Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel, a preparation method thereof and a display device. The problem that in the prior art, a display panel is high in cost or low in yield is solved. The display panel includes: a substrate; the partition structure is located on one side of the substrate, and the partition structure is provided with a plurality of first openings; a light emitting device in the first opening; the filling structure is located on the side, away from the substrate, of the light-emitting device, the filling structure corresponds to the first opening, and at least part of the filling structure fills the corresponding first opening. One side, deviating from the substrate, of the light-emitting device is provided with a filling structure, the filling structure corresponds to the first opening, and at least part of the filling structure fills the corresponding first opening, so that the first opening enclosed by the partition structure is filled by the filling structure, and when a subsequent film layer such as a packaging layer is prepared, almost no gap exists between the packaging layer and the partition structure; the packaging effect of the display panel is improved, and the product yield is improved; the display panel is simple in structure, easy to implement and beneficial to cost reduction.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to display panels, their manufacturing methods, and display devices. Background Technology

[0002] Display panels, such as organic light-emitting diode (OLED) display panels, have advantages such as thinness, flexibility, high contrast, and wide color gamut, and have gradually gained a foothold in the small-size display field. As the adoption rate of OLED display panels continues to increase, enhancing product competitiveness requires continuous breakthroughs in both quality and cost. While current manufacturing processes can produce OLED display panels that achieve full-color display, they suffer from high costs and some yield losses. Summary of the Invention

[0003] In view of this, the present application provides a display panel, a method for manufacturing the same, and a display device, which solves the problems of high cost or low yield of display panels in the prior art.

[0004] The first aspect of this application provides a display panel, including:

[0005] substrate;

[0006] A partition structure is located on one side of the substrate, and the partition structure has multiple first openings;

[0007] The light-emitting device is located in the first opening;

[0008] A filling structure is located on the side of the light-emitting device away from the substrate. The filling structure corresponds to the first opening, and at least part of the filling structure fills the corresponding first opening.

[0009] In one embodiment, the orthographic projection of the filling structure on the substrate overlaps the orthographic projection of the first opening on the substrate.

[0010] In one embodiment, along the direction from the partition structure to the filling structure, the distance from the surface of the filling structure away from the substrate to the substrate gradually increases.

[0011] In one embodiment, the distance from the surface of the filling structure away from the substrate to the substrate is greater than or equal to the distance from the surface of the partition structure away from the substrate to the substrate.

[0012] In one embodiment, the distance between the surface of the filling structure facing away from the substrate and the surface of the partition structure away from the substrate is 10nm-1000nm.

[0013] In one embodiment, the filling structure includes a UV-curable adhesive and / or a thermosetting adhesive;

[0014] Preferably, the UV-curable adhesive includes at least one of epoxy resin-based curable adhesive and acrylic resin-based curable adhesive, and / or, the thermosetting adhesive includes at least one of epoxy resin-based curable adhesive and acrylic resin-based curable adhesive.

[0015] In one embodiment, the UV-curable adhesive includes a prepolymer, an active monomer, and an initiator;

[0016] Preferably, the prepolymer includes at least one of acrylate resin prepolymer and epoxy resin prepolymer;

[0017] Preferably, the active monomer includes at least one of acrylate and alicyclic epoxy compound;

[0018] Preferably, the initiator includes at least one of free radicals and cations.

[0019] In one embodiment, it further includes: a buffer layer located between the light-emitting device and the filling structure;

[0020] Preferably, the thickness of the buffer layer is 10-500 nm.

[0021] In one embodiment, the buffer layer comprises an inorganic material;

[0022] Preferably, the inorganic material includes alkali metal halides;

[0023] Preferably, the alkali metal halide includes at least one of LiF, NaK, and KF.

[0024] In one embodiment, it further includes a light extraction layer located between the light-emitting device and the buffer layer.

[0025] In one embodiment, when the wavelength of light is 460 nm, the refractive index of the filled structure is 0.1 to 0.3 higher than that of the buffer layer.

[0026] In one embodiment, it further includes: a first encapsulation layer located on the side of the filling structure opposite to the substrate;

[0027] Preferably, the first encapsulation layer includes a plurality of encapsulation portions, the encapsulation portions corresponding to the first opening, and the orthographic projection of the encapsulation portions on the substrate covers the orthographic projection of the filling structure on the substrate;

[0028] Preferably, the first encapsulation layer comprises an inorganic material;

[0029] Preferably, it further includes: a pixel defining layer located between the substrate and the partition structure, the pixel defining layer having a plurality of second openings, the orthographic projection of the first opening on the substrate covering the orthographic projection of the second opening on the substrate.

[0030] In one embodiment, the partition structure includes a first part and a second part stacked together, the first part being located on the side of the second part away from the substrate, and the orthographic projection of the second part on the substrate being located within the orthographic projection of the first part on the substrate.

[0031] Preferably, the partition structure further includes a third part located on the side of the second part closer to the substrate, and the orthographic projection of the second part on the substrate is within the orthographic projection range of the third part on the substrate.

[0032] Preferably, the display panel further includes: a second encapsulation layer located on the side of the first encapsulation layer away from the substrate, wherein the orthographic projection of the second encapsulation layer on the substrate covers the orthographic projection of the first encapsulation layer on the substrate;

[0033] Preferably, the second encapsulation layer comprises an organic material;

[0034] Preferably, the display panel further includes: a third encapsulation layer located on the side of the second encapsulation layer opposite to the substrate, wherein the orthographic projection of the third encapsulation layer on the substrate covers the orthographic projection of the second encapsulation layer on the substrate;

[0035] Preferably, the third encapsulation layer comprises an inorganic material.

[0036] A second aspect of this application provides a method for manufacturing a display panel, the method comprising:

[0037] Provide a substrate;

[0038] A partition structure and a light-emitting device are fabricated on one side of a substrate. The partition structure has multiple first openings, and the light-emitting device is partially located within the first openings. A filling structure is fabricated on the side of the light-emitting device away from the substrate. The filling structure corresponds to the first openings, and at least part of the filling structure fills the corresponding first opening.

[0039] In one embodiment, after fabricating the partition structure and the light-emitting device on one side of the substrate, and before fabricating the filling structure on the side of the light-emitting device facing away from the substrate, the method further includes:

[0040] A buffer layer is prepared on the side of the light-emitting device that is away from the substrate;

[0041] Preferably, after the partition structure and the light-emitting device are fabricated on one side of the substrate, and before the buffer layer is fabricated on the side of the light-emitting device away from the substrate, the method further includes: fabricating a light extraction layer on the side of the light-emitting device away from the substrate.

