Switch

Abstract

The invention discloses a switch, and relates to the technical field of switches, the switch comprises an upper shell and a lower shell arranged at the lower end of the upper shell, the upper shell and the lower shell are tightly connected to form an internal cavity, the upper shell is provided with a first heat dissipation assembly, and the lower shell is provided with a second heat dissipation assembly; a circuit board assembly is arranged in the internal cavity; a first heating device and a second heating device are arranged in the inner cavity, and the first heating device is electrically connected with the circuit board assembly and is thermally coupled with the first heat dissipation assembly; the second heating device is electrically connected with the circuit board assembly and thermally coupled with the second heat dissipation assembly, and heat dissipation is achieved through the second heat dissipation assembly. The first region and the second region are isolated from each other in the interior chamber by a physical space. The main heating source is arranged in the two cavities with physical isolation, and the independent heat dissipation paths integrally formed with the shell are configured for the two cavities respectively, so that partitioned heat dissipation is realized, and long-term temperature stability of the equipment under high load is ensured.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of switches, in particular to a switch. BACKGROUND

[0002] The switch generally comprises a mainboard and a shell. When the switch transmits electrical signals, especially when a large number of network nodes are connected, a large amount of heat will be generated on the mainboard. The existing switch generally has a heat dissipation hole on one side of the shell and an air supply fan installed on the other side to achieve heat dissipation. When there are a large number of network nodes, multiple switches are often used. In order to reduce the occupied area, a rack is needed to support each switch.

[0003] In outdoor scenarios such as rail transit, smart lamp poles, port cranes, and energy storage microgrids, switches need to simultaneously carry gigabit ring networks, PoE++ power supply (≥90 W / port), and edge AI computing power. The total power consumption of the switch has increased from the traditional 50 W to 300 W~600 W. The existing switch needs to be cooled by a fan, but the service life of the fan is short, the failure rate is high, and it cannot meet the needs of being exposed to rain, salt spray, dust, and-40 ℃~+75 ℃ alternating environments for a long time.

[0004] Therefore, there is an urgent need for a switch device with high heat dissipation and high protection effect. SUMMARY

[0005] The main purpose of the present application is to provide a switch. To solve the problem of poor heat dissipation effect of the prior art under high power consumption.

[0006] To achieve the above purpose, the present application provides a switch, comprising: an upper shell, a lower shell arranged at the lower end of the upper shell, the upper shell and the lower shell being tightly connected and forming an internal chamber, the upper shell being provided with a first heat dissipation assembly, and the lower shell being provided with a second heat dissipation assembly; a circuit board assembly arranged in the internal chamber; a first heat generating device arranged in a first region of the internal chamber and electrically connected to the circuit board assembly, the first heat generating device being arranged in the first region and being thermally coupled to the first heat dissipation assembly to dissipate heat through the first heat dissipation assembly; a second heat generating device arranged in a second region of the internal chamber and electrically connected to the circuit board assembly, the second heat generating device being thermally coupled to the second heat dissipation assembly to dissipate heat through the second heat dissipation assembly; The first region and the second region are isolated from each other by a physical interval in the internal chamber.

[0007] In one embodiment, the first heat generating device is a heat generating chip, the heat generating chip is arranged on a heat generating assembly and is in thermal coupling with the first heat dissipation assembly, the heat generating assembly is connected with the circuit board assembly, and the heat generating assembly is arranged in the first area; The second heat generating device is a power supply assembly, the power supply assembly is arranged in the second area, a heat generating part of the power supply assembly is in thermal coupling with the second heat dissipation assembly, and the power supply assembly is electrically connected with the circuit board assembly.

[0008] In one embodiment, the first area further comprises a third area for accommodating the circuit board assembly, the first heat dissipation assembly is arranged on one side of the third area, one side of the first heat dissipation assembly is in contact with the third area, and the lower end of the first heat dissipation assembly corresponds to the heat generating chip in the first area, so that the first heat dissipation assembly simultaneously dissipates heat for the third area on the side and the heat generating chip at the lower end.

[0009] In one embodiment, a flexible waterproof pad is further arranged between the upper shell and the lower shell, a sealing groove is formed in the bottom of the upper shell, and the upper shell is in interference fit with the flexible waterproof pad through the sealing groove, so as to seal and prevent water.

