Flexible circuit board electronic structure roll-to-roll cleaning control method and system

Abstract

The application discloses a flexible circuit board electronic structural member roll-to-roll cleaning control method and system, and relates to the technical field of electronic manufacturing, which comprises the following steps: carrying out partition processing on the to-be-cleaned member to obtain thin areas and thick areas; carrying out partition processing on a drying cavity based on the thin areas and the thick areas, and constructing a partition temperature control method; placing a dehumidifying drying module, and obtaining a hot air drying method based on a cold mirror dew point instrument; the application is used to solve the problem that in the existing flexible circuit board electronic structural member roll-to-roll cleaning control method, the thick and thin areas are not differentiated in temperature control, and the influence of the environmental humidity in the drying cavity on the drying effect is not considered, resulting in overheating of the thin plate after drying, incomplete evaporation of water in the thick plate, and watermarks appearing on the surface of the electronic structural member which cannot be wiped, thereby affecting the practicability of the electronic structural member after cleaning.

Description

Technical Field

[0001] This invention relates to the field of electronic manufacturing technology, specifically to a method and system for controlling roll-to-roll cleaning of flexible circuit board electronic structural components. Background Technology

[0002] Flexible printed circuit board (FPC) electronic structural components are flexible substrates that integrate conductive lines, components, and reinforcing structures. These flexible and foldable electronic functional components are used for circuit connection, signal transmission, and structural support. Roll-to-roll cleaning of FPC electronic structural components is a continuous precision cleaning process that removes oil, dust, residual adhesive, and etching solution residues from the FPC substrate and circuit surfaces online through spraying, ultrasonic cleaning, and brushing during continuous roll production. This ensures the quality of subsequent bonding, electroplating, and mounting.

[0003] Existing methods for roll-to-roll cleaning control of flexible circuit board electronic structural components typically focus on improvements in the design of the cleaning material. This involves bringing the cleaning material into contact with the rollers to be cleaned, then using another material to remove debris from the cleaning material. This achieves the goal of removing small defects from the long rollers containing the flexible electronic components. While this improved method enhances the cleaning efficiency of electronic structural components, it suffers from several drawbacks. In the drying process, it only controls the hot air temperature, wind speed, and drying time, failing to differentiate temperature control for thicker and thinner areas, and neglecting the impact of ambient humidity within the drying chamber on the drying effect. This results in problems such as overheating of thinner boards after drying, incomplete evaporation of water from thicker boards, and watermarks on the surface of the electronic structural components that cannot be wiped away, ultimately affecting the usability of the cleaned electronic structural components. For example, this is illustrated in patent application CN112313018A. The present invention discloses novel materials and hardware for automatically cleaning flexible electronic mesh rollers. This solution removes small defects from the long rollers of flexible electronic materials while they are in continuous motion. By improving the cleaning material, the cleaning film can be reused multiple times. Other improvements to roll-to-roll cleaning control methods for flexible circuit board electronic structural components usually focus on the cleaning solution. However, they still cannot solve the problem of drying during the cleaning process of flexible circuit board electronic structural components. They do not differentiate the temperature control for thick and thin areas, nor do they consider the impact of the ambient humidity in the drying chamber on the drying effect. This results in overheating of thin boards after drying, incomplete evaporation of water in thick boards, and watermarks on the surface of electronic structural components that cannot be wiped off, thus affecting the usability of the cleaned electronic structural components. Therefore, it is necessary to improve the existing roll-to-roll cleaning control methods for flexible circuit board electronic structural components. Summary of the Invention

[0004] This invention aims to at least partially solve one of the technical problems in the prior art. By proposing a roll-to-roll cleaning control method and system for flexible circuit board electronic structural components, this invention addresses the issues in existing roll-to-roll cleaning control methods for flexible circuit board electronic structural components. These methods fail to differentiate temperature control for thick and thin areas during the drying process and do not consider the impact of ambient humidity within the drying chamber on the drying effect. Consequently, the thin boards overheat after drying, water in the thick boards does not evaporate completely, and watermarks that cannot be wiped off appear on the surface of the electronic structural components, thus affecting the usability of the cleaned electronic structural components.

[0005] To achieve the above objectives, in a first aspect, this application provides a roll-to-roll cleaning control method for flexible printed circuit board electronic structural components, comprising the following steps:

[0006] Flexible circuit board electronic structural components that allow roll-to-roll cleaning are designated as components to be cleaned; based on closed-loop tension control and automatic deviation correction, a dust-removing roller is used to pre-remove dust from the components to be cleaned and to eliminate static electricity;

[0007] Based on the cleaning process standards, the parts to be cleaned are subjected to multi-stage chemical cleaning and multi-stage countercurrent rinsing, and high-pressure blowing is performed using a double-sided symmetrical air knife.

[0008] Before the parts to be cleaned enter the drying chamber, the parts to be cleaned are divided into sections based on their structure, and the corresponding thin and thick sections are obtained. Based on the lengths of the thin and thick sections, the drying chamber is divided into sections, and a section temperature control method is constructed.

[0009] A dehumidifying and drying module is placed at the air inlet of the drying chamber, and a hot air drying method is based on a cold mirror dew point meter.

[0010] After the parts to be cleaned are removed from the drying chamber, static electricity is eliminated, and servo constant tension winding is performed based on the cleaning process standards.

[0011] Furthermore, before the parts to be cleaned enter the drying chamber, the parts are divided into sections based on their structure, and the corresponding thin and thick areas of the parts to be cleaned are obtained, including:

[0012] The area containing only flexible circuit boards in the part to be cleaned is designated as the thin plate area, and the area where FR-4, steel sheets, aluminum sheets and multi-layer PI reinforcement are pasted on the surface of the flexible circuit boards in the part to be cleaned is designated as the thick plate area.

[0013] Based on the order in which each independent thin plate region enters the drying chamber when the parts to be cleaned enter, all thin plate regions are sequentially designated as thin plate region BQ1 to thin plate region BQ. t Based on the order in which each independent thick plate region enters the drying chamber when the parts to be cleaned enter, all thick plate regions are sequentially designated as Thick Zone HQ1 to Thick Zone HQ.r .