[0042] Preferably, fabricating the partition structure and the light-emitting device on one side of the substrate includes:

[0043] A first electrode layer is prepared on one side of the substrate;

[0044] A partition structure is prepared on the side of the first electrode layer away from the substrate. The partition structure has a plurality of first openings, and the first electrode layer is at least partially exposed to the first openings.

[0045] An organic light-emitting functional layer and a second electrode layer are sequentially fabricated in the first opening to obtain a light-emitting device.

[0046] In one embodiment, fabricating a filling structure on the side of the light-emitting device away from the substrate includes:

[0047] Liquid organic filler material is filled on the side of the light-emitting device away from the substrate using a printing method;

[0048] The organic filler material is solidified to obtain the filled structure.

[0049] Preferably, after fabricating the filling structure on the side of the light-emitting device away from the substrate, the method further includes:

[0050] A first encapsulation layer is prepared on the side of the filling structure that faces away from the substrate.

[0051] A third aspect of this application provides a display device that includes the display panel described above, or a display panel prepared by the preparation method described above.

[0052] According to the display panel provided in the embodiments of this application, a filling structure is provided on the side of the light-emitting device away from the substrate. The filling structure corresponds to the first opening, and at least part of the filling structure fills the corresponding first opening, so that the first opening surrounded by the partition structure is filled by the filling structure. As a result, when preparing subsequent film layers, such as encapsulation layers, there will be almost no gaps between the encapsulation layer and the partition structure, which is beneficial to improving the encapsulation effect of the display panel and increasing the product yield. Moreover, the display panel structure of the embodiments of this application is simple, easy to implement, and conducive to reducing costs. Attached Figure Description

[0053] Figure 1 This is a schematic diagram of the structure of the display panel in one embodiment of this application.

[0054] Figure 2 This is a schematic diagram of the structure of the display panel in another embodiment of this application.

[0055] Figure 3 This is a schematic diagram of the structure of the display panel in another embodiment of this application.

[0056] Figure 4 This is a schematic diagram of the structure of the display panel in another embodiment of this application.

[0057] Figure 5 This is a schematic diagram of the structure of the display panel in another embodiment of this application.

[0058] Figure 6 This is a schematic diagram of the partition structure in one embodiment of this application.

[0059] Figure 7 This is a schematic diagram of the partition structure in another embodiment of this application.

[0060] Figure 8 This is a schematic diagram of the partition structure in another embodiment of this application.

[0061] Figure 9 This is a schematic diagram of the structure of the display panel in another embodiment of this application.

[0062] Figure 10 This is a schematic diagram of the structure of the display panel in another embodiment of this application.

[0063] Figure 11 This is a schematic diagram of the process for manufacturing a display panel in one embodiment of this application.

[0064] Figure 12 This is a schematic diagram of the process for manufacturing a display panel in another embodiment of this application.

[0065] Figure 13 This is a schematic diagram of the process for manufacturing a display panel in another embodiment of this application.

[0066] Figure 14 This is a schematic diagram of the preparation method of the filling structure in one embodiment of this application.

[0067] Figure 15 This is a schematic diagram of the process for manufacturing a display panel in another embodiment of this application. Detailed Implementation

[0068] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0069] Furthermore, to better illustrate this application, numerous specific details are provided in the following detailed embodiments. Those skilled in the art should understand that this application can be implemented even without certain specific details. In some instances, methods and means well-known to those skilled in the art have not been described in detail in order to highlight the main points of this application.

[0070] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0071] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0072] The first aspect of this application provides a display panel, as shown in the reference... Figure 1 The schematic diagram of the display panel shown includes: a substrate 100; a partition structure 200 located on one side of the substrate 100, the partition structure 200 having a plurality of first openings 210; a light-emitting device 300 located in the first openings 210; and a filling structure 400 located on the side of the light-emitting device 300 away from the substrate 100, the filling structure 400 corresponding to the first openings 210, and at least part of the filling structure 400 filling the corresponding first openings 210.

[0073] It should be noted that, Figure 1 The manner in which the filling structure 400 fills the corresponding first opening 210 is used only to explain this application and should not be construed as a limitation thereof. There are many other possibilities for how the filling structure 400 fills the corresponding first opening 210, such as the filling structure 400 partially filling the corresponding first opening 210, or the filling structure 400 completely filling the corresponding first opening 210, and the surface of the filling structure 400 facing away from the substrate 100 and the surface of the partition structure 200 facing away from the substrate 100 being on the same plane. Patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, and PCT / CN2024 / 099072 describe relevant content regarding the partition structure 200 and are provided for reference.

[0074] It should be noted that the filling structure 400 and the first opening 210 correspond to each other, meaning that the light-emitting device 300 includes red light-emitting devices, green light-emitting devices and blue light-emitting devices, etc. The red light-emitting devices, green light-emitting devices and blue light-emitting devices are located in different first openings. At least some of the light-emitting devices 300 have a filling structure 400 on the surface away from the substrate 100. The orthographic projection of the filling structure 400 on the substrate 100 of a light-emitting device 300 away from the substrate 100 does not intersect with the orthographic projection of the first opening 210 corresponding to the adjacent light-emitting device 300 on the substrate 100.

[0075] According to the display panel provided in the embodiments of this application, a filling structure 400 is provided on the side of the light-emitting device 300 away from the substrate 100. The filling structure 400 corresponds to the first opening 210, and at least part of the filling structure 400 fills the corresponding first opening 210, so that the first opening 210 surrounded by the partition structure 200 is filled by the filling structure 400. As a result, when preparing subsequent film layers such as encapsulation layers, there will be almost no gaps between the encapsulation layer and the partition structure 200, which is beneficial to improving the encapsulation effect of the display panel and increasing the product yield. Moreover, the display panel structure of the embodiments of this application is simple, easy to implement, and conducive to reducing costs.

[0076] In one embodiment, refer to Figure 1 The display panel also includes a pixel defining layer 1000 located between the substrate 100 and the partition structure 200. The pixel defining layer 1000 has a plurality of second openings 1100, and the orthographic projection of the first opening 210 on the substrate 100 covers the orthographic projection of the second openings 1100 on the substrate 100. It should be noted that the pixel defining layer is a conventional pixel defining layer and is not considered an improvement of this application, and will not be described in detail here.

