Spring member, camera module, and electronic device

Abstract

The spring member includes a first face and a second face opposite to the first face, and contains three or more thin lines in a cross section orthogonal to the first face. The thin lines at both ends among the thin lines are outer thin lines, and the thin line sandwiched by the outer thin lines is an inner thin line. The inner thin line has a width of 10 μm or more on the first face and the second face. The outer thin lines have a width of 2 μm or more and 8 μm or less thicker than the width of the inner thin line on the first face and the second face.

Description

Technical Field

[0001] This disclosure relates to spring components for camera modules, camera modules, and electronic devices. Background Technology

[0002] Camera modules in electronic devices with cameras, such as tablets and smartphones, include drive mechanisms for autofocus and zoom. Known drive mechanisms include lens-driven and sensor-driven mechanisms. Lens-driven drive mechanisms include spring members capable of changing the position of the lens along its optical axis. In contrast, sensor-driven drive mechanisms include spring members capable of changing the position of an image sensor along the optical axis of the lens (see, for example, Patent Documents 1 and 2).

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2014-059345

[0006] Patent Document 2: Japanese Patent Application Publication No. 2020-170170 Summary of the Invention

[0007] The problem that the invention aims to solve

[0008] However, the spring component includes: a first spring component having a spring portion that has a zigzag shape when viewed from a viewpoint opposite to a plane extending from the spring component; and a second spring component having a spring portion composed of a plurality of independent springs. The spring portions connect the inner frame portion to the outer frame portion.

[0009] Both the spring portion of the first spring component and the spring portion of the second spring component are composed of a plurality of fine lines arranged at intervals on a plane orthogonal to the plane extending from the spring component and to the direction in which the spring portion extends. The plurality of fine lines includes a pair of outer fine lines located at the ends in the direction in which the fine lines are arranged, and inner fine lines located between the outer fine lines. From the viewpoint of miniaturizing the spring portion, a narrow interval between the fine lines is required. On the other hand, in order to enable the spring portion to be driven, a certain distance is required between the spring portion and the outer frame portion, and between the spring portion and the inner frame portion.

[0010] The spring component is formed by wet etching of a metal foil. The resist mask used for wet etching of the metal foil has openings corresponding to the gaps between the fine lines and openings corresponding to the gaps between the spring portion and each frame portion. The opening corresponding to the gaps between the fine lines is wider than the opening corresponding to the gaps between the spring portion and each frame portion. Therefore, it is difficult to supply etching solution to the opening corresponding to the gaps between the fine lines, but it is easy to supply etching solution to the opening corresponding to the gaps between the spring portion and each frame portion.

[0011] Therefore, in the outer fine lines, the side farther from the inner fine line among the pair of opposing sides in the direction of the fine line arrangement is more likely to have a shape with a significant depression near the center in the thickness direction of the spring component compared to the side of the inner fine line. Consequently, during wet etching of the metal foil, a local through-section is formed between the pair of sides in the outer fine lines near the center in the thickness direction of the spring component, and if further etching is performed, the outer fine lines may sometimes break.

[0012] Methods for solving problems

[0013] The spring component for the camera module used to solve the above-mentioned problem includes a first surface and a second surface opposite to the first surface. In a cross-section orthogonal to the first surface, there are three or more thin wires, wherein the two ends of the thin wires are outer thin wires, and the thin wire sandwiched between the outer thin wires is an inner thin wire. The inner thin wire has a width of 10 μm or more on both the first and second surfaces. The outer thin wire has a width on both the first and second surfaces that is 2 μm or more but less than 8 μm thicker than the width of the inner thin wire.

[0014] According to the aforementioned spring component, the inner fine lines have a width of 10 μm or more on each surface, and the outer fine lines have a width that is 2 μm or more thicker than the inner fine lines on each surface. Therefore, during etching, the formation of localized through-holes and line breaks near the central portion in the thickness direction can be suppressed in both the inner and outer fine lines. Furthermore, the fact that the inner fine lines have a width of 10 μm or more on each surface, and the outer fine lines have a width that is 8 μm or less thicker than the inner fine lines on each surface, can suppress load concentration on the inner fine lines due to the driving of the spring component. As a result, deformation of the inner fine lines caused by the driving of the spring component can be suppressed.

[0015] In the aforementioned spring component, the width on the first surface of each fine wire may be a first width, and the width on the second surface may be a second width. In the thickness direction of the spring component, the first width and the second width may be the first or second largest width.

[0016] According to the above-mentioned spring component, compared with the case where the spring component is thicker than the first width and the second width on the inner side in the thickness direction, it is possible to suppress the stiffness of the thin wire from becoming too high.

[0017] In the above-mentioned spring component, the first width and the second width of each fine wire can also be less than 20 μm.

[0018] According to the above-mentioned spring component, on each surface, the inner fine line is 10 μm or more, and the width of the outer fine line is 2 μm or more but less than 8 μm wider than the width of the inner fine line, thereby achieving a significant effect.

[0019] In the above-mentioned spring component, it is also possible that, among the outer fine lines, the side of a pair of sides extending along the thickness direction of the spring component that is shorter from the inner fine line is the first side, and the side opposite to the first side is the second side, and the second side has a V-shape that is recessed from the second side toward the first side.

[0020] According to the above-mentioned spring component, since the outer thin wire is necked on at least one side, the rigidity of the outer thin wire is not likely to become too high.

[0021] In the aforementioned spring component, the aspect ratio of the thin wire can also be 3 or more and 20 or less.

[0022] According to the above-mentioned spring component, within a wide range of aspect ratios of the fine wire, it is possible to suppress the generation of through-holes and wire breakage in the fine wire during etching, as well as the deformation of the fine wire during driving.

[0023] In the above-mentioned spring component, the thickness of the spring component can also be more than 120μm and less than 200μm.

[0024] The reliability of the effect of obtaining a fine wire that meets the above conditions can be improved by using the aforementioned spring component.

[0025] In the aforementioned spring component, the spring component may contain any one selected from the group consisting of stainless steel alloy, beryllium copper, nickel-tin copper, phosphor bronze, Cosun alloy, and titanium copper.

[0026] Based on the above-mentioned spring component, since the spring component can have high hardness, the durability of the spring component can be improved.

[0027] In the above-described spring component, the spring component may also include a base material selected from the group consisting of stainless steel alloy, beryllium copper, nickel-tin copper, phosphor bronze, Cosun alloy and titanium copper, the base material having a first surface and a second surface located on the side opposite to the first surface, and the spring component further having a copper layer on at least one of the first surface and the second surface of the base material.

