Method and system for controlling closed alternating pressure polishing of microstructured parts

Abstract

This invention discloses a closed-loop alternating pressure polishing control method and system for microstructured parts, comprising: placing the part to be processed in a processing chamber to construct a closed loop, and filling it with polishing slurry to form a constant-volume, pressure-maintaining processing environment; driving the polishing slurry to circulate in the closed loop and applying alternating pressure; during the high-pressure phase of the alternating pressure, the polishing slurry is stiffened to selectively remove microscopic peaks; during the low-pressure phase or when flowing through microscopic valleys, the polishing slurry is kept in a flexible fluid state to achieve chip removal; real-time acquisition of the current temperature data of the polishing slurry and the current output resistance torque data of the power source driving the polishing slurry circulation; if the decline slope of the current output resistance torque data reaches a preset threshold, a compensation command is generated to increase the switching frequency of the alternating pressure or increase the amplitude of the alternating pressure. This invention achieves precise targeted polishing and maintains the consistency of the removal rate during long-cycle processing.

Description

Technical Field

[0001] This invention relates to the field of ultra-precision machining technology, and more specifically, to a closed-loop alternating pressure polishing control method and system for microstructured parts. Background Technology

[0002] With the development of precision manufacturing technology, microstructured parts are increasingly widely used in aerospace, medical devices, and precision optics. These parts typically have complex microscopic peaks and valleys on their surfaces, placing extremely high demands on surface quality and morphological accuracy. Currently, fluid polishing technology is frequently used to process complex micro-surfaces, with the utilization of the non-Newtonian fluid properties of shear-thickened polishing fluids being a research hotspot in this field.

[0003] However, existing fluid polishing methods still have many limitations in practical applications. On the one hand, traditional fluid polishing typically uses constant pressure to drive the polishing fluid flow. This processing method cannot fully utilize the physical differences in the surface morphology of micro-parts, resulting in the polishing fluid maintaining a high shear state in the processing area. This not only easily causes unintended over-cutting damage to the micro-valves that need protection, making it difficult to achieve truly selective targeted polishing, but also the continuous rigidity makes it difficult for the removed material debris to be effectively discharged with the fluid, easily causing blockage of the microstructure. On the other hand, the rheological effect of shear-thickening fluids is significantly affected by temperature. Under continuous mechanical friction and fluid shearing, the temperature of the processing environment will inevitably rise, causing a physical decay in the base viscosity and shear-thickening properties of the polishing fluid. Existing polishing systems often lack a deep adaptive compensation mechanism for this thermal decay phenomenon. As the processing time increases, the material removal rate will decrease significantly and fluctuate, severely restricting the consistency of the polishing process for micro-structured parts and the stability of mass production. Summary of the Invention

[0004] This invention provides a closed-loop alternating pressure polishing control method and system for microstructured parts, aiming to solve the technical problems of existing fluid polishing technology, which easily causes over-cutting damage to micro-valves when processing microstructures, and cannot effectively overcome the attenuation of the shear thickening effect caused by the temperature rise of the polishing fluid, thus leading to inconsistent removal rates of micro-peaks.

[0005] The closed-loop alternating pressure polishing control method for microstructured parts provided by this invention includes the following steps:

[0006] S1. Place the part to be processed in the processing chamber, control the processing chamber to be connected with the polishing fluid circulation unit to form a closed loop, and fill the closed loop with polishing fluid with shear thickening properties so that the closed loop forms a constant volume and pressure processing environment.

[0007] S2. The polishing slurry is driven to circulate in the closed loop and continuously flow over the microscopic peaks and valleys on the surface of the workpiece, while a periodically varying alternating pressure is applied to the polishing slurry. Based on the spatial throttling difference between the microscopic peaks and valleys on the polishing slurry, the control parameters of the alternating pressure are configured as follows: In the high-pressure phase of the alternating pressure, when the polishing slurry flows over the microscopic peaks, its local instantaneous shear rate reaches the critical shear rate to trigger a shear thickening effect, thereby stiffening the local polishing slurry and selectively removing material from the microscopic peaks; while in the low-pressure phase of the alternating pressure, or when the polishing slurry flows over the microscopic valleys, because its local instantaneous shear rate is lower than the critical shear rate, the polishing slurry maintains a flexible fluid state to achieve chip removal and avoid morphological damage to the microscopic valleys.

