Gluing method and gluing equipment for sensor

Abstract

The invention relates to the technical field of sensor manufacturing, and discloses a sensor gluing method which comprises the following steps: uniformly coating glue on an adhesive tape; the sensor is moved, so that the gluing surface of the sensor is attached to the surface, attached with the glue, of the adhesive tape, and the sensor is attached to the glue through glue dipping; the sensor attached with the glue is moved to an extraction position, and the step of evenly coating the adhesive tape with the glue comprises the substeps that the adhesive tape is driven to move in the first direction; uniformly gluing at the upstream of the moving direction of the adhesive tape; the glue on the adhesive tape is stricken between the gluing position and the sensor glue dipping position, the adhesive tape is introduced to serve as an intermediate medium for glue transfer, the sensor obtains the glue through dipping, direct contact and pressure on the thin and brittle sensor are avoided, the risk that the sensor is broken or damaged in the gluing process is reduced, and the gluing quality of the thin and brittle sensor is improved. And the consistency and uniformity of the glue amount obtained by each sensor are ensured, and the product quality is improved.

Description

Technical Field

[0001] This application relates to the field of sensor manufacturing technology, specifically to a method and equipment for applying adhesive to a sensor. Background Technology

[0002] In the field of sensor manufacturing, the encapsulation or fixation of sensors (such as elastic wave sensors) typically requires the use of adhesives. With product iterations, sensor designs are becoming increasingly miniaturized and precise; for example, the thickness of second-generation elastic wave sensors has been significantly reduced to 0.45mm, and the material has changed from ceramic to copper sheets, which are more easily deformed and broken. This presents a significant challenge to traditional adhesive application processes.

[0003] Traditional adhesive application processes typically involve scraping and dispensing. In the scraping process, adhesive is first applied to the groove of the fixture, smoothed out, and then the sensor is placed inside before a cover plate is pressed in to adhere the sensor. This method has several drawbacks: First, cleaning residual adhesive from the fixture is extremely difficult, severely impacting production speed; furthermore, the cured adhesive can cause changes in the dimensions of the fixture groove, making it prone to being lifted and cracked by the cover plate when placing the sensor. Second, adhesive easily stains gloves, requiring frequent changes, increasing labor and material costs.

[0004] If the traditional automatic dispensing method is used, the amount of glue is controlled by controlling the opening and closing time of the dispensing valve. For glues with high viscosity that change over time, the amount of glue dispensed fluctuates greatly, requiring frequent manual intervention and verification. In addition, the dispensing needle directly applies force to the fragile sensor, which poses a very high risk of pressure damage. Summary of the Invention

[0005] In view of this, this application provides a method for applying adhesive to a sensor to solve the problem of applying adhesive to thin-walled, fragile sensors, avoid damage to the sensor during the adhesive application process, ensure uniform and stable adhesive application, and achieve fully automated production, significantly improving efficiency and yield.

[0006] In a first aspect, this application provides a method for applying adhesive to a sensor, comprising: uniformly coating adhesive onto an adhesive tape; Move the sensor so that the adhesive surface of the sensor is attached to the adhesive surface of the tape, so that the sensor can adhere to the adhesive by dipping it in the adhesive. Move the sensor with the glue attached to it to the extraction position.

[0007] Beneficial effects: By introducing adhesive tape as an intermediate medium for adhesive transfer, the sensor acquires adhesive through "dipping" rather than "being dispensed" or "being scraped." This method fundamentally avoids direct contact and pressure between the dispensing needle or scraper and the thin, fragile sensor, greatly reducing the risk of breakage or damage during adhesive application. Simultaneously, because the adhesive is first evenly coated onto the tape before being picked up by the sensor, the consistency and uniformity of the amount of adhesive obtained by each sensor are ensured, improving product quality.

[0008] In one alternative embodiment, the step of uniformly applying adhesive to the tape includes: The drive tape moves along the first direction; Apply adhesive evenly upstream in the direction of tape movement; Scrape the adhesive on the tape smooth between the adhesive application point and the sensor adhesive application point.

[0009] Beneficial effects: By moving the tape, applying glue, and smoothing the glue, the continuous process ensures that the glue layer on the tape surface is continuous, flat, and of uniform thickness when it reaches the glue application station. This allows the sensor to pick up a stable and consistent amount of glue, and the entire glue application surface of the sensor can be coated with glue, thus achieving high-precision glue application for the sensor.

[0010] In one optional embodiment, glue is uniformly applied upstream of the conveyor belt in the direction of belt movement using a glue dispensing module with a flat nozzle, the length direction of the flat nozzle being perpendicular to the direction of belt movement; the glue dispensing module includes a glue tube for storing glue and a push rod disposed within the glue tube for dispensing glue, and the uniform glue application step includes: The push rod is driven at a constant speed to move closer to the flat nozzle.

[0011] Beneficial effects: The flat nozzle's length direction is perpendicular to the tape's movement direction, allowing it to form a wide adhesive line on the tape in one go. This ensures that the tape is stably covered with adhesive at the position corresponding to the adhesive line, preventing the adhesive from concentrating in areas away from the dipping position during the adhesive application process, which would result in poor adhesive application and ensure wide coverage of the adhesive.

[0012] By using a hose and a constant-speed push rod, precise and stable control of the glue dispensing amount can be achieved. There will be no interruptions in the process of applying glue to the tape, and it is not affected by changes in glue viscosity, thus ensuring the uniformity of glue supply from the source.

[0013] In one optional embodiment, the conveyor belt is moved by a conveyor belt conveying device, which includes a take-up roller and a unwind roller. The two ends of the conveyor belt are respectively wound between the take-up roller and the unwind roller, and the conveyor belt is tensioned between them. Driven by the conveyor belt conveying device, the conveyor belt moves along a first direction on a transmission platform. The steps of driving the conveyor belt to move include: Drive the tape take-up roller to rotate.

[0014] Beneficial effects: The tape conveying method using tape take-up rollers and tape unwind rollers enables automated and continuous tape supply, ensuring that the tape can move stably in one direction, resulting in more uniform and consistent application of adhesive and scraping processes.

[0015] After each application of adhesive, the used tape segment can be removed by rotating the take-up roller at a certain angle, while a new, clean tape segment is conveyed to the coating and dipping station. This ensures that each application of adhesive is carried out on a clean tape surface, avoiding the impact of residual adhesive accumulation on the dipping effect, thereby achieving stable application of adhesive to sensors over a long period of time and in large quantities.

[0016] In one optional embodiment, the sensor is moved by a movable component, the lower end of which is provided with a suction nozzle. Prior to the step of moving the sensor, the following steps are included: Place the sensor in the initial position with the adhesive side facing down; The moving part is pressed down to make the nozzle adhere to and fix the sensor.

