Gripping assembly, testing machine and actuator

Abstract

The disclosure provides a clamping assembly, a testing machine and an actuator. The clamping assembly comprises a substrate, wherein the substrate comprises a chip placement area for carrying a chip; the chip placement area comprises a light transmission area corresponding to a light sensitive area of the chip; a pressing plate is arranged on one side of the substrate and is configured to cooperate with the substrate to position the chip; the pressing plate comprises a first pin assembly and a second pin assembly; the first pin assembly is configured to conductively connect with a pin of the chip; the second pin assembly comprises a conversion pin; and the substrate further comprises an avoidance area for avoiding the second pin assembly. Through cooperation of the substrate and the pressing plate, the chip can be placed upside down, bottom light irradiation can be achieved, and the testing machine and the actuator can be less modified, thereby having higher universality.

Description

Technical Field

[0001] This disclosure relates to the field of testing technology, and more specifically, to a clamping component, a testing machine, and an actuator. Background Technology

[0002] The SPAD (single-photon avalanche diode) + SOC (system-on-chip) combination in LiDAR is a highly integrated technical solution that helps improve consistency and reduce costs. However, this also presents the challenge of performing automotive-grade testing under three temperatures (low, normal, and high) with illumination.

[0003] Some solutions require large-scale modifications to the testing robotic arms and testing machines before they can be applied to SPAD SOC testing. These modifications are costly and have poor versatility.

[0004] The content of the background section is merely the technology known to the inventor and does not necessarily represent the prior art in this field. Summary of the Invention

[0005] This disclosure provides at least one clamping component, a testing machine, and an actuator to reduce the need for equipment modifications.

[0006] In a first aspect, a clamping assembly is provided for clamping a chip; the clamping assembly includes:

[0007] A substrate, the substrate including a chip placement area for carrying the chip; the chip placement area including a light-transmitting area corresponding to the photosensitive area of ​​the chip;

[0008] A pressure plate, disposed on one side of the substrate, is configured to cooperate with the substrate to position the chip; the pressure plate includes a first pin assembly and a second pin assembly; the first pin assembly is configured to be electrically connected to the pins of the chip; the second pin assembly includes adapter pins;

[0009] The substrate further includes a clearance area for avoiding the second pin assembly.

[0010] Optionally, the avoidance area and the chip placement area are arranged at a distance.

[0011] Optionally, the chip placement area is provided with a first receiving groove for accommodating the chip, and the light-transmitting area is provided with a light-transmitting hole;

[0012] The light-transmitting hole is connected to the first receiving groove.

[0013] Optionally, the first pin assembly and the second pin assembly are arranged in a stepped manner, and the height of the second pin assembly is greater than the height of the first pin assembly.

[0014] Optionally, the pressure plate includes a circuit board and a pin plate; the circuit board and the pin plate are stacked together.

[0015] The circuit board includes a connection circuit; the pin board includes a first pin assembly and a second pin assembly;

[0016] The first pin assembly and the second pin assembly are electrically connected through the connection circuit.

[0017] Optionally, the substrate includes a first substrate and a second substrate, the second substrate being nested with the first substrate; the second substrate includes the chip placement area.

[0018] Optionally, the first substrate includes a second receiving groove and a through hole; the second substrate is disposed in the second receiving groove, and the second pin assembly is correspondingly disposed with respect to the through hole so that the second pin assembly is exposed through the through hole; the light-transmitting area is correspondingly disposed with respect to the through hole so that an optical path channel is realized through the through hole.

[0019] Optionally, it also includes:

[0020] An adapter circuit board is located on the side of the substrate away from the pressure plate, and the adapter circuit board is electrically connected to the second pin assembly.

[0021] Optionally, it also includes:

[0022] A light source is disposed on the side of the substrate away from the pressure plate; the light-emitting end of the light source faces the light-transmitting area.

[0023] In a second aspect, a testing machine is provided, which includes a testing machine body and a substrate embedded in the testing machine body;

[0024] The substrate includes a chip placement area for supporting the chip; the chip placement area includes a light-transmitting area corresponding to the photosensitive area of ​​the chip; the substrate also includes a clearance area for avoiding the second pin assembly of the pressure plate.

[0025] Optionally, the chip placement area is provided with a first receiving groove for accommodating the chip; the light-transmitting area is provided with a light-transmitting hole; the light-transmitting hole is connected to the first receiving groove.

[0026] Optionally, the substrate includes a first substrate and a second substrate, the second substrate being nested with the first substrate; the second substrate includes the chip placement area.

[0027] Optionally, the first substrate includes a second receiving groove and a through hole; the second substrate is disposed in the second receiving groove, and the second pin assembly is correspondingly disposed with respect to the through hole so that the second pin assembly is exposed through the through hole; the light-transmitting area is correspondingly disposed with respect to the through hole so that an optical path channel is realized through the through hole.

