Mainboard cutting control system and method for computer processing

Abstract

The invention provides a mainboard board cutting control system and method for computer processing. The mainboard board cutting control method comprises the steps that stress wave signals and heat distribution images corresponding to cutting points are collected; identifying deformation characteristics at the cutting points based on the stress wave signals, and identifying potential heat accumulation areas in front of cutting point paths according to the heat distribution images; determining a first path offset in the cutting process according to the deformation characteristics in combination with the critical stress state of the cutting point, and further determining a first compensation path; in space-time correlation analysis of the space coordinates of the potential heat accumulation area and the first compensation path, when it is judged that a follow-up cutting section of the first compensation path passes through the potential heat accumulation area, a heat regulation and control instruction generated when the main board is cut is generated according to the heat radiation intensity gradient of the potential heat accumulation area; and the mainboard board is cooperatively cut based on the first compensation path and the heat regulation and control instruction. According to the technical scheme, deviation compensation of the cutting path of the main board can be achieved under the influence of stress concentration and heat accumulation.

Description

Technical Field

[0001] This application relates to the field of cutting control technology, and more specifically, to a cutting control system and method for motherboard plates used in computer processing. Background Technology

[0002] Cutting is a fundamental process in modern manufacturing, and its control level directly determines the processing quality and efficiency. Traditional cutting relies on manual experience or mechanical contouring, which has limited precision and adaptability. With the popularization of CNC technology, servo drives, and precision machinery, cutting has entered a new stage characterized by programming and automation. The core control task is to accurately coordinate the trajectory, speed, and start and stop of the actuator. Current technological frontiers are focusing on introducing machine vision, sensor feedback, and artificial intelligence algorithms to achieve automatic identification of workpieces, real-time path compensation, and adaptive optimization of process parameters, aiming to comprehensively improve the precision of cutting to meet the needs of complex and high-end manufacturing.

[0003] In existing cutting control, the cutting control is based on the closed-loop servo control of the CNC system. First, the CNC system decomposes the pre-programmed machining path into the command positions of each motion axis. Then, sensors such as encoders detect the actual position of the motor in real time and feed it back to the controller. The controller compares the command position with the actual position to generate speed or torque commands, thereby achieving precise tracking of the cutting head's motion trajectory. However, in the cutting control of motherboard plates for computer machining, the mechanical stress generated by the contact between the cutting tool and the motherboard plate will cause local plastic deformation. At the same time, the cutting heat input will cause non-uniform thermal expansion and thermal diffusion of the motherboard plate, forming a heat accumulation area. The mechanical stress concentration area often overlaps with the heat accumulation area, causing the motherboard plate to deform. This leads to the cutting path of the motherboard plate deviating from the reference cutting path. Therefore, how to achieve deviation compensation of the motherboard plate cutting path under the influence of stress concentration and heat accumulation has become a difficult problem for the industry. Summary of the Invention

[0004] This application provides a cutting control system and method for motherboard materials used in computer processing, which can compensate for deviations in the cutting path of motherboard materials under the influence of stress concentration and heat accumulation.

[0005] In a first aspect, this application provides a method for controlling the cutting of motherboard material for computer processing, comprising the following steps: During the process of cutting the motherboard material for computer processing along the reference cutting path, stress wave signals and thermal distribution images are collected at the cutting points. Based on the stress wave signal, the deformation characteristics of the motherboard material at the cutting point are identified. Based on the thermal distribution image, thermal diffusion analysis is performed on the cutting point area, thereby identifying the potential heat accumulation area located in front of the cutting point path. Based on the deformation characteristics and the critical stress state of the cutting point, the first path offset during the cutting process of the motherboard material is determined, and the first path offset is used to compensate the reference cutting path under the influence of stress deformation to obtain the first compensation path. The spatial coordinates of the potential heat accumulation area are analyzed in a spatiotemporal correlation with the first compensation path. During the spatiotemporal matching analysis, when it is determined that the subsequent cutting segment of the first compensation path passes through the potential heat accumulation area, a thermal control command for cutting the motherboard material is generated based on the thermal radiation intensity gradient of the potential heat accumulation area. The motherboard material is cut collaboratively using the first compensation path and the thermal control command.

[0006] In some embodiments, identifying the deformation characteristics of the motherboard material at the cutting point based on the stress wave signal specifically includes: Determine the energy distribution characteristics of the stress wave signal; Establish a mapping relationship between energy distribution characteristics and the degree of deformation of the motherboard material; The deformation and deformation direction at the cutting point are calculated based on the mapping relationship and the energy distribution characteristics. The deformation characteristics of the mainboard material at the cutting point are determined based on the calculated deformation amount and deformation direction.

[0007] In some embodiments, performing thermal diffusion analysis on the cutting point region based on the thermal distribution image to identify potential heat accumulation regions located in front of the cutting point path specifically includes: The thermal distribution image is analyzed for temperature field to obtain the instantaneous temperature value and temperature gradient distribution of the cutting point and surrounding area; The dominant direction of heat diffusion during motherboard material cutting is determined based on the temperature gradient distribution. The region to be analyzed is delineated along the extension direction of the reference cutting path, matching the dominant direction of heat diffusion; Calculate the temperature change rate of each sub-region within the area to be analyzed, and identify sub-regions with a consistently positive temperature change rate as potential heat accumulation regions.

[0008] In some embodiments, determining the first path offset during the cutting process of the motherboard material based on the deformation characteristics and the critical stress state of the cutting point specifically includes: Obtain the deformation amount and deformation direction in the deformation feature; The current stress value at the cutting point is detected, and the critical stress state of the cutting point is determined based on the material properties of the motherboard material. Calculate the stress difference between the current stress value and the critical stress state to obtain the stress surplus; Establish the coupling relationship between deformation amount, deformation direction and stress surplus, and then determine the stress-deformation compensation coefficient; The first path offset during the cutting process of the motherboard material is determined based on the stress-deformation compensation coefficient, the deformation amount, and the deformation direction.

