Display panel, preparation method thereof and display device

Abstract

The invention discloses a display panel, a preparation method thereof and a display device. The display panel comprises a stretchable substrate which comprises a plurality of island areas arranged in an array, a plurality of bridge areas and blank areas located outside the island areas and the bridge areas; the bridge area is connected with two adjacent island areas; the flexible substrate is positioned on one side of the stretchable base and comprises a hollow area corresponding to the bridge area and the blank area; the driving circuit layer is located on the side, away from the stretchable substrate, of the flexible substrate; comprising a plurality of driving units and a plurality of connecting leads, the driving unit is located in the island area, and the connecting lead penetrates through the bridge area and extends to the island area to be electrically connected with the driving unit; when the stretchable base is in an unstretched state, at least part of the connecting lead sinks towards one side of the flexible substrate or the connecting lead protrudes towards one side deviating from the flexible substrate.

Description

Display panel and manufacturing method thereof, and display device Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] With the development of flexible manufacturing processes, the transition from bending and flexing to elastic flexibility has gradually occurred. Flexible stretchable displays have garnered widespread market attention due to their broad application potential. Existing flexible stretchable display products require openings in a flexible substrate to form an island-bridge structure. Light-emitting devices, such as the light-emitting components, are placed in the island region, while connecting lines are placed in the bridge region, achieving the stretchability of the display panel. However, the flexible substrate has a low stretchability, and the signal lines placed in the bridge region on the flexible substrate affect the stretchability of the display product.

[0003] Summary of the Invention

[0004] An embodiment of the present disclosure provides a display panel, the display panel comprising:

[0005] A stretchable substrate comprising: a plurality of island regions arranged in an array, a plurality of bridge regions, and a blank region outside the island regions and the bridge regions; the bridge region connects two adjacent island regions;

[0006] The flexible substrate is located on one side of the stretchable base and includes: a hollow area corresponding to the bridge area and the blank area;

[0007] The driving circuit layer is located on the side of the flexible substrate facing away from the stretchable substrate; it includes: multiple driving units and multiple connecting leads; the driving units are located in the island area, and the connecting leads pass through the bridge area and extend to the island area to be electrically connected to the driving units; when the stretchable substrate is in an unstretched state, at least part of the connecting leads sinks toward the side of the flexible substrate or the connecting leads protrude toward the side facing away from the flexible substrate.

[0008] In some embodiments, the connecting lead has at least one protrusion facing toward the flexible substrate and / or facing away from the flexible substrate.

[0009] In some embodiments, the connecting lead has a plurality of protrusions; the directions of the plurality of protrusions are not completely the same.

[0010] In some embodiments, the extended profile of the protrusion has a plurality of sub-protrusions, and the plurality of sub-protrusions are oriented in the same direction.

[0011] In some embodiments, the orthographic projection of the connecting lead on the bridge region is curved.

[0012] In some embodiments, the driving unit includes: a thin film transistor;

[0013] The connecting lead is located on a side of the thin film transistor facing away from the flexible substrate;

[0014] The driving circuit layer further includes: a first protective layer located between the connecting lead and the thin film transistor, a second protective layer located between the first protective layer and the connecting lead, and a third protective layer located on a side of the connecting lead away from the flexible substrate;

[0015] The second protection layer and the third protection layer pass through the bridge area and extend to the island area;

[0016] The orthographic projection of the connecting lead on the flexible substrate falls within the orthographic projection of the second protective layer on the flexible substrate, and the orthographic projection of the connecting lead on the flexible substrate falls within the orthographic projection of the third protective layer on the flexible substrate;

[0017] The third protection layer covers the surface of the connecting lead facing away from the flexible substrate and the side surfaces of the connecting lead.

[0018] In some embodiments, in the bridge region, an orthographic projection of the second protection layer on the flexible substrate substantially coincides with an orthographic projection of the third protection layer on the flexible substrate.

[0019] In some embodiments, the connecting lead includes: a first sub-layer, and a second sub-layer located on a side of the first sub-layer facing away from the flexible substrate;

[0020] In a direction perpendicular to the flexible substrate, the thickness of the second sub-layer is greater than the thickness of the first sub-layer.

[0021] In some embodiments, the display panel further comprises:

[0022] A plurality of micro-sized inorganic light-emitting diode devices are bonded to the driving circuit layer in the island region and on a side of the driving circuit layer facing away from the flexible substrate;

[0023] The stretchable cover is located on the side of the micro-sized inorganic light-emitting diode device facing away from the flexible substrate.

[0024] An embodiment of the present disclosure provides a method for manufacturing a display panel, the method comprising:

[0025] Providing a first substrate; comprising: a plurality of island areas arranged in an array, a plurality of bridge areas, and blank areas outside the island areas and the bridge areas; the bridge area connects two adjacent island areas;

[0026] forming a flexible substrate on one side of the first substrate;

[0027] A driving circuit layer pattern is formed on a side of the flexible substrate facing away from the first base, and the flexible substrate is patterned to form hollow areas in the blank area and the bridge area; the driving circuit layer includes: a plurality of driving units and a plurality of connecting leads; the driving units are located in the island area, and the connecting leads pass through the bridge area and extend to the island area to be electrically connected to the driving units;

[0028] peeling off the first substrate and transferring the structure formed on one side of the first substrate to a stretchable substrate that is stretched by applying a tensile force;

[0029] The tension of the stretchable substrate is released, so that the stretchable substrate returns to an unstretched state; wherein, in the unstretched state of the stretchable substrate, at least a portion of the connecting lead sinks toward the flexible substrate or the connecting lead protrudes toward the side away from the flexible substrate.

[0030] In some embodiments, a pattern of a driving circuit layer is formed on a side of the flexible substrate facing away from the first base, and the flexible substrate is patterned to form hollow areas in the blank areas and the bridge areas; specifically, the method includes:

[0031] forming a pattern of a portion of the film layer included in the driving circuit layer on a side of the flexible substrate facing away from the first base, and performing a patterning process on the flexible substrate to form hollow areas in the blank area and the bridge area;

[0032] forming a sacrificial layer in an area corresponding to the hollow area;

[0033] forming a pattern of connecting leads on a side of the sacrificial layer facing away from the first substrate;

[0034] The sacrificial layer is removed.

[0035] In some embodiments, forming a sacrificial layer in a region corresponding to the hollow region specifically includes:

[0036] Forming a metal sacrificial layer in the area corresponding to the hollowed area by electroplating process;

[0037] Removing the sacrificial layer, specifically including:

[0038] The sacrificial layer is removed by wet etching process.

[0039] In some embodiments, a metal sacrificial layer is formed in an area corresponding to the hollowed-out region using an electroplating process, specifically including:

[0040] forming a seed layer covering part of the film layer and the hollow area;

[0041] forming a strippable electroplated barrier covering the seed layer in an area outside the hollow area;

[0042] Applying electricity to the seed layer to grow an electroplated layer in the hollow area, filling the area corresponding to the hollow area to form a metal sacrificial layer;

[0043] Removal of strippable plating retaining walls;

[0044] The seed layer outside the hollow area is removed, and the metal sacrificial layer is thinned so that the surface of the metal sacrificial layer facing away from the first substrate and the surface of the partial film layer facing away from the first substrate are approximately in the same plane.

