Method and system for matching calibration of detectors in an array of detectors

Abstract

The present disclosure describes a method and system for checking a meter response. The method includes positioning a sample having a known profile and a uniform composition between a radiation source and a subset of detectors in a detector array arranged linearly in a first direction. A sample signal is generated by irradiating the sample with radiation from the radiation source and detecting radiation transmitted through the sample and reaching the subset of detectors. The method includes inputting the sample signal into a calibration for each detector of the subset of detectors and each sample of one or more samples, thereby determining a value corresponding to each sample of the one or more samples and each detector of the subset of detectors. The method determines whether the value corresponding to the one or more samples coincides with a known value of the sample and thereby provides an indication of a calibration status of the meter.

Description

Cross-references to applications related to methods and systems for calibrating detectors in a detector array

[0001] This application claims the benefit of U.S. Provisional Application No. 63 / 578,415, filed August 24, 2023, pursuant to 35 USC § 119(e). The entire contents of the aforementioned application are incorporated herein by reference. Technical Field

[0002] This invention relates to detector arrays. Specifically, it relates to a method for troubleshooting detector calibration in a detector array. Background Technology

[0003] Detectors for electromagnetic radiation can be arranged in arrays, such as in rows or to cover an area. This arrangement allows for simultaneous detection of radiation across a large area. In measurement systems (such as X-ray or IR systems) or in X-ray screening systems (such as those for packages, cargo, or letters), detector arrays can be arranged below the screening area or space, and beams from the source can be directed through the screening area and to the detectors in the array. This allows for quantitative or qualitative measurements by detecting a reduction in transmission through objects in the screening area. Especially in the case of quantitative measurements, appropriate calibration curves are used. Because the response of each detector is slightly different, each detector in the array is calibrated to ensure accuracy and precision.

[0004] The challenge with such systems is ensuring that each detector in the detector array has a matched response after proper calibration. For example, if a web moving in the longitudinal (MD) direction is measured by a detector array oriented laterally (CD), stripes may be seen in the web orientation (WD) if one or more detectors are not properly calibrated to the required resolution. Conversely, the appearance of stripes may actually be a true characteristic of the web. There is no good way to determine the source of the stripes and correct the data and calibration curves as necessary except by recalibrating the detectors and remeasuring the web.

[0005] Therefore, there is an unmet need for calibration of detectors in the detector array for screening and matching. Summary of the Invention

[0006] This document describes systems, methods, and products for addressing these and other needs with respect to exemplary and non-limiting embodiments. Various alternatives, modifications, and equivalents are possible.

[0007] According to a first aspect, a method for examining the response of an instrument is described. The method includes positioning one or more samples, one at a time, between a radiation source and a subset of detectors in an array of detectors linearly arranged in a first direction at one or more locations. The method further includes generating a sample signal by irradiating the sample with radiation from the radiation source and detecting the radiation transmitted through the sample and reaching the subset of detectors. In another step, the method includes inputting the sample signal into a calibration curve for each detector in the subset of detectors and for each of the one or more samples, thereby determining a value corresponding to each of the one or more samples and each detector in the subset of detectors. If the value corresponding to the one or more samples is consistent with the known profile and uniform composition of the sample, the method provides a first indication.

[0008] According to a second aspect, a system for checking the response of an instrument is described. The system includes a radiation source, a detector array arranged in a first direction, a sample holder, a space between the source and the detector array, and a computing device having executable code stored thereon. The executable code is configured to send instructions for one or more of the following: positioning one or more samples having a known profile and uniform composition in the sample holder, one at a time, at one or more locations between the radiation source and a subset of detectors in the detector array; generating a sample signal by irradiating the sample with radiation from the radiation source and detecting radiation transmitted through the sample and reaching the subset of detectors; inputting the sample signal into a calibration curve for each detector in the subset of detectors and for each of the one or more samples, thereby determining a value corresponding to each of the one or more samples and each detector in the subset of detectors; and providing a first indication if the value corresponding to the one or more samples matches the known profile and uniform composition of the sample.

[0009] According to a third aspect, one or more non-transitory computer-readable media having instructions thereon are described. When executed by one or more processing devices of a measuring instrument, the one or more non-transitory computer-readable media cause the measuring instrument to perform the method according to the first aspect.

[0010] These methods, systems, and non-transient media address unmet needs for calibrating and matching detectors in detector arrays. Attached Figure Description

[0011] The foregoing and other features and advantages of embodiments of the invention will be more fully understood from the following detailed description of exemplary embodiments taken in conjunction with the accompanying drawings.

[0012] Figures 1A and 1B illustrate measuring or screening instruments according to some embodiments.

[0013] Figures 1C and 1D illustrate the measuring instruments of Figures 1A and 1B, according to some embodiments, with a sample holder that may be included.

[0014] Figure 2A illustrates a method for checking the response of a measuring instrument according to some embodiments.

[0015] Figure 2B is a flowchart illustrating the steps of the method illustrated in Figure 2A.

[0016] Figure 3 illustrates instructions provided by the methods and systems described herein according to some implementations.

[0017] Figures 4A to 4D illustrate a radiation beam incident on sample 101 and on detectors in a subset of detectors according to some embodiments. Figure 4A shows a sample with defects, and Figure 4B shows the sample with defects translated along the detector array. Figure 4C shows the sample, and Figure 4D shows the sample translated along the detector array.

[0018] Figure 5 is a flowchart illustrating the steps for detecting possible streaks in a sample according to some embodiments.

[0019] Figure 6 shows a topographic image of a wafer scanned according to the method described with reference to Figure 5.

[0020] Figure 7 is a block diagram of a computing device 700 that can perform some or all of the method steps described herein, according to some embodiments.

[0021] Figure 8 is a block diagram of an exemplary scientific instrument support system in which some or all of the methods disclosed herein can be performed according to various embodiments.

[0022] Figure 9 is a block diagram of a system 900 for checking the response of a measuring instrument according to some embodiments.

[0023] The figures mentioned above are not necessarily drawn to scale and should be understood as providing representations of specific embodiments, and are conceptual in nature only, illustrating the principles involved. The same reference numerals in the figures are used for similar or identical parts and features shown in various alternative embodiments. Detailed Implementation

[0024] In the description of the invention herein, it should be understood that, unless implied or expressly otherwise understood or stated, words appearing in the singular form encompass their plural counterparts, and words appearing in the plural form encompass their singular counterparts. Furthermore, it should be understood that, for any given component or embodiment described herein, any possible candidates or alternatives listed for that component may generally be used alone or in combination with each other, unless implied or expressly otherwise understood or stated. Additionally, it should be understood that the figures shown herein are not necessarily drawn to scale, and some elements may be drawn only for clarity of the invention. Furthermore, corresponding or similar elements may be shown in the various figures by repeating reference numerals. Moreover, it should be understood that any list of such candidates or alternatives is merely illustrative and not restrictive, unless implied or expressly otherwise understood or stated. Additionally, unless otherwise indicated, the figures used in the specification and claims to represent quantities of ingredients, components, reaction conditions, etc., should be understood to be modified by the term "about".