[0077] In one embodiment, refer to Figure 2 The schematic diagram of the display panel shown includes a first encapsulation layer 500 located on the side of the filling structure 400 facing away from the substrate 100. Thus, the first encapsulation layer 500 can completely fill the structure enclosed by the partition structure 200 and the filling structure 400, resulting in almost no gaps between the first encapsulation layer 500 and the partition structure 200, leading to excellent encapsulation performance of the display panel.

[0078] In one embodiment, refer to Figure 2 The first encapsulation layer 500 includes a plurality of encapsulation portions 510, each of which corresponds to a first opening 210. The orthographic projection of the encapsulation portion 510 on the substrate 100 covers the orthographic projection of the filling structure 400 on the substrate 100. As a result, the encapsulation effect of the display panel is superior.

[0079] It should be noted that the corresponding arrangement of the encapsulation part 510 and the first opening 210 means that one encapsulation part 510 is provided at each first opening 210. For example, the orthographic projections of the encapsulation parts 510 adjacent to the first opening on the substrate 100 may be separate, connected, or intersecting.

[0080] In one embodiment, the first encapsulation layer 500 comprises an inorganic material. Thus, the first encapsulation layer 500 can effectively isolate water and oxygen, and also prevent the light-emitting device 300 in the first opening 210 adjacent to the first opening 210 from being corroded during fabrication.

[0081] It is understandable that the filling structure 400 is made of organic material, which can effectively fill or even completely fill the first opening 210. There are almost no gaps between the filling structure 400 and the partition structure 200, and the filling structure 400 can effectively protect the light-emitting device 300.

[0082] For example, the light-emitting device 300 can be an organic light-emitting diode (OLED), a micro light-emitting diode (Micro LED), a quantum dot light-emitting diode (QLED), etc. The light-emitting device 300 can be a light-emitting device of various colors, such as a red light-emitting device R, a green light-emitting device G, a blue light-emitting device B, etc.

[0083] For example, the light-emitting device 300 includes a first electrode layer 310, a second electrode layer 330, and at least one organic light-emitting functional layer 320 located between the first electrode layer 310 and the second electrode layer 330. The first electrode layer 310 is located on the side of the second electrode layer 330 closest to the substrate 100, and the first electrode layer 310 is at least partially exposed to the first opening 210. The first electrode layer 310 can be an anode, and the second electrode layer 330 can be a cathode. Optionally, the material of the first electrode layer 310 includes a metallic material, such that the first electrode layer 310 has good conductivity. Optionally, the material of the first electrode layer 310 can include magnesium, silver, etc. Optionally, the material of the second electrode layer 330 includes a transparent conductive material, such that the second electrode layer 330 has good conductivity and light transmittance. Optionally, the second electrode layer 330 includes indium tin oxide (ITO), fluorine-doped tin oxide (FTO), etc. At least one organic light-emitting functional layer 320 includes an emitting layer (EML), and may further include at least one of a hole injection layer (HIL), a hole transport layer (HTL), and an electron-blocking layer (EBL) located between the anode and the emitting layer (EML), and at least one of an electron injection layer (EIL), an electron transport layer (ETL), and a hole-blocking layer (HBL) located between the cathode and the emitting layer (EML).

[0084] For example, in the fabrication process of the display panel of this application, a first electrode layer is first fabricated on one side of a substrate 100, then a pixel defining layer 1000 and a partition structure 200 are sequentially fabricated, and then an organic light-emitting functional layer and a second electrode layer are sequentially fabricated in the first opening 210 and the second opening 1100 enclosed by the partition structure 200 to obtain a light-emitting device 300. A filling structure 400 is then fabricated in the first opening 210 corresponding to the light-emitting device 300. The filling structure 400 can completely fill the first opening 210 or partially fill it. It is understood that when the filling structure 400 fills part of the first opening 210, the filling structure 400 can be located on the surface of the light-emitting device 300 facing away from the substrate. Then, a first encapsulation layer 500 is prepared on the side of the filling structure 400 away from the substrate 100. Thus, the filling structure 400 has filled at least part of the first opening 210. The first encapsulation layer 500 can smoothly fill the structure enclosed by the partition structure 200 and the filling structure 400, so that there are almost no gaps between the first encapsulation layer 500 and the partition structure 200, thereby improving the encapsulation effect of the display panel.

[0085] For example, the display panel of this application includes light-emitting devices 300 of different colors, such as red light-emitting device R, green light-emitting device G, and blue light-emitting device B. During the fabrication of the display panel, after the partition structure 200 is fabricated, the red light-emitting device R is fabricated first. Then, a filling structure 400 is filled into the first opening 210 corresponding to the red light-emitting device R. Next, a first encapsulation layer 500 is fabricated on the surface of the first opening 210 corresponding to the red light-emitting device R that is away from the substrate 100. Afterwards, the above steps are repeated to fabricate the green light-emitting device G, the filling structure 400 corresponding to the green light-emitting device G, and the first encapsulation layer 500. Then, the above steps are repeated to fabricate the blue light-emitting device B, the filling structure 400 corresponding to the blue light-emitting device B, and the first encapsulation layer 500. It is understandable that after fabricating the red light-emitting device R, the corresponding filling structure 400, and the first encapsulation layer 500, the red light-emitting device R exhibits excellent encapsulation performance during the fabrication of the green light-emitting device G. This is unaffected by the fabrication process or conditions of the green light-emitting device G, such as the etching solution used during its fabrication, thus improving the yield of the display panel. It should be noted that the fabrication order of different colored light-emitting devices is not limited. The above-described fabrication order of the red light-emitting device R, green light-emitting device G, and blue light-emitting device B is only for illustrative purposes and should not be construed as a limitation of this application.

[0086] In one embodiment, the orthographic projection of the filling structure 400 on the substrate 100 covers the orthographic projection of the first opening 210 on the substrate 100. Therefore, the filling structure 400 can completely fill the first opening 210, which further reduces the probability of gaps between the first encapsulation layer 500 and the partition structure 200, thereby improving the encapsulation effect of the display panel.

[0087] In one embodiment, refer to Figure 3 The schematic diagram of the display panel shown illustrates that, along the direction from the partition structure 200 to the filling structure 400, the distance between the surface of the filling structure 400 away from the substrate 100 and the substrate 100 gradually increases. Consequently, the surface of the filling structure 400 away from the substrate 100 is convex, which can concentrate the light projected onto this surface, ensuring higher light coupling output efficiency of the light-emitting device 300, increasing the light extraction efficiency of the display panel, and reducing its power consumption.

