Display panel, display device and manufacturing method of display panel

Abstract

The invention relates to a display panel, a display device and a manufacturing method of the display panel. The display panel comprises a substrate, a planarization layer and a first protection layer. The planarization layer is arranged on one side of the substrate and at least located in the display area and the frame area. The planarization layer comprises a first part located in the frame area. The first protection layer is arranged on the side, away from the substrate, of the planarization layer and at least located in the frame area. The substrate comprises an inorganic layer, and in the frame area, the first protection layer is in contact with the inorganic layer. The orthographic projection of the first part on the substrate is located in the orthographic projection of the first protection layer on the substrate. Therefore, the condition that the planarization layer is stripped from the substrate due to the subsequent etching process can be reduced, and the display effect of the display panel can be improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, a display device, and a method for manufacturing the display panel. Background Technology

[0002] OLED (Organic Light Emitting Diode) display panels are one of the hottest topics in the field of display panel research today. OLED display panels have advantages such as low energy consumption, low cost, self-emissiveness, wide viewing angle and fast response speed.

[0003] However, traditional display panels have poor display quality. Summary of the Invention

[0004] Therefore, it is necessary to provide a display panel, a display device, and a method for manufacturing the display panel to address the problem of poor display performance of traditional display panels.

[0005] According to a first aspect of this application, a display panel is provided, the display panel having a display area and a border area located on at least one side of the display area, the display panel comprising:

[0006] A substrate, the substrate comprising an inorganic layer;

[0007] A planarization layer is disposed on one side of the substrate and is located at least in the display area and the bezel area; the planarization layer includes a first portion located in the bezel area; and

[0008] A first protective layer is disposed on the side of the planarization layer opposite to the substrate, and is at least located in the border region; in the border region, the first protective layer is in contact with the inorganic layer;

[0009] Wherein, the orthographic projection of the first portion on the substrate is located within the orthographic projection of the first protective layer on the substrate.

[0010] In one embodiment, the first protective layer includes an edge portion in the border region, the edge portion contacting the inorganic layer;

[0011] Optionally, the first protective layer comprises an inorganic material;

[0012] Optionally, the thickness of the first protective layer is 0.2 μm to 0.6 μm.

[0013] In one embodiment, the display panel further includes a second protective layer disposed on the side of the first protective layer opposite to the planarization layer; the orthographic projection of the first protective layer on the substrate is located within the orthographic projection of the second protective layer on the substrate.

[0014] Optionally, the thickness of the second protective layer is 0.2 μm to 0.6 μm;

[0015] Optionally, the material of the second protective layer includes inorganic materials;

[0016] Optionally, the orthographic projection of the first protective layer on the substrate completely overlaps with the orthographic projection of the second protective layer on the substrate.

[0017] In one embodiment, the first portion has a first outer edge;

[0018] The orthographic projection of the first outer edge onto the substrate is located within the orthographic projection of the first protective layer onto the substrate.

[0019] Optionally, the first outer edge includes two first edge portions disposed opposite each other along a first direction, and two second edge portions disposed opposite each other along a second direction; at least one of the first edge portions has its orthographic projection on the substrate located within the orthographic projection of the first protective layer on the substrate; and / or, at least one of the second edge portions has its orthographic projection on the substrate located within the orthographic projection of the first protective layer on the substrate.

[0020] Wherein, the first direction and the second direction intersect each other and are both perpendicular to the thickness direction of the substrate;

[0021] Optionally, along the first direction, the distance between the orthographic projection of the first edge portion on the substrate and the outer contour of the orthographic projection of the first protective layer on the substrate is J1, where J1 ≥ 2 μm;

[0022] Optionally, along the second direction, the distance between the orthographic projection of the second edge portion on the substrate and the outer contour of the orthographic projection of the first protective layer on the substrate is J2, where J2 ≥ 2 μm;

[0023] Optionally, 2μm≤J1≤4μm;

[0024] Optionally, 2μm≤J2≤4μm;

[0025] Optionally, the orthographic projection of the first outer edge on the substrate is located within the orthographic projection of the first protective layer on the substrate;

[0026] Optionally, the border area includes a first border area and a second border area disposed on opposite sides of the display area along the first direction, and a third border area and a fourth border area disposed on opposite sides of the display area along the second direction.

[0027] Optionally, the first direction and the second direction are perpendicular to each other.

[0028] In one embodiment, the border area includes a binding area;

[0029] The display panel also includes signal leads disposed on one side of the substrate and located in the bonding area, wherein the first part covers a portion of the signal leads and exposes the remaining portion of the signal leads;

[0030] The first protective layer overlaps with the orthogonal projection portion of the signal lead on the substrate;

[0031] Optionally, the first portion is provided with a first lead opening for exposing the signal lead;

[0032] The orthographic projection of the sidewall of the first lead opening onto the substrate is located within the orthographic projection of the first protective layer onto the substrate.

[0033] Optionally, the sidewall of the first lead opening includes two first sidewalls disposed opposite to each other along a first direction and two second sidewalls disposed opposite to each other along a second direction. The orthographic projection of at least one first sidewall and / or at least one second sidewall on the substrate is located within the orthographic projection of the first protective layer on the substrate. The first direction and the second direction intersect each other and are both perpendicular to the thickness direction of the substrate.

[0034] Optionally, the orthographic projection of the sidewall of the first lead opening on the substrate is located within the orthographic projection of the first protective layer on the substrate;

[0035] Optionally, the first direction and the second direction are perpendicular to each other;

[0036] The first protective layer is provided with a second lead opening that communicates with the first lead opening, and the orthographic projection of the sidewall of the first lead opening on the substrate surrounds the orthographic projection of the sidewall of the second lead opening on the substrate.

[0037] Optionally, along the first direction, the distance between the first sidewall and the sidewall of the second lead opening within their orthographic projections on the substrate is J3, where J3 ≥ 2 μm; and / or

[0038] Along the second direction, the distance between the second sidewall and the sidewall of the second lead opening within the orthographic projection on the substrate is J4, where J4 ≥ 2 μm;

[0039] Optionally, 2μm≤J3≤4μm;

[0040] Optionally, 2μm≤J4≤4μm.

[0041] In one embodiment, the display panel further has a first area located between the display area and the border area;

[0042] The orthographic projection of the planarization layer on the substrate does not overlap with the orthographic projection of the first region on the substrate;

[0043] Optionally, in the first region, the first protective layer is in contact with the inorganic layer.

[0044] In one embodiment, the first protective layer includes a first protective portion located in the border area and a second protective portion located in the first area; the first protective portion is connected to the second protective portion;

[0045] The orthographic projection of the first portion onto the substrate is located within the orthographic projection of the first protective portion onto the substrate;

[0046] Optionally, in the border area, the first protective portion contacts the inorganic layer; in the first area, the second protective portion contacts the inorganic layer.

[0047] In one embodiment, the display panel further has a bend area located between the display area and the first area;

[0048] The first protective layer includes a third protective portion located in the bending area, and the second protective portion is connected between the first protective portion and the third protective portion;

[0049] Optionally, the planarization layer further includes a second portion located in the bending region;

[0050] The orthographic projection of the second part on the substrate is located within the outer contour of the orthographic projection of the third protective part on the substrate;

[0051] Optionally, the second portion has a second outer edge, the second outer edge including two third edge portions disposed opposite to each other along a first direction, and two fourth edge portions disposed opposite to each other along a second direction; at least one of the third edge portions has its orthographic projection on the substrate located within the orthographic projection of the third protective portion on the substrate; and / or, at least one of the fourth edge portions has its orthographic projection on the substrate located within the orthographic projection of the third protective portion on the substrate;

[0052] Wherein, the first direction and the second direction intersect each other and are both perpendicular to the thickness direction of the substrate;

[0053] Optionally, along the first direction, the distance between the orthographic projection of the third edge portion on the substrate and the orthographic projection of the third protective portion on the substrate is J5, where J5 ≥ 2 μm;

[0054] Optionally, along the second direction, the distance between the orthographic projection of the fourth edge portion on the substrate and the orthographic projection of the third protective portion on the substrate is J6, where J6 ≥ 2 μm;

[0055] Optionally, 2μm≤J5≤4μm;

[0056] Optionally, 2μm≤J6≤4μm;

[0057] Optionally, the orthographic projection of the second outer edge on the substrate is located within the orthographic projection of the third protective portion on the substrate;

[0058] Optionally, the first direction and the second direction are perpendicular to each other.

[0059] In one embodiment, the third protective portion is provided with a first opening;

[0060] The orthographic projection of the first opening on the substrate is located inside the outer contour of the orthographic projection of the third protective part on the substrate.