[0017] Beneficial effects: The sensor is held in place using a suction nozzle, a non-invasive, low-stress clamping method that is particularly suitable for thin, brittle, and easily damaged workpieces. By controlling the downward pressure of the moving part for suction, precise and reliable sensor gripping is achieved without applying clamping forces that could cause deformation or damage to the sensor, further ensuring the stability of adhesive application.

[0018] In one optional embodiment, the sensor is moved by a movable component, the lower end of which is provided with a suction nozzle, and the extraction position is located at an extraction platform. The extraction platform is provided with a suction module. After the step of moving the sensor with adhesive to the extraction position, the following steps are included: Activate the suction module of the extraction platform to adsorb and fix the sensor; The control unit moves upwards and separates from the sensor.

[0019] Beneficial effects: After adhesive application, the sensor transfer process is achieved through an extraction platform equipped with a suction module, enabling a smooth and reliable transfer of the sensor from the moving part to the platform. As the moving part moves upward, the suction of the extraction platform firmly holds the sensor, preventing it from being accidentally lifted or shifted in position, thus ensuring smooth transitions between processes and accurate product positioning.

[0020] Secondly, this application provides a glue application device for implementing the above method, the glue application device comprising: Base; The transmission platform is fixedly installed above the base; A tape conveyor, mounted on a base, is used to drive the tape to move along a first direction on a transmission platform; The glue application module, located on the base, is used to evenly apply glue to the tape upstream of the glue application station. A sensor moving device, located on the base, is used to move the sensor between its initial position, the adhesive application station on the transmission platform, and the extraction position.

[0021] Beneficial effects: This adhesive application equipment, through the coordinated operation of the transmission platform, tape conveyor, adhesive application module, and sensor moving device, efficiently and automatically realizes the tape transfer and adhesive application process for sensors. By integrating all key functions such as tape conveying, precise adhesive application, and sensor pick-and-place adhesive application, it achieves full-process automation from sensor loading to adhesive application completion. This results in high adhesive application efficiency, reduced risks associated with manual operations, and improved sensor production efficiency and product consistency.

[0022] In one optional embodiment, the tape conveying device includes a first drive member, a tape take-up roller, and a tape unwind roller. The first drive member is used to drive the tape take-up roller to rotate. The two ends of the tape are respectively wound between the tape take-up roller and the tape unwind roller. The tape is tensioned between the tape take-up roller and the tape unwind roller, and at least a portion of the tape between the tape take-up roller and the tape unwind roller is limited to the transmission platform.

[0023] Beneficial effects: The tape take-up roller and tape unwind roller constitute a stable roll-to-roll supply system, and the first drive component provides precise transmission control. Confining the tape to the transmission platform ensures that the tape remains flat and stable during the coating and dipping process, providing a platform for precise coating and uniform dipping, facilitating force application, and guaranteeing the stability of the coating process.

[0024] In one alternative embodiment, the tape conveying device further includes: Two first guide rollers are respectively located at both ends of the transmission platform along the first direction, and the conveyor belt passes over the top of the first guide rollers; The second guide roller is located between the unwinding roller and the adjacent first guide roller, and is located below the first guide roller. The conveyor belt passes under the second guide roller. The third guide roller is located between the belt take-up roller and the adjacent first guide roller, and is located below the first guide roller. The belt passes under the third guide roller.

[0025] Beneficial effects: By setting up multiple rollers and adopting a belt path that wraps around the belt from top to bottom, an effective tensioning and guiding system is formed. This layout can ensure that the belt maintains appropriate tension during transmission, preventing slack or wrinkling, while accurately guiding the movement trajectory of the belt so that it passes smoothly through the transmission platform, further improving the stability of the adhesive application equipment and the accuracy of the belt position.

[0026] In one optional embodiment, the glue application module includes a glue dispensing device, which includes a flat nozzle, a glue tube, a dispensing rod, and a second driving member. The length direction of the flat nozzle is perpendicular to the direction of movement of the tape. The glue tube is of equal thickness at the top and bottom and is used to store glue. The dispensing rod is located inside the glue tube and is used to push out the glue. The second driving member is used to drive the dispensing rod.

[0027] Beneficial effects: The combination of the hose and the push rod ensures precise glue application; the glue dispensing amount can be precisely controlled by adjusting the displacement of the push rod. The directional design of the flat nozzle ensures that the glue applied covers the entire target width of the tape in one pass. The second drive unit provides a precise and controllable power source for the push rod, thereby achieving quantitative and width-based glue application and ensuring product consistency after production.

[0028] In one optional embodiment, the adhesive application module further includes a scraper, and the transmission platform is provided with a mounting groove. The scraper is movably inserted into the mounting groove in the vertical direction and forms an equidistant gap with the upper surface of the transmission platform. The height of the gap is greater than the thickness of the adhesive tape, and the width of the gap is greater than the width of the adhesive tape.

[0029] Beneficial effects: The scraper ensures uniform glue application, and the equidistant gap between the scraper and the transmission platform surface acts as a "quantitative scraper." The height of the gap precisely controls the final glue thickness on the tape; the width of the gap, greater than the tape width, ensures the scraper can evenly apply glue across the entire tape width, preventing any omissions. The movable, pluggable design allows for easy adjustment or replacement of the scraper according to process requirements, accommodating different glue thicknesses while preventing glue solidification from affecting the scraping effect.

[0030] In one optional embodiment, the base includes two columns disposed on both sides of the transmission platform in the second direction and a crossbeam connected between the two columns, and the sensor moving device is movably disposed on the crossbeam in the second direction. The sensor moving device includes a third driving member, a fourth driving member, and a moving member. The third driving member is used to drive the sensor moving device to move along a second direction, the fourth driving member is used to drive the moving member to move up and down, and the lower end of the moving member is provided with a suction nozzle for adsorbing the sensor.

[0031] Beneficial effects: The frame structure of the beams and columns provides a stable support structure for the sensor moving device. The sensor moving device integrates two degrees of freedom of movement in the horizontal direction (second direction) and the vertical direction. Through the precise control of the third and fourth driving components, it can move the sensor quickly and accurately in three-dimensional space between the initial position, the adhesive application station, and the extraction position, thereby efficiently and reliably completing a series of complex actions such as picking up and placing the sensor and applying adhesive to the sensor.

[0032] In one alternative embodiment, the suction nozzles include multiple sets arranged side by side along a first direction, each set of suction nozzles being used to simultaneously adsorb and fix one sensor.

[0033] Beneficial effects: The scheme of using multiple sets of suction nozzles arranged in parallel enables the simultaneous operation of multiple sensors within a single motion cycle, i.e., a "multiple-pieces-per-single" parallel processing mode. This greatly increases the output per unit time of the adhesive application equipment, with production efficiency increasing exponentially compared to single-piece sequential processing. It is suitable for large-scale batch production scenarios. Each set of suction nozzles is used to simultaneously adsorb and fix one sensor, and multiple nozzles in a set can work together to fix the same sensor, ensuring the stability of the sensor fixation and preventing the sensor from falling due to the failure of one suction nozzle, thus ensuring the stable operation of the adhesive application process.

