A heat dissipation simulation method and device of a charging and discharging equipment and an electronic device

Abstract

This application proposes a heat dissipation simulation method, apparatus, and electronic device for charging and discharging equipment. The charging and discharging equipment includes an air duct, a power supply board, and multiple charging and discharging bays. The method includes: acquiring an air duct model, a power supply board model, a single bay model, and a multi-bay integrated model; simulating the air duct model, power supply board model, and single bay model respectively to obtain target air duct structural parameters, target power supply board heat dissipation parameters, and target single bay heat dissipation parameters; and determining the target heat dissipation design parameters of the charging and discharging equipment based on the target air duct structural parameters, target power supply board heat dissipation parameters, target single bay heat dissipation parameters, and the multi-bay integrated model. The above technical solution can improve simulation accuracy and design efficiency, ensuring reliable heat dissipation and stable operation of the charging and discharging equipment.

Description

Technical Field

[0001] This application relates to the field of heat dissipation design and simulation technology for charging and discharging equipment, and in particular to a heat dissipation simulation method, apparatus, and electronic equipment for charging and discharging equipment. Background Technology

[0002] Integrated charging and discharging equipment, with multiple charging and discharging bays built-in, enables simultaneous charging and discharging management of multiple battery packs. It is widely used in energy storage power stations, new energy battery capacity testing and formation production equipment, and other scenarios. During charging and discharging, the power devices on the power supply board and the batteries within the bays generate a significant amount of heat. Inadequate heat dissipation design can lead to excessively high local temperatures and uneven temperatures between bays, consequently affecting the operational stability, lifespan, and charging / discharging efficiency of the equipment. Therefore, improving the accuracy and efficiency of heat dissipation simulation is a pressing issue that needs to be addressed. Summary of the Invention

[0003] This application provides a heat dissipation simulation method, apparatus, and electronic device for charging and discharging equipment, which can improve the accuracy and efficiency of heat dissipation simulation.

[0004] A first aspect of this application provides a heat dissipation simulation method for a charging and discharging device. The charging and discharging device includes an air duct, a power supply board, and multiple charging and discharging bays. The air duct includes an air duct body, a guide plate, and a heat insulation layer. The power supply board includes multiple power devices and a printed circuit board (PCB). The charging and discharging bays include a battery pack, a bay frame, and a heat dissipation channel. The battery pack is mounted on the bay frame. The method includes:

[0005] The system acquires a duct model, a power supply board model, a single storage location model, and a multi-storage location integrated model. The duct model is used to simulate the duct, the power supply board model is used to simulate the power supply board, the single storage location model is used to simulate one of the multiple charging / discharging storage locations, and the multi-storage location integrated model is used to simulate the charging / discharging equipment. The system is formed by assembling multiple single storage location models, power supply board models, and duct models.

[0006] Simulations were performed on the air duct model, the power supply board model, and the single storage location model to obtain the target air duct structure parameters, the target power supply board heat dissipation parameters, and the target single storage location heat dissipation parameters.

[0007] Based on the target air duct structure parameters, the target power supply board heat dissipation parameters, the target single-storage heat dissipation parameters, and the multi-storage integrated model, the target heat dissipation design parameters of the charging and discharging equipment are determined.

[0008] In some possible embodiments, determining the target heat dissipation design parameters of the charging and discharging equipment based on the target air duct structure parameters, the target power supply board heat dissipation parameters, the target single-storage heat dissipation parameters, and the multi-storage integrated model includes:

[0009] Based on the target air duct structure parameters, the target power supply board heat dissipation parameters, and the target single storage location heat dissipation parameters, the multi-storage location integrated model is simulated to obtain the target multi-storage location coordination parameters of the charging and discharging equipment. The multi-storage location coordination parameters are parameters used to characterize the coupling relationship between the air duct, the power supply board, and the various components in the multiple charging and discharging locations.

[0010] Multiple parameters, including the target air duct structure parameters, the target power supply board heat dissipation parameters, the target single-storage heat dissipation parameters, and the target multi-storage coordination parameters, are input into the multi-storage integrated model. The multi-storage integrated model is then verified and simulated to obtain the target heat dissipation design parameters.

[0011] In some possible embodiments, multiple parameters, including the target airflow structure parameters, the target power supply board heat dissipation parameters, the target single-storage location heat dissipation parameters, and the target multi-storage location coordination parameters, are input into the multi-storage location integrated model. The multi-storage location integrated model is then verified and simulated to obtain the target heat dissipation design parameters, including:

[0012] The multi-location integrated model is verified and simulated under various working conditions, and the simulation results for each working condition are output. The simulation results include the sub-simulation results corresponding to each of the various parameters.

[0013] If the simulation results of each operating condition meet the design requirements corresponding to each operating condition, then the various parameters are determined as the target heat dissipation design parameters.

[0014] In some possible embodiments, the method further includes:

[0015] If at least one sub-simulation result of any operating condition does not meet the corresponding design requirements, the parameters of at least one model corresponding to the at least one sub-simulation result are adjusted to obtain the adjusted parameters of each model. The at least one model includes at least one of the following: a multi-storage integrated model, the air duct model, the power supply board model, and the single-storage model.

[0016] The adjusted parameters of at least one model and the parameters of models other than the at least one model are input into the multi-storage integrated model, and the multi-storage integrated model is verified by simulation to obtain the target heat dissipation design parameters; or,

[0017] The adjusted parameters of the at least one model are input into the multi-storage integrated model, and the multi-storage integrated model is verified and simulated to obtain the target heat dissipation design parameters. The at least one model includes the multi-storage integrated model, the air duct model, the power supply board model, and the single-storage model.

[0018] In some possible embodiments, the simulation of the multi-storage integrated model based on the target air duct structure parameters, the target power supply board heat dissipation parameters, and the target single-storage heat dissipation parameters to obtain the target multi-storage coordination parameters of the charging and discharging equipment includes:

[0019] Obtain the first heat dissipation boundary condition of the multi-location integrated model;

[0020] Under the first heat dissipation boundary condition, the multi-storage integrated model is simulated based on the target air duct structure parameters, the target power supply board heat dissipation parameters, and the target single-storage heat dissipation parameters to obtain the target multi-storage coordination parameters of the charging and discharging equipment.

[0021] In some possible embodiments, under the first heat dissipation boundary conditions, the multi-storage integrated model is simulated based on the target airflow structure parameters, the target power supply board heat dissipation parameters, and the target single-storage heat dissipation parameters to obtain the target multi-storage coordination parameters of the charging and discharging equipment, including:

[0022] Under the first heat dissipation boundary condition, multiple sets of simulations are performed on the multi-storage integrated model based on the target air duct structure parameters, the target power supply board heat dissipation parameters, and the target single storage location heat dissipation parameters to obtain multiple sets of parameter values ​​corresponding to the multiple simulation processes.

[0023] From multiple sets of parameter values ​​corresponding to multiple simulation processes, a set of parameter values ​​is determined as the target multi-storage location coordination parameter;

[0024] Each simulation process includes:

[0025] Using the target value of any parameter among the multi-storage location coordination parameters as a quantifier and other parameters as variables, the multi-storage location integrated model is simulated at least once until the simulation results of the multi-storage location integrated model meet the multi-storage location design conditions, thereby obtaining a set of parameter values ​​of the multi-storage location coordination parameters that meet the multi-storage location design conditions.

[0026] In some possible embodiments, the process of determining the target single-storage heat dissipation parameters includes:

[0027] Obtain the second heat dissipation boundary conditions of the single-storage location model;

[0028] Under the second heat dissipation boundary condition, the single-storage model is simulated based on the heat dissipation parameters of the target power supply board to obtain the target single-storage heat dissipation parameters of the charging and discharging storage location.

[0029] In some possible embodiments, the target air duct structural parameters include at least one of the following: the size of the air inlet of the air duct, the size of the air outlet, the angle of the guide vane, the diameter of the branch air ducts of the air duct, and the length of the air duct; and / or,

[0030] The target power supply board heat dissipation parameters include at least one of the following: the layout of the plurality of power devices, the area of ​​the heat dissipation pads, the copper foil thickness of the PCB, and the thermal conductivity of the thermal paste used on the power devices and the PCB; and / or,

[0031] The target single-slot heat dissipation parameters include at least one of the following: the spacing between the batteries in the battery pack, the width of the heat dissipation channel, the connection method between the charging / discharging slot and the air duct, and the thermal conductivity of the batteries in the battery pack and the slot frame; and / or,

[0032] The target multi-storage location coordination parameters include at least one of the following: the connection angle between each charging / discharging storage location and the air duct; the relative position of the power supply board and the charging / discharging storage location; the airflow distribution ratio of the branch air duct; and the matching relationship between the airflow velocity at the air inlet and the heating power of each charging / discharging storage location.