[0010] In one embodiment, a first fixing groove is further arranged in the bottom of the upper shell, a second fixing groove is arranged in the lower shell corresponding to the first fixing groove, and a third fixing groove is arranged in the flexible waterproof pad corresponding to the first fixing groove, so that the fixing bolts are sequentially arranged through the first, second and third fixing grooves to realize close fixing.

[0011] In one embodiment, the flexible waterproof pad comprises a flat pad and a convex pad, the convex pad is a convex part of the flat pad, the flat pad corresponds to the bottom of the upper shell, the convex pad corresponds to the sealing groove, and the flexible waterproof pad is in interference fit with the sealing groove through the convex pad.

[0012] In one embodiment, the upper shell and the first heat dissipation assembly are in one-piece structure, and the lower shell and the second heat dissipation assembly are in one-piece structure.

[0013] In one embodiment, the external interface connector on the circuit board assembly is a waterproof connector.

[0014] In one embodiment, a uniform temperature plate is further arranged in the spacing layer between the first heat generating device and the second heat generating device.

[0015] In one embodiment, a plurality of supporting columns are arranged between the first heat generating device and the second heat generating device, the supporting columns are used for supporting and forming physical spacing.

[0016] In one embodiment, the first heat dissipation assembly and the second heat dissipation assembly are heat dissipation fin groups.

[0017] The beneficial effects of the present application are: 1. By placing the main heat source in two chambers with physical isolation, and configuring independent heat dissipation paths integrated with the shell for each chamber, precise partitioned heat dissipation is achieved, ensuring long-term temperature stability of the device under high load.

[0018] 2. The shell joint uses an interference fit of a flexible waterproof pad and a sealing groove, and is precisely compressed by a fixed groove and a bolt, forming a high-level seal that is repeatedly detachable and has durable performance, solving the maintenance problems of permanent bonding solutions.

[0019] 3. The integrated shell setting effectively reduces the gap between structures, facilitating efficient protection of the switch when working in the external environment. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or prior art description. Obviously, the drawings described below are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative labor based on the structures shown in these drawings.

[0021] Figure 1 The overall structure of the switch provided by the present application is shown in the figure; Figure 2 The exploded structure of an embodiment of the switch provided by the present application is shown in the figure; Figure 3 The exploded structure of another embodiment of the switch provided by the present application is shown in the figure; Figure 4 The cross-sectional view of the switch provided by the present application is shown in the figure; Figure 5 The Figure 4 The enlarged state diagram of part A is shown in the figure; Figure 6 The cross-sectional view of another embodiment of the switch provided by the present application is shown in the figure.

[0022] Explanation of reference numerals: 100, upper shell; 101, first heat dissipation assembly; 102, sealing groove; 103, first fixed groove; 200, lower shell; 201, second heat dissipation assembly; 202, second fixed groove; 203, fixed bolt; 300, heat generating assembly; 301, heat generating chip; 302, support column; 400, power supply assembly; 500, circuit board assembly; 600, flexible waterproof pad; 601, flat pad; 602, convex pad; 603, third fixed groove; 700, first area; 702, third area; 800, second area.

[0023] The objectives, functional characteristics and advantages of the present application will be further described with reference to the embodiments in combination with the accompanying drawings. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present application will be clearly and completely described in combination with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0025] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement condition, etc. between components in a certain posture, and if the certain posture changes, the directional indications also change accordingly.

[0026] In addition, if the embodiments of the present application involve descriptions of “first”, “second”, etc., the descriptions of “first”, “second”, etc. are only for description purposes, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by “first” and “second” can explicitly or implicitly include at least one of the features. In addition, “and / or” or “and / or” appearing throughout the text means that the three parallel solutions are included, for example, “A and / or B” includes A solution, or B solution, or A and B solutions are satisfied at the same time. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the fact that a person of ordinary skill in the art can realize it, and when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, and is not within the protection scope of the present application.

[0027] The present application provides a switch.

[0028] Please refer to Figure 1 and Figure 2 In an embodiment of the present application, the switch of the present application comprises: an upper shell 100 and a lower shell 200, the lower shell 200 is arranged at the lower end of the upper shell 100 and is tightly connected, for preventing external sand and rain from entering; the upper shell 100 and the lower shell 200 jointly enclose a closed internal chamber for accommodating all electronic components. In the present application, the tight connection between the upper shell 100 and the lower shell 200 includes bolt fixing, full glue fixing, buckle fixing, etc.

