Chip failure analysis tool and method
By designing a chip failure analysis fixture, rapid failure analysis of semiconductor laser chips was achieved, solving the failure problem in the chip manufacturing process and improving the chip's performance and reliability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-12
- Publication Date
- 2026-03-31
AI Technical Summary
In existing technologies, semiconductor laser chips are prone to failure during the manufacturing process, resulting in reduced maximum output power and device lifespan, and there is a lack of effective failure analysis methods.
A chip failure analysis fixture was designed, including a loading base, multiple mounting bases, and a power-on component. By using different mounting bases, the fixture can perform chip appearance inspection, grinding, and power-on analysis, respectively removing metal electrodes and energizing the active area. Combined with probes with magnetic suction components and spring structures, the fixture enables rapid chip loading and unloading and protects the chip.
This tooling and method enable rapid and accurate analysis of chip failure causes, improvement of the production process, enhancement of chip performance and reliability, and prevention of chip damage.
Smart Images
Figure CN121763053A_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of semiconductor laser chip detection technology, specifically relating to a chip failure analysis tooling and method. Background Technology
[0002] High-power semiconductor lasers possess advantages such as high optical output power, high electro-optical conversion efficiency, compact structure, and high stability, and are widely used in industrial processing, medical aesthetics, and other fields. With the increasing number of applications, the performance and reliability requirements are becoming increasingly stringent. During use, it has been found that the main factor affecting the maximum output power and device lifespan of semiconductor lasers is sudden chip failure. Therefore, it is necessary to analyze chip failures during the chip manufacturing process. By analyzing the causes of failure, improvements can be made to the chip manufacturing process to enhance the performance and reliability of the chip in subsequent use. Summary of the Invention
[0003] Therefore, it is necessary to provide a chip failure analysis tooling and method that can be used for chip failure analysis.
[0004] The technical solution proposed in this application is as follows: A chip failure analysis fixture, comprising: Loading socket, used to load chips; The first mounting base, the second mounting base, and the third mounting base are provided, wherein the loading base can be detachably mounted on any one of the first mounting base, the second mounting base, and the third mounting base; A power-conducting component is disposed on the third mounting base; When the loading seat is mounted on the first mounting seat, the first mounting seat can push the chip out of the loading seat so that the part of the chip to be tested extends out of the loading seat and the first mounting seat; When the loading base is mounted on the second mounting base, the portion of the chip to be ground protrudes from both the second mounting base and the loading base; When the mounting base is installed on the third mounting base, the power-conducting component can make contact with the chip.
[0005] Using the aforementioned chip failure analysis fixture, the chip is loaded onto the mounting base. First, the chip is visually inspected by the mounting base in conjunction with the first mounting base. Then, the chip is ground by the mounting base in conjunction with the second mounting base to remove the metal electrodes. Finally, the mounting base is connected to the third mounting base, and the power supply equipment energizes the active area of the chip through the power-on component. This enables chip failure analysis, identifies potential problems in the chip manufacturing process, and allows for improvements to the chip manufacturing process, thereby enhancing the performance and reliability of subsequently produced chips.
[0006] Furthermore, a loading slot is provided on one side of the loading seat, and the chip is loaded into the loading slot.
[0007] Furthermore, the first mounting base is provided with a top block; When the loading seat is installed on the first mounting seat, the top block can extend into the loading slot and push a portion of the chip out of the loading slot.
[0008] Furthermore, when the loading seat is installed on the second mounting seat, the side of the loading seat that loads the chip is flush with the bottom side of the second mounting seat.
[0009] Furthermore, the second mounting base has a mounting opening on its bottom side, and the loading base is mounted on the mounting opening.
[0010] Furthermore, it also includes a first magnetic attractor and a plurality of second magnetic attractors; the first magnetic attractor is disposed on the loading seat, and the first mounting seat, the second mounting seat and the third mounting seat are all provided with second magnetic attractors, and the first magnetic attractor and the second magnetic attractor can attract each other.
[0011] Furthermore, a mounting groove is provided on one side of the third mounting base, and the loading seat is installed in the mounting groove; the power supply component and the mounting groove are located on the same side of the third mounting base.
[0012] Furthermore, the power-on component includes a first mounting block, a second mounting block, a first probe, and a second probe. The first mounting block and the second mounting block are both movably connected to the third mounting base. The first probe and the second probe are respectively disposed on the first mounting block and the second mounting block. During the movement of the first mounting block and the second mounting block, the first probe and the second probe can both contact the chip.
