Temperature acquisition system circuit

Abstract

The invention relates to the technical field of power supply management, and discloses a temperature acquisition system circuit, which comprises a temperature acquisition circuit, the temperature acquisition circuit is composed of a power supply circuit, an MCU circuit, an ADC circuit and eight temperature sensor circuits, the power supply circuit is used for converting a power supply signal, and the MCU circuit is used for converting the power supply signal; a power signal is adapted to the ADC circuit and the eight-way temperature sensor circuit, the eight-way temperature sensor circuit is used for acquiring a temperature signal, converting the temperature signal into a voltage signal and outputting the voltage signal to the ADC circuit, and the ADC circuit is used for acquiring the voltage signal and outputting the voltage signal to the MCU circuit. And the MCU circuit is used for carrying out data acquisition on the voltage signal, maintaining system operation and outputting temperature data. The system has the advantages of multi-channel data acquisition, long-time temperature data storage, improvement of the accuracy of output data through data compensation and the like, and solves the problem of inaccurate output data caused by incapability of meeting acquisition of too many temperature channels and incapability of filtering the data.

Description

Technical Field

[0001] This invention relates to the field of power management technology, specifically to a temperature acquisition system circuit. Background Technology

[0002] Currently, to ensure the safe and stable operation of aircraft, it is necessary to accurately monitor the temperature of individual battery cells. When batteries output power, the cells generate a large amount of heat. If this heat accumulates continuously, it can lead to safety accidents such as short circuits, sudden loss of power, or even spontaneous combustion in the aircraft. Furthermore, when batteries operate at low temperatures, their charging and discharging performance is severely affected. Therefore, thermal management of batteries is essential, and the prerequisite for effective thermal management is the accurate acquisition of the temperature of individual battery cells.

[0003] However, current power management chips on the market do not have a dedicated temperature acquisition channel. They basically acquire analog signals through auxiliary GPIO to complete temperature acquisition. Battery management chips have a very limited number of GPIO ports. In addition to temperature acquisition, they also need to perform functions such as pressure sensing and fan feedback, which cannot meet the needs of acquiring too many temperature channels. At the same time, traditional temperature acquisition cannot filter the data, resulting in inaccurate data output everywhere.

[0004] Therefore, we propose a temperature acquisition system circuit to solve the above problems. Summary of the Invention

[0005] (a) Technical problems to be solved To address the shortcomings of existing technologies, this invention provides a temperature acquisition system circuit that features multi-channel data acquisition, long-term temperature data storage, and improved output data accuracy through data compensation. This solves the problems of inaccurate output data caused by the inability to acquire too many temperature channels and the inability to filter data.

[0006] (II) Technical Solution To achieve the aforementioned objectives, the present invention provides the following technical solution: a temperature acquisition system circuit, comprising: The temperature acquisition circuit consists of a power supply circuit, an MCU circuit, an ADC circuit, and an eight-channel temperature sensor circuit. The power supply circuit converts the power signal to adapt it to the ADC circuit and the eight-channel temperature sensor circuit. The eight-channel temperature sensor circuit acquires the temperature signal and converts it into a voltage signal, which is then output to the ADC circuit. The ADC circuit acquires the voltage signal and outputs it to the MCU circuit. The MCU circuit acquires the voltage signal data, maintains system operation, and outputs temperature data. A storage circuit is provided for receiving and storing data acquired by the temperature acquisition circuit. A temperature compensation circuit is used to calibrate and compensate the eight-channel temperature sensor circuit, thereby improving the temperature data output by the temperature acquisition circuit.

[0007] As a further optimization of the present invention: the power supply circuit includes a power conversion circuit one and a power conversion circuit two. The power conversion circuit one includes a DC-DC chip U2, an XT30, capacitors C6, C7, C8, C9, C1, C3, C4, C5, C10, and C11, resistors R1, R2, R3, R4, R5, and R6, diodes D1 and D2, and an inductor L1. Pin 2 of the XT30 is connected to pin 1 of capacitor C6 and pin 2 of capacitor C7. Pin 1 of the XT30 is connected to pin 1 of capacitor C8, pin 1 of capacitor C9, pin 1 of resistor R2, and pin 2 of DC-DC chip U2, and connected to a 12V voltage. Pin 2 of resistor R2 is connected to pin 3 of DC-DC chip U2, pin 1 of diode D2, and pin 1 of resistor R5. Pin 1 of the XT30 is connected to pin 2 of capacitors C6, C7, C8, and C9, pin 2 of resistor R5, and pin 2 of resistor R6, and grounded. Pin 1 of resistor R6 is connected to the DC-DC chip U2. The circuit is connected to pin 4. Pin 2 of diode D2 outputs the DC-RESET# terminal. Pin 1 of DC-DC chip U2 is connected to pin 1 of capacitor C1. Pin 2 of capacitor C1 is connected to pin 1 of inductor L1, pin 8 of DC-DC chip U2, and pin 1 of diode D1. Pin 7 of DC-DC chip U2 is connected to pin 2 of diode D1 and grounded. Pin 2 of inductor L1 is connected to pin 1 of capacitors C3, C4, and C5, and pin 1 of resistor R1. The circuit is connected to the ground and outputs a 5V voltage. Pin 2 of resistor R1 is connected to pin 1 of resistor R3. Pin 2 of resistor R3 is connected to pin 2 of capacitors C3, C4, and C5 and grounded. Pin 6 of DC-DC chip U2 is connected to pin 1 of resistor R4 and pin 1 of capacitor C10. Pin 2 of resistor R4 is connected to pin 1 of capacitor C11. Pin 2 of capacitor C11 is connected to pin 2 of capacitor C10 and grounded. Pin 9 of DC-DC chip U2 is grounded.