[0028] Invention Effects

[0029] According to this disclosure, it is possible to simultaneously suppress the generation of local through-holes and wire breakage near the central portion of the wire in the thickness direction during etching of the metal foil, and to suppress wire deformation during the driving of the spring component. Attached Figure Description

[0030] Figure 1 This is a top view showing the structure of the spring component.

[0031] Figure 2 It means along Figure 1 A cross-sectional view of the construction of line II-II.

[0032] Figure 3 (A) to (C) are sectional views showing an example of the construction of the inner fine line.

[0033] Figure 4 (A) to (C) are cross-sectional views showing an example of the construction of the outer fine line.

[0034] Figure 5 This is a process diagram showing one step in the manufacturing process of a spring component.

[0035] Figure 6 This is a process diagram showing one step in the manufacturing process of a spring component.

[0036] Figure 7 This is a process diagram showing one step in the manufacturing process of a spring component.

[0037] Figure 8 This is a process diagram showing one step in the manufacturing process of a spring component.

[0038] Figure 9 This is a process diagram showing one step in the manufacturing process of a spring component.

[0039] Figure 10 It is a top view schematically representing the shape of the resist mask.

[0040] Figure 11 This is a table showing the evaluation results of the embodiments and comparative examples.

[0041] Figure 12 This is a table showing the evaluation results of the embodiments and comparative examples.

[0042] Figure 13 This is a table showing the evaluation results of the embodiments and comparative examples. Detailed Implementation

[0043] Reference Figures 1 to 13An embodiment of the spring component for the camera module, the camera module, and the electronic device will be described.

[0044] [Spring components for camera modules]

[0045] Reference Figures 1 to 4 The spring components used in the camera module will be explained. Figure 1 The planar structure of the spring component is schematically shown from a viewpoint opposite to the plane extending from the spring component.

[0046] like Figure 1 As shown, the spring component 10 for the camera module includes a first surface 10S1 and a second surface 10S2 opposite to the first surface 10S1. The first surface 10S1 and the second surface 10S2 are a pair of surfaces facing each other in the thickness direction of the spring component 10. The spring component 10 includes an outer frame portion 11, an inner frame portion 12, and a spring portion 13. The spring portion 13 is a leaf spring.

[0047] The spring section 13 includes a plurality of fine wires 13A. Viewed from a viewpoint opposite to the plane extending from the spring member 10, each fine wire 13A is a straight line extending along the plane extending from the spring member 10. Each fine wire 13A is part of the metal foil forming the spring member 10, and adjacent fine wires 13A are interconnected with each other through bends.

[0048] exist Figure 1 In the example shown, the outer frame 11 has an octagonal shape, and the inner frame 12 has a circular shape. The spring 13 has a zigzag shape. Furthermore, the shapes of the outer frame 11 and the inner frame 12 can be varied according to the shapes of other components in the drive mechanism of the camera module carrying the spring component 10, i.e., components other than the spring component 10. The inner frame 12 is located within the area defined by the outer frame 11. The spring 13 connects the inner frame 12 to the outer frame 11.

[0049] In the lens-driven drive mechanism, a pair of spring members 10 are arranged with respect to the lens in the optical axis direction. In the optical axis direction, the position of the inner frame portion 12, which is connected to each outer frame portion 11, changes relative to the outer frame portion 11, thereby changing the position of the lens in the optical axis direction. Thus, jitter can be corrected by the lens-driven drive mechanism.

[0050] In contrast, in the sensor-driven drive mechanism, a pair of spring members 10 are arranged with the camera sensor in between, along the optical axis of the lens. Along the optical axis, the position of the inner frame portion 12, which is connected to each outer frame portion 11, changes relative to the outer frame portion 11, thereby changing the position of the camera sensor along the optical axis of the lens. This allows for the correction of jitter using the sensor-driven drive mechanism.

[0051] Electronic devices equipped with a camera module having a spring component 10 may include, for example, mobile phone terminals, smartphones, tablet terminals, and laptop personal computers.

[0052] Figure 2 It shows along Figure 1 The cross-sectional structure of the spring section 13 of line II-II is shown. That is, Figure 2 The cross-sectional structure of the spring member 10 is shown along a plane orthogonal to the first surface 10S1 of the spring member 10 and to the direction in which each fine line 13A extends.

[0053] like Figure 2 As shown, in a cross-section orthogonal to the first surface 10S1, the spring portion 13 includes three or more fine wires 13A. In this cross-section, the fine wires 13A located at both ends in the direction in which they are arranged are the outer fine wires 13A1. The direction in which the fine wires 13A are arranged is the first direction D1. The fine wire 13A sandwiched between the outer fine wires 13A1 in the first direction D1 is the inner fine wire 13A2.

[0054] exist Figure 2 In the example shown, in a cross-section orthogonal to the first surface 10S1, the spring portion 13 includes six fine wires 13A. Therefore, in the first direction D1, four inner fine wires 13A2 are sandwiched between two outer fine wires 13A1. The multiple fine wires 13A are arranged side by side at approximately equal intervals in the first direction D1.

[0055] The width on the first surface 10S1 of each fine line 13A is a first width WS1. The width on the second surface 10S2 of each fine line 13A is a second width WS2. The inner fine line 13A2 has a width of 10 μm or more on both the first surface 10S1 and the second surface 10S2. The first width WS1 of the inner fine line 13A2 is 10 μm or more, and the second width WS2 is 10 μm or more.

[0056] The outer fine line 13A1 has a width that is 2 μm or more but less than 8 μm wider than the inner fine line 13A2 on both the first surface 10S1 and the second surface 10S2. The first width WS1 of the outer fine line 13A1 is 2 μm or more but less than 8 μm wider than the first width WS1 of the inner fine line 13A2. The second width WS2 of the outer fine line 13A1 is 2 μm or more but less than 8 μm wider than the second width WS2 of the inner fine line 13A2.

[0057] Thus, the spring component 10 of this disclosure satisfies the following conditions 1 and 2.

[0058] (Condition 1) The inner fine line 13A2 has a width of more than 10 μm on the first surface 10S1 and the second surface 10S2.

[0059] (Condition 2) The outer fine line 13A1 has a width that is 2 μm thicker and less than 8 μm thicker than the inner fine line 13A2 on the first surface 10S1 and the second surface 10S2.

