Display panel and manufacturing method thereof

Abstract

The invention discloses a display panel and a manufacturing method thereof, belongs to the technical field of display, and aims to at least solve the technical problem that black spots are easy to appear on a display panel in related technologies. The display panel comprises a substrate, at least one base and a plurality of partition structures, wherein the base and the partition structures are located on the substrate, and the base and the partition structures are located in a transition area of the display panel. The plurality of partition structures comprise at least one first partition structure, the first partition structure is supported on the corresponding base, and the orthographic projection of the base on the substrate is located in the range of the orthographic projection of the first partition structure on the substrate.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display panel and a manufacturing method thereof. BACKGROUND

[0002] With the development of display technology, in order to ensure the front shooting effect, an opening is usually formed in the opening area of the display panel, which causes the encapsulation reliability of the display panel to be affected by the side exposure of the organic light-emitting layer. Water vapor and oxygen are easy to penetrate through the organic light-emitting layer, affecting the reliability of the display panel.

[0003] In the related art, in order to improve the influence of water and oxygen penetration, a partition structure made of metal material is usually arranged in the transition area between the opening area and the display area of the display panel to partition the organic light-emitting layer. However, the electrode layer on the organic light-emitting layer in the display panel is continuously arranged in the display area and the transition area. Although the first electrode in the transition area is partitioned at the partition structure, the disconnected first electrode will be overlapped on the side surface of the partition structure, thereby causing the electrode layer to form a conductive path in the display area and the transition area, and further causing the display area of the display panel to easily appear black spots. SUMMARY

[0004] Embodiments of the present application provide a display panel and a manufacturing method thereof to at least improve the technical problem that the display panel easily appears black spots in the related art.

[0005] In order to achieve the above-mentioned purpose, according to a first aspect of the present application, a display panel is provided, the display panel has a display area, an opening area, and a transition area between the display area and the opening area, and the display panel comprises: a substrate; at least one pedestal arranged on the substrate and located in the transition area; and a plurality of partition structures arranged on the substrate and located in the transition area, the plurality of partition structures comprising at least one first partition structure, the first partition structure being supported on the corresponding pedestal, and the orthographic projection of the pedestal on the substrate being located in the range of the orthographic projection of the first partition structure on the substrate.

[0006] In some embodiments, a first width of a first surface of the pedestal away from the substrate is less than a second width of a second surface of the first partition structure close to the substrate.

[0007] In some embodiments, the first width is less than a third width of a third surface of the pedestal close to the substrate.

[0008] In some embodiments, the third width is equal to the second width.

[0009] In some embodiments, a projection of the first surface of the base on the substrate away from the substrate side overlaps with a projection of the second surface of the first partition structure on the substrate close to the substrate side.

[0010] In some embodiments, a first width of the first surface is greater than a third width of a third surface of the base close to the substrate side.

[0011] In some embodiments, a sidewall of the base is perpendicular to a surface of the substrate.

[0012] In some embodiments, the plurality of partition structures further comprises a plurality of second partition structures, the second partition structures are disposed apart from the base, and the first partition structure is located between two adjacent second partition structures.

[0013] In some embodiments, the partition structure comprises a first conductive layer and a second conductive layer stacked, the second conductive layer is located away from the substrate side of the first conductive layer, and a projection of the first conductive layer on the substrate is within a range of a projection of the second conductive layer on the substrate.

[0014] According to a second aspect of the present application, a manufacturing method of a display panel is provided, comprising: providing a substrate; forming at least one base and a plurality of partition structures on the substrate, the plurality of partition structures comprises at least one first partition structure, the first partition structure is supported on a corresponding base, and a projection of the base on the substrate is within a range of a projection of the first partition structure on the substrate.

[0015] In some embodiments, forming at least one base and a plurality of partition structures on the substrate comprises: forming at least one transition base on the substrate; forming the plurality of partition structures on a side of the transition base away from the substrate, the first partition structure is supported on a corresponding transition base; and etching the transition base to form the base.

