Fault positioning method and system adopting passive RFID tag

By integrating passive RFID smart chips and LED chip fault indication tags into the secondary circuit of intelligent substations, and utilizing micro boost modules for power supply and fault maps, real-time detection and accurate location of secondary circuit faults are achieved. This solves the problems of low efficiency and low accuracy of traditional positioning methods and reduces operation and maintenance costs.

CN121899561APending Publication Date: 2026-04-21STATE GRID HUNAN ELECTRIC POWER COMPANY LIMITED +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
STATE GRID HUNAN ELECTRIC POWER COMPANY LIMITED
Filing Date
2025-11-21
Publication Date
2026-04-21

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Abstract

The invention discloses a fault positioning method and system adopting a passive RFID tag, and the method comprises the steps: enabling a passive RFID intelligent chip and an LED chip to be integrated to form a fault indication tag, and enabling the fault indication tag to be disposed at a plurality of preset positions of a secondary circuit; monitoring an operation fault of the secondary circuit; when a fault occurs, the passive RFID intelligent chip corresponding to the fault position is activated to drive the LED chip to emit light as a fault indication; and determining a fault point according to the light emitting position of the LED chip, thereby realizing accurate positioning of the fault. According to the invention, the passive RFID intelligent chip and the LED chip are integrated, and the fault tag with activation and visual indication functions is constructed, so that the real-time detection, accurate positioning and visual display of the fault of the secondary circuit are realized, the accuracy and response efficiency of fault diagnosis are remarkably improved, and the operation and maintenance cost is reduced.
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Description

Technical Field

[0001] This invention relates to the field of smart grids, and specifically to a fault location method and system using passive RFID tags. Background Technology

[0002] In existing smart substation operations, secondary circuits serve as crucial carriers of equipment control, signal transmission, and protection logic, and their operational status directly impacts the accuracy of primary equipment control and the safety of system operation. However, due to the complex structure, numerous nodes, and dense line distribution of secondary circuits, faults such as open circuits, loose connections, or short circuits often require extensive manual inspections, point-by-point measurements, and on-site experience to locate the fault point. This results in low diagnostic efficiency and poor accuracy, severely hindering the timeliness of fault handling. Furthermore, traditional fault identification methods rely heavily on paper labels or fixed numbers, lacking dynamic feedback capabilities and failing to achieve real-time perception and visual labeling of circuit status, leading to high maintenance difficulty and a high risk of operational errors. With the increasing demands of smart grid and digital operation and maintenance, the limitations of traditional methods in terms of response speed, location accuracy, and information interaction are becoming increasingly prominent.

[0003] In recent years, Radio Frequency Identification (RFID) technology has been gradually applied to power system equipment management and status awareness scenarios due to its advantages such as non-contact identification, passive power supply, and read / write capabilities. Especially in complex substation scenarios, RFID tags can be bound to equipment for rapid identification and data traceability. However, current applications are mostly limited to static identification or asset management, and have not yet been deeply integrated into the fault location and visual diagnostics of secondary circuits. How to properly address these issues has become a pressing problem for the industry. Summary of the Invention

[0004] The technical problem to be solved by this invention is to provide a fault location method and system using passive RFID tags, which addresses the above-mentioned problems in the prior art. By constructing fault tags with activation and visualization indication functions, real-time detection, accurate location and intuitive display of secondary circuit faults are achieved, which significantly improves the accuracy and response efficiency of fault diagnosis and reduces operation and maintenance costs.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by the present invention includes the following steps: S1, integrate the passive RFID smart chip and the LED chip to form a fault indication tag, and place the fault indication tag in multiple predetermined positions in the secondary circuit; S2, monitor the operational faults of the secondary circuit; S3, when a fault occurs, the passive RFID smart chip corresponding to the fault location is activated to drive the LED chip to emit light as a fault indication; S4. Determine the fault point based on the light-emitting position of the LED chip to achieve accurate fault location.

[0006] Furthermore, the method for forming the fault indication tag in step S1 is as follows: The LED chip is connected to the control circuit of the passive RFID smart chip. A miniature boost module is configured in the circuit of the passive RFID smart chip. When the passive RFID smart chip is activated, the miniature boost module supplies power to the LED chip to drive the LED chip to emit light.

[0007] Furthermore, step S2 specifically involves reasoning about the link path of the detected abnormal fault based on the fault map, determining the source of the abnormal fault and the corresponding link path, wherein the fault map includes each device node of the secondary loop and its connection relationship.

[0008] The ability to quickly pinpoint the exact location of a fault consists of two aspects: the speed at which the fault is located on-site and the speed at which the fault is detected and indicated to a predetermined location.