[0034] In one alternative embodiment, the transmission platform has an initial platform on one side in the second direction and an extraction platform on the other side.

[0035] Beneficial effects: The spatial separation of the initial platform and the extraction platform clearly distinguishes the loading and unloading areas, which facilitates the connection with the preceding and following processes, effectively avoids material confusion, and facilitates the full automation of the production line.

[0036] In one alternative implementation, the initial stage is movably disposed on the base and can move between a first position and a second position. When in the second position, the initial stage is close to the transmission platform, and the sensor on it is located in the initial position. Beneficial effects: The movable design of the initial platform allows it to switch between the "working position" and the "loading position that avoids the working position", which not only facilitates loading by operators or robots, but also enables the precise delivery of sensors to the designated position during operation.

[0037] In one alternative implementation, the extraction platform is equipped with a suction module.

[0038] Beneficial effects: The suction module ensures the stable fixation of the sensor on the extraction platform, preventing slippage or displacement during movement or handover, further improving the reliability and positioning accuracy of the dispensing equipment. At the same time, it provides a stable force for the separation of the sensor from the nozzle, ensuring that the sensor can be stably separated from the nozzle and fixed on the extraction platform.

[0039] In one alternative embodiment, the extraction platform is movably disposed on the base and can move between a third position and a fourth position. When in the third position, the extraction platform is close to the transmission platform, and the sensor on it is located at the extraction position. Beneficial effects: The movable design of the extraction platform allows it to switch between a "working position" and a "material unloading position that avoids the working position", which not only facilitates the unloading of materials by operators or robotic arms, but also enables the precise delivery of sensors to designated positions during operation.

[0040] In one alternative implementation, a suction module is provided on the initial platform.

[0041] Beneficial effects: The suction module ensures that the sensor is stably fixed on the initial platform, preventing slippage or displacement during movement or handover, and further improving the reliability and positioning accuracy of the dispensing equipment. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in the specific embodiments of this application or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0043] Figure 1 This is a schematic diagram of the structure of a glue application device according to an embodiment of this application; Figure 2 for Figure 1 A magnified view of a portion at point A; Figure 3 for Figure 2 A magnified view of the area at point B; Figure 4 This is a schematic diagram of the structure of a glue application device according to an embodiment of this application; Figure 5 This is a schematic diagram of the structure of a glue application device according to an embodiment of this application; Figure 6 This is a schematic diagram of the structure of a glue application device according to an embodiment of this application; Figure 7 for Figure 6 A magnified view of point C; Figure 8 for Figure 7 A magnified view of the area at point D; Figure 9 This is a schematic diagram of the structure of a glue application device according to an embodiment of this application; Figure 10 This is a schematic diagram of the structure of a glue application device according to an embodiment of this application; Figure 11 for Figure 10 A magnified view of the area at point E; Figure 12 This is a schematic diagram of the structure of a glue application device according to an embodiment of this application; Figure 13 This is a schematic diagram of the structure of a glue application device according to an embodiment of this application; Figure 14 for Figure 13 A magnified view of the area at point F; Figure 15 This is a partial structural schematic diagram of an adhesive application device according to an embodiment of this application; Figure 16 This is a partial structural schematic diagram of an adhesive application device according to an embodiment of this application; Figure 17 for Figure 16 A magnified view of the area at point G; Figure 18 This is a flowchart of the adhesive application method for the sensor according to an embodiment of this application; Figure 19 This is a flowchart of the adhesive application method for the sensor according to an embodiment of this application; Figure 20 This is a flowchart of the adhesive application method for the sensor according to an embodiment of this application; Figure 21 This is a flowchart of the adhesive application method for the sensor according to an embodiment of this application.

[0044] Explanation of reference numerals in the attached figures: 1. Base; 11. Column; 12. Horizontal beam; 2. Transmission platform; 21. Mounting groove; 3. Adhesive tape; 4. Belt conveying device; 41. Belt take-up roller; 411. First drive component; 42. Belt unwind roller; 43. First guide roller; 44. Second guide roller; 45. Third guide roller; 5. Glue application module; 51. Glue dispensing device; 511. Flat glue nozzle; 512. Glue tube; 513. Push rod; 514. First driving component; 52. Glue scraper; 6. Sensor moving device; 61. Third driving component; 62. Fourth driving component; 63. Moving component; 64. Nozzle; 7. Initial stage; 8. Extraction platform; 9. Sensor. Detailed Implementation

[0045] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0046] In the field of electronic adhesive application equipment manufacturing, the encapsulation or fixation of sensors 9, such as elastic wave sensors 9, typically requires the use of adhesives. With product iterations, the design of sensors 9 has become increasingly miniaturized and precise; for example, the thickness of second-generation elastic wave sensors has been significantly reduced to 0.45mm, and the material has changed from ceramic to copper sheets, which are more easily deformed and broken. This presents a significant challenge to traditional adhesive application processes.

[0047] The traditional adhesive application process typically includes scraping and dispensing. In the scraping process, adhesive is first applied to the groove of the fixture, smoothed out, and then the sensor 9 is placed in. Finally, a cover plate is used to press the sensor 9 together to adhere it. This method has many drawbacks: First, cleaning residual adhesive from the fixture is extremely difficult, severely impacting production cycle time. Furthermore, the cured adhesive can cause changes in the dimensions of the fixture groove, making it prone to being lifted and cracked by the cover plate when the sensor 9 is placed. Second, the adhesive easily stains gloves, requiring frequent changes, increasing labor and material costs.

[0048] If the traditional automatic dispensing method is used, the amount of glue is controlled by controlling the opening and closing time of the dispensing valve. For glues with high viscosity that change over time, the amount of glue dispensed fluctuates greatly, requiring frequent manual intervention and verification. In addition, the dispensing needle directly applies force to the fragile sensor 9, which poses a very high risk of pressure damage.

[0049] In order to solve the problems of the glue application methods in the related technologies, the technical solution of this application proposes a concept of obtaining glue by "dipping" to avoid direct contact and pressure on the thin and brittle sensor 9.

[0050] The cleaning system of this application can introduce "tape 3" as an intermediate medium for glue transfer, so that the sensor 9 can obtain glue by "dipping", avoiding direct contact and pressure on the thin and brittle sensor 9, reducing the risk of breakage or damage to the sensor 9 during glue application, and ensuring the consistency and uniformity of the amount of glue obtained by each sensor 9, thereby improving product quality.

[0051] The following is combined Figures 1 to 21 The following describes embodiments of the present invention.

[0052] like Figure 18As shown, according to an embodiment of the present invention, the present invention provides a method for applying adhesive to a sensor 9, comprising: S10, Apply glue evenly to tape 3; The adhesive is evenly applied to the tape 3 to form a uniform and consistent adhesive layer, which facilitates the subsequent pick-up of the sensor 9.