[0013] Furthermore, both the end of the first probe that contacts the chip and the end of the second probe that contacts the chip are spring structures.
[0014] A chip failure analysis method, based on the aforementioned chip failure analysis fixture, includes the following steps: S110, loads the chip into the mounting bracket; S120, the loading base is installed on the first mounting base, and the part of the chip to be tested is observed through a microscope; S130, detach the loading seat from the first mounting seat; S140, the mounting base is installed on the second mounting base. The mounting base and the second mounting base press the part of the chip to be polished onto the polishing pad, and polish the part of the chip to be polished by the polishing pad to expose the area of the chip to be powered on for testing. S150, remove the loading seat from the second mounting seat; S160, the mounting base is installed on the third mounting base, and the power-on component is brought into contact with the area of the chip to be powered on for detection. The power supply device supplies power to the chip through the power-on component.
[0015] In summary, the chip failure analysis fixture and method provided in this application have at least one of the following advantages: 1. The chip is loaded onto the mounting base. First, the chip is visually inspected by the mounting base in conjunction with the first mounting base. Then, the chip is ground by the mounting base in conjunction with the second mounting base to remove the metal electrodes of the chip. Finally, the mounting base is connected to the third mounting base, and the power supply equipment energizes the active area of the chip through the power-on component. This enables failure analysis of the chip, identifies potential problems in the chip production process, and allows for improvements to the chip production process, thereby enhancing the performance and reliability of subsequent chips. 2. The loading seat and mounting seat are quickly assembled and disassembled via magnetic attachment, improving testing efficiency; 3. The end of the probe that contacts the chip has a spring structure, which can prevent damage to the chip during the contact process. Attached Figure Description
[0016] The accompanying drawings are provided to further understand this application and form part of the specification. They are used together with the embodiments of this application to explain this application and do not constitute a limitation thereof.
[0017] Figure 1 This is a schematic diagram of the structure of a loading seat provided in one embodiment of this application; Figure 2 for Figure 1 The diagram shows the mating structure between the loading seat and the first mounting seat. Figure 3 for Figure 1 The diagram shows the mating structure between the loading seat and the second mounting seat. Figure 4 for Figure 1 The diagram shows the mating structure between the loading seat and the third mounting seat; Figure 5 for Figure 2 A schematic diagram of the structure of the first mounting base in the mating structure shown; Figure 6 for Figure 3 A schematic diagram of the structure of the second mounting base in the mating structure shown; Figure 7 This is a flowchart of a chip failure analysis method provided in an embodiment of this application.
[0018] Label Explanation: 100, Loading seat; 110, Loading slot; 120, Step structure; 200, First mounting seat; 210, Top block; 220, Receiving slot; 300, Second mounting seat; 310, Bottom side; 320, Mounting port; 330, Bearing structure; 400, Third mounting seat; 410, Mounting slot; 500, Power-conducting assembly; 510, First mounting block; 520, First probe; 530, First guide post; 540, Locking element; 550, Return spring; 600, Chip; 700, Second magnetic element. Detailed Implementation
[0019] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.
[0020] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0022] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0023] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0024] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.
[0025] This application provides a chip failure analysis tooling that can be used for chip failure analysis. By performing failure analysis on the chip, potential problems in the chip manufacturing process can be identified, thereby improving the chip manufacturing process and enhancing the performance and reliability of subsequently produced chips.
[0026] like Figures 1 to 4 As shown, in one embodiment, the chip 600 failure analysis fixture includes a loading base 100, a first mounting base 200, a second mounting base 300, a third mounting base 400, and a power-conducting component 500. The loading base 100 is used to load the chip 600, and the loading base 100 can be detachably mounted to any one of the first mounting base 200, the second mounting base 300, and the third mounting base 400. The power-conducting component 500 is disposed on the third mounting base 400.
[0027] When the mounting base 100 is mounted on the first mounting base 200, the first mounting base 200 can push the chip 600 out of the mounting base 100 so that the part of the chip 600 to be tested extends out of the mounting base 100 and the first mounting base 200; when the mounting base 100 is mounted on the second mounting base 300, the part of the chip 600 to be ground protrudes from the second mounting base 300 and the mounting base 100; when the mounting base 100 is mounted on the third mounting base 400, the power supply component 500 can contact the chip 600.