[0016] In the display panel provided by the embodiments of the present application, since the orthographic projection of the pedestal on the substrate is located in the range of the orthographic projection of the first partition structure on the substrate, the sidewall of the pedestal will not exceed the edge of the first partition structure, so that the first electrode cannot continuously cover the sidewall of the pedestal and the first partition structure in the process of manufacturing the first electrode, thereby causing the first electrode to be disconnected at the partition assembly formed by the first partition structure and the pedestal. Compared with the longer conductive path formed by the first electrode and the partition structure in the related art, the first electrode in the present application can be effectively disconnected by the partition assembly formed by the first partition structure and the pedestal, so that the length of the conductive path is reduced, thereby improving the technical problem that the display panel in the related art is prone to black spots.

[0017] Other features and advantages of the present application will be described in detail in the following detailed description. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0019] Figure 1 is a top view of a display panel provided by some embodiments of the present application; Figure 2 is Figure 1 is a sectional view along the direction of E-E'; Figure 3 is Figure 1 is a sectional view along the direction of F-F'; Figure 4 is Figure 1 is another sectional view along the direction of F-F'; Figure 5 is Figure 1 is still another sectional view along the direction of F-F'; Figure 6 is Figure 1 is yet another sectional view along the direction of F-F'; Figure 7 is a flowchart of a manufacturing method of a display panel provided by some embodiments of the present application; Figures 8A-8B is a manufacturing step diagram of a display panel according to some embodiments of the present application; Figure 9 is a sectional view of a display device provided by some embodiments of the present application. DETAILED DESCRIPTION

[0020] The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application. The described technical solutions are only used to explain and describe the ideas of the present application, and should not be regarded as limiting the protection scope of the present application.

[0021] In the description of the present application, it should be understood that the terms "first", "second" and similar words do not represent any order, number or importance, but are only used to distinguish different technical features.

[0022] "A and / or B" includes the following three combinations: only A, only B, and the combination of A and B.

[0023] In the present application, the description of each embodiment has its own focus, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments. The embodiments, implementation manners, examples and related technical features of the present application can be combined, replaced with each other without conflict.

[0024] In the related art, a partition structure made of metal material is usually arranged in the transition area between the opening area and the display area to partition the organic light-emitting layer. However, the electrode layer on the organic light-emitting layer in the display panel is continuously arranged in the display area and the transition area, although the first electrode in the transition area will be partitioned at the partition structure, the disconnected first electrode will be overlapped on the side surface of the partition structure, thereby causing the electrode layer to form a conductive path in the display area and the transition area.

[0025] When the display panel is powered on, the second electrode in the display area has a low level, so that the first electrode and the partition structure are both low level, in this case, an electric field will be generated in the transition area. The light-emitting side of the display panel is generally attached with a polarizer, and the potassium ions in the polarizer will enter the encapsulation layer of the display panel under the action of the electric field, so that the inorganic encapsulation film in the encapsulation layer is corroded and expands, thereby causing the encapsulation layer to crack or separate the film layer, and further forming a water and oxygen intrusion channel. Water and oxygen enter the display area through the water and oxygen intrusion channel, causing the organic light-emitting layer in the display area to fail, thereby causing black spots in the display area. On the other hand, when the display panel is subjected to electrostatic discharge (ESD) test, since the first electrode and the partition structure are low level, the partition structure will attract positive electricity, so that the partition structure is damaged under the action of positive and negative electricity, thereby affecting the encapsulation layer, causing the encapsulation layer to crack or separate the film layer, forming a water and oxygen intrusion channel, and further causing black spots in the display area.

[0026] Based on this, some embodiments of the present application provide a display panel, a manufacturing method of the display panel, and a display device to at least improve the technical problem that the display panel is prone to black spots in the related art.

[0027] As shown in Figures 1-6 The display panel 100 has a display area AA, an opening area OA, and a transition area TA between the display area AA and the opening area OA.