[0008] As a further optimization of the present invention: the second power conversion circuit includes an LDO-U3, a transistor Q1, capacitors C17, C18, C19, C20, C21, a diode D4, and a capacitor R7. The second circuit includes an LDO-U3 whose 8 pins are connected to pin 1 of transistor Q1, pin 1 of capacitor C19, pin 1 of capacitor C20, and pin 1 of resistor R7, and are connected to the 5V output voltage of the first power conversion circuit. The second pin of capacitor C19 is connected to the second pin of capacitor C20 and pin 2 of transistor Q1. The resistor R7 is connected to pin 2 of LDO-U3 and pin 1 of diode D4. Pin 2 of diode D4 outputs LDO-RESET#. Pin 1 of LDO-U3 is connected to pin 1 of capacitor C17 and pin 1 of capacitor C18 and outputs 3.3V. Pins 4 and 9 of LDO-U3 are connected to pins 2 of capacitor C21, pins 2 of capacitor C17 and pin 2 of capacitor C18 and grounded. Pin 1 of capacitor C21 is connected to pin 3 of LDO-U3.

[0009] As a further optimization of the present invention: the MCU circuit includes a chip U1A, the chip U1A including pins 15, 67, 24, 25, 26, 29, 30, 31, 32, 55, 56, 57, 58, 59, 60, 61, 62, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, and 91. Pin 67 is connected to the DC-DC-RESET# terminal output by the first power conversion circuit, and pin 15 is connected to the LDO-RESET# terminal output by the second power conversion circuit.

[0010] As a further optimization of the present invention: the ADC circuit includes an ADC chip U6, the ADC chip U6 including pins 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 24, 25, 27, 28, 29, 30, 31, 32, 33, 49, 51, 53, 55, 57, 59, 61, and 63. The ADC chip U6 has pins 9, 10, 11, 12, 13, 14, 15, 16, 1... Pins 7, 18, 19, 20, 21, and 22 are connected to pins 24, 25, 26, 29, 30, 31, 32, 81, 82, 83, 84, 85, 86, and 87 of chip U1A, respectively. Pins 24 and 25 of ADC chip U6 are connected to pins 88 and 55 of chip U1A, respectively. Pins 27, 28, 29, 30, 31, 32, and 33 of ADC chip U6 are connected to pins 56, 57, 58, 59, 60, 61, and 62 of chip U1A, respectively.

[0011] As a further optimization of the present invention: the eight-channel temperature sensor circuit includes sensor circuit one, sensor circuit two, sensor circuit three, sensor circuit four, sensor circuit five, sensor circuit six, sensor circuit seven, and sensor circuit eight. Sensor circuit one includes resistors R14, R25, and R21, and capacitor C40. Pin 1 of resistor R14 is connected to the 3.3V voltage output by power conversion circuit two. Pin 2 of resistor R14 is connected to pin 1 of resistor R25, pin 1 of capacitor C40, and pin 1 of resistor R21. Pin 2 of resistor R25 is connected to pin 2 of capacitor C40 and grounded. Pin 2 of resistor R21 outputs the ADC-AIN1 terminal. The second sensor circuit includes resistors R15, R26, and R22, and capacitor C41. Pin 1 of resistor R15 is connected to the 3.3V voltage output by the second power conversion circuit. Pin 2 of resistor R15 is connected to pin 1 of resistor R26, pin 1 of capacitor C41, and pin 1 of resistor R22. Pin 2 of resistor R26 is connected to pin 2 of capacitor C41 and grounded. Pin 2 of resistor R22 outputs the ADC-AIN2 terminal. The sensor circuit three includes resistors R16, R27, and R23, and capacitor C42. Pin 1 of resistor R16 is connected to the 3.3V voltage output by power conversion circuit two. Pin 2 of resistor R16 is connected to pin 1 of resistor R27, pin 1 of capacitor C42, and pin 1 of resistor R23. Pin 2 of resistor R27 is connected to pin 2 of capacitor C42 and grounded. Pin 2 of resistor R23 outputs the ADC-AIN3 terminal. The sensor circuit four includes resistors R17, R28, and R24, and capacitor C43. Pin 1 of resistor R17 is connected to the 3.3V voltage output by power conversion circuit two. Pin 2 of resistor R17 is connected to pin 1 of resistor R28, pin 1 of capacitor C43, and pin 1 of resistor R24. Pin 2 of resistor R28 is connected to pin 2 of capacitor C43 and grounded. Pin 2 of resistor R24 ​​outputs the ADC-AIN4 terminal. The sensor circuit five includes resistors R29, R37, and R33, and capacitor C46. Pin 1 of resistor R29 is connected to the 3.3V voltage output by power conversion circuit two. Pin 2 of resistor R29 is connected to pin 1 of resistor R37, pin 1 of capacitor C46, ​​and pin 1 of resistor R33. Pin 2 of resistor R37 is connected to pin 2 of capacitor C46 and grounded. Pin 2 of resistor R33 outputs the ADC-AIN5 terminal. The sensor circuit six includes resistors R30, R38, and R34, and capacitor C47. Pin 1 of resistor R30 is connected to the 3.3V voltage output by power conversion circuit two. Pin 2 of resistor R30 is connected to pin 1 of resistor R38, pin 1 of capacitor C47, and pin 1 of resistor R34. Pin 2 of resistor R38 is connected to pin 2 of capacitor C47 and grounded. Pin 2 of resistor R34 outputs the ADC-AIN6 terminal. The sensor circuit seven includes resistors R31, R39, and R35, and capacitor C48. Pin 1 of resistor R31 is connected to the 3.3V voltage output by power conversion circuit two. Pin 2 of resistor R31 is connected to pin 1 of resistor R39, pin 1 of capacitor C48, and pin 1 of resistor R35. Pin 2 of resistor R39 is connected to pin 2 of capacitor C48 and grounded. Pin 2 of resistor R35 outputs the ADC-AIN7 terminal. The sensor circuit eight includes resistors R32, R40, and R36, and capacitor C49. Pin 1 of resistor R32 is connected to the 3.3V voltage output by power conversion circuit two. Pin 2 of resistor R32 is connected to pin 1 of resistor R40, pin 1 of capacitor C49, and pin 1 of resistor R36. Pin 2 of resistor R40 is connected to pin 2 of capacitor C49 and grounded. Pin 2 of resistor R36 outputs the ADC-AIN8 terminal.