[0028] Optionally, it also includes:

[0029] An adapter circuit board is electrically connected to the circuit board of the test machine body, and the adapter circuit board is located on the side of the substrate facing the test machine body;

[0030] The adapter circuit board is used for conductive connection with the second pin assembly.

[0031] Optionally, it also includes:

[0032] A light source is disposed on the side of the substrate away from the pressure plate, and the light source faces the light-transmitting area.

[0033] Thirdly, an actuator is provided, which includes an actuator body and a pressure plate that is detachably and fixedly connected to the actuator body;

[0034] The pressure plate is configured to cooperate with the substrate to position the chip; the pressure plate includes a first pin assembly and a second pin assembly; the first pin assembly is configured to be electrically connected to the pins of the chip, and the second pin assembly includes adapter pins.

[0035] Optionally, the first pin assembly and the second pin assembly are arranged in a stepped manner, and the height of the second pin assembly is greater than the height of the first pin assembly.

[0036] Optionally, the pressure plate includes a circuit board and a pin plate; the circuit board and the pin plate are stacked together.

[0037] The circuit board includes a connection circuit; the pin board includes a first pin assembly and a second pin assembly;

[0038] The first pin assembly and the second pin assembly are electrically connected through the connection circuit.

[0039] Optionally, the executing entity includes a robotic arm.

[0040] The clamping assembly, testing machine, and actuator provided in this disclosure allow the chip to be placed upside down through the cooperation of the substrate and the pressure plate, enabling direct bottom illumination. This reduces the need for modifications to the testing machine and actuator, and provides high versatility.

[0041] To make the above-mentioned objects, features and advantages of this disclosure more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0042] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the embodiments will be described by way of example below. These drawings are incorporated in and constitute a part of this specification. They illustrate embodiments conforming to this disclosure and, together with the specification, serve to explain the technical solutions of this disclosure. It should be understood that the following drawings only illustrate certain embodiments of this disclosure and should not be considered as limiting the scope. For those skilled in the art, these drawings can be used to obtain other related drawings without creative effort.

[0043] Figure 1 A schematic diagram of a clamping assembly consistent with some embodiments of this disclosure is shown.

[0044] Figure 2 An exploded schematic diagram of a substrate consistent with some embodiments of this disclosure is shown.

[0045] Figure 3 A schematic diagram of the structure of a pressure plate consistent with some embodiments of this disclosure is shown.

[0046] Figure 4 A side view of a pressure plate consistent with some embodiments of this disclosure is shown.

[0047] Figure 5 A cross-sectional view of a pressure plate consistent with some embodiments of this disclosure is shown.

[0048] Figure 6 An exploded view of the support frame, substrate, and light source component consistent with some embodiments of this disclosure is shown. Detailed Implementation

[0049] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the specific implementation methods of this disclosure will be described below with reference to the accompanying drawings. The accompanying drawings described below are merely some embodiments of this disclosure. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without creative effort. Adjustments and improvements made without departing from the concept of this disclosure are all within the protection scope of this disclosure.

[0050] To keep the drawings simple, each figure only schematically shows the parts related to the corresponding embodiment, and they do not represent the actual structure of the product. In addition, to make the drawings simple and easy to understand, some figures only schematically show parts with the same structure or function, and in actual use there may be more or fewer parts with the same structure or function.

[0051] Unless otherwise defined, the technical or scientific terms used in the claims and description shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar words used in this patent application description and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. The terms “an” or “a” and similar words do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “comprising” or “including” and similar words mean that the element or object preceding “comprising” or “including” encompasses the element or object listed following “comprising” or “including” and its equivalents, and do not exclude other elements or objects. The terms “connected,” “coupled,” or “linked” and similar words are not limited to physical or mechanical connections, nor are they limited to direct or indirect connections.

[0052] Unless otherwise specified, all embodiments mentioned in this disclosure are intended to be combined with each other to form new technical solutions. Similarly, all technical features and preferred features mentioned in this disclosure are intended to be combined with each other to form new technical solutions.

[0053] In this disclosure, the terms "or" and "and / or" describe the relationship between related objects and indicate a non-exclusive inclusion. For example, "A and / or B" and "A or B" are used to include: the presence of only "A", the presence of only "B", and the presence of both "A" and "B", where "A" and "B" are used to be singular or plural. As another example, "A, B, and / or C" and "A, B, or C" are used to include: the presence of only "A", the presence of only "B", the presence of only "C", the presence of both "A" and "B", the presence of both "A" and "C", the presence of both "B" and "C", and the presence of both "A", "B", and "C", where "A", "B", and "C" are used to be singular or plural. Furthermore, the symbol " / " in this disclosure indicates an "or" relationship between the related objects before and after the symbol. In this disclosure, the term "at least one A or B" has the same meaning as "A or B" described above. The term "at least one A, B, or C" has the same meaning as "A, B, or C" above. "One or more" of multiple objects refers to any one or any combination of multiple objects, such as "one or more of A, B, and C" including: "A alone", "B alone", "C alone", "A and B", "A and C", "B and C", or "A, B, and C".

