A method and apparatus for manufacturing a magnetic shielding assembly

Abstract

This application discloses a method and apparatus for preparing a magnetic shielding component. The preparation method first involves laminating several single-layer shielding raw materials to form a pre-composite strip. The pre-composite strip is then attached to the surface of a pre-punched positioning carrier strip to form a shielding sheet substrate. The processed die-cut semi-finished product is cut and separated along with the positioning carrier strip. The separated multi-layer shielding sheets are then bonded and fixed in a stacked manner using a stacking fixture. The preparation apparatus includes a release film conveying mechanism, a release film punching mechanism, a pre-composite strip laminating mechanism, a first punching mechanism, a first strip conveying mechanism, a second punching mechanism, a second strip conveying mechanism, a waste removal slicing mechanism, and a stacking fixture. This application not only effectively overcomes the problems of edge breakage and forming difficulties caused by direct punching when the target thickness of the magnetic shielding component is relatively thick, but also ensures the dimensional accuracy and appearance quality of the component through subsequent assembly using a stacking fixture, thereby improving production yield and process flexibility.

Description

Technical Field

[0001] This application relates to the field of precision die-cutting technology, and in particular to a method and apparatus for preparing a magnetic shielding component. Background Technology

[0002] PDU control boards are widely used in high-energy-consuming scenarios such as data centers, AI computing power, and energy storage. The magnetic fields and signal interference generated by the internal electronic components during high-speed operation and control need to be effectively shielded by high-performance magnetic shielding sheets (such as 2mm thick nanocrystals). However, the existing manufacturing process usually adopts the technical route of pre-stacking single-layer nanocrystal raw materials (such as 20um) into multiple layers to the target thickness (such as 2000um) before overall processing. Such thick materials are prone to wrinkles, cracks, or even breakage during subsequent winding and bending. Furthermore, it is extremely difficult to directly punch and process composite materials with a thickness of more than 2mm. Even with expensive high-precision QDC hardware molds, it is difficult to eliminate the problem of crystal fragmentation and breakage caused by edge winding, resulting in burrs and burrs on the punched surface, which seriously affects the product yield and appearance quality. Summary of the Invention

[0003] In order to improve the defects of existing thick magnetic shielding materials, such as wrinkling and cracking, poor quality of punched cut surfaces and low processing yield during the manufacturing process, this application provides a method and apparatus for preparing magnetic shielding components.

[0004] The method and apparatus for preparing a magnetic shielding component provided in this application adopt the following technical solution:

[0005] A method for preparing a magnetic shielding component includes the following steps:

[0006] S1. Preparation of pre-composite tape: Several single-layer shielding materials are laminated together to form a pre-composite tape with a first thickness, the first thickness being less than the target thickness of the magnetic shielding component.

[0007] S2. Preparation of positioning carrier: Provide a release substrate as a positioning carrier, and pre-punch to form positioning features on the positioning carrier;

[0008] S3, Carrier tape bonding and splicing: The pre-composite tape is bonded to the positioning carrier tape, and the pre-composite tape is aligned and spliced ​​based on the positioning features, so that the pre-composite tape forms a shielding substrate covering the target length along the length direction of the positioning carrier tape.

[0009] S4. Segmented positioning punching: The shielding sheet substrate is segmented contour punched at different punching stations in sequence to form a die-cut semi-finished product with a complete outer contour and hole structure, which is composed of segmented parts punched from different stations.

[0010] S5. Waste removal and unitized cutting: Remove the waste material around the die-cut semi-finished product, and cut the positioning carrier and the die-cut semi-finished product simultaneously to obtain an independent multi-layer shielding sheet.

[0011] S6. Fixture stacking assembly: Multiple multi-layer shielding sheets are sequentially placed into a stacking fixture for multi-layer stacking assembly until the target thickness is reached, forming a magnetic shielding assembly composed of stacked multi-layer shielding sheets.

[0012] By adopting the above technical solution, a pre-composite strip is first formed by laminating several single-layer shielding raw materials. The pre-composite strip is then attached to the surface of a positioning carrier strip with pre-cut positioning features to form the shielding sheet substrate. The processed die-cut semi-finished product is cut and separated along with the positioning carrier strip. The separated multi-layer shielding sheets are then glued and fixed in a stacked manner using a stacking fixture. This application, by adopting a process route of thin-layer die-cutting and thick-layer stacking, combined with the positioning features on the positioning carrier strip, achieves segmented positioning punching and precise alignment splicing of long dimensions. This not only effectively overcomes the problems of edge breakage and forming difficulties caused by direct punching when the target thickness of the magnetic shielding component is thick, but also ensures the dimensional accuracy and appearance quality of the component through the subsequent assembly of the stacking fixture, thereby improving the production yield and process flexibility.