[0025] Therefore, unless otherwise indicated, the numerical parameters set forth in this specification and the appended claims are approximations that may vary depending on the desired properties sought to be obtained through the subject matter presented herein. At a minimum, and without attempting to limit the application of the equivalence principle to the scope of the claims, each numerical parameter should be interpreted at least according to the number of significant figures reported and by applying ordinary rounding techniques. Although the numerical ranges and parameters that set forth the broad scope of the subject matter presented herein are approximations, the values ​​set forth in the specific examples are reported as precisely as possible. However, any numerical value inherently contains some error due to the statistical deviations necessarily found in the corresponding test measurements.

[0026] Figures 1A and 1B illustrate a measuring or screening instrument 100 according to some embodiments. The measuring instrument 100 includes a radiation source 102, a web 104, and a detector array 106. Figure 1A shows a front view, and Figure 1B shows a side view. The detector array 106 includes a plurality of detectors 108 oriented in a first direction 110 corresponding to CD. The web 104 travels in a second direction 112 corresponding to MD here and may be supported by a guide element 114. The radiation source 102 is depicted as a point source, providing radiation 116 as a fan-shaped beam that is projected onto the detector array 106 after passing through the web 104. The web 104 itself may be the object being studied, such as a film, or an article 105 may be placed on the web 104 (e.g., a conveyor belt), with the article 105 passing through the space 107 between the radiation source 102 and the array.

[0027] Figures 1C and 1D illustrate a measuring instrument 100 with a sample holder 109, which may be included in some embodiments. Figure 1C is a front view, and Figure 1D is a side view. The sample holder 109 is movable in a first direction 110 to move the holder 109 within radiation 116 in space 107. In some embodiments, the sample holder 109 is also movable in a second direction 112, such that the sample holder 109 acts as an "xy" stage. The sample holder may be connected by an arm 111 to a track 113 to move the sample holder in the first direction 110. The track 113 may be longer than the detector array 106, allowing the sample holder 109 to be moved out of radiation 116. The sample holder may also include other or alternative elements, such as tracks, actuators, and screws and motors, to move the sample holder 109 in the second direction 112. In some embodiments, the sample holder 109 is an xyz stage and includes elements for moving the holder upwards in a third direction orthogonal to the first direction 110 and the second direction 112. In some embodiments, the holder can accommodate more than one sample 101 at a time. For example, the sample holder can accommodate multiple samples 101 adjacent to each other on the sample holder 109, such that each sample can be positioned between radiation 116 and detector 108, wherein the samples 101 do not overlap. In some embodiments, the samples 101 can be stacked (overlapped), such that radiation 116 passes through the stacked samples 101 before reaching detector 108.

[0028] It should be understood that a scanning beam performing raster scanning in the CD direction can also be used, or multiple fan-shaped beams spanning the detector array 106 can be used. Furthermore, more than one row of detectors 108 can be used in the detector array 106, such as two or more adjacent rows oriented in the MD direction. In some embodiments, the radiation source 102 is an X-ray source.

[0029] Figure 2A illustrates a method for checking the response of a measuring instrument according to some embodiments. Using the measuring instrument 100, a sample 101 is positioned between a radiation source 102 and a subset 204 of a detector array 106 linearly arranged in a first direction 110. The sample 101 casts a shadow on the detector subset 204 because it blocks some of the radiation 116 from reaching the detector subset 204. In some embodiments, the sample 101 may be placed in a sample holder 109 (Figures 1C and 1D).

[0030] A sample signal is generated by irradiating sample 101 with radiation 116 from radiation source 102 and detecting the radiation transmitted through sample 101 and reaching detector subset 204. Detector 108 includes or communicates with circuitry 205 to receive an initial signal generated based on the interaction of radiation 116 with detector 108 as input. These initial signals are amplified and digitized by circuitry 205 and output as a sample signal, which is input to a calibration curve of detector 108, as described below. In some embodiments, the sample signal is transmitted / input to computing device 700 (described in more detail below with reference to FIG. 7).

[0031] The sample signal is input to a calibration curve for each of the detectors 108 in at least the subset 204 of detectors, and a value such as thickness or basic weight is determined for sample 101 for each of the detectors 108. A first indication 302 is provided if the value corresponding to one or more samples 101 is consistent with the known profile and uniform composition of sample 101. As used herein, "consistent with" means that the value is the same as the expected value for the known profile and uniform composition within the measurement error or the desired and selected accuracy. The first indication 302 may be provided by computing device 700. In some embodiments, a second indication 304 is provided if the value corresponding to one or more samples 101 is inconsistent with the known profile and uniform composition of sample 101. In some embodiments, calibration is adjusted. In some embodiments, sample 101 is placed at one or more additional locations between source 102 and detector subset 204 by moving sample 101 in a first direction 110.

[0032] Detector subset 204 may include one or all of the detectors 108 in detector array 110. The number of detectors 108 in detector subset 204 depends on the length of sample 101 in the first direction 106 compared to the length of array 106 in the first direction 110. That is, the number of detectors 108 in detector subset 204 depends on which detectors 108 are occluded by sample 101. In some embodiments, sample 101 occludes 1% to 80% (e.g., 1% to 50%, 1% to 10%) of detector array 106.

[0033] Any suitable detector 108 can be used. For example, a photodiode that is sensitive to or responsive to radiation 116 can be used. The size of the diode can also be selected based on the required resolution. For example, the spacing between the diodes can be in the range of about 0.5 mm to about 1 cm, such as about 1 mm to 1.6 mm.

[0034] Sample 101 has a known profile. For example, sample 101 may be concave, convex, have a stepped change in profile, be wedge-shaped, flat, have an irregular surface, or include regular features. In some embodiments, sample 101 is flat and has a uniform profile. For example, in some embodiments, sample 101 has a total thickness variation (TTV) of less than 10 micrometers (e.g., less than 5 micrometers, less than 3 micrometers, or less than 1 micrometer).

[0035] In some embodiments, sample 101 also has a homogeneous composition. For example, sample 101 may have a layered structure in which the composition is the same within each layer, while each layer may have a different composition, or the entire sample 101 may be substantially homogeneous. "Substantially homogeneous" here means that the bulk of the sample has a homogeneous composition, and recognizes that the outer surface may have thin layers (e.g., 1 nm to 100 nm) of different materials (such as oxides). In some embodiments, sample 101 has impurities less than about 100 ppm (e.g., less than 10 ppm, less than 1 ppm, less than 100 ppb, less than 10 ppb). Sample 101 may include any element or combination of elements that can form a stable structure. As used herein, "stable" means that sample 101 retains its form and composition during treatment and irradiation with measuring instrument 100 (i.e., it does not undergo chemical change or degradation). In some embodiments, sample 101 includes a metal or alloy. In some embodiments, sample 101 comprises plastics such as polypropylene, polyethylene, polycarbonate, and polyurethane. In some embodiments, sample 101 comprises main group elements such as carbon, silicon, germanium, oxygen, nitrogen, and phosphorus. In some embodiments, sample 101 is a metal or a main group oxide. The sample may even comprise a fluid within a container, wherein the container holds the sample in its form or shape.