[0014] Furthermore, based on the lengths of the thin and thick zones, the drying chamber is divided into zones, and a zoned temperature control method is constructed, including:

[0015] For any thin area: obtain the smallest rectangle on the surface of the part to be cleaned that can enclose the thin area, and denote it as the smallest outer rectangle of the thin area; obtain a line segment parallel to the length of the part to be cleaned within the smallest outer rectangle, and denote it as the longitudinal span line; denote the length of the longest longitudinal span line as the longitudinal span value of the thin area.

[0016] Obtain the longitudinal span values ​​of all thin regions, and record the smallest longitudinal span value as the low-temperature zone length; based on the analysis method of all thin regions, obtain the longitudinal span values ​​of all thick regions, and record the smallest longitudinal span value among all thick regions as the high-temperature zone length.

[0017] Furthermore, based on the lengths of the thin and thick zones, the drying chamber is divided into zones, and a zoned temperature control method is constructed, which also includes:

[0018] The conveyor belt that carries the parts to be cleaned in the drying chamber is called the drying conveyor belt; the drying conveyor belt is divided into 3 areas, and based on the conveying direction of the conveyor belt, the 3 areas are called the pre-drying area, the main drying area and the cooling area in sequence.

[0019] Based on the process requirements for drying electronic structural components of flexible circuit boards, the temperature range for drying only flexible circuit boards is denoted as the thin temperature range, and the temperature range for drying flexible circuit boards reinforced with FR-4, steel sheets, aluminum sheets, and multilayer PI is denoted as the thick temperature range; the median values ​​of the thin temperature range and the thick temperature range are denoted as the thin median value and the thick median value, respectively.

[0020] Furthermore, zoned temperature control methods include:

[0021] The minimum value within the thin temperature range is denoted as the thin low temperature.

[0022] When the parts to be cleaned enter the drying chamber and are in the pre-drying area of ​​the drying conveyor belt, the drying temperature in the pre-drying area is adjusted to [low temperature for thin parts, medium temperature for thin parts].

[0023] When any thin area in the part to be cleaned moves from the pre-drying area to the main drying area, the midpoint of the thin area is recorded as the thin area midpoint. When the thin area is completely within the main drying area, an air field with a longitudinal length equal to the low temperature zone length and a transverse length of L is used to dry the thin area from top to bottom with the thin area midpoint as the center. The drying temperature range during the drying process is the thin temperature range, and L is the width of the drying conveyor belt.

[0024] Furthermore, the zoned temperature control method also includes:

[0025] When any thick area in the part to be cleaned moves from the pre-drying area to the main drying area, the midpoint of the thick area is recorded as the midpoint of the thick area; when the thick area is completely within the main drying area, an air field with a longitudinal length equal to the length of the high temperature zone and a transverse length of L is used to dry the thick area from top to bottom with the midpoint of the thick area as the center. The drying temperature range during the drying process is the thick temperature range.

[0026] When there are both air fields A1 with a thin temperature range and air fields A2 with a thick temperature range in the main drying area, and the thin and thick areas corresponding to air fields A1 and A2 are adjacent, the line connecting the midpoint of the thin area and the midpoint of the thick area corresponding to air fields A1 and A2 during the drying process is recorded as the gradient line, and the midpoint of the gradient line is recorded as the gradient midpoint.

[0027] Furthermore, the zoned temperature control method also includes:

[0028] When the gradient midpoint is obtained, a wind field with a vertical length of 2 / low temperature zone length and a horizontal length of L is used to perform drying treatment from top to bottom with the gradient midpoint as the center. The drying temperature range during the drying treatment is [thin median, thick median];

[0029] The boundary line between the cooling zone and the main drying zone is designated as the cooling boundary line. When the part to be cleaned moves to the cooling zone, the room temperature outside the drying chamber is designated as the outside temperature. The area between the cooling boundary line and the end point of the drying conveyor belt is dried. The drying temperature during the drying process is set as follows: the drying temperature of the cooling boundary line is set to the median value, and the drying temperature at the end point of the drying conveyor belt is set as the outside temperature. Within the area between the cooling boundary line and the end point of the drying conveyor belt, the drying temperature continuously decreases from the median value to the outside temperature.

[0030] Furthermore, the hot air drying method includes:

[0031] Based on the process requirements for drying electronic structural components of flexible circuit boards, the maximum allowable dew point temperature in the drying chamber is recorded as the dew point threshold.

[0032] When the air inlet of the dehumidification and drying module is located in the pre-drying area and the cooling area, the dew point temperature of the pre-drying area and the cooling area during the drying process is obtained in real time using a cold mirror dew point meter based on the drying temperature of the pre-drying area and the cooling area.

[0033] When the dew point temperature is greater than the dew point threshold, the dehumidification drying module is used to dehumidify the hot air in the air inlet of the pre-drying area and the cooling area until the dew point temperature is less than or equal to the dew point threshold. The operating power of the dehumidification drying module in the pre-drying area and the cooling area is recorded as the standard dehumidification power.

[0034] Furthermore, the hot air drying method also includes:

[0035] When the air inlet of the dehumidifying and drying unit is located in the main drying area, when the part to be cleaned is moved to the main drying area, a cold mirror dew point meter is used to obtain the dew point temperature in the main drying area every T. When the dew point temperature is greater than the dew point threshold, the dehumidifying and drying module is used to dehumidify the main drying area until the dew point temperature is less than or equal to the dew point threshold.

[0036] When the parts to be cleaned are moved to the pre-drying area and the cooling area, the dehumidification and drying modules in the pre-drying area and the cooling area are activated based on the standard dehumidification power of the dehumidification and drying modules in the pre-drying area and the cooling area.

[0037] Secondly, this application also provides a roll-to-roll cleaning control system for flexible circuit board electronic structural components, including a pre-drying treatment module, a drying control module, and a post-drying rewinding module.

