Camera module including baffle plate and electronic device including same

Abstract

The camera module may include: a housing; a lens carrier configured to carry the lens along an optical axis of the lens; an image sensor configured to receive the light passing through the lens; a first baffle plate disposed on a portion of the lens carrier; and a second shutter disposed parallel to the first shutter and disposed inside the housing between the lens and the image sensor.

Description

TECHNICAL FIELD

[0001] The disclosure relates generally to a camera module, for example, to a camera module including a baffle. The disclosure also relates to an electronic device including the camera module. BACKGROUND

[0002] Techniques have been developed to reduce phenomena that can affect image quality, such as ghosting, flare, or glare, in a camera module.

[0003] The related art described above is information that the inventors acquired during the process of conceiving the present disclosure, or information that the inventors had at that time, and does not necessarily mean prior art known before filing of the present application. SUMMARY

[0004] TECHNICAL SOLUTION A camera module includes a housing, a lens carrier configured to move a lens along an optical axis of the lens, an image sensor configured to receive light passing through the lens, a first baffle disposed on a portion of the lens carrier, and a second baffle disposed parallel to the first baffle and disposed inside the housing between the lens and the image sensor.

[0005] An electronic device includes a camera module. The camera module includes a housing, a lens carrier configured to move a lens along an optical axis of the lens, an image sensor configured to receive light passing through the lens, a first baffle disposed on a portion of the lens carrier, and a second baffle disposed parallel to the first baffle and disposed inside the housing between the lens and the image sensor. BRIEF DESCRIPTION OF DRAWINGS

[0006] The above and other aspects, features, and advantages of the example embodiments in the disclosure will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0007] Figure 1 is a block diagram illustrating an electronic device in a network environment according to an embodiment.

[0008] Figure 2 is a block diagram illustrating a camera module according to an embodiment.

[0009] Figure 3 is a perspective view of an electronic device according to an embodiment, in one direction.

[0010] Figure 4 is a perspective view of an electronic device according to an embodiment, in another direction.

[0011] Figure 5 is a perspective view of a camera module according to an embodiment.

[0012] Figure 6is a plan view of a camera module according to an embodiment.

[0013] Figure 7 is an exploded perspective view of a camera module according to an embodiment.

[0014] Figure 8a is a plan view of a camera module according to an embodiment including an AF carrier in a first position and with a camera cover removed.

[0015] Figure 8b is a plan view of a camera module according to an embodiment including an AF carrier in a second position and with a camera cover removed.

[0016] Figure 9a is a cross-sectional view of a camera module according to an embodiment taken along line 9-9 of Figure 6

[0017] Figure 9b is a first wall of a 9B portion of Figure 9a

[0018] Figure 9c is a second wall of a 9C portion of Figure 9a

[0019] Figure 10a is a plan view of a camera module according to an embodiment.

[0020] Figure 10b is a bottom view of a baffle according to an embodiment.

[0021] Figure 10c is a 10C portion of a baffle of Figure 10b

[0022] Figure 11 is a cross-sectional view of a camera module according to an embodiment.

[0023] Figure 12 is a cross-sectional view of a camera module according to an embodiment.

[0024] Figure 13 is a perspective view of a carrier in a camera module according to an embodiment.

[0025] Figure 14 is a perspective view of a carrier in a camera module according to an embodiment.

[0026] Figure 15 is a perspective view of a carrier in a camera module according to an embodiment.

[0027] Figure 16 is a cross-sectional view of a camera module according to an embodiment.

[0028] ​​​​Figure 17 is a cross-sectional view of a camera module according to an embodiment.

[0029] Figure 18 is a cross-sectional view of a baffle according to an embodiment.

[0030] Figure 19 is a cross-sectional view of a baffle according to an embodiment. DETAILED DESCRIPTION

[0031] Figure 1 is a block diagram illustrating an electronic device in a network environment according to an embodiment.

[0032] Referring to Figure 1 , the electronic device 101 in the network environment 100 can communicate with an electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or an electronic device 104 or a server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 can include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one (e.g., the connection terminal 178) of the above components can be omitted from the electronic device 101, or one or more other components can be added in the electronic device 101. In some embodiments, some of the above components (e.g., the sensor module 176, the camera module 180, or the antenna module 197) can be configured into a single component (e.g., the display module 160).

[0033] The processor 120 can execute, for example, software (e.g., a program 140) to control at least one other component (e.g., a hardware or software component) of the electronic device 101 connected to the processor 120 and can perform various data processing or computation. According to an embodiment, as at least part of the data processing or computation, the processor 120 can store a command or data received from another component (e.g., the sensor module 176 or the communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store processed data in the non-volatile memory 134. According to an embodiment, the processor 120 can include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)), or a coprocessor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently from, or in conjunction with, the main processor 121. For example, when the electronic device 101 includes the main processor 121 and the coprocessor 123, the coprocessor 123 can be adapted to consume less power than the main processor 121, or to be specialized in a particular function. The coprocessor 123 can be implemented as separate from, or as part of, the main processor 121.

[0034] The coprocessor 123 (rather than the main processor 121) can control at least some of the functions or states related to at least one of the components (e.g., the display module 160, the sensor module 176, or the communication module 190) of the electronic device 101, while the main processor 121 is in an inactive (e.g., sleep) state, or together with the main processor 121 control at least some of the functions or states related to at least one of the components (e.g., the display module 160, the sensor module 176, or the communication module 190) of the electronic device 101, while the main processor 121 is in an active state (e.g., executing an application). According to an embodiment, the coprocessor 123 (e.g., an ISP or a CP) can be implemented as a part of another component (e.g., the camera module 180 or the communication module 190) functionally related to the coprocessor 123. According to an embodiment, the coprocessor 123 (e.g., an NPU) can include a hardware structure dedicated to artificial intelligence (AI) model processing. An artificial intelligence model can be generated through machine learning. For example, machine learning can be performed by the electronic device 101 in which artificial intelligence is executed or via a separate server (e.g., the server 108). Learning algorithms can include, but are not limited to, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. An artificial intelligence model can include multiple artificial neural network layers. The artificial neural network can include, for example, a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more thereof, but the example is not limited thereto. Additionally or alternatively, the artificial intelligence model can include a software structure other than the hardware structure.

[0035] The memory 130 can store various data used by at least one component (e.g., the processor 120 or the sensor module 176) of the electronic device 101. The various data can include, for example, software (e.g., the program 140), input data or output data for a command related thereto, or the like. The memory 130 can include the volatile memory 132 or the non-volatile memory 134.

[0036] The program 140 can be stored in the memory 130 as software, and can include, for example, the operating system (OS) 142, the middleware 144, or the applications 146.

[0037] The input module 150 can receive a command or data to be used by other components (e.g., the processor 120) of the electronic device 101 from the outside (e.g., a user) of the electronic device 101. The input module 150 can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0038] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as playing multimedia or playing record. The receiver can be used to receive an incoming call. According to an embodiment, the receiver can be implemented as separate from the speaker, or implemented as part of the speaker.

[0039] The display module 160 can visually provide information to the outside (e.g., a user) of the electronic device 101. The display module 160 can include, for example, a control circuit for controlling a display, a hologram device or a projector, and a control circuit for controlling a corresponding one of the display, the hologram device, and the projector. According to an embodiment, the display module 160 can include a touch sensor adapted to sense a touch, or a pressure sensor adapted to measure the intensity of force incurred by the touch.

[0040] The audio module 170 can convert a sound into an electrical signal and vice versa. According to an embodiment, the audio module 170 can obtain sound through the input module 150, or output sound through the sound output module 155 or an external electronic device (e.g., an electronic device 102 such as a speaker or a headphone) directly or wirelessly connected to the electronic device 101.

[0041] The sensor module 176 can detect an operational state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) external to the electronic device 101, and can generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 can include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0042] The interface 177 can support one or more specified protocols to be used for the electronic device 101 to be coupled with the external electronic device (e.g., the electronic device 102) directly (e.g., wiredly) or wirelessly. According to an example embodiment, the interface 177 can include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0043] The connection terminal 178 can include a connector through which the electronic device 101 can be physically connected with the external electronic device (e.g., the electronic device 102). According to an example embodiment, the connection terminal 178 can include, for example, a HDMI connector, a USB connector, a SD card connector, or an audio connector (e.g., a headphone connector).

[0044] The haptic module 179 can convert electrical signal into a mechanical stimulus (e.g., vibration or movement) or electrical stimulus that can be recognized by users through their tactile sensation or kinesthetic sensation. According to an embodiment, the haptic module 179 can include, for example, a motor, a piezoelectric element, or an electrical stimuluser.

[0045] The camera module 180 can capture still images and moving images. According to an embodiment, the camera module 180 can include one or more lenses, image sensors, image signal processors, or flashes.

[0046] The power management module 188 can manage power supplied to the electronic device 101. According to an embodiment, the power management module 188 can be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0047] The battery 189 can supply power to at least one component of the electronic device 101. According to an embodiment, the battery 189 can include, for example, a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell.

[0048] The communication module 190 can support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108) and performing communication between the electronic devices 101 and the external electronic device via the established communication channel. The communication module 190 can include one or more communication processors that operate independently of the processor 120 (e.g., an application processor) and supports direct (e.g., wired) communication or wireless communication. According to an embodiment, the communication module 190 can include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can perform communication by being mounted to, for example, the first network 198 (e.g., a short-range communication network, such as Bluetooth, wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or the second network 199 (e.g., a long-range communication network, such as a conventional cellular network, a fifth generation (5G) network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or wide area network (WAN)). These various types of communication modules can be implemented as a single component (e.g., a single chip) or can be implemented as separate components (e.g., separate chips) from each other. The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network, such as the first network 198 or the second network 199, using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module 196.

