Automatic test characterization system and method for optical phased array chip

Abstract

The invention discloses an automatic test characterization system and method for an optical phased array chip, and belongs to the field of equipment testing, and the method comprises the steps: carrying out the state initialization calibration of a test characterization system, and guaranteeing that the system is in a good calibration state; obtaining test characterization parameters input by a user; determining a test process according to test characterization parameters input by a user, and carrying out automatic test characterization; performing algorithm processing on the test data generated by the test system, and automatically generating a test characterization result report; and evaluating the performance of the phased array chip according to the generated characterization result report, and judging whether the phased array chip passes the test or not. According to the automatic test characterization system and method, the test characterization efficiency of the optical phased array chip can be effectively improved, and the inconsistency of test characterization results caused by human factors is avoided to the greatest extent.

Description

Automated testing and characterization system and method for optical phased array chips Technical Field

[0001] This invention relates to the field of equipment testing, and in particular to an automated testing and characterization system and method for optical phased array chips. Background Technology

[0002] An optical phased array chip is a monolithic integrated photonic device that integrates optical path distribution, phase modulation, and coherent emission functions on a silicon photonic chip. It possesses advantages such as solid-state operation, high speed, miniaturization, and low cost, and has promising applications in cutting-edge fields such as lidar, free-space optical communication, biomedical imaging, augmented reality displays, and quantum information processing.

[0003] To ensure that the manufactured optical phased array chips have reliable performance, calibration and testing are necessary steps. However, in related technologies, the testing requirements and performance indicators for optical phased array chips are diverse, the testing process is complex and cumbersome, the amount of test data is extremely large, and the testing process mainly relies on engineers to manually build various test optical paths to carry out the testing process, which makes it difficult to meet the testing needs of large-scale standardized devices. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing an automated testing and characterization system and method for optical phased array chips.

[0005] The objective of this invention is achieved through the following technical solution: an automated testing and characterization system for optical phased array chips. This system includes: a system calibration module, used to acquire optical axis pointing information data of the optical system, electrical state characteristic data of the electronic control system, and imaging data of the imaging system, and to obtain calibration state data for each system after processing; a characterization testing module, used to acquire test state data of the optical phased array chip, specifically including test data for coupling insertion loss, chip electrical carrier impedance state, chip system photoelectric response characteristics, beam deflection angle of the chip under test, beam shape and power intensity, beam wavefront and polarization state, and repeatability accuracy; and a test result generation module, used to read the test data generated by the characterization testing module, generate data images, and generate test reports for device analysis.

[0006] Furthermore, the system calibration module acquires the optical axis pointing information of the optical system of the automated test and characterization system to verify the effectiveness of the optical system; it processes the optical axis pointing data of the optical system of the automated test and characterization system to determine the current optical system state and the required adjustment amount of the optical system's horizontal height and optical system pointing, and controls the multi-dimensional displacement mechanism to adjust and calibrate so that the direction of the laser beam emitted by the chip under test is parallel to the optical axis of the optical system; it acquires the optical axis pointing data of the optical system of the automated test and characterization system after calibration, and determines whether the next round of system calibration needs to be repeated.

[0007] Furthermore, the system calibration module acquires the electrical state characteristic data of the electronic control system of the automated test characterization system to verify the effectiveness of the electronic control system; processes the electrical state characteristic data of the electronic control system of the automated test characterization system to determine whether the current electrical state of the electronic control system is normal; and if the electrical state of the electronic control system of the automated test characterization system is abnormal, the entire automated test characterization process is terminated and a prompt is issued to the user.

[0008] Furthermore, the system calibration module acquires the imaging data of the imaging system of the automated test and characterization system to verify the effectiveness of the imaging system; processes the imaging data acquired by the imaging system of the automated test and characterization system to determine the required adjustment amount between the current imaging system state and the distance between the sensor target surface and the lens; and sends control signals to the electronically controlled displacement stage for adjustment based on the real-time imaging state of the imaging system, so that the sensor array is located at the optimal data acquisition position.