[0028] Combination Figures 1 to 4It should be noted that, firstly, chip 600 is loaded onto mounting base 100, and then mounting base 100 is installed onto first mounting base 200. First mounting base 200 pushes the portion of chip 600 to be tested from mounting base 100 and first mounting base 200. The portion to be tested is then inspected using a microscope to check for any abnormalities in the appearance of chip 600. Alternatively, the metal interconnect area, transistor area, or other areas of chip 600 can be inspected. The length of the chip 600 extending outwards can be adjusted as needed, and no limitation is made here. After completing the initial inspection of chip 600, mounting base 100 is detached from first mounting base 200, and then mounting base 100 is installed onto second mounting base 300. The portion of chip 600 to be polished protrudes from second mounting base 300 and mounting base 100. Chip 600 is placed face down on a polishing pad. The portion of chip 600 to be polished is pressed firmly against the polishing pad under the weight of second mounting base 300 and mounting base 100, and the polishing pad polishes the portion of chip 600 to be polished. After grinding, the metal electrodes of chip 600 can be removed. Next, the mounting base 100 is detached from the second mounting base 300 and installed on the third mounting base 400. The power supply component 500 is then brought into contact with the area of chip 600 to be powered on for testing. The power supply device is electrically connected to the area to be powered on for testing via the power supply device. The power supply device supplies power to the area to be powered on for testing, thereby enabling EL (Electroluminescence) failure analysis of chip 600.
[0029] It should be explained that, taking the above process as an example, grinding chip 600 is to remove the metal electrodes of chip 600, making it easier to supply power to the area to be tested, thereby enabling EL failure analysis of chip 600. The area to be tested can be the active area of chip 600.
[0030] Using the aforementioned chip 600 failure analysis fixture, chip 600 is loaded onto the mounting base 100. First, the mounting base 100, in conjunction with the first mounting base 200, performs visual inspection on chip 600. Then, the mounting base 100, in conjunction with the second mounting base 300, grinds chip 600 to remove metal electrodes. Finally, the mounting base 100, in conjunction with the third mounting base 400, powers the active area of chip 600 through the energizing component 500. This enables failure analysis of chip 600, identifies potential problems in the chip 600 production process, and allows for improvements to the chip 600 production process, thereby enhancing the performance and reliability of subsequently produced chips 600.
[0031] Please see Figure 1In one embodiment, a loading groove 110 is provided on one side of the loading base 100, and the chip 600 is loaded in the loading groove 110. Specifically, after the chip 600 is loaded in the loading groove 110, the part of the chip 600 to be ground will still protrude from the loading base 100, thereby ensuring that when the loading base 100 is installed on the second mounting base 300, the part of the chip 600 to be ground can protrude from the loading base 100. In addition, it is understood that the size of the loading groove 110 can be opened according to the size of the chip 600, and is not limited here.
[0032] In one embodiment, the mounting base 100 is made of copper to dissipate the heat generated by the chip 600 during power-on testing, thereby improving the heat dissipation capacity of the chip 600 during the testing process, preventing the chip 600 from being damaged due to overheating during power-on testing, and improving the reliability of the testing.
[0033] In one embodiment, the chip 600 failure analysis fixture further includes a first magnetic chuck and a plurality of second magnetic chucks 700 (see [link]). Figure 5 A first magnetic attractor is disposed on the loading seat 100, and a second magnetic attractor 700 is provided on the first mounting seat 200, the second mounting seat 300, and the third mounting seat 400. The first magnetic attractor and the second magnetic attractor 700 can attract each other. In this way, the loading seat 100 can be quickly assembled and disassembled from the first mounting seat 200, the second mounting seat 300, and the third mounting seat 400. In practical applications, one of the first magnetic attractor and the second magnetic attractor 700 is a magnet or electromagnet, and the other is made of a material that can be attracted by a magnet or electromagnet.
[0034] like Figure 5 As shown, in one embodiment, the first mounting base 200 is provided with a top block 210. When the loading base 100 is mounted on the first mounting base 200, the top block 210 can extend into the loading groove 110 and push a portion of the chip 600 out of the loading groove 110. Specifically, the top block 210 can extend into the bottom of the loading groove 110 and push the chip 600 out from the bottom of the loading groove 110.