[0061] Optionally, the opening area of ​​the first opening is a, and the projection area of ​​the third protective part on the substrate is b.

[0062] a≥80%*(a+b);

[0063] Optionally, 80%*(a+b)≤a<(a+b).

[0064] In one embodiment, the size of the first area is D, where D ≥ 10 μm, along the direction from the display area to the border area.

[0065] Optionally, 10μm≤D≤20μm.

[0066] In one embodiment, the display panel further includes a pixel definition layer located in the display area, the pixel definition layer being disposed on the side of the planarization layer away from the substrate; the pixel definition layer is disposed in the same layer as the first protective layer;

[0067] Optionally, both the first protective layer and the pixel definition layer comprise inorganic materials.

[0068] In one embodiment, the display panel further includes:

[0069] Multiple sub-pixels are spaced apart on the side of the planarization layer away from the substrate; and

[0070] An isolation structure is disposed on the side of the planarization layer away from the substrate; the isolation structure is used to space adjacent sub-pixels apart;

[0071] Optionally, the isolation structure is provided with a plurality of isolation openings corresponding to the plurality of sub-pixels, and the sub-pixels are disposed within the corresponding isolation openings;

[0072] Optionally, the display panel further includes a pixel definition layer located in the display area, the pixel definition layer being disposed on the side of the planarization layer away from the substrate; the pixel definition layer is disposed in the same layer as the first protective layer;

[0073] The pixel definition layer is provided with multiple pixel openings, and the pixel openings are connected to the corresponding isolation openings;

[0074] Optionally, the pixel opening corresponds one-to-one with the isolation opening.

[0075] According to a second aspect of this application, a display panel is provided, the display panel having a display area, a border area located on at least one side of the display area, and a first area located between the display area and the border area, the display panel comprising:

[0076] substrate;

[0077] A planarization layer is disposed on one side of the substrate, and is located at least in the display area and the border area; the orthographic projection of the planarization layer on the substrate does not overlap with the orthographic projection of the first area on the substrate; and

[0078] A first protective layer is disposed on the side of the planarization layer opposite to the substrate, and is at least located in the border area.

[0079] In one embodiment, the size of the first area is D, where D ≥ 10 μm, along the direction from the display area to the border area.

[0080] Optionally, 10μm≤D≤20μm.

[0081] In one embodiment, the planarization layer includes a first portion located in the border region, the first portion having an orthographic projection on the substrate within the orthographic projection of the first protective layer on the substrate;

[0082] Optionally, the first protective layer includes a first protective portion located in the border area and a second protective portion located in the first area; the first protective portion is connected to the second protective portion;

[0083] The orthographic projection of the first portion onto the substrate is located within the orthographic projection of the first protective portion onto the substrate;

[0084] Optionally, the substrate includes a substrate and an inorganic layer stacked together, and the planarization layer is disposed on the side of the inorganic layer away from the substrate;

[0085] At least a portion of the first protective portion is disposed on the side of the planarization layer opposite to the substrate; the second protective portion is disposed on the side of the inorganic layer away from the substrate;

[0086] Optionally, in the border area, the first protective portion contacts the inorganic layer; in the first area, the second protective portion contacts the inorganic layer.

[0087] In one embodiment, the display panel further has a bend area located between the display area and the first area;

[0088] The first protective layer includes a third protective portion located in the bending area, and the second protective portion is connected between the first protective portion and the third protective portion;

[0089] Optionally, the planarization layer further includes a second portion located in the bending region;

[0090] The orthographic projection of the second part on the substrate is located within the orthographic projection of the third protective part on the substrate.

[0091] According to a third aspect of this application, a display device is provided, including the display panel of any of the above embodiments.

[0092] According to a fourth aspect of this application, a method for manufacturing a display panel is provided, the display panel having a display area and a border area located on one side of the display area, the method for manufacturing the display panel comprising:

[0093] A substrate is provided, the substrate comprising an inorganic layer;

[0094] A planarization layer is formed on one side of the substrate; wherein the planarization layer is located at least in the display area and the border area; the planarization layer includes a first portion located in the border area;

[0095] A first protective layer is formed on the side of the planarization layer opposite to the substrate;

[0096] Wherein, the first protective layer is located at least in the border area, and in the border area, the first protective layer is in contact with the inorganic layer;

[0097] The orthographic projection of the first portion on the substrate is located within the orthographic projection of the first protective layer on the substrate.

[0098] In one embodiment, forming a first protective layer on the side of the planarization layer opposite to the substrate includes:

[0099] A first protective layer is formed on the side of the planarization layer opposite to the substrate, at least in the border area, and a pixel definition layer is formed in the display area.

[0100] In one embodiment, after forming the first protective layer on the side of the planarization layer opposite to the substrate, the method further includes:

[0101] An isolation structure and multiple sub-pixels are formed on the side of the planarization layer away from the substrate;

[0102] The isolation structure is used to separate adjacent sub-pixels.

[0103] In the technical solution of this application, the first protective layer can be made to cover the side of the planarization layer away from the substrate, thereby protecting the first part of the planarization layer by utilizing the portion of the first protective layer located in the frame area, reducing the possibility of the planarization layer peeling off from the substrate due to subsequent etching processes, and thus improving the display effect of the display panel. Attached Figure Description

[0104] Figure 1 A top view of a display panel according to an embodiment of this application is shown.

[0105] Figure 2 It shows Figure 1 A cross-sectional view at point I.

[0106] Figure 3 A cross-sectional view (bonding area) of a display panel in an embodiment of this application is shown in the direction perpendicular to the thickness of the display panel.

[0107] Figure 4 A top view of a display panel according to another embodiment of this application is shown.

[0108] Figure 5 It shows Figure 4 A cross-sectional view at point II.

[0109] Figure 6 A cross-sectional view (bending area) of a display panel in an embodiment of this application is shown in the direction perpendicular to the thickness of the display panel.

[0110] Figure 7 A cross-sectional view of the display panel at point II is shown in another embodiment of this application.

[0111] Figure 8 A cross-sectional schematic diagram of the display panel in the display area according to an embodiment of this application is shown.

[0112] Figure 9 A cross-sectional schematic diagram of the display panel in the display area is shown in another embodiment of this application.

[0113] Reference numerals: 10, display panel; 101, display area; 102, border area; 1021, first border area; 10211, bonding area; 1022, third border area; 1023, fourth border area; 103, first area; 104, bending area; 100, substrate; 110, substrate; 120, inorganic layer; 131, signal lead; 132, pixel circuit; 1321, first source / drain metal layer; 1322, second source / drain metal layer; 1323, third source / drain metal layer; 1324, first via connection structure; 1325, second via connection structure; 200, planarization layer; 210, first portion; 211, first outer edge; 2111, first edge portion; 2112, second edge portion; 2101, first lead opening; b1, first sidewall b2, Second sidewall; 220, Second part; 221, Second outer edge; 2211, Third edge part; 2212, Fourth edge part; 2001, First planarization layer; 2002, Second planarization layer; 2003, Third planarization layer; 310, First protective layer; 311, First protective part; 3101, Second lead opening; 3111, Edge part; 312, Second protective part; 313, Third protective part; 3131, First opening; 320, Pixel definition layer; 400, Second protective layer; 500, Sub-pixel; 510, First electrode; 520, Light-emitting part; 530, Second electrode; 600, Isolation structure; K1, Isolation opening; K2, Pixel opening; 710, First encapsulation layer; 711, Encapsulation unit; 720, Second encapsulation layer. Detailed Implementation

[0114] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0115] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0116] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0117] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0118] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0119] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0120] The composition and preparation of the isolation structure mentioned below are further described in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 100935, PCT / CN2024 / 102785, PCT / CN2024 / 099419, PCT / CN2024 / 099072, and CN116685174A for reference.

[0121] Figure 1 A top view of the display panel 10 according to an embodiment of this application is shown. Figure 2 It shows Figure 1 A cross-sectional view at point I.

[0122] Please see Figure 1 and Figure 2 According to a first aspect of this application, one embodiment of this application provides a display panel 10 having a display area 101 and a border area 102 located on at least one side of the display area 101.

[0123] Alternatively, the display area 101 may have a border area 102 on at least one side along the first direction F1; or the display area 101 may have a border area 102 on at least one side along the second direction F2, wherein the first direction F1 and the second direction F2 are perpendicular to each other and both are perpendicular to the thickness direction of the display panel 10, the first direction F1 is parallel to the length direction of the display panel 10, and the second direction is parallel to the width direction of the display panel 10.