[0036] In some embodiments, sample 101 is a semiconductor wafer or a portion thereof, such as a test piece or diced piece taken from a semiconductor wafer. In some embodiments, the semiconductor wafer includes group IV elements (e.g., carbon, silicon, germanium), group II-V elements (e.g., aluminum, gallium, indium, arsenic, nitrogen, phosphorus), and metals (e.g., copper, tungsten, titanium). For example, the semiconductor wafer may be a silicon wafer, a silicon nitride wafer, a silicon carbide wafer, a germanium wafer, a gallium arsenide wafer, a titanium nitride wafer, a tungsten wafer, a copper wafer, or a layered combination of these wafers (e.g., a silicon nitride layer, a titanium nitride layer, a copper layer, or a tungsten layer deposited or grown on silicon). In some embodiments, the wafer is patterned, such as including copper, titanium, or aluminum patterned on the silicon oxide surface of a silicon wafer. In some embodiments, the semiconductor wafer is a silicon wafer. In some embodiments, the semiconductor wafer is a germanium wafer. In some embodiments, the sample is a single crystal, such as a single crystal grown by the Czerklaussky process. In some embodiments, the wafer is a crystalline silicon wafer, and in other embodiments, the wafer is a crystalline germanium wafer.

[0037] In some embodiments, more than one sample 101 is used. For example, one to 100 samples 101 may be used (e.g., 1 to 10 or 1 to 3 samples). In some embodiments, samples 101 with different thicknesses / basic weights are used. In some embodiments, samples 101 have different compositions and different profiles. In some embodiments, samples 101 have the same composition and the same profile but different thicknesses / basic weights. The thickness of the sample can be measured by any suitable profilometer, or profile information can be provided by the manufacturer. The basic weight can be determined by measuring the area of ​​the sample presented to radiation 116 (e.g., the top portion of the sample typically facing source 102) and weighing the sample (e.g., using an analytical balance).

[0038] As described above, in some embodiments, the method includes providing a first indication 302 if the value corresponding to sample 101 is consistent with the known profile and uniform composition of sample 101. The first indication 302 indicates that detector 108 is matched. As used herein, "matched" means that detector 108 provides the same value within the measurement limits for the same sample 101. Therefore, if sample 101 is located above the subset 204 of detectors, indication 302 implies that the calibration for detectors 108 in the subset 204 is matched, thus implying that these detectors provide the same value within the expected error range. This does not imply that the calibration curves are identical (although this is possible), as each detector 108 will typically have a unique calibration curve due to its unique response. A second indication 304 may be provided if the value corresponding to sample 101 is inconsistent with the known profile and uniform composition of sample 101. In the case where sample 101 obscures detector subset 204 as shown in Figure 2A, the second indication 304 means that at least one detector 108 in detector subset 204 is mismatched. This could be due to a calibration mismatch in detector subset 204.

[0039] Figure 2B is a flowchart illustrating the steps illustrated in Figure 2A. In step 252, sample 101 is positioned between radiation source 102 and detector subset 204. In step 254, a sample signal is generated. In step 256, values ​​of a calibration curve based on detector 108 in detector subset 204 are determined. That is, in step 256, these signals are processed by inputting signals such as radiative absorbance values ​​generated in step 254 into a calibration curve established for detector 108. In some embodiments, steps 252, 254, and 256 are repeated for one or more additional samples as indicated in step 258. In step 260, the values ​​are evaluated to determine whether they are consistent with the known profile and homogeneous composition of sample 101, and a first indication 302 is provided in step 262. In some embodiments, a second indication 304 is provided if these values ​​are inconsistent with the known profile and homogeneous composition of sample 101. In some embodiments, a first index 302 is provided if these values ​​are consistent within the measurement error. In some embodiments, a first indication 302 is provided if these values ​​are consistent with a selected accuracy. In some embodiments, a second index 304 is provided if these values ​​are inconsistent within the measurement error. In some embodiments, a second indication 304 is provided if these values ​​are inconsistent with a selected accuracy. In some embodiments, the calibration of the detector subset 204 is adjusted in step 266. In some embodiments, as indicated in step 268, the sample 101 is moved such that it is placed at one or more additional locations between the source 102 and the detector subset 204, and steps 252, 254, and 256 are repeated.

[0040] One or more steps shown in Figure 2B may not be performed in the order shown. For example, providing more than one sample 101, as indicated by 258, may be performed at any point. For example, if the value determined at step 260 is consistent with the profile / composition of sample 101, a second sample may be used for verification after step 260 and before the first indication 302 is provided in step 262. Alternatively, if the value determined at step 260 is inconsistent with the profile / composition of sample 101, a second sample 101 may be used for verification before the second indication 304 is provided in step 264 and to provide additional data for adjusting the calibration in step 266. In some embodiments, moving sample 101, as indicated by 268, may be performed before step 256 or after steps 260, 264, or 266.

[0041] Figure 3 illustrates instructions 302 and 304 according to some embodiments. Sample 101 is irradiated with radiation 116, which then reaches a subset of detectors 204. For simplicity, radiation 116 is shown as a parallel beam projected perpendicularly onto detector 108; however, other arrangements are possible, such as the fan-shaped beam discussed earlier, in which radiation 116 will not be parallel and will be projected onto detector 108 at various angles. When creating calibration for each detector in detector 108, the specific orientation of radiation 116 relative to detector 108 is taken into account.

[0042] Detectors 108a to 108j generate signals, which are processed by inputting these signals into a calibration curve for each of the detectors 108a to 108j to provide values ​​such as thickness. The thickness is mapped to each of the detectors 108a to 108j and can be compared to a desired thickness. In the figures, this is illustrated by a first index 302 plot and a second index 304 plot, where each of these plots represents a possible result. These plots show the desired thicknesses of detectors 108, named a to j, matched to the thickness profile of sample 101, via line 306. “x” markers indicate the individual values ​​obtained from each of the detectors 108a to 108j. In the case of the first index 302, all x markers match the expected values ​​of line 306 within the measurement error or the desired and selected accuracy. In the case of the second index 304, the x markers for detectors 108b and 108g do not approach the desired thickness. The second indicator 304 is only correctly triggered if the distance of detectors 108b and 108g from the marker of line 306 is within the measurement error or the required accuracy. Indicators 302 and 304 are determined by an algorithm executed by computing device 700, and although they can be plotted by computing device 700, this is not mandatory. Indicators 302 and 304 can be one or more values ​​stored in and used by computing device 700. For example, the second indicator may include or point to data indicating which detectors 108a through 108j did not provide the expected value. In some embodiments, the indicator provides a measure of how closely the value, such as that represented by the x-mark, matches the expected value represented by line 306. For example, the indicator may be a percentage of match or a statistical value of match, such as a p-value.