[0035] In practical applications, the first mounting base 200 has a receiving groove 220. The top block 210 and the second magnetic suction member 700 are both disposed in the receiving groove 220, specifically located on opposite inner walls of the receiving groove 220. The receiving groove 220 matches the loading base 100, allowing the loading base 100 to be installed in the receiving groove 220, and the top block 210 on the inner wall of the receiving groove 220 can extend into the loading groove 110. Figure 2 Understandably, in actual use, the loading base 100 can be installed on the first mounting base 200 first, and then the chip 600 can be inserted into the loading slot 110.
[0036] like Figure 3As shown, in one embodiment, when the mounting base 100 is mounted on the second mounting base 300, the side of the mounting base 100 that holds the chip 600 is flush with the bottom side 310 of the second mounting base 300. The portion of the chip 600 to be polished protrudes from the mounting base 100 and also from the bottom side 310 of the second mounting base 300, thereby allowing the mounting base 100 and the second mounting base 300 to press the portion of the chip 600 to be polished firmly onto the polishing pad. It can be understood that the side of the mounting base 100 that holds the chip 600 is the side of the mounting base 100 where the mounting groove 110 is formed.
[0037] like Figure 6 As shown, in one embodiment, the bottom side 310 of the second mounting base 300 has a mounting opening 320, and the loading seat 100 is installed in the mounting opening 320. Preferably, the mounting opening 320 penetrates the second mounting base 300, that is, it penetrates the bottom side 310 and the top side of the second mounting base 300, and a bearing structure 330 is provided inside the mounting opening 320. The loading seat 100 is provided with a step structure 120 that can match the bearing structure 330, so that the loading seat 100 can be installed from the top side of the second mounting base 300 into the mounting opening 320, and the bearing structure 330 can support the loading seat 100, preventing the loading seat 100 from falling off from the bottom side 310 of the second mounting base 300.
[0038] like Figure 4 As shown, in one embodiment, a mounting groove 410 is provided on one side of the third mounting base 400, and the loading base 100 is mounted in the mounting groove 410. The power-conducting component 500 and the mounting groove 410 are located on the same side of the third mounting base 400, thereby ensuring that the power-conducting component 500 can contact the chip 600 on the loading base 100.
[0039] In one embodiment, the power-conducting component 500 includes a first mounting block 510, a second mounting block, a first probe 520, and a second probe. The first mounting block 510 and the second mounting block are both movably connected to the third mounting base 400. The first probe 520 and the second probe are respectively disposed on the first mounting block 510 and the second mounting block. During the movement of the first mounting block 510 and the second mounting block, the first probe 520 and the second probe can both contact the chip 600.
[0040] Furthermore, the power-conducting assembly 500 also includes a first guide post 530 and a second guide post. Both the first guide post 530 and the second guide post are movably connected to the third mounting base 400, with the first guide post 530 connected to the first mounting block 510 and the second guide post connected to the second mounting block, to guide the movement of the first mounting block 510 and the second mounting block. It is understood that the power-conducting assembly 500 includes two sets of structures, symmetrically arranged. For simplicity, the following description will use either set of structures as an example.
[0041] Furthermore, the energizing assembly 500 also includes a locking member 540 and a return spring 550. The locking member 540 is connected to the mounting block and the third mounting base 400, and the two ends of the return spring 550 abut against the mounting block and the third mounting base 400 respectively. The locking member 540 and the return spring 550 can cooperate to drive the mounting block closer to and away from the third mounting base 400. Optionally, the locking member 540 is a locking bolt. Thus, after the loading base 100 is installed on the third mounting base 400, tightening the locking member 540 can drive the mounting block to descend closer to the third mounting base 400, thereby causing the probe to descend closer to the chip 600 on the loading base 100 until the probe contacts the area to be energized on the chip 600.
[0042] In one embodiment, the end of the probe that contacts the chip 600 is a spring structure. This avoids rigid contact between the probe and the chip 600, thereby preventing damage to the chip 600 during the contact process.