[0012] As a further optimization of the present invention: the ADC-AIN1, ADC-AIN2, ADC-AIN3, ADC-AIN4, ADC-AIN5, ADC-AIN6, ADC-AIN7, and ADC-AIN8 outputs of sensor circuit 1, sensor circuit 2, sensor circuit 3, sensor circuit 4, sensor circuit 5, sensor circuit 6, sensor circuit 7, and sensor circuit 8 are respectively connected to pins 49, 51, 53, 55, 57, 59, 61, and 63 of the ADC chip U6.

[0013] As a further optimization of the present invention: the storage circuit includes chip U7, capacitor C30, and capacitor C31. Pins 2, 3, 5, and 6 of chip U7 are connected to pins 77, 78, 80, and 79 of chip U1A, respectively. Pin 4 of chip U7 is grounded. Pin 8 of chip U7 is connected to pin 1 of capacitor C30 and pin 1 of capacitor C31, and is connected to the MCU circuit. Pin 2 of capacitor C30 is connected to pin 2 of capacitor C31 and is grounded.

[0014] As a further optimization of the present invention: the temperature compensation circuit includes a compensation circuit one and a compensation circuit two. The compensation circuit one includes a chip U8, resistors R18, R19, and R20, and a capacitor C44. Pin 1 of the chip U8 is connected to pin 2 of the resistor R19, pin 2 of the chip U8 is grounded, pin 3 of the chip U8 is connected to pin 2 of the resistor R18, pin 1 of the resistor R18 is connected to pin 1 of the resistor R19 and connected to a 3.3V voltage, pin 4 of the chip U8 is connected to pin 2 of the capacitor C44 and grounded, pin 1 of the capacitor C44 is connected to pin 5 of the chip U8 and connected to a 3.3V voltage, pin 6 of the chip U8 is connected to pin 2 of the resistor R20, and pin 1 of the resistor R20 is connected to a 3.3V voltage.

[0015] As a further optimization of the present invention: the compensation circuit II includes chip U9, PT100, and capacitor C45. Pin 1 of chip U9 is connected to pin 2 of capacitor C45 and grounded. Pin 1 of capacitor C45 is connected to pin 4 of chip U9. Pins 1 and 2 of PT100 are connected to pins 2 and 3 of chip U9, respectively. Pins 5, 6, and 7 of chip U9 are connected to pins 89, 91, and 90 of chip U1A, respectively.

[0016] (III) Beneficial Effects Compared with the prior art, the present invention provides a temperature acquisition system circuit, which has the following beneficial effects: 1. This temperature acquisition system circuit, by setting up a power supply circuit, MCU circuit, ADC circuit and eight-channel temperature sensor circuit, can convert the conventional power signal into a power signal used by the system, and process it through an LC filter to avoid interference with the acquired data, thereby improving the accuracy of obtaining the temperature signal. 2. The temperature acquisition system circuit is compensated and calibrated by the MCU circuit, and then sent to the chip U7 for storage via the SPI interface; there are a total of 10 acquisition circuits, with a data volume of 200 bytes / second. According to the redundancy design, the 4G memory can be used for at least half a year, and the temperature data can be stored in the storage chip U7 for half a year to achieve long-term temperature data storage. 3. The temperature acquisition system circuit uses chip U8, a high-precision temperature sensor, to collect the internal temperature of the system. It integrates an ADC function and sends the temperature data to the MCU circuit via an IIC interface. PT100 is a thermocouple, primarily used to collect ambient temperature. Thermocouples change their electrical properties when heated due to their material characteristics. The data is converted from analog to digital by a dedicated ADC chip and then sent to the MCU circuit via SPI. These two sets of temperature data help calibrate and compensate for the 8-channel temperature acquisition circuit. In systems where measurement is difficult, the three sets of temperature data can be used to calculate more accurate temperature data for temperature compensation. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the power supply circuit structure of the present invention; Figure 2 This is a schematic diagram of the MCU circuit structure of the present invention; Figure 3 This is a schematic diagram of the ADC circuit structure of the present invention; Figure 4 This is a schematic diagram of the circuit structure of the eight-channel temperature sensor of the present invention; Figure 5 This is a schematic diagram of the storage circuit structure of the present invention; Figure 6This is a schematic diagram of the temperature compensation circuit structure of the present invention. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0019] Please see Figure 1-6 Working principle: A temperature acquisition system circuit, including: The temperature acquisition circuit consists of a power supply circuit, an MCU circuit, an ADC circuit, and an eight-channel temperature sensor circuit. The power supply circuit converts the power signal to adapt it to the ADC circuit and the eight-channel temperature sensor circuit. The eight-channel temperature sensor circuit acquires the temperature signal and converts it into a voltage signal, which is then output to the ADC circuit. The ADC circuit acquires the voltage signal and outputs it to the MCU circuit. The MCU circuit acquires the voltage signal data, maintains system operation, and outputs temperature data. The storage circuit receives and stores the data acquired by the temperature acquisition circuit. The temperature compensation circuit is used to calibrate and compensate the eight-channel temperature sensor circuit, thereby improving the temperature data output by the temperature acquisition circuit.