[0013] Preferably, in step S1, the single-layer shielding material includes a nanocrystalline alloy strip and a double-sided adhesive layer attached to both sides of the nanocrystalline alloy strip. The thickness of a single layer of the single-layer shielding material is 20 micrometers. Ten layers of the single-layer shielding material are laminated together with the double-sided adhesive to form the pre-composite strip, and the first thickness is 0.2 millimeters.

[0014] By adopting the above technical solution, the extremely thin and brittle nanocrystalline alloy strip is "sandwiched" and pre-composite in multiple layers through double-sided adhesive layers. The flexible buffer of the adhesive layer enhances the mechanical strength and anti-fracture performance of the material, preventing breakage during transmission. At the same time, the thickness of the pre-composite strip is controlled at 0.2 mm, which ensures that the material has sufficient stiffness for transportation and is within the optimal processing range of conventional precision die-cutting, avoiding the excessive fragility of directly processing single-layer materials or edge breakage when processing the final thickness material.

[0015] Preferably, in step S2, the positioning carrier is a PET release film, and the positioning feature is a positioning circular hole distributed on the outer edge region of the positioning carrier and located on the outer side of the shielding substrate; in step S3, the pre-composite tape covers the region between the positioning circular holes.

[0016] By adopting the above technical solution, the PET release film serves as the positioning carrier, and by setting positioning round holes on both sides of the outer area of ​​the tape to construct an independent positioning reference, it not only effectively isolates the potential damage to the product body caused by die-cutting alignment, but also ensures the tension stability and processing alignment accuracy of the flexible pre-composite tape during long-distance transportation.

[0017] Preferably, in step S4, the segmented component includes at least a first segmented component and a second segmented component; the segmented contour punching includes: punching the contour of the first segmented component using a first die at a first punching station; punching the contour of the second segmented component using a second die at a second punching station; the first segmented component and the second segmented component are adjacent end-to-end in the conveying direction of the positioning carrier belt to splice together to form the complete die-cut semi-finished product.

[0018] By adopting the above technical solution, this application uses multi-station segmented punching to disassemble long-sized products and distribute them to different molds for step-by-step execution. This avoids the problem that conventional single-station molds cannot form workpieces longer than 450mm in one go due to insufficient punching range. At the same time, by using a positioning carrier as a unified bearing and guiding benchmark, it ensures that the first and second segments of the step-by-step punching can achieve high-precision seamless splicing, ensuring the integrity and dimensional consistency of the final die-cut semi-finished product's outline.

[0019] Preferably, the target length of the magnetic shielding assembly is greater than 450 mm, and the combined length of the first segment and the second segment is equal to the target length.

[0020] By adopting the above technical solution, this application successfully overcomes the hardware limitation that the effective punching stroke of conventional precision die-cutting equipment is usually less than 450 mm by disassembling the magnetic shielding component with a diameter greater than 450 mm into the first segment and the second segment for step-by-step processing. Without the need to customize expensive ultra-large molds or replace large equipment, it realizes low-cost, high-precision and continuous manufacturing of ultra-long magnetic shielding components.

[0021] Preferably, in step S5, the process of removing waste includes: first removing the waste from the internal holes of the die-cut semi-finished product, and then removing the waste frame around the outer contour of the die-cut semi-finished product; the cutting process is to use a cutting tool to cut along the direction perpendicular to the length of the positioning carrier belt.

[0022] By adopting the above technical solution, this application ensures the complete separation of complex structure waste through graded waste removal, avoiding the back-adhesion or residue of small waste materials. At the same time, the positioning carrier is cut together with the cutting tool. The positioning carrier serves as a rigid substrate during cutting, which effectively overcomes the problems of end burrs, extrusion deformation and interlayer misalignment that are easily generated when cutting flexible multilayer materials directly, and improves the flatness and dimensional consistency of the cut of the final multilayer shielding sheet.

[0023] Preferably, in step S6, the stacking fixture has a positioning cavity that matches the outline of the magnetic shielding assembly; the multi-layer shielding sheets are sequentially placed into the positioning cavity, each multi-layer shielding sheet has a double-sided adhesive layer, and the multi-layer shielding sheets are fixed between layers by the double-sided adhesive layer until 10 multi-layer shielding sheets are stacked, so that the target thickness reaches 2 mm.