[0043] Please see Figure 7 Based on the aforementioned chip 600 failure analysis fixture, this application also provides a chip 600 failure analysis method, including the following steps: S110, the chip 600 is loaded onto the mounting base 100; S120, the mounting base 100 is installed on the first mounting base 200, and the part of the chip 600 to be tested is observed through a microscope; S130, the mounting base 100 is removed from the first mounting base 200; S140, the mounting base 100 is installed on the second mounting base 300, the mounting base 100 and the second mounting base 300 press the part of the chip 600 to be polished onto the polishing pad, and polish the part of the chip 600 to be polished by the polishing pad to remove the metal electrodes of the chip 600 and expose the area of the chip 600 to be powered on for testing; S150, the mounting base 100 is removed from the second mounting base 300; S160, the mounting base 100 is installed on the third mounting base 400, and the power supply component 500 is brought into contact with the area of the chip 600 to be powered on for testing, and the power supply device supplies power to the chip 600 through the power supply component 500.
[0044] It should be noted that the specific steps for chip 600 failure analysis can be found in the above embodiments and will not be repeated here.
[0045] In summary, the chip 600 failure analysis fixture and method provided in this application have at least one of the following advantages: 1. The chip 600 is loaded onto the mounting base 100. First, the chip 600 is visually inspected by the mounting base 100 in conjunction with the first mounting base 200. Then, the chip 600 is ground by the mounting base 100 in conjunction with the second mounting base 300 to remove the metal electrodes of the chip 600. Finally, the mounting base 100 is connected to the third mounting base 400, and the power supply equipment energizes the active area of the chip 600 through the power supply component 500. This enables failure analysis of the chip 600, identifies potential problems in the chip 600 production process, and allows for improvement of the chip 600 production process, thereby enhancing the performance and reliability of subsequently produced chips 600. 2. The loading seat 100 and the mounting seat are connected by magnetic attachments for quick assembly and disassembly, which improves the testing efficiency; 3. The end of the probe that contacts chip 600 has a spring structure, which can prevent damage to chip 600 during the contact process.
[0046] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A chip failure analysis tool, characterized by, The chip loading seat is used for loading the chip. The first mounting seat, the second mounting seat and the third mounting seat are arranged on the first mounting seat, the second mounting seat and the third mounting seat. The power supply component is arranged on the third mounting seat. When the chip loading seat is mounted on the first mounting seat, the first mounting seat can push the chip out of the chip loading seat, so that the part of the chip to be detected protrudes out of the chip loading seat and the first mounting seat. When the chip loading seat is mounted on the second mounting seat, the part of the chip to be ground protrudes out of the second mounting seat and the chip loading seat. When the chip loading seat is mounted on the third mounting seat, the power supply component can contact the chip. The chip loading seat is provided with a loading groove on one side.
2. The chip failure analysis tool of claim 1, wherein, The first mounting seat is provided with a top block.
3. The chip failure analysis tool of claim 2, wherein, When the chip loading seat is mounted on the first mounting seat, the top block can extend into the loading groove and push the part of the chip out of the loading groove. When the chip loading seat is mounted on the second mounting seat, one side of the chip loading seat loaded with the chip is flush with the bottom side of the second mounting seat.
4. The chip failure analysis tool of claim 1, wherein The second mounting seat is provided with a mounting opening on the bottom side.
5. The chip failure analysis tool of claim 4, wherein The first magnetic member is arranged on the chip loading seat, and the second magnetic members are arranged on the first mounting seat, the second mounting seat and the third mounting seat.
6. The die failure analysis tool of claim 1, wherein, The third mounting seat is provided with a mounting groove on one side, and the power supply component and the mounting groove are located on the same side of the third mounting seat.
7. The die failure analysis tool of claim 1, wherein, The power supply component comprises a first mounting block, a second mounting block, a first probe and a second probe.
8. The die failure analysis tool of claim 1, wherein, The first probe and the second probe are in spring structure.
9. The chip failure analysis tool of claim 8, wherein, The chip failure analysis method comprises the steps of:
10. A method of chip failure analysis using the chip failure analysis tool according to any one of claims 1 to 9, wherein S110, loading the chip on the chip loading seat; S120, mounting the chip loading seat on the first mounting seat and observing the part of the chip to be detected through the microscope; S130, dismounting the chip loading seat from the first mounting seat; S140, mounting the chip loading seat on the second mounting seat, pressing the part of the chip to be ground on the grinding pad through the chip loading seat and the second mounting seat, and grinding the part of the chip to be ground through the grinding pad to expose the part of the chip to be powered for detection; S150, dismounting the chip loading seat from the second mounting seat; S160, mounting the chip loading seat on the third mounting seat and contacting the part of the chip to be powered for detection with the power supply component, and supplying power to the chip through the power supply component.