Multi-pin electronic component packaging structure

Abstract

The invention discloses a multi-pin electronic component packaging structure, and relates to the technical field of semiconductor device packaging, the multi-pin electronic component packaging structure comprises a support frame, the front end of the support frame is provided with a control system, the top of the support frame is provided with a left-right moving mechanism, the movable end of the left-right moving mechanism is provided with an up-down adjusting mechanism, and the up-down adjusting mechanism is provided with an up-down adjusting mechanism. A turnover mechanism is arranged at the movable end of the up-down adjusting mechanism, and a fine adjustment mechanism is arranged in the middle of the turnover mechanism. According to the invention, through the precise cooperation of the four-stage adjusting mechanism and the limiting mechanism, the positioning deviation of the component and the damage rate of the pin are respectively controlled; the heating mechanism accelerates curing of epoxy resin, ejector pin type demolding is combined, the voidage and layering rate of a packaging body are lower than and far superior to the quality level of traditional manual packaging or semi-automatic equipment, and the strict requirements of multi-pin components for electrical performance and reliability are met.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device packaging technology, specifically to a multi-pin electronic component packaging structure. Background Technology

[0002] With the rapid rise of high-end fields such as artificial intelligence, automotive electronics, and third-generation semiconductors, the integrated circuit industry's demand for packaging technology is upgrading from "basic protection" to "high-density integration, high reliability, and efficient mass production." Among them, multi-pin electronic components (such as QFP, SOP, and system-in-package devices with 50-500 pins) are increasingly used in communication base stations, autonomous driving chips, and other scenarios due to their adaptability to complex circuit integration requirements.

[0003] However, existing technologies have significant drawbacks in manual packaging: positioning relies on visual judgment, which is prone to deviations, and pin deformation and exposure are frequent problems, increasing the probability of defective products; processing efficiency is low; injection volume is controlled by experience, which is prone to overflow or insufficient material; natural curing takes a long time and is prone to voids, while also posing risks of burns and dust pollution. Secondly, semi-automated equipment has prominent bottlenecks: process separation requires manual connection, increasing the proportion of conversion time; there is no precise fine-tuning mechanism, which increases the adsorption and offset rate of electronic components, and mechanical clamping is prone to damage to pins; changeover requires manual replacement of parts, resulting in poor adaptability; and there is a lack of closed-loop control, with anomalies relying on manual inspection. Summary of the Invention

[0004] The purpose of this invention is to provide a multi-pin electronic component packaging structure to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a multi-pin electronic component packaging structure, comprising a support frame, a control system installed at the front end of the support frame, a left-right moving mechanism installed at the top of the support frame, an up-down adjusting mechanism installed at the movable end of the left-right moving mechanism, a flipping mechanism provided at the movable end of the up-down adjusting mechanism, a fine-tuning mechanism provided in the middle of the flipping mechanism, a long plate provided in the middle of the fine-tuning mechanism, a heating mechanism installed at the lower end of the long plate, a vacuum adsorption component installed at the upper end of the long plate, a shaped frame plate installed at one end of the support frame, a mold base installed at the upper end of the shaped frame plate, six sets of mold slots opened at the upper end of the mold base, a limit mechanism provided at the upper end of the shaped frame plate, and an ejection mechanism provided at the inner top of the shaped frame plate. The flipping mechanism includes a fixed frame, a long rod rotatably mounted inside the fixed frame, a servo motor fixedly mounted on a protrusion on one side of the fixed frame, two sets of belt drive assemblies being driven on the outer wall of the long rod, and rotating rods rotatably mounted through both sides of the fixed frame. The left-right moving mechanism and the up-down adjusting mechanism are both connected to the control system signal. The fine-tuning mechanism includes two sets of L-shaped seats. Irregularly shaped connecting plates are installed on both sides of the long plate. Two sets of miniature cylinders are installed at the bottom of the inner side of the two sets of L-shaped seats. Slide rails are installed at the bottom of the inner side of the two sets of L-shaped seats. Slide seats are slidably installed on the outer wall of the two sets of slide rails.

[0006] Preferably, one end of the fixed frame is fixed to the movable end of the up-down adjustment mechanism, one end of the long rod passes through one end of the protrusion of the fixed frame and is fixed to the output end of the servo motor, the outer walls of the two sets of rotating rods are respectively fixed to the inner walls of the two driven wheels in the two sets of belt drive assemblies, and the servo motor is connected to the control system signal.

[0007] Preferably, one side of each of the two sets of L-shaped seats is fixed to one end of each of the two sets of rotating rods, the extended ends of each of the two sets of miniature cylinders are fixed to one end of each of the two sets of irregular connecting plates, the upper ends of each of the two sets of slides are fixed to the lower end of the long plate, and each of the two sets of miniature cylinders is connected to the control system signal.

[0008] Preferably, the limiting mechanism includes a slide cylinder, a movable plate is provided at the upper end of the irregular frame plate, a long block is installed at the upper end of the movable plate, a displacement sensor is installed at the upper end of the movable plate, an arc plate is provided inside each of the six sets of mold slots, and two sets of push rods are fixedly installed at one end of each of the six sets of arc plates.

