Display substrate and display screen

Abstract

Embodiments of the present application provide a display substrate and a display screen, the display substrate comprising an opening area, an opening encapsulation area and a display area; the opening encapsulation area is located between the opening area and the display area, and the opening encapsulation area is arranged around the opening area; the opening encapsulation area comprises an isolation groove, an isolation column and a dam structure; the isolation column comprises an inner isolation column and an outer isolation column, the inner isolation column is located on a side of the dam structure away from the opening area, and the outer isolation column is located on a side of the dam structure close to the opening area; the isolation groove is opened on a first inorganic layer of the opening encapsulation area, and the isolation groove is located between the outer isolation columns. By arranging the isolation column and the isolation groove between the outer isolation columns close to the opening area, the film crack can be prevented from extending from the opening area to the in-plane to form a water and oxygen channel, thereby improving the problem of black spot generation.

Description

Technical Field

[0001] This invention relates to the field of display technology, and in particular to a display substrate and a display screen. Background Technology

[0002] OLED (Organic Light-Emitting Diode) display technology does not require a backlight. It uses a very thin coating of organic material and a glass substrate (or a flexible organic substrate). When an electric current passes through, these organic materials emit light. OLED screens have advantages such as high contrast, wide viewing angle, and low power consumption, and are currently widely used in mobile electronic products, such as mobile phones.

[0003] Screen-to-body ratio (SVR) refers to the proportion of a device's screen area to its overall front panel area, usually expressed as a percentage. A higher SVR means a larger proportion of the device's front panel is occupied by the screen, with smaller bezels or other areas that don't display content. For example, if a phone's screen area occupies 85% of the entire front panel, its SVR is 85%. A high SVR typically provides a more immersive visual experience and makes the device look more modern and stylish. In pursuit of the ultimate SVR, OLED punch-hole displays have gradually become mainstream. OLED punch-hole displays involve creating a hole in the screen's usable area to house the camera. Hole black spots are defects that occur in the hole area during the reliability process. This is caused by the stress generated by cutting the hole, which extends inwards from the hole, causing film rupture and separation between film layers. These cracks form water and oxygen channels; once water and oxygen invade, it can cause electrode / light-emitting layer failure, resulting in hole black spots. Summary of the Invention

[0004] The purpose of this invention is to provide a display substrate and a display screen to improve the problem of black spots caused by holes. The specific technical solution is as follows:

[0005] In a first aspect, embodiments of this application provide a display substrate, including:

[0006] An opening area, an opening encapsulation area, and a display area; the opening encapsulation area is located between the opening area and the display area, and the opening encapsulation area is arranged around the opening area;

[0007] The opening encapsulation area includes: an isolation groove, an isolation pillar, and a dam structure; the isolation pillar includes an inner isolation pillar and an outer isolation pillar, the inner isolation pillar is located on the side of the dam structure away from the opening area, and the outer isolation pillar is located on the side of the dam structure close to the opening area;

[0008] The isolation groove is formed on the first inorganic layer of the opening encapsulation area, and the isolation groove is located between the outer isolation pillars.

[0009] In one possible implementation, the isolation trench includes a first isolation trench located between a first isolation pillar and a second isolation pillar, the first isolation trench being filled with a first organic layer that extends beyond the first and second isolation pillars in the thickness direction of the display substrate.

[0010] In one possible implementation, the first organic layer is a pixel definition layer, and the first inorganic layer is an interlayer dielectric layer.

[0011] In one possible implementation, the isolation trench includes a second isolation trench filled with a second organic layer, wherein the second organic layer in the second isolation trench is lower than the second organic layers on both sides of the second isolation trench in the thickness direction of the display substrate.

[0012] In one possible implementation, there are multiple second isolation slots, with at most one second isolation slot between two adjacent outer isolation columns.

[0013] In one possible implementation, there are multiple second isolation slots, with at least one set of adjacent outer isolation columns having multiple second isolation slots.

[0014] In one possible implementation, the second isolation groove is located between the third isolation post and the fourth isolation post, which are the two isolation posts closest to the opening area.

[0015] In one possible implementation, the second organic layer is an electroluminescent layer.