[0024] By adopting the above technical solution, the positioning cavity of the stacking fixture is used to force the single layer of multi-layer shielding sheet to be vertically stacked, and the double-sided adhesive layer is used to fix the layers. This application effectively eliminates the misalignment between layers and the difference in edge steps, avoids the direct punching of high-thickness materials, and thus realizes the precision forming of 2 mm thick magnetic shielding components, ensuring the dimensional accuracy and appearance quality of the product.

[0025] Preferably, during the stacking assembly process of S6, each multi-layer shielding sheet is placed into the stacking fixture while remaining in a flat state.

[0026] By adopting the above technical solution, the internal stress caused by bending of the material is effectively eliminated by maintaining the flat and unfolded state of the multi-layer shielding sheet during the stacking and assembly process. This application prevents defects such as microcracks, wrinkles and delamination, and improves the integrity of the magnetic shielding assembly and the yield of finished products.

[0027] Preferably, a magnetic shielding component manufacturing apparatus includes a release film conveying mechanism, a release film punching mechanism, a pre-composite strip bonding mechanism, a first punching mechanism, a first strip conveying mechanism, a second punching mechanism, a second strip conveying mechanism, a waste removal slicing mechanism, and a stacking fixture, arranged sequentially along the positioning carrier conveying direction; the release film punching mechanism is used to punch positioning features on the release film; the pre-composite strip bonding mechanism is used to bond the pre-composite strip to the release film with positioning features; the first punching mechanism and the second punching mechanism are used to perform segmented contour punching on the bonded pre-composite strip.

[0028] By adopting the above technical solution, this application pre-positions the global position through the release film punching mechanism, and coordinates the segmented punching with the first punching mechanism and the second punching mechanism to solve the equipment limitation that long-size components cannot be formed in a single mold in one go. At the same time, multi-layer stacking assembly is realized through stacking fixtures, avoiding the problems of edge breakage and forming difficulties caused by direct processing of thick magnetic shielding materials, and improving the dimensional accuracy, appearance quality and production efficiency of magnetic shielding components.

[0029] Preferably, the stacking fixture has an upward-opening positioning cavity for inserting the multi-layer shielding sheet individually, and a shielding sheet removal groove located on the side wall of the stacking fixture for connecting the positioning cavity with the external space; the shielding sheet removal groove is used to allow the multi-layer shielding sheet to be tilted out from the positioning cavity after the stacking assembly is completed.

[0030] By adopting the above technical solution, the positioning cavity ensures the automatic alignment accuracy of the multi-layer shielding sheet during stacking and assembly, preventing misalignment between layers. At the same time, the shielding sheet removal groove opened on the side wall creates a lateral tilting channel, which facilitates material removal in the deep cavity structure, avoids mechanical damage or deformation to the edge of the component caused by forced vertical removal, and improves operating efficiency and material removal yield.

[0031] In summary, this application includes at least one of the following beneficial technical effects:

[0032] 1. A method for preparing a magnetic shielding component, comprising firstly, forming a pre-composite strip by laminating several single-layer shielding raw materials, and then attaching the pre-composite strip to the surface of a positioning carrier strip pre-punched with positioning features to form a shielding sheet substrate. The processed die-cut semi-finished product is cut and separated along with the positioning carrier strip, and the separated multi-layer shielding sheets are glued and fixed by stacking fixtures in a stacked manner. This application adopts a process route of thin-layer die-cutting and thick-layer stacking, combined with the positioning features on the positioning carrier strip to achieve segmented positioning punching and precise alignment splicing of long dimensions. This not only effectively overcomes the problems of edge breakage and forming difficulties caused by direct punching when the target thickness of the magnetic shielding component is thick, but also ensures the dimensional accuracy and appearance quality of the component through the subsequent assembly of the stacking fixture, thereby improving the production yield and process flexibility.

[0033] 2. A magnetic shielding component manufacturing apparatus, which pre-positions the entire structure using a release film punching mechanism, and coordinates the segmented punching with a first punching mechanism and a second punching mechanism, thus solving the equipment limitation that long-sized components cannot be formed in a single mold in one step. At the same time, it achieves multi-layer stacking assembly through a stacking fixture, avoiding the problems of edge breakage and forming difficulties caused by direct processing of thick magnetic shielding materials, thereby improving the dimensional accuracy, appearance quality and production efficiency of the magnetic shielding component.