[0009] Preferably, the upper end of the slide cylinder is fixed to the inner top of the irregular frame plate, the upper end of the movable plate is fixed to the lower end of the movable end of the slide cylinder, one end of each of the multiple sets of push rods penetrates the outer wall of the mold base and is fixed to one end of the long block, and the displacement sensor and the slide cylinder are both connected to the control system signal.

[0010] Preferably, the ejection mechanism includes an L-shaped plate, with two sets of small cylinders installed through the lower end of the L-shaped plate, four sets of ejector pins inserted through the interior of each of the six sets of mold slots, and two sets of push plates installed at the extended ends of the two sets of small cylinders.

[0011] Preferably, the lower ends of the multiple sets of ejector pins all penetrate the lower end of the mold base and the upper end of the irregular frame plate, and are all fixed to the upper end of the push plate. Both sets of small cylinders are connected to the control system signal.

[0012] Preferably, a conveyor belt mechanism is installed at the bottom of the inner side of the support frame, two sets of concave blocks are installed at the top of the upper side of the conveyor belt mechanism frame, multiple sets of guide plates are installed at the top of the inner side of the two sets of concave blocks, a placement platform is installed at the bottom of the inner side of the support frame, a storage seat is installed at the top of the placement platform, and six sets of long slots are opened at one end of the storage seat. One end of every two sets of guide plates is aligned with the two edges of the opening of one set of long slots. The conveyor belt mechanism is connected to the control system signal.

[0013] Preferably, a second telescopic rod is installed through the protrusion at one end of the irregularly shaped frame plate, an injection molding mechanism is provided above the irregularly shaped frame plate, a sliding block is slidably installed at the upper end of the irregularly shaped frame plate, the lower end of the injection molding mechanism frame is fixed to the upper end of the sliding block, and the second telescopic rod is connected to the system signal.

[0014] Preferably, a fixed frame plate is installed at the bottom of the inner side of the support frame, and a telescopic rod is installed through one side of the protrusion of the fixed frame plate. A concave seat is installed at the upper end of the irregular frame plate, and a concave plate is slidably installed inside the concave seat. A sliding frame is slidably installed at the upper end of the fixed frame plate, and one side of the concave plate is fixed to one side of the sliding frame. The protruding end of the first telescopic rod is fixed to one side of the sliding frame, and the first telescopic rod is signal-connected to the control system.

[0015] Compared with the prior art, the beneficial effects of the present invention are: 1. In this invention, the precise coordination of the four-level adjustment mechanism and the limiting mechanism controls the component positioning deviation and pin damage rate. The heating mechanism accelerates the curing of epoxy resin, and combined with the ejector pin demolding, the void rate and delamination rate of the package are also reduced, which is far superior to the quality level of traditional manual packaging or semi-automatic equipment, and is suitable for the stringent requirements of multi-pin components for electrical performance and reliability.

[0016] 2. In this invention, the equipment can achieve simultaneous packaging of six groups of components, shortening the packaging time per batch and increasing the production capacity of electronic components. Compared with traditional single-slot packaging equipment, the efficiency is greatly improved. Through the specification library call of the control system and the adaptive adjustment of the mechanism parameters, it can adapt to multiple specifications of components within a small size range without changing the mold. The changeover time for small-batch, multi-variety production is shortened, and the production switching cost is reduced.

[0017] 3. In this invention, the equipment does not require manual intervention in core processes such as component gripping, positioning, and packaging. Only a single operator is required to handle material loading and finished product collection. By replacing mechanical clamping with vacuum adsorption, combined with the safety protection design of the heating mechanism, the risks of components falling and burns during manual operation are avoided, while also reducing dust pollution caused by human contact.

[0018] 4. In this invention, each system adopts modular installation (such as the injection molding mechanism and the flipping mechanism can be disassembled independently), and can be quickly replaced and repaired when a fault occurs, thus shortening the downtime for maintenance; the reserved interface can increase the number of mold slots (expanded to 8-12 sets) or upgrade the detection module (such as adding AOI appearance inspection) as needed, adapting to the needs of the semiconductor packaging industry with rapid technological iteration, and extending the service life of the equipment. Attached Figure Description

[0019] Figure 1This is a three-dimensional structural diagram of a multi-pin electronic component packaging structure according to the present invention; Figure 2 This is a front view of a multi-pin electronic component packaging structure according to the present invention. Figure 3 This is a schematic diagram of the conveyor belt mechanism and placement platform structure of a multi-pin electronic component packaging structure according to the present invention; Figure 4 This is a partial perspective view of a multi-pin electronic component packaging structure according to the present invention; Figure 5 This is a perspective view of the flipping mechanism and fine-tuning mechanism of a multi-pin electronic component packaging structure according to the present invention; Figure 6 This is a schematic diagram of the flipping mechanism and long plate structure of a multi-pin electronic component packaging structure according to the present invention; Figure 7 This is a schematic diagram of the fixed frame plate, the second telescopic rod, the irregular frame plate, and the L-shaped plate structure of a multi-pin electronic component packaging structure according to the present invention. Figure 8 This is a schematic diagram of the limiting mechanism, the second telescopic rod, and the irregularly shaped frame plate of a multi-pin electronic component packaging structure according to the present invention. Figure 9 This invention relates to a multi-pin electronic component packaging structure. Figure 8 A magnified structural diagram of A in the middle; Figure 10 This is a schematic diagram of the ejection mechanism and irregularly shaped frame structure of a multi-pin electronic component packaging structure according to the present invention.