[0033] A second aspect of this application provides a heat dissipation simulation device for a charging and discharging device. The charging and discharging device includes an air duct, a power supply board, and multiple charging and discharging bays. The air duct includes an air duct body, a guide plate, and a heat insulation layer. The power supply board includes multiple power devices and a printed circuit board (PCB). The charging and discharging bays include a battery pack, a bay frame, and a heat dissipation channel. The battery pack is mounted on the bay frame. The device includes:

[0034] The acquisition module is used to acquire the air duct model, the power supply board model, the single storage location model, and the multi-storage location integrated model. The air duct model is used to simulate the air duct, the power supply board model is used to simulate the power supply board, the single storage location model is used to simulate one of the multiple charging and discharging storage locations, and the multi-storage location integrated model is used to simulate the charging and discharging equipment. The model is formed by assembling multiple single storage location models, power supply board models, and air duct models.

[0035] The simulation module is used to simulate the air duct model, the power supply board model, and the single storage location model respectively, to obtain the target air duct structure parameters, the target power supply board heat dissipation parameters, and the target single storage location heat dissipation parameters of the charging and discharging storage location.

[0036] The determination module is used to determine the target heat dissipation design parameters of the charging and discharging equipment based on the target air duct structure parameters, the target power supply board heat dissipation parameters, the target single storage location heat dissipation parameters, and the multi-storage location integrated model.

[0037] A third aspect of this application provides an electronic device including a processor and a memory, the memory storing a computer program, wherein the processor executes the computer program to implement the steps of any of the methods described in the first aspect of this application.

[0038] The technical solutions provided in this application have at least the following beneficial effects:

[0039] This application proposes a heat dissipation simulation method for a charging and discharging device. The charging and discharging device includes an air duct, a power supply board, and multiple charging and discharging bays. The air duct includes an air duct body, a guide plate, and a heat insulation layer. The power supply board includes multiple power devices and a printed circuit board (PCB). The charging and discharging bays include a battery pack, a bay frame, and a heat dissipation channel. The battery pack is mounted on the bay frame. The method includes: acquiring an air duct model, a power supply board model, a single bay model, and a multi-bay integrated model. The air duct model is used to simulate the air duct, the power supply board model is used to simulate the power supply board, and the single bay model is used to simulate the multiple charging and discharging bays. A charging / discharging compartment is included in the charging / discharging system. The multi-compartment integrated model is used to simulate the charging / discharging equipment and is formed by assembling multiple single-compartment models, the power supply board model, and the air duct model. Simulations are performed on the air duct model, the power supply board model, and the single-compartment model to obtain the target air duct structure parameters, the target power supply board heat dissipation parameters, and the target single-compartment heat dissipation parameters of the charging / discharging compartment. Based on the target air duct structure parameters, the target power supply board heat dissipation parameters, the target single-compartment heat dissipation parameters, and the multi-compartment integrated model, the target heat dissipation design parameters of the charging / discharging equipment are determined. The above technical solution, by independently acquiring and simulating multi-level models such as air ducts, power supply boards, and single storage locations, can accurately optimize the target air duct structure parameters, the target power supply board heat dissipation parameters, and the target single storage location heat dissipation parameters. Then, the optimized parameters are integrated into a multi-storage location integrated model for overall verification to obtain the target heat dissipation design parameters of the charging and discharging equipment. This enables a systematic simulation of the heat dissipation design of the charging and discharging equipment, effectively improving simulation accuracy and design efficiency, and ensuring reliable heat dissipation and stable operation of the charging and discharging equipment. Attached Figure Description

[0040] Figure 1 This is a schematic diagram of the structure of a charging and discharging device according to an embodiment of this application;

[0041] Figure 2 This is a flowchart illustrating a heat dissipation simulation method for a charging and discharging device proposed in an embodiment of this application.

[0042] Figure 3 This is a schematic diagram of the air duct model proposed in the embodiments of this application;

[0043] Figure 4 This is a schematic diagram of the power supply board model proposed in the embodiments of this application;

[0044] Figure 5 This is a schematic diagram of the structure of the single-storage location model proposed in the embodiments of this application;

[0045] Figure 6 This is a schematic diagram illustrating the process for determining the heat dissipation parameters of a target single storage location as proposed in an embodiment of this application.

[0046] Figure 7 This is a schematic diagram illustrating the process of determining the target heat dissipation design parameters proposed in the embodiments of this application;

[0047] Figure 8 This is a schematic diagram of the structure of the multi-storage location integration model proposed in the embodiments of this application;

[0048] Figure 9 This is a schematic diagram illustrating the process for determining the target multi-storage location coordination parameters proposed in the embodiments of this application;

[0049] Figure 10 This is a schematic diagram of the simulation process for determining the target multi-storage location coordination parameters proposed in the embodiments of this application;

[0050] Figure 11 This is a schematic diagram of the verification simulation process for determining the target heat dissipation design parameters proposed in the embodiments of this application;

[0051] Figure 12 This is a schematic diagram illustrating the process of determining target heat dissipation design parameters through verification simulation, as proposed in an embodiment of this application.

[0052] Figure 13 This is a flowchart illustrating another heat dissipation simulation method for a charging and discharging device proposed in an embodiment of this application;

[0053] Figure 14 This is a schematic diagram of the structure of a heat dissipation simulation device for a charging and discharging device according to an embodiment of this application;

[0054] Figure 15 This is a schematic diagram of the structure of the electronic device proposed in the embodiments of this application. Detailed Implementation

[0055] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0056] To facilitate a clear description of the technical solutions in the embodiments of this application, the terms "first" and "second" are used in the embodiments of this application to distinguish identical or similar items with essentially the same function and effect. For example, "first instruction" and "second instruction" are used to distinguish different user instructions and do not limit their order. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and the terms "first" and "second" are not necessarily different.

[0057] It should be noted that in the embodiments of this application, the words "exemplarily" or "for example" are used to indicate examples, illustrations, or explanations. Any embodiment or design scheme described as "exemplarily" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design schemes. Specifically, the use of the words "exemplarily" or "for example" is intended to present the relevant concepts in a specific manner.

[0058] Furthermore, "at least one" refers to one or more, while "more than one" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can mean: A alone, A and B simultaneously, or B alone, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, and c can mean: a, or b, or c, or a and b, or a and c, or b and c, or a, b, and c, where a, b, and c can be single or multiple.

[0059] It should be noted that, in the embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0060] Integrated charging and discharging equipment, with multiple charging and discharging bays built-in, enables simultaneous charging and discharging management of multiple battery packs. It is widely used in energy storage power stations, new energy battery capacity testing and formation production equipment, and other scenarios. During charging and discharging, the power devices on the power supply board and the batteries within the bays generate a significant amount of heat. Inadequate heat dissipation design can lead to excessively high local temperatures and uneven temperatures between bays, consequently affecting the operational stability, lifespan, and charging / discharging efficiency of the equipment. Therefore, improving the accuracy and efficiency of heat dissipation simulation is a pressing issue that needs to be addressed.

[0061] In view of this, this application proposes a heat dissipation simulation method for a charging and discharging device. The charging and discharging device includes an air duct, a power supply board, and multiple charging and discharging bays. The air duct includes an air duct body, a guide plate, and a heat insulation layer. The power supply board includes multiple power devices and a printed circuit board (PCB). The charging and discharging bays include a battery pack, a bay frame, and a heat dissipation channel. The battery pack is mounted on the bay frame. The method includes: acquiring an air duct model, a power supply board model, a single bay model, and a multi-bay integrated model. The air duct model is used to simulate the air duct, the power supply board model is used to simulate the power supply board, and the single bay model is used to simulate the heat dissipation of the charging and discharging device. A multi-location integrated model is used to simulate the charging and discharging equipment, consisting of multiple single-location models, power supply board models, and airflow models. Simulations are performed on the airflow model, power supply board model, and single-location model to obtain target airflow structure parameters, target power supply board heat dissipation parameters, and target single-location heat dissipation parameters. Based on these parameters and the multi-location integrated model, the target heat dissipation design parameters for the charging and discharging equipment are determined. This technical solution, by independently acquiring and simulating multi-level models such as airflow, power supply board, and single-location, can accurately optimize the target airflow structure parameters, power supply board heat dissipation parameters, and target single-location heat dissipation parameters for each charging and discharging location. These optimized parameters are then integrated into a complete multi-location integrated model for overall verification, yielding the target heat dissipation design parameters for the charging and discharging equipment. This systematizes the heat dissipation design of the charging and discharging equipment, effectively improving simulation accuracy and design efficiency, and ensuring reliable heat dissipation and stable operation of the equipment.

[0062] Exemplary examples are provided below to briefly describe the charging and discharging device mentioned in the embodiments of this application. A schematic diagram of the charging and discharging device is shown below. Figure 1 As shown.

[0063] For example, the charging and discharging device 100 includes an air duct 101, a power supply board 102, and multiple charging and discharging bays 103.

[0064] The system includes: the air duct body, the air guide plate and the insulation layer; the power supply board includes multiple power devices and a printed circuit board (PCB); the charging and discharging bay includes a battery pack, a bay frame and a heat dissipation channel, with the battery pack mounted on the bay frame.

