Grid cover tape for antistatic packaging and preparation method thereof
By constructing a synergistic conductive network of composite conductive microspheres and carbon nanotubes in the mesh cover tape, the problems of unstable antistatic performance and insufficient transparency of traditional antistatic cover tapes are solved, achieving efficient charge conduction and high light transmittance, making it suitable for packaging applications of electronic components.
Patent Information
- Application Number
- CN202610027116.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-01-09
- Publication Date
- 2026-04-24
AI Technical Summary
Traditional antistatic caps have problems such as unstable antistatic performance, insufficient transparency, and insufficient mesh structure strength in electronic component packaging. Furthermore, the addition of conductive fillers may affect the transparency and mechanical properties of the material.
A conductive network was constructed by synergistically combining composite conductive microspheres and carbon nanotubes. PS-DVB copolymer microspheres were prepared by copolymerizing styrene and divinylbenzene, and composite conductive microspheres were formed by sulfonation and modification of graphene oxide. An antistatic coating was prepared by combining polyester polyol and polyether polyol.
With low conductive filler content, an efficient charge conduction path is achieved, exhibiting excellent antistatic properties and high light transmittance, expanding its application potential in the field of transparent packaging. Furthermore, it is easy to operate, low in cost, and suitable for industrial production.
Smart Images
Figure IMAGE_AE355013-9673-4914-8287-9AB9A78868B9
Abstract
Description
Technical Field
[0001] This invention relates to the field of cover tape technology for electronic component packaging, specifically to an antistatic packaging mesh cover tape and its preparation method. Background Technology
[0002] In the electronics manufacturing industry, the packaging of electronic components (such as chips, resistors, and capacitors) is a crucial step in ensuring product quality and reliability. During the packaging process, cover tape and carrier tape are used to seal the components within the carrier tape pockets, preventing contamination, impact, or electrostatic damage during transportation and storage. While traditional cover tape materials provide basic sealing protection, they are ineffective in addressing electrostatic issues.
[0003] Electrostatic discharge (ESD) is a major hidden danger in the production of electronic components. Even a small electrostatic voltage (such as a few hundred volts) can cause internal circuit breakdown, data loss, or performance degradation in chips, especially in high-precision, high-density modern electronic devices where electrostatic sensitivity is even higher. Traditional antistatic capping tapes often use antistatic agents coated on the substrate surface or add conductive fillers, but these methods suffer from problems such as unstable antistatic performance, insufficient transparency, and inadequate mesh structure strength. Adding conductive fillers may also affect the transparency and mechanical properties of the material.
[0004] Therefore, we propose a mesh cover tape for antistatic encapsulation and its preparation method. Summary of the Invention
[0005] The purpose of this invention is to provide an antistatic encapsulation mesh cover tape and its preparation method, so as to solve the problems raised in the prior art.
[0006] To achieve the above objectives, the present invention provides the following technical solution: An antistatic encapsulation mesh cover strip, the antistatic encapsulation mesh cover strip being composed of a substrate layer and an antistatic coating.
[0007] Furthermore, the substrate layer is a mesh PET substrate.
[0008] Furthermore, the antistatic coating is composed of the following components in parts by weight: 20-40 parts of polyether polyol, 30-50 parts of polyester polyol, 3-5 parts of carbon nanotubes, 1-3 parts of composite conductive microspheres, 40-80 parts of diphenylmethane diisocyanate, 0.3-1.0 parts of dibutyltin dilaurate, 0.2-0.5 parts of leveling agent, 0.5-2.0 parts of dispersant, 40-80 parts of water, and 0.05-0.3 parts of antioxidant.
