Camera module comprising encapsulated super optical element

Abstract

The present disclosure describes an apparatus comprising a camera module comprising an optical stack attached over an image sensor. In an example, at least a portion of the optical stack without the air gap includes an aperture stop and a first substrate with a packaged super optical element (MOE) on the first substrate. The invention further discloses a method for manufacturing the camera module.

Description

Technical Field

[0001] This disclosure relates to a camera module including encapsulated super-optical devices. Background Technology

[0002] In many camera modules, multiple refractive lenses are stacked together, for example, within a lens barrel or using wafer-level optics. However, refractive systems involve variations in refractive index between different optical surfaces. At each interface with a varying refractive index, undesirable reflections can occur, and it may be necessary to add an anti-reflective coating at all or some of the interfaces. Summary of the Invention

[0003] This disclosure describes a camera module that includes encapsulated super-optical devices.

[0004] For example, in one aspect, this disclosure describes an apparatus including a camera module. The camera module includes an optical stack directly or indirectly attached to an image sensor. At least a portion of the optical stack includes an aperture stop and a first substrate having a packaged super-optical element (MOE) on the first substrate. This portion of the optical stack has no air gap.

[0005] Some implementations include one or more of the following features. For example, in some implementations, the MOE is encapsulated by optically transparent glass or a polymer. In some implementations, the MOE is encapsulated by a material whose refractive index matches that of the first substrate. In some implementations, the MOE is encapsulated by an adhesive.

[0006] In some embodiments, the device is configured such that light entering the camera module does not encounter an internal interface with a high refractive index contrast. In some embodiments, at least some adjacent elements and / or layers of the optical stack (i.e., elements and / or layers adjacent to each other) are substantially refractively matched to each other.

[0007] In some embodiments, an aperture stop is disposed on the surface of a first substrate. In some embodiments, this portion of the optical stack further includes a second substrate, and the aperture stop is disposed on the surface of the second substrate.

[0008] In some embodiments, this portion of the optical stack includes a second substrate having an encapsulated MOE on the second substrate. In some embodiments, this portion of the optical stack includes a third substrate disposed between the first and second substrates, and an aperture stop disposed on the surface of the third substrate.

[0009] In some embodiments, this portion of the optical stack includes at least one of a bandpass filter or an angle-of-incident filter. In some embodiments, this portion of the optical stack includes an optically transparent spacer.

[0010] In some implementations, edge blacking is included on the sidewalls of the camera module.

[0011] In some embodiments, a second aperture is present on the surface of the optical stack, wherein the second aperture is defined by a layer of black chromium or black photoresist.

[0012] In some embodiments, the camera module includes a cover glass disposed above an image sensor, wherein the optical stack is attached to the cover glass using a refractive index-matching adhesive. In some embodiments, the MOE has the same rectangular aspect ratio as the image sensor. In some embodiments, the camera module is attached to an optically clear glass support. In some embodiments, the optically clear glass support forms a component of a windshield, rearview mirror, glasses, augmented reality (AR) head-mounted display, virtual reality (VR) head-mounted display, or mixed reality (MR) head-mounted display.

[0013] This disclosure also describes an apparatus comprising a camera module including an image sensor and an optical stack attached to the image sensor. At least a portion of the optical stack includes an aperture stop and a first substrate having encapsulated superoptical elements (MOEs) on the first substrate. This portion of the optical stack has no air gaps except for the voids between adjacent superatoms of the MOEs.

[0014] This disclosure also describes a method for manufacturing a camera module. The method includes forming a wafer-level optical stack, wherein at least a gapless portion of the optical stack includes an aperture stop and a first substrate, on which a packaged super-optical element (MOE) is having been disposed. The wafer-level optical stack is monolithized into individual modules, and at least one of the modules is attached to an image sensor.

