Integrated liquid cooling high-power LED optical module and control method thereof

Abstract

The invention discloses an integrated liquid-cooled high-power LED optical module and a control method thereof.The integrated liquid-cooled high-power LED optical module is provided with an LED packaging unit, a wiring unit and a temperature sensing unit, a heat dissipation assembly comprises a second substrate, a liquid-cooled circulating unit and multiple sets of heat dissipation fins, and the temperature sensing unit detects temperature signals of the LED packaging unit; the cooling liquid driving assembly is controlled to drive cooling liquid in the liquid cooling micro-flow pipe to exchange heat with the cooling fins and the first substrate, the LED packaging unit, the compound eye collimating lens and the cooling assembly are structurally fused, heat generated by the first substrate is effectively dissipated, the liquid cooling micro-flow pipe is arranged between the two sets of cooling fins, and the heat dissipation efficiency is improved. The cooling liquid driving assembly is arranged at the bottoms of the multiple sets of heat dissipation fins, heat dissipation paths of the heat dissipation fins and liquid cooling circulation heat dissipation are fully utilized, light rays emitted by the LED packaging unit are collimated, deflected or integrated through the compound eye collimating lens, the problems of heat dissipation and optical efficiency of a high-power-density LED are solved, and the product integration degree and the working stability are improved.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of semiconductor lighting, and particularly relates to an integrated liquid-cooled high-power LED optical module and a control method thereof. BACKGROUND

[0002] With the development of LED technology towards high power density, the heat generated is sharply increased. Poor heat dissipation has become the main bottleneck restricting the development of high-power LEDs, directly leading to a decrease in light efficiency, wavelength drift, shortened life, and even chip burnout. Traditional heat dissipation methods, such as adding fins to an aluminum substrate or air cooling, have been difficult to meet the heat dissipation needs of such LEDs with increasingly high power. In order to realize the lighting efficiency of high-power density LEDs, a high-efficiency optical system (such as a collimating lens) needs to be equipped to collect and utilize the light emitted thereby to achieve different beam angle requirements.

[0003] However, in the prior art, the packaging of the LED chip, the heat dissipation module, and the optical lens are usually three independent components designed and produced. Such a separate structure has the following inherent defects: (1) long heat dissipation path and low efficiency: heat is sequentially transferred from the LED chip through multiple interfaces such as the packaging substrate, the heat-conducting silicone grease, and the heat sink, resulting in a large thermal resistance and a high chip junction temperature; (2) complex structure and large volume: the three independent systems are stacked together, making the entire lamp structure bulky, which is not conducive to the miniaturization and lightweight design of the lamp, and also increases the complexity of the back-end application. Although liquid-cooled heat dissipation technology has been maturely applied in the field of AI chips, and compound eye lenses are known in the field of projection, there is no precedent for deep integration of these with the packaging and optics of high-power LEDs in the field of lighting. Therefore, there is an urgent need to provide an integrated liquid-cooled high-power LED optical module to solve the above technical problems. SUMMARY

[0004] Therefore, the present application provides an integrated liquid-cooled high-power LED optical module and a control method thereof, which highly integrates liquid-cooled heat dissipation, LED packaging units, and compound eye collimating optics, can solve the heat dissipation and optical efficiency problems of high-power density LEDs, and realizes the beneficial effects of a short heat dissipation path, high light efficiency, high integration, and stable performance. The following technical solutions are used to realize the beneficial effects.

[0005] In a first aspect, the present application provides an integrated liquid-cooled high-power LED optical module, comprising:

[0006] a mounting plate;

[0007] A first substrate is arranged on the upper surface of the mounting plate, and the first substrate comprises an LED packaging unit, a temperature sensing unit and a wiring unit. The wiring unit is arranged on one side of the first substrate, and the temperature sensing unit is located between the LED packaging unit and the wiring unit. The LED packaging unit is arranged at the center of the upper surface of the first substrate. The LED packaging unit and the temperature sensing unit are connected with the wiring unit.

[0008] An eye collimating lens is arranged above the LED packaging unit and connected with the first substrate. The eye collimating lens is used for receiving light emitted by the LED packaging unit and collimating, deflecting or integrating the light.

[0009] A heat dissipation assembly comprises a second substrate arranged on the lower surface of the mounting plate, a liquid cooling circulation unit and a plurality of heat dissipation fins. The top of the plurality of heat dissipation fins abuts against the lower surface of the second substrate. The liquid cooling circulation unit comprises a liquid cooling micro-flow pipe located between two groups of heat dissipation fins and a cooling liquid driving assembly arranged at the bottom of the plurality of heat dissipation fins. The liquid cooling micro-flow pipe extends from the lower surface of the second substrate to the bottom of the mounting plate.