[0060] By ensuring that the spring member 10 satisfies both condition 1 and the lower limit of condition 2, the generation and breakage of local through-holes near the center of the thickness direction of the inner fine line 13A2 and the outer fine line 13A1 during etching can be suppressed. Furthermore, by ensuring that the spring member 10 satisfies both condition 1 and the upper limit of condition 2, the concentration of load on the inner fine line 13A2 due to the driving of the spring member 10 can be suppressed. As a result, deformation of the inner fine line 13A2 caused by the driving of the spring member 10 can be suppressed.

[0061] In each of the fine wires 13A, the first width WS1 and the second width WS2 in the thickness direction of the spring member 10 can be either the first largest or the second largest width. That is, in the thickness direction of the spring member 10, the first width WS1 and the second width WS2 are greater than the width of the fine wire 13A other than the first width WS1 and the second width WS2. In the thickness direction of the spring member 10, in each of the fine wires 13A, the first width WS1 and the second width WS2 are larger than the width sandwiched between the first width WS1 and the second width WS2. In this case, compared with the case where the fine wire 13A is thicker than the first width WS1 and the second width WS2 on the inner side in the thickness direction of the spring member 10, it is possible to prevent the stiffness of the fine wire 13A from becoming too high.

[0062] The first width WS1 and the second width WS2 of each fine wire 13A can be 20 μm or less. In each fine wire 13A, the entire width in the thickness direction of the spring member 10 can be 20 μm or less. By setting the upper limit of the first width WS1 and the second width WS2 of each fine wire 13A to 20 μm or less, the effect of satisfying conditions 1 and 2 regarding the width of the fine wire 13A can be significantly obtained. Furthermore, the upper limit of the first width WS1 and the second width WS2 of each fine wire 13A can be 40 μm or 15 μm.

[0063] Furthermore, the upper limit of the widths WS1 and WS2 of the inner fine lines 13A2 can be 40 μm, 20 μm, or 15 μm. By making the widths WS1 and WS2 of the inner fine lines 13A2 less than 40 μm, the effects of satisfying conditions 1 and 2 can be further obtained. In addition, by making the widths WS1 and WS2 less than 20 μm, the effects of satisfying conditions 1 and 2 can be further obtained.

[0064] Furthermore, the upper limit of the widths WS1 and WS2 of the outer thin lines 13A1 can be 40 μm, 20 μm, or 15 μm. By making the widths WS1 and WS2 of the outer thin lines 13A1 less than 40 μm, the effects of satisfying conditions 1 and 2 can be further obtained. In addition, by making the widths WS1 and WS2 less than 20 μm, the effects of satisfying conditions 1 and 2 can be further obtained.

[0065] The thickness of the spring component 10 can be 120 μm or more and 200 μm or less. The thickness of the spring component 10 is the distance between the first surface 10S1 and the second surface 10S2. By including the thickness of the spring component 10 within the above range, the reliability of obtaining the fine wire 13A to satisfy the effects of conditions 1 and 2 above can be improved.

[0066] The ratio (T / W) of the thickness (T) of the spring component 10 to the width (W) of the thin wire 13A is the aspect ratio of the thin wire 13A. The aspect ratio of the inner thin wire 13A2 can be, for example, 3 or more and 20 or less. The lower limit of the aspect ratio of the inner thin wire 13A2 can be 6, 8, or 12. The upper limit of the aspect ratio of the inner thin wire 13A2 can be 13, 10, or 5. Furthermore, the aspect ratio of the inner thin wire 13A2 can take multiple values ​​in the thickness direction of the spring component 10. That is, the aspect ratio at any position in the thickness direction of the spring component 10, i.e., the first position, and the aspect ratio at a second position different from the first position, can be different from each other. The multiple values ​​that an inner thin wire 13A2 can take only need to be within the range of 3 or more and 20 or less.

[0067] The aspect ratio of the outer thin line 13A1 can be, for example, 3 or more and 20 or less. The lower limit of the aspect ratio of the outer thin line 13A1 can be 6, 8, or 12. The upper limit of the aspect ratio of the outer thin line 13A1 can be 13, 10, or 5. Furthermore, the aspect ratio of the outer thin line 13A1 can take multiple values ​​in the thickness direction of the spring member 10. That is, the aspect ratio at any position in the thickness direction of the spring member 10, i.e., the first position, and the aspect ratio at a second position different from the first position, can be different from each other. The multiple values ​​that one outer thin line 13A1 can take only need to be within the range of 3 or more and 20 or less.

[0068] By ensuring that the widths of the inner fine line 13A2 and the outer fine line 13A1 satisfy conditions 1 and 2, the generation of local through-holes and line breaks near the center of the thickness direction of the fine line 13A during etching and the deformation of the fine line 13A during driving can be suppressed over a wide range of aspect ratios of the fine line 13A.

[0069] In the direction in which the fine lines 13A are arranged, the distance between the centers of the fine lines 13A is the spacing P of the fine lines 13A. The spacing P can be the distance between the centers of the fine lines 13A on the first surface 10S1 or the distance between the centers of the fine lines 13A on the second surface 10S2. In either case, the spacing P is the same value. The spacing P can be, for example, 200 μm or more and 500 μm or less, preferably 240 μm or more and 400 μm or less.

[0070] The spring component 10 is formed of a metal with high hardness capable of achieving the required spring load or deflection. The spring component 10 may be formed, for example, of a stainless steel alloy or a copper alloy. The stainless steel alloy may be, for example, the stainless steel alloy specified in JIS G 4313:2011 "Stainless Steel Strip for Springs". The copper alloy may be, for example, the copper alloy specified in JIS H3130:2018 "Beryllium Copper, Titanium Copper, Phosphor Bronze, Nickel-Tin Copper and Zinc-Clad Copper Plates and Strips for Springs".

[0071] The spring component 10 may contain any material selected from the group consisting of stainless steel alloy, beryllium copper, nickel-tin copper, phosphor bronze, Cosun alloy, and titanium copper. The spring component 10 is preferably formed from any material selected from the above group. Because the spring component 10 can have high hardness, its durability can be improved.

[0072] Figure 3 (A) to Figure 3 (C) shows an example of the cross-sectional shape of the inner fine line 13A2. Furthermore, Figure 3 (A) to Figure 3 (C) are all along Figure 1An example of the shape of the inner fine line 13A2 in the cross section of line II-II.

[0073] like Figure 3 (A) to Figure 3 As shown in (C), among the pair of side surfaces extending along the thickness direction of the spring member 10 in each inner fine line 13A2, one side surface is the first side surface 13A21, and the other side surface is the second side surface 13A22. In each inner fine line 13A2, the second side surface 13A22 has a shape that reverses the left and right sides of the first side surface 13A21.