[0124] The display panel 10 includes a substrate 100, a planarization layer 200, and a first protective layer 310. The planarization layer 200 is disposed on one side of the substrate 100 and is located at least in the display area 101 and the bezel area 102. The first protective layer 310 is disposed on the side of the planarization layer 200 away from the substrate 100 and is located at least in the bezel area 102. The substrate 100 includes an inorganic layer 120, and the first protective layer 310 is in contact with the inorganic layer 120 in the bezel area 102.

[0125] In this embodiment, the substrate 100 further includes a substrate 110, and the planarization layer 200 is disposed on the side of the inorganic layer 120 away from the substrate 110.

[0126] Alternatively, the planarization layer 200 may be located in the display area 101 and the border area 102; or a portion of the planarization layer 200 may be located in the display area 101 and the border area 102, while another portion of the planarization layer 200 may be located in other areas of the display panel 10 besides the display area 101 and the border area 102.

[0127] Similarly, the first protective layer 310 may be located in the border area 102; or a portion of the first protective layer 310 may be located in the border area 102, and another portion of the first protective layer 310 may be located in other areas of the display panel 10 other than the display area 101 and the border area 102.

[0128] The planarization layer 200 includes a first portion 210 located in the border region 102. The orthographic projection of the first portion 210 on the substrate 100 is located within the orthographic projection of the first protective layer 310 on the substrate 100.

[0129] Since the orthographic projection of the first portion 210 on the substrate 100 is located within the orthographic projection of the first protective layer 310 on the substrate 100, and since the first protective layer 310 is disposed on the side of the planarization layer 200 away from the substrate 100, the first protective layer 310 can cover the side of the planarization layer 200 away from the substrate 100. Thus, the portion of the first protective layer 310 located in the frame area 102 can protect the first portion 210 of the planarization layer 200, reducing the possibility of the planarization layer 200 peeling off from the substrate 100 due to subsequent etching processes, thereby improving the display effect of the display panel 10.

[0130] Furthermore, it is understood that a portion of the first protective layer 310 is disposed on the side of the inorganic layer 120 away from the substrate 110, and another portion of the first protective layer 310 is disposed on the side of the planarization layer 200 away from the inorganic layer 120.

[0131] Therefore, a portion of the first protective layer 310 disposed on the inorganic layer 120 can wrap the other portion of the first protective layer 310 disposed on the planarization layer 200, which helps to reduce the side etching of the planarization layer 200, thereby reducing the probability of the planarization layer 200 peeling off from the substrate 100, and also reducing the probability of the signal lead 131 being corroded due to water absorption by the planarization layer 200.

[0132] In some embodiments, such as Figure 2 As shown, the first protective layer 310 includes an edge portion 3111 in the border area 102, where the edge portion 3111 contacts the inorganic layer 120.

[0133] In this way, the edge portion 3111 of the first protective layer 310 can be better used to wrap the planarization layer 200 located in the frame area 102, which is more conducive to reducing the side etching of the planarization layer 200, thereby reducing the probability of the planarization layer 200 peeling off from the substrate 100, and also reducing the probability of the signal lead 131 being corroded due to water absorption by the planarization layer 200.

[0134] Optionally, the second protective section 312 covers the inorganic layer 120 located in the first zone 103.

[0135] In some embodiments, such as Figure 7 As shown, the display panel 10 also includes a second protective layer 400, which is disposed on the side of the first protective layer 310 opposite to the planarization layer 200. The orthographic projection of the first protective layer 310 on the substrate 100 is located within the orthographic projection of the second protective layer 400 on the substrate 100.

[0136] Optionally, the thickness of the first protective layer 310 is 0.2 μm to 0.6 μm.

[0137] For example, the thickness of the first protective layer 310 is 0.2 μm, 0.3 μm, 0.4 μm, 0.5 μm or 0.6 μm.

[0138] Optionally, the thickness of the second protective layer 400 is 0.2 μm to 0.6 μm.

[0139] For example, the thickness of the second protective layer 400 is 0.2 μm, 0.3 μm, 0.4 μm, 0.5 μm or 0.6 μm.

[0140] In this way, the first protective layer 310 and the second protective layer 400 can be used to better protect the planarization layer 200, thereby reducing the probability of the planarization layer 200 peeling off from the substrate 100 and reducing the probability of the signal lead 131 being corroded due to water absorption by the planarization layer 200.

[0141] Optionally, the material of the second protective layer 400 may include inorganic materials.

[0142] For example, the material of the second protective layer 400 may be the same as that of the passivation layer, such as silicon nitride or silicon oxide.

[0143] In this way, the second protective layer 400 can better prevent moisture from entering the first protective layer 310 below it, thereby reducing the probability of the planarization layer 200 peeling off from the substrate 100 and reducing the probability of corrosion of the signal lead 131 due to water absorption by the planarization layer 200. Optionally, the orthographic projection of the first protective layer 310 on the substrate 100 completely overlaps with the orthographic projection of the second protective layer 400 on the substrate 100.

[0144] In this way, the planarization layer 200 can be protected more comprehensively by the first protective layer 310 and the second protective layer 400, thereby reducing the probability of the planarization layer 200 peeling off from the substrate 100 and reducing the probability of the signal lead 131 being corroded due to water absorption by the planarization layer 200.

[0145] In some embodiments, please refer to Figure 3The first part 210 has a first outer edge 211, and the orthographic projection of the first outer edge 211 on the substrate 100 is located within the orthographic projection of the first protective layer 310 on the substrate 100.

[0146] In this way, the possibility of the first outer edge 211 of the first portion 210 being etched due to being exposed can be reduced, thereby reducing the possibility of the planarization layer 200 peeling off from the substrate 100 due to subsequent etching processes, which is beneficial to improving the display effect of the display panel 10.

[0147] In some embodiments, the first outer edge 211 includes two first edge portions 2111 disposed opposite each other along a first direction F1, and two second edge portions 2112 disposed opposite each other along a second direction F2. Alternatively, the orthographic projection of at least one first edge portion 2111 on the substrate 100 may lie within the orthographic projection of the first protective layer 310 on the substrate 100; or the orthographic projection of at least one second edge portion 2112 on the substrate 100 may lie within the orthographic projection of the first protective layer 310 on the substrate 100. Furthermore, the orthographic projection of at least one first edge portion 2111 on the substrate 100 may lie within the orthographic projection of the first protective layer 310 on the substrate 100, and the orthographic projection of at least one second edge portion 2112 on the substrate 100 may also lie within the orthographic projection of the first protective layer 310 on the substrate 100. The first direction F1 and the second direction F2 intersect each other and are both perpendicular to the thickness direction of the substrate 100.

[0148] Optionally, the first direction F1 and the second direction F2 are perpendicular to each other and both are perpendicular to the thickness direction of the substrate 100, that is, perpendicular to the thickness direction of the display panel 10.

[0149] In this way, the first protective layer 310 can be used to protect the first edge portion 2111 and / or the second edge portion 2112, reducing the possibility that the first edge portion 2111 and / or the second edge portion 2112 will be etched due to being exposed. This can reduce the possibility that the planarization layer 200 will peel off from the substrate 100 due to subsequent etching processes, thereby improving the display effect of the display panel 10.

[0150] In some embodiments, along the first direction F1, the distance between the orthographic projection of the first edge portion 2111 on the substrate 100 and the outer contour of the orthographic projection of the first protective layer 310 on the substrate 100 is J1, where J1 ≥ 2 μm.

[0151] Optionally, 2μm ≤ J1 ≤ 4μm. For example, J1 is 2μm, 3μm, or 4μm.

[0152] The first protective layer 310 can be designed to wrap the first edge portion 2111 with sufficient wrapping amount. In this way, the etching solution can be reduced to etch the side of the first edge portion 2111. The first protective layer 310 can be used to better protect the planarization layer 200, thereby reducing the possibility of the planarization layer 200 peeling off from the substrate 100 due to subsequent etching processes, which is beneficial to improving the display effect of the display panel 10.

[0153] In some embodiments, along the second direction F2, the distance between the orthographic projection of the second edge portion 2112 on the substrate 100 and the outer contour of the orthographic projection of the first protective layer 310 on the substrate 100 is J2, where J2 ≥ 2 μm.

[0154] Optionally, 2μm ≤ J2 ≤ 4μm. For example, J2 is 2μm, 3μm, or 4μm.