[0010] The wiring unit is used for connecting a control unit. The control unit is used for receiving a temperature signal of the LED packaging unit detected by the temperature sensing unit and controlling the cooling liquid driving assembly to drive the cooling liquid in the liquid cooling micro-flow pipe to exchange heat with the heat dissipation fins and the first substrate according to the temperature signal.

[0011] As a preferred embodiment of the above technical solution, the heat dissipation assembly further comprises sealing frames and a fan. The sealing frames are arranged on both sides of the second substrate, and the fan is arranged on the surface of the plurality of heat dissipation fins between the two sealing frames. The sealing frames are attached to the side surface of the cooling liquid driving assembly along the length direction of the liquid cooling micro-flow pipe.

[0012] As a preferred embodiment of the above technical solution, the cooling liquid driving assembly comprises a micro-flow channel plate and a liquid box. The top of the micro-flow channel plate abuts against the bottom of the liquid cooling micro-flow pipe. The liquid box comprises a sealing plate, a support seat and a circulating pump. The sealing plate is arranged between the micro-flow channel plate and the support seat. The liquid box on both sides of the support seat is used for containing cooling liquid. The upper surface of the sealing plate is attached to the bottom of the micro-flow channel plate, and the lower surface of the sealing plate is used for sealing the liquid box.

[0013] As a preferred embodiment of the above technical solution, the sealing frame is provided with a limiting clamping plate at the end away from the second substrate. The limiting clamping plate extends to the side surface of the liquid box along the side surface of the micro-flow channel plate. First recovery grooves are arranged on both sides of the sealing plate, and each first recovery groove is respectively inserted with a liquid cooling micro-flow pipe.

[0014] As the preferred of the above technical solution, the microfluidic channel plate comprises a plurality of flow guide holes corresponding to the liquid-cooled microfluidic tubes.

[0015] As the preferred of the above technical solution, the sealing plate is provided with openings corresponding to the support seats, the support seats are provided with sealing covers and circulating pumps, and the sealing covers are arranged above the circulating pumps.

[0016] As the preferred of the above technical solution, the mounting plate is provided with a liquid outlet groove, a boss and a second recovery groove, the liquid outlet groove is arranged on the boss and parallel to the arrangement direction of the liquid-cooled microfluidic tubes, the boss is in abutment with the lower surface of the first substrate, and the second recovery groove is located on both sides of the boss and corresponds to the first recovery groove and is arranged at both ends of the liquid-cooled microfluidic tubes.

[0017] As the preferred of the above technical solution, the mounting plate further comprises heat dissipation holes arranged along the four peripheral edges of the mounting plate.

[0018] As the preferred of the above technical solution, the compound eye collimating lens comprises an aspheric main collimating mirror and a plurality of microlens arrays, the aspheric main collimating mirror is opposite to the light emitting center of the LED packaging unit and is used for receiving and collimating the light emitted by the LED packaging unit, and the plurality of microlens arrays are arranged around the aspheric main collimating mirror.

[0019] In the second aspect, the application further provides a control method of the integrated liquid-cooled high-power LED optical module, which is applied to the integrated liquid-cooled high-power LED optical module, and comprises the following steps:

[0020] When the temperature value corresponding to the temperature signal exceeds the first preset temperature, the fan is controlled to start;

[0021] When the temperature value corresponding to the temperature signal exceeds the second preset temperature, the circulating pump is controlled to start to make the cooling liquid in the liquid box contact the first substrate bottom along the first liquid-cooled microfluidic tube above the circulating pump to obtain heated cooling liquid, wherein the second preset temperature is greater than the first preset temperature.

[0022] When the heated cooling liquid flows from the liquid outlet groove into the second recovery groove, the fan speed is controlled to cool the heated cooling liquid in the second liquid-cooled microfluidic tube corresponding to the second recovery groove.

[0023] This invention provides an integrated liquid-cooled high-power LED optical module and its control method. An LED packaging unit, a wiring unit, and a temperature sensing unit are mounted on a first substrate. The heat dissipation assembly includes a second substrate, a liquid-cooling circulation unit, and multiple sets of heat dissipation fins. The temperature sensing unit detects the temperature signal of the LED packaging unit and controls a coolant driving assembly to drive the coolant in the liquid-cooled microfluidic tube to exchange heat with the heat dissipation fins and the first substrate. The LED packaging unit, compound eye collimating lens, and heat dissipation assembly are structurally integrated. The compound eye collimating lens collimates, deflects, or integrates the light emitted from the LED packaging unit. The heat dissipation fins, liquid-cooled microfluidic tube, and coolant driving assembly work together to effectively dissipate heat from the first substrate. The liquid-cooled microfluidic tube is positioned between two sets of heat dissipation fins, and the coolant driving assembly is positioned at the bottom of the multiple sets of heat dissipation fins. By fully utilizing the heat dissipation path of the heat dissipation fins and the liquid-cooling circulation, the heat dissipation and optical efficiency problems of high-power-density LEDs can be solved. The entire product is small in size, improving product integration and operational stability. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 A schematic diagram of the integrated liquid-cooled high-power LED optical module provided by the present invention;

[0026] Figure 2 An exploded view of the integrated liquid-cooled high-power LED optical module provided by the present invention;

[0027] Figure 3 A schematic diagram of the structure of the liquid cooling circulation unit provided by the present invention;

[0028] Figure 4 A bottom view of the liquid container provided by the present invention;

[0029] Figure 5 This is a schematic diagram of the structure of the mounting plate provided by the present invention;

[0030] Figure 6 A flowchart of the control method provided by the present invention.