[0049] The wireless communication module 192 can support 5G networks after 4th generation (4G) networks and next-generation communication technologies (e.g., new radio (NR) access technology). The NR access technology can support enhanced mobile broadband (eMBB), massive machine type communications (mMTC), or ultra-reliable low-latency communications (URLLC). The wireless communication module 192 can support a high frequency band (e.g., a millimeter wave band) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for securing performance on a high frequency band, such as, for example, beamforming, massive multiple-input multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module 192 can support various requirements designated in the electronic device 101, an external electronic device (e.g., an electronic device 104), or a network system (e.g., a second network 199). According to an embodiment, the wireless communication module 192 can support a peak data rate for implementing eMBB (e.g., 20 Gbps or more), a loss coverage for implementing mMTC (e.g., 164 dB or less), or a U-plane latency for implementing URLLC (e.g., 0.5 ms or less for each of downlink (DL) and uplink (UL), or 1 ms or less of round trip).

[0050] The antenna module 197 can transmit or receive a signal or power to or from the outside (e.g., an external electronic device) of the electronic device 101. According to an embodiment, the antenna module 197 can include an antenna including a radiating element including a conductive material or a conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 can include a plurality of antennas (e.g., array antennas). In this case, at least one antenna suitable for a communication scheme used in a communication network, such as the first network 198 or the second network 199, can be selected from the plurality of antennas by, for example, the communication module 190. A signal or power can be transmitted or received between the communication module 190 and an external electronic device via the selected at least one antenna. According to an embodiment, in addition to the radiating element, another component (e.g., a radio frequency integrated circuit (RFIC)) other than the radiating element can additionally be formed as part of the antenna module 197.

[0051] According to an embodiment, the antenna module 197 can form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module can include a PCB, an RFIC, and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., a bottom surface) of the PCB, or adjacent to the first surface and capable of supporting a designated high frequency band (e.g., a millimeter wave band), and the plurality of antennas is disposed on a second surface (e.g., a top surface or a side surface) of the PCB, or adjacent to the second surface and capable of transmitting or receiving a signal in the designated high frequency band.

[0052] At least some of the above-described components can be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and exchange signals (e.g., commands or data) between them.

[0053] According to an embodiment, commands or data can be transmitted or received between the electronic device 101 and an external electronic device 104 via the server 108 connected with the second network 199. Each of the external electronic devices (e.g., electronic devices 102 or 104) can be a device of a same type as, or a different type from, the electronic device 101. According to an embodiment, all or some of the operations to be executed by the electronic device 101 can be executed at one or more of the external electronic devices, for example, the electronic devices 102, 104, or 108. For example, if the electronic device 101 needs to perform a function or a service automatically, or in response to a request from a user or another device, the electronic device 101, instead of, or in addition to, executing the function or the service, can request one or more of the external electronic devices to perform at least part of the function or the service. The one or more of the external electronic devices receiving the request can perform the at least part of the function or the service, or an additional function or an additional service related to the request, and transfer a result of the execution to the electronic device 101. The electronic device 101 can provide the result, with or without further processing of the result, as at least part of a reply to the request. To that end, a cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used, for example. The electronic device 101 can use, for example, distributed computing or mobile edge computing to provide a super-low latency service. In an embodiment, the external electronic device 104 can include an Internet-of-Things (IoT) device. The server 108 can be an intelligent server using machine learning and / or a neural network. According to an embodiment, the external electronic device 104 or the server 108 can be included in the second network 199. The electronic device 101 can be applied to intelligent services (e.g., smart home, smart city, smart car, or health care), based on 5G communication technologies or IoT-related technologies.

[0054] An electronic device according to an embodiment as disclosed herein can be one of various types of electronic devices. The electronic devices can include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to an embodiment of the disclosure, the electronic devices are not limited to the aforementioned electronic devices.

[0055] It should be understood that the embodiments of the present disclosure and the terms used therein are not intended to limit technically described features set forth herein to particular embodiments and include various changes, equivalents, or replacements for a corresponding embodiment. With regard to the description of the drawings, like reference numerals can be used to refer to like or similar components. It is to be understood that the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. As used herein, "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can include all possible combinations of the items enumerated together in a related formulation. Terms such as "1st" and "2nd," or "first" and "second" can be used to mean "one," or "the one," or the like, and do not require a limitation of the quantity or order of the items. It is to be understood that if an item corresponding to a certain terminology in a "wherein" clause is not specifically designated in some "wherein" clauses, the item can be assumed to be also included in the "wherein" clauses. It will be understood that if a component (for example, a first component) is referred to as being "operatively or communicatively coupled with / to" or as being "connected with / to" another component (for example, a second component), it can be directly coupled with / to the other component or be indirectly coupled with / to the other component via a third component.

[0056] As used in connection with the embodiments of the present disclosure, the term "module" can include a unit implemented in hardware, software, or firmware, and can interchangeably be used with other terms, for example, "logic," "logic block," "component," or "circuitry." The module can be a single integral component, or a minimum unit or a part thereof, adapted to perform one or more functions. For example, according to an embodiment, the module can be implemented in a form of an application-specific integrated circuit (ASIC).

[0057] The embodiments as set forth herein can be implemented as software (e.g., a program 140) including one or more instructions that are stored in a storage medium (e.g., internal memory 136 or external memory 138) that are readable by a machine (e.g., electronic device 101). For example, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke at least one of the one or more instructions stored in the storage medium, and execute it. This allows the machine to be constructed so as to perform at least one function according to the at least one instruction invoked. The one or more instructions can include a code generated by a complier or a code executable by an interpreter. The machine-readable storage medium can be provided in the form of a non-transitory storage medium. Here, the term "non-transitory" simply means that the storage medium is tangible, and does not include a signal (e.g., an electromagnetic wave), but this term does not differentiate between where data is semi-permanently stored in the storage medium and where the data is temporarily stored in the storage medium.

[0058] According to the embodiments, a method according to the embodiments disclosed herein can be included in a computer program product and be provided. The computer program product can be traded as a product between a seller and a buyer. The computer program product can be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or be distributed (e.g., downloaded or uploaded) online via an application store (e.g., PlayStore®) or between two electronic devices (e.g., smart phones or computers). If distributed online, at least part of the computer program product can be temporarily generated or at least temporarily stored in the memory of the manufacturer's server, an application store's server, or a relay server. TM

[0059] ​According to an embodiment, each component (e.g., a module or a program) of the above-described components can include a single entity or multiple entities, and some of the multiple entities can be separately configured in different components. According to an embodiment, one or more of the above-described components or operations can be omitted, or one or more other components or operations can be added. The components (e.g., modules or programs) can be integrated into a single component, according to an embodiment. In such a case, the integrated component can still perform one or more functions of the corresponding one or more of the above-described components. According to an embodiment, operations performed by the module, the program, or another component can be carried out sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations can be executed in a different order or omitted, or one or more other operations can be added.

[0060] Figure 2 is a block diagram illustrating a camera module according to an embodiment.

[0061] Referring to Figure 2 The camera module 180 can include a lens assembly 210, a flash 220, an image sensor 230, an image stabilizer 240, a memory 250 (e.g., a buffer memory), or an image signal processor 260. The lens assembly 210 can collect light emitted from an object as a target to be captured from which an image is to be captured. The lens assembly 210 can include one or more lenses. According to an embodiment, the camera module 180 can include a plurality of lens assemblies 210. In this case, the camera module 180 can be included in, for example, a dual camera, a 360-degree camera, or a spherical camera. Some of the lens assemblies 210 can have the same lens characteristics (e.g., angle of view, focal length, auto focus, f number, or optical zoom), or at least one lens assembly can have one or more lens characteristics different from the lens characteristics of the other lens assembly. The lens assembly 210 can include, for example, a wide-angle lens or a telephoto lens.

[0062] The flash 220 can emit light for enhancing light emitted or reflected from an object. According to an embodiment, the flash 220 can include one or more light emitting diodes (LEDs) (e.g., red green blue (RGB) LEDs, white LEDs, infrared (IR) LEDs, or ultraviolet (UV) LEDs) or a xenon lamp. The image sensor 230 can acquire an image corresponding to an object by converting light emitted or reflected from the object and transmitted via the lens assembly 210 into an electrical signal. According to an embodiment, the image sensor 230 can include, for example, one image sensor selected from among image sensors having different characteristics (such as, for example, an RGB sensor, a black and white (BW) sensor, an IR sensor, or a UV sensor), a plurality of image sensors having the same characteristics, or a plurality of image sensors having different characteristics. Each of the image sensors included in the image sensor 230 can be implemented using, for example, a charge-coupled device (CCD) sensor or a complementary metal-oxide semiconductor (CMOS) sensor.

[0063] The image stabilizer 240 can move the image sensor 230 or at least one lens included in the lens assembly 210 in a certain direction in response to a motion of the camera module 180 or the electronic device 101 including the camera module 180, or control an operational characteristic of the image sensor 230 (e.g., adjust a readout timing). This can compensate for at least a portion of a negative effect on an image being captured due to the motion. According to an embodiment, the image stabilizer 240 can sense such a motion of the camera module 180 or the electronic device 101 using a gyro sensor (not shown) or an acceleration sensor (not shown) disposed inside or outside the camera module 180. According to an embodiment, the image stabilizer 240 can be implemented as, for example, an optical image stabilizer. The memory 250 can at least temporarily store at least a portion of an image acquired via the image sensor 230 for a subsequent image processing task. For example, if an image capture is delayed due to a shutter lag, or a plurality of images are rapidly captured, an acquired raw image (e.g., a Bayer pattern image, a high resolution image) can be stored in the memory 250, and a corresponding copy image (e.g., a low resolution image) thereof can be previewed via the display module 160. Subsequently, when a specified condition (e.g., a user's input or a system command) is satisfied, at least a portion of the raw image stored in the memory 250 can be acquired and processed by, for example, the image signal processor 260. According to an embodiment, the memory 250 can be configured as at least a portion of the memory 130, or the memory 250 can be configured as a separate memory operating independently of the memory 130.