[0065] For example, the charging and discharging equipment can be a formation equipment, which is a key process equipment on the lithium battery production line used to activate the battery. It can perform precise control of the first charge (and partial discharge) of the assembled unactivated cell, so that the positive and negative electrode materials inside the battery form a stable electrochemical interface, especially the solid electrolyte interphase (SEI) film on the surface of the negative electrode.

[0066] Having understood the structure of the charging and discharging device proposed in the embodiments of this application, we will now describe in detail the execution steps of the heat dissipation simulation method for the charging and discharging device proposed in the embodiments of this application, such as... Figure 2 As shown.

[0067] Step 201: Obtain the air duct model, power supply board model, single storage location model, and multi-storage location integrated model. The air duct model is used to simulate the air duct, the power supply board model is used to simulate the power supply board, the single storage location model is used to simulate one of the multiple charging and discharging storage locations, and the multi-storage location integrated model is used to simulate the charging and discharging equipment. It is formed by assembling multiple single storage location models, power supply board models, and air duct models.

[0068] Based on the actual structural parameters of the charging and discharging equipment, a model library containing four types of core simulation models is constructed to provide basic model support for hierarchical simulation. The model library includes air duct models, power supply board models, single storage location models, and multi-storage location integrated models.

[0069] The duct model was created using SolidWorks to establish a 3D geometric model based on the actual dimensions of the main and exhaust ducts (including inlets, outlets, guide structures, and branch ducts). This ensured the model fully reproduced the spatial layout and structural details of the duct system, such as the central main channel, side guide vanes, branch interfaces, and end fan mounting positions. After establishing the duct model, to discretize the continuous geometric space into a finite number of tiny units (i.e., "mesh"), and thus numerically simulate the physical processes such as airflow, heat transfer, and pressure drop distribution within the duct in a computer, the model was imported into Ansys Icepak software for mesh generation. For example, the mesh size can be controlled between 20-50 mm. Simultaneously, the mesh was refined for key areas of the duct, such as branch duct interfaces and areas near guide vanes, to improve the calculation accuracy in these high-gradient areas (such as areas with drastic changes in velocity, pressure, or temperature fields). This allowed for more accurate capture of airflow disturbances and heat transfer characteristics, ultimately constructing a numerical model that balances geometric realism, mesh rationality, and simulation reliability, providing a solid foundation for subsequent duct performance evaluation and optimization design.

[0070] In the thermal simulation modeling of the power supply board, key parameters need to be extracted from the actual PCB design documents, including PCB board dimensions, power device layout, copper foil thickness and trace layout, and the size of heat dissipation pads for critical high-power components. Based on these parameters, a 3D model containing detailed PCB structure and component geometry is built in Ansys Icepak or a corresponding thermal simulation software. The power consumption values ​​of the power devices are not theoretical estimates, but are directly assigned based on measured temperature rise and power consumption data of the device under actual operating conditions, such as rated load, maximum load, and specific ambient temperature. Ultimately, the power supply board model accurately reflects the heat generation and heat transfer path of the board under operating conditions, providing an accurate basis for thermal simulation.

[0071] The single-location model requires the 3D construction of a single storage unit, taking into account the actual structural dimensions of the charging / discharging storage unit, the arrangement and placement of the internal batteries, and the specific connection relationship between the storage unit and the main / branch air ducts. The core structure of this model includes: the battery pack, the storage unit frame (i.e., structural components supporting and housing the batteries, such as cabinets, partitions, and mounting rails), and the heat dissipation channels (i.e., the airflow path within the storage unit, such as battery gap ducts, inlet and outlet vents, and airflow guiding structures). This single-location model is used to accurately simulate the distribution of airflow within the storage unit, the heat dissipation of the batteries, and the cooling efficiency of the entire air-cooling system.

[0072] The multi-storage integrated model aims to simulate the thermal-fluid coupling state of the entire charging and discharging equipment under real-world operating conditions. Its construction process is as follows: First, based on the overall mechanical structure of the charging and discharging equipment (such as cabinet layout and installation space), the multiple single-storage models, power supply board models (including heat-generating components), and air duct models (including airflow guiding structures) established in the previous steps are assembled in three-dimensional space. This ensures the physical connection relationships between each component, such as the connection between the air duct outlet and the storage unit inlet, and that the installation position of the power supply board in the cabinet is completely consistent with the actual product. To balance computational accuracy and solution efficiency, for non-critical heat dissipation paths or structurally complex small components (such as screws, wire harnesses, and non-heat-generating structural parts), equivalent thermal resistance networks can be used for simplification. This significantly reduces the number of meshes while retaining the core heat transfer paths, ultimately forming the multi-storage integrated simulation model.

[0073] Step 202: Simulate the air duct model, power supply board model, and single storage location model respectively to obtain the target air duct structure parameters, the target power supply board heat dissipation parameters, and the target single storage location heat dissipation parameters.

[0074] Independent simulations were performed on the duct model, focusing on airflow characteristics, and the duct structure parameters were optimized to obtain the target duct structure parameters.

[0075] Independent heat dissipation simulation is performed on the power supply board to optimize its heat dissipation parameters and obtain the target heat dissipation parameters for the power supply board.

[0076] The charging and discharging storage locations were simulated, and the heat dissipation parameters of a single storage location were optimized to obtain the target heat dissipation parameters of a single storage location.

[0077] For example, the target air duct structure parameters include at least one of the following: the size of the air inlet of the air duct, the size of the air outlet, the angle of the guide plate, the diameter of the branch air ducts of the air duct, and the length of the air duct; and / or, the target power supply board heat dissipation parameters include at least one of the following: the layout of the multiple power devices, the area of ​​the heat dissipation pads, the copper foil thickness of the PCB, and the thermal conductivity of the thermal paste of the power devices and the PCB; and / or, the target single-slot heat dissipation parameters include at least one of the following: the spacing between the batteries in the battery pack, the width of the heat dissipation channel, the connection method between the charging / discharging slot and the air duct, and the thermal conductivity of the batteries in the battery pack and the slot frame; and / or, the target multi-slot coordination parameters include at least one of the following: the connection angle between each charging / discharging slot and the air duct, the relative position of the power supply board and the charging / discharging slot, the airflow distribution ratio of the branch air ducts, and the matching relationship between the air velocity of the air inlet and the heat generation power of each charging / discharging slot.

[0078] Step 203: Determine the target heat dissipation design parameters of the charging and discharging equipment based on the target air duct structure parameters, target power supply board heat dissipation parameters, target single storage location heat dissipation parameters, and multi-storage location integrated model.

[0079] In step 202, the target air duct structure parameters, the target power board heat dissipation parameters, and the target single-slot heat dissipation parameters of the charging and discharging storage space were obtained.

[0080] The purpose of step 203 is to integrate the optimized parameters of each sub-model obtained from the hierarchical simulation in step 202 into the complete multi-storage integrated model. Subsequently, coupled simulations are performed on this multi-storage integrated model to evaluate the overall heat dissipation performance of the entire charging and discharging device under real-world operating conditions. Finally, based on the simulation results of the multi-storage integrated model, the target heat dissipation design parameters are determined.

[0081] The above technical solution, by independently acquiring and simulating multi-level models such as air ducts, power supply boards, and single storage locations, can accurately optimize the target air duct structure parameters, the target power supply board heat dissipation parameters, and the target single storage location heat dissipation parameters. These optimized parameters are then integrated into a complete multi-storage integrated model for overall verification, resulting in the target heat dissipation design parameters for the charging and discharging equipment. This enables a systematic simulation of the heat dissipation design of the charging and discharging equipment, effectively improving simulation accuracy and design efficiency, and ensuring reliable heat dissipation and stable operation of the charging and discharging equipment.

[0082] The following embodiments detail the process of simulating the air duct model, power supply board model, and single storage location model in this application, so as to obtain the target air duct structure parameters, the target power supply board heat dissipation parameters, and the target single storage location heat dissipation parameters of the charging and discharging storage location.

[0083] (a) Simulate the duct model to obtain the target duct structure parameters. For example, the duct structure model is as follows: Figure 3 As shown. The duct structure model includes: a main duct exhaust port 301, an exhaust fan 302, and branch ducts 303 in the duct body. At least a portion of the inner wall of the duct is provided with an insulation layer (not shown in the figure) and / or at least a portion of the outer wall of the duct is provided with an insulation layer; a guide plate (not shown in the figure).

[0084] Simulation of the air duct model yields the target air duct structural parameters, including:

[0085] Obtain the third heat dissipation boundary condition of the air duct model, and simulate the air duct model under the third heat dissipation boundary condition to obtain the target air duct structure parameters.

[0086] For example, the setting of the third heat dissipation boundary condition includes: the air inlet is set as a velocity inlet or set using the fan pq curve (the initial air velocity can be calculated based on the design rated air volume), the air outlet is set as a pressure outlet (atmospheric pressure), and the duct wall is set as a non-slip boundary, ignoring the influence of gravity. Here, the pq curve refers to the curve of air pressure and air volume.