[0038] The pre-drying treatment module is used to mark flexible circuit board electronic structural components that allow roll-to-roll cleaning as the parts to be cleaned; based on closed-loop tension control and automatic correction, the dust removal roller is used to pre-remove dust from the parts to be cleaned and to eliminate static electricity;

[0039] Based on the cleaning process standards, the parts to be cleaned are subjected to multi-stage chemical cleaning and multi-stage countercurrent rinsing, and high-pressure blowing is performed using a double-sided symmetrical air knife.

[0040] The drying control module is used to partition the workpiece before it enters the drying chamber based on its structure and obtain the corresponding thin and thick areas of the workpiece. Based on the length of the thin and thick areas, the drying chamber is partitioned and a partitioned temperature control method is constructed.

[0041] A dehumidifying and drying module is placed at the air inlet of the drying chamber. The hot air drying method corresponding to the dehumidifying and drying module and the zoned temperature control method is obtained based on the zoned temperature control method and the cold mirror dew point meter.

[0042] The post-drying rewinding module is used to eliminate static electricity from the parts to be cleaned after they are removed from the drying chamber, and to perform servo constant tension rewinding based on the cleaning process standards.

[0043] The beneficial effects of this invention are as follows: First, based on closed-loop tension control and automatic deviation correction, the parts to be cleaned are pre-dust removed and electrostatic discharge is eliminated; multi-stage chemical cleaning, multi-stage countercurrent rinsing, and high-pressure blowing are performed based on cleaning process standards; then, before the parts to be cleaned enter the drying chamber, the parts to be cleaned are partitioned based on their structure, and the corresponding thin and thick areas are obtained; based on the lengths of the thin and thick areas, the drying chamber is partitioned. The advantage of this is that by partitioning the parts to be cleaned and partitioning the drying chamber based on the obtained thin and thick areas, it helps to effectively dry the moisture on the surface of the parts to be cleaned according to the structure of the thick and thin areas within the parts during subsequent execution of the partitioned temperature control method and hot air drying method. This achieves differentiated temperature control of the thick and thin areas on the surface of the electronic structural components, preventing the problem of overheating of thin plates and incomplete evaporation of water in thick plates due to uniform high or low temperatures after drying, thereby avoiding the impact of the drying process on the appearance and usability of the electronic structural components.

[0044] This application also constructs a zoned temperature control method, placing a dehumidifying drying module at the air inlet of the drying chamber and using a hot air drying method based on a cold mirror dew point meter; finally, after the parts to be cleaned are removed from the drying chamber, static electricity is eliminated, and servo constant tension winding is performed based on the cleaning process standard. The advantage of this is that by placing a dehumidifying drying module and establishing a hot air drying method, it is possible to control the dew point of the environment inside the drying chamber based on the ambient humidity inside the drying chamber during the drying process, thereby preventing the problem of watermarks that cannot be wiped off from the surface of electronic structural parts due to excessively high dew point temperature inside the drying chamber during the drying process. Attached Figure Description

[0045] Figure 1 This is a schematic diagram of the system of the present invention;

[0046] Figure 2 This is a flowchart of the steps of the method of the present invention;

[0047] Figure 3 This is a schematic diagram of a thin area of ​​the workpiece to be cleaned according to the present invention;

[0048] Figure 4 This is a schematic diagram of the partitioning of the drying conveyor belt of the present invention;

[0049] Figure 5 This is a schematic diagram of the electronic device of the present invention. Detailed Implementation

[0050] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0051] Example 1, please refer to Figure 1 As shown, this application provides a roll-to-roll cleaning control system for flexible circuit board electronic structural components, including a pre-drying treatment module, a drying control module, and a post-drying rewinding module.

[0052] The pre-drying treatment module is used to mark flexible circuit board electronic structural components that allow roll-to-roll cleaning as the parts to be cleaned; based on closed-loop tension control and automatic correction, the dust removal roller is used to pre-remove dust from the parts to be cleaned and to eliminate static electricity;

[0053] Based on the cleaning process standards, the parts to be cleaned are subjected to multi-stage chemical cleaning and multi-stage countercurrent rinsing, and high-pressure blowing is performed using a double-sided symmetrical air knife.

[0054] In the data analysis of this embodiment, only the drying process of the parts to be cleaned in the drying chamber during the cleaning process is improved. Therefore, for other steps in the cleaning process besides drying, such as pre-dust removal, static elimination, rinsing and high-pressure blowing, the actual cleaning standards can be met according to the process requirements of the specific implementation.

[0055] The drying control module is used to partition the workpiece before it enters the drying chamber based on its structure and obtain the corresponding thin and thick areas of the workpiece. Based on the length of the thin and thick areas, the drying chamber is partitioned and a partitioned temperature control method is constructed.

[0056] A dehumidifying and drying module is placed at the air inlet of the drying chamber. The hot air drying method corresponding to the dehumidifying and drying module and the zoned temperature control method is obtained based on the zoned temperature control method and the cold mirror dew point meter.

[0057] The drying control module includes a drying partition unit, which includes: a region in the part to be cleaned that contains only flexible circuit boards is designated as a thin plate region, and a region in the part to be cleaned that has FR-4, steel sheets, aluminum sheets and multi-layer PI reinforcements pasted on the surface of the flexible circuit boards is designated as a thick plate region.

[0058] In the data analysis of this embodiment, by analyzing a group of electronic structural components undergoing roll-to-roll cleaning, it was found that the thickness of the area containing only flexible circuit boards in the component to be cleaned is [50μm, 125μm], while the thickness of the area reinforced with FR-4, steel sheets, aluminum sheets, and multilayer PI is [0.3mm, 1.5mm]. Therefore, if a uniform high temperature is used to dry the moisture on the surface of the component to be cleaned in the drying chamber, it will cause the thin board area to overheat after high-temperature drying, resulting in problems such as PI yellowing, substrate shrinkage, circuit size displacement, and adhesive layer aging. On the other hand, if a uniform low temperature is used to dry the moisture on the surface of the component to be cleaned, it will cause the moisture in the center of the thick board area and inside the adhesive layer to not evaporate completely after low-temperature drying, forming hidden wet residue, resulting in watermarks, oxidation, and interlayer blistering after rewinding.