[0054] The clamping assembly provided in this disclosure is used in the three-temperature testing of chips. The chip involved in this disclosure is a photosensitive chip, which can be applied in different scenarios, such as LiDAR, cameras, or other imaging devices. The photosensitive chip includes a SPAD array and logic processing circuitry. For example, the SPAD array and logic processing circuitry are stacked.

[0055] The three temperatures mentioned above refer to low temperature, normal temperature, and high temperature. For different chips, the three temperatures can be selected according to the conditions of the chip's application scenario. For example, when the chip is used in LiDAR, the three temperature settings could be: low temperature -40°C, normal temperature 20°C, and high temperature 125°C.

[0056] When performing three-temperature testing on a chip, the chip needs to be fixed in place to determine its performance at different temperatures. Some testing methods use a robotic arm to hold the chip, which is then inspected by a testing machine. When the robotic arm holds the chip, the photosensitive area of ​​the chip faces upwards, and a light source illuminates the photosensitive area from the top. This requires significant modifications to the robotic arm to meet the testing requirements. Therefore, this disclosure provides a clamping assembly to reduce the need for equipment modifications and facilitate chip testing. A detailed description is provided below with reference to the accompanying drawings and embodiments.

[0057] refer to Figure 1 As shown, Figure 1A schematic diagram of a clamping assembly consistent with some embodiments of this disclosure is shown. The clamping assembly provided in the embodiments of this disclosure includes a substrate 20 and a pressure plate 10. The substrate 20 and the pressure plate 10 cooperate to position the chip and fix the chip within the space enclosed by the substrate 20 and the pressure plate 10.

[0058] Please refer to the above. Figure 2 As shown, Figure 2 A schematic diagram of a substrate structure consistent with some embodiments of this disclosure is shown. The substrate 20 includes a chip placement area 222, through which a chip 30 can be carried. The chip placement area 222 is provided with a light-transmitting area 223 corresponding to the photosensitive area of ​​the chip 30. When placing the chip 30, the chip 30 is placed in the chip placement area 222, with the photosensitive area of ​​the chip 30 facing downwards and opposite to the light-transmitting area 223.

[0059] Please refer to the above. Figure 1 and Figure 3 , Figure 3 A schematic diagram of a substrate structure consistent with some embodiments of this disclosure is shown. A pressure plate 10 is disposed on one side of a substrate 20 and cooperates with the substrate 20 to position the chip 30. The substrate 20 and the pressure plate 10 are positioned on opposite sides of the chip 30, clamping and fixing the chip 30 between them. The pressure plate 10 is located on the side of the chip 30 away from the photosensitive area. The pressure plate 10 includes a first pin assembly 121 and a second pin assembly 122. The first pin assembly 121 and the second pin assembly 122 are electrically connected. The first pin assembly 121 can be electrically connected to the pins of the chip 30. When the pressure plate 10 is closed on the substrate 20, the first pin assembly 121 abuts against and is electrically connected to the pins of the chip 30. The second pin assembly 122 includes an adapter pin. The adapter pin can be electrically connected to an external power supply device. For example, the second pin assembly 122 is electrically connected to the tester to power the chip 30 and / or receive the output signals of the chip 30 through the second pin assembly 122 and the first pin assembly 121.

[0060] The substrate 20 also includes a clearance area 221 for avoiding the second pin assembly 122. The clearance area 221 exposes the second pin assembly 122 so that the second pin assembly 122 can be electrically connected to an external power supply device.

[0061] During assembly, the substrate 20 is connected to the testing machine, and the pressure plate 10 is fixedly connected to the actuator. The chip 30 is placed on the substrate 20, and the actuator drives the pressure plate 10 to close onto the substrate 20 and fix the chip 30. The testing machine supplies power to the chip 30 through the first pin assembly 121 and the second pin assembly 122. The light source is located on the side of the substrate 20 away from the pressure plate 10, and the light beam emitted by the light source can directly enter the photosensitive area from the bottom. The testing machine receives the signal fed back by the chip 30 and tests the chip 30. Tests are performed under different test conditions such as low temperature, normal temperature, and high temperature to test the performance of the chip 30 in different temperature environments. Using the clamping assembly provided in this disclosure, it is only necessary to fix it to the pressure plate 10 through the connector on the actuator, which can greatly reduce the modification of the actuator.

[0062] When the chip is fixed using the clamping assembly provided in this embodiment, direct testing of the three temperatures can be achieved, improving the comprehensiveness of the detection.

