Pneumatic control device with guiding heat dissipation function and automobile seat

Abstract

The invention belongs to the technical field of controllers, and particularly relates to a pneumatic control device with a guiding heat dissipation function and an automobile seat, the pneumatic control device comprises at least one cover film unit (100), the cover film unit (100) comprises a first groove-shaped part (100a) and a second groove-shaped part (100b), the first groove-shaped part (100a) and the second groove-shaped part (100b) are adjacently arranged, and the opening directions of the first groove-shaped part (100a) and the second groove-shaped part (100b) are opposite; the film covering unit (100) is fixedly connected in the pneumatic control device and is close to the PCB; the common side wall between the first groove-shaped part (100a) and the second groove-shaped part (100b) is obliquely arranged, and the opening area of the first groove-shaped part (100a) and the opening area of the second groove-shaped part (100b) are larger than the bottom area of the first groove-shaped part (100a) and the bottom area of the second groove-shaped part (100b); wherein the bottom area of the first groove-shaped part (100a) is used for accommodating part of the memory alloy wire (300), and the opening of the second groove-shaped part (100b) faces the PCB (200) to form an avoiding space for accommodating components. And the heat dissipation effect on the PCB and the memory alloy wire is enhanced, so that the overall reliability of the device is improved.

Description

Technical Field

[0001] This invention belongs to the field of controller technology, and specifically relates to a pneumatic control device with directional heat dissipation function and an automobile seat. Background Technology

[0002] As the core component of electronic devices, controllers typically integrate printed circuit boards (PCBAs) and various electronic components within a sealed housing. In some precision control applications, such as pneumatic massage or lumbar support systems for car seats, shape memory alloy (SMA) wires are used as miniature actuators. SMA wires contract when heated by electricity, thereby driving the movement of mechanical components such as valves; after power is cut off, they need to cool to return to their original shape, preparing for the next action.

[0003] During the aforementioned operation, the heating of the SMA wire generates a significant amount of heat, and other electronic components on the PCBA also generate heat. If this heat accumulates within the compact and sealed controller housing, it will cause a significant increase in the internal ambient temperature. Excessively high ambient temperatures will severely affect the cooling and reset process of the SMA wire, preventing it from returning to its initial length within the specified time. This can lead to controller malfunction, stuck operation, or even complete failure, severely impacting the controller's operational stability and reliability.

[0004] Furthermore, during the assembly of the controller, the tiny SMA wires need to be precisely installed in predetermined positions. Existing controller internal structures often lack effective guiding structures, making the threading and positioning of the SMA wires complex. This not only reduces production assembly efficiency but may also affect the driving effect of the SMA wires due to installation position deviations, and may even damage the SMA wires during installation.

[0005] Therefore, designing a controller structure that can effectively dissipate heat and facilitate the installation of SMA wires is a technical problem that urgently needs to be solved in this field. Summary of the Invention

[0006] To address the aforementioned problems in the prior art, namely the poor heat dissipation of the controller, the present invention provides a pneumatic control device with directional heat dissipation function, comprising:

[0007] At least one cover film unit, the cover film unit including a first groove-shaped portion and a second groove-shaped portion arranged adjacent to each other and with openings facing opposite directions, the cover film unit being fixedly connected to the pneumatic control device and close to the PCB board; The common sidewall between the first groove and the second groove is inclined, and the opening area of ​​the first groove and the second groove is larger than the bottom area; The bottom area of ​​the first groove is used to accommodate a portion of the shape memory alloy wire, and the opening of the second groove faces the PCB board to form a clearance space for accommodating components.

[0008] Furthermore, the first groove-shaped portion and the second groove-shaped portion include a first sidewall, a second sidewall, and a third sidewall connected in sequence; The first sidewall and the second sidewall are connected to form a first groove-shaped portion, and the second sidewall and the third sidewall are connected to form a second groove-shaped portion. The top of the first sidewall is higher than the top of the second groove.

[0009] Furthermore, the bottoms of the first groove and the second groove are connected to the PCB board, and the bottom of the second groove is provided with a first heat dissipation hole that communicates with the PCB board.

[0010] Furthermore, a second heat dissipation hole is provided at the top of the second groove, and the first heat dissipation hole and the second heat dissipation hole together form a through heat dissipation path.

[0011] Furthermore, a third heat dissipation hole is provided at the bottom of the first groove portion and on the PCB board.