[0009] Furthermore, the preparation method of the composite conductive microspheres is as follows: Step A: Add gelatin to deionized water at 40-50℃ and stir until dissolved. Add styrene, divinylbenzene and benzoyl peroxide in sequence, stir evenly, and polymerize at 70-80℃ for 4-6 hours. Continue to heat to 85-90℃ and polymerize for 3-4 hours. After the reaction is completed, wash and dry to obtain PS-DVB copolymer microspheres. Add PS-DVB copolymer microspheres to concentrated sulfuric acid and sulfonate at 40-50℃ for 2-4 hours. After centrifugation, washing and drying, obtain sulfonated polymer microspheres. Step B: Add sulfonated polymer microspheres and modified graphene oxide to deionized water, and ultrasonically disperse for 20-40 min to obtain a dispersion. Then, allow it to stand, filter, purify, and dry to obtain polymer microspheres @GO. Step C: Add polymer microspheres @GO and 3,4-ethylenedioxythiophene to chloroform solvent and stir until homogeneous. Add potassium persulfate and polymerize at 20-30℃ for 8-12 hours. After standing, filtration, purification and drying, composite conductive microspheres are obtained.
[0010] Furthermore, in step A, the mass ratio of gelatin, deionized water, styrene, divinylbenzene and benzoyl peroxide is 1:(20-30):(15-20):(1.8-2.0):(0.1-0.3).
[0011] Furthermore, in step A, the mass ratio of PS-DVB copolymer microspheres to concentrated sulfuric acid is 1:(40-50).
[0012] Furthermore, in step B, the mass ratio of sulfonated polymer microspheres, modified graphene oxide, and deionized water is 1:(0.2-0.4):(20-30).
[0013] Furthermore, the modified graphene oxide is prepared as follows: Graphene oxide was ultrasonically dispersed in deionized water to obtain a graphene oxide dispersion; polydiallyldimethylammonium chloride solution was added and stirred for 30-40 min; then hydrazine hydrate was added, the temperature was raised to 80-90℃, and the reaction was continued with stirring for 5-7 h; after centrifugation, washing, and drying, modified graphene oxide was obtained.
[0014] Furthermore, the concentration of the graphene oxide dispersion is 1 mg / mL.
[0015] Furthermore, the volume fraction of the polydiallyldimethylammonium chloride solution is 20%, and its amount is 80-100 times the mass of graphene oxide.
[0016] Furthermore, the amount of hydrazine hydrate used is 60-70 times the mass of graphene oxide.
[0017] Furthermore, in step C, the mass ratio of polymer microspheres @GO, 3,4-ethylenedioxythiophene, chloroform, and potassium persulfate is 1:(0.2-0.5):(20-30):(0.01-0.03).
[0018] A method for preparing an antistatic encapsulation mesh cover tape includes the following steps: Step 1: Dehydrate polyester polyol, polyether polyol and composite conductive microspheres under vacuum at 110-130℃ for 2-3 hours, cool to 60-70℃, add diphenylmethane diisocyanate under nitrogen protection, and react at 100-130℃ for 1-2 hours; then add dibutyltin dilaurate and react at 80℃-90℃ for 3-5 hours, followed by vacuum degassing to obtain the polymerization solution; Step 2: Mix the polymerization liquid, carbon nanotubes, leveling agent, dispersant, antioxidant and water evenly to obtain the antistatic coating; Step 3: Apply antistatic coating to the surface of the substrate layer to form an antistatic coating; after cooling, roll up and die-cut to obtain an antistatic encapsulation mesh cover tape.
[0019] Furthermore, the thickness of the substrate layer is 15-50 μm.
[0020] Furthermore, the thickness of the antistatic coating is 15-45 μm.