[0043] It should be noted that the determination of the first index 302 or the second index 304 is a function of the amount of time the sample 101 is irradiated. Increasing the amount of irradiation time increases the accuracy of the measurement and allows for the detection of smaller deviations from line 306. The distance or spacing between the detectors 108 also affects accuracy, wherein deviations in the thickness of the sample 101 in the first direction 110 can be resolved to a greater extent when the detectors 108 are close together. Theoretically, any accuracy can be achieved within the resolution limit of the X-ray wavelength if the irradiation time is long enough, the distance between the detectors 108 in the detector array 106 is small enough, and the sample 101 can withstand radiation 116 without disintegration during the measurement.

[0044] In some embodiments, no first indication is provided, or a second indication is provided, indicating that at least one of the detectors 108 is mismatched and may be uncalibrated. In this case, the uncalibrated detector 108 can be adjusted such that inputting the sample signal into the adjusted calibration provides a value corresponding to the known profile and uniform composition of the sample 101. It should be noted that after initial calibration, the detector may be uncalibrated due to physical defects caused by use or aging (such as degradation or contamination on the detector), or the detector may have been unintentionally moved or positioned out of alignment.

[0045] In some embodiments, detector 108 is calibrated using calibration standards with known thickness / basic weight. A polynomial fit between the known thickness or basic weight and the X-ray transmittance through the standard can be generated for each detector 108. In some embodiments, if detector 108 is mismatched, one or more calibrations of each uncalibrated detector 108 are adjusted by applying corrections to the polynomial fit calibration curve. In some embodiments, calibration is adjusted by offset (zero-order adjustment). In some embodiments, calibration is adjusted by linear correction (first-order adjustment). In some embodiments, calibration is adjusted by second-, third-, or fourth-order adjustments. Correction can be performed using known algebraic methods.

[0046] In the embodiment providing the first indication 302, a prompt may be triggered or created to indicate that the detector subset 204 is in calibration and functioning properly. For example, the prompt may signal to the operator which detector subset 204 has been measured with sample 101 and that these detectors are all matched. If a stripe is detected, this indicates to the operator that the stripe is not caused by the detector subset 204.

[0047] As previously described, in some embodiments, sample 101 is placed in two or more locations by translating it in a first direction. The translation can be continuous or incremental. For incremental translation, the x-ray source 102 can continuously irradiate sample 101, and after each step, sample 101 stops, and sample signals from detector subset 204 can be collected for a specified time (e.g., 1 microsecond to 10 seconds) before the next step of movement. Alternatively, a shield for the x-ray source can be closed during sample 101 movement and opened when sample 101 is in a position that shields detector subset 204. For continuous translation, slower movement or faster scanning speeds provide more accurate data.

[0048] Translation of sample 101 in the first direction 110 allows the sample 101 to scan a detector array 106 whose width in the first direction 110 is greater than the width of sample 101 in the same direction. If sample 101 is made wider in the first direction 110, scanning all detectors in detector 108 of detector array 106 requires less translation. A sample 101 with the same width as detector array 106 does not require translation to determine whether the detector array is in calibration. However, providing a large sample 101 with controlled and known profiles and uniform composition is challenging. For example, semiconductor wafers are highly uniform in both thickness and composition, and conventionally produced current semiconductor wafers are at most 300 mm in diameter. Therefore, theoretically, current semiconductor wafer products could be used to simultaneously scan a detector array 106 that is at most about 300 mm wide.

[0049] In addition to the aforementioned challenges of finding a suitable large sample, translating sample 101 offers other benefits. For example, if sample 101 is translated, the mismatched detectors 108 in detector array 106 can be easily distinguished from the actual features on sample 101. This is illustrated in Figures 4A through 4D, which show, on the left side of the page, radiation beam 116 incident on sample 101 and on detectors 108a through 108j in detector subset 204. On the right side of the page, the corresponding processed signals are shown as thickness values ​​plotted relative to detectors 108a through 108j. The expected thickness is indicated by line 306, and the determined values ​​are indicated by x-markers.

[0050] In Figures 4A and 4B, sample 101 includes a defect or feature 402. Defect 402 is illustrated as a raised area or contaminant or particle, but it can also include other defects, such as grooves or portions of sample 101 with different compositions. In Figure 4A, defect 402 is shown / detected as a higher-than-expected thickness value corresponding to detector 108d. In Figure 4B, sample 101 is translated approximately three detectors in a first direction 110. Defect 402 is shown / detected as a higher-than-expected thickness value corresponding to detector 108g, which is three detectors away from detector 108d. If the steps used are small, such as on the order of the detector 108 spacing, each detector 108 will show defect 402 “moving” along with sample 101, as indicated by the higher-than-expected thickness value reading. Therefore, this behavior suggests a defect or feature of sample 101, rather than a mismatched detector 108. It should be understood that defect 402 may produce values ​​that are higher or lower than expected. Furthermore, defect 402 may mask more than one detector, causing an increase or decrease in values ​​for adjacent detectors rather than just one detector.

[0051] In Figures 4C and 4D, sample 101 has no detectable defects or features. In Figure 4C, sample 101 obscures detectors 108a to 108e, and the thickness profile of line 306 should be given. However, the thickness measurement associated with detector 108d is lower than expected. In Figure D, the sample has been translated in the first direction 110 to obscure detectors 108c to 108h. The thickness measurement associated with detector 108d is still lower than expected. This is a strong indication that detector 108d is mismatched with the remaining detectors in the subset of detectors 108 of detector 204, as the lower-than-expected value does not move with sample 101. It should be understood that thickness measurements associated with mismatched detectors 108 may cause increases or decreases in detected values, and more than one adjacent or non-adjacent detector 108 may be mismatched with the remaining detectors in the subset of detectors 204.

[0052] Therefore, in some embodiments, the sample 101 is moved in the first direction 110, and if the movement of the marker x is proportionate to the movement of the sample 101, feature 402 can be identified as a sample feature. Otherwise, marker x that does not conform to the expected profile and uniformity of the sample 101 can be attributed to a mismatched detector 108.

[0053] In some embodiments, the method includes a step for identifying stripes. For example, a web measurement process can be used to identify such stripes, which are then confirmed as a feature of the web or a mismatch in detector 108. Therefore, the method includes translating an object such as a web 104 or article 105 (Figures 1A and 1B) over a detector array 106 oriented in a first direction 110 (Figures 1A and 1B) in a second direction 112. While the object is translated in the second direction 112, an object signal is generated by irradiating the object with radiation 116 from a radiation source 102 and detecting the radiation transmitted through the object and reaching the detector array 106. The object signal is input into a calibration curve for each detector in the detectors 108 to determine a value corresponding to the object. A topographic map or thermal map of the object can then be created using values ​​that can correspond to thickness or basic weight; for example, stripes are identified in the topographic map. Stripes are associated with one or more detectors 108 in the detector array 106 that show peaks or valleys in the object signal compared to adjacent detectors.