[0045] In some embodiments, forming a sacrificial layer in a region corresponding to the hollow region specifically includes:

[0046] Filling an area corresponding to the hollow area with an organic material to form an organic sacrificial layer;

[0047] Removing the sacrificial layer, specifically including:

[0048] The organic sacrificial layer is removed using a stripping process using a stripping solution.

[0049] In some embodiments, after forming a sacrificial layer in the area corresponding to the hollow region and before forming a pattern of connecting leads on a side of the sacrificial layer facing away from the first substrate, the method further includes:

[0050] A plurality of spacer structures are formed on a side of the sacrificial layer away from the first substrate; the plurality of spacer structures are arranged at intervals in the arrangement direction of two adjacent island regions; and the surface of the spacer structure away from the first substrate is a curved surface;

[0051] Removal of the sacrificial layer also includes:

[0052] Remove the spacer layer.

[0053] In some embodiments, a pattern of a portion of a film layer included in the driving circuit layer is formed on a side of the flexible substrate facing away from the first base, and a patterning process is performed on the flexible substrate to form hollow areas in the blank areas and the bridge areas, specifically including:

[0054] forming patterns of various film layers of the thin film transistor on a side of the flexible substrate facing away from the first base; wherein the patterns of various film layers of the thin film transistor do not overlap with the blank area and the bridge area;

[0055] forming a pattern of a first protective layer on a side of each film layer of the thin film transistor away from the first substrate; the pattern of the first protective layer does not overlap with the blank area and the bridge area;

[0056] Performing a patterning process on the flexible substrate using the pattern of the first protective layer as a mask to form hollow areas in the blank areas and the bridge areas;

[0057] Before forming a pattern of connecting leads on the side of the sacrificial layer facing away from the first substrate, the method further includes:

[0058] forming a pattern of a second protective layer on a side of the sacrificial layer facing away from the first substrate; the second protective layer passes through the bridge area and extends to the island area;

[0059] After forming a pattern of connecting leads on a side of the sacrificial layer facing away from the first substrate, the method further includes:

[0060] A pattern of a third protection layer is formed on the side of the connecting lead away from the sacrificial layer; the third protection layer passes through the bridge area and extends to the island area.

[0061] In some embodiments, after removing the sacrificial layer and before peeling off the first substrate, the method further includes:

[0062] A micro-sized inorganic light-emitting diode device is bonded to a side of the driving circuit layer facing away from the flexible substrate;

[0063] A protective film is attached to the side of the micro-sized inorganic light-emitting diode device facing away from the flexible substrate;

[0064] After releasing the tension of the stretchable substrate so that the stretchable substrate returns to an unstretched state, the method further includes:

[0065] Remove the protective film.

[0066] In some embodiments, after removing the protective film, the method further includes:

[0067] A stretchable cover is attached to the side of the micro-sized inorganic light emitting diode device facing away from the flexible substrate.

[0068] A display device provided by an embodiment of the present disclosure includes the display panel provided by an embodiment of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0069] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0070] FIG1 is a schematic structural diagram of a display panel provided by an embodiment of the present disclosure;

[0071] FIG2 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0072] FIG3 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0073] FIG4 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0074] FIG5 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0075] FIG6 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0076] FIG7 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0077] FIG8 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0078] FIG9 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0079] FIG10 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0080] FIG11 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0081] FIG12 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0082] FIG13 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present disclosure;

[0083] 14a to 14f are schematic flow charts of another method for manufacturing a display panel according to an embodiment of the present disclosure;

[0084] FIG15 is a schematic diagram of a cross-sectional structure of a bridge area and a blank area provided by an embodiment of the present disclosure;

[0085] FIG16 is a schematic diagram of forming a spacer structure in a method for manufacturing a display panel provided by an embodiment of the present disclosure;

[0086] FIG17 is a schematic diagram of forming a groove in a method for manufacturing a display panel provided by an embodiment of the present disclosure;

[0087] FIG18 is a schematic diagram of forming a sacrificial layer in a method for manufacturing a display panel provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0088] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. And in the absence of conflict, the embodiments in the present disclosure and the features in the embodiments can be combined with each other. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0089] Unless otherwise defined, the technical or scientific terms used in this disclosure should have the usual meanings understood by persons of ordinary skill in the field to which this disclosure belongs. The words "first", "second" and similar terms used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Words such as "include" or "comprise" mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

[0090] It should be noted that the sizes and shapes of the figures in the accompanying drawings do not reflect the actual scale and are only for the purpose of illustrating the present disclosure. The same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions.

[0091] An embodiment of the present disclosure provides a display panel, as shown in FIG1 , comprising:

[0092] The stretchable substrate 1 comprises: a plurality of island regions 11 arranged in an array, a plurality of bridge regions 12, and a blank region 13 outside the island regions 11 and the bridge regions 12; the bridge region 12 connects two adjacent island regions 11;

[0093] The flexible substrate 2 is located on one side of the stretchable base 1 and includes: a hollow area 21 corresponding to the bridge area 12 and the blank area 13;

[0094] The driving circuit layer 3 is located on the side of the flexible substrate facing away from the stretchable substrate 1 and includes: multiple driving units 31 and multiple connecting leads 32; the driving units 31 are located in the island area 11, and the connecting leads 32 pass through the bridge area 12 and extend to the island area 11 to electrically connect to the driving units 31; when the stretchable substrate 1 is unstretched, at least part of the connecting leads 32 sinks toward the side of the flexible substrate or protrudes toward the side facing away from the flexible substrate.

[0095] The display panel provided by the embodiment of the present disclosure removes the flexible substrate in the bridge area, and the connecting leads passing through the bridge area are suspended. This can prevent the low stretchability of the flexible substrate from affecting the overall stretchability of the display panel. In addition, a stretchable base is further provided on the flexible substrate away from the driving circuit layer. When the stretchable base is in a stretched state, the flexible substrate and the film layers on one side are transferred to the stretchable base. The stretchable base is then restored to an unstretched state. This can reduce the size of the bridge area, causing at least a portion of the connecting leads to sink toward the side of the flexible substrate or to bulge toward the side away from the flexible substrate, i.e., causing the connecting leads to be in a bent state. In this way, when the display panel is stretched, the connecting leads are stretched from the bent state to a straight extension state, which can improve the stretchability of the display panel compared to stretching the connecting leads from a straight extension state.