[0020] In the diagram: 1. Support frame; 11. Control system; 12. Conveyor belt mechanism; 121. Concave block; 122. Guide plate; 13. Placement platform; 131. Storage seat; 132. Long trough; 14. Left and right moving mechanism; 15. Up and down adjusting mechanism; 16. Fixed frame plate; 161. No. 1 telescopic rod; 162. Concave plate; 163. Concave seat; 164. Sliding frame; 17. Long plate; 171. Heating mechanism; 172. Vacuum adsorption assembly; 18. No. 2 telescopic rod; 181. Injection molding mechanism; 182. Sliding block; 19. Irregularly shaped frame plate 191. Mold base; 192. Mold groove; 2. Tilting mechanism; 21. Fixed frame; 22. Long rod; 23. Servo motor; 24. Belt drive assembly; 25. Rotating rod; 3. Fine adjustment mechanism; 31. L-shaped seat; 32. Irregularly shaped connecting plate; 33. Miniature cylinder; 34. Slide rail; 35. Slide seat; 4. Limiting mechanism; 41. Slide cylinder; 42. Movable plate; 43. Long block; 44. Displacement sensor; 45. Arc plate; 46. Push rod; 5. Ejection mechanism; 51. L-shaped plate; 52. Small cylinder; 53. Ejector pin; 54. Push plate. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] Example 1: Refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9 and Figure 10 As shown: A multi-pin electronic component packaging structure includes a support frame 1, a control system 11 installed at the front end of the support frame 1, a left-right moving mechanism 14 installed at the top of the support frame 1, an up-down adjusting mechanism 15 installed at the movable end of the left-right moving mechanism 14, a flipping mechanism 2 provided at the movable end of the up-down adjusting mechanism 15, a fine-tuning mechanism 3 provided in the middle of the flipping mechanism 2, a long plate 17 provided in the middle of the fine-tuning mechanism 3, a heating mechanism 171 installed at the lower end of the long plate 17, a vacuum adsorption component 172 installed at the upper end of the long plate 17, a shaped frame plate 19 installed at one end of the support frame 1, a mold base 191 installed at the upper end of the shaped frame plate 19, six sets of mold slots 192 opened at the upper end of the mold base 191, a limit mechanism 4 provided at the upper end of the shaped frame plate 19, and an ejection mechanism 5 provided at the inner top of the shaped frame plate 19. The flipping mechanism 2 includes a fixed frame 21, a long rod 22 is rotatably mounted inside the fixed frame 21, a servo motor 23 is fixedly mounted on a protrusion on one side of the fixed frame 21, two sets of belt drive assemblies 24 are driven to be mounted on the outer wall of the long rod 22, and rotating rods 25 are rotatably mounted through both sides of the fixed frame 21. The left and right moving mechanism 14 and the up and down adjusting mechanism 15 are both signal connected to the control system 11. One end of the fixed frame 21 is fixed to the movable end of the up and down adjusting mechanism 15. One end of the long rod 22 passes through one end of the protrusion of the fixed frame 21 and is fixed to the output end of the servo motor 23. The outer walls of the two sets of rotating rods 25 are respectively fixed to the inner walls of the two driven wheels in the two sets of belt drive assemblies 24. The servo motor 23 is signal connected to the control system 11. The fine-tuning mechanism 3 includes two sets of L-shaped seats 31. Different-shaped connecting plates 32 are installed on both sides of the long plate 17. Two sets of miniature cylinders 33 are installed at the bottom of the two sets of L-shaped seats 31. Slide rails 34 are installed at the bottom of the two sets of L-shaped seats 31. Slide seats 35 are slidably installed on the outer walls of the two sets of slide rails 34. One side of the two sets of L-shaped seats 31 is fixed to one end of the two sets of rotating rods 25 respectively. The extended ends of the two sets of miniature cylinders 33 are fixed to one end of the two sets of different-shaped connecting plates 32 respectively. The upper ends of the two sets of slide seats 35 are fixed to the lower end of the long plate 17. The two sets of miniature cylinders 33 are connected to the control system 11 by signal. A conveyor belt mechanism 12 is installed at the bottom of the support frame 1. Two sets of concave blocks 121 are installed at the top of the frame of the conveyor belt mechanism 12. Multiple sets of guide plates 122 are installed at the top of the two sets of concave blocks 121. A placement platform 13 is installed at the bottom of the support frame 1. A storage seat 131 is installed at the top of the placement platform 13. Six sets of long grooves 132 are opened at one end of the storage seat 131. One end of every two sets of guide plates 122 is aligned with the two edges of the opening of a set of long grooves 132. The conveyor belt mechanism 12 is connected to the control system 11.