[0088] In one embodiment, refer to Figure 3 The distance from the surface of the filling structure 400 away from the substrate to the substrate 100 is greater than or equal to the distance from the surface of the partition structure 200 away from the substrate 100 to the substrate 100. This effectively ensures that the filling structure 400 completely fills the first opening 210, eliminating gaps between the filling structure 400 and the partition structure 200 and improving the encapsulation effect of the display panel.

[0089] For example, when the distance between the surface of the filling structure 400 away from the substrate 100 and the substrate 100 gradually increases along the direction from the partition structure 200 to the filling structure 400, the distance between the surface of the filling structure 400 away from the substrate and the substrate 100 can be the maximum distance between the surface of the filling structure 400 away from the substrate and the substrate 100.

[0090] In one embodiment, the distance between the surface of the filling structure 400 facing away from the substrate 100 and the surface of the partition structure 200 facing away from the substrate 100 is 10nm-1000nm, for example, it can be 10nm, 100nm, 200nm, 300nm, 400nm, 500nm, 600nm, 700nm, 800nm, 900nm, or 1000nm. This effectively ensures that the filling structure 400 completely fills the first opening 210, and the filling structure 400 has a good light-gathering effect, achieving both excellent encapsulation performance and high light extraction efficiency for the display panel.

[0091] In one embodiment, the filling structure includes a UV-curable adhesive and / or a thermosetting adhesive. Therefore, the UV-curable adhesive and / or thermosetting adhesive do not contain water or organic solvents, preventing moisture from entering the light-emitting device during the fabrication of the filling structure, thus avoiding corrosion of the light-emitting device and improving the manufacturing yield of the display panel.

[0092] In one embodiment, the UV-curable adhesive includes at least one of an epoxy resin-based curing adhesive and an acrylic resin-based curing adhesive, and / or, the thermosetting adhesive includes at least one of an epoxy resin-based curing adhesive and an acrylic resin-based curing adhesive. Therefore, the materials are widely available, relatively inexpensive, easy to cure, have a relatively high refractive index, and are easy to fill the first opening enclosed by the partition structure.

[0093] In one embodiment, the UV-curable adhesive includes a prepolymer, an active monomer, and an initiator. Thus, the above raw materials can react under UV light to obtain a high-performance UV-curable adhesive. The resulting filling structure can completely fill the corresponding first opening, and there are no gaps between the partition structure and the filling structure, avoiding gaps between the subsequently fabricated first encapsulation layer and the partition structure.

[0094] In one embodiment, the prepolymer includes at least one of an acrylate resin prepolymer and an epoxy resin prepolymer; the active monomer includes at least one of an acrylate and an alicyclic epoxy compound; and the initiator includes at least one of a free radical and a cationic compound. Thus, the prepolymer, active monomer, and initiator readily react under ultraviolet light irradiation to obtain a high-performance UV-curable adhesive, and the resulting filled structure can completely fill the corresponding first opening.

[0095] For example, the acrylate resin prepolymer includes at least one selected from methyl methacrylate prepolymer, dimethacrylate prepolymer, and urethane prepolymer. The active monomer corresponding to the acrylate resin prepolymer includes at least one selected from methyl methacrylate, dimethacrylate, and urethane.

[0096] For example, the epoxy resin prepolymer includes at least one of alicyclic epoxy resin, epoxidized olefin epoxy resin, glycidyl amine epoxy resin, and glycidyl ether epoxy resin. The active monomer corresponding to the epoxy resin prepolymer includes 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexylcarboxylate.

[0097] Exemplarily, the free radical includes at least one of benzoyl peroxide, benzoyl peroxide, and tert-butylbenzene peroxide. Exemplarily, the cation includes at least one of azobisisobutyronitrile and ammonium persulfate.

[0098] It should be noted that the thermosetting adhesive is a conventional thermosetting adhesive, and will not be described in detail here.

[0099] In one embodiment, refer to Figure 4The schematic diagram of the display panel shown includes a light extraction layer 600 located between the light-emitting device 300 and the filling structure 400. Therefore, the light extraction layer 600 can increase the light extraction efficiency of the light emitted by the light-emitting device 300, improve the display quality of the display panel, and reduce the power consumption of the display panel.

[0100] Exemplarily, the structure and materials of the light extraction layer 600 are those of a conventional light extraction layer 600, and are not considered improvements to this application, and will not be described in detail here. Exemplarily, the light extraction layer 600 includes an organic material, and the surface of the light extraction layer 600 facing away from the substrate 100 has a high degree of smoothness.

[0101] In one embodiment, refer to Figure 5 The schematic diagram of the display panel shown includes a buffer layer 700 located between the light extraction layer 600 and the filling structure 400. For example, the light extraction layer 600 comprises an organic material, and the surface of the light extraction layer 600 facing away from the substrate 100 has a high degree of smoothness. When the filling structure 400 is directly fabricated on the surface of the light extraction layer 600 facing away from the substrate 100, the organic material in the filling structure 400 will react with the organic material in the light extraction layer 600, damaging the smoothness of the surface of the light extraction layer 600 facing away from the substrate 100, resulting in unsatisfactory light extraction efficiency of the display panel. However, by providing a buffer layer 700 between the light extraction layer 600 and the filling structure 400, the influence of the filling structure 400 on the smoothness of the surface of the light extraction layer 600 facing away from the substrate 100 can be effectively avoided, ensuring that the light extraction efficiency of the light extraction layer 600 is not affected by the filling structure 400. The thickness of the buffer layer 700 is 10-500nm, and optionally, the thickness of the buffer layer 700 is 10nm, 50nm, 100nm, 150nm, 200nm, 250nm, 300nm, 350nm, 400nm, 450nm or 500nm.

[0102] In one embodiment, when the wavelength of light is 460nm, the refractive index of the refractive index buffer layer 700 of the filling structure 400 is 0.1 to 0.3 higher, for example, it can be 0.1, 0.2, or 0.3, etc. Preferably, the refractive index of the refractive index buffer layer 700 of the filling structure 400 is 0.2 higher. Therefore, the relatively high refractive index of the filling structure 400 can effectively concentrate the light emitted by the light-emitting device, improve the light extraction efficiency of the display panel, and reduce the power consumption of the display panel.