[0016] In one possible implementation, the slope angle of the isolation groove ranges from 30 degrees to 50 degrees, wherein the slope angle is the acute angle formed by the side surface and the bottom surface of the isolation groove, and the bottom surface is a surface parallel to the substrate plane.

[0017] Secondly, embodiments of this application provide a display screen, the display screen including any of the display substrates described above.

[0018] Beneficial effects of the embodiments of the present invention:

[0019] In this embodiment, the display substrate includes an opening area, an opening encapsulation area, and a display area. The opening encapsulation area is located between the opening area and the display area, and is disposed around the opening area. The opening encapsulation area includes: an isolation groove, isolation pillars, and a dam structure. The isolation pillars include inner isolation pillars and outer isolation pillars. The inner isolation pillars are located on the side of the dam structure away from the opening area, and the outer isolation pillars are located on the side of the dam structure closer to the opening area. The isolation groove is formed on the first inorganic layer of the opening encapsulation area, and the isolation groove is located between the outer isolation pillars. By setting isolation pillars and setting isolation grooves between the outer isolation pillars near the opening area, it is possible to prevent film cracks from extending from the opening area into the surface to form water and oxygen channels, thereby improving the problem of black spots caused by holes.

[0020] Of course, implementing any product or method of the present invention does not necessarily require achieving all of the advantages described above at the same time. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other embodiments can be obtained based on these drawings.

[0022] Figure 1 This is a schematic diagram of a first structure of a display substrate provided in an embodiment of this application;

[0023] Figure 2a This is a schematic diagram of a second structure of a display substrate provided in an embodiment of this application;

[0024] Figure 2b This is a schematic diagram of a third structure of a display substrate provided in an embodiment of this application;

[0025] Figure 3 This is a first design rendering of the isolation trench provided in an embodiment of this application;

[0026] Figure 4 This is a second design rendering of the isolation trench provided in an embodiment of this application;

[0027] Figure 5 This is a third design rendering of the isolation trench provided in the embodiments of this application;

[0028] Figure 6 This is a schematic diagram of a type of isolation column provided in an embodiment of this application. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art based on this application are within the scope of protection of the present invention.

[0030] OLED (Organic Light-Emitting Diode) display technology does not require a backlight. It uses a very thin coating of organic material and a glass substrate (or a flexible organic substrate). When an electric current passes through, these organic materials emit light. OLED screens have advantages such as high contrast, wide viewing angle, and low power consumption, and are currently widely used in mobile electronic products, such as mobile phones.

[0031] Screen-to-body ratio (SVR) refers to the proportion of a device's screen area to its overall front panel area, usually expressed as a percentage. A higher SVR means a larger proportion of the device's front panel is occupied by the screen, with smaller bezels or other areas that don't display content. For example, if a phone's screen area occupies 85% of the entire front panel, its SVR is 85%. A high SVR typically provides a more immersive visual experience and makes the device look more modern and stylish. In pursuit of the ultimate SVR, OLED punch-hole displays have gradually become mainstream. OLED punch-hole displays involve creating a hole in the screen's usable area to house the camera. Hole black spots are defects that occur in the hole area during the reliability process. This is caused by the stress generated by cutting the hole, which extends inwards from the hole, causing film rupture and separation between film layers. These cracks form water and oxygen channels; once water and oxygen invade, it can cause electrode / light-emitting layer failure, resulting in hole black spots.

[0032] Among them, membrane rupture mainly refers to the rupture of the insulating layer (Chemical Vapor Deposition, CVD). The separation between membrane layers mainly occurs between the insulating layer and the cathode layer, between the first insulating layer (Chemical Vapor Deposition 1, CVD1) and the second insulating layer (Chemical Vapor Deposition 2, CVD2), and between the insulating layer and the thermal laminated dielectric (TLD).

[0033] With technological advancements and improved living standards, consumers have increasingly higher demands for OLED mobile phone displays. To address the issue of black spots appearing around holes, firstly, see... Figure 1 This application provides a display substrate, comprising:

[0034] The device includes an opening area 101, an opening encapsulation area 102, and a display area 103; the opening encapsulation area 102 is located between the opening area 101 and the display area 103, and the opening encapsulation area 102 is arranged around the opening area 101.