[0087] Setting the air inlet as a velocity inlet typically means directly specifying a uniform inlet velocity value, the initial value of which can be estimated by dividing the design rated air volume by the inlet cross-sectional area. A more precise engineering approach is to use the fan's pq curve (i.e., the air pressure-air volume performance curve). This is designed to more realistically simulate the operating characteristics of an actual fan. Fans do not provide a constant air velocity; their air volume is dynamically related to the system resistance (i.e., duct pressure drop), and the pq curve describes this relationship. After setting this curve in the software, the simulation will automatically match the corresponding fan operating point (i.e., actual air volume and air pressure) on the curve based on the calculated system resistance, thus forming a closed-loop, physically accurate coupled solution.

[0088] For example, the air outlet is typically set as a pressure outlet and given a reference static pressure value, such as atmospheric pressure, i.e., a gauge pressure of 0 Pa. This means that airflow can flow freely at this boundary, and the static pressure remains constant. The duct wall is set as a no-slip boundary condition, assuming that the fluid velocity against the wall is zero, to simulate the interaction between a real viscous fluid and a solid wall. Furthermore, since the air velocity inside the duct is usually low and the temperature difference is small, the buoyancy effect is negligible, and therefore the influence of gravity is often ignored to simplify the model and improve computational efficiency. In summary, the above third heat dissipation boundary condition together constitutes a closed, solvable physical model of the fluid system.

[0089] Under the aforementioned third heat dissipation boundary condition, single-parameter simulations were performed on the duct structure parameters to analyze the impact of each parameter on the airflow velocity distribution, pressure loss, and airflow uniformity within the duct. The duct structure parameters include at least one of the following: inlet size, outlet size, guide vane angle, branch duct diameter, and duct length. Each duct structure parameter corresponds to at least one value. Single-parameter simulations were performed using the controlled variable method, fixing the value of one duct structure parameter while varying the values ​​of other duct structure parameters to obtain multiple sets of parameter values ​​corresponding to multiple simulation processes.

[0090] Next, the duct structure parameters are optimized. From multiple sets of parameter values ​​corresponding to multiple simulation processes, a set of parameter values ​​is determined as the target multi-location coordination parameters to obtain the target duct structure parameters. For example, parameter optimization can aim for branch duct airflow uniformity ≥80% and total duct pressure loss ≤100Pa. The target duct structure parameters are determined through simulation results, and the optimized duct model is output.

[0091] For example, if there are multiple duct structure parameters that meet the above objectives, the set of values ​​with the lowest cost can be selected as the target duct structure parameters based on the cost of the structure corresponding to each set of duct structure parameters.

[0092] (ii) Simulate the power supply board model to obtain the target power supply board heat dissipation parameters.

[0093] For example, the structural diagram of the power supply board model is as follows: Figure 4 As shown, it includes: exhaust fan 302, module (a sub-circuit containing multiple circuit elements) and components (components refer to electronic components mounted on the PCB board, including power devices).

[0094] Simulation of the power supply board model yields the target power supply board heat dissipation parameters, including:

[0095] Obtain the fourth heat dissipation boundary condition of the power supply board model. Under the fourth heat dissipation boundary condition, simulate the power supply board model to obtain the target heat dissipation parameters of the power supply board.

[0096] For example, the setting of the fourth heat dissipation boundary condition includes: setting the convective heat transfer boundary condition of the power supply board, setting the heat generation power of the power device according to the actual operating conditions (assigning values ​​for charging and discharging states respectively), and setting the ambient temperature to the required initial ambient temperature.

[0097] The convection heat transfer boundary condition defines the heat transfer intensity between the air and the board surface. This is typically achieved by specifying a convection heat transfer coefficient, the value of which can be determined based on the board's actual installation location in the equipment, such as whether it's located within an air duct, the wind speed, calculated using empirical formulas, or by referring to experimental data from similar scenarios. Secondly, to accurately reflect the power board's operating state, a heating power setting needs to be assigned to the power devices on the board. This power value should be based on actual operating condition test data, and should consider both charging and discharging states separately, assigning values ​​according to the corresponding test values ​​to simulate real-world heating scenarios. Finally, an initial ambient temperature is set. This temperature is usually determined based on product specifications or design requirements (such as the maximum operating ambient temperature) and serves as the air reference temperature for simulation calculations. All convection heat transfer is based on this temperature and environment. By coordinating these three boundary conditions, an independent simulation environment can be constructed that can effectively evaluate the board's heat dissipation performance under different operating conditions.

[0098] Under the aforementioned fourth heat dissipation boundary condition, single-parameter simulations are performed on the heat dissipation parameters of the power supply board to analyze the influence of each parameter on the maximum temperature of the board and the temperature distribution of the components. The heat dissipation parameters of the power supply board include at least one of the following: power device layout, heat dissipation pad area, PCB copper foil thickness, and thermal conductivity of the thermal paste between the components and the PCB. Each heat dissipation parameter of the power supply board corresponds to at least one value. Single-parameter simulations can be performed using the controlled variable method, fixing the value of one heat dissipation parameter while varying the values ​​of the other heat dissipation parameters to obtain multiple sets of values ​​for the heat dissipation parameters of the power supply board.

[0099] Next, the heat dissipation parameters of the power supply board are optimized. From multiple sets of parameter values ​​corresponding to various simulation processes, a set of parameter values ​​is determined as the target power supply board parameters, thus obtaining the target power supply board heat dissipation parameters. For example, the target heat dissipation parameters can be determined with the highest temperature of the power supply board components being ≤85℃, and the optimized power supply board model is output.

[0100] (III) Simulate the single storage location model to obtain the target single storage location heat dissipation parameters for the charging and discharging storage location.

[0101] Example: A schematic diagram of a single storage location model Figure 5 As shown, it includes: storage unit frame 501, module part (the power supply board in the storage unit refers to the module part); probe, negative pressure, temperature probe assembly and cell part. The cell part is the core energy storage unit of the battery pack. In addition, a single storage unit also includes heat dissipation channel (not shown in the figure).

[0102] In this embodiment, such as Figure 6 As shown, the determination of the target single-storage location heat dissipation parameters includes:

[0103] Step 601: Obtain the second heat dissipation boundary conditions for the single-storage model.

[0104] For example, the second heat dissipation boundary conditions include airflow parameters from the target airflow structure parameters, such as: the outlet size and branch airflow diameter serving as the air inlet and outlet boundaries of the storage location; the battery pack's heat generation power being set based on charge-discharge test data to reflect the actual heat load; and the storage location wall being set as a convective heat transfer boundary to simulate natural convective heat dissipation between the storage unit and the surrounding ambient air. This series of settings collectively constructs a comprehensive simulation environment coupling internal air cooling, battery heating, single-board heat dissipation, and external heat exchange, used to evaluate the overall heat dissipation efficiency of a single storage location.

[0105] Step 602: Under the second heat dissipation boundary condition, simulate the single-storage model based on the heat dissipation parameters of the target power supply board to obtain the target single-storage heat dissipation parameters of the charging and discharging storage location.

[0106] Under the second heat dissipation boundary condition, the power supply board structure is assembled into the single storage location model, and the power supply board model is coupled with the single storage location model. The single storage location model is then simulated to obtain the target single storage location heat dissipation parameters for the charging and discharging storage location.

[0107] The couplings mentioned here, besides structural assembly, also include thermal coupling, flow field coupling, and structural coupling. Thermal coupling focuses on the conduction, convection, and radiation of heat generated during component operation within the system, and the resulting temperature field distribution—a core factor affecting component lifespan and system thermal stability. Flow field coupling primarily describes the flow state of cooling airflow driven by the cooling fan between complex air ducts and storage structures; its pressure and velocity distribution directly affect heat dissipation efficiency and closely interact with the thermal coupling process. Structural coupling reflects the minute deformations, stresses, or vibrations that components (such as boards, connectors, and structural parts) may experience under the aforementioned thermal loads and fluid forces. These mechanical responses, in turn, may alter channel clearances or contact thermal resistance, thus affecting the flow and thermal fields. These three types of coupling interact and are mutually causal.

[0108] Under the second heat dissipation boundary condition, a single storage location model is simulated to analyze the influence of various parameters on the battery temperature distribution within the storage location and the temperature difference between the inlet and outlet of the storage location. For example, the heat dissipation parameters of a single storage location include at least one of the following: battery placement spacing, width of the heat dissipation channel in the charging and discharging storage location, connection method between the charging and discharging storage location and the air duct, and thermal conductivity of the battery and the storage location frame.

[0109] Next, the heat dissipation parameters of a single storage location are optimized to obtain the target heat dissipation parameters for that location. For example, the parameter optimization can be aimed at achieving a maximum battery temperature rise of ≤15℃, a battery temperature range of ≤5℃, and an ambient temperature difference of ≤5℃. The target heat dissipation parameters for a single storage location are determined through simulation results, and the optimized single storage location model is output.

