Preparation method of display panel, display panel and display device

Abstract

The invention relates to a preparation method of a display panel, the display panel and a display device. The display panel is provided with a display area and a non-display area, the preparation method of the display panel comprises the steps that a substrate is provided, the substrate comprises a preset wiring layer, the preset wiring layer comprises preset wires, and at least part of the preset wires is located in the non-display area; forming an isolation material layer on the substrate; the isolation material layer is etched to form an isolation part and a protection part, the isolation part is located in the display area and provided with a first isolation opening, the protection part is located in the non-display area, and the protection part at least covers the side wall of the preset wire; and performing a preset process, wherein the preset process comprises an etching process. The packaging reliability can be improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a method for preparing a display panel, a display panel, and a display device. Background Technology

[0002] With the development of display technology, a technique has emerged that uses photolithography to pattern pixels. This technique can achieve pixel patterning without the need for fine mask (FMM), thereby effectively increasing pixel density.

[0003] However, the reliability of display products produced using this technology still needs to be improved. Summary of the Invention

[0004] Therefore, it is necessary to provide a method for manufacturing a display panel, a display panel, and a display device that can improve reliability in response to the above-mentioned technical problems.

[0005] A method for manufacturing a display panel, the display panel having a display area and a non-display area, the method comprising:

[0006] A substrate is provided, the substrate including a preset wiring layer, the preset wiring layer including preset wiring, at least a portion of the preset wiring being located in the non-display area;

[0007] An isolation material layer is formed on the substrate, and the isolation material layer covers the preset trace;

[0008] The isolation material layer is etched to form an isolation portion and a protective portion. The isolation portion is located in the display area and has a first isolation opening. The protective portion is located in the non-display area and at least covers the preset trace sidewall.

[0009] A preset process is performed, which includes an etching process.

[0010] In one embodiment, after performing the preset process, the method further includes:

[0011] Remove at least a portion of the protective portion;

[0012] Optionally, after a preset process, all the protective parts can be removed.

[0013] In one embodiment, before forming the insulating material layer on the substrate, the following steps are included:

[0014] An insulating material layer is formed on the substrate.

[0015] In one embodiment, the preset process includes:

[0016] The insulating material layer is etched to form a first pixel opening that communicates with the first isolation opening, and the first pixel opening and the first isolation opening form a first opening;

[0017] A light-emitting structural material layer of a first color is formed inside the first opening and on the insulating material layer;

[0018] The light-emitting structure material layer of the first color is etched to form a light-emitting structure of the first color within the first opening;

[0019] Optionally, the substrate further includes a plurality of first electrodes spaced apart in the display area, the insulating material layer covering a portion of the first electrodes, and the first pixel opening exposing the first electrodes.

[0020] In one embodiment, the formation of a light-emitting structural material layer of a first color within the first opening and on the insulating material layer includes:

[0021] A light-emitting material layer of a first color and a second electrode material layer are sequentially formed inside the first opening and on the insulating material layer;

[0022] A first encapsulation material layer is formed on the surface of the second electrode material layer and the sidewall of the isolation portion;

[0023] Furthermore, the etching of the first-color luminescent material layer to form a first-color luminescent structure within at least a portion of the first opening includes:

[0024] The first encapsulation material layer is etched to form an encapsulation unit within at least a portion of the first opening;

[0025] The second electrode material layer and the first color light-emitting material layer are etched to form the second electrode and the first color light-emitting unit in the first opening where the encapsulation unit is formed, and the second electrode overlaps with the isolation portion.

[0026] In one embodiment, after forming the light-emitting structure of the first color within the first opening, the process includes:

[0027] The isolation material layer is etched to remove the protective portion and part of the isolation portion to form an isolation structure with a third isolation opening;

[0028] The insulating material layer is etched to form a third pixel opening that communicates with the third isolation opening. The third pixel opening and the third isolation opening together form a third opening, and the remaining insulating material layer forms an insulating layer.

[0029] A light-emitting structure of a third color is formed within the third opening.

[0030] In one embodiment, before etching the isolation material layer to remove the protective portion and a portion of the isolation portion to form an isolation structure with a third isolation opening, the pre-defined process further includes:

[0031] The insulating material layer is etched to form a second insulating opening;

[0032] The insulating material layer is etched to form a second pixel opening that communicates with the second isolation opening, and the second pixel opening and the second isolation opening form a second opening;

[0033] A light-emitting structural material layer of a second color is formed inside the second opening and on the insulating material layer;

[0034] The light-emitting structure material layer of the second color is etched to form a light-emitting structure of the second color within the second opening.

[0035] In one embodiment, a second isolation opening is formed at the same time as the first isolation opening; and a second pixel opening that communicates with the second isolation opening is formed at the same time as the first pixel opening; the second pixel opening and the second isolation opening together form a second opening.

[0036] Before etching the isolation material layer to remove the protective portion and part of the isolation portion to form an isolation structure with a third isolation opening, the pre-processing step further includes:

[0037] A light-emitting structural material layer of a second color is formed inside the second opening and on the insulating material layer;

[0038] The light-emitting structure material layer of the second color is etched to form a light-emitting structure of the second color within the second opening.

[0039] In one embodiment, after forming the light-emitting structure of the first color within the first opening, the process includes:

[0040] The insulating material layer is etched to remove the protective portion, and a second insulating opening is formed within the insulating portion;

[0041] The insulating material layer is etched to form a second pixel opening that communicates with the second isolation opening, and the second pixel opening and the second isolation opening form a second opening;

[0042] A light-emitting structure of a second color is formed within the second opening.

[0043] In one embodiment, after forming the light-emitting structure of the second color within the second opening, the method further includes:

[0044] The isolation portion is etched to form a third isolation opening, and the remaining isolation portion forms an isolation structure;

[0045] The insulating material layer is etched to form a third pixel opening that communicates with the third isolation opening, and the third pixel opening and the third isolation opening together form a third opening;

[0046] A light-emitting structure of a third color is formed within the third opening.

[0047] In one embodiment, after forming the light-emitting structure of the first color within the first opening, a preset process is performed, including:

[0048] The insulating material layer is etched to form a second insulating opening;

[0049] The insulating material layer is etched to form a second pixel opening that communicates with the second isolation opening, and the second pixel opening and the second isolation opening form a second opening;

[0050] A light-emitting structural material layer of a second color is formed inside the second opening and on the insulating material layer;

[0051] The light-emitting structure material layer of the second color is etched to form a light-emitting structure of the second color within the second opening;

[0052] The isolation material layer is etched to form a third isolation opening within the isolation portion;

[0053] The insulating material layer is etched to form a third pixel opening that communicates with the third isolation opening, and the third pixel opening and the third isolation opening together form a third opening;

[0054] A light-emitting structural material layer of a third color is formed within the third opening and on the insulating material layer;

[0055] The light-emitting structure material layer of the third color is etched to form a light-emitting structure of the third color within the third opening;

[0056] After forming a light-emitting structure of a third color within the third opening, the process includes:

[0057] Remove the protective part.

[0058] In one embodiment, the non-display area includes at least one bonding area, the bonding area having a bonding electrode, and the protective portion covering the bonding area;

[0059] Optionally, the at least one bonding region includes a first bonding region for bonding with an integrated circuit, and the protection portion completely covers the first bonding region;

[0060] Optionally, the at least one bonding area includes a second bonding area for bonding with a flexible circuit board, and the protective portion covers a portion of the second bonding area and exposes a portion of the bonding electrodes within the second bonding area.

[0061] A display panel having a display area and a non-display area, and comprising:

[0062] The substrate includes a preset wiring layer, the preset wiring layer includes preset wiring, and at least a portion of the preset wiring is located in the non-display area;

[0063] An isolation layer includes an isolation structure and a protective portion. The isolation structure is located in the display area and forms an isolation opening. The protective portion is located in the non-display area and at least covers the preset trace sidewall.

[0064] The light-emitting structure is at least partially located within the isolation opening.

[0065] In one embodiment, the sidewall of the preset trace located in the non-display area is recessed;

[0066] Optionally, the preset trace includes a first titanium layer, an aluminum layer, and a second titanium layer stacked sequentially.