[0028] The display panel 100 includes a substrate SUB, a plurality of partition structures 10, and at least one pedestal 21. The pedestal 21 is disposed on the substrate SUB and located in the transition area TA, the partition structure 10 is disposed on the substrate SUB and located in the transition area TA, the plurality of partition structures 10 includes at least one first partition structure 10A, the first partition structure 10A is supported on the corresponding pedestal 21, and the orthographic projection of the pedestal 21 on the substrate SUB is located within the orthographic projection of the first partition structure 10A on the substrate SUB.

[0029] For the display panel 100 provided by the embodiments of the present application, since the orthographic projection of the pedestal 21 on the substrate SUB is located within the orthographic projection of the first partition structure 10A on the substrate SUB, the sidewall of the pedestal 21 will not exceed the edge of the first partition structure 10A, so that in the process of manufacturing the first electrode 31, the first electrode 31 cannot continuously cover the sidewall of the pedestal 21 and the first partition structure 10A, thereby causing the first electrode 31 to be disconnected at the partition assembly formed by the first partition structure 10A and the pedestal 21. Compared with the longer conductive path formed by the first electrode and the partition structure in the related art, the first electrode 31 in the present application can be effectively partitioned by the partition assembly formed by the first partition structure 10A and the pedestal 21, so that the length of the conductive path is reduced, thereby improving the technical problem that the display panel is prone to black spots in the related art.

[0030] The display panel, the manufacturing method thereof, and the display device provided by the present application will be described in detail below through specific embodiments.

[0031] As shown in Figure 1 The display panel 100 provided by the embodiments of the present application has a display area AA, an opening area OA, and a transition area TA between the display area AA and the opening area OA. As an example, the transition area TA surrounds the opening area OA, and the display area AA surrounds at least part of the transition area TA. For example, the display area AA can be arranged around the transition area TA. The opening area OA is used to install light-sensitive elements such as cameras, fingerprint recognition sensors, etc.

[0032] It is worth noting that Figure 1The opening area OA shown is circular. This is merely an example. In practice, the opening area OA can also be oval, rectangular, drop-shaped, etc. The embodiments of the present application are not limited in this respect.

[0033] As shown in Figure 2 Figure 2 As shown in Figure 1 A cross-sectional structure along the direction of E-E' is shown. The display panel 100 includes a substrate SUB and a pixel definition layer PDL disposed on the substrate SUB. The pixel definition layer PDL defines a plurality of pixel openings in the display area AA. Each pixel opening is provided with a corresponding light emitting device K. Each light emitting device K includes a lower electrode K1, a light emitting material layer K2, and an upper electrode K3, which are sequentially stacked. The pixel opening exposes at least part of the lower electrode K1. The light emitting material layers K2 of different light emitting devices K are disconnected from each other. The upper electrode K3 can be continuously arranged to form the second electrode 32 in the display area AA. In this case, the part of the second electrode 32 located in the pixel opening serves as the upper electrode K3. In addition, the lower electrode K1 and the upper electrode K3 can serve as an anode and a cathode, respectively. By inputting corresponding voltages to the lower electrode K1 and the upper electrode K3, the corresponding light emitting material layer K2 can be driven to emit light.

[0034] In some examples, the display panel 100 further includes an encapsulation layer covering the light emitting device K. The encapsulation layer can include a first inorganic encapsulation film, an organic encapsulation film, and a second inorganic encapsulation film, which are sequentially stacked. In this way, the light emitting device K can be well encapsulated.

[0035] In some embodiments, please refer to Figure 2 , the display panel 100 further includes a pixel circuit layer CL, a transfer electrode layer 61, and a planarization layer PLN disposed in the display area AA and between the substrate SUB and the pixel definition layer PDL. The pixel circuit layer CL, the transfer electrode layer 61, and the planarization layer PLN are sequentially stacked in a direction away from the substrate SUB.

[0036] The pixel circuit layer CL includes a plurality of pixel circuits. Each pixel circuit is connected to a corresponding transfer electrode in the transfer electrode layer 61 and connected to the lower electrode K1 of the light emitting device K through the transfer electrode, so as to transmit a corresponding signal to the lower electrode K1. In addition, the planarization layer PLN covers the transfer electrode layer 61, so as to provide a flat surface for the arrangement of the lower electrode K1.