[0155] The first protective layer 310 can be designed to cover the second edge portion 2112 with sufficient coverage. This reduces the etching of the side of the second edge portion 2112 by the etching solution, and allows the first protective layer 310 to better protect the planarization layer 200. This further reduces the possibility of the planarization layer 200 peeling off from the substrate 100 due to subsequent etching processes, thereby improving the display effect of the display panel 10.

[0156] In some embodiments, the orthographic projection of the first outer edge 211 on the substrate 100 is located within the orthographic projection of the first protective layer 310 on the substrate 100.

[0157] In this way, the first protective layer 310 can be used to more comprehensively protect the first outer edge 211, reduce the etching of the side of the first outer edge 211 by the etching solution, better protect the planarization layer 200 by the first protective layer 310, and further reduce the situation where the planarization layer 200 peels off from the substrate 100 due to subsequent etching processes, thereby improving the display effect of the display panel 10.

[0158] In some embodiments, the border area 102 includes a first border area 1021 and a second border area disposed on opposite sides of the display area 101 along a first direction F1, and a third border area 1022 and a fourth border area 1023 disposed on opposite sides of the display area 101 along a second direction F2. The first direction F1 and the second direction F2 intersect each other and are both perpendicular to the thickness direction of the substrate 100, that is, perpendicular to the thickness direction of the display panel 10.

[0159] For example, the first direction F1 and the second direction F2 are perpendicular to each other. For instance, the first direction F1 is parallel to the length direction of the display panel 10, the second direction F2 is parallel to the width direction of the display panel 10, the first border area 1021 is the bottom border area, the second border area is the top border area, the third border area 1022 is the left border area, and the fourth border area 1023 is the right border area.

[0160] The first border area 1021 includes the binding area 10211 described below.

[0161] Thus, within the frame area 102, the planarization layer 200 can be protected by the first protective layer 310, which can better reduce the situation where the planarization layer 200 peels off from the substrate 100 due to subsequent etching processes, thereby improving the display effect of the display panel 10.

[0162] In some embodiments, the border area 102 includes a bonding area 10211, and the display panel 10 also includes a signal lead 131 disposed on one side of the substrate 100 and located in the bonding area 10211. A first portion 210 covers a portion of the signal lead 131 and exposes the remaining portion of the signal lead 131. A first protective layer 310 overlaps with the orthographic projection portion of the signal lead 131 on the substrate 100.

[0163] Alternatively, the portion of the signal lead 131 exposed in the first part 210 may not overlap with the orthographic projection of the signal lead 131 on the substrate 100; or the portion of the signal lead 131 exposed in the first part 210 may overlap with the orthographic projection of the signal lead 131 on the substrate 100.

[0164] Thus, on the one hand, the first protective layer can be used to protect the first part 210, reducing the possibility of the planarization layer 200 peeling off from the substrate 100 due to subsequent etching processes, thereby improving the display effect of the display panel 10; on the other hand, the portion of the signal lead 131 exposed in the first part 210 can also be exposed through the first protective layer 310, facilitating the subsequent bonding operation of the signal lead 131, and also reducing the probability of corrosion of the signal lead 131 due to water absorption by the planarization layer 200.

[0165] In some embodiments, the first portion 210 is provided with a first lead opening 2101 for exposing the signal lead 131, and the orthographic projection of the sidewall of the first lead opening 2101 on the substrate 100 is located within the orthographic projection of the first protective layer 310 on the substrate 100.

[0166] In this way, the first protective layer 310 can be used to wrap at least part of the sidewall of the first lead opening 2101, which helps to reduce the situation where the planarization layer 200 peels off from the substrate 100 at the first lead opening 2101 due to subsequent etching processes, thereby improving the display effect of the display panel 10.

[0167] In some embodiments, the sidewall of the first lead opening 2101 includes two first sidewalls b1 disposed opposite to each other along the first direction F1, and two second sidewalls b2 disposed opposite to each other along the second direction F2. The orthographic projection of at least one first sidewall b1 and / or at least one second sidewall b2 on the substrate 100 is located within the orthographic projection of the first protective layer 310 on the substrate 100. The first direction F1 and the second direction F2 intersect each other and are both perpendicular to the thickness direction of the substrate 100.

[0168] It can be that the orthographic projection of at least one first sidewall b1 on the substrate 100 is located within the orthographic projection of the first protective layer 310 on the substrate 100; it can also be that the orthographic projection of at least one second sidewall b2 on the substrate 100 is located within the orthographic projection of the first protective layer 310 on the substrate 100; or it can be that the orthographic projection of at least one first sidewall b1 on the substrate 100 is located within the orthographic projection of the first protective layer 310 on the substrate 100, and the orthographic projection of at least one second sidewall b2 on the substrate 100 is located within the orthographic projection of the first protective layer 310 on the substrate 100.

[0169] Optionally, the first direction F1 and the second direction F2 are perpendicular to each other.

[0170] In this way, the first protective layer 310 can be used to protect the first sidewall b1 and / or the second sidewall b2, reducing the possibility that the planarization layer 200 will peel off from the substrate 100 at the first lead opening 2101 due to subsequent etching processes, thereby improving the display effect of the display panel 10.

[0171] In some embodiments, the first protective layer 310 is provided with a second lead opening 3101 that communicates with the first lead opening 2101, and the orthographic projection of the sidewall of the first lead opening 2101 on the substrate 100 surrounds the orthographic projection of the sidewall of the second lead opening 3101 on the substrate 100.

[0172] In this way, the sidewall of the second lead opening 3101 can extend into the corresponding first lead opening 2101, and the sidewall of the second lead opening 3101 can be used to protect the sidewall of the first lead opening 2101. This can better reduce the possibility of the planarization layer 200 peeling off from the substrate 100 at the first lead opening 2101 due to subsequent etching processes, thereby improving the display effect of the display panel 10.

[0173] In some embodiments, along the first direction F1, the distance between the first sidewall b1 and the sidewall of the second lead opening 3101 in the orthogonal projection on the substrate 100 is J3, wherein J3 ≥ 2 μm.

[0174] Optionally, 2μm ≤ J3 ≤ 4μm. For example, J3 is 2μm, 3μm, or 4μm.

[0175] The first protective layer 310 can be designed to wrap around the first sidewall b1 with sufficient wrapping amount. This can better reduce the side etching of the first sidewall b1 by the etching solution, better protect the planarization layer 200 with the first protective layer 310, and further reduce the possibility of the planarization layer 200 peeling off from the substrate 100 due to subsequent etching processes, thereby improving the display effect of the display panel 10.

[0176] In other embodiments, along the second direction F2, the distance between the second sidewall b2 and the sidewall of the second lead opening 3101 in the orthographic projection on the substrate 100 is J4, wherein J4 ≥ 2 μm.

[0177] Optionally, 2μm ≤ J3 ≤ 4μm. For example, J3 is 2μm, 3μm, or 4μm.

[0178] The first protective layer 310 can be designed to wrap around the second sidewall b2 with sufficient wrapping amount. This can better reduce the side etching of the second sidewall b2 by the etching solution, better protect the planarization layer 200 with the first protective layer 310, and further reduce the possibility of the planarization layer 200 peeling off from the substrate 100 due to subsequent etching processes, thereby improving the display effect of the display panel 10.

[0179] In some embodiments, along the first direction F1, the distance between the first sidewall b1 and the sidewall of the second lead opening 3101 in the orthographic projection on the substrate 100 is J3, wherein J3 ≥ 2 μm. Along the second direction F2, the distance between the second sidewall b2 and the sidewall of the second lead opening 3101 in the orthographic projection on the substrate 100 is J4, wherein J4 ≥ 2 μm.

[0180] In this way, the first protective layer 310 can be used to better protect the planarization layer 200, thereby reducing the possibility of the planarization layer 200 peeling off from the substrate 100 due to subsequent etching processes, which is beneficial to improving the display effect of the display panel 10.

[0181] In some embodiments, please refer to Figure 4 and Figure 5The display panel 10 also has a first region 103 located between the display area 101 and the bezel area 102. The orthographic projection of the planarization layer 200 on the substrate 100 does not overlap with the orthographic projection of the first region 103 on the substrate 100.

[0182] The first area 103 refers to the area on the display panel 10 located between the display area 101 and the border area 102, where no planarization layer 200 is provided.

[0183] Specifically, the first area 103 is located between the display area 101 and the lower border area.

[0184] Since the first region 103 is located between the display region 101 and the border region 102, and the orthographic projection of the planarization layer 200 on the substrate 100 does not overlap with the orthographic projection of the first region 103 on the substrate 100, the moisture generated by etching in the portion of the planarization layer 200 located between the first region 103 and the display region 101 is difficult to diffuse through the first region 103 to the border region 102. In this way, the probability of the planarization layer 200 peeling off from the substrate 100 can be further reduced, and the probability of the signal lead 131 being corroded due to water absorption by the planarization layer 200 can also be reduced.