[0067] In one embodiment, the display panel further includes:

[0068] An insulating layer is located at least between the preset trace and the protective portion;

[0069] Optionally, the insulating layer extends from the display area to the non-display area and has pixel openings, the pixel openings being located in the display area and communicating with the isolation openings;

[0070] Optionally, the substrate further includes a plurality of first electrodes spaced apart in the display area, the insulating layer covering the first electrodes, and the pixel opening exposing the first electrodes;

[0071] Optionally, the light-emitting structure includes a light-emitting unit, a second electrode, and a packaging unit. The light-emitting unit is located between the first electrode and the second electrode, the second electrode is connected to the isolation structure, and the packaging unit covers the side of the second electrode away from the substrate.

[0072] In one embodiment, the preset routing includes power lines.

[0073] In one embodiment, the power line includes a first power line for connecting to a first power supply voltage, and the isolation structure is for connecting to a second power supply voltage, wherein the second power supply voltage and the first power supply voltage are either positive or negative.

[0074] The protection part includes a first protection sub-part, which at least covers the side wall of the first power line, and the first protection sub-part is spaced apart from the isolation structure.

[0075] Optionally, the non-display area includes a first sub-area, the first power line is at least partially located in the first sub-area, and the first protection sub-area covers the first sub-area.

[0076] In one embodiment, the power line further includes a second power line electrically connected to the isolation structure.

[0077] The protection section includes a second protection subsection, which at least covers the side wall of the second power line, and the second protection subsection is spaced apart from the first protection subsection.

[0078] Optionally, the non-display area includes a second sub-area, the second power line is at least partially located in the second sub-area, and the second protection sub-area covers the second sub-area;

[0079] Optionally, the distance between the second protective sub-part and the first protective sub-part is greater than a preset distance.

[0080] In one embodiment, the substrate includes a plurality of wiring layers, and the preset wiring layer includes the wiring layer closest to the isolation layer.

[0081] A display device includes a display panel as described above.

[0082] The aforementioned display panel and display device have both an isolation structure and a protective portion in the isolation layer. The protective portion at least covers the sidewall of the preset trace, thereby protecting the preset trace during the etching process in the manufacturing process of the display panel and preventing electrochemical corrosion of the display panel under temperature and humidity conditions. Attached Figure Description

[0083] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0084] Figure 1 This is a schematic diagram of the manufacturing process of the display panel in one embodiment of this application;

[0085] Figure 2 This is a partial top view of the substrate in one embodiment of this application;

[0086] Figure 3a For along Figure 2 A schematic diagram of the cross-section in the AA' direction;

[0087] Figure 3b For along Figure 2 A schematic diagram of the cross-section in the BB' direction;

[0088] Figure 4 This is a partial top view schematic diagram of the manufacturing process of the display panel in the embodiments of this application;

[0089] Figures 5 to 11 This is a partial cross-sectional schematic diagram of the manufacturing process of the display panel in the embodiments of this application;

[0090] Figure 12 This is a partial cross-sectional schematic diagram of the non-display area of ​​a display panel in one embodiment of this application;

[0091] Figure 13 A top view of a display panel in one embodiment of this application.

[0092] 110 - Preset trace, 120 - First planarization layer, 130 - First electrode, 2001 - Isolation material layer, 2201 - Second isolation material sublayer, 2301 - Third isolation material sublayer, 200 - Isolation structure, 200a - Isolation part, 200b - Protection part, 3001 - Insulating material layer, 300 - Insulating layer, 400 - Light-emitting structure, 410 - Light-emitting unit, 420 - Second electrode, 430 - Encapsulation unit, 500 - Organic encapsulation layer, 600 - Inorganic encapsulation layer, 700 - Touch inorganic layer, 800 - Polarizer, 900 - Optical adhesive, 11 - First isolation opening, 12 - First pixel opening, 10 - First opening, 20 - Second opening, AA - Display area, NAA - Non-display area, A1 - First sub-area, A2 - Second sub-area, A3 - First bonding area, A4 - Second bonding area, A5 - Bending area. Detailed Implementation

[0093] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0094] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0095] It should be noted that when a component is said to be "fixed to" another component, it can be directly attached to the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0096] In the accompanying drawings, the dimensions of layers and regions may be exaggerated for clarity. It is understood that when a layer or element is referred to as "on" another layer or substrate, the layer or element may be directly on said other layer or substrate, or there may be intermediate layers. Furthermore, it is understood that when a layer is referred to as "between" two layers, the layer may be the only layer between said two layers, or there may be one or more intermediate layers. Additionally, the same reference numerals always denote the same elements.

[0097] In the following embodiments, when a layer, region, or element is “connected,” it can be interpreted as the layer, region, or element being connected not only directly but also through other constituent elements placed therebetween. For example, when a layer, region, element, etc., is described as being connected or electrically connected, the layer, region, element, etc., can not only be directly connected or directly electrically connected, but can also be connected or electrically connected through another layer, region, element, etc., placed therebetween.

[0098] In the following text, although terms such as “first” and “second” may be used to describe various components, these components are not necessarily limited to the terms above. The terms above are only used to distinguish one component from another. It will also be understood that expressions used in the singular form include plural expressions, unless the singular form has a distinctly different meaning in the context.

[0099] When a phrase such as “at least one of…” follows a list of elements, it modifies the entire list of elements, not individual elements within that list. The term “and / or” as used herein includes any and all combinations of one or more of the associated listed items. As used in the application documents, the term “and / or” includes any and all combinations of one or more of the associated listed items. It should also be understood that terms such as “comprising / including” or “having” specify the presence of the stated feature, whole, step, operation, component, part, or combination thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof.

[0100] Electronic or electrical devices and / or any other related devices or components (e.g., display devices including a display panel and a display panel driver, wherein the display panel driver further includes a drive controller, a gate driver, a gamma reference voltage generator, a data driver, and a transmit driver) according to embodiments of the concepts described herein can be implemented using any suitable hardware, firmware (e.g., application-specific integrated circuits), software, or a combination of software, firmware, and hardware. For example, various components of these devices may be formed on an integrated circuit (IC) chip or on a separate IC chip. Additionally, various components of these devices may be implemented on a flexible printed circuit film, a tape-on-a-package (TCP), a printed circuit board (PCB), or formed on a substrate. Furthermore, various components of these devices may be processes or threads running on one or more processors in one or more computing devices to execute computer program instructions and interact with other system components to perform the various functions described herein. Computer program instructions are stored in memory, which may be implemented in a computing device using standard storage devices such as random access memory (RAM). Computer program instructions may also be stored in other non-transitory computer-readable media such as CD-ROMs, flash drives, etc. Furthermore, those skilled in the art will recognize that the functions of various computing devices may be combined or integrated into a single computing device, or the functions of a particular computing device may be distributed across one or more other computing devices, without departing from the spirit and scope of the exemplary embodiments of the present application.

[0101] In one embodiment, see Figure 1 A method for manufacturing a display panel is provided, comprising:

[0102] Step S10: Provide a substrate, the substrate including a preset trace layer 110, the preset trace layer 110 including preset traces 110, at least a portion of the preset traces 110 being located in the non-display area NAA.

[0103] Please see Figure 2 as well as Figure 3a In the non-display area NAA, part of the default trace 110 is exposed.

[0104] The display panel has a display area AA and a non-display area NAA.

[0105] The substrate may include a rigid substrate or a flexible substrate. The substrate may also include multiple wiring layers spaced apart and stacked on the substrate.

[0106] As an example, the preset trace layer 110 may include the trace layer furthest from the substrate, i.e., the top trace layer. Of course, the preset trace layer 110 is not limited to this. For example, the preset trace layer 110 may also include the trace layer second furthest from the substrate. Furthermore, the preset trace layer 110 is not limited to a single trace layer. Correspondingly, the preset trace layer 110 is not limited to traces within the same trace layer.

[0107] Specifically, for example, the substrate includes five wiring layers spaced apart. The preset wiring layer 110 may include the fifth wiring layer, or it may include the fourth wiring layer. Of course, the preset wiring layer 110 may also include both the fifth and fourth wiring layers simultaneously. The preset wiring layer 110 may include wirings in the fifth wiring layer and / or the fourth wiring layer.

[0108] At least a portion of the default trace 110 is located in the non-display area (NAA). Simultaneously, the default trace 110 located in the non-display area (NAA) is exposed, meaning the portion of the default trace 110 located in the non-display area (NAA) is exposed.

