Light-cured resin as well as preparation method and application thereof

Abstract

The invention relates to the technical field of curable resin synthesis, in particular to light-cured resin and a preparation method and application thereof.The light-cured resin is prepared from, by weight, 40-70 parts of olefin-terminated polyurethane prepolymer, 20-40 parts of polythiol compound, 5-15 parts of phosphate functional monomer, 1-4 parts of photoinitiator and 0.5-3 parts of silane coupling agent; wherein the olefin-terminated polyurethane prepolymer is prepared by reacting isocyanate, polyester polyol containing a cyclic carbonate group and an olefin monomer containing a hydroxyl group. The adhesive material provided by the invention has the comprehensive properties of rapid curing, low stress, strong adhesive force, weather resistance, temperature resistance and the like, and can meet the requirements of microelectronic packaging and high-reliability bonding on the performance of the adhesive material.

Description

Technical Field

[0001] This invention relates to the field of curable resin synthesis technology, and in particular to a photocurable resin, its preparation method, and its application. Background Technology

[0002] Photopolymerization technology, especially ultraviolet (UV) curing technology, has been widely used in the electronics manufacturing industry due to its advantages such as rapid curing, low energy consumption, solvent-free operation, and suitability for patterning and automated production. Applications include micro-component mounting, chip packaging, camera module sealing, and flexible circuit board reinforcement bonding. As the core material of this technology, the performance of photocurable adhesives directly determines the long-term reliability and lifespan of electronic components.

[0003] Currently, commonly used photocurable adhesives mainly include acrylate free radical curing systems, epoxy cationic curing systems, and thiol-olefin click chemistry systems. However, these systems all have corresponding limitations: acrylate systems have high curing shrinkage and high polymerization stress, which can easily lead to component warping or interface failure, and also suffer from poor surface curing due to oxygen inhibition, as well as high brittleness and insufficient toughness of the cured product; epoxy cationic systems have slow curing speed, are sensitive to moisture, have limited deep curing capabilities, and the cured product is also brittle and has poor impact resistance; although thiol-olefin systems theoretically have advantages such as low shrinkage and low stress, they are often complex to synthesize and costly, and existing formulations cannot systematically balance multiple requirements such as low stress, high reliable adhesion, long-term resistance to humid heat aging, and applicable modulus. Therefore, developing a novel photocurable resin composition that combines low shrinkage and low stress characteristics with high adhesion reliability and long-term aging resistance is of great significance for meeting the growing demand for microelectronic packaging and high-reliability adhesion. Summary of the Invention

[0004] In view of this, the present invention provides a photocurable resin with comprehensive properties such as rapid curing, low stress, strong adhesion, and weather and temperature resistance. The present invention also provides its preparation method and applications.

[0005] To solve the above-mentioned technical problems, in a first aspect, the present invention provides a photocurable resin, wherein the photocurable resin comprises, by weight, the following raw materials: 40-70 parts of olefin-terminated polyurethane prepolymer 20-40 parts of polythiol compounds 5-15 parts of phosphate ester functional monomers 1-4 parts of photoinitiator 0.5-3 parts of silane coupling agent; The olefin-terminated polyurethane prepolymer is prepared by reacting isocyanate, polyester polyol containing cyclic carbonate groups, and olefin monomer containing hydroxyl groups.

[0006] This invention uses olefin-terminated polyurethane prepolymers with terminal olefin functionalization as the reaction matrix. These prepolymers can rapidly construct a basic cross-linked network with polythiol compounds via thiol-olefin click chemistry, providing initial mechanical strength and moldability. Furthermore, the cyclic carbonate groups carried in this prepolymer can further react during subsequent heat treatment (e.g., interacting with active groups such as urethane bonds in the network), initiating polymer network rearrangement, increased cross-linking density, and the formation of a rigid structure. This significantly and directionally improves the heat resistance, modulus, and dimensional stability of the cured network, enabling the material to withstand the high-temperature environments encountered during the processing and use of electronic devices. Simultaneously, through the synergistic effect of phosphate ester functional monomers and silane coupling agents, an effective sealing barrier can be constructed at the resin-substrate interface, preventing corrosive media such as moisture and ionic contaminants from penetrating into the electronic components. This significantly reduces the risk of short circuits and open circuits caused by interface failure, metal corrosion, or electrochemical migration, thereby improving the long-term reliability and service life of electronic components in harsh environments. Among them, phosphate ester groups can form stable coordination bonds and chemical bonds with hydroxyl groups and metal ions on the substrate surface, effectively enhancing interfacial adhesion; silane coupling agents form covalent connections with the substrate through their hydrolyzable siloxane groups, and achieve chemical bonding with the resin network through organic functional groups, thereby eliminating interfacial tension and suppressing interfacial defects.

