Multi-board-card power state management system and method based on VPX architecture

Abstract

The invention provides a multi-board power state management system and method based on a VPX framework. The management system comprises a board state management layer, a monitoring node layer, a data processing layer and a system management layer. The board card state management layer internally comprises a power dynamic management module, a temperature sensor and a temperature dynamic management module; the monitoring node layer collects data such as voltage and current of a plurality of board cards in real time through a VPX card slot; according to the scheme, a layered power supply state management system (a board card state management layer, a monitoring node layer, a data processing layer and a system management layer) is constructed, millisecond-level power supply state monitoring is realized through a multi-parameter sensor network, and closed-loop regulation of power / temperature is realized by adopting a dynamic strategy configuration module; a hardware level integrates a power dynamic distribution module and a temperature cooperative control module, and supports + / -5% voltage precision regulation and control and TEC active refrigeration.

Description

Technical Field

[0001] This invention relates to the field of embedded system power management, specifically to a multi-board power status management system and method based on the VPX architecture. Background Technology

[0002] VPX is an open embedded system standard that supports high-speed serial buses and modular design. To meet the needs of different application scenarios, VPX boards provide rich interfaces, enabling faster transmission of large amounts of data between multi-board systems and facilitating easier connection and communication with other devices. VPX's modular design allows for flexible expansion of board functionality as needed, and with continuous technological advancements, it is widely used in scenarios requiring multifunctionality, high performance, and high reliability.

[0003] However, in multi-board systems based on the VPX architecture, as system integration increases, the power consumption of a single board gradually increases. The power status of each board directly affects system stability. Early VPX power designs relied heavily on static protection circuits and manual testing. Traditional power monitoring and management methods have the following problems: 1. Insufficient real-time monitoring: The system lacks real-time monitoring of parameters such as voltage and current, making it unable to quickly capture transient faults (such as voltage drops). 2. Lack of a unified management framework: In multi-board systems, the power status of each module is dispersed, making centralized control difficult and resulting in difficulty in quickly locating abnormal boards or power modules. 3. Poor scalability: Existing solutions struggle to support dynamically added boards or heterogeneous power types. Summary of the Invention

[0004] To address the shortcomings of existing technologies, the present invention aims to provide a multi-board power state management system and method based on the VPX architecture to solve the problems mentioned in the background. The present invention has a novel structure and provides a multi-board power state management system and method with high real-time performance, high reliability, and dynamic expansion support, enabling rapid fault location and adaptive management strategies.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a current and voltage transformer polarity testing device, wherein the management system comprises: a board status management layer, a monitoring node layer, a data processing layer, and a system management layer; the board status management layer includes a power dynamic management module, a temperature sensor, and a temperature dynamic management module; the monitoring node layer collects voltage, current, and other data from multiple boards in real time through VPX card slots; the data processing layer is responsible for performing data preprocessing and abnormal threshold judgment, and adjusting the sampling frequency, power, and power supply temperature of each board according to the received parameters; the system management layer includes a dynamic strategy configuration module, a historical data storage module, and a human-machine interface module.

[0006] Furthermore, the power dynamic management module is used to dynamically allocate power to each board, the temperature sensor is responsible for collecting the power module temperature, and the temperature dynamic management module is used to adjust the power module temperature.

[0007] Furthermore, the dynamic strategy configuration module is used to dynamically adjust the sampling frequency, power and power supply temperature of each board according to the load status, and transmit the set parameters to the data processing layer. The historical data storage module is responsible for storing the data transmitted by the data processing layer. The human-machine interface module is used to display the multi-dimensional parameters of the board power supply and the location of the faulty board.

[0008] Furthermore, the monitoring node layer is deployed on the VPX backplane and includes multiple multi-parameter sensors for real-time acquisition of voltage and current data from multiple boards.