[0021] Compared with the prior art, the beneficial effects of the present invention are: 1. This invention constructs a synergistic conductive network of "composite conductive microspheres-carbon nanotubes", which can form an efficient charge conduction path while significantly reducing the total amount of conductive filler added. This enables the coating to have both excellent antistatic properties and high light transmittance, expanding its application potential in the field of transparent encapsulation. Specifically, this invention first prepares PS-DVB copolymer microspheres through copolymerization of styrene and divinylbenzene, which exhibit good chemical modifiability and stability (heat resistance, acid and alkali resistance, and solvent resistance). Then, the PS-DVB copolymer microspheres are sulfonated with concentrated sulfuric acid to derive acid functional groups from the phenyl groups. Spherical graphene oxide is modified with polydiallyldimethylammonium chloride (PDDA) to give the graphene oxide surface a positive charge. This positive charge, combined with the negatively charged sulfonated polymer microspheres, allows for electrostatic assembly and bonding, resulting in polymer microspheres@GO. This strong interfacial bonding prevents structural damage or loss of conductive components during subsequent processing and use, ensuring long-term stability of the antistatic properties. Finally, in-situ oxidative polymerization of 3,4-ethylenedioxythiophene (EDOT) on the surface of the polymer microspheres@GO yields composite conductive microspheres. These composite conductive microspheres and carbon nanotubes synergistically form a conductive network, enabling the antistatic coating to achieve excellent antistatic effects and high light transmittance even with low levels of conductive filler.
[0022] 2. The raw materials used in this invention are readily available, the operation is controllable, and it is suitable for continuous production. Compared with some antistatic technologies that require high-temperature sintering, vacuum coating, or complex surface metallization, the method of this invention is simpler, lower in cost, and has good prospects for industrialization. Detailed Implementation
[0023] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0024] Unless otherwise specified, all quantities below are by weight. It should be noted that there are no special restrictions on the purchasers of any of the raw materials involved in this invention. Exemplary examples include (in this embodiment) the following: Mesh PET substrate: 30 μm thick, purchased from Suzhou Lezhitai Electronic Materials Co., Ltd.; Polyether polyol: CP450, sourced from Dow Chemical; Polyester polyol: BY-3113; Carbon nanotubes: NACODC8, purchased from Jiaxing Naco New Materials Co., Ltd.; Leveling agent: KYC-615; Dispersant: Fatty alcohol polyoxyethylene ether AEO-7; Antioxidant: Antioxidant 1010; Graphene oxide: 1-3 nm thick, 4-7 μm in diameter, 2-5 layers, purchased from Zhejiang Zhitai Nanomaterials Co., Ltd.
[0025] Example 1: A method for preparing an antistatic encapsulation mesh cover tape, comprising the following processes: Step 1: Dehydrate 30 parts of polyester polyol, 20 parts of polyether polyol and 1 part of composite conductive microspheres under vacuum at 110℃ for 2 hours, cool to 60℃, add 40 parts of diphenylmethane diisocyanate under nitrogen protection, and react at 100℃ for 1 hour; then add 0.3 parts of dibutyltin dilaurate, react at 80℃ for 3 hours, and degas under vacuum to obtain the polymerization solution; Step 2: Mix the polymerization liquid, 3 parts carbon nanotubes, 0.2 parts leveling agent, 0.5 parts dispersant, 0.05 parts antioxidant and 40 parts water evenly to obtain an antistatic coating; Step 3: Apply antistatic coating to the surface of the mesh PET substrate layer and allow it to cure naturally at room temperature to form an antistatic coating; after cooling, roll it up and die-cut it to obtain the antistatic encapsulation mesh cover tape; The preparation method of composite conductive microspheres is as follows: Step A: Add 0.2 parts of gelatin to 4 parts of deionized water at 40℃ and stir until dissolved. Then add 3 parts of styrene, 0.36 parts of divinylbenzene, and 0.02 parts of benzoyl peroxide in sequence, stir evenly, and polymerize at 70℃ for 4 hours. Continue to heat to 85℃ and polymerize for 3 hours. After the reaction is completed, wash and dry to obtain PS-DVB copolymer microspheres. Add 2 parts of PS-DVB copolymer microspheres to 80 parts of concentrated sulfuric acid and sulfonate at 40℃ for 2 hours. After centrifugation, washing, and drying, obtain sulfonated polymer microspheres. Step B: Add 1 part of sulfonated polymer microspheres and 0.2 parts of modified graphene oxide to 20 parts of deionized water, and ultrasonically disperse for 20 min to obtain a dispersion. Then, allow it to stand, filter, purify and dry to obtain polymer microspheres @GO. Step C: Add 1 part of polymer microspheres @GO and 0.2 parts of 3,4-ethylenedioxythiophene to 20 parts of chloroform solvent and stir evenly. Add 0.01 parts of potassium persulfate and polymerize at 20°C for 8 hours. After standing, filtration, purification and drying, composite conductive microspheres are obtained. The preparation method of modified graphene oxide is as follows: 0.2 parts of graphene oxide were ultrasonically dispersed in deionized water to obtain a 1 mg / mL graphene oxide dispersion; 16 parts of a 20% (v / v) polydiallyldimethylammonium chloride solution were added, and the mixture was stirred for 30 min; then 12 parts of hydrazine hydrate were added, the temperature was raised to 80 °C, and the reaction was continued to be stirred for 5 h; after centrifugation, washing, and drying, modified graphene oxide was obtained.