[0012] Furthermore, the pneumatic control device also includes a cover, in which a first cover is disposed on one side of the cover membrane unit. A column is disposed on the first cover, and a heat dissipation channel is formed inside the column, connecting the interior of the pneumatic controller with the external space. The wall forming the heat dissipation channel protrudes from the upper and lower surfaces of the first cover.

[0013] Furthermore, the inner diameter of the heat dissipation channel gradually increases from one end to the other.

[0014] Furthermore, the column is positioned near the connection point between the shape memory alloy wire and the valve stem.

[0015] Furthermore, the cover also includes a second cover, which is disposed on the other side of the cover film unit. The first cover and the second cover form a receiving space, and the PCB board is located within the receiving space. The PCB board covered by the second groove is provided with ventilation holes, and the second cover is provided with air inlets. Airflow flows from the air inlet, through the air vent, and then out through the heat dissipation channel.

[0016] Furthermore, the first sidewall is vertically arranged.

[0017] Furthermore, at least one hollow support protrusion is provided on the second sidewall and / or the third sidewall, and the hollow channel of the support protrusion connects the clearance space formed by the second groove portion with the first groove portion to enhance heat convection.

[0018] In a second aspect, the present invention provides an automobile seat, including a pneumatic control device with a heat dissipation function as described in the first aspect, for controlling the pneumatic massage or lumbar support function of the seat.

[0019] The beneficial effects of this invention are: When the cover unit's overall three-dimensional structure is placed on the PCB board, it creates a clearance space between itself and the electronic components underneath. This space physically isolates the two, preventing direct heat conduction and creating additional airflow and heat dissipation channels for the components, effectively preventing performance degradation or damage to the electronic components due to overheating.

[0020] The grooved section suspends the shape memory alloy wire, significantly increasing the contact area between the heating element and the surrounding air. More importantly, the open groove structure formed by the inclined second and third sidewalls allows the hot air above the shape memory alloy wire to rise smoothly and dissipate quickly along this channel when it heats up, creating efficient natural convection. This significantly enhances the cooling effect on the shape memory alloy wire, ensuring it can cool and reset quickly and reliably after power failure, thus guaranteeing the response speed and operational reliability of the control device.

[0021] This invention solves the installation problem of tiny shape memory alloy wires by using the groove structure on the cover unit. Specifically, the groove forms a preset, unobstructed installation track, providing precise guidance for the thin and soft shape memory alloy wires, allowing operators to easily and quickly thread them in and accurately position them, significantly reducing assembly difficulty and improving production efficiency.

[0022] The groove wall, composed of the first sidewall, the second sidewall, etc., effectively limits the shape memory alloy wire laterally, which can effectively prevent it from coming out of the predetermined path when it is relaxed, and ensures the high consistency of its installation position, tension state and working position.

[0023] In structures requiring guide posts to separate two shape memory alloy wires, the grooved design of this invention exhibits unique advantages. Its internal guide space of a certain width allows for minute lateral position adjustments of the shape memory alloy wires to naturally adapt to the lateral support of the guide posts, thereby maintaining a straight tension path from the fixed end to the guide posts. This straightness ensures that the tension generated by the shape memory alloy wires during thermal contraction is transmitted losslessly and efficiently along the axial direction, avoiding lateral force components caused by tilting, thus significantly improving the drive's response speed, tension efficiency, and the accuracy of the stroke.

[0024] The cover unit, as a whole, covers the PCB board, and its main structure completely isolates the high-temperature operating shape memory alloy wires from the sensitive electronic components and circuit areas below. This effectively prevents the risk of physical interference or electrical short circuits caused by vibration, displacement, or unexpected situations, and comprehensively improves the structural safety and electrical reliability of the product. Attached Figure Description