[0074] Each inner fine line 13A2 is adjacent to other fine lines 13A on both sides of the direction in which the fine lines 13A are arranged. Furthermore, the distance between the fine lines 13A is approximately the same in the direction in which the fine lines 13A are arranged. Therefore, during the wet etching of the metal foil forming the spring component 10, approximately the same amount of etching solution with approximately the same flow rate is used to form the two side surfaces 13A21 and 13A22 of the inner fine lines 13A2. Thus, in a cross-section orthogonal to the first side 10S1, the second side surface 13A22 has a shape that reverses the left-right orientation of the first side surface 13A21.

[0075] exist Figure 3 In the example shown in (A), each side 13A21, 13A22 has a zigzag shape with multiple inflection points in the thickness direction of the spring member 10. Each side 13A21, 13A22 has two connected V-shaped indentations toward the center of the inner fine line 13A2 in the thickness direction of the spring member 10.

[0076] exist Figure 3 In the example shown in (B), each side 13A21, 13A22 is composed of a pair of inclined lines and a straight line sandwiched between the pair of inclined lines in the thickness direction of the spring member 10. The inclined line connected to the first side 10S1 has an inclination that narrows the width of the inner thin line 13A2 in the direction from the first side 10S1 toward the second side 10S2. The inclined line connected to the second side 10S2 has an inclination that narrows the width of the inner thin line 13A2 in the direction from the second side 10S2 toward the first side 10S1.

[0077] exist Figure 3 In the example shown in (C), each side 13A21, 13A22 has a V-shape with only one inflection point in the thickness direction of the spring member 10. The first side 13A21 has a V-shape that is recessed from the first side 13A21 toward the second side 13A22. The second side 13A22 has a V-shape that is recessed from the second side 13A22 toward the first side 13A21. Thus, the inner fine line 13A2 has a shape that is approximately centrally constricted in the thickness direction of the spring member 10.

[0078] Figure 4 (A) to Figure 4 (C) shows an example of the cross-sectional shape of the outer thin line 13A1. Additionally, Figure 4 (A) to Figure 4 (C) are all along Figure 1 An example of the shape of the outer thin line 13A1 in the cross-section of line II-II. Additionally, Figure 4 (A) to Figure 4 The outer fine line 13A1 shown in (C) indicates Figure 2 An example of the right outer thin line 13A1 among a pair of outer thin lines 13A1. Figure 2 The outer thin line 13A1 located on the left has a shape that reverses the left and right sides of the outer thin line 13A1 located on the right.

[0079] like Figure 4 (A) to Figure 4 As shown in (C), among the pair of side surfaces extending along the thickness direction of the spring member 10 in each outer fine line 13A1, the side surface shorter than the inner fine line 13A2 is the first side surface 13A11, and the side surface opposite to the first side surface 13A11 is the second side surface 13A12. The first side surface 13A11 and the second side surface 13A12 in each outer fine line 13A1 have different shapes.

[0080] In the direction in which the outer fine lines 13A are arranged, each outer fine line 13A1 has a first side surface 13A11 adjacent to an inner fine line 13A2, but no fine line 13A adjacent to a second side surface 13A12. Therefore, during wet etching of the metal foil forming the spring member 10, the second side surface 13A12 of the outer fine lines 13A1 comes into contact with more etchant than the first side surface 13A11 of the outer fine lines 13A1. Furthermore, the second side surface 13A12 is formed by an etchant having a different flow than the etchant used to form the first side surface 13A11. Thus, in each outer fine line 13A1, the first side surface 13A11 and the second side surface 13A12 have different shapes.

[0081] like Figure 4 As shown in (A), the second side 13A12 may have a V-shape that is recessed from the second side 13A12 toward the first side 13A11. In this case, since the outer wire 13A1 is necked on at least one side, the rigidity of the outer wire 13A1 is less likely to become too high.

[0082] exist Figure 4In the example shown in (A), the second side 13A12 has a V-shape with only one inflection point in the thickness direction of the spring member 10. The second side 13A12 has a V-shape that is recessed from the second side 13A12 toward the first side 13A11. The valley of the V is located approximately at the center in the thickness direction of the spring member 10. In contrast, the first side 13A11 has a zigzag shape with multiple inflection points in the thickness direction of the spring member 10. The first side 13A11 has two connected V-shapes that are recessed toward the center of the outer thin line 13A1 in the thickness direction of the spring member 10. In the width direction of the spring member 10, the peak of the first side 13A11, which serves as the boundary between the two V-shapes, is adjacent to the valley of the V-shape in the second side 13A12.

[0083] exist Figure 4 In the example shown in (B), with Figure 4 Similarly, in the example shown in (A), the second side 13A12 has a V-shape with only one inflection point in the thickness direction of the spring member 10. The second side 13A12 has a V-shape that is recessed from the second side 13A12 toward the first side 13A11. The valley of the V is located approximately at the center in the thickness direction of the spring member 10.

[0084] In contrast, the first side surface 13A11 is composed of a pair of inclined lines and a straight line sandwiched between the pair of inclined lines in the thickness direction of the spring component 10. The inclined line connected to the first surface 10S1 has an inclination that narrows the width of the outer thin line 13A1 in the direction from the first surface 10S1 toward the second surface 10S2. The inclined line connected to the second surface 10S2 has an inclination that narrows the width of the outer thin line 13A1 in the direction from the second surface 10S2 toward the first surface 10S1.

[0085] exist Figure 4 In the example shown in (C), the second side 13A12 has a concave shape that extends from the second side 13A12 toward the first side 13A11. The second side 13A12 has multiple inflection points in the thickness direction of the spring member 10. In contrast, the first side 13A11 has a V-shape with only one inflection point in the thickness direction of the spring member 10. The first side 13A11 has a V-shape that extends from the first side 13A11 toward the second side 13A12. The valley of the V is located approximately at the center in the length direction of the spring member 10. In the width direction of the spring member 10, the most concave portion, i.e., the bottom, of the second side 13A12 is adjacent to the valley of the first side 13A11.

[0086] In each fine line 13A, the deviation of the width of the fine line 13A in the thickness direction is less than ±2 μm relative to the average width of the fine line 13A. In each fine line 13A, the maximum width is less than or equal to the average width plus 2 μm, and the minimum width is greater than or equal to the average width minus 2 μm.

[0087] [Manufacturing method for spring components]

[0088] Reference Figures 5 to 9 The manufacturing method of the spring component 10 will be described.