[0008] S3. Real-time acquisition of the current temperature data of the polishing fluid in the closed loop, and the current output resistance torque data of the power source driving the circulation of the polishing fluid;

[0009] S4. Determine whether the downward slope of the current output resistance torque data reaches a preset threshold; if it does, generate a compensation command based on the viscosity compensation relationship corresponding to the current temperature data to automatically increase the switching frequency of the alternating pressure or increase the amplitude of the alternating pressure, so as to compensate in real time for the attenuation of the shear thickening effect caused by the increase in the temperature of the polishing fluid, thereby maintaining the consistency of the polishing fluid in the removal rate of the microscopic peaks.

[0010] Preferably, in step S2, the instantaneous pressure value P(t) of the alternating pressure satisfies the following formula: ;

[0011] in, The basic static pressure is used to create the processing environment. The amplitude of the alternating pressure. The switching frequency of the alternating pressure is denoted as .

[0012] Preferably, in step S4, the compensation instruction follows the following priority strategy:

[0013] Prioritize increasing the switching frequency of the alternating pressure to enhance the local instantaneous shear rate of the polishing fluid as it flows through the microscopic peaks;

[0014] If the switching frequency reaches the system execution limit and the current output resistance torque data has not yet recovered to the target value, the amplitude of the alternating pressure is further increased to compensate for the removal rate by increasing the normal impact kinetic energy of the polishing fluid on the micro-peaks.

[0015] Preferably, in step S1, the value of the base static pressure is configured such that the bulk elastic modulus of the polishing fluid in the closed loop is maintained within a preset stable range, so as to eliminate the attenuation effect of trace residual bubbles in the polishing fluid on the alternating pressure transmission process.

[0016] Preferably, the polishing control method further includes:

[0017] The concentration of chips and impurities in the polishing fluid is monitored in real time, and the circulation rate of the polishing fluid is dynamically adjusted according to the concentration of chips and impurities to maintain the stability of the flow field distribution in the processing cavity.

[0018] The present invention also provides a closed alternating pressure polishing system for microstructured parts, used to perform the polishing control method described in any of the above claims, comprising:

[0019] The processing cavity is configured to accommodate the part to be processed.

[0020] A polishing slurry circulation unit is connected to the processing chamber to form the closed loop and is configured to drive the polishing slurry to circulate.

[0021] A pressure regulating module, connected to the closed loop, is configured to apply the alternating pressure to the polishing fluid;

[0022] The sensing module is configured to collect the current temperature data and the current output drag torque data; and

[0023] The controller is communicatively connected to the polishing fluid circulation unit, the pressure regulation module, and the sensing module, and is configured to generate the compensation command based on the current temperature data and the current output resistance torque data.

[0024] Preferably, the pressure regulating module includes:

[0025] A servo proportional relief valve is used to receive a high-frequency pulse width modulation signal from the controller to perform pressure regulation on the polishing fluid; and

[0026] An accumulator is used to absorb pressure pulsations generated by the polishing fluid circulation unit in order to maintain the processing environment.

[0027] Preferably, the sensing module includes:

[0028] A temperature sensor is located at the return port of the processing chamber; and

[0029] A dynamic torque sensor, integrated on the output shaft of the drive motor of the polishing fluid circulation unit, is used to acquire the current output resistance torque data in real time.

[0030] One or more technical solutions provided in this invention have at least the following technical effects or advantages:

[0031] This invention establishes a constant-volume, pressure-maintaining processing environment by constructing a closed loop isolated from the external atmosphere and filling it with polishing fluid. This design physically empties the air from the system, eliminates the buffering interference of compressible gas on pressure transmission, and provides a solid physical basis for the lossless transmission of high-frequency dynamic pressure fields in the fluid.

[0032] Furthermore, this invention creatively couples the global alternating pressure of the polishing slurry with the spatial throttling differences in the surface microstructure of the workpiece. During the application of periodic alternating pressure to the polishing slurry, the system utilizes the geometric differences in the flow cross-sections of the microscopic peaks and valleys of the workpiece to induce a spatially differentiated rheological response in the polishing slurry. During the high-pressure phase of the alternating pressure, the polishing slurry flowing through the microscopic peaks experiences a sudden increase in local shear rate due to throttling and water-blocking effects, triggering stiffening and thus achieving precise cutting of the microscopic peaks. Conversely, during the low-pressure phase or when the fluid flows through the microscopic valleys, the local shear rate decreases and the fluid returns to a flexible state. This dynamic synergy between high and low-pressure phases not only effectively avoids morphological damage to the microscopic valleys of the workpiece but also utilizes the interval during which the fluid regains its flexibility to achieve efficient chip removal, perfectly achieving adaptive precision polishing that preserves concavity while removing convexity.