[0053] The tape 3 is used as an intermediate medium for adhesive transfer because it does not readily react with the adhesive, allowing the adhesive to easily detach from its structure and transfer to the sensor 9. Furthermore, the tape 3 is simple and readily available. To prevent adhesive from solidifying on the tape 3 after each application and affecting the subsequent application to the sensor 9, it can be replaced promptly after each application to ensure optimal adhesive application.

[0054] In some cases, structures such as glass plates can also be used as intermediate media for adhesive transfer.

[0055] S20, Move sensor 9 so that the adhesive surface of sensor 9 is attached to the adhesive surface of tape 3, so that sensor 9 is attached to adhesive by dipping in adhesive; By moving the sensor 9 instead of using the adhesive tape 3 coated with glue to achieve contact and adhesion between the sensor 9 and the adhesive-coated surface of the tape 3, the flow caused by the low viscosity of the glue in the early stage of application of the tape 3 can be avoided, thus ensuring the stability of the adhesive layer formed on the tape 3.

[0056] S30, move the sensor 9 with the glue attached to the extraction position; By introducing "adhesive tape 3" as an intermediate medium for adhesive transfer, the sensor 9 acquires adhesive through "dipping" rather than "being dispensed" or "being scraped." This method fundamentally avoids direct contact and pressure between the dispensing needle or scraper and the thin, fragile sensor 9, greatly reducing the risk of breakage or damage to the sensor 9 during adhesive application. Simultaneously, because the adhesive is first evenly coated onto the adhesive tape 3 before being picked up by the sensor 9, the consistency and uniformity of the amount of adhesive obtained by each sensor 9 are ensured, improving product quality.

[0057] like Figure 19 As shown, in some embodiments, the step of uniformly applying adhesive to tape 3 includes: S11, drive the tape 3 to move along the first direction; By moving the tape 3 in a first direction parallel to the horizontal plane, the tape 3 on the adhesive application station can be easily replaced, avoiding the glue that has solidified after being applied by the sensor 9 affecting the subsequent adhesive application of the sensor 9.

[0058] S12, apply adhesive evenly upstream of the moving direction of tape 3; As the tape 3 moves along a first direction parallel to the horizontal plane, glue is evenly applied upstream of the moving direction of the tape 3, thus forming a glue strip on the moving tape 3. The process of evenly applying glue makes the amount of glue uniform throughout the length of this glue strip.

[0059] S13, scrape the glue on the tape 3 between the glue application position and the glue application position of the sensor 9.

[0060] By continuously moving the tape 3, applying glue, and smoothing the glue, it is ensured that the glue layer on the surface of the tape 3 is continuous, flat, and of uniform thickness when it reaches the glue application station. This allows the sensor 9 to pick up a stable and consistent amount of glue, and the entire glue application surface of the sensor 9 can be glued, thus achieving high-precision glue application for the sensor 9.

[0061] In some embodiments, refer to Figure 12 - Figure 17 The glue is evenly applied upstream of the tape 3 by a glue delivery module with a flat nozzle 511. The length direction of the flat nozzle 511 is perpendicular to the moving direction of the tape 3. The flat nozzle 511 can form a wide glue line on the tape 3 at one time, ensuring that the glue is stably covered at the position corresponding to the glue line on the tape 3. This avoids the glue from concentrating in areas away from the dipping position due to the flow of glue during the application of glue to the tape 3, which would result in a poor dipping effect and ensure the width coverage of the glue application.

[0062] The glue delivery module includes a glue tube 512 for storing glue and a push rod 513 disposed inside the glue tube 512 for dispensing glue. By using the glue tube 512 and the constant speed push rod 513, the glue dispensing amount can be accurately and stably controlled. There will be no breakpoints during the glue coating process on the tape 3, and it is not affected by changes in glue viscosity, thus ensuring the uniformity of glue supply from the source.

[0063] The step of uniformly applying adhesive includes: driving the push rod 513 at a constant speed to move towards the flat nozzle 511.

[0064] Therefore, within the same time period, the amount of adhesive dispensed by the uniformly driven push rod 513 is the same, the distance that the tape 3 moves relative to the nozzle is the same, and a uniform adhesive line can be formed on the tape 3.

[0065] In some embodiments, refer to Figure 15The tape 3 is moved by a tape conveying device 4, which includes a tape take-up roller 41 and a tape unwind roller 42. The two ends of the tape 3 are wound between the tape take-up roller 41 and the tape unwind roller 42, respectively, and the tape 3 is tensioned between them. Driven by the tape conveying device 4, the tape 3 moves along a first direction on the transmission platform 2. This tape 3 conveying method, using the tape take-up roller 41 and tape unwind roller 42 in cooperation, achieves automated and continuous supply of the tape 3, ensuring that the tape 3 can move stably in one direction, making the application of glue and the scraping process more uniform. It also ensures the continuous cleanliness of the glue-dipping interface: after each glue-dipping process, by driving the take-up roller to rotate a fixed angle, the used tape 3 segment with residual glue can be promptly removed from the work area, while a brand new, clean tape 3 segment is precisely delivered to the glue application station and the glue-dipping station. This mechanism fundamentally avoids the accumulation of residual adhesive on the surface of tape 3, eliminating problems such as uneven adhesive application and foreign matter mixed in the adhesive layer caused by tape 3 contamination.

[0066] The steps for driving the tape 3 to move include: driving the tape take-up roller 41 to rotate. By driving the tape take-up roller 41, the automated and continuous supply of tape 3 is realized, ensuring the stability of large-scale production. Under the mechanism of automatically updating tape 3, the glue application equipment can carry out long-term, large-volume continuous operation without interruption or cleaning of solidified glue, which greatly improves production efficiency, effectively reduces the production capacity loss caused by maintenance downtime, and ensures the high stability and product yield of the entire glue application process.

[0067] Therefore, after each application of adhesive, the used tape 3 segments can be removed by rotating the take-up roller at a certain angle, while a new, clean tape 3 segments are conveyed to the coating and dipping station. This ensures that each application of adhesive is carried out on the clean tape 3 surface, avoiding the impact of residual adhesive accumulation on the dipping effect, thereby achieving stable application of adhesive to the sensor 9 over a long period of time and in large quantities.

[0068] In some embodiments, refer to Figure 1 , Figure 4 , Figure 5 , Figure 6 and Figure 12 The sensor 9 is moved by the moving part 63, the lower end of which is provided with a suction nozzle 64. The step of moving the sensor 9 includes the following: S21, Position sensor 9 with the adhesive side facing down in the initial position.

[0069] Throughout the entire adhesive application process, sensor 9 will always move with the adhesive surface facing down. Therefore, when moving part 63 moves sensor 9, it can control sensor 9 to move linearly without controlling its flipping.

[0070] S22, control the moving part 63 to press down, so that the nozzle 64 adsorbs and fixes the sensor 9.