[0029] The upper shell 100 is provided with a first heat dissipation assembly 101. The first heat dissipation assembly 101 can be an array of heat dissipation fins formed on the inner side or the outer side of the upper shell 100, or a heat pipe heat spreader system. Similarly, the lower shell 200 is provided with a second heat dissipation assembly 201, which can be the same as or different from the first heat dissipation assembly 101. Alternatively, the lower shell 200 uses a metal casting body itself as a heat dissipation substrate. The internal chamber formed by the upper shell 100 and the lower shell 200 is provided with a circuit board assembly 500. The circuit board assembly 500 integrates the main functional circuits of the switch.

[0030] In this application, the internal chamber is divided into a first region 700 and a second region 800. In the first region 700 of the internal chamber, a first heat generating device is provided. The first heat generating device is usually the core chip with the highest heat dissipation density and temperature sensitivity in the switch; alternatively, the first heat generating device is a core switching chip or a main processor. The first heat generating device is electrically connected to the circuit board assembly 500 through a plug-in connector to realize signal and power supply. The first heat generating device establishes a close thermal coupling relationship with the first heat dissipation assembly 101 of the upper shell 100, and most of the heat generated by the operation is directly dissipated to the external air through the heat conduction path via the first heat dissipation assembly 101.

[0031] In the second region 800 of the internal chamber, a second heat generating device is provided. Alternatively, the second heat generating device is a power supply voltage stabilizing module element. It is also electrically connected to the circuit board assembly 500 and establishes a thermal coupling relationship with the second heat dissipation assembly 201 of the lower shell 200 to form an independent downward heat dissipation path. It should be noted that the second heat dissipation assembly 201 in the lower shell 200 is independent, and the size of the heat dissipation fins can be adjusted flexibly according to the power of the elements of the power supply assembly 400, and the heat dissipation assembly can be replaced conveniently and quickly, reducing the difficulty of re-development.

[0032] The first region 700 and the second region 800 are isolated from each other in the internal chamber by a physical separation. In this application, the physical separation can be a heat insulation barrier integrally formed on the inner wall of the upper shell 100, or a separate partition member fixed to the circuit board assembly 500 or the shell. The physical separation can effectively block the heat exchange between the two regions through air convection, so that the hot air generated by the first heat generating device and the hot air generated by the second heat generating device are difficult to diffuse into each other.

[0033] In this application, the external interface connector on the circuit board assembly 500 is a waterproof connector. Alternatively, the waterproof interface connector is a standard M12 circular waterproof connector. Through the locking mechanism and the device shell, and using the radial sealing ring of the interface end to realize the waterproof sealing with the mating plug, the external network interface of the device reaches the IP68 and above protection level, and adapts to the harsh environment of industrial field.

[0034] When the switch is working, the first heat-generating device and the second heat-generating device each generate heat. The heat of the first heat-generating device is conducted upward and is efficiently dissipated by the first heat-dissipating assembly 101 of the upper shell 100; the heat of the second heat-generating device is conducted downward and is carried away by the second heat-dissipating assembly 201 of the lower shell 200. Due to the existence of the physical interval, the two heat-dissipating areas independently dissipate heat, reducing the baking effect of the primary heat source on the secondary heat source. The high-power switch working heat can be effectively dissipated without worrying about the influence of the overheated air on other components; the elements in the second area 800 can work in a relatively independent and stable low-temperature environment, the reliability and service life are guaranteed, and the long-term operation stability of the switch in a high-temperature environment is improved.

[0035] Referring to Figure 6 In an embodiment, the power of the elements of the power assembly 400 is increased, and the height of the second heat-dissipating assembly 201 is also increased; alternatively, the power of the elements of the power assembly 400 is increased by 18-22 W, and the height of the second heat-dissipating assembly 201 is correspondingly increased by one time.