[0015] In some embodiments, the method includes providing edge blackening to the sidewalls of the module, wherein the edge blackening material includes a black resist, a black epoxy resin, or another black polymer. In some embodiments, providing edge blackening includes partially dicing the wafer-level optical stack to form grooves, and filling the grooves with the edge blackening material.

[0016] Some implementations include one or more of the following advantages. For example, the MOE can be packaged without sacrificing the optical functionality for imaging objects at the sensor. Multiple substrates having packaged MOEs can be combined and formed into an optical stack. Furthermore, in some cases, the MOE can be integrated into the optical stack, where the MOE is in direct contact with other planar optical elements, such as filters and / or sensors. By using superlenses, fewer MOE lenses may be required in some cases to achieve good image quality. In some cases, these designs can be more compact compared to designs based on refractive optics when manufacturing tolerances are taken into account.

[0017] Using encapsulated super-optical devices can avoid air gaps in the optical stack. Furthermore, the optical stack can be attached, for example, to a cover glass over the image sensor using a refractive index-matching adhesive. Therefore, in some embodiments, light entering the camera module will not encounter internal interfaces with high refractive index contrast, and thus may not require an anti-reflective coating. In some embodiments, providing an optical stack in which at least some adjacent optical elements and / or layers are substantially refractively matched to each other can also help avoid or reduce problems associated with total internal reflection.

[0018] In some implementations, the lenses can be completely glued together, and no adhesive lines are required at the edges of the lenses. Additionally, in some cases, the superlens can be fabricated with the same rectangular aspect ratio as the image sensor, which allows for a further reduction in the lens's footprint. Furthermore, gluing the individual layers together in a single optical stack can help improve mechanical stability. Additionally, because there are no gaps in the optical stack, it is dustproof and, in some cases, waterproof.

[0019] Details of one or more embodiments of the invention are set forth in the accompanying drawings and the following description. Other aspects, features, and advantages will become apparent from the following detailed description, drawings, and claims. Attached Figure Description

[0020] Figure 1 A first example of a camera module including encapsulated super-optical devices is shown.

[0021] Figure 2 A second example of a camera module including encapsulated super-optical devices is shown.

[0022] Figure 3 A third example of a camera module including encapsulated super-optical devices is shown.

[0023] Figure 4 A fourth example of a camera module including encapsulated super-optical devices is shown.

[0024] Figure 5 A fifth example of a camera module including encapsulated super-optical devices is shown.

[0025] Figure 6 A sixth example of a camera module including encapsulated super-optical devices is shown.

[0026] Figure 7 A seventh example of a camera module including encapsulated super-optical devices is shown.

[0027] Figure 8 An eighth example of a camera module including encapsulated super-optical devices is shown.

[0028] Figure 9 A ninth example of a camera module including encapsulated super-optical devices is shown.

[0029] Figure 10 A tenth example of a camera module including encapsulated super-optical devices is shown.

[0030] Figure 11 An example method for manufacturing a camera module is shown.

[0031] Figure 12 An example of a camera module attached to another device is shown.

[0032] Similar reference symbols in the accompanying drawings denote similar elements. Detailed Implementation

[0033] This disclosure describes a camera module including a packaged super-optical device (MOE). The MOE employs planar optics and has a metasurface comprising distributed, small subwavelength structures (e.g., nanostructures or other superatoms) arranged to interact with light in a specific manner. The superatoms can interact with the light wave individually and / or collectively to alter the local amplitude, local phase, or both of the incident light wave. In some cases, MOEs can offer several potential advantages compared to refractive elements. For example, compared to refractive lenses, MOEs can have less surface area and less performance degradation due to tolerances.

[0034] According to this disclosure, an apparatus includes a camera module. The camera module includes an optical stack directly or indirectly attached to an image sensor (e.g., a CMOS image sensor). At least a gapless portion of the optical stack includes an aperture stop and a first substrate having a packaged super-optical element (MOE) on the first substrate.