[0009] Furthermore, the data processing layer includes a main control processor of the power management system, which is connected to the sensor for frequency adjustment, data preprocessing, and abnormal threshold judgment; it is connected to the system management layer through the interface of the VPX backplane to realize low-latency data transmission; and it is connected to the power dynamic management module and temperature dynamic management module of the board status management layer, which are responsible for dynamically adjusting the power and power temperature of each board according to the power status management parameters transmitted by the system management layer.

[0010] Furthermore, the human-machine interface module displays the power status management parameters set by the user, multi-dimensional parameters of multiple boards (including voltage, current and historical trends), location of faulty boards, and power supply temperature.

[0011] A multi-board power status management method based on VPX architecture, the management method includes the following steps:

[0012] (1) Initialization configuration: Set the power status management parameters and alarm thresholds of each board in the human-computer interaction interface of the system management layer, and transmit the set parameters to the main control processor of the data processing layer;

[0013] (2) Configuration parameter processing: The main control processor transmits the power values ​​of each board to the power dynamic management module of the board status management layer, and sets the sampling frequency of the multi-parameter sensor and temperature sensor according to the received parameters;

[0014] (3) Initial power allocation: The power dynamic management module of the board status management layer allocates initial power to each board, including voltage and current;

[0015] (4) Real-time data acquisition: The multi-parameter sensors at the monitoring node layer acquire information such as voltage and current of each board according to the acquisition frequency set by the main control processor, and transmit the acquired power status information of each board to the main control processor at the data processing layer. The temperature sensors at the board status management layer also acquire power temperature at a set frequency and transmit the temperature information to the main control processor;

[0016] (5) Data processing: After receiving the collected data, the main control processor preprocesses the power status data and power temperature data of each board and compares them with the corresponding alarm thresholds. It then transmits the voltage and current, power temperature and alarm information of each board to the system management layer through the VPX backplane interface.

[0017] (6) Data collection and storage: The historical data storage module of the system management layer stores the received raw data and diagnostic results in non-volatile memory;

[0018] (7) Dynamic strategy adjustment: The dynamic strategy configuration module of the system management layer dynamically switches the monitoring frequency according to the system load and historical data, and adjusts the power and power supply temperature of each board according to the control algorithm, and transmits the changed power status management parameters to the main control processor of the data processing layer.

[0019] (8) Dynamic strategy configuration: After receiving the changed power status management parameters, the main control processor transmits the changed power values ​​of each board to the power dynamic management module, transmits the changed temperature values ​​to the temperature dynamic management module, and changes the monitoring frequency of the multi-parameter sensor and the temperature sensor.

[0020] (9) Configuration change execution: The power dynamic adjustment module reallocates power according to the power values ​​of each board received, the temperature dynamic management module dynamically adjusts the power module temperature according to the temperature value transmitted by the main control processor, and the multi-parameter sensor and temperature sensor sample according to the changed sampling value;

[0021] (10) Repeat the operation steps (5)-(9) to realize dynamic management of the power status of multiple boards.

[0022] Furthermore, in step (2), the main control processor uses an STM32 chip and has different power supplies on the VPX backplane. The main control processor of the lower-level machine automatically scans the VPX slots to identify the online board.

[0023] Furthermore, in step (4), the multi-parameter sensor is an INA233, and the temperature sensor is an AD7714 temperature measurement circuit.

[0024] Furthermore, in step (9), the temperature dynamic management module dynamically adjusts the power module temperature according to the temperature value transmitted by the main control processor. When the initial power-on temperature is low, the heating element controls the temperature rise. When the power supply temperature is too high during continuous multi-load operation, the TEC controller chip controls the TEC to reduce the power supply temperature. The cooling chip is MTE23Z0302.

[0025] The beneficial effects of this invention are:

[0026] This invention constructs a hierarchical power status management system (board status management layer, monitoring node layer, data processing layer, and system management layer), which realizes millisecond-level power status monitoring through a multi-parameter sensor network and adopts a dynamic strategy configuration module to achieve closed-loop regulation of power / temperature; at the hardware level, it integrates a dynamic power allocation and temperature collaborative control module, supporting ±5% voltage accuracy regulation and TEC active cooling.