[0037] In some examples, the planarization layer PLN can be made of an organic polymer material. For example, the planarization layer PLN can include polyimide or acrylic resin, etc. In addition, the pixel definition layer PDL can include a positive photoresist material or polyimide, etc.

[0038] ​In some examples, the display panel 100 can further include support columns located within the display area AA, the support columns being disposed on the pixel definition layer PDL and outside the pixel openings. The support columns are used to support the fine metal mask, so as to use the fine metal mask to evaporate the light-emitting material layer K2.

[0039] As shown in Figures 3-6 , Figures 3-6 Each of the figures shows Figure 1 a cross-sectional structure along the F-F' direction. The display panel 100 includes a plurality of partition structures 10 disposed on the substrate SUB and located within the transition area TA. The display panel 100 further includes an organic light-emitting layer 41 and a first electrode 31 located within the transition area TA, wherein the organic light-emitting layer 41 is disposed on a side of the partition structure 10 away from the substrate SUB, and the first electrode 31 is located on a side of the organic light-emitting layer 41 away from the substrate SUB. In addition, the organic light-emitting layer 41 is disposed in the same layer as the light-emitting material layer K2 in the display area AA, and the first electrode 31 is disposed in the same layer as the second electrode 32 in the display area AA.

[0040] It is worth noting that in the process of manufacturing the light-emitting material layer K2 in the display area AA, the organic light-emitting material is usually disposed (for example, by an evaporation process) in the display area AA and the transition area TA, the organic light-emitting material located in the display area AA finally forms the light-emitting material layer K2, and the organic light-emitting material located in the transition area TA forms the organic light-emitting layer 41. The organic light-emitting layer 41 is partitioned by the partition structure 10, so as to avoid water and oxygen penetrating through the organic light-emitting layer 41 and invading the light-emitting material layer K2 in the display area AA, thereby causing the light-emitting device K to fail.

[0041] In some embodiments, please refer to Figures 3-6 , the display panel 100 further includes at least one pedestal 21, and the plurality of partition structures 10 includes at least one first partition structure 10A, the first partition structure 10A is supported on the corresponding pedestal 21, and the orthographic projection of the pedestal 21 on the substrate SUB is located within the orthographic projection of the first partition structure 10A on the substrate SUB. Wherein, the orthographic projection of the pedestal 21 on the substrate SUB is located within the orthographic projection of the first partition structure 10A on the substrate SUB means that the orthographic projection of the pedestal 21 on the substrate SUB does not exceed the orthographic projection of the first partition structure 10A on the substrate SUB. For example, the orthographic projection of the first partition structure 10A on the substrate SUB and the orthographic projection of the pedestal 21 on the substrate SUB can completely overlap; or the orthographic projection of the first partition structure 10A on the substrate SUB surrounds the orthographic projection of the pedestal 21 on the substrate SUB. In addition, the number of first partition structures 10A is the same as the number of pedestals 21. In the case where both the pedestal 21 and the first partition structure 10A are provided in multiple, the plurality of first partition structures 10A and the plurality of pedestals 21 correspond one by one.

[0042] Since the orthographic projection of the base 21 on the substrate SUB is located within the range of the orthographic projection of the first partition structure 10A on the substrate SUB, the sidewall of the base 21 will not exceed the edge of the first partition structure 10A, so that the first electrode 31 is difficult to cover the sidewall of the base 21 during the manufacturing process of the first electrode 31, thereby breaking at the partition assembly formed by the first partition structure 10A and the base 21. In this way, the length of the conductive path formed by the first electrode 31 can be reduced, thereby alleviating the technical problem that the display panel is prone to black spots.

[0043] In some embodiments, referring to Figure 3 , the first width D1 of the first surface 211 (i.e., the top surface of the base 21) of the base 21 away from the substrate SUB is less than the second width D2 of the second surface 101 (i.e., the bottom surface of the first partition structure 10A) of the first partition structure 10A close to the substrate SUB.