[0009] In some embodiments, the first compensation path is obtained by performing stress deformation compensation on the reference cutting path based on the first path offset, specifically including: The coordinate sequence of the reference cutting path is analyzed to obtain the spatial coordinate parameters of each discrete cutting point on the reference cutting path. Based on the magnitude and direction of the first path offset, calculate the compensation coordinate increment corresponding to each discrete cutting point; The spatial coordinate parameters of each discrete cutting point are vector-superimposed with the corresponding compensation coordinate increments to obtain the compensation coordinates of each discrete cutting point. The compensation coordinates of each discrete cutting point are smoothed by interpolation to generate the first compensation path.

[0010] In some embodiments, performing spatiotemporal correlation analysis between the spatial coordinates of the potential heat accumulation region and the first compensation path specifically includes: Extract the boundary coordinates of the potential heat accumulation region to generate a boundary coordinate set; Analyze the time sequence and corresponding spatial coordinates of the cutting actuator moving along the first compensation path; The spatial intersection operation is performed between the boundary coordinate set and the spatial coordinates of the first compensation path to obtain the spatial overlapping region. Based on the preset movement speed of the cutting actuator, the time interval for passing through the spatially overlapping area is calculated, thereby completing the spatiotemporal correlation analysis between the potential heat accumulation area and the first compensation path.

[0011] In some embodiments, an infrared camera is used to capture the thermal distribution image corresponding to the cutting point.

[0012] Secondly, this application provides a motherboard material cutting control system for computer processing, comprising: The acquisition module is used to acquire stress wave signals and thermal distribution images at the cutting points during the cutting process of the motherboard material used for computer processing along the reference cutting path. The processing module is used to identify the deformation characteristics of the motherboard material at the cutting point based on the stress wave signal, perform thermal diffusion analysis on the cutting point area based on the thermal distribution image, and then identify the potential heat accumulation area located in front of the cutting point path. The processing module is further configured to determine the first path offset during the cutting process of the motherboard material based on the deformation characteristics and the critical stress state of the cutting point, and to perform cutting compensation under stress deformation on the reference cutting path based on the first path offset, thereby obtaining the first compensation path. The processing module is further configured to perform spatiotemporal correlation analysis between the spatial coordinates of the potential heat accumulation area and the first compensation path. During the spatiotemporal matching analysis, when it is determined that the subsequent cutting segment of the first compensation path passes through the potential heat accumulation area, a thermal control command for cutting the motherboard material is generated based on the thermal radiation intensity gradient of the potential heat accumulation area. The execution module is used to perform coordinated cutting of the motherboard material through the first compensation path and the thermal control command.

[0013] Thirdly, this application provides a computer device, the computer device including a memory and a processor, the memory storing code, and the processor being configured to acquire the code and execute the above-described computer processing motherboard sheet cutting control method.

[0014] Fourthly, this application provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the above-described computer-processing motherboard sheet cutting control method.

[0015] The technical solutions provided by the embodiments disclosed in this application have the following beneficial effects: The computer motherboard material cutting control system and method provided in this application firstly acquires stress wave signals and thermal distribution images at the cutting point during the cutting of the motherboard material along a reference cutting path; secondly, based on the stress wave signals, the deformation characteristics of the motherboard material at the cutting point are identified, and thermal diffusion analysis is performed on the cutting point area according to the thermal distribution image to identify a potential heat accumulation area located in front of the cutting point path; further, based on the deformation characteristics and the critical stress state of the cutting point, a first path offset is determined during the cutting process of the motherboard material, and the first path offset is used to compensate the reference cutting path under the influence of stress deformation to obtain a first compensation path; then, the spatial coordinates of the potential heat accumulation area are spatiotemporally correlated with the first compensation path, and during the spatiotemporal matching analysis, when it is determined that the subsequent cutting segment of the first compensation path passes through the potential heat accumulation area, a thermal control command is generated for cutting the motherboard material according to the thermal radiation intensity gradient of the potential heat accumulation area; finally, the motherboard material is collaboratively cut using the first compensation path and the thermal control command.

[0016] Therefore, this application can achieve deviation compensation of the cutting path of the motherboard sheet under the influence of stress concentration and heat accumulation. First, it collects stress wave signals and heat distribution images at the cutting point, providing real-time raw data support for subsequent deformation feature identification and heat accumulation area analysis, avoiding deviations in subsequent judgments due to missing data. Second, it identifies deformation features based on stress wave signals and potential heat accumulation areas based on heat distribution images, enabling early identification of stress deformation hazards and heat accumulation risks during the cutting process, clarifying the targets for subsequent targeted cutting compensation and thermal control, and preventing the risk from escalating. Furthermore, it determines the first path offset and obtains the first compensation path by using deformation features and critical stress state to counteract the influence of stress deformation on the cutting path and avoid the cutting tool... The mechanical stress generated by contact with the motherboard material causes localized plastic deformation, leading to cutting deviations, thus ensuring the spatial accuracy of the cutting path. Then, a spatiotemporal correlation analysis is used to generate thermal control commands, establishing a spatiotemporal correspondence between the first compensation path and potential heat accumulation areas. This allows thermal control to precisely match the cutting sequence and spatial position, avoiding cutting deviations caused by thermal deformation of the material due to heat accumulation during the cutting process. Finally, collaborative cutting based on the first compensation path and thermal control commands achieves synchronous linkage between path compensation and thermal control, doubly balancing the stress and temperature distribution during the cutting process, ultimately improving the cutting accuracy of the motherboard material. In summary, the technical solution provided in this application can compensate for deviations in the motherboard material cutting path under the influence of stress concentration and heat accumulation. Attached Figure Description

[0017] Figure 1 This is an exemplary flowchart of a computer-aided motherboard material cutting control method according to some embodiments of this application; Figure 2 This is an exemplary flowchart illustrating the determination of deformation features according to some embodiments of this application; Figure 3 This is an exemplary flowchart illustrating the determination of a first compensation path according to some embodiments of this application; Figure 4 This is a schematic diagram of the structure of a computer-aided motherboard material cutting control system according to some embodiments of this application; Figure 5 This is a schematic diagram of the structure of a computer device that implements a method for controlling the cutting of motherboard sheet material for computer processing, according to some embodiments of this application. Detailed Implementation

[0018] To better understand the technical solution of this application, the technical solution of this application will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0019] refer to Figure 1The figure is an exemplary flowchart of a computer motherboard material cutting control method according to some embodiments of this application. The computer motherboard material cutting control method mainly includes the following steps: In step 101, during the cutting of the motherboard material for computer processing along the reference cutting path, stress wave signals and thermal distribution images corresponding to the cutting points are collected.