[0185] In some embodiments, in the first region 103, the first protective layer 310 is in contact with the inorganic layer 120.

[0186] Thus, the first protective layer 310 can be used to protect the first region 103, reducing the possibility of moisture spreading to the frame region 102 through the first region 103. In addition, since the first region 103 is located between the display region 101 and the frame region 102, the first protective layer 310 can also be used to wrap the first part 210 located in the frame region 102, reducing the probability of side etching on the side of the first part 210 close to the first region 103. This can further reduce the probability of the planarization layer 200 peeling off from the substrate 100, and also reduce the probability of the signal lead 131 being corroded due to water absorption by the planarization layer 200.

[0187] In some embodiments, the first protective layer 310 includes a first protective portion 311 located in the border region 102 and a second protective portion 312 located in the first region 103, wherein the first protective portion 311 and the second protective portion 312 are connected. The orthographic projection of the first portion 210 on the substrate 100 is located within the orthographic projection of the first protective portion 311 on the substrate 100.

[0188] In this way, the second protective portion 312 of the first protective layer 310 can be used to protect the portion of the substrate 100 located in the first region 103, which can further reduce the possibility of moisture spreading from the first region 103 to the frame region 102. This can further reduce the probability of the planarization layer 200 peeling off from the substrate 100, and also reduce the probability of the signal lead 131 being corroded due to water absorption by the planarization layer 200.

[0189] In this embodiment, in the border area 102, the first protective part 311 contacts the inorganic layer 120, and in the first area 103, the second protective part 312 contacts the inorganic layer 120.

[0190] In this way, the first protective part 311 and the second protective part 312 connected together can be used to form a wrapping design for the first part 210, reducing the probability of side etching on the side of the first part 210 near the first region 103, thereby reducing the probability of the planarization layer 200 peeling off from the substrate 100, and also reducing the probability of the signal lead 131 being corroded due to water absorption by the planarization layer 200.

[0191] In some embodiments, the display panel 10 further has a bending region 104 located between the display area 101 and the first area 103, and the first protective layer 310 includes a third protective portion 313 located in the bending region 104, and a second protective portion 312 connected between the first protective portion 311 and the third protective portion 313.

[0192] It is advantageous that the second protective part 312 is connected between the first protective part 311 and the third protective part 313. Therefore, it is more difficult for moisture to diffuse through the first region 103 to the frame region 102. In this way, the probability of the planarization layer 200 peeling off from the substrate 100 can be further reduced, and the probability of the signal lead 131 being corroded due to water absorption by the planarization layer 200 can also be reduced.

[0193] In some embodiments, the planarization layer 200 further includes a second portion 220 located in the bending region 104, the orthographic projection of the second portion 220 on the substrate 100 being located within the outer contour of the orthographic projection of the third protective portion 313 on the substrate 100.

[0194] It is possible that the orthographic projection of the second part 220 on the substrate 100 is located within the outer contour of the orthographic projection of the third protective part 313 on the substrate 100; or it is possible that the orthographic projection of the second part 220 on the substrate 100 is located within the outer contour of the orthographic projection of the third protective part 313 on the substrate 100.

[0195] The first protective layer 310 can be used to reduce the diffusion of moisture generated by etching on the second part 220 of the planarization layer 200 to the frame area 102 through the first area 103. The second part 220 of the planarization layer 200 can also be used to improve the flexibility of the bending area 104, making it easier for the display panel 10 to perform subsequent bonding operations.

[0196] In some embodiments, such as Figure 6 As shown, the second portion 220 has a second outer edge 221, which includes two third edge portions 2211 disposed opposite to each other along a first direction F1, and two fourth edge portions 2212 disposed opposite to each other along a second direction F2. Alternatively, the orthographic projection of at least one third edge portion 2211 on the substrate 100 may lie within the orthographic projection of the third protective portion 313 on the substrate 100; or the orthographic projection of at least one fourth edge portion 2212 on the substrate 100 may lie within the orthographic projection of the third protective portion 313 on the substrate 100; or the orthographic projection of at least one third edge portion 2211 on the substrate 100 may lie within the orthographic projection of the third protective portion 313 on the substrate 100, and the orthographic projection of at least one fourth edge portion 2212 on the substrate 100 may lie within the orthographic projection of the third protective portion 313 on the substrate 100. The first direction F1 and the second direction F2 intersect each other and are both perpendicular to the thickness direction of the substrate 100.

[0197] Optionally, the first direction F1 and the second direction F2 are perpendicular to each other.

[0198] In this way, the third protective portion 313 of the first protective layer 310 can protect the third edge portion 2211 and / or the fourth edge portion 2212, reducing the possibility that the third edge portion 2211 and / or the fourth edge portion 2212 will be etched due to being exposed. This can reduce the possibility that the planarization layer 200 will peel off from the substrate 100 due to subsequent etching processes, thereby improving the display effect of the display panel 10.

[0199] In some embodiments, along the first direction F1, the distance between the orthographic projection of the third edge portion 2211 on the substrate 100 and the orthographic projection of the third protective portion 313 on the substrate 100 is J5, where J5 ≥ 2 μm.

[0200] Optionally, 2μm ≤ J5 ≤ 4μm. For example, J5 is 2μm, 3μm, or 4μm.

[0201] The third protective portion 313 of the first protective layer 310 can be designed to wrap the third edge portion 2211 with sufficient wrapping amount. In this way, the etching solution can be reduced to etch the side of the third edge portion 2211, and the first protective layer 310 can be used to better protect the planarization layer 200. This can further reduce the possibility of the planarization layer 200 peeling off from the substrate 100 due to subsequent etching processes, thereby improving the display effect of the display panel 10.

[0202] In some embodiments, along the second direction F2, the distance between the orthographic projection of the fourth edge portion 2212 on the substrate 100 and the orthographic projection of the third protective portion 313 on the substrate 100 is J6, where J6 ≥ 2 μm.

[0203] Optionally, 2μm ≤ J6 ≤ 4μm. For example, J6 is 2μm, 3μm, or 4μm.

[0204] The third protective portion 313 of the first protective layer 310 can be designed to wrap the fourth edge portion 2212 with sufficient wrapping amount. In this way, the etching solution can be reduced to etch the side of the fourth edge portion 2212, and the first protective layer 310 can be used to better protect the planarization layer 200. This can further reduce the possibility of the planarization layer 200 peeling off from the substrate 100 due to subsequent etching processes, thereby improving the display effect of the display panel 10.

[0205] In some embodiments, the orthographic projection of the second outer edge 221 on the substrate 100 is located within the orthographic projection of the third protective portion 313 on the substrate 100.

[0206] It can be understood that the orthographic projections of the two third edge portions 2211 on the substrate 100 are located within the orthographic projections of the third protection portion 313 on the substrate 100, and the orthographic projections of the two fourth edge portions 2212 on the substrate 100 are located within the orthographic projections of the third protection portion 313 on the substrate 100.

[0207] In this way, the first protective layer 310 can be used to better protect the planarization layer 200, thereby reducing the possibility of the planarization layer 200 peeling off from the substrate 100 due to subsequent etching processes, which is beneficial to improving the display effect of the display panel 10.

[0208] In some embodiments, the third protective portion 313 is provided with a first opening 3131, and the orthographic projection of the first opening 3131 on the substrate 100 is located inside the outer contour of the orthographic projection of the third protective portion 313 on the substrate 100.

[0209] Thus, if the first protective layer 310 is made of an inorganic material, and the first opening 3131 is provided on the third protective part 313, it is beneficial to facilitate bending in the bending area 104 to perform bonding work on the back of the display panel 10. At the same time, it can also reduce the etching solution's etching of the side of the second outer edge 221 of the second part 220. In this way, the third protective part 313 of the first protective layer 310 can better protect the second outer edge 221 of the second part 220, thereby reducing the possibility of the planarization layer 200 peeling off from the substrate 100 due to subsequent etching processes, which is beneficial to improving the display effect of the display panel 10.

[0210] In some embodiments, the opening area of ​​the first opening 3131 is a, and the projection area of ​​the third protective part 313 on the substrate 100 is b, where a ≥ 80% * (a + b).

[0211] Optionally, 80%*(a+b)≤a<(a+b).

[0212] For example, 'a' can be 80%*(a+b), 90%*(a+b), or 99%*(a+b), etc.