[0023] In this embodiment, the support frame 1 is the overall load-bearing structure of the equipment, providing an installation benchmark for each functional module. Its front-end integrated control system 11 serves as the "central hub" of the equipment, enabling signal linkage with all electric / pneumatic components such as the left and right moving mechanism 14, the up and down adjusting mechanism 15, and the servo motor 23, and coordinating the timing of each process action.

[0024] The conveyor belt mechanism 12 is responsible for transporting multi-pin electronic components to be packaged in batches to the processing area. The two sets of concave blocks 121 installed on the upper end of its frame and the multiple sets of guide plates 122 at the top inside can accurately guide components of different specifications through the spacing adaptation design, avoiding deviation during the transportation process.

[0025] The placement platform 13 is located at the end of the conveyor belt mechanism 12 and serves as a temporary storage and gripping station for electronic components. The storage seat 131 at its upper end has six sets of long slots 132. The opening edge of each set of long slots 132 is aligned with the ends of two sets of guide plates 122 to ensure that the guided components fall accurately into the long slots 132 for positioning, thus achieving a seamless connection between "conveying and temporary storage".

[0026] Grab and transfer adjustment system: This system is the core execution unit of the equipment, responsible for the precise transfer of components between the temporary storage area, mold area, and discharge area. It consists of a four-level adjustment mechanism and execution components: "movement - lifting - flipping - fine adjustment". The left and right moving mechanism 14 is installed on the top of the support frame 1, providing a wide range of horizontal movement power. Its movable end is connected to the up and down adjusting mechanism 15, which can drive the subsequent components to switch positions between the placement table 13, the mold base 191, and the concave base 163. The vertical adjustment mechanism 15 connects the left and right moving mechanism 14 and the flipping mechanism 2. It achieves vertical height adjustment through telescopic movement, ensuring that the actuator can accurately approach the storage seat 131 (grabbing), the mold groove 192 (discharging), and the concave seat 163 (discharging). The flipping mechanism 2 consists of a fixed frame 21, a long rod 22, a servo motor 23, a belt drive assembly 24, and a rotating rod 25. The fixed frame 21 is fixed to the movable end of the up-down adjustment mechanism 15. The servo motor 23 drives the long rod 22 to rotate. The two sets of belt drive assemblies 24 synchronously drive the rotating rods 25 on both sides to rotate. Then, the fine adjustment mechanism 3 drives the long plate 17 to achieve a 180° flip. The fine-tuning mechanism 3 connects the flipping mechanism 2 and the actuating component. It consists of two sets of L-shaped seats 31, irregular connecting plates 32, micro cylinders 33, slide rails 34 and slide blocks 35. The two sets of L-shaped seats 31 are respectively fixed to the rotating rods 25 of the flipping mechanism 2. When the micro cylinders 33 extend and retract, they can push the irregular connecting plates 32 to drive the long plate 17 to slide along the slide rails 34, thereby achieving high-precision horizontal fine-tuning. Execution components: integrated at the top and bottom ends of the long plate 17, the lower end is the heating mechanism 171 (used for rapid curing of epoxy resin after encapsulation), and the upper end is the vacuum adsorption component 172 (composed of a suction nozzle, vacuum generator and pressure sensor, used for adsorbing components). The position switching between the two is achieved by the flipping mechanism 2.

[0027] Through the unified scheduling of control system 11, all systems form an operating mechanism that is "closely connected, highly efficient, and with controllable precision." The advantages of this cooperation are mainly reflected in the following four aspects: 1. Precise positioning throughout the entire "transport-temporary storage-grabbing" chain, adaptable to multiple component specifications: The guide plate 122 of the conveyor belt mechanism 12 is precisely aligned with the long groove 132 of the storage seat 131 to achieve "offset-free transition" in component transportation; the vacuum adsorption component 172, in conjunction with the fine-tuning mechanism 3, can call different adsorption parameters (such as nozzle model and vacuum degree) through the control system 11 to adapt to components of various specifications with different pin numbers and sizes; the displacement sensor 44 of the limiting mechanism 4 and the slide cylinder 41 form a closed-loop control, and the clamping force can be dynamically adjusted according to the component shell material (ceramic / plastic) to control positioning deviation.

[0028] 2. Four-level adjustment: "movement-lifting-flipping-fine-adjustment," making transplanting flexible and efficient. The left-right moving mechanism 14 and the up-down adjusting mechanism 15 enable a wide range of workstation switching to meet the batch production cycle time; the flipping mechanism 2 enables the smooth flipping of the long plate 17 through belt drive, and can quickly switch between "adsorption gripping" and "heat curing" functions; the slide rail 34 of the fine-tuning mechanism 3 cooperates with the micro cylinder 33 to solve the "last mile" accuracy problem after a wide range of movement, ensuring that the components fall accurately into the mold slot 192 or the concave seat 163.