[0059] Therefore, in this embodiment, by obtaining the thin plate area and thick plate area in the part to be cleaned, and obtaining the low temperature partition length and high temperature partition length corresponding to the thin plate area and thick plate area in the subsequent analysis, it can be ensured that after the part to be cleaned enters the drying chamber, all thin areas and all thick areas in the part to be cleaned are dried at low temperature and at high temperature respectively, and the drying range during drying can be effectively controlled according to the low temperature partition length and high temperature partition length, avoiding the problem of drying thin areas at high temperature and thick areas at low temperature.

[0060] Based on the order in which each independent thin plate region enters the drying chamber when the parts to be cleaned enter, all thin plate regions are sequentially designated as thin plate region BQ1 to thin plate region BQ. t Based on the order in which each independent thick plate region enters the drying chamber when the parts to be cleaned enter, all thick plate regions are sequentially designated as Thick Zone HQ1 to Thick Zone HQ. r ;

[0061] For any thin area: obtain the smallest rectangle on the surface of the part to be cleaned that can enclose the thin area, and denote it as the smallest outer rectangle of the thin area; obtain a line segment parallel to the length of the part to be cleaned within the smallest outer rectangle, and denote it as the longitudinal span line; denote the length of the longest longitudinal span line as the longitudinal span value of the thin area.

[0062] In the data analysis of this embodiment, for example, a portion of the aforementioned set of electronic structural components is obtained. Figure 3 As shown, DJ is the part to be cleaned, and region BQ is a thin area in the part to be cleaned. Through analysis, it can be found that the dashed rectangle ZW is the smallest outer rectangle of the thin area, and the line segment ZK is the longest longitudinal span line within the smallest outer rectangle. Therefore, the length of the line segment ZK can be recorded as the longitudinal span value.

[0063] Obtain the longitudinal span values ​​of all thin regions, and record the smallest longitudinal span value as the low-temperature zone length; based on the analysis method of all thin regions, obtain the longitudinal span values ​​of all thick regions, and record the smallest longitudinal span value among all thick regions as the high-temperature zone length.

[0064] The drying zone unit also includes: the conveyor belt that carries the moving parts to be cleaned within the drying chamber is referred to as the drying conveyor belt; please refer to [link to relevant documentation]. Figure 4 As shown, the drying conveyor belt is divided into three equal areas, and based on the conveying direction of the conveyor belt, the three areas are sequentially named the pre-drying area, the main drying area, and the cooling area.

[0065] Based on the process requirements for drying electronic structural components of flexible circuit boards, the temperature range for drying only flexible circuit boards is denoted as the thin temperature range, and the temperature range for drying flexible circuit boards reinforced with FR-4, steel sheets, aluminum sheets, and multilayer PI is denoted as the thick temperature range; the median values ​​of the thin temperature range and the thick temperature range are denoted as the thin median value and the thick median value, respectively.

[0066] The zoned temperature control method includes: defining the minimum value within a narrow temperature range as the narrow low temperature range;

[0067] In the data analysis of this embodiment, by obtaining the process requirements during drying, the thin temperature range and the thick temperature range are [60℃, 70℃] and [75℃, 85℃], respectively, and the median values ​​for the thin and thick parts are 65℃ and 80℃, respectively. Therefore, in the pre-drying area, the drying temperature can be adjusted to [60℃, 65℃], thereby achieving pre-drying of the parts to be cleaned at a medium and low temperature, evaporating the surface water of the parts to be cleaned first, and preventing watermarks from forming on the surface of the parts to be cleaned due to boiling of water due to direct high-temperature drying.

[0068] When the parts to be cleaned enter the drying chamber and are in the pre-drying area of ​​the drying conveyor belt, the drying temperature in the pre-drying area is adjusted to [low temperature for thin parts, medium temperature for thin parts].

[0069] When any thin area in the part to be cleaned moves from the pre-drying area to the main drying area, the midpoint of the thin area is recorded as the thin area midpoint; when the thin area is completely within the main drying area, an air field with a longitudinal length equal to the low temperature zone length and a transverse length of L is used to dry the thin area from top to bottom with the thin area midpoint as the center. The drying temperature range during the drying process is the thin temperature range, and L is the width of the drying conveyor belt.

[0070] In the data analysis of this example, for instance, after analyzing the above set of electronic structural components, the low-temperature partition length and high-temperature analysis length are 2cm and 1cm respectively, and the width of the drying conveyor belt is 25cm; then when drying region BQ, after obtaining the midpoint of the thin area corresponding to region BQ, a wind field with a longitudinal length of 2cm and a transverse length of 25cm should be used to dry region BQ from top to bottom with the midpoint of region BQ as the center, and the drying temperature range during the drying process is [60℃, 70℃].

[0071] The zoned temperature control method also includes: when any thick zone in the part to be cleaned moves from the pre-drying area to the main drying area, the midpoint of the thick zone is recorded as the midpoint of the thick zone; when the thick zone is completely within the main drying area, an air field with a longitudinal length equal to the length of the high-temperature zone and a transverse length of L is used to dry the thick zone from top to bottom with the midpoint of the thick zone as the center, wherein the drying temperature range during the drying process is the thick temperature range;

[0072] When there are both air fields A1 with a thin temperature range and air fields A2 with a thick temperature range in the main drying area, and the thin and thick areas corresponding to air fields A1 and A2 are adjacent, the line connecting the midpoint of the thin area and the midpoint of the thick area corresponding to air fields A1 and A2 during the drying process is recorded as the gradient line, and the midpoint of the gradient line is recorded as the gradient midpoint.

[0073] The zoned temperature control method also includes: when the midpoint of the gradient is obtained, a wind field with a vertical length of 2 times the length of the low temperature zone and a horizontal length of L is used to perform drying treatment from top to bottom with the midpoint of the gradient as the center. The drying temperature range during the drying treatment is [thin midpoint, thick midpoint];

[0074] In the data analysis of this embodiment, by obtaining the midpoint of the gradient and using an airflow with a temperature range of [65℃, 80℃] to dry the midpoint of the gradient, a gradient temperature zone can be constructed, avoiding large temperature difference stress that could cause the edges of the thick area to warp. In this embodiment, the midpoint of the gradient is the midpoint between adjacent thin and thick areas. When drying with the midpoint of the gradient as the center, a lower temperature of [65℃, 80℃] can be used for areas within the thin area, and a higher temperature of [65℃, 80℃] can be used for areas within the thick area, so as to effectively construct the gradient temperature zone.