[0009] Furthermore, step S3 includes: S31, when an abnormal circuit state is detected at a predetermined location, it is determined that a fault has occurred in the secondary circuit; S32, the RFID reader sends a radio frequency excitation signal to activate the passive RFID smart chip; S33, after the passive RFID smart chip is activated by receiving the radio frequency excitation signal, it uses the energy provided by the micro boost module to drive the LED chip to emit light to indicate the specific location of the fault.

[0010] Furthermore, step S3 also includes: S34, the passive RFID smart chip arranged on the circuit connected to the fault circuit is activated after receiving the radio frequency excitation signal, and uses the energy provided by the micro boost module to drive the LED chip to emit light, but the color is different from the light emitted in step S33, so as to intuitively show the possible range of the fault.

[0011] Furthermore, it also includes: S5 writes fault information to the passive RFID chip for future reference in case of another fault.

[0012] Furthermore, it also includes: S6. After troubleshooting, a reset command is sent to the fault indicator tag to cancel the fault indication state, turn off the LED chip of the fault indicator tag, and restore it to the initial standby state.

[0013] The present invention also provides a fault location system using passive RFID tags, comprising a processor and a computer-readable storage medium interconnected thereto, wherein the computer-readable storage medium stores a computer program, which is executed by the processor to implement the steps of the fault location method using passive RFID tags described above.

[0014] The present invention also provides a computer-readable storage medium storing a computer program, which, when executed by a processor, implements the steps of the above-described fault location method using passive RFID tags.

[0015] The present invention also provides a computer program product, including a computer program that, when executed by a processor, implements the steps of the above-described fault location method using passive RFID tags.

[0016] Compared with the prior art, the advantages of the present invention are as follows: This invention integrates a passive RFID smart chip with an LED chip to create a fault tag with activation and visual indication functions. This enables real-time detection, accurate location, and intuitive display of secondary circuit faults, significantly improving the accuracy and response efficiency of fault diagnosis and reducing maintenance costs. Attached Figure Description

[0017] Figure 1 A schematic diagram of the process of this invention. Detailed Implementation

[0018] The present invention will be further described below with reference to the accompanying drawings and specific preferred embodiments, but this does not limit the scope of protection of the present invention.

[0019] The technical solution adopted in this embodiment is as follows: Figure 1 As shown, it includes the following steps: S1, integrate the passive RFID smart chip and the LED chip to form a fault indication tag, and place the fault indication tag in multiple predetermined positions in the secondary circuit; S2, monitor the operational faults of the secondary circuit; S3, when a fault occurs, the passive RFID smart chip corresponding to the fault location is activated to drive the LED chip to emit light as a fault indication; S4. Determine the fault point based on the light-emitting position of the LED chip to achieve accurate fault location.

[0020] In practical applications, substations consist of multiple devices, each of which is composed of multiple circuits. Although fault detection can pinpoint the specific circuit that has malfunctioned, it is difficult for on-site maintenance personnel to directly identify the faulty circuit due to the complexity of the wiring. Therefore, installing a passive, long-term, and luminous fault indicator tag on the circuit allows the indicator light to automatically illuminate when maintenance personnel approach, making it easier for them to locate the specific circuit that has malfunctioned more quickly.

[0021] Preferably, the method for forming the fault indication tag in step S1 is as follows: The LED chip is connected to the control circuit of the passive RFID smart chip. A miniature boost module is configured in the circuit of the passive RFID smart chip. When the passive RFID smart chip is activated, the miniature boost module supplies power to the LED chip to drive the LED chip to emit light.

[0022] Passive RFID smart chips have extremely low output voltage and power, and usually require energy storage devices to light up LEDs. However, the energy provided by passive RFID smart chips is very limited and they are passively activated, so this method is inconvenient and difficult to implement. Therefore, this embodiment uses a miniature boost module to ensure that the fault indication tag can be used for a long time without energy storage and without the lifespan problem caused by energy storage devices.

[0023] Preferably, step S2 specifically involves reasoning about the link path of the detected abnormal fault based on the fault map, determining the abnormal fault source and the corresponding link path, wherein the fault map includes each device node of the secondary loop and its connection relationship.

[0024] The ability to quickly pinpoint the exact location of a fault consists of two aspects: the speed at which the fault is located on-site and the speed at which the fault is detected and indicated to a predetermined location.

[0025] Preferably, step S3 includes: S31, when an abnormal circuit state is detected at a predetermined location, it is determined that a fault has occurred in the secondary circuit; S32, the RFID reader sends a radio frequency excitation signal to activate the passive RFID smart chip; S33, after the passive RFID smart chip is activated by receiving the radio frequency excitation signal, it uses the energy provided by the micro boost module to drive the LED chip to emit light to indicate the specific location of the fault.