[0029] 3. Collaborative "injection molding-curing-demolding" packaging process ensures packaging quality: The injection mechanism 181 achieves continuous injection of multiple mold slots 192 through the second telescopic rod 18. The injection volume and moving speed are matched with the dimensions of the mold slots 192 through the control system 11 to avoid overflow or shortage of material. The heating mechanism 171 can quickly approach the mold base 191 after injection and raise the curing temperature of the epoxy resin to [150-180]℃, shortening the curing time to 1 / 3 of the traditional process. The multiple sets of ejector pins 53 of the ejection mechanism 5 move synchronously and cooperate with the secondary gripping of the vacuum adsorption component 172 to achieve non-destructive demolding of the packaged parts.

[0030] IV. Full-process automated linkage reduces human intervention and errors: All processes, from component conveying, gripping, packaging to material discharge, are automatically executed by the control system 11 through preset programs. The timing of each mechanism's actions is linked by signal feedback to achieve "completion of the previous process - start of the next process" (e.g., the left and right moving mechanism 14 only starts after the vacuum adsorption component 172 detects the "adsorption successful" signal). Sensors such as displacement sensor 44 and pressure sensor collect data in real time. When an abnormality occurs (such as adsorption failure or positioning deviation), the machine will stop immediately and alarm, reducing the probability of defective products.

[0031] Example 2: According to Figure 1 , Figure 2 , Figure 7 , Figure 8 , Figure 9 and Figure 10 As shown, the limiting mechanism 4 includes a slide cylinder 41, a movable plate 42 is provided at the upper end of the irregular frame plate 19, a long block 43 is installed at the upper end of the movable plate 42, a displacement sensor 44 is installed at the upper end of the movable plate 42, an arc plate 45 is provided inside the six sets of mold slots 192, two sets of push rods 46 are fixedly installed at one end of each of the six sets of arc plates 45, the upper end of the slide cylinder 41 is fixed to the top of the interior of the irregular frame plate 19, the upper end of the movable plate 42 is fixed to the lower end of the movable end of the slide cylinder 41, one end of each set of push rods 46 penetrates the outer wall of the mold base 191 and is fixed to one end of the long block 43, and the displacement sensor 44 and the slide cylinder 41 are both connected to the control system 11 by signal. The ejection mechanism 5 includes an L-shaped plate 51. Two sets of small cylinders 52 are installed through the lower end of the L-shaped plate 51. Four sets of ejector pins 53 are inserted through the interior of each of the six mold slots 192. Two sets of push plates 54 are installed at the extended ends of the two sets of small cylinders 52. The lower ends of the multiple sets of ejector pins 53 all pass through the lower end of the mold base 191 and the upper end of the irregular frame plate 19, and are all fixed to the upper end of the push plate 54. Both sets of small cylinders 52 are connected to the control system 11 via signals.

[0032] In this embodiment, the packaging mold and positioning system: the irregular frame plate 19 is located at one end of the support frame 1, serving as the bearing base of the packaging station. The mold base 191 is installed on its upper end. The mold base 191 has six sets of mold slots 192. The size of the slots is adapted to the components to be packaged and the pin shape, providing molding space for injection packaging. The limiting mechanism 4 ensures the positioning accuracy of the components within the mold slot 192. It consists of a slide cylinder 41, a movable plate 42, a long block 43, a displacement sensor 44, an arc plate 45, and push rods 46. The slide cylinder 41 drives the movable plate 42 to move the long block 43. Multiple sets of push rods 46 push the arc plate 45 toward the center of the mold slot 192, achieving flexible clamping of the components. The displacement sensor 44 detects the position of the long block 43 in real time and feeds the signal back to the control system 11 to ensure that the clamping force and positioning accuracy are adapted to components of different specifications. The ejection mechanism 5 enables the demolding of components after packaging. It consists of an L-shaped plate 51, two sets of small cylinders 52, a push plate 54, and multiple sets of ejector pins 53. The extension and retraction of the small cylinders 52 drives the push plate 54 to rise and fall, so that the four sets of ejector pins 53 in each mold slot 192 simultaneously lift the components, avoiding damage to the pins during demolding.

[0033] Example 3: According to Figure 1 , Figure 2 , Figure 7 , Figure 8 , Figure 9 and Figure 10 As shown, a second telescopic rod 18 is installed through the protrusion at one end of the irregular frame plate 19. An injection molding mechanism 181 is provided above the irregular frame plate 19. A sliding block 182 is slidably installed on the upper end of the irregular frame plate 19. The lower end of the frame of the injection molding mechanism 181 is fixed to the upper end of the sliding block 182. Both the second telescopic rod 18 are connected to the control system 11 signal. A fixed frame plate 16 is installed at the bottom of the inner side of the support frame 1. A telescopic rod 161 is installed through one side of the protrusion of the fixed frame plate 16. A concave seat 163 is installed at the upper end of the irregular frame plate 19. A concave plate 162 is slidably installed inside the concave seat 163. A sliding frame 164 is slidably installed at the upper end of the fixed frame plate 16. One side of the concave plate 162 is fixed to one side of the sliding frame 164. The protruding end of the telescopic rod 161 is fixed to one side of the sliding frame 164. The telescopic rod 161 is connected to the control system 11 via signal.