[0075] Step S2076: The boundary line between the cooling area and the main drying area is recorded as the cooling boundary line; when the part to be cleaned moves to the cooling area, the room temperature outside the drying chamber is recorded as the outside temperature; the area between the cooling boundary line and the end point of the drying conveyor belt is dried, wherein the drying temperature during the drying process is set as follows: the drying temperature of the cooling boundary line is set to the thin median value, the drying temperature of the end point of the drying conveyor belt is set to the outside temperature, and the drying temperature in the area between the cooling boundary line and the end point of the drying conveyor belt continuously decreases from the thin median value to the outside temperature;

[0076] In the data analysis of this embodiment, by setting up a cooling zone, it can be ensured that the dried parts to be cleaned are cooled to near room temperature when they are removed from the drying chamber, thereby eliminating internal stress and preventing deformation and adhesion caused by residual heat during winding.

[0077] The hot air drying method includes: based on the process requirements when drying flexible circuit board electronic structural components, the maximum allowable dew point temperature in the drying chamber is recorded as the dew point threshold;

[0078] In the data analysis of this embodiment, by obtaining the process requirements, the dew point threshold is found to be -40℃. That is, when the value corresponding to the dew point is greater than -40℃, it indicates that the humidity in the drying chamber is too high and the hot air entering the drying chamber should be dehumidified.

[0079] When the air inlet of the dehumidification and drying module is located in the pre-drying area and the cooling area, the dew point temperature of the pre-drying area and the cooling area during the drying process is obtained in real time using a cold mirror dew point meter based on the drying temperature of the pre-drying area and the cooling area.

[0080] When the dew point temperature is greater than the dew point threshold, the dehumidification drying module is used to dehumidify the hot air in the air inlet of the pre-drying area and the cooling area until the dew point temperature is less than or equal to the dew point threshold. The operating power of the dehumidification drying module in the pre-drying area and the cooling area is recorded as the standard dehumidification power.

[0081] In the specific implementation process, since the temperature of the hot air in the pre-drying area and the cooling area remains basically unchanged, the air humidity in the pre-drying area and the cooling area is relatively stable when the drying process is performed. By obtaining the standard dehumidification power, the dehumidification drying module can be directly started with the standard dehumidification power when the drying process is performed in the pre-drying area and the cooling area to achieve dehumidification of the hot air entering the pre-drying area and the cooling area.

[0082] The hot air drying method also includes: when the air inlet of the dehumidifying drying unit is the main drying area, when the part to be cleaned is moved to the main drying area, a cold mirror dew point meter is used to obtain the dew point temperature every T in the main drying area, and when the dew point temperature is greater than the dew point threshold, the dehumidifying drying module is used to dehumidify the main drying area until the dew point temperature is less than or equal to the dew point threshold.

[0083] In the specific implementation process, the value of T can be determined according to the dew point change state in the main drying area. Since the temperature of the hot air in the main drying area will change depending on the thin and thick areas entering the main drying area, the air humidity in the main drying area is unstable. Therefore, the dew point temperature in the main drying area should be collected in real time. In the data analysis of this embodiment, the value of T is set to 10s.

[0084] When the parts to be cleaned are moved to the pre-drying area and the cooling area, the dehumidification and drying modules in the pre-drying area and the cooling area are activated based on the standard dehumidification power of the dehumidification and drying modules in the pre-drying area and the cooling area.

[0085] The post-drying rewinding module is used to eliminate static electricity from the parts to be cleaned after they are removed from the drying chamber, and to perform servo constant tension rewinding based on the cleaning process standards.

[0086] Example 2, please refer to Figure 2 As shown, this application also provides a roll-to-roll cleaning control method for flexible circuit board electronic structural components, including the following steps:

[0087] Step S1: Select flexible circuit board electronic structural components that are allowed to be cleaned as the components to be cleaned; based on closed-loop tension control and automatic correction, use a dust-removing roller to pre-remove dust from the components to be cleaned and eliminate static electricity.

[0088] Based on the cleaning process standards, the parts to be cleaned are subjected to multi-stage chemical cleaning and multi-stage countercurrent rinsing, and high-pressure blowing is performed using a double-sided symmetrical air knife.

[0089] Step S2: Before the part to be cleaned enters the drying chamber, the part to be cleaned is divided into sections based on its structure, and the corresponding thin and thick sections are obtained; based on the lengths of the thin and thick sections, the drying chamber is divided into sections, and a section temperature control method is constructed.

[0090] A dehumidifying and drying module is placed at the air inlet of the drying chamber, and a hot air drying method is based on a cold mirror dew point meter.

[0091] Step S2 includes: Step S201, the area in the part to be cleaned that contains only flexible circuit boards is designated as the thin plate area, and the area in the part to be cleaned where FR-4, steel sheets, aluminum sheets and multi-layer PI reinforcement are pasted on the surface of the flexible circuit boards is designated as the thick plate area.

[0092] Step S202: Based on the entry order of each independent thin plate region when the part to be cleaned enters the drying chamber, all thin plate regions are sequentially denoted as thin plate region BQ1 to thin plate region BQ. t Based on the order in which each independent thick plate region enters the drying chamber when the parts to be cleaned enter, all thick plate regions are sequentially designated as Thick Zone HQ1 to Thick Zone HQ. r .

[0093] Step S2 further includes: Step S203, for any thin area: obtain the smallest rectangle that can wrap the thin area on the surface of the part to be cleaned, and record it as the smallest outer rectangle of the thin area; obtain a line segment parallel to the length of the part to be cleaned within the smallest outer rectangle, and record it as the longitudinal span line; record the length of the longest longitudinal span line as the longitudinal span value of the thin area.