[0009] Furthermore, the characterization test module sequentially performs three levels of photoelectric response tests on the chip system to obtain test status data of the chip system's photoelectric response characteristics, specifically as follows: The first level of photoelectric response testing is conducted by setting the voltage of all electrical digital-to-analog converter units to zero, individually changing the voltage value of each unit, and recording the imaging data collected by the shortwave imaging system at fixed intervals. Based on the data results, it is determined whether the tested optical phased array chip passes the first level response test. The first level photoelectric response test is used to determine whether the chip produces a basic response to external electrical signals; In the three levels of photoelectric response testing... The second-level photoelectric response test uses a closed-loop iterative optimization algorithm based on far-field imaging data to determine the electrical performance of each channel of the phased array chip based on the contribution of each channel to the far-field imaging optimization index. The second-level photoelectric response test is used to determine whether each phase-shifting unit of the chip responds to external voltage and can generate net gain for far-field imaging calibration. The third-level photoelectric response test is carried out among the three levels of photoelectric response tests. The voltage of each electronically controlled channel of the optical phased array chip is changed one by one. The single-channel response curve is obtained based on the light intensity change collected by the far-field imaging system for each channel, which can further determine the effectiveness of the optical-electrical response of a single phase-shifting unit.

[0010] Furthermore, the characterization and testing module determines the reference plane of the optical phased array chip based on the parallelism between the direction of the laser beam emitted by the chip under test and the optical axis of the optical system. By controlling the two-dimensional orientation of the chip under test, the emitted beam of the optical phased array chip is located at the center of the camera target surface of the imaging system. The two-dimensional angle rotated relative to the reference plane is the beam emission angle of the phased array chip.

[0011] Furthermore, the characterization and testing module locks light spots at different emission angles to the center of the camera target surface by applying calibration voltages at different angles. It controls a short-wave infrared camera and a power meter at the receiving end to collect characterization data on the beam shape and power. It controls a multi-channel laser source at the transmitting end to select test channels and adjust the input laser power. Furthermore, the characterization and testing module can lock light beams at different angles to the center of the cage system by applying calibration voltages at different angles. It controls a wavefront sensor at the receiving end to characterize the wavefront characteristics of light beams at different angles in the optical phased array. It also controls a polarimeter at the receiving end to characterize the polarization state of light beams at different angles in the optical phased array.

[0012] Furthermore, the test result generation module automatically reads the test data generated by the characterization test module for subsequent data analysis and processing using various algorithms; specifically as follows: the two-dimensional deflection angle data of the optical phased array chip beam obtained by the characterization test module. , The data is processed and a data image is generated, in which... and The optical phased array chip is respectively in The actual deflection angles in both directions, Different scanning angles are input to the optical phased array chip; the optical phased array chip beam shape image obtained by the characterization and testing module. With power intensity The data is processed and a data image is generated, in which... The image data corresponding to different scanning angles of the optical phased array chip acquired by the short-wave infrared camera is represented by a two-dimensional matrix corresponding to the number of pixels on the camera target surface. Each matrix element represents the light spot intensity acquired by the corresponding pixel. The far-field spot energy power values ​​of the optical phased array chip at different scanning angles are obtained from the optical power meter probe. Different scanning angles are input to the optical phased array chip; the wavefront data of the optical phased array chip obtained by the characterization and testing module are... With beam polarization state data The data is processed and a data image is generated. Among them, The wavefront data of the optical phased array chip acquired by the Shaker-Hartmann wavefront sensor at different scanning angles is represented by a two-dimensional matrix corresponding to the number of microlens array elements of the wavefront sensor. Each matrix element represents the wavefront phase acquired by the sensor at the current spatial location. These are the degree of polarization, polarization azimuth angle, and ellipticity acquired by the beam polarimeter, which can be used to reconstruct the polarization state information of the incident beam. Different scanning angles are input for the optical phased array chip; after processing the data, the test results are summarized and a test report is generated for device analysis.

[0013] On the other hand, the present invention also provides an automated test characterization method for optical phased array chips. The method includes the following steps: (1) performing state initialization calibration to ensure that the system is in a good calibration state, determining the calibration steps according to the system state, and issuing control commands to perform system self-calibration and calibration status prompts, thereby obtaining accurate test characterization data; (2) obtaining the test characterization parameters input by the user to determine the various items and their order of the required test characterization, configuring the test parameters, and issuing control commands to each electronic control device according to the test process; (3) determining the test process according to the test characterization parameters input by the user, carrying out automated test characterization, determining the entire test process through the configuration steps of step (2), and sequentially controlling the electronic control devices in the entire system to achieve multi-dimensional control of the emitted beam of the chip under test; (4) obtaining the data of each sensor and the test system state, performing algorithm processing on the test data generated by the test system, and automatically generating a test characterization result report; (5) evaluating the performance of the chip under test according to the generated multi-dimensional test characterization result report and determining whether it passes the test.