[0026] Example 2: A method for preparing an antistatic encapsulation mesh cover tape, comprising the following processes: Step 1: Dehydrate 40 parts of polyester polyol, 30 parts of polyether polyol and 2 parts of composite conductive microspheres under vacuum at 120℃ for 2.5h, cool to 65℃, add 70 parts of diphenylmethane diisocyanate under nitrogen protection, and react at 120℃ for 1.5h; then add 0.8 parts of dibutyltin dilaurate, react at 85℃ for 4h, and degas under vacuum to obtain the polymerization solution; Step 2: Mix the polymerization liquid, 4 parts carbon nanotubes, 0.3 parts leveling agent, 1 part dispersant, 0.2 parts antioxidant and 60 parts water evenly to obtain an antistatic coating; Step 3: Apply antistatic coating to the surface of the mesh PET substrate layer and allow it to cure naturally at room temperature to form an antistatic coating; after cooling, roll it up and die-cut it to obtain the antistatic encapsulation mesh cover tape; The preparation method of composite conductive microspheres is as follows: Step A: Add 0.25 parts of gelatin to 6 parts of deionized water at 45℃ and stir until dissolved. Then add 4.5 parts of styrene, 0.48 parts of divinylbenzene, and 0.05 parts of benzoyl peroxide in sequence, stir evenly, and polymerize at 75℃ for 5 hours. Continue to heat to 88℃ and polymerize for 3.5 hours. After the reaction is completed, wash and dry to obtain PS-DVB copolymer microspheres. Add 4 parts of PS-DVB copolymer microspheres to 180 parts of concentrated sulfuric acid and sulfonate at 45℃ for 3 hours. After centrifugation, washing, and drying, obtain sulfonated polymer microspheres. Step B: Add 2 parts of sulfonated polymer microspheres and 0.6 parts of modified graphene oxide to 50 parts of deionized water, and sonicate for 30 min to obtain a dispersion. Then, allow it to stand, filter, purify and dry to obtain polymer microspheres @GO. Step C: Add 2 parts of polymer microspheres @GO and 0.8 parts of 3,4-ethylenedioxythiophene to 50 parts of chloroform solvent and stir evenly. Add 0.04 parts of potassium persulfate and polymerize at 25°C for 10 hours. After standing, filtration, purification and drying, composite conductive microspheres are obtained. The preparation method of modified graphene oxide is as follows: 0.6 parts of graphene oxide were ultrasonically dispersed in deionized water to obtain a 1 mg / mL graphene oxide dispersion; 54 parts of a 20% (v / v) polydiallyldimethylammonium chloride solution were added, and the mixture was stirred for 35 min. Then, 40 parts of hydrazine hydrate were added, the temperature was raised to 85 °C, and the reaction was continued to be stirred for 6 h. After centrifugation, washing, and drying, modified graphene oxide was obtained.