[0036] In an embodiment, the first heat-dissipating assembly 101 and the second heat-dissipating assembly 201 are arranged as arrayed heat-dissipating fins, and the gap between adjacent heat-dissipating fins is ≥4 mm. Alternatively, in the embodiment, the gap between two adjacent heat-dissipating fins is 4 mm. The gap of 4 mm provides a wide enough channel for air flow. Compared with the 2 mm gap of the more dense fins, it can greatly reduce the air flow resistance. And since the hot air flows from bottom to top, the first heat-dissipating assembly 101 and the second heat-dissipating assembly 201 are consistent with the air flow direction during equipment installation, which accelerates the contact efficiency with the external air, thereby achieving more efficient heat dissipation.

[0037] In an embodiment, the first heat-generating device arranged in the first area 700 is a heat-generating chip 301. The heat-generating chip 301 is usually the core logic chip of the switch, including one of an Ethernet switch chip, a central processing unit or a network processor. Such a chip has extremely high computing density and will generate concentrated high heat flow when working.

[0038] The heat-generating chip 301 is installed on the heat-generating assembly 300. The heat-generating assembly 300 can be selected as a PCB capable of carrying the heat-generating chip 301, and the heat-generating assembly 300 realizes electrical and mechanical connection with the circuit board assembly 500 through a connector, completing signal transmission and power supply. The heat-generating chip 301 and the first heat-dissipating assembly 101 establish close thermal coupling. So that when the switch is started, the heat-generating chip 301 starts to run and heat, and is efficiently dissipated upward by the first heat-dissipating assembly 101.

[0039] The second heat-generating device disposed in the second region 800 is the power supply assembly 400. The power supply assembly 400 is responsible for providing stable and reliable direct current power supply for the entire switch. The power supply assembly 400 is a relatively independent module, and its circuit is arranged on an independent PCB and is integrally installed in the second region 800. The power supply assembly 400 is electrically connected with the circuit board assembly 500 through a cable or a connector to supply power for the circuit board assembly 500. In operation, the internal power elements of the power supply assembly 400 generate significant heat. These heat-generating parts are in direct or indirect contact with the inner surface of the lower shell 200. Since the power supply assembly 400 is disposed in a position corresponding to the first heat dissipation assembly 101 and is thermally coupled with the first heat dissipation assembly 101, the heat is conducted to the second heat dissipation assembly 201 of the lower shell 200, and is efficiently dissipated downward through the second heat dissipation assembly 201.

[0040] The heat-generating assembly 300 and the first region 700 where the heat-generating assembly 300 is located are physically separated from the power supply assembly 400 and the second region 800 where the power supply assembly 400 is located. Therefore, the heat-generating chip 301 is not disturbed by the temperature generated by the power supply assembly 400 in operation. By explicitly physically separating the heat-generating chip 301 from the power supply assembly 400 with large power consumption and by separately arranging the heat dissipation paths, the core chip operates in a more optimal temperature environment, has more stable performance, and has a longer service life. The power supply assembly 400 is independently cooled, and the heat accumulation of the power supply assembly 400 does not affect itself and other elements.

[0041] In an embodiment, the first region 700 includes a third region 702, and the third region 702 is mainly used for accommodating and supporting the circuit board assembly 500. The lower end of the first heat dissipation assembly 101 is in close thermal coupling with the heat-generating chip 301 and is responsible for receiving the main heat flow generated by the chip. The side surface of the first heat dissipation assembly 101 is parallel to the plane where the circuit board assembly 500 is located, and the heat in the third region 702 is conducted through the side surface of the first heat dissipation assembly 101. This can effectively increase the contact area of the first heat dissipation assembly 101 with the heat in the first region 700 and realize heat transfer with the external air.

[0042] Referring to Figure 2 and Figure 3In an embodiment, a continuous sealing groove 102 is arranged on the bottom of the upper shell 100, that is, on the end face that is in abutment with the lower shell 200. Optionally, the cross section of the sealing groove 102 includes at least one of a rectangle, a trapezoid, or a semicircle, and the profile of the sealing groove 102 is strictly along the predetermined joint surface profile of the upper shell 100 and the lower shell 200 to form a closed loop. In this embodiment, a flexible waterproof pad 600 is further arranged between the upper shell 100 and the lower shell 200. The material of the flexible waterproof pad 600 has good elasticity, small permanent deformation, high and low temperature resistance, and aging resistance. The shape of the flexible waterproof pad 600 completely matches the profile of the sealing groove 102 to form a closed loop, and the cross-sectional dimension of the flexible waterproof pad 600 in a free state is slightly larger than the width or depth of the sealing groove 102. Thus, an interference fit is formed between the sealing groove 102 of the upper shell 100 and the flexible waterproof pad 600 for sealing and waterproofing.

