Display panel and display device

Abstract

The invention relates to a display panel and a display device. The display panel comprises a substrate, a signal lead, a planarization layer and a protection layer. The signal lead is arranged on one side of the substrate and located in the binding area. The planarization layer is arranged on one side of the substrate and located in the binding area and the display area. The planarization layer located in the binding area covers part of the signal lead and exposes the signal lead. The protection layer is arranged on the side, away from the substrate, of the planarization layer and located in the binding area, and the orthographic projection of the protection layer and the orthographic projection of the signal lead on the substrate are partially overlapped. The condition that the planarization layer is stripped from the substrate due to a subsequent etching process can be reduced, and the display effect of the display panel can be improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel and display device. Background Technology

[0002] OLED (Organic Light Emitting Diode) display panels are currently a hot topic in display panel research, offering advantages such as low energy consumption, low cost, self-emissiveness, wide viewing angles, and fast response times. However, traditional display panels generally have poorer display performance. Summary of the Invention

[0003] Therefore, it is necessary to provide a display panel and display device to address the issue of how to improve the display effect of traditional display panels.

[0004] According to a first aspect of this application, a display panel is provided, the display panel having a display area and a binding area located on one side of the display area, the display panel comprising:

[0005] substrate;

[0006] Signal leads are disposed on one side of the substrate and located in the bonding area;

[0007] A planarization layer is disposed on one side of the substrate and located between the bonding area and the display area; the planarization layer located in the bonding area covers a portion of the signal leads; and

[0008] A protective layer is disposed on the side of the planarization layer opposite to the substrate and located in the bonding area, wherein the orthographic projection of the protective layer on the substrate overlaps with the orthographic projection of the signal lead on the substrate.

[0009] In one embodiment, the display panel further includes a pixel definition layer located in the display area, the pixel definition layer covering the portion of the planarization layer located in the display area; the pixel definition layer and the protective layer are disposed on the same layer.

[0010] Optionally, the protective layer comprises an inorganic material;

[0011] Optionally, both the protective layer and the pixel definition layer comprise inorganic materials.

[0012] In one embodiment, the planarization layer includes a first portion located in the bonding region, the first portion covering a portion of the signal lead and exposing the remainder of the signal lead;

[0013] The first portion has a first outer contour in its orthographic projection onto the substrate, and at least a portion of the first outer contour lies within the orthographic projection of the protective layer onto the substrate.

[0014] Optionally, the first outer contour includes two first projection edges disposed opposite each other along a first direction and two second projection edges disposed opposite each other along a second direction, wherein at least one of the first projection edges and / or at least one of the second projection edges are located within the orthographic projection of the protective layer on the substrate; the first direction and the second direction intersect each other and are both perpendicular to the thickness direction of the substrate;

[0015] Optionally, the orthographic projection of the first portion on the substrate is located within the orthographic projection of the protective layer on the substrate;

[0016] Optionally, the first direction and the second direction are perpendicular to each other.

[0017] In one embodiment, the distance between the first projection edge and the orthographic projection of the protective layer onto the substrate along the first direction is J1, wherein 2μm≤J1≤4μm; and / or

[0018] Along the second direction, the distance between the second projection edge and the orthographic projection of the protective layer on the substrate is J2, where 2μm≤J2≤4μm.

[0019] In one embodiment, the first portion is provided with a first lead opening for exposing the signal lead;

[0020] At least a portion of the sidewall of the first lead opening has its orthographic projection on the substrate located within the orthographic projection of the protective layer on the substrate.

[0021] Optionally, the orthographic projection of the sidewall of the first lead opening on the substrate includes two third projection edges disposed opposite to each other along a first direction and two fourth projection edges disposed opposite to each other along a second direction, wherein at least one of the third projection edges and / or at least one of the fourth projection edges is located within the orthographic projection of the protective layer on the substrate; the first direction and the second direction intersect each other;

[0022] Optionally, the orthographic projection of the first portion on the substrate is located within the orthographic projection of the protective layer on the substrate;

[0023] Optionally, the first direction and the second direction are perpendicular to each other.

[0024] In one embodiment, the protective layer is provided with a second lead opening that communicates with the corresponding first lead opening, and the orthographic projection of the sidewall of the first lead opening on the substrate surrounds the orthographic projection of the sidewall of the corresponding second lead opening on the substrate.

[0025] Optionally, along the first direction, the distance between the third projection edge and the sidewall of the second lead opening within its orthographic projection on the substrate is J3, where 2μm≤J3≤4μm; and / or

[0026] Along the second direction, the distance between the fourth projection edge and the sidewall of the second lead opening within the orthographic projection on the substrate is J4, where 2μm≤J4≤4μm.

[0027] In one embodiment, the protective layer is provided with a plurality of openings for partially exposing the first portion;

[0028] The orthographic projection of the opening on the substrate is offset from the orthographic projection of the first lead opening on the substrate.

[0029] In one embodiment, the display panel includes a plurality of signal leads spaced apart, the first portion covering a portion of each signal lead and exposing the remaining portion of each signal lead; the orthographic projection of the protective layer on the substrate overlaps with the orthographic projection portion of each signal lead on the substrate;

[0030] Optionally, the orthographic projection of the opening on the substrate is located between the orthographic projections of two adjacent first lead openings on the substrate;

[0031] Optionally, the plurality of openings are arranged to form multiple sets of openings spaced apart along the spacing direction of the signal leads, and the orthographic projection of the plurality of openings in at least one of the opening sets on the substrate is located between the orthographic projections of two corresponding and adjacent first lead openings on the substrate.

[0032] In one embodiment, the display panel further includes:

[0033] Multiple sub-pixels are spaced apart on the side of the planarization layer away from the substrate; and

[0034] An isolation structure is disposed on the side of the planarization layer away from the substrate; the isolation structure is used to space adjacent sub-pixels apart;

[0035] Optionally, the isolation structure is provided with a plurality of isolation openings corresponding to the plurality of sub-pixels, and the sub-pixels are disposed within the corresponding isolation openings;

[0036] Optionally, the display panel further includes a pixel definition layer located in the display area, the pixel definition layer covering the portion of the planarization layer located in the display area; the pixel definition layer and the protective layer are disposed on the same layer.

[0037] The sub-pixel includes a first electrode, a light-emitting portion, and a second electrode stacked and arranged along a direction away from the substrate. The pixel definition layer is provided with a plurality of pixel openings for at least partially exposing the corresponding first electrode. The pixel openings are connected to the corresponding isolation openings.

[0038] Optionally, each pixel opening is connected to the isolation opening in a one-to-one correspondence.

[0039] According to a second aspect of this application, a display panel is provided, the display panel having a display area and a binding area located on one side of the display area, the display panel comprising:

[0040] substrate;

[0041] Signal leads are disposed on one side of the substrate and located in the bonding area;

[0042] A planarization layer is disposed on one side of the substrate and located between the bonding area and the display area; the planarization layer located in the bonding area covers a portion of the signal leads and exposes the signal leads; and

[0043] A pixel definition layer is disposed on the side of the planarization layer opposite to the substrate, and is located in the bonding area and the display area. The pixel definition layer located in the bonding area overlaps with the orthogonal projection portion of the signal lead on the substrate.