[0109] Step S30, please refer to Figures 4 to 6 An isolation material layer 2001 is formed on the substrate, and the isolation material layer 2001 covers the preset trace 110.

[0110] An isolation material layer 2001 is formed on the substrate. Therefore, when the preset trace layer 110 includes the trace layer that is furthest from the substrate, it includes the trace layer that is closest to the isolation material layer 2001.

[0111] As an example, the insulating material layer 2001 may include a first insulating material sublayer, a second insulating material sublayer 2201, and a third insulating material sublayer 2301 formed by sequentially stacking. Alternatively, the insulating material layer 2001 may include a second insulating material sublayer 2201 and a third insulating material sublayer 2301 formed by sequentially stacking.

[0112] The materials of the first and / or second insulating material sublayers 2201 may include conductive materials. The material of the third insulating material sublayer 2301 may be either conductive or insulating. Furthermore, when the material of the second insulating material sublayer 2201 is conductive, the material of the first insulating material sublayer may be either conductive or insulating.

[0113] Specifically, the material of the first isolation material sublayer may include, but is not limited to, molybdenum (Mo). The material of the second isolation material sublayer 2201 may include, but is not limited to, aluminum (Al). The material of the third isolation material sublayer 2301 may include, but is not limited to, titanium (Ti).

[0114] Please refer to step S40. Figures 4 to 6 The isolation material layer 2001 is etched to form an isolation part 200a and a protective part 200b. The isolation part 200a is located in the display area AA and has a first isolation opening 11. The protective part 200b is located in the non-display area NAA and at least covers the sidewall of the preset trace 110.

[0115] Specifically, when etching the isolation material layer 2001, multiple first isolation openings 11 can be etched. That is, the isolation portion 200a can have multiple spaced-apart first isolation openings 11. It can be understood that the first isolation opening 11 is an opening that penetrates the isolation portion 200a.

[0116] As an example, when the isolation material layer 2001 includes a second isolation material sublayer 2201 and a third isolation material sublayer 2301, a patterned photoresist P11 can first be formed on the third isolation material sublayer 2301. Then, the third isolation material sublayer 2301 is dry-etched based on the patterned photoresist P11. Afterward, the patterned photoresist P11 can be removed. Then, the second isolation material sublayer 2201 is wet-etched to form a first isolation opening 11 with a small opening and a large belly.

[0117] Furthermore, the orthographic projection of the patterned photoresist P11 formed during this process onto the substrate can at least cover the orthographic projection of the sidewall of the preset trace 110 onto the substrate. Therefore, after etching the isolation material layer 2001, while forming the isolation portion 200a in the display area AA, a protective portion 200b that at least covers the sidewall of the preset trace 110 can be simultaneously formed in the non-display area NAA.

[0118] It is understandable that the protection unit 200b can directly cover the side wall of the preset wiring 110, or there can be an intermediate layer between the protection unit 200b and the side wall of the wiring.

[0119] Step S50: Perform a preset process, which includes an etching process.

[0120] After the first isolation opening 11 is formed, subsequent processes such as forming a corresponding light-emitting structure 400 within the first isolation opening 11 can be performed. Furthermore, after forming the light-emitting structures 400 of all colors, an inorganic encapsulation layer 600 extending from the display area AA to the non-display area NAA can be formed. The preset process can be at least a portion of the process from the formation of the first isolation opening 11 to the formation of the inorganic encapsulation layer 600.

[0121] The preset process includes an etching process. The etching process may include a wet etching process and / or a dry etching process. The preset process may include one or more etching processes. During the etching process of the preset process, the preset trace 110 can be protected.

[0122] In this embodiment, when etching the isolation material layer 2001 formed on the substrate, in addition to forming an isolation portion 200a in the display area AA, a protective portion 200b is also formed in the non-display area NAA. The protective portion 200b at least covers the sidewalls of the preset trace 110, thereby protecting the preset trace 110 in subsequent etching processes. This prevents the sidewalls of the preset trace 110 from being damaged by etching in subsequent etching processes. For example, it prevents the sidewalls of the preset trace 110 from being further etched in subsequent wet etching processes. Therefore, this embodiment can prevent the subsequently formed inorganic encapsulation layer 600 from failing to properly cover the preset trace 110, thereby preventing water, oxygen, or metal ions from entering and corroding the preset trace 110, thus preventing electrochemical corrosion problems. Therefore, this embodiment can improve the encapsulation reliability of the preset trace 110 by the inorganic encapsulation layer 600.

[0123] In one embodiment, the sidewall of the preset trace 110 located in the non-display area NAA is recessed.

[0124] Please see Figure 2 as well as Figure 3b In the BB' direction, the sidewall of the preset trace 110 is recessed.

[0125] As an example, the preset trace 110 may include multiple conductive layers, such as a first titanium layer, an aluminum layer, and a second titanium layer stacked together. In this case, the aluminum layer located between the two titanium layers is easily affected by the etching of other film layers (such as wet etching) and may be recessed inward.

[0126] As an example, the substrate also includes a first planarization layer 120. The first planarization layer 120 covers a preset trace layer 110. The preset trace layer 110 in the display area AA can be formed on a second planarization layer (not shown).

[0127] When fabricating the first planarization layer 120, a planarization material layer covering the preset trace 110 layer can be formed first. The material of the planarization material layer may include an organic material. Then, the planarization material layer is wet-etched to remove at least a portion of the planarization material layer located in the non-display area NAA, and the remaining planarization material layer in the display area AA forms the first planarization layer 120. Furthermore, during the wet etching of the planarization material layer, the aluminum layer of the preset trace 110 in the non-display area NAA is also etched laterally, resulting in the aluminum layer being recessed relative to the titanium layers (first titanium layer and second titanium layer) on both sides.

[0128] The greater the sidewall recess of the preset trace 110, the weaker the coverage of the subsequently formed inorganic encapsulation layer 600 on the preset trace 110.

[0129] In this embodiment, protecting the preset trace 110 can prevent the sidewalls of the preset trace 110 from being further etched in subsequent etching processes, thereby preventing the sidewalls of the preset trace 110 from becoming more deeply recessed, and thus preventing the inorganic packaging layer 600 from failing to properly cover the sidewalls of the preset trace 110.

[0130] In one embodiment, after step S50, the method further includes:

[0131] Step S60: Remove at least part of the protective portion 200b.

[0132] As an example, after step S50, the entire protective section 200b is removed.

[0133] The protective part 200b is a structure formed by etching the isolation material layer 2001, and therefore includes a conductive material. At this time, removing the protective part 200b can prevent a short circuit between the protective part 200b and the preset trace 110 in the final formed display panel, which would cause the conductive path between different preset traces 110 to shorten under the influence of temperature and humidity, and thus potentially lead to electrochemical corrosion problems.

[0134] As an example, the preset wiring 110 includes a first power line and a second power line spaced apart. One of the first power line and the second power line is a positive power line, and the other is a negative power line.

[0135] The distance between the protective portion 200b on the positive power line and the upper protective portion 200b on the negative power line is the first distance. The distance between the first power line and the second power line is the second distance. The first distance is less than the second distance.

[0136] At this time, if a short circuit occurs between the protection part 200b on the positive power line and the positive power line, and / or between the protection part 200b on the negative power line and the negative power line, then during reliability testing or application, the conductive path length between the first power line and the second power line will be shortened from the second distance to the first distance under the influence of temperature and humidity, which may lead to electrochemical corrosion between the first power line and the second power line.

[0137] Therefore, removing the protective part 200b makes it less likely for electrochemical corrosion to occur between the first power line and the second power line in the final formed display panel.

[0138] In one embodiment, prior to step S30, the method further includes:

[0139] For step S20, please refer to... Figure 5 as well as Figure 6 An insulating material layer 3001 is formed on the substrate.

[0140] Specifically, the insulating material layer 3001 may cover the first planarization layer 120 and the preset traces 110 exposed by the first planarization layer 120 in the non-display area NAA. The material of the insulating material layer 3001 may include inorganic materials.

[0141] After forming the insulating material layer 3001, an isolation material layer 2001 can be formed on the insulating material layer 3001. The insulating material layer 3001 can form an isolation between the isolation material layer 2001 and the preset trace 110. At the same time, the insulating material layer 3001 can also cover the sidewalls of the preset trace 110, thereby improving the encapsulation reliability of the preset trace 110.