[0103] In one embodiment, the buffer layer 700 comprises an inorganic material. Thus, an inorganic buffer layer 700 is formed on the surface of the light extraction layer 600, which has an organic material, away from the substrate 100. An organic filling structure 400 is then formed on the surface of the inorganic buffer layer 700 away from the substrate 100. The inorganic buffer layer 700 can effectively isolate the light extraction layer 600 from damage caused by the filling structure 400. Furthermore, the surface of the buffer layer 700 is relatively smooth, and there is almost no reaction between the buffer layer 700 and the filling structure 400 that would affect the smoothness of the buffer layer 700's surface, thus having almost no impact on the light extraction efficiency of the light extraction layer 600.

[0104] In one embodiment, the inorganic material includes an alkali metal halide; preferably, the alkali metal halide includes at least one of LiF, NaK, and KF. Thus, the aforementioned inorganic material hardly reacts with the buffer layer 700 and the filling structure 400, resulting in a relatively smooth surface of the buffer layer 700 and minimal impact on the light extraction efficiency of the light extraction layer 600.

[0105] In one embodiment, refer to Figure 6 and Figure 7 The schematic diagram of the partition structure shown illustrates that the partition structure 200 includes a first part 201 and a second part 202 stacked together. The first part 201 is located on the side of the second part 202 facing away from the substrate 100, and the orthographic projection of the second part 202 onto the substrate 100 lies within the orthographic projection of the first part 201 onto the substrate 100. For example, the second part 202 can be designed as an independent film layer, meaning there is no physical interface within the second part 202, and all parts are made of the same material, such as aluminum. Alternatively, the second part 202 can be designed as being composed of at least two stacked film layers. For example, the second part 202 can be formed by stacking two conductive film layers, the materials of which can be molybdenum and aluminum, respectively, with the molybdenum conductive film layer located between the substrate 100 and the aluminum conductive film layer. For example, the second part 202 may include a conductive sub-part, or the second part 202 itself may be a conductive structure. The second part 202 overlaps with the first electrode layer of the light-emitting device 300, so that the first electrode layers of adjacent light-emitting devices 300 are electrically connected to each other, thereby realizing a full-surface cathode. The material of the first part 201 can be an organic material, an inorganic material, or a metallic material. When the first part 201 is a metallic material, the material of the first part 201 can be titanium. In this case, the cross-section of the partition structure 200 is T-shaped or inverted trapezoidal.

[0106] In one embodiment, refer to Figure 8The schematic diagram of the partition structure shown illustrates that the partition structure 200 further includes a third part 203 located on the side of the second part 202 near the substrate 100. The orthographic projection of the second part 202 onto the substrate 100 lies within the orthographic projection range of the third part 203 onto the substrate 100. For example, the second part 202 is a conductive film layer made of aluminum, and the third part 203 is a conductive film layer made of molybdenum. In this case, the cross-section of the partition structure 200 is I-shaped.

[0107] In one embodiment, refer to Figure 9 The schematic diagram of the display panel shown includes a second encapsulation layer 800 located on the side of the first encapsulation layer 500 facing away from the substrate 100. The orthographic projection of the second encapsulation layer 800 on the substrate 100 covers the orthographic projection of the first encapsulation layer 500 on the substrate 100. This further improves the encapsulation effect of the display panel.

[0108] In one embodiment, the second encapsulation layer 800 comprises an organic material. Thus, the organic material easily fills the structure surrounding the partition structure 200 and the first encapsulation layer 500, eliminating gaps between the partition structure 200, the first encapsulation layer 500, and the second encapsulation layer 800, thereby ensuring the encapsulation effect of the display panel.

[0109] In one embodiment, refer to Figure 10 The schematic diagram of the display panel shown includes a third encapsulation layer 900 located on the side of the second encapsulation layer 800 opposite to the substrate 100. The orthographic projection of the third encapsulation layer 900 on the substrate 100 covers the orthographic projection of the second encapsulation layer 800 on the substrate 100. This further improves the encapsulation effect of the display panel.

[0110] In one embodiment, the third encapsulation layer 900 comprises an inorganic material. Therefore, the third encapsulation layer 900 can effectively prevent moisture from penetrating the light-emitting device, resulting in excellent encapsulation of the display panel.

[0111] For example, the material of the first encapsulation layer 500 includes, but is not limited to, inorganic materials such as silicon nitride, silicon oxide, and silicon oxynitride, with a refractive index typically between 1.75 and 1.95; the material of the second encapsulation layer 800 includes, but is not limited to, organic materials such as polyimide (PI) and epoxy resin, with a refractive index typically between 1.5 and 1.6; and the material of the third encapsulation layer 900 includes, but is not limited to, inorganic materials such as silicon nitride, silicon oxide, and silicon oxynitride, with a refractive index typically between 1.75 and 1.95. Thus, the first encapsulation layer 500, the second encapsulation layer 800, and the third encapsulation layer 900 form a composite encapsulation layer, which can provide multiple layers of protection for the functional structure of the display panel, resulting in better encapsulation performance. For example, the first encapsulation layer 500 and the third encapsulation layer 900 are formed using methods such as chemical vapor deposition (CVD). The second encapsulation layer 800 is formed using inkjet printing (IJP).

[0112] Exemplarily, substrate 100 may be a substrate substrate. In some embodiments, the substrate substrate may be a glass substrate. In one embodiment, the substrate substrate may include an organic resin material such as epoxy resin, triazine, silicone resin, or polyimide. For example, the substrate substrate may be an FR4 type printed circuit board (PCB), or it may be a flexible PCB that is easily deformable. In one embodiment, the substrate substrate may include a ceramic material such as silicon nitride, aluminum nitride, or aluminum oxide, or it may include a metal or metal compound. For example, the substrate substrate may be a metal core PCB (MCPCB) or a metal copper clad laminate (MCCL).

[0113] The second aspect of this application provides a method for manufacturing a display panel, referring to... Figure 11 The diagram shows a process flow chart for manufacturing a display panel, which includes the following steps.

[0114] S100: Provides a substrate.

[0115] It should be noted that the substrate is the same as described above, and will not be repeated here.

[0116] S200: A partition structure and a light-emitting device are fabricated on one side of a substrate. The partition structure has multiple first openings, and the light-emitting device is located within the first openings.

[0117] It should be noted that the partition structure and light-emitting devices are consistent with the previous description, and will not be repeated here.