[0035] Figure 1An example of a camera module 20 is shown, which includes an optical stack 22 attached to an image sensor 25 disposed in or on a support substrate 24. The support substrate 24 may be, for example, a printed circuit board (PCB) having external electrical connections (e.g., a ball grid array) 40 on its underside. The optical stack 22 includes a first substrate 26 having an aperture 28 defined, for example, by a layer of black chromium or black resist 27 on one side of the substrate 26. The first substrate 26 is optically transparent and may be made of, for example, glass. The optical stack 22 also includes an optically transparent envelope (MOE) 29 on the opposite side of the substrate 26. The MOE 29 is encapsulated (e.g., embedded or buried) by an encapsulation layer 30, which may be made of, for example, an optically transparent material (such as glass or a polymer). In the context of this application, optical transparency indicates that the material is optically transparent to a specified operating wavelength (e.g., in the infrared, UV, or visible portion of the spectrum). The material used for the encapsulation layer 30 should be substantially optically refractive-index matched to the substrate 26. In some embodiments, an adhesive (e.g., a bonding agent) may be used as an encapsulation material. In some embodiments, the optical stack 22 includes one or more additional optical elements. For example, in some cases, the optical stack 22 includes an optical filter (e.g., a bandpass filter or an angle of incidence filter) 32, which can be attached to the encapsulation layer 30 by an adhesive 31 (e.g., a bonding agent). In some embodiments, an anti-reflective coating (ARC) layer 23 is disposed between the first substrate 26 and a black chromium or photoresist 27 defining an aperture 28.

[0036] like Figure 1 As shown, there are no air gaps between the various optical elements and layers in the optical stack 22. This arrangement can help reduce or eliminate unwanted reflections that might otherwise occur, for example, at the air / lens interface.

[0037] like Figure 1 As illustrated, in some embodiments, a cover glass 36 is disposed above the image sensor 25 and may be attached to a support substrate 24, for example, via spacers 38. In the illustrated example, the opposite (upper) sides of the cover glass 36 are attached to the bottom of the stack 22 (e.g., to an optical filter 32) via an adhesive 34 (e.g., an adhesive). Preferably, the various optical elements and layers are substantially optically matched to each other in refractive index. That is, preferably, the refractive indices of the various optical elements and layers (i.e., the substrate, encapsulation material, and adhesive) in the stack 22 deviate from each other by no more than 0.2 in refractive index.

[0038] Various implementations may include additional and / or different elements in the optical stack. For example, some implementations include multiple MOEs on a respective substrate. In some implementations, the location of the aperture may differ from... Figure 1 Examples. The aperture stop can be on the same substrate as the MOE or on a separate substrate. Some implementations include spacers as components of the optical stack. Further, in some implementations, the positions of the optical filters in the stack can be... Figure 1 The positions differ. In some cases, there are no air gaps between any components and layers in the optical stack. Examples of camera modules that include one or more of the aforementioned features are described below.

[0039] Figure 2 An example of a camera module 120 including an optical stack 122 has a first MOE substrate 126 and a second MOE substrate 126B, with a first MOE 129A disposed on the first MOE substrate 126 and a second MOE 129B disposed on the second MOE substrate 126B. An aperture substrate 127, for example made of glass, is disposed between the first and second MOE substrates 126A and 126B and has a layer of black chromium or black resist 127A on its surface, which defines an aperture stop 128. Each of the MOEs 129A and 129B is encapsulated by corresponding encapsulation layers 130A and 130B. The stack 122 also includes an optical filter 132 (e.g., a bandpass filter or an angle of incidence filter). (As described above...) Figure 1 The various optical elements and layers in the stack can be attached to each other, for example, by a corresponding adhesive (e.g., adhesive layer) 150. Similarly, the optical stack 122 can be joined in a manner similar to that described above. Figure 1 The described method is attached to the image sensor 25. For example... Figure 2 As shown, there are no air gaps between the various optical elements and layers in the optical stack 122. In some embodiments, an ARC layer 123 may be applied to the encapsulation material 130A.