[0035] The opening area 101 is generally cut into a circular area for placing the camera. The display area 103 refers to the operable area (AA, Active Area).

[0036] The opening and sealing area 102 includes: an isolation groove, an isolation pillar, and a dam structure 11; the isolation pillar includes an inner isolation pillar and an outer isolation pillar, the inner isolation pillar is located on the side of the dam structure 11 away from the opening area 101, and the outer isolation pillar is located on the side of the dam structure 11 close to the opening area 101.

[0037] Isolation pillars can block negatively charged cathode materials, thus preventing electrochemical corrosion caused by the combination of a small amount of water vapor and electricity at the edge of the borehole. However, even with a power-off design that includes inner isolation pillars, outer isolation pillars, and both inner and outer isolation pillars, a certain percentage of borehole black spots still occur under conditions of 85℃ and 85% humidity. This is because the film stress caused by cutting the borehole area extends from the borehole cut channel into the surface, causing film rupture or film separation at the borehole edge.

[0038] Figure 1 In the dam structure 11, the seven isolation columns on the right side are the outer isolation columns, and the three isolation columns on the left side are the inner isolation columns. The number of outer isolation columns is not limited to seven; for example, there can be eight outer isolation columns. The number of inner isolation columns is not limited to three; for example, there can be four inner isolation columns.

[0039] The isolation groove is formed on the first inorganic layer 12 of the opening encapsulation area 102, and the isolation groove is located between the outer isolation pillars.

[0040] The isolation groove is formed on the first inorganic layer 12 of the opening encapsulation area 102. When the membrane crack extends from the opening area into the surface, the presence of the isolation groove prevents the membrane crack from continuing to develop after passing through the isolation groove. The design of the isolation groove can cut off the water and oxygen channels formed by the membrane crack. Moreover, the isolation groove is located between the outer isolation pillars. The closer it is to the opening area, the earlier it can block the formation of water and oxygen channels, and prevent the water and oxygen channels from further developing into the surface under the action of membrane stress.

[0041] In this embodiment, the display substrate includes an opening area, an opening encapsulation area, and a display area. The opening encapsulation area is located between the opening area and the display area, and is disposed around the opening area. The opening encapsulation area includes: an isolation groove, isolation pillars, and a dam structure. The isolation pillars include inner isolation pillars and outer isolation pillars. The inner isolation pillar is located on the side of the dam structure away from the opening area, and the outer isolation pillar is located on the side of the dam structure closer to the opening area. The isolation groove is formed on the first inorganic layer of the opening encapsulation area, and the isolation groove is located between the outer isolation pillars. By setting the isolation pillars, the organic layer in the light-emitting device is blocked, preventing moisture in the air in the opening area from entering the display area along the organic layer and causing display defects. Furthermore, by setting the isolation groove between the outer isolation pillars near the opening area, the film cracks can be prevented from extending from the opening area into the surface to form water and oxygen channels, thereby improving the problem of black spots caused by holes.

[0042] In some embodiments, see Figure 1 The isolation groove includes a first isolation groove 13, which is located between a first isolation post 14 and a second isolation post 15. The first isolation groove 13 is filled with a first organic layer 16, which extends beyond the first isolation post 14 and the second isolation post 15 in the thickness direction of the display substrate.

[0043] In the direction from the opening encapsulation area to the opening area, the outer isolation pillars are arranged sequentially as follows: a first isolation pillar and a second isolation pillar, that is, the first isolation pillar and the second isolation pillar are the two outer isolation pillars closest to the dam structure. A first isolation groove is provided between the first isolation pillar and the second isolation pillar, and the first isolation groove is filled with a first organic layer.

[0044] In some embodiments, the first inorganic layer is an inter-layer dielectric (ILD); the first organic layer is a pixel defining layer (PDL). The pixel organic layer is often made of polyimide (PI), which is an organic polymer material. The first organic layer and the first isolation groove form a tenon-and-mortise structure, that is, a tenon-and-mortise structure is formed between the organic layer and the inorganic layer. This can utilize the intermolecular interaction force to hold the upper and lower film layers together, preventing the film layers from separating. This can prevent film cracks from extending from the opening area into the surface and forming water and oxygen channels, thereby improving the problem of black spots caused by pores.