[0027] This invention employs a heterogeneous processing architecture of STM32 + INA233 to achieve a data acquisition-processing-response latency of around 20ms; it also supports adaptive power allocation in hot-swappable board scenarios, offering enhanced scalability. These features enable it to more effectively prevent system crashes caused by power supply failures in high-reliability scenarios such as aerospace.

[0028] This invention is a multi-layer collaborative power management system based on the VPX architecture, which realizes real-time monitoring of the power status of multiple boards, dynamic power allocation and intelligent temperature control, and solves the pain points of poor real-time performance, decentralized management and insufficient scalability of traditional solutions.

[0029] This invention combines a distributed sensor network with centralized processing to achieve millisecond-level fault detection (voltage drop response time <10ms) and precise board-level positioning.

[0030] This invention supports load-adaptive sampling frequency switching (up to 1kHz) and power redistribution (adjustment accuracy ±2%) through a dynamic strategy engine, thereby improving system energy efficiency by more than 30%.

[0031] This invention features a modular design compatible with heterogeneous power supply types and supports hot-swappable expansion. This technology can significantly improve the reliability of high-density electronic systems in aerospace, military communications, and other fields, reducing maintenance costs by 20%–40%, and has significant application value in domestic substitution and intelligent equipment upgrades. Attached Figure Description

[0032] Figure 1 This is a system architecture diagram of a multi-board power status management system based on VPX architecture according to the present invention;

[0033] Figure 2This is a software processing flowchart of a multi-board power status management system based on VPX architecture according to the present invention.

[0034] Figure 3 This is a flowchart illustrating the steps of a multi-board power state management method based on the VPX architecture of the present invention. Detailed Implementation

[0035] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0036] Please see Figures 1 to 3 The present invention provides a technical solution:

[0037] A multi-board power status management method based on VPX architecture, the management method includes the following steps:

[0038] (1) Initialization configuration: Set the power status management parameters and alarm thresholds of each board in the human-machine interface of the system management layer, and transmit the set parameters to the main control processor of the data processing layer; After the system is powered on, run the host computer of the power management system on the PC, set the power status management parameters and alarm thresholds of each board through the human-machine interface of the system management layer, and transmit them to the data processing layer through the dynamic strategy configuration module.

[0039] (2) Configuration parameter processing: The main control processor transmits the power values ​​of each board to the power dynamic management module of the board status management layer, and sets the sampling frequency of the multi-parameter sensor and temperature sensor according to the received parameters; different power supplies are available on the VPX backplane, and the main control processor of the lower-level machine automatically scans the VPX slot to identify the online board, and transmits the power values ​​of each board to the power dynamic management module of the board status management layer, and sets the sampling frequency of the multi-parameter sensor and temperature sensor according to the received parameters. The main control processor uses an STM32 chip;

[0040] (3) Initial power allocation: The power dynamic management module of the board status management layer allocates initial power to each board, including voltage and current; the power dynamic management module supplies power to other slots according to the different power provided by the data processing layer;

[0041] (4) Real-time data acquisition: The multi-parameter sensors at the monitoring node layer acquire voltage, current, and other information of each board according to the acquisition frequency set by the main control processor, and transmit the acquired power status information of each board to the main control processor at the data processing layer. The temperature sensor at the board status management layer also acquires the power temperature at a set frequency and transmits the temperature information to the main control processor; the multi-parameter sensors use INA233, and the temperature sensor uses AD7714 temperature measurement circuit; the multi-parameter sensors at the monitoring node layer acquire power status data of each board at a set sampling frequency, and the temperature sensor at the board status management layer also acquires power temperature data at a set sampling frequency and transmits it to the data processing layer through the I2C interface. Preferably, the multi-parameter sensors use INA233, and the temperature sensor uses AD7714 temperature measurement circuit;

[0042] (5) Data acquisition and processing: After receiving the acquired data, the main control processor preprocesses the power status data and power temperature data of each board and compares them with the corresponding alarm thresholds. It then transmits the voltage and current, power temperature and alarm information of each board to the system management layer through the VPX backplane interface. After receiving the acquired data, the data processing layer preprocesses the received data and power temperature data of each board according to the data processing relationship of the sensor chip, and converts them into multi-dimensional parameters of the board power status, including voltage, current and power temperature.