[0044] In this case, the part of the second surface 101 protruding from the first surface 211 will form a shadow area in the vertical direction (i.e., the thickness direction of the display panel 100), so that the first electrode 31 will break at the edge of the second surface 101 during the manufacturing process, thereby ensuring that the first electrode 31 cannot form an electrical connection at the partition assembly formed by the first partition structure 10A and the base 21.

[0045] It is worth noting that during the manufacturing process of the base 21, a transition base can be first manufactured, the top surface of which coincides with the bottom surface of the first partition structure 10A, and then the sidewall of the transition base is etched to form the base 21, thereby realizing that the top surface of the base 21 is recessed compared to the bottom surface of the first partition structure 10A.

[0046] In some examples, referring to Figure 3 , the first width D1 is less than the third width D3 of the third surface 212 (i.e., the bottom surface of the base 21) of the base 21 close to the substrate SUB.

[0047] In this way, the base 21 has a structure of being narrow at the top and wide at the bottom, which can improve the supporting performance of the base 21 for the first partition structure 10A. Moreover, since the bottom surface of the base 21 has a relatively large area, the contact area between the base 21 and the substrate SUB is increased, thereby improving the adhesion performance of the base 21 on the substrate SUB and reducing the risk of peeling between the base 21 and the substrate SUB.

[0048] In some examples, the third width D3 is equal to the second width D2.

[0049] In this case, the side walls of the base 21 do not exceed the coverage of the first partition structure 10A, which makes the side walls of the base 21 not adhere to the first electrode 31. In addition, in the case where the third width D3 is equal to the second width D2, the area of the bottom surface of the base 21 can be maximized, thereby effectively improving the supporting performance of the base 21 on the first partition structure 10A and reducing the risk of peeling between the base 21 and the substrate SUB.

[0050] In some examples, the third width D3 can be greater than the second width D2.

[0051] It is worth noting that, in the embodiments of the present application, the width direction of the first surface 211 of the base 21 is the same as the width direction of the third surface 212, and both are perpendicular to the extension direction of the base 21. For example, the base 21 is arranged around the aperture region OA, and in the longitudinal section of the display panel 100 passing through the base 21, the size of the first surface 211 of the base 21 in the section is the first width D1 of the first surface 211, and the size of the third surface 212 of the base 21 in the section is the third width D3 of the third surface 212. In addition, the width direction of the second surface 101 is the same as the width direction of the first surface 211. Therefore, the size of the second surface 101 of the first partition structure 10A in the section is the second width D2 of the second surface 101.

[0052] In some examples, the base 21 can be made of an organic insulating material. For example, the base 21 can be made of the same material as the planar layer PLN. In this way, the top surface of the base 21 can be relatively flat, thereby facilitating the improvement of the structural stability of the first partition structure 10A.

[0053] In some embodiments, referring to Figure 4 and Figure 5 , the orthographic projection of the first surface 211 of the base 21 away from the substrate SUB (i.e., the top surface of the base 21) on the substrate SUB overlaps with the orthographic projection of the second surface 101 of the first partition structure 10A close to the substrate SUB (i.e., the bottom surface of the first partition structure 10A) on the substrate SUB.

[0054] In this case, the top surface of the base 21 and the bottom surface of the first partition structure 10A are the same in shape and size. Since the top surface of the base 21 is in contact with the bottom surface of the first partition structure 10A, a vertical force transmission can be formed therebetween. When the area of the display panel 100 corresponding to the area where the base 21 is located is subjected to a force (e.g., external pressing), the force borne by the first partition structure 10A can be uniformly transmitted to the base 21, thereby avoiding local stress concentration and causing damage to the first partition structure 10A and the base 21.

[0055] In some examples, referring toFigure 4 The first width D1 of the first surface 211 is greater than the third width D3 of the third surface 212 of the base 21 near the side of the substrate SUB. That is, the width of the top surface of the base 21 is greater than the width of the bottom surface of the base 21. At this time, the base 21 has a structure of being wider at the top and narrower at the bottom.