[0027] Example 3: A method for preparing an antistatic encapsulation mesh cover tape, comprising the following processes: Step 1: Dehydrate 50 parts of polyester polyol, 40 parts of polyether polyol and 3 parts of composite conductive microspheres under vacuum at 130℃ for 3 hours, cool to 70℃, add 80 parts of diphenylmethane diisocyanate under nitrogen protection, and react at 130℃ for 2 hours; then add 1.0 part of dibutyltin dilaurate, react at 90℃ for 5 hours, and degas under vacuum to obtain the polymerization solution; Step 2: Mix the polymerization liquid, 5 parts carbon nanotubes, 0.5 parts leveling agent, 2.0 parts dispersant, 0.3 parts antioxidant and 80 parts water evenly to obtain an antistatic coating; Step 3: Apply antistatic coating to the surface of the mesh PET substrate layer and allow it to cure naturally at room temperature to form an antistatic coating; after cooling, roll it up and die-cut it to obtain the antistatic encapsulation mesh cover tape; The preparation method of composite conductive microspheres is as follows: Step A: Add 0.25 parts of gelatin to 7.5 parts of deionized water at 50℃ and stir until dissolved. Then add 5 parts of styrene, 0.5 parts of divinylbenzene, and 0.075 parts of benzoyl peroxide in sequence, stir evenly, and polymerize at 80℃ for 6 hours. Continue to heat to 90℃ and polymerize for 4 hours. After the reaction is completed, wash and dry to obtain PS-DVB copolymer microspheres. Add 3 parts of PS-DVB copolymer microspheres to 150 parts of concentrated sulfuric acid and sulfonate at 50℃ for 4 hours. After centrifugation, washing, and drying, obtain sulfonated polymer microspheres. Step B: Add 3 parts of sulfonated polymer microspheres and 1.2 parts of modified graphene oxide to 90 parts of deionized water, and ultrasonically disperse for 40 min to obtain a dispersion. Then, allow it to stand, filter, purify and dry to obtain polymer microspheres @GO. Step C: Add 3 parts of polymer microspheres @GO and 1.5 parts of 3,4-ethylenedioxythiophene to 90 parts of chloroform solvent and stir until homogeneous. Add 0.09 parts of potassium persulfate and polymerize at 30°C for 12 hours. After standing, filtration, purification and drying, composite conductive microspheres are obtained. The preparation method of modified graphene oxide is as follows: Two parts of graphene oxide were ultrasonically dispersed in deionized water to obtain a 1 mg / mL graphene oxide dispersion. 200 parts of a 20% (v / v) polydiallyldimethylammonium chloride solution were added and stirred for 40 min. Then, 140 parts of hydrazine hydrate were added, the temperature was raised to 90 °C, and the reaction was continued with stirring for 7 h. After centrifugation, washing, and drying, modified graphene oxide was obtained.
[0028] Comparative Example 1: A method for preparing an antistatic encapsulation mesh cover tape, comprising the following processes: Step 1: Dehydrate 40 parts of polyester polyol and 30 parts of polyether polyol under vacuum at 120°C for 2.5 hours, cool to 65°C, add 70 parts of diphenylmethane diisocyanate under nitrogen protection, and react at 120°C for 1.5 hours; then add 0.8 parts of dibutyltin dilaurate, react at 85°C for 4 hours, and degas under vacuum to obtain the polymerization solution; Step 2: Mix the polymerization liquid, 6 parts carbon nanotubes, 0.3 parts leveling agent, 1 part dispersant, 0.2 parts antioxidant and 60 parts water evenly to obtain an antistatic coating; Step 3: Apply antistatic coating to the surface of the mesh PET substrate layer and allow it to cure naturally at room temperature to form an antistatic coating; after cooling, roll it up and die-cut it to obtain the antistatic encapsulation mesh cover tape; Compared with Example 2, Comparative Example 1 did not introduce composite conductive microspheres, but replaced them with carbon nanotubes of the same mass. The other steps were the same as in Example 2.