[0096] In some embodiments, as shown in FIG1 , the driving unit 31 includes: a thin film transistor 311 ;

[0097] The connecting lead 32 is located on the side of the thin film transistor 311 facing away from the flexible substrate 2;

[0098] The driving circuit layer 3 further includes: a first protective layer 33 located between the connecting lead 32 and the thin film transistor 311 , a second protective layer 34 located between the first protective layer 33 and the connecting lead 32 , and a third protective layer 35 located on the side of the connecting lead 32 facing away from the flexible substrate 2 ;

[0099] The second protection layer 34 and the third protection layer 35 pass through the bridge area 12 and extend to the island area 11 and cover at least a portion of the island area 11;

[0100] The orthographic projection of the connecting lead 32 on the flexible substrate 2 falls within the orthographic projection of the second protective layer 34 on the flexible substrate 2 , and the orthographic projection of the connecting lead 32 on the flexible substrate 2 falls within the orthographic projection of the third protective layer 35 on the flexible substrate 2 ;

[0101] The third protective layer 35 covers the surface of the connecting lead 32 facing away from the flexible substrate 2 and the side surfaces of the connecting lead 32 .

[0102] In the display panel provided by the embodiment of the present disclosure, the second protective layer and the third protective layer pass through the bridge area from the island area, and the orthographic projection of the connecting lead in the bridge area falls into the orthographic projection of the second protective layer, and the third protective layer covers the connecting lead, so that the upper and lower surfaces of the connecting lead passing through the bridge area are protected even if it is in an unsupported suspended state, thereby avoiding damage to the connecting lead passing through the bridge area.

[0103] In some embodiments, as shown in FIG. 2 , in the bridge region 12 , the width of the second protection layer 34 in the X direction is greater than the width of the connection lead 32 in the X direction, and the width of the third protection layer 35 in the X direction is greater than the width of the connection lead 32 in the X direction.

[0104] In some embodiments, as shown in FIG. 2 , in the bridge region 12 , the orthographic projection of the second protection layer 34 on the flexible substrate 2 substantially coincides with the orthographic projection of the third protection layer 35 on the flexible substrate 2 .

[0105] It should be noted that the orthographic projection of the second protective layer on the flexible substrate substrate and the orthographic projection of the third protective layer on the flexible substrate substrate roughly coincide with each other means that: in the X direction, the difference in distance between the edge of the second protective layer and the edge of the third protective layer is less than the allowable range of process error, and it can be regarded that the orthographic projection of the second protective layer on the flexible substrate substrate and the orthographic projection of the third protective layer on the flexible substrate substrate coincide with each other.

[0106] It should be noted that FIG2 is an example of three connecting leads passing through the bridge area. In a specific implementation, the number of connecting leads passing through the bridge area needs to be set according to the specific structure of the driving unit.

[0107] In some embodiments, as shown in FIG1 , the display panel further includes:

[0108] A plurality of light emitting devices 6 are located in the island region on a side of the driving circuit layer 3 facing away from the flexible substrate 2 .

[0109] In some embodiments, as shown in FIG1 , the light emitting device 6 is a micro-sized inorganic light emitting diode device 61 , which is bonded to the driving circuit layer 3 in the island region 11 and on the side of the driving circuit layer 3 facing away from the flexible substrate 2 .

[0110] In a specific implementation, micro-sized inorganic light-emitting diodes are, for example, mini light-emitting diodes (Mini-LEDs) or micro light-emitting diodes (Micro-LEDs). Mini-LEDs and Micro-LEDs are small in size and high in brightness, and can be widely used in display devices or their backlight modules. For example, the typical size (e.g., length) of a Micro-LED is less than 100 microns, such as 10 to 80 microns; the typical size (e.g., length) of a Mini-LED is 80 to 350 microns, such as 80 to 120 microns.

[0111] Of course, in a specific implementation, the light emitting device may also be an organic light emitting diode device.

[0112] In a specific implementation, as shown in FIG1 , the display panel further includes a silicon-based filling layer 8 located on a side of the driving circuit layer 3 facing away from the flexible substrate 2 .

[0113] It should be noted that, in a specific embodiment, as shown in FIG3 , the display panel includes a display area 4 and a peripheral area 5 surrounding the display area 4, and the stretchable substrate 1 of the display area 4 and the peripheral area 5 both include an island area 11, a bridge area 12, and a blank area 13. In the display area 4, the driving unit is a display driving unit, and the display driving unit includes, for example, a thin film transistor and a capacitor. The island area 11 includes a plurality of pixels (not shown), each pixel includes a plurality of sub-pixels, and each sub-pixel includes a display driving unit. In the peripheral area 5, the driving unit is a peripheral driving unit, for example, the periphery includes a gate driving circuit, the gate driving circuit includes a plurality of cascaded peripheral driving units, the peripheral driving unit may also include a thin film transistor and a capacitor, and the peripheral driving unit may be arranged in at least one island area 11 in the peripheral area. FIG1 may, for example, be a cross-sectional view along AA' in FIG3 , and FIG2 may, for example, be a cross-sectional view along BB' in FIG3 . The driving unit shown in FIG1 is a display driving unit.

[0114] In a specific implementation, as shown in FIG1 , the display panel further includes a buffer layer 7 located between the driving circuit layer 3 and the flexible substrate 2; the driving circuit layer specifically includes: a first conductive layer 3-1, a first gate insulating layer 36, an active layer 3111, a second gate insulating layer 37, a second conductive layer 3-2, an interlayer insulating layer 38, a third conductive layer 3-3, which are sequentially arranged between the buffer layer 7 and the first protective layer 33; and a fourth conductive layer 3-4 located between the second protective layer 34 and the third protective layer 35; wherein the first conductive layer 3-1 includes: a first gate electrode G1 of the thin film transistor 311 and The first connection portion 3-1-1; the second conductive layer 3-2 includes: the second gate G2 of the thin film transistor 311, the second connection portion 3-2-1, and the third connection portion 3-2-2; the third conductive layer includes 3-3: the source S and drain D of the thin film transistor 311, the fourth connection portion 3-3-1 electrically connected to the connection lead 32, the fifth connection portion 3-3-2, the sixth connection portion 3-3-3, and the seventh connection portion 3-3-4; the fourth conductive layer 3-4 includes: the connection lead 32, the eighth connection portion 3-4-1, the ninth connection portion 3-4-2, and the tenth connection portion 3-4-3. That is, the thin film transistor of the embodiment of the present disclosure is a dual-gate thin film transistor. Of course, the thin film transistor can also be a thin film transistor with other structures such as top gate or bottom gate.