[0064] The image signal processor 260 can perform one or more image processes on an image acquired via the image sensor 230 or an image stored in the memory 250. The one or more image processes can include, for example, depth map generation, three-dimensional (3D) modeling, panorama generation, feature point extraction, image synthesis, or image compensation (e.g., noise reduction, resolution adjustment, brightness adjustment, blurring, sharpening, or softening). Additionally or alternatively, the image signal processor 260 can perform control (e.g., exposure time control or readout timing control) on at least one of the components included in the camera module 180 (e.g., the image sensor 230). An image processed by the image signal processor 260 can be stored back into the memory 250 for further processing, or the image can be provided to an external component (e.g., the memory 130, the display module 160, the electronic device 102, the electronic device 104, or the server 108) outside the camera module 180. According to an embodiment, the image signal processor 260 can be configured as at least part of the processor 120, or the image signal processor 260 can be configured as a separate processor operating independently of the processor 120. If the image signal processor 260 is configured as a separate processor independent of the processor 120, at least one image processed by the image signal processor 260 can be displayed as it is by the processor 120 via the display module 160, or displayed by the processor 120 via the display module 160 after being further processed.

[0065] According to an embodiment, the electronic device 101 can include a plurality of camera modules 180 having different attributes or functions. In this case, for example, at least one of the plurality of camera modules 180 can be a wide-angle camera, and at least another of the plurality of camera modules 180 can be a telephoto camera. Similarly, for example, at least one of the plurality of camera modules 180 can form a front camera, and at least another of the plurality of camera modules 180 can form a rear camera.

[0066] Figure 3 is a perspective view of an electronic device according to an embodiment, in one direction. Figure 4 is a perspective view of an electronic device according to an embodiment, in another direction.

[0067] Referring to Figure 3 and Figure 4 , the electronic device 301 (e.g., Figure 1The electronic device 101) can include a housing 310 including a first surface 310A (e.g., a front surface), a second surface 310B (e.g., a rear surface), and a third surface 310C (e.g., a side surface) that surrounds a space between the first surface 310A and the second surface 310B. The first surface 310A can be formed by a first plate 311A at least a portion of which is substantially transparent. For example, the first plate 311A can include a polymer plate or a glass plate including at least one coating layer. The second surface 310B can be formed by a second plate 311B that is substantially opaque. For example, the second plate 311B can be formed with coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination thereof. The third surface 310C can be formed by a frame 311C that is bonded to the first plate 311A and the second plate 311B and includes metal and / or polymer. The second plate 311B and the frame 311C can be integrally and seamlessly formed. The second plate 311B and the frame 311C can be formed with substantially the same material (e.g., aluminum).

[0068] The electronic device 301 can include an input module 350 (e.g., Figure 1 The input module 350 can be disposed on the third surface 310C. The input module 350 can include at least one key input device. For example, the key input device can include one or more mechanical actuators (e.g., buttons), one or more capacitors, and / or one or more inductors.

[0069] The electronic device 301 can include a sound output module 355 (e.g., Figure 1 The sound output module 355 can be disposed on the third surface 310C. The sound output module 355 can include one or more holes.

[0070] The electronic device 301 can include a display module 361 (e.g., Figure 1The display module 361 can be disposed on the first surface 310A. The display module 361 can be visible through at least a portion of the first plate 311A. The display module 361 can have a shape substantially the same as a shape of an outer edge of the first plate 311A. A periphery of the display module 361 can substantially coincide with the outer edge of the first plate 311A. The display module 361 can include a touch sensing circuit, a pressure sensor for measuring intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic field type stylus pen. The display module 361 can include a screen display area 361A visually exposed to display content using pixels. The screen display area 361A can include a sensing area 361A-1. The sensing area 361A-1 can overlap at least one area of the screen display area 361A. The sensing area 361A-1 can allow transmission of an input signal related to the sensor module 376 (e.g., the sensor module 176 of FIG. 1), Figure 1 The display module 361 can be disposed on the first surface 310A. The display module 361 can be visible through at least a portion of the first plate 311A. The display module 361 can have a shape substantially the same as a shape of an outer edge of the first plate 311A. A periphery of the display module 361 can substantially coincide with the outer edge of the first plate 311A. The display module 361 can include a touch sensing circuit, a pressure sensor for measuring intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic field type stylus pen. The display module 361 can include a screen display area 361A visually exposed to display content using pixels. The screen display area 361A can include a sensing area 361A-1. The sensing area 361A-1 can overlap at least one area of the screen display area 361A. The sensing area 361A-1 can allow transmission of an input signal related to the sensor module 376 (e.g., the sensor module 176 of FIG. 1), Figure 1 The display module 361 can be disposed on the first surface 310A. The display module 361 can be visible through at least a portion of the first plate 311A. The display module 361 can have a shape substantially the same as a shape of an outer edge of the first plate 311A. A periphery of the display module 361 can substantially coincide with the outer edge of the first plate 311A. The display module 361 can include a touch sensing circuit, a pressure sensor for measuring intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic field type stylus pen. The display module 361 can include a screen display area 361A visually exposed to display content using pixels. The screen display area 361A can include a sensing area 361A-1. The sensing area 361A-1 can overlap at least one area of the screen display area 361A. The sensing area 361A-1 can allow transmission of an input signal related to the sensor module 376 (e.g., the sensor module 176 of FIG. 1), Figure 2 The display module 361 can be disposed on the first surface 310A. The display module 361 can be visible through at least a portion of the first plate 311A. The display module 361 can have a shape substantially the same as a shape of an outer edge of the first plate 311A. A periphery of the display module 361 can substantially coincide with the outer edge of the first plate 311A. The display module 361 can include a touch sensing circuit, a pressure sensor for measuring intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic field type stylus pen. The display module 361 can include a screen display area 361A visually exposed to display content using pixels. The screen display area 361A can include a sensing area 361A-1. The sensing area 361A-1 can overlap at least one area of the screen display area 361A. The sensing area 361A-1 can allow transmission of an input signal related to the sensor module 376 (e.g., the sensor module 176 of FIG. 1),

[0071] The electronic device 301 can include an audio module 370 (e.g., the audio module 170 of FIG. 1). The audio module 370 can be disposed on the third surface 310C. The audio module 370 can acquire sound through at least one hole. Figure 1 The electronic device 301 can include an audio module 370 (e.g., the audio module 170 of FIG. 1). The audio module 370 can be disposed on the third surface 310C. The audio module 370 can acquire sound through at least one hole.

[0072] The electronic device 301 can include a sensor module 376. The sensor module 376 can be disposed on the first surface 310A. The sensor module 376 can form a sensing area 361A-1 in at least a portion of the screen display area 361A. The sensor module 376 can receive an input signal transmitted through the sensing area 361A-1 and generate an electrical signal based on the received input signal. For example, the input signal can have a specified physical quantity (e.g., heat, light, temperature, sound, pressure, or ultrasound). The input signal can include a signal related to biometric information (e.g., a fingerprint) of a user.

[0073] Electronic device 301 may include connection terminal 378 (e.g., Figure 1 The connection terminal 378 may be disposed on the third surface 310C. For example, when the electronic device 301 is viewed along a direction (e.g., the -Y direction), the connection terminal 378 may be located substantially in the central portion of the third surface 310C, and the sound output module 355 may be located on one side (e.g., the right side) relative to the connection terminal 378.

[0074] Electronic device 301 may include a first camera module 380A (e.g., Figure 1 Camera module 180 and / or Figure 2 The first camera module 380A may be disposed on the first surface 310A. At least a portion of the first camera module 380A may be disposed below the display module 361. The first camera module 380A may receive optical signals transmitted through the camera area 361A-2.

[0075] Electronic device 301 may include multiple second camera modules 380B (e.g., Figure 1 Camera module 180 and / or Figure 2 (Camera module 180). Multiple second camera modules 380B may be disposed on the second surface 310B. The multiple second camera modules 380B may be arranged in a first row in one direction (e.g., the Y-axis direction) of the second plate 311B. The multiple second camera modules 380B may have different field of view angles. For example, the multiple second camera modules 380B may include an ultra-wide-angle camera, a wide-angle camera, and / or a telephoto camera.

[0076] Electronic device 301 may include optical module 380C (e.g., Figure 2 (Flash 220). An optical module 380C may be arranged on a second surface 310B in a second row substantially parallel to the first row of the plurality of second camera modules 380B. The optical module 380C may include one or more light-emitting diodes or xenon lamps. The optical module 380C may include a sensor configured to detect external light. For example, the sensor may include a flash sensor.

[0077] Electronic device 301 may include a third camera module 380D. The pixels, magnification, and / or field of view of the third camera module 380D may differ from the pixels, magnification, and / or field of view of at least one second camera module 380B. The third camera module 380D may be arranged on a second surface 310B in a second row that is substantially parallel to the first row of the plurality of second camera modules 380B.

[0078] The electronic device 301 can include a fourth camera module 380E. The fourth camera module 380E (which can also be referred to as a "depth camera" or a "time-of-flight (ToF) camera") can be configured to measure a distance between the fourth camera module 380E and an object. For example, the fourth camera module 380E can be configured to measure the distance using at least one of ultrasound waves, infrared rays, or laser light, or a combination thereof. The fourth camera module 380E can be disposed in a second row on the second surface 310B substantially parallel to a first row of the plurality of second camera modules 380B.

[0079] In addition, the embodiments set forth herein can be applied to electronic devices other than the electronic devices shown in Figure 3 and Figure 4 , such as foldable electronic devices, slidable electronic devices, rollable electronic devices, digital cameras, digital camcorders, tablet computers, laptop computers, and other electronic devices.

[0080] As used herein, the terms "substantially," "approximately," "generally," and "about" in reference to a given parameter, property, or condition can include variations understood by a person of ordinary skill in the art to be equivalent in light of the overall disclosure. For example, a parameter that is substantially satisfied can be at least about 90% satisfied, at least about 95% satisfied, or at least about 99% satisfied.