[0040] Figure 3 An example of camera module 220 is shown, which is similar to Figure 2 The camera module 120 differs in that the camera module 220 also includes another layer of black chrome or black resist 230, which defines an aperture stop 240 on the outer (upper) surface of the module.

[0041] Figure 4 Another example of a camera module 320 is shown. Similar to... Figure 2 For example, module 320 includes an optical stack 322 having a first MOE substrate 126A and a second MOE substrate 126B, with a first MOE 129A disposed on the first MOE substrate 126A and a second MOE 129B disposed on the second MOE substrate 126B. In this case, instead of... Figure 2 In the example of a separated aperture substrate, Figure 4 The optical stack 322 includes a layer of black chromium or black resist 127A on the surface of the first MOE substrate 126A to define an aperture stop 128. Similarly, the various optical elements and layers in the stack 322 can be attached to each other, for example, by a corresponding adhesive (e.g., adhesive layer) 150. Likewise, the optical stack 322 can be combined in a manner similar to that described above. Figure 1 The described method is attached to the image sensor 25. For example... Figure 4 As shown, there are no air gaps between the various optical elements and layers in the optical stack 322.

[0042] Figure 5 It shows something similar to Figure 4 Another example of the camera module 420. However, instead of providing a layer of black chromium or black resist on the surface of the first MOE substrate 126A to define the aperture stop, Figure 5 One implementation includes a layer of black chromium or black resist 127B on the surface of a second MOE substrate 126B to define an aperture stop 128. For example... Figure 5 As shown, there are no air gaps between the various optical elements and layers in the optical stack 422.

[0043] Optical filters (if included) can be positioned in the stack at locations different from those shown in the preceding examples. The thickness of the filters can be adjusted based on the optical design of the camera module. For example, Figure 6 It shows something similar to Figure 5 The camera module 520 of the module differs in that the optical filter 132 (e.g., a bandpass filter and / or an angle-of-incident filter) is located at or near the top of the optical stack 522, rather than at or near the bottom of the stack. Figure 6 As shown, there are no air gaps between the various optical elements and layers in the optical stack 522.

[0044] Some implementations of the camera module include one or more spacers that facilitate proper vertical alignment and focusing of the light signal onto the image sensor. The spacers may be made of, for example, an optically transparent material (e.g., glass). Figure 7 An example of a camera module 620 with an optical stack 622 is shown, the optical stack 622 including spacers 650 having the same X and Y dimensions as the optical stack. Figure 8 An example of a camera module 720 is shown, comprising an optical stack 722 including spacers 750 with openings. Figure 8In the example, the bottom of the optical stack 722 has an air interface. However, even in this case, the portion of the optical stack including the aperture stop and the substrate has no air gap, and the substrate has a packaged super-optical element (MOE).

[0045] In some implementations, edge blackening can be applied, for example, to the edges of optical stacks to reduce stray light. Figure 9 It shows something similar to Figure 5 The example includes a camera module 820, but also includes edge blackening 850. Edge blackening 850 may be made of, for example, a black resist, a black polymer, black chrome, or a black coating. In some embodiments, a molded black housing may be applied over the entire module. Edge blackening may be applied to any other embodiments described in this disclosure.

[0046] The camera module 820 includes an optical stack 822 having a first MOE substrate 126A and a second MOE substrate 126B. A first MOE 129A is disposed on the first MOE substrate 126A, and a second MOE 129B is disposed on the second MOE substrate 126B. Each of MOEs 129A and 129B is encapsulated by a corresponding encapsulation layer 130A and 130B. The encapsulation layers 130A and 130B may be made of, for example, an optically transparent material (such as glass or a polymer). The material used for the encapsulation layers 130A and 130B should be substantially optically refractive-index matched to the corresponding substrates 126A and 126B. In some embodiments, an adhesive (e.g., bonding agent) may be used as an encapsulation material and may be applied during the stacking process.

