Power supply shielding device and vehicle-mounted power supply

Abstract

The invention provides a power source shielding device and a vehicle-mounted power source, the power source shielding device comprises a shell, the shell comprises a bottom plate and a plurality of side walls which are connected with each other, and the bottom plate and the side walls form a containing space with an opening; the shielding part is arranged in the accommodating space and is connected with the bottom plate, so that the accommodating space is divided into an isolation cavity and a plurality of shielding cavities; and the shielding cover is arranged on the shielding piece to seal the isolation cavity, the isolation cavity is used for installing a power supply module, and the shielding piece and the shielding cover isolate the isolation cavity and the shielding cavity so as to prevent the power supply module from generating interference on devices in the shielding cavity. By means of the mode, the power module is sealed in the isolation cavity through the shielding piece and the shielding cover, and electromagnetic interference of the power module on devices in the shielding cavity can be effectively avoided.

Description

Technical Field

[0001] This application relates to the technical field of vehicle power supplies, and in particular to a power shielding device and a vehicle power supply. Background Technology

[0002] The on-board power supply for new energy vehicles consists of an on-board charger and a DC-DC converter, and is connected to multiple external interfaces. The DC-DC converter and the on-board charger are strong sources of electromagnetic interference (EMC) within the on-board power supply, located near these interfaces. This EMC is transmitted to the interfaces via the internal electromagnetic field of the on-board power supply, causing excessive interference and affecting the vehicle's EMC performance. Current technologies often use multiple shielding covers to individually enclose each interface to shield the EMC generated by the DC-DC converter; however, this method is structurally complex and has high production costs. Summary of the Invention

[0003] This application provides a power shielding device to solve the problem of excessive electromagnetic interference to internal components by vehicle power supplies in the prior art.

[0004] To address the aforementioned technical problems, this application provides a power shielding device, comprising: a housing, the housing including a base plate and multiple side walls interconnected, the base plate and multiple side walls forming an accommodating space with openings; a shielding member, the shielding member disposed within the accommodating space and connected to the base plate to divide the accommodating space into an isolation cavity and multiple shielding cavities; and a shielding cover, the shielding cover disposed on the shielding member to enclose the isolation cavity, the isolation cavity being used to install a power module, the shielding member and the shielding cover isolating the isolation cavity and the shielding cavity to prevent the power module from interfering with the devices within the shielding cavity.

[0005] The shielding component includes two first baffles arranged along a first direction and two second baffles arranged along a second direction. The two ends of the first baffles are connected to the sidewalls, and the second baffles are arranged between the first baffles and connected to the first baffles. Both the first baffles and the second baffles are connected to the bottom plate so that the two first baffles and the two second baffles form an isolation cavity. The first direction and the second direction are arranged at a preset angle and are not parallel.

[0006] The distance between the shielding cover and the base plate is less than the distance between the end of the first baffle furthest from the base plate and the base plate.

[0007] The power shielding device includes a first circuit board coupled to the power module. The first circuit board is isolated from the power module by a shielding component and is attached to the base plate.

[0008] The shielding cover includes a first plate and a second plate, which are connected by a straight plate. The first plate is attached to the power module, and the second plate is attached to the first circuit board. The first circuit board is equipped with a transmission interface, which is located between the second plate and the base plate.

[0009] The shielding cover also includes a bending section. Both the first plate and the second plate are provided with bending sections, which are perpendicular to the planes on which the first plate and the second plate are located.

[0010] The power shielding device further includes a second circuit board disposed within the accommodating space; the shielding cavity includes a first filter cavity, a second filter cavity, and a third filter cavity, with two first baffles and sidewalls surrounding to form the first filter cavity and the second filter cavity, and two first baffles, the second baffle, and the sidewalls surrounding to form the third filter cavity, the third filter cavity being located between the first filter cavity and the second filter cavity and isolated by the first baffles; the second circuit board includes a first filter interface, a second filter interface, and a third filter interface, respectively corresponding to the first filter cavity, the second filter cavity, and the third filter cavity.