[0081] Figure 5 is a perspective view of a camera module according to an embodiment. Figure 6 is a plan view of a camera module according to an embodiment. Figure 7 is an exploded perspective view of a camera module according to an embodiment. Figure 8a is a plan view of a camera module according to an embodiment, including an AF carrier in a first position and with a camera cover removed. Figure 8b is a plan view of a camera module according to an embodiment, including an AF carrier in a second position and with a camera cover removed. Figure 9a is a cross-sectional view of a camera module according to an embodiment, taken along line 9-9 of Figure 6 . Figure 9b is an enlarged view showing a first wall of the 9B portion of Figure 9a according to an embodiment. Figure 9c is an enlarged view showing a second wall of the 9C portion of Figure 9a according to an embodiment.

[0082] Referring to Figure 5 to Figure 7 , Figure 8a , Figure 8b , Figure 9a , Figure 9b and Figure 9c , the camera module 400 (e.g., Figure 1 andFigure 2 of the camera module 180 and / or Figure 3 and Figure 4 of the second camera module 380B and / or the third camera module 380D) can include a camera housing 410. The camera housing 410 can be configured to house one or more camera-related components. The camera housing 410 can include a base frame 410A and a plurality of side housing frames 410B connected to the base frame 410A.

[0083] The camera module 400 can include a camera cover 411. The camera cover 411 (which can also be referred to as a "shield cover") can be configured to cover one or more camera-related components housed in the camera housing 410. The camera cover 411 can include a top frame 411A and a plurality of side cover frames 411B connected to the top frame 411A.

[0084] The camera module 400 can include a first lens assembly 420A (e.g., Figure 2 of the lens assembly 210). The first lens assembly 420A can include at least one first lens 421A having a defined optical axis OA. A portion of the optical axis OA can be defined as a line connecting a center of curvature of a first surface of the at least one first lens 421A and a center of curvature of an Nth (N is a natural number) surface. The first lens assembly 420A can include a first lens housing 422A configured to house the at least one first lens 421A. The first lens assembly 420A can include a lens holder 423A configured to hold the first lens housing 422A. The lens holder 423A can be configured to support the at least one first lens 421A. The lens holder 423A can be configured to be coupled to the camera housing 410. In an embodiment, the lens holder 423A can be detachably coupled to the first lens housing 422A. In an embodiment not shown, the lens holder 423A can be integrally formed with the first lens housing 422A. The first lens assembly 420A can include a blocking wall 423B. The blocking wall 423B can at least partially block light passing through the first lens 421A and located between the second lens 421B and the reflector 440A. The blocking wall 423B can be integrally and seamlessly formed with the lens holder 423A.

[0085] In an embodiment not shown, the camera module 400 can not include the first lens assembly 420A.

[0086] The camera module 400 can include a second lens assembly 420B (e.g., Figure 2The second lens assembly 420B may include at least one second lens 421B having a defined optical axis OA. A portion of the optical axis OA may be defined as a line connecting the center of curvature of a first surface of the at least one second lens 421B and the center of curvature of an Nth (N is a natural number) surface. The second lens assembly 420B may include a second lens housing 422B configured to accommodate at least one second lens 421B.

[0087] Camera module 400 may include sensor assembly 430. Sensor assembly 430 may include image sensor 431 configured to convert light signals into electrical signals (e.g., Figure 2 Image sensor 230). Sensor assembly 430 may include an image sensor 230 electrically connected to a processor (not shown) (e.g., Figure 1 Processor 120 and / or Figure 2 The image signal processor 260 has a connector 432. The sensor assembly 430 may include a PCB 433 configured to transmit electrical signals from the image sensor 431 to the connector 432. The PCB 433 may be electrically connected to the image sensor 431 and / or the connector 432. The PCB 433 may include an FPCB.

[0088] Camera module 400 may include a reflector 440 configured to reflect light. Reflector 440 may include an incident surface 440A on which light is incident. For example, light passing through at least one first lens 421A may pass through incident surface 440A. Reflector 440 may include an exit surface 440B through which light exits. For example, light passing through exit surface 440B may be directed toward at least one second lens 421B. Reflector 440 may include at least one reflective surface 440C configured to reflect light passing through incident surface 440A toward exit surface 440B. Incident surface 440A, exit surface 440B, and at least one reflective surface 440C substantially define the effective optical path of reflector 440. In embodiments not shown, reflector 440 may include a mirror having reflective surface 440C.

[0089] Camera module 400 may include an autofocus (AF) actuator 450. The AF actuator 450 enables AF operation (e.g., movement in the X-axis direction) of the second lens assembly 420B. The AF actuator 450 may include an AF carrier 451 configured to carry the second lens housing 422B. In this disclosure, the AF carrier 451 may also be referred to as a "lens carrier". The AF carrier 451 may be sized and shaped to accommodate the second lens housing 422B. The AF carrier 451 may be mounted on a base frame 410A.

[0090] The AF actuator 450 can include at least one AF magnet 452 (may also be referred to as an “electromagnetic element”). The at least one AF magnet 452 can be disposed in a region (e.g., a side region or a recess of its + / - Y direction) of the AF carrier 451. The AF actuator 450 can include at least one AF coil 453 (may also be referred to as an “electromagnetic element”). The at least one AF coil 453 can be configured to electromagnetically couple to the at least one AF magnet 452. The at least one AF coil 453 can be disposed in a region (e.g., a + / - Y direction region) of the side housing frame 410B. The at least one AF coil 453 can be disposed in a region (e.g., a + / - Y direction region) of the PCB 480.

[0091] The camera module 400 can include an optical image stabilization (OIS) actuator 460 (e.g., an image stabilizer 240 of the camera module 100 of FIG. 1A). The OIS actuator 460 can rotate or tilt the reflector 440 about a pitch axis (e.g., the Y axis) and / or a yaw axis (e.g., the Z axis). The OIS actuator 460 can include an OIS carrier 461 configured to carry the reflector 440. The OIS carrier 461 can be sized and shaped to accommodate the reflector 440. The OIS carrier 461 can be disposed on the base frame 410A. Figure 2

[0092] The OIS actuator 460 can include at least one first OIS magnet 462 (may also be referred to as an “electromagnetic element”). The at least one first OIS magnet 462 can be disposed in a first region (e.g., a side region or a recess of its approximately + / - Y direction) of the OIS carrier 461. The OIS actuator 460 can include at least one first OIS coil 463 (may also be referred to as an “electromagnetic element”). The at least one first OIS coil 463 can be configured to electromagnetically couple to the at least one first OIS magnet 462. The at least one first OIS coil 463 can be spaced apart from the at least one AF coil 453 in one direction (e.g., in the X axis direction) so as not to be superposed with the at least one AF magnet 452, and can be disposed in a region (e.g., a + / - Y direction region) of the side housing frame 410B. The at least one first OIS coil 463 can be spaced apart from the at least one AF coil 453 in one direction (e.g., in the X axis direction) and can be disposed in a region (e.g., in a + / - Y direction region) of the PCB 480. Electromagnetic coupling between the first OIS magnet 462 and the first OIS coil 463 can enable rotation of the OIS carrier 461 about the yaw axis (e.g., the Z axis).

[0093] ​The OIS actuator 460 can include at least one second OIS magnet 464 (may also be referred to as an “electromagnetic element”). The OIS actuator 460 can include at least one second OIS coil 465 (may also be referred to as an “electromagnetic element”). The at least one second OIS coil 465 can be configured to electromagnetically couple to the at least one second OIS magnet 464. The at least one second OIS coil 465 can be disposed in a region (e.g., a region in the +X direction) of the side housing frame 410B. The at least one second OIS coil 465 can be spaced apart from the at least one AF coil 453 in one direction (e.g., in the X-axis direction), and can be disposed in a region (e.g., a region in the + / -X direction) of the PCB 480.

[0094] The camera module 400 can include a first guide 470. The first guide 470 can include a guide body 471 and at least one first guide ball 472. The first guide body 471 can include at least one first inner groove configured to at least partially accommodate the at least one first guide ball 472. For example, the first inner groove can extend along an inner surface of the first guide body 471 in a rotational direction about the Z-axis. The OIS carrier 461 can include at least one outer groove configured to at least partially accommodate the at least one first guide ball 472. The at least one outer groove of the OIS carrier 461 can extend along an outer surface of the OIS carrier 461 in the rotational direction about the Z-axis. The OIS carrier 461 can be configured to be in rolling contact with the at least one first guide ball 472 and to rotate about the Z-axis by the first guide body 471.

[0095] The camera module 400 can include a second guide 473. The second guide 473 can include a second guide body 474 and at least one second guide ball 475. The first guide body 471 can include at least one first outer groove configured to accommodate the at least one second guide ball 475, and the second guide body 474 can include at least one second inner groove configured to accommodate the at least one second guide ball 475. For example, the at least one first outer groove can extend along an outer surface of the first guide body 471 in a rotational direction about the Y-axis, and the at least one second inner groove can extend along an inner surface of the second guide body 474 in the rotational direction about the Y-axis. The first guide body 471 can be disposed between the OIS carrier 461 and the second guide body 474, and the second guide body 474 can be disposed in a region (e.g., a region in the +X direction) of the side housing frame 410B. The first guide body 471 can be configured to be in rolling contact with the at least one second guide ball 475 and to rotate about the Y-axis. The second guide body 474 can be fixed to the side housing frame 410B.

[0096] The camera module 400 can include a PCB 480. The PCB 480 can provide electrical connections with the at least one AF coil 453, the at least one first OIS coil 463, and the at least one second OIS coil 465. The coils can be disposed on the PCB 480. The PCB 480 can include an FPCB. The PCB 480 can surround the side housing frame 410B.

[0097] The camera module 400 can include at least one stopper 485. The stopper 485 can reduce or prevent the second lens assembly 420B from moving beyond a predetermined range of motion in the Z-axis direction due to an external impact. The stopper 485 can be disposed between the camera cover 411 and the second lens housing 422B.

[0098] The camera module 400 can include a first baffle 490A. The first baffle 490A (which can also be referred to as a "light blocking member") can be configured to control the flow of light. The first baffle 490A can reduce or suppress interference with the optical system caused by stray light from the camera module 400.