[0045] In some embodiments, see Figure 1 The isolation trench includes a second isolation trench 17, which is filled with a second organic layer 18. The second organic layer 18 in the second isolation trench 17 is lower than the second organic layers on both sides of the second isolation trench in the thickness direction of the display substrate.

[0046] The second organic layer is disposed on the second isolation trench, and the first inorganic layer is disposed below the isolation pillar. The second organic layer on the second isolation trench and the second organic layer on the first inorganic layer are an integrated structure. Because the isolation trench is formed on the first inorganic layer, and the second isolation trench is filled with the second organic layer, it is equivalent to the second organic layer being disposed on the trench-shaped first inorganic layer. In addition, the second isolation trench is also filled with a first insulating layer CVD1, which is an inorganic layer. In this way, the path for membrane rupture and separation between membrane layers is extended inward.

[0047] The second isolation groove can be disposed between the third isolation column 19 and the fourth isolation column 20, which are the two isolation columns closest to the opening area. There can be multiple second isolation grooves, and at least one set of adjacent outer isolation columns has multiple second isolation grooves. When the second isolation groove is disposed between the third and fourth isolation columns, multiple second isolation grooves can be disposed between the third and fourth isolation columns. Since the third and fourth isolation columns are the two isolation columns closest to the opening area, when the membrane stress in the opening area extends inward from the opening area, it will encounter the second isolation groove after only a short extension. The other end of the second isolation groove will not receive the membrane stress due to its presence. By disposing of a second isolation groove between the third and fourth isolation columns, the inward extension of membrane rupture and membrane separation caused by membrane stress can be quickly interrupted, preventing the formation of water-oxygen channels.

[0048] The second organic layer is disposed on the second isolation groove, but unlike the first organic layer disposed on the first isolation groove, which extends through the first isolation groove and the first and second isolation pillars and exceeds the height of the first and second isolation pillars, forming a tenon-and-mortise structure between the first organic layer, the second organic layer is only a thin layer disposed on the second isolation groove. The thickness of the film layer of the second organic layer disposed on the second isolation groove is comparable to the thickness of the film layer of the second organic layer disposed on the first inorganic layer. However, because the second isolation groove is formed on the first inorganic layer and its height is lower than that of the first inorganic layer, the second organic layer in the second isolation groove is lower than the second organic layers on both sides of the second isolation groove in the thickness direction of the display substrate.

[0049] The second organic layer mentioned above is an electroluminescent layer (EL).

[0050] In some embodiments, there are multiple second isolation slots, with at most one second isolation slot between two adjacent outer isolation pillars.

[0051] See Figure 1In the direction from the opening encapsulation area to the opening area, the following outer isolation pillars are arranged sequentially: a first isolation pillar, a second isolation pillar, a fifth isolation pillar, a sixth isolation pillar, a seventh isolation pillar, a third isolation pillar, and a fourth isolation pillar. The third and fourth isolation pillars are the two isolation pillars closest to the opening area 101. A first isolation groove is provided between the first and second isolation pillars. A second isolation groove is not provided between the first and second isolation pillars. The second isolation groove can be provided between the second and fifth isolation pillars, between the fifth and sixth isolation pillars, between the sixth and seventh isolation pillars, between the seventh and third isolation pillars, and between the third and fourth isolation pillars. There can be at most one second isolation groove between two adjacent outer isolation pillars.

[0052] In some embodiments, see Figure 2a A first isolation groove 13 is provided between the first isolation pillar 14 and the second isolation pillar 15; a second isolation groove 17 is provided between the seventh isolation pillar 21 and the third isolation pillar 19, and a second isolation groove 17 is provided between the third isolation pillar 19 and the fourth isolation pillar 20; that is, the current display substrate has one first isolation groove and two second isolation grooves. The second isolation grooves are located close to the hole area, which can take timely measures to prevent film rupture and interlayer separation caused by film stress from spreading from the hole area into the surface.