[0047] A layer of black chromium or black resist 127A is provided on the surface of the first MOE substrate 126A to define an aperture stop 128 for imaging. Thus, the aperture 128 is sandwiched between the first and second MOE substrates 126A, 126B. The imaging module 820 also includes another layer of black chromium or black resist 230, which defines another aperture stop 240 at the outer (top) surface of the module. In some cases, this aperture 240 can help control stray light in the module. This feature may also be included in any other embodiments described in this disclosure. The stack 822 may further include an optical filter 132 (e.g., a bandpass filter and / or an angle of incidence filter) between the superlens stack and the image sensor. Various optical elements and layers in the stack can be attached to each other, for example, by a corresponding adhesive (e.g., adhesive layer) 150. The optical stack 822 may be attached to the image sensor cover glass 36, for example, by an adhesive (e.g., adhesive 34).

[0048] Preferably, the various optical elements and layers in the stack 822 are substantially optically refractively matched to each other. That is, preferably, the refractive indices of the various optical elements and layers (i.e., the substrate, encapsulation material, and adhesive) in the stack 822 deviate from each other by no more than 0.2. Figure 9 As shown, there are no air gaps between the various optical elements and layers in the optical stack 822.

[0049] In some implementations, the MOE is encapsulated by adding a layer of optically transparent material (e.g., glass, polymer) on top of the metasurface, allowing voids (e.g., air gaps) to exist between adjacent superatoms. For example, in some cases, a piece of glass can be bonded onto the MOE. In other cases, a layer can be deposited on the top surface of the MOE, allowing voids (e.g., air gaps) to remain between adjacent superatoms. Figure 10 It shows something similar to Figure 4 An example of a camera module 1020 differs in that there are gaps (e.g., air gaps) 1021 between adjacent superatoms 1023 of the packaged MOE 129C. In this case, the camera module 1020 includes an optical stack 1022 attached to the image sensor 25, wherein at least a portion of the optical stack has no air gaps (except for the gaps between adjacent superatoms) and includes an aperture stop 127A and a first substrate 126A on which the packaged superoptical element (MOE) 129C is located. In this case, the height of the air gap 1021 is no greater than the height of the superatoms 1023.

[0050] In some cases, the camera module has alignment marks to facilitate lens alignment over the sensor. In some cases, self-alignment occurs due to capillary forces (e.g., when the cover glass and optical stack have the same lateral dimensions). In some cases, the camera module may include one or more anti-reflective coatings (ARC). In some cases, the cover glass may be placed directly on the photosensitive surface of the image sensor. In some cases, the optical stack is directly glued to the image sensor without any cover glass.

[0051] like Figure 11As shown, as part of the manufacturing or assembly process of a camera module, the various layers used for optical stacking (e.g., one or more wafers, each including a super optics device, an aperture stop, and a filter) are attached (e.g., by adhesives such as adhesive glue) to each other (1000). Glass wafers for the super optics devices can be stacked during the manufacturing process, for example, at the wafer level. In some cases, the wafers may have reference marks to align the entire wafer. In some cases, optical filters (e.g., bandpass filters or AOI filters) can be added at the wafer level. The wafer-level stack can then be monolithized (e.g., diced) into individual modules (1002). In some cases, optical filters can be added at the unit level rather than the wafer level. Next, the modules are aligned and attached to the image sensor (1004). Edge blackening can also be provided to the sidewalls of each camera module (1006).

[0052] In some implementations, prior to the assembly of the optical stack with the image sensor, the wafer-level optical stack is partially diced to form grooves, which are then filled with an edge-blackening material (e.g., black resist, black epoxy, or other polymers). The wafer-level optical stack is then diced through its entire thickness to separate the stack into individual modules. In some implementations, edge blackening (e.g., by spraying) can be provided after the stack has been separated into individual camera modules. In some cases, the aforementioned process can avoid the need for separate housings (e.g., lens barrels) for the camera modules and, in some cases, facilitates the control of stray light.