[0142] As an example, the default trace 110 includes a negative power line. Before forming the insulating material layer 2001 on the insulating material layer 3001, a connection via may be formed within the insulating material layer 3001, exposing the negative power line. After forming the insulating material layer 2001, the insulating material layer 2001 can be connected to the negative power line through the connection via.

[0143] In one embodiment, step S50 includes:

[0144] For step S51, please refer to... Figure 5 The insulating material layer 3001 is etched to form a first pixel opening 12 that communicates with the first isolation opening 11. The first pixel opening 12 and the first isolation opening 11 form a first opening 10.

[0145] Specifically, a patterned photoresist P21 can first be formed on the insulating material layer 3001. Then, the insulating material layer 3001 is etched based on the patterned photoresist P21 to form the first pixel opening 12. Afterward, the patterned photoresist P21 is removed.

[0146] At this time, the insulating material layer 3001 is a material film layer used to form the pixel definition layer.

[0147] As an example, the substrate also includes a plurality of first electrodes 130 spaced apart in the display area AA, an insulating material layer 3001 covering the first electrodes 130, and a first pixel opening 12 exposing the first electrodes 130. The first electrodes 130 can be either an anode or a cathode.

[0148] For step S52, please refer to... Figure 7 A light-emitting structural material layer 4001 of the first color is formed inside the first opening 10 and on the insulating material layer 2001.

[0149] The luminescent structural material layer may include at least a luminescent material layer with luminescent function. As an example, the luminescent structural material layer may also include other film layers related to the luminescent function.

[0150] The display panel may include multiple light-emitting sub-pixels of different colors. These multiple light-emitting sub-pixels are used to emit light of different colors.

[0151] Different colored luminescent subpixels have different luminescent material layers. Furthermore, different colored luminescent subpixels can be formed in stages. After the fabrication of one color of subpixel is completed, the fabrication of another color of subpixel is then performed.

[0152] For step S53, please refer to... Figure 9 The light-emitting structure material layer of the first color is etched to form a light-emitting structure 400 of the first color within the first opening 10.

[0153] At this time, please refer to Figure 8 First, an imaged photoresist P31 can be formed within the first opening 10 corresponding to the first color. Then, please refer to... Figure 9 Based on the imaged photoresist P31, the light-emitting structure material layer 4001 in other areas is etched away, thereby forming a light-emitting structure 400 of the first color within the first opening 10. Afterwards, the imaged photoresist P31 is removed.

[0154] During this process, the protective portion 200b located in the non-display area NAA can serve as an etching protective layer, thereby protecting at least the insulating material layer 3001 covering the sidewall of the preset trace 110.

[0155] The insulating material layer 3001 covering the sidewall of the preset trace 110 has a relatively poor coverage effect. For example, when the sidewall of the preset trace 110 is recessed, the insulating material layer 3001 covering the sidewall of the preset trace 110 is not well covered, and there may be holes, gaps, etc. within it. Therefore, the protection of the protective part 200b can prevent the holes in the insulating material layer 3001 from continuing to grow, and prevent etching fluid and the like from continuing to etch the sidewall of the preset trace 110 through the holes in the insulating material layer 3001.

[0156] In one embodiment, step S52 may include:

[0157] For step S521, please refer to... Figure 7 A light-emitting material layer 4101 of a first color and a second electrode material layer 4201 are sequentially formed inside the first opening 10 and on the insulating material layer 2001.

[0158] The luminescent material layer may include multiple organic light-emitting functional film layers.

[0159] The light-emitting material layer and the second electrode material layer can be formed by a vapor deposition process. Since the first isolation opening 11 has a small opening and a large belly, the vapor-deposited light-emitting material layer and the second electrode material layer can be separated by the first isolation opening 11. Furthermore, the vapor deposition angles of the light-emitting material layer and the second electrode material layer can be different, allowing the second electrode material layer to cover the light-emitting material layer within the first opening 10 and connect to the isolation portion 200a.

[0160] For step S522, please refer to... Figure 8 A first encapsulation material layer 4301 is formed on the surface of the second electrode material layer and the sidewall of the isolation portion 200a.

[0161] The material of the first encapsulation material layer may include inorganic materials, which can be formed by processes such as chemical vapor deposition.

[0162] It can be understood that the light-emitting structural material layer at this time includes a light-emitting material layer, a second electrode material layer, and a first encapsulation material layer.

[0163] Meanwhile, step S53 includes:

[0164] Step S531: Etch the first encapsulation material layer to form an encapsulation unit 430 within at least a portion of the first opening 10.

[0165] At this point, an imaged photoresist P31 can be formed in the first opening 10 corresponding to the first color.

[0166] Then, based on the imaged photoresist P31, the first encapsulation material layer in other areas is dry etched to remove the first encapsulation material layer in other areas, thereby forming an encapsulation unit 430 in the first opening 10 corresponding to the first color.

[0167] During this dry etching process, in the non-display area (NAA), the thickness of the second electrode material layer and the light-emitting material layer located on the sidewall of the preset trace 110 is relatively small. Therefore, this portion of the second electrode material layer and the light-emitting material layer may also be etched through during the dry etching of the first encapsulation material layer. At this time, the presence of the protection part 200b can prevent the insulating material layer 3001 on the sidewall of the preset trace 110 from being etched, thereby protecting the preset trace 110.

[0168] In step S532, the second electrode material layer and the first color light-emitting material layer are etched to form the second electrode 420 and the first color light-emitting unit 410 in the first opening 10 where the encapsulation unit 430 is formed. The second electrode 420 overlaps with the isolation portion 200a.

[0169] Based on the imaged photoresist P31, wet etching can be performed on the second electrode material layer and the first color light-emitting material layer in other areas to remove them, thereby forming the second electrode 420 and the first color light-emitting unit 410 within the first opening 10 corresponding to the first color. Here, the second electrode 420 can be set as the cathode and the first electrode 130 as the anode. Alternatively, the second electrode 420 can be set as the anode and the first electrode 130 as the cathode. A set of first electrode 130, light-emitting unit 410, and second electrode 420 can form a sub-pixel.

[0170] During this wet etching process, the presence of the protective part 200b in the non-display area NAA can prevent the expansion of holes and gaps in the insulating material layer 3001 on the sidewall of the preset trace 110 due to wet erosion, and prevent the wet etching solution from eroding the preset trace 110 through holes and gaps in the insulating material layer 3001, thereby preventing the sidewall of the preset trace 110 from being further etched and producing a larger depression.

[0171] It can be understood that the light-emitting structure 400 at this time includes a light-emitting unit 410, a second electrode 420 and an encapsulation unit 430 stacked sequentially in the first opening 10.

[0172] In one embodiment, see Figure 11 After step S53, the following is included:

[0173] Step S61: Etch the isolation material layer 2001 to remove the protective part 200b and part of the isolation part, so as to form an isolation structure 200 with a third isolation opening.

[0174] As an example, when the isolation material layer 2001 includes a second isolation material sublayer 2201 and a third isolation material sublayer 2301, a patterned photoresist P12 can be formed first. The patterned photoresist P12 may have a first photoresist opening and a second photoresist opening. The first photoresist opening can define the size, position, etc., of the first isolation opening 11. The second photoresist opening can expose the non-display area NAA.

[0175] Then, the third isolation material sublayer 2301 is dry-etched based on the patterned photoresist P12. Afterwards, the patterned photoresist P12 can be removed. Then, the second isolation material sublayer 2201 is wet-etched to form a third isolation opening with a small opening and a large belly, while the protective part 200b located in the non-display area NAA can be removed.

[0176] In step S62, the insulating material layer 3001 is etched to form a third pixel opening that communicates with the third isolation opening. The third pixel opening and the third isolation opening form a third opening 30, and the remaining insulating material layer 3001 forms an insulating layer 300.

[0177] First, a patterned photoresist P22 can be formed. Then, an insulating material layer 3001 is etched based on the patterned photoresist P22 to form the third pixel opening. Afterward, the patterned photoresist P22 is removed.

[0178] Step S63: A light-emitting structure 400 of the third color is formed within the third opening 30.