[0025] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings: Figure 1 This is a schematic cross-sectional view of the cover membrane unit in a pneumatic control device with guiding heat dissipation function according to the present invention. Figure 2 This is a partially enlarged schematic diagram of the cover membrane unit in a pneumatic control device with guiding heat dissipation function according to the present invention; Figure 3 This is an exploded structural diagram of a pneumatic control device with a guiding and heat dissipation function according to the present invention; Figure 4 This is a schematic diagram of the gas flow direction in a pneumatic control device with a guiding heat dissipation function according to the present invention; Figure 5 This is a top view of the internal structure of a pneumatic control device with guiding and heat dissipation function according to the present invention. Figure 6 This is a schematic diagram of the vent in a pneumatic control device with guiding heat dissipation function according to the present invention; Figure 7 This is a bottom view of a pneumatic control device with a guiding and heat dissipation function according to the present invention; Figure 8 This is a side view of a pneumatic control device with a guiding and heat dissipation function according to the present invention; Figure 9 This is a front view of a pneumatic control device with a guiding and heat dissipation function according to the present invention; Figure 10This is a schematic diagram of the third heat dissipation hole in a pneumatic control device with a guiding heat dissipation function according to the present invention; Figure 11 This is a schematic diagram of the supporting protrusion in a pneumatic control device with guiding and heat dissipation function according to the present invention; In the figure, 100 is the cover unit; 100a is the first groove; 100b is the second groove; 110 is the first sidewall; 120 is the second sidewall; 130 is the third sidewall; 150 is the support protrusion; 200 is the PCB board; 210 is the first heat dissipation hole; 220 is the second heat dissipation hole; 230 is the third heat dissipation hole; 300 is the shape memory alloy wire; 400 is the first cover; 410 is the column; 411 is the heat dissipation channel; 500 is the valve stem; 510 is the guide column; 600 is the second cover; 610 is the air inlet; 620 is the first air nozzle; 630 is the second air nozzle; and 640 is the third air nozzle. Detailed Implementation

[0026] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the invention. Furthermore, it should be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0027] Please see Figures 1-10 The first embodiment of the present invention provides a pneumatic control device with a guiding and heat dissipation function, the device comprising: At least one cover film unit 100, the cover film unit 100 including a first groove-shaped portion 100a and a second groove-shaped portion 100b arranged adjacent to each other and with openings facing opposite directions, the cover film unit 100 being fixedly connected to the pneumatic control device and close to the PCB board; The common sidewall between the first groove-shaped portion 100a and the second groove-shaped portion 100b is inclined, and the opening area of ​​the first groove-shaped portion 100a and the second groove-shaped portion 100b is larger than the bottom area. The bottom region of the first groove 100a is used to accommodate a portion of the shape memory alloy wire 300, and the opening of the second groove 100b faces the PCB board 200 to form a clearance space for accommodating components.

[0028] Specifically, refer to Figure 1 and Figure 2The cover unit 100 is connected to the pneumatic control device and can be fixed to the housing or connected to the PCB board. As a key structural component mounted on the PCB board 200, it is preferably integrally molded using processes such as injection molding to ensure structural strength and dimensional accuracy. The core design of this unit lies in the integrated design of two functional areas. The first groove-shaped portion 100a has its opening facing away from the PCB board 200, forming a V-shaped or U-shaped channel for guiding and accommodating the memory alloy wire 300, the driving element. The second groove-shaped portion 100b has its opening facing the PCB board 200. Since it shares a common inclined sidewall with the first groove-shaped portion 100a, it naturally forms an arched clearance space. This space covers the PCB board 200, providing ample accommodating area for the electronic components below, which are the main heat sources, and avoiding physical interference after installation. The advantage of this design is that it solves both the installation path guidance and working limit problems of the memory alloy wire 300, and the physical clearance problem of high-heat, tall components on the PCB board, through a single component. More importantly, it effectively isolates the shape memory alloy wire 300, which serves as the driving element, from the temperature-sensitive electronic components that are the main heat source, and creates independent heat dissipation space for both. This significantly improves the structural rationality and thermal management efficiency of the entire device, thereby enhancing the overall reliability of the device.

[0029] In a preferred embodiment, the first groove portion 100a and the second groove portion 100b include a first sidewall 110, a second sidewall 120 and a third sidewall 130 connected in sequence. Wherein, the first sidewall 110 and the second sidewall 120 are connected to form a first groove-shaped portion 100a, and the second sidewall 120 is connected to the third sidewall 130 to form a second groove-shaped portion 100b. The top of the first sidewall 110 is higher than the top of the second groove 100b.

[0030] Please see Figure 2 This structure provides a more specific definition to the geometry of the cover unit 100. The inclined second sidewall 120 serves as a common wall, with one side forming a first groove 100a with the first sidewall 110 to accommodate the shape memory alloy wire 300, and the other side forming a second groove 100b with the third sidewall 130 to avoid components.