[0029] Comparative Example 2: A method for preparing an antistatic encapsulation mesh cover tape, comprising the following processes: Step 1: 40 parts of polyester polyol, 30 parts of polyether polyol and 2 parts of sulfonated polymer microspheres were vacuum dehydrated at 120℃ for 2.5h, cooled to 65℃, and under nitrogen protection, 70 parts of diphenylmethane diisocyanate were added and reacted at 120℃ for 1.5h; then 0.8 parts of dibutyltin dilaurate were added and reacted at 85℃ for 4h, followed by vacuum degassing to obtain the polymerization solution. Step 2: Mix the polymerization liquid, 4 parts carbon nanotubes, 0.3 parts leveling agent, 1 part dispersant, 0.2 parts antioxidant and 60 parts water evenly to obtain an antistatic coating; Step 3: Apply antistatic coating to the surface of the mesh PET substrate layer and allow it to cure naturally at room temperature to form an antistatic coating; after cooling, roll it up and die-cut it to obtain the antistatic encapsulation mesh cover tape; The preparation method of sulfonated polymer microspheres is as follows: Step A: Add 0.25 parts of gelatin to 6 parts of deionized water at 45℃ and stir until dissolved. Then add 4.5 parts of styrene, 0.48 parts of divinylbenzene, and 0.05 parts of benzoyl peroxide in sequence, stir evenly, and polymerize at 75℃ for 5 hours. Continue to heat to 88℃ and polymerize for 3.5 hours. After the reaction is completed, wash and dry to obtain PS-DVB copolymer microspheres. Add 4 parts of PS-DVB copolymer microspheres to 180 parts of concentrated sulfuric acid and sulfonate at 45℃ for 3 hours. After centrifugation, washing, and drying, obtain sulfonated polymer microspheres. Compared with Example 2, Comparative Example 2 did not introduce modified graphene oxide, but replaced the composite conductive microspheres with the same mass of sulfonated polymer microspheres. The other steps were the same as in Example 2.
[0030] Comparative Example 3: A method for preparing an antistatic encapsulation mesh cover tape, comprising the following processes: Step 1: Dehydrate 40 parts of polyester polyol, 30 parts of polyether polyol and 2 parts of modified graphene oxide under vacuum at 120°C for 2.5 h, cool to 65°C, add 70 parts of diphenylmethane diisocyanate under nitrogen protection, and react at 120°C for 1.5 h; then add 0.8 parts of dibutyltin dilaurate, react at 85°C for 4 h, and degas under vacuum to obtain the polymerization solution; Step 2: Mix the polymerization liquid, 4 parts carbon nanotubes, 0.3 parts leveling agent, 1 part dispersant, 0.2 parts antioxidant and 60 parts water evenly to obtain an antistatic coating; Step 3: Apply antistatic coating to the surface of the mesh PET substrate layer and allow it to cure naturally at room temperature to form an antistatic coating; after cooling, roll it up and die-cut it to obtain the antistatic encapsulation mesh cover tape; The preparation method of modified graphene oxide is as follows: 0.6 parts of graphene oxide were ultrasonically dispersed in deionized water to obtain a 1 mg / mL graphene oxide dispersion; 54 parts of 20% polydiallyldimethylammonium chloride solution were added, stirred for 35 min, and then 40 parts of hydrazine hydrate were added. The temperature was raised to 85℃, and the reaction was continued to be stirred for 6 h. After centrifugation, washing, and drying, modified graphene oxide was obtained. Compared with Example 2, Comparative Example 3 replaced the composite conductive microspheres with the same mass of modified graphene oxide, while the other steps were the same as in Example 2.