[0044] In one embodiment, the pixel definition layer comprises an inorganic material.

[0045] In one embodiment, the planarization layer includes a first portion located in the binding region, and the pixel definition layer includes a second portion located in the binding region;

[0046] The first part covers a portion of the signal lead and exposes the signal lead, and the second part overlaps with the orthographic projection portion of the signal lead on the substrate;

[0047] The first portion has a first outer contour in its orthographic projection onto the substrate, and at least a portion of the first outer contour lies within the orthographic projection of the second portion onto the substrate.

[0048] Optionally, the first outer contour includes two first projection edges disposed opposite each other along a first direction and two second projection edges disposed opposite each other along a second direction, wherein at least one of the first projection edges and / or at least one of the second projection edges is located within the orthographic projection of the second portion on the substrate; the first direction and the second direction intersect each other;

[0049] Optionally, the orthographic projection of the first portion on the substrate is located within the orthographic projection of the second portion on the substrate;

[0050] Optionally, the first direction and the second direction are perpendicular to each other.

[0051] In one embodiment, the distance between the first projection edge and the orthographic projection of the second portion onto the substrate along the first direction is J1, where 2μm≤J1≤4μm; and / or

[0052] Along the second direction, the distance between the second projection edge and the orthographic projection of the second portion on the substrate is J2, where 2μm≤J2≤4μm.

[0053] In one embodiment, the first portion is provided with a first lead opening for exposing the signal lead;

[0054] At least a portion of the sidewall of the first lead opening has its orthographic projection on the substrate located within the orthographic projection of the second portion on the substrate;

[0055] Optionally, the orthographic projection of the sidewall of the first lead opening on the substrate includes two third projection edges disposed opposite each other along a first direction and two fourth projection edges disposed opposite each other along a second direction, wherein at least one of the third projection edges and / or at least one of the fourth projection edges is located within the orthographic projection of the second portion on the substrate; the first direction and the second direction intersect each other;

[0056] Optionally, the orthographic projection of the first portion on the substrate is located within the orthographic projection of the second portion on the substrate;

[0057] Optionally, the first direction and the second direction are perpendicular to each other.

[0058] In one embodiment, the second portion is provided with a second lead opening that communicates with the corresponding first lead opening, and the orthographic projection of the sidewall of the first lead opening on the substrate surrounds the orthographic projection of the sidewall of the corresponding second lead opening on the substrate.

[0059] In one embodiment, along the first direction, the distance between the third projection edge and the sidewall of the second lead opening within its orthographic projection on the substrate is J3, wherein 2μm≤J3≤4μm; and / or

[0060] Along the second direction, the distance between the fourth projection edge and the sidewall of the second lead opening within the orthographic projection on the substrate is J4, where 2μm≤J4≤4μm.

[0061] According to a third aspect of this application, a display device is provided, including the display panel described in any of the above embodiments.

[0062] According to a fourth aspect of this application, a method for manufacturing a display panel is provided, the display panel having a display area and a bonding area located on one side of the display area, the method for manufacturing the display panel comprising:

[0063] A substrate is provided; wherein a signal lead located in the bonding area is provided on one side of the substrate;

[0064] A planarization layer is formed on one side of the substrate; wherein the planarization layer is located in the bonding area and the display area, and the planarization layer located in the bonding area covers a portion of the signal leads;

[0065] A protective layer located in the bonding region is formed on the side of the planarization layer opposite to the substrate;

[0066] The orthographic projection of the protective layer on the substrate overlaps with the orthographic projection of the signal lead on the substrate.

[0067] In one embodiment, forming a protective layer located in the bonding region on the side of the planarization layer opposite to the substrate includes:

[0068] A protective layer located in the bonding area is formed on the side of the planarization layer opposite to the substrate, and a pixel definition layer is formed in the display area.

[0069] In one embodiment, after forming a protective layer located in the bonding region on the side of the planarization layer opposite to the substrate, the method further includes:

[0070] An isolation structure and multiple sub-pixels are formed on the side of the planarization layer away from the substrate;

[0071] The isolation structure is used to separate at least partially adjacent sub-pixels.

[0072] In the technical solution of this application, a protective layer or pixel definition layer can be used to cover the side of the planarization layer away from the substrate and expose the signal leads. This facilitates the subsequent bonding of the signal leads and also protects the planarization layer in the bonding area by using the protective layer or pixel definition layer. This reduces the possibility of the planarization layer peeling off from the substrate due to subsequent etching processes, which is beneficial to improving the display effect of the display panel. Attached Figure Description

[0073] Figure 1 A partial top view of the display panel according to the first embodiment of this application is shown.

[0074] Figure 2 It shows Figure 1 A cross-sectional view at point I.

[0075] Figure 3 A cross-sectional schematic diagram (display area) of a display panel according to an embodiment of this application is shown.

[0076] Figure 4 A partial top view of the display panel according to the second embodiment of this application is shown.

[0077] Figure 5 A partial top view of the display panel according to the third embodiment of this application is shown.

[0078] Figure 6 It shows Figure 5 A cross-sectional view at point II.

[0079] Figure 7 A partial top view of the display panel according to the fourth embodiment of this application is shown.

[0080] Figure 8 A partial top view of the display panel according to the fifth embodiment of this application is shown.

[0081] Figure 9 A partial top view of the display panel according to the sixth embodiment of this application is shown.

[0082] Figure 10 It shows Figure 9 A partial cross-sectional schematic diagram.

[0083] Reference numerals: 10, display panel; 101, display area; 102, bonding area; 100, substrate; 110, first source / drain metal layer; 200, signal lead; 210, first metal layer; 220, second metal layer; 230, third metal layer; 300, planarization layer; 310, first portion; 311, first lead opening; 320, via connection structure; t1, first projection edge; t2, second projection edge; t3, third projection edge. Edge; t4, fourth projection edge; 410, protective layer; 411, second lead opening; 412, aperture; 412a, aperture group; 420, pixel definition layer; 421, second part; 500, sub-pixel; 510, first electrode; 520, light-emitting part; 530, second electrode; 600, isolation structure; 710, first encapsulation layer; 711, encapsulation unit; 720, second encapsulation layer; K1, isolation opening; K2, pixel opening. Detailed Implementation

[0084] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0085] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0086] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0087] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0088] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0089] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0090] The composition and preparation of the isolation structure mentioned below are further described in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 100935, PCT / CN2024 / 102785, PCT / CN2024 / 099419, PCT / CN2024 / 099072, and CN116685174A for reference.

[0091] Research has revealed that by using a fine metal mask (FMM) to deposit subpixels of different colors onto the planarization layer of a substrate, and considering the need to facilitate subsequent bonding operations and improve bonding yield, there is usually no protective design above the planarization layer in the bonding area before the subpixel formation. Processes that forgo FMMs typically retain this unprotected design.