[0031] The top of the first sidewall 110 is designed to be significantly higher vertically than the top of the third sidewall 130. The core function of this design is to provide reliable protection against the detachment of the shape memory alloy wire 300. After cooling down after power failure, the shape memory alloy wire 300 returns to its initial length and is in a relaxed state. At this time, if the device encounters external vibration or impact, the small and flexible wire can easily deviate or detach from its pre-set channel. The higher first sidewall 110 forms an effective physical barrier, reliably preventing the shape memory alloy wire 300 in its relaxed state from accidentally escaping from the first groove 100a. This design ensures that the shape memory alloy wire maintains the integrity and stability of its working path under all operating conditions, providing a fundamental structural guarantee for the accuracy and reliability of the next power-on contraction action.

[0032] Further, see Figure 5 The inclined second sidewall 120 offers a significant advantage in structures requiring a guide post 510 fixed within the cover to separate the two shape memory alloy wires 300. Because the second sidewall 120 is inclined, the guide space within the first groove 100a has a certain width, allowing the shape memory alloy wire 300 to make minor lateral adjustments. This allows the shape memory alloy wire 300 to naturally adapt to the lateral support of the guide post 510, maintaining a straight tension path from the fixed end to the guide post 510. This straightness ensures that the tension generated by the shape memory alloy wire during thermal contraction is transmitted efficiently and without loss along the axial direction, avoiding lateral forces caused by the inclination, thereby significantly improving the drive's response speed, tension efficiency, and the accuracy of the stroke.

[0033] In a preferred embodiment, the bottoms of the first groove portion 100a and the second groove portion 100b are connected to the PCB board 200, and the bottom of the second groove portion 100b is provided with a first heat dissipation hole 210 that communicates with the PCB board 200.

[0034] Specifically, the cover unit 100 is fixed to the surface of the PCB board 200 via the bottom edge of its groove-shaped portion. In the area of ​​the PCB board 200 covered by the second groove-shaped portion 100b, where the main heat-generating electronic components are located, at least one or more through-holes 210 are formed, such as... Figure 6As shown, these first heat dissipation holes 210 directly connect the arched clearance space formed by the second groove 100b to the space on the other side of the PCB board 200. This arrangement has a clear purpose: to provide a heat dissipation channel for the electronic components within the clearance space. When the components generate heat during operation, the heat can be convection and conduction through the pathway formed by the first heat dissipation holes 210, effectively transferring the heat to other spaces in the device and then dissipating it to the outside. The advantage of this is that it constructs an efficient heat dissipation path targeting the main heat source, avoiding excessive heat accumulation in localized areas of the PCB board 200, ensuring that the electronic components can operate stably at a suitable temperature, thereby improving the electrical performance and lifespan of the entire control device.

[0035] In other preferred embodiments, to further enhance the heat dissipation effect, one or a combination of the following structures may be used: The top of the second groove-shaped portion 100b is provided with a second heat dissipation hole 220, and the first heat dissipation hole 210 and the second heat dissipation hole 220 together form a through heat dissipation path. The bottom of the first groove-shaped portion 100a is provided with a third heat dissipation hole 230 that is connected to the PCB board 200.

[0036] First, see Figure 3 A second heat dissipation hole 220 is provided on the top wall of the second groove-shaped portion 100b. This second heat dissipation hole 220 corresponds to the first heat dissipation hole 210 on the bottom PCB board 200, thereby forming a through channel from bottom to top within the clearance space covered by the second groove-shaped portion 100b. Its working principle is that when airflow occurs inside the device, the air flowing through the first heat dissipation hole 210 into the clearance space, after being heated and rising, can smoothly flow out directly through the second heat dissipation hole 220 at the top, greatly optimizing the airflow path within this local space. This design effectively breaks the original closed structure at the top of the clearance space, significantly enhances the cross-ventilation effect of the internal air, improves the heat dissipation efficiency of passive convection, and is especially beneficial for the rapid exhaust of hot air accumulated above the components.

[0037] Secondly, see Figure 10At the bottom of the first groove-shaped portion 100a and at the corresponding position on the PCB board 200, a third heat dissipation hole 230 is provided, aligned and connected to each other. This structure is specifically designed for heat dissipation of the shape memory alloy wire 300. Since the shape memory alloy wire 300 generates instantaneous localized high temperatures when it contracts under power, and its reset performance is highly dependent on the cooling rate, the third heat dissipation hole 230 establishes a direct heat dissipation channel for the area at the bottom of the first groove-shaped portion 100a. It allows airflow within the device to more effectively contact and cool the shape memory alloy wire 300, accelerating its cooling and reset process after operation. Simultaneously, it also allows the heat generated by the shape memory alloy wire to be more efficiently dissipated through this channel, preventing heat accumulation within the groove, reducing thermal interference to surrounding electronic components, thereby ensuring the response speed and operational reliability of the drive unit.