[0071] The sensor 9 is held in place by suction nozzle 64, a non-invasive, low-stress clamping method that is particularly suitable for thin, brittle, and easily damaged workpieces. By controlling the downward suction of the moving part 63, the sensor 9 is accurately and reliably gripped without applying clamping force that could cause deformation or damage, further ensuring the stability of adhesive application.

[0072] In some embodiments, refer to Figure 1 , Figure 4 , Figure 5 , Figure 6 ,and Figure 12 The process involves moving the sensor 9 with adhesive residue via a movable component 63. The movable component 63 has a suction nozzle 64 at its lower end. The extraction position is located on the extraction platform 8, which is equipped with a suction module. Following this step, the process includes: S31, activate the suction module of the extraction platform 8 to adsorb and fix the sensor 9.

[0073] Therefore, the transfer process of sensor 9 after glue application is achieved by setting up an extraction platform 8 with a suction module, which can realize the smooth and reliable transfer of sensor 9 from moving part 63 to platform.

[0074] S32, control the moving part 63 to move upward and separate from the sensor 9.

[0075] When the moving part 63 moves upward, the suction of the extraction platform 8 can firmly fix the sensor 9, preventing it from being accidentally lifted or shifted in position with the moving part 63, thus ensuring smooth connection between processes and accurate positioning of the product.

[0076] Secondly, such as Figure 1 - Figure 17 As shown, this application provides a glue application device for implementing the above method.

[0077] The adhesive application equipment includes: a base 1, a transmission platform 2, a tape conveyor 4, an adhesive application module 5, and a sensor moving device 6.

[0078] The transmission platform 2, the tape conveyor 4, the glue application module 5, and the sensor moving device 6 are located on the base 1. The base 1 integrates multiple structures into one, ensuring that each structure can interact with each other and jointly perform its corresponding function.

[0079] The transmission platform 2 is fixedly installed above the base 1, and the tape conveying device 4 is installed on the base 1 to drive the tape 3 to move along the first direction on the transmission platform 2; the glue coating module 5 is used to uniformly coat the tape 3 with glue upstream of the glue dipping station; the sensor moving device 6 is used to move the sensor 9, so that the sensor 9 moves between the initial position, the glue dipping station on the transmission platform 2 and the extraction position.

[0080] During the operation of the adhesive application equipment, sensor 9 is placed in the initial position, and sensor moving device 6 moves to that position to adsorb and grab sensor 9.

[0081] At the same time, the tape conveyor 4 drives the tape 3 to move; the glue coating module 5 applies a quantitative amount of glue while the tape 3 is moving, and after passing through the glue scraping mechanism, it forms a glue layer of uniform thickness, and finally moves to the glue dipping station.

[0082] The sensor moving device 6 carries the sensor 9 to the glue application station above the transmission platform 2, and then controls the sensor 9 to press down so that its glue application surface contacts the uniform glue layer on the tape 3, thus completing the glue transfer and application.

[0083] After the adhesive is applied, the sensor moving device 6 lifts the sensor 9 and moves it to the extraction position, then releases the sensor 9, completing one work cycle.

[0084] Thus, through the coordinated operation of the aforementioned devices, this adhesive application equipment efficiently and automatically realizes the "tape 3 transfer" adhesive application process for sensor 9. By integrating all key functions such as automatic tape 3 conveying, precise adhesive coating and leveling, and precise sensor 9 picking, placing, and applying adhesive, the entire process from sensor 9 loading, positioning, adhesive application to unloading is fully automated. This not only frees operators from tedious and high-precision manual operations, reducing the intensity of manual labor and the risk of operational errors, but also significantly improves the production efficiency of sensor 9. Furthermore, due to the high repeatability and consistency of the process, it greatly ensures the uniformity and stability of the product quality after adhesive application.

[0085] like Figure 15 As shown, in some embodiments, the tape conveying device 4 includes a first drive member 514, a tape take-up roller 41, and a tape unwind roller 42. The first drive member 514 is used to drive the tape take-up roller 41 to rotate. The two ends of the tape 3 are respectively wound between the tape take-up roller 41 and the tape unwind roller 42. The tape 3 is tensioned between the tape take-up roller 41 and the tape unwind roller 42, and at least a portion of the tape 3 between the tape take-up roller 41 and the tape unwind roller 42 is limited to the transmission platform 2.

[0086] The tape 3 is conveyed by a combination of tape take-up roller 41 and tape unwind roller 42, achieving automated and continuous supply of tape 3. This ensures that tape 3 moves stably in one direction, resulting in more uniform and consistent glue application and scraping processes. It also ensures the continuous cleanliness of the glue application interface: after each glue application process, the used tape 3 segment with residual glue is promptly removed from the work area by driving the take-up roller to rotate at a fixed angle, while a brand new, clean tape 3 segment is precisely delivered to the glue application and glue application stations. This mechanism fundamentally avoids the accumulation of residual glue on the surface of tape 3, eliminating problems such as uneven glue application and foreign matter inclusions in the glue layer caused by tape 3 contamination.

[0087] The drive tape take-up roller 41 rotates to drive the tape 3 to move. By driving the tape take-up roller 41, the automated and continuous supply of tape 3 is realized, which ensures the stability of large-scale production. Under the mechanism of automatic tape 3 renewal, the glue application equipment can carry out long-term and large-scale continuous operation without interruption or cleaning of solidified glue, which greatly improves production efficiency, effectively reduces the production capacity loss caused by maintenance downtime, and ensures the high stability and product yield of the entire glue application process.

[0088] Therefore, after each application of adhesive, the used tape 3 segments can be removed by rotating the take-up roller at a certain angle, while a new, clean tape 3 segments are conveyed to the coating and dipping station. This ensures that each application of adhesive is carried out on the clean tape 3 surface, avoiding the impact of residual adhesive accumulation on the dipping effect, thereby achieving stable application of adhesive to the sensor 9 over a long period of time and in large quantities.

[0089] Thus, the tape take-up roller 41 and the tape unwind roller 42 constitute a stable roll-to-roll supply system, and the first drive component 514 provides precise transmission control. By confining the tape 3 on the transmission platform 2, it ensures that the tape 3 remains flat and stable during the adhesive application and dipping process, providing a platform for precise adhesive application and uniform dipping, facilitating force application and ensuring the stability of the adhesive application process.

[0090] like Figure 15 As shown, in some embodiments, the tape conveying device 4 further includes a plurality of guide rollers disposed between the tape take-up roller 41 and the tape unwind roller 42. These include two first guide rollers 43, a second guide roller 44, and a third guide roller 45.

[0091] Two first rollers 43 are respectively located at both ends of the transmission platform 2 along the first direction. The conveyor belt 3 passes over the top of the first rollers 43. The two first rollers 43 can accurately guide the movement trajectory of the conveyor belt 3, so that it passes smoothly through the transmission platform 2, further improving the stability of the glue application equipment and the accuracy of the position of the conveyor belt 3.