[0092] However, during the formation of sub-pixels, excess pixel material needs to be etched away, causing the planarization layer to peel off from the substrate due to the wet etching process, which in turn results in a poor display effect of the display panel.

[0093] Based on this, this application designs a display panel that can use a protective layer to protect the planarization layer, reducing the possibility of the planarization layer peeling off from the substrate due to subsequent etching processes, thereby improving the display effect of the display panel.

[0094] Figure 1 A schematic diagram of the structure of a display panel according to an embodiment of this application is shown. Figure 2 It shows Figure 1 A cross-sectional view at point I. Figure 3 A cross-sectional schematic diagram (display area) of a display panel according to an embodiment of this application is shown.

[0095] According to the first aspect of this application, please refer to Figures 1-3 One embodiment of this application provides a display panel 10, which has a display area 101 and a bonding area 102 located on one side of the display area 101. The display panel 10 includes a substrate 100, signal leads 200, a planarization layer 300 and a protective layer 410.

[0096] The signal lead 200 is disposed on one side of the substrate 100 and located in the bonding area 102.

[0097] Optionally, the signal lead 200 includes a first metal layer 210, a second metal layer 220, and a third metal layer 230 stacked along a direction away from the substrate 100. The display panel 10 has a first source / drain metal layer 110, a second source / drain metal layer (not shown), and a third source / drain metal layer (not shown) stacked in the display area 101. Compared to the first source / drain metal layer 110, the third source / drain metal layer is disposed closer to the substrate 100. The first electrode 510 of the sub-pixel 500 is electrically connected to the first source / drain metal layer 110 through a via connection structure 320 provided on the planarization layer 300. The first source / drain metal layer 110 is electrically connected to the third source / drain metal layer through the second source / drain metal layer. The third source / drain metal layer is disposed on the same layer as the first metal layer 210, the second source / drain metal layer is disposed on the same layer as the second metal layer 220, and the first source / drain metal layer 110 is disposed on the same layer as the third metal layer 230.

[0098] Thus, on the one hand, it is convenient to provide the corresponding high-level voltage signal to the first electrode 510 of the sub-pixel 500 through the third source drain metal layer, the second source drain metal layer and the first source drain metal layer 110; on the other hand, the third source drain metal layer and the first metal layer 210 are formed in the same manufacturing process, the second source drain metal layer and the second metal layer 220 are formed in the same manufacturing process, and the first source drain metal layer 110 and the third metal layer 230 are formed in the same manufacturing process, which can improve the manufacturing efficiency of the display panel 10 and reduce the manufacturing cost of the display panel 10.

[0099] A planarization layer 300 is disposed on one side of the substrate 100 and is located in the bonding area 102 and the display area 101. The planarization layer 300 located in the bonding area 102 covers part of the signal lead 200 and exposes the rest of the signal lead 200. A protective layer 410 is disposed on the side of the planarization layer 300 away from the substrate 100 and is located in the bonding area 102. The orthographic projection of the protective layer 410 on the substrate 100 overlaps with the orthographic projection of the signal lead 200 on the substrate 100.

[0100] Alternatively, the orthographic projections of the protective layer 410 and the portion of the planarization layer 300 exposed to the signal lead 200 on the substrate 100 may not overlap; or the orthographic projections of the protective layer 410 and the portion of the planarization layer 300 exposed to the signal lead 200 on the substrate 100 may overlap.

[0101] In this way, the protective layer 410 can be used to cover the side of the planarization layer 300 away from the substrate 100 and expose the signal lead 200. This facilitates the subsequent bonding of the signal lead 200 and also protects the planarization layer 300, reducing the possibility of the planarization layer 300 peeling off from the substrate 100 due to subsequent etching processes. This is beneficial to improving the display effect of the display panel 10.

[0102] In some embodiments, the display panel 10 further includes a pixel definition layer 420 located in the display area 101, the pixel definition layer 420 covering the portion of the planarization layer 300 located in the display area 101; the pixel definition layer 420 is disposed on the same layer as the protective layer 410.

[0103] It is understood that the protective layer 410 and the pixel definition layer 420 are formed in the same manufacturing process, which can improve the manufacturing efficiency of the display panel 10 and reduce the manufacturing cost of the display panel 10.

[0104] In some embodiments, the protective layer 410 comprises an inorganic material.

[0105] Compared to organic materials, inorganic materials can better reduce the impact of etching solutions on the planarization layer 300, and can also better protect the planarization layer 300 using the protective layer 410. This can further reduce the possibility of the planarization layer 300 peeling off from the substrate 100 due to subsequent etching processes, thereby improving the display effect of the display panel 10.

[0106] In some embodiments, both the protective layer 410 and the pixel definition layer 420 comprise inorganic materials.

[0107] The protective layer 410 and the pixel definition layer 420 can be formed in the same manufacturing process, which can improve the manufacturing efficiency of the display panel 10 and also better reduce the situation where the planarization layer 300 peels off from the substrate 100 due to subsequent etching processes, thereby improving the display effect of the display panel 10.

[0108] In some embodiments, the planarization layer 300 includes a first portion 310 located in the bonding region 102, the first portion 310 covering a portion of the signal lead 200 and exposing the remaining portion of the signal lead 200. The orthographic projection of the first portion 310 onto the substrate 100 has a first outer contour, at least a portion of which lies within the orthographic projection of the protective layer 410 onto the substrate 100.

[0109] It can be, such as Figure 1 As shown, the first outer contour lies within the orthographic projection of the protective layer 410 onto the substrate 100; alternatively, it can be as follows: Figure 4 As shown, a portion of the first outer contour lies within the orthographic projection of the protective layer 410 onto the substrate 100.

[0110] In other words, the protective layer 410 provides an edge-wrapping design for at least a portion of the outer edge of the planarization layer 300. This can be either the protective layer 410 wrapping the outer edge of the planarization layer 300, or the protective layer 410 wrapping a portion of the outer edge of the planarization layer 300. This reduces the side etching of the etching solution, allows the protective layer 410 to better protect the planarization layer 300, and further reduces the likelihood of the planarization layer 300 peeling off from the substrate 100 due to subsequent etching processes, thereby improving the display effect of the display panel 10.

[0111] Optionally, the first outer contour includes two first projection edges t1 disposed opposite to each other along the first direction F1, and two second projection edges t2 disposed opposite to each other along the second direction F2, wherein at least one first projection edge t1 and / or at least one second projection edge t2 are located within the orthographic projection of the protective layer 410 on the substrate 100; the first direction F1 and the second direction F2 intersect each other and are both perpendicular to the thickness direction of the substrate 100.

[0112] Optionally, the first direction F1 and the second direction F2 are perpendicular to each other. This can be because the first direction F1 is parallel to the length direction of the substrate 100, and the second direction F2 is parallel to the width direction of the substrate 100; or the first direction F1 is parallel to the width direction of the substrate 100, and the second direction F2 is parallel to the length direction of the substrate 100.