[0089] like Figure 5 As shown, in manufacturing the spring component 10, firstly, a first resist layer PR1 is formed on the first surface 21S1 of the metal foil 21, and a second resist layer PR2 is formed on the second surface 21S2. Furthermore, in use... Figures 5 to 9 In the illustrated example, each resist layer PR1, PR2 is formed by a positive photoresist, but each resist layer PR1, PR2 can also be formed by a negative photoresist.

[0090] Next, as Figure 6 As shown, a first photomask PM1 is disposed on a first resist layer PR1, and a second photomask PM2 is disposed on a second resist layer PR2. Then, the first resist layer PR1 is exposed using the first photomask PM1, and the second resist layer PR2 is exposed using the second photomask PM2.

[0091] like Figure 7 As shown, the exposed resist layers PR1 and PR2 are developed, thereby forming a first resist mask RM1 from the first resist layer PR1 and a second resist mask RM2 from the second resist layer PR2.

[0092] like Figure 8 As shown, the metal foil 21 is wet-etched using resist masks RM1 and RM2. During this process, the metal foil 21 is etched from both the first surface 21S1 and the second surface 21S2. This forms a through-hole extending along the thickness direction of the metal foil 21, resulting in the formation of an outer frame portion 11, an inner frame portion 12 away from the outer frame portion 11, and a spring portion 13 connecting the inner frame portion 12 and the outer frame portion 11.

[0093] Thus, a spring member 10 that satisfies conditions 1 and 2 above is formed, thereby being able to suppress the generation and breakage of local through portions near the center portion of the thickness direction of each fine line 13A during etching, as well as suppress the deformation of the inner fine line 13A2 caused by the driving of the spring member 10.

[0094] like Figure 9As shown, after removing the resist masks RM1 and RM2 from the etched metal foil 21, the spring component 10 is cut out from the etched metal foil 21, thereby obtaining the spring component 10.

[0095] The metal foil 21 used to form the spring component 10 may also have a base material and a copper layer. The base material may contain any material selected from the group consisting of stainless steel alloys, beryllium copper, nickel-tin copper, phosphor bronze, Cosun alloy, and titanium copper. The base material has a first side and a second side opposite to the first side. The copper layer may be located on at least one of the first and second sides of the base material. That is, the copper layer may be located on both the first and second sides, or only on the first side or only on the second side. The copper layer may be formed by methods such as vacuum evaporation, sputtering, and wet plating.

[0096] Furthermore, when the metal foil 21 has a base material and one or more copper layers, the spring member 10 also has a base material and one or more copper layers. The base material of the spring member 10 is part of the base material of the metal foil 21, and the copper layer of the spring member 10 is part of the copper layer of the metal foil 21. The base material has a first side and a second side opposite to the first side. The copper layer is located on at least one of the first side and the second side. That is, the copper layer may be located on both the first side and the second side of the base material, or it may be located only on the first side or only on the second side.

[0097] [Example]

[0098] Reference Figures 10 to 13 The embodiments and comparative examples are described below.

[0099] [Comparative Example 1-1]

[0100] In Comparative Example 1-1, a rolled material, namely metal foil 21, made of titanium copper and having a thickness of 120 μm was prepared. Next, resist masks RM1 and RM2 were formed on the first side 21S1 and the second side 21S2 of the metal foil 21. Using the two resist masks RM1 and RM2, wet etching was performed on the metal foil 21 from both the first side 21S1 and the second side 21S2. An aqueous solution of ferric chloride was used as the etching solution for the wet etching.

[0101] Furthermore, within the 280mm square area of ​​the metal foil 21, square unit areas corresponding to one spring component 10 and having a square shape of 20mm are arranged in a grid pattern, covering both the rolling direction and the width direction of the metal foil 21. Therefore, on each resist mask RM1, RM2, unit patterns corresponding to the shape of one spring component 10 are also arranged in a grid pattern, covering both the rolling direction and the width direction.

[0102] Figure 10It is a top view schematically representing a portion of the unit pattern in the first resist mask RM1. Figure 10 The portion of the unit pattern corresponding to the spring portion 13 of the spring component 10 is schematically shown. Figure 10 In the illustration, for ease of understanding, the openings of the unit pattern are represented by rectangles. Furthermore, the position of the second resist mask RM2 relative to the metal foil 21 differs from that of the first resist mask RM1, but it has the same shape as the first resist mask RM1. Therefore, the shape of the first resist mask RM1 will be described below, while the description of the shape of the second resist mask RM2 will be omitted.

[0103] like Figure 10 As shown, the unit pattern has multiple openings in the portion corresponding to the spring portion 13. Each opening consists of two first openings RM1A1 located at the ends in the arrangement direction and a second opening RM1A2 sandwiched between the two first openings RM1A1. In the arrangement direction, the width of the first opening RM1A1 is a first width WA1, and the width of the second opening RM1A2 is a second width WA2.

[0104] The portion of the first resist mask RM1 sandwiched between the first opening RM1A1 and the second opening RM1A2 in the arrangement direction is the first linear portion RM11. The portion sandwiched between the two second openings RM1A2 in the arrangement direction is the second linear portion RM12. After etching of the metal foil 21, the portion covered by the first linear portion RM11 is the outer fine line 13A1, and the portion covered by the second linear portion RM12 is the inner fine line 13A2. After etching of the metal foil 21, a unit pattern is formed such that six fine lines 13A are included in a cross-section orthogonal to the first surface 21S1 and orthogonal to the direction in which the fine lines 13A extend.

[0105] In the first resist mask RM1, the spacing P between the adjacent linear portions RM11 and RM12 in the arrangement direction is set to 240 μm. In addition, the first width WA1 of the first opening RM1A1 is set to 220 μm, and the second width WA2 of the second opening RM1A2 is set to 100 μm.

[0106] Furthermore, when viewed from above opposite the first surface 21S1 of the metal foil 21, a plurality of unit patterns are formed on each of the resist masks RM1 and RM2 in such a way that the entirety of one unit pattern of the first resist mask RM1 overlaps with the entirety of one unit pattern of the second resist mask RM2.

[0107] Using such resist masks RM1 and RM2, multiple etched patterns corresponding to the shape of the spring component 10 are formed on the metal foil 21.

[0108] [Comparative Examples 1-2 to 1-7]

[0109] In Comparative Examples 1-2 to 1-7, compared with Comparative Example 1-1, the first width WA1 of the first opening RM1A1 was narrowed, and the width of the first linear portion RM11 was widened. Otherwise, the etching patterns of Comparative Examples 1-2 to 1-7 were obtained using the same method as Comparative Example 1-1.