[0063] In some embodiments, the chip placement area 222 is provided with a first receiving groove for accommodating the chip 30. The chip 30 is positioned when placed in the first receiving groove. The chip 30 can be positioned by the groove wall of the first receiving groove, or by a limiting structure (such as a limiting post or limiting protrusion) arranged in the first receiving groove. In some embodiments, a clearance groove 224 is provided on the side wall of the first receiving groove, which facilitates the insertion of a tool for gripping the chip 30 into the first receiving groove to grasp and place the chip 30.

[0064] The light-transmitting area 223 within the chip placement area 222 can be implemented in different ways. For example, the substrate 20 can be made of a light-transmitting material, or the portion of the substrate 20 corresponding to the light-transmitting area 223 can be made of a light-transmitting material. The light-transmitting material can be materials such as glass, quartz, or resin. Alternatively, the light-transmitting area 223 can be provided with a light-transmitting hole, which communicates with the first receiving groove. Light emitted from the light source passes through the light-transmitting hole and illuminates the photosensitive area of ​​the chip 30. For example, the light-transmitting area 223 can be provided with a filter. The filter can filter light outside the desired wavelength range.

[0065] In some embodiments, the clearance area 221 and the chip placement area 222 are arranged at a distance from each other. The distance between them facilitates the formation of two areas on the substrate 20. The clearance area 221 and the chip placement area 222 are arranged at a distance, and the first pin assembly 121 and the second pin assembly 122 are arranged at a distance, so that the two pin assemblies can be arranged on the pressure plate 10.

[0066] The clearance area 221 can be implemented through different structures. For example, the clearance area 221 can be a cutout area formed on the substrate 20; or, the clearance area 221 can be an area formed by a notch formed on the substrate 20. Alternatively, the size of the substrate 20 can be smaller than the size of the pressure plate 10, the second pin assembly 122 can be exposed on the outer side of the substrate 20, and the clearance area 221 can be the area outside the sidewall of the substrate 20.

[0067] In some embodiments, the substrate 20 provided in this disclosure includes a first substrate 21 and a second substrate 22, with the second substrate 22 nested within the first substrate 21. The second substrate 22 is located on the inner side, and the first substrate 21 is located on the outer side. For example, the first substrate 21 adopts a frame structure, and the second substrate 22 is nested within the frame structure.

[0068] Continue to refer to Figure 2 The chip placement area 222 is located on the second substrate 22 to support the chip 30. For example, the second substrate 22 can be supported on the first substrate 21. The first substrate 21 is fixedly connected to the testing machine, and the second substrate 22 is positioned and nested within the first substrate 21. If the second substrate 22 becomes worn, only the second substrate 22 needs to be replaced; the entire substrate 20 does not need to be replaced. Furthermore, replacing the second substrate 22 does not require disassembling the first substrate 21, making replacement convenient.

[0069] When the first substrate 21 and the second substrate 22 are positioned and engaged, positioning can be achieved by the engagement of positioning posts and positioning holes. For example, the first substrate 21 is provided with positioning posts 213, and the second substrate 22 is provided with positioning holes 225. Alternatively, the first substrate 21 is provided with positioning holes, and the second substrate 22 is provided with positioning posts.

[0070] In some embodiments, the first substrate 21 and the second substrate 22 are connected by a first threaded connector 23, and the first substrate 21 is connected to the testing machine by a second threaded connector 24, facilitating disassembly. The first threaded connector 23 and the second threaded connector 24 include at least bolts or screws.

[0071] The first substrate 21 and the second substrate 22 may be made of the same material or different materials, and no specific limitation is made in this embodiment. For example, the first substrate 21 and the second substrate 22 are both made of metal or plastic materials.

[0072] In some embodiments, the first substrate 21 includes a second receiving groove 211 and a through hole 212. The through hole 212 communicates with the second receiving groove 211. The second substrate 22 is disposed within the second receiving groove 211, and the second pin assembly 122 corresponds to the through hole 212, so that the second pin assembly 122 is exposed through the through hole 212. Figure 2 and Figure 3As shown, if the second pin assembly 122 is inserted into the through hole 212, the conductive component of the test machine that mates with the second pin assembly 122 can be inserted into the through hole 212, and the two are electrically connected within the through hole 212; or, the second pin assembly 122 is inserted into the through hole 212 and exposed on the side of the substrate 20 away from the pressure plate 10, and the conductive component of the test machine that mates with the second pin assembly 122 is electrically connected to the second pin assembly 122 outside the through hole 212; or, the second pin assembly 122 is not inserted into the through hole 212, and the conductive component of the test machine that mates with the second pin assembly 122 passes through the through hole 212 and is electrically connected to the second pin assembly 122.

[0073] The light-transmitting area 223 corresponds to the through hole 212, so that the light path channel is realized through the through hole 212. The light emitted by the light source can shine into the light-transmitting area 223 through the through hole 212.