[0026] Preferably, step S3 further includes: S34, the passive RFID smart chip arranged on the circuit connected to the fault circuit is activated after receiving the radio frequency excitation signal, and uses the energy provided by the micro boost module to drive the LED chip to emit light, but the color is different from the light emitted in step S33, so as to intuitively show the possible range of the fault.

[0027] Preferred options also include: S5 writes fault information to the passive RFID chip for future reference in case of another fault.

[0028] Preferred options also include: S6. After troubleshooting, a reset command is sent to the fault indicator tag to cancel the fault indication state, turn off the LED chip of the fault indicator tag, and restore it to the initial standby state.

[0029] This embodiment also provides a fault location system using passive RFID tags, including a processor and a computer-readable storage medium connected to each other. The computer-readable storage medium stores a computer program, which is executed by the processor to implement the steps of the fault location method using passive RFID tags described above.

[0030] This embodiment also provides a computer-readable storage medium storing a computer program, which, when executed by a processor, implements the steps of the above-described fault location method using passive RFID tags.

[0031] This embodiment also provides a computer program product, including a computer program that, when executed by a processor, implements the steps of the above-described fault location method using passive RFID tags.

[0032] Compared with the prior art, the advantages of this embodiment are: This embodiment integrates a passive RFID smart chip with an LED chip to construct a fault tag with activation and visual indication functions, realizing real-time detection, accurate location and intuitive display of secondary circuit faults, significantly improving the accuracy and response efficiency of fault diagnosis and reducing operation and maintenance costs.

[0033] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product embodied on one or more computer-readable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code. This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of this application. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create a machine for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The functions specified in one or more boxes. These computer program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable apparatus for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0034] The above description is merely a preferred embodiment of the present invention. The scope of protection of the present invention is not limited to the above embodiments. All technical solutions falling within the scope of the present invention's concept are within the scope of protection of the present invention. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principle of the present invention should also be considered within the scope of protection of the present invention.

Claims

1. A fault location method using passive RFID tags, characterized in that, include: S1, integrate the passive RFID smart chip and the LED chip to form a fault indication tag, and place the fault indication tag in multiple predetermined positions in the secondary circuit; S2, monitor the operational faults of the secondary circuit; S3, when a fault occurs, the passive RFID smart chip corresponding to the fault location is activated to drive the LED chip to emit light as a fault indication; S4. Determine the fault point based on the light-emitting position of the LED chip to achieve accurate fault location.

2. The fault location method using passive RFID tags according to claim 1, characterized in that, The method for forming the fault indication tag in step S1 is as follows: The LED chip is connected to the control circuit of the passive RFID smart chip. A miniature boost module is configured in the circuit of the passive RFID smart chip. When the passive RFID smart chip is activated, the miniature boost module supplies power to the LED chip to drive the LED chip to emit light.

3. The fault location method using passive RFID tags according to claim 1, characterized in that, Step S2 specifically involves reasoning about the link path of the detected abnormal fault based on the fault map, determining the source of the abnormal fault and the corresponding link path. The fault map includes each device node of the secondary loop and its connection relationship.

4. The fault location method using passive RFID tags according to claim 1, characterized in that, Step S3 includes: S31, when an abnormal circuit state is detected at a predetermined location, it is determined that a fault has occurred in the secondary circuit; S32, the RFID reader sends a radio frequency excitation signal to activate the passive RFID smart chip; S33, after the passive RFID smart chip is activated by receiving the radio frequency excitation signal, it uses the energy provided by the micro boost module to drive the LED chip to emit light to indicate the specific location of the fault.

5. A fault location method using passive RFID tags according to claim 4, characterized in that, Step S3 further includes: S34, the passive RFID smart chip arranged on the circuit connected to the fault circuit is activated after receiving the radio frequency excitation signal, and uses the energy provided by the micro boost module to drive the LED chip to emit light, but the color is different from the light emitted in step S33, so as to intuitively show the possible range of the fault.

6. A fault location method using passive RFID tags according to claim 1, characterized in that, Also includes: S5 writes fault information to the passive RFID chip for future reference in case of another fault.

7. A fault location method using passive RFID tags according to claim 1, characterized in that, Also includes: S6. After troubleshooting, a reset command is sent to the fault indicator tag to cancel the fault indication state, turn off the LED chip of the fault indicator tag, and restore it to the initial standby state.

8. A fault location system using passive RFID tags, characterized in that, The method includes an interconnected processor and a computer-readable storage medium, wherein the computer-readable storage medium stores a computer program that is executed by the processor to implement the steps of the fault location method using passive RFID tags as described in any one of claims 1 to 7.

9. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by a processor, implements the steps of the fault location method using passive RFID tags as described in any one of claims 1 to 7.

10. A computer program product, characterized in that, It includes a computer program, which, when executed by a processor, implements the steps of the fault location method using passive RFID tags as described in any one of claims 1 to 7.