[0118] In one embodiment, fabricating a partition structure and a light-emitting device on one side of a substrate includes: fabricating a first electrode layer on one side of the substrate; fabricating a partition structure on the side of the first electrode layer away from the substrate, the partition structure having a plurality of first openings, the first electrode layer being at least partially exposed in the first openings; and sequentially fabricating an organic light-emitting functional layer and a second electrode layer in the first openings to obtain a light-emitting device.

[0119] It should be noted that the first electrode layer is consistent with the previous description, and will not be elaborated on further here.

[0120] For example, the material of the first electrode layer includes a metallic material, and the preparation method of the first electrode layer includes, but is not limited to, vapor deposition, magnetron sputtering, etc.

[0121] For example, the method for preparing the first electrode layer includes the following steps: forming a full-surface first electrode material layer on one side of a substrate, and simultaneously patterning the full-surface first electrode material layer by wet etching to obtain the first electrode layer.

[0122] It should be noted that the organic light-emitting functional layer, the second electrode layer, and the light-emitting device are the same as described above, and will not be repeated here.

[0123] For example, in the process of preparing the organic light-emitting functional layer and the second electrode layer, vapor deposition or magnetron sputtering can be used. The partition structure will separate the organic light-emitting functional layer and the second electrode layer to obtain the desired organic light-emitting functional layer and the second electrode layer located in the first opening.

[0124] For example, the organic light-emitting functional layer includes a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer and an electron injection layer stacked together. The hole injection layer is located on the side of the hole transport layer close to the substrate. The fabrication of the organic light-emitting functional layer includes fabricating a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer and an electron injection layer stacked together in sequence.

[0125] For example, the light-emitting device includes light-emitting devices of different colors, such as red light-emitting device R, green light-emitting device G, and blue light-emitting device B. For ease of fabrication, one color of light-emitting device can be fabricated first, followed by another color, until all colors of light-emitting devices are fabricated. For example, the fabrication can be carried out in the order of red light-emitting device R, green light-emitting device G, and blue light-emitting device B, or in the order of other colors of light-emitting devices.

[0126] For example, when fabricating a light-emitting device of a certain color, an organic light-emitting functional layer and a second electrode layer can be deposited in one whole layer by vapor deposition, and then the organic light-emitting functional layer and the second electrode layer at the first opening corresponding to the light-emitting devices of other colors can be etched away.

[0127] For example, the partition structure can be made of stacked materials with different etching rates. The partition structure includes a first part and a second part stacked together. The first part is located on the side of the second part away from the substrate. The orthographic projection of the second part on the substrate is located within the orthographic projection of the first part on the substrate. The etching rates of the first part and the second part are different. For example, the material of the first part is titanium and the material of the second part is aluminum. The etching rate of the second part is greater than that of the first part. The method for fabricating the partition structure includes the following steps: a first part material layer and a second part material layer are sequentially fabricated on the side of the first electrode layer away from the substrate. In the same etching environment, more material is etched away from the second part material layer to form the second part of the partition structure, while less material is etched away from the first part material layer to form the first part of the partition structure.

[0128] For example, the partition structure can be made of stacked materials with different etching rates. The partition structure includes a first part, a second part, and a third part stacked together. The first part is located on the side of the second part away from the substrate, and the third part is located on the side of the second part close to the substrate. The orthographic projection of the second part on the substrate is within the orthographic projection of the first part on the substrate, and the orthographic projection of the second part on the substrate is within the orthographic projection range of the third part on the substrate. The etching rates of the first part, the third part, and the second part are different. For example, the materials of the first part and the third part are titanium, and the materials of the second part are aluminum. The etching rate of the second part is greater than that of the first and the third parts. The method for fabricating the partition structure includes the following steps: a first material layer, a second material layer, and a third material layer are sequentially fabricated on the side of the first electrode layer away from the substrate. In the same etching environment, more material is etched away from the second material layer to form the second part of the partition structure, while less material is etched away from the first and the third material layers to form the first and the third parts of the partition structure.

[0129] In one embodiment, refer to Figure 12 The schematic diagram of the display panel fabrication method shown includes the following steps after the partition structure and light-emitting device are fabricated on one side of the substrate and before the buffer layer is fabricated on the side of the light-emitting device away from the substrate.

[0130] S400: A light extraction layer is prepared on the side of the light-emitting device away from the substrate.

[0131] It should be noted that the optical extraction layer is consistent with the previous description, and will not be elaborated further here.

[0132] In one embodiment, refer to Figure 13 The schematic diagram of the display panel fabrication method shown includes the following steps after a light extraction layer is fabricated on the side of the light-emitting device away from the substrate and before a filling structure is fabricated on the side of the light-emitting device away from the substrate.

[0133] S500: A buffer layer is prepared on the side of the light extraction layer away from the substrate.

[0134] It should be noted that the buffer layer is the same as described above, and will not be elaborated on further here.

[0135] S300: A filling structure is prepared on the side of the light-emitting device away from the substrate, the filling structure corresponds to the first opening, and at least part of the filling structure fills the corresponding first opening.

[0136] It should be noted that the filling structure is consistent with the previous description, and will not be elaborated further here.

[0137] For example, the filling structure can either completely fill the corresponding first opening or partially fill the corresponding first opening.

[0138] For example, when preparing the filling structure, an entire layer of filling material can be prepared, and then patterned (e.g., etched) using a photomask to obtain the filling structure corresponding to the first opening; or, the filling structure corresponding to the first opening can be obtained by printing using a photomask.

[0139] In one embodiment, refer to Figure 14 The schematic diagram of the display panel fabrication method shown includes the following steps for fabricating a filling structure on the side of the light-emitting device away from the substrate.

[0140] S310: Liquid organic filler material is filled on the side of the light-emitting device away from the substrate by printing.

[0141] Understandably, liquid organic filler material is good at filling the first opening, and there are no gaps between the liquid organic filler material and the partition structure.

[0142] In one embodiment, the liquid organic filler material includes a prepolymer, an active monomer, and an initiator. Thus, the above raw materials can react under ultraviolet light to obtain a high-performance UV-curable adhesive. The resulting filler structure can completely fill the corresponding first opening, and there are no gaps between the partition structure and the filler structure, avoiding gaps between the subsequently fabricated first encapsulation layer and the partition structure.

[0143] S320: Solidify the organic filler material to obtain the filled structure.