[0115] In a specific implementation, as shown in FIG1 , the connecting lead 32 is electrically connected to the fourth connecting portion 3-3-1 through a via penetrating the second protective layer 34 and the first protective layer 33, and the fourth connecting portion 3-3-1 is electrically connected to the driving unit 31 (the specific connection point is not shown), thereby realizing the electrical connection between the connecting lead 32 and the driving unit 31; the tenth connecting portion 3-4-3 is electrically connected to the drain D through a via penetrating the second protective layer 34 and the first protective layer 33, the third protective layer 35 exposes a partial area of ​​the tenth connecting portion 3-4-3, and one of the binding ends of the micro-size inorganic light-emitting diode device 61 is bound to the tenth connecting portion 3-4-3; the ninth connecting portion 3-4-2 is electrically connected to the sixth connecting portion 3-3-3 through a via penetrating the second protective layer 34 and the first protective layer 33, and is electrically connected to the sixth connecting portion 3-3-3 through a via penetrating the insulating layer 38 and the third connecting portion 3-2-2, the third protective layer 35 exposes a partial area of ​​the ninth connecting portion 3-4-2, and the micro-size inorganic light-emitting diode device 61 is bound to the tenth connecting portion 3-4-3. One of the binding ends of the micro-sized inorganic light-emitting diode device 61 is electrically connected to the ninth connection part 3-4-2. In a specific implementation, for example, a low-level power signal (VSS) can be provided to the micro-sized inorganic light-emitting diode device 61 through the third connection part 3-2-2, the sixth connection part 3-3-3, and the ninth connection part 3-4-2; the eighth connection part 3-4-1 is electrically connected to the fifth connection part 3-3-2 through a via hole penetrating the second protective layer 34 and the first protective layer 33, the fifth connection part 3-3-2 is electrically connected to the second connection part 3-2-1 through a via hole penetrating the interlayer insulating layer 38, and the fifth connection part 3-3-2 is electrically connected to the first connection part 3-1-1 through a via hole penetrating the interlayer insulating layer 38, the second gate insulating layer 37, and the first gate insulating layer 36. In a specific implementation, a high-level power signal (VDD) can be provided to the driving unit through the eighth connection part 3-4-1, the fifth connection part 3-3-2, the second connection part 3-2-1, and the first connection part 3-1-1.

[0116] 1 , the fourth conductive layer 3 - 4 includes a first sublayer 39 and a second sublayer 310 located on the side of the first sublayer 39 facing away from the flexible substrate 2 .

[0117] In some embodiments, in a direction perpendicular to the flexible substrate, the thickness of the fourth conductive layer is greater than or equal to 0.05 micrometers and less than or equal to 15 micrometers.

[0118] Therefore, the thickness of the fourth conductive layer is thicker, that is, the thickness of the connecting lead is thicker, which can reduce the resistance of the connecting lead and also prevent the connecting lead in the bridge area from being stretched and broken.

[0119] In a specific implementation, in a direction perpendicular to the flexible substrate, the thickness of the fourth conductive layer is preferably greater than or equal to 1 micron and less than or equal to 10 microns.

[0120] In a specific implementation, in Figure 1 , the fourth conductive layer 3-4 is formed using an electroplating process. The first sublayer 39 serves as a seed layer for the electroplating process, and the second sublayer 310 is grown on the seed layer. The second sublayer includes at least one element common to the first sublayer. For example, both the first and second sublayers include copper. In a direction perpendicular to the flexible substrate, in Figure 1 , the thickness of the second sublayer 310 is greater than the thickness of the first sublayer 39.

[0121] The display panel provided by the embodiment of the present disclosure adopts an electroplating process to form a fourth conductive layer having a relatively thick thickness, and the process is simple and easy to implement.

[0122] Of course, a deposition process can also be used to form the fourth conductive layer. For example, the first sublayer can be deposited first, followed by the second sublayer. For example, as shown in FIG4 , in the direction perpendicular to the flexible substrate and outside the vias, the thickness of the first sublayer 39 and the thickness of the second sublayer 310 are the same. This prevents the first and second sublayers from being too thick, reducing the difficulty of forming the fourth conductive layer through the deposition process.

[0123] Of course, the thicknesses of the first sub-layer and the second sub-layer formed by the deposition process may also be different.

[0124] In a specific implementation, the fourth conductive layer is formed by a deposition process, and the first sublayer and the second sublayer include the same material, or the first sublayer and the second sublayer include different materials.

[0125] In some embodiments, as shown in FIG5 , the display panel further includes:

[0126] The stretchable cover plate 102 is located on the side of the micro-sized inorganic light emitting diode device 6 facing away from the flexible substrate 2 .

[0127] In the display panel provided by the embodiment of the present disclosure, the cover plate covering the micro-sized inorganic light-emitting diode device is a stretchable cover plate, thereby preventing the cover plate from affecting the stretching effect of the display panel and improving the stretching rate of the display panel.

[0128] In a specific implementation, the material of the flexible substrate may be, for example, polyimide (PI); the material of the active layer may be, for example, low-temperature polysilicon or an oxide semiconductor; the first protective layer, the second protective layer, and the third protective layer may all be organic protective layers or inorganic protective layers, or may be a stack of organic and inorganic protective layers.

[0129] In some embodiments, as shown in FIG. 1 and FIG. 6 to FIG. 11 , the connecting lead 32 has at least one protrusion 321 facing toward the flexible substrate 2 and / or away from the flexible substrate 2 .

[0130] It should be noted that after the film layer provided on the flexible substrate is transferred to the stretchable substrate to which tension is applied, the applied tension is removed so that the stretchable substrate returns to an unstretched state, thereby reducing the size of the bridge area, so that the connecting lead is in a bent state and the bent connecting lead has at least one protrusion facing one side of the flexible substrate and / or facing away from the flexible substrate.

[0131] In some embodiments, as shown in Figures 1 and 6 , the connecting lead 32 has a protrusion 321, which faces toward or away from the flexible substrate 2. In Figure 1 , the protrusion 321 faces away from the flexible substrate 2, while in Figure 6 , the protrusion 321 faces toward the flexible substrate 2.

[0132] In some embodiments, as shown in FIG. 7 to FIG. 11 , the connecting lead 32 has a plurality of protrusions 321 .

[0133] In some embodiments, as shown in FIG7 , the multiple protrusions 321 are oriented in different directions. It should be noted that the oriented directions of the multiple protrusions are different: some of the protrusions are oriented toward the flexible substrate, while the remaining protrusions are oriented away from the flexible substrate. As shown in FIG7 , the connecting lead 32 has a protrusion 321 oriented toward the flexible substrate 2 and a protrusion 321 oriented away from the flexible substrate 2.

[0134] It should be noted that FIG7 illustrates an example in which the connecting lead 32 has two protrusions 321. In a specific implementation, the connecting lead may also have more protrusions.

[0135] In a specific implementation, after the flexible substrate and the film layer thereon are transferred to the stretchable base, the applied tension is removed to restore the stretchable base to an unstretched state, so that the connecting lead can be sunk toward the side of the flexible substrate or the connecting lead can be raised toward the side away from the flexible substrate, so that the connecting lead has a raised portion 321 as shown in Figure 6 or multiple raised portions 321 as shown in Figure 7.

[0136] In some embodiments, as shown in FIG8 to FIG11 , the extended profile of the raised portion 321 has a plurality of sub-raised portions 3211 , and the plurality of sub-raised portions 3211 are oriented in the same direction. It should be noted that the plurality of sub-raised portions 3211 being oriented in the same direction means that the plurality of sub-raised portions 3211 are all raised away from the side of the flexible substrate 2 , or the plurality of sub-raised portions 3211 are all raised toward the side of the flexible substrate 2 .