[0053] In some cases, the active region of the MOE structure can have a rectangular shape factor similar to that of an image sensor. In some embodiments, a virtual structure consisting of, for example, cylindrical pillars can be provided around the active region of the MOE structure. In some cases, such an arrangement can improve the flow of adhesives (e.g., bonding agents).

[0054] Various advantages can be achieved in some implementations. For example, using encapsulated super-optical devices eliminates the need for air gaps in the optical stack. The optical stack can be, for example, attached to a cover glass above the image sensor using a refractive index-matching adhesive. Therefore, in some implementations, light entering the camera module does not encounter an internal interface with high refractive index contrast, and thus may not require an anti-reflective coating.

[0055] Matching the refractive indices of optical elements and layers in a stack can provide additional advantages in some implementations. For example, in designs with a wide field of view (FOV), some rays will have relatively high angles of incidence, which can pose problems for designs incorporating planar optics (e.g., superlenses) because total internal reflection (TIR) ​​occurs for rays propagating from higher to lower refractive indices at high angles. However, TIR should be eliminated or reduced to allow more imaging light to pass through the lens system and to avoid trapped rays that may produce stray light. In systems using conventional optics (i.e., refractive optics), the curvature of the lens surface can be used to reduce or minimize the angle of incidence of the surface normal. In contrast, for systems using planar optics (e.g., superlenses), the curvature of the lens cannot be used to address TIR. Instead, providing an optical stack in which elements and layers are substantially refractively matched to each other allows the optical system to take advantage of the characteristics of planar optics while also avoiding or reducing TIR. Furthermore, for aperture stops centered in the optical stack of lens elements, TIR near the stop can be avoided by providing a stack structure with a refractive index-matching adhesive. As described above, in some embodiments, the refractive indices of the various optical elements and layers (i.e., substrates, sealants, and adhesives) in the stack are substantially matched such that they deviate from each other in refractive index by no more than 0.2.

[0056] Furthermore, in some embodiments, the lenses can be completely cemented together, and no adhesive lines are required at the edges of the lenses. Additionally, in some cases, the superlens can be fabricated with the same rectangular aspect ratio as the image sensor, which allows for a further reduction in the lens's footprint. Furthermore, cementing the individual layers together in a single optical stack can help improve mechanical stability. Using wafer-level stacking of lenses makes it easier to fabricate relatively complex optical systems, and allows for the parallel fabrication of many lenses.

[0057] As described above, one end of the optical stack (e.g., 22, 122, 322, 422, 522, 622, 722, 822) can be attached (e.g., by adhesive) to the cover glass of the image sensor. In some embodiments, the camera module can be embedded or otherwise integrated into the device, wherein a second end of the optical stack is attached to glass or other optically transparent support. For example, in some embodiments, the camera module is integrated into glasses or augmented reality head-mounted displays to provide in-mold eye tracking. In some embodiments, the camera module is integrated into a car windshield or a solar cell. In such embodiments, as Figure 12As shown, the camera module 1100 can be directly glued to the optically transparent glass support 1102 of a component forming an application device (e.g., a windshield, rearview mirror, glasses, augmented reality (AR) head-mounted display, virtual reality (VR) head-mounted display, mixed reality (MR) head-mounted display).

[0058] While this specification contains numerous details, these should not be construed as limiting the scope of this disclosure or the scope of any claims, but rather as descriptions of features specific to particular implementations. Certain features described in the context of separate embodiments may also be combined in the same embodiment. Conversely, various features described in the context of a single embodiment may also be implemented separately or in any suitable sub-combination in multiple embodiments. Various modifications may be made to the foregoing examples. Therefore, other embodiments are also within the scope of the claims.