[0031] Comparative Example 4: A method for preparing an antistatic encapsulation mesh cover tape, comprising the following processes: Step 1: Dehydrate 40 parts of polyester polyol, 30 parts of polyether polyol and 2 parts of composite conductive microspheres under vacuum at 120℃ for 2.5h, cool to 65℃, add 70 parts of diphenylmethane diisocyanate under nitrogen protection, and react at 120℃ for 1.5h; then add 0.8 parts of dibutyltin dilaurate, react at 85℃ for 4h, and degas under vacuum to obtain the polymerization solution; Step 2: Mix the polymerization liquid, 4 parts carbon nanotubes, 0.3 parts leveling agent, 1 part dispersant, 0.2 parts antioxidant and 60 parts water evenly to obtain an antistatic coating; Step 3: Apply antistatic coating to the surface of the mesh PET substrate layer and allow it to cure naturally at room temperature to form an antistatic coating; after cooling, roll it up and die-cut it to obtain the antistatic encapsulation mesh cover tape; The preparation method of composite conductive microspheres is as follows: Step A: Add 0.25 parts of gelatin to 6 parts of deionized water at 45℃ and stir until dissolved. Then add 4.5 parts of styrene, 0.48 parts of divinylbenzene, and 0.05 parts of benzoyl peroxide in sequence, stir evenly, and polymerize at 75℃ for 5 hours. Continue to heat to 88℃ and polymerize for 3.5 hours. After the reaction is completed, wash and dry to obtain PS-DVB copolymer microspheres. Add 4 parts of PS-DVB copolymer microspheres to 180 parts of concentrated sulfuric acid and sulfonate at 45℃ for 3 hours. After centrifugation, washing, and drying, obtain sulfonated polymer microspheres. Step B: Add 2 parts of sulfonated polymer microspheres and 0.2 parts of modified graphene oxide to 50 parts of deionized water, and ultrasonically disperse for 30 min to obtain a dispersion. Then, allow it to stand, filter, purify and dry to obtain polymer microspheres @GO. Step C: Add 2 parts of polymer microspheres @GO and 0.8 parts of 3,4-ethylenedioxythiophene to 50 parts of chloroform solvent and stir evenly. Add 0.04 parts of potassium persulfate and polymerize at 25°C for 10 hours. After standing, filtration, purification and drying, composite conductive microspheres are obtained. Compared with Example 2, in step B of Comparative Example 4, the mass ratio of sulfonated polymer microspheres to modified graphene oxide was 1:0.1, and the other steps were the same as in Example 2.
[0032] experiment: 1. Take the antistatic encapsulation mesh cover tape obtained in Examples 1-3 and Comparative Examples 1-4, attach it to the carrier tape, and then seal it at a heat sealing temperature of 90±5℃. Measure the light transmittance and haze of the heat-sealed cover tape according to the standard "ASTM D1003 Transparent Plastics - Test Method for Light Transmittance and Haze".
[0033] 2. Measure the surface resistance of the heat-sealed cover strip according to the standard GB / T 33398-2016.
[0034] The test results are shown in Table 1.
[0035] Table 1 Performance test results of mesh cover tape for antistatic encapsulation Based on the data in the table above, the following conclusions can be clearly drawn: Combining Examples 1-3 and Comparative Examples 1-4, it can be seen that the antistatic encapsulation mesh cover prepared by the present invention has excellent light transmittance and low surface resistance, which is beneficial for the release of static electricity and has good antistatic function. Compared with Examples 1-3, the light transmittance and surface resistance of the product obtained in Comparative Example 1 both decreased, indicating that the composite conductive microspheres prepared by the present invention can form a highly efficient and synergistic conductive network with carbon nanotubes, jointly improving the material performance; the surface resistance of the products obtained in Comparative Examples 2 and 3 both decreased, indicating that the antistatic performance of the material was jointly improved by introducing sulfonated polymer microspheres and modified graphene oxide composites; the surface resistance of the product obtained in Comparative Example 4 decreased, indicating that the performance of the composite conductive microspheres prepared by the present invention is affected by its component ratio, and by selecting the component ratio within the specified range, a material with better antistatic effect can be prepared.
[0036] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within the present invention.
Claims
1. A mesh cover tape for antistatic encapsulation, characterized in that: The antistatic encapsulation mesh cover consists of a substrate layer and an antistatic coating. The antistatic coating consists of the following components in parts by weight: 20-40 parts polyether polyol, 30-50 parts polyester polyol, 3-5 parts carbon nanotubes, 1-3 parts composite conductive microspheres, 40-80 parts diphenylmethane diisocyanate, 0.3-1.0 parts dibutyltin dilaurate, 0.2-0.5 parts leveling agent, 0.5-2.0 parts dispersant, 40-80 parts water, and 0.05-0.3 parts antioxidant. The composite conductive microspheres are prepared by polymer microspheres @GO and 3,4-ethylenedioxythiophene through a polymerization reaction.