[0014] The beneficial effects of this invention are as follows: This invention configures the test process and sends control commands to the optical phased array chip under test and the various electronic control actuators of the automated test and characterization platform through the main control system. It can realize the self-check of the test system status, the self-calibration of the test system optical path, the acquisition, processing and generation of test characterization data, and determine whether the chip under test passes the test based on the generated test report. It can effectively realize highly automated test characterization, improve test efficiency and ensure the consistency of test results. Attached Figure Description

[0015] Figure 1 is a flowchart illustrating an automated test and characterization method for an optical phased array chip according to an exemplary embodiment.

[0016] Figure 2 is a schematic diagram of an automated test and characterization system for an optical phased array chip according to an exemplary embodiment.

[0017] Figure 3 is a schematic diagram of an optical phased array chip according to an exemplary embodiment. Detailed Implementation

[0018] Embodiments of this disclosure will now be described in more detail with reference to the accompanying drawings. While some embodiments of this disclosure are shown in the drawings, it should be understood that this disclosure can be implemented in forms not limited to those described herein, and these embodiments are provided to provide a more thorough and complete understanding of this disclosure. It should be understood that the drawings and embodiments of this disclosure are for illustrative purposes only and are not intended to limit the scope of protection of this disclosure.

[0019] It should be understood that the steps described in the method embodiments of this disclosure may be performed in different orders and / or in parallel. Furthermore, the method embodiments may include additional steps and / or omit the steps shown. The scope of this disclosure is not limited in this respect.

[0020] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, but this is not intended to limit the scope of the invention.

[0021] Figure 1 is a flowchart illustrating an automatic test and characterization method for an optical phased array chip according to an exemplary embodiment. This test method can be applied to an automatic test and characterization system for optical phased array chips, thereby achieving efficient test and characterization of optical phased array chips and minimizing inconsistencies in test and characterization results caused by human factors. As shown in Figure 1, the test process includes: S101, the system performs state initialization calibration to ensure that the system is in a good calibration state, determines the calibration steps according to the system state, and issues control commands to perform system self-calibration and calibration status prompts, thereby obtaining accurate test and characterization data.

[0022] In detail, by selecting multiple laser channels through the central control system, the calibration light source located on the two-dimensional angular displacement stage emits a calibration laser beam. By adjusting the light source parameters and the two-dimensional angular displacement stage, the system optical axis pointing and calibration status can be determined by the data collected by the detector array, the adjustment amount of the cage optical system and the position of the detector array can be determined.

[0023] S102. The system obtains the test characterization parameters input by the user, which are mainly used to determine the various items to be tested and their order, configure the test parameters of each item, and issue control commands to each electrical control device according to the test process.

[0024] In this embodiment, the automated test characterization items carried out after the system self-calibration described in S101 include two-dimensional beam deflection pointing accuracy test, beam shape characterization, beam wavefront characteristic characterization, beam polarization state characterization, beam loss characteristic characterization, multi-beam coincidence characterization, extremely small angle beam switching performance characterization, repeated switching positioning accuracy characterization, and phased array chip three-level electrical response characteristic performance test.

[0025] In the aforementioned test content, the main parameters configured in this embodiment include, but are not limited to: characterization angle range, angle interval, input laser intensity, number of test repetitions, power test sample data volume, multi-angle repeatable positioning accuracy test data volume, and response test single-step size. Through parameter configuration, various different optical phased array chip test presets can be implemented, thereby meeting diverse testing needs on a single automated testing system.

[0026] S103. The system determines the test process based on the test characterization parameters input by the user and conducts automated test characterization. Through the configuration steps described in S102, the system determines the entire test process and sequentially controls the electronically controlled components throughout the system via the central control system, including the two-dimensional electrically controlled slide rail, two-dimensional electrically controlled turntable, multi-channel laser, and chip under test, to achieve multi-dimensional control of the beam emitted from the chip under test. By selecting the multi-channel laser, optical coupling tests can be performed on the fiber array coupling test channel of the chip under test to determine the chip's coupling performance.

[0027] By using a two-dimensional electrically controlled slide rail and a two-dimensional electrically controlled turntable, the beam of the chip under test is always positioned at the center of the sensor target surface, and the angle is calibrated in real time according to the beam offset. By controlling the metal probe to perform impedance testing at the test points on the chip under test carrier, the electrical performance of the chip can be preliminarily determined, avoiding damage to the device under test by direct power-on.

[0028] The entire automated test is completed by controlling the detector array to collect data.