[0053] In some embodiments, there are multiple second isolation slots, with at least one set of adjacent outer isolation pillars having multiple second isolation slots. See also Figure 2b A first isolation groove 13 is provided between the first isolation post 14 and the second isolation post 15; two second isolation grooves 17 are provided between the seventh isolation post 21 and the third isolation post 19, and a second isolation groove 17 is provided between the third isolation post 19 and the fourth isolation post 20; that is, the current display substrate has one first isolation groove and three second isolation grooves, and there are multiple second isolation grooves between adjacent third isolation posts 19 and fourth isolation posts 20.

[0054] An isolation groove is a structure disposed between isolation pillars. In some embodiments, isolation grooves can also be disposed between inner isolation pillars. When an isolation groove is disposed between two inner isolation pillars farther from the aperture area 101, the isolation groove is filled with a pixel definition layer (PDL). The height range of the PDL includes the distance from the isolation groove to the top of the two inner isolation pillars farther from the aperture area 101. That is, the PDL penetrates the isolation groove and the two inner isolation pillars farther from the aperture area 101, and its height exceeds that of the two inner isolation pillars farther from the aperture area 101, thus forming a tenon-and-mortise structure between the PDL and the isolation groove. This utilizes the intermolecular interaction forces to hold the upper and lower film layers together, preventing separation between the film layers and preventing film cracks from extending from the aperture area inward to form water and oxygen channels, thereby improving the problem of black spots caused by pores.

[0055] When an isolation groove is set between two inner isolation pillars close to the aperture region 101, the isolation groove is filled with an electroluminescent layer EL. The electroluminescent layer EL on the isolation groove and the electroluminescent layer EL on the interlayer dielectric layer ILD are an integrated structure. Because the isolation groove is set on the interlayer dielectric layer ILD and is filled with an electroluminescent layer EL, it is equivalent to the electroluminescent layer EL being set on the groove-shaped interlayer dielectric layer ILD. In addition, the isolation groove is also filled with a first insulating layer CVD1, which is an inorganic layer. In this way, the path of membrane rupture and interlayer separation extending inward is extended. When the membrane stress in the aperture region extends inward from the aperture region, after encountering the isolation groove, the other end of the isolation groove will not receive the membrane stress due to the presence of the isolation groove. By setting an isolation groove between two inner isolation pillars close to the aperture region 101, the inward extension of membrane rupture and interlayer separation caused by membrane stress can be quickly cut off, preventing the formation of water-oxygen channels.

[0056] Furthermore, when an isolation groove is provided between two inner isolation pillars that are close to the opening area 101, the number of isolation grooves can be one or more.

[0057] If isolation grooves are placed between the inner isolation pillars, they can indeed form a tenon-and-mortise structure with the pixel definition layer (PDL), using intermolecular interactions to hold the upper and lower film layers together, preventing separation between the film layers. This can prevent film cracks from extending inward from the opening area, thus avoiding the formation of water and oxygen channels. Alternatively, together with the electroluminescent layer (EL), they can block the path of film rupture and separation extending inward, preventing the formation of water and oxygen channels. However, these effects only apply to the portion from the inner isolation pillars to the left. They do not provide good protection for the portion from the inner isolation pillars to the right. Therefore, isolation grooves are usually placed between the outer isolation pillars. Since the outer isolation pillars are close to the opening area, they can quickly cut off the film stress as soon as it begins to take effect, causing film rupture and separation, preventing the film stress from extending inward from the opening to form water and oxygen channels.

[0058] In some embodiments, the slope angle of the isolation groove ranges from 30 degrees to 50 degrees, wherein the slope angle is the acute angle formed by the side surface and the bottom surface of the isolation groove, and the bottom surface is a surface parallel to the substrate plane.