[0020] The power supply circuit includes power conversion circuit one and power conversion circuit two. Power conversion circuit one includes a DC-DC chip U2, XT30, capacitors C6, C7, C8, C9, C1, C3, C4, C5, C10, and C11, resistors R1, R2, R3, R4, R5, and R6, diodes D1 and D2, and inductor L1. Pin 2 of XT30 is connected to pin 1 of capacitors C6, C7, C8, and C9, pin 1 of resistor R2, and pin 2 of DC-DC chip U2, providing a 12V voltage. Pin 2 of resistor R2 is connected to... Pin 3 of the DC-DC converter is connected to pin 1 of diode D2 and pin 1 of resistor R5. Pin 1 of the XT30 converter is connected to pins 2 of capacitors C6, C7, C8, and C9, pins 2 of resistor R5, and pin 2 of resistor R6, and grounded. Pin 1 of resistor R6 is connected to pin 4 of DC-DC chip U2. Pin 2 of diode D2 outputs the DC-DC-RESET# terminal. Pin 1 of DC-DC chip U2 is connected to pin 1 of capacitor C1. Pin 2 of capacitor C1 is connected to pin 1 of inductor L1, pin 8 of DC-DC chip U2, and pin 1 of diode D1. Pin 7 of DC-DC chip U2 is connected to pin 2 of diode D1 and grounded. Inductor L... Pin 2 of DC-DC chip U2 is connected to pins 1 of capacitors C3, C4, and C5, and pin 1 of resistor R1, outputting a 5V voltage. Pin 2 of resistor R1 is connected to pin 1 of resistor R3, and pin 2 of resistor R3 is connected to pins 2 of capacitors C3, C4, and C5, and grounded. Pin 6 of DC-DC chip U2 is connected to pins 1 of resistor R4 and C10, pin 2 of resistor R4 is connected to pin 1 of capacitor C11, and pin 2 of capacitor C11 is connected to pin 2 of capacitor C10, and grounded. Pin 9 of DC-DC chip U2 is grounded. Power conversion circuit two includes LDO-U3, transistor Q1, capacitor C17, and capacitor... C18, capacitors C19, C20, C21, diode D4, and capacitor R7 are connected to pin 8 of LDO-U3, pin 1 of transistor Q1, pin 1 of capacitor C19, pin 1 of capacitor C20, and pin 1 of resistor R7, and are connected to the 5V output of the power conversion circuit. Pin 2 of capacitor C19 is connected to pin 2 of capacitor C20 and pin 2 of transistor Q1 and is grounded. Pin 2 of resistor R7 is connected to pin 5 of LDO-U3 and pin 1 of diode D4. Pin 2 of diode D4 outputs the LDO-RESET# terminal. Pin 1 of LDO-U3 is connected to pin 1 of capacitor C17 and pin 1 of capacitor C18 and outputs 3V.With a 3V voltage, pins 4 and 9 of LDO-U3 are connected to pin 2 of capacitor C21, pin 2 of capacitor C17, and pin 2 of capacitor C18, and grounded. Pin 1 of capacitor C21 is connected to pin 3 of LDO-U3. The 12V power supply from the XT30 is stepped down to 5V by the DC-DC chip U2. The 5V power supply powers the ADC chip U6 and is also stepped down to 3.3V by the LDO-U3 to power the subsequent system.

[0021] The MCU circuit includes chip U1A, which has pins 15, 67, 24, 25, 26, 29, 30, 31, 32, 55, 56, 57, 58, 59, 60, 61, 62, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, and 91. Pin 67 is connected to the DC-DC-RESET# output of power conversion circuit one, and pin 15 is connected to the LDO-RESET# output of power conversion circuit two. The main components consist of the high-performance chip STM32F407VET6, also known as U1A. The 32kHz crystal oscillator X1 and the 8M crystal oscillator X2 provide the system clock. USB1 is a Type-C interface, and U5 is a USB to UART chip. USB and UART are mainly used for transmission, communication, and debugging. The MCU circuit is responsible for important tasks such as data processing and system operation.

[0022] The ADC circuit includes an ADC chip U6, which has pins 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 24, 25, 27, 28, 29, 30, 31, 32, 33, 49, 51, 53, 55, 57, 59, 61, and 63. Pins 18, 19, 20, 21, and 22 are connected to pins 24, 25, 26, 29, 30, 31, 32, 81, 82, 83, 84, 85, 86, and 87 of chip U1A, respectively. Pins 24 and 25 of ADC chip U6 are connected to pins 88 and 55 of chip U1A, respectively. Pins 27, 28, 29, 30, 31, 32, and 33 of ADC chip U6 are connected to pins 56, 57, 58, 59, 60, 61, and 62 of chip U1A, respectively. The ADC chip U6 consists of a 16-bit ADC chip, model AD7606BBSTZ, with a main power supply of 5V and an I / O voltage of 3.3V. Inductors L2, C27, C28, and C29, and inductors L3, C32, and C33 form LC filters, and the power input is supplied to the ADC chip U6 through the LC filters. Resistor R13 is a 0-ohm resistor that separates the ADC circuit from the system circuit to avoid interference with the acquisition circuit. The ADC circuit acquires data every 100ms, and the ADC chip U6 converts the data to AD and sends the calculation results to the MCU circuit through the data pin.