[0043] Optionally, the flexible waterproof pad 600 is preferably made of silicone material. The silicone material has a wide working temperature range, excellent weather resistance, and low compression permanent deformation characteristics, and can adapt to the working temperature rise inside the switch and the external environmental changes to ensure that the sealing pressure at the joint of the shell is persistent and stable throughout the life cycle of the equipment, thereby achieving high-level reliable dustproof and waterproof. By using the flexible waterproof pad 600 made of silicone material and the interference fit with the sealing groove 102 of the upper shell 100, not only is physical sealing achieved, but also the sealing structure has long-term reliability due to the excellent elastic recovery force and environmental aging resistance of the silicone material, which is particularly suitable for industrial and outdoor application scenarios with strict protection requirements.

[0044] Referring to Figure 2 and Figure 3 Further, on the bottom of the upper shell 100, in addition to the sealing groove 102, a first fixing groove 103 is also arranged at a specific position on the periphery or inside of the sealing groove 102. The upper part of the first fixing groove 103 has a larger aperture for cooperating with the fixing bolt 203 for fastening connection. The second fixing groove 202 is arranged at a position corresponding to the first fixing groove 103 of the lower shell 200 and the upper shell 100, and is used for forming fastening connection with the fixing bolt 203. The third fixing groove 603 is arranged on the flexible waterproof pad 600 at a position corresponding to the first fixing groove 103 and the second fixing groove 202, and is used for forming fastening connection with the fixing screw. During installation, the flexible waterproof pad 600 is first fixed by interference fit with the sealing groove 102 of the upper shell 100, the first, second, and third fixing grooves 603 of the upper shell 100, the flexible waterproof pad 600, and the lower shell 200 are correspondingly arranged, the fixing bolt 203 is sequentially inserted through the third fixing groove 603, the second fixing groove 202, the first fixing groove 103, and is threadedly fixed with the first fixing groove 103, so that the upper shell 100, the flexible waterproof pad 600, and the lower shell 200 are tightly connected and fixed, and the internal devices are efficiently protected to cope with outdoor scenarios.

[0045] Referring to 4 and Figure 5 Further, the flexible waterproof pad 600 includes a flat pad 601 and a convex pad 602. The flat pad 601 is the main base part of the waterproof pad, with uniform thickness and large planar area. The upper surface of the flat pad 601 corresponds to and is attached to the bottom plane of the upper shell 100 to provide an auxiliary end face seal and increase the contact area of the entire pad with the shell after assembly, thereby improving stability. The convex pad 602 is a continuous or discontinuous raised structure formed upward from the upper surface of the flat pad 601. The cross-sectional shape of the convex pad 602 can be semicircular, trapezoidal, or rectangular. The profile, height, and width of the convex pad 602 correspond to the size of the sealing groove 102 at the bottom of the upper shell 100.

[0046] During installation, the flexible waterproof pad 600 is placed on the bottom of the upper shell 100, at which time the upper surface of the flat pad 601 is in contact with the bottom plane of the upper shell 100, and the convex pad 602 is aligned and embedded in the sealing groove 102 of the upper shell 100. In the free state, the top height of the convex pad 602 is greater than the depth of the sealing groove 102, and the width of the connection part of the convex pad 602 and the flat pad 601 is also slightly greater than or equal to the slot width of the sealing groove 102, thereby forming a predetermined interference in height and width. When the lower shell 200 is fastened to the upper shell 100 by bolts, the sealing surface of the lower shell 200 exerts downward pressure on the entire flexible waterproof pad 600. Due to the interference of the convex pad 602, it is compressed. The pressure forces the material of the convex pad 602 to undergo significant elastic deformation, and the material flows outward, thereby tightly filling the entire cavity of the sealing groove 102, including the groove bottom, groove sidewall, and gap between the groove opening and the sealing surface of the lower shell 200. At the same time, the flat pad 601 is also compressed. Since the upper shell 100 and the lower shell 200 are usually metal structures, the flexible waterproof pad 600 is arranged between the upper shell 100 and the lower shell 200, thereby forming a stable auxiliary sealing surface to achieve IP68 level waterproof effect.

