Head-mounted display device

Abstract

The invention provides head-mounted display equipment. The head-mounted display equipment comprises a complete machine shell, a mainboard, a heat dissipation module and an optical module, wherein the mainboard, the heat dissipation module and the optical module are arranged in the complete machine shell; the heat dissipation module comprises a main support located between the mainboard and the optical module, and a rolling heat conduction structure arranged on the main support. The optical module is movably connected with the main support through the rolling heat conduction structure, and the mainboard and the optical module dissipate heat through the main support. According to the invention, effective heat dissipation of the movable optical module can be realized.

Description

Technical Field

[0001] This invention relates to the field of smart wearable technology, and more specifically, to a head-mounted display device. Background Technology

[0002] Virtual Reality (VR) primarily refers to the generation of a virtual environment using modern high-tech methods centered on computer technology. Users interact naturally with objects in the virtual world through special input / output devices, obtaining the same sensations as in the real world through sight, hearing, and touch. Augmented Reality (AR), on the other hand, simulates and overlays virtual information within the spatial range of the real world, enabling users to perceive sensory experiences that transcend reality. As such technologies continue to develop, the market for head-mounted display devices based on these technologies is becoming increasingly hot.

[0003] Currently, when users use VR / AR electronic products, the products themselves generate a certain amount of heat. If this heat cannot be dissipated in time, it will affect the failure rate of internal components, shorten the product's lifespan, and in severe cases, may even cause system failures and safety hazards. In addition, for electronic products with adjustable IPD, since the screen needs to be repositioned, it cannot be directly connected to the main bracket of the device. Therefore, screen heat dissipation is mainly achieved through forced convection, that is, the airflow of the cooling fan sweeps over the heat sink above the screen to dissipate heat.

[0004] However, convection cooling capacity is related to fan speed; higher speeds result in greater airflow, but also increased fan noise. As screen power consumption increases while the screen SPEC temperature remains constant, relying solely on convection cooling not only increases the fan load and its own heat generation but also increases device noise.

[0005] Therefore, how to effectively dissipate heat from mobile screens is a technical problem that urgently needs to be solved. Summary of the Invention

[0006] In view of the above problems, the purpose of this invention is to provide a head-mounted display device to solve the heat dissipation problem of mobile screens in existing devices.

[0007] The head-mounted display device provided by the present invention includes a housing, a motherboard disposed within the housing, a heat dissipation module, and an optical module; wherein, the heat dissipation module includes a main support located between the motherboard and the optical module, and a rolling heat conduction structure disposed on the main support; the optical module is movably connected to the main support through the rolling heat conduction structure, and the motherboard and the optical module dissipate heat through the main support.

[0008] In addition, an optional technical solution is that the optical module includes two screens with adjustable relative positions, and the rolling heat conduction structure includes a first rolling heat conduction structure and a second rolling heat conduction structure corresponding to the positions of the two screens respectively; a limiting slide rail is provided on the main bracket, and the first rolling heat conduction structure and the second rolling heat conduction structure are limited to move within the limiting slide rail.

[0009] Alternatively, an optional technical solution is to fill the space between the rolling heat-conducting structure and the screen at the corresponding position with a heat-conducting interface material; during the movement of the screen, the rolling heat-conducting structure is driven to move within the limiting slide rail by the heat-conducting interface material.

[0010] Alternatively, the optional technical solution is that the rolling heat conduction structure includes a sliding plate, a limiting hole through the sliding plate, and a ball bearing disposed in the limiting hole; the ball bearing is limited to rolling between the optical module and the main support.

[0011] Alternatively, a thermally conductive gel can be filled between the ball and the limiting hole.

[0012] Alternatively, the main support is a hollow structure with openings at both ends, and at least one fan module is provided inside the main support; wherein the fan module includes a fan fixed inside the main support and a heat sink provided at the air outlet of the fan.

[0013] Alternatively, an optional technical solution is to provide an air outlet and an air inlet at the upper and lower ends of the main housing, respectively; the main bracket is fixed inside the main housing, and the openings at both ends of the main bracket correspond to the positions of the air outlet and the air inlet, respectively.