[0110] The above technical solution simulates a single storage location model that integrates an optimized power supply board model to determine target single storage location heat dissipation parameters such as battery spacing and heat dissipation channel width, thereby ensuring that the heat dissipation performance of a single storage location reaches the optimal level in an independent state.

[0111] The above embodiments are layered simulations of each component. The target parameters obtained from the simulation are considered to be optimized by simulating parameters such as air duct size, single board power, and storage location layout separately, ignoring the mutual influence between parameters. The optimized parameter combination may have the problem of "local optimum and overall suboptimal". Therefore, the following embodiments introduce how to obtain the target multi-storage location coordination parameters between the components of the multi-storage location through a multi-storage location integrated model based on the target parameters obtained above, so as to realize systematic simulation and obtain the target heat dissipation design parameters of the charging and discharging equipment.

[0112] In some possible embodiments, the target heat dissipation design parameters of the charging and discharging equipment are determined based on the target air duct structure parameters, the target power supply board heat dissipation parameters, the target single-storage location heat dissipation parameters, and the multi-storage location integrated model, such as... Figure 7 As shown, it includes:

[0113] Step 701: Simulate the multi-storage integrated model based on the target air duct structure parameters, target power supply board heat dissipation parameters, and target single-storage heat dissipation parameters to obtain the target multi-storage coordination parameters of the charging and discharging equipment. The multi-storage coordination parameters are used to characterize the coupling relationship between the air duct, power supply board, and various components in multiple charging and discharging storage locations.

[0114] In order to cover all dimensions from components to the system and fully consider the thermal coupling relationship between components, the target parameters obtained from the above layered simulation are input into the multi-storage integrated model, so as to simulate the multi-storage coordination parameters between components in the multi-storage system.

[0115] The multi-storage location coordination parameter is a parameter used to characterize the coupling relationship between various components in the air duct, power supply board, and multiple charging / discharging storage locations.

[0116] In the simulation of the multi-storage integrated model, the multi-storage coordination parameters are design variables used to accurately characterize and control the complex physical coupling relationships between the air ducts, power supply boards, multiple charging and discharging storage locations, and their internal components. This coupling relationship is essentially a typical multi-physics coupling, including thermal coupling, flow field coupling, and structural coupling. Thermal coupling, flow field coupling, and structural coupling have already been described in detail above and will not be repeated here.

[0117] At the fluid level, the structure and pressure distribution of the air duct determine the flow rate and velocity of the cooling air flowing to each storage location. The arrangement and resistance of multiple storage locations and their internal components (battery packs, single boards) in turn affect the overall flow field and pressure drop distribution of the air duct, forming a closed-loop fluid network coupling. At the heat transfer level, the heat generated by the power devices on the power supply single board and the heat generated by the battery during charging and discharging are transferred to the flowing air through solid conduction, contact thermal resistance, and convection heat transfer. After the temperature of the heated air increases, its cooling capacity decreases, which in turn affects the heat dissipation of downstream storage locations and components, forming a two-way coupling between the flow field and the temperature field. At the structural level, the thermal expansion of components due to uneven temperature may change the contact thermal resistance or even fine-tune the flow gap, while the flow pressure may also cause micro-deformation of the structure. All of these fall under the category of fluid-structure interaction. Therefore, multi-storage location coordination parameters, such as the opening ratio of air inlets in each storage location, the speed ratio of fans in different areas, and the airflow layout between modules, are precisely for the purpose of actively managing and optimizing this coupling effect across components and physical fields. The aim is to achieve dynamic balance of airflow distribution, uniform distribution of heat load, and consistency of the final temperature field within the entire system, thereby ensuring that the heat dissipation efficiency and operational reliability of the charging and discharging equipment reach the global optimum.

[0118] Step 702: Input various parameters, including target air duct structure parameters, target power supply board heat dissipation parameters, target single storage location heat dissipation parameters, and target multi-storage location coordination parameters, into the multi-storage location integrated model, and perform verification simulation on the multi-storage location integrated model to obtain the target heat dissipation design parameters.

[0119] After simulation of each model, various parameters that meet the design conditions are input into the multi-location integrated model for parameter verification. The parameters that meet the design requirements for each working condition are the target heat dissipation design parameters. If they do not meet the requirements, the parameters of the corresponding model are further adjusted until the target heat dissipation design parameters are obtained. This is described in detail in the following examples.

[0120] The above technical solution obtains the local optimal solutions for the target air duct structure parameters, the target power supply board heat dissipation parameters, and the target single storage location heat dissipation parameters, and then achieves the overall optimal solution through multi-storage location coordination parameter simulation, thus avoiding "local optimality and overall suboptimal" and improving the rationality of heat dissipation design.

[0121] The following examples illustrate the detailed steps for determining the target multi-storage location coordination parameters.

[0122] In some embodiments, such as Figure 8 As shown, Figure 8 The diagram shows the structure of the multi-storage integrated model, including: air ducts, including a centralized heat exhaust duct 801 and air ducts 802 for each storage location, a centralized heat exhaust duct in the middle of two symmetrical single storage locations, a power supply board (not shown in the figure), and a charging / discharging storage location 803.

[0123] Simulations were performed on a multi-storage integrated model based on target air duct structure parameters, target power supply board heat dissipation parameters, and target single-storage heat dissipation parameters to obtain the target multi-storage coordination parameters of the charging and discharging equipment, such as... Figure 9 As shown, it includes:

[0124] Step 901: Obtain the first heat dissipation boundary conditions of the multi-location integrated model.

[0125] For example, the setting of the first heat dissipation boundary condition includes: the inlet air velocity is set according to the target air duct structure parameters determined by the independent optimization of the air duct model, such as the target air velocity and flow field distribution at the branch air duct outlet, to simulate the actual cooling airflow from the main air duct; the outlet is set as a pressure outlet, usually given as atmospheric pressure, allowing airflow to flow freely. Regarding the heat source, the heat generation power of the power supply board and battery pack is not simply superimposed according to their respective maximum power, but is comprehensively set based on typical operating conditions of multiple storage locations working simultaneously, such as test data under balanced charging and discharging states, to reflect the actual power distribution and heat load during system-level operation. The initial value of the ambient temperature of the entire simulation domain is set to the initial ambient temperature required by the product specifications. Furthermore, to accurately simulate the heat conduction path in the assembly, the contact thermal resistance between components, such as between the battery and the bracket, and between the board and the mounting surface, needs to be assigned values ​​based on actual test data of material properties, surface treatment, and fastening pressure.

[0126] Step 902: Under the first heat dissipation boundary condition, the multi-storage integrated model is simulated based on the target air duct structure parameters, the target power supply board heat dissipation parameters, and the target single-storage heat dissipation parameters to obtain the target multi-storage coordination parameters of the charging and discharging equipment.

[0127] Under the first heat dissipation boundary condition, the multi-warehouse integrated model is simulated based on the target airflow structure parameters, target power supply board heat dissipation parameters, and target single-warehouse-location heat dissipation parameters. The focus is on analyzing the thermal coupling relationship between the components, optimizing the multi-warehouse-location coordination parameters, and obtaining the target multi-warehouse-location coordination parameters. The multi-warehouse-location model here is obtained by assembling the airflow model, power supply board model, and single-warehouse-location model.

[0128] Among them, the multi-storage location coordination parameters include at least one of the following: the connection angle between each charging / discharging storage location and the air duct, the relative position of the power supply board and the charging / discharging storage location, the air volume distribution ratio of the branch air duct, and the matching relationship between the air velocity at the air inlet and the heating power of each charging / discharging storage location.

[0129] Simulations were performed on the multi-storage integrated model to analyze the impact of various multi-storage coordination parameters on the temperature uniformity of the multi-storage locations, the maximum system temperature, and the overall heat dissipation efficiency.

[0130] Next, the coordination parameters of the multi-storage locations are optimized. For example, the target parameters can be "the maximum temperature difference between batteries in multiple storage locations is ≤5℃, the maximum temperature rise in the environment is ≤5℃, the maximum temperature difference in the environment is ≤5℃, and the overall heat dissipation efficiency is ≥85%". Through range analysis and variance analysis, the target multi-storage location coordination parameters are determined, and the optimized multi-storage location integrated model is output.

[0131] The detailed steps for determining the target multi-storage location coordination parameters and outputting the optimized multi-storage location integrated model through range analysis and variance analysis are as follows:

[0132] 1) Through range analysis, preliminary screening was conducted to identify multi-storage location coordination parameters that significantly affect multiple indicators such as "maximum temperature difference between batteries in multiple storage locations ≤ 5℃, maximum ambient temperature rise ≤ 5℃, maximum ambient temperature difference ≤ 5℃, and overall heat dissipation efficiency ≥ 85%".

[0133] 2) Use analysis of variance to verify the statistical significance of the influence of these factors and quantify their contribution.

[0134] 3) For each key factor, select the optimal level that makes all its indicators change towards the optimization goal (e.g., minimum temperature difference, maximum efficiency). The optimal combination of all key coordination parameters constitutes the target multi-storage location coordination parameters. Finally, substituting these parameters into the multi-storage location integrated model yields the optimized multi-storage location integrated model.

