Electronic device packaging method
By employing a gradient protection system of UV adhesive damming and PIB sealant, the issues of cell isolation and interface compatibility in flexible perovskite solar cell encapsulation are resolved, achieving high reliability and flexible encapsulation effects, suitable for wearable electronics and building-integrated photovoltaic applications.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-29
- Publication Date
- 2026-04-07
AI Technical Summary
Existing flexible perovskite solar cell encapsulation technology cannot effectively achieve electrical and environmental isolation between cells, resulting in insufficient interface compatibility and difficulty in controlling thermomechanical stress, leading to poor device reliability and stability.
A closed dam is formed using UV adhesive, combined with a gradient protection system of PIB sealant and water-oxygen barrier film. The process involves first applying UV adhesive to form a protective layer, then applying PIB sealant and covering with a barrier film, to achieve unitized independent packaging.
It improves the safety and controllability of the packaging process, prevents cross-contamination of processes, enhances the reliability and flexibility of devices, avoids global failure caused by local damage, and is suitable for flexible and wearable applications.
Smart Images
Figure CN121815929A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of device packaging technology, and in particular to a method for packaging electronic devices. Background Technology
[0002] In the field of photovoltaic technology, flexible perovskite solar cells have become a research hotspot for next-generation photovoltaic devices due to their lightweight, bendability, high power conversion efficiency, and low-cost solution processing potential. As the technology advances towards commercialization, in order to realize their large-scale application in integrated energy systems, wearable electronics, building-integrated photovoltaics, and other scenarios, there is an urgent need to fabricate highly uniform and reliable micro-device arrays on large-area flexible substrates (e.g., with dimensions of 300mm × 300mm and above).
[0003] However, the organic-inorganic hybrid perovskite materials used in flexible perovskite solar cells are extremely sensitive to environmental factors such as moisture and oxygen, and their long-term stability has become one of the core bottlenecks restricting their industrialization. Therefore, efficient and reliable encapsulation technology is a key factor in ensuring the lifespan of the devices. Currently, most mainstream encapsulation solutions in the industry borrow from the processes of traditional silicon-based photovoltaic modules, employing film lamination encapsulation. This involves using a solid encapsulation film (such as ethylene-vinyl acetate copolymer, polyolefin elastomer, etc.) and a barrier film to seal the device through hot-press lamination.
[0004] Although this technology is maturely applied in silicon solar cell packaging, its application in flexible perovskite microdevice arrays reveals a series of inherent defects, mainly including: 1. Inability to achieve electrical and environmental isolation between cells: Continuous adhesive film layers form interconnected water and oxygen diffusion channels between adjacent microdevices. Once the packaging edge or a local location in the array is damaged, moisture can rapidly penetrate laterally along the adhesive film layer, triggering a chain reaction of failures in adjacent cells and even the entire array, severely reducing the overall reliability of the system. 2. Insufficient interface compatibility and filling performance: The high temperature and pressure required for lamination can easily cause the thermally unstable perovskite active layer to decompose or degrade. At the same time, the adhesive film may overflow into electrode scratch areas or undesigned areas during flow, causing short circuits or performance degradation. For devices with micro-nano structures or uneven surfaces, the adhesive film is difficult to completely fill, easily leaving voids that become weak points for water and oxygen intrusion. 3. Difficulty in controlling thermomechanical stress: The shrinkage stress generated during the hot pressing and subsequent cooling and curing process of the adhesive film can easily cause the flexible substrate to curl or warp, or introduce microcracks in the perovskite film and functional layer, thereby damaging the mechanical integrity and photoelectric performance consistency of the device.
[0005] Therefore, existing technologies still need to be improved and developed. Summary of the Invention
[0006] In view of the shortcomings of the prior art, the purpose of this invention is to provide an electronic device packaging method that aims to solve the problem that existing array-type electronic devices cannot achieve cell isolation.
[0007] The technical solution of the present invention is as follows: This invention provides a method for packaging electronic devices, the method comprising the following steps: S1. Provide a substrate and fabricate arrayed electronic devices on the surface of the substrate; S2. Apply the first adhesive to the active area of the electronic device and allow it to cure. S3. Apply the first adhesive around the individual electronic component, let it cure, and form a closed dam. S4. Apply a second layer of adhesive to the outside of the dam. S5. Cover the surface of the electronic device with a water-oxygen barrier film to complete the encapsulation; The first adhesive includes UV adhesive, and the second adhesive includes one of PIB sealant, fluoropolymer, tetrafluoroethylene-vinyl ether copolymer, TPU polyurethane, and polyisobutylene diacrylate.
[0008] Optionally, the electronic device includes a flexible perovskite solar cell, an organic photovoltaic solar cell, or an organic light-emitting diode.
[0009] Optionally, the curing method includes UV curing, low-temperature curing, room-temperature curing, and two-component chemical curing.