[0137] 9 and 11 , the connecting lead 32 includes a protrusion 321 facing the flexible substrate 2 ; as shown in FIG8 and 10 , the connecting lead 32 includes a protrusion 321 facing away from the flexible substrate 2 ;

[0138] As shown in Figures 8 and 9, the extended profile of the raised portion 321 of the connecting lead 32 has multiple sub-raised portions 3211 on the side facing away from the flexible substrate 2; as shown in Figures 10 and 11, the extended profile of the raised portion 321 of the connecting lead 32 has multiple sub-raised portions 3211 on the side facing the flexible substrate 2.

[0139] It should be noted that if the connecting lead includes a plurality of protrusions, for example, all sub-protrusions included in the plurality of protrusions have the same orientation, thereby simplifying the difficulty of preparing the sub-protrusions.

[0140] In a specific implementation, during the fabrication of the connecting leads, multiple protrusions can be formed facing away from the flexible substrate or toward the flexible substrate, thereby increasing the extension length of the connecting leads and thereby improving the stretchability of the connecting leads. Furthermore, after the flexible substrate and the film layer thereon are transferred to the stretchable base, the applied tension is removed, allowing the stretchable base to return to its unstretched state. This allows the connecting leads with the multiple protrusions to further sink toward the flexible substrate or protrude away from the flexible substrate, further increasing the stretchability of the connecting leads and thereby improving the stretchability of the display panel.

[0141] In some embodiments, as shown in FIG3 , the bridge region is in the shape of a bar, and the orthographic projection of the connecting lead on the bridge region is in the shape of a straight line.

[0142] Alternatively, in some embodiments, as shown in FIG. 12 , the orthographic projection of the connecting lead 32 on the bridge region 12 is in a curved shape.

[0143] In the display panel provided by the embodiment of the present disclosure, the shape of the positive projection of the connecting lead in the bridge area is curved rather than straight, which can further increase the extension length of the connecting lead, thereby increasing the stretching rate of the connecting lead, thereby improving the stretchability of the display panel.

[0144] It should be noted that FIG12 illustrates an example in which the curved shape of the orthographic projection of the connecting lead 32 on the bridge region 12 includes a single set of bending units 322. However, in specific implementations, the curved shape of the orthographic projection of the connecting lead 32 on the bridge region 12 may also include multiple sets of bending units 322. For example, the curved shape of the orthographic projection of the connecting lead on the bridge region may include 1 to 12 sets of bending units. In specific implementations, as shown in FIG12 , the bending units 322 have a first width l1 and a second width l2. The first width l1 is the width of the bending unit 322 perpendicular to the arrangement of the two island regions 11, and the second width l2 is the width of the bending unit 322 in the arrangement of the two island regions 11. The ratio l1:l2 is, for example, greater than or equal to 1:2 and less than or equal to 10:1. Alternatively, the first width l1 may be greater than the second width l2, i.e., the ratio l1:l2 is, for example, greater than 1:1 and less than or equal to 10:1.

[0145] In a specific implementation, regardless of the number of raised portions a connecting lead has, the orthographic projection of the connecting lead on the bridge region can be configured to be curved. When a connecting lead has multiple raised portions oriented in the same direction, the connecting lead is sunken toward the flexible substrate or raised away from the flexible substrate, and the orthographic projection of the connecting lead on the bridge region is curved, the extended length of the connecting lead can be increased in directions perpendicular to and parallel to the flexible substrate, thereby maximizing the stretchability of the display panel.

[0146] Based on the same inventive concept, an embodiment of the present disclosure further provides a method for manufacturing a display panel, as shown in FIG13 , comprising:

[0147] S101, providing a first substrate; wherein the first substrate comprises: a plurality of island regions arranged in an array, a plurality of bridge regions, and a blank region outside the island regions and the bridge regions; the bridge region connects two adjacent island regions;

[0148] S102, forming a flexible substrate on one side of the first substrate;

[0149] S103, forming a pattern of a driving circuit layer on a side of the flexible substrate facing away from the first base, and performing a patterning process on the flexible substrate to form hollow areas in the blank area and the bridge area; the driving circuit layer includes: a plurality of driving units and a plurality of connecting leads; the driving units are located in the island area, and the connecting leads pass through the bridge area and extend to the island area to be electrically connected to the driving units;

[0150] S104, peeling off the first substrate, and transferring the structure formed on one side of the first substrate to a stretchable substrate to which a tensile force is applied for stretching;

[0151] S105 , releasing the tension of the stretchable substrate, so that the stretchable substrate returns to an unstretched state; wherein, in the unstretched state of the stretchable substrate, at least a portion of the connecting lead sinks toward the side of the flexible substrate or the connecting lead protrudes toward a side away from the flexible substrate.

[0152] The method for preparing a display panel provided by an embodiment of the present disclosure removes the flexible substrate in the bridge area, and sets the connecting leads passing through the bridge area in a suspended state, which can avoid the low stretchability of the flexible substrate affecting the overall stretchability of the display panel. In addition, the film layer set on the flexible substrate is transferred to a stretchable substrate that applies tension, and then the stretchable substrate is restored to an unstretched state, which can reduce the size of the bridge area, so that at least part of the connecting lead sinks toward the side of the flexible substrate or the connecting lead bulges toward the side away from the flexible substrate, that is, the connecting lead is in a bent state. In this way, when the display panel is stretched, the connecting lead is stretched from a bent state to a straight extension state, which can improve the stretchability of the display panel compared to stretching the connecting lead from a straight extension state.

[0153] In a specific implementation, for example, a buckling induction process can be used to transfer the structure formed on one side of the first substrate to a stretchable substrate that is stretched by applying a tensile force.

[0154] In some embodiments, as shown in FIG. 14 a to FIG. 14 e , step S103 forms a pattern of the driving circuit layer 3 on the side of the flexible substrate 2 facing away from the first base and performs a patterning process on the flexible substrate 2 to form a hollow area 21 in the blank area 13 and the bridge area 12 ; specifically, the step S103 includes:

[0155] S1031, forming a pattern of a portion of the film layer included in the driving circuit layer 3 on the side of the flexible substrate 2 facing away from the first base 10, and performing a patterning process on the flexible substrate 2 to form a hollow area 21 in the blank area 13 and the bridge area 12;

[0156] S1032, forming a sacrificial layer 9 in the area corresponding to the hollow area 21;

[0157] S1033, forming a pattern of connecting leads 32 on the side of the sacrificial layer 9 facing away from the first substrate 10;

[0158] S1034 , removing the sacrificial layer 9 .

[0159] In some embodiments, as shown in FIG. 14 b , step S1032 forms a sacrificial layer 9 in the area corresponding to the hollow area 21 , specifically comprising:

[0160] A metal sacrificial layer 9 is formed in the area corresponding to the hollow area 21 by electroplating.

[0161] When the sacrificial layer is a metal sacrificial layer, in some embodiments, removing the sacrificial layer specifically includes:

[0162] The sacrificial layer is removed by wet etching process.