[0011] The shielding cavity further includes a fourth filter cavity, a fifth filter cavity, and a sixth filter cavity. The fourth filter cavity and the fifth filter cavity are located on opposite sides of the two first baffles. The fourth filter cavity is adjacent to the first filter cavity, the fifth filter cavity is adjacent to the second filter cavity, and the sixth filter cavity is located between the fourth filter cavity and the fifth filter cavity and adjacent to the isolation cavity. The second circuit board is provided with an inductor assembly, a transformer assembly, and an auxiliary power supply assembly, which are respectively arranged corresponding to the fourth filter cavity, the fifth filter cavity, and the sixth filter cavity.

[0012] The housing includes a cover plate, which is detachably connected to the side wall, and an abutment portion is formed on the cover plate; corresponding grounding springs are formed on both end faces of the second circuit board, and the grounding springs abut against the shield and the abutment portion.

[0013] To address the aforementioned issues, a second aspect of this application provides an on-board power supply, including any of the aforementioned power shielding devices.

[0014] The beneficial effects of this application are as follows: Unlike the prior art, this application forms an accommodating space with openings by connecting multiple side walls and a base plate. A shielding component is set in the accommodating space, which divides the accommodating space into an isolation cavity and multiple shielding cavities. A shielding cover is set in the accommodating space and is placed on the shielding component to close the isolation cavity. Thus, the power module is enclosed in the isolation cavity by the shielding component and the shielding cover, which can effectively prevent the power module from causing electromagnetic interference to the devices inside the filter component. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of an embodiment of the power shielding device of this application; Figure 2 This is a schematic diagram of the connection between the shielding component and the shielding cover in this application; Figure 3 This is a schematic diagram of an embodiment of the connection between the power module and the isolation cavity in this application; Figure 4 This is a schematic diagram of another embodiment of the connection between the power module and the isolation cavity in this application; Figure 5 This is a schematic diagram of the exploded view of the power module and the isolation cavity in this application; Figure 6 This is a schematic diagram of the structure of an embodiment of the shielding cover of this application; Figure 7 This is a schematic diagram of the structure of an embodiment of the shielding cavity of this application; Figure 8 This is a schematic diagram of an embodiment of the connection between the shielding cavity and the second circuit board in this application; Figure 9 This is a structural schematic diagram of the cross-sectional view of the power shielding device of this application; Figure 10 This is an exploded view of the power shielding device of this application. Detailed Implementation

[0016] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0017] It should be noted that if the embodiments of this application involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0018] Furthermore, if the embodiments of this application involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0019] Please see Figure 1 , Figure 1 This is a structural schematic diagram of the cross-sectional view of the power shielding device provided in this application.

[0020] This application provides a power supply shielding device. For example... Figure 1 and Figure 2 As shown, the power shielding device of this embodiment includes: a housing 10, a shielding member 20, and a shielding cover 50. The housing 10 includes a bottom plate 11 and a plurality of side walls 12 connected to each other. The bottom plate 11 and the plurality of side walls 12 form an accommodating space 13 with an opening. The shielding member 20 is disposed in the accommodating space 13 and connected to the bottom plate 11 to divide the accommodating space 13 into an isolation cavity 31 and a plurality of shielding cavities 32. The shielding cover 50 is disposed on the shielding member 20 to close the isolation cavity 31. The isolation cavity 31 is used to install the power module 41. The shielding member 20 and the shielding cover 50 isolate the isolation cavity 31 and the shielding cavity 32 to avoid the power module 41 from interfering with the devices in the shielding cavity 32. The power module 41 may be a DC-DC (Direct Current to Direct Current Converter) converter module, which is not specifically limited in this application.

[0021] In an optional embodiment, the housing 10 includes multiple sidewalls 12 and a base plate 11 connected to the multiple sidewalls 12. The multiple sidewalls 12 are connected sequentially, and one end of each sidewall 12 is connected to the base plate 11, thereby forming an accommodating space 13. Based on this, a shielding member 20 is disposed within the accommodating space 13 and is connected to the base plate 11. That is, the base plate 11 of the housing 10 has multiple sidewalls 12, and the area enclosed by the multiple sidewalls 12 is provided with a shielding member 20 connected to the base plate 11. The shielding member 20 can be specifically connected to the base plate 11, thereby dividing the accommodating space 13 into an isolation cavity 31 and multiple shielding cavities 32. The housing 10 and the shielding member 20 can be designed as a single piece, i.e., the housing 10 and the shielding member 20 are an integral structure.