[0031] The symbols for the main components are explained below:

[0032] 10-mounting plate; 11-first substrate; 12-LED package unit; 13-temperature sensing unit; 14-wiring unit; 15-eyeshaped collimating lens; 16-second substrate; 17-liquid cooling circulation unit; 18-radiating fins; 19-liquid cooling micro-flow tube; 20-cooling liquid driving assembly; 21-sealing frame; 22-fan; 23-micro-flow channel plate; 24-liquid box; 25-sealing plate; 26-supporting seat; 28-limiting clamping plate; 29-first recovery groove; 30-flow guiding hole; 31-opening; 32-sealing cover; 33-circulation pump; 34-liquid outlet groove; 35-convex boss; 36-second recovery groove; 37-radiating hole; 38-injection inlet. DETAILED DESCRIPTION

[0033] Embodiments of the present application are described in detail below with reference to the attached drawing figures, wherein the same or like reference numerals and characters in the drawings and the following description denote the same or similar functions. The embodiments described below are only exemplary for the purpose of explanation and are not to be understood as limiting the present application.

[0034] It is noted that when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. As used herein the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0035] In the present application, unless otherwise clearly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0036] Referring to Figure 1 , Figure 2 and Figure 3 , the present application provides an integrated liquid cooling high-power LED optical module, comprising:

[0037] a mounting plate 10;

[0038] A first substrate 11 is arranged on the upper surface of the mounting plate 10, and the first substrate 11 comprises an LED packaging unit 12, a temperature sensing unit 13 and a wiring unit 14. The wiring unit 14 is arranged on one side of the first substrate 11, and the temperature sensing unit 13 is located between the LED packaging unit 12 and the wiring unit 14. The LED packaging unit 12 is arranged at the center of the upper surface of the first substrate 11, and the LED packaging unit 12 and the temperature sensing unit 13 are connected to the wiring unit 14.

[0039] An eye collimating lens 15 is arranged above the LED packaging unit 12 and connected to the first substrate 11. The eye collimating lens 15 is used to receive the light emitted by the LED packaging unit 12 and collimate, deflect or integrate the light.

[0040] A heat dissipation assembly comprises a second substrate 16 arranged on the lower surface of the mounting plate 10, a liquid cooling circulation unit 17 and a plurality of heat dissipation fins 18. The top of the plurality of heat dissipation fins 18 abuts against the lower surface of the second substrate 16. The liquid cooling circulation unit 17 comprises a liquid cooling micro-flow pipe 19 located between two groups of heat dissipation fins 18 and a cooling liquid driving assembly 20 arranged at the bottom of the plurality of heat dissipation fins 18. The liquid cooling micro-flow pipe 19 extends from the lower surface of the second substrate 16 to the bottom of the mounting plate 10.

[0041] The wiring unit 14 is used to connect a control unit. The control unit is used to receive a temperature signal of the LED packaging unit 12 detected by the temperature sensing unit 13 and control the cooling liquid driving assembly 20 to drive the cooling liquid in the liquid cooling micro-flow pipe 19 to exchange heat with the heat dissipation fins 18 and the first substrate 11 according to the temperature signal.

[0042] In this embodiment, the heat dissipation assembly further comprises sealing frames 21 arranged on both sides of the second substrate 16 and fans 22 arranged on the surface of the groups of heat dissipation fins 18 between the two sealing frames 21, and the sealing frames 21 are attached to the side surface of the cooling liquid driving assembly 20 along the length direction of the liquid-cooled micro-flow tube 19. The cooling liquid driving assembly 20 comprises a micro-flow channel plate 23 and a liquid box 24, the top of the micro-flow channel plate 23 is in abutment with the bottom of the liquid-cooled micro-flow tube 19, and the liquid box 24 comprises a sealing plate 25, a support seat 26 and a circulating pump 33, the sealing plate 25 is arranged between the micro-flow channel plate 23 and the support seat 26, the liquid box 24 on both sides of the support seat 26 is used for containing cooling liquid, the upper surface of the sealing plate 25 is attached to the bottom of the micro-flow channel plate 23, and the lower surface of the sealing plate 25 is used for sealing the liquid box 24. The end of the sealing frame 21 away from the second substrate 16 is provided with a limiting clamping plate 28, the limiting clamping plate 28 extends along the side surface of the micro-flow channel plate 23 to the side surface of the liquid box 24; the sealing plate 25 is provided with a first recovery groove 29 on both sides, and each first recovery groove 29 is respectively inserted into the liquid-cooled micro-flow tube 19.