[0020] In practice, during the cutting of the motherboard material for computer processing along the reference cutting path, the stress wave signal at the cutting point can be collected by an acoustic emission sensor integrated on the cutting actuator, and the thermal distribution image at the cutting point can be collected by an infrared camera. The reference cutting path refers to the ideal cutting trajectory of the motherboard material that has been preset, which can be obtained from the cutting instructions of the motherboard material, and will not be elaborated here.

[0021] It should be noted that, in this application, the stress wave signal refers to the transient elastic wave generated instantaneously inside the material when the cutting actuator interacts with the main board. The signal characteristics of the stress wave signal reflect the dynamic process of microscopic fracture, deformation and rapid release of internal stress at the cutting point. In this application, the thermal distribution image refers to the temperature field image of the cutting point and its surrounding area captured by an infrared camera. The thermal distribution image visually presents the heat generated by friction and plastic deformation during the cutting process and its spatial diffusion on the surface of the wood board.

[0022] In step 102, the deformation characteristics of the motherboard material at the cutting point are identified based on the stress wave signal, and the thermal diffusion analysis of the cutting point area is performed based on the thermal distribution image to identify the potential heat accumulation area located in front of the cutting point path.

[0023] In some embodiments, reference Figure 2 As shown, this figure is an exemplary flowchart illustrating the determination of deformation characteristics according to some embodiments of this application. In this embodiment, the identification of deformation characteristics of the motherboard material at the cutting point based on the stress wave signal can be achieved by the following steps: First, in step 1021, the energy distribution characteristics of the stress wave signal are determined; Secondly, in step 1022, a mapping relationship is established between the energy distribution characteristics and the degree of deformation of the motherboard material; Then, in step 1023, the deformation and deformation direction at the cutting point are calculated based on the mapping relationship and the energy distribution characteristics. Finally, in step 1024, the deformation characteristics of the main board material at the cutting point are determined based on the calculated deformation amount and deformation direction.

[0024] In specific implementation, firstly, the filtered stress wave signal is converted into a frequency domain signal using a Fast Fourier Transform (FFT). The power spectral density at each frequency point in the frequency domain signal is calculated to obtain the characteristic frequency bands related to deformation. The power spectral density within these characteristic frequency bands is then integrated. Using an experimental calibration method, samples of the same material and specifications as the motherboard material to be cut are selected. A controlled loading device applies deformation of known magnitude and direction to the samples, simultaneously acquiring the energy distribution characteristics of the stress wave signal under each deformation state. The energy distribution characteristics of each sample under different deformation states are used as independent variables, and the corresponding deformation is used as... The output quantity is fitted using the least squares method, and the resulting regression equation is used as a mapping relationship between the stress wave and the deformation degree of the motherboard material. This mapping relationship refers to the mathematical relationship describing the one-to-one correspondence between the stress wave and the deformation degree of the motherboard material. Then, the energy distribution characteristics are substituted into the established mapping relationship, and the deformation amount and deformation direction at the cutting point are calculated from the mapping relationship. The deformation amount refers to the displacement of the motherboard material at the cutting point relative to its initial state, and the deformation direction is the specific direction of the displacement when the material deforms. Finally, the calculated deformation amount and deformation direction are combined to characterize the deformation features of the motherboard material at the cutting point.

[0025] It should be noted that, in this application, deformation characteristics refer to parameters that reflect the magnitude and direction of deformation of the motherboard material at the cutting point. Determining the deformation characteristics at the cutting point of the motherboard material can accurately identify the deformation state of the motherboard material caused by stress during the cutting process, providing a direct and crucial basis for subsequent cutting path compensation. By clarifying the magnitude and direction of deformation, the reference cutting path can be adjusted in a targeted manner to offset the cutting deviation caused by deformation and avoid cut offset and dimensional deviation.

[0026] In some embodiments, the identification of potential heat accumulation areas located in front of the cutting point path by performing thermal diffusion analysis on the cutting point region based on the thermal distribution image is achieved through the following steps: The thermal distribution image is analyzed for temperature field to obtain the instantaneous temperature value and temperature gradient distribution of the cutting point and surrounding area; The dominant direction of heat diffusion during motherboard material cutting is determined based on the temperature gradient distribution. The region to be analyzed is delineated along the extension direction of the reference cutting path, matching the dominant direction of heat diffusion; Calculate the temperature change rate of each sub-region within the area to be analyzed, and identify sub-regions with a consistently positive temperature change rate as potential heat accumulation regions.