[0074] In one example, both the first substrate 21 and the second substrate 22 adopt a rectangular plate structure, and the second receiving groove 211 is a rectangular recess. A through-hole 212 is formed at the bottom of the second receiving groove 211 and penetrates the first substrate 21. The through-hole 212 is a rectangular hole, and its length direction is along the arrangement direction of the photosensitive area and the second pin assembly 122. For example, the first substrate 21, the second substrate 22, the second receiving groove 211, and the through-hole 212 can adopt regular shapes for ease of fabrication.

[0075] In addition to the rectangular structure shown in the example above, other regular polygonal structures can also be used. For example, the first substrate 21 can be a rectangular plate structure, and the second substrate 22 can be a hexagonal plate structure. The threaded connectors connecting the first substrate 21 to the testing machine are located at the four corners of the first substrate 21. When the second substrate 22 is a hexagonal plate structure, it can avoid the second threaded connector 24.

[0076] The first pin assembly 121 provided in some embodiments of this disclosure includes a plurality of first pins. The number of first pins is less than or equal to the number of pins of the chip 30. For example, when the number of first pins is less than the number of pins, the first pins can be connected to pins on the chip 30 used for detection. When the number of first pins is equal to the number of pins, the first pins can be connected one-to-one with the pins of the chip 30.

[0077] The number of second pins in the second pin assembly 122 provided in some embodiments of this disclosure is the same as or different from the number of first pins in the first pin assembly 121.

[0078] Please refer to the above. Figure 4 and Figure 5 As shown, Figure 4 A side view of a pressure plate consistent with some embodiments of this disclosure is shown; Figure 5A cross-sectional view of a pressure plate consistent with some embodiments of this disclosure is shown. In some embodiments, the first pin assembly 121 and the second pin assembly 122 are arranged in a stepped manner, and the height of the second pin assembly 122 is greater than the height of the first pin assembly 121, facilitating conductive connection between the second pin assembly 122 and an external power supply device. The heights of the first pin assembly 121 and the second pin assembly 122 are the heights of the pins exposed on the pressure plate 10. Figure 5 As shown, taking the surface where the pressure plate 10 and the substrate 20 are attached as the reference surface, the height of the first pin assembly 121 exposed on the reference surface is h1, and the height of the second pin assembly 122 exposed on the reference surface is h2, where h1 < h2. When the height of the second pin assembly 122 is greater than that of the first pin assembly 121, the second pin assembly 122 can be partially exposed on the side of the substrate 20 away from the pressure plate 10, facilitating the conductive connection between the second pin assembly 122 and an external power supply device.

[0079] Continue to refer to Figure 4 and Figure 5 In some embodiments, the pressure plate 10 has a raised structure 123 on the side facing the substrate 20, which forms two stepped surfaces of different heights. For example, a first pin assembly 121 is located on the first stepped surface 124, and a second pin assembly 122 is located on the second stepped surface 125. The raised structure 123 forms the stepped surfaces so that the first pin assembly 121 and the second pin assembly 122 are arranged on two surfaces of different heights. When the pressure plate 10 is closed to the substrate 20, the second pin assembly 122 can be inserted into the clearance area 221, closer to the tester, facilitating connection to the tester's circuit board. By using a stepped arrangement of the first pin assembly 121 and the second pin assembly 122, the second pin assembly 122 can use shorter pins to achieve a conductive connection with the tester's circuit board.

[0080] Continue to refer to Figure 3 and Figure 4 As shown, in some embodiments, the pressure plate 10 may include a circuit board 11 and a pin plate 12, with the circuit board 11 and pin plate 12 stacked together. The pin plate 12 faces the substrate 20, and the circuit board 11 is located on the side of the pin plate 12 facing away from the substrate 20. A connection circuit is provided on the circuit board 11, and the pin plate 12 includes a first pin assembly 121 and a second pin assembly 122. The first pin assembly 121 and the second pin assembly 122 are electrically connected through the connection circuit. If a pin is damaged, only the pin plate 12 needs to be replaced; the entire pressure plate 10 does not need to be replaced.

[0081] For example, the circuit board 11 may be a printed circuit board 11, which facilitates conductive connection with the pin board 12. For example, the side of the circuit board 11 facing the pin board 12 is provided with a printed circuit, and the printed circuit is provided with contact pads connected to the first pin and the second pin, so as to increase the contact area between the first pin and the second pin and the printed circuit.

[0082] The circuit board 11 and the pin plate 12 can be fixedly connected by snap-fit ​​or by threaded fasteners (bolts or screws). When fixedly connected, they can be positioned using positioning elements to ensure the accuracy of the connection between the first and second pins and the connecting circuit. For example, the circuit board 11 can have positioning holes, and the pin plate 12 can have positioning protrusions; or the circuit board 11 can have positioning protrusions, and the pin plate 12 can have positioning holes.