[0213] In this way, the area of ​​the third protective part 313 located in the bending area 104 can be reduced, which facilitates subsequent bending in the bending area 104 for bonding work on the back of the display panel 10, thereby enabling a narrow bezel design.

[0214] In some embodiments, the size of the first area 103 is D, where D ≥ 10 μm, along the direction from the display area 101 to the border area 102.

[0215] Optionally, 10μm≤D≤20μm.

[0216] For example, D is 10μm, 15μm, or 20μm.

[0217] Along the direction from the display area 101 to the border area 102, the size of the first area 103 is large enough that the moisture generated by etching in the part of the planarization layer 200 located between the first area 103 and the display area 101 is less likely to diffuse through the first area 103 to the border area 102. In this way, the probability of the planarization layer 200 peeling off from the substrate 100 can be further reduced, and the probability of the signal lead 131 being corroded due to water absorption by the planarization layer 200 can also be reduced.

[0218] In some embodiments, please refer to Figure 8 The display panel 10 also includes a pixel definition layer 320 located in the display area 101. The pixel definition layer 320 is disposed on the side of the planarization layer 200 away from the substrate 100. The pixel definition layer 320 is disposed on the same layer as the first protective layer 310.

[0219] It is understood that the first protective layer 310 and the pixel definition layer 320 are formed in the same manufacturing process, which can improve the manufacturing efficiency of the display panel 10 and reduce the manufacturing cost of the display panel 10.

[0220] In some embodiments, the first protective layer 310 comprises an inorganic material.

[0221] Compared to organic materials, inorganic materials can better reduce the impact of etching solutions on the planarization layer 200, and can also better utilize the first protective layer 310 to protect the planarization layer 200. This can further reduce the possibility of the planarization layer 200 peeling off from the substrate 100 due to subsequent etching processes, thereby improving the display effect of the display panel 10.

[0222] In some embodiments, both the first protective layer 310 and the pixel definition layer 320 comprise inorganic materials.

[0223] This allows the first protective layer 310 and the pixel definition layer 320 to be formed in the same manufacturing process, which can improve the manufacturing efficiency of the display panel 10 and also better reduce the possibility of the planarization layer 200 peeling off from the substrate 100 due to subsequent etching processes, thereby improving the display effect of the display panel 10.

[0224] In some embodiments, please refer to Figure 8 The display panel 10 also includes a plurality of sub-pixels 500 and an isolation structure 600. The plurality of sub-pixels 500 are spaced apart on the side of the planarization layer 200 away from the substrate 100. The isolation structure 600 is disposed on the side of the planarization layer 200 away from the substrate 100. The isolation structure 600 is used to separate adjacent sub-pixels 500.

[0225] The isolation structure 600 may be disposed on the side of the pixel definition layer 320 away from the substrate 100, or the isolation structure 600 and the pixel definition layer 320 may both be disposed on the side of the planarization layer 200 away from the substrate 100.

[0226] In the process of forming multiple sub-pixels 500 by vapor deposition, the expensive fine metal mask (FMM) can be eliminated. Multiple sub-pixels 500 can be formed on the side of the planarization layer 200 away from the substrate 100. The pixel material of the sub-pixels 500 (the pixel material includes at least the material of the light-emitting part 520, or the pixel material includes the material of the light-emitting part 520 and the material of the second electrode 530; or the pixel material includes the material of the light-emitting part 520) is separated by the isolation structure 600. The structural design of the sub-pixels 500 is no longer limited by the fine metal mask (FMM). The isolation structure 600 and the sub-pixels 500 can be designed according to the requirements of increasing the aperture ratio of the display panel 10, which is beneficial to improving the aperture ratio of the display panel 10 while reducing the manufacturing cost of the display panel 10.

[0227] In some embodiments, the isolation structure 600 is provided with a plurality of isolation openings K1 corresponding to a plurality of sub-pixels 500, and the sub-pixels 500 are disposed within the corresponding isolation openings K1. In this way, during the process of forming a plurality of sub-pixels 500 by vapor deposition, the pixel material of the sub-pixels 500 can be formed on the side of the planarization layer 200 away from the substrate 100 through the isolation openings K1, and adjacent sub-pixels 500 are spaced apart. The formation of a plurality of sub-pixels 500 on the side of the planarization layer 200 away from the substrate 100 is beneficial to improving the aperture ratio of the display panel 10 while reducing the manufacturing cost of the display panel 10.

[0228] In some embodiments, the sub-pixel 500 includes a first electrode 510, a light-emitting portion 520, and a second electrode 530 stacked and arranged along a direction away from the substrate 100. The pixel definition layer 320 is provided with a plurality of pixel openings K2 for at least partially exposing the corresponding first electrode 510. The pixel openings K2 are connected to the corresponding isolation openings K1.

[0229] At least a portion of the light-emitting part 520 is disposed within the corresponding pixel opening K2, and at least a portion of the second electrode 530 is disposed within the corresponding isolation opening K1. Optionally, the pixel opening K2 is connected to the isolation opening K1 in a one-to-one correspondence.

[0230] In this way, the pixel material of the sub-pixel 500 can be deposited on the first electrode 510 on the substrate 100 through the corresponding isolation opening K1 and the corresponding pixel opening K2, so that at least a portion of the light-emitting part 520 is disposed in the corresponding pixel opening K2, and at least a portion of the second electrode 530 is disposed in the corresponding isolation opening K1, so as to form a plurality of sub-pixels 500 on the side of the planarization layer 200 away from the substrate 100, which is beneficial to improve the aperture ratio of the display panel 10 and reduce the manufacturing cost of the display panel 10.

[0231] In some embodiments, the substrate 100 includes a plurality of pixel circuits 132 corresponding to a plurality of sub-pixels 500. The pixel circuits 132 include a first source-drain metal layer 1321 disposed on the same layer as the signal leads 131. The first source-drain metal layer 1321 is electrically connected to the first electrode 510 of the sub-pixels 500.

[0232] Optionally, the pixel circuit 132 corresponds one-to-one with the sub-pixel 500.

[0233] In some embodiments, the pixel circuit 132 further includes a second source-drain metal layer 1322 and a third source-drain metal layer 1323, with the first source-drain metal layer 1321 located between the second source-drain metal layer 1322 and the third source-drain metal layer 1323. The first electrode 510 of the sub-pixel 500 is electrically connected to one side of the first source-drain metal layer 1321 through the second source-drain metal layer 1322, and the other side of the first source-drain metal layer 1321 is electrically connected to the third source-drain metal layer 1323.

[0234] In this embodiment, the substrate 100 includes a substrate 110 and an inorganic layer 120 stacked together. The planarization layer 200 includes a first planarization layer 2001, a second planarization layer 2002, and a third planarization layer 2003 stacked together in a direction away from the substrate 100. The third source / drain metal layer 1323 is disposed on the side of the inorganic layer 120 away from the substrate 110. The first planarization layer 2001 is disposed on the side of the inorganic layer 120 away from the substrate 110 and covers the third source / drain metal layer 1323. The first source / drain metal layer 1321 is disposed on the side of the first planarization layer 2001 away from the inorganic layer 120. The second planarization layer 2002 is disposed on the side of the first planarization layer 2001 away from the inorganic layer 120 and covers the first source / drain metal layer 1321. The second source / drain metal layer 1322 is disposed on the side of the second planarization layer 2002 away from the first planarization layer 2001, and the third planarization layer 2003 is disposed on the side of the second planarization layer 2002 away from the first planarization layer 2001, and covers the second source / drain metal layer 1322. A first via connection structure 1324 is provided on the second planarization layer 2002, through which the second source / drain metal layer 1322 is electrically connected to the first source / drain metal layer 1321. A second via connection structure 1325 is provided on the first planarization layer 2001, through which the first source / drain metal layer 1321 is electrically connected to the third source / drain metal layer 1323.

[0235] In some embodiments, such as Figure 9 As shown, the display panel 10 also includes a first encapsulation layer 710, which includes a plurality of encapsulation units 711. At least a portion of the encapsulation units 711 are disposed within the corresponding isolation opening K1, and the encapsulation units 711 completely cover the corresponding sub-pixels 500.

[0236] The material of the packaging unit 711 may include at least one of organic and inorganic materials.

[0237] The encapsulation unit 711 can be used to prevent moisture from entering the corresponding sub-pixel 500, forming an independent encapsulation of the corresponding sub-pixel 500, which helps to improve the reliability of the display panel 10.

[0238] In some embodiments, the display panel 10 further includes a second encapsulation layer 720, which is disposed on the isolation structure 600 and covers a plurality of encapsulation units 711.