[0027] In practical implementation, firstly, the grayscale value of each pixel in the thermal distribution image is converted to the actual temperature of its corresponding spatial location using a linear calibration equation between the output grayscale value and the actual temperature preset by the infrared camera. This converted actual temperature is then used as the instantaneous temperature value of the corresponding cutting point and surrounding area. Next, the Sobel gradient operator is used to perform spatial domain convolution on the instantaneous temperature values ​​of the pixels in the thermal distribution image. The temperature difference between each pixel and its adjacent pixels in the horizontal (x-axis) and vertical (y-axis) directions is calculated. Combined with the actual physical distance between the pixels (i.e., calculated from the infrared camera resolution and shooting distance), the rate of temperature change in the horizontal and vertical directions is calculated using "temperature difference / physical distance". Finally, the Pythagorean theorem is applied... The resultant rate of temperature change in the horizontal and vertical directions is used as the temperature gradient magnitude, and the direction angle of the resultant rate is used as the temperature gradient direction. The temperature gradient magnitudes and directions of all pixels are integrated according to their spatial locations to form the temperature gradient distribution of the cutting point and its surrounding area. This temperature gradient distribution refers to the magnitude and spatial direction of the temperature change rate at each spatial location around the cutting point. Next, all temperature gradient vectors in the temperature gradient distribution are sorted by magnitude, and the top N temperature gradient vectors with the largest magnitudes are selected (where N is a preset statistical number, which can be set according to actual needs). The average value of the temperature gradient direction corresponding to the top N temperature gradient vectors is calculated, and the angle between this average value and the extension direction of the reference cutting path is selected to be within ±30°. The temperature gradient direction within a certain range is determined as the dominant direction of heat diffusion during motherboard material cutting. This dominant direction refers to the spatial orientation where heat propagation intensity is greatest within the motherboard material and is related to the cutting path. Then, by extracting the coordinates of the start, end, and intermediate key nodes of the reference cutting path (which can be selected according to actual needs), an extension trajectory of the reference cutting path in front of the cutting point (i.e., a straight line extending forward along the tangent direction of the reference cutting path) is generated using existing linear interpolation methods. Using this extension trajectory as the central axis, a coverage angle of 15° is set to the left and right based on the angle range of the dominant heat diffusion direction. A rectangular region generation algorithm is used to delineate a spatial range matching the coverage angle of the dominant heat diffusion direction. The region to be analyzed refers to the target analysis space in front of the focused cutting path and covering the dominant heat diffusion direction. Finally, the region to be analyzed is divided into multiple sub-regions of equal area according to a preset pixel size (e.g., 8×8 pixels, which is not limited here) using an existing uniform grid. The instantaneous temperature value of the same sub-region in the continuous frame heat distribution image is extracted by matching the image frame sequence number. The temperature change rate of the corresponding sub-region is calculated by the first-order forward difference method, thereby obtaining the temperature change rate of all sub-regions in the region to be analyzed. For sub-regions with a positive temperature change rate, heat distribution image monitoring is performed for a preset number of frames. If a sub-region has a positive temperature change rate in every frame of the preset number of frames, then the sub-region is identified as a potential heat accumulation region.

[0028] It should be noted that, in this application, the potential heat accumulation area refers to the area in front of the cutting point path where heat continuously accumulates. During the cutting process of the motherboard material, the heat generated by the cutting heat source is prone to accumulate in front of the cutting point path. If not controlled in time, it will lead to excessively high local temperature, causing thermal deformation of the motherboard material and cutting deviation. Therefore, identifying the potential heat accumulation area can locate the dangerous area where heat continuously accumulates in front of the cutting path, providing clear targets and data support for the generation of subsequent thermal control commands, avoiding local overheating that causes thermal deformation of the motherboard material and cutting deviation, and ensuring that the cutting quality of the motherboard material meets the design requirements.

[0029] In step 103, the first path offset during the cutting process of the motherboard material is determined based on the deformation characteristics and the critical stress state of the cutting point. The first path offset is used to compensate the reference cutting path under the influence of stress deformation, thereby obtaining the first compensation path.

[0030] In some embodiments, determining the first path offset during the cutting process of the motherboard material based on the deformation characteristics and the critical stress state of the cutting point is achieved through the following steps: Obtain the deformation amount and deformation direction in the deformation feature; The current stress value at the cutting point is detected, and the critical stress state of the cutting point is determined based on the material properties of the motherboard material. Calculate the stress difference between the current stress value and the critical stress state to obtain the stress surplus; Establish the coupling relationship between deformation amount, deformation direction and stress surplus, and then determine the stress-deformation compensation coefficient; The first path offset during the cutting process of the motherboard material is determined based on the stress-deformation compensation coefficient, the deformation amount, and the deformation direction.

[0031] In specific implementation, firstly, the deformation amount and deformation direction in the deformation characteristics are obtained; secondly, resistance strain gauges attached around the cutting point are used to collect the current stress value at the cutting point, and at the same time, the maximum stress value of the motherboard material without plastic deformation is obtained by consulting the material mechanical properties manual of the motherboard material as the critical stress state of the cutting point. The critical stress state refers to the critical stress value that characterizes the motherboard material at the cutting point to begin irreversible deformation; further, the difference between the current stress value and the critical stress state is calculated, and the calculated difference is used as the stress surplus, which refers to the additional stress value at the cutting point that exceeds the critical stress; then, samples of the same material and specifications as the motherboard material being cut are selected, and gradient controllable deformation is applied to the samples using a material testing machine. Simultaneously, resistance strain gauges are used to collect the current stress value of the cutting point under each deformation state. Based on the current stress value of the cutting point under each deformation state, the stress surplus corresponding to each deformation state is determined by the aforementioned method for determining the stress surplus, and each set of deformation amount, deformation direction and stress surplus is mapped one-to-one to construct a sample set containing the correlation data of the three (i.e., multiple sets of deformation amount, deformation direction, and stress surplus). A correlation dataset consisting of stress surplus was generated. After normalizing the deformation, deformation direction, and stress surplus in the sample set, a multiple linear regression model was used to fit the normalized sample set, with deformation and deformation direction as independent variables and stress surplus as dependent variable. The coefficient matrix in the regression equation was solved using the least squares method, and the coefficient matrix was used as the coupling relationship between deformation, deformation direction, and stress surplus. The influence coefficient corresponding to the deformation in the coupling relationship was extracted as the stress-deformation compensation coefficient. The coupling relationship quantifies the deformation and deformation direction. The coefficient of stress surplus on stress compensation reflects the influence weight of deformation and deformation direction on stress surplus and their interaction. The stress-deformation compensation coefficient refers to the correction coefficient of stress compensation under the synergistic effect of deformation, deformation direction and stress surplus. Finally, with the deformation direction parameter as the vector direction, the deformation and the stress-deformation compensation coefficient are multiplied to obtain the offset amplitude. The offset amplitude and the deformation direction parameter are integrated by the existing vector synthesis algorithm to obtain the first path offset in the cutting process of the motherboard sheet.