[0022] In this embodiment, the power shielding device further includes a shielding cover 50, which is disposed on the shielding member 20, thereby connecting the shielding member 20 and the shielding cover 50 to enclose the isolation cavity 31. The isolation cavity 31 is used to install the power module 41. That is, when installing the power module 41 in the power shielding device, the power module 41 can be pre-installed in the isolation cavity 31 formed within the shielding member 20, and then the shielding cover 50 is placed on the power module 41 and connected to the shielding member 20, thereby enclosing the power module 41 within the isolation cavity 31 formed by the shielding member 20 through the shielding cover 50. When the power module 41 is working, it is a strong electromagnetic interference source within the power shielding device. To avoid power interference generated by the power module 41, the power module 41 is enclosed within the isolation cavity 31. The shielding member 20 and the shielding cover 50 can provide electromagnetic shielding for the power module 41, thereby effectively preventing the strong electromagnetic interference generated by the power module 41 from affecting the interior of the power shielding device.

[0023] In an optional embodiment, the shielding member 20 is disposed within the accommodating space 13 and connected to the base plate 11, thereby dividing the accommodating space 13 into an isolation cavity 31 and a shielding cavity 32. The shielding cavity 32 can be used to install other electronic devices, such as connecting devices connected to the power module 41, such as interfaces. That is, by using the isolation cavity 31 to house the power module 41, when the power module 41 generates electromagnetic waves during operation, the shielding member 20 and the shielding cover 50 can block the strong electromagnetic waves generated by the power module 41, thereby preventing the electromagnetic waves generated by the power module 41 from interfering with the devices in the shielding cavity 32.

[0024] In the above embodiment, a receiving space 13 with an opening is formed by connecting multiple side walls 12 to the base plate 11. A shielding member 20 is provided in the receiving space 13, which divides the receiving space 13 into an isolation cavity 31 and multiple shielding cavities 32. A shielding cover 50 is provided in the receiving space 13 and is placed on the shielding member 20 to close the isolation cavity 31. Thus, the power module 41 is enclosed in the isolation cavity 31 by the shielding member 20 and the shielding cover 50, which can effectively prevent the power module 41 from causing electromagnetic interference to the devices in the filtering device.

[0025] In an optional embodiment, such as Figure 1 and Figure 4As shown, the shielding member 20 includes two first baffles 21 arranged along a first direction 61 and two second baffles 22 arranged along a second direction 62. The two ends of the first baffles 21 are connected to the sidewalls 12, and the second baffles 22 are arranged between the first baffles 21 and connected to the first baffles 21. Both the first baffles 21 and the second baffles 22 are connected to the bottom plate 11 so that the two first baffles 21 and the two second baffles 22 form an isolation cavity 31. The first direction 61 and the second direction 62 are arranged at a preset angle and are not parallel. Specifically, the first direction 61 and the second direction 62 can be represented as follows: one direction is the length direction of the housing 10, and the other direction is the width direction of the housing 10. For example, the first direction 61 is the length direction of the housing 10, and the second direction 62 is the width direction of the housing 10. In other embodiments, the first direction 61 can also be the width direction of the housing 10, and the second direction 62 can be the length direction of the housing 10.

[0026] In this embodiment, taking the first direction 61 as the length direction of the housing 10 and the second direction 62 as the width direction of the housing 10 as an example, the shielding member 20 includes a first baffle 21 arranged along the first direction 61 and two second baffles 22 arranged along the second direction 62. The two ends of the first baffle 21 are connected to the side wall 12, and the two ends of the two second baffles 22 are connected to the opposite side end face of the two first baffles 21. The two baffles are spaced apart, and both the first baffle 21 and the second baffles 22 are connected to the bottom plate 11. Thus, the two first baffles 21 and the two second baffles 22 can surround and form an isolation cavity 31. Therefore, when installing the power module 41, the power module 41 can be installed in the isolation cavity 31 formed by the first baffles 21 and the second baffles 22.

[0027] In an optional embodiment, the shielding member 20 includes two first baffles 21 arranged along a first direction 61. The two ends of the first baffles 21 are connected to the side wall 12 of the housing 10, thereby forming a cavity between the first baffles 21 and the side wall 12, namely the shielding cavity 32. The shielding cavity 32 can be used to install other devices. That is, the first baffles 21 and the second baffles 22 can isolate the isolation cavity 31 and the shielding cavity 32. Thus, when the power module 41 generates electromagnetic waves, the first baffles 21 and the second baffles 22 can isolate the electromagnetic waves, thereby enclosing the electromagnetic waves in the isolation cavity 31 and preventing the electromagnetic waves from being transmitted to the shielding cavity 32 and affecting other devices installed in the shielding cavity 32.