[0054] Figure 5 is a flowchart illustrating the steps for detecting possible stripes in a sample according to some embodiments. In step 502, the object is translated in a second direction. In step 504, an object signal is generated. In step 506, a value corresponding to the object is determined. In step 508, a topography map or thermal image is generated. In step 510, possible stripes are identified.

[0055] Figure 6 shows a topographical view of wafer 602, which is the object scanned as described with reference to Figure 5. As indicated, two stripes 604 are found. After the stripes 604 are found, the detector array 106 can be measured with sample 101 to determine whether the stripes 604 are a genuine feature of wafer 602 or an artifact of a mismatched detector 108 in detector array 106.

[0056] The object can be, but is not limited to, a continuous membrane, or various objects on a conveyor belt or similar transport system, such as packages, goods, or letters. In some embodiments, the object is food or medicine. In some embodiments, the object is a mineral or other extract from a mining source. In some embodiments, the object is a living organism, such as a plant or mammal. In some embodiments, the object is a vehicle, such as a car, train, or truck. In some embodiments, the object is the cathode or anode of a lithium-ion battery, or a precursor thereof. In some embodiments, the object is the separator of a lithium-ion battery.

[0057] Figure 7 is a block diagram of a computing device 700 capable of performing some or all of the method steps described herein. In some embodiments, the method is implemented using a single computing device 700 or through multiple computing devices 700. Furthermore, as discussed below, the computing device 700 (or multiple computing devices 700) implementing the method may be part of one or more of the following: a scientific instrument 810, a user local computing device 820, a service local computing device 830, or a remote computing device 840, as described below with reference to Figure 8.

[0058] The computing device 700 of Figure 7 is illustrated as having multiple components, but any one or more of these components may be omitted or repeated based on application and setup requirements. In some embodiments, some or all of the components included in the computing device 700 may be attached to one or more motherboards and enclosed in a housing (e.g., including plastic, metal, and / or other materials). In some embodiments, some of these components may be fabricated onto a single system-on-a-chip (SoC) (e.g., the SoC may include one or more processing devices 702 and one or more storage devices 704). Furthermore, in various embodiments, the computing device 700 may not include one or more of the components illustrated in Figure 7, but may include interface circuitry (not shown) for coupling to the one or more components using any suitable interface (e.g., a Universal Serial Bus (USB) interface, a High Definition Multimedia Interface (HDMI) interface, a Controller Area Network (CAN) interface, a Serial Peripheral Interface (SPI) interface, an Ethernet interface, a wireless interface, or any other suitable interface). For example, computing device 700 may not include display device 710, but may include display device interface circuitry (e.g., connectors and driver circuitry) to which display device 710 may be coupled.

[0059] Computing device 700 may include processing device 702 (e.g., one or more processing devices). As used herein, the term "processing device" may refer to any device or part of a device that processes electronic data from registers and / or memory to convert that electronic data into other electronic data that can be stored in registers and / or memory. Processing device 702 may include one or more digital signal processors (DSPs), application-specific integrated circuits (ASICs), central processing units (CPUs), graphics processing units (GPUs), cryptographic processors (dedicated processors that execute cryptographic algorithms within hardware), server processors, or any other suitable processing device.

[0060] Computing device 700 may include storage device 704 (e.g., one or more storage devices). Storage device 7004 may include one or more memory devices, such as random access memory (RAM) (e.g., static RAM (SRAM) devices, magnetic RAM (MRAM) devices, dynamic RAM (DRAM) devices, resistive RAM (RRAM) devices, or conductive bridged RAM (CBRAM) devices), hard disk drive-based memory devices, solid-state memory devices, network drives, cloud drives, or any combination of memory devices. In some embodiments, storage device 704 may include memory sharing a die with processing device 702. In such embodiments, the memory may be used as cache memory and may include, for example, embedded dynamic random access memory (eDRAM) or spin-transfer torque magnetic random access memory (STT-MRAM). In some embodiments, storage device 704 may include a non-transitory computer-readable medium having instructions thereon that, when executed by one or more processing devices (e.g., processing device 702), cause computing device 700 to perform any suitable method or portion thereof of the methods disclosed herein. Storage device 704 may also store calibration curves for each detector in detector 108, as well as sample and object signals generated by irradiating sample 101 or object (e.g., web 104 or article 105 in FIG. 1A) with radiation from radiation source 102 and detecting radiation transmitted through sample 101 or object and reaching the detector subset 204.

[0061] Computing device 700 may include interface device 706 (e.g., one or more interface devices 706). Interface device 706 may include one or more communication chips, connectors, and / or other hardware and software to manage communication between computing device 700 and other computing devices. For example, interface device 706 may include circuitry for managing wireless communication used to transfer data with computing device 700. The term "wireless" and its derivatives can be used to describe circuits, devices, systems, methods, techniques, communication channels, etc., that can transmit data through a non-solid medium using modulated electromagnetic radiation. This term does not imply that the associated device contains no wires, although in some embodiments it may not contain any wires. The circuitry included in interface device 706 for managing wireless communications may implement any of a number of wireless standards or protocols, including but not limited to Institute of Electrical and Electronics Engineers (IEEE) standards, including Wi-Fi (IEEE 802.11 series), IEEE 802.16 standards (e.g., IEEE 802.16-2005 amendments), Long Term Evolution (LTE) projects, and any amendments, updates, and / or revisions (e.g., Advanced LTE projects, Ultra Mobile Broadband (UMB) projects (also known as “3GPP2”), etc.). In some implementations, the circuitry included in interface device 706 for managing wireless communications may operate according to Global System for Mobile Telecommunications (GSM), General Packet Radio Service (GPRS), Universal Mobile Telecommunications System (UMTS), High Speed ​​Packet Access (HSPA), Evolved HSPA (E-HSPA), or LTE networks. In some embodiments, the circuitry included in interface device 706 for managing wireless communications may operate according to enhanced data for GSM Evolution (EDGE), GSM EDGE Radio Access Network (GERAN), Universal Terrestrial Radio Access Network (UTRAN), or Evolved UTRAN (E-UTRAN). In some embodiments, the circuitry included in interface device 4006 for managing wireless communications may operate according to Code Division Multiple Access (CDMA), Time Division Multiple Access (TDMA), Digital Enhanced Cordless Telecommunications (DECT), Evolved Data Optimization (EV-DO) and its derivatives, and any other wireless protocol designated as 3G, 4G, 5G, and higher. In some embodiments, interface device 4006 may include one or more antennas (e.g., one or more antenna arrays) for receiving and / or transmitting wireless communications.

[0062] In some embodiments, interface device 706 may include circuitry for managing wired communications such as electrical, optical, or any other suitable communication protocol. For example, interface device 706 may include circuitry supporting communications based on Ethernet technology. In some embodiments, interface device 706 may support both wireless and wired communications, and / or may support multiple wired communication protocols and / or multiple wireless communication protocols. For example, a first set of circuitry for interface device 706 may be dedicated to short-range wireless communications such as Wi-Fi or Bluetooth, while a second set of circuitry for interface device 706 may be dedicated to long-range wireless communications such as Global Positioning System (GPS), EDGE, GPRS, CDMA, WiMAX, LTE, EV-DO, etc. In some embodiments, a first set of circuitry for interface device 706 may be dedicated to wireless communications, while a second set of circuitry for interface device 706 may be dedicated to wired communications.