[0038] Furthermore, the pneumatic control device also includes a cover, wherein a first cover 400 is disposed on one side of the cover membrane unit 100, and a column 410 is disposed on the first cover 400. The interior of the column 410 forms a heat dissipation channel 411 that connects the interior of the pneumatic controller with the external space, and the wall forming the heat dissipation channel 411 protrudes from the upper and lower surfaces of the first cover 400.

[0039] As attached Figure 3 and attached Figure 4 As shown, the first cover 400 typically serves as the top cover of the device. A hollow tubular structure, 410, extends through the first cover 400, with its walls protruding both upwards and downwards, forming a ventilation duct with a certain vertical height. This structure utilizes the chimney effect, a natural convection principle. When the air inside the controller is heated by heat sources, primarily electronic components, its temperature increases and its density decreases, causing it to rise naturally. This protruding column 410 structure provides an unobstructed, centralized exhaust channel for this rising hot air, allowing it to be effectively exhausted to the outside of the device through the heat dissipation channel 411. This invention utilizes physical principles to achieve passive heat dissipation, eliminating the need for additional energy-consuming components such as fans. By providing an efficient exhaust path for the internal hot air, the heat generated by the operation of the components inside the device can be continuously removed, effectively reducing the overall operating temperature inside the controller and ensuring the performance stability of all components.

[0040] To further optimize heat dissipation efficiency, the inner diameter of the heat dissipation channel 411 gradually decreases from one end to the other. Specifically, the heat dissipation channel 411 is designed as a converging channel that is wider at the inside and narrower at the outside, with its inner diameter gradually decreasing along the direction of hot air discharge. According to fluid dynamics principles, when a fluid passes through a pipe with a decreasing cross-sectional area, its velocity increases. Therefore, this converging channel structure forces the rising hot air to accelerate as it passes through the heat dissipation channel 411. The advantage of this is that the accelerated hot air discharge can create a stronger local low-pressure zone at the channel outlet, thereby enhancing the overall chimney effect's suction capacity. This stronger negative pressure will more effectively draw in the cool air at the bottom of the controller, forming a faster and more efficient natural convection circulation. By actively accelerating the discharge of hot air, this design significantly improves the overall efficiency of natural convection, allowing more heat to be carried away per unit time, thus achieving a better passive heat dissipation effect.

[0041] To achieve efficient heat dissipation at a specific point, the column 410 is positioned near the connection point between the shape memory alloy wire 300 and the valve stem 500. For example... Figure 5 As shown, in the entire control device, although electronic components are the primary and continuous heat source, the shape memory alloy wire 300 generates significant localized and instantaneous heat upon energization, and its connection point with the valve stem 500 is its core working area. Precisely positioning the column 410, which serves as the main heat dissipation channel, above this critical area allows the localized heat generated by the shape memory alloy wire to be quickly carried away by the rising airflow via the shortest path. The advantage of this layout is that it achieves targeted heat dissipation of the secondary but critical localized heat source, preventing the accumulation and diffusion of instantaneous heat within the controller. This maximizes the efficiency of cooling the shape memory alloy wire, ensuring its rapid cooling and reset, effectively protecting other surrounding electronic components from thermal shock, and guaranteeing the controller's rapid response and cyclic operation capabilities.

[0042] To construct a complete heat dissipation channel, the cover also includes a second cover 600, which is disposed on the other side of the cover film unit 100. The first cover 400 and the second cover 600 form an accommodating space, and the PCB board 200 is located in the accommodating space. The PCB board 200, which is covered by the second groove portion 100b, has a first heat dissipation hole 210, and the second cover 600 has an air inlet hole 610. Airflow flows from the air inlet hole 610 through the first heat dissipation hole 210 and then flows out from the heat dissipation channel 411.