[0029] S104. Acquire data from each sensor and the status of the test system. Process the test data generated by the test system using algorithms to automatically generate a test characterization result report. In this embodiment, the detector array mainly includes a polarimeter, a short-wave infrared camera, an optical power meter, and a wavefront sensor, which respectively collect data such as beam polarization, image morphology, power intensity, and beam wavefront. Taking image morphology data as an example, the contour morphology of the main lobe of the beam can be determined through a contour recognition algorithm, and the centroid position can be calculated. The difference between the main lobe and the target scanning position can be judged to evaluate the accuracy of the beam scanning of the chip under test, and the quality factor and divergence angle of the main lobe beam morphology in different directions can be calculated.

[0030] S105. The system evaluates the performance of the chip under test based on the generated multi-dimensional test characterization result report and determines whether the test is passed.

[0031] In this disclosed example, through the automated test characterization process, the test system can achieve efficient automated test characterization according to requirements. Its advantages are that it improves the test efficiency of optical phased array chips under various requirements, reduces labor costs, and can maximize the consistency of test results obtained by different testers, avoiding the influence of testers' subjective factors on the test results of different chips.

[0032] Figure 2 is a schematic diagram of an automatic testing and characterization system for an optical phased array chip according to an exemplary embodiment. The main hardware structure of the system includes a multi-dimensional detector array 210, which in this embodiment consists of a polarimeter, an infrared camera, an optical power meter, and a wavefront sensor. It is mainly used to acquire multi-dimensional data of the chip under test, including multi-dimensional characterization data such as beam polarization, image morphology, power intensity, and beam wavefront.

[0033] The cage-type optical system module 220, in this embodiment, consists of an adjustable aperture, a power attenuator, an adjustable polarizer, and a lens. It is mainly used to achieve high-precision beam processing and transformation, so that the beam can be clearly imaged in the far field on the detector target surface, while reducing the influence of background reflection stray light, and modulating the beam energy intensity to prevent damage to the detector.

[0034] In this embodiment, this part of the system uses a cage-type optical system design to improve the alignment accuracy of the system, while facilitating modular adjustment of the internal optical components. In actual application scenarios, this part can add or remove components as needed.

[0035] The two-dimensional phased array emission system 230 consists of a multi-channel laser, a two-dimensional electrically controlled angular displacement stage, a chip under test, and a calibration light source. It is primarily used to achieve laser input whose state can be controlled by a central control system. Through the two-dimensional electrically controllable high-precision angular displacement stage system, in conjunction with an external electric driver, different beam scanning directions of the optical phased array chip can be controlled, enabling multi-dimensional manipulation and thus fulfilling complex beam characterization requirements. The calibration light source is used for system calibration in the aforementioned S101. In this embodiment, the calibration light source consists of an optical fiber collimator connected to the multi-channel programmable laser.

[0036] The main control system 240 and the multi-channel drive controller 241 can realize program control of the electrically controllable parts of the entire automated calibration and testing system through the programmed automated control program. In this embodiment, it mainly includes data transmission, including detection devices such as polarimeters, infrared cameras, optical power meters, and wavefront sensors, as well as two-dimensional electrically controlled slide rails, two-dimensional electrically controlled angular displacement stages, electrically driven chips of devices under test, and multi-channel lasers.

[0037] Figure 3 is a schematic diagram illustrating the principle of an optical phased array chip according to an exemplary embodiment. An optical phased array chip is an optical device that fabricates phased array elements onto a single chip using micro-nano optical processing techniques. It can control and shape the beam by controlling the relative phase between antennas. Similar to the microwave phased arrays used in radar systems, optical phased array chips achieve high-speed, flexible beam control through purely electrical control. As shown in Figure 3, a typical optical phased array chip system consists of the following main components: an optical phased array chip 310, used to couple input laser light onto the chip to achieve multi-channel phase control, thereby realizing electrically controllable all-solid-state beam scanning in the far field. It mainly includes the following main devices: a first coupling device 311 and a second coupling device 314, used to couple external laser light into the optical phased array chip in the forward direction, or from the chip to an external output in the reverse direction. In this embodiment, the first coupling device 311 and the second coupling device 314 are an end face coupler and a grating coupler, respectively. The incident laser 301 is coupled from the laser to the chip via the end face coupler through the optical fiber, and then coupled from the chip to the spatial laser output 302 via the grating coupler.

[0038] The beam splitter 312 is used to split a single laser beam into multiple beams on a chip, enabling subsequent phase modulation of each beam. In this embodiment, the beam splitter is a series of cascaded multimode interference couplers.

