a portion of the first inclined portion is projected onto the substrate in the orthographic projection of the pixel defining portion onto the substrate.

20. A method for manufacturing a display panel, characterized in that, The display panel includes a display area and a binding area located on one side of the display area, and the method includes: A first conductive layer is prepared on a substrate. The first conductive layer includes a first conductive portion located in the bonding region. The first conductive portion includes a first portion recessed toward the substrate and a second portion located around the periphery of the first portion. The first portion includes a first flat portion and a first inclined portion located between the first flat portion and the second portion. A pixel definition layer is prepared on the side of the first conductive layer away from the substrate. The pixel definition layer includes a pixel defining portion and a pixel opening formed by the pixel defining portion and located in the display area. The pixel defining portion covers a portion of the first flat portion. The second portion and the first inclined portion are projected onto the substrate and are located within the projection of the pixel defining portion onto the substrate. The distance between the edge of the pixel defining portion near the first inclined portion and the projection of the first inclined portion onto the substrate is greater than or equal to 0.5 μm.

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