[0033] This invention also introduces an adaptive closed-loop compensation mechanism based on physical characteristic attenuation. By acquiring the slope of the decrease in the output resistance torque data of the power source in real time, the system can proactively and accurately identify the attenuation trend of the polishing fluid's shear performance. When the attenuation threshold is reached, the system automatically increases the switching frequency or amplitude of the alternating pressure based on the current temperature data. This mechanism effectively and precisely offsets the decrease in fluid phase change capability caused by temperature rise, thereby maintaining an extremely stable microscopic peak removal rate throughout the entire processing cycle, greatly improving the consistency and yield of ultra-precision machining. Attached Figure Description

[0034] Figure 1 A schematic diagram of the mechanical and fluid circuit of a closed alternating pressure polishing system for microstructured parts provided in an embodiment of the present invention;

[0035] Figure 2 This is a block diagram illustrating the control principle of a closed alternating pressure polishing system for microstructured parts provided in an embodiment of the present invention.

[0036] Figure 3 This is a microscopic partial cross-sectional view showing the spatial throttling difference of the polishing fluid on the surface of the workpiece in an embodiment of the present invention.

[0037] Explanation of reference numerals in the attached drawings: 10, machining chamber; 11, inner wall of the flow guide; 20, polishing fluid circulation unit; 21, motor; 22, pump body; 30, pressure regulation module; 31, servo proportional overflow valve; 32, accumulator; 40, sensing module; 41, temperature sensor; 42, dynamic torque sensor; 50, controller; 60, part to be processed; 61, microscopic peak; 62, microscopic valley. Detailed Implementation

[0038] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments. It should be noted that this embodiment is the best implementation method provided under the premise of ensuring a complete disclosure of the technical solution of the present invention. Its purpose is to help those skilled in the art better understand the core physical mechanism and control logic of the present invention, rather than to limit the scope of protection of the present invention.

[0039] like Figure 1 and Figure 2 As shown, this embodiment provides a closed-loop alternating pressure polishing system for microstructured parts. This system is primarily used to execute the closed-loop alternating pressure polishing control method described in this invention. The main structure of the system includes a processing chamber 10, a polishing fluid circulation unit 20, a pressure regulating module 30, a sensing module 40, and a centrally coordinating controller 50. All components are interconnected within a closed piping system, collectively constructing a closed-loop pressure-maintaining circulation loop isolated from the external atmosphere.

[0040] The machining cavity 10 is configured to accommodate and fix the workpiece 60 to be machined. In specific industrial applications, the cavity body of the machining cavity 10 is typically made of high-strength alloy steel or pressure-resistant material with surface hardening treatment to withstand extremely high internal working fluid pressure without deformation. Figure 3 As shown, to enhance the hydrodynamic effect of the polishing slurry as it flows over the microscopic surface of the part, a flow-guiding inner wall 11 is formed inside the processing cavity 10. The flow-guiding inner wall 11 is positioned opposite to the surface of the part 60 to be processed. As a preferred and more specific embodiment, the macroscopic three-dimensional profile of the flow-guiding inner wall 11 can be designed as a conformal structure matching the macroscopic profile of the part 60 to be processed, thereby forcibly forming an extremely narrow polishing slurry flow channel between them. This narrow channel can effectively compress the thickness of the fluid boundary layer, making the response of changes in hydrodynamic parameters to the microscopic morphology more sensitive.

[0041] The polishing slurry circulation unit 20 is connected to the machining chamber 10 to form a closed loop and is configured to drive the polishing slurry to continuously circulate within the loop. Specifically, the polishing slurry circulation unit 20 includes a motor 21 for providing mechanical power and a pump body 22 driven by the motor 21. The pump body 22 can be a positive displacement pump, such as an external gear pump or a high-pressure plunger pump, depending on the size of the workpiece and the required nominal flow rate. The advantage of using a positive displacement pump is that its output flow rate is insensitive to fluctuations in system pressure, ensuring that the basic macroscopic flow velocity of the polishing slurry flowing over the surface of the workpiece 60 remains stable.