[0056] In this case, the sidewall of the base 21 does not exceed the edge of the first partition structure 10A, so that the first electrode 31 cannot cover the sidewall of the base 21 during the manufacturing of the first electrode 31, thereby being broken at the partition assembly formed by the first partition structure 10A and the base 21. In addition, by setting the base 21 to have a structure of being wider at the top and narrower at the bottom, the manufacturing of the base 21 is also facilitated.

[0057] As an example, the base 21 can include a negative photoresist material.

[0058] During the manufacturing of the base 21, a negative photoresist layer is first provided, and then the negative photoresist layer is exposed. The exposed area will undergo a cross-linking reaction and thus be insoluble in a developing solution. After development, the unexposed area is dissolved away, and the exposed part forms the base 21. Since the exposure process is performed from top to bottom, and the light intensity at the top is the strongest, the negative photoresist layer at the top near the opening of the mask plate receives the most cumulative light energy, resulting in the most intense cross-linking reaction in this area and the widest range. This makes the base 21 formed after development of the negative photoresist layer have a reverse trapezoidal structure. Therefore, in the case where the base 21 includes a negative photoresist material, the stable structure of the base 21 being wider at the top and narrower at the bottom can be effectively ensured, thereby ensuring that the first electrode 31 is broken at the partition assembly formed by the first partition structure 10A and the base 21.

[0059] In other examples, referring to Figure 5 The sidewall of the base 21 is perpendicular to the surface of the substrate SUB.

[0060] In this case, the base 21 itself can form a vertical force transmission. When the display panel 100 is subjected to a force (for example, external pressing) at the area corresponding to the base 21, the force borne by the first partition structure 10A can be uniformly transmitted to the substrate SUB through the base 21, thereby avoiding local stress concentration and causing damage to the first partition structure 10A and the base 21. In addition, the area of the bottom surface of the base 21 can also be maximized, thereby effectively improving the support performance of the base 21 for the first partition structure 10A and reducing the risk of peeling between the base 21 and the substrate SUB.

[0061] In some embodiments, the plurality of partition structures 10 further comprises a plurality of second partition structures 10B, the second partition structures 10B are spaced apart from the base 21, and the first partition structure 10A is located between two adjacent second partition structures 10B. It is worth mentioning that the second partition structure 10B is the same structure as the first partition structure 10A, and the difference between them is only the position.

[0062] Since the first partition structure 10A is supported on the base 21, the height of the first partition structure 10A and the base 21 as a whole is greater than the height of the second partition structure 10B, and the partition assembly formed by the first partition structure 10A and the base 21 is prone to cause local stress concentration. By arranging the partition assembly between the adjacent second partition structures 10B, it is beneficial to prevent the problem of easy peeling between the partition assembly and the substrate SUB caused by excessive local stress superposition in the transition area TA.

[0063] In some examples, a plurality of first partition structures 10A can be spaced apart, and each first partition structure 10A is arranged between two adjacent second partition structures 10B. In this case, at least one second partition structure 10B is arranged between two adjacent first partition structures 10A.

[0064] In some embodiments, referring to Figures 3-5 , the partition structure 10 comprises a first conductive layer 11 and a second conductive layer 12 arranged in a stack, the second conductive layer 12 is located on the side of the first conductive layer 11 away from the substrate SUB, and the orthographic projection of the first conductive layer 11 on the substrate SUB is within the range of the orthographic projection of the second conductive layer 12 on the substrate SUB.

[0065] In this case, when the organic light-emitting layer 41 is formed on the partition structure 10, since the sidewall of the first conductive layer 11 does not exceed the edge of the second conductive layer 12, the organic light-emitting layer 41 can be disconnected at the partition structure 10, thereby avoiding the different parts of the organic light-emitting layer 41 being connected to each other and easily forming a water and oxygen intrusion channel.