[0028] In this embodiment, the first baffle 21 is arranged along the first direction 61 and the second baffle 22 is arranged along the second direction 62. That is, when setting the first baffle 21 and the second baffle 22, it is necessary to make sure that the first direction 61 and the second direction 62 are not parallel, so as to ensure that the first baffle 21 and the second baffle 22 surround to form the isolation cavity 31.

[0029] In an optional embodiment, such as Figure 7 As shown, the first baffle 21 can be formed by a bulge in the housing 10 via a water channel (not shown), meaning that a water channel is formed within the first baffle 21. Specifically, the housing has an inlet 71 and an outlet 72, which are connected to the water channel. Water can be transferred to the water channel through the inlet 71 and then discharged through the outlet 72, thus dissipating heat from the components inside the power shielding device through the water channel. In other words, by forming a water channel within the first baffle 21, it is unnecessary to install other heat dissipation devices inside the power shielding device, thereby effectively improving the space utilization rate within the power shielding device.

[0030] In an optional embodiment, such as Figure 2 and Figure 3 As shown, the distance between the shielding cover 50 and the base plate 11 is less than the distance between the end of the first baffle 21 away from the base plate 11 and the base plate 11. The shielding cover 50 is disposed on the shielding member 20, thereby sealing the isolation cavity 31 formed by the shielding member 20 through the shielding cover 50, so as to avoid the electromagnetic interference generated by the power module 41 disposed in the isolation cavity 31 from interfering with the devices in the shielding cavity 32.

[0031] In this embodiment, in order to enhance the electromagnetic shielding of the power module 41 by the shielding component 20 and the shielding cover 50, it is necessary to ensure that the distance between the shielding cover 50 and the base plate 11 is less than the distance between the first baffle 21 and the base plate 11. Thus, after the power module 41 is installed in the isolation cavity 31, the shielding cover 50 can be placed on the power module 41, thereby enclosing the power module 41 in the isolation cavity 31. After the isolation cavity 31 is closed, in order to ensure that the shielding cover 50 and the shielding component 20 provide electromagnetic shielding for the power module 41, the distance between the shielding cover 50 and the base plate 11 is less than the distance between the first baffle 21 and the base plate 11, thereby effectively enclosing the power module 41. That is, by setting the distance between the shielding cover 50 and the base plate 11 to be less than the distance between the end of the first baffle 21 and the base plate 11, that is, the distance between the shielding cover 50 and the base plate 11 is less than the distance between the end of the first baffle 21 away from the connection between the first baffle 21 and the base plate 11, the electromagnetic shielding of the power module 41 by the shielding cover 50 and the shielding component 20 can be effectively enhanced.

[0032] In an optional embodiment, the power shielding device includes a first circuit board 42 coupled to the power module 41. The first circuit board 42 is isolated from the power module 41 via a shielding member 20 and is mounted in contact with the base plate 11. The first circuit board 42 and the power module 41 are isolated by the shielding member 20, that is, the first circuit board 42 can be disposed within the shielding cavity 32 formed by the two first baffles 21, the second baffle 22, and the sidewall 12. Specifically, the first circuit board 42 and the power module 41 can be isolated by the second baffle 22. When the power module 41 generates electromagnetic fields during operation, the second baffle 22 can shield the electromagnetic fields, thereby preventing the electromagnetic fields generated by the power module 41 from interfering with the first circuit board 42.