[0010] The present invention has the following beneficial effects: This invention provides an electronic device packaging method that, compared to existing technologies, achieves the following significant and beneficial technical effects: 1. By using a first adhesive to form a closed dam around a single electronic device, an active and pre-set chemically inert barrier is constructed. This barrier effectively isolates the subsequently applied sealant (e.g., PIB sealant) from the active areas of the electronic device (especially perovskite materials), thereby fundamentally preventing the components in the sealant from contaminating or corroding sensitive functional layers such as perovskite. Simultaneously, the selected UV adhesive (first adhesive) possesses good flexibility, adapting to the bending deformation of flexible electronic devices, ensuring that the dam structure does not crack during device bending and maintaining its stable isolation and protection function. 2. By establishing a "protection first, sealing later" process flow of "first applying the first adhesive (UV adhesive) to form a protective dam, then applying the second adhesive (e.g., PIB sealant) for main sealing," this rigorous process sequence logically ensures that a robust and reliable protective barrier has been pre-constructed before the introduction of potentially contaminating second adhesive. This process design significantly enhances the safety and controllability of the encapsulation process, effectively preventing cross-contamination and ensuring device reliability. 3. By applying different functional adhesives in separate zones, a functional spatial division is achieved between the "UV adhesive protection zone" (acting as an inert barrier) and the "PIB adhesive sealing zone" (acting as the main seal and water / oxygen barrier). This zoned design allows the UV adhesive and the secondary adhesive to leverage their respective material advantages (such as the rapid curing, chemical inertness, and flexibility of the UV adhesive, and the high water / oxygen barrier performance and viscoelasticity of the PIB adhesive) while mitigating their respective disadvantages (such as the potential insufficient water / oxygen barrier capacity of the UV adhesive, and the potential contamination of the perovskite by the PIB adhesive). This collaborative encapsulation strategy, where each component performs its specific function, optimizes overall encapsulation performance and reliability while ensuring the safety of the core functional areas. Attached Figure Description
[0011] Figure 1 This is a flowchart of the packaging process for a single electronic device in a preferred embodiment of the present invention; Figure 2 This is a flowchart of the fabrication process for the entire plate in a preferred embodiment of the present invention. Detailed Implementation
[0012] This invention provides a method for packaging electronic devices. To make the objectives, technical solutions, and effects of this invention clearer and more explicit, the invention is further described in detail below. It should be understood that the specific embodiments described herein are only for explaining this invention and are not intended to limit this invention.
[0013] Based on this, embodiments of the present invention provide an electronic device packaging method, the flowchart of which is shown below. Figure 1 The method includes the following steps: S1. Provide a substrate and fabricate arrayed electronic devices on the surface of the substrate; S2. Apply the first adhesive to the active area of the electronic device; S3. Apply the first adhesive around the individual electronic component to form a closed dam; S4. Apply a second layer of adhesive to the outside of the dam. S5. Cover the surface of the electronic device with a water-oxygen barrier film to complete the encapsulation; The first adhesive includes UV adhesive, and the second adhesive includes one of PIB sealant, fluoropolymer, tetrafluoroethylene-vinyl ether copolymer, TPU polyurethane, and polyisobutylene diacrylate.
[0014] The packaging method provided in this invention achieves high-reliability packaging of electronic devices through synergistic innovation in structural design and material processing. The steps and technical effects are described below: I. On the Gradient Multi-layer Protection System This embodiment constructs a three-tiered protection system in space through the sequential steps of "applying the first adhesive to the active area → applying the first adhesive around the device to form a dam → applying the second adhesive to the outside of the dam → covering the entire surface with a water and oxygen barrier film," which consists of "unit active area protection – dam area isolation – edge sealing and full-surface coverage." Specifically, the first level (active area protection): flexible UV adhesive (the first adhesive) is directly applied to the surface of sensitive active materials such as perovskite to form an initial protective layer that adheres tightly to the functional layer. This adhesive layer cures rapidly under UV irradiation, which can initially fix the surface of the active layer, isolate it from physical contact contamination that may be introduced by subsequent processes, and provide it with the first curing barrier. The second level (dam area isolation): the closed UV adhesive dam constructed around the individual device has a function far beyond simple physical barrier. It establishes a robust barrier of chemical inertness and physical isolation between the active area and the external environment (especially the subsequently applied second adhesive). This barrier fundamentally blocks the diffusion path of migratory small molecules or ions (such as oligomers in PIB and certain additives) that may exist in the second adhesive to the perovskite active layer, solving the problem of device performance degradation that may be caused by the encapsulation material itself. The third level (edge sealing and full coverage): A second adhesive (such as PIB sealant) with excellent viscoelasticity and high gas barrier properties is applied to the outer area of the dam, and a complete water and oxygen barrier film is then applied. This layer constitutes the main sealing structure of the encapsulation, primarily responsible for blocking the longitudinal penetration of external water vapor and oxygen, and providing mechanical buffering and stress release for the entire component. The full coverage of the barrier film further enhances the integrity of the first two levels of protection.