[0042] The pressure regulation module 30 is connected to a closed loop and configured to apply a periodically varying alternating pressure to the polishing fluid. Specifically, the pressure regulation module 30 includes a servo proportional relief valve 31 and an accumulator 32. During operation, the servo proportional relief valve 31 receives a high-frequency pulse width modulation signal from the controller 50 and adjusts the valve opening at high frequency to regulate the pressure of the polishing fluid. Alternatively, in ultra-precision machining scenarios requiring extremely high-frequency pressure pulsations, the servo proportional relief valve 31 can be replaced by a piezoelectric ceramic-driven miniature throttle valve to achieve a higher dynamic response bandwidth. The accumulator 32, for example, is a bladder-type or diaphragm-type accumulator connected in parallel in the fluid pipeline. It is mainly used to absorb the background hydraulic pulsations generated by the polishing fluid circulation unit 20 during fluid pumping and to help maintain the basic static pressure of the entire system under constant volume and pressure conditions.

[0043] Combination Figure 3 The microscopic cross-sectional view shown illustrates the core physical mechanism of this invention, which is embodied in the interaction between steps S1 and S2. Before polishing, the system first places the part to be processed 60 into the processing chamber 10 and fills the closed loop with a polishing fluid that has shear-thickening properties. This polishing fluid can be, for example, a non-Newtonian fluid formulated by uniformly dispersing nano-silica particles in a polyethylene glycol-based liquid. The core purpose of filling the loop with polishing fluid is not only to provide a grinding medium but also to completely purge the air from the loop. Due to the high compressibility of gases, residual air bubbles will significantly reduce the bulk modulus of the system, causing the alternating pressure wave to be severely attenuated during transmission. After purging the air and establishing a constant-volume pressure environment, it is possible to ensure that the alternating pressure generated by the servo proportional overflow valve 31 is transmitted to the surface of the part to be processed 60 without damage and instantaneously.

[0044] During the circulation of the polishing slurry, the pressure regulating module 30 applies a periodically varying alternating pressure to the polishing slurry via the servo proportional overflow valve 31. Specifically, the instantaneous pressure value P(t) of this alternating pressure strictly satisfies the following sinusoidal control formula: .

[0045] In the above formula This establishes the basic static pressure for the aforementioned processing environment. This parameter is not an arbitrarily set constant, but rather the core element for establishing a constant pressure reference in the system. In engineering practice, The value is precisely configured to maintain the bulk modulus of the polishing fluid within a preset stable range in the closed loop. Fluids inevitably contain or entrain trace amounts of air bubbles, which are highly compressible. Without basic static pressure... The high-frequency alternating pressure is largely absorbed and dissipated by the volume expansion and contraction of the bubbles during transmission. By setting a sufficiently high... (For example, set between 1.5MPa and 3.0MPa), the system can forcibly compress trace residual bubbles to an extremely small volume or even redissolve them in the liquid phase, thereby completely eliminating the attenuation effect of bubbles on the transmission process of alternating pressure waves and ensuring that the pressure waves can reach the surface of the workpiece 60 without damage.

[0046] In the above formula The amplitude of the alternating pressure represents the magnitude of the dynamic energy superimposed on the system's base static pressure. The physical significance lies in determining the normal impact kinetic energy applied to the microscopic peaks 61 by the polishing slurry during instantaneous stiffening. When there are hard burrs or oxide layers on the surface of the workpiece 60 that are difficult to remove, the controller 50 can increase the amplitude by adjusting the control current of the servo proportional overflow valve 31. This makes the hardened polishing fluid in the high-pressure phase act like a rigid micro-blade with extremely high kinetic energy, powerfully removing microscopic peaks 61.

[0047] In the above formula, f is the switching frequency of the alternating pressure. This frequency parameter directly determines the rate of change of the velocity gradient of the polishing fluid within the spatial throttling region, that is, it determines how quickly the local instantaneous shear rate of the polishing fluid rises. In actual processing, if the basic viscosity of the polishing fluid decreases due to temperature rise, the controller 50 will preferentially increase the switching frequency f (for example, from 10Hz to 50Hz or even higher). The increase in frequency means that the polishing fluid is accelerated through the microscopic peak 61 in a very short time, significantly amplifying the local instantaneous shear rate, thus forcibly triggering the shear thickening effect even when the material properties decay.