[0063] In some implementations, the interface device can input sample signals, such as those from circuit 205, into a calibration curve for each detector in the detector subset 204.

[0064] The computing device 700 may include a battery / power circuit 708. The battery / power circuit 708 may include one or more energy storage devices (e.g., batteries or capacitors) and / or circuitry for coupling components of the computing device 700 to a power source (e.g., AC line power) that is separate from the computing device 700.

[0065] Computing device 700 may include display device 710 (e.g., multiple display devices). Display device 710 may include any visual indicator, such as a head-up display, computer monitor, projector, touchscreen display, liquid crystal display (LCD), light-emitting diode display, or flat panel display. In some embodiments, the display device may display real-time processing information, such as the thickness or basic weight of the span 104.

[0066] The computing device 700 may include other input / output (I / O) devices 712. Other I / O devices 712 may include, for example, one or more audio output devices (e.g., speakers, headphones, earphones, alarm clocks, etc.), one or more audio input devices (e.g., microphones or microphone arrays), positioning devices (e.g., GPS devices that communicate with satellite-based systems to receive the location of the computing device 700, as known in the art), audio codecs, video codecs, printers, sensors (e.g., thermocouples or other temperature sensors, humidity sensors, pressure sensors, vibration sensors, accelerometers, gyroscopes, etc.), image capture devices (such as cameras), keyboards, cursor control devices (such as mice, styluses, trackballs, or touchpads), barcode readers, quick-response (QR) code readers, or radio frequency identification (RFID) readers.

[0067] The computing device 700 can have any form factor suitable for its application and scenario, such as handheld or mobile computing devices (e.g., mobile phones, smartphones, mobile internet devices, tablets, laptops, netbooks, ultrabooks, personal digital assistants (PDAs), ultra-mobile personal computers, etc.), desktop computing devices, server computing devices, or other networked computing components.

[0068] One or more computing devices 700 implementing any of the methods disclosed herein may be part of a scientific instrument support system. Figure 8 is a block diagram of an exemplary scientific instrument support system 800 according to various embodiments in which some or all of the methods disclosed herein may be performed. The methods disclosed herein (e.g., the methods described with reference to Figures 2A, 2B, 5, and 6) may be implemented by one or more of the scientific instruments 810 (e.g., measurement or screening instrument 100), user local computing devices 820, service local computing devices 830, or remote computing devices 840 of the scientific instrument support system 800.

[0069] Any of the scientific instrument 810, the user local computing device 820, the service local computing device 830, or the remote computing device 840 may include any of the embodiments of the computing device 700 discussed herein with reference to FIG. 7, and any of the scientific instrument 810, the user local computing device 820, the service local computing device 830, or the remote computing device 840 may take the form of any suitable embodiment of the computing device 700 discussed herein with reference to FIG. 7.

[0070] Scientific instrument 810, user local computing device 820, service local computing device 830, or remote computing device 840 may each include a processing device 802, a storage device 804, and an interface device 806. The processing device 802 may take any suitable form, including any of the processing devices 702 discussed herein with reference to FIG. 7, and the processing devices 802 included in different devices of scientific instrument 810, user local computing device 820, service local computing device 830, or remote computing device 840 may take the same or different forms. The storage device 804 may take any suitable form, including any of the storage devices 704 discussed herein with reference to FIG. 7, and the storage devices 804 included in different devices of scientific instrument 810, user local computing device 820, service local computing device 830, or remote computing device 840 may take the same or different forms. Interface device 806 may take any suitable form, including any of the interface devices 706 discussed herein with reference to FIG7, and the interface devices 806 included in different devices such as scientific instrument 810, user local computing device 820, service local computing device 830, or remote computing device 840 may take the same or different forms.

[0071] Scientific instrument 810, user local computing device 820, service local computing device 830, and remote computing device 840 can communicate with other elements of scientific instrument support system 800 via communication path 808. As shown, communication path 808 communicatively couples interface devices 806 of different elements in scientific instrument support system 800 and can be a wired or wireless communication path (e.g., any of the communication technologies discussed herein according to interface device 706 of computing device 700 with reference to FIG. 7). The particular scientific instrument support system 800 depicted in FIG. 8 includes communication paths between each pair of scientific instrument 810, user local computing device 820, service local computing device 830, and remote computing device 840; however, this “fully connected” implementation is merely illustrative, and various communication paths in communication path 808 may not exist in various implementations. For example, in some embodiments, the serving local computing device 830 may not have a direct communication path 808 between its interface device 806 and the interface device 806 of the scientific instrument 810. Instead, it may communicate with the scientific instrument 810 via a communication path 808 between the serving local computing device 830 and the user local computing device 820 and a communication path 808 between the user local computing device 820 and the scientific instrument 810.

[0072] Scientific instrument 810 may include any suitable scientific instrument, such as measuring or X-ray screening instrument 100.

[0073] User local computing device 820 may be a user-local computing device of scientific instrument 810 (e.g., any of the embodiments of computing device 700 discussed herein). In some embodiments, user local computing device 820 may also be located locally to scientific instrument 810, but this is not always the case; for example, user local computing device 820 located in a user's home or office may be remote from scientific instrument 810 but communicate with it, allowing the user to use user local computing device 820 to control and / or access data from scientific instrument 810. In some embodiments, user local computing device 820 may be a laptop computer, smartphone, or tablet device. In some embodiments, user local computing device 820 may be a portable computing device.

[0074] The servicing local computing device 830 can be a computing device local to the physical entity serving the scientific instrument 810 (e.g., any of the embodiments of the computing device 700 discussed herein). For example, the servicing local computing device 830 can be located at the location of the manufacturer of the scientific instrument 810, a local user of the scientific instrument 810, or a third-party service company. In some embodiments, the servicing local computing device 830 can communicate with the scientific instrument 810, the user's local computing device 820, and / or the remote computing device 840 (e.g., via a direct communication path 808 or via multiple "indirect" communication paths 808, as discussed above) to receive data regarding the operation of the scientific instrument 810, the user's local computing device 820, and / or the remote computing device 840 (e.g., self-test results of the scientific instrument 810, calibration coefficients used by the scientific instrument 810, measurement results from sensors (such as detectors) associated with the scientific instrument 810, etc.). In some implementations, the service local computing device 830 may communicate with scientific instrument 810, user local computing device 820, and / or remote computing device 840 (e.g., via direct communication path 808 or via multiple "indirect" communication paths 808, as discussed above) to transmit data to scientific instrument 810, user local computing device 820, and / or remote computing device 840 (e.g., to update programming instructions, such as firmware, in scientific instrument 810 to initiate the execution of test or calibration sequences in scientific instrument 810, or to update programming instructions, such as software, in user local computing device 820 or remote computing device 840). Users of scientific instrument 810 may use scientific instrument 810 or user local computing device 820 to communicate with the service local computing device 830 to report problems with scientific instrument 810 or user local computing device 820, request on-site technician assistance to improve the operation of scientific instrument 810, order consumables or replacement parts associated with scientific instrument 810, or for other purposes.