[0043] Board fault location: The data processing layer compares the processed power status data with the corresponding alarm threshold. If the alarm threshold is triggered (e.g., voltage deviation > 5%), an alarm is sent to the system management layer. The voltage and current of each board, power supply temperature and alarm information are transmitted to the system management layer through the VPX backplane interface. Preferably, the VPX backplane interface can be Gigabit Ethernet.

[0044] (6) Data collection and storage: The historical data storage module of the system management layer stores the received raw data and diagnostic results in non-volatile memory; the system management layer stores the raw data and diagnostic results in non-volatile memory. Preferably, the non-volatile memory is Flash with a capacity of not less than 256KB.

[0045] (7) Dynamic strategy adjustment: The dynamic strategy configuration module of the system management layer dynamically switches the monitoring frequency according to the system load and historical data, and adjusts the power and power supply temperature of each board according to the control algorithm, and transmits the changed power status management parameters to the main control processor of the data processing layer.

[0046] (8) Dynamic strategy configuration: After receiving the changed power status management parameters, the main control processor transmits the changed power values ​​of each board to the power dynamic management module, transmits the changed temperature values ​​to the temperature dynamic management module, and changes the monitoring frequency of the multi-parameter sensor and the temperature sensor; The dynamic strategy configuration module of the system management layer receives the historical data from the memory and the power status information of each board uploaded in real time by the lower computer, dynamically modifies the monitoring frequency according to the system load and historical data and transmits it to the data processing layer and the human-machine interface module, and reallocates power and controls the power temperature of faulty boards (such as power deviation > 20%) based on the control processing algorithm;

[0047] (9) Configuration Change Execution: The power dynamic adjustment module reallocates power according to the received power values ​​of each board, the temperature dynamic management module dynamically adjusts the power module temperature according to the temperature value transmitted by the main control processor, and the multi-parameter sensor and temperature sensor sample according to the changed sampling value; the data processing layer receives and automatically switches the monitoring frequency (such as enabling high-speed sampling in burst mode and reducing frequency to save energy when light load), transmits the changed power values ​​of each board to the power dynamic management module, and transmits the changed temperature value to the temperature dynamic management module. The power dynamic adjustment module reallocates power according to the received power values ​​of each board, and the temperature dynamic management module dynamically adjusts the power module temperature according to the temperature value transmitted by the main control processor. When the initial power-on temperature is low, the heating element controls the temperature rise. When the power supply temperature is too high during continuous multi-load operation, the TEC controller chip controls the TEC to reduce the power supply temperature. Preferably, the cooling chip is MTE23Z0302.

[0048] (10) Repeat the operation steps (5)-(9) to realize dynamic management of the power status of multiple boards.

[0049] A multi-board power status management system based on VPX architecture, the management system comprising: a board status management layer, a monitoring node layer, a data processing layer, and a system management layer;

[0050] The board status management layer includes a power dynamic management module, a temperature sensor, and a temperature dynamic management module. The power dynamic management module is used to dynamically allocate power to each board, the temperature sensor is responsible for collecting the power module temperature, and the temperature dynamic management module is used to adjust the power module temperature.

[0051] The monitoring node layer collects voltage, current and other data of multiple boards in real time through the VPX card slot; the monitoring node layer is deployed on the VPX backplane and contains multiple multi-parameter sensors for collecting voltage and current data of multiple boards in real time.

[0052] The data processing layer is responsible for performing data preprocessing and anomaly threshold judgment, and adjusting the sampling frequency, power, and power supply temperature of each board according to the received parameters. The data processing layer includes the main control processor of the power management system, which is connected to the sensor and used to collect frequency adjustment, data preprocessing, and anomaly threshold judgment. It is connected to the system management layer through the interface of the VPX backplane to realize low-latency data transmission. It is connected to the power dynamic management module and temperature dynamic management module of the board status management layer and is responsible for dynamically adjusting the power and power supply temperature of each board according to the power status management parameters transmitted by the system management layer.