[0034] 3. A magnetic shielding component manufacturing apparatus, which ensures the automatic alignment accuracy of single multi-layer shielding sheets during stacking and assembly through a positioning cavity, preventing misalignment between layers; at the same time, a lateral inclined channel is constructed through the shielding sheet removal groove opened in the side wall, which facilitates material removal in the deep cavity structure, avoids mechanical damage or deformation to the edge of the component caused by forced vertical removal, and improves operating efficiency and material yield. Attached Figure Description

[0035] Figure 1This is a schematic diagram of the process steps of an embodiment of the preparation method of a magnetic shielding component according to this application.

[0036] Figure 2 This is a side view of an embodiment of a magnetic shielding component manufacturing apparatus according to this application.

[0037] Figure 3 This is a three-dimensional structural diagram of a stacked fixture in an embodiment of a magnetic shielding component manufacturing apparatus of this application.

[0038] Figure 4 This is a schematic diagram of the three-dimensional structure of a single-layer shielding material in an embodiment of a method for preparing a magnetic shielding component according to this application.

[0039] Explanation of reference numerals in the attached figures:

[0040] 1. Release film conveying mechanism; 2. Release film punching mechanism; 3. Pre-composite strip bonding mechanism; 4. First punching mechanism; 5. First strip conveying mechanism; 6. Second punching mechanism; 7. Second strip conveying mechanism; 8. Waste removal slicing mechanism; 9. Stacking fixture; 91. Positioning cavity; 92. Shielding sheet removal chute; 10. Single-layer shielding material; 101. Nanocrystalline alloy strip; 102. Double-sided adhesive layer. Detailed Implementation

[0041] The following is in conjunction with the appendix Figures 1 to 4 This application will be described in further detail.

[0042] This application discloses a method and apparatus for preparing a magnetic shielding component. (Refer to...) Figure 1 A method for preparing a magnetic shielding component includes the following steps:

[0043] S1. Preparation of pre-composite tape: Several single-layer shielding materials are laminated together to form a pre-composite tape with a first thickness, which is less than the target thickness of the magnetic shielding component.

[0044] S2. Preparation of positioning carrier: Provide a release substrate as a positioning carrier, and pre-punch to form positioning features on the positioning carrier;

[0045] S3, Carrier tape bonding and splicing: The pre-composite tape is bonded to the positioning carrier tape, and the pre-composite tape is aligned and spliced ​​based on the positioning features, so that the pre-composite tape forms a shielding substrate covering the target length along the length direction of the positioning carrier tape.

[0046] S4. Segmented positioning punching: The shielding sheet substrate is segmented and punched at different punching stations in sequence to form a die-cut semi-finished product with a complete outer contour and hole structure, which is composed of segmented parts punched from different stations.

[0047] S5. Waste removal and unitized cutting: Remove the waste material around the die-cut semi-finished product and cut the positioning carrier tape and the die-cut semi-finished product simultaneously to obtain an independent multi-layer shielding sheet.

[0048] S6. Fixture stacking assembly: Multiple multi-layer shielding sheets are sequentially placed into a stacking fixture for multi-layer stacking assembly until the target thickness is reached, forming a magnetic shielding assembly composed of stacked multi-layer shielding sheets.

[0049] This application first forms a pre-composite strip by laminating several single-layer shielding materials. The pre-composite strip is then attached to the surface of a positioning carrier strip with pre-cut positioning features to form the shielding sheet substrate. The processed die-cut semi-finished product is cut and separated along with the positioning carrier strip. The separated multi-layer shielding sheets are then glued and fixed together in a stacking manner using a stacking fixture. This application adopts a process route of thin-layer die-cutting and thick-layer stacking, combined with the positioning features on the positioning carrier strip, to achieve segmented positioning punching and precise alignment splicing of long dimensions. This not only effectively overcomes the problems of edge breakage and forming difficulties caused by direct punching when the target thickness of the magnetic shielding component is thick, but also ensures the dimensional accuracy and appearance quality of the component through the subsequent assembly of the stacking fixture, thereby improving the production yield and process flexibility.

[0050] Furthermore, in S1 of this application, each single-layer shielding material is a "sandwich" composite structure with a nanocrystalline alloy strip as the core layer and double-sided adhesive layers on both sides of the nanocrystalline alloy strip. The overall thickness of a single layer is limited to 20 micrometers. Then, the 10 layers of the single-layer shielding materials are stacked and pressed together in the thickness direction using the adhesive of the double-sided adhesive layers, thereby integrating them into a pre-composite strip with a first thickness of 0.2 mm. This application uses double-sided adhesive layers to encapsulate and pre-composite the extremely thin and brittle nanocrystalline alloy strip on both sides. On the one hand, the flexible buffering effect of the adhesive layer enhances the mechanical strength and anti-fracture performance of the 20-micrometer nanocrystalline alloy strip, avoiding breakage of the material due to tension during transmission. On the other hand, the basic thickness of the pre-composite strip is precisely controlled at 0.2 mm (first thickness), which ensures that the material has sufficient stiffness for transportation and is within the optimal processing range of conventional precision die-cutting, avoiding the excessive fragility of directly processing single-layer materials or edge breakage when processing the final thickness material.