[0094] Step S204: Obtain the longitudinal span values ​​of all thin regions and record the smallest longitudinal span value as the low temperature zone length; based on the analysis method of all thin regions, obtain the longitudinal span values ​​of all thick regions and record the smallest longitudinal span value among all thick regions as the high temperature zone length.

[0095] Step S2 also includes: Step S205, referring to the conveyor belt that carries the moving parts to be cleaned in the drying chamber as the drying conveyor belt; dividing the drying conveyor belt into 3 equal areas, and referring to the 3 areas as the pre-drying area, the main drying area and the cooling area in order from first to last based on the conveying direction of the conveyor belt.

[0096] Step S206: Based on the process requirements for drying the electronic structural components of the flexible circuit board, the temperature range for drying only the flexible circuit board is recorded as the thin temperature range, and the temperature range for drying the flexible circuit board that has been reinforced with FR-4, steel sheets, aluminum sheets and multi-layer PI is recorded as the thick temperature range; the median values ​​of the thin temperature range and the thick temperature range are recorded as the thin median value and the thick median value, respectively.

[0097] Step S207, the zoned temperature control method includes: Step S2071, the minimum value within the thin temperature range is recorded as the thin low temperature;

[0098] Step S2072: When the part to be cleaned enters the drying chamber and is in the pre-drying area of ​​the drying conveyor belt, the drying temperature in the pre-drying area is adjusted to [low temperature, medium temperature];

[0099] Step S2073: When any thin area in the part to be cleaned moves from the pre-drying area to the main drying area, the midpoint of the thin area is recorded as the thin area midpoint; when the thin area is completely within the main drying area, an air field with a longitudinal length equal to the low temperature zone length and a transverse length of L is used to dry the thin area from top to bottom with the thin area midpoint as the center. The drying temperature range during the drying process is the thin temperature range, and L is the width of the drying conveyor belt.

[0100] The zoned temperature control method also includes: step S2074, when any thick zone in the part to be cleaned moves from the pre-drying area to the main drying area, the midpoint of the thick zone is recorded as the midpoint of the thick zone; when the thick zone is completely within the main drying area, an air field with a longitudinal length equal to the length of the high-temperature zone and a transverse length of L is used to dry the thick zone from top to bottom with the midpoint of the thick zone as the center, wherein the drying temperature range during the drying process is the thick temperature range;

[0101] Step S2075: When there are both air fields A1 with a thin temperature range and air fields A2 with a thick temperature range in the main drying area, and the thin and thick areas corresponding to air fields A1 and A2 are adjacent, the line connecting the midpoint of the thin area and the midpoint of the thick area corresponding to air fields A1 and A2 during the drying process is recorded as the gradient line, and the midpoint of the gradient line is recorded as the gradient midpoint.

[0102] The zoned temperature control method also includes: step S2075, when the gradient midpoint is obtained, a wind field with a vertical length of 2 / low temperature zone length and a horizontal length of L is used to perform drying treatment from top to bottom with the gradient midpoint as the center, wherein the drying temperature range during the drying treatment is [thin midpoint, thick midpoint];

[0103] Step S2076: The boundary line between the cooling area and the main drying area is recorded as the cooling boundary line; when the part to be cleaned moves to the cooling area, the room temperature outside the drying chamber is recorded as the outside temperature; the area between the cooling boundary line and the end point of the drying conveyor belt is dried, wherein the drying temperature during the drying process is set as follows: the drying temperature of the cooling boundary line is set to the thin median value, the drying temperature of the end point of the drying conveyor belt is set to the outside temperature, and the drying temperature in the area between the cooling boundary line and the end point of the drying conveyor belt continuously decreases from the thin median value to the outside temperature.

[0104] Step S208, the hot air drying method includes: Step S2081, based on the process requirements when drying the flexible circuit board electronic structural components, the maximum allowable dew point temperature in the drying chamber is recorded as the dew point threshold.

[0105] Step S2082: When the air inlet of the dehumidifying and drying module is the pre-drying area and the cooling area, the dew point temperature of the pre-drying area and the cooling area during the drying process is obtained in real time using a cold mirror dew point meter based on the drying temperature of the pre-drying area and the cooling area.

[0106] When the dew point temperature is greater than the dew point threshold, the dehumidification drying module is used to dehumidify the hot air in the air inlet of the pre-drying area and the cooling area until the dew point temperature is less than or equal to the dew point threshold. The operating power of the dehumidification drying module in the pre-drying area and the cooling area is recorded as the standard dehumidification power.

[0107] The hot air drying method also includes: step S2083, when the air inlet of the dehumidifying drying unit is the main drying area, when the part to be cleaned is moved to the main drying area, a cold mirror dew point meter is used to obtain the dew point temperature every T in the main drying area, and when the dew point temperature is greater than the dew point threshold, the dehumidifying drying module is used to dehumidify the main drying area until the dew point temperature is less than or equal to the dew point threshold.

[0108] Step S2084: When the part to be cleaned moves to the pre-drying area and the cooling area, the dehumidification and drying module in the pre-drying area and the cooling area is activated based on the standard dehumidification power of the dehumidification and drying module in the pre-drying area and the cooling area.

[0109] Step S3: After the part to be cleaned is removed from the drying chamber, static electricity is eliminated from the part to be cleaned, and servo constant tension winding is performed based on the cleaning process standard.

[0110] Example 3, please refer to Figure 5 As shown, Figure 5The example illustrates the structure of an electronic device, which may include a processor, a communication interface, a memory, and a communication bus, wherein the processor, the communication interface, and the memory communicate with each other through the communication bus. The memory stores computer-readable instructions, which the processor can call. When the computer-readable instructions are executed by the processor, steps such as those in the roll-to-roll cleaning control method for flexible circuit board electronic structural components are performed to achieve the following functions: First, based on closed-loop tension control and automatic deviation correction, a dust-removing roller is used to pre-dust the workpiece to be cleaned and electrostatic elimination is performed; based on the cleaning process standard, the workpiece to be cleaned undergoes multi-stage chemical cleaning and multi-stage countercurrent rinsing, and high-pressure blowing is performed using a double-sided symmetrical air knife; then, before the workpiece to be cleaned enters the drying chamber, it is partitioned based on its structure, and the corresponding thin and thick areas are obtained; based on the lengths of the thin and thick areas, the drying chamber is partitioned, and a partitioned temperature control method is constructed; a dehumidification drying module is placed at the air inlet of the drying chamber, and a hot air drying method is obtained based on a cold mirror dew point meter; finally, after the workpiece to be cleaned is removed from the drying chamber, electrostatic elimination is performed, and servo constant tension winding is performed based on the cleaning process standard.