[0007] Preferably, the molar ratio of the isocyanate, the polyester polyol containing cyclic carbonate groups, and the olefin monomer containing hydroxyl groups is (1.8-2.2): 1: (0.8-1.2).

[0008] The optimal molar ratio of isocyanate, polyester polyol containing cyclic carbonate groups, and hydroxyl-containing olefin monomers enables the obtained olefin-terminated polyurethane prepolymer to possess sufficient photocuring reaction sites, post-curing reaction sites, and a suitable molecular weight, thus providing a structural basis for the material to achieve low-stress curing and a high-toughness network. Specifically, an appropriate amount of isocyanate ensures that after the cyclic carbonate polyol has fully reacted, sufficient isocyanate groups remain in the system for subsequent end-capping reactions; while the near-equimolar addition of hydroxyl-containing olefin monomers enables precise olefin functionalization end-capping of the prepolymer.

[0009] Preferably, the method for preparing the olefin-terminated polyurethane prepolymer includes the following steps: The isocyanate and the polyol containing cyclic carbonate groups are reacted at 60-80°C under the action of a catalyst to obtain an isocyanate-terminated intermediate; then the hydroxyl-containing olefin monomer is added and the end-capping reaction is carried out at 50-60°C; the isocyanate group content in the reaction system is monitored, and the reaction is stopped when it drops below 0.5% to obtain the olefin-terminated polyurethane prepolymer.

[0010] Preferably, the catalyst is dibutyltin dilaurate, and the amount added is 0.01%-0.1% of the total mass of the isocyanate, the polyol containing cyclic carbonate groups and the olefin monomer containing hydroxyl groups.

[0011] Preferably, the isocyanate is isophorone diisocyanate.

[0012] Preferably, the polyester polyol containing cyclic carbonate groups is polypropylene carbonate diol.

[0013] Preferably, the hydroxyl-containing olefin monomer is hydroxyethyl acrylate.

[0014] Preferably, the polythiol compound is selected from at least one of pentaerythritol tetra(3-mercaptopropionic acid) ester and trimethylolpropane tri(3-mercaptopropionic acid) ester.

[0015] Preferably, the phosphate ester functional monomer has the general structural formula (I): CH2=CR 1 -COO-(CH2) n -OP(O)(OR 2 (OH) (I) Among them, R 1 For H or CH3; n is any natural number from 2 to 4; R 2 It is H or C1-C4 alkyl.

[0016] The (meth)acrylate double bond in the preferred phosphate ester functional monomer structure can participate in the mercapto-olefin photocuring reaction, synergistically forming a crosslinked network with the olefin-terminated polyurethane prepolymer and polythiols in the system. Simultaneously, the phosphate groups contained in this monomer can form stable chemical bonds with the surface of the electronic substrate, thereby significantly improving and maintaining interfacial adhesion. Furthermore, the active phosphate ester groups can further react with residual active groups (such as amino groups) in the resin network during subsequent heat treatment. This process not only enhances the density and stability of the overall crosslinked network but also helps to build stronger chemical connections at the interface, thereby synergistically improving the heat resistance and long-term reliability of the cured product.

[0017] Preferably, the photoinitiator is selected from at least one of 2-hydroxy-2-methyl-1-phenyl-1-propanone, 1-hydroxycyclohexylphenyl ketone, 2-hydroxy-4-(2-hydroxyethoxy)-2-methylphenylpropanone, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, ethyl 2,4,6-trimethylbenzoylphenylphosphine, bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, and methyl benzoylformate.

[0018] Preferably, the silane coupling agent is selected from at least one of γ-glycidoxypropyltrimethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-methacryloyloxypropyltrimethoxysilane, 8-epoxypropoxyoctyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, vinyltrimethoxysilane, and vinyltriethoxysilane.