[0047] The sealing method of the upper shell 100 and the lower shell 200 is arranged to be sealed by the flexible waterproof pad 600, and the flexible waterproof pad 600 is fastened and connected by fastening bolts, thereby realizing a seal that can be repeatedly opened and restored to facilitate later disassembly and maintenance. By arranging silicone material as the waterproof pad, the long-term stability and predictability of the sealing performance are ensured, and the risk of aging of chemical adhesives is avoided. Therefore, it is suitable for high-end network communication equipment that needs to operate stably for a long time and may be maintained on site.

[0048] In one embodiment, the upper shell 100 is integrally formed with the first heat dissipation assembly 101, and the lower shell 200 is integrally formed with the second heat dissipation assembly 201. Optionally, the upper shell 100 is a die-cast aluminum shell. All features of the upper shell 100, such as the outer wall, the inner wall, and the heat dissipation fins as the first heat dissipation assembly 101, are integrally formed. The relationship between the lower shell 200 and the second heat dissipation assembly 201 is consistent with that between the upper shell 100 and the first heat dissipation assembly 101. The integrally formed shell arrangement effectively reduces the gap between the structures to facilitate the protection of the switch when it is in operation in the external environment.

[0049] Referring to Figure 2 and Figure 4 In one embodiment, a plurality of support columns 302 are used to form the physical spacing. Optionally, the support columns 302 are cylindrical or square solid or hollow metal columns arranged between the first heat generating device and the second heat generating device, and the circuit boards of the first heat generating device and the second heat generating device are supported and physically connected by the plurality of support columns 302. In this application, the circuit boards of the first heat generating device and the second heat generating device are in abutment with the inner wall of the upper shell 100 and are mutually adapted in size, the support columns 302 are circular columns with a certain length, and are respectively fixed at the corners of the circuit boards of the first heat generating device and the second heat generating device, thereby forming the physical spacing. The heat generating parts of the first heat generating device are directed to the top of the upper shell 100, and the heat generating parts of the second heat generating device are directed to the bottom of the lower shell 200, so it is difficult for the heat to be conducted between the areas of the first heat generating device and the second heat generating device. The heat of the device is dissipated by the first and second heat dissipation assemblies 201 respectively, so that the device can effectively dissipate heat under high power conditions.

[0050] In summary, the switch of the present application integrates the load-bearing structure and the heat dissipation fins into one by using the integrally die-cast aluminum upper shell 100 and the lower shell 200, thereby realizing an efficient heat dissipation path with high thermal resistance. The plurality of support columns 302 form physical spacing and mechanical support between the first and second heat generating devices, effectively isolating the mutual interference between the main heat sources. At the joint of the shell, the interference fit of the flexible waterproof pad 600 and the sealing groove 102, and the tight fixation between the fixing bolt 203 and the fixing groove, realize reliable sealing with high protection effect and repeatable maintenance. At the same time, the standardized external waterproof connector ensures the environmental tolerance of the data port. The switch has reliability in terms of heat dissipation performance, environmental protection, and long-term maintainability, and is particularly suitable for communication network scenarios with high power consumption and strict environmental adaptability requirements.

[0051] In one embodiment, a piece of vapor chamber is added in the physical spacing area between the heat generating component 300 and the power supply component 400. The vapor chamber is substantially plate-shaped and horizontally arranged in the middle of the chamber. The vapor chamber is used for auxiliary heat transfer in the internal area. When the instantaneous power consumption of a heat source suddenly increases and the temperature rises sharply, the heat will be transferred to the other side of the vapor chamber through the vapor chamber, and will be dissipated by another heat dissipation path. The two heat sources establish mutual heat dissipation channels, effectively cope with the instantaneous high heat load, and prevent the chip from being damaged or frequency reduced due to local overheating.

[0052] In one embodiment, in order to meet the application requirements of one-time sealing, extremely high protection level or strong chemical corrosion environment, no independent flexible waterproof pad 600 is arranged between the upper shell 100 and the lower shell 200. The difference between the above embodiment is that, at the joint surface of the upper shell 100 and the lower shell 200, an adhesive such as epoxy resin, silicone or polyurethane sealant is coated, and the adhesive is filled in the gap of the joint surface and solidified to realize permanent and tight connection and sealing between the two. This scheme can provide a continuous and dead angle-free sealing layer, and simplify the shell structure. Through full gluing sealing, it is particularly suitable for deployment scenarios that are expected to be maintenance-free and face extreme humid, salt spray or chemical corrosion environment.