[0066] In some examples, the material of the first conductive layer 11 can include at least one of aluminum, copper or silver. The material of the second conductive layer 12 includes at least one of titanium, gold, molybdenum and platinum. Since the etch resistance of the material of the second conductive layer 12 is stronger than that of the material of the first conductive layer 11, in the subsequent etching process, the etching amount of the second conductive layer 12 is less than that of the first conductive layer 11, thereby forming a recess on the side of the partition structure 10 to disconnect the organic light-emitting layer 41.

[0067] In some examples, a fourth width D4 of a fourth surface 111 (i.e., a top surface of the first conductive layer 11) of the first conductive layer 11 close to the second conductive layer 12 is less than a fifth width D5 of a fifth surface 121 (i.e., a bottom surface of the second conductive layer 12) of the second conductive layer 12 close to the first conductive layer 11.

[0068] In some embodiments, the partition structure 10 further includes a third conductive layer 13 between the first conductive layer 11 and the substrate SUB, and a projection of the first conductive layer 11 on the substrate SUB is within a projection of the third conductive layer 13 on the substrate SUB. The third conductive layer 13 is made of a material with a higher etching resistance than the material of the first conductive layer 11. For example, the material of the third conductive layer 13 can be the same as the material of the second conductive layer 12. In a subsequent etching process, the third conductive layer 13 is etched to a smaller extent than the first conductive layer 11. For example, the partition structure 10 has a H-shaped structure in a cross-section of the display panel 100.

[0069] In some embodiments, as shown in FIG. 1B, the display panel 100 further includes at least one dam DAM disposed on the substrate SUB and located in the transition area TA. The dam DAM can effectively block the flow leveling of the organic encapsulation film, so as to limit the organic encapsulation film to one side of the dam DAM, thereby achieving a good encapsulation effect on the light emitting device K. Figure 6

[0070] In some examples, two dams DAM can be provided, one dam DAM (e.g., a first dam DAM1) is disposed close to the display area AA, and the other dam DAM (e.g., a second dam DAM2) is disposed close to the opening area OA. The first dam DAM1 can effectively limit the organic encapsulation film to one side close to the display area AA, and the second dam DAM2 can form an encapsulation barrier to block the water and oxygen from the side of the opening area OA, thereby improving the protection effect on the light emitting device K.

[0071] In some examples, the dam DAM can be disposed in the same layer as at least one of the planarization layer PLN, the pixel definition layer PDL, and the support column. For example, the dam DAM can be disposed in the same layer as the planarization layer PLN, the pixel definition layer PDL, and the support column, in which case the dam DAM includes a first portion made in the same layer as the planarization layer PLN, a second portion made in the same layer as the pixel definition layer PDL, and a third portion made in the same layer as the support column, and the first portion, the second portion, and the third portion are sequentially stacked.

[0072] Some embodiments of the present application further provide a manufacturing method of a display panel, as shown in FIG. 1C and FIG. 1D, the manufacturing method includes the following steps. Figure 7 and Figure 8B The manufacturing method includes the following steps. The manufacturing method includes the following steps.

[0073] S11: providing a substrate SUB.

[0074] S12: forming at least one pedestal 21 and a plurality of partition structures 10 on the substrate SUB, the plurality of partition structures 10 comprising at least one first partition structure 10A supported on a corresponding pedestal 21, and a projection of the pedestal 21 on the substrate SUB is within a projection of the first partition structure 10A on the substrate SUB.

[0075] In the present embodiment, since the projection of the pedestal 21 on the substrate SUB is within the projection of the first partition structure 10A on the substrate SUB, the sidewall of the pedestal 21 does not exceed the edge of the first partition structure 10A, so that the first electrode is difficult to cover the sidewall of the pedestal 21 in the process of manufacturing the first electrode, thereby being disconnected at the partition assembly formed by the first partition structure 10A and the pedestal 21. In this way, the length of the conductive path formed by the first electrode is reduced, thereby alleviating the technical problem that the display panel is prone to black spots.

[0076] In some embodiments, as shown in Figure 8A and Figure 8B , step S12 comprises the following steps.