[0059] In existing manufacturing processes, trenching can be achieved through etching. The etching process involves photoresist (PR) undergoing exposure and development to form a mask pattern. Utilizing the characteristics of the etched film material, thickness, and density, appropriate etching gases are introduced, and chemical reactions and plasma bombardment are used to remove the portions of the film not covered by the mask. Exposure and development are steps in the fabrication process primarily used to transfer the photolithographic pattern onto the photoresist. Exposure involves shining a light source (such as ultraviolet light) through the mask onto the photoresist, altering its chemical properties. Then, the developer removes the unexposed or exposed portions, forming the pattern. See also... Figure 3 , Figure 3 The left side of the image shows a design diagram and effect diagram of an isolation trench formation method in the prior art: the isolation trench with a width of b1 has photoresist with a width of a1 and photoresist with a width of c1 on both sides. When the first inorganic layer is etched with a solution, since there is no photoresist where the isolation trench is to be etched, the solution can etch the isolation trench but cannot etch the sides of the isolation trench, thus forming an isolation trench.

[0060] However, it was found that if the inorganic layer between the isolation columns is directly grooved in the existing technology, the groove is relatively deep and the resulting slope angle is relatively large. Photoresist or impurities are likely to remain at the corner of the groove. Moreover, the larger the etching slope angle, the worse the flatness of the upper coating. Figure 3 The second image on the left in the middle shows photoresist or impurity residue. Figure 3 The third image on the left shows the slope angle, represented by α in the image.

[0061] To reduce the slope angle, such as Figure 3The upper right corner of the diagram shows a design of an isolation trench formation method provided in this application: By selecting a region of width d from the area with photoresist on both sides of the original location where a trench needs to be dug, and removing the photoresist from this region, the region of width d becomes the same as the isolation trench, and can be etched by the solution. Between this region of width d and the isolation trench, there is also a region of width e, which still contains photoresist. The regions on both sides of the isolation trench, with widths of a2 and c2 respectively, also contain photoresist. Thus, when the first inorganic layer is etched with the solution, both the region of width d and the isolation trench of width b2 will be etched. For the isolation trench of width b2, the etching effect is no different from direct trenching in the prior art. For the region of width d, the solution also penetrates downwards. Because width e is a very small value, as both the isolation trench of width b2 and the region of width d are etched, gradually, the etched spaces of the isolation trench of width b2 and the region of width d will connect. For a region with a width of *e* containing photoresist, the space beneath it has already been etched away, so the photoresist of width *e* will also be etched away. Furthermore, as the solution penetrates downwards, the etching time for the part in contact with the solution compared to the upper inorganic layer is longer, resulting in more etching of the upper layer and less etching of the lower layer. Therefore, the final isolation trench will always have more etching on the upper part than on the lower part. Figure 3 As shown in the lower right corner, the slope angle is β in the figure. This application expands the upper corrosion area, making the excavated groove a trapezoidal isolation groove. Compared to the previous right-angle isolation groove, the trapezoidal isolation groove has a smaller slope angle and is less prone to photoresist or impurity residue. Thus, when filling the isolation groove with the first or second organic layer, the filling effect is better. The better filling effect creates a mortise and tenon structure with stronger molecular forces, which better prevents film separation and film rupture.

[0062] In some embodiments, this application can further involve applying photoresist to areas of width *e* on both sides of the original location where a trench would be created. Between this area of ​​width *e* and the edge of the isolation trench, there is another area of ​​width *d*, which is free of photoresist. When etching the isolation trench with a width of (b² + 2d + 2e) using a solution, the solution penetrates downwards into both the area of ​​width *d* and the area of ​​width *b²*. Because width *e* is a very small value, as both the area of ​​width *b²* and the area of ​​width *d* are etched, the etched spaces of the area of ​​width *b²* and the area of ​​width *d* gradually become connected. For the area of ​​width *e* with photoresist, the space below it has been etched away, so the photoresist of width *e* will also be etched away. Moreover, as the solution penetrates downwards, the etching time for the part in contact with the solution compared to the upper inorganic layer is longer, resulting in more etching of the upper layer and less etching of the lower layer. Therefore, the final isolation trench will always have more etching on the upper part than on the lower part. It can be viewed as a trapezoidal isolation trench. Compared to the previous right-angle isolation trench, the trapezoidal isolation trench has a smaller slope angle, making it less likely for photoresist or impurities to remain. In this way, when the first or second organic layer is filled into the isolation trench, the filling effect will be better. The mortise and tenon structure formed by the better filling effect has stronger molecular forces between the layers, which can better prevent the separation and rupture of the film layers.