[0043] It should be noted that the micro-flow channel plate 23 comprises a plurality of flow guide holes 30 corresponding to the liquid-cooled micro-flow tube 19, the sealing plate 25 is provided with an opening 31 corresponding to the support seat 26, the support seat 26 is provided with a sealing cover 32 and a circulating pump 33, and the sealing cover 32 is arranged above the circulating pump 33. The mounting plate 10 is provided with a liquid outlet groove 34, a boss 35 and a second recovery groove 36, the liquid outlet groove 34 is arranged on the boss 35 and is parallel to the arrangement direction of the liquid-cooled micro-flow tube 19, the boss 35 is in abutment with the lower surface of the first substrate 11, and the second recovery groove 36 is located on both sides of the boss 35, and the second recovery groove 36 is arranged at both ends of the liquid-cooled micro-flow tube 19 corresponding to the first recovery groove 29. The mounting plate 10 further comprises heat dissipation holes 37 arranged at intervals along the four peripheral edges of the mounting plate 10, the compound eye collimating lens 15 comprises an aspheric main collimating lens and a plurality of microlens arrays, the aspheric main collimating lens is directly opposite the light emitting center of the LED packaging unit 12 and is used for receiving and collimating the light emitted by the LED packaging unit 12; and a plurality of microlens arrays are arranged around the aspheric main collimating lens.

[0044] The first substrate 11 can be a PCB board or a PCBA board, and the mounting plate 10 is made of a high-thermal-conductivity material such as copper or aluminum alloy, and has a micro channel (adapted to the liquid cooling micro flow pipe) etched or processed inside, which can be used for circulating flow of the cooling liquid, and the first substrate 11 has a micro channel etched at the bottom for the flow of the cooling liquid. The second substrate 16 is made of the same material as the first substrate 11, the liquid cooling micro flow pipe 19 penetrates through the second substrate 16, a plurality of groups of heat dissipation fins 18 are mounted between the second substrate 16 and the sealing frames 21 on both sides of the second substrate 16, and the sealing frames 21 and the second substrate 16 can be clamped or fastened.

[0045] Specifically, the LED packaging unit 12 includes a plurality of high-power-density LED chips, and the LED packaging unit 12 is formed on the upper surface of the first substrate by means of eutectic welding, high-thermal-conductivity glue, or hot pressing, and the plurality of LED chips can be arranged in an array, a hexagon, a rhombus, or other patterns at the center of the first substrate 11. The wiring unit 14 includes two wiring terminals, and the two wiring terminals are located on both sides of the LED packaging unit 12. The temperature sensing unit 13 is an NTC resistor or other temperature sensor. The fly-eye collimating lens 15 is formed by one-time injection molding or mold pressing of an optical-grade transparent material such as PMMA, PC, or glass, and has a mounting structure at the bottom that matches the outline of the first substrate 11 and the LED packaging unit 12, thereby achieving seamless docking and accurate positioning. The optical working surface of the fly-eye collimating lens 15 is a fly-eye structure composed of a central aspheric main collimating lens and a plurality of micro-lens arrays (fly-eyes) surrounding the aspheric main collimating lens. The aspheric main collimating lens is directly opposite the light-emitting center of the LED packaging unit and is used to receive and collimate most of the direct light. The micro-lens arrays are used to capture the large-angle lateral light emitted by the LED chips and deflect and integrate the light into the main light path, thereby achieving a high light collection rate and collimation rate and improving the illumination effect of the LED packaging unit 12. The fly-eye collimating lens 15 and the first substrate 11 can be detachably connected or fixed by means of positioning columns and positioning holes, buckle structures, or the like, and can be bonded by using sealing glue or by adding a sealing gasket in the middle to ensure the sealing of the optical cavity.

[0046] Specifically, as Figure 5As shown, the mounting plate 10 is provided with a plurality of heat dissipation holes 37 arranged at intervals around the periphery of the mounting plate 10, and mounting holes are arranged at the positions protruding from the two side edges of the mounting plate 10, and the number of mounting holes on each side can be three, the mounting holes being used for mounting the fan 22 on the surface of the plurality of groups of heat dissipation fins 18. A screw hole for fixing and mounting the first substrate 11 is arranged between every two heat dissipation holes, and at least one screw hole is arranged between every two adjacent heat dissipation holes. The mounting plate 10 is provided with a liquid outlet groove 34, a boss 35 and a second recovery groove 36, the length direction of the liquid outlet groove 34 is consistent with the arrangement direction of the plurality of groups of heat dissipation fins 18, the height of the boss 35 is less than the mounting surface of the screw hole, the liquid outlet groove 34 is perpendicular to the direction of the two second recovery grooves 36, the boss 35 is hexagonal, the liquid outlet groove 34 is located at the central position of the boss 35, so that the liquid outlet groove 34 is in full contact with the bottom of the first substrate 11, thereby increasing the contact area of the cooling liquid with the bottom of the first substrate 11 and improving the heat exchange rate.