[0099] The first baffle 490A can include a base 491A and a plurality of first walls W1 disposed on the base 491A. The plurality of first walls W1 can be disposed on one surface (e.g., a -Z direction surface) of the base 491A. The plurality of first walls W1 can have a first wall surface T11 that forms a first angle a11 with respect to one surface (e.g., a -Z direction surface) of the base 491A and a second wall surface T12 that forms a second angle a12 with respect to one surface (e.g., a -Z direction surface) of the base 491A. The first angle a11 can have a size that is greater than a size of the second angle a12. For example, the first angle a11 can be substantially about 90 degrees, and the second angle a12 can be an angle that is greater than 0 and less than about 90 degrees. Each second wall surface T12 among the plurality of first walls W1 can be oriented toward the image sensor 431. The plurality of first walls W1 can be arranged on the base 491A between one edge (e.g., an edge proximate to the second lens 421B) and an opposite edge (e.g., an edge distal from the second lens 421B).

[0100] At least a portion of the second wall surface T12 can include an etched region. For example, the etched region can be formed by a laser. At least a portion of the second wall surface T12 can include a substantially matte region. The second wall surface T12 can cause scattering of light reflected by the second wall surface T12.

[0101] The first baffle 490A can include at least one engagement tab 492A configured to engage the AF carrier 451. The engagement tab 492A can protrude from a side edge of the base 491A in a predetermined direction (e.g., a -Z direction).

[0102] The camera module 400 may include a second baffle 490B. The second baffle 490B (also referred to as a "light-shielding member") may be configured to control the flow of light. The second baffle 490B may reduce or suppress interference to the optical system caused by stray light from the camera module 400.

[0103] The second baffle 490B may include a plurality of second walls W2. The plurality of second walls W2 may be arranged on the base frame 410A between the second lens 421B and the image sensor 431. The plurality of second walls W2 may have a third wall surface T21 forming a third angle a21 relative to a surface of the base frame 410A (e.g., a +Z direction surface) and a fourth wall surface T22 forming a fourth angle a22 relative to a surface of the base frame 410A (e.g., a +Z direction surface). The magnitude of the third angle a21 may be greater than the magnitude of the fourth angle a22. For example, the third angle a21 may be substantially about 90 degrees, and the fourth angle a22 may be an angle greater than 0 and less than about 90 degrees. Each of the plurality of second walls W2's fourth wall surface T22 may be oriented toward the image sensor 431.

[0104] At least a portion of the fourth wall surface T22 may include etched areas. For example, the etched areas may be formed by a laser. At least a portion of the fourth wall surface T22 may include substantially matte areas. The fourth wall surface T22 may cause scattering of light reflected by the fourth wall surface T22.

[0105] The second baffle 490B can be integrally and seamlessly formed with the base frame 410A. For example, the second baffle 490B and the base frame 410A can be manufactured as a single component by insert injection molding.

[0106] The second baffle 490B may be disposed between the second lens 421B and the image sensor 431. It can suppress flare phenomena that may be caused by stray light between the image sensor 431, which is disposed at a fixed position in the camera housing 410, and the second lens 421B, which moves relative to the camera housing 410 along a predetermined direction (e.g., the X-axis direction).

[0107] The first baffle 490A and the second baffle 490B can be arranged substantially parallel to each other. The first baffle 490A and the second baffle 490B can be arranged opposite each other relative to the optical axis OA. For example, the first baffle 490A can be located on a first side (e.g., the +Z direction side) relative to the second lens 421B, and the second baffle 490B can be located on a second side (e.g., the -Z direction side) opposite to the first side relative to the second lens 421B. The first baffle 490A can be oriented towards the first direction (e.g., the -Z direction), and the second baffle 490B can be oriented towards a second direction opposite to the first direction (e.g., the +Z direction). The arrangement of the first baffle 490A and the second baffle 490B can effectively prevent flare by substantially suppressing stray light in both directions.

[0108] The first baffle 490A and the second baffle 490B can be separated from each other. Compared with a structure that only provides one of the first baffle 490A and the second baffle 490B (e.g., a frame structure), the separation structure of the baffles can be advantageous in terms of manufacturing the components.

[0109] The first baffle 490A and the second baffle 490B may at least partially overlap each other. For example, as Figure 8a As shown, when the distance between the second lens assembly 420B and the image sensor 431 is a first distance (e.g., during macro photography), when viewed along a direction substantially orthogonal to the optical axis OA (e.g., along the Z-axis), the first baffle 490A and the second baffle 490B may have an overlapping area of ​​a first size. Figure 8b As shown, when the distance between the second lens assembly 420B and the image sensor 431 is a second distance less than the first distance (e.g., during infinity photography), when viewed along a direction substantially orthogonal to the optical axis OA (e.g., along the Z-axis), the first baffle 490A and the second baffle 490B may have a stacked area with a second size greater than the first size. The size of the stacked area between the first baffle 490A and the second baffle 490B may vary depending on the movement of the AF carrier 451 in the AF travel direction (e.g., in the X-axis direction). The size of the stacked area between the first baffle 490A and the second baffle 490B at a predetermined travel position of the AF carrier 451 may be substantially zero, or no stacking may occur between the first baffle 490A and the second baffle 490B. The stacked structure of the baffles 490A and 490B may reduce or suppress flare that may occur on both sides (e.g., the first side (or the +Z direction side) and the second side (or the -Z direction side)) relative to the image sensor 431.

[0110] A size of at least one first wall W1 among the plurality of first walls W1 can be smaller than a size of at least one second wall W2 among the plurality of second walls W2. For example, a height of the first wall W1 relative to one surface (e.g., a -Z direction surface) of the base 491A can be smaller than a height of the second wall W2 relative to one surface (e.g., a +Z direction surface) of the base frame 410A.

[0111] A surface area occupied by the first baffle 490A on the base 491A can be smaller than a surface area occupied by the second baffle 490B on the base frame 410A. By maximizing the use of available space between the second lens 421B and the image sensor 431, flare phenomena that can be caused by stray light located between the second lens 421B and the image sensor 431 can be effectively suppressed.

[0112] An angle of each inclined surface of the plurality of first walls W1 can be substantially the same as an angle of each inclined surface of the plurality of second walls W2. An angle of at least some of the inclined surfaces of the plurality of first walls W1 can be different (e.g., smaller or larger) than an angle of at least some of the inclined surfaces of the plurality of second walls W2.

[0113] A size of at least one first wall W1 can be smaller than a size of at least one second wall W2. For example, an area of the first wall surface T11 can be smaller than an area of the third wall surface T21, and an area of the second wall surface T12 can be smaller than an area of the fourth wall surface T22.

[0114] A first distance between adjacent first walls W1 among the plurality of first walls W1 can be smaller than a second distance between adjacent second walls W2 among the plurality of second walls W2.

[0115] In an embodiment not shown, at least one first wall W1 and / or at least one second wall W2 can have a substantially trapezoidal cross-section. This enables the molded resin to be smoothly removed from a mold during manufacturing (e.g., injection molding) of the first baffle 490A and the second baffle 490B without causing substantial damage to the first wall W1 and the second wall W2.

[0116] In an embodiment not shown, the camera module 400 can include a plurality of first baffles 490A. In an embodiment not shown, the camera module 400 can include a plurality of second baffles 490B.

[0117] In an embodiment not shown, the camera module 400 can include one or more baffles and / or occlusion walls (e.g., occlusion wall 423B) disposed between the first lens assembly 420A and the second lens assembly 420B.

[0118] Figure 10a is a plan view of a camera module according to an embodiment. Figure 10b is a bottom view of a baffle according to an embodiment.Figure 10c According to the embodiments Figure 10b Enlarged view of section 10C of the baffle.

[0119] Reference Figure 10a to Figure 10c Camera module 400-1 (e.g., Figure 1 and Figure 2 Camera module 180, Figure 3 and Figure 4 The second camera module 380B and / or the third camera module 380D and / or Figure 5 to Figure 7 , Figure 8a , Figure 8b , Figure 9a , Figure 9b and Figure 9c The camera module 400 may include a second lens assembly 420B, an AF carrier 451, and a first baffle 490A-1 (e.g., Figure 5 to Figure 7 , Figure 8a , Figure 8b , Figure 9a , Figure 9b and Figure 9c The first baffle 490A and the second baffle 490B. The first baffle 490A-1 may include a base 491A-1 (e.g., Figure 5 to Figure 7 , Figure 8a , Figure 8b , Figure 9a , Figure 9b and Figure 9c The base 491A). The first baffle 490A-1 may include a plurality of engaging tabs 492A (e.g., Figure 7 (The engaging tab 492A). The first baffle 490A-1 may include a plurality of first walls W1.

[0120] The AF carrier 451 may include a first region A1 and a second region A2 separated from each other. The first region A1 and the second region A2 may be at least partially formed by the base surface of the AF carrier 451 (e.g., Figure 13 The base surface 451A) and sidewalls (e.g., Figure 13 The sidewall is defined as 451B.

[0121] The AF carrier 451 may include a separator P that separates the first region A1 and the second region A2. The separator P may serve as a bridge connecting the sidewalls of the AF carrier 451. The separator P may be spaced apart from the base surface of the AF carrier 451.

[0122] The second lens assembly 420B can be disposed in the first area A1. The second lens housing 422B can be disposed close to the partition P to define a reduced first gap G1 between the second lens housing 422B and the partition P. In an embodiment not shown, the second lens housing 422B can at least partially contact the partition P such that no gap is formed between the second lens housing 422B and the partition P. The narrower the distance between the second lens housing 422B and the partition P, the less unnecessary light can propagate between them.

[0123] The first baffle 490A-1 can be disposed in the second area A2. The base 491A-1 can be disposed close to the partition P to define a reduced second gap G2 between the base 491A-1 and the partition P. In an embodiment not shown, the base 491A-1 can at least partially contact the partition P such that no gap is formed between the base 491A-1 and the partition P. The narrower the distance between the base 491A-1 and the partition P, the less unnecessary light can propagate between them.