[0075] The remote computing device 840 may be a computing device located remotely from scientific instrument 810 and / or user local computing device 820 (e.g., any of the embodiments of computing device 700 discussed herein). In some embodiments, the remote computing device 840 may be included in a data center or other large server environment. In some embodiments, the remote computing device 840 may include network-attached storage (e.g., as part of storage device 804). The remote computing device 840 may store data generated by scientific instrument 810, perform analysis on data generated by scientific instrument 810 (e.g., according to programming instructions), facilitate communication between user local computing device 820 and scientific instrument 810, and / or facilitate communication between service local computing device 830 and scientific instrument 810.

[0076] In some embodiments, one or more of the elements of the scientific instrument support system 800 illustrated in FIG8 may be absent. Furthermore, in some embodiments, multiple elements of the various elements of the scientific instrument support system 800 of FIG8 may be present. For example, the scientific instrument support system 800 may include multiple user local computing devices 820 (e.g., different user local computing devices 820 associated with different users or located in different locations). In another example, the scientific instrument support system 800 may include multiple scientific instruments 810, all of which communicate with a serving local computing device 830 and / or a remote computing device 840; in such embodiments, the serving local computing device 830 may monitor the multiple scientific instruments 810, and the serving local computing device 830 may cause updates, or other information may be simultaneously “broadcast” to the multiple scientific instruments 810. Different scientific instruments among the scientific instruments 810 in the scientific instrument support system 800 may be positioned close to each other (e.g., in the same room) or far from each other (e.g., on different floors of a building, in different buildings, in different cities, etc.). In some implementations, scientific instrument 810 may be connected to an Internet of Things (IoT) stack that allows command and control of scientific instrument 810 via web-based applications, virtual or augmented reality applications, mobile applications, and / or desktop applications. Any of these applications may be accessible to a user operating a user-local computing device 820 that communicates with scientific instrument 810 via an intermediate remote computing device 840. In some implementations, the manufacturer may sell scientific instrument 810, along with one or more associated user-local computing devices 820, as part of a local scientific instrument computing unit 812.

[0077] Figure 9 is a block diagram of a system 900 for checking the response of an instrument according to some embodiments. The system includes previously described elements: a radiation source 102, a detector array 106 linearly arranged or oriented in a first direction 110, a sample holder 109, a computing device 700, and a space 107 between the source 102 and the detector array 106. The system also includes a power supply 902, such as a mains power supply or a battery. The power supply 902 may be the same as the battery / power supply 708 that powers the computing device 700, or the power supply 902 may be a different power source. In some embodiments, the system 900 also includes a translation element 114, such as a roller, to translate the web 104 through the space 107.

[0078] In some embodiments, the system also includes one or more housings and supports 904. One or more supports hold or support the various components, enabling them to function. For example, a support frame can be properly oriented to hold the source 102 above the detector array 106. Supports can also hold mechanical components, such as motors connected to the sample holder 109 or translation element 114. Housings may be implemented for safety reasons. For example, radiation shielding may be included as part of the housing. Housings may also be used to separate various components of the system, such as the measuring instrument 100 and the computing device 700.

[0079] Paragraphs 1-15 below provide various examples of the embodiments disclosed herein.

[0080] Paragraph 1. A method for checking the response of an instrument, the method comprising: positioning one or more samples having a known profile and uniform composition, one at a time, at one or more locations between a radiation source and a subset of detectors in an array of detectors linearly arranged in a first direction; generating a sample signal by irradiating the sample with radiation from the radiation source and detecting radiation transmitted through the sample and reaching the subset of detectors; inputting the sample signal into a calibration curve for each detector in the subset of detectors and for each of the one or more samples, thereby determining a value corresponding to each of the one or more samples and each detector in the subset of detectors; and providing a first indication if the value corresponding to the one or more samples is consistent with the known profile and uniform composition of the sample.

[0081] Paragraph 2. According to the method described in Paragraph 1, each of one or more samples has a flat and uniform profile.

[0082] Paragraph 3. According to the method described in Paragraph 2, each of one or more samples has a total thickness variation (TTV) of less than 10 micrometers.

[0083] Paragraph 4. The method described in any of paragraphs 1 through 3, wherein more than one sample is used, and each sample has a different thickness or basic weight.

[0084] Paragraph 5. The method described in any one of paragraphs 1 through 4, wherein the sample has impurities of less than 100 ppm.

[0085] Paragraph 6. The method described in any of paragraphs 1 through 5, wherein the sample is a semiconductor wafer or a portion thereof.

[0086] Paragraph 7. The method described in any of paragraphs 1 through 6, wherein the sample is a single crystal.

[0087] Paragraph 8. The method described in any of paragraphs 1 through 7, wherein the sample is a silicon wafer.

[0088] Paragraph 9. The method according to any one of paragraphs 1 through 8 further includes providing a second indication if the value corresponding to the sample is inconsistent with the known profile and uniform composition of the sample.

[0089] Paragraph 10. The method described in any of paragraphs 1 through 9, wherein a first indication is provided, and a prompt indicating that the detector array is correctly calibrated is provided.

[0090] Paragraph 11. The method described in any of paragraphs 1 through 9, wherein no first indication is provided, and one or more calibrations of the detectors in the detector subset are adjusted such that inputting the sample signal into the adjusted calibration provides a value corresponding to the known profile and uniform composition of the sample.

[0091] Paragraph 12. According to the method described in Paragraph 11, one or more calibrations for each detector are adjusted by applying corrections to a polynomial-fit calibration curve.

[0092] Paragraph 13. The method described in any of paragraphs 1 through 12, wherein the sample is placed in two or more locations by translating the sample in a first direction.

[0093] Paragraph 14. The method described in any of paragraphs 1 through 13, wherein radiation forms a fan-shaped beam emitted from the source and extending toward the detector array.

[0094] Paragraph 15. The method according to any one of paragraphs 1 through 14 further includes: translating an object in a second direction above an array of linear detectors oriented in a first direction; generating an object signal by irradiating the object with radiation from a radiation source and detecting radiation transmitted through the object and reaching the detectors while the object is translated in the second direction; inputting the object signal into a calibration curve for each detector in the detector array to determine a value corresponding to the object; generating a topographic map of the object; and identifying stripes in the topographic map, the stripes being associated with one or more detectors in the detector array that exhibit peak or trough values ​​in the object signal relative to adjacent detectors.

[0095] Paragraph 16. According to the method described in paragraph 15, the object is a continuous web.

[0096] Paragraph 17. According to the method described in paragraph 15 or 16, the object includes a cathode or anode of a lithium-ion battery, or a precursor thereof.

[0097] Paragraph 18. The method described in any one of paragraphs 15 through 17, wherein the first direction is not parallel to the second direction.