[0047] Specifically, the fan 22 is located on both sides of the plurality of groups of heat dissipation fins 18, the mounting surface of the fan 22 is flush with the sealing frame 21, and the two fans 22 are respectively connected to the wiring terminals on each side, thereby reducing the wiring. The two wiring terminals can be simultaneously connected to one control unit, or respectively connected to one control unit, and the control unit can be arranged at the position of the cooling liquid driving assembly 20, and part of the interfaces of one of the wiring terminals can be used for controlling the illumination brightness, and part of the interfaces of the other wiring terminal can be used for controlling the rotating speed of the fan 22 or the circulating pump 33, and the specific setting can be determined according to the actual situation, which is not limited here.

[0048] Specifically, the number of liquid-cooled micro-flow tubes 19 is set to sixteen as an example, and the heat dissipation fins 18 are seventeen groups in total. The eight liquid-cooled micro-flow tubes 19 in the middle are marked as first liquid-cooled micro-flow tubes, the two liquid-cooled micro-flow tubes (first, sixteenth in the horizontal direction of the micro-flow channel plate) on both sides of the first liquid-cooled micro-flow tubes 19 are marked as second liquid-cooled micro-flow tubes, the top of the first liquid-cooled micro-flow tubes (close to the mounting plate direction), and the top of the second liquid-cooled micro-flow tubes are adapted and mounted with the grooves or holes on the second substrate. The bottom of the first liquid-cooled micro-flow tubes penetrates the sealing plate and is opposite to the opening, that is, the installation position of the circulating pump 33 corresponds to the bottom of the first liquid-cooled micro-flow tubes, which can ensure that the temperature of the cooling liquid flowing from the liquid box 24 into the first liquid-cooled micro-flow tubes has no change (that is, the first liquid-cooled micro-flow tubes are regarded as inlet channels) when starting the liquid cooling mode. The second liquid-cooled micro-flow tubes are adapted with the second recovery groove 36 on the mounting plate, and the cooling liquid flowing out of the outlet groove 34 will become heated cooling liquid when it contacts the bottom of the first substrate 11. The heated cooling liquid flows into the second recovery groove 36 through the gap around the boss 35 and is affected by gravity. After that, the heated cooling liquid passes through the second substrate 16 and the second liquid-cooled micro-flow tubes in turn. The multiple heat dissipation holes around the second substrate 16 make the heated cooling liquid dissipate part of the heat. The heat dissipation fins 18 on both sides of each liquid-cooled micro-flow tube 19 in the second liquid-cooled micro-flow tubes can dissipate heat from the heated cooling liquid, and the fan 22 can speed up the heat dissipation rate of the heat dissipation fins. It can be ensured that the temperature of the cooling liquid flowing back into the liquid box 24 is basically close to the initial temperature.

[0049] Among them, the number of first liquid-cooled micro-flow tubes can be adjusted according to the rotating speed of the circulating pump 33. The initial state can be that four liquid-cooled micro-flow tubes are started, that is, the cooling liquid flows into the corresponding four liquid-cooled micro-flow tubes from the opening 31. After the rotating speed is increased, the cooling liquid expands from the four liquid-cooled micro-flow tubes to one, two, and even ten liquid-cooled micro-flow tubes next to it. The flow rate of the liquid-cooled micro-flow tubes in each liquid-cooled micro-flow tube is different, and the flow rate of the liquid-cooled micro-flow tubes opposite the opening is the same. As the distance from the opening increases, the flow rate of the liquid-cooled micro-flow tubes will decrease. The specific setting can be selected according to the actual situation, which is not described here.

[0050] Specifically, the sealing frame 21 is provided with a limiting clamping plate 28 at the end, the limiting clamping plate 28 is in inverted T shape, the two sides of the sealing plate 25 are provided with a first recycling groove 29, the limiting clamping plate 28 is tightly attached to the two sides of the micro-flow channel plate 23 and extends to the side of the liquid box 24, in actual installation, the limiting clamping plate 28 is directly attached to the side of the liquid box 24 and abuts (or is welded) with the "convex" shaped upper surface of the limiting clamping plate 28, thereby improving the sealing performance of the liquid box 24. The support seat 26 is located at the middle position of the liquid box 24 and can extend from the bottom of the liquid box 24 to the sealing plate 25, the height of the sealing cover 32 is flush with the sealing plate 25, the hole of the sealing cover 32 is correspondingly arranged with the opening 31 on the sealing plate 25, and the diameter of the hole of the sealing cover 32 is preferably greater than the diameter of the opening 31, so that the cooling liquid can be quickly driven to flow into the liquid cooling micro-flow pipe 19, the circulating pump 33 is installed on the support seat 26 (the opening is correspondingly connected to the liquid cooling micro-flow pipe and air is pumped to generate negative pressure), the body of the circulating pump 33 is covered by the sealing cover 32, and the bottom of the support seat 26 is detachably connected with the sealing cover 32, wherein, as shown in Figure 4 the bottom of the liquid box 24 is provided with an injection port 38 for the cooling liquid.