[0023] The eight-channel temperature sensor circuit includes sensor circuit 1, sensor circuit 2, sensor circuit 3, sensor circuit 4, sensor circuit 5, sensor circuit 6, sensor circuit 7, and sensor circuit 8. Sensor circuit 1 includes resistors R14, R25, and R21, and capacitor C40. Pin 1 of resistor R14 is connected to the 3.3V output of power conversion circuit 2. Pin 2 of resistor R14 is connected to pin 1 of resistor R25, pin 1 of capacitor C40, and pin 1 of resistor R21. Pin 2 of resistor R25 is connected to pin 2 of capacitor C40 and grounded. Pin 2 of resistor R21 outputs the ADC-AIN1 terminal. Sensor circuit two includes resistors R15, R26, R22, and capacitor C41. Pin 1 of resistor R15 is connected to the 3.3V output of power conversion circuit two. Pin 2 of resistor R15 is connected to pin 1 of resistor R26, pin 1 of capacitor C41, and pin 1 of resistor R22. Pin 2 of resistor R26 is connected to pin 2 of capacitor C41 and grounded. Pin 2 of resistor R22 outputs the ADC-AIN2 terminal. Sensor circuit three includes resistors R16, R27, R23, and capacitor C42. Pin 1 of resistor R16 is connected to the 3.3V output of power conversion circuit two. Pin 2 of resistor R15 is connected to the ADC-AIN2 terminal. Pin 1 is connected to pin 1 of resistor R27, pin 1 of capacitor C42, and pin 1 of resistor R23. Pin 2 of resistor R27 is connected to pin 2 of capacitor C42 and grounded. Pin 2 of resistor R23 outputs the ADC-AIN3 terminal. Sensor circuit four includes resistors R17, R28, R24, and capacitor C43. Pin 1 of resistor R17 is connected to the 3.3V voltage output from power conversion circuit two. Pin 2 of resistor R17 is connected to pin 1 of resistor R28, pin 1 of capacitor C43, and pin 1 of resistor R24. Pin 2 of resistor R28 is connected to pin 2 of capacitor C43 and grounded. Pin 2 of resistor R24 ​​outputs the ADC-AIN3 terminal. The output ADC-AIN4 terminal is used; Sensor circuit five includes resistors R29, R37, R33, and capacitor C46. Pin 1 of resistor R29 is connected to the 3.3V output of power conversion circuit two. Pin 2 of resistor R29 is connected to pin 1 of resistor R37, pin 1 of capacitor C46, ​​and pin 1 of resistor R33. Pin 2 of resistor R37 is connected to pin 2 of capacitor C46 and grounded. Pin 2 of resistor R33 outputs the ADC-AIN5 terminal; Sensor circuit six includes resistors R30, R38, R34, and capacitor C47. Pin 1 of resistor R30 is connected to the 3.3V output of power conversion circuit two.The 3V voltage is connected to the 3.3V output of the power conversion circuit 2. Resistor R30's pin 2 is connected to resistor R38's pin 1, capacitor C47's pin 1, and resistor R34's pin 1. Resistor R38's pin 2 is connected to capacitor C47's pin 2 and grounded. Resistor R34's pin 2 outputs the ADC-AIN6 terminal. Sensor circuit 7 includes resistors R31, R39, R35, and capacitor C48. Resistor R31's pin 1 is connected to the 3.3V output of the power conversion circuit 2. Resistor R31's pin 2 is connected to resistor R39's pin 1, capacitor C48's pin 1, and resistor R35's pin 1. Resistor R39's pin 2 is connected to capacitor C48's pin 2 and grounded. Resistor R35's pin 2 outputs the ADC-AIN7 terminal. Sensor circuit 8 includes resistors R32, R40, R36, and capacitor C49. Resistor R32's pin 1 is connected to the power conversion circuit 2. The 3.3V output from circuit 2 is connected to pin 2 of resistor R32, pin 1 of resistor R40, pin 1 of capacitor C49, and pin 1 of resistor R36. Pin 2 of resistor R40 is connected to pin 2 of capacitor C49 and grounded. Pin 2 of resistor R36 outputs the ADC-AIN8 terminal. The ADC-AIN1, ADC-AIN2, ADC-AIN3, ADC-AIN4, ADC-AIN5, ADC-AIN6, ADC-AIN7, and ADC-AIN8 terminals output from sensor circuits 1, 2, 3, 4, 5, 6, 7, and 8 are respectively connected to pins 49, 51, 53, 55, 57, 59, 61, and 63 of ADC chip U6. Resistors R14, R25, R15, R26, R16, R27, R17, R28, R29, R37, R30, R38, R31, R39, R32, and R40 are composed of NTC resistors. The resistance of NTC resistors changes with temperature. Due to the series voltage division, the temperature change is converted into a voltage change, which is input to the ADC circuit through ADC_AIN[1:8].