[0163] In some embodiments, as shown in FIG14 b , a metal sacrificial layer is formed in the area corresponding to the hollow region 21 by an electroplating process, specifically including:

[0164] S1032-1, forming a seed layer 91 covering a portion of the film layer of the driving circuit layer 3 and the hollow area 21;

[0165] S1032-2, forming a strippable electroplated retaining wall 93 covering the seed layer in the area outside the hollow area 21;

[0166] S1032-3, applying power to the seed layer 91 to grow an electroplated layer 92 in the hollow area 21, filling the area corresponding to the hollow area 21, and forming a metal sacrificial layer 9;

[0167] S1032-4, removing the strippable electroplated retaining wall 93;

[0168] S1032-5, remove the seed layer 91 outside the hollow area 21, and thin the metal sacrificial layer 9 so that the surface of the metal sacrificial layer 9 facing away from the first substrate 10 and the surface of part of the film layer of the driving circuit layer 3 facing away from the first substrate 10 are roughly located in the same plane.

[0169] It should be noted that since a peelable electroplating retaining wall covering the seed layer is formed in the area outside the hollow area, the seed layer is loaded with voltage for electroplating, and the electroplating layer only grows in the area outside the electroplating retaining wall, that is, only grows in the hollow area. By controlling the electroplating time, the electroplating layer can fill the area corresponding to the hollow area.

[0170] In specific implementation, the metal sacrificial layer can be thinned by adjusting the etching time so that the surface of the metal sacrificial layer facing away from the first substrate and the surface of part of the film layer of the driving circuit layer facing away from the first substrate are roughly in the same plane.

[0171] It should be noted that when the distance between the surface of the metal sacrificial layer facing away from the first substrate and the surface of the partial film layer of the driving circuit layer facing away from the first substrate is less than a preset value, the surface of the metal sacrificial layer facing away from the first substrate and the surface of the partial film layer of the driving circuit layer facing away from the first substrate can be regarded as being in the same plane.

[0172] In some embodiments, as shown in FIG. 14 a , step S1031 forms a pattern of a portion of the film layer included in the driving circuit layer 3 on the side of the flexible substrate 2 facing away from the first base, and performs a patterning process on the flexible substrate 2 to form a hollow area 21 in the blank area 13 and the bridge area 12 , specifically including:

[0173] S1031-1. Form patterns of various film layers of the thin film transistor 311 on the side of the flexible substrate 2 facing away from the first base 10. The patterns of various film layers of the thin film transistor 311 do not overlap with the blank area 13 and the bridge area 12.

[0174] S1031-2, forming a pattern of a first protective layer 33 on a side of each film layer of the thin film transistor 311 facing away from the first substrate 10; the pattern of the first protective layer 33 does not overlap with the blank area 13 and the bridge area 12;

[0175] S1031-3, performing a patterning process on the flexible substrate 2 using the pattern of the first protective layer 33 as a mask to form hollow areas 21 in the blank areas 13 and the bridge areas 12;

[0176] As shown in FIG. 14 c and FIG. 14 d , step S1033 forms a pattern of connecting leads 32 on the side of the sacrificial layer 9 facing away from the first substrate 10 , specifically comprising:

[0177] S1033-1, forming a pattern of a second protective layer 34 on a side of the sacrificial layer 9 facing away from the first substrate 10; the second protective layer 34 passes through the bridge area 12 and extends to the island area 11;

[0178] S1033-2, forming a pattern of connecting leads 32 on a side of the second protective layer 34 facing away from the first substrate 10;

[0179] S1033 - 3 , forming a third protection layer 35 on the side of the connection lead 32 away from the sacrificial layer 9 ; the third protection layer 35 passes through the bridge area 12 and extends to the island area 11 .

[0180] In some embodiments, as shown in FIG. 14 c and FIG. 14 d , step S1033 - 2 forms a pattern of connecting leads 32 on a side of the second protective layer 34 facing away from the first substrate 10 , specifically comprising:

[0181] S1033-2-1, forming a first sublayer 39 as an electroplating seed layer on a side of the second protective layer 34 facing away from the first substrate 10;

[0182] S1033-2-2, forming a pattern of a strippable electroplated retaining wall 93 covering a portion of the first sub-layer 39;

[0183] S1033-2-3, applying power to the first sub-layer 39 to grow the second sub-layer 310 in the area not covered by the pattern of the strippable electroplating retaining wall 93;

[0184] S1033-2-4, removing the strippable electroplated retaining wall 93;

[0185] S1033-2-5, removing the first sub-layer 39 in the region where the second sub-layer 310 is not grown, and forming a pattern of the fourth conductive layer 3-4 including the connecting lead 32.

[0186] It should be noted that the cross-sectional view of the bridge area and the blank area in the arrangement direction of the connecting leads is shown in FIG15 .

[0187] It should be noted that FIG14c and FIG14d are illustrative examples of forming the fourth conductive layer by electroplating. Alternatively, in some embodiments, step S1033-2 forms a pattern of connecting leads on the side of the second protective layer facing away from the first substrate 10, specifically including:

[0188] Depositing a first sublayer and a second sublayer in sequence on a side of the second protective layer facing away from the first substrate;

[0189] The second sub-layer and the first sub-layer are subjected to a patterning process to form a pattern of the fourth conductive layer.

[0190] In some embodiments, as shown in FIG. 14 e , after forming the third protection layer 35 on the side of the connecting lead 32 away from the sacrificial layer 9 , the following steps are specifically performed:

[0191] S1034, removing the sacrificial layer 9;

[0192] S1035 , performing a patterning process on the third protective layer 35 to form a pattern of the third protective layer 35 , exposing a portion of the fourth conductive layer 3 - 4 .

[0193] In some embodiments, as shown in FIG14 a , a pattern of each film layer of a thin film transistor 311 is formed on a side of the flexible substrate 2 facing away from the first base 10 , specifically including:

[0194] On the side of the flexible substrate 2 facing away from the first base 10, a buffer layer 7, a first conductive layer 3-1, a first gate insulating layer 36, an active layer 3111, a second gate insulating layer 37, a second conductive layer 3-2, an interlayer insulating layer 38, and a third conductive layer 3-3 are sequentially formed.

[0195] In some embodiments, as shown in FIG14e , after removing the sacrificial layer and before peeling off the first substrate, the method further includes:

[0196] S1036 , bonding the micro-sized inorganic light-emitting diode device 61 to the side of the driving circuit layer 3 facing away from the flexible substrate 2 , and filling it with silica gel 8 ;

[0197] S1037 , attaching a protective film 101 to the side of the micro-sized inorganic light emitting diode device 61 facing away from the flexible substrate 2 .

[0198] In a specific implementation, step S104 involves peeling off the first substrate and transferring the structure formed on one side of the first substrate to a stretchable substrate that is stretched by applying tension using a buckling induction process; and step S105 involves releasing the tension on the stretchable substrate, allowing the stretchable substrate to return to an unstretched state; wherein, in the unstretched state of the stretchable substrate, the connecting leads are in a bent state, as shown in FIG14f . In step S104, the width of the bridge region 12 is h1; after releasing the tension on the stretchable substrate in step S105, the width of the bridge region 12 is h2. The width of the island region is h3. For example, h1:h3 is within a range of 1:5 to 5:1, and h1-h2 is less than the total thickness of the display panel in a direction perpendicular to the stretchable substrate.