[0113] It is possible that at least one first projection edge t1 is located within the orthogonal projection of the protective layer 410 on the substrate 100; it is also possible that at least one second projection edge t2 is located within the orthogonal projection of the protective layer 410 on the substrate 100; or it is possible that at least one first projection edge t1 is located within the orthogonal projection of the protective layer 410 on the substrate 100, and at least one second projection edge t2 is located within the orthogonal projection of the protective layer 410 on the substrate 100.

[0114] Thus, the protective layer 410 can be designed to wrap the outer edge of the planarization layer 300 corresponding to the first projection edge t1 and / or the second projection edge t2. This can reduce the side etching of the etching solution, better utilize the protective layer 410 to protect the planarization layer 300, and further reduce the possibility of the planarization layer 300 peeling off from the substrate 100 due to subsequent etching processes, thereby improving the display effect of the display panel 10.

[0115] In some embodiments, the orthographic projection of the first portion 310 on the substrate 100 lies within the orthographic projection of the protective layer 410 on the substrate 100.

[0116] In other words, the protective layer 410 is designed to completely cover the outer edge of the planarization layer 300. This can better reduce the side etching of the etching solution, better protect the planarization layer 300 with the protective layer 410, and further reduce the possibility of the planarization layer 300 peeling off from the substrate 100 due to subsequent etching processes, thereby improving the display effect of the display panel 10.

[0117] In some embodiments, along the first direction F1, the distance between the first projection edge t1 and the orthographic projection of the protective layer 410 on the substrate 100 is J1, wherein 2μm≤J1≤4μm.

[0118] For example, J1 can be 2μm, 3μm, or 4μm.

[0119] It is understood that the protective layer 410 can be designed to wrap the outer edge of the planarization layer 300 corresponding to the first projection edge t1, and has a certain amount of wrapping. In this way, the side etching of the etching solution can be reduced better, the protective layer 410 can be used to better protect the planarization layer 300, and the situation where the planarization layer 300 peels off from the substrate 100 due to subsequent etching processes can be reduced better, which is conducive to improving the display effect of the display panel 10.

[0120] In other embodiments, along the second direction F2, the distance between the second projection edge t2 and the orthographic projection of the protective layer 410 on the substrate 100 is J2, wherein 2μm≤J2≤4μm.

[0121] For example, J2 can be 2μm, 3μm, or 4μm.

[0122] It is understood that the protective layer 410 can be designed to wrap the outer edge of the planarization layer 300 corresponding to the second projection edge t2, and has a certain amount of wrapping. In this way, the side etching of the etching solution can be reduced better, the protective layer 410 can be used to better protect the planarization layer 300, and the situation where the planarization layer 300 peels off from the substrate 100 due to subsequent etching processes can be reduced better, which is conducive to improving the display effect of the display panel 10.

[0123] In some embodiments, the distance between the first projection edge t1 and the orthographic projection of the protective layer 410 on the substrate 100 in the first direction F1 is J1, and the distance between the second projection edge t2 and the orthographic projection of the protective layer 410 on the substrate 100 in the second direction F2 is J2. Wherein, 2μm≤J1≤4μm, 2μm≤J2≤4μm.

[0124] It is understood that the protective layer 410 can be designed to wrap the outer edge of the planarization layer 300 and has a certain amount of wrapping. In this way, the side etching of the etching solution can be reduced better, the protective layer 410 can be used to better protect the planarization layer 300, and the situation where the planarization layer 300 peels off from the substrate 100 due to subsequent etching processes can be reduced better, which is conducive to improving the display effect of the display panel 10.

[0125] In some embodiments, the first portion 310 is provided with a first lead opening 311 for exposing the signal lead 200, and at least a portion of the sidewall of the first lead opening 311 is projected onto the substrate 100 in the orthographic projection of the protective layer 410 onto the substrate 100.

[0126] Alternatively, the orthographic projection of the sidewall of the first lead opening 311 onto the substrate 100 may lie within the orthographic projection of the protective layer 410 onto the substrate 100. Or, a portion of the orthographic projection of the sidewall of the first lead opening 311 onto the substrate 100 may lie within the orthographic projection of the protective layer 410 onto the substrate 100.

[0127] In this way, the protective layer 410 can be used to wrap at least part of the sidewall of the first lead opening 311, which helps to reduce the situation where the planarization layer 300 peels off from the substrate 100 at the first lead opening 311 due to subsequent etching processes, thereby improving the display effect of the display panel 10.

[0128] Optionally, the orthographic projection of the sidewall of the first lead opening 311 onto the substrate 100 includes two third projection edges t3 arranged opposite each other along the first direction F1 and two fourth projection edges t4 arranged opposite each other along the second direction F2, wherein at least one third projection edge t3 and / or at least one fourth projection edge t4 are located within the orthographic projection of the protective layer 410 onto the substrate 100; the first direction F1 and the second direction F2 intersect each other.

[0129] Optionally, the first direction F1 and the second direction F2 are perpendicular to each other.

[0130] It is possible that at least one third projection edge t3 is located within the orthogonal projection of the protective layer 410 on the substrate 100; it is also possible that at least one fourth projection edge t4 is located within the orthogonal projection of the protective layer 410 on the substrate 100; or it is possible that at least one third projection edge t3 is located within the orthogonal projection of the protective layer 410 on the substrate 100, and at least one fourth projection edge t4 is located within the orthogonal projection of the protective layer 410 on the substrate 100.

[0131] It is understood that the protective layer 410 is designed to wrap at least part of the sidewall of the first lead opening 311. In this way, the protective layer 410 can better protect the planarization layer 300, thereby reducing the possibility of the planarization layer 300 peeling off from the substrate 100 due to subsequent etching processes, which is beneficial to improving the display effect of the display panel 10.

[0132] In some embodiments, the orthographic projection of the first portion 310 on the substrate 100 lies within the orthographic projection of the protective layer 410 on the substrate 100.

[0133] Specifically, all first projection edges t1 are located within the orthographic projection of the protective layer 410 on the substrate 100, all second projection edges t2 are located within the orthographic projection of the protective layer 410 on the substrate 100, all third projection edges t3 are located within the orthographic projection of the protective layer 410 on the substrate 100, and all fourth projection edges t4 are located within the orthographic projection of the protective layer 410 on the substrate 100.

[0134] In other words, the protective layer 410 wraps around the entire outer edge of the planarization layer 300, and the protective layer 410 also wraps around the sidewall of each first lead opening 311. In this way, the protective layer 410 can better protect the planarization layer 300, thereby reducing the possibility of the planarization layer 300 peeling off from the substrate 100 at the first lead opening 311 due to subsequent etching processes, which is beneficial to improving the display effect of the display panel 10.

[0135] In some embodiments, the protective layer 410 is provided with a second lead opening 411 that communicates with the corresponding first lead opening 311, and the orthographic projection of the sidewall of the first lead opening 311 on the substrate 100 surrounds the orthographic projection of the sidewall of the corresponding second lead opening 411 on the substrate 100.