[0135] The above technical solution, based on the target air duct structure parameters, target power supply board heat dissipation parameters, and target single-storage heat dissipation parameters, only needs to optimize the coordination parameters between each component to obtain the target multi-storage coordination parameters that conform to the multi-storage heat dissipation design. It not only considers the coupling relationship within the multi-storage, but also reduces the problem of high simulation model complexity and large computational load caused by directly simulating the simulation parameters of the multi-storage integrated model. It further improves the simulation accuracy and simulation efficiency.

[0136] The following examples detail how the multi-library integration model is simulated.

[0137] In some embodiments, under the first heat dissipation boundary condition, the multi-storage integrated model is simulated based on the target air duct structure parameters, the target power supply board heat dissipation parameters, and the target single-storage heat dissipation parameters to obtain the target multi-storage coordination parameters of the charging and discharging equipment, such as... Figure 10 As shown, it includes:

[0138] Step 1001: Under the first heat dissipation boundary condition, perform multiple simulations on the multi-storage integrated model based on the target air duct structure parameters, the target power supply board heat dissipation parameters, and the target single-storage location heat dissipation parameters to obtain multiple sets of parameter values ​​corresponding to the multiple simulation processes.

[0139] For example, the multi-storage location coordination parameters include at least one of the following: the connection angle between each charging / discharging storage location and the air duct; the relative position of the power supply board and the charging / discharging storage location; the airflow distribution ratio of the branch air duct; and the matching relationship between the airflow velocity at the air inlet and the heating power of each charging / discharging storage location. Each multi-storage location coordination parameter corresponds to multiple values, and there can be multiple sets of combinations of different values ​​for multiple coordination parameters.

[0140] For example, orthogonal experimental design can be used to design coordination parameter combinations. For instance, each multi-storage location coordination parameter corresponds to three values; taking four multi-storage location coordination parameters as an example, there are a total of nine coordination parameter combinations. Multi-storage location integrated simulations are then performed on each of the nine coordination parameter combinations.

[0141] For example, the method of controlling variables can also be used for combination.

[0142] Step 1002: Determine a set of parameter values ​​from the multiple sets of parameter values ​​corresponding to the multiple simulation processes as the target multi-storage location coordination parameters.

[0143] The multiple sets of simulations obtained above correspond to multiple sets of parameter values. From these, a set of parameter values ​​that meet the design conditions for multiple storage locations is obtained as the target multi-storage location coordination parameters.

[0144] In detail, after combining the coordination parameters of multiple storage locations, each simulation process in the multi-storage location integrated simulation includes:

[0145] Using the target value of any parameter among the multi-storage location coordination parameters as the quantifier and other parameters as variables, the multi-storage location integrated model is simulated at least once until the simulation results of the multi-storage location integrated model meet the multi-storage location design conditions, thus obtaining a set of parameter values ​​for the multi-storage location coordination parameters that meet the multi-storage location design conditions.

[0146] For example, if any parameter can take the same number of target values, such as each multi-storage location coordination parameter having three values, and each value is selected the same number of times during the combination process, such as three times, then there are 9 combinations.

[0147] In other words, based on the determined multi-location coordination parameters and all values ​​corresponding to each multi-location coordination parameter, an appropriate orthogonal array, such as the L9(3^4) table, is selected. Orthogonal arrays can scientifically select a small subset of representative combinations from all possible parameter combinations (full factorial experiments) for simulation in a balanced, distributed, and comparable manner. For example, with four factors, each with three levels, only nine simulations are needed using an orthogonal array.

[0148] For each set of parameters (e.g., Group 1: A1, B1, C1, D1; Group 2: A2, B1, C2, D3...), perform a simulation calculation in the multi-storage location integrated model. Record the results indicators corresponding to each simulation. Continue until the simulation results of the multi-storage location integrated model meet the multi-storage location design conditions, obtaining a set of parameter values ​​for the multi-storage location coordination parameters that meet the multi-storage location design conditions. The multi-storage location design conditions can be defined with the following objectives: "maximum battery temperature difference between multiple storage locations ≤ 5℃, maximum ambient temperature rise ≤ 5℃, maximum ambient temperature difference ≤ 5℃, overall heat dissipation efficiency ≥ 85%".

[0149] For example, if there are multiple sets that meet the design conditions for multiple storage locations, an optimal target multi-storage location coordination parameter can be selected through range analysis and method analysis.

[0150] The above technical solution adopts the orthogonal experimental design method to design the simulation parameter combination, which reduces the number of simulations and further improves the simulation efficiency.

[0151] The following examples detail how to systematically verify various parameters obtained through a multi-location integrated model to determine the target heat dissipation design parameters for charging and discharging equipment.

[0152] In some embodiments, multiple parameters, including target air duct structure parameters, target power supply board heat dissipation parameters, target single-storage location heat dissipation parameters, and target multi-storage location coordination parameters, are input into a multi-storage location integrated model. The multi-storage location integrated model is then validated through simulation to obtain the target heat dissipation design parameters, such as... Figure 11 As shown, it includes:

[0153] Step 1101: Verify the multi-location integrated model under various working conditions and output the simulation results for each working condition. The simulation results include the sub-simulation results corresponding to various parameters.

[0154] To verify the performance of the various parameters obtained under different operating conditions of the charging and discharging equipment, the multi-location integrated model was verified and simulated under different operating conditions to obtain the simulation results for each operating condition.

[0155] Each operating condition includes at least four typical operating conditions: rated charging and discharging, peak charging and discharging, partial storage location operation, and full storage location operation of the charging and discharging equipment.

[0156] For example, under the rated charge and discharge conditions of the charging and discharging equipment, the simulation verifies whether various parameters meet the design requirements. These parameters include target air duct structure parameters, target power supply board heat dissipation parameters, target single-storage heat dissipation parameters, and target multi-storage coordination parameters. The simulation results include sub-simulation results corresponding to each parameter, with each parameter under one operating condition corresponding to one design requirement.

[0157] Step 1102: If the simulation results of each working condition meet the design requirements of each working condition, then the various parameters are determined as the target heat dissipation design parameters.

[0158] If the simulation results under each operating condition meet the corresponding design requirements, then the various parameters will be determined as the target heat dissipation design parameters.

[0159] The aforementioned technical solution integrates all independently and collaboratively optimized component parameters (air ducts, single boards, storage locations) and their coordination relationships into a unified integrated model. Through multi-condition simulation, it comprehensively verifies the collaborative working efficiency of each optimized subsystem under actual coupled conditions, and verifies its functional implementation under dynamic and complex working conditions, thereby improving the effectiveness of the verification. Secondly, by requiring all sub-simulation results (such as temperature, pressure drop, and efficiency at various points) under all working conditions to meet the design requirements, this method systematically evaluates the adaptability and margin of the design scheme within the entire working envelope, fundamentally avoiding the risk that the scheme is only effective at ideal points but fails under extreme working conditions, thus ensuring the thermal safety and operational reliability of the product.

[0160] In some embodiments, such as Figure 12 As shown, the method also includes:

[0161] Step 1201: If at least one sub-simulation result of any operating condition does not meet the corresponding design requirements, adjust the parameters of at least one model corresponding to at least one sub-simulation result to obtain the adjusted parameters of each model. At least one model includes at least one of the following: multi-storage location integrated model, air duct model, power supply board model, and single-storage location model.

[0162] If, under any operating condition, the sub-simulation result corresponding to a certain parameter does not meet the design requirements for that parameter, then the system returns to the model corresponding to that parameter for further adjustments.

[0163] For example, if the sub-simulation results corresponding to the multi-storage location coordinated heat dissipation parameters do not meet the design requirements, the system returns to the multi-storage location model for readjustment. If the sub-simulation results corresponding to the air duct structure parameters do not meet the corresponding design requirements, the system returns to the air duct model for parameter adjustment, such as adjusting the airflow angle, cross-sectional dimensions, etc. If the sub-simulation results corresponding to the power supply board heat dissipation parameters do not meet the corresponding design requirements, the system returns to the power supply board model to adjust the heat dissipation parameters of that power supply board, such as adjusting the fan speed, fin area, etc. If the sub-simulation results corresponding to the single-storage location heat dissipation parameters do not meet the corresponding design requirements, the system returns to the single-storage location model to adjust that parameter, such as adjusting the air duct matching parameters of the storage location, such as the inlet air velocity or sealing performance, etc.

[0164] For example, it is possible that some parameters in a model do not meet the design requirements, or that all parameters in at least one model do not meet the design requirements.

[0165] Step 1202: Input the adjusted parameters of at least one model and the parameters of the other models into the multi-storage integrated model, and perform verification simulation on the multi-storage integrated model to obtain the target heat dissipation design parameters.

[0166] If some parameters in a model do not meet the design requirements, the adjusted parameters of at least one model and the parameters of the other models are input into the multi-location integrated model. The multi-location integrated model is then verified and simulated to obtain the target heat dissipation design parameters.