[0051] like Figure 4 The single-layer shielding material 10 shown includes a nanocrystalline alloy strip 101 and a double-sided adhesive layer 102 attached to both sides of the nanocrystalline alloy strip.

[0052] Furthermore, in S2 of this application, the positioning carrier is preferably a PET release film. Several spaced positioning holes are provided through the outer edge areas on both sides of the positioning carrier along the width direction. The pre-composite tape is attached to the surface of the positioning carrier by adhesive and is precisely defined in the central area between the positioning holes on both sides, thereby forming a parallel distribution structure of "positioning holes on both sides and material tape in the middle" in space. This application uses the high strength characteristics of the PET release film to support the flexible pre-composite tape. By setting the positioning holes on the outside of the shielding substrate, a precise positioning reference structure independent of the product material is constructed. This avoids damage to the product body during subsequent die-cutting and alignment, and ensures the tension stability and alignment accuracy of the pre-composite tape during long-distance transportation.

[0053] Specifically, in step S4 of this application, the segmented component includes at least a first segmented component and a second segmented component. A first punching station equipped with a first mold and a second punching station equipped with a second mold are sequentially arranged along the conveying path of the positioning carrier belt. The shielding sheet substrate is attached to the positioning carrier belt and passes sequentially through the first and second punching stations. The first segmented component and the second segmented component are bonded together on the positioning carrier belt to maintain relative fixation. The positioning carrier belt carries the shielding sheet substrate to the first punching station, where the first mold performs a downward punching action to process the outline of the first segmented component on the shielding sheet substrate. Subsequently, the positioning carrier belt continues to convey the component to the second punching station, where the second mold, guided by the positioning carrier belt,... The pre-set relative position is used to perform a punching action to process the outline of the second segment, so that the first segment and the second segment are arranged end-to-end on the positioning carrier, thereby splicing them to form a complete die-cut semi-finished product. This application avoids the problem that conventional single-station molds cannot form workpieces longer than 450mm in one step due to insufficient punching range. At the same time, by using the positioning carrier as a unified bearing and guiding reference, it ensures that the first segment and the second segment can be seamlessly spliced ​​with high precision, ensuring the integrity and dimensional consistency of the final die-cut semi-finished product outline.

[0054] Furthermore, the target length of the magnetic shielding component in this application is preferably greater than 450 mm. The forming pattern of the magnetic shielding component is decomposed into a first segment and a second segment connected end to end. The first segment and the second segment are attached to the surface of the positioning carrier tape, and the combined length of the first segment and the second segment is equal to the target length. By decomposing the magnetic shielding component with a length greater than 450 mm into the first segment and the second segment for step-by-step processing, this application successfully overcomes the hardware limitation that the effective punching stroke of conventional precision die-cutting equipment is usually less than 450 mm. Without the need to customize expensive ultra-large molds or replace large equipment, low-cost, high-precision and continuous manufacturing of ultra-long magnetic shielding components is achieved.

[0055] Furthermore, in S5 of this application, the die-cut semi-finished product is attached to the surface of the positioning carrier in a bonded state. The waste portion on the die-cut semi-finished product is clearly distinguished into waste material in the internal holes and waste material frame around the outer contour, and is in a state to be separated. The cutting tool is arranged horizontally above the positioning carrier and perpendicular to the length direction of the positioning carrier. The positioning carrier conveys the die-cut semi-finished product into the waste removal process. First, the waste material in the internal holes of the die-cut semi-finished product is extracted and removed. Then, the waste material frame around the outer contour surrounding the die-cut semi-finished product is peeled off and removed as a whole, so that the die-cut semi-finished product with a clean shape continues to be synchronously conveyed with the positioning carrier to the process. At the cutting station, the cutting tool then performs a cutting action along the direction perpendicular to the length of the positioning carrier tape, cutting the positioning carrier tape and the die-cut semi-finished product together, thereby physically separating the independent multi-layer shielding sheet. This application ensures the complete separation of complex structure waste through graded waste removal, avoiding the back-sticking or residue of small waste materials. At the same time, the cutting tool is used to cut the positioning carrier tape together. By using the positioning carrier tape as a rigid substrate during cutting, the problems of end burrs, extrusion deformation and interlayer misalignment that are easily generated when cutting flexible multi-layer materials directly are effectively overcome, thereby improving the cut flatness and dimensional consistency of the final multi-layer shielding sheet.