[0014] Alternatively, an optional technical solution is to provide a heat-conducting component between the motherboard and the main bracket; wherein the heat-conducting component is a heat-conducting sheet or heat-conducting adhesive.

[0015] In addition, an optional technical solution is that the main support and the slide plate are made of at least one of aluminum, copper, iron, alloy and composite thermally conductive materials.

[0016] Alternatively, the optional technical solution is that the housing includes a rear housing and a front housing, and the motherboard is fixed to the rear housing.

[0017] Using the aforementioned head-mounted display device, and taking advantage of the movable nature of the optical module, a rolling heat conduction structure is installed between it and the main support. This rolling heat conduction structure ensures a sliding connection between the optical module and the main support, allowing the heat generated by the motherboard and the optical module to be dissipated through the main support without increasing the fan load, thus achieving a significant heat dissipation effect.

[0018] To achieve the foregoing and related objectives, one or more aspects of the invention include the features that will be described in detail below. The following description and accompanying drawings illustrate certain exemplary aspects of the invention. However, these aspects indicate only a few of the various ways in which the principles of the invention can be used. Furthermore, the invention is intended to encompass all such aspects and their equivalents. Attached Figure Description

[0019] Other objects and results of the invention will become more apparent and readily understood with reference to the following description taken in conjunction with the accompanying drawings. In the drawings:

[0020] Figure 1 An exploded view of a head-mounted display device according to an embodiment of the present invention;

[0021] Figure 2 This is a schematic diagram of the main support of a head-mounted display device according to an embodiment of the present invention;

[0022] Figure 3 This is an exploded view of the rolling heat-conducting structure according to an embodiment of the present invention;

[0023] Figure 4 This is an assembly diagram of the rolling heat conduction structure and the main support according to an embodiment of the present invention.

[0024] The reference numerals in the attached drawings include: optical module 1, thermal interface material 2, rolling thermal structure 3, slide plate 31, ball bearing 32, main bracket 4, motherboard 5, casing 6, air outlet 61, heat sink 71, fan 72, and limit rail 8.

[0025] In all the accompanying drawings, the same reference numerals indicate similar or corresponding features or functions. Detailed Implementation

[0026] In the following description, numerous specific details are set forth for illustrative purposes and to provide a thorough understanding of one or more embodiments. However, it will be apparent that these embodiments may also be implemented without these specific details. In other instances, well-known structures and devices are shown in block diagram form for ease of description of one or more embodiments.

[0027] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0028] It will be understood by those skilled in the art that, unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It should also be understood that terms such as those defined in general dictionaries should be understood to have the same meaning as in the context of the prior art, and should not be interpreted in an idealized or overly formal sense unless defined as herein.

[0029] To provide a detailed description of the head-mounted display device and its usage method according to the present invention, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0030] Figures 1 to 4 The overall exploded view and partial view of the head-mounted display device and heat dissipation module according to embodiments of the present invention are shown from different angles.

[0031] like Figures 1 to 4 As shown in the figure, the head-mounted display device of this invention includes: a housing 6, a motherboard 5 disposed within the housing 6, an optical module 1, and a heat dissipation module located between the motherboard 5 and the optical module 1; wherein, the heat dissipation module includes a main support 4 located between the motherboard 5 and the optical module 1, and a rolling heat conduction structure 3 disposed on the main support 4; the optical module 1 and the main support 4 are movably connected through the rolling heat conduction structure 3, and during the process of adjusting the PID of the optical module 1, the rolling heat conduction structure 3 can move synchronously with the optical module 1, thereby ensuring that the heat generated by the motherboard 5 and the optical module 1 is timely discharged through the main support 4, achieving an effective heat dissipation effect.