[0167] For example, if the sub-simulation results corresponding to the heat dissipation parameters of a single storage location do not meet the corresponding design requirements, the parameter is adjusted in the single storage location model. After adjustment, the adjusted heat dissipation parameters of the single storage location and other parameters that meet the design requirements are input into the multi-storage location integrated model for verification simulation.

[0168] Step 1203: Input the adjusted parameters of at least one model into the multi-storage integrated model, and perform verification simulation on the multi-storage integrated model to obtain the target heat dissipation design parameters. The at least one model includes a multi-storage integrated model, an air duct model, a power supply board model, and a single-storage model.

[0169] If the parameters of all models in at least one model do not meet the design requirements, the adjusted parameters of all models are directly input into the multi-storage integrated model. The multi-storage integrated model is then verified and simulated until the simulation results of each working condition meet the design requirements of each working condition. Then, the multiple parameters are determined as the target heat dissipation design parameters.

[0170] The above technical solution can accurately pinpoint the root cause of performance bottlenecks when any sub-result under any operating condition fails to meet the requirements. That is, it can identify which model(s) (air duct, single board, single storage location, or multi-storage location integrated model itself) needs further adjustment of its design parameters. This makes subsequent adjustments no longer global trial and error, but targeted corrections. Furthermore, it allows parameter adjustments to one or more specific models that have been identified, while retaining the parameters of other models that have met the standards. This strategy of minimizing intervention greatly improves optimization efficiency and avoids unnecessary repeated simulation calculations. In addition, this process can be continuously iterated until all requirements of all operating conditions are met, thereby ensuring that the final determined target heat dissipation design parameters are not only optimal at the subsystem level, but also achieve robust, reliable, and globally convergent design goals under the coupled environment of the entire system operating conditions.

[0171] In some embodiments, such as Figure 13 As shown, Figure 13 This is a flowchart of the heat dissipation simulation proposed in the embodiments of this application.

[0172] Step 1301: Check if the air duct structure parameters meet the air duct design conditions; Step 1302: Adjust the air duct structure parameters; Step 1304: Check if the power supply board heat dissipation parameters meet the board design conditions; Step 1305: Adjust the power supply board heat dissipation parameters; Step 1306: Check if the single-warehouse location heat dissipation parameters meet the single-warehouse location design conditions; Step 1307: Adjust the single-warehouse location heat dissipation parameters; Step 1308: Check if the multi-warehouse location heat dissipation parameters meet the multi-warehouse location design conditions; Step 1309: Adjust the multi-warehouse location heat dissipation parameters; Step 1310: Verify and simulate multiple parameters using a multi-warehouse location integrated model; Step 1311: Check if multiple parameters meet the design requirements; Step 1312: Determine the target heat dissipation design parameters.

[0173] In this embodiment, the determination of target heat dissipation design parameters involves inputting the target airflow structure parameters, target power supply board parameters, target single-storage heat dissipation design parameters, and target multi-storage heat dissipation design parameters corresponding to each model into the multi-storage integrated model. Step 1310 is then executed, and the multi-storage integrated model is used to verify and simulate various parameters. Under various operating conditions, if all parameters meet the design requirements, step 1312 is executed: the various parameters are determined as target heat dissipation design parameters. Under any operating condition, if there are parameters that do not meet the design requirements, the model corresponding to the parameter that does not meet the requirements is returned, and the simulation is performed again to adjust the corresponding parameters until the design requirements are met.

[0174] For example, if the parameters that do not meet the design requirements are the air duct structure parameters, return to A, the air duct model, and execute step 1301 to adjust the air duct structure parameters until they meet the design requirements, thereby obtaining the target heat dissipation design parameters.

[0175] It should be understood that some steps in this flowchart, as well as the implicit steps, have been discussed in detail above and will not be repeated here.

[0176] It should be understood that although the steps in the flowchart above are shown sequentially as indicated by the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowchart above may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the sub-steps or stages of other steps.

[0177] In some embodiments, such as Figure 14 As shown, a heat dissipation simulation device for a charging and discharging device is provided. The charging and discharging device includes an air duct, a power supply board, and multiple charging and discharging bays. The air duct includes an air duct body, a guide plate, and an insulation layer. The power supply board includes multiple power devices and a printed circuit board (PCB). The charging and discharging bays include battery packs, bay frames, and heat dissipation channels. The battery packs are mounted on the bay frames. The device includes: an acquisition module 1401, a simulation module 1402, and a determination module 1403, wherein:

[0178] The acquisition module 1401 is used to acquire the air duct model, power supply board model, single storage location model and multi-storage location integrated model. The air duct model is used to simulate the air duct, the power supply board model is used to simulate the power supply board, the single storage location model is used to simulate one of the multiple charging and discharging storage locations, and the multi-storage location integrated model is used to simulate the charging and discharging equipment. It is formed by assembling multiple single storage location models, power supply board models and air duct models.

[0179] Simulation module 1402 is used to simulate the air duct model, power supply board model, and single storage location model respectively, to obtain the target air duct structure parameters, the target power supply board heat dissipation parameters, and the target single storage location heat dissipation parameters.

[0180] The determination module 1403 is used to determine the target heat dissipation design parameters of the charging and discharging equipment based on the target air duct structure parameters, the target power supply board heat dissipation parameters, the target single storage location heat dissipation parameters, and the multi-storage location integrated model.

[0181] Further limitations on the heat dissipation simulation device for charging and discharging equipment can be found in the limitations on the heat dissipation simulation method for charging and discharging equipment mentioned above, and will not be repeated here. Each module in the aforementioned heat dissipation simulation device for charging and discharging equipment can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in the processor of the terminal device in hardware form or independent of it, or stored in the memory of the terminal device in software form, so that the processor can call and execute the operations corresponding to each module.

[0182] Another embodiment provides a computer-readable storage medium for storing a computer program. This computer program contains instructions for implementing the methods described in the embodiments of this application. By installing this computer program on a computer, the computer can execute the corresponding methods.

[0183] Another embodiment proposes a computer program product that includes computer program code. When this computer program code is run on a computer, it causes the computer to implement the methods proposed in the embodiments of this application. Thus, a user can implement these methods by using this computer program product.

[0184] In some embodiments, Figure 15 This is a schematic block diagram of the electronic device provided in the embodiments of this application.

[0185] Electronic device 1500 may include: a memory 1501 storing executable program code and a processor 1502 coupled to the memory 1501.

[0186] In this embodiment, processor 1502 calls executable program code stored in memory to execute any of the methods disclosed in the embodiments of this application. Those skilled in the art will understand that... Figure 15 The electronic device structure shown does not constitute a limitation on the electronic device. The electronic device may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0187] The processor 1502 is the control center of the electronic device. It connects various parts of the electronic device via various interfaces and lines, and performs various functions and processes data by running or executing software programs and / or modules stored in the memory, and by calling data stored in the memory, thereby providing overall monitoring of the electronic device. Optionally, the processor may include one or more processing units; preferably, the processor may integrate an application processor and a modem processor, wherein the application processor mainly handles the operating system, user interface, and applications, and the modem processor mainly handles wireless communication. It is understood that the modem processor may also not be integrated into the processor.

[0188] The memory 1501 can be used to store software programs and modules. The processor executes various functional applications and data processing of the electronic device by running the software programs and modules stored in the memory. The memory may mainly include a program storage area and a data storage area. The program storage area may store the operating system, at least one application program required for a function, etc.; the data storage area may store data created according to the use of the electronic device, etc. In addition, the memory may include high-speed random access memory, and may also include non-volatile memory, such as at least one disk storage device, flash memory device, or other volatile solid-state storage device.

[0189] It should be understood that, in the embodiments of this application, the processor may be a Central Processing Unit (CPU), or it may be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor may be a microprocessor or any conventional processor, etc.

[0190] In implementation, each step of the above method can be completed by integrated logic circuits in the processor's hardware or by instructions in software. The steps of the method disclosed in the embodiments of this application can be directly manifested as execution by a hardware processor, or as a combination of hardware and software modules within the processor. The software modules can reside in random access memory, flash memory, read-only memory, programmable read-only memory, electrically erasable programmable memory, registers, or other mature storage media in the art. This storage medium is located in memory, and the processor executes the instructions in the memory, combining them with its hardware to complete the steps of the above method. To avoid repetition, detailed descriptions are omitted here.

[0191] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the embodiments of this application.

[0192] Those skilled in the art will understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0193] In the embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative. For instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the displayed or discussed mutual couplings, direct couplings, or communication connections may be through some interfaces; indirect couplings or communication connections between devices or units may be electrical, mechanical, or other forms.

[0194] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0195] In addition, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0196] If the aforementioned function is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application embodiment, essentially, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of this application. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0197] The above description is merely a specific implementation of the embodiments of this application, but the protection scope of the embodiments of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the embodiments of this application should be included within the protection scope of the embodiments of this application. Therefore, the protection scope of the embodiments of this application should be determined by the protection scope of the claims.