[0144] Understandably, UV-curable organic filler materials can be used.

[0145] In one embodiment, refer to Figure 15 The schematic diagram of the display panel fabrication method shown includes the following steps after the filling structure is fabricated on the side of the light-emitting device away from the substrate.

[0146] S600: A first encapsulation layer is prepared on the side of the filling structure away from the substrate.

[0147] It should be noted that the first encapsulation layer is consistent with the previous description, and will not be elaborated on further here.

[0148] For example, the first encapsulation layer includes a plurality of encapsulation portions, which are disposed corresponding to the first opening, and the orthographic projection of the encapsulation portions on the substrate covers the orthographic projection of the filling structure on the substrate. The method for fabricating the first encapsulation layer includes: fabricating a first encapsulation material layer on the side of the filling structure facing away from the substrate, and patterning the first encapsulation material layer to obtain the first encapsulation layer. The first encapsulation material layer can be formed by deposition or other methods.

[0149] For example, after fabricating the first encapsulation layer on the side of the filling structure facing away from the substrate, the method further includes: sequentially fabricating a second encapsulation layer and a third encapsulation layer on the side of the first encapsulation layer facing away from the substrate. The second and third encapsulation layers are as described above and will not be repeated here. Optionally, the second encapsulation layer is formed by inkjet printing (IJP), and the third encapsulation layer is formed by deposition or other methods.

[0150] In one specific embodiment, the display panel includes a red light-emitting device R, a green light-emitting device G, and a blue light-emitting device B, and the light-emitting devices are fabricated in the order of red light-emitting device R, green light-emitting device G, and blue light-emitting device B. The fabrication method of the display panel includes the following steps:

[0151] 1. Provide a glass substrate.

[0152] 2. A first electrode material layer is prepared on one side of the substrate, and the entire first electrode material layer is patterned simultaneously by wet etching to obtain the first electrode layer.

[0153] 3. A first material layer, a second material layer, and a third material layer are sequentially stacked on the side of the first electrode layer away from the substrate. The first and third material layers are made of titanium, and the second material layer is made of aluminum. In the same etching environment, more material is etched away from the second material layer, forming the second part of the partition structure, while less material is etched away from the first and third material layers, forming the first and third parts of the partition structure. The partition structure is obtained by etching to form multiple first openings, and the first electrode layer is exposed in the first openings.

[0154] 4. Prepare a full-layer red organic light-emitting functional material layer, and etch away the organic light-emitting functional material layer in the first opening corresponding to the green light-emitting device G and the blue light-emitting device B to obtain the organic light-emitting functional layer in the first opening corresponding to the red light-emitting device R.

[0155] 5. Prepare a complete second electrode material layer, and etch away the second electrode material layer in the first opening corresponding to the green light-emitting device G and the blue light-emitting device B to obtain the second electrode layer in the first opening corresponding to the red light-emitting device R.

[0156] 6. A light extraction layer and a buffer layer are sequentially prepared on the side of the second electrode layer facing away from the substrate in the first opening corresponding to the red light-emitting device R.

[0157] 7. Prepare a full-layer filling material layer, and etch away the filling material layer in the first opening corresponding to the green light-emitting device G and the blue light-emitting device B to obtain the filling structure in the first opening corresponding to the red light-emitting device R.

[0158] 8. Prepare a first encapsulation layer on the side of the filling structure facing away from the substrate in the first opening corresponding to the red light-emitting device R.

[0159] 9. Following the steps of steps 4 to 8, prepare a green light-emitting device G, and a light extraction layer, a buffer layer, a filling structure, and a first encapsulation layer corresponding to the first opening where the green light-emitting device G is located. Then, following the steps of steps 4 to 8, prepare a blue light-emitting device B, and a light extraction layer, a buffer layer, a filling structure, and a first encapsulation layer corresponding to the first opening where the blue light-emitting device B is located.

[0160] 10. A second encapsulation layer and a third encapsulation layer are sequentially stacked on the side of the first encapsulation layer away from the substrate.

[0161] It is understandable that after fabricating the light-emitting device of the previous color, more etching steps are required when fabricating the light-emitting device of the next color. If the encapsulation effect of the light-emitting device of the previous color is poor, the fabrication of the light-emitting device of the next color will cause the light-emitting device of the previous color to be corroded, resulting in poor display effect of the display panel. In the display panel fabrication method of this application embodiment, after the light-emitting device of the previous color is fabricated, a filling structure is filled into the corresponding first opening. There are no gaps between the filling structure and the partition structure, so that there are no gaps between the first encapsulation layer and the filling structure and the partition structure, resulting in excellent encapsulation effect. During the fabrication of the light-emitting device of the next color, the etching solution cannot enter the light-emitting device of the previous color in the etching process, resulting in a high yield of the display panel. Moreover, the above method is relatively easy to implement, resulting in a lower cost of the display panel.

[0162] Understandably, in existing technologies, display panels without a filling structure often fail to completely fill the first opening corresponding to the light-emitting device in the first encapsulation layer, which is made of inorganic material. This results in gaps between the first encapsulation layer and the partition structure. During the fabrication of the light-emitting device, after fabricating the previous color's light-emitting device, etching solution can easily penetrate and corrode the previous color's light-emitting device when fabricating the next color's light-emitting device, leading to poor display quality and low yield. In contrast, in this embodiment, a filling structure is used to fill the corresponding first opening. There are no gaps between the filling structure and the partition structure, ensuring excellent encapsulation between the first encapsulation layer and both the filling and partition structures. During the fabrication of the next color's light-emitting device, etching solution cannot penetrate the previous color's light-emitting device during the etching process, resulting in a higher yield for the display panel. Furthermore, the above method is relatively easy to implement, leading to lower display panel costs.

[0163] A third aspect of this application provides a display device that includes the display panel described above, or a display panel prepared by the preparation method described above.

[0164] It should be noted that the display panel is the same as described above, so we will not go into further detail here.

[0165] It is understandable that, in addition to the front display panel, the display device may also include the structure that a conventional display device should have, such as chips, cover plates, touch panels, and housings, which will not be elaborated on further here.

[0166] For example, the display device can be used for color display or black and white display; the display device can be used for dynamic display or static display.