[0039] The phase-shifting device 313 is used to change the phase of each laser path on the chip under external control, thereby achieving direction control of the emitted laser. In this embodiment, the phase-shifting device is an on-chip phase shifter based on carrier dispersion effect, and the phase within the optical waveguide can be controlled by changing the electrode voltage.

[0040] In this embodiment, the third coupling device 315 and the fourth coupling device 316 are directly connected without passing through other phased array devices. They can be used to perform the initialization calibration step S101 in Figure 1 above to evaluate the coupling alignment and packaging performance of the test chip fiber array.

[0041] The multi-channel electric drive chip 320 is mainly used to receive control signals sent by the host computer 330 and to effectively control the phase shifting device 313 on the optical phased array chip.

[0042] The host computer 330 is mainly used to run the automated test and characterization system program. According to the test process, it sends control signals to the multi-channel electric drive chip and further sends driving voltages to each phase shifter 313 of the optical phased array chip 310 to deflect the emitted beam of the chip.

[0043] This invention provides an automated testing and characterization system for optical phased array chips. The testing process of the automated testing and characterization system mainly includes the following three modules: a system calibration module, used for configuring the system according to the model and batch of the optical phased array chip being tested and the test items of interest; this module realizes automated system calibration through a host computer and a servo controller; the host computer issues movement commands to the detector's two-dimensional displacement stage to control the camera movement, acquires multiple frames of camera images, and determines the system's optical axis pointing deviation by combining the data read back from the horizontal sensor; the system's zero-position calibration position is determined by the image of the calibration laser emitted by the collimating light source hitting the short-wave infrared camera target surface through the optical system.

[0044] The system calibration module acquires the optical axis pointing information of the optical system of the automated test and characterization system to verify the effectiveness of the optical system; it processes the optical axis pointing data of the optical system of the automated test and characterization system to determine the current optical system state and the required adjustment amount of the optical system's horizontal height and optical system pointing, and controls the multi-dimensional displacement mechanism to adjust and calibrate so that the direction of the laser beam emitted by the chip under test is parallel to the optical axis of the optical system; it acquires the optical axis pointing data of the optical system of the automated test and characterization system after calibration, and determines whether the next round of system calibration needs to be repeated.

[0045] The system calibration module acquires the electrical state characteristic data of the electronic control system of the automated test and characterization system to verify the effectiveness of the electronic control system; processes the electrical state characteristic data of the electronic control system of the automated test and characterization system to determine whether the current electrical state of the electronic control system is normal; if the electrical state of the electronic control system of the automated test and characterization system is abnormal, the entire automated test and characterization process is terminated and a prompt is issued to the user.

[0046] The system calibration module acquires the imaging data of the imaging system of the automated test and characterization system to verify the effectiveness of the imaging system; it processes the imaging data acquired by the imaging system of the automated test and characterization system to determine the required adjustment amount between the current imaging system state and the distance between the sensor target surface and the lens; and based on the real-time imaging state of the imaging system, it sends control signals to the electronically controlled displacement stage for adjustment so that the sensor array is located at the optimal data acquisition position.

[0047] The system calibration module acquires calibration status data of the optical system, electronic control system, and imaging system, and determines whether the next round of system calibration needs to be repeated; based on the calibration status data of each system, it generates a system status judgment log.

[0048] The characterization and testing module is used to automatically execute test procedures for optical phased array chips based on system configuration information. These include, but are not limited to, coupling insertion loss, chip electrical carrier impedance state, three levels of chip system photoelectric response characteristics, beam deflection angle of the chip under test, beam shape and power intensity, beam wavefront and polarization state, and performance characterization tests for repeatability accuracy. This module achieves automated characterization testing through a host computer and servo controller, including: issuing movement commands to the detector's two-dimensional displacement stage from the host computer, controlling the camera to move within the stage's travel range, acquiring camera image data at different positions, performing contour recognition based on the acquired image data, and calculating the beam shape quality factor within the contour. The evaluation index determines the x-stage input that maximizes the beam evaluation index, thus determining the optimal camera image acquisition position. The host computer issues movement commands to the two-dimensional displacement stage of the detector, enabling the selection of different types of detectors and calibration devices, including short-wave infrared cameras, optical power meters, wavefront sensors, and polarimeters. Control commands from the host computer to the two-dimensional electrically controlled rotary stage allow for horizontal and pitch alignment of the optical phased array chip at different angles in the x and y directions of the field of view. The tooling structure design ensures that the beam emission aperture of the optical phased array chip under test is located at the fixed point of the two-dimensional pointing composite control system, namely the rotation axis of the rotary displacement stage and the rotation center of the pitch displacement stage.