[0051] It should be understood that, by arranging the LED packaging unit 12, the wiring unit 14 and the temperature sensing unit 13 on the first substrate 11, the heat dissipation assembly includes the second substrate 16, the liquid cooling circulating unit 17 and the plurality of heat dissipation fins 18, the temperature sensing unit 13 detects the temperature signal of the LED packaging unit 12, the cooling liquid driving assembly 20 drives the cooling liquid in the liquid cooling micro-flow pipe 19 to exchange heat with the heat dissipation fins 18 and the first substrate 11 according to the temperature signal, the LED packaging unit 12, the compound eye collimating lens 15 and the heat dissipation assembly are structurally integrated, the compound eye collimating lens 15 collimates, deflects or integrates the light emitted by the LED packaging unit 12, the heat dissipation fins, the liquid cooling micro-flow pipe 19 and the cooling liquid driving assembly 20 cooperate to effectively dissipate the heat generated by the first substrate 11, the liquid cooling micro-flow pipe 19 is arranged between the two groups of heat dissipation fins 18, and the cooling liquid driving assembly 20 is arranged at the bottom of the plurality of heat dissipation fins 18, so that the heat dissipation path of the heat dissipation fins 18 and the liquid cooling circulation are fully utilized, the problem of heat dissipation and optical efficiency of high-power-density LEDs is solved, the whole product has small volume, and the product integration and working stability are improved.

[0052] Referring to Figure 6 , the application further provides a control method of the integrated liquid cooling high-power LED optical module, which is applied to the integrated liquid cooling high-power LED optical module, and the control method comprises the following steps:

[0053] S1: acquiring a temperature signal of the LED packaging unit detected by the temperature sensing unit, and controlling the fan to start when the temperature value corresponding to the temperature signal exceeds a first preset temperature;

[0054] S2: when the temperature value corresponding to the temperature signal exceeds a second preset temperature, the circulating pump is controlled to start to make the cooling liquid in the liquid box flow along the first liquid cooling micro-flow pipe above the circulating pump to contact the bottom of the first substrate to obtain heated cooling liquid, wherein the second preset temperature is greater than the first preset temperature;

[0055] S3: when the heated cooling liquid flows from the liquid outlet groove into the second recovery groove, the fan speed is controlled to cool the heated cooling liquid in the second liquid cooling micro-flow pipe corresponding to the second recovery groove.

[0056] In the embodiment, when powered on, the LED packaging unit, the temperature sensing unit and the wiring unit are self-checked, the control unit can be an MCU, the MCU is connected with the wiring unit, after detecting that the components on the first substrate are normal (i.e. voltage, current and temperature are normal), the MCU collects and records the initial temperature signal of the temperature sensing unit, turns on at least one LED chip in the LED packaging unit, and collects the temperature on the LED chip, the compound eye collimating lens and the first substrate, the NTC (thermistor) feeds back different temperatures to the MCU in real time, and the MCU is also connected with an analog-to-digital converter (ADC) or a digital-to-analog converter (DAC), the first preset temperature can be 20 degrees, and the second preset temperature can be 40 degrees.

[0057] It should be noted that when the collected temperature does not reach the first preset temperature, the fan is not started, and part of the heat on the first substrate can be transferred to the heat dissipation fins through the mounting plate and the second substrate, and this heat dissipation process is recorded as a normal heat dissipation mode. As the number of LED chips increases and the light-emitting time continues, the temperature value corresponding to the temperature signal collected by the NTC also increases, and when the collected temperature is greater than or equal to the first preset temperature, the MCU controls the fan to start, and when the temperature collected in a certain period of time is less than the first preset temperature and tends to be stable, the cooling liquid driving assembly does not need to be started, because part of the heat on the first substrate can be transferred to the heat dissipation fins through the mounting plate and the second substrate, and this heat dissipation process is set as an air cooling mode.

[0058] When the fan is started, and the collected temperature is greater than or equal to the second preset temperature, the MCU controls the circulating pump to start to make the cooling liquid in the liquid box flow from the first liquid cooling micro-flow pipe into the liquid outlet groove on the mounting plate to cool the first substrate, and when the collected temperature changes greatly in a certain period of time and does not reach the second preset temperature, the fan can be turned off, the speed of the circulating pump is controlled to speed up and finally rotate at a constant speed, until the collected temperature does not exceed the first preset temperature, and this heat dissipation process is set as a liquid cooling heat dissipation mode.