[0053] The system management layer includes a dynamic strategy configuration module, a historical data storage module, and a human-machine interface module. The dynamic strategy configuration module dynamically adjusts the sampling frequency, power, and power supply temperature of each board according to the load status and transmits the set parameters to the data processing layer. The historical data storage module is responsible for storing the data transmitted by the data processing layer. The human-machine interface module displays multi-dimensional parameters of the board power supply and the location of the faulty board. The human-machine interface module displays the power status management parameters set by the user, multi-dimensional parameters of multiple boards (including voltage, current, and historical trends), the location of the faulty board, and the power supply temperature.

[0054] This invention constructs a hierarchical power status management system (board status management layer, monitoring node layer, data processing layer, and system management layer), which realizes millisecond-level power status monitoring through a multi-parameter sensor network and uses a dynamic strategy configuration module to realize closed-loop regulation of power / temperature.

[0055] At the hardware level, it integrates a power dynamic distribution and temperature coordinated control module, supporting ±5% voltage accuracy regulation and TEC active cooling;

[0056] A heterogeneous processing architecture of STM32+INA233 is adopted to achieve a latency of 20ms for data acquisition, processing and response;

[0057] It supports adaptive power allocation in hot-swappable board scenarios, offering enhanced scalability. These features enable it to more effectively prevent system crashes caused by power supply failures in high-reliability scenarios such as aerospace.

[0058] The multi-layer collaborative power management system based on the VPX architecture realizes real-time monitoring of the power status of multiple boards, dynamic power allocation and intelligent temperature control, and solves the pain points of poor real-time performance, decentralized management and insufficient scalability of traditional solutions.

[0059] By combining distributed sensor networks with centralized processing, millisecond-level fault detection (voltage drop response time <10ms) and precise board-level location are achieved.

[0060] The dynamic strategy engine supports load-adaptive sampling frequency switching (up to 1kHz) and power redistribution (adjustment accuracy ±2%), improving system energy efficiency by more than 30%.

[0061] The modular design is compatible with heterogeneous power supply types and supports hot-swappable expansion. This technology can significantly improve the reliability of high-density electronic systems in aerospace, military communications, and other fields, reducing maintenance costs by 20%–40%, and has significant application value in domestic substitution and intelligent equipment upgrades.

[0062] The foregoing has shown and described the basic principles and main features of the present invention and its advantages. It will be apparent to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or basic features of the present invention.

[0063] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A multi-board power status management system based on VPX architecture, characterized in that: The management system includes: a board status management layer, a monitoring node layer, a data processing layer, and a system management layer; The board status management layer includes a power dynamic management module, a temperature sensor, and a temperature dynamic management module. The monitoring node layer collects data such as voltage and current from multiple boards in real time through the VPX card slot; The data processing layer is responsible for performing data preprocessing and anomaly threshold judgment, and adjusting the sampling frequency, power and power supply temperature of each board according to the received parameters; The system management layer includes a dynamic strategy configuration module, a historical data storage module, and a human-computer interaction interface module.

2. The multi-board power status management system based on VPX architecture according to claim 1, characterized in that: The power dynamic management module is used to dynamically allocate power to each board, the temperature sensor is responsible for collecting the temperature of the power module, and the temperature dynamic management module is used to adjust the temperature of the power module.

3. The multi-board power status management system based on VPX architecture according to claim 1, characterized in that: The dynamic strategy configuration module is used to dynamically adjust the sampling frequency, power and power supply temperature of each board according to the load status, and transmit the set parameters to the data processing layer. The historical data storage module is responsible for storing the data transmitted by the data processing layer. The human-machine interface module is used to display the multi-dimensional parameters of the board power supply and the location of the faulty board.

4. A multi-board power status management system based on VPX architecture according to claim 1, characterized in that: The monitoring node layer is deployed on the VPX backplane and includes multiple multi-parameter sensors for real-time acquisition of voltage and current data from multiple boards.