[0034] In this embodiment, the injection molding packaging system: the injection molding mechanism 181 is responsible for filling epoxy resin into the mold groove 192, and its lower end is fixed to the sliding block 182. The sliding block 182 can slide along the upper slide rail 34 of the irregular frame plate 19. The second telescopic rod 18 passes through the protrusion of the irregular frame plate 19, and its extended end is connected to the sliding block 182. Through the telescopic action, it drives the injection molding mechanism 181 to move along the length direction of the mold base 191, so as to realize the sequential or synchronous injection molding of the six sets of mold slots 192.

[0035] Packaging and material feeding system: Fixed frame plate 16: installed at the bottom of the inside of the support frame 1, with a first telescopic rod 161 installed on its protrusion and a sliding frame 164 slidably connected to its upper end; The material discharge positioning component consists of a concave seat 163 and a concave plate 162. The concave seat 163 is fixed to the upper end of the irregular frame plate 19. The concave plate 162 is slidably installed inside the concave seat 163 and fixed to the sliding frame 164. The first telescopic rod 161 pushes the sliding frame 164 to move the concave plate 162, which can push the packaged components in the concave seat 163 to the subsequent collection device.

[0036] The usage and working principle of this device: First, the initialization and parameter configuration stage: After the equipment is started, the operator completes two core preparatory tasks through the human-machine interface of the control system 11: Specification parameter call: According to the specifications of the multi-pin electronic components to be packaged, the system calls matching parameters from the preset "specification library" and automatically synchronizes them to each actuator - such as the vacuum threshold of vacuum adsorption component 172, the clamping stroke of limit mechanism 4, the injection volume of injection mechanism 181 (matched according to the volume of mold groove 192), etc. Mechanism reset calibration: The control system 11 sends a reset command to each mechanism. The left and right moving mechanism 14 drives the gripping component back to the "initial standby position" (located directly above the placement table 13). The up and down adjusting mechanism 15 retracts to the highest position. The flipping mechanism 2 keeps the long plate 17 horizontal (vacuum adsorption component 172 facing down). The arc plate 45 of the limiting mechanism 4 returns to the initial position. The ejector pin 53 of the ejection mechanism 5 retracts completely to the bottom of the mold groove 192, ensuring that each mechanism is in the "ready to work state". Afterwards, the component conveying and temporary storage stage (conveying-temporary storage system operation): Batch conveying start: The control system 11 sends a start signal to the conveyor belt mechanism 12, the conveyor belt starts to run at a constant speed, and the operator places the components to be packaged in batches on the conveyor belt. Precise guidance and positioning: When the components move to the concave block 121 area with the conveyor belt, multiple sets of guide plates 122, through spacing constraints, straighten the components into a "single-row aligned state" to avoid conveying deviation; then the components slide along the end of the guide plate 122 into the six sets of long grooves 132 of the storage seat 131. The groove walls of the long grooves 132 restrict the lateral displacement of the components, realizing a seamless connection between "conveyance and temporary storage". At this time, the conveyor belt mechanism 12 sends a "temporary storage in place" signal to the control system 11. Then, the electronic component gripping and transfer stage (grip-transfer system operation): This stage is the core execution link of the equipment. Through the coordination of four-level adjustment mechanisms, the precise transfer of components from the temporary storage area to the packaging area is completed. Grasping and positioning action: After receiving the "temporary storage in place" signal, the control system 11 sends instructions to the left and right moving mechanism 14 and the up and down adjusting mechanism 15. The left and right moving mechanism 14 drives the component to move horizontally to the top of the placement platform 13, and the up and down adjusting mechanism 15 extends so that the suction nozzle of the vacuum adsorption component 172 fits against the surface of the component in the long groove 132. Vacuum adsorption confirmation: The vacuum generator is started, and a partial vacuum is formed in the suction nozzle. The pressure sensor detects the adsorption pressure in real time. When the pressure reaches the preset threshold, a "adsorption successful" signal is sent. If the pressure does not meet the standard (such as air leakage due to misalignment of components), the system triggers the "retry mechanism". The micro cylinder 33 of the fine adjustment mechanism 3 drives the long plate 17 to make fine adjustments along the slide rail 34 until adsorption is successful (if the retry fails three times, the machine will stop and alarm). Transfer to the encapsulation area: After successful adsorption, the up-down adjustment mechanism 15 retracts to lift the component, and the left-right movement mechanism 14 moves the component horizontally to directly above the mold base 191; the control system 11 sends a precise positioning command to the fine-tuning mechanism 3 according to the position coordinates of the mold groove 192, and the micro cylinder 33 pushes the long plate 17 for fine-tuning to ensure that the center of the component is aligned with the center of the mold groove 192. Then, the up-down adjustment mechanism 15 extends to place the component into the mold groove 192, and the vacuum adsorption component 172 releases the vacuum to complete the "grab-transfer" action; Next, in the packaging, positioning, and injection molding stage (mold-injection system operation): flexible limiting and fixing: after the component is placed into the mold slot 192, the control system 11 sends a "clamping command" to the limiting mechanism 4. The slide cylinder 41 pushes the movable plate 42 to move the long block 43. Multiple sets of push rods 46 simultaneously push the arc plate 45 toward the center of the mold slot 192. The displacement sensor 44 detects the moving distance of the long block 43 in real time and feeds the signal back to the control system 11. When the moving distance reaches the preset value (the clamping stroke corresponding to the component size), the slide cylinder 41 stops moving. The arc plate 45 clamps the component through flexible contact to avoid the pins being deformed by pressure. Injection Mechanism 181 Displacement and Filling: After the limit is completed, the control system 11 starts the injection process—the second telescopic rod 18 extends and retracts, causing the sliding block 182 to slide along the irregular frame plate 19, so that the injection port of the injection mechanism 181 is aligned with the inlet of the first set of mold slots 192; the injection mechanism 181 injects epoxy resin into the mold slots 192 according to the preset injection volume. After the injection is completed, the second telescopic rod 18 drives the injection mechanism 181 to move to the next set of mold slots 192, repeating the injection action until all six sets of mold slots 192 are filled, and the injection mechanism 181 returns to the initial position; Next, the curing and demolding stage (execution-ejection system operation): rapid heating and curing: after injection molding, the control system 11 sends a "flipping command" to the flipping mechanism 2. The servo motor 23 drives the long rod 22 to rotate, and through the belt drive assembly 24, it drives the rotating rod 25 to rotate 180°, so that the long plate 17 flips up and down (the heating mechanism 171 faces down and is aligned with the mold base 191); the up and down adjustment mechanism 15 extends, bringing the heating mechanism 171 close to the surface of the mold base 191, and the heating temperature rises to [150-180]℃ to rapidly cure the epoxy resin. After curing, the heating mechanism 171 stops working, and the flipping mechanism 2 returns to its initial state. Synchronous ejection and demolding: After curing, the control system 11 sends an "ejection command" to the ejection mechanism 5. The two sets of small cylinders 52 extend synchronously to push the push plate 54 upward. Multiple sets of ejector pins 53 lift the packaged part in the mold groove 192 synchronously with the push plate 54. The top of the ejector pin 53 contacts the bottom of the packaged part and applies a uniform force to eject the packaged part out of the mold groove 192. Then, the vacuum adsorption component 172 starts adsorption again to grab the ejected packaged part, completing the "curing-demolding" action. Finally, the finished product unloading stage (unloading system operation): the packaged parts are transferred to the unloading area: after the vacuum adsorption component 172 grabs the packaged parts, the left and right moving mechanism 14 drives the component to move directly above the concave seat 163, and the up and down adjusting mechanism 15 extends to put the packaged parts into the concave seat 163, and the vacuum is released to complete the placement. Batch push and discharge: When the concave seat 163 is full of six sets of packaged parts, the control system 11 sends a "push command" to the first telescopic rod 161. The first telescopic rod 161 extends and pushes the sliding frame 164 to slide, which drives the concave plate 162 to move along the inside of the concave seat 163, pushing the packaged parts into the collection device (such as a material box) at the end of the concave seat 163. After the push is completed, the first telescopic rod 161 retracts and resets, and the concave plate 162 returns to its initial position, waiting for the next batch of packaged parts.