[0083] The pin plate 12 includes a support plate, and a first pin assembly 121 and a second pin assembly 122 are disposed on the support plate. One end of the first pin is exposed on the side of the support plate facing the circuit board 11, and the other end protrudes on the side of the support plate facing the substrate 20. One end of the second pin is exposed on the side of the support plate facing the circuit board 11, and the other end protrudes on the side of the support plate facing the substrate 20.

[0084] In some examples, the first and second pins can be unidirectional or bidirectional telescopic pins. When using unidirectional telescopic pins, the fixed end of the pin can face the connection circuit, while the telescopic end protrudes from the side of the pin plate 12 away from the circuit board 11. The contact force between the first and second pins and the connection circuit can be provided by the connection force when the circuit board 11 and the pin plate 12 are fixedly connected. When using bidirectional telescopic pins, the two telescopic ends of the first pin can respectively abut against the pin and the connection circuit, and the two telescopic ends of the second pin respectively abut against the external power supply and the connection circuit, thereby utilizing the contact force between the pressure plate 10 and the substrate 20 to improve the stability of the electrical connection.

[0085] In some embodiments, when the first pin assembly 121 and the second pin assembly 122 are arranged in a stepped manner, both the circuit board 11 and the pin plate 12 can adopt a stepped structure to facilitate their mating. For example, the areas of the circuit board 11 and the second pin assembly 122 corresponding to each other protrude towards the substrate 20. The areas of the pin plate 12 and the second pin assembly 122 corresponding to each other also protrude towards the substrate 20. When the pressure plate 10 mates with the substrate 20, the clearance area 221 on the substrate 20 avoids the protruding area of ​​the pin plate 12 to prevent interference between them.

[0086] In some embodiments, the clamping assembly provided in this disclosure further includes an adapter circuit board (not shown in the figures). The adapter circuit board is located on the side of the substrate 20 away from the pressure plate 10, and is electrically connected to the second pin assembly 122. The adapter circuit board is used to connect to the circuit board 11 of the testing machine. The circuit board inside the testing machine can be electrically connected to the second pin assembly 122 through the adapter circuit board. The arrangement of the adapter circuit board can reduce modifications to the testing machine; only an external adapter circuit board is needed to electrically connect the chip 30 to the circuit board inside the testing machine.

[0087] Please refer to the above. Figure 1 , Figure 2 and Figure 6 , Figure 6 An exploded view of the support frame, substrate, and light source 50, consistent with some embodiments of this disclosure, is shown. In some embodiments, the clamping assembly provided in this disclosure further includes a light source 50. The light source 50 is disposed on the side of the substrate 20 facing away from the pressure plate 10. The light-emitting end of the light source 50 faces the light-transmitting area 223, and the light emitted from the emitting end illuminates the photosensitive area of ​​the chip 30. The light source 50 may be a laser, an LED (light emitting diode), or other light-emitting devices.

[0088] In some embodiments, the clamping assembly provided in this disclosure further includes a support frame 40. The support frame 40 includes a cavity 41 with openings at both ends. The substrate 20 is disposed at one end of the support frame 40, and the light source 50 is disposed at the other end of the support frame 40. For example, the substrate 20, the light source 50, and the support frame 40 can form a dark box, and the light emitted by the light source 50 only illuminates the photosensitive area of ​​the chip 30, reducing light leakage.

[0089] For example, the support frame 40 has a groove 42 at its port facing the substrate 20, and the substrate 20 is fixed within the groove 42 and fixedly connected to the support frame 40. The light source component 50 includes a frame 51, which is inserted into the support frame 40 and fixedly connected to the support frame 40. For example, the substrate 20 can be sealed to the support frame 40. For example, the frame 51 can be sealed to the support frame 40.

[0090] In some embodiments, when the pressure plate 10 mates with the substrate 20, the edge of the pressure plate 10 is sealed to the edge of the substrate 20 to reduce light leakage. This also facilitates improved heat preservation of the chip 30 during three-temperature testing.

[0091] This disclosure also provides a testing machine, which includes a testing machine body and a substrate 20 embedded in the testing machine body.

[0092] The substrate 20 includes a chip placement area 222 for supporting the chip 30, and the chip placement area 222 includes a light-transmitting area 223 corresponding to the photosensitive area of ​​the chip 30. The substrate 20 also includes a clearance area 221 for avoiding the second pin assembly 122 of the pressure plate 10. The structures of the substrate 20 and the pressure plate 10 described above can be found in the description of the substrate 20 and the pressure plate 10 in the clamping assembly described above, and will not be described in detail here. The connection can be achieved by directly fixing the substrate to the test machine body without requiring major modifications to the test machine body.

[0093] In some embodiments, the chip placement area 222 is provided with a first receiving groove for accommodating the chip 30; the light-transmitting area 223 is provided with a light-transmitting hole; the light-transmitting hole communicates with the first receiving groove. For details, please refer to the description of the substrate 20 in the clamping assembly above, which will not be elaborated here.