[0124] The base 491A-1 can include a first portion B1 connected to the side wall of the AF carrier 451. The first portion B1 can have a first width (e.g., Y-axis direction dimension) and a first length (e.g., X-axis direction dimension). The base 491A-1 can include a second portion B2 seamlessly and integrally connected to the first portion B1. The second portion B2 can have a shape corresponding to the shape of the partition P. The second portion B2 can have a second width (e.g., Y-axis direction dimension) smaller than the first width and a second length (e.g., X-axis direction dimension) smaller than the first length. The second portion B2 can have the second width variable (e.g., decreasing) along the second length. The second gap G2 can be defined by the distance between the second portion B2 and the partition P.

[0125] The plurality of first walls W1 can include a plurality of first wall elements W11. The plurality of first wall elements W11 can be arranged on one surface (e.g., -Z direction surface) of the first portion B1 along a predetermined direction (e.g., X-axis direction). The plurality of first wall elements W11 can have substantially the same length (e.g., Y-axis direction dimension). The distance between a pair of adjacent first wall elements W11 can be substantially the same as the distance between another pair of adjacent first wall elements W11.

[0126] The plurality of first walls W1 can include at least one second wall element W12. The at least one second wall element W12 can be disposed on one surface (e.g., -Z direction surface) of the second portion B2. The at least one second wall element W12 can be disposed close to any one of the first wall elements W11. The length (e.g., Y-axis direction dimension) of the at least one second wall element W12 can be smaller than the length (e.g., Y-axis direction dimension) of any one of the first wall elements W11.

[0127] The plurality of first walls W1 can include at least one third wall element W13. The at least one third wall element W13 can be disposed on one surface (e.g., -Z direction surface) of the second portion B2. The at least one third wall element W13 can be disposed close to the at least one second wall element W12. The at least one second wall element W12 can be disposed between the first wall element W11 and the third wall element W13. A distance between the first wall element W11 and the second wall element W12 can be substantially the same as a distance between the second wall element W12 and the third wall element W13. A length (e.g., Y-axis direction dimension) of the at least one third wall element W13 can be smaller than a length (e.g., Y-axis direction dimension) of any one of the first wall elements W11. The length (e.g., Y-axis direction dimension) of the at least one third wall element W13 can be greater than a length (e.g., Y-axis direction dimension) of the at least one second wall element W12.

[0128] The first baffle 490A-1 can include a plurality of protrusions PT. The first wall element W11, the second wall element W12, and the third wall element W13 can be implemented as the protrusions PT. The protrusions PT can protrude in one direction (e.g., -Z direction) of the first baffle 490A-1. The protrusions PT can have a substantially curved top portion. The protrusions PT can have a width that decreases toward the top portion in one direction (e.g., -Z direction) of the first baffle 490A-1. At least one of the first wall element W11, the second wall element W12, or the third wall element W13 can have a predetermined shape (e.g., zigzag shape) at a distal end thereof.

[0129] The first baffle 490A-1 can include a plurality of recesses R. The recesses R can be formed in the first baffle 490A-1 in a direction (e.g., +Z direction) opposite to a protruding direction (e.g., -Z direction) of the protrusions PT. The recesses R can be formed between a pair of adjacent protrusions PT.

[0130] Figure 11 is a cross-sectional view of a camera module according to an embodiment.

[0131] Referring to Figure 11 , the camera module 400-2 (e.g., Figure 1 and Figure 2 the camera module 180 of Figure 3 and Figure 4 the second camera module 380B and / or the third camera module 380D of Figure 5 to Figure 7 , Figure 8a , Figure 8b , Figure 9a , Figure 9b and Figure 9c the camera module 400 of Figure 10a to Figure 10cThe camera module 400-1 can include a camera housing 410, a camera cover 411, a first lens assembly 420A, a second lens assembly 420B, an image sensor 431, and an AF carrier 451.

[0132] The camera module 400-2 can include a first reflector 440A (e.g., Figure 5 to Figure 7 , Figure 8a , Figure 8b , Figure 9a , Figure 9b and Figure 9c a reflector 440) configured to reflect light passing through the first lens assembly 420A toward the second lens assembly 420B. The first reflector 440A can be disposed between the first lens assembly 420A and the second lens assembly 420B.

[0133] The camera module 400-2 can include a second reflector 440B (e.g., Figure 5 to Figure 7 , Figure 8a , Figure 8b , Figure 9a , Figure 9b and Figure 9c a reflector 440) configured to reflect light passing through the second lens assembly 420B toward the image sensor 431. The second reflector 440B can be disposed between the second lens assembly 420B and the image sensor 431.

[0134] An optical axis OA can be defined by a light path passing through the first lens assembly 420A, the first reflector 440A, the second lens assembly 420B, the second reflector 440B, and the image sensor 431.

[0135] The camera module 400-2 can include a first baffle 490A disposed between the second lens assembly 420B and the second reflector 440B and on the AF carrier 451. The camera module 400-2 can include a second baffle 490B disposed between the second lens assembly 420B and the second reflector 440B and in the camera housing 410. The first baffle 490A and the second baffle 490B can be disposed substantially parallel to each other along the light path defined by the optical axis OA. The first baffle 490A and the second baffle 490B can reduce or prevent flare that can occur in an image by substantially blocking unnecessary light paths between the second lens assembly 420B and the second reflector 440B.

[0136] Figure 12 is a cross-sectional view of a camera module according to an embodiment.

[0137] Referring to Figure 12 , the camera module 400-3 (e.g., Figure 1 and Figure 2the camera module 180 of the electronic device 100, Figure 3 and Figure 4 the second camera module 380B and / or the third camera module 380D of the electronic device 380, Figure 5 to Figure 7 、 Figure 8a 、 Figure 8b 、 Figure 9a 、 Figure 9b and Figure 9c the camera module 400 of the electronic device 400, Figure 10a to Figure 10c the camera module 400-1 of the electronic device 400-1, and / or Figure 11 the camera module 400-2 of the electronic device 400-2) can include a camera housing 410, a camera cover 411, a first lens assembly 420A, a second lens assembly 420B, an image sensor 431, a reflector 440, and an AF carrier 451. An optical axis OA can be defined by a light path passing through the first lens assembly 420A, the reflector 440, the second lens assembly 420B, and the image sensor 431.

[0138] The camera module 400-3 can include a first baffle 490A having a plurality of first walls W1. The first baffle 490A can be disposed on the AF carrier 451.

[0139] The camera module 400-3 can include a second baffle 490B having a plurality of second walls W2. The second baffle 490B can be disposed on the camera cover 411 (e.g., a shield). The plurality of second walls W2 can be arranged on one surface (e.g., a -Z direction surface) of the top frame 411A.

[0140] In an embodiment, the second baffle 490B can be integrally and seamlessly formed with the top frame 411A. For example, the second baffle 490B and the top frame 411A can be manufactured as a single assembly by insert injection molding.

[0141] In an embodiment, the second baffle 490B can be combined to the top frame 411A as a separate assembly. For example, the second baffle 490B can be manufactured separately from the top frame 411A and joined to the top frame 411A.

[0142] Figure 13 is a perspective view of a carrier in a camera module according to an embodiment.

[0143] Referring to Figure 13 , the camera module 400-4 (e.g., Figure 1 and Figure 2 the camera module 180 of the electronic device 100, Figure 3 and Figure 4 the second camera module 380B and / or the third camera module 380D of the electronic device 380, Figure 5 to Figure 7 、 Figure 8a 、 Figure 8b 、 Figure 9a 、 Figure 9b and Figure 9cthe camera module 400-1 of FIG. 1A, Figure 10a to Figure 10c the camera module 400-2 of FIG. 1B, Figure 11 the camera module 400-3 of FIG. 1C, and / or Figure 12 the camera module 400-4 of FIG. 1D) can include an AF carrier 451. The AF carrier 451 can include a base surface 451A and a plurality of sidewalls 451B. The AF carrier 451 can include a partition P separating the first region Al and the second region A2.

[0144] The camera module 400-4 can include a first baffle 490A-4 (e.g., Figure 13 , Figure 14 , Figure 13 , Figure 14 , Figure 5 to Figure 7 and Figure 8a the first baffle 490A of FIG. 1A, Figure 8b the first baffle 490A-1 of FIG. 1A, Figure 9a the first baffle 490A of FIG. 1B, and / or Figure 9b the first baffle 490A of FIG. 1C). The first baffle 490A-4 can include a base 491A-4 (e.g., Figure 9c , Figure 10a to Figure 10c , Figure 11 , Figure 12 , Figure 13 and Figure 5 to Figure 7 the base 491A of FIG. 1A) and a plurality of engagement tabs 492A-4 (e.g., Figure 8a , Figure 8b , Figure 9a , Figure 9b , Figure 9c and Figure 13 the engagement tabs 492A of FIG. 1A). The plurality of engagement tabs 492A-4 can be bonded to the sidewalls 451B. The first baffle 490A-4 can be positioned in the second region A2.

[0145] The camera module 400-4 can include a second baffle 490B-4 (e.g., Figure 5 to Figure 7 , Figure 8a , Figure 8b , Figure 9a , Figure 9b and Figure 9c the second baffle 490B of FIG. 1A, Figure 13 the second baffle 490B of FIG. 1A, Figure 5 to Figure 7 the second baffle 490B of FIG. 1B, and / or Figure 8a the second baffle 490B of FIG. 1C). The second baffle 490B-4 can be disposed on the base surface 451A. The second baffle 490B-4 can be integrally and seamlessly formed with the base surface 451A. The second baffle 490B-4 can be positioned in the second region A2.

[0146] Figure 8bis a perspective view of a carrier in a camera module according to an embodiment.