[0136] In this way, the sidewall of the second lead opening 411 can extend into the corresponding first lead opening 311, and the sidewall of the second lead opening 411 can be used to protect the sidewall of the first lead opening 311. This can better reduce the possibility of the planarization layer 300 peeling off from the substrate 100 at the first lead opening 311 due to subsequent etching processes, thereby improving the display effect of the display panel 10.

[0137] In some embodiments, along the first direction F1, the distance between the third projection edge t3 and the second lead opening 411 in the orthogonal projection on the substrate 100 is J3, wherein 2μm≤J3≤4μm.

[0138] For example, J3 is 2μm, 3μm, or 4μm.

[0139] Thus, the sidewall of the second lead opening 411 protects the portion of the sidewall of the first lead opening 311 corresponding to the third projection edge t3, and has a certain amount of protection on the portion of the sidewall of the first lead opening 311 corresponding to the third projection edge t3. This can better reduce the situation where the planarization layer 300 peels off from the substrate 100 at the first lead opening 311 due to subsequent etching processes, thereby improving the display effect of the display panel 10.

[0140] In other embodiments, along the second direction F2, the distance between the fourth projection edge t4 and the sidewall of the second lead opening 411 in the orthographic projection on the substrate 100 is J4, where 2μm≤J4≤4μm.

[0141] Thus, the sidewall of the second lead opening 411 protects the portion of the sidewall of the first lead opening 311 corresponding to the fourth projection edge t4, and has a certain amount of protection on the portion of the sidewall of the first lead opening 311 corresponding to the fourth projection edge t4. This can better reduce the situation where the planarization layer 300 peels off from the substrate 100 at the first lead opening 311 due to subsequent etching processes, thereby improving the display effect of the display panel 10.

[0142] In some embodiments, along the first direction F1, the distance between the third projection edge t3 and the second lead opening 411 in the orthogonal projection on the substrate 100 is J3, and along the second direction F2, the distance between the fourth projection edge t4 and the sidewall of the second lead opening 411 in the orthogonal projection on the substrate 100 is J4, wherein 2μm≤J3≤4μm and 2μm≤J4≤4μm.

[0143] Thus, the sidewall of the second lead opening 411 fully protects the sidewall of the first lead opening 311, and has a certain amount of edge protection on the sidewall of the first lead opening 311. This can better reduce the situation where the planarization layer 300 peels off from the substrate 100 at the first lead opening 311 due to subsequent etching processes, thereby improving the display effect of the display panel 10.

[0144] In some embodiments, please refer to Figure 5 and Figure 6 The protective layer 410 is provided with a plurality of openings 412 for partially exposing the first part 310. The orthographic projection of the openings 412 on the substrate 100 is staggered from the orthographic projection of the first lead opening 311 on the substrate 100.

[0145] In other words, the orthographic projection of the opening 412 on the substrate 100 does not overlap with the orthographic projection of the first lead opening 311 on the substrate 100.

[0146] Specifically, the orthographic projection of the opening 412 on the substrate 100 does not overlap with the orthographic projection of the second lead opening 411 on the substrate 100.

[0147] In this way, moisture can be released by the opening 412, thereby reducing the possibility of the planarization layer 300 peeling off from the substrate 100 due to subsequent etching processes, which is beneficial to improving the display effect of the display panel 10.

[0148] In some embodiments, the display panel 10 includes a plurality of signal leads 200 spaced apart, a first portion 310 covering a portion of each signal lead 200 and exposing the remaining portion of each signal lead 200. The orthographic projection of the protective layer 410 on the substrate 100 overlaps with the orthographic projection portion of each signal lead 200 on the substrate 100.

[0149] Optionally, the protective layer 410 covers the sidewall of each first lead opening 311, providing full edge protection for the sidewall of each first lead opening 311.

[0150] On the one hand, the protective layer 410 can protect the planarization layer 300 and reduce the possibility of the planarization layer 300 peeling off from the substrate 100 due to subsequent etching processes, which is beneficial to improving the display effect of the display panel 10; on the other hand, it can facilitate the subsequent bonding of multiple signal leads 200.

[0151] In some embodiments, the orthographic projection of the opening 412 on the substrate 100 is located between the orthographic projections of two adjacent first lead openings 311 on the substrate 100.

[0152] In this way, an opening 412 can be made on the protective layer 410 at the position between two adjacent first lead openings 311. This can make reasonable use of the position of the protective layer 410, and the opening 412 can also release moisture, thereby better reducing the possibility of the planarization layer 300 peeling off from the substrate 100 due to subsequent etching processes, which is beneficial to improving the display effect of the display panel 10.

[0153] In some embodiments, a plurality of openings 412 are arranged to form a plurality of opening groups 412a spaced apart along the spacing direction of the signal lead 200. The orthographic projection of the plurality of openings 412 of at least one opening group 412a on the substrate 100 is located between the orthographic projections of two corresponding and adjacent first lead openings 311 on the substrate 100.

[0154] For example, the spacing of the signal leads 200 is parallel to the first direction F1.

[0155] It can be, such as Figure 7 As shown, the orthographic projection of the plurality of openings 412 of an opening group 412a onto the substrate 100 is located between the orthographic projections of two corresponding and adjacent first lead openings 311 onto the substrate 100; alternatively, it can be as follows: Figure 5 and Figure 8 As shown, the orthographic projections of the plurality of openings 412 of the two sets of opening groups 412a onto the substrate 100 are located between the orthographic projections of the corresponding and adjacent first lead openings 311 onto the substrate 100. Of course, this application is not limited to this; it is also possible that the orthographic projections of the plurality of openings 412 of three or more sets of opening groups 412a onto the substrate 100 are located between the orthographic projections of the corresponding and adjacent first lead openings 311 onto the substrate 100.

[0156] Optionally, the orthographic projections of multiple openings 412 of at least two sets of opening groups 412a onto the substrate 100 are located between the orthographic projections of corresponding and adjacent first lead openings 311 onto the substrate 100. The at least two sets of opening groups 412a are spaced apart along a first direction F1, and adjacent sets of opening groups 412a are staggered along a second direction F2 (e.g., ...). Figure 8 (As shown).

[0157] In this way, the position of the protective layer 410 can be reasonably utilized, and multiple openings 412 can be arranged roughly evenly on the protective layer 410. This allows the multiple openings 412 to better release the moisture generated by the subsequent etching process, reducing the possibility of the planarization layer 300 peeling off from the substrate 100 due to the subsequent etching process, thereby improving the display effect of the display panel 10.

[0158] In some embodiments, please refer to Figure 3 The display panel 10 also includes a plurality of sub-pixels 500 and an isolation structure 600. The plurality of sub-pixels 500 are spaced apart on the side of the planarization layer 300 away from the substrate 100. The isolation structure 600 is disposed on the side of the planarization layer 300 away from the substrate 100. The isolation structure 600 is used to separate adjacent sub-pixels 500.