[0179] The step of forming a third-color light-emitting structure 400 within the third opening 30 can be similar to the steps of forming a first-color light-emitting structure 400 within the first opening 10 in steps S52 to S53, and will not be described in detail here.

[0180] In this embodiment, the protective part 200b is removed while forming the third isolation opening using the same photomask, thereby saving photomask costs.

[0181] At the same time, the protective part 200b is removed, so that the final product does not contain the protective part 200b. At this time, the presence of the protective part 200b can prevent the conductive path between different preset traces 110 from shortening under the influence of temperature and humidity, which could lead to potential electrochemical corrosion problems.

[0182] Specifically, for example, when the sidewall of the preset trace 110 is recessed, the insulating material layer 3001 does not cover the sidewall of the preset trace 110 well, which may result in holes or gaps within the insulating material layer 3001. Subsequently, when the conductive insulating material layer 2001 is formed, it may fill the holes or gaps, which may cause a short circuit between the protective portion 200b formed after the insulating material layer 2001 is patterned and the preset trace 110.

[0183] At this point, if the final product contains a protective part 200b, the conductive path between different preset traces 110 (such as positive power line and negative power line) may be shortened under the influence of temperature and humidity, which may lead to electrochemical corrosion problems between different preset traces 110.

[0184] Of course, in other embodiments, the distance between different preset traces 110 (such as positive power lines and negative power lines) can be set to be greater than a preset distance to prevent electrochemical corrosion problems. The specific value of the preset distance can be set according to actual needs.

[0185] In one embodiment, before step S61, step S50 further includes:

[0186] Step S54: Etch the isolation material layer 2001 to form a second isolation opening.

[0187] As an example, when the isolation material layer 2001 includes a second isolation material sublayer 2201 and a third isolation material sublayer 2301, a patterned photoresist P13 can be formed first. Then, the third isolation material sublayer 2301 is dry etched based on the patterned photoresist P13. Afterward, the patterned photoresist P13 can be removed.

[0188] Then, the second isolation material sublayer 2201 is wet-etched to form a second isolation opening with a small opening and a large belly.

[0189] During this wet etching process, the presence of the protective part 200b in the non-display area NAA can prevent the expansion of holes and gaps in the insulating material layer 3001 on the sidewall of the preset trace 110 due to wet erosion, and prevent the wet etching solution from eroding the preset trace 110 through holes and gaps in the insulating material layer 3001, thereby preventing the sidewall of the preset trace 110 from being further etched and producing a larger depression.

[0190] In step S55, the insulating material layer 3001 is etched to form a second pixel opening that communicates with the second isolation opening. The second pixel opening and the second isolation opening together form a second opening 20.

[0191] First, a patterned photoresist P23 can be formed. Then, an insulating material layer 3001 is etched based on the patterned photoresist P23 to form the second pixel opening. Afterward, the patterned photoresist P23 is removed.

[0192] Step S56: A light-emitting structural material layer of the second color is formed inside the second opening 20 and on the insulating material layer 2001.

[0193] This step can be similar to step S52 in the aforementioned embodiment, and will not be described in detail here.

[0194] Step S57: Etch the light-emitting structure material layer of the second color to form a light-emitting structure 400 of the second color within the second opening 20.

[0195] This step can be similar to step S53 in the aforementioned embodiment, and will not be described in detail here.

[0196] At this point, in step S50, steps S51 to S53 can be executed sequentially to form a blue light-emitting structure 400 within the first opening 10. Then, steps S54 to S57 are executed to form a green light-emitting structure 400 within the second opening 20. Then, steps S61 to S63 are executed to form a red light-emitting structure 400 within the third opening 30.

[0197] In this embodiment, before forming each sub-pixel of a certain color, an isolation opening corresponding to that color is formed only within the isolation material layer 2001. This prevents the fabrication process of the previously formed sub-pixels from affecting the subsequently formed sub-pixels. Furthermore, the protection part 200b can provide etching protection during the relevant etching processes in the fabrication of the light-emitting structures of the first and second colors.

[0198] In one embodiment, see Figure 10 In step S40, a second isolation opening is formed at the same time as the first isolation opening is formed.

[0199] Specifically, during step S40, when etching the isolation material layer, a patterned photoresist P11 can first be formed on the isolation material layer. The openings within the patterned photoresist P11 can simultaneously define a first isolation opening and a second isolation opening. Then, based on the patterned photoresist P11, the isolation material layer is etched, thereby simultaneously forming the first isolation opening and the second isolation opening.

[0200] Simultaneously, while forming the first pixel opening in step S51, a second pixel opening connected to the second isolation opening is also formed, and the second pixel opening and the second isolation opening together form the second opening 20.

[0201] Specifically, during step S51, when etching the insulating material layer, a patterned photoresist P21 can first be formed on the insulating material layer. The openings within the patterned photoresist P21 can simultaneously define a first pixel opening and a second pixel opening. Then, based on the patterned photoresist P21, an isolation material layer is etched, thereby simultaneously forming the first pixel opening and the second pixel opening.

[0202] Before step S61, step S50 also includes:

[0203] Step S56: A light-emitting structural material layer of the second color is formed inside the second opening 20 and on the insulating material layer 2001.

[0204] This step can be similar to step S52 in the aforementioned embodiment, and will not be described in detail here.

[0205] Step S57: Etch the light-emitting structure material layer of the second color to form a light-emitting structure 400 of the second color within the second opening 20.

[0206] This step can be similar to step S53 in the aforementioned embodiment, and will not be described in detail here.

[0207] In this embodiment, the first opening corresponding to the first color and the second opening 20 corresponding to the second color can be formed simultaneously, thereby improving process efficiency. Furthermore, the protective portion 200b can provide etching protection during the relevant etching processes in the fabrication of the light-emitting structures of the first and second colors.

[0208] In one embodiment, after step S53, the following is included:

[0209] Step S64: Etch the isolation material layer to remove the protective portion and form a second isolation opening within the isolation portion.

[0210] This step can be similar to step S61 in the previous embodiment, and will not be described in detail here.

[0211] Step S65: Etch the insulating material layer to form a second pixel opening that communicates with the second isolation opening. The second pixel opening and the second isolation opening together form a second opening 20.

[0212] This step can be similar to step S55 in the aforementioned embodiment, and will not be described in detail here.

[0213] Step S66: A light-emitting structure of the second color is formed within the second opening 20.

[0214] This step can be similar to steps S56 to S57 in the aforementioned embodiments, and will not be described in detail here.

[0215] As an example, after step S66, the following also includes:

[0216] In step S67, the isolation portion is etched to form a third isolation opening, and the remaining isolation portion forms an isolation structure 200.

[0217] After removing the protective portion in step S64, the remaining portion of the isolation material layer is the remaining portion of the isolation portion. In this step, after the third isolation opening is formed in the isolation portion, the remaining isolation portion forms the isolation structure 200.

[0218] Step S68: Etch the insulating material layer to form a third pixel opening that communicates with the third isolation opening. The third pixel opening and the third isolation opening together form a third opening 30.

[0219] This step can be similar to step S62 in the aforementioned embodiment, and will not be described in detail here.

[0220] Step S69: A light-emitting structure of the third color is formed within the third opening 30.

[0221] This step can be similar to step S63 in the aforementioned embodiment, and will not be described in detail here.

[0222] In this embodiment, the protective part 200b is removed while forming the second isolation opening using the same photomask, thereby saving photomask costs.

[0223] In one embodiment, after step S53, step S50 includes:

[0224] Step S54: Etch the isolation material layer to form a second isolation opening;

[0225] Step S55: Etch the insulating material layer to form a second pixel opening that communicates with the second isolation opening. The second pixel opening and the second isolation opening form a second opening 20.

[0226] Step S56: A light-emitting structural material layer of the second color is formed inside the second opening 20 and on the insulating material layer;

[0227] Step S57: Using the protective part as an etching protective layer, the light-emitting structure material layer of the second color is etched to form a light-emitting structure of the second color within the second opening 20.

[0228] Step S58: Etch the isolation material layer to form a third isolation opening within the isolation section;

[0229] Step S59: Etch the insulating material layer to form a third pixel opening that communicates with the third isolation opening. The third pixel opening and the third isolation opening form a third opening 30.