[0063] In some embodiments, the area to be excavated may also be designed as... Figure 4 and Figure 5 The area with width a3, the area with width e, the area with width c3, the small square between the area with width a3 / c3 and the area with width b3, the area with width a4, the area with width c4, the small square between the area with width a4 / c4 and the area with width b4 are also covered with photoresist. When etched with solution, the slope of the isolation trench formed is relatively small.

[0064] In some embodiments, see Figure 1The display substrate provided in this application embodiment also includes a bottommost substrate, a first gate metal layer Gate1 (22) disposed on the substrate, a second gate metal layer Gate2 (23) disposed on the first gate metal layer Gate1, and an interlayer dielectric layer disposed on the second gate metal layer Gate2. The film layer configuration will vary depending on the region. Specifically, for the display area, it includes a first planarization layer (PLN1) 24, a second planarization layer (PLN2) 25, a pixel definition layer PDL (16), an electroluminescent layer EL (26), a first insulating layer CVD1 (27), an organic layer (Ink Jet Printing, IJP) 28, a second insulating layer CVD2 (29), a touch insulating layer TLD, a buffer layer Buffer (30), and a touch overlay component (TOC) 31. The first planarization layer 24, the second planarization layer 25, and the touch overlay component 31 are typically made of polyimide.

[0065] The first planarization layer PLN1 is disposed on the side of the interlayer dielectric layer ILD away from the substrate; the second planarization layer PLN2 is disposed on the side of the first planarization layer PLN1 away from the interlayer dielectric layer ILD; the pixel definition layer PDL is disposed on the side of the second planarization layer PLN2 away from the first planarization layer PLN1; the electroluminescent layer is disposed on the side of the pixel definition layer PDL away from the second planarization layer PLN2; the first insulating layer CVD1 is disposed on the side of the electroluminescent layer EL away from the pixel definition layer PDL; the organic layer IJP is disposed on the side of the first insulating layer CVD1 away from the electroluminescent layer; the second insulating layer CVD2 is disposed on the side of the organic layer IJP away from the first insulating layer CVD1; the touch protection layer TLD and the buffer layer Buffer are disposed on the side of the second insulating layer CVD2 away from the organic layer IJP; the touch protection layer TOC is disposed on the side of the touch protection layer TLD and the buffer layer Buffer away from the second insulating layer CVD2.

[0066] For the open-hole encapsulation area, it includes isolation pillars, pixel definition layer PDL (16), dam structure 11, isolation trench, electroluminescent layer EL (26), first insulating layer CVD1 (27), second insulating layer CVD2 (29), touch insulating layer TLD and buffer layer Buffer (30), and touch protection layer 31.

[0067] The isolation pillars are positioned on the side of the interlayer dielectric layer (ILD) away from the substrate. When the electroluminescent layer (EL) of the display area extends towards the via encapsulation area, it is blocked by the isolation pillars. (See also...) Figure 6One specific structure of the isolation pillar can be a first structure + a second structure. The first structure is disposed on the same layer as the source and drain metal layers (SD), both located on the side away from the substrate of the interlayer dielectric layer ILD (12). The first structure of the isolation pillar includes a titanium metal layer 32, a first aluminum metal layer 33, and another titanium metal layer 32 stacked sequentially. The first aluminum metal layer 33 is recessed to form a notch with the upper and lower titanium metal layers 32, which can be used to isolate organic light-emitting materials such as the electroluminescent layer EL (26). The second structure of the isolation pillar is below the first structure of the isolation pillar, and the orthographic projections of the second structure and the first structure on the substrate at least partially overlap. The second structure includes at least one gate metal layer, which may include a first gate metal layer Gate1 (22) and a second gate metal layer Gate2 (23). The second structure may also include an inorganic insulating layer, such as an interlayer dielectric layer ILD (12), a gate insulating layer (Gate Insulator 1, GI), etc. The gate insulating layer may include a first gate insulating layer GI1 and a second gate insulating layer GI2. The first gate insulating layer GI1 is prepared on the first gate metal layer Gate1 (22), and the second gate insulating layer GI2 is prepared on the first gate metal layer Gate1 (22). The second structure can elevate the first structure and can also be used to prevent cracks formed during cutting from propagating to the display area. Of course, the structure of the isolation pillar is not limited to this and other designs are also possible.