[0032] The optical module 1 typically includes two screens with adjustable relative positions. Correspondingly, the rolling heat conduction structure 3 includes a first rolling heat conduction structure and a second rolling heat conduction structure, which are respectively positioned corresponding to the two screens. The first rolling heat conduction structure moves synchronously with one screen, and the second rolling heat conduction structure moves synchronously with the other screen, thereby ensuring that the heat generated by each screen can be transferred out to the maximum extent. At the same time, a limiting slide rail 8 is provided on the main support 4, and the first and second rolling heat conduction structures are limited to move within the limiting slide rail 8. The heat generated by the screen is transferred to the main support 4 through the rolling heat conduction structure 3, and then rapidly dissipated through the main support 4.

[0033] Specifically, the main support 4 adopts a hollow structure with open ends at both the top and bottom. At least one fan module is set inside the main support 4. The fan module can be set according to the number of screens and the number of rolling heat conduction structures 3. The fan module further includes a fan 72 fixed inside the main support 4 and a heat sink 71 set at the air outlet of the fan 72. Two fan modules can be set according to the position of the screen. The size of the fan module should be as large as possible than the size of the rolling heat conduction structure 3 at the corresponding position to ensure that the rolling heat conduction structure 3 can always be located in the optimal heat dissipation area during the movement, thereby increasing the effective contact area during heat transfer and improving the heat dissipation capacity of the device.

[0034] In one specific embodiment of the present invention, the rolling heat conduction structure 3 includes a sliding plate 31, a limiting hole through the sliding plate 31, and a ball bearing 32 disposed in the limiting hole. Since the limiting hole is a through hole, after the ball bearing 32 is limited in the limiting hole, its two sides will protrude from the limiting hole, thereby generating a rolling contact effect with the structural component on the corresponding side. It can be seen that the opening size of the limiting hole needs to be smaller than the diameter of the ball bearing 32, so as to effectively limit it, so that the ball bearing 32 can roll between the optical module 1 and the main support 4. Specifically, the number or density of the ball bearing 32 can be flexibly adjusted according to the size of the optical module 1, and is not limited to the specific number shown in the figure.

[0035] In order to improve heat dissipation and reduce friction between the ball bearing 32 and the limiting hole, thermal conductive gel can be filled between the ball bearing 32 and the limiting hole. In addition, thermal conductive interface material 2 can be filled between the rolling thermal conductive structure 3 and the screen at the corresponding position. During the movement of the screen, the rolling thermal conductive structure 3 can be driven to move within the limiting slide rail 8 through the thermal conductive interface material 2.

[0036] It should be noted that, since the thermal interface material 2 has a certain degree of viscosity, it can be filled between the rolling thermal structure 3 and the frame of the fixed screen to make the rolling thermal structure 3 move synchronously with the screen; of course, the rolling thermal structure 3 can also be directly fixed to the frame of the fixed screen, and then the thermal interface material 2 can be filled between the two to improve the thermal conductivity and reduce friction.

[0037] Similarly, a heat-conducting component can be installed between the motherboard 5 and the main bracket 4; the heat-conducting component can be a heat-conducting sheet, heat-conducting adhesive, or heat-conducting interface material 2, etc., so as to realize heat conduction between the motherboard 5 and the main bracket 4.

[0038] In the head-mounted display device of the present invention, an air outlet 61 and an air inlet (not shown in the figure) can be respectively provided at the upper and lower ends of the housing 6, wherein the air outlet 61 is located at the upper end of the housing 6 and the air inlet is located at the lower end of the housing 6; the main bracket 4 is fixed inside the housing 6, and the openings at both ends of the main bracket 4 correspond to the positions of the air outlet 61 and the air inlet, respectively. When the main bracket 4 is sealed and connected to the housing 6, external liquid or water vapor can only pass through the interior of the main bracket 4 and cannot enter the motherboard 5 or the optical module 1, thereby achieving the effect of waterproofing and heat dissipation through the cooperation of the air inlet and the air outlet 61.

[0039] The housing 6 can further include a rear housing and a front housing. The motherboard 5 and the main bracket 4 are both fixed to the rear housing, and the air inlet and outlet 61 of the main bracket 4 are slightly higher than the housing 6. At the same time, the joint between the main bracket 4 and the housing 6 can be sealed. During the use of the head-mounted display device, the hot gas will rise, and the heat will be discharged through one side of the outlet 61. When liquid or water vapor passes through the main bracket 4, it can enter through the outlet 61 and flow out through the inlet. With the main bracket 4 sealed, the liquid will not only not enter the housing 6, but it can also further accelerate the heat transfer, ultimately achieving the waterproof heat dissipation effect of the head-mounted display device.