[0159] The isolation structure 600 can be disposed on the side of the pixel definition layer 420 away from the substrate 100, or it can be disposed on the side of the planarization layer 300 away from the substrate 100, along with the pixel definition layer 420.

[0160] In the process of forming multiple sub-pixels 500 by vapor deposition, the expensive fine metal mask (FMM) can be eliminated. Multiple sub-pixels 500 can be formed on the side of the planarization layer 300 away from the substrate 100. The pixel material of the sub-pixels 500 (the pixel material includes at least the material of the light-emitting part 520, or the pixel material includes the material of the light-emitting part 520 and the material of the second electrode 530; or the pixel material includes the material of the light-emitting part 520) is separated by the isolation structure 600. The structural design of the sub-pixels 500 is no longer limited by the fine metal mask (FMM). The isolation structure 600 and the sub-pixels 500 can be designed according to the requirements of increasing the aperture ratio of the display panel 10, which is beneficial to improving the aperture ratio of the display panel 10 while reducing the manufacturing cost of the display panel 10.

[0161] In some embodiments, the isolation structure 600 is provided with a plurality of isolation openings K1 corresponding to a plurality of sub-pixels 500, and the sub-pixels 500 are disposed within the corresponding isolation openings K1. In this way, during the process of forming a plurality of sub-pixels 500 by vapor deposition, the pixel material of the sub-pixels 500 can be formed on the side of the planarization layer 300 away from the substrate 100 through the isolation openings K1, and adjacent sub-pixels 500 are spaced apart. The formation of a plurality of sub-pixels 500 on the side of the planarization layer 300 away from the substrate 100 is beneficial to improving the aperture ratio of the display panel 10 while reducing the manufacturing cost of the display panel 10.

[0162] In some embodiments, the sub-pixel 500 includes a first electrode 510, a light-emitting portion 520, and a second electrode 530 stacked and arranged along a direction away from the substrate 100. The pixel definition layer 420 is provided with a plurality of pixel openings K2 for at least partially exposing the corresponding first electrode 510. The pixel openings K2 are connected to the corresponding isolation openings K1.

[0163] At least a portion of the light-emitting part 520 is disposed within the corresponding pixel opening K2, and at least a portion of the second electrode 530 is disposed within the corresponding isolation opening K1. Optionally, the pixel opening K2 is connected to the isolation opening K1 in a one-to-one correspondence.

[0164] In this way, the pixel material of the sub-pixel 500 can be deposited on the first electrode 510 on the substrate 100 through the corresponding isolation opening K1 and the corresponding pixel opening K2, so that at least a portion of the light-emitting part 520 is disposed in the corresponding pixel opening K2, and at least a portion of the second electrode 530 is disposed in the corresponding isolation opening K1, so as to form a plurality of sub-pixels 500 on the side of the planarization layer 300 away from the substrate 100, which is beneficial to improve the aperture ratio of the display panel 10 and reduce the manufacturing cost of the display panel 10.

[0165] In some embodiments, such as Figure 3 As shown, the display panel 10 also includes a first encapsulation layer 710, which includes a plurality of encapsulation units 711. At least a portion of the plurality of encapsulation units 711 are correspondingly disposed within a plurality of isolation openings K1, and the encapsulation units 711 completely cover the corresponding sub-pixels 500.

[0166] The material of the packaging unit 711 may include at least one of organic and inorganic materials.

[0167] The encapsulation unit 711 can be used to prevent moisture from entering the corresponding sub-pixel 500, forming an independent encapsulation of the corresponding sub-pixel 500, which helps to improve the reliability of the display panel 10.

[0168] In some embodiments, the display panel 10 further includes a second encapsulation layer 720, which is disposed on the isolation structure 600 and covers a plurality of encapsulation units 711.

[0169] The material of the second encapsulation layer 720 may include organic and / or inorganic materials. For example, the second encapsulation layer 720 includes an organic encapsulation layer and an inorganic encapsulation layer stacked in a direction away from the substrate 100.

[0170] The first encapsulation layer 710 and the second encapsulation layer 720 effectively encapsulate multiple sub-pixels 500, improving the barrier to moisture and thus enhancing the reliability of the display panel 10.

[0171] According to the second aspect of this application, such as Figure 9 and Figure 10 As shown, one embodiment of this application provides a display panel 10, which has a display area 101 and a bonding area 102 located on one side of the display area 101. The display panel 10 includes a substrate 100, signal leads 200, a planarization layer 300 and a pixel definition layer 420.

[0172] Signal lead 200 is disposed on one side of substrate 100 and located in bonding area 102. Planarization layer 300 is disposed on one side of substrate 100 and located in bonding area 102 and display area 101. Planarization layer 300 located in bonding area 102 covers part of signal lead 200 and exposes signal lead 200. Pixel definition layer 420 is disposed on the side of planarization layer 300 away from substrate 100 and located in bonding area 102 and display area 101. Pixel definition layer 420 located in bonding area 102 overlaps with the orthographic projection of signal lead 200 on substrate 100.

[0173] In this way, the portion of the pixel definition layer 420 located in the bonding area 102 can cover the side of the planarization layer 300 away from the substrate 100, exposing the signal leads 200. This facilitates the subsequent bonding of the signal leads 200, while also protecting the planarization layer 300 by the portion of the pixel definition layer 420 located in the bonding area 102. This reduces the likelihood of the planarization layer 300 peeling off from the substrate 100 due to subsequent etching processes, which is beneficial for improving the display effect of the display panel 10.

[0174] In some embodiments, the pixel definition layer 420 comprises inorganic materials.

[0175] Compared to organic materials, inorganic materials can better reduce the impact of etching solutions on the planarization layer 300, and can also better utilize the pixel definition layer 420 to protect the planarization layer 300. This can further reduce the possibility of the planarization layer 300 peeling off from the substrate 100 due to subsequent etching processes, thereby improving the display effect of the display panel 10.

[0176] In some embodiments, the planarization layer 300 includes a first portion 310 located in the bonding region 102, and the pixel definition layer 420 includes a second portion 421 located in the bonding region 102. The first portion 310 covers a portion of the signal lead 200 and exposes the signal lead 200. The second portion 421 overlaps with the orthographic projection portion of the signal lead 200 on the substrate 100. The orthographic projection of the first portion 310 on the substrate 100 has a first outer contour, and at least a portion of the first outer contour is located within the orthographic projection of the second portion 421 on the substrate 100.

[0177] It is possible that the orthographic projections of the second part 421 and the portion of the planarization layer 300 exposed to the signal lead 200 on the substrate 100 do not overlap; or it is possible that the orthographic projections of the second part 421 and the portion of the planarization layer 300 exposed to the signal lead 200 on the substrate 100 overlap.

[0178] In other words, the second part 421 provides an edge-wrapping design for at least a portion of the outer edge of the planarization layer 300. This can be either the second part 421 providing an edge-wrapping design for the outer edge of the planarization layer 300, or the second part 421 providing an edge-wrapping design for a portion of the outer edge of the planarization layer 300. In this way, the second part 421 can better protect the planarization layer 300, thereby reducing the possibility of the planarization layer 300 peeling off from the substrate 100 due to subsequent etching processes, which is beneficial to improving the display effect of the display panel 10.