[0019] Secondly, the present invention provides a method for preparing the photocurable resin described in claim 1, comprising the following steps: The olefin-terminated polyurethane prepolymer, polythiol compound, phosphate functional monomer, and silane coupling agent are mixed evenly, and then the photoinitiator is added. After mixing evenly, the mixture is degassed under vacuum to obtain a composition. The composition is then photocured and then heat-treated at 120-150°C for 30-60 minutes to obtain the photocurable resin.

[0020] Preferably, in the photocuring process, the ultraviolet light wavelength is 355-405 nm and the light intensity is 200-1000 mW / cm². 2 The illumination time is 5-60 seconds.

[0021] Thirdly, the present invention provides the application of the above-mentioned photocurable resin in the preparation of adhesives for sealing or bonding electronic components.

[0022] Compared with the prior art, the present invention has the following beneficial effects: This invention achieves rapid, deep, and low-stress curing by constructing a mercapto-olefin click chemical curing system. Furthermore, through the design of an olefin-terminated polyurethane prepolymer containing cyclic carbonate groups, a two-stage process of photocuring and heat treatment is employed, significantly improving key properties such as heat resistance and elastic modulus after heat treatment following molding. Simultaneously, the synergistic effect of the reactive phosphate functional monomer and the silane coupling agent forms a strong and stable chemical bonding layer at the resin-substrate interface, thereby greatly improving the material's resistance to humid heat aging and interfacial adhesion durability. Ultimately, the photocurable resin provided by this invention possesses comprehensive properties such as rapid curing, low stress, strong adhesion, and weather and temperature resistance, meeting the performance requirements of adhesive materials for microelectronic packaging and high-reliability bonding. Detailed Implementation

[0023] The present invention will now be described in further detail with reference to specific embodiments. The given embodiments are merely illustrative of the invention and not intended to limit its scope. The embodiments provided below can serve as a guide for further improvements by those skilled in the art and do not constitute a limitation on the invention in any way.

[0024] Unless otherwise specified, the experimental methods used in the following examples are conventional methods, performed according to the techniques or conditions described in the literature in this field or according to the product instructions. Unless otherwise specified, the materials and reagents used in the following examples are commercially available.

[0025] In the following embodiments of the present invention, the olefin-terminated polyurethane prepolymer was prepared by the following method: Isophorone diisocyanate, polypropylene carbonate diol (number average molecular weight Mn≈2000), and hydroxyethyl acrylate were weighed out at a molar ratio of 2:1:1. A catalyst, dibutyltin dilaurate, was also prepared, with a mass of 0.05% of the total mass of isophorone diisocyanate, polypropylene carbonate diol, and hydroxyethyl acrylate. In a nitrogen atmosphere, polypropylene carbonate diol and dibutyltin dilaurate were mixed, and isophorone diisocyanate was slowly added dropwise to the reaction system at 80°C with stirring at a speed of 250 r / min to obtain an isocyanate-terminated intermediate. Then, hydroxyethyl acrylate was added and the reaction was carried out at 60°C. The content of isocyanate groups in the reaction system was monitored, and the reaction was stopped when it dropped to below 0.5%, thus obtaining olefin-terminated polyurethane prepolymer.

[0026] Example 1 1. This embodiment provides a photocurable resin, comprising the following raw materials: 55 parts of olefin-terminated polyurethane prepolymer 30 parts of polythiol compounds 10 parts of phosphate ester functional monomers 2 parts of photoinitiator 1.5 parts of silane coupling agent; In this embodiment, the polythiol compound is selected from pentaerythritol tetra(3-mercaptopropionic acid) ester; The structural formula of the phosphate ester functional monomer is: CH2=CR 1 -COO-(CH2) n -OP(O)(OR 2 (OH) Among them, R 1 H; n=2; R 2 For H; The photoinitiator is selected from 2-hydroxy-2-methyl-1-phenyl-1-propanone; The silane coupling agent is selected from γ-glycidoxypropyltrimethoxysilane.

[0027] 2. The method for preparing the photocurable resin provided in this embodiment includes the following steps: Olefin-terminated polyurethane prepolymer, polythiol compound, phosphate functional monomer, and silane coupling agent were added to a stirred tank and stirred at 25°C and 300 rpm for 30 min until homogeneous. Then, a photoinitiator was added, and stirring continued for 20 min. The mixture was then transferred to a vacuum degassing machine and degassed at -0.095 MPa for 15 min to obtain the composition. The composition was then photocured at a wavelength of 365 nm and a light intensity of 600 mW / cm². 2 The light exposure time is 15s; then heat treatment is carried out at 130℃ for 45min to obtain the light-cured resin.