[0110] [Comparative Examples 1-8]

[0111] In Comparative Examples 1-8, compared to Comparative Example 1-1, the second width WA2 of the second opening RM1A2 was narrowed, and the width of the second linear portion RM12 was widened. Otherwise, the etching patterns of Comparative Examples 1-8 were obtained by the same method as in Comparative Example 1-1.

[0112] [Comparative Examples 1-9, 1-10, Examples 1-1 to 1-4, Comparative Examples 1-11 to 1-13]

[0113] In Comparative Examples 1-9, 1-10, Examples 1-1 to 1-4, and Comparative Examples 1-11 to 1-13, compared with Comparative Example 1-8, the first width WA1 of the first opening RM1A1 was narrowed, and the width of the first linear portion RM11 was widened. Otherwise, the etching patterns of Comparative Examples 1-9, 1-10, Examples 1-1 to 1-4, and Comparative Examples 1-11 to 1-13 were obtained using the same method as in Comparative Examples 1-8.

[0114] [Examples 1-5]

[0115] In Examples 1-5, compared to Comparative Examples 1-1, the widths WA1 and WA2 of each opening RM1A1 and RM1A2 were narrowed, and the widths of each linear portion RM11 and RM12 were widened. Otherwise, the etching patterns of Examples 1-5 were obtained by the same method as in Comparative Examples 1-1.

[0116] [Examples 1-6 to 1-8, Comparative Examples 1-14]

[0117] In Examples 1-6 to 1-8 and Comparative Examples 1-14, compared with Examples 1-5, the first width WA1 of the first opening RM1A1 was narrowed, and the width of the first linear portion RM11 was widened. Otherwise, the etching patterns of Examples 1-6 to 1-8 and Comparative Examples 1-14 were obtained by the same method as in Examples 1-5.

[0118] [Comparative Example 2-1]

[0119] In Comparative Example 2-1, the thickness of the metal foil 21 was changed to 150 μm, the spacing P was changed to 300 μm, and the widths WA1 and WA2 of each opening RM1A1 and RM1A2 were enlarged. Otherwise, the etching pattern of Comparative Example 2-1 was obtained by the same method as in Comparative Example 1-1.

[0120] [Comparative Examples 2-2 to 2-7]

[0121] In Comparative Examples 2-2 to 2-7, compared to Comparative Example 2-1, the first width WA1 of the first opening RM1A1 was narrowed, and the width of the first linear portion RM11 was widened. Otherwise, the etching patterns of Comparative Examples 2-2 to 2-7 were obtained by the same method as in Comparative Example 2-1.

[0122] [Comparative Examples 2-8]

[0123] In Comparative Examples 2-8, compared to Comparative Example 2-1, the second width WA2 of the second opening RM1A2 was narrowed, and the width of the second linear portion RM12 was widened. Otherwise, the etching pattern of Comparative Example 2-8 was obtained by the same method as in Comparative Example 2-1.

[0124] [Comparative Examples 2-9, 2-10, Examples 2-1 to 2-4, Comparative Examples 2-11 to 2-13]

[0125] In Comparative Examples 2-9, 2-10, Examples 2-1 to 2-4, and Comparative Examples 2-11 to 2-13, compared with Comparative Example 2-8, the first width WA1 of the first opening RM1A1 was narrowed, and the width of the first linear portion RM11 was widened. Otherwise, the etching patterns of Comparative Examples 2-9, 2-10, Examples 2-1 to 2-4, and Comparative Examples 2-11 to 2-13 were obtained using the same method as in Comparative Example 2-8.

[0126] [Examples 2-5]

[0127] In Examples 2-5, compared to Comparative Example 2-1, the widths WA1 and WA2 of each opening RM1A1 and RM1A2 were narrowed, and the widths of each linear portion RM11 and RM12 were widened. Otherwise, the etching patterns of Examples 2-5 were obtained by the same method as in Comparative Example 2-1.

[0128] [Examples 2-6 to 2-8, Comparative Example 2-14]

[0129] In Examples 2-6 to 2-8 and Comparative Example 2-14, compared with Example 2-5, the first width WA1 of the first opening RM1A1 was narrowed, and the width of the first linear portion RM11 was widened. Otherwise, the etching patterns of Examples 2-6 to 2-8 and Comparative Example 2-14 were obtained by the same method as in Example 2-5.

[0130] [Comparative Example 3-1]

[0131] In Comparative Example 3-1, the thickness of the metal foil 21 was changed to 200 μm, the spacing P was changed to 400 μm, and the widths WA1 and WA2 of each opening RM1A1 and RM1A2 were enlarged. Otherwise, the etching pattern of Comparative Example 3-1 was obtained by the same method as in Comparative Example 1-1.

[0132] [Comparative Examples 3-2 to 3-7]

[0133] In Comparative Examples 3-2 to 3-7, compared to Comparative Example 3-1, the first width WA1 of the first opening RM1A1 was narrowed, and the width of the first linear portion RM11 was widened. Otherwise, the etching patterns of Comparative Examples 3-2 to 3-7 were obtained by the same method as in Comparative Example 3-1.

[0134] [Comparative Examples 3-8]

[0135] In Comparative Examples 3-8, compared to Comparative Example 3-1, the second width WA2 of the second opening RM1A2 was narrowed, and the width of the second linear portion RM12 was widened. Otherwise, the etching pattern of Comparative Example 3-8 was obtained by the same method as in Comparative Example 3-1.

[0136] [Comparative Examples 3-9, 3-10, Examples 3-1 to 3-4, Comparative Examples 3-11 to 3-13]

[0137] In Comparative Examples 3-9, 3-10, Examples 3-1 to 3-4, and Comparative Examples 3-11 to 3-13, compared with Comparative Example 3-8, the first width WA1 of the first opening RM1A1 was narrowed, and the width of the first linear portion RM11 was widened. Otherwise, the etching patterns of Comparative Examples 3-9, 3-10, Examples 3-1 to 3-4, and Comparative Examples 3-11 to 3-13 were obtained using the same method as in Comparative Example 3-8.

[0138] [Examples 3-5]

[0139] In Examples 3-5, compared to Comparative Example 3-1, the widths WA1 and WA2 of each opening RM1A1 and RM1A2 were narrowed, and the widths of each linear portion RM11 and RM12 were widened. Otherwise, the etching patterns of Examples 3-5 were obtained by the same method as in Comparative Example 3-1.