[0179] It can be understood that the second part 421 is equivalent to the protective layer 410 in the first aspect. The relative positional relationship between the second part 421 and the first part 310 can be referred to the relative positional relationship between the protective layer 410 and the first part 310, which will not be elaborated here.

[0180] According to a third aspect of this application, a display device is provided, including a display panel 10 of any of the embodiments of the first or second aspect described above.

[0181] The display device can be a mobile or fixed terminal with a display panel 10, such as a mobile phone, television, tablet computer, laptop computer, Ultra-Mobile Personal Computer (UMPC), Personal Digital Assistant (PDA), navigation device, smartwatch, virtual reality device, etc.

[0182] The display device provided in this application embodiment can improve the display effect of the display panel 10.

[0183] According to a fourth aspect of this application, a method for manufacturing a display panel 10 is provided, comprising the following steps:

[0184] S10. A substrate 100 is provided, wherein a signal lead 200 located in the bonding area 102 is provided on the substrate 100.

[0185] S20. A planarization layer 300 is formed on one side of the substrate 100, wherein the planarization layer 300 is located in the display area 101 and the bonding area 102, and the planarization layer 300 located in the bonding area 102 covers a portion of the signal lead 200.

[0186] S30. A protective layer 410 is formed on the side of the planarization layer 300 away from the substrate 100.

[0187] The orthographic projection of the protective layer 410 on the substrate 100 overlaps with the orthographic projection of the signal lead 200 on the substrate 100.

[0188] In this way, the protective layer 410 can be used to cover the side of the planarization layer 300 away from the substrate 100 and expose the signal lead 200. This facilitates the subsequent bonding of the signal lead 200 and also protects the planarization layer 300, reducing the possibility of the planarization layer 300 peeling off from the substrate 100 due to subsequent etching processes. This is beneficial to improving the display effect of the display panel 10.

[0189] In some embodiments, step S30 of forming a protective layer 410 on the side of the planarization layer 300 facing away from the substrate 100 includes:

[0190] S31. A protective layer 410 located in the bonding region 102 is formed on the side of the planarization layer 300 away from the substrate 100, and a pixel definition layer 420 located in the display region 101 is formed.

[0191] In this way, the protective layer 410 and the pixel definition layer 420 are formed in the same manufacturing process, which can improve the manufacturing efficiency of the display panel 10 and reduce the manufacturing cost of the display panel 10.

[0192] In some embodiments, after forming a protective layer 410 on the side of the planarization layer 300 facing away from the substrate 100, the method for manufacturing the display panel 10 further includes:

[0193] S40, an isolation structure 600 and a plurality of sub-pixels 500 are formed on the side of the planarization layer 300 away from the substrate 100. The isolation structure 600 is used to space apart at least partially adjacent sub-pixels 500.

[0194] On the one hand, by using vapor deposition to form multiple sub-pixels 500, the expensive fine metal mask (FMM) can be eliminated. Multiple sub-pixels 500 can be formed on the side of the planarization layer 300 away from the substrate 100, and the pixel materials of the sub-pixels 500 are separated by the isolation structure 600. The structural design of the sub-pixels 500 is no longer limited by the fine metal mask (FMM). The isolation structure 600 and the sub-pixels 500 can be designed according to the requirements of increasing the aperture ratio of the display panel 10, which is beneficial to improving the aperture ratio of the display panel 10 while reducing the manufacturing cost of the display panel 10. On the other hand, the process of fabricating the isolation structure 600 and the sub-pixels 500 both include an etching process. Since the protective layer 410 is formed before the fabrication process of the isolation structure 600 and the sub-pixels 500, the protective layer 410 can be used to reduce the possibility of the planarization layer 300 peeling off from the substrate 100 due to the subsequent etching process, thereby improving the display effect of the display panel 10.

[0195] Of course, the manufacturing method of the display panel 10 also includes the manufacturing process of the first encapsulation layer 710 and the second encapsulation layer 720, which will not be described in detail here.

[0196] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0197] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A display panel, characterized in that, The display panel has a display area and a bonding area located on one side of the display area, and the display panel includes: substrate; Signal leads are disposed on one side of the substrate and located in the bonding area; A planarization layer is disposed on one side of the substrate and located between the bonding area and the display area; the planarization layer located in the bonding area covers a portion of the signal leads; and A protective layer is disposed on the side of the planarization layer opposite to the substrate and located in the bonding area, wherein the orthographic projection of the protective layer on the substrate overlaps with the orthographic projection of the signal lead on the substrate.

2. The display panel according to claim 1, characterized in that, The display panel further includes a pixel definition layer located in the display area, which covers the portion of the planarization layer located in the display area; the pixel definition layer and the protective layer are disposed on the same layer. Optionally, the protective layer comprises an inorganic material; Optionally, both the protective layer and the pixel definition layer comprise inorganic materials.

3. The display panel according to claim 1, characterized in that, The planarization layer includes a first portion located in the bonding area, the first portion covering a portion of the signal lead and exposing the remaining portion of the signal lead; The first portion has a first outer contour in its orthographic projection onto the substrate, and at least a portion of the first outer contour lies within the orthographic projection of the protective layer onto the substrate. Optionally, the first outer contour includes two first projection edges disposed opposite each other along a first direction and two second projection edges disposed opposite each other along a second direction, wherein at least one of the first projection edges and / or at least one of the second projection edges are located within the orthographic projection of the protective layer on the substrate; the first direction and the second direction intersect each other and are both perpendicular to the thickness direction of the substrate; Optionally, the orthographic projection of the first portion on the substrate is located within the orthographic projection of the protective layer on the substrate; Optionally, the first direction and the second direction are perpendicular to each other.

4. The display panel according to claim 3, characterized in that, Along the first direction, the distance between the first projected edge and the orthographic projection of the protective layer on the substrate is J1, where 2μm≤J1≤4μm; and / or Along the second direction, the distance between the second projection edge and the orthographic projection of the protective layer on the substrate is J2, where 2μm≤J2≤4μm.

5. The display panel according to claim 3, characterized in that, The first portion is provided with a first lead opening for exposing the signal lead; At least a portion of the sidewall of the first lead opening has its orthographic projection on the substrate located within the orthographic projection of the protective layer on the substrate. Optionally, the orthographic projection of the sidewall of the first lead opening on the substrate includes two third projection edges disposed opposite to each other along a first direction and two fourth projection edges disposed opposite to each other along a second direction, wherein at least one of the third projection edges and / or at least one of the fourth projection edges is located within the orthographic projection of the protective layer on the substrate; the first direction and the second direction intersect each other; Optionally, the orthographic projection of the first portion on the substrate is located within the orthographic projection of the protective layer on the substrate; Optionally, the first direction and the second direction are perpendicular to each other.