[0032] It should be noted that the first path offset in this application refers to the amount of spatial adjustment made to the reference cutting path to offset the effect of deformation. Determining the first path offset can offset the cutting deviation caused by the deformation, deformation direction and stress surplus during the cutting process of the motherboard board. By superimposing this offset onto the reference cutting path, the cutting actuator moves along the corrected path, effectively avoiding the cut offset caused by deformation, ensuring that the size and shape of the cut board meet the design requirements, and improving the stability of the processing technology and the yield of finished products.

[0033] In some embodiments, reference Figure 3 As shown in the figure, this is an exemplary flowchart of determining the first compensation path according to some embodiments of this application. In this embodiment, the first compensation path is obtained by performing cutting compensation under the influence of stress deformation on the reference cutting path based on the first path offset, which can be achieved by the following steps: First, in step 1031, the coordinate sequence of the reference cutting path is parsed to obtain the spatial coordinate parameters of each discrete cutting point on the reference cutting path. Secondly, in step 1032, the compensation coordinate increment corresponding to each discrete cutting point is calculated based on the magnitude and direction of the first path offset. Then, in step 1033, the spatial coordinate parameters of each discrete cutting point are vector-superimposed with the corresponding compensation coordinate increment to obtain the compensation coordinates of each discrete cutting point. Finally, in step 1034, the compensation coordinates of each discrete cutting point are smoothed by interpolation to generate the first compensation path.

[0034] In specific implementation, firstly, the coordinate sequence of the reference cutting path is discretized according to a preset path sampling interval, and the spatial coordinates of each discrete cutting point are read to obtain the spatial coordinate parameters of each discrete cutting point on the reference cutting path. These spatial coordinate parameters refer to the specific location of each discrete cutting point in space. Secondly, based on the magnitude and direction of the first path offset, a polar coordinate-Cartesian coordinate conversion algorithm is used to multiply the magnitude of the first path offset by the cosine, sine, and tangent values ​​of the direction angle, respectively, to obtain the displacement increments corresponding to the x, y, and z coordinate axes. This yields the compensation coordinate increments corresponding to each discrete cutting point. This refers to the specific numerical values ​​that each discrete cutting point needs to be offset and adjusted on the three-dimensional coordinate axes. Then, based on the existing vector superposition principle, the x-axis coordinate value and the x-axis compensation coordinate increment, the y-axis coordinate value and the y-axis compensation coordinate increment, and the z-axis coordinate value and the z-axis compensation coordinate increment of the spatial coordinate parameters of each discrete cutting point are algebraically added to complete the vector synthesis of the coordinate parameters and the compensation increment, and the compensation coordinates of each discrete cutting point are obtained. The compensation coordinates refer to the three-dimensional spatial position of each discrete cutting point after offset adjustment. Finally, the B-spline interpolation method is used to continuously fit the compensation coordinates of all discrete cutting points to generate a smooth and continuous path curve, and the path curve is used as the first compensation path.

[0035] It should be noted that the first compensation path in this application refers to the path obtained after cutting compensation of the reference cutting path. Determining the first compensation path can convert the first path offset into a corrected path that can be directly used for cutting execution. By performing targeted compensation for stress deformation of the reference cutting path, the path deviation caused by the combination of deformation, deformation direction and stress surplus during the cutting of the motherboard board can be effectively avoided. This ensures the continuity and stability of the movement trajectory of the cutting execution mechanism, reduces vibration and stress concentration during the cutting process, and forms a synergy with subsequent thermal control commands to achieve dual avoidance of stress deformation and thermal deformation, ensuring the contour accuracy of the cutting cut, thereby improving the stability of the processing technology and the yield of finished products.

[0036] In step 104, the spatial coordinates of the potential heat accumulation region are analyzed in a spatiotemporal correlation with the first compensation path. During the spatiotemporal matching analysis, when it is determined that the subsequent cutting segment of the first compensation path passes through the potential heat accumulation region, a thermal control command for cutting the motherboard material is generated based on the thermal radiation intensity gradient of the potential heat accumulation region.

[0037] In some embodiments, the spatiotemporal correlation analysis of the spatial coordinates of the potential heat accumulation region with the first compensation path is performed by the following steps: Extract the boundary coordinates of the potential heat accumulation region to generate a boundary coordinate set; Analyze the time sequence and corresponding spatial coordinates of the cutting actuator moving along the first compensation path; The spatial intersection operation is performed between the boundary coordinate set and the spatial coordinates of the first compensation path to obtain the spatial overlapping region. Based on the preset movement speed of the cutting actuator, the time interval for passing through the spatially overlapping area is calculated, thereby completing the spatiotemporal correlation analysis between the potential heat accumulation area and the first compensation path.