Claims

1. An apparatus including a camera module, wherein, The camera module includes: Image sensor; An optical stack, attached to the image sensor, wherein at least a gapless portion of the optical stack comprises: Aperture stop; and A first substrate having a packaged super-optical element (MOE) on the first substrate.

2. The apparatus according to claim 1, wherein, The MOE is encapsulated by optically transparent glass or polymer.

3. The apparatus according to any one of claims 1 to 2, wherein, The MOE is encapsulated by a material whose refractive index is optically matched to that of the first substrate.

4. The apparatus according to any one of claims 1 to 2, wherein, The MOE is encapsulated with adhesive.

5. The apparatus according to any one of claims 1 to 4, wherein, The aperture stop is disposed on the surface of the first substrate.

6. The apparatus according to any one of claims 1 to 4, wherein, The portion of the optical stack further includes a second substrate, wherein the aperture stop is disposed on the surface of the second substrate.

7. The apparatus according to claim 1, wherein, The portion of the optical stack further includes a second substrate having an encapsulated MOE on the second substrate.

8. The apparatus according to any one of claims 1 to 7, wherein, At least some adjacent elements and / or layers of the optical stack are substantially matched in refractive index with each other.

9. The apparatus according to claim 8, wherein, At least some adjacent elements and / or layers of the optical stack are substantially refractive index matched, such that they deviate from each other in refractive index by no more than 0.

2.

10. The apparatus according to claim 8, wherein, The portion of the optical stack further includes a third substrate disposed between the first substrate and the second substrate, wherein the aperture stop is disposed on the surface of the third substrate.

11. The apparatus according to any one of claims 1 to 10, wherein, The portion of the optical stack further includes at least one of a bandpass filter or an angle of incidence filter.

12. The apparatus according to any one of claims 1 to 11, wherein, The portion of the optical stack further includes an optically transparent spacer.

13. The apparatus according to any one of claims 1 to 12, comprising edge blackening on the sidewall of the camera module.

14. The apparatus according to any one of claims 1 to 13, comprising a second aperture on the surface of the optical stack, wherein, The second aperture is defined by a layer of black chromium or black resist.

15. The apparatus according to any one of claims 1 to 14, configured such that light entering the camera module does not encounter an internal interface having a high refractive index contrast.

16. The apparatus according to any one of claims 1 to 15, wherein, The MOE has the same rectangular aspect ratio as the image sensor.

17. The apparatus of claim 1, further comprising a cover glass disposed above the image sensor, wherein, The optical stack is attached to the cover glass using a refractive index matching adhesive.

18. The apparatus according to any one of claims 1 to 17, further comprising an optically transparent glass support, wherein, The camera module is attached to the optically transparent glass support.

19. The apparatus according to claim 18, wherein, The optically transparent glass support forms a component of a windshield, rearview mirror, glasses, augmented reality (AR) head-mounted display device, virtual reality (VR) head-mounted display device, or mixed reality (MR) head-mounted display device.

20. An apparatus including a camera module, wherein, The camera module includes: Image sensor; An optical stack, attached to the image sensor, wherein at least a portion of the optical stack comprises: Aperture stop; and A first substrate having a packaged super-optical element (MOE) on the first substrate. The portion of the optical stack has no air gaps except for the gaps between adjacent superatoms of the MOE.

21. A method for manufacturing a camera module, the method comprising: A wafer-level optical stack is formed, wherein at least a gapless portion of the optical stack includes an aperture stop and a first substrate, on which a packaged super-optical element (MOE) is present. The wafer-level optical stack is monolithized into individual modules; and At least one of the modules is attached to the image sensor.

22. The method of claim 21, further comprising providing edge blackening to the sidewalls of the module, wherein, Edge blackening materials include black resists, black epoxy resins, or other black polymers or black overmolding materials.

23. The method of claim 22, wherein providing edge blackening comprises: The wafer-level optical stack is partially diced to form grooves; as well as The groove is filled with an edge-blackening material.

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