[0094] In some embodiments, the substrate 20 includes a first substrate 21 and a second substrate 22, the second substrate 22 being nested with the first substrate 21, and the second substrate 22 including a chip placement area 222. For details, please refer to the description of the substrate 20 in the above-described clamping assembly; further details will not be elaborated here.

[0095] In some embodiments, the first substrate 21 includes a second receiving groove 211 and a through hole 212; the second substrate 22 is disposed within the second receiving groove 211, and the second pin assembly 122 is correspondingly disposed with respect to the through hole 212, so that the second pin assembly 122 is exposed through the through hole 212; the light-transmitting area 223 is correspondingly disposed with respect to the through hole 212, so that an optical path channel is realized through the second receiving groove 211. For details, please refer to the description of the substrate 20 in the above clamping assembly, which will not be elaborated here.

[0096] In some embodiments, the testing machine further includes an adapter circuit board, which is electrically connected to the circuit board 11 and is located on the side of the substrate 20 facing the testing machine body; wherein the adapter circuit board is used for conductive connection with the second pin assembly 122. For details, please refer to the description of the substrate 20 in the above clamping assembly, which will not be described in detail here.

[0097] In some embodiments, the testing machine further includes a light source 50, which is disposed on the side of the substrate 20 away from the pressure plate 10 and faces the light-transmitting area 223. For details, please refer to the description of the substrate 20 in the above clamping assembly; further details will not be elaborated here.

[0098] In addition to the structure exemplified above, the substrate 20 included in the testing machine provided in this embodiment may also include other structures of the substrate 20 exemplified in the clamping assembly, which will not be described in detail here.

[0099] This disclosure also provides an actuator, which includes an actuator body and a pressure plate 10 detachably and fixedly connected to the actuator body. The pressure plate 10 is configured to cooperate with a substrate 20 to position a chip 30. The pressure plate 10 includes a first pin assembly 121 and a second pin assembly 122. The first pin assembly 121 is configured to electrically connect to the pins of the chip 30, and the second pin assembly 122 includes adapter pins. The structure of the pressure plate 10 in the clamping assembly can be referenced. The pressure plate 10 is detachably and fixedly connected to the actuator. Specifically, the actuator has a connection structure, and the pressure plate 10 can be directly and fixedly connected to the actuator through the connection structure without requiring modification of the actuator.

[0100] For example, the actuator may include a robotic arm or a manual operating tool. When using a robotic arm, the pressure provided by the robotic arm can press the pressure plate 10 onto the substrate 20 to ensure that the chip 30 is electrically connected to the first pin assembly 121, and the first pin assembly 121 is electrically connected to the circuit board 11. When using a manual operating tool, the clamping force between the tool and the substrate 20 can provide the force required for the aforementioned conductive connection.

[0101] In some embodiments, the first pin assembly 121 and the second pin assembly 122 are arranged in a stepped manner, and the height of the second pin assembly 122 is greater than the height of the first pin assembly 121. For details, please refer to the description of the pressure plate 10 in the clamping assembly above, which will not be elaborated here.

[0102] In some embodiments, the pressure plate 10 includes a circuit board 11 and a pin plate 12; the circuit board 11 and the pin plate 12 are stacked; the circuit board 11 includes a connection circuit; the pin plate 12 includes a first pin assembly 121 and a second pin assembly 122; the first pin assembly 121 and the second pin assembly 122 are electrically connected through the connection circuit. For details, please refer to the description of the pressure plate 10 in the above clamping assembly section, which will not be elaborated further here.

[0103] In the above embodiments, the descriptions of each embodiment have their own emphasis. Parts not described in detail or in a particular embodiment are provided for reference in the relevant descriptions of other embodiments. Furthermore, the above embodiments are all intended to be freely combined as needed, and as long as the combination of these technical features does not contradict each other, it should be considered within the scope of this specification.

[0104] Finally, it should be noted that the above embodiments are merely specific implementations of this disclosure, used to illustrate the technical solutions of this disclosure, and not to limit it. The protection scope of this disclosure is not limited thereto. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art, within the scope of the technology disclosed in this disclosure, can still modify the technical solutions described in the foregoing embodiments or easily conceive of changes, or make equivalent substitutions for some of the technical features; and these modifications, changes, or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this disclosure. All should be covered within the protection scope of this disclosure. Therefore, the protection scope of this disclosure should be determined by the protection scope of the claims.

Claims

1. A clamping assembly for clamping a chip; the clamping assembly comprising: A substrate, the substrate including a chip placement area for carrying the chip; the chip placement area including a light-transmitting area corresponding to the photosensitive area of ​​the chip; A pressure plate, disposed on one side of the substrate, is configured to cooperate with the substrate to position the chip; the pressure plate includes a first pin assembly and a second pin assembly; the first pin assembly and the second pin assembly are electrically connected, and the first pin assembly is configured to be electrically connected to the pins of the chip; the second pin assembly includes adapter pins; The substrate further includes a clearance area for avoiding the second pin assembly.