[0053] The above description is only an exemplary embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structural transformation made according to the technical concept of the present application, or direct / indirect application in other related technical fields, is included in the patent protection scope of the present application.

Claims

1. A switch, characterized in that, include: Upper shell (100); The lower shell (200) is disposed at the lower end of the upper shell (100). The upper shell (100) and the lower shell (200) are tightly connected to form an internal cavity. A first heat dissipation assembly (101) is disposed on the upper shell (100), and a second heat dissipation assembly (201) is disposed on the lower shell (200). A circuit board assembly (500) is disposed within the internal cavity; A first heating device is disposed in a first region (700) of the internal cavity and electrically connected to the circuit board assembly (500). The first heating device is disposed in the first region (700) and is thermally coupled to a first heat dissipation assembly (101) to dissipate heat through the first heat dissipation assembly (101). The second heating device is disposed in the second region (800) of the internal cavity and electrically connected to the circuit board assembly (500). The second heating device is thermally coupled to the second heat dissipation assembly (201) and dissipates heat through the second heat dissipation assembly (201). The first region (700) and the second region (800) are physically separated from each other in the internal chamber.

2. The switch as described in claim 1, characterized in that, The first heating device is a heating chip (301), which is disposed on the heating component (300) and thermally coupled to the first heat dissipation component (101). The heating component (300) is connected to the circuit board assembly (500) and is disposed in the first region (700). The second heating device is a power supply assembly (400), which is disposed in the second region (800). The heating part of the power supply assembly (400) is thermally coupled to the second heat dissipation assembly (201), and the power supply assembly (400) is electrically connected to the circuit board assembly (500).

3. The switch as described in claim 2, characterized in that, The first region (700) also includes a third region (702), which is used to accommodate the circuit board assembly (500). The first heat dissipation component (101) is disposed on one side of the third region (702). One side of the first heat dissipation component (101) is in contact with the third region (702). The lower end of the first heat dissipation component (101) corresponds to the heat-generating chip (301) of the first region (700). The first heat dissipation component (101) is used to dissipate heat from the third region (702) on the side and the heat-generating chip (301) at the lower end at the same time.

4. The switch as described in any one of claims 1 to 3, characterized in that, A flexible waterproof pad (600) is also provided between the upper shell (100) and the lower shell (200). A sealing groove (102) is provided at the bottom of the upper shell (100). The upper shell (100) is press-fitted with the flexible waterproof pad (600) through the sealing groove (102) for sealing and waterproofing.

5. The switch as described in claim 4, characterized in that, The bottom of the upper shell (100) is provided with a first fixing groove (103), the lower shell (200) is provided with a second fixing groove (202) corresponding to the fixing groove, and the flexible waterproof pad (600) is provided with a third fixing groove (603) corresponding to the first fixing groove (103). The fixing bolts (203) pass through the first, second and third fixing grooves (603) in sequence to achieve tight fixation.

6. The switch as described in claim 5, characterized in that, The flexible waterproof gasket (600) includes a flat gasket (601) and a raised gasket (602). The raised gasket (602) is the raised part of the flat gasket (601). The flat gasket (601) corresponds to the bottom of the upper shell (100). The raised gasket (602) corresponds to the sealing groove (102). The flexible waterproof gasket (600) is interference-fitted with the sealing groove (102) through the raised gasket (602).

7. The switch as described in claim 1, characterized in that, The upper shell (100) and the first heat dissipation component (101) are integrally formed, and the lower shell (200) and the second heat dissipation component (201) are integrally formed.

8. The switch as described in claim 1, characterized in that, A plurality of support columns (302) are provided between the first heating device and the second heating device, which provide support and form a physical gap.

9. The switch as described in claim 8, characterized in that, A heat spreader is also provided in the spacer layer between the first heating device and the second heating device.

10. The switch as described in claim 1, characterized in that, The first heat dissipation component (101) and the second heat dissipation component (201) are heat dissipation fin groups.

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