[0043] like Figure 4 , Figure 7 , Figure 8 and Figure 9As shown, the second cover 600 serves as the lower cover of the device, forming a closed enclosure together with the first cover 400. A complete and efficient heat dissipation path is clearly defined: external ambient cold air is first drawn into the device through the air inlet 610 on the second cover 600; after entering, the airflow mainly flows upward through the multiple first heat dissipation holes 210 on the PCB board 200, directly providing the first stage of cooling to the electronic components located below the second groove 100b, which serve as the main heat source; subsequently, the air that has absorbed the heat from the components rises within the clearance space formed by the second groove 100b and can flow vertically upward through the second heat dissipation hole 220 at its top, entering the upper cavity of the device; simultaneously, some airflow can also provide auxiliary cooling to the shape memory alloy wire 300 area through the third heat dissipation hole 230 at the bottom of the first groove 100a. All the rising airflow carrying heat converges in the upper cavity of the device and is finally discharged to the outside of the device through the heat dissipation channel 411 formed inside the column 410 on the first cover 400. This invention constructs a clear and efficient heat dissipation airflow that draws in cold air from the bottom and exhausts hot air from the top, conforming to the physical law of hot air rising. This ensures that the cooling airflow can first flow through the core area that needs the most heat dissipation, achieving comprehensive and three-dimensional cooling of the entire device and greatly improving the reliability of operation under high load or high temperature environments.

[0044] In a specific, preferred embodiment, the above structure is applied in an array. Specifically, as shown below... Figure 3 and Figure 5 As shown, this device has three cover film units 100, which are connected side by side in sequence. Next to the third sidewall 130 of the last cover film unit 100, a sidewall with the same structure as the first sidewall 110 is connected, thus forming a regular, closed array structure. This array structure forms six first groove-shaped portions 100a for accommodating shape memory alloy wires 300, with one shape memory alloy wire 300 disposed in each first groove-shaped portion 100a. Simultaneously, another shape memory alloy wire 300 is disposed on the outer side of each of the two outermost first sidewalls 110 of the array. Therefore, this embodiment accommodates a total of eight shape memory alloy wires 300, forming four drive pairs. Correspondingly, on the first cover body 400, a pillar 410 is disposed above each group of shape memory alloy wires 300, thus a total of four pillars 410 are provided, achieving independent and efficient targeted heat dissipation for each group of heat sources.

[0045] like Figure 4As shown, to form a complete and efficient natural convection loop, this device also optimizes the entry path of cold air. Specifically, the PCB board 200 inside the controller has multiple first heat dissipation holes 210 along the length of the cover unit 100. Correspondingly, multiple air inlets 610 are also provided on the second cover 600 of the device, corresponding to the positions of the first heat dissipation holes 210 on the PCB board 200. By setting multiple first heat dissipation holes 210 and corresponding air inlets 610, and arranging them in an array along the length of the PCB board 200, the purpose is to form a wider and more uniform cold air supply channel. Since the electronic components on the PCB board 200 are usually also distributed along the length, this porous design ensures that external cold air can act on various areas of the board simultaneously and more evenly, directly and specifically cooling multiple main heat-generating components. This not only effectively avoids the problem of local overheating that may be caused by single-point air intake, but also significantly improves the uniformity and efficiency of overall heat dissipation, and further strengthens the overall natural convection circulation driven by the column 410.

[0046] In a preferred embodiment of the structure, the first sidewall 110 is vertically arranged.

[0047] like Figure 2 As shown, the outermost first sidewall 110 of the cover film unit 100 is designed to be perpendicular to the plane of the PCB board 200. The main advantages of this design are in manufacturing and assembly. First, the vertical sidewall provides a stable and flat mounting surface for the cover film unit 100, facilitating precise positioning and automated mounting on the PCB board 200. Second, when multiple valves driven by shape memory alloy wires need to be arranged side-by-side within a controller, multiple cover film units 100 with this structure can be tightly and seamlessly spliced ​​together to form a neat and compact array, greatly improving space utilization and facilitating the miniaturization and integration of the device. Of course, the arrangement of the first sidewall 110 is not limited to this; for example, it can also be inclined outwards. Those skilled in the art can design it accordingly based on actual assembly or spatial layout requirements.

[0048] To enable the pneumatic control device to control external pneumatic components, this device also integrates an air circuit interface on the cover, such as... Figure 7 and Figure 8As shown. In this embodiment, the interface consists of three air nozzles forming a functional unit, including a first air nozzle 620 and a second air nozzle 630 located on both sides, and a third air nozzle 640 located between them. The third air nozzle 640 serves as the main air inlet for the entire pneumatic control unit. In practical applications, it is connected to a centralized air supply unit such as a vehicle air pump via an air pipe to provide continuous compressed air to the device. The first air nozzle 620 and the second air nozzle 630 serve as working air ports, connected to external loads, such as the first and second air bags in a car seat, respectively, via independent air pipes.