[0056] Furthermore, in S6 of this application, a positioning cavity with a limiting function is provided on the stacking fixture. The geometry of the inner wall of the positioning cavity matches the outline of the magnetic shielding assembly and the individual multi-layer shielding sheets. Ten individual multi-layer shielding sheets are stacked sequentially in the vertical direction inside the positioning cavity. Adjacent individual multi-layer shielding sheets are physically bonded and fixed by a pre-set double-sided adhesive layer on their surface, thus integrating them into an integrated layered structure. In this application, the first individual multi-layer shielding sheet is first placed smoothly into the bottom of the positioning cavity to achieve initial positioning. Subsequently, the subsequent individual multi-layer shielding sheets are placed on the side wall of the positioning cavity. Guided by the stacking mechanism, the layers are sequentially placed and stacked on top of the previous single layer. The adhesion of the double-sided adhesive layer completes the interlayer bonding motion. This stacking action is repeated until a total of 10 layers are accumulated and the total thickness reaches the target thickness of 2 mm. This application uses the positioning cavity of the stacking fixture to forcibly align and support the multi-layer flexible materials, eliminating the interlayer misalignment and edge step difference that may occur during manual or mechanical stacking. At the same time, combined with the interlayer fixing effect of the double-sided adhesive layer, it is possible to obtain a 2 mm thick magnetic shielding component without the need for difficult thick plate punching processing, ensuring the flatness of the product appearance and the consistency of dimensions.

[0057] Furthermore, in the stacking assembly process of S6, the stacking fixture is preferably a rigid carrier with a planar support reference. The multi-layer shielding sheets are placed one by one inside the stacking fixture in a fully unfolded planar form to form a stress-free bending stacked structure. By adopting a flat placement operation, this application effectively reduces the internal stress caused by bending and rolling of the material, and reduces defects such as hidden cracks, breakage, wrinkling or delamination of the multi-layer shielding sheets, thereby ensuring the integrity and yield of the final magnetic shielding assembly.

[0058] Specifically, such as Figure 2 As shown, this application also discloses a magnetic shielding component manufacturing apparatus, including a release film conveying mechanism 1, a release film punching mechanism 2, a pre-composite strip bonding mechanism 3, a first punching mechanism 4, a first strip conveying mechanism 5, a second punching mechanism 6, a second strip conveying mechanism 7, a waste removal and slicing mechanism 8, and a stacking fixture 9 located at the end of the production line, all connected sequentially along the process flow direction. The release film conveying mechanism 1 outputs a release substrate, which is punched out with positioning features by the release film punching mechanism 2 to form a positioning carrier. The pre-composite strip bonding mechanism 3 precisely bonds the pre-composite strip onto the positioning carrier based on the positioning features. Subsequently, under the step-by-step conveying and tension control of the first strip conveying mechanism 5 and the second strip conveying mechanism 7, the material sequentially enters the first... The punching mechanism 4 and the second punching mechanism 6 complete the contour punching of the first segment and the second segment in steps to form a complete die-cut semi-finished product. Then, the waste removal and slicing mechanism 8 removes the waste material and cuts and separates it into independent single pieces along with the positioning carrier. The independent single pieces fall into the stacking fixture 9 to complete multi-layer stacking assembly. This application uses the release film punching mechanism 2 to perform global positioning in advance, and cooperates with the segmented punching of the first punching mechanism 4 and the second punching mechanism 6 to solve the equipment limitation that long-size components cannot be formed in a single mold in one step. At the same time, the stacking fixture 9 realizes multi-layer stacking assembly, avoids the edge breakage and forming difficulties caused by direct processing of thick magnetic shielding materials, and improves the dimensional accuracy, appearance quality and production efficiency of magnetic shielding components.

[0059] The output end of the first punching mechanism 4 is connected to the first mold, and the first punching mechanism 4 is located at the first punching station; the output end of the second punching mechanism 6 is connected to the second mold, and the second punching mechanism 6 is located at the second punching station.