[0167] Exemplarily, the display device can include any device or product with display functionality. For example, the display device can be a smartphone, mobile phone, e-book reader, desktop computer (PC), laptop PC, netbook PC, personal digital assistant (PDA), portable multimedia player (PMP), digital audio player, mobile medical device, camera, wearable device (e.g., head-mounted device, electronic clothing, electronic bracelet, electronic necklace, electronic accessory, electronic tattoo, or smartwatch), television set, etc. Because this display device includes the display panel described in this application, it offers excellent packaging, superior display performance, and lower cost.

[0168] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0169] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A display panel, characterized in that, include: substrate; A partition structure is located on one side of the substrate, the partition structure having a plurality of first openings; The light-emitting device is located in the first opening; A filling structure is located on the side of the light-emitting device away from the substrate. The filling structure corresponds to the first opening, and at least part of the filling structure fills the corresponding first opening.

2. The display panel according to claim 1, characterized in that, The orthographic projection of the filling structure on the substrate covers the orthographic projection of the first opening on the substrate.

3. The display panel according to claim 1, characterized in that, Along the direction from the partition structure to the filling structure, the distance from the surface of the filling structure away from the substrate to the substrate gradually increases.

4. The display panel according to claim 1, characterized in that, The distance from the surface of the filling structure away from the substrate to the substrate is greater than or equal to the distance from the surface of the partition structure away from the substrate to the substrate.

5. The display panel according to claim 4, characterized in that, The distance between the surface of the filling structure facing away from the substrate and the surface of the partition structure away from the substrate is 10nm-1000nm.

6. The display panel according to any one of claims 1 to 5, characterized in that, The filling structure includes UV-curable adhesive and / or thermosetting adhesive; Preferably, the UV-curable adhesive includes at least one of epoxy resin-based curable adhesive and acrylic resin-based curable adhesive, and / or, the thermosetting adhesive includes at least one of epoxy resin-based curable adhesive and acrylic resin-based curable adhesive.

7. The display panel according to claim 6, characterized in that, The UV-curable adhesive comprises a prepolymer, an active monomer, and an initiator; Preferably, the prepolymer includes at least one of acrylate resin prepolymer and epoxy resin prepolymer; Preferably, the active monomer includes at least one of acrylate and alicyclic epoxy compound; Preferably, the initiator comprises at least one of free radicals and cations.

8. The display panel according to claim 1, characterized in that, Also includes: A buffer layer is located between the light-emitting device and the filling structure; Preferably, the thickness of the buffer layer is 10-500 nm.

9. The display panel according to claim 8, characterized in that, The buffer layer comprises inorganic materials; Preferably, the inorganic material includes alkali metal halides; Preferably, the alkali metal halide includes at least one of LiF, NaK, and KF.

10. The display panel according to claim 8 or 9, characterized in that, Also includes: A light extraction layer is located between the light-emitting device and the buffer layer.

11. The display panel according to claim 8 or 9, characterized in that, When the wavelength of light is 460 nm, the refractive index of the filling structure is 0.1 to 0.3 higher than that of the buffer layer.

12. The display panel according to claim 1, characterized in that, Also includes: The first encapsulation layer is located on the side of the filling structure opposite to the substrate; Preferably, the first encapsulation layer includes a plurality of encapsulation portions, the encapsulation portions corresponding to the first opening, and the orthographic projection of the encapsulation portions on the substrate covers the orthographic projection of the filling structure on the substrate; Preferably, the first encapsulation layer comprises an inorganic material; Preferably, it further includes: a pixel defining layer located between the substrate and the partition structure, the pixel defining layer having a plurality of second openings, the orthographic projection of the first opening on the substrate covering the orthographic projection of the second opening on the substrate.

13. The display panel according to claim 1, characterized in that, The partition structure includes a first part and a second part stacked together, the first part being located on the side of the second part away from the substrate, and the orthographic projection of the second part on the substrate being located within the orthographic projection of the first part on the substrate; Preferably, the partition structure further includes a third part located on the side of the second part closer to the substrate, wherein the orthographic projection of the second part on the substrate is within the orthographic projection range of the third part on the substrate; Preferably, the display panel further includes: a second encapsulation layer located on the side of the first encapsulation layer opposite to the substrate, wherein the orthographic projection of the second encapsulation layer on the substrate covers the orthographic projection of the first encapsulation layer on the substrate; Preferably, the second encapsulation layer comprises an organic material; Preferably, the display panel further includes: a third encapsulation layer located on the side of the second encapsulation layer opposite to the substrate, wherein the orthographic projection of the third encapsulation layer on the substrate covers the orthographic projection of the second encapsulation layer on the substrate; Preferably, the third encapsulation layer comprises an inorganic material.

14. A method for manufacturing a display panel, characterized in that, include: Provide a substrate; A partition structure and a light-emitting device are fabricated on one side of the substrate. The partition structure has a plurality of first openings, and the light-emitting device is partially located within the first openings. A filling structure is prepared on the side of the light-emitting device away from the substrate, the filling structure corresponding to the first opening, and at least part of the filling structure filling the corresponding first opening.

15. The preparation method according to claim 14, characterized in that, After the partition structure and the light-emitting device are fabricated on one side of the substrate, and before the filling structure is fabricated on the side of the light-emitting device facing away from the substrate, the method further includes: A buffer layer is prepared on the side of the light-emitting device that is away from the substrate; Preferably, after the partition structure and the light-emitting device are fabricated on one side of the substrate, and before the buffer layer is fabricated on the side of the light-emitting device facing away from the substrate, the method further includes: fabricating a light extraction layer on the side of the light-emitting device facing away from the substrate; Preferably, the fabrication of the partition structure and the light-emitting device on one side of the substrate includes: A first electrode layer is prepared on one side of the substrate; The partition structure is formed on the side of the first electrode layer opposite to the substrate, the partition structure having a plurality of the first openings, and the first electrode layer being at least partially exposed to the first openings; An organic light-emitting functional layer and a second electrode layer are sequentially stacked in the first opening to obtain the light-emitting device.

16. The preparation method according to claim 14 or 15, characterized in that, The process of fabricating a filling structure on the side of the light-emitting device away from the substrate includes: Liquid organic filler material is filled on the side of the light-emitting device away from the substrate by printing. The organic filler material is cured to obtain the filled structure; Preferably, after fabricating the filling structure on the side of the light-emitting device opposite to the substrate, the method further includes: A first encapsulation layer is prepared on the side of the filling structure opposite to the substrate.

17. A display device, characterized in that, It includes the display panel according to any one of claims 1 to 13, or the display panel prepared by the preparation method according to any one of claims 14 to 16.

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