[0049] When the controller issues a command to inflate the first air bag, the shape memory alloy wire 300 corresponding to the first air nozzle 620 is energized, heated, and rapidly contracts. This contraction force is transmitted to the valve stem 500 through the connector, driving the valve stem to move. The displacement of the valve stem changes its position in the valve body integrated inside the cover body, thereby opening an internal channel that allows compressed air from the third air nozzle 640 to flow smoothly through the channel and be output from the first air nozzle 620, achieving rapid inflation of the first air bag.

[0050] When it is necessary to deflate the air bag, the controller cuts off the power supply to the corresponding shape memory alloy wire 300. At this time, the heat dissipation structure designed in this invention, consisting of the cover membrane unit 100 and heat dissipation channel 411, plays a crucial role in ensuring that the shape memory alloy wire can be efficiently cooled and return to its initial length. As the shape memory alloy wire elongates, the valve stem 500 returns to its initial rest position under the action of the return spring. The return movement of the valve stem closes the air intake channel from the third air nozzle 640 to the first air nozzle 620, and simultaneously opens the channel connecting the first air nozzle 620 and the exhaust port, allowing the gas in the first air bag to be discharged. The inflation and deflation control of the second air bag connected to the second air nozzle 630 is performed in exactly the same manner by another independent set of shape memory alloy wires and valve stem units.

[0051] In summary, through the arrangement of the first air nozzle 620, the second air nozzle 630, and the third air nozzle 640, combined with an internal micro-valve system driven by a shape memory alloy wire 300, this pneumatic control device can achieve independent, rapid, and reliable inflation and deflation control of multiple air bag loads. The core of this invention, namely the integrated design of guidance and heat dissipation, is the fundamental guarantee for ensuring high-speed, stable, and long-life operation of the entire drive cycle, which is crucial for improving the performance and user experience of functions such as pneumatic massage or lumbar support in car seats.

[0052] The second embodiment of the present invention, based on the pneumatic control device with guiding heat dissipation function proposed in the first embodiment, further enhances the heat dissipation of the shape memory alloy wire 300, such as... Figure 11As shown, at least one hollow support protrusion 150 is provided on the second sidewall 120 and / or the third sidewall 130. The hollow channel of the support protrusion 150 connects the clearance space formed by the second groove portion 100b with the first groove portion 100a to enhance heat convection.

[0053] like Figure 11 As shown, the support protrusion 150 extends from the inner wall of the second sidewall 120 or the third sidewall 130 toward the interior of the first groove 100a. Structurally, the top of the protrusion provides a support point for the shape memory alloy wire 300, changing its contact with the groove wall from line or surface contact to a less frictional point contact. This effectively avoids wear caused by friction during the reciprocating extension and retraction of the shape memory alloy wire, extending its service life. In terms of thermal management, the support protrusion 150 is hollow, and its internal channel directly connects the space of the first groove 100a with the space of the second groove 100b below, which is part of the main airflow channel. This is equivalent to opening several micro-convection shortcuts outside the main heat dissipation channel, allowing the hot air rising from the component area below to partially flow through this channel, thereby enhancing the disturbance of the air around the shape memory alloy wire and the heat removal effect. The advantage of this structure is that, through a simple microstructure design, it synergistically improves the mechanical durability of the device and the heat dissipation efficiency of local heat sources, further ensuring the high performance and long service life of the shape memory alloy wire.

[0054] Therefore, by adding this hollow support protrusion 150 to the inclined sidewall, combined with the overall design of the cover unit 100, the problems of PCB board heat dissipation, precise guidance of shape memory wire, efficient heat dissipation of shape memory wire, and wear during long-term operation are solved in a coordinated manner, thus comprehensively improving the performance and reliability of the pneumatic control device.

[0055] The third embodiment of the present invention also provides a car seat, including a pneumatic control device with a guiding heat dissipation function as proposed in the first or second embodiment, for controlling the pneumatic massage or lumbar support function of the seat.

[0056] In automotive seat applications, comfort functions such as pneumatic massage and lumbar support rely on a controller to rapidly, accurately, and reliably actuate a series of air valves. Integrating the pneumatic control device with excellent heat dissipation capabilities described in this invention into the automotive seat control system ensures that the electronic components (the main heat source) and the shape memory alloy wires (the actuators) can still respond stably and quickly to control signals under harsh conditions such as high temperatures inside the vehicle during summer or prolonged continuous operation, without experiencing sluggish action or failure due to overheating. Simultaneously, its convenient installation guide structure simplifies the automotive seat production and assembly process. Therefore, the application of this invention can significantly improve the reliability and durability of automotive seat comfort functions, bringing a better driving and riding experience to end users.