[0033] In this embodiment, as Figure 3 and Figure 5 As shown, when installing the first circuit board 42 and the power module 41, the first circuit board 42 and the power module 41 can be specifically connected by a copper busbar and a filter magnetic ring. That is, when connecting the first circuit board 42 and the power module 41, the copper busbar can be soldered to the power module 41 by welding, and it can be fixed to the first circuit board 42 by screw riveting to form an electrical connection and structural connection between the first circuit board 42 and the power module 41. In other embodiments, other connection methods can also be used, which are not specifically limited here. And since the first circuit board 42 is set to be attached to the base plate 11, that is, in the vertical direction along the plane formed by the first direction 61 and the second direction 62, there is a height difference between the first circuit board 42 and the power module 41. That is, the distance from the end of the first circuit board 42 away from the base plate 11 is less than the distance from the end of the power module 41 away from the base plate 11. Therefore, when connecting the first circuit board 42 and the power module 41, they can be connected by a copper busbar and a filter magnetic ring. The copper busbar and the filter magnetic ring can be located on the side end face of the second baffle 22 away from the isolation cavity 31. The filter magnetic ring can be fitted onto the copper busbar or it can be integrally injection molded. The specific configuration can be determined according to actual needs, and this application does not impose any limitations on it.

[0034] In an optional embodiment, such as Figure 6As shown, the shielding cover 50 includes a first plate 51 and a second plate 52, which are connected by a straight plate 53. The first plate 51 is attached to the power module 41, and the second plate 52 is attached to the first circuit board 42. The shielding cover 50 includes a first plate 51 and a second plate 52, which are connected by a straight plate 53. When installing the power module 41 and the first circuit board 42, the first circuit board 42 can be pre-attached to the base plate 11, and the power module 41 can be installed in the isolation cavity 31. Then, the first circuit board 42 and the power module 41 are connected by a copper busbar and a filter magnetic ring. Then, the shielding cover 50 is placed over the first circuit board 42 and the power module 41. Specifically, when setting the shielding cover 50, the first plate 51 can be attached to the side of the power module 41 away from the base plate 11, and the second plate 52 can be attached to the side of the first circuit board 42 away from the base plate 11. Thus, the installation of the power module 41 and the first circuit board 42 can be completed through the shielding cover 50.

[0035] In an optional embodiment, a transmission interface (not shown) is provided on the first circuit board 42, located between the second plate 52 and the base plate 11. Specifically, the two first baffles 21, the second baffle 22, the side wall 12, the second plate 52, and the base plate 11 surround the cavity formed therearound, thereby effectively preventing electromagnetic interference signals from affecting the transmission interface on the first circuit board 42. The transmission interface may specifically be a DC (Direct Current) interface.

[0036] In an optional embodiment, such as Figure 6 As shown, the shielding cover 50 also includes a bending portion 54. Both the first plate 51 and the second plate 52 are provided with bending portions 54, which are perpendicular to the planes where the first plate 51 and the second plate 52 are located. When installing the power module 41 and the first circuit board 42, to enhance the electromagnetic shielding effect on the power module 41, bending portions 54 can be provided on the shielding cover 50. After installing the power module 41 in the isolation cavity 31 and the first circuit board 42 on the base plate 11, the shielding cover 50 can be placed over the first circuit board 42 and the power module 41. During the installation of the shielding cover 50, since both the first plate 51 and the second plate 52 are provided with bending portions 54, the bending portions 54 can be fitted against the first baffle 21, resulting in an alternating arrangement of the bending portions 54 and the first baffle 21, thereby further improving the electromagnetic shielding effect of the shielding cover 50 and the shielding component 20.

[0037] In this embodiment, the bent portion 54 provided on the first plate 51 and the second plate 52 can be arranged perpendicularly to the first plate 51 and the second plate 52. That is, when the shielding cover 50 is placed on the shielding member 20, the first plate 51 and the second plate 52 can be arranged perpendicularly to the plane where the first baffle 21 is located. Based on this, when the shielding cover 50 is placed on the shielding member 20, the bent portion 54 can be arranged parallel to the first baffle 21 and fit against the first baffle 21.

[0038] In an optional embodiment, the length of the bend 54 on the first plate 51 needs to be less than the length of the power module 41. That is, when the shielding cover 50 is installed on the shielding member 20, i.e., the first plate 51 is positioned between the two first baffles 21, the bend 54 on the first plate 51 does not abut against the base plate 11 when the shielding cover 50 is installed. This avoids vibration between the bend 54 and the first baffles 21 when the power shielding device vibrates during operation. Specifically, the length of the bend 54 can be set according to requirements, and this application does not impose a specific limitation.