[0028] Example 2 1. This embodiment provides a photocurable resin, comprising the following raw materials: 70 parts of olefin-terminated polyurethane prepolymer 40 parts of polythiol compounds 15 parts of phosphate ester functional monomers 4 parts of photoinitiator 3 parts silane coupling agent; In this embodiment, the polythiol compound is selected from pentaerythritol tetra(3-mercaptopropionic acid) ester; The structural formula of the phosphate ester functional monomer is: CH2=CR 1 -COO-(CH2) n -OP(O)(OR 2 (OH) Among them, R 1 CH3; n=3; R 2 It is CH3; The photoinitiator was selected from bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide and 2,4,6-trimethylbenzoyl-diphenylphosphine oxide in a mass ratio of 1:1. The silane coupling agent is selected from γ-mercaptopropyltrimethoxysilane.

[0029] 2. The method for preparing the photocurable resin provided in this embodiment includes the following steps: Olefin-terminated polyurethane prepolymer, polythiol compound, phosphate functional monomer, and silane coupling agent were added to a stirred tank and stirred at 25°C and 300 rpm for 30 min until homogeneous. Then, a photoinitiator was added, and stirring continued for 20 min. The mixture was then transferred to a vacuum degassing machine and degassed at -0.095 MPa for 15 min to obtain the composition. The composition was then photocured at a wavelength of 365 nm and a light intensity of 600 mW / cm². 2 The light exposure time is 10s; then heat treatment is carried out at 120℃ for 60min to obtain the light-cured resin.

[0030] Example 3 1. This embodiment provides a photocurable resin, comprising the following raw materials: 40 parts of olefin-terminated polyurethane prepolymer 20 parts of polythiol compounds 5 parts of phosphate ester functional monomers 1 part of photoinitiator 0.5 parts of silane coupling agent; In this embodiment, the polythiol compound is selected from pentaerythritol tetra(3-mercaptopropionic acid) ester; The structural formula of the phosphate ester functional monomer is: CH2=CR 1 -COO-(CH2) n -OP(O)(OR 2 (OH) Among them, R 1 CH3; n=3; R 2 It is CH3; The photoinitiator is selected from 1-hydroxycyclohexylphenyl ketone; The silane coupling agent is selected from 3-methacryloyloxypropyltrimethoxysilane.

[0031] 2. The method for preparing the photocurable resin provided in this embodiment includes the following steps: Olefin-terminated polyurethane prepolymer, polythiol compound, phosphate functional monomer, and silane coupling agent were added to a stirred tank and stirred at 25°C and 300 rpm for 30 min until homogeneous. Then, a photoinitiator was added, and stirring continued for 20 min. The mixture was then transferred to a vacuum degassing machine and degassed at -0.095 MPa for 15 min to obtain the composition. The composition was then photocured at a wavelength of 365 nm and a light intensity of 600 mW / cm². 2 The light exposure time is 20s; then heat treatment is carried out at 140℃ for 30min to obtain the light-cured resin.

[0032] Comparative Example 1 This comparative example provides a photocurable resin, comprising the following raw materials: 55 parts of polyurethane acrylate 30 parts of polythiol compounds 10 parts of phosphate ester functional monomers 2 parts of photoinitiator 1.5 parts of silane coupling agent; In this comparative example, the polythiol compound is selected from pentaerythritol tetra(3-mercaptopropionic acid) ester; The structural formula of the phosphate ester functional monomer is: CH2=CR 1-COO-(CH2) n -OP(O)(OR 2 (OH) Among them, R 1 H; n=2; R 2 For H; The photoinitiator is selected from 2-hydroxy-2-methyl-1-phenyl-1-propanone; The silane coupling agent is selected from γ-glycidoxypropyltrimethoxysilane.