[0024] The storage circuit includes chip U7, capacitor C30, and capacitor C31. Pins 2, 3, 5, and 6 of chip U7 are connected to pins 77, 78, 80, and 79 of chip U1A, respectively. Pin 4 of chip U7 is grounded. Pin 8 of chip U7 is connected to pin 1 of capacitor C30 and pin 1 of capacitor C31, and is also connected to the MCU circuit. Pin 2 of capacitor C30 is connected to pin 2 of capacitor C31 and is grounded. Chip U7 consists of 4GB NAND FLASH U7 memory. The MCU circuit receives the data collected by the ADC circuit, and after compensation and calibration by the MCU circuit, it sends the data to chip U7 for storage via the SPI interface. There are a total of 10 acquisition circuits, with a data volume of 200 bytes / second. According to the redundancy design, the 4GB memory can be used for at least half a year, and the temperature data can be stored in the storage chip U7 for half a year.

[0025] The temperature compensation circuit includes compensation circuit one and compensation circuit two. Compensation circuit one includes chip U8, resistors R18, R19, and R20, and capacitor C44. Pin 1 of chip U8 is connected to pin 2 of resistor R19, pin 2 of chip U8 is grounded, pin 3 of chip U8 is connected to pin 2 of resistor R18, pin 1 of resistor R18 is connected to pin 1 of resistor R19 and connected to a 3.3V voltage, pin 4 of chip U8 is connected to pin 2 of capacitor C44 and grounded, and pin 1 of capacitor C44 is connected to pin 5 of chip U8 for connection to the voltage source. The 3.3V voltage is applied to the circuit. Pin 6 of chip U8 is connected to pin 2 of resistor R20, and pin 1 of resistor R20 is connected to 3.3V. The compensation circuit 2 includes chip U9, PT100, and capacitor C45. Pin 1 of chip U9 is connected to pin 2 of capacitor C45 and grounded. Pin 1 of capacitor C45 is connected to pin 4 of chip U9. Pins 1 and 2 of PT100 are connected to pins 2 and 3 of chip U9, respectively. Pins 5, 6, and 7 of chip U9 are connected to pins 89, 91, and 90 of chip U1A, respectively. Chip U8 is a high-precision temperature sensor, primarily used to acquire internal system temperatures. It integrates an ADC function and transmits temperature data to the MCU circuit via an IIC interface. PT100 is a thermocouple, mainly used to acquire ambient temperature. Due to the material properties of thermocouples, their electrical properties change when heated. Chip U9, a dedicated ADC chip, performs AD conversion and then transmits the data to the MCU circuit via SPI. These two sets of temperature data can help calibrate and compensate for the 8-channel temperature acquisition circuit. In some difficult-to-measure systems, the temperature data can be calculated using these three sets of data for a more accurate reading.

[0026] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A temperature acquisition system circuit, characterized by, The application relates to a temperature acquisition circuit, a storage circuit and a temperature compensation circuit. The temperature acquisition circuit is composed of a power supply circuit, an MCU circuit, an ADC circuit and eight temperature sensor circuits. The power supply circuit is used for converting a power supply signal, so that the power supply signal is adapted to the ADC circuit and the eight temperature sensor circuits. The eight temperature sensor circuits are used for acquiring temperature signals and converting the temperature signals into voltage signals output to the ADC circuit. The ADC circuit is used for acquiring voltage signals and outputting the voltage signals to the MCU circuit. The MCU circuit is used for data acquisition of the voltage signals and system operation maintenance, and outputs temperature data. The storage circuit is used for receiving and storing the data acquired by the temperature acquisition circuit. The temperature compensation circuit is used for calibrating and compensating the eight temperature sensor circuits, so as to improve the temperature data output by the temperature acquisition circuit.

2. The temperature acquisition system circuit of claim 1, wherein: The power supply circuit includes power conversion circuit one and power conversion circuit two, power conversion circuit one includes DCDC chip U2, XT30, capacitor C6, capacitor C7, capacitor C8, capacitor C9, capacitor C1, capacitor C3, capacitor C4, capacitor C5, capacitor C10, capacitor C11, resistor R1, resistor R2, resistor R3, resistor R4, resistor R5, resistor R6, diode D1 and diode D2, inductor L1, the 2 pin of XT30 is connected with the 1st pin of capacitor C6, capacitor C7 1st pin, capacitor C8 1st pin, capacitor C9 1st pin, resistor R2 1st pin and the 2 pin of DCDC chip U2 and access 12V voltage, the 2nd pin of resistor R2 is connected with the 3 pin of DCDC chip U2, the 1st pin of diode D2 and the 1st pin of resistor R5, the 1 pin of XT30 is connected with the 2nd pin of capacitor C6, capacitor C7 2nd pin, capacitor C8 2nd pin, capacitor C9 2nd pin, resistor R5 2nd pin and the 2nd pin of resistor R6 and ground, the 1st pin of resistor R6 is connected with the 4 pin of DCDC chip U2, the 2nd pin of diode D2 outputs DCDC-RESET# end, the 1st pin of DCDC chip U2 is connected with the 1st pin of capacitor C1, the 2nd pin of capacitor C1 is connected with the 1st pin of inductor L1, the 8 pin of DCDC chip U2 and the 1st pin of diode D1, the 7 pin of DCDC chip U2 is connected with the 2nd pin of diode D1 and ground, the 2nd pin of inductor L1 is connected with the 1st pin of capacitor C3, capacitor C4 1st pin, capacitor C5 1st pin and the 1st pin of resistor R1 and outputs 5V voltage, the 2nd pin of resistor R1 is connected with the 1st pin of resistor R3, the 2nd pin of resistor R3 is connected with the 2nd pin of capacitor C3, capacitor C4 2nd pin, capacitor C5 2nd pin and ground, the 6 pin of DCDC chip U2 is connected with the 1st pin of resistor R4, capacitor C10 1st pin, the 2nd pin of resistor R4 is connected with the 1st pin of capacitor C11, the 2nd pin of capacitor C11 is connected with the 2nd pin of capacitor C10 and ground, the 9 pin of DCDC chip U2 is grounded.