[0092] The second guide roller 44 is located between the unwinding roller 42 and the adjacent first guide roller 43, and is below the first guide roller 43. The conveyor belt 3 passes under the second guide roller 44. The third guide roller 45 is located between the take-up roller 41 and the adjacent first guide roller 43, and is below the first guide roller 43. The conveyor belt 3 passes under the third guide roller 45. By setting the second guide roller 44 and the third guide roller 45 and adopting a wrap-around conveyor belt path, an effective tensioning and guiding system is formed. This layout can ensure that the conveyor belt 3 always maintains appropriate tension during the transmission process, preventing slack or wrinkling.

[0093] like Figure 12 - Figure 17 As shown, in some embodiments, the glue application module 5 includes a glue delivery device 51, which includes a flat nozzle 511, a glue tube 512, a push rod 513, and a second drive member. The length direction of the flat nozzle 511 is perpendicular to the moving direction of the tape 3. The glue tube 512 is of equal thickness at the top and bottom and is used to store glue. The push rod 513 is disposed inside the glue tube 512 for pushing out the glue. The second drive member is used to drive the push rod 513.

[0094] The glue dispensing module with a flat nozzle 511 applies glue evenly upstream of the tape 3 in the direction of movement. The length direction of the flat nozzle 511 is perpendicular to the direction of movement of the tape 3. The flat nozzle 511 can form a wide glue line on the tape 3 in one go, ensuring that the tape 3 is stably covered with glue at the position corresponding to the glue line. This avoids the glue from concentrating in areas away from the dipping position due to the flow of glue during the application of glue to the tape 3, which would result in poor glue application and ensure the width coverage of the glue application.

[0095] The glue dispensing module includes a glue tube 512 for storing glue and a push rod 513 disposed inside the glue tube 512 for dispensing glue. By using the glue tube 512 and the constant speed push rod 513, the glue dispensing amount can be accurately and stably controlled. There will be no breakpoints during the glue coating process on the tape 3, and it is not affected by changes in glue viscosity, thus ensuring the uniformity of glue supply from the source.

[0096] By driving the push rod 513 at a constant speed to move closer to the flat nozzle 511, adhesive is applied evenly. Thus, within the same time frame, the push rod 513 dispenses the same amount of adhesive, and the tape 3 moves the same distance relative to the nozzle, resulting in a uniform adhesive line on the tape 3.

[0097] In some embodiments, the tube 512 has the same diameter at the top and bottom to ensure that the amount of adhesive dispensed is the same when the push rod 513 is pushed the same distance.

[0098] In summary, the adhesive tube 512, in conjunction with the push rod 513, ensures precise adhesive application. By controlling the displacement of the push rod 513, the amount of adhesive dispensed can be precisely controlled. The directional design of the flat nozzle 511 ensures that the applied adhesive can cover the entire target width of the tape 3 in one pass. The second drive component provides a precise and controllable power source for the push rod 513, thereby achieving quantitative and width-controlled adhesive application and ensuring product consistency after production.

[0099] like Figure 7 and Figure 8 As shown, in some embodiments, the glue application module 5 further includes a scraper 52. The transmission platform 2 is provided with an installation groove 21. The scraper 52 is movably inserted into the installation groove 21 in the vertical direction and forms an equidistant gap with the upper surface of the transmission platform 2. The height of the gap is greater than the thickness of the tape 3, and the width of the gap is greater than the width of the tape 3.

[0100] The scraper 52 ensures uniform glue application. The equidistant gap between the scraper 52 and the surface of the transmission platform 2 forms a "quantitative scraper." The height of the gap precisely controls the final thickness of the glue layer on the tape 3; the width of the gap, being greater than the width of the tape 3, ensures that the scraper 52 can evenly apply glue across the entire width of the tape 3, preventing any omissions. The movable, pluggable design allows for easy adjustment or replacement of the scraper 52 according to process requirements, accommodating different glue layer thicknesses while preventing glue solidification from affecting the scraping effect.

[0101] like Figure 1 , Figure 4 , Figure 5 , Figure 6 ,and Figure 12 As shown, in some embodiments, the base 1 includes two columns 11 disposed on both sides of the transmission platform 2 in the second direction and a crossbeam 12 connected between the two columns 11. The sensor moving device 6 is movably disposed on the crossbeam 12 in the second direction. The frame structure of the crossbeam 12 and the columns 11 provides a stable support structure for the sensor moving device 6, and the sensor moving device 6 is movably disposed on the crossbeam 12 in the second direction.

[0102] The sensor moving device 6 includes a third driving member 61, which is used to drive the sensor moving device 6 to move along the second direction. Thus, by driving the sensor moving device 6, which is connected to the sensor 9, to move along the second direction on the crossbeam 12 through the third driving member 61, the sensor 9 can be driven to move along the second direction.

[0103] The sensor moving device 6 also includes a fourth driving member 62 and a moving member 63. The fourth driving member 62 is used to drive the moving member 63 to move up and down. The lower end of the moving member 63 is provided with a suction nozzle 64 for adsorbing the sensor 9.

[0104] The moving part 63 is detachably and fixedly connected to the sensor 9 via the suction nozzle 64. The sensor 9 is picked up and placed using the suction nozzle 64 for adsorption and fixation, which is a non-invasive, low-stress clamping method, especially suitable for thin, brittle, and easily damaged workpieces. By controlling the downward pressure of the moving part 63 for adsorption, the sensor 9 is accurately and reliably gripped without applying clamping force that could cause deformation or damage to the sensor 9, further ensuring the stability of adhesive application.

[0105] The fourth driving member 62 is used to drive the moving member 63 to move up and down. Thus, by driving the moving member 63 connected to the sensor 9 to move up and down through the fourth driving member 62, the sensor 9 can be driven to move up and down.

[0106] Thus, the sensor moving device 6 integrates two degrees of freedom of movement in the horizontal direction (the second direction) and the vertical direction. Through the precise control of the third driving component 61 and the fourth driving component 62, the sensor 9 can be moved quickly and accurately in three-dimensional space between the initial position, the glue application station and the extraction position, thereby efficiently and reliably completing a series of complex actions such as picking up and placing the sensor 9 and applying glue to the sensor 9.

[0107] like Figure 2 and Figure 3 As shown, in some embodiments, the suction nozzle 64 includes multiple groups arranged side by side along a first direction, each group of suction nozzles 64 being used to simultaneously adsorb and fix one sensor 9.

[0108] By employing a scheme of multiple sets of suction nozzles 64 arranged in parallel, multiple sensors 9 can be processed simultaneously within a single motion cycle, achieving a "multiple-pieces-per-single" parallel processing mode. This significantly increases the output per unit time of the adhesive application equipment, with production efficiency increasing exponentially compared to sequential single-piece processing. It is suitable for large-scale batch production scenarios. Each set of suction nozzles 64 is used to simultaneously adsorb and fix one sensor 9. Multiple nozzles 64 within a set can work together to fix the same sensor 9, ensuring the stability of the sensor 9 and preventing it from falling due to the failure of one suction nozzle 64, thus ensuring a stable adhesive application process.