[0147] Referring to Figure 9a , the camera module 400-5 (e.g., the camera module 180 of FIG. 1A, Figure 9b and Figure 9c the second camera module 380B and / or the third camera module 380D of FIG. 1B, Figure 5 to Figure 7 , Figure 8a , Figure 8b , Figure 9a , Figure 9b , Figure 9c , Figure 15 and Figure 15 the camera module 400 of FIG. 1C, Figure 1 the camera module 400-1 of FIG. 1D, Figure 2 the camera module 400-2 of FIG. 1E, Figure 3 the camera module 400-3 of FIG. 1F, and / or Figure 4 the camera module 400-4 of FIG. 1G) can include an AF carrier 451-5. The AF carrier 451-5 can include a base surface 451A-5 (e.g., the base surface 451A of FIG. 1A) and a plurality of side walls 451B. The AF carrier 451-5 can include a partition P separating a first region A1 and a second region A2. The base surface 451A-5 can be formed at least partially in the first region A1. Figure 5 to Figure 7

[0148] The camera module 400-5 can include a plurality of baffles 490-5 (e.g., the first baffles 490A of FIG. 1A, Figure 8a , Figure 8b , Figure 9a , Figure 9b , Figure 9c and Figure 10a to Figure 10c the first baffles 490A of FIG. 1B, Figure 11 the first baffles 490A-1 of FIG. 1C, Figure 12 the first baffles 490A of FIG. 1D, Figure 13 the first baffles 490A of FIG. 1E, and / or Figure 14 the first baffles 490A-4 of FIG. 1F). Each baffle 490-5 can include a base 491-5 (e.g., the base 491A of FIG. 1A, Figure 13 , Figure 14 , Figure 5 to Figure 7 , Figure 8a , Figure 8b and Figure 9a the base 491A of FIG. 1B, and / or Figure 9b the base 491A-4 of FIG. 1C). Each baffle 490-5 can include a plurality of engagement tabs 492-5 (e.g., the engagement tabs 492A of FIG. 1A, Figure 9c , Figure 10a to Figure 10c , Figure 11 , Figure 12 , Figure 13 and Figure 14 the engagement tabs 492A of FIG. 1B, and / or Figure 5 to Figure 7 ​engagement tabs 492A-4 of the plurality of baffles 490-4 can be coupled to the first side (e.g., the +Z-direction side) of the sidewall 451B, and the engagement tabs 492A-5 of the plurality of baffles 490-5 can be coupled to the second side (e.g., the -Z-direction side) of the sidewall 451B opposite the first side.

[0149] The plurality of baffles 490-5 can be disposed substantially parallel to each other. For example, the direction along which the plurality of walls W (e.g., Figure 8a 、 Figure 8b 、 Figure 9a 、 Figure 9b 、 Figure 9c and Figure 13 the first wall W1) of one baffle 490-5 is oriented can be opposite the direction along which the plurality of walls W (e.g., Figure 14 、 Figure 5 to Figure 7 、 Figure 8a 、 Figure 8b 、 Figure 9a and Figure 9b the first wall W1) of another baffle 490-5 is oriented.

[0150] The plurality of baffles 490-5 can be positioned in the second area A2. In an example, the base surface 451A-5 can not be formed in the second area A2, but the plurality of baffles 490-5 positioned in the second area A2 can block stray light that can occur in the second area A2. The plurality of engagement tabs 492-5 of one baffle 490-5 can be coupled to the first side (e.g., the +Z-direction side) of the sidewall 451B, and the plurality of engagement tabs 492-5 of another baffle 490-5 can be coupled to the second side (e.g., the -Z-direction side) of the sidewall 451B opposite the first side.

[0151] The plurality of baffles 490-5 can have substantially the same shape, size, and / or material. For example, the plurality of baffles 490-5 can include the base 491-5 and the plurality of engagement tabs 492-5 having the same shape, size, and / or material. The walls W of each of the plurality of baffles 490-5 can have the same shape, size, material, and / or pitch.

[0152] Figure 9c is a perspective view of a carrier in a camera module according to an embodiment.

[0153] Referring to Figure 14 , the camera module 400-6 (e.g., Figure 16 and Figure 16 the camera module 180 of FIGS. Figure 1 and Figure 2 the second camera module 380B and / or the third camera module 380D of FIGS. Figure 3 、 Figure 4 、 Figure 5 to Figure 7 、 Figure 8a 、 Figure 8b and Figure 9a the camera module 400 of FIGS. Figure 9b the camera module 400-1 of FIGS. Figure 9c the camera module 400-2 of FIGS.Figure 10a to Figure 10c Camera module 400-3, Figure 11 Camera module 400-4, and / or Figure 12 Camera module 400-5) can include an AF carrier 451. AF carrier 451 can include a base surface 451A-6 (e.g., Figure 13 base surface 451A and / or Figure 14 base surface 451A-5) and a plurality of sidewalls 451B. AF carrier 451 can include a partition P separating the first region Al and the second region A2. Base surface 451A-6 can be formed at least partially in the first region Al.

[0154] Camera module 400-6 can include a plurality of baffles (e.g., Figure 15 , Figure 17 , Figure 18 , Figure 19 , Figure 17 to Figure 19 and Figure 1 first baffle 490A of Figure 2 first baffle 490A-1 of ​ first baffle 490A of ​ first baffle 490A of ​ first baffle 490A-4 of and / or ​ baffle 490-5 ofAn integrated baffle structure 490-6 of first baffles 490A of ​ , ​ , ​ , ​ , ​ and ​ base 491A of ​ base 491A-4 of and / or ​ base 491-5 ofA plurality of walls W (e.g., ​ , ​ , ​ , ​ , ​ and ​ first wall Wl of and / or ​ wall W ofmay be formed on the respective base 491-6. In embodiments, the plurality of walls W can not be formed on the joint side 493-6. In embodiments, the plurality of walls W can be formed on the joint side 493-6. In embodiments, the base surface 451A-6 can not be formed in the second region A2, but the integrated baffle structure 490-6 positioned in the second region A2 can block stray light that can occur in the second region A2.​​​​​​​​​​​​​​​

[0155] ​ This is a cross-sectional view of the camera module according to an embodiment.

[0156] Reference ​ Camera module 400-7 (e.g., ​ and ​ Camera module 180, ​ and ​ The second camera module 380B and / or the third camera module 380D, ​ , ​ , ​ , ​ , ​ and ​ Camera module 400, ​ Camera module 400-1, ​ Camera module 400-2, ​ Camera module 400-3 ​ Camera module 400-4 ​ Camera module 400-5 and / or ​ The camera module 400-6 may include a camera housing 410, a camera cover 411, a first lens assembly 420A, a second lens assembly 420B, an image sensor 431, a reflector 440, an AF carrier 451, a first baffle 490A, and a second baffle 490B. The optical axis OA may be defined by an optical path passing through the first lens assembly 420A, the reflector 440, the second lens assembly 420B, and the image sensor 431. The first baffle 490A may be disposed on the top frame 411A of the camera cover 411. The second baffle 490B may be disposed substantially parallel to the first baffle 490A on the base frame 410A of the camera housing 410. In embodiments not shown, the camera module 400-7 may include at least one baffle disposed on the AF carrier 451 or an integral baffle structure.

[0157] ​ This is a cross-sectional view of the camera module according to an embodiment. ​ This is a cross-sectional view of the baffle according to an embodiment. ​ This is a cross-sectional view of the baffle according to an embodiment.

[0158] Reference ​ Camera module 400-8 (e.g., ​ and ​ Camera module 180, Figure 3 and Figure 4 The second camera module 380B and / or the third camera module 380D, Figures 5 to 7 , Figure 8a , Figure 8b , Figure 9a ,Figure 9b and Figure 9c the camera module 400-1 of Figures 10a to 10c the camera module 400-2 of Figure 11 the camera module 400-3 of Figure 12 the camera module 400-4 of Figure 13 the camera module 400-5 of Figure 14 the camera module 400-6 of Figure 15 and / or Figure 16 the camera module 400-7 of may include the camera housing 410, the camera cover 411, the first lens assembly 420A, the second lens assembly 420B, the image sensor 431, the reflector 440, the AF carrier 451, the first baffle 490A, and the second baffle 490B. An optical axis OA can be defined by a light path passing through the first lens assembly 420A, the reflector 440, the second lens assembly 420B, and the image sensor 431.

[0159] The first baffle 490A can include a plurality of first walls W1. The second baffle 490B can include a plurality of second walls W2.

[0160] The first baffle 490A can be disposed on the AF carrier 451. The first baffle 490A can be located outside an effective light path of the second lens assembly 420B and outside an effective light path area of the image sensor 431. The second baffle 490B can be disposed on the base frame 410A of the camera housing 410 substantially in parallel with the first baffle 490A.

[0161] As shown in Figure 18 , when the walls W (e.g., the first walls W1 and / or the second walls W2) of the baffle 490 (e.g., the first baffle 490A and / or the second baffle 490B) have a relatively large height, the distance between adjacent walls W can be increased relative to when the walls W have a relatively low height (e.g., Figure 19 ). In addition, as shown in Figure 19 , when the walls W have a relatively low height, the number of walls W can be increased, and the distance between adjacent walls W can be decreased relative to when the walls W have a relatively large height (e.g., Figure 18 ). In this way, the height of the walls W can be inversely proportional to the number of walls W.

[0162] Referring again to Figure 17 , the height of the camera module 400-8 can be defined as the sum of a distance H1 between the optical axis OA and the top frame 411A and a distance H2 between the optical axis OA and the base frame 410A. The height (e.g., the Z-axis direction dimension) of the effective light path area of the second lens assembly 420B and the height (e.g., the Z-axis direction dimension) of the effective light path area of the image sensor 431 can be substantially symmetrical with respect to the optical axis OA.