6. The display panel according to claim 5, characterized in that, The protective layer is provided with a second lead opening that communicates with the corresponding first lead opening, and the orthographic projection of the sidewall of the first lead opening on the substrate surrounds the orthographic projection of the sidewall of the corresponding second lead opening on the substrate. Optionally, along the first direction, the distance between the third projection edge and the sidewall of the second lead opening within its orthographic projection on the substrate is J3, where 2μm≤J3≤4μm; and / or Along the second direction, the distance between the fourth projection edge and the sidewall of the second lead opening within the orthographic projection on the substrate is J4, where 2μm≤J4≤4μm.

7. The display panel according to claim 5, characterized in that, The protective layer has multiple openings for partially exposing the first part; The orthographic projection of the opening on the substrate is offset from the orthographic projection of the first lead opening on the substrate.

8. The display panel according to claim 7, characterized in that, The display panel includes multiple signal leads arranged at intervals, the first part covers a portion of each signal lead and exposes the remaining portion of each signal lead; the orthographic projection of the protective layer on the substrate overlaps with the orthographic projection of each signal lead on the substrate. Optionally, the orthographic projection of the opening on the substrate is located between the orthographic projections of two adjacent first lead openings on the substrate; Optionally, the plurality of openings are arranged to form multiple sets of openings spaced apart along the spacing direction of the signal leads, and the orthographic projection of the plurality of openings in at least one of the opening sets on the substrate is located between the orthographic projections of two corresponding and adjacent first lead openings on the substrate.

9. The display panel according to any one of claims 1-8, characterized in that, The display panel also includes: Multiple sub-pixels are spaced apart on the side of the planarization layer away from the substrate; and An isolation structure is disposed on the side of the planarization layer away from the substrate; the isolation structure is used to space adjacent sub-pixels apart; Optionally, the isolation structure is provided with a plurality of isolation openings corresponding to the plurality of sub-pixels, and the sub-pixels are disposed within the corresponding isolation openings; Optionally, the display panel further includes a pixel definition layer located in the display area, the pixel definition layer covering the portion of the planarization layer located in the display area; the pixel definition layer and the protective layer are disposed on the same layer. The sub-pixel includes a first electrode, a light-emitting portion, and a second electrode stacked and arranged along a direction away from the substrate. The pixel definition layer is provided with a plurality of pixel openings for at least partially exposing the corresponding first electrode. The pixel openings are connected to the corresponding isolation openings. Optionally, each pixel opening is connected to the isolation opening in a one-to-one correspondence.

10. A display panel, characterized in that, The display panel has a display area and a bonding area located on one side of the display area, and the display panel includes: substrate; Signal leads are disposed on one side of the substrate and located in the bonding area; A planarization layer is disposed on one side of the substrate and located between the bonding area and the display area; the planarization layer located in the bonding area covers a portion of the signal leads and exposes the signal leads; and A pixel definition layer is disposed on the side of the planarization layer opposite to the substrate, and is located in the bonding area and the display area. The pixel definition layer located in the bonding area overlaps with the orthogonal projection portion of the signal lead on the substrate.

11. The display panel according to claim 10, characterized in that, The pixel definition layer comprises inorganic materials.

12. The display panel according to claim 10, characterized in that, The planarization layer includes a first portion located in the binding region, and the pixel definition layer includes a second portion located in the binding region; The first part covers a portion of the signal lead and exposes the signal lead, and the second part overlaps with the orthographic projection portion of the signal lead on the substrate; The first portion has a first outer contour in its orthographic projection onto the substrate, and at least a portion of the first outer contour lies within the orthographic projection of the second portion onto the substrate. Optionally, the first outer contour includes two first projection edges disposed opposite each other along a first direction and two second projection edges disposed opposite each other along a second direction, wherein at least one of the first projection edges and / or at least one of the second projection edges is located within the orthographic projection of the second portion on the substrate; The first direction and the second direction intersect each other; Optionally, the orthographic projection of the first portion on the substrate is located within the orthographic projection of the second portion on the substrate; Optionally, the first direction and the second direction are perpendicular to each other.

13. The display panel according to claim 12, characterized in that, Along the first direction, the distance between the first projection edge and the orthographic projection of the second portion onto the substrate is J1, where 2μm≤J1≤4μm; and / or Along the second direction, the distance between the second projection edge and the orthographic projection of the second portion on the substrate is J2, where 2μm≤J2≤4μm.

14. The display panel according to claim 12, characterized in that, The first portion is provided with a first lead opening for exposing the signal lead; At least a portion of the sidewall of the first lead opening has its orthographic projection on the substrate located within the orthographic projection of the second portion on the substrate; Optionally, the orthographic projection of the sidewall of the first lead opening on the substrate includes two third projection edges disposed opposite to each other along a first direction and two fourth projection edges disposed opposite to each other along a second direction, wherein at least one of the third projection edges and / or at least one of the fourth projection edges is located within the orthographic projection of the second portion on the substrate. The first direction and the second direction intersect each other; Optionally, the orthographic projection of the first portion on the substrate is located within the orthographic projection of the second portion on the substrate; Optionally, the first direction and the second direction are perpendicular to each other.

15. The display panel according to claim 14, characterized in that, The second part is provided with a second lead opening that communicates with the corresponding first lead opening, and the orthographic projection of the sidewall of the first lead opening on the substrate surrounds the orthographic projection of the sidewall of the corresponding second lead opening on the substrate.

16. The display panel according to claim 15, characterized in that, Along the first direction, the distance between the third projection edge and the sidewall of the second lead opening within its orthographic projection on the substrate is J3, where 2μm≤J3≤4μm; and / or Along the second direction, the distance between the fourth projection edge and the sidewall of the second lead opening within the orthographic projection on the substrate is J4, where 2μm≤J4≤4μm.

17. A display device, characterized in that, Includes the display panel as described in any one of claims 1-16.

18. A method for manufacturing a display panel, characterized in that, The display panel has a display area and a bonding area located on one side of the display area. The method for manufacturing the display panel includes: A substrate is provided; wherein, the substrate is provided with signal leads located in the bonding area; A planarization layer is formed on one side of the substrate; wherein the planarization layer is located in the bonding area and the display area, and the planarization layer located in the bonding area covers a portion of the signal leads; A protective layer located in the bonding region is formed on the side of the planarization layer opposite to the substrate; The orthographic projection of the protective layer on the substrate overlaps with the orthographic projection of the signal lead on the substrate.

19. The method for manufacturing a display panel according to claim 18, characterized in that, The step of forming a protective layer located in the bonding region on the side of the planarization layer opposite to the substrate includes: A protective layer located in the bonding area is formed on the side of the planarization layer opposite to the substrate, and a pixel definition layer is formed in the display area.

20. The method for manufacturing a display panel according to claim 18, characterized in that, After forming a protective layer located in the bonding region on the side of the planarization layer opposite to the substrate, the method further includes: An isolation structure and multiple sub-pixels are formed on the side of the planarization layer away from the substrate; The isolation structure is used to separate at least partially adjacent sub-pixels.

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