A high-precision modular event timing system
By using a modular event timing system based on the MicroTCA.4 standard and Zynq SoC architecture, the problems of insufficient hardware modularity and scalability are solved, achieving nanosecond-level event triggering accuracy and signal transmission stability, making it suitable for high-precision industrial control and scientific research experiments.
Patent Information
- Application Number
- CN202511681757.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-17
- Publication Date
- 2026-07-24
- Estimated Expiration
- 2045-11-17
AI Technical Summary
Existing event timing devices suffer from insufficient hardware modularity and scalability, making it difficult to meet the requirements of multi-channel synchronous control and flexible configuration. Traditional mLVDS signal transmission methods are prone to signal conflicts and bandwidth bottlenecks, failing to meet the needs of high-precision and high-stability industrial control and scientific research experiments.
The system employs a high-precision modular event timing system based on the MicroTCA.4 standard and Zynq SoC architecture, including the Zynq SoC timing main logic AMC board, RTM board, FMC board, and terminal matching board. Through AXI bus communication and high-speed photoelectric conversion technology, it achieves nanosecond-level event timing accuracy and multi-level interface adaptation, and supports dynamic configuration and independent signal control.
It achieves nanosecond-level event triggering accuracy, improves the system's flexibility and scalability, enhances the real-time performance and stability of signal transmission, adapts to different application scenarios, and meets the needs of high-precision and high-reliability industrial control and scientific research experiments.