[0060] More specifically, such as Figure 3As shown, the stacking fixture 9 of this application has an upward-opening positioning cavity 91 with a precision limiting function. The internal space of the positioning cavity 91 is connected to the external environment through a shielding sheet removal groove 92 opened on the side wall of the stacking fixture 9, so as to form a material picking channel that is easy to operate. The multi-layer shielding sheets are first inserted vertically into the positioning cavity 91 from the top. Under the guidance of the inner wall of the positioning cavity 91, they are automatically aligned and multi-layered adhesive stacked. After the multi-layer shielding sheets are assembled to reach the preset target thickness, the finished magnetic shielding assembly does not need to be vertically removed from the top. Instead, it is moved out of the positioning cavity 91 and into the external space in an inclined posture along the guide path of the shielding sheet removal groove 92. The positioning cavity 91 of this application ensures the alignment accuracy of the multi-layer flexible materials during assembly and prevents interlayer misalignment. The shielding sheet removal groove 92 facilitates material picking from the deep cavity structure. By providing a laterally inclined picking path, it avoids mechanical damage or deformation to the edge of the magnetic shielding assembly during forced removal, thereby improving production efficiency and material picking yield.

[0061] The implementation principle of the method and apparatus for preparing a magnetic shielding component in this application is as follows:

[0062] A method for preparing a magnetic shielding component involves first laminating several single-layer shielding materials to form a pre-composite strip. The pre-composite strip is then attached to the surface of a pre-punched positioning carrier strip to form a shielding sheet substrate. The processed die-cut semi-finished product is cut and separated along with the positioning carrier strip. The separated multi-layer shielding sheets are then bonded and fixed in a stacked manner using a stacking fixture. This application adopts a process route of thin-layer die-cutting and thick-layer stacking, combined with the positioning features on the positioning carrier strip, to achieve segmented positioning punching and precise alignment splicing of long dimensions. This not only effectively overcomes the problems of edge breakage and forming difficulties caused by direct punching when the target thickness of the magnetic shielding component is thick, but also ensures the dimensional accuracy and appearance quality of the component through subsequent assembly using a stacking fixture, thereby improving production yield and process flexibility.

[0063] A magnetic shielding component manufacturing apparatus comprises a release film conveying mechanism 1 that outputs a release substrate, which is then punched out with positioning features by a release film punching mechanism 2 to form a positioning carrier. A pre-composite tape bonding mechanism 3 precisely bonds the pre-composite tape onto the positioning carrier based on the positioning features. Subsequently, under the step-by-step conveying and tension control of a first tape conveying mechanism 5 and a second tape conveying mechanism 7, the material sequentially enters a first punching mechanism 4 and a second punching mechanism 6, completing the contour punching of the first and second segments in stages to form a complete die-cut semi-finished product. Afterward, it is discarded by a waste removal and slicing mechanism 8. The waste material is removed and the positioning carrier is cut and separated into individual pieces. The individual pieces fall into the stacking fixture 9 to complete the multi-layer stacking assembly. This application uses the release film punching mechanism 2 to perform global positioning in advance, and cooperates with the segmented punching of the first punching mechanism 4 and the second punching mechanism 6 to solve the equipment limitation that long-size components cannot be formed in a single mold in one go. At the same time, the stacking fixture 9 realizes multi-layer stacking assembly, avoids the problems of edge breakage and forming difficulties caused by direct processing of thick magnetic shielding materials, and improves the dimensional accuracy, appearance quality and production efficiency of magnetic shielding components.

[0064] The multi-layer shielding sheets are first inserted vertically into the positioning cavity 91 from above. Guided by the inner wall of the positioning cavity 91, they are automatically aligned and stacked in multiple layers. After the multi-layer shielding sheets are assembled to the preset target thickness, the finished magnetic shielding assembly does not need to be pried out vertically from above. Instead, it is moved out of the positioning cavity 91 into the external space in an inclined posture along the guide path of the shielding sheet removal groove 92. The positioning cavity 91 of this application ensures the alignment accuracy of the multi-layer flexible materials during assembly and prevents misalignment between layers. The shielding sheet removal groove 92 facilitates material removal from the deep cavity structure. By providing a laterally inclined removal path, it avoids mechanical damage or deformation to the edge of the magnetic shielding assembly during forced removal, thereby improving production efficiency and material yield.