[0049] Based on the insertion loss data of the chip's fiber array coupling, determine the chip's optical coupling performance. For abnormal chips, record the existing test results and terminate subsequent test steps. Based on the impedance state of the chip's electrical carrier board, determine the next power-on state. For abnormal chips, terminate power-on, record the existing test results, and terminate subsequent test steps.

[0050] The characterization and testing module sequentially performs three levels of photoelectric response tests on the chip system to obtain test status data of the photoelectric response characteristics of the chip system, specifically as follows: First-level photoelectric response testing is conducted, with all electrical digital-to-analog converter voltages set to zero. For each unit, the voltage value is changed individually, and the imaging data collected by the shortwave imaging system is recorded at fixed intervals. Based on the data results, it is determined whether the tested optical phased array chip passes the first-level response test. The first-level photoelectric response test is used to determine whether the chip produces a basic response to external electrical signals. Second-level photoelectric response testing is conducted, using a closed-loop iterative optimization algorithm based on far-field imaging data. The contribution of each channel to the far-field imaging optimization index is used to determine the electrical performance of each channel of the phased array chip. The second-level photoelectric response test is used to determine whether each phase-shifting unit of the chip responds to external voltage and can generate net gain for far-field imaging calibration. Third-level photoelectric response testing is conducted, changing the voltage of each electrically controlled channel of the optical phased array chip. Based on the change in light intensity collected by the far-field imaging system for each channel, a single-channel response curve is obtained, which can further determine the effectiveness of the optical-electric response of a single phase-shifting unit.

[0051] The characterization and testing module determines the reference plane of the optical phased array chip based on the parallelism between the direction of the laser beam emitted by the chip under test and the optical axis of the optical system. By controlling the two-dimensional orientation of the chip under test, the emitted beam of the optical phased array chip is located at the center of the camera target surface of the imaging system. The two-dimensional angle rotated relative to the reference plane is the beam emission angle of the phased array chip.

[0052] The characterization and testing module locks light spots at different emission angles to the center of the camera target surface by applying calibration voltages at different angles. It controls the receiver, which is a short-wave infrared camera and a power meter, to collect characterization data on the beam shape and power. It controls the multi-channel laser source at the transmitter to select test channels and adjust the input laser power. The characterization and testing module can lock light beams at different angles to the center of the cage system by applying calibration voltages at different angles. It controls the receiver to select a wavefront sensor to characterize the wavefront characteristics of light beams at different angles of the optical phased array. It controls the receiver to select a polarimeter to characterize the polarization state of light beams at different angles of the optical phased array.

[0053] The characterization and testing module can characterize the repeatability of the optical phased array chip by repeatedly switching between different angles and back to the field of view of the short-wave infrared camera and collecting and analyzing multiple frames of images.

[0054] The test result generation module is used to process the obtained test characterization data, generate a test report for the corresponding optical phased array chip, and determine whether the test passes based on the set chip performance judgment criteria.

[0055] The test result generation module automatically reads the test data generated by the characterization test module for subsequent data analysis and processing using various algorithms; specifically, it reads the two-dimensional deflection angle data of the optical phased array chip beam obtained by the characterization test module. , The data is processed and a data image is generated, in which... and The optical phased array chip is respectively in The actual deflection angles in both directions, Different scanning angles are input to the optical phased array chip; the optical phased array chip beam shape image obtained by the characterization and testing module. With power intensity The data is processed and a data image is generated, in which... The image data corresponding to different scanning angles of the optical phased array chip acquired by the short-wave infrared camera is represented by a two-dimensional matrix corresponding to the number of pixels on the camera target surface. Each matrix element represents the light spot intensity acquired by the corresponding pixel. The far-field spot energy power values ​​of the optical phased array chip at different scanning angles are obtained from the optical power meter probe. Different scanning angles are input to the optical phased array chip; the wavefront data of the optical phased array chip obtained by the characterization and testing module are... With beam polarization state data The data is processed and a data image is generated. Among them, The wavefront data of the optical phased array chip acquired by the Shaker-Hartmann wavefront sensor at different scanning angles is represented by a two-dimensional matrix corresponding to the number of microlens array elements of the wavefront sensor. Each matrix element represents the wavefront phase acquired by the sensor at the current spatial location. These are the degree of polarization, polarization azimuth angle, and ellipticity acquired by the beam polarimeter, which can be used to reconstruct the polarization state information of the incident beam. Different scanning angles are input to the optical phased array chip; after processing the data, the test results are summarized, and a test report is generated for device analysis. It should be noted that the aforementioned host computer control system carries one or more programs, which can be written in one or more programming languages ​​or combinations thereof to perform the operations of this disclosure. These programming languages ​​include, but are not limited to, object-oriented programming languages—such as Java, Python, and C++—as well as conventional procedural programming languages—such as C or similar languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In this embodiment, the program is written in Python and C++, and the program code can be executed entirely on the user's computer without relying on a network connection or external server.