[0230] Step S510: A light-emitting structural material layer of a third color is formed inside the third opening 30 and on the insulating material layer;

[0231] Step S511: Using the protective part as an etching protective layer, the third color light-emitting structure material layer is etched to form a third color light-emitting structure within the third opening 30.

[0232] The specific processes of steps S54 to S57 can be referred to the aforementioned embodiments. Steps S58 to S511 are similar to steps S54 to S57, and will not be described in detail here.

[0233] Following step S511, the method further includes:

[0234] Step S60a: Remove the protective part.

[0235] At this point, an additional photolithography process can be added to remove the protective layer.

[0236] Please see Figure 12 After forming the light-emitting structures 400 of all colors, an organic encapsulation layer 500 can be formed covering each color light-emitting structure 400 and the isolation structure 200. The organic encapsulation layer 500 can extend from the display area AA to a portion of the non-display area NAA. Then, an inorganic encapsulation layer 600 can be formed on the organic encapsulation layer 500. The inorganic encapsulation layer 600 can extend from the display area AA to a portion of the non-display area NAA and cover the preset trace 110. Afterward, a polarizer 800 can be formed on the inorganic encapsulation layer 600. The polarizer 800 can be attached to the inorganic encapsulation layer 600 using optical adhesive 900. As an example, a touch-sensitive inorganic layer 700 can also be formed before forming the polarizer 800.

[0237] In some embodiments, the polarizer 800 typically contains potassium ions (K+) or iodine ions (I-). In the final display panel, at least part of the protective portion 200b may not be removed. In this case, during reliability testing or application, the protective portion 200b can prevent potassium ions (K+) or iodine ions (I-) in the polarizer 800 from penetrating the preset trace 110 and causing electrochemical corrosion.

[0238] In one embodiment, the preset trace 110 includes a power line. The power line may include a positive power line and / or a negative power line.

[0239] In one embodiment, the power supply line includes a first power supply line. The first power supply line is used to connect to a first power supply voltage, and the isolation part 200a is used to connect to a second power supply voltage. One of the second power supply voltage and the first power supply voltage is a positive power supply voltage, and the other is a negative power supply voltage.

[0240] For example, if the first power supply voltage is a positive power supply voltage, then the first power supply line is a positive power supply line. Correspondingly, the second electrode 420 is a cathode, and the second electrode 420 is connected to the isolation section 200a to be connected to a negative power supply voltage.

[0241] Meanwhile, the protection unit 200b includes a first protection sub-unit. The first protection sub-unit at least covers the sidewall of the first power line. Optionally, please refer to... Figure 13 The non-display area (NAA) includes a first sub-area A1. A first power line is at least partially located in the first sub-area A1. A first protective sub-area covers the first sub-area A1. In this case, the first protective sub-area can completely cover the portion of the first power line located in the first sub-area A1, thereby reducing the manufacturing process difficulty of the first protective sub-area.

[0242] Meanwhile, the first protective sub-section and the isolation section 200a are spaced apart.

[0243] In actual manufacturing processes, a short circuit may occur between the first protection sub-unit and the first power supply line.

[0244] For example, when the sidewall of the first power line is recessed, the insulating material layer 3001 does not cover the sidewall of the first power line well, which may result in holes or gaps within the insulating material layer 3001. Subsequently, when the conductive insulating material layer 2001 is formed, it may fill the holes or gaps, which may cause a short circuit between the first protective sub-part formed after the insulating material layer 2001 is patterned and the first power line.

[0245] Meanwhile, during the manufacturing process of the display panel, after each color sub-pixel is formed, a lighting test can be performed on that color sub-pixel.

[0246] At this time, if the first protection sub-unit is connected to the isolation unit 200a, and a short circuit occurs between the first protection sub-unit and the first power line, the first protection sub-unit will short-circuit the isolation unit 200a and the first power line, thereby affecting the lighting test.

[0247] Therefore, by setting the first protection sub-section and the isolation section 200a at an interval, it can be ensured that the lighting test can be carried out normally.

[0248] In one embodiment, the power cord further includes a second power cord.

[0249] For example, if the second power supply voltage is a negative power supply voltage, then the second power supply line is a negative power supply line. Correspondingly, the second electrode 420 is a cathode, and the second electrode 420 is connected to the isolation section 200a to be connected to the negative power supply voltage.

[0250] The second power line is electrically connected to the isolation section 200a, thereby providing a negative power supply voltage to the isolation section 200a.

[0251] Meanwhile, the protection unit 200b includes a second protection sub-unit. The second protection sub-unit at least covers the sidewall of the second power line. Optionally, please refer to... Figure 13 The non-display area NAA includes a second sub-area A2. The second power line is at least partially located in the second sub-area A2. A second protective sub-area covers the second sub-area A2. In this case, the second protective sub-area can completely cover the portion of the second power line located in the second sub-area A2, thereby reducing the manufacturing difficulty of the second protective sub-area.

[0252] Meanwhile, the second protection sub-section is spaced apart from the first protection sub-section.

[0253] As explained above, in actual manufacturing processes, a short circuit may occur between the first protection sub-unit and the first power supply line. Similarly, a short circuit may also occur between the second protection sub-unit and the second power supply line.

[0254] Meanwhile, during the manufacturing process of the display panel, after each color sub-pixel is formed, a lighting test can be performed on that color sub-pixel.

[0255] If the first protection sub-unit is connected to the second protection sub-unit, and a short circuit occurs between the first protection sub-unit and the first power line, and a short circuit also occurs between the second protection sub-unit and the second power line, then a short circuit will occur between the second power line and the first power line, thus affecting the lamp-lighting test.

[0256] Therefore, by setting the first protection sub-section and the second protection sub-section at an interval, it can be ensured that the lighting test can be carried out normally.

[0257] Of course, the arrangement of the protective portion 200b is not limited to this. For example, in some embodiments, during the fabrication of the display panel, the illumination test can be performed after all color sub-pixels have been fabricated. In the final display panel, the protective portion 200b is removed. In this case, the first protective sub-portion can also be connected to the isolation portion 200a. The second protective sub-portion can also be connected to the first protective sub-portion. Alternatively, the protective layer can directly cover the non-display area NAA.

[0258] In one embodiment, see Figure 13 The non-display area (NAA) includes at least one binding area. Specifically, the non-display area (NAA) may include a bend area (A5), and each binding area may be set in the bend area (A5).

[0259] The bonding area contains bonding electrodes. Specifically, multiple bonding electrodes may be present in the same bonding area.

[0260] At the same time, the protection unit 200b also covers the binding area. Specifically, the protection unit 200b can completely cover the binding area or partially cover it.

[0261] As an example, at least one bonding region includes a first bonding region A3. The first bonding region A3 is used for bonding with the integrated circuit. The protection part 200b completely covers the first bonding region A3.

[0262] As another example, at least one bonding area includes a second bonding area A4 for bonding with a flexible circuit board. The protective portion 200b partially covers the second bonding area A4 and exposes a portion of the bonding electrodes within the second bonding area A4.

[0263] The portion of the bonding electrodes within the second bonding area A4 exposed by the protected section 200b can be connected to a test signal during the illumination test. This facilitates performing an illumination test on each sub-pixel of a given color after it has been formed.

[0264] In this embodiment, the bonding electrode can also be protected during the etching process in step S50.

[0265] After step S50, the protective portion 200b covering the bonding area can be removed, thereby exposing the bonding electrodes in the bonding area to facilitate bonding.

[0266] Based on the same inventive concept, embodiments of this application also provide a display panel.

[0267] In one embodiment, the display panel includes a substrate, an insulating layer, and a light-emitting structure 400.

[0268] The substrate includes a preset trace layer 110. The preset trace layer 110 includes preset traces 110. At least a portion of the preset traces 110 is located in the non-display area (NAA).

[0269] The substrate may include a rigid substrate or a flexible substrate. The substrate may also include multiple wiring layers spaced apart and stacked on the substrate.

[0270] As an example, the preset trace layer 110 may include the trace layer furthest from the substrate, that is, it may include the trace layer furthest from the isolation layer, i.e., the top trace layer. Of course, the preset trace layer 110 is not limited to this. For example, the preset trace layer 110 may also include the trace layer second furthest from the substrate. Moreover, the preset trace layer 110 is not limited to a single trace layer. Accordingly, the preset trace layer 110 is not limited to traces within the same trace layer.