[0065] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A method for preparing a magnetic shielding component, characterized in that, Includes the following steps: S1. Preparation of pre-composite tape: Several single-layer shielding materials are laminated together to form a pre-composite tape with a first thickness, the first thickness being less than the target thickness of the magnetic shielding component. S2. Preparation of positioning carrier tape: A release substrate is provided as a positioning carrier tape, and positioning features are pre-cut on the positioning carrier tape to form positioning features; the positioning carrier tape is a PET release film, and the positioning features are positioning circular holes distributed in the outer edge region of the positioning carrier tape. S3. Carrier tape bonding and splicing: The pre-composite tape is attached to the positioning carrier tape, the pre-composite tape covers the area between the positioning holes, and the pre-composite tape is aligned and spliced ​​based on the positioning features, so that the pre-composite tape forms a shielding substrate covering the target length along the length direction of the positioning carrier tape, and the positioning holes are located on the outside of the shielding substrate. S4. Segmented Positioning Punching: The shielding sheet substrate is sequentially segmented and punched at different punching stations to form a die-cut semi-finished product with a complete outer contour and hole structure, composed of segmented parts punched at different stations; wherein, the segmented parts include at least a first segmented part and a second segmented part; the segmented contour punching includes: punching the contour of the first segmented part at a first punching station using a first die; punching the contour of the second segmented part at a second punching station using a second die; the first segmented part and the second segmented part are adjacent end to end in the conveying direction of the positioning carrier belt to splice together to form the complete die-cut semi-finished product; S5. Waste removal and unitized cutting: Remove the waste material around the die-cut semi-finished product, and cut the positioning carrier and the die-cut semi-finished product simultaneously to obtain an independent multi-layer shielding sheet. S6. Fixture stacking assembly: Multiple multi-layer shielding sheets are sequentially placed into a stacking fixture for multi-layer stacking assembly until the target thickness is reached, forming a magnetic shielding assembly composed of stacked multi-layer shielding sheets.

2. The method for preparing a magnetic shielding component according to claim 1, characterized in that, In step S1, the single-layer shielding material includes a nanocrystalline alloy strip and a double-sided adhesive layer attached to both sides of the nanocrystalline alloy strip. The thickness of a single layer of the single-layer shielding material is 20 micrometers. Ten layers of the single-layer shielding material are laminated together through the double-sided adhesive layer to form the pre-composite strip. The first thickness is 0.2 millimeters.

3. The method for preparing a magnetic shielding component according to claim 1, characterized in that, The target length of the magnetic shielding assembly is greater than 450 mm, and the combined length of the first segment and the second segment is equal to the target length.

4. The method for preparing a magnetic shielding component according to claim 1, characterized in that, In step S5, the process of removing waste material around the die-cut semi-finished product includes: first removing waste material from the internal holes of the die-cut semi-finished product, and then removing waste material from the outer contour of the die-cut semi-finished product; the cutting process is to use a cutting tool to cut along the direction perpendicular to the length of the positioning carrier belt.

5. The method for preparing a magnetic shielding component according to claim 1, characterized in that, In step S6, the stacking fixture is provided with a positioning cavity that matches the outline of the magnetic shielding assembly; the multi-layer shielding sheet is placed into the positioning cavity in sequence, and the multi-layer shielding sheet is provided with a double-sided adhesive layer. The multi-layer shielding sheet is fixed between layers by the double-sided adhesive layer until 10 multi-layer shielding sheets are stacked, so that the target thickness reaches 2 mm.

6. The method for preparing a magnetic shielding component according to claim 5, characterized in that, During the stacking assembly process of S6, each multi-layer shielding sheet is placed into the stacking fixture while remaining in a flat state.

7. An apparatus for fabricating a magnetic shielding component according to any one of claims 1 to 6, characterized in that, The system includes a release film conveying mechanism (1), a release film punching mechanism (2), a pre-composite strip bonding mechanism (3), a first punching mechanism (4), a first strip conveying mechanism (5), a second punching mechanism (6), a second strip conveying mechanism (7), a waste removal slicing mechanism (8), and a stacking fixture (9), arranged sequentially along the positioning carrier belt conveying direction. The release film punching mechanism (2) is used to punch positioning features on the release film. The pre-composite strip bonding mechanism (3) is used to bond the pre-composite strip to the release film with positioning features. The first punching mechanism (4) and the second punching mechanism (6) are used to perform segmented contour punching on the bonded pre-composite strip. The stacking fixture (9) is provided with an upward-opening positioning cavity (91) for inserting the multi-layer shielding sheet individually, and a shielding sheet removal groove (92) located on the side wall of the stacking fixture (9) for connecting the positioning cavity (91) with the external space; the shielding sheet removal groove (92) is used for tilting out of the positioning cavity (91) after the multi-layer shielding sheet is stacked and assembled individually.

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