[0056] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this disclosure. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0057] For illustrative purposes, the foregoing description has been made with reference to specific embodiments. However, the foregoing illustrative discussions are not intended to be exhaustive or to limit the present disclosure to the precise forms disclosed. Numerous modifications and variations are possible based on the foregoing examples. These embodiments were chosen and described to best illustrate the principles of the present disclosure and its practical application, thereby enabling those skilled in the art to best utilize the present disclosure and to employ various embodiments with different modifications to suit a particular intended application. For illustrative purposes, the foregoing description has been made with reference to specific embodiments. However, the foregoing illustrative discussions are not intended to be exhaustive or to limit the present disclosure to the precise forms disclosed. Numerous modifications and variations are possible based on the foregoing teachings. These embodiments were chosen and described to best illustrate the principles of the present disclosure and its practical application, thereby enabling those skilled in the art to best utilize the present disclosure and to employ various embodiments with different modifications to suit a particular intended application.

Claims

1. An automated testing and characterization system for optical phased array chips, characterized in that, The system includes: a system calibration module, used to acquire optical axis pointing information data of the optical system, electrical state characteristic data of the electronic control system, and imaging data of the imaging system, and to obtain calibration state data of each system after processing; a characterization and testing module, used to acquire test state data of the optical phased array chip, specifically including test data of coupling insertion loss, chip electrical carrier impedance state, chip system photoelectric response characteristics, beam deflection angle of the chip under test, beam shape and power intensity, beam wavefront and polarization state, and repeatability accuracy; and a test result generation module, used to read the test data generated by the characterization and testing module, generate data images, and generate test reports for device analysis.

2. The automated testing and characterization system for an optical phased array chip according to claim 1, characterized in that, in, The system calibration module acquires the optical axis pointing information of the optical system of the automated test characterization system to verify the effectiveness of the optical system. The optical axis pointing data of the automated test characterization system is processed to determine the current state of the optical system and the required adjustment amount of the optical system's horizontal height and optical system pointing. The multi-dimensional displacement mechanism is then controlled to adjust and calibrate the system so that the direction of the laser beam emitted by the chip under test is parallel to the optical axis of the optical system. The calibrated optical axis pointing data of the automated test characterization system is then obtained, and it is determined whether the next round of system calibration needs to be repeated.

3. The automated testing and characterization system for an optical phased array chip according to claim 1, characterized in that, in, The system calibration module acquires the electrical state characteristic data of the electronic control system of the automated test characterization system to verify the effectiveness of the electronic control system. The electrical state characteristic data of the electrical control system of the automated test characterization system are processed to determine whether the current electrical state of the electrical control system is normal. If the electrical state of the electronic control system of the automated test characterization system is abnormal, the entire automated test characterization process will be stopped and a prompt will be issued to the user.

4. The automated testing and characterization system for an optical phased array chip according to claim 1, characterized in that, in, The system calibration module acquires imaging data from the imaging system of the automated test characterization system to verify the effectiveness of the imaging system. The imaging data collected by the imaging system of the automated testing and characterization system is processed to determine the required adjustment amount between the current imaging system state and the distance between the sensor target surface and the lens. Based on the real-time imaging state of the imaging system, a control signal is sent to the electronically controlled displacement stage for adjustment so that the sensor array is located at the optimal data acquisition position.

5. The automated testing and characterization system for an optical phased array chip according to claim 1, characterized in that, The characterization and testing module sequentially performs three levels of photoelectric response tests on the chip system to obtain test status data of the photoelectric response characteristics of the chip system, specifically as follows: First-level photoelectric response testing is conducted, with all electrical digital-to-analog converter voltages set to zero. For each unit, the voltage value is changed individually, and the imaging data collected by the shortwave imaging system is recorded at fixed intervals. Based on the data results, it is determined whether the tested optical phased array chip passes the first-level response test. The first-level photoelectric response test is used to determine whether the chip produces a basic response to external electrical signals. Second-level photoelectric response testing is conducted, using a closed-loop iterative optimization algorithm based on far-field imaging data. The contribution of each channel to the far-field imaging optimization index is used to determine the electrical performance of each channel of the phased array chip. The second-level photoelectric response test is used to determine whether each phase-shifting unit of the chip responds to external voltage and can generate net gain for far-field imaging calibration. Third-level photoelectric response testing is conducted, changing the voltage of each electrically controlled channel of the optical phased array chip. Based on the change in light intensity collected by the far-field imaging system for each channel, a single-channel response curve is obtained, which can further determine the effectiveness of the optical-electric response of a single phase-shifting unit.