2. The clamp assembly of claim 1, wherein, The avoidance area is arranged at an interval from the chip placement area.

3. The clamp assembly of claim 2, wherein, The chip placement area is provided with a first receiving groove for accommodating the chip, and the light-transmitting area is provided with a light-transmitting hole; The light-transmitting hole is connected to the first receiving groove.

4. The clamp assembly of claim 2, wherein, The first pin assembly and the second pin assembly are arranged in a stepped manner, and the height of the second pin assembly is greater than the height of the first pin assembly.

5. The clamp assembly of claim 1, wherein, The pressure plate includes a circuit board and a pin plate; the circuit board and the pin plate are stacked together. The circuit board includes a connection circuit; the pin board includes a first pin assembly and a second pin assembly; The first pin assembly and the second pin assembly are electrically connected through the connection circuit.

6. The clamping assembly according to claim 1, characterized in that, The substrate includes a first substrate and a second substrate, the second substrate being nested with the first substrate; the second substrate includes the chip placement area.

7. The clamping assembly according to claim 6, characterized in that, The first substrate includes a second receiving groove and a through hole; the second substrate is disposed in the second receiving groove, and the second pin assembly is correspondingly disposed with respect to the through hole so as to expose the second pin assembly through the through hole; the light-transmitting area is correspondingly disposed with respect to the through hole so as to realize an optical path channel through the through hole.

8. The clamping assembly according to any one of claims 1-7, characterized in that, Also includes: An adapter circuit board is located on the side of the substrate away from the pressure plate, and the adapter circuit board is electrically connected to the second pin assembly.

9. The clamping assembly according to any one of claims 1-7, characterized in that, Also includes: A light source element, wherein the light source element is disposed on the side of the substrate opposite to the pressure plate; The light-emitting end of the light source is oriented towards the light-transmitting area.

10. A testing machine, characterized in that, Includes the test machine body and the substrate embedded in the test machine body; The substrate includes a chip placement area for carrying a chip; the chip placement area includes a light-transmitting area corresponding to the photosensitive area of ​​the chip; the substrate also includes a clearance area for avoiding the second pin assembly of the pressure plate. The substrate is configured to cooperate with the pressure plate to position the chip; the pressure plate includes a first pin assembly and a second pin assembly; the first pin assembly and the second pin assembly are electrically connected, and the first pin assembly is configured to be electrically connected to the pins of the chip; the second pin assembly includes adapter pins.

11. The testing machine according to claim 10, characterized in that, The chip placement area is provided with a first receiving groove for accommodating the chip; the light-transmitting area is provided with a light-transmitting hole; the light-transmitting hole is connected to the first receiving groove.

12. The testing machine according to claim 10, characterized in that, The substrate includes a first substrate and a second substrate, the second substrate being nested with the first substrate; the second substrate includes the chip placement area.

13. The testing machine according to claim 12, characterized in that, The first substrate includes a second receiving groove and a through hole; the second substrate is disposed in the second receiving groove, and the second pin assembly is correspondingly disposed with respect to the through hole so as to expose the second pin assembly through the through hole; the light-transmitting area is correspondingly disposed with respect to the through hole so as to realize an optical path channel through the through hole.

14. The testing machine according to any one of claims 10 to 13, characterized in that, Also includes: An adapter circuit board is electrically connected to the circuit board of the test machine body, and the adapter circuit board is located on the side of the substrate facing the test machine body; The adapter circuit board is used for conductive connection with the second pin assembly.

15. The testing machine according to any one of claims 10 to 13, characterized in that, Also includes: A light source is disposed on the side of the substrate away from the pressure plate, and the light source faces the light-transmitting area.

16. An actuator, characterized in that, Includes an execution body and a pressure plate that is detachably and fixedly connected to the execution body; The pressure plate is configured to cooperate with the substrate to position the chip; the pressure plate includes a first pin assembly and a second pin assembly; the first pin assembly and the second pin assembly are electrically connected, the first pin assembly is configured to be electrically connected to the pins of the chip, and the second pin assembly includes adapter pins; The first pin assembly and the second pin assembly are arranged in a stepped manner, and the height of the second pin assembly is greater than the height of the first pin assembly.

17. The actuator according to claim 16, characterized in that, The pressure plate includes a circuit board and a pin plate; the circuit board and the pin plate are stacked together. The circuit board includes a connection circuit; the pin board includes a first pin assembly and a second pin assembly; The first pin assembly and the second pin assembly are electrically connected through the connection circuit.

18. The actuator according to claim 16 or 17, characterized in that, The executing entity includes a robotic arm.

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