Claims

1. A heat dissipation simulation method for a charging and discharging device, characterized in that, The charging and discharging equipment includes an air duct, a power supply board, and multiple charging and discharging bays. The air duct includes an air duct body, a guide plate, and an insulation layer. The power supply board includes multiple power devices and a printed circuit board (PCB). The charging and discharging bays include a battery pack, a bay frame, and a heat dissipation channel. The battery pack is mounted on the bay frame. The method includes: The system acquires a duct model, a power supply board model, a single storage location model, and a multi-storage location integrated model. The duct model is used to simulate the duct, the power supply board model is used to simulate the power supply board, the single storage location model is used to simulate one of the multiple charging / discharging storage locations, and the multi-storage location integrated model is used to simulate the charging / discharging equipment. The system is formed by assembling multiple single storage location models, power supply board models, and duct models. Simulations were performed on the air duct model, the power supply board model, and the single storage location model to obtain the target air duct structure parameters, the target power supply board heat dissipation parameters, and the target single storage location heat dissipation parameters. Based on the target air duct structure parameters, the target power supply board heat dissipation parameters, the target single storage location heat dissipation parameters, and the multi-storage location integrated model, determine the target heat dissipation design parameters of the charging and discharging equipment; The step of determining the target heat dissipation design parameters of the charging and discharging equipment based on the target air duct structure parameters, the target power supply board heat dissipation parameters, the target single-storage heat dissipation parameters, and the multi-storage integrated model includes: Based on the target air duct structure parameters, the target power supply board heat dissipation parameters, and the target single-storage heat dissipation parameters, the multi-storage integrated model is simulated to obtain the target multi-storage coordination parameters of the charging and discharging equipment. The multi-storage coordination parameters are parameters used to characterize the coupling relationship between the air duct, the power supply board, and the various components in the multiple charging and discharging storage locations. Multiple parameters, including the target air duct structure parameters, the target power supply board heat dissipation parameters, the target single-storage heat dissipation parameters, and the target multi-storage coordination parameters, are input into the multi-storage integrated model. The multi-storage integrated model is then verified and simulated to obtain the target heat dissipation design parameters.

2. The method of claim 1, wherein, The process involves inputting various parameters, including the target air duct structure parameters, the target power supply board heat dissipation parameters, the target single-storage location heat dissipation parameters, and the target multi-storage location coordination parameters, into the multi-storage location integrated model. The multi-storage location integrated model is then validated and simulated to obtain the target heat dissipation design parameters, including: The multi-location integrated model is verified and simulated under various working conditions, and the simulation results for each working condition are output. The simulation results include the sub-simulation results corresponding to each of the various parameters. If the simulation results of each operating condition meet the design requirements corresponding to each operating condition, then the various parameters are determined as the target heat dissipation design parameters.

3. The method of claim 2, wherein, The method further includes: If at least one sub-simulation result of any operating condition does not meet the corresponding design requirements, the parameters of at least one model corresponding to the at least one sub-simulation result are adjusted to obtain the adjusted parameters of each model. The at least one model includes at least one of the following: a multi-storage integrated model, the air duct model, the power supply board model, and the single-storage model. The adjusted parameters of at least one model and the parameters of models other than the at least one model are input into the multi-storage integrated model, and the multi-storage integrated model is verified by simulation to obtain the target heat dissipation design parameters; or, The adjusted parameters of the at least one model are input into the multi-storage integrated model, and the multi-storage integrated model is verified and simulated to obtain the target heat dissipation design parameters. The at least one model includes the multi-storage integrated model, the air duct model, the power supply board model, and the single-storage model.

4. The method of claim 1, wherein, The multi-storage integrated model is simulated based on the target air duct structure parameters, the target power supply board heat dissipation parameters, and the target single-storage heat dissipation parameters to obtain the target multi-storage coordination parameters of the charging and discharging equipment, including: Obtain the first heat dissipation boundary condition of the multi-location integrated model; Under the first heat dissipation boundary condition, the multi-storage integrated model is simulated based on the target air duct structure parameters, the target power supply board heat dissipation parameters, and the target single-storage heat dissipation parameters to obtain the target multi-storage coordination parameters of the charging and discharging equipment.

5. The method of claim 4, wherein, Under the first heat dissipation boundary condition, the multi-storage integrated model is simulated based on the target airflow structure parameters, the target power supply board heat dissipation parameters, and the target single-storage heat dissipation parameters to obtain the target multi-storage coordination parameters of the charging and discharging equipment, including: Under the first heat dissipation boundary condition, multiple sets of simulations are performed on the multi-storage integrated model based on the target air duct structure parameters, the target power supply board heat dissipation parameters, and the target single storage location heat dissipation parameters to obtain multiple sets of parameter values ​​corresponding to the multiple simulation processes. From multiple sets of parameter values ​​corresponding to multiple simulation processes, a set of parameter values ​​is determined as the target multi-storage location coordination parameter; Each simulation process includes: Using the target value of any parameter among the multi-storage location coordination parameters as a quantifier and other parameters as variables, the multi-storage location integrated model is simulated at least once until the simulation results of the multi-storage location integrated model meet the multi-storage location design conditions, thereby obtaining a set of parameter values ​​of the multi-storage location coordination parameters that meet the multi-storage location design conditions.

6. The method of claim 1, wherein, The process of determining the heat dissipation parameters of the target single storage location includes: Obtain the second heat dissipation boundary conditions of the single-storage location model; Under the second heat dissipation boundary condition, the single-storage model is simulated based on the heat dissipation parameters of the target power supply board to obtain the target single-storage heat dissipation parameters of the charging and discharging storage location.

7. The method according to any one of claims 1-6, characterized in that, The target air duct structural parameters include at least one of the following: the size of the air inlet of the air duct, the size of the air outlet, the angle of the guide plate, the diameter of the branch air ducts of the air duct, and the length of the air duct; and / or, The target power supply board heat dissipation parameters include at least one of the following: the layout of the plurality of power devices, the area of ​​the heat dissipation pads, the copper foil thickness of the PCB, and the thermal conductivity of the thermal paste used on the power devices and the PCB; and / or, The target single-slot heat dissipation parameters include at least one of the following: the spacing between the batteries in the battery pack, the width of the heat dissipation channel, the connection method between the charging / discharging slot and the air duct, and the thermal conductivity of the batteries in the battery pack and the slot frame; and / or, The target multi-storage coordination parameters of the charging and discharging equipment include at least one of the following: the connection angle between each charging and discharging storage location and the air duct; the relative position of the power supply board and the charging and discharging storage location; the air volume distribution ratio of the branch air duct; and the matching relationship between the air velocity at the air inlet and the heating power of each charging and discharging storage location.

8. A heat dissipation simulation device for charging and discharging equipment, characterized in that, The charging and discharging equipment includes an air duct, a power supply board, and multiple charging and discharging bays. The air duct includes an air duct body, a guide plate, and a heat insulation layer. The power supply board includes multiple power devices and a printed circuit board (PCB). Each charging and discharging bay includes a battery pack, a bay frame, and a heat dissipation channel. The battery pack is mounted on the bay frame. The device includes: The acquisition module is used to acquire the air duct model, the power supply board model, the single storage location model, and the multi-storage location integrated model. The air duct model is used to simulate the air duct, the power supply board model is used to simulate the power supply board, the single storage location model is used to simulate one of the multiple charging and discharging storage locations, and the multi-storage location integrated model is used to simulate the charging and discharging equipment. The model is formed by assembling multiple single storage location models, power supply board models, and air duct models. The simulation module is used to simulate the air duct model, the power supply board model, and the single storage location model respectively, to obtain the target air duct structure parameters, the target power supply board heat dissipation parameters, and the target single storage location heat dissipation parameters of the charging and discharging storage location. The determination module is used to determine the target heat dissipation design parameters of the charging and discharging equipment based on the target airflow structure parameters, the target power supply board heat dissipation parameters, the target single-storage heat dissipation parameters, and the multi-storage integrated model. The determination of the target heat dissipation design parameters of the charging and discharging equipment based on the target airflow structure parameters, the target power supply board heat dissipation parameters, the target single-storage heat dissipation parameters, and the multi-storage integrated model includes: simulating the multi-storage integrated model based on the target airflow structure parameters, the target power supply board heat dissipation parameters, and the target single-storage heat dissipation parameters to obtain the target multi-storage coordination parameters of the charging and discharging equipment. These multi-storage coordination parameters are parameters used to characterize the coupling relationship between the airflow, the power supply board, and the various components in the multiple charging and discharging compartments; and inputting multiple parameters, including the target airflow structure parameters, the target power supply board heat dissipation parameters, the target single-storage heat dissipation parameters, and the target multi-storage coordination parameters, into the multi-storage integrated model to perform verification simulations on the multi-storage integrated model to obtain the target heat dissipation design parameters.

9. An electronic device, characterized in that, It includes a processor and a memory, the memory storing a computer program, and the processor executing the computer program to implement the steps of the method according to any one of claims 1-7.

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