[0140] [Examples 3-6 to 3-8, Comparative Example 3-14]

[0141] In Examples 3-6 to 3-8 and Comparative Example 3-14, compared with Example 3-5, the first width WA1 of the first opening RM1A1 was narrowed, and the width of the first linear portion RM11 was widened. Otherwise, the etching patterns of Examples 3-6 to 3-8 and Comparative Example 3-14 were obtained by the same method as in Example 3-5.

[0142] [Width of the thin line]

[0143] Using synthetic resin, the spring portions 13 present in the etched patterns of each etched metal foil 21 are embedded. Then, the embedded spring portions 13 are cut by using a slicing machine to expose the cross section of the spring portions 13 on a plane that is orthogonal to the direction of the extension of the fine lines contained in the spring portions 13 and orthogonal to the first surface 21S1.

[0144] In the cross-section of the spring portion 13, the spring width was measured at the following locations: a first width WS1 on the first surface 21S1 of the metal foil 21, a second width WS2 on the second surface 21S2 of the metal foil 21, and the widths on three planes sandwiched between the first surface 21S1 and the second surface 21S2 of the metal foil 21 in a plane that divides the spring portion 13 into four equal parts in the thickness direction. When measuring the width of the spring portion 13, a digital microscope (KEYENCE Corporation, VHX-6000) was used, and the objective lens magnification was set to 100x.

[0145] In each spring portion 13 of each metal foil 21, the average value of the second width WS2 is calculated based on the two outer fine lines 13A1, and the average value of the second width WS2 is calculated based on the four inner fine lines 13A2. Then, by averaging the average values ​​of the second width WS2 of the ten spring portions 13, the average value of the second width WS2 of the outer fine lines 13A1 and the average value of the second width WS2 of the inner fine lines 13A2 are calculated. This average value is set as the second width WS2 of the fine lines 13A1 and 13A2 in each embodiment and comparative example.

[0146] Furthermore, in each spring portion 13 of each metal foil 21, the average value of the first width WS1 is calculated based on the two outer fine lines 13A1, and the average value of the first width WS1 is calculated based on the four inner fine lines 13A2. Then, by averaging the average values ​​of the first width WS1 of the ten spring portions 13, the average value of the first width WS1 of the outer fine lines 13A1 and the average value of the first width WS1 of the inner fine lines 13A2 are calculated. This average value is set as the first width WS1 of the fine lines 13A1 and 13A2 in each embodiment and comparative example.

[0147] Furthermore, in each spring section 13 of each metal foil 21, the average width of five points is calculated for each outer fine line 13A1, and then the average width is calculated for two outer fine lines 13A1. Thus, the average width of the outer fine lines 13A1 of one spring section 13 is calculated. Then, by averaging the average widths of the outer fine lines 13A1 of ten spring sections 13, the average width of the outer fine lines 13A1 is calculated. Similarly, in each spring section 13 of each metal foil 21, the average width of five points is calculated for each inner fine line 13A2, and then the average width is calculated for four inner fine lines 13A2. Thus, the average width of the inner fine lines 13A2 in one spring section 13 is calculated. Then, by averaging the average widths of the inner fine lines 13A2 of ten spring sections 13, the average width of the inner fine lines 13A2 is calculated.

[0148] [The formation of local continuity and breakage in a thin thread]

[0149] After etching the metal foil 21, a digital microscope (as above) was used to confirm whether all etched patterns contained in each metal foil 21 included fine lines 13A with local through-sections near the center in the thickness direction, or broken fine lines 13A. Furthermore, a local through-section is a through-section on a pair of sides of the fine line 13A. The presence or absence of fine lines 13A with through-sections or broken fine lines 13A in the etched pattern was evaluated at the following two levels.

[0150] ○: The etched pattern does not contain any fine lines 13A that have local through-sections near the center in the thickness direction, or fine lines 13A that are broken.

[0151] ×: The etched pattern includes one or more fine lines 13A that have a local through-section near the center in the thickness direction, or fine lines 13A that are broken.

[0152] [Deformation of thin lines]

[0153] Ten etched patterns contained in each metal foil 21 were cut out as spring components 10. Then, a dynamic test was conducted in which the spring component 13 was driven while the outer frame 11 of the spring component 10 was fixed. Then, whether the spring component 10 contained deformed fine lines 13A was evaluated at the following two levels. When determining whether the spring component 10 contained deformed fine lines 13A, the spring component 10 was observed using a digital microscope (as above).

[0154] ○: After the dynamic test, the spring component 10 does not contain any deformed fine wire 13A.

[0155] ×: After dynamic testing, the spring component 10 contains one or more deformed fine wires 13A.

[0156] [Evaluation Results]

[0157] In the etching patterns of each embodiment and comparative example, the average value of the second width WS2 of each fine line 13A, the occurrence of through portions in the fine line 13A, the presence or absence of broken lines, and the presence or absence of deformation of the fine line 13A were evaluated, and the results are as follows: Figures 11 to 13 As shown.

[0158] like Figures 11 to 13 As shown, when the width of the inner fine line 13A2 is within the range of 6.0 μm or more and 6.6 μm or less, a partial through-hole is found near the center of the inner fine line 13A2 in the thickness direction. The inner fine line 13A2 is the most constricted part of the inner fine line 13A2, and it has a partial through-hole near the center of the spring member 10 in the thickness direction.

[0159] Furthermore, when the width of the inner fine line 13A2 is within the range of 6.0 μm to 6.6 μm and the width of the outer fine line 13A1 is less than 10 μm, a partial through-hole is found near the center of the outer fine line 13A1 in the thickness direction. The outer fine line 13A1 is the most constricted part of the outer fine line 13A1, and it has a partial through-hole near the center of the spring member 10 in the thickness direction. On the other hand, even when the width of the inner fine line 13A2 is within the range of 6.0 μm to 6.6 μm and the width of the outer fine line 13A1 is 10 μm or more, no partial through-hole or break is found near the center of the outer fine line 13A1 in the thickness direction.

[0160] Furthermore, when the width of the inner fine line 13A2 is within the range of 6.0 μm or more and 6.6 μm or less, deformation of the inner fine line 13A2 was confirmed. In contrast, when the width of the inner fine line 13A2 is within the range of 6.0 μm or more and 6.6 μm or less, no deformation was confirmed in the outer fine line 13A1.