[0033] The method for preparing the photocurable resin provided in this comparative example includes the following steps: Polyurethane acrylate, polythiol compound, phosphate functional monomer, and silane coupling agent were added to a stirred tank and stirred at 25°C and 300 rpm for 30 min until homogeneous. Then, a photoinitiator was added, and stirring continued for 20 min. The mixture was then transferred to a vacuum degassing machine and degassed at -0.095 MPa for 15 min to obtain the composition. The composition was then photocured at a wavelength of 365 nm and a light intensity of 600 mW / cm². 2 The light exposure time is 15s; then heat treatment is carried out at 130℃ for 45min to obtain the light-cured resin.

[0034] Comparative Example 2 This comparative example provides a photocurable resin, comprising the following raw materials: 55 parts of olefin-terminated polyurethane prepolymer 30 parts of polythiol compounds 7 parts of triphenyl phosphate 3 parts of β-carboxyethyl acrylate 2 parts of photoinitiator 1.5 parts of silane coupling agent; In this comparative example, the polythiol compound is selected from pentaerythritol tetra(3-mercaptopropionic acid) ester; The photoinitiator is selected from 2-hydroxy-2-methyl-1-phenyl-1-propanone; The silane coupling agent is selected from γ-glycidoxypropyltrimethoxysilane.

[0035] The method for preparing the photocurable resin provided in this comparative example includes the following steps: Olefin-terminated polyurethane prepolymer, polythiol compound, triphenyl phosphate, β-carboxyethyl acrylate, and silane coupling agent were added to a stirred tank and stirred at 25°C and 300 rpm for 30 min until homogeneous. Then, a photoinitiator was added, and stirring continued for 20 min. The mixture was then transferred to a vacuum degassing machine and degassed at -0.095 MPa for 15 min to obtain the composition. The composition was then photocured at a wavelength of 365 nm and a light intensity of 600 mW / cm². 2 The light exposure time is 15s; then heat treatment is carried out at 130℃ for 45min to obtain the light-cured resin.

[0036] Example 4 Performance Testing The performance of the photocurable resins prepared in Examples 1-3 and Comparative Examples 1 and 2 was tested, as follows: Curing shrinkage: In-line photorheological testing was performed using a rotational rheometer (ThermoFisher Scientific, HAAKE MARS 60, USA). The compositions from each example and comparative example were placed in a parallel plate fixture (gap set to 0.2 mm), and under constant oscillation frequency (1 Hz) and near-zero shear stress, a 365 nm UV point light source (irradiance 30 mW / cm²) was activated. 2 Curing was initiated, with a curing time of 120 seconds, and the change in plate spacing during the polymerization process was monitored in real time. The volume shrinkage rate (S) was calculated using the following formula: S = (H0 - H) t ) / H0×100% In the formula, H0 is the initial spacing between the plates before illumination, and H t Let be the spacing between the plates at time t, the illumination time.

[0037] Glass transition temperature (Tg) and storage modulus: These were tested using a dynamic thermomechanical analyzer (TA Q800, USA). The photocurable resins of each example and comparative example were cut into samples of specified dimensions and tested in single cantilever beam mode, heated from -40°C to 200°C at a rate of 3°C / min, under conditions of 1Hz frequency and 10μm amplitude. Tg was defined as the temperature corresponding to the peak value of the loss factor (tanδ), and storage modulus values ​​were read at 25°C and 80°C. Heat distortion temperature: measured on a Vicat tester, sample size 80mm×10mm×3.0mm; Bonding strength: The bonding area of ​​the test sample was 25.4mm × 5mm, the substrate was aluminum alloy, and the adhesive layer thickness was 0.1mm. The two sheets were pulled apart in opposite directions using a universal testing machine and tested at an ambient temperature of 25℃. The measured force value was recorded as strength (MPa). After the test sample was treated with heating and humidification conditions of 85℃ / 85%RH / 750h, the bonding strength of the sample was tested again at an ambient temperature of 25℃. Flame retardancy rating: Sample size is 130×13×3.2mm 3 The flame retardancy level of the samples was tested using a vertical burning tester.