[0199] In some embodiments, after releasing the tension of the stretchable substrate so that the stretchable substrate returns to an unstretched state, the method further comprises:

[0200] Remove the protective film.

[0201] In some embodiments, after removing the protective film as shown in FIG14f , the method further includes:

[0202] S106 , attaching a stretchable cover plate 102 to the side of the micro-sized inorganic light emitting diode device 6 facing away from the flexible substrate 2 .

[0203] In some embodiments, as shown in FIG16 , after forming the sacrificial layer 9 in the area corresponding to the hollow region 21 and before forming the pattern of the connecting lead 32 on the side of the sacrificial layer 9 facing away from the first substrate 10 , the method further includes:

[0204] A plurality of spacer structures 102 are formed on the side of the sacrificial layer 9 away from the first substrate 10 ; the plurality of spacer structures 102 are arranged at intervals in the arrangement direction of two adjacent islands 11 ; and the surface of the spacer structure 102 away from the first substrate 10 is a curved surface.

[0205] In a specific implementation, in a direction perpendicular to the first substrate, the maximum thickness of the spacer structure is greater than the thickness of the connecting lead and less than the thickness of the micro-size inorganic light-emitting diode device; in the arrangement direction of multiple spacer structures, the width of the spacer structure is greater than the thickness of the connecting lead in a direction perpendicular to the first substrate.

[0206] In some embodiments, removing the sacrificial layer also includes:

[0207] Remove the spacer layer.

[0208] The method for preparing a display panel provided by an embodiment of the present disclosure forms multiple spacer structures on the side of the sacrificial layer facing away from the first substrate, and then forms a second protective layer, a connecting lead, and a third protective layer. The connecting lead thus formed has multiple sub-protrusions facing away from the side of the flexible substrate, which can increase the length of the connecting lead and thus increase the stretchability of the display panel.

[0209] In some embodiments, as shown in FIG17 , after forming the sacrificial layer 9 in the area corresponding to the hollow region 21 and before forming the pattern of the connecting lead 32 on the side of the sacrificial layer 9 facing away from the first substrate 10 , the method further includes:

[0210] A plurality of grooves 103 are formed on the side of the sacrificial layer 9 facing away from the first substrate 10 . The grooves 103 are arranged at intervals in the arrangement direction of two adjacent islands 11 . The surface of the grooves 103 facing the first substrate 10 is a curved surface.

[0211] The method for preparing a display panel provided by an embodiment of the present disclosure forms a plurality of grooves on the side of the sacrificial layer facing away from the first substrate, and then forms a second protective layer, a connecting lead, and a third protective layer. The connecting lead thus formed has a plurality of sub-protrusions facing the side of the flexible substrate, which can increase the length of the connecting lead and thus increase the stretchability of the display panel.

[0212] In a specific implementation, in a direction perpendicular to the first substrate, the maximum thickness of the groove is greater than the thickness of the connecting lead and less than the maximum thickness of the sacrificial layer; in the arrangement direction of multiple grooves, the width of the groove is greater than the thickness of the connecting lead in a direction perpendicular to the first substrate.

[0213] It should be noted that FIG. 14 a to FIG. 14 d illustrate an example in which the sacrificial layer includes a metal material formed by an electroplating process. Of course, the sacrificial layer may also include an organic material.

[0214] In some embodiments, as shown in FIG18 , forming a sacrificial layer in the area corresponding to the hollow area 21 specifically includes:

[0215] An organic material is filled in the area corresponding to the hollow region 21 to form an organic sacrificial layer 9 .

[0216] In a specific implementation, the organic material is, for example, phenolic resin, polyimide resin, etc.

[0217] In some embodiments, removing the sacrificial layer specifically includes:

[0218] The organic sacrificial layer is removed using a stripping process using a stripping solution.

[0219] It should be noted that when the sacrificial layer is an organic sacrificial layer, the process of forming a second protective layer, connecting leads, and a third protective layer on the organic sacrificial layer is the same as the process when the sacrificial layer includes metal materials, and the process of preparing the display panel after removing the organic sacrificial layer is the same as the process when the sacrificial layer includes metal materials, which will not be repeated here.

[0220] An embodiment of the present disclosure provides a display device, including the display panel provided by the embodiment of the present disclosure.

[0221] The display device provided in the embodiments of the present disclosure is any product or component with a display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigation system. Other essential components of the display device are well understood by those skilled in the art and are not described here in detail, nor should they be construed as limitations of the present disclosure. The implementation of the display device can be referenced to the above-described display panel embodiments, and any repetitive details will not be repeated.

[0222] In summary, the display panel, preparation method thereof, and display device provided by the embodiments of the present disclosure remove the flexible substrate in the bridge area, and the connecting leads passing through the bridge area are suspended. This can prevent the low stretchability of the flexible substrate from affecting the overall stretchability of the display panel. In addition, a stretchable base is provided on the flexible substrate away from the driving circuit layer. When the stretchable base is in a stretched state, the flexible substrate and the film layers on one side are transferred to the stretchable base. The stretchable base is then restored to an unstretched state. This can reduce the size of the bridge area, causing at least a portion of the connecting leads to sink toward one side of the flexible substrate or to bulge toward the side away from the flexible substrate, i.e., causing the connecting leads to be bent, thereby improving the stretchability of the display panel.

[0223] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0224] Obviously, those skilled in the art may make various changes and modifications to the embodiments of the present invention without departing from the spirit and scope of the embodiments of the present invention. Thus, if such changes and modifications of the embodiments of the present invention fall within the scope of the claims and their equivalents, the present invention is intended to include such changes and modifications.

Claims

1. A display panel, wherein: The display panel includes: A stretchable substrate comprising: a plurality of island regions arranged in an array, a plurality of bridge regions, and blank regions outside the island regions and the bridge regions; the bridge region connects two adjacent island regions; a flexible substrate, located on one side of the stretchable base, comprising: a hollow area corresponding to the bridge area and the blank area; The driving circuit layer is located on a side of the flexible substrate facing away from the stretchable substrate; it includes: a plurality of driving units and a plurality of connecting leads; the driving units are located in the island area, and the connecting leads pass through the bridge area and extend to the island area to be electrically connected to the driving units; when the stretchable substrate is not stretched, at least part of the connecting leads sinks toward the side of the flexible substrate or the connecting leads protrude toward the side facing away from the flexible substrate.

2. The display panel according to claim 1, wherein The connecting lead has at least one protrusion facing the flexible substrate and / or facing away from the flexible substrate.

3. The display panel according to claim 2, wherein: The connecting lead has a plurality of protrusions; the directions of the plurality of protrusions are not completely the same.

4. The display panel according to claim 2 or 3, wherein: The extended profile of the protrusion has a plurality of sub-protrusions, and the plurality of sub-protrusions are oriented in the same direction.

5. The display panel according to any one of claims 1 to 4, wherein: The orthographic projection of the connecting lead in the bridge area is in a curved shape.