[0038] In specific implementation, firstly, the Canny edge detection operator in image processing is used to extract the boundary pixels in the potential heat accumulation region. Then, based on the calibration parameters of the infrared camera, the pixel coordinates of the boundary pixels are converted into the actual three-dimensional spatial coordinates of the motherboard surface. These boundary pixels are then sorted in clockwise order to generate the boundary coordinate set of the potential heat accumulation region. The boundary coordinate set refers to the set of actual spatial positions of the boundary points of the potential heat accumulation region. Secondly, based on the preset movement speed of the cutting actuator, the corresponding time when the cutting actuator passes through each spatial coordinate point on the first compensation path is calculated segment by segment using the formula "movement time = distance between adjacent discrete coordinate points / movement speed". This forms a time sequence of the cutting actuator's movement along the first compensation path and its corresponding spatial coordinates. The spatial coordinates refer to the actual spatial positions of the cutting actuator at different time points. Then, a polygon Boolean intersection operation algorithm is used to bring the closed polygon formed by the boundary coordinate set and the spatial coordinates of the first compensation path, expanded by a preset path width, into the path. The system performs a spatial overlap determination, filtering out spatial coordinate ranges that simultaneously belong to both closed polygons and path bands to obtain spatial overlap regions. These spatial overlap regions refer to the areas where the potential heat accumulation region and the first compensation path coincide in physical space. Finally, based on the preset movement speed of the cutting actuator, the entry and exit spatial coordinates of the spatial overlap region are extracted, and the straight-line distance between the two points is calculated. The total time for passing through the spatial overlap region is calculated using the formula "passage time = straight-line distance / movement speed". Combined with the start time corresponding to the entry spatial coordinates in the time series, the specific time range from the entry of the cutting actuator to its exit from the spatial overlap region is determined as the passage time interval, thereby completing the spatiotemporal correlation analysis between the potential heat accumulation region and the first compensation path. Here, the entry spatial coordinates refer to the coordinates of the spatial point where the cutting actuator first contacts the boundary of the spatial overlap region along the preset movement direction of the first compensation path, and the exit spatial coordinates refer to the coordinates of the spatial point where the cutting actuator continues to travel along the preset movement direction of the first compensation path and finally contacts the boundary of the spatial overlap region.

[0039] It should be noted that the spatiotemporal correlation analysis between the potential heat accumulation area and the first compensation path in this application refers to the analysis process of the cutting actuator passing through the potential heat accumulation area in terms of time dimension. This will not be elaborated here. The reason for conducting the spatiotemporal correlation analysis is that the potential heat accumulation area only defines the dangerous space range in front of the cutting path, and the first compensation path only determines the cutting motion trajectory after stress deformation compensation. When the two exist alone, it is impossible to determine when the cutting actuator will enter, pass through, and leave the heat accumulation area. However, the impact of heat on the motherboard material during the cutting process is directly related to the duration of the effect. It is necessary to establish the correspondence between spatial position and time node through spatiotemporal correlation to provide accurate time and space triggering basis for subsequent thermal control commands, and avoid cutting deviation caused by thermal deformation of the motherboard material due to high temperature during the period when the cutting actuator stays in the heat accumulation area.

[0040] In some embodiments, when it is determined during the spatiotemporal matching analysis that a subsequent cutting segment of the first compensation path passes through the potential heat accumulation region, the generation of the thermal control command for cutting the motherboard material based on the thermal radiation intensity gradient of the potential heat accumulation region is achieved through the following steps: Obtain the spatial overlap region and the time interval between the subsequent cut segments of the first compensation path and the potential heat accumulation region; Extract the thermal radiation intensity gradient of the spatially overlapping region in the potential heat accumulation region; The thermal regulation coefficient is calculated based on the aforementioned thermal radiation intensity gradient; The adjustment range of the heat input is determined based on the thermal regulation coefficient and the rated power parameters of the cutting actuator; The heat control command, which includes the adjustment amplitude of the heat input and the duration of action, is generated based on the time interval.

[0041] In specific implementation, firstly, the spatial overlap area and time interval between the subsequent cutting segment of the first compensation path and the potential heat accumulation area are determined; secondly, an infrared thermal imager is used to acquire thermal radiation images of the spatially overlapping area, and the existing Sobel gradient operator is used to perform a convolution operation on each pixel in the thermal radiation image to obtain the thermal radiation intensity gradient of the spatially overlapping area in the potential heat accumulation area. The thermal radiation intensity gradient refers to the rate of change of thermal radiation intensity along the spatial direction in the spatially overlapping area; further, the average amplitude of the thermal radiation intensity gradient in the spatially overlapping area is calculated, and then a safety threshold for the thermal radiation intensity gradient (i.e., the maximum gradient amplitude that will not cause thermal deformation) is set according to the heat resistance characteristics of the motherboard material. Then, the ratio of the average amplitude to the safety threshold is used as the thermal control coefficient, which is a parameter characterizing the degree of adjustment of the heat input corresponding to the thermal radiation intensity gradient. Then, by multiplying the thermal control coefficient with the rated power parameter of the cutting actuator (i.e., the rated output power value of the cutting mechanism when working normally), the adjustment amplitude of the heat input is obtained, which is the amount of power that the heat input needs to be changed. Finally, the start time of the time interval is used as the start time of thermal control and the end time is used as the stop time, thereby obtaining the action period of the thermal control command. The adjustment amplitude of the heat input and the action period are integrated according to the preset command format to obtain the thermal control command when cutting the motherboard sheet.

[0042] It should be noted that the thermal control command in this application refers to the execution command used to adjust the output intensity and action time of the cutting heat source. The purpose of determining the thermal control command is to accurately adjust the magnitude and timing of the cutting heat input according to the thermal radiation intensity gradient of the spatially overlapping area in a specific scenario where the subsequent cutting segment of the first compensation path passes through a potential heat accumulation area, so as to avoid thermal deformation of the plate caused by local high temperature when the cutting execution mechanism stays in the heat accumulation area.

[0043] In step 105, the motherboard material is cut collaboratively using the first compensation path and the thermal control command.

[0044] In some embodiments, the coordinated cutting of the motherboard material using the first compensation path and the thermal control command is achieved through the following steps: The first compensation path is parsed into motion control parameters of the cutting actuator, and then a path drive signal is generated. The adjustment amplitude and duration of the heat input in the heat control command are converted into power regulation signals and time triggering conditions for cutting the heat source, respectively. The cutting actuator moves along the first compensation path according to the path drive signal, and at the same time adjusts the output of the heat source according to the power adjustment signal and the time trigger condition, thereby completing the collaborative cutting of the motherboard material.