[0109] like Figure 1 , Figure 4 , Figure 5 , Figure 9 , Figure 10 , Figure 11 and Figure 12 As shown, in some embodiments, the transmission platform 2 has an initial platform 7 on one side in the second direction and an extraction platform 8 on the other side.

[0110] The spatial separation of the initial platform 7 and the extraction platform 8 clearly distinguishes the loading and unloading areas, facilitating connection with the preceding and following processes, effectively preventing material confusion, and enabling fully automated flow of the production line.

[0111] like Figure 1 , Figure 4 , Figure 5 , Figure 9 , Figure 10 , Figure 11 and Figure 12 As shown, the initial platform 7 is movably set on the base 1 and can move between the first position and the second position. When it is in the second position, the initial platform 7 is close to the transmission platform 2, and the sensor 9 on it is located in the initial position. Through the movable design of the initial platform 7, it is possible to switch between the "working position" and the "loading position that avoids the working position", which not only facilitates the loading of materials by the operator or robot, but also accurately delivers the sensor 9 to the designated position during operation.

[0112] In one optional embodiment, the extraction platform 8 is provided with a suction module. The suction module ensures that the sensor 9 is stably fixed on the extraction platform 8, preventing slippage or displacement during movement or handover, thereby further improving the reliability and positioning accuracy of the dispensing equipment. At the same time, it provides a stable force for the separation of the sensor 9 from the nozzle 64, ensuring that the sensor 9 can be stably separated from the nozzle 64 and fixed on the extraction platform 8.

[0113] like Figure 1 , Figure 4 , Figure 5 , Figure 9 , Figure 10 , Figure 11 and Figure 12 As shown, the extraction platform 8 is movably set on the base 1 and can move between the third position and the fourth position. When it is in the third position, the extraction platform 8 is close to the transmission platform 2, and the sensor 9 on it is located in the extraction position. Through the movable design of the extraction platform 8, it can switch between the "working position" and the "material unloading position of the avoidance working position", which not only facilitates the unloading of materials by the operator or robot, but also accurately sends the sensor 9 to the designated position during operation.

[0114] In one optional implementation, a suction module is provided on the initial platform 7. The suction module ensures that the sensor 9 is stably fixed on the initial platform 7, preventing slippage or displacement during movement or handover, and further improving the reliability and positioning accuracy of the dispensing equipment.

[0115] The following is combined Figures 1 to 21 This describes an embodiment of the present application.

[0116] The sensor 9 adhesive application equipment includes a base 1, which provides support for the entire adhesive application equipment. A transmission platform 2 is fixedly mounted above the base 1. A tape conveyor 4 is mounted on the base 1 and is used to drive the tape 3 along a first direction (e.g., ...) on the transmission platform 2. Figure 1 The conveyor belt moves at a constant speed in the direction shown (A). The conveyor belt device 4 includes a tape take-up roller 41 and a tape unwind roller 42 driven by a first drive member 514, as well as two first guide rollers 43, a second guide roller 44 and a third guide roller 45 for tensioning and guiding.

[0117] The glue application module 5 is mounted on the base 1, located upstream of the glue application station. It includes a glue delivery device 51 and a scraper 52. The glue delivery device 51 has a flat nozzle 511 whose length direction is perpendicular to the moving direction of the tape 3, a glue tube 512, a push rod 513 placed inside the glue tube 512, and a second drive component for driving the push rod 513. A mounting groove 21 is formed on the transmission platform 2. The scraper 52 is vertically mounted in the mounting groove 21 by insertion, and its height is adjustable, thus forming an equidistant gap between its lower edge and the upper surface of the transmission platform 2. The height of this gap is slightly greater than the thickness of the tape 3, and its width is greater than the width of the tape 3.

[0118] The base 1 includes a structure positioned in the second direction of the transmission platform 2 (e.g., ...). Figure 1 The sensor moving device 6 is movably mounted on the crossbeam 12 along the second direction (as shown in direction B). The sensor moving device 6 includes a third driving member 61 for driving its movement along the second direction, a fourth driving member 62 for driving the moving member 63 up and down, and the moving member 63 itself. The lower end of the moving member 63 is provided with multiple sets of suction nozzles 64 arranged side-by-side along the first direction, each set of nozzles 64 for adsorbing one sensor 9.

[0119] An initial platform 7 is provided on one side of the transmission platform 2 in the second direction, and an extraction platform 8 is provided on the other side. Both the initial platform 7 and the extraction platform 8 can move between positions close to and far from the transmission platform 2 via a slide rail mechanism. Suction modules are provided on both the initial platform 7 and the extraction platform 8.

[0120] The working process of this adhesive application equipment is as follows: The initial stage 7 is moved to a first position away from the transmission platform 2, and several sensors 9 with the adhesive surface facing down are placed on it. The suction module is then activated so that the sensors 9 are fixed by the suction module.

[0121] The initial stage 7 moves to a second position close to the transmission platform 2, on which several sensors 9 with their adhesive surfaces facing down are placed and fixed by the suction module. The extraction platform 8 also moves to a third position close to the transmission platform 2.

[0122] The sensor moving device 6 picks up the material and moves it above the initial platform 7. The fourth driving member 62 drives the moving member 63 to press down, so that the suction nozzle 64 contacts and adsorbs the sensor 9 to fix it. Then the moving member 63 moves up.

[0123] Simultaneously, the tape conveyor 4 drives the tape 3 to move. After the tape 3 moves, the glue propulsion device 51 operates, and the second driving component pushes the propulsion rod 513 at a uniform speed, squeezing the glue in the glue tube 512 through the flat glue nozzle 511 and applying it onto the moving tape 3. The applied glue passes under the scraper 52 and is scraped flat to form a uniform glue layer. The tape 3 with the glue layer finally stops at the glue dipping station.

[0124] The sensor moving device 6 carries the sensor 9 to the glue-dip station above the transmission platform 2. The fourth driving component 62 drives the moving component 63 to press down, so that the glue application surface of the sensor 9 contacts the glue layer on the tape 3, thus completing the glue application.

[0125] The sensor moving device 6 then carries the adhesive-coated sensor 9 to above the extraction platform 8 and presses down again to place the sensor 9 on the platform surface. At this time, the suction module of the extraction platform 8 is activated, adsorbing the sensor 9. Next, the moving part 63 moves upward, the suction nozzle 64 stops suctioning, and separates from the sensor 9.

[0126] The sensor moving device 6 returns to the initial platform 7 to prepare for the next material pick-up. The tape conveyor 4 starts, winding up the used tape 3 sections, and the new clean tape 3 sections are sent to the coating station to start the next cycle.