[0239] The material of the second encapsulation layer 720 may include organic and / or inorganic materials. For example, the second encapsulation layer 720 includes an organic encapsulation layer and an inorganic encapsulation layer stacked in a direction away from the substrate 100.

[0240] The first encapsulation layer 710 and the second encapsulation layer 720 effectively encapsulate multiple sub-pixels 500, improving the barrier to moisture and thus enhancing the reliability of the display panel 10.

[0241] According to a second aspect of this application, a display panel 10 is provided, the display panel 10 having a display area 101, a border area 102 located on at least one side of the display area 101, and a first area 103 located between the display area 101 and the border area 102.

[0242] The display panel 10 includes a substrate 100, a planarization layer 200, and a first protective layer 310. The planarization layer 200 is disposed on one side of the substrate 100 and is located at least in the display area 101 and the bezel area 102. The first protective layer 310 is disposed on the side of the planarization layer 200 away from the substrate 100 and is located at least in the bezel area 102. The orthographic projection of the planarization layer 200 onto the substrate 100 does not overlap with the orthographic projection of the first area 103 onto the substrate 100.

[0243] Thus, on the one hand, the first protective layer 310 can cover the side of the planarization layer 200 away from the substrate 100, thereby protecting the first portion 210 of the planarization layer 200 by utilizing the portion of the first protective layer 310 located in the bezel area 102. This reduces the likelihood of the planarization layer 200 peeling off from the substrate 100 due to subsequent etching processes, thereby improving the display effect of the display panel 10. On the other hand, since the first area 103 is located between the display area 101 and the bezel area 102, and the orthographic projection of the planarization layer 200 on the substrate 100 does not overlap with the orthographic projection of the first area 103 on the substrate 100, moisture generated by etching in the portion of the planarization layer 200 located between the first area and the display area 101 is difficult to diffuse through the first area 103 to the bezel area 102. This further reduces the probability of the planarization layer 200 peeling off from the substrate 100 and also reduces the probability of corrosion of the signal lead 131 due to water absorption by the planarization layer 200.

[0244] The specific structure of the planarization layer 200 in this application can be referred to the specific structure of the planarization layer 200 in the first aspect, and the specific structure of the first protective layer 310 in this application can be referred to the specific structure of the first protective layer 310 in the first aspect, and will not be described in detail here.

[0245] According to a third aspect of this application, a display device is provided, including the display panel 10 of any of the above embodiments.

[0246] According to a fourth aspect of this application, a method for manufacturing a display panel 10 is provided, comprising the following steps:

[0247] S10, Provide substrate 100.

[0248] S20. A planarization layer 200 is formed on one side of the substrate 100, wherein the planarization layer 200 is located at least in the display area 101 and the border area 102; the planarization layer 200 includes a first portion 210 located in the border area 102.

[0249] S30. A first protective layer 310 is formed on the side of the planarization layer 200 away from the substrate 100.

[0250] The first protective layer 310 is located at least in the frame region 102, and in the frame region 102, the first protective layer 310 is in contact with the inorganic layer 120. The orthographic projection of the first portion 210 on the substrate 100 is located within the orthographic projection of the first protective layer 310 on the substrate 100.

[0251] In this way, the first protective layer 310 can cover the side of the planarization layer 200 away from the substrate 100, and the portion of the first protective layer 310 located in the frame area 102 can protect the first portion 210 of the planarization layer 200, reducing the possibility of the planarization layer 200 peeling off from the substrate 100 due to subsequent etching processes, thereby improving the display effect of the display panel 10.

[0252] In some embodiments, step S30 of forming a first protective layer 310 on the side of the planarization layer 200 facing away from the substrate 100 includes:

[0253] S31. A first protective layer 310 is formed on the side of the planarization layer 200 away from the substrate 100, at least in the border area 102, and a pixel definition layer 320 is formed in the display area 101.

[0254] In this way, the first protective layer 310 and the pixel definition layer 320 are formed in the same manufacturing process, which can improve the manufacturing efficiency of the display panel 10 and reduce the manufacturing cost of the display panel 10.

[0255] In some embodiments, after forming a first protective layer 310 on the side of the planarization layer 200 facing away from the substrate 100, the method for manufacturing the display panel 10 further includes:

[0256] S40, an isolation structure 600 and a plurality of sub-pixels 500 are formed on the side of the planarization layer 200 away from the substrate 100. The isolation structure 600 is used to space adjacent sub-pixels 500 apart.

[0257] On the one hand, by using vapor deposition to form multiple sub-pixels 500, the expensive fine metal mask (FMM) can be eliminated. Multiple sub-pixels 500 can be formed on the side of the planarization layer 200 away from the substrate 100, and the pixel materials of the sub-pixels 500 are separated by the isolation structure 600. The structural design of the sub-pixels 500 is no longer limited by the fine metal mask (FMM). The isolation structure 600 and the sub-pixels 500 can be designed according to the requirements of increasing the aperture ratio of the display panel 10, which is beneficial to improving the aperture ratio of the display panel 10 while reducing the manufacturing cost of the display panel 10. On the other hand, the process of fabricating the isolation structure 600 and the sub-pixels 500 both include an etching process. Since the first protective layer 310 is formed before the fabrication process of the isolation structure 600 and the sub-pixels 500, the first protective layer 310 can be used to reduce the possibility of the planarization layer 200 peeling off from the substrate 100 due to the subsequent etching process, thereby improving the display effect of the display panel 10.

[0258] Of course, this application also includes the manufacturing process of the first encapsulation layer 710 and the second encapsulation layer 720, which will not be described in detail here.

[0259] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0260] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A display panel, characterized in that, The display panel has a display area and a border area located on at least one side of the display area, and the display panel includes: A substrate, the substrate comprising an inorganic layer; A planarization layer is disposed on one side of the substrate and is located at least in the display area and the bezel area; the planarization layer includes a first portion located in the bezel area; and A first protective layer is disposed on the side of the planarization layer opposite to the substrate, and is at least located in the border region; in the border region, the first protective layer is in contact with the inorganic layer; Wherein, the orthographic projection of the first portion on the substrate is located within the orthographic projection of the first protective layer on the substrate.

2. The display panel according to claim 1, characterized in that, The first protective layer includes an edge portion that contacts the inorganic layer in the border area; optionally, the first protective layer includes an inorganic material. Optionally, the thickness of the first protective layer is 0.2 μm to 0.6 μm.

3. The display panel according to claim 1, characterized in that, The display panel further includes a second protective layer, which is disposed on the side of the first protective layer opposite to the planarization layer; the orthographic projection of the first protective layer on the substrate is located within the orthographic projection of the second protective layer on the substrate. Optionally, the thickness of the second protective layer is 0.2 μm to 0.6 μm; Optionally, the material of the second protective layer includes inorganic materials; Optionally, the orthographic projection of the first protective layer on the substrate completely overlaps with the orthographic projection of the second protective layer on the substrate.

4. The display panel according to claim 1, characterized in that, The first portion has a first outer edge; The orthographic projection of the first outer edge onto the substrate is located within the orthographic projection of the first protective layer onto the substrate. Optionally, the first outer edge includes two first edge portions disposed opposite each other along a first direction, and two second edge portions disposed opposite each other along a second direction; at least one of the first edge portions has its orthographic projection on the substrate located within the orthographic projection of the first protective layer on the substrate. And / or, at least one of the second edge portions has its orthographic projection on the substrate located within the orthographic projection of the first protective layer on the substrate; Wherein, the first direction and the second direction intersect each other and are both perpendicular to the thickness direction of the substrate; Optionally, along the first direction, the distance between the orthographic projection of the first edge portion on the substrate and the outer contour of the orthographic projection of the first protective layer on the substrate is J1, where J1 ≥ 2 μm; Optionally, along the second direction, the distance between the orthographic projection of the second edge portion on the substrate and the outer contour of the orthographic projection of the first protective layer on the substrate is J2, where J2 ≥ 2 μm; Optionally, 2μm≤J1≤4μm; Optionally, 2μm≤J2≤4μm; Optionally, the orthographic projection of the first outer edge on the substrate is located within the orthographic projection of the first protective layer on the substrate; Optionally, the border area includes a first border area and a second border area disposed on opposite sides of the display area along the first direction, and a third border area and a fourth border area disposed on opposite sides of the display area along the second direction; Optionally, the first direction and the second direction are perpendicular to each other.