[0045] In specific implementation, firstly, the first compensation path is parsed into motion control parameters for the cutting actuator. These motion control parameters include the movement speed of the cutting path (specifically determined by the constant movement speed of the cutting actuator) and the position commands of each cutting node. Then, a path drive signal is generated from the motion control parameters. This path drive signal is the control signal that drives the cutting actuator to move along a set trajectory. Secondly, the adjustment amplitude and duration of the heat input in the heat control command are converted into a power adjustment signal and a time trigger condition for the cutting heat source. The power adjustment signal is an electrical signal that controls the output power of the cutting heat source, and the time trigger condition is the timing of the start and end of the power adjustment signal. Finally, the motion controller of the cutting actuator receives the path drive signal and controls the motor to perform motion cutting along the first compensation path according to the path drive signal. Simultaneously, the power controller of the cutting heat source receives the power adjustment signal and the time trigger condition. When the time trigger condition is met, the heat source output power is adjusted according to the power adjustment signal. When the trigger condition is met, the heat source output power is adjusted according to the power adjustment signal. When the trigger condition ends, the heat source output power is restored to normal power, thereby completing the collaborative cutting of the motherboard material.

[0046] It should be noted that in this application, collaborative cutting refers to the synchronous linkage between the cutting execution mechanism and the cutting heat source during the cutting process. Its function is to avoid cut deviation and dimensional deviation caused by stress deformation through dual collaborative intervention, and to solve the thermal deformation and thermal cracking of the board caused by heat accumulation. At the same time, it ensures the stability of cutting execution and the adaptability of heat source output, and ultimately improves the cutting accuracy of the main board board.

[0047] In another aspect, in some embodiments, this application provides a motherboard material cutting control system for computer processing, referencing... Figure 4 The figure is a schematic diagram of the structure of a computer motherboard material cutting control system according to some embodiments of this application. The computer motherboard material cutting control system includes: a data acquisition module 201, a processing module 202, and an execution module 203, which are described below: The acquisition module 201 in this application is mainly used to acquire stress wave signals and thermal distribution images at the cutting point during the cutting process of the motherboard material for computer processing along the reference cutting path. Processing module 202 in this application is mainly used to identify the deformation characteristics of the motherboard material at the cutting point based on the stress wave signal, perform thermal diffusion analysis on the cutting point area based on the thermal distribution image, and then identify the potential heat accumulation area located in front of the cutting point path. The processing module 202 is further configured to determine the first path offset during the cutting process of the motherboard material based on the deformation characteristics and the critical stress state of the cutting point, and to perform cutting compensation under stress deformation on the reference cutting path based on the first path offset, thereby obtaining the first compensation path. In addition, the processing module 202 is also used to perform spatiotemporal correlation analysis on the spatial coordinates of the potential heat accumulation area and the first compensation path. During the spatiotemporal matching analysis, when it is determined that the subsequent cutting segment of the first compensation path passes through the potential heat accumulation area, a thermal control command for cutting the motherboard material is generated according to the thermal radiation intensity gradient of the potential heat accumulation area. The execution module 203 in this application is mainly used to perform collaborative cutting of the motherboard material through the first compensation path and the thermal control command.

[0048] In addition, this application also provides a computer device, the computer device including a memory and a processor, the memory storing code, and the processor being configured to acquire the code and execute the above-described computer processing motherboard plate cutting control method.

[0049] In some embodiments, reference Figure 5 This figure is a schematic diagram of the structure of a computer device implementing a method for controlling the cutting of motherboard material for computer processing, according to some embodiments of this application. The method for controlling the cutting of motherboard material for computer processing in the above embodiments can... Figure 5 The computer device shown is used to implement this, and the computer device includes at least one processor 301, a communication bus 302, a memory 303, and at least one communication interface 304.

[0050] The processor 301 may be a general-purpose central processing unit (CPU), an application-specific integrated circuit (ASIC), or one or more devices used to control the execution of the computer-processed motherboard cutting control method described in this application.

[0051] The communication bus 302 can be used to transmit information between the aforementioned components.

[0052] The memory 303 may be a read-only memory (ROM) or other type of static storage device capable of storing static information and instructions, random access memory (RAM) or other type of dynamic storage device capable of storing information and instructions, or electrically erasable programmable read-only memory (EEPROM), compact disc read-only memory (CDROM) or other optical disc storage, optical disc storage (including compressed optical discs, laser discs, optical discs, digital universal optical discs, Blu-ray discs, etc.), magnetic disks or other magnetic storage devices, or any other medium capable of carrying or storing desired program code in the form of instructions or data structures and accessible by a computer, but not limited thereto. The memory 303 may exist independently and be connected to the processor 301 via the communication bus 302. The memory 303 may also be integrated with the processor 301.

[0053] The memory 303 stores program code for executing the scheme of this application, and its execution is controlled by the processor 301. The processor 301 executes the program code stored in the memory 303. The program code may include one or more software modules. In the above embodiments, the determination of the cutting control method for motherboard sheet metal for computer processing can be achieved by the processor 301 and one or more software modules in the program code in the memory 303.

[0054] Communication interface 304 uses any transceiver-like device for communicating with other devices or communication networks, such as Ethernet, radio access network (RAN), wireless local area networks (WLAN), etc.

[0055] In a specific implementation, as one example, a computer device may include multiple processors, each of which may be a single-core (single CPU) processor or a multi-core (multi CPU) processor. Here, a processor may refer to one or more devices, circuits, and / or processing cores used to process data (e.g., computer program instructions).

[0056] The aforementioned computer device can be a general-purpose computer device or a special-purpose computer device. In specific implementations, the computer device can be a desktop computer, a portable computer, a network server, a handheld digital assistant (PDA), a mobile phone, a tablet computer, a wireless terminal device, a communication device, or an embedded device. This application does not limit the type of computer device.

[0057] In addition, this application also provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the above-described computer-processing motherboard sheet cutting control method.

[0058] Although preferred embodiments of this application have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of this application.