[0127] Therefore, this adhesive application equipment, through a non-contact "dipping" method, completely avoids direct force applied to the thin and brittle sensor 9 by the dispensing needle or scraper, fundamentally eliminating the risk of breakage during the adhesive application process and significantly improving product yield. Using adhesive tape 3 as an intermediate medium, combined with precise adhesive application and quantitative leveling processes, ensures a highly consistent amount of adhesive applied to each sensor 9, improving product performance and reliability. It achieves full automation from sensor 9 loading, adhesive application, dipping to unloading, and can realize parallel processing of "multiple parts per batch," resulting in high production efficiency and low labor costs. The adhesive tape 3 is disposable, eliminating the problem of residual adhesive cleaning from fixtures, maintaining a clean working environment, and reducing adhesive waste and auxiliary material consumption. This method and adhesive application equipment are particularly suitable for applying adhesive to thin, brittle, and easily damaged precision sensors 9, solving technical problems that traditional processes cannot handle.

[0128] Although embodiments of this application have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of this application, and such modifications and variations all fall within the scope defined by this application.

Claims

1. A sizing method for a sensor, characterized by, The method comprises the following steps: uniformly applying glue on the adhesive tape; moving the sensor so that the glue- applying surface of the sensor is attached to the surface of the adhesive tape where the glue is attached, so that the sensor is attached with glue by dipping; moving the sensor with glue to an extraction position; wherein the step of uniformly applying glue on the adhesive tape comprises: driving the adhesive tape to move in a first direction; uniformly applying glue upstream of the moving direction of the adhesive tape; scraping the glue on the adhesive tape between the glue applying position and the sensor dipping position.

2. The sizing method of a sensor according to claim 1, characterized by, The glue is uniformly applied upstream of the moving direction of the adhesive tape by a glue pushing module with a flat glue nozzle, the length direction of the flat glue nozzle is perpendicular to the moving direction of the adhesive tape; the glue pushing module comprises a glue pipe for storing the glue and a pushing rod in the glue pipe for pushing the glue; the step of uniformly applying glue comprises: driving the pushing rod to move at a constant speed towards the flat glue nozzle.

3. The method of sizing a sensor of claim 1, wherein, The movement of the adhesive tape is realized by an adhesive tape conveying device, the adhesive tape conveying device comprises an adhesive tape winding roller and an adhesive tape unwinding roller, the two ends of the adhesive tape are wound between the adhesive tape winding roller and the adhesive tape unwinding roller, the adhesive tape is tensioned between the adhesive tape winding roller and the adhesive tape unwinding roller, and under the driving of the adhesive tape conveying device, the adhesive tape moves on the transmission platform in a first direction; The step of driving the adhesive tape to move comprises: driving the adhesive tape winding roller to rotate.

4. The method of sizing a sensor of claim 1, wherein, The sensor is moved by a moving member, the lower end of the moving member is provided with a suction nozzle, and the step of moving the sensor comprises the following steps: arranging the sensor in an initial position with the glue- applying surface downward; controlling the moving member to press downward so that the suction nozzle adsorbs and fixes the sensor.

5. The method of sizing a sensor of claim 1, wherein, The sensor is moved by a moving member, the lower end of the moving member is provided with a suction nozzle, and the step of moving the sensor comprises the following steps: turning on the suction force module of the extraction platform to adsorb and fix the sensor; controlling the moving member to move upward and separate from the sensor.

6. A sizing apparatus for implementing the sizing method according to any one of claims 1 to 5, characterized in that The method comprises the following steps: a base; a transmission platform fixedly arranged above the base; an adhesive tape conveying device arranged on the base and used for driving the adhesive tape to move on the transmission platform in a first direction; a glue applying module arranged on the base and used for uniformly applying glue on the adhesive tape upstream of a dipping position; a sensor moving device arranged on the base and used for moving the sensor between an initial position, the dipping position on the transmission platform and an extraction position.

7. The sizing apparatus of claim 6, wherein The adhesive tape conveying device comprises a first driving member, an adhesive tape winding roller and an adhesive tape unwinding roller, the first driving member is used for driving the adhesive tape winding roller to rotate, the two ends of the adhesive tape are wound between the adhesive tape winding roller and the adhesive tape unwinding roller, the adhesive tape is tensioned between the adhesive tape winding roller and the adhesive tape unwinding roller, and at least a part of the adhesive tape between the adhesive tape winding roller and the adhesive tape unwinding roller is limited on the transmission platform.

8. The sizing apparatus of claim 7, wherein, The adhesive tape conveying device further comprises: Two first over rollers are respectively arranged at two ends of the transmission platform along the first direction, and the adhesive tape passes from the upper side of the first over rollers; A second over roller is arranged between the adhesive tape unwinding roller and the adjacent first over roller, and is located below the first over roller, and the adhesive tape passes from the lower side of the second over roller; A third over roller is arranged between the adhesive tape winding roller and the adjacent first over roller, and is located below the first over roller, and the adhesive tape passes from the lower side of the third over roller.

9. The sizing apparatus of claim 6, wherein, The glue coating module comprises a glue pushing device, the glue pushing device comprises a flat glue nozzle, a glue pipe, a pushing rod and a second driving member, the length direction of the flat glue nozzle is perpendicular to the moving direction of the adhesive tape, the glue pipe is equal in thickness and is used for storing glue, the pushing rod is arranged in the glue pipe for pushing out glue, and the second driving member is used for driving the pushing rod.

10. The sizing apparatus of claim 6, wherein, The glue coating module further comprises a glue scraping plate, the transmission platform is provided with a mounting groove, the glue scraping plate is movably inserted into the mounting groove in the vertical direction, and an equal gap is formed between the glue scraping plate and the upper surface of the transmission platform, the height of the gap is greater than the thickness of the adhesive tape, and the width of the gap is greater than the width of the adhesive tape.

11. The sizing apparatus of claim 6, wherein, The base comprises two vertical columns arranged on both sides of the transmission platform in the second direction and a cross beam connected between the two vertical columns, and the sensor moving device is movably arranged on the cross beam in the second direction; The sensor moving device comprises a third driving member, a fourth driving member and a moving member, the third driving member is used for driving the sensor moving device to move in the second direction, the fourth driving member is used for driving the moving member to move up and down, and the lower end of the moving member is provided with a suction nozzle for adsorbing the sensor.

12. The sizing apparatus of claim 11, wherein, The suction nozzle comprises a plurality of groups arranged side by side in the first direction, and each group of suction nozzles is used for simultaneously adsorbing a sensor.

13. The sizing apparatus of claim 6, wherein, One side of the transmission platform in the second direction is provided with an initial loading platform, and the other side is provided with an extraction platform.

14. The glue applying device according to claim 13, wherein, The initial loading platform is movably arranged on the base and can move between a first position and a second position, when in the second position, the initial loading platform is close to the transmission platform, and the sensor thereon is located in the initial position; And / or, the extraction platform is provided with a suction module; And / or, the extraction platform is movably arranged on the base and can move between a third position and a fourth position, when in the third position, the extraction platform is close to the transmission platform, and the sensor thereon is located in the extraction position; And / or, the initial loading platform is provided with a suction module.

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