5. The display panel according to claim 1, characterized in that, The border area includes a binding area; The display panel also includes signal leads disposed on one side of the substrate and located in the bonding area, wherein the first part covers a portion of the signal leads and exposes the remaining portion of the signal leads; The first protective layer overlaps with the orthogonal projection portion of the signal lead on the substrate; Optionally, the first portion is provided with a first lead opening for exposing the signal lead; The orthographic projection of the sidewall of the first lead opening onto the substrate is located within the orthographic projection of the first protective layer onto the substrate. Optionally, the sidewall of the first lead opening includes two first sidewalls disposed opposite to each other along a first direction and two second sidewalls disposed opposite to each other along a second direction. The orthographic projection of at least one first sidewall and / or at least one second sidewall on the substrate is located within the orthographic projection of the first protective layer on the substrate. The first direction and the second direction intersect each other and are both perpendicular to the thickness direction of the substrate. Optionally, the orthographic projection of the sidewall of the first lead opening on the substrate is located within the orthographic projection of the first protective layer on the substrate; Optionally, the first direction and the second direction are perpendicular to each other; The first protective layer is provided with a second lead opening that communicates with the first lead opening, and the orthographic projection of the sidewall of the first lead opening on the substrate surrounds the orthographic projection of the sidewall of the second lead opening on the substrate. Optionally, along the first direction, the distance between the first sidewall and the sidewall of the second lead opening within their orthographic projections on the substrate is J3, where J3 ≥ 2 μm; and / or Along the second direction, the distance between the second sidewall and the sidewall of the second lead opening within the orthographic projection on the substrate is J4, where J4 ≥ 2 μm; Optionally, 2μm≤J3≤4μm; Optionally, 2μm≤J4≤4μm.

6. The display panel according to claim 1, characterized in that, The display panel also has a first area located between the display area and the border area; The orthographic projection of the planarization layer on the substrate does not overlap with the orthographic projection of the first region on the substrate; Optionally, in the first region, the first protective layer is in contact with the inorganic layer.

7. The display panel according to claim 6, characterized in that, The first protective layer includes a first protective portion located in the border area and a second protective portion located in the first area; the first protective portion and the second protective portion are connected. The orthographic projection of the first portion onto the substrate is located within the orthographic projection of the first protective portion onto the substrate; Optionally, in the border area, the first protective portion contacts the inorganic layer; in the first area, the second protective portion contacts the inorganic layer.

8. The display panel according to claim 7, characterized in that, The display panel also has a bent area located between the display area and the first area; The first protective layer includes a third protective portion located in the bending area, and the second protective portion is connected between the first protective portion and the third protective portion; Optionally, the planarization layer further includes a second portion located in the bending region; The orthographic projection of the second part on the substrate is located within the outer contour of the orthographic projection of the third protective part on the substrate; Optionally, the second portion has a second outer edge, the second outer edge including two third edge portions disposed opposite to each other in a first direction, and two fourth edge portions disposed opposite to each other in a second direction; At least one of the third edge portions has its orthographic projection on the substrate located within the orthographic projection of the third protective portion on the substrate; And / or, at least one of the fourth edge portions has its orthographic projection on the substrate located within the orthographic projection of the third protective portion on the substrate; Wherein, the first direction and the second direction intersect each other and are both perpendicular to the thickness direction of the substrate; Optionally, along the first direction, the distance between the orthographic projection of the third edge portion on the substrate and the orthographic projection of the third protective portion on the substrate is J5, where J5 ≥ 2 μm; Optionally, along the second direction, the distance between the orthographic projection of the fourth edge portion on the substrate and the orthographic projection of the third protective portion on the substrate is J6, where J6 ≥ 2 μm; Optionally, 2μm≤J5≤4μm; Optionally, 2μm≤J6≤4μm; Optionally, the orthographic projection of the second outer edge on the substrate is located within the orthographic projection of the third protective portion on the substrate; Optionally, the first direction and the second direction are perpendicular to each other.

9. The display panel according to claim 8, characterized in that, The third protective part is provided with a first opening; The orthographic projection of the first opening on the substrate is located inside the outer contour of the orthographic projection of the third protective part on the substrate. Optionally, the opening area of ​​the first opening is a, and the projection area of ​​the third protective part on the substrate is b. a≥80%*(a+b); Optionally, 80%*(a+b)≤a<(a+b).

10. The display panel according to claim 6, characterized in that, Along the direction from the display area to the border area, the size of the first area is D, where D≥10μm; Optionally, 10μm≤D≤20μm.

11. The display panel according to any one of claims 1-10, characterized in that, The display panel further includes a pixel definition layer located in the display area, the pixel definition layer being disposed on the side of the planarization layer away from the substrate; the pixel definition layer is disposed in the same layer as the first protective layer; Optionally, both the first protective layer and the pixel definition layer comprise inorganic materials.

12. The display panel according to any one of claims 1-10, characterized in that, The display panel also includes: Multiple sub-pixels are spaced apart on the side of the planarization layer away from the substrate; and An isolation structure is disposed on the side of the planarization layer away from the substrate; the isolation structure is used to space adjacent sub-pixels apart; Optionally, the isolation structure is provided with a plurality of isolation openings corresponding to the plurality of sub-pixels, and the sub-pixels are disposed within the corresponding isolation openings; Optionally, the display panel further includes a pixel definition layer located in the display area, the pixel definition layer being disposed on the side of the planarization layer away from the substrate; the pixel definition layer is disposed in the same layer as the first protective layer; The pixel definition layer is provided with multiple pixel openings, and the pixel openings are connected to the corresponding isolation openings; Optionally, the pixel opening corresponds one-to-one with the isolation opening.

13. A display panel, characterized in that, The display panel has a display area, a border area located on at least one side of the display area, and a first area located between the display area and the border area. The display panel includes: substrate; A planarization layer is disposed on one side of the substrate, and is located at least in the display area and the bezel area; the orthographic projection of the planarization layer on the substrate does not overlap with the orthographic projection of the first area on the substrate; and A first protective layer is disposed on the side of the planarization layer opposite to the substrate, and is at least located in the border area.

14. The display panel according to claim 13, characterized in that, Along the direction from the display area to the border area, the size of the first area is D, where D≥10μm; Optionally, 10μm≤D≤20μm.

15. The display panel according to claim 13, characterized in that, The planarization layer includes a first portion located in the border area, the first portion having an orthographic projection on the substrate within the orthographic projection of the first protective layer on the substrate; Optionally, the first protective layer includes a first protective portion located in the border area and a second protective portion located in the first area; the first protective portion is connected to the second protective portion; The orthographic projection of the first portion onto the substrate is located within the orthographic projection of the first protective portion onto the substrate; Optionally, the substrate includes a substrate and an inorganic layer stacked together, and the planarization layer is disposed on the side of the inorganic layer away from the substrate; At least a portion of the first protective portion is disposed on the side of the planarization layer opposite to the substrate; the second protective portion is disposed on the side of the inorganic layer away from the substrate; Optionally, in the border area, the first protective portion contacts the inorganic layer; in the first area, the second protective portion contacts the inorganic layer.

16. The display panel according to claim 15, characterized in that, The display panel also has a bent area located between the display area and the first area; The first protective layer includes a third protective portion located in the bending area, and the second protective portion is connected between the first protective portion and the third protective portion; Optionally, the planarization layer further includes a second portion located in the bending region; The orthographic projection of the second part on the substrate is located within the orthographic projection of the third protective part on the substrate.

17. A display device, characterized in that, Includes the display panel as described in any one of claims 1-16.

18. A method for manufacturing a display panel, characterized in that, The display panel has a display area and a border area located on one side of the display area. The method for manufacturing the display panel includes: A substrate is provided, the substrate comprising an inorganic layer; A planarization layer is formed on one side of the substrate; wherein the planarization layer is located at least in the display area and the border area; the planarization layer includes a first portion located in the border area; A first protective layer is formed on the side of the planarization layer opposite to the substrate; Wherein, the first protective layer is located at least in the border area, and in the border area, the first protective layer is in contact with the inorganic layer; The orthographic projection of the first portion on the substrate is located within the orthographic projection of the first protective layer on the substrate.

19. The method for manufacturing a display panel according to claim 18, characterized in that, The formation of a first protective layer on the side of the planarization layer opposite to the substrate includes: A first protective layer is formed on the side of the planarization layer opposite to the substrate, at least in the border area, and a pixel definition layer is formed in the display area.

20. The method for manufacturing a display panel according to claim 18, characterized in that, After forming the first protective layer on the side of the planarization layer opposite to the substrate, the method further includes: An isolation structure and multiple sub-pixels are formed on the side of the planarization layer away from the substrate; The isolation structure is used to separate adjacent sub-pixels.

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