[0077] S121: forming at least one transition pedestal 20 on the substrate SUB. For example, the transition pedestal 20 can have a trapezoidal cross-sectional structure.

[0078] S122: forming a plurality of partition structures 10 on a side of the transition pedestal 20 away from the substrate SUB, wherein the first partition structure 10A is supported on a corresponding transition pedestal 20.

[0079] As an example, the bottom surface of the first partition structure 10A can overlap the top surface of the transition pedestal 20.

[0080] S123: etching the transition pedestal 20 to form the pedestal 21.

[0081] As an example, a photoresist layer can be first provided to cover all the partition structures 10 and the transition pedestals 20, and then an opening exposing the transition pedestals 20 and the first partition structures 10A is formed on the photoresist layer by a photolithography process, and then the transition pedestals 20 are etched by a dry etching process to form the pedestals 21. At this time, the first width D1 of the top surface of the pedestal 21 is less than the second width D2 of the bottom surface of the first partition structure 10A.

[0082] Some embodiments of the present application also provide a display device, as shown in Figure 9 , the display device 1000 comprises the display panel 100 according to any one of the above embodiments.

[0083] The display device 1000 has the technical effects of the display panel 100 as described above due to comprising the display panel 100, which will not be repeated here.

[0084] The above describes the embodiments of the present application in detail, and the principles and implementation manners of the present application are described by applying specific examples. The above description of the embodiments is only used to help understand the method of the present application and its core idea; meanwhile, for those skilled in the art, the specific implementation manners and application ranges will be changed according to the idea of the present application. In summary, the content of the specification should not be understood as a limitation of the present application.

Claims

1. A display panel, characterized in that, The display panel has a display area, an opening area, and a transition area located between the display area and the opening area, the display panel comprising: substrate; At least one base is disposed on the substrate and located in the transition region; and Multiple partition structures are disposed on the substrate and located in the transition area. The multiple partition structures include at least one first partition structure, which is supported on a corresponding base. The orthographic projection of the base on the substrate is within the range of the orthographic projection of the first partition structure on the substrate.

2. The display panel according to claim 1, characterized in that, The first width of the first surface of the base away from the substrate is less than the second width of the second surface of the first partition structure close to the substrate.

3. The display panel according to claim 2, characterized in that, The first width is less than the third width of the third surface of the base on the side closest to the substrate.

4. The display panel according to claim 3, characterized in that, The third width is equal to the second width.

5. The display panel according to claim 1, characterized in that, The orthographic projection of the first surface of the base away from the substrate onto the substrate overlaps with the orthographic projection of the second surface of the first partition structure close to the substrate onto the substrate.

6. The display panel according to claim 5, characterized in that, The first width of the first surface is greater than the third width of the third surface of the base on the side closer to the substrate.

7. The display panel according to claim 5, characterized in that, The sidewalls of the base are perpendicular to the surface of the substrate.

8. The display panel according to any one of claims 1-7, characterized in that, The plurality of partition structures also include a plurality of second partition structures, the second partition structures being spaced apart from the base, and the first partition structure being located between two adjacent second partition structures.

9. The display panel according to any one of claims 1-7, characterized in that, The partition structure includes a first conductive layer and a second conductive layer stacked together. The second conductive layer is located on the side of the first conductive layer away from the substrate, and the orthographic projection of the first conductive layer on the substrate is within the range of the orthographic projection of the second conductive layer on the substrate.

10. A method for manufacturing a display panel, characterized in that, include: Provide substrate; At least one base and a plurality of partition structures are formed on the substrate. The plurality of partition structures include at least one first partition structure, which is supported on a corresponding base, and the orthographic projection of the base on the substrate is within the range of the orthographic projection of the first partition structure on the substrate.

11. The method for manufacturing a display panel according to claim 10, characterized in that, At least one base and a plurality of partition structures are formed on the substrate, including: At least one transition base is formed on the substrate; The plurality of partition structures are formed on the side of the transition base away from the substrate, wherein the first partition structure is supported on the corresponding transition base; and The transition base is etched to form the base.

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