[0040] In the head-mounted display device of this invention, in order to improve the heat transfer effect, the main support 4, the slide plate 31 and the module housing can be made of at least one of aluminum, copper, iron, alloy and composite thermal conductive materials, thereby accelerating the heat transfer and diffusion.

[0041] According to the head-mounted display device of the present invention, based on the movable characteristic of the optical module, a rolling heat conduction structure is set between it and the main support. When each screen position moves, the corresponding rolling heat conduction structure can move synchronously, thereby realizing the sliding connection between the optical module and the main support through the rolling heat conduction structure. The heat generated by the motherboard and the optical module can be transferred to the main support in a timely manner, and then cooperate with the fan module in the main support for heat dissipation. The heat can be concentrated and then dissipated by the fan, reducing the fan voltage drop caused by system impedance. This not only reduces noise, but also achieves a significant heat dissipation effect.

[0042] The head-mounted display device according to the present invention has been described above by way of example with reference to the accompanying drawings. However, those skilled in the art should understand that various modifications can be made to the head-mounted display device proposed in the present invention without departing from the scope of the invention. Therefore, the scope of protection of the present invention should be determined by the contents of the appended claims.

Claims

1. A head-mounted display device, characterized in that, include: The main unit housing, the motherboard housed within the main unit housing, the heat dissipation module, and the optical module; wherein... The heat dissipation module includes a main bracket located between the motherboard and the optical module, and a rolling heat conduction structure disposed on the main bracket; The optical module and the main bracket are movably connected through the rolling heat conduction structure, and the motherboard and the optical module are cooled through the main bracket.

2. The head-mounted display device according to claim 1, characterized in that, The optical module includes two screens whose relative positions are adjustable, and the rolling heat conduction structure includes a first rolling heat conduction structure and a second rolling heat conduction structure that correspond to the positions of the two screens respectively. A limiting slide rail is provided on the main support, and the first rolling heat conduction structure and the second rolling heat conduction structure are limited to move within the limiting slide rail.

3. The head-mounted display device according to claim 2, characterized in that, A thermally conductive interface material is filled between the rolling heat-conducting structure and the screen at the corresponding position; During the movement of the screen, the rolling heat-conducting structure moves within the limiting slide rail via the heat-conducting interface material.

4. The head-mounted display device according to claim 1, characterized in that, The rolling heat conduction structure includes a sliding plate, a limiting hole that passes through the sliding plate, and a ball bearing disposed in the limiting hole; The ball bearing is limited to rolling between the optical module and the main support.

5. The head-mounted display device according to claim 4, characterized in that, Thermally conductive gel is filled between the ball and the limiting hole.

6. The head-mounted display device according to claim 1, characterized in that, The main support frame is a hollow structure open at both ends, and at least one fan module is installed inside the main support frame; wherein... The fan module includes a fan fixed inside the main bracket and a heat sink disposed at the air outlet of the fan.

7. The head-mounted display device according to claim 6, characterized in that, An air outlet and an air inlet are respectively provided at the upper and lower ends of the main body housing; The main bracket is fixed inside the housing of the unit, and the openings at both ends of the main bracket correspond to the positions of the air outlet and the air inlet, respectively.

8. The head-mounted display device according to claim 1, characterized in that, A heat-conducting component is provided between the motherboard and the main bracket; wherein, The heat-conducting component is a heat-conducting sheet or heat-conducting adhesive.

9. The head-mounted display device according to claim 4, characterized in that, The main support and the sliding plate are made of at least one of aluminum, copper, iron, alloys and composite thermally conductive materials.

10. The head-mounted display device according to claim 1, characterized in that, The housing includes a rear housing and a front housing, and the motherboard is fixed to the rear housing.

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