[0048] The above formula uses This sinusoidal time function not only reflects the periodic fluctuations of pressure over time, but also plays a crucial protective role in fluid mechanics. Compared to square waves or step waveforms, the sine wave ensures the continuity of the pressure derivative (i.e., the rate of pressure change), effectively avoiding the liquid hammer (water hammer) phenomenon induced in the closed loop during rapid pressurization or depressurization, thus protecting fragile microstructures such as the micro-valve 62 from unexpected fatigue impact damage.

[0049] Figure 3The spatial throttling difference effect in this process is clearly revealed. Due to the outward protrusion of the microscopic peak 61, the spatial flow cross-section between it and the inner guide wall 11 is drastically reduced; while the microscopic valley 62 is inwardly recessed, resulting in a relatively large flow cross-section. When under the high-pressure phase of alternating pressure, the polishing fluid is driven by the overall superimposed peak pressure, generating a strong squeezing and flow-blocking effect as it flows through the microscopic peak 61 with its reduced flow cross-section. This causes the local instantaneous shear rate of the polishing fluid at the microscopic peak 61 to surge instantaneously and exceed the critical shear rate. At this point, the polishing fluid in this local area triggers a shear thickening effect and stiffens, essentially forming a fluid-like flexible file tightly adhering to the microscopic peak 61, precisely and selectively removing material from it.

[0050] Conversely, during the low-pressure phase of the alternating pressure, the overall driving pressure of the polishing fluid decreases. Simultaneously, even during the high-pressure phase of the alternating pressure, when the polishing fluid flows through the micro-valve 62, the inward concavity of this region results in a larger flow cross-section, significantly reducing the squeezing effect on the polishing fluid. In both cases, the local instantaneous shear rate of the polishing fluid fails to reach a critical value, thus restoring or maintaining a flexible fluid state. This periodic low-pressure unloading under alternating pressure, combined with the geometric shielding effect of the micro-valve 62 itself, not only prevents over-cutting damage to the micro-valve 62 caused by continuous high pressure but also utilizes the flexible fluid state to smoothly flush away the cut material debris, perfectly achieving a unified approach to targeted deburring and conformal chip removal.

[0051] Furthermore, to address the issue of the shear thickening effect attenuation caused by temperature rise during prolonged reciprocating shear friction of the polishing slurry, this invention introduces a deep-level adaptive closed-loop compensation mechanism. The temperature sensor 41 in the sensing module 40 collects the polishing slurry temperature at the return port in real time, while the dynamic torque sensor 42 integrated on the output shaft of the motor 21 acquires the current output resistance torque data of the motor 21 in real time.

[0052] When the controller 50 (e.g., an industrial PC, PLC, or DSP digital signal processor) determines that the slope of the current output resistance torque data has reached a preset threshold, it indicates that the polishing slurry has experienced physical performance degradation due to temperature rise. At this time, the controller 50 generates a compensation command based on the viscosity compensation relationship corresponding to the current temperature data fed back by the temperature sensor 41. When executing the compensation command, the system follows a scientific priority strategy to first increase the switching frequency of the alternating pressure, thereby directly increasing the local instantaneous shear rate of the polishing slurry flowing through the micro-peaks 61, forcing the polishing slurry, which has thinned due to temperature rise, to reach the stiffening critical point again. Only when the switching frequency reaches the physical upper limit of the mechanical actuator and the resistance torque still does not meet the standard will the system resort to further increasing the amplitude of the alternating pressure, using the enhanced normal impact kinetic energy of the polishing slurry on the micro-peaks 61 for mechanical compensation. This strategy effectively avoids the risk of increased system vibration and shortened seal life that may be caused by blindly increasing the amplitude of the alternating pressure, thus maintaining the uniformity of the removal rate of the micro-peaks 61 throughout the entire processing cycle.

[0053] Furthermore, as a further extension of system stability, the system in this embodiment can also integrate a turbidity sensor or an online particle size analyzer to monitor the concentration of chip impurities in the polishing slurry in real time. When the chip concentration is too high and affects the rheological properties, the controller 50 can appropriately increase the speed of the motor 21 to increase the circulation rate of the polishing slurry and accelerate the transfer of waste chips to the external filtration system, thereby maintaining the absolute stability of the flow field distribution within the processing environment for a long time.