[0059] When the fan is started and the collected temperature is greater than or equal to the second preset temperature, the MCU controls the circulating pump to start so that the cooling liquid in the liquid box enters the liquid outlet groove on the mounting plate from the first liquid cooling micro-channel to cool the first substrate; when the collected temperature changes little and does not reach the second preset temperature within a certain time, the fan speed is reduced, and the rotating speed of the circulating pump is accelerated to finally rotate at a uniform speed, until the collected temperature does not exceed the first preset temperature, and the heat dissipation process is set as a wind-liquid cooling heat dissipation mode. When the fan is started and the collected temperature is greater than or equal to the second preset temperature, the MCU controls the circulating pump to start so that the cooling liquid in the liquid box enters the liquid outlet groove on the mounting plate from the first liquid cooling micro-channel to cool the first substrate; when the collected temperature continues to exceed the second preset temperature within a certain time, the fan speed is accelerated, and the rotating speed of the circulating pump is also accelerated. On this basis, the driving rotating speed and on-off state of the fan and the circulating pump can be reasonably allocated according to the real-time detected temperature, so as to ensure that the LED packaging unit works at a safe temperature, and the working reliability and service life of the LED packaging unit are improved,

[0060] In addition, the NTC thermistor feeds back different resistance values to the MCU according to different temperatures, and when the temperature exceeds the safe temperature of the LED, an instruction of stopping or reducing the LED driving current is sent to make the temperature drop, and when the temperature drops to a set temperature (less than or equal to the first preset temperature), an instruction of resuming full-power output is sent, so as to ensure that the LED packaging unit outputs safely and stably; when any unit of the fan and the circulating pump works abnormally, the MCU sends an instruction, and the LED packaging unit does not output, so as to ensure that the module is safe and stable. An engineer data interface is set, the working condition data of the module can be read through the engineer data interface, the data such as working time, temperature change and working state are obtained, the fault codes of each unit are set, and the engineer can quickly determine the fault point of the module according to the codes. The temperature of the control module and the whole machine is monitored, the high-temperature and low-temperature alarms and protections are set, and the temperature comparison operation of the air inlet and the air outlet is performed, so as to ensure that the whole machine works safely and stably.

[0061] It should be understood that the present application has the following remarkable technical effects:

[0062] (1) Heat dissipation performance: the LED chip is directly die-bonded on the mounting of the micro-channel, the multilayer thermal interface material in the traditional structure is eliminated, the heat path from the chip PN junction to the cooling liquid is shortened to the shortest, and all high-thermal-conductivity materials with equivalent coefficients are used, the thermal resistance is low, there is no large bottleneck in the whole heat dissipation path, the heat generated by the chip can be quickly taken away, the LED can work stably at low temperature, the low-temperature high-luminous-efficiency output is continuously maintained, and the service life is greatly prolonged;

[0063] (2) Optical efficiency: the compound eye collimating lens is designed in an integrated manner, and is seamlessly connected with the LED chip, thereby minimizing the loss and Fresnel reflection of light on the transmission interface. The compound eye structure can efficiently collect almost all light emitted by the LED, including large-angle side light, and collimate the light, and the light output efficiency (optical extraction efficiency) is significantly improved compared with the traditional discrete lens, and the condensing effect is uniform and without stray light;

[0064] (3) Integration and modularization: three cross-domain technologies (packaging, heat dissipation, and optics) are integrated into a standard module, and the back-end lamp manufacturer no longer needs to separately process complex heat dissipation and optical problems, but only needs to simply connect the power supply to use, thereby greatly reducing the application threshold and technical difficulty;

[0065] (4) Compact structure and high power density: the module is small in size and light in weight, but can bear a great power density, and is particularly suitable for lighting applications with strict requirements on space and weight, such as searchlights, stage lights, automobile headlights, and special working lights;

[0066] (5) Production efficiency and cost optimization: the integrated module design simplifies the supply chain and assembly process, facilitates large-scale standardized production, and reduces the overall manufacturing cost and assembly time.

[0067] In all the examples shown and described herein, any specific values should be interpreted as merely exemplary and not as a limitation, and thus other examples of the example embodiments can have different values.

[0068] It should be noted that: similar reference numbers and letters represent similar items in the following drawings, and thus, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0069] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but should not be understood as a limitation on the scope of the present application. It should be noted that, for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application.