[0161] When the width of the inner fine line 13A2 is within the range of 10.0 μm or more and 10.7 μm or less, and the difference between the width of the outer fine line 13A1 and the width of the inner fine line 13A2 is 2.0 μm or more, no local penetration or break is found in the outer fine line 13A1 near the center in the thickness direction. Conversely, when the width of the inner fine line 13A2 is within the range of 10.0 μm or more and 10.7 μm or less, and the difference between the width of the outer fine line 13A1 and the width of the inner fine line 13A2 is less than 2.0 μm, a local penetration is found near the center in the thickness direction of the outer fine line 13A1.

[0162] Furthermore, when the width of the inner fine line 13A2 is within the range of 10.0 μm to 10.7 μm, and the difference between the width of the outer fine line 13A1 and the width of the inner fine line 13A2 is 8.0 μm or less, no deformation of the inner fine line 13A2 is confirmed. Conversely, when the width of the inner fine line 13A2 is within the range of 10.0 μm to 10.7 μm, and the difference between the width of the outer fine line 13A1 and the width of the inner fine line 13A2 exceeds 8.0 μm, deformation of the inner fine line 13A2 is confirmed.

[0163] If the width of the inner fine line 13A2 is within the range of 40.1 μm or more and 40.8 μm or less, and the difference obtained by subtracting the width of the inner fine line 13A2 from the width of the outer fine line 13A1 is 2.0 μm or more, then a local through-section near the center in the thickness direction is not identified in the outer fine line 13A1, and the line is broken.

[0164] Furthermore, when the width of the inner fine line 13A2 is within the range of 40.1 μm to 40.8 μm, and the difference between the width of the outer fine line 13A1 and the width of the inner fine line 13A2 is 8.0 μm or less, no deformation of the inner fine line 13A2 is confirmed. Conversely, when the width of the inner fine line 13A2 is within the range of 40.1 μm to 40.8 μm, and the difference between the width of the outer fine line 13A1 and the width of the inner fine line 13A2 exceeds 8.0 μm, deformation of the inner fine line 13A2 is confirmed.

[0165] Furthermore, the average value of the first width WS1 of each fine line 13A was confirmed to be... Figures 11 to 13 The average value of the second width WS2 shown is equal. Furthermore, it was confirmed that the width of each fine line 13A deviates from the average value by less than ±2 μm.

[0166] Based on these results, it can be said that by satisfying condition 1 above, the fine wire 13A included in the spring portion 13 can suppress local penetrations and wire breaks near the center portion in the thickness direction of the fine wire 13A during etching. Furthermore, it can be said that by satisfying condition 2 above, the fine wire 13A included in the spring portion 13 can suppress deformation of the fine wire 13A during the driving of the spring member 10.

[0167] As explained above, according to one embodiment of the spring component for the camera module, the camera module, and the electronic device, the following effects can be obtained.

[0168] (1) By satisfying both condition 1 and the lower limit value in condition 2, the generation of through portions or breakage of lines in the inner fine line 13A2 and the outer fine line 13A1 during etching can be suppressed. Furthermore, by satisfying both condition 1 and the upper limit value in condition 2, the concentration of load on the inner fine line 13A2 due to the driving of the spring member 10 can be suppressed. As a result, deformation of the inner fine line 13A2 caused by the driving of the spring member 10 can be suppressed.

[0169] (2) Compared with the case where the spring component 10 is thicker than the first width WS1 and the second width WS2 on the inner side in the thickness direction, it is possible to suppress the stiffness of the thin wire 13A from becoming too high.

[0170] (3) By making the upper limit of the width of each fine line 13A less than 20μm, the effect of the width of the fine line 13A satisfying conditions 1 and 2 can be significantly obtained.

[0171] (4) Since the outer fine line 13A1 is necked on at least one side, the rigidity of the outer fine line 13A1 is not likely to become too high.

[0172] (5) Since the spring component 10 can have high hardness, the durability of the spring component 10 can be improved.

[0173] Furthermore, the above-described implementation methods can be modified as follows.

[0174] [Spring section]

[0175] As described above, the spring section 13 can be a zigzag shape formed by bending a single leaf spring through multiple bends, or it can be composed of multiple independent leaf springs. When the spring section has multiple independent leaf springs, each leaf spring is connected to both the inner frame section and the outer frame section.

[0176] Explanation of reference numerals in the attached figures

[0177] 10…Spring components;

[0178] 10S1…First page;

[0179] 10S2…Second side;

[0180] 13…Spring section;

[0181] 13A… fine thread;

[0182] 13A1… outer fine line;

[0183] 13A11…First side view;

[0184] 13A12…Second side view;

[0185] 13A2…inner fine line.

Claims

1. A spring component for use in a camera module, comprising: First impression; as well as The second surface, opposite to the first surface. In a cross-section orthogonal to the first surface, there are three or more thin lines. The thin lines located at both ends are called outer thin lines, and the thin lines sandwiched between the outer thin lines are called inner thin lines. The inner fine lines have a width of more than 10 μm on both the first and second surfaces. The outer fine line has a width that is 2 μm thicker and less than 8 μm thicker than the width of the inner fine line on the first surface and the second surface.

2. The spring component according to claim 1, wherein, In each fine line, the width on the first surface is a first width, and the width on the second surface is a second width. In the thickness direction of the spring component, the first width and the second width are the first or second largest widths.

3. The spring component according to claim 2, wherein, The first width and the second width of each fine line are less than 20 μm.

4. The spring component according to any one of claims 1 to 3, wherein, Among the outer fine lines, of the pair of side surfaces extending along the thickness direction of the spring component, the side shorter in distance from the inner fine line is the first side surface, and the side opposite to the first side surface is the second side surface. The second side has a V-shape that is recessed from the second side toward the first side.

5. The spring component according to any one of claims 1 to 3, wherein, The aspect ratio of the thin line is 3 or more and 20 or less.

6. The spring component according to any one of claims 1 to 3, wherein, The thickness of the spring component is greater than 120 μm and less than 200 μm.

7. The spring component according to any one of claims 1 to 3, wherein, The spring component comprises any one selected from the group consisting of stainless steel alloy, beryllium copper, nickel-tin copper, phosphor bronze, Cosun alloy, and titanium copper.

8. The spring component according to any one of claims 1 to 3, wherein, The spring component comprises a base material selected from the group consisting of stainless steel alloy, beryllium copper, nickel-tin copper, phosphor bronze, Cosun alloy, and titanium copper. The base material has a first surface and a second surface opposite to the first surface. The spring component further comprises a copper layer on at least one of the first surface and the second surface of the base material.

9. A camera module comprising a spring component according to any one of claims 1 to 3.

10. An electronic device comprising the camera module of claim 9.

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