[0039] In an optional embodiment, such as Figure 7 and Figure 8As shown, the power shielding device also includes a second circuit board 43, which is disposed within the accommodating space 13. The shielding cavity 32 includes a first filter cavity 321, a second filter cavity 322, and a third filter cavity 323. Specifically, two first baffles 21 and a side wall 12 surround to form the first filter cavity 321 and the second filter cavity 322, and the two first baffles 21, the second baffle 22, and the side wall 12 surround to form the third filter cavity 323. The third filter cavity 323 is located between the first filter cavity 321 and the second filter cavity 322 and is isolated by the first baffles 21. The second circuit board 43 includes a first filter interface 432, a second filter interface 433, and a third filter interface 434, which are respectively disposed corresponding to the first filter cavity 321, the second filter cavity 322, and the third filter cavity 323. When installing the second circuit board 43 inside the housing 10, the first filter interface 432 must correspond to the first filter cavity 321, the second filter interface 433 to the second filter cavity 322, and the third filter interface 434 to the third filter cavity 323. After the second circuit board 43 is installed inside the housing 10, the first filter interface 432 is located inside the first filter cavity 321, the second filter interface 433 is located inside the second filter cavity 322, and the third filter interface 434 is located inside the third filter cavity 323. After the second circuit board 43 is installed inside the housing 10, the shielding cavity 32 can complete the filtering and shielding function of the corresponding interfaces. That is, the first filter cavity 321 filters and shields the first filter interface 432, the second filter cavity 322 filters and shields the second filter interface 433, and the third filter cavity 323 filters and shields the third filter interface 434. This effectively completes the electromagnetic shielding between the power module 41 and the filter interface, ensuring the shielding effect of the filter interface while reducing the need for corresponding shielding devices. Furthermore, it eliminates the need to create slots on the second circuit board 43, thereby effectively enhancing the shock resistance of the power shielding device.

[0040] In this embodiment, when installing the second circuit board 43, the second circuit board 43 can be installed on the side of the shielding cover 50 and the shielding component 20 away from the base plate 11. In this way, the power module 41 and the second circuit board 43 can be isolated by the shielding component 20 and the shielding cover 50, thereby avoiding interference from the electromagnetic field generated by the power module 41 to the second circuit board 43.

[0041] Specifically, the first filter interface 432 can be an AC (Alternating Current) interface, the second filter interface 433 can be an HV (High Voltage Direct Current) interface, and the third filter interface 434 can be an LV (Low Voltage Direct Current) interface. Based on this, the shielding cavity 32 can include an AC filter cavity, an HV filter cavity, and an LV filter cavity; that is, the first filter cavity 321 is an AC filter cavity, the second filter cavity 322 is an HV filter cavity, and the third filter cavity 323 is an LV filter cavity.

[0042] In an optional embodiment, such as Figure 7 and Figure 8 As shown, the shielding cavity 32 also includes a fourth filter cavity 324, a fifth filter cavity 325, and a sixth filter cavity 326. The fourth filter cavity 324 and the fifth filter cavity 325 are located on opposite sides of the two first baffles. The fourth filter cavity 324 is adjacent to the first filter cavity 321, the fifth filter cavity 325 is adjacent to the second filter cavity 322, and the sixth filter cavity 326 is located between the fourth filter cavity 324 and the fifth filter cavity 325, and is adjacent to the isolation cavity. The second circuit board is equipped with an inductor assembly 435, a transformer assembly (not shown), and an auxiliary power supply assembly (not shown), which are respectively positioned corresponding to the fourth filter cavity 324, the fifth filter cavity 325, and the sixth filter cavity 326. When the second circuit board 43 is installed in the housing 10, the inductor assembly 435 is located in the fourth filter cavity 324, the transformer assembly is located in the fifth filter cavity 325, and the auxiliary power supply assembly is located in the sixth filter cavity 326. That is, by setting the shielding component 20, the accommodating space 13 can be divided into an isolation cavity 31 and multiple shielding components 32, which can effectively complete the electromagnetic shielding between multiple components in the power supply shielding device, avoid electromagnetic interference between multiple components, and effectively improve the space utilization rate within the housing 10.