Claims

1. A closed alternating pressure polishing control method for a microstructure part, characterized by, Includes the following steps: S1. Place the part to be processed in the processing chamber, control the processing chamber to be connected with the polishing fluid circulation unit to form a closed loop, and fill the closed loop with polishing fluid with shear thickening properties so that the closed loop forms a constant volume and pressure processing environment. S2. The polishing slurry is driven to circulate in the closed loop and continuously flow over the microscopic peaks and valleys on the surface of the workpiece, while a periodically varying alternating pressure is applied to the polishing slurry. Based on the spatial throttling difference between the microscopic peaks and valleys on the polishing slurry, the control parameters of the alternating pressure are configured as follows: In the high-pressure phase of the alternating pressure, when the polishing slurry flows over the microscopic peaks, its local instantaneous shear rate reaches the critical shear rate to trigger a shear thickening effect, thereby stiffening the local polishing slurry and selectively removing material from the microscopic peaks; while in the low-pressure phase of the alternating pressure, or when the polishing slurry flows over the microscopic valleys, because its local instantaneous shear rate is lower than the critical shear rate, the polishing slurry maintains a flexible fluid state to achieve chip removal and avoid morphological damage to the microscopic valleys. S3. Real-time acquisition of the current temperature data of the polishing fluid in the closed loop, and the current output resistance torque data of the power source driving the circulation of the polishing fluid; S4. Determine whether the downward slope of the current output resistance torque data reaches a preset threshold. If the desired temperature is reached, a compensation command is generated based on the viscosity compensation relationship corresponding to the current temperature data to automatically increase the switching frequency of the alternating pressure or increase the amplitude of the alternating pressure, so as to compensate in real time for the attenuation of the shear thickening effect caused by the increase in the temperature of the polishing fluid, thereby maintaining the consistency of the polishing fluid in the removal rate of the microscopic peaks.

2. The polishing control method according to claim 1, wherein In the step S2, the instantaneous pressure value P(t) of the alternating pressure satisfies the following formula: ​ wherein is a base static pressure for forming the processing environment, is an amplitude of the alternating pressure, is a switching frequency of the alternating pressure.

3. The polishing control method according to claim 1, wherein In step S4, the compensation instruction follows the following priority strategy: Prioritize increasing the switching frequency of the alternating pressure to enhance the local instantaneous shear rate of the polishing fluid as it flows through the microscopic peaks; If the switching frequency reaches the system execution limit and the current output resistance torque data has not yet recovered to the target value, the amplitude of the alternating pressure is further increased to compensate for the removal rate by increasing the normal impact kinetic energy of the polishing fluid on the micro-peaks.

4. The polishing control method according to claim 2, wherein In step S1, the value of the basic static pressure is configured to maintain the bulk elastic modulus of the polishing fluid in the closed loop within a preset stable range, so as to eliminate the attenuation effect of trace residual bubbles in the polishing fluid on the alternating pressure transmission process.

5. The polishing control method according to claim 1, wherein Also includes: The concentration of chips and impurities in the polishing fluid is monitored in real time, and the circulation rate of the polishing fluid is dynamically adjusted according to the concentration of chips and impurities to maintain the stability of the flow field distribution in the processing cavity.

6. A closed alternating pressure polishing system for microstructured parts, characterized in that For performing the polishing control method as described in any one of claims 1 to 5, comprising: The processing cavity (10) is configured to accommodate the part to be processed (60). The polishing fluid circulation unit (20) is connected to the processing chamber (10) to form the closed loop and is configured to drive the polishing fluid to circulate. A pressure regulating module (30), connected to the closed loop, is configured to apply the alternating pressure to the polishing fluid; The sensing module (40) is configured to collect the current temperature data and the current output drag torque data; and The controller (50) is communicatively connected to the polishing fluid circulation unit (20), the pressure regulation module (30) and the sensing module (40), and is configured to generate the compensation command based on the current temperature data and the current output resistance torque data.

7. The polishing system of claim 6, wherein, The pressure regulating module (30) includes: A servo proportional relief valve (31) is used to receive a high-frequency pulse width modulation signal from the controller (50) to perform pressure regulation on the polishing fluid; and An accumulator (32) is used to absorb pressure pulsations generated by the polishing fluid circulation unit (20) to maintain the processing environment.

8. The polishing system of claim 6, wherein, The sensing module (40) includes: Temperature sensor (41) is located at the return port of the processing chamber (10); and A dynamic torque sensor (42) is integrated on the output shaft of the drive motor of the polishing fluid circulation unit (20) to acquire the current output resistance torque data in real time.

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