[0057] The terms “first”, “second”, etc., are used to distinguish similar objects, not to describe or indicate a specific order or sequence.

[0058] The term "comprising" or any other similar term is intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus / device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent in such process, method, article, or apparatus / device.

[0059] The technical solution of the present invention has been described above with reference to the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the scope of protection of the present invention is obviously not limited to these specific embodiments. Without departing from the principles of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the scope of protection of the present invention.

Claims

1. A pneumatic control device with a guiding and heat dissipation function, characterized in that, include: At least one cover film unit (100) includes a first groove-shaped portion (100a) and a second groove-shaped portion (100b) arranged adjacent to each other and with openings facing opposite directions. The cover film unit (100) is fixedly connected to the pneumatic control device and close to the PCB board. The common sidewall between the first groove (100a) and the second groove (100b) is inclined, and the opening area of ​​the first groove (100a) and the second groove (100b) is larger than the bottom area; The bottom region of the first groove (100a) is used to accommodate a portion of the shape memory alloy wire (300), and the opening of the second groove (100b) faces the PCB board (200) to form a clearance space for accommodating components.

2. The pneumatic control device with guiding and heat dissipation function according to claim 1, characterized in that, The first groove (100a) and the second groove (100b) include a first sidewall (110), a second sidewall (120) and a third sidewall (130) connected in sequence. The first sidewall (110) and the second sidewall (120) are connected to form a first groove (100a), and the second sidewall (120) and the third sidewall (130) are connected to form a second groove (100b). The top of the first sidewall (110) is higher than the top of the second groove (100b).

3. The pneumatic control device with guiding and heat dissipation function according to claim 1, characterized in that, The bottoms of the first groove (100a) and the second groove (100b) are connected to the PCB board (200), and the bottom of the second groove (100b) is provided with a first heat dissipation hole (210) that is connected to the PCB board (200).

4. A pneumatic control device with guiding and heat dissipation function according to claim 3, characterized in that, The top of the second groove (100b) is provided with a second heat dissipation hole (220), and the first heat dissipation hole (210) and the second heat dissipation hole (220) together form a through heat dissipation path.

5. A pneumatic control device with guiding and heat dissipation function according to claim 3 or 4, characterized in that, The bottom of the first groove (100a) is provided with a third heat dissipation hole (230) that is connected to the PCB board (200).

6. A pneumatic control device with guiding and heat dissipation function according to claim 1, characterized in that, The pneumatic control device also includes a cover, in which a first cover (400) is disposed on one side of the cover membrane unit (100). A column (410) is disposed on the first cover (400). A heat dissipation channel (411) is formed inside the column (410) to connect the inside of the pneumatic controller with the outside space. The wall forming the heat dissipation channel (411) protrudes from the upper and lower surfaces of the first cover (400).

7. A pneumatic control device with guiding and heat dissipation function according to claim 6, characterized in that, The inner diameter of the heat dissipation channel (411) gradually increases from one end to the other.

8. A pneumatic control device with guiding and heat dissipation function according to claim 6, characterized in that, The column (410) is located near the connection position between the shape memory alloy wire (300) and the valve stem (500).

9. A pneumatic control device with guiding and heat dissipation function according to claim 6, characterized in that, The cover also includes a second cover (600), which is disposed on the other side of the cover film unit (100). The first cover (400) and the second cover (600) form a receiving space, and the PCB board (200) is located in the receiving space. The PCB board (200) covered by the second groove (100b) has a first heat dissipation hole (210), and the second cover (600) has an air inlet hole (610). Airflow flows from the air inlet (610) through the first heat dissipation hole (210) and then out from the heat dissipation channel (411).

10. A pneumatic control device with guiding and heat dissipation function according to claim 2, characterized in that, The first sidewall (110) is vertically arranged.

11. A pneumatic control device with guiding and heat dissipation function according to claim 2, characterized in that, At least one hollow support protrusion (150) is provided on the second sidewall (120) and / or the third sidewall (130), the hollow channel of the support protrusion (150) connecting the clearance space formed by the second groove (100b) with the first groove (100a) to enhance heat convection.

12. A car seat, characterized in that, Includes a pneumatic control device with a heat dissipation function according to any one of claims 1-11, used to control the pneumatic massage or lumbar support function of the seat.

Images