[0059] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A computer processing main plate material cutting control method, characterized by, The method comprises the following steps: In the cutting process of the reference cutting path of the mainboard plate material for computer processing, the stress wave signal and the thermal distribution image corresponding to the cutting point are collected; Based on the stress wave signal, the deformation feature of the mainboard plate material at the cutting point is identified, and the thermal diffusion analysis of the cutting point region is performed according to the thermal distribution image, and then the potential heat accumulation region located in front of the cutting point path is identified; According to the deformation feature and the critical stress state of the cutting point, the first path offset amount in the cutting process of the mainboard plate material is determined, and the cutting compensation of the reference cutting path under the influence of stress deformation is performed according to the first path offset amount, and then the first compensation path is obtained; The spatial coordinates of the potential heat accumulation region are analyzed in space-time with the first compensation path, and when it is determined that the subsequent cutting section of the first compensation path passes through the potential heat accumulation region in the space-time matching analysis process, the thermal regulation instruction of the mainboard plate material during cutting is generated according to the thermal radiation intensity gradient of the potential heat accumulation region; The mainboard plate material is cooperatively cut through the first compensation path and the thermal regulation instruction.

2. The method of claim 1, wherein, Based on the stress wave signal, the deformation feature of the mainboard plate material at the cutting point is identified, and the thermal diffusion analysis of the cutting point region is performed according to the thermal distribution image, and then the potential heat accumulation region located in front of the cutting point path is identified; According to the deformation feature and the critical stress state of the cutting point, the first path offset amount in the cutting process of the mainboard plate material is determined, and the cutting compensation of the reference cutting path under the influence of stress deformation is performed according to the first path offset amount, and then the first compensation path is obtained; The spatial coordinates of the potential heat accumulation region are analyzed in space-time with the first compensation path, and when it is determined that the subsequent cutting section of the first compensation path passes through the potential heat accumulation region in the space-time matching analysis process, the thermal regulation instruction of the mainboard plate material during cutting is generated according to the thermal radiation intensity gradient of the potential heat accumulation region; The mainboard plate material is cooperatively cut through the first compensation path and the thermal regulation instruction. Based on the stress wave signal, the deformation feature of the mainboard plate material at the cutting point is identified, and the thermal diffusion analysis of the cutting point region is performed according to the thermal distribution image, and then the potential heat accumulation region located in front of the cutting point path is identified; 3. The method of claim 1, wherein, According to the deformation feature and the critical stress state of the cutting point, the first path offset amount in the cutting process of the mainboard plate material is determined, and the cutting compensation of the reference cutting path under the influence of stress deformation is performed according to the first path offset amount, and then the first compensation path is obtained; The spatial coordinates of the potential heat accumulation region are analyzed in space-time with the first compensation path, and when it is determined that the subsequent cutting section of the first compensation path passes through the potential heat accumulation region in the space-time matching analysis process, the thermal regulation instruction of the mainboard plate material during cutting is generated according to the thermal radiation intensity gradient of the potential heat accumulation region; The mainboard plate material is cooperatively cut through the first compensation path and the thermal regulation instruction. ​ ​ 4. The method of claim 1, wherein, ​ ​ ​ ​ ​ ​ 5. The method of claim 1, wherein, ​ The coordinate sequence of the reference cutting path is parsed, and then the spatial coordinate parameters of each discrete cutting point on the reference cutting path are obtained; Based on the amplitude and direction of the first path offset, the compensation coordinate increment corresponding to each discrete cutting point is calculated; The spatial coordinate parameters of each discrete cutting point are vector superimposed with the corresponding compensation coordinate increment to obtain the compensation coordinates of each discrete cutting point. The compensation coordinates of each discrete cutting point are subjected to smoothing interpolation processing to generate a first compensation path.

6. The method of claim 1, wherein, The spatiotemporal correlation analysis of the spatial coordinates of the potential heat accumulation area and the first compensation path specifically includes: Extract the boundary coordinates of the potential heat accumulation area to generate a boundary coordinate set; Parse the time sequence and corresponding spatial coordinates of the cutting execution mechanism moving along the first compensation path; The boundary coordinate set and the spatial coordinates of the first compensation path are subjected to spatial intersection operation to obtain a spatial overlap region; Based on the preset movement speed of the cutting execution mechanism, the passing time interval through the spatial overlap region is calculated, and the spatiotemporal correlation analysis of the potential heat accumulation area and the first compensation path is completed.

7. The method of claim 1, wherein, The corresponding thermal distribution image at the cutting point is collected by an infrared camera.

8. A computer processing main plate material cutting control system, characterized in that, The system includes: The acquisition module is used to collect the stress wave signal and the thermal distribution image at the cutting point during the cutting process of the reference cutting path of the computer-processed mainboard plate material; The processing module is used to identify the deformation feature of the mainboard plate material at the cutting point based on the stress wave signal, and to analyze the heat diffusion of the cutting point region based on the thermal distribution image, and then to identify the potential heat accumulation area located in front of the cutting point path; The processing module is also used to determine the first path offset during the cutting process of the mainboard plate material according to the deformation feature combined with the critical stress state of the cutting point, and to compensate the cutting of the reference cutting path under the influence of stress deformation according to the first path offset, and then to obtain a first compensation path; The processing module is also used to perform spatiotemporal correlation analysis on the spatial coordinates of the potential heat accumulation area and the first compensation path, and when it is determined that the subsequent cutting section of the first compensation path passes through the potential heat accumulation area during the spatiotemporal matching analysis process, the heat regulation instruction during the cutting of the mainboard plate material is generated according to the thermal radiation intensity gradient of the potential heat accumulation area; The execution module is used to cooperatively cut the mainboard plate material through the first compensation path and the heat regulation instruction.

9. A computer device, comprising: The computer device includes a memory and a processor, the memory stores code, and the processor is configured to obtain the code and execute the computer-processed mainboard plate material cutting control method according to any one of claims 1 to 7.

10. A computer-readable storage medium storing a computer program, the computer program comprising instructions that, when executed by a computer, cause the computer to perform the method of any one of claims 1-9. The computer program is executed by the processor to implement the computer-processed mainboard plate material cutting control method according to any one of claims 1 to 7.

Images