[0111] Furthermore, when the logical instructions in the aforementioned memory can be implemented as software functional units and sold or used as independent products, they can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0112] Example 4: This application also provides a computer-readable storage medium storing a computer program. When the computer program is executed by a processor, it runs the steps in the above-mentioned roll-to-roll cleaning control method for flexible circuit board electronic structural components to achieve the following functions: First, based on closed-loop tension control and automatic deviation correction, a dust-removing roller is used to pre-remove dust from the workpiece to be cleaned and to eliminate static electricity; based on the cleaning process standard, the workpiece to be cleaned undergoes multi-stage chemical cleaning and multi-stage countercurrent rinsing, and a double-sided symmetrical air knife is used to perform high-pressure blowing; then, before the workpiece to be cleaned enters the drying chamber, it is partitioned based on its structure, and the corresponding thin and thick areas are obtained; based on the lengths of the thin and thick areas, the drying chamber is partitioned, and a partitioned temperature control method is constructed; a dehumidification drying module is placed at the air inlet of the drying chamber, and a hot air drying method is obtained based on a cold mirror dew point meter; finally, after the workpiece to be cleaned is removed from the drying chamber, static electricity is eliminated, and servo constant tension winding is performed based on the cleaning process standard.

[0113] Based on the above description of the embodiments, the embodiments of the present invention can be provided as methods, systems, or computer program products. Based on this understanding, the above technical solutions, in essence or in terms of their contribution to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods described in the various embodiments or certain parts of the embodiments.

[0114] In the embodiments provided in this application, it should be understood that the disclosed system or method can be implemented in other ways. The embodiments described above are merely illustrative. For example, the division of modules or units is only a logical functional division, and there may be other division methods in actual implementation. Furthermore, multiple modules or units may be combined or integrated into another system, or some features may be ignored or not executed. Additionally, the coupling or direct coupling or communication connection shown or discussed may be through some communication interfaces. The indirect coupling or communication connection between systems, modules, and units may be electrical, mechanical, or other forms.

[0115] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A method for controlling the roll-to-roll cleaning of flexible circuit board electronic structural components, characterized in that, Includes the following steps: Flexible circuit board electronic structural components that allow roll-to-roll cleaning are designated as components to be cleaned; based on closed-loop tension control and automatic deviation correction, a dust-removing roller is used to pre-remove dust from the components to be cleaned and to eliminate static electricity; Based on the cleaning process standards, the parts to be cleaned are subjected to multi-stage chemical cleaning and multi-stage countercurrent rinsing, and high-pressure blowing is performed using a double-sided symmetrical air knife. Before the parts to be cleaned enter the drying chamber, the parts to be cleaned are divided into sections based on their structure, and the corresponding thin and thick areas of the parts to be cleaned are obtained. Based on the lengths of the thin and thick zones, the drying chamber is divided into zones, and a zoned temperature control method is constructed. A dehumidifying and drying module is placed at the air inlet of the drying chamber, and a hot air drying method is based on a cold mirror dew point meter. After the parts to be cleaned are removed from the drying chamber, static electricity is eliminated, and servo constant tension winding is performed based on the cleaning process standards.

2. The roll-to-roll cleaning control method for flexible circuit board electronic structural components according to claim 1, characterized in that, Before the parts to be cleaned enter the drying chamber, the parts are divided into sections based on their structure, and the corresponding thin and thick areas of the parts to be cleaned are obtained, including: The area containing only flexible circuit boards in the part to be cleaned is designated as the thin plate area, and the area where FR-4, steel sheets, aluminum sheets and multi-layer PI reinforcement are pasted on the surface of the flexible circuit boards in the part to be cleaned is designated as the thick plate area. Based on the order in which each independent thin plate region enters the drying chamber when the parts to be cleaned enter, all thin plate regions are sequentially designated as thin plate region BQ1 to thin plate region BQ. t Based on the order in which each independent thick plate region enters the drying chamber when the parts to be cleaned enter, all thick plate regions are sequentially designated as Thick Zone HQ1 to Thick Zone HQ. r .

3. The roll-to-roll cleaning control method for flexible circuit board electronic structural components according to claim 2, characterized in that, Based on the lengths of the thin and thick zones, the drying chamber is divided into zones, and a zoned temperature control method is constructed, including: For any thin area: obtain the smallest rectangle on the surface of the part to be cleaned that can enclose the thin area, and denote it as the smallest outer rectangle of the thin area; obtain a line segment parallel to the length of the part to be cleaned within the smallest outer rectangle, and denote it as the longitudinal span line; denote the length of the longest longitudinal span line as the longitudinal span value of the thin area. Obtain the longitudinal span values ​​of all thin regions, and record the smallest longitudinal span value as the low-temperature zone length; based on the analysis method of all thin regions, obtain the longitudinal span values ​​of all thick regions, and record the smallest longitudinal span value among all thick regions as the high-temperature zone length.

4. The roll-to-roll cleaning control method for flexible circuit board electronic structural components according to claim 3, characterized in that, Based on the lengths of the thin and thick zones, the drying chamber is divided into zones, and a zoned temperature control method is constructed, which also includes: The conveyor belt that carries the parts to be cleaned in the drying chamber is called the drying conveyor belt; the drying conveyor belt is divided into 3 areas, and based on the conveying direction of the conveyor belt, the 3 areas are called the pre-drying area, the main drying area and the cooling area in sequence. Based on the process requirements for drying electronic structural components of flexible circuit boards, the temperature range for drying only flexible circuit boards is denoted as the thin temperature range, and the temperature range for drying flexible circuit boards reinforced with FR-4, steel sheets, aluminum sheets, and multilayer PI is denoted as the thick temperature range; the median values ​​of the thin temperature range and the thick temperature range are denoted as the thin median value and the thick median value, respectively.