[0043] In an optional embodiment, such as Figure 9 and Figure 10As shown, the housing 10 includes a cover plate 14, which is detachably connected to the side wall 12. An abutment portion 141 is formed on the cover plate 14. Corresponding grounding springs 431 are formed on both end faces of the second circuit board 43, and these grounding springs 431 abut against the shielding cover 50 and the abutment portion 141. The detachable connection between the cover plate 14 and the side wall 12 means that when the cover plate 14 is connected to the side wall 12, it can be used to enclose the accommodating space 13. The cover plate 14 is provided with an abutment portion 141, and the second circuit board 43 is provided with a grounding spring 431. When the cover plate 14 is installed, the abutment portion 141 on the cover plate 14 can be connected with the grounding spring 431 on the second circuit board 43, so that the second circuit board 43 can be grounded through the grounding spring 431. The LV interface provided on the second circuit board 43 can be isolated from the cover plate 14 and the shielding cover 50 through the grounding springs 431 on both sides of the second circuit board 43, thereby isolating the power module 41 from the LV interface, and then allowing the LV interface to be connected to the external components through the side wall 12 of the housing 10.

[0044] In other embodiments, the grounding spring 431 can be replaced with conductive foam or conductive silicone. That is, when connecting the cover plate 14 and the side wall 12, the abutment portion 141 on the cover plate 14 can connect the second circuit board 43 and the cover plate 14 through conductive foam or conductive silicone, so that the second circuit board 43 is grounded through the cover plate 14. Specifically, the grounding spring 431 can also be set as other conductive devices, which are not specifically limited here.

[0045] In an optional embodiment, during the installation of the power shielding device, the power module 41 can be pre-installed in the isolation cavity 31, that is, between the cavity formed by the two first baffles 21 and the two second baffles 22. Then, the first circuit board 42 is attached to the base plate 11, and the first circuit board 42 and the power module 41 are isolated by the second baffles 22 and connected to the magnetic ring through the copper busbar. Then, the shielding cover 50 is set on the shielding member 20, that is, the first plate 51 is attached to the end face of the power module 41, and the second plate 52 is attached to the first circuit board 42. Thus, the shielding cover 50 seals the first circuit board 42 and the power module 41, thereby preventing the electromagnetic interference generated by the power module 41 from interfering with other devices in the housing 10. After the power module 41 is sealed, the second circuit board 43 can be installed at the end of the shielding cover 50 and the shielding component 20 away from the base plate 11. When installing the second circuit board 43, the first filter interface 432, the second filter interface 433 and the third filter interface 434 on the second circuit board 43 are respectively set to the first filter cavity 321, the second filter cavity 322 and the third filter cavity 323. When installing the second circuit board 43, the grounding spring 431 on one side of the second circuit board 43 abuts against the shielding cover 50. Then the cover plate 14 is installed, and the abutting part 141 on the cover plate 14 abuts against the grounding spring 431 on the other side of the second circuit board 43. Thus, the grounding springs 431 on both sides of the second circuit board 43 isolate the interface 432 from the accommodating space 13, thereby preventing the electromagnetic interference of the devices in the accommodating space 13 from interfering with the interface 432.

[0046] Unlike the prior art, the second aspect of this application also discloses an on-board power supply, including a power shielding device, which is the power shielding device of any of the above embodiments.

[0047] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A power supply shielding device, characterized in that, The power shielding device includes: A housing, the housing including an interconnected base plate and a plurality of side walls, the base plate and the plurality of side walls forming an accommodating space with openings; A shielding component is disposed within the accommodating space and connected to the base plate to divide the accommodating space into an isolation cavity and multiple shielding cavities; A shielding cover is disposed on the shielding component to enclose the isolation cavity. The isolation cavity is used to install a power module. The shielding component and the shielding cover isolate the isolation cavity from the shielding cavity to prevent the power module from interfering with the devices inside the shielding cavity.

2. The power shielding device according to claim 1, characterized in that, The shielding component includes two first baffles arranged along a first direction and two second baffles arranged along a second direction. The two ends of the first baffles are connected to the side wall. The second baffles are arranged between the first baffles and connected to the first baffles. Both the first baffles and the second baffles are connected to the bottom plate so that the two first baffles and the two second baffles form the isolation cavity. The first direction and the second direction are set at a preset angle and are not parallel.

3. The power shielding device according to claim 2, characterized in that, The distance between the shield and the base plate is less than the distance between the end of the first baffle away from the base plate and the base plate.

4. The power supply shielding device according to claim 2, characterized in that, The power shielding device includes a first circuit board coupled to the power module. The first circuit board is isolated from the power module via the shielding member and is attached to the base plate.

5. The power supply shielding