[0068] The dam structure is located on the side of the interlayer dielectric layer (ILD) away from the substrate. The dam structure is composed of three polyimide materials: PI1, PI2, and PI3. The pixel definition layer (PDL) is located on the two isolation pillars closest to the display area and on the first isolation groove. The electroluminescent layer (EL) of the aperture encapsulation area is located on the side of the interlayer dielectric layer (ILD) away from the substrate, on the side of the dam structure away from the substrate, on the side of the pixel definition layer (PDL) away from the substrate, and on the side of the isolation pillars away from the substrate. The first insulating layer (CVD1) is located on the side of the electroluminescent layer (EL) away from the interlayer dielectric layer (ILD). The second insulating layer (CVD2) is located on the side of the first insulating layer (CVD1) away from the electroluminescent layer (EL). The touch protection layer (TLD) and the buffer layer (Buffer) are located on the side of the second insulating layer (CVD2) away from the first insulating layer (CVD1). The touch protection layer (TOC) is located on the side of the touch protection layer (TLD) and the buffer layer (Buffer) away from the second insulating layer (CVD2).

[0069] A second aspect of this application also provides a display screen, which includes the display panel described above. The display screen can be used in any product with a display function, such as mobile phones, tablets, televisions, laptops, digital photo frames, and navigators.

[0070] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0071] The various embodiments in this specification are described in a related manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0072] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention are included within the scope of protection of the present invention.

Claims

1. A display substrate, characterized in that, include: Opening area, opening encapsulation area, and display area; The opening encapsulation area is located between the opening area and the display area, and the opening encapsulation area is arranged around the opening area; The opening encapsulation area includes: an isolation groove, an isolation pillar, and a dam structure; the isolation pillar includes an inner isolation pillar and an outer isolation pillar, the inner isolation pillar is located on the side of the dam structure away from the opening area, and the outer isolation pillar is located on the side of the dam structure close to the opening area; The isolation groove is formed on the first inorganic layer of the opening encapsulation area, and the isolation groove is located between the outer isolation pillars.

2. The display substrate according to claim 1, characterized in that, The isolation trench includes a first isolation trench located between a first isolation pillar and a second isolation pillar. The first isolation trench is filled with a first organic layer, which extends beyond the first isolation pillar and the second isolation pillar in the thickness direction of the display substrate.

3. The display substrate according to claim 2, characterized in that, The first organic layer is a pixel definition layer, and the first inorganic layer is an interlayer dielectric layer.

4. The display substrate according to claim 2, characterized in that, The isolation trench includes a second isolation trench, which is filled with a second organic layer. The second organic layer in the second isolation trench is lower than the second organic layers on both sides of the second isolation trench in the thickness direction of the display substrate.

5. The display substrate according to claim 4, characterized in that, There are multiple second isolation slots, with a maximum of one second isolation slot between two adjacent outer isolation columns.

6. The display substrate according to claim 4, characterized in that, There are multiple second isolation slots, and at least one set of adjacent outer isolation columns has multiple second isolation slots.

7. The display substrate according to claim 4, characterized in that, The second isolation groove is located between the third isolation post and the fourth isolation post, which are the two isolation posts closest to the opening area.

8. The display substrate according to any one of claims 4-7, characterized in that, The second organic layer is an electroluminescent layer.

9. The display substrate according to claim 1, characterized in that, The slope angle of the isolation groove ranges from 30 degrees to 50 degrees, wherein the slope angle is the acute angle formed by the side surface and the bottom surface of the isolation groove, and the bottom surface is a surface parallel to the substrate plane.

10. A display screen, characterized in that, The display screen includes the display substrate according to any one of claims 1-9.

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