5. A multi-board power status management system based on VPX architecture according to claim 4, characterized in that: The data processing layer includes the main control processor of the power management system, which is connected to the sensors for frequency adjustment, data preprocessing, and abnormal threshold judgment; it is connected to the system management layer through the interface of the VPX backplane to realize low-latency data transmission; and it is connected to the power dynamic management module and temperature dynamic management module of the board status management layer, which are responsible for dynamically adjusting the power and power temperature of each board according to the power status management parameters transmitted by the system management layer.

6. A multi-board power status management system based on VPX architecture according to claim 5, characterized in that: The human-machine interface module displays the power status management parameters set by the user, multi-dimensional parameters of multiple boards (including voltage, current and historical trends), location of faulty boards and power temperature.

7. A multi-board power state management method based on VPX architecture implemented according to claim 1, characterized in that: The management method includes the following steps: (1) Initialization configuration: Set the power status management parameters and alarm thresholds of each board in the human-computer interaction interface of the system management layer, and transmit the set parameters to the main control processor of the data processing layer; (2) Configuration parameter processing: The main control processor transmits the power values ​​of each board to the power dynamic management module of the board status management layer, and sets the sampling frequency of the multi-parameter sensor and temperature sensor according to the received parameters; (3) Initial power allocation: The power dynamic management module of the board status management layer allocates initial power to each board, including voltage and current; (4) Real-time data acquisition: The multi-parameter sensors at the monitoring node layer acquire information such as voltage and current of each board according to the acquisition frequency set by the main control processor, and transmit the acquired power status information of each board to the main control processor at the data processing layer. The temperature sensors at the board status management layer also acquire power temperature at a set frequency and transmit the temperature information to the main control processor; (5) Data processing: After receiving the collected data, the main control processor preprocesses the power status data and power temperature data of each board and compares them with the corresponding alarm thresholds. It then transmits the voltage and current, power temperature and alarm information of each board to the system management layer through the VPX backplane interface. (6) Data collection and storage: The historical data storage module of the system management layer stores the received raw data and diagnostic results in non-volatile memory; (7) Dynamic strategy adjustment: The dynamic strategy configuration module of the system management layer dynamically switches the monitoring frequency according to the system load and historical data, and adjusts the power and power supply temperature of each board according to the control algorithm, and transmits the changed power status management parameters to the main control processor of the data processing layer. (8) Dynamic strategy configuration: After receiving the changed power status management parameters, the main control processor transmits the changed power values ​​of each board to the power dynamic management module, transmits the changed temperature values ​​to the temperature dynamic management module, and changes the monitoring frequency of the multi-parameter sensor and the temperature sensor. (9) Configuration change execution: The power dynamic adjustment module reallocates power according to the power values ​​of each board received, the temperature dynamic management module dynamically adjusts the power module temperature according to the temperature value transmitted by the main control processor, and the multi-parameter sensor and temperature sensor sample according to the changed sampling value; (10) Repeat the operation steps (5)-(9) to realize dynamic management of the power status of multiple boards.

8. A multi-board power state management method based on VPX architecture according to claim 7, characterized in that: In step (2), the main control processor uses an STM32 chip and has different power supplies on the VPX backplane. The main control processor of the lower-level machine automatically scans the VPX slots to identify the online board.

9. A multi-board power state management method based on VPX architecture according to claim 7, characterized in that: In step (4), the multi-parameter sensor is INA233, and the temperature sensor is AD7714 temperature measurement circuit.

10. A multi-board power state management method based on VPX architecture according to claim 7, characterized in that: In step (9), the temperature dynamic management module dynamically adjusts the power module temperature according to the temperature value transmitted by the main control processor. When the initial power-on temperature is low, the heating element controls the temperature rise. When the power supply temperature is too high during continuous multi-load operation, the TEC controller chip controls the TEC to reduce the power supply temperature. The cooling chip is MTE23Z0302.

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