5. The roll-to-roll cleaning control method for flexible circuit board electronic structural components according to claim 4, characterized in that, Zoned temperature control methods include: The minimum value within the thin temperature range is denoted as the thin low temperature. When the parts to be cleaned enter the drying chamber and are in the pre-drying area of ​​the drying conveyor belt, the drying temperature in the pre-drying area is adjusted to [low temperature for thin parts, medium temperature for thin parts]. When any thin area in the part to be cleaned moves from the pre-drying area to the main drying area, the midpoint of the thin area is recorded as the thin area midpoint. When the thin area is completely within the main drying area, an air field with a longitudinal length equal to the low temperature zone length and a transverse length of L is used to dry the thin area from top to bottom with the thin area midpoint as the center. The drying temperature range during the drying process is the thin temperature range, and L is the width of the drying conveyor belt.

6. The roll-to-roll cleaning control method for flexible circuit board electronic structural components according to claim 5, characterized in that, Zoned temperature control methods also include: When any thick area in the part to be cleaned moves from the pre-drying area to the main drying area, the midpoint of the thick area is recorded as the midpoint of the thick area; when the thick area is completely within the main drying area, an air field with a longitudinal length equal to the length of the high temperature zone and a transverse length of L is used to dry the thick area from top to bottom with the midpoint of the thick area as the center. The drying temperature range during the drying process is the thick temperature range. When there are both air fields A1 with a thin temperature range and air fields A2 with a thick temperature range in the main drying area, and the thin and thick areas corresponding to air fields A1 and A2 are adjacent, the line connecting the midpoint of the thin area and the midpoint of the thick area corresponding to air fields A1 and A2 during the drying process is recorded as the gradient line, and the midpoint of the gradient line is recorded as the gradient midpoint.

7. The roll-to-roll cleaning control method for flexible circuit board electronic structural components according to claim 6, characterized in that, Zoned temperature control methods also include: When the gradient midpoint is obtained, a wind field with a vertical length of 2 / low temperature zone length and a horizontal length of L is used to perform drying treatment from top to bottom with the gradient midpoint as the center. The drying temperature range during the drying treatment is [thin median, thick median]; The boundary line between the cooling zone and the main drying zone is designated as the cooling boundary line. When the part to be cleaned moves to the cooling zone, the room temperature outside the drying chamber is designated as the outside temperature. The area between the cooling boundary line and the end point of the drying conveyor belt is dried. The drying temperature during the drying process is set as follows: the drying temperature of the cooling boundary line is set to the median value, and the drying temperature at the end point of the drying conveyor belt is set as the outside temperature. Within the area between the cooling boundary line and the end point of the drying conveyor belt, the drying temperature continuously decreases from the median value to the outside temperature.

8. The roll-to-roll cleaning control method for flexible circuit board electronic structural components according to claim 7, characterized in that, Hot air drying methods include: Based on the process requirements for drying electronic structural components of flexible circuit boards, the maximum allowable dew point temperature in the drying chamber is recorded as the dew point threshold. When the air inlet of the dehumidification and drying module is located in the pre-drying area and the cooling area, the dew point temperature of the pre-drying area and the cooling area during the drying process is obtained in real time using a cold mirror dew point meter based on the drying temperature of the pre-drying area and the cooling area. When the dew point temperature is greater than the dew point threshold, the dehumidification drying module is used to dehumidify the hot air in the air inlet of the pre-drying area and the cooling area until the dew point temperature is less than or equal to the dew point threshold. The operating power of the dehumidification drying module in the pre-drying area and the cooling area is recorded as the standard dehumidification power.

9. The roll-to-roll cleaning control method for flexible circuit board electronic structural components according to claim 1, characterized in that, Hot air drying methods also include: When the air inlet of the dehumidifying and drying unit is located in the main drying area, when the part to be cleaned is moved to the main drying area, a cold mirror dew point meter is used to obtain the dew point temperature in the main drying area every T. When the dew point temperature is greater than the dew point threshold, the dehumidifying and drying module is used to dehumidify the main drying area until the dew point temperature is less than or equal to the dew point threshold. When the parts to be cleaned are moved to the pre-drying area and the cooling area, the dehumidification and drying modules in the pre-drying area and the cooling area are activated based on the standard dehumidification power of the dehumidification and drying modules in the pre-drying area and the cooling area.

10. A roll-to-roll cleaning control system for flexible printed circuit board electronic structural components, used to implement the roll-to-roll cleaning control method for flexible printed circuit board electronic structural components as described in any one of claims 1-9, characterized in that, It includes a pre-drying treatment module, a drying control module, and a post-drying winding module; The pre-drying treatment module is used to identify flexible circuit board electronic structural components that are permissible for roll-to-roll cleaning as components to be cleaned; Based on closed-loop tension control and automatic deviation correction, a dust-removing roller is used to pre-remove dust from the parts to be cleaned and to eliminate static electricity. Based on the cleaning process standards, the parts to be cleaned are subjected to multi-stage chemical cleaning and multi-stage countercurrent rinsing, and high-pressure blowing is performed using a double-sided symmetrical air knife. The drying control module is used to partition the part to be cleaned based on its structure before it enters the drying chamber, and to obtain the corresponding thin and thick areas of the part to be cleaned. Based on the lengths of the thin and thick zones, the drying chamber is divided into zones, and a zoned temperature control method is constructed. A dehumidifying and drying module is placed at the air inlet of the drying chamber. The hot air drying method corresponding to the dehumidifying and drying module and the zoned temperature control method is obtained based on the zoned temperature control method and the cold mirror dew point meter. The post-drying rewinding module is used to eliminate static electricity from the parts to be cleaned after they are removed from the drying chamber, and to perform servo constant tension rewinding based on the cleaning process standards.

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