[0163] Further, portions of the camera module 400-8 corresponding to the distances H1 and H2 can not be symmetrical with respect to the optical axis OA. In an embodiment in which the distance H1 is smaller than the distance H2, the first baffle 490A is disposed in a relatively smaller space, and the second baffle 490B is disposed in a relatively larger space. Accordingly, to block light paths that can cause flare phenomena, the height of the first wall W1 can be smaller than the height of the second wall W2, the distance between adjacent first walls W1 can be smaller than the distance between adjacent second walls W2, and the number of the first walls W1 can be greater than the number of the second walls W2. However, not limited to the illustrated embodiment, according to the arrangement of the camera module 400-8, the height of the first wall W1 can be substantially the same as or greater than the height of the second wall W2, the distance between adjacent first walls W1 can be substantially the same as or greater than the distance between adjacent second walls W2, and the number of the first walls W1 can be the same as or smaller than the number of the second walls W2.

[0164] In the embodiment illustrated in Figure 18 and Figure 19 , the height of at least one first wall W1 among the plurality of first walls W1 can be different from the height of at least one other first wall W1. The height of at least one second wall W2 among the plurality of second walls W2 can be different from the height of at least one other second wall W2. In an unillustrated embodiment, the plurality of first walls W1 can have substantially the same height. The plurality of second walls W2 can have substantially the same height.

[0165] Further, any embodiment of one baffle described in the present disclosure can be combined with any embodiment of another baffle described herein. For example, an embodiment of an AF carrier 451 including a plurality of baffles 490A-4, 490B-4, 490-5, and 490-6 as illustrated in Figures 13 to 15 and an embodiment of a camera module including a plurality of baffles 490A and 490B as illustrated in Figure 16 may be implemented.

[0166] An aspect of the present disclosure can provide a camera module that reduces or suppresses flare and an electronic device including the same.

[0167] A camera module 400 can include a housing 410, a lens carrier 451 configured to move a lens 421B along an optical axis OA of the lens 421B, and an image sensor 431 configured to receive light passing through the lens 421B. The camera module 400 can include a first baffle 490A disposed on a portion of the lens carrier 451. The camera module 400 can include a second baffle 490B. The second baffle 490B can be disposed parallel to the first baffle 490A. The second baffle 490B can be disposed inside the housing 410 and between the lens 421B and the image sensor 431.

[0168] The first baffle 490A can be disposed on a portion of the lens carrier 451. The first baffle 490A can face the second baffle 490B.

[0169] The first baffle 490A can include a plurality of first walls W1. The second baffle 490B can include a plurality of second walls W2.

[0170] A size of at least one of the first walls W1 among the plurality of first walls W1 can be smaller than a size of at least one of the second walls W2 among the plurality of second walls W2.

[0171] A first distance between adjacent ones of the first walls W1 among the plurality of first walls W1 can be smaller than a second distance between adjacent ones of the second walls W2 among the plurality of second walls W2.

[0172] One of the first walls W1 among the plurality of first walls W1 can be longer than another of the first walls W1 among the plurality of first walls W1.

[0173] At least one of the first walls W1 or the second walls W2 can include a plurality of protrusions PT at a top side of the first walls W1 or the second walls W2.

[0174] A cross-section of at least some of the first walls W1 can include a first side facing the lens 421B, a second side facing the image sensor 431, and a bottom side, and can be substantially triangular. A first angle between the first side and the bottom side can be greater than a second angle between the second side and the bottom side.

[0175] A surface area of the first baffle 490A can be smaller than a surface area of the second baffle 490B.

[0176] The first baffle 490A can at least partially overlap the second baffle 490B when viewed along a direction substantially orthogonal to the optical axis OA of the lens 421B.

[0177] The camera module 400 can include an additional lens 421A. The camera module 400 can include a third baffle disposed between the lens 421B and the additional lens 421A.

[0178] The camera module 400 can further include a first reflector 440A disposed between the additional lens 421A and the lens 421B. The additional lens 421A can be disposed outside of the housing 410. A portion of the optical axis OA of the additional lens 421A can be substantially orthogonal to a portion of the optical axis OA of the lens 421B.

[0179] The camera module 400 can further include a second reflector 440B disposed between the lens 421B and the image sensor 431. The image sensor 431 and the second baffle 490B can be disposed at the same side of the housing 410. A portion of the optical axis OA of the lens 421B can be parallel to the image sensor 431.

[0180] The lens carrier 451 can include a first area A1 in which the lens 421B is disposed. The lens carrier 451 can include a second area A2 in which the first baffle 490A-1 is disposed. The lens carrier 451 can include a partition P that separates the first area A1 and the second area A2.

[0181] The first baffle 490A-1 can extend toward the partition P. The first baffle 490A-1 can form a reduced gap G2 between the first baffle 490A-1 and the partition P. The first baffle 490A-1 can substantially not form a gap between the first baffle 490A-1 and the partition P.

[0182] The housing 410 can include a shield. The second baffle 490B can be disposed inside of the shield.

[0183] The camera module 400-4 can include a fourth baffle 490B-4 disposed on another portion of the lens carrier 451 opposite the first baffle 490A-4.

[0184] The first baffle 490A-4 and the fourth baffle 490B-4 can have substantially the same shape, size, and / or material.

[0185] The camera module 400 can include a fifth baffle 490A disposed on another inside of the housing 410 opposite the second baffle 490B.

[0186] The camera module 400 can include an additional lens 421A, a reflector 440 configured to reflect light passing through the additional lens 421A toward the lens 421B, and a blocking wall 423B configured to block the light passing through the additional lens 421A from passing between the reflector 440 and the lens 421B.

[0187] An electronic device 301 can include the camera module 400.

[0188] In an embodiment, flare can be reduced or suppressed without increasing the size of the camera module. Effects of the camera module according to an embodiment and an electronic device including the same can not be limited to the above-mentioned effects, and other unmentioned effects can be clearly understood from the following description by those skilled in the art.

[0189] Embodiments of the disclosure are intended to be illustrative rather than restrictive. Various modifications to the details of the disclosure, including the accompanying claims and equivalents, can be made by those skilled in the art. Any embodiment described herein can be used in combination with any other embodiment described herein.

Claims

1. A camera module (400) comprising: a housing (410); a lens carrier (451) configured to move a lens (421B) along an optical axis (OA) of the lens (421B); an image sensor (431) configured to receive light passing through the lens (421B); a first baffle (490A) provided on a portion of the lens carrier (451); and a second baffle (490B) provided parallel to the first baffle (490A) and inside the housing (410) between the lens (421B) and the image sensor (431).

2. The camera module according to claim 1, wherein the first baffle (490A) is provided on the portion of the lens carrier (451) such that the first baffle (490A) faces the second baffle (490B).

3. The camera module according to claim 1 or 2, wherein the first baffle (490A) comprises a plurality of first walls (W1), and the second baffle (490B) comprises a plurality of second walls (W2).

4. The camera module according to claim 3, wherein a size of at least one first wall (W1) among the plurality of first walls (W1) is smaller than a size of at least one second wall (W2) among the plurality of second walls (W2), preferably, a first distance between adjacent first walls (W1) among the plurality of first walls (W1) is smaller than a second distance between adjacent second walls (W2) among the plurality of second walls (W2), and preferably, one of the plurality of first walls (W1) is longer than another of the plurality of first walls (W1).

5. The camera module according to claim 3 or 4, wherein at least one of the first walls (W1) or the second walls (W2) comprises a plurality of protrusions (PT) at a top side of the first wall (W1) or the second wall (W2).

6. The camera module according to any one of claims 3 to 5, wherein a cross section of at least some of the first walls (W1) comprises a first side facing the lens (421B), a second side facing the image sensor (431), and a bottom side, and is substantially triangular, wherein a first angle between the first side and the bottom side is larger than a second angle between the second side and the bottom side.

7. The camera module according to any one of claims 1 to 6, wherein a surface area of the first baffle (490A) is smaller than a surface area of the second baffle (490B).

8. The camera module according to any one of claims 1 to 7, wherein the first baffle (490A) and the second baffle (490B) at least partially overlap when viewed along a direction substantially orthogonal to the optical axis (OA) of the lens (421B).

9. The camera module according to any one of claims 1 to 8, comprising: an additional lens (421A); and a third baffle provided between the lens (421B) and the additional lens (421A). ​ ​ Preferably, the camera module further includes a first reflector (440A) disposed between the additional lens (421A) and the lens (421B), wherein the additional lens (421A) is disposed outside of the housing (410), wherein a portion of the optical axis (OA) of the additional lens (421A) is substantially orthogonal to a portion of the optical axis (OA) of the lens (421B), and Preferably, the camera module further includes a second reflector (440B) disposed between the lens (421B) and the image sensor (431), wherein the image sensor (431) and the second baffle (490B) are disposed on a same side of the housing (410) such that a portion of the optical axis (OA) of the lens (421B) is parallel to the image sensor (431).

10. The camera module according to any one of claims 1 to 9, wherein the lens carrier (451) includes: a first region (Al) in which the lens (421B) is disposed; a second region (A2) in which the first baffle (490A-1) is disposed; and a partition (P) separating the first region (Al) and the second region (A2), and Preferably, the first baffle (490A-1) extends toward the partition (P) to form a reduced gap (G2) between the first baffle (490A-1) and the partition (P), or substantially no gap between the first baffle (490A-1) and the partition (P).

11. The camera module according to any one of claims 1 to 10, wherein the housing (410) includes a shield, and the second baffle (490B) is disposed inside of the shield.

12. The camera module according to any one of claims 1 to 11, further comprising: a fourth baffle (490B-4) disposed on another portion of the lens carrier (451) opposite the first baffle (490A-4), and Preferably, the first baffle (490A-4) and the fourth baffle (490B-4) have substantially the same shape, size, and / or material.

13. The camera module according to any one of claims 1 to 12, further comprising: a fifth baffle (490A) disposed on another inside of the housing (410) opposite the second baffle (490B).

14. The camera module according to any one of claims 1 to 13, further comprising: an additional lens (421A); a reflector (440) configured to reflect light passing through the additional lens (421A) toward the lens (421B); and a blocking wall (423B) configured to block light passing through the additional lens (421A) from passing between the reflector (440) and the lens (421B).

Images