Claims

1. An integrated liquid-cooled high-power LED optical module, characterized in that, include: Mounting plate; A first substrate is disposed on the upper surface of the mounting plate. The first substrate includes an LED packaging unit, a temperature sensing unit, and a wiring unit. The wiring unit is disposed on one side of the first substrate. The temperature sensing unit is located between the LED packaging unit and the wiring unit. The LED packaging unit is disposed at the center of the upper surface of the first substrate. Both the LED packaging unit and the temperature sensing unit are connected to the wiring unit. A compound eye collimating lens is sleeved above the LED packaging unit and connected to the first substrate. The compound eye collimating lens is used to receive the light emitted by the LED packaging unit and to collimate, deflect, or integrate the light. The heat dissipation assembly includes a second substrate disposed on the lower surface of the mounting plate, a liquid cooling circulation unit, and multiple sets of heat dissipation fins. The tops of the multiple sets of heat dissipation fins abut against the lower surface of the second substrate. The liquid cooling circulation unit includes a liquid cooling microfluidic tube located between the two sets of heat dissipation fins and a coolant driving assembly disposed at the bottom of the multiple sets of heat dissipation fins. The liquid cooling microfluidic tube extends from the lower surface of the second substrate to the bottom of the mounting plate. The wiring unit is used to connect to the control unit, which is used to receive the temperature signal of the LED packaging unit detected by the temperature sensing unit, and control the coolant driving component to drive the coolant in the liquid-cooled microfluidic tube to exchange heat with the heat dissipation fins and the first substrate according to the temperature signal.

2. The integrated liquid-cooled high-power LED optical module according to claim 1, characterized in that, The heat dissipation assembly also includes a sealing frame and a fan. The sealing frame is disposed on both sides of the second substrate, and the fan is disposed on the surface of multiple sets of heat dissipation fins between the two sealing frames. The sealing frame is attached to the side of the coolant drive assembly along the length of the liquid-cooled microfluidic tube.

3. The integrated liquid-cooled high-power LED optical module according to claim 2, characterized in that, The coolant drive assembly includes a microfluidic channel plate and a liquid box. The top of the microfluidic channel plate abuts against the bottom of the liquid-cooled microfluidic tube. The liquid box includes a sealing plate, a support base, and a circulation pump. The sealing plate is disposed between the microfluidic channel plate and the support base. The liquid boxes on both sides of the support base are used to contain coolant. The upper surface of the sealing plate is in contact with the bottom of the microfluidic channel plate, and the lower surface of the sealing plate is used to seal the liquid box.

4. The integrated liquid-cooled high-power LED optical module according to claim 3, characterized in that, A limiting plate is provided at one end of the sealing frame away from the second substrate. The limiting plate extends along the side of the microfluidic channel plate to fit against the side of the liquid box. First recovery grooves are provided on both sides of the sealing plate, and each first recovery groove is inserted into the liquid-cooled microfluidic tube.

5. The integrated liquid-cooled high-power LED optical module according to claim 4, characterized in that, The microfluidic channel plate includes multiple flow guide holes, which are matched one-to-one with the liquid-cooled microfluidic tubes.

6. The integrated liquid-cooled high-power LED optical module according to claim 4, characterized in that, The sealing plate is provided with an opening corresponding to the support base. The support base is provided with a sealing cover and a circulation pump, and the sealing cover is fitted over the circulation pump.

7. The integrated liquid-cooled high-power LED optical module according to claim 6, characterized in that, The mounting plate is provided with a liquid outlet groove, a boss, and a second recovery groove. The liquid outlet groove is disposed on the boss and parallel to the arrangement direction of the liquid-cooled microfluidic tubes. The boss abuts against the lower surface of the first substrate. The second recovery groove is located on both sides of the boss and is disposed at both ends of the liquid-cooled microfluidic tubes, corresponding to the first recovery groove.

8. The integrated liquid-cooled high-power LED optical module according to claim 7, characterized in that, The mounting plate also includes heat dissipation holes spaced apart along its four edges.

9. The integrated liquid-cooled high-power LED optical module according to claim 1, characterized in that, The compound eye collimating lens includes an aspherical main collimating lens and multiple microlens arrays. The aspherical main collimating lens is directly opposite the light-emitting center of the LED packaging unit and is used to receive and collimate the light emitted by the LED packaging unit. The multiple microlens arrays are arranged around the aspherical main collimating lens.

10. A control method for an integrated liquid-cooled high-power LED optical module, characterized in that, The control method, applied to the integrated liquid-cooled high-power LED optical module as described in any one of claims 1-9, comprises the following steps: The temperature signal of the LED packaging unit is obtained by the temperature sensing unit, and when the temperature value corresponding to the temperature signal exceeds a first preset temperature, the fan is controlled to start. When the temperature value corresponding to the temperature signal exceeds the second preset temperature, the circulation pump is controlled to start and the coolant in the liquid box is brought into contact with the bottom of the first substrate through the first liquid-cooled microfluidic tube above the circulation pump to obtain heated coolant, wherein the second preset temperature is greater than the first preset temperature. When the heated coolant flows from the outlet tank into the second recovery tank, the fan speed is controlled to cool the heated coolant in the second liquid-cooled microfluidic tube corresponding to the second recovery tank.

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