[0037] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A multi-pin electronic component packaging structure, comprising a support frame (1), characterized in that: The front end of the support frame (1) is equipped with a control system (11), the top of the support frame (1) is equipped with a left and right moving mechanism (14), the movable end of the left and right moving mechanism (14) is equipped with an up and down adjusting mechanism (15), the movable end of the up and down adjusting mechanism (15) is equipped with a flipping mechanism (2), the middle of the flipping mechanism (2) is equipped with a fine adjustment mechanism (3), the middle of the fine adjustment mechanism (3) is equipped with a long plate (17), the lower end of the long plate (17) is equipped with a heating mechanism (171), the upper end of the long plate (17) is equipped with a vacuum adsorption component (172), one end of the support frame (1) is equipped with a special-shaped frame plate (19), the upper end of the special-shaped frame plate (19) is equipped with a mold seat (191), the upper end of the mold seat (191) is provided with six sets of mold slots (192), the upper end of the special-shaped frame plate (19) is equipped with a limit mechanism (4), and the top of the inside of the special-shaped frame plate (19) is equipped with an ejection mechanism (5). The flipping mechanism (2) includes a fixed frame (21), a long rod (22) is rotatably installed inside the fixed frame (21), a servo motor (23) is fixedly installed on the protrusion on one side of the fixed frame (21), two sets of belt drive assemblies (24) are driven on the outer wall of the long rod (22), and rotating rods (25) are rotatably installed through both sides of the fixed frame (21). The left and right moving mechanism (14) and the up and down adjusting mechanism (15) are both signal connected to the control system (11). The fine-tuning mechanism (3) includes two sets of L-shaped seats (31), and irregular connecting plates (32) are installed on both sides of the long plate (17). Two sets of miniature cylinders (33) are installed at the bottom inside the two sets of L-shaped seats (31). Slide rails (34) are installed at the bottom inside the two sets of L-shaped seats (31). Slide seats (35) are slidably installed on the outer walls of the two sets of slide rails (34).