[0271] The isolation layer includes an isolation structure 200 and a protective part 200b.

[0272] The isolation layer may include a first isolation sublayer, a second isolation sublayer, and a third isolation sublayer stacked sequentially. Alternatively, the isolation layer may include a second isolation sublayer and a third isolation sublayer stacked sequentially.

[0273] The materials of the first and / or second isolation layers may include conductive materials. The material of the third isolation layer may be either conductive or insulating. Furthermore, when the material of the second isolation layer is conductive, the material of the first isolation layer may be either conductive or insulating.

[0274] The orthographic projection of the second isolation sublayer on the substrate can lie within the orthographic projection of the third isolation sublayer on the substrate.

[0275] The isolation structure 200 is located in the display area AA and forms an isolation opening. The isolation opening may include, for example, the aforementioned first isolation opening 11, third isolation opening, and second isolation opening.

[0276] Patents PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202310707209.0, 202311346196.5, 202311499823.9, 202311764506.5, and 202310773656.6 describe the relevant technical solutions of the isolation structure 200210, the contents of which are incorporated herein by reference.

[0277] The protection unit 200b is located in the non-display area NAA. The protection unit 200b covers at least the sidewall of the preset trace 110.

[0278] It is understandable that the protection unit 200b can directly cover the side wall of the preset wiring 110, or there can be an intermediate layer between the protection unit 200b and the side wall of the wiring.

[0279] The light-emitting structure 400 is at least partially located within the isolation opening.

[0280] The light-emitting structure 400 may include at least a light-emitting unit 410. As an example, the light-emitting structure 400 may include a light-emitting unit 410, a second electrode 420, and an encapsulation unit 430 stacked sequentially in a direction away from the substrate.

[0281] In addition, the display panel may also include an organic encapsulation layer 500 and an inorganic encapsulation layer 600. The organic encapsulation layer 500 covers the isolation structure 200 and the light-emitting structure 400 formed within the isolation opening. The inorganic encapsulation layer 600 covers the organic encapsulation layer 500 and the pre-defined traces 110.

[0282] In this embodiment, an isolation structure 200 and a protective portion 200b are simultaneously provided in the isolation layer. The protective portion 200b at least covers the sidewall of the preset trace 110, thereby protecting the preset trace 110 during the etching process in the manufacturing process of the display panel, thus preventing electrochemical corrosion of the display panel under temperature and humidity conditions.

[0283] In one embodiment, the sidewall of the preset trace 110 located in the non-display area NAA is recessed.

[0284] As an example, the preset trace 110 includes a first titanium layer, an aluminum layer, and a second titanium layer stacked sequentially. The aluminum layer is recessed relative to the titanium layers (first titanium layer and second titanium layer) on both sides of it.

[0285] The greater the sidewall recess of the preset trace 110, the weaker the coverage of the inorganic encapsulation layer 600 of the display panel on the preset trace 110.

[0286] In this embodiment, the presence of the protective part 200b can prevent the side wall recess of the preset trace 110 from being continuously deepened during the display panel manufacturing process, thereby improving the reliability of the encapsulation.

[0287] In one embodiment, the display panel further includes an insulating layer 300. The insulating layer 300 is located at least between the preset trace 110 and the protective portion 200b. The protective portion 200b and the isolation structure 200 are both part of the isolation layer. The material of the isolation layer typically includes a conductive material. By placing the insulating layer 300 between the preset trace 110 and the protective portion 200b, the two can be insulated from each other.

[0288] In one embodiment, the insulating layer 300 extends from the display area AA to the non-display area NAA. The insulating layer 300 has pixel openings located in the display area AA and communicating with the isolation openings. In this case, the insulating layer 300 serves as a pixel definition layer. The pixel openings may, for example, include the aforementioned first pixel opening 12, third pixel opening, and second pixel opening.

[0289] As an example, the substrate also includes a plurality of first electrodes 130 disposed at intervals in the display area AA.

[0290] An insulating layer 300 covers the first electrode 130, and a pixel opening exposes the first electrode 130.

[0291] Optionally, the light-emitting structure 400 includes a light-emitting unit 410, a second electrode 420, and an encapsulation unit 430. The light-emitting unit 410 is located between the first electrode 130 and the second electrode 420. The second electrode 420 is connected to the isolation structure 200. The second electrodes 420 in different isolation openings can be electrically connected through the isolation structure 200.

[0292] A set of first electrode 130, light-emitting unit 410, and second electrode 420 can form a sub-pixel. The second electrode 420 can be configured as a cathode and the first electrode 130 as an anode. Alternatively, the second electrode 420 can be configured as an anode and the first electrode 130 as a cathode.

[0293] The packaging unit 430 covers the side of the second electrode 420 away from the substrate.

[0294] In one embodiment, the preset wiring 110 includes a power line.

[0295] In one embodiment, the power supply line includes a first power supply line. The first power supply line is used to connect to a first power supply voltage. The isolation structure 200 is used to connect to a second power supply voltage. One of the second power supply voltage and the first power supply voltage is a positive power supply voltage, and the other is a negative power supply voltage.

[0296] For example, if the first power supply voltage is a positive power supply voltage, then the first power supply line is a positive power supply line. Correspondingly, the second electrode 420 is a cathode, and the second electrode 420 is connected to the isolation structure 200 to be connected to a negative power supply voltage.

[0297] Meanwhile, the protection section 200b includes a first protection subsection. The first protection subsection at least covers the sidewall of the first power line. Optionally, the non-display area NAA includes a first sub-region A1. The first power line is at least partially located in the first sub-region A1. The first protection subsection covers the first sub-region A1. In this case, the first protection subsection can completely cover the portion of the first power line located in the first sub-region A1, thereby reducing the manufacturing process difficulty of the first protection subsection.

[0298] Meanwhile, the first protection sub-unit is spaced apart from the isolation structure 200 to prevent the first protection sub-unit from short-circuiting the isolation structure 200 and the first power line.

[0299] In one embodiment, the power line further includes a second power line electrically connected to the isolation structure 200.

[0300] For example, if the second power supply voltage is a negative power supply voltage, then the second power supply line is a negative power supply line. Correspondingly, the second electrode 420 is a cathode, and the second electrode 420 is connected to the isolation structure 200 to receive the negative power supply voltage. The second power supply line is electrically connected to the isolation structure 200, thereby providing a negative power supply voltage to the isolation structure 200.

[0301] The protective portion 200b includes a second protective sub-portion. The second protective sub-portion at least covers the sidewall of the second power line. Optionally, the non-display area NAA includes a second sub-region A2. The second power line is at least partially located in the second sub-region A2. The second protective sub-portion covers the second sub-region A2. In this case, the second protective sub-portion can completely cover the portion of the second power line located in the second sub-region A2, thereby reducing the manufacturing process difficulty of the second protective sub-portion.

[0302] Meanwhile, the second protection sub-section is spaced apart from the first protection sub-section to prevent short circuits between the second power line and the first power line.

[0303] In one embodiment, the distance between the second protective sub-part and the first protective sub-part is greater than a preset distance, thereby preventing electrochemical corrosion problems. The specific value of the preset distance can be set according to actual needs.

[0304] Based on the same inventive concept, this application also provides a display device (not shown), which includes the display panel in the above embodiments.

[0305] It is understood that the display device in the embodiments of this application can be any product or component with display function, such as OLED display device, QLED display device, electronic paper, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, navigator, wearable device, Internet of Things device, etc., and the embodiments disclosed in this application do not limit this.

[0306] In the description of this specification, references to terms such as "some embodiments," "other embodiments," and "ideal embodiments" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0307] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0308] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A method for manufacturing a display panel, characterized in that, The display panel has a display area and a non-display area, and the method for manufacturing the display panel includes: A substrate is provided, the substrate including a preset wiring layer, the preset wiring layer including preset wiring, at least a portion of the preset wiring being located in the non-display area; An isolation material layer is formed on the substrate, and the isolation material layer covers the preset trace; The isolation material layer is etched to form an isolation portion and a protective portion. The isolation portion is located in the display area and has a first isolation opening. The protective portion is located in the non-display area and at least covers the preset trace sidewall. A preset process is performed, which includes an etching process.