3. The temperature acquisition system circuit of claim 2, wherein: The power conversion circuit two includes LDO-U3, transistor Q1, capacitor C17, capacitor C18, capacitor C19, capacitor C20, capacitor C21, diode D4 and capacitor R7, the 8th pin of the LDO-U3 is connected with the first pin of the transistor Q1, the first pin of the capacitor C19, the first pin of the capacitor C20 and the first pin of the resistor R7, and is connected to the 5V voltage output by the power conversion circuit one, the second pin of the capacitor C19 is connected with the second pin of the capacitor C20 and the second pin of the transistor Q1, and is grounded, the second pin of the resistor R7 is connected with the 5th pin of the LDO-U3 and the first pin of the diode D4, the second pin of the diode D4 outputs the LDO-RESET# end, the first pin of the capacitor C17 and the first pin of the capacitor C18 are connected with the 1st pin of the LDO-U3, and output 3.3V voltage, the 4th pin and the 9th pin of the LDO-U3 are connected with the second pin of the capacitor C21, the second pin of the capacitor C17 and the second pin of the capacitor C18, and are grounded, and the first pin of the capacitor C21 is connected with the 3rd pin of the LDO-U3.

4. The temperature acquisition system circuit of claim 3, wherein: The MCU circuit includes a chip U1A, the chip U1A includes 15th pin, 67th pin, 24th pin, 25th pin, 26th pin, 29th pin, 30th pin, 31th pin, 32th pin, 55th pin, 56th pin, 57th pin, 58th pin, 59th pin, 60th pin, 61th pin, 62th pin, 77th pin, 78th pin, 79th pin, 80th pin, 81th pin, 82th pin, 83th pin, 84th pin, 85th pin, 86th pin, 87th pin, 88th pin, 89th pin, 90th pin and 91th pin, the 67th pin is connected with the DCDC-RESET# end output by the power conversion circuit one, and the 15th pin is connected with the LDO-RESET# end output by the power conversion circuit two.

5. The temperature acquisition system circuit of claim 4, wherein: The ADC circuit includes an ADC chip U6, the ADC chip U6 includes 9 pins, 10 pins, 11 pins, 12 pins, 13 pins, 14 pins, 15 pins, 16 pins, 17 pins, 18 pins, 19 pins, 20 pins, 21 pins, 22 pins, 24 pins, 25 pins, 27 pins, 28 pins, 29 pins, 30 pins, 31 pins, 32 pins, 33 pins, 49 pins, 51 pins, 53 pins, 55 pins, 57 pins, 59 pins, 61 pins, 63 pins, the 9 pins, 10 pins, 11 pins, 12 pins, 13 pins, 14 pins, 15 pins, 16 pins, 17 pins, 18 pins, 19 pins, 20 pins, 21 pins, 22 pins of the ADC chip U6 are connected with the 24 pins, 25 pins, 26 pins, 29 pins, 30 pins, 31 pins, 32 pins, 81 pins, 82 pins, 83 pins, 84 pins, 85 pins, 86 pins, 87 pins of the chip U1A respectively, the 24 pins, 25 pins of the ADC chip U6 are connected with the 88 pins, 55 pins of the chip U1A respectively, the 27 pins, 28 pins, 29 pins, 30 pins, 31 pins, 32 pins, 33 pins of the ADC chip U6 are connected with the 56 pins, 57 pins, 58 pins, 59 pins, 60 pins, 61 pins, 62 pins of the chip U1A respectively.