[0015] This gradient system achieves progressively enhanced protective functions and zoned responsibility. The inner layer (UV adhesive) focuses on chemical compatibility and precision protection, while the outer layer (second adhesive and barrier film) focuses on environmental isolation and overall sealing. This architecture significantly improves the encapsulation's comprehensive resistance to various failure factors (chemical invasion, water and oxygen, stress).
[0016] II. On the concept of unitized independent packaging The embodiments of the present invention abandon the traditional "overall interconnected" encapsulation mode of film lamination. By constructing a UV adhesive dam for each unit device, the large-area flexible array is essentially divided into multiple miniature, environmentally isolated independent encapsulation units at the encapsulation structure level.
[0017] Each sealed cavity, consisting of a UV adhesive dam, an upper barrier film, and part of the substrate, is an independent sealed unit. The closed structure of the dam not only blocks lateral chemical diffusion between materials but also cuts off the continuous channel for water and oxygen to diffuse laterally along the interlayer interface. Even if the edge encapsulation or barrier film of a unit is partially damaged in subsequent applications, water and oxygen intrusion will be confined within the dam of that unit and cannot diffuse to adjacent units through the continuous adhesive layers.
[0018] This design completely eliminates the cascading failure risk of "a single point of damage leading to global failure" caused by "continuous adhesive film" in traditional laminated packaging. It greatly improves the overall robustness and long-term reliability of array devices under localized damage conditions, making it particularly suitable for flexible, wearable, and other applications with stringent reliability requirements.
[0019] III. Collaborative Design of Materials and Processes This embodiment does not simply replace materials, but achieves a synergistic effect of "1+1>2" by deeply matching the sequence of steps with the material properties.
[0020] Application of UV adhesive: Utilizing its rapid light curing properties (it can be set within seconds), it can quickly form a stable dam structure after coating, providing precise spatial positioning and a reliable protective barrier for subsequent processes, realizing a reliable process flow of "protection first, sealing later".
[0021] The use of a second adhesive (such as PIB adhesive): A material with high elasticity, low modulus, and high water and oxygen barrier properties is selected as the main sealing material. Its high elasticity can absorb and release the stress generated when the device is bent or twisted, avoiding stress concentration in the brittle perovskite layer; its low modulus and high barrier properties simultaneously meet the dual requirements of flexible deformation and long-term sealing.
[0022] The pre-cured UV adhesive dam provides a clear boundary for the PIB adhesive coating, preventing it from contaminating the active area. The PIB adhesive coating then fills the gaps outside the dam and combines with the barrier membrane to complete the final seal. The barrier membrane, as a unified upper cover, integrates and protects the overall structure.
[0023] By combining the rapid and precise positioning of UV adhesive with the flexible and high-barrier sealing of PIB adhesive, and the comprehensive protection of the water and oxygen barrier film, this embodiment achieves an efficient and controllable manufacturing process. In terms of performance, it simultaneously meets the requirements of extremely high environmental stability of the package and the necessary mechanical flexibility of the device, thus resolving the long-standing contradiction between reliability (lifetime) and functionality (flexibility) in flexible perovskite device packaging.
[0024] In summary, the embodiments of the present invention provide a highly reliable, highly flexible, and mass-producible packaging solution for electronic devices through an innovative three-level protection architecture, modular independent packaging design, and synergistic optimization of materials and processes.
[0025] Additionally, it should be noted that the necessity of steps S2-5 depends on the subsequent updates to the material system. For example, the curing adhesive in step S2-3 or the PIB adhesive in step S4 can be directly applied to the surface for integral molding, and the barrier film in step S5 may not even be necessary. This depends on the barrier performance of the above materials and the actual application of the product. Some application scenarios do not require stringent sealing conditions, so all of the above steps are unnecessary.
[0026] In some embodiments, the electronic device includes flexible perovskite solar cells, organic photovoltaic solar cells, and organic light-emitting diodes.
[0027] In some embodiments, the curing method includes UV curing, low-temperature curing, room-temperature curing, and two-component chemical curing.
[0028] This invention provides a method for encapsulating, leading out electrodes, and separating individual cells in an array-type perovskite solar cell. The detailed process is as follows: Figure 2 As shown, the specific steps include: Step 1: Device Fabrication: A flexible substrate is provided, which can be selected from materials such as polyimide, polyethylene terephthalate, or surface-insulated metal foil. Multiple perovskite photovoltaic units arranged in an array are fabricated on this flexible substrate using processes such as coating, patterning, and vacuum deposition. Electrical isolation between the units is achieved through physical scribing or insulating channels, forming the desired micro-device array.