2. The antistatic encapsulation mesh cover tape according to claim 1, characterized in that: The substrate layer is a PET substrate.
3. The antistatic encapsulation mesh cover tape according to claim 1, characterized in that: The method for preparing the composite conductive microspheres is as follows: Step A: Add gelatin to deionized water at 40-50℃ and stir until dissolved. Add styrene, divinylbenzene and benzoyl peroxide in sequence, stir evenly, and polymerize at 70-80℃ for 4-6 hours. Continue to heat to 85-90℃ and polymerize for 3-4 hours. After the reaction is completed, wash and dry to obtain PS-DVB copolymer microspheres. Add PS-DVB copolymer microspheres to concentrated sulfuric acid and sulfonate at 40-50℃ for 2-4 hours. After centrifugation, washing and drying, obtain sulfonated polymer microspheres. Step B: Add sulfonated polymer microspheres and modified graphene oxide to deionized water, and ultrasonically disperse for 20-40 min to obtain a dispersion. Then, allow it to stand, filter, purify, and dry to obtain polymer microspheres @GO. Step C: Add polymer microspheres @GO and 3,4-ethylenedioxythiophene to chloroform solvent and stir until homogeneous. Add potassium persulfate and polymerize at 20-30℃ for 8-12 hours. After standing, filtration, purification and drying, composite conductive microspheres are obtained.
4. The antistatic encapsulation mesh cover tape according to claim 3, characterized in that: In step A, the mass ratio of gelatin, deionized water, styrene, divinylbenzene and benzoyl peroxide is 1:(20-30):(15-20):(1.8-2.0):(0.1-0.3).
5. The antistatic encapsulation mesh cover tape according to claim 3, characterized in that: In step B, the mass ratio of sulfonated polymer microspheres, modified graphene oxide, and deionized water is 1:(0.2-0.4):(20-30).
6. The antistatic encapsulation mesh cover tape according to claim 5, characterized in that: The modified graphene oxide is prepared as follows: Graphene oxide was ultrasonically dispersed in deionized water to obtain a graphene oxide dispersion; polydiallyldimethylammonium chloride solution was added and stirred for 30-40 min; then hydrazine hydrate was added, the temperature was raised to 80-90℃, and the reaction was continued with stirring for 5-7 h; after centrifugation, washing, and drying, modified graphene oxide was obtained.
7. The antistatic encapsulation mesh cover tape according to claim 3, characterized in that: In step C, the mass ratio of polymer microspheres @GO, 3,4-ethylenedioxythiophene, chloroform, and potassium persulfate is 1:(0.2-0.5):(20-30):(0.01-0.03).
8. A method for preparing an antistatic encapsulation mesh cover tape according to any one of claims 1-7, characterized in that: Includes the following steps: Step 1: Dehydrate polyester polyol, polyether polyol and composite conductive microspheres under vacuum at 110-130℃ for 2-3 hours, cool to 60-70℃, add diphenylmethane diisocyanate under nitrogen protection, and react at 100-130℃ for 1-2 hours; then add dibutyltin dilaurate and react at 80℃-90℃ for 3-5 hours, followed by vacuum degassing to obtain the polymerization solution; Step 2: Mix the polymerization liquid, carbon nanotubes, leveling agent, dispersant and water evenly to obtain the antistatic coating; Step 3: Apply antistatic coating to the surface of the PET substrate layer to form an antistatic coating. After cooling, the material is wound up and die-cut to obtain a mesh cover tape for antistatic packaging.
9. The method for preparing an antistatic encapsulation mesh cover tape according to claim 8, characterized in that: The thickness of the substrate layer is 15-50 μm.