[0038] The test results are shown in Table 1 below: Table 1 Test piece Example 1 Example 2 Example 3 Comparative Example 1 Comparative Example 2 Curing shrinkage / % 2.1 1.8 1.5 3.5 2.3 Glass transition temperature / °C 116 108 122 85 97 Storage modulus at 25°C / MPa 2350 2150 2680 1950 2080 Storage modulus at 80°C / MPa 98 95 145 25 75 Heat distortion temperature / °C 118 110 125 88 102 Adhesive strength / MPa 19.8 17.5 20.5 16.5 15.2 Adhesive strength after heat and humidity / MPa 18.3 16.3 18.9 14.5 13.0 Flame retardant rating V-0 V-0 V-0 V-0 V-1

[0039] The performance comparison tests above demonstrate that the photocurable resin prepared by this invention has comprehensive properties such as rapid curing, low stress, strong adhesion, and weather and temperature resistance, which can meet the performance requirements of adhesive materials for microelectronic packaging and high-reliability bonding.

[0040] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions or improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A photocurable resin, characterized in that, The photocurable resin comprises the following raw materials by weight: 40-70 parts of olefin-terminated polyurethane prepolymer 20-40 parts of polythiol compounds 5-15 parts of phosphate ester functional monomers 1-4 parts of photoinitiator 0.5-3 parts of silane coupling agent; The olefin-terminated polyurethane prepolymer is prepared by reacting isocyanate, polyester polyol containing cyclic carbonate groups, and olefin monomer containing hydroxyl groups.

2. The photocurable resin as described in claim 1, characterized in that, The isocyanate is isophorone diisocyanate; the polyester polyol containing cyclic carbonate groups is polypropylene carbonate diol; and the hydroxyl-containing olefin monomer is hydroxyethyl acrylate.

3. The photocurable resin as described in claim 1, characterized in that, The molar ratio of the isocyanate, the polyester polyol containing cyclic carbonate groups, and the olefin monomer containing hydroxyl groups is (1.8-2.2): 1: (0.8-1.2).

4. The photocurable resin according to any one of claims 1 to 3, characterized in that, The method for preparing the olefin-terminated polyurethane prepolymer includes the following steps: Isocyanate is reacted with a polyol containing cyclic carbonate groups at 60-80°C under the action of a catalyst to obtain an isocyanate-terminated intermediate; then, an olefin monomer containing hydroxyl groups is added and the end-capping reaction is carried out at 50-60°C; the isocyanate group content in the reaction system is monitored, and the reaction is stopped when it drops below 0.5% to obtain the olefin-terminated polyurethane prepolymer.

5. The photocurable resin as described in claim 4, characterized in that, The catalyst is dibutyltin dilaurate, and the amount added is 0.01%-0.1% of the total mass of isocyanate, polyol containing cyclic carbonate groups and olefin monomer containing hydroxyl groups.

6. The photocurable resin as described in claim 1, characterized in that, The polythiol compound is selected from at least one of pentaerythritol tetra(3-mercaptopropionic acid) ester and trimethylolpropane tri(3-mercaptopropionic acid) ester.

7. The photocurable resin as described in claim 1, characterized in that, The phosphate ester functional monomer has the general structural formula (I): CH2=CR 1 -COO-(CH2) n -O-P(O)(OR 2 )(OH) (I) Among them, R 1 For H or CH3; n is any natural number from 2 to 4; R 2 It is H or C1-C4 alkyl.

8. The photocurable resin as described in claim 1, characterized in that, The photoinitiator is selected from at least one of 2-hydroxy-2-methyl-1-phenyl-1-propanone, 1-hydroxycyclohexylphenyl ketone, 2-hydroxy-4-(2-hydroxyethoxy)-2-methylphenylpropanone, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, ethyl 2,4,6-trimethylbenzoylphenylphosphine, bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, and methyl benzoylcarbamate. The silane coupling agent is selected from at least one of γ-glycidoxypropyltrimethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-methacryloyloxypropyltrimethoxysilane, 8-epoxypropoxyoctyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, vinyltrimethoxysilane, and vinyltriethoxysilane.

9. A method for preparing the photocurable resin according to any one of claims 1-8, characterized in that, Includes the following steps: The olefin-terminated polyurethane prepolymer, polythiol compound, phosphate functional monomer, and silane coupling agent are mixed evenly, and then the photoinitiator is added. After mixing evenly, the mixture is degassed under vacuum to obtain a composition. The composition is then photocured and then heat-treated at 120-150°C for 30-60 minutes to obtain the photocurable resin.

10. The use of the photocurable resin according to any one of claims 1-8 in the preparation of adhesives for sealing or bonding electronic components.