2. The method for manufacturing a display panel according to claim 1, characterized in that, After the preset process is performed, it also includes: Remove at least a portion of the protective portion; Optionally, after performing a preset process, all the protective parts can be removed.

3. The method for manufacturing a display panel according to claim 1, characterized in that, Before forming the insulating material layer on the substrate, the process includes: An insulating material layer is formed on the substrate.

4. The method for manufacturing a display panel according to claim 3, characterized in that, The preset process includes: The insulating material layer is etched to form a first pixel opening that communicates with the first isolation opening, and the first pixel opening and the first isolation opening form a first opening; A light-emitting structural material layer of a first color is formed inside the first opening and on the insulating material layer; The light-emitting structure material layer of the first color is etched to form a light-emitting structure of the first color within the first opening; Optionally, the substrate further includes a plurality of first electrodes spaced apart in the display area, the insulating material layer covering a portion of the first electrodes, and the first pixel opening exposing the first electrodes.

5. The method for manufacturing a display panel according to claim 4, characterized in that, The light-emitting structural material layer of the first color formed within the first opening and on the insulating material layer includes: A light-emitting material layer of a first color and a second electrode material layer are sequentially formed inside the first opening and on the insulating material layer; A first encapsulation material layer is formed on the surface of the second electrode material layer and the sidewall of the isolation portion; Furthermore, the etching of the first-color luminescent material layer to form a first-color luminescent structure within at least a portion of the first opening includes: The first encapsulation material layer is etched to form an encapsulation unit within at least a portion of the first opening; The second electrode material layer and the first color light-emitting material layer are etched to form the second electrode and the first color light-emitting unit in the first opening where the encapsulation unit is formed, and the second electrode overlaps with the isolation portion.

6. The method for manufacturing a display panel according to claim 4, characterized in that, After forming the light-emitting structure of the first color within the first opening, the process includes: The isolation material layer is etched to remove the protective portion and part of the isolation portion to form an isolation structure with a third isolation opening; The insulating material layer is etched to form a third pixel opening that communicates with the third isolation opening. The third pixel opening and the third isolation opening together form a third opening, and the remaining insulating material layer forms an insulating layer. A light-emitting structure of a third color is formed within the third opening.

7. The method for manufacturing a display panel according to claim 6, characterized in that, Before etching the isolation material layer to remove the protective portion and part of the isolation portion to form an isolation structure with a third isolation opening, the pre-processing step further includes: The insulating material layer is etched to form a second insulating opening; The insulating material layer is etched to form a second pixel opening that communicates with the second isolation opening, and the second pixel opening and the second isolation opening form a second opening; A light-emitting structural material layer of a second color is formed within the second opening and on the insulating material layer; The light-emitting structure material layer of the second color is etched to form a light-emitting structure of the second color within the second opening.

8. The method for manufacturing a display panel according to claim 6, characterized in that, A second isolation opening is formed at the same time as the first isolation opening is formed. A second pixel opening that communicates with the second isolation opening is also formed at the same time as the first pixel opening. The second pixel opening and the second isolation opening together form a second opening. Before etching the isolation material layer to remove the protective portion and part of the isolation portion to form an isolation structure with a third isolation opening, the pre-processing step further includes: A light-emitting structural material layer of a second color is formed within the second opening and on the insulating material layer; The light-emitting structure material layer of the second color is etched to form a light-emitting structure of the second color within the second opening.

9. The method for manufacturing a display panel according to claim 4, characterized in that, After forming the light-emitting structure of the first color within the first opening, the process includes: The insulating material layer is etched to remove the protective portion, and a second insulating opening is formed within the insulating portion; The insulating material layer is etched to form a second pixel opening that communicates with the second isolation opening, and the second pixel opening and the second isolation opening form a second opening; A light-emitting structure of a second color is formed within the second opening.

10. The method for manufacturing a display panel according to claim 9, characterized in that, After forming the light-emitting structure of the second color within the second opening, the method further includes: The isolation portion is etched to form a third isolation opening, and the remaining isolation portion forms an isolation structure; The insulating material layer is etched to form a third pixel opening that communicates with the third isolation opening, and the third pixel opening and the third isolation opening together form a third opening; A light-emitting structure of a third color is formed within the third opening.

11. The method for manufacturing a display panel according to claim 4, characterized in that, After forming the light-emitting structure of the first color within the first opening, a preset process is performed, including: The insulating material layer is etched to form a second insulating opening; The insulating material layer is etched to form a second pixel opening that communicates with the second isolation opening, and the second pixel opening and the second isolation opening form a second opening; A light-emitting structural material layer of a second color is formed within the second opening and on the insulating material layer; The light-emitting structure material layer of the second color is etched to form a light-emitting structure of the second color within the second opening; The isolation material layer is etched to form a third isolation opening within the isolation portion; The insulating material layer is etched to form a third pixel opening that communicates with the third isolation opening, and the third pixel opening and the third isolation opening together form a third opening; A light-emitting structural material layer of a third color is formed within the third opening and on the insulating material layer; The light-emitting structure material layer of the third color is etched to form a light-emitting structure of the third color within the third opening; After forming a light-emitting structure of a third color within the third opening, the process includes: Remove the protective part.

12. The method for manufacturing a display panel according to claim 1, characterized in that, The non-display area includes at least one bonding area, the bonding area is provided with a bonding electrode, and the protective part covers the bonding area; Optionally, the at least one bonding region includes a first bonding region for bonding with an integrated circuit, and the protection portion completely covers the first bonding region; Optionally, the at least one bonding area includes a second bonding area for bonding with a flexible circuit board, and the protective portion covers a portion of the second bonding area and exposes a portion of the bonding electrodes within the second bonding area.

13. A display panel, characterized in that, The display panel has a display area and a non-display area, and includes: The substrate includes a preset wiring layer, the preset wiring layer includes preset wiring, and at least a portion of the preset wiring is located in the non-display area; An isolation layer includes an isolation structure and a protective portion. The isolation structure is located in the display area and forms an isolation opening. The protective portion is located in the non-display area and at least covers the preset trace sidewall. The light-emitting structure is at least partially located within the isolation opening.

14. The display panel according to claim 13, characterized in that, The sidewall of the preset trace located in the non-display area is recessed; Optionally, the preset trace includes a first titanium layer, an aluminum layer, and a second titanium layer stacked sequentially.

15. The display panel according to claim 13, characterized in that, The display panel also includes: An insulating layer is located at least between the preset trace and the protective portion; Optionally, the insulating layer extends from the display area to the non-display area and has pixel openings, the pixel openings being located in the display area and communicating with the isolation openings; Optionally, the substrate further includes a plurality of first electrodes spaced apart in the display area, the insulating layer covering the first electrodes, and the pixel opening exposing the first electrodes; Optionally, the light-emitting structure includes a light-emitting unit, a second electrode, and a packaging unit. The light-emitting unit is located between the first electrode and the second electrode, the second electrode is connected to the isolation structure, and the packaging unit covers the side of the second electrode away from the substrate.

16. The display panel according to claim 13, characterized in that, The preset wiring includes power lines.

17. The display panel according to claim 16, characterized in that, The power supply line includes a first power supply line for connecting to a first power supply voltage, and the isolation structure is for connecting to a second power supply voltage, wherein one of the second power supply voltage and the first power supply voltage is a positive power supply voltage, and the other is a negative power supply voltage. The protection part includes a first protection sub-part, which at least covers the side wall of the first power line, and the first protection sub-part is spaced apart from the isolation structure. Optionally, the non-display area includes a first sub-area, the first power line is at least partially located in the first sub-area, and the first protection sub-area covers the first sub-area.

18. The display panel according to claim 17, characterized in that, The power line also includes a second power line, which is electrically connected to the isolation structure. The protection section includes a second protection subsection, which at least covers the side wall of the second power line, and the second protection subsection is spaced apart from the first protection subsection. Optionally, the non-display area includes a second sub-area, the second power line is at least partially located in the second sub-area, and the second protection sub-area covers the second sub-area; Optionally, the distance between the second protective sub-part and the first protective sub-part is greater than a preset distance.

19. The method for manufacturing a display panel according to claim 13, characterized in that, The substrate includes multiple wiring layers, and the preset wiring layer includes the wiring layer that is closest to the isolation layer.

20. A display device, characterized in that, Includes the display panel as described in any one of claims 13-19.

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