6. The display panel according to any one of claims 1 to 5, wherein: The driving unit includes: a thin film transistor; The connecting lead is located on a side of the thin film transistor facing away from the flexible substrate; The driving circuit layer further includes: a first protective layer located between the connecting lead and the thin film transistor, a second protective layer located between the first protective layer and the connecting lead, and a third protective layer located on a side of the connecting lead away from the flexible substrate; The second protection layer and the third protection layer pass through the bridge area and extend to the island area; The orthographic projection of the connecting lead on the flexible substrate falls within the orthographic projection of the second protective layer on the flexible substrate, and the orthographic projection of the connecting lead on the flexible substrate falls within the orthographic projection of the third protective layer on the flexible substrate; The third protection layer covers the surface of the connecting lead facing away from the flexible substrate and the side surfaces of the connecting lead.

7. The display panel according to claim 6, wherein: In the bridge region, an orthographic projection of the second protection layer on the flexible substrate substantially overlaps with an orthographic projection of the third protection layer on the flexible substrate.

8. The display panel according to claim 6, wherein: The connecting lead comprises: a first sub-layer, and a second sub-layer located on a side of the first sub-layer facing away from the flexible substrate; In a direction perpendicular to the flexible substrate, the thickness of the second sub-layer is greater than the thickness of the first sub-layer.

9. The display panel according to any one of claims 1 to 8, wherein: The display panel further includes: A plurality of micro-sized inorganic light-emitting diode devices are bonded to the driving circuit layer in the island region and on a side of the driving circuit layer facing away from the flexible substrate; The stretchable cover is located on a side of the micro-sized inorganic light emitting diode device facing away from the flexible substrate.

10. A method for preparing a display panel, wherein: The method comprises: A first substrate is provided; comprising: a plurality of island areas arranged in an array, a plurality of bridge areas, and blank areas outside the island areas and the bridge areas; the bridge area connects two adjacent island areas; forming a flexible substrate on one side of the first base; A driving circuit layer pattern is formed on the side of the flexible substrate facing away from the first base, and the flexible substrate is patterned to form hollow areas in the blank area and the bridge area; the driving circuit layer includes: a plurality of driving units and a plurality of connecting leads; the driving units are located in the island area, and the connecting leads pass through the bridge area and extend to the island area to be electrically connected to the driving units; peeling off the first substrate, and transferring the structure formed on one side of the first substrate to a stretchable substrate that is stretched by applying a tensile force; The tension of the stretchable substrate is released so that the stretchable substrate returns to an unstretched state; wherein, in the unstretched state of the stretchable substrate, at least a portion of the connecting lead sinks toward a side of the flexible substrate or the connecting lead protrudes toward a side away from the flexible substrate.

11. The method according to claim 10, wherein: Forming a pattern of a driving circuit layer on a side of the flexible substrate facing away from the first base and performing a patterning process on the flexible substrate to form hollow areas in the blank area and the bridge area; specifically comprising: forming a pattern of a portion of a film layer included in a driving circuit layer on a side of the flexible substrate facing away from the first base, and performing a patterning process on the flexible substrate to form hollow areas in the blank area and the bridge area; forming a sacrificial layer in an area corresponding to the hollow area; forming a pattern of connecting leads on a side of the sacrificial layer facing away from the first substrate; The sacrificial layer is removed.

12. The method according to claim 10, wherein: Forming a sacrificial layer in a region corresponding to the hollow region specifically includes: forming a metal sacrificial layer in an area corresponding to the hollowed-out area by an electroplating process; Removing the sacrificial layer specifically includes: The sacrificial layer is removed by a wet etching process.

13. The method according to claim 12, wherein: The method further comprises forming a metal sacrificial layer in an area corresponding to the hollow area by an electroplating process, specifically comprising: forming a seed layer covering the portion of the film layer and the hollow area; forming a strippable electroplated retaining wall covering the seed layer in an area outside the hollow area; Applying electricity to the seed layer to grow an electroplated layer in the hollow area, filling the area corresponding to the hollow area to form a metal sacrificial layer; removing the strippable electroplated retaining wall; The seed layer outside the hollow area is removed, and the metal sacrificial layer is thinned so that the surface of the metal sacrificial layer facing away from the first substrate and the surface of the partial film layer facing away from the first substrate are approximately in the same plane.

14. The method according to claim 11, wherein Forming a sacrificial layer in a region corresponding to the hollow region specifically includes: Filling an area corresponding to the hollow area with an organic material to form an organic sacrificial layer; Removing the sacrificial layer, specifically including: The organic sacrificial layer is removed by a stripping process using a stripping solution.

15. The method according to any one of claims 11 to 14, wherein: After forming a sacrificial layer in a region corresponding to the hollow region and before forming a pattern of connecting leads on a side of the sacrificial layer facing away from the first substrate, the method further includes: A plurality of spacer structures are formed on a side of the sacrificial layer away from the first substrate; the plurality of spacer structures are arranged at intervals in the arrangement direction of two adjacent island regions; and the surface of the spacer structure away from the first substrate is a curved surface; Removing the sacrificial layer also includes: The spacer layer is removed.

16. The method according to any one of claims 11 to 15, wherein: Forming a pattern of a portion of a film layer included in the driving circuit layer on a side of the flexible substrate facing away from the first base, and performing a patterning process on the flexible substrate to form a hollow area in the blank area and the bridge area, specifically comprising: forming patterns of various film layers of the thin film transistor on a side of the flexible substrate facing away from the first base; wherein the patterns of various film layers of the thin film transistor do not overlap with the blank area and the bridge area; forming a pattern of a first protective layer on a side of each film layer of the thin film transistor facing away from the first substrate; the pattern of the first protective layer does not overlap with the blank area and the bridge area; Performing a patterning process on the flexible substrate using the pattern of the first protective layer as a mask to form hollow areas in the blank area and the bridge area; Before forming a pattern of connecting leads on a side of the sacrificial layer facing away from the first substrate, the method further includes: forming a pattern of a second protective layer on a side of the sacrificial layer facing away from the first substrate; the second protective layer passes through the bridge area and extends to the island area; After forming a pattern of connecting leads on a side of the sacrificial layer facing away from the first substrate, the method further includes: A pattern of a third protection layer is formed on a side of the connecting lead away from the sacrificial layer; the third protection layer passes through the bridge area and extends to the island area.

17. The method according to claim 16, wherein After removing the sacrificial layer and before peeling off the first substrate, the method further includes: Binding a micro-sized inorganic light-emitting diode device on a side of the driving circuit layer facing away from the flexible substrate; affixing a protective film on the side of the micro-sized inorganic light-emitting diode device facing away from the flexible substrate; After releasing the tension of the stretchable substrate so that the stretchable substrate returns to an unstretched state, the method further comprises: The protective film is removed.

18. The method according to claim 17, wherein: After removing the protective film, it also includes: A stretchable cover is attached to the side of the micro-sized inorganic light emitting diode device facing away from the flexible substrate.

19. A display device, wherein: The display panel comprises the display panel according to any one of claims 1 to 9.

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