[0029] Step 2: Applying a protective barrier: Using precision dispensing equipment or inkjet printing equipment, precisely apply a layer of flexible UV-curable adhesive (i.e., the first adhesive) to the surface and surrounding edges of all perovskite units. This coating operation should ensure that: ① the active area on the upper surface of each perovskite unit is covered by a continuous and uniformly thick layer of UV adhesive; ② the UV adhesive forms a continuous, closed, and sufficiently high annular barrier structure around each unit, thereby physically and chemically defining and initially encapsulating the individual unit. The flexible UV adhesive should be selected based on good chemical compatibility with the perovskite material and an appropriate elastic modulus after curing. Its function is to establish an inert and dense protective barrier between the perovskite layer and the subsequent encapsulation material. This barrier must effectively prevent the penetration or diffusion of sealant components (such as low molecular weight components in PIB adhesive) used in subsequent steps into the perovskite layer.
[0030] Step 3: Edge Sealing with PIB (Polyisobutylene) Sealant: After completing Step 2, the cleared edge areas on the substrate (i.e., the outer perimeter of the array and the blank areas between cells not covered by the perovskite layer and UV adhesive) are designated as sealing areas. Using a dispensing device, PIB sealant or other high-barrier adhesive is applied to this area. At this point, the continuous barrier formed by the pre-applied but not fully cured UV adhesive (or pre-cured and set) from Step 2 constitutes a clear physical barrier, ensuring a safe, non-direct-contact space between the PIB sealant and the perovskite cells, fundamentally avoiding potential contamination of the perovskite active layer by the PIB component.
[0031] Step 4, Coating and Step-by-Step Curing: A single sheet of water and oxygen barrier film (such as a composite aluminum-plastic film or flexible ceramic barrier film) is applied to the entire substrate surface, ensuring full contact with the UV adhesive layer and the PIB sealant layer. Step-by-step curing is then performed: ① UV Adhesive Curing: First, ultraviolet light is applied from above the barrier film or through the substrate to fully cure the flexible UV adhesive. After curing, the UV adhesive forms a robust and elastic protective structure and dam, providing a stable primary encapsulation and isolation wall for each unit. ② PIB Adhesive Curing: After the UV adhesive has cured, the PIB sealant is fully cured by heating, allowing it to stand at room temperature, or using other curing methods suitable for the selected second adhesive. After curing, the PIB sealant exhibits strong adhesion and high elasticity, bonding tightly to the barrier film and substrate, forming the final primary sealing structure at the edges and gaps of the array, effectively blocking the intrusion paths of water and oxygen.
[0032] Step 5, Electrode Lead-Out: For devices requiring external electrical connections, the electrodes are led out from the perovskite unit area tightly protected by UV adhesive. The led-out electrode wires or conductive patterns extend to the "safe zone" (i.e., the UV adhesive surface area not directly covered by PIB adhesive or a specially reserved conductive channel) between the UV adhesive dam and the surrounding PIB sealant. Subsequently, in this safe zone, the partially covered adhesive layer or barrier film is removed using processes such as laser windowing, mechanical peeling, or photolithography to expose the electrode contact points. Finally, welding or conductive adhesive bonding is performed to achieve the connection of the external circuit. This design ensures that the electrode lead-out process does not damage the integrity of the main sealing area, while avoiding the direct impact of welding thermal stress or flux on the perovskite active area.
[0033] This embodiment achieves highly reliable and flexible unitized packaging of flexible perovskite array devices through the above-mentioned "isolation, sealing, and lead-out" process and the functional partitioning design in space, and lays the foundation for direct processing for their subsequent individualized separation and application.
[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of this invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.
[0035] It should be understood that the application of the present invention is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.
Claims
1. A method for packaging electronic devices, characterized in that, The method includes the following steps: S1. Provide a substrate and fabricate arrayed electronic devices on the surface of the substrate; S2. Apply the first adhesive to the active area of the electronic device and allow it to cure. S3. Apply the first adhesive around the individual electronic component, let it cure, and form a closed dam. S4. Apply a second layer of adhesive to the outside of the dam. S5. Cover the surface of the electronic device with a water-oxygen barrier film to complete the encapsulation; The first adhesive includes UV adhesive, and the second adhesive includes one of PIB sealant, fluoropolymer, tetrafluoroethylene-vinyl ether copolymer, TPU polyurethane, and polyisobutylene diacrylate.
2. The electronic device packaging method according to claim 1, characterized in that, The electronic devices include flexible perovskite solar cells, organic photovoltaic solar cells, and organic light-emitting diodes.
3. The electronic device packaging method according to claim 1, characterized in that, The curing methods include UV curing, low-temperature curing, room-temperature curing, and two-component chemical curing.