6. The automated testing and characterization system for an optical phased array chip according to claim 1, characterized in that, The characterization and testing module determines the reference plane of the optical phased array chip based on the parallelism between the direction of the laser beam emitted by the chip under test and the optical axis of the optical system. By controlling the two-dimensional orientation of the chip under test, the emitted beam of the optical phased array chip is located at the center of the camera target surface of the imaging system. The two-dimensional angle rotated relative to the reference plane is the beam emission angle of the phased array chip.

7. The automated testing and characterization system for an optical phased array chip according to claim 1, characterized in that, The characterization and testing module locks light spots at different emission angles onto the center of the camera target surface by applying calibration voltages at different angles. It controls the receiver to collect characterization data on the beam shape and power for a short-wave infrared camera and a power meter. It controls the multi-channel laser source at the transmitter to select test channels and adjust the input laser power.

8. The automated testing and characterization system for an optical phased array chip according to claim 1, characterized in that, The characterization and testing module can lock beams at different angles to the center of the cage system by applying calibration voltages at different angles. By controlling the device selected at the receiver to be a wavefront sensor, the wavefront characteristics of beams at different angles of the optical phased array can be characterized. By controlling the device selected at the receiver to be a polarimeter, the polarization state of beams at different angles of the optical phased array can be characterized.

9. The automated testing and characterization system for an optical phased array chip according to claim 1, characterized in that, The test result generation module automatically reads the test data generated by the characterization test module for subsequent data analysis and processing using various algorithms; specifically, it reads the two-dimensional deflection angle data of the optical phased array chip beam obtained by the characterization test module. 、 The data is processed and a data image is generated, in which... and The optical phased array chip is respectively in 、 The actual deflection angles in both directions, Different scanning angles are input to the optical phased array chip; the optical phased array chip beam shape image obtained by the characterization and testing module. With power intensity The data is processed and a data image is generated, in which... The image data corresponding to different scanning angles of the optical phased array chip acquired by the short-wave infrared camera is represented by a two-dimensional matrix corresponding to the number of pixels on the camera target surface. Each matrix element represents the light spot intensity acquired by the corresponding pixel. The far-field spot energy power values ​​of the optical phased array chip at different scanning angles are obtained from the optical power meter probe; the wavefront data of the optical phased array chip obtained from the characterization and testing module are... With beam polarization state data 、 、 The data is processed and a data image is generated; among which, The wavefront data of the optical phased array chip acquired by the Shaker-Hartmann wavefront sensor at different scanning angles is represented by a two-dimensional matrix corresponding to the number of microlens array elements of the wavefront sensor. Each matrix element represents the wavefront phase acquired by the sensor at the current spatial location. 、 、 The polarization degree, polarization azimuth angle, and ellipticity acquired by the beam polarimeter can be used to reconstruct the polarization state information of the incident beam. After processing the data, the test results are summarized and a test report is generated for device analysis.

10. An automated testing and characterization method for an optical phased array chip based on the system described in any one of claims 1-9, characterized in that, The method includes the following steps: (1) Perform state initialization calibration to ensure that the system is in a good calibration state, determine the calibration steps according to the system state, and issue control commands to perform system self-calibration and calibration status prompts, thereby obtaining accurate test characterization data; (2) Obtain the test characterization parameters input by the user to determine the various items and their order of the required test characterization, configure the test parameters, and issue control commands to each electronic control device according to the test process; (3) Determine the test process according to the test characterization parameters input by the user, carry out automated test characterization, determine the entire test process through the configuration steps of step (2), and sequentially adjust the electronic control devices in the entire system to achieve multi-dimensional control of the beam emitted by the chip under test; (4) Obtain the data of each sensor and the test system state, perform algorithm processing on the test data generated by the test system, and automatically generate a test characterization result report; (5) Evaluate the performance of the chip under test according to the generated multi-dimensional test characterization result report and determine whether the test is passed.

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