2. The multi-pin electronic component packaging structure according to claim 1, characterized in that: One end of the fixed frame (21) is fixed to the movable end of the up-down adjustment mechanism (15). One end of the long rod (22) passes through one end of the protrusion of the fixed frame (21) and is fixed to the output end of the servo motor (23). The outer walls of the two sets of rotating rods (25) are respectively fixed to the inner walls of the two driven wheels in the two sets of belt drive assemblies (24). The servo motor (23) is connected to the control system (11) via signal.

3. The multi-pin electronic component packaging structure according to claim 1, characterized in that: One side of each of the two sets of L-shaped seats (31) is fixed to one end of each of the two sets of rotating rods (25), the extended ends of each of the two sets of miniature cylinders (33) are fixed to one end of each of the two sets of irregular connecting plates (32), the upper ends of each of the two sets of sliding seats (35) are fixed to the lower end of the long plate (17), and the two sets of miniature cylinders (33) are connected to the control system (11) via signal.

4. The multi-pin electronic component packaging structure according to claim 1, characterized in that: The limiting mechanism (4) includes a slide cylinder (41), a movable plate (42) is provided at the upper end of the irregular frame plate (19), a long block (43) is installed at the upper end of the movable plate (42), a displacement sensor (44) is installed at the upper end of the movable plate (42), an arc plate (45) is provided inside the six sets of mold slots (192), and two sets of push rods (46) are fixedly installed at one end of each of the six sets of arc plates (45).

5. The multi-pin electronic component packaging structure according to claim 4, characterized in that: The upper end of the slide cylinder (41) is fixed to the inner top of the irregular frame plate (19), the upper end of the movable plate (42) is fixed to the lower end of the movable end of the slide cylinder (41), one end of each of the multiple push rods (46) penetrates the outer wall of the mold base (191) and is fixed to one end of the long block (43), and the displacement sensor (44) and the slide cylinder (41) are both connected to the control system (11) via signal.

6. The multi-pin electronic component packaging structure according to claim 1, characterized in that: The ejection mechanism (5) includes an L-shaped plate (51), with two sets of small cylinders (52) installed through the lower end of the L-shaped plate (51). Four sets of ejector pins (53) are inserted through the interior of each of the six sets of mold slots (192), and two sets of push plates (54) are installed at the extended ends of the two sets of small cylinders (52).

7. A multi-pin electronic component packaging structure according to claim 6, characterized in that: The lower ends of the multiple sets of ejector pins (53) all penetrate the lower end of the mold base (191) and the upper end of the irregular frame plate (19), and are all fixed to the upper end of the push plate (54). The two sets of small cylinders (52) are both connected to the control system (11) via signal.

8. The multi-pin electronic component packaging structure according to claim 1, characterized in that: The support frame (1) is equipped with a conveyor belt mechanism (12) at its inner bottom. The upper end of the conveyor belt mechanism (12) frame is equipped with two sets of concave blocks (121). The upper top of the two sets of concave blocks (121) is equipped with multiple sets of guide plates (122). The support frame (1) is equipped with a placement platform (13) at its inner bottom. The upper end of the placement platform (13) is equipped with a storage seat (131). One end of the storage seat (131) is provided with six sets of long grooves (132). One end of every two sets of guide plates (122) is aligned with the two edges of the opening of a set of long grooves (132). The conveyor belt mechanism (12) is connected to the control system (11) via signal.

9. The multi-pin electronic component packaging structure according to claim 1, characterized in that: The protrusion at one end of the irregular frame plate (19) is through which a second telescopic rod (18) is installed. An injection molding mechanism (181) is provided above the irregular frame plate (19). A sliding block (182) is slidably installed on the upper end of the irregular frame plate (19). The lower end of the frame of the injection molding mechanism (181) is fixed to the upper end of the sliding block (182). The second telescopic rod (18) is connected to the signal of the control system (11).

10. A multi-pin electronic component packaging structure according to claim 1, characterized in that: A fixed frame plate (16) is installed at the bottom of the inner side of the support frame (1). A telescopic rod (161) is installed through one side of the protrusion of the fixed frame plate (16). A concave seat (163) is installed at the upper end of the irregular frame plate (19). A concave plate (162) is slidably installed inside the concave seat (163). A sliding frame (164) is slidably installed at the upper end of the fixed frame plate (16). One side of the concave plate (162) is fixed to one side of the sliding frame (164). The protruding end of the first telescopic rod (161) is fixed to one side of the sliding frame (164). The first telescopic rod (161) is signal connected to the control system (11).

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