[0098] Paragraph 19. The method described in any of paragraphs 1 through 14, wherein the radiation source is an X-ray source and the radiation is X-rays.

[0099] Paragraph 20. A system for checking the response of an instrument, the system comprising: a radiation source; an array of detectors linearly arranged in a first direction; a sample holder; a space between the source and the detector array; and a computing device having executable code stored thereon, wherein the executable code is configured to send instructions for one or more of the following: positioning one or more samples having a known profile and uniform composition in the sample holder one at a time at one or more locations between the radiation source and a subset of detectors in the detector array; generating a sample signal by irradiating the sample with radiation from the radiation source and detecting radiation transmitted through the sample and reaching the subset of detectors; inputting the sample signal to a calibration curve for each detector in the subset of detectors and for each of the one or more samples, thereby determining a value corresponding to each of the one or more samples and each detector in the subset of detectors; and providing a first indication if the value corresponding to the one or more samples is consistent with the known profile and uniform composition of the sample.

[0100] Paragraph 21. The system according to paragraph 20 further includes: a translation element configured to translate an object through space in a second direction other than the first direction.

[0101] Paragraph 22. According to the system described in paragraph 21, the translation element is one or more rollers configured to translate the web through space.

[0102] Paragraph 23. The system according to any one of paragraphs 20 through 22, wherein the holder is capable of accommodating more than one sample at the same time.

[0103] Paragraph 24. The system according to any one of paragraphs 20 through 23, wherein the sample holder includes an xy stage movable in a first direction.

[0104] Paragraph 25. One or more non-transitory computer-readable media having instructions thereon, which, when executed by one or more processing devices of a measuring instrument, cause the measuring instrument to perform the method according to any one of claims 1 to 19.

[0105] Using the knowledge gained from this disclosure, those skilled in the art will recognize that various changes can be made to the disclosed apparatus and methods in order to obtain these and other advantages without departing from the scope of this disclosure. Therefore, it should be understood that the features described herein are readily modified, altered, changed, or substituted. For example, all combinations of those elements and / or steps that are expressly contemplated to perform substantially the same function in substantially the same manner to achieve the same result are within the scope of the embodiments described herein. Substitution of elements from one described embodiment to another is also fully contemplated and envisioned. The specific embodiments illustrated and described herein are for illustrative purposes only and are not intended to limit the embodiments set forth in the appended claims. Other embodiments will be apparent to those skilled in the art. It should be understood that the foregoing description is provided for clarity only and is merely exemplary. The spirit and scope of this disclosure are not limited to the foregoing embodiments and descriptions, but are covered by the following claims. All publications and patent applications referenced herein are incorporated by reference in their entirety to the same extent for all purposes, as if each individual publication or patent application were specifically and individually designated to be incorporated by such reference.

Claims

1. A method for checking the response of a measuring instrument, the method comprising: One or more samples with known profiles and uniform composition are positioned one at a time at one location between a radiation source and a subset of detectors in a detector array linearly arranged in a first direction; a sample signal is generated by irradiating the sample with radiation from the radiation source and detecting the radiation transmitted through the sample and reaching the subset of detectors. The sample signal is input into a calibration curve for each detector in the subset of detectors and for each of the one or more samples, thereby determining a value corresponding to each of the one or more samples and for each detector in the subset of detectors; And if the value corresponding to the one or more samples is consistent with the known profile and uniform composition of the sample, a first indication is provided.

2. The method of claim 1, wherein each of the one or more samples has a flat and uniform profile.

3. The method of claim 2, wherein each of the one or more samples has a total thickness variation (TTV) of less than 10 micrometers.

4. The method of claim 1, wherein more than one sample is used, and each sample has a different thickness or basic weight.

5. The method according to claim 1, wherein the sample has less than 100 ppm of impurities.

6. The method of claim 1, wherein the sample is a semiconductor wafer or a portion thereof.

7. The method according to claim 1, wherein the sample is a single crystal.

8. The method according to claim 1, wherein the sample is a silicon wafer.

9. The method of claim 1, further comprising providing a second indication if the value corresponding to the sample is inconsistent with the known profile and the uniform composition of the sample.

10. The method of claim 1, wherein the first indication is provided, and a prompt indicating that the detector array is correctly calibrated is provided.

11. The method of claim 1, wherein the first indication is not provided, and one or more calibrations of the detectors in the subset of detectors are adjusted such that inputting the sample signal into the adjusted calibration provides the value corresponding to the known profile and the uniform composition of the sample.

12. The method of claim 11, wherein the calibration of each detector is adjusted by applying correction to a polynomial fitting calibration curve.

13. The method of claim 1, wherein the sample is placed in two or more locations by translating the sample in the first direction.

14. The method of claim 1, wherein the radiation forms a fan-shaped beam emanating from the source and extending toward the detector array.

15. The method of claim 1, further comprising: The object is translated in a second direction above the detector array oriented in the first direction; While the object is translating in the second direction, an object signal is generated by irradiating the object with radiation from the radiation source and detecting the radiation that passes through the object and reaches the detector. The object signal is input into the calibration curve for each of the detectors to determine the value corresponding to the object; Generate a topographic image of the object; And to identify stripes in the topography image, the stripes being associated with one or more detectors in the detector array that exhibit peak or valley values ​​in the object signal relative to adjacent detectors.

16. The method of claim 15, wherein the object is a continuous web.

17. The method of claim 15, wherein the object comprises a cathode or anode of a lithium-ion battery, or a precursor thereof.

18. The method of claim 15, wherein the first direction is not parallel to the second direction.

19. The method of claim 1, wherein the radiation source is an X-ray source and the radiation is X-rays.

20. A system for checking the response of a measuring instrument, the system comprising: Radiation source; A detector array linearly arranged in the first direction; Sample holder; The space between the source and the detector array; And a computing device having executable code stored thereon, wherein the executable code is configured to send instructions for one or more of the following: positioning one or more samples having a known profile and uniform composition one at a time at one location between the radiation source and a subset of detectors in the detector array; generating a sample signal by irradiating the sample with radiation from the radiation source and detecting radiation transmitted through the sample and reaching the subset of detectors. The sample signal is input into a calibration curve for each detector in the subset of detectors and for each of the one or more samples, thereby determining a value corresponding to each of the one or more samples and for each detector in the subset of detectors; And if the value corresponding to the one or more samples is consistent with the known profile and uniform composition of the sample, a first indication is provided.

21. The system of claim 20, further comprising: A translation element configured to translate an object through the space in a second direction different from the first direction.

22. The system of claim 21, wherein the translation element is one or more rollers configured to translate the web through the space.

23. The system of claim 20, wherein the holder is capable of accommodating more than one sample at a time.

24. The system of claim 20, wherein the sample holder includes an xy stage movable in the first direction.

25. One or more non-transitory computer-readable media having instructions thereon, which, when executed by one or more processing devices of a measuring instrument, cause the measuring instrument to perform the method according to claim 1.

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