6. The temperature acquisition system circuit of claim 5, wherein: The eight-way temperature sensor circuit includes sensor circuit one, sensor circuit two, sensor circuit three, sensor circuit four, sensor circuit five, sensor circuit six, sensor circuit seven and sensor circuit eight, the sensor circuit one includes resistance R14, resistance R25, resistance R21 and capacitor C40, the 1st pin of the resistance R14 is connected with 3.3V voltage output by the power conversion circuit two, the 2nd pin of the resistance R14 is connected with the 1st pin of the resistance R25, the 1st pin of the capacitor C40 and the 1st pin of the resistance R21, the 2nd pin of the resistance R25 is connected with the 2nd pin of the capacitor C40 and grounded, the 2nd pin of the resistance R21 outputs the end of ADC-AIN1; The sensor circuit two includes resistance R15, resistance R26, resistance R22 and capacitor C41, the 1st pin of the resistance R15 is connected with 3.3V voltage output by the power conversion circuit two, the 2nd pin of the resistance R15 is connected with the 1st pin of the resistance R26, the 1st pin of the capacitor C41 and the 1st pin of the resistance R22, the 2nd pin of the resistance R26 is connected with the 2nd pin of the capacitor C41 and grounded, the 2nd pin of the resistance R22 outputs the end of ADC-AIN2; The sensor circuit three includes resistance R16, resistance R27, resistance R23 and capacitor C42, the first pin of the resistance R16 is connected to the 3.3V voltage output by the power conversion circuit two, the second pin of the resistance R16 is connected with the first pin of the resistance R27, the first pin of the capacitor C42 and the first pin of the resistance R23, the second pin of the resistance R27 is connected with the second pin of the capacitor C42 and grounded, and the second pin of the resistance R23 outputs the ADC-AIN3 end; The sensor circuit four includes resistance R17, resistance R28, resistance R24 and capacitor C43, the first pin of the resistance R17 is connected to the 3.3V voltage output by the power conversion circuit two, the second pin of the resistance R17 is connected with the first pin of the resistance R28, the first pin of the capacitor C43 and the first pin of the resistance R24, the second pin of the resistance R28 is connected with the second pin of the capacitor C43 and grounded, and the second pin of the resistance R24 outputs the ADC-AIN4 end; The sensor circuit five includes resistance R29, resistance R37, resistance R33 and capacitor C46, the first pin of the resistance R29 is connected to the 3.3V voltage output by the power conversion circuit two, the second pin of the resistance R29 is connected with the first pin of the resistance R37, the first pin of the capacitor C46 and the first pin of the resistance R33, the second pin of the resistance R37 is connected with the second pin of the capacitor C46 and grounded, and the second pin of the resistance R33 outputs the ADC-AIN5 end; The sensor circuit six includes resistance R30, resistance R38, resistance R34 and capacitor C47, the first pin of the resistance R30 is connected to the 3.3V voltage output by the power conversion circuit two, the second pin of the resistance R30 is connected with the first pin of the resistance R38, the first pin of the capacitor C47 and the first pin of the resistance R34, the second pin of the resistance R38 is connected with the second pin of the capacitor C47 and grounded, and the second pin of the resistance R34 outputs the ADC-AIN6 end; The sensor circuit seven includes resistance R31, resistance R39, resistance R35 and capacitor C48, the first pin of the resistance R31 is connected to the 3.3V voltage output by the power conversion circuit two, the second pin of the resistance R31 is connected with the first pin of the resistance R39, the first pin of the capacitor C48 and the first pin of the resistance R35, the second pin of the resistance R39 is connected with the second pin of the capacitor C48 and grounded, and the second pin of the resistance R35 outputs the ADC-AIN7 end; The sensor circuit eight includes resistance R32, resistance R40, resistance R36 and capacitor C49, the first pin of the resistance R32 is connected to the 3.3V voltage output by the power conversion circuit two, the second pin of the resistance R32 is connected with the first pin of the resistance R40, the first pin of the capacitor C49 and the first pin of the resistance R36, the second pin of the resistance R40 is connected with the second pin of the capacitor C49 and grounded, and the second pin of the resistance R36 outputs the ADC-AIN8 end.

7. The temperature acquisition system circuit of claim 6, wherein: The sensor circuit one, sensor circuit two, sensor circuit three, sensor circuit four, sensor circuit five, sensor circuit six, sensor circuit seven, sensor circuit eight output ADC-AIN1 end, ADC-AIN2 end, ADC-AIN3 end, ADC-AIN4 end, ADC-AIN5 end, ADC-AIN6 end, ADC-AIN7 end, ADC-AIN8 end are connected with the 49th pin, 51st pin, 53rd pin, 55th pin, 57th pin, 59th pin, 61st pin, 63rd pin of the ADC chip U6 respectively.

8. The temperature acquisition system circuit of claim 4, wherein: The storage circuit includes chip U7, capacitor C30 and capacitor C31, the 2nd pin, 3rd pin, 5th pin and 6th pin of the chip U7 are connected with the 77th pin, 78th pin, 80th pin and 79th pin of the chip U1A respectively, the 4th pin of the chip U7 is grounded, the 8th pin of the chip U7 is connected with the 1st pin of the capacitor C30 and the 1st pin of the capacitor C31 and connected with the MCU circuit, the 2nd pin of the capacitor C30 is connected with the 2nd pin of the capacitor C31 and grounded.

9. The temperature acquisition system circuit of claim 4, wherein: The temperature compensation circuit includes compensation circuit one and compensation circuit two, the compensation circuit one includes chip U8, resistor R18, resistor R19, resistor R20 and capacitor C44, the 1st pin of the chip U8 is connected with the 2nd pin of the resistor R19, the 2nd pin of the chip U8 is grounded, the 3rd pin of the chip U8 is connected with the 2nd pin of the resistor R18, the 1st pin of the resistor R18 is connected with the 1st pin of the resistor R19 and connected with 3.3V voltage, the 4th pin of the chip U8 is connected with the 2nd pin of the capacitor C44 and grounded, the 1st pin of the capacitor C44 is connected with the 5th pin of the chip U8 and connected with 3.3V voltage, the 6th pin of the chip U8 is connected with the 2nd pin of the resistor R20, the 1st pin of the resistor R20 is connected with 3.3V voltage.

10. The temperature acquisition system circuit of claim 9, wherein: The compensation circuit two includes chip U9, PT100 and capacitor C45, the 1st pin of the chip U9 is connected with the 2nd pin of the capacitor C45 and grounded, the 1st pin of the capacitor C45 is connected with the 4th pin of the chip U9, the 1st pin and 2nd pin of the PT100 are connected with the 2nd pin and 3rd pin of the chip U9 respectively, the 5th pin, 6th pin and 7th pin of the chip U9 are connected with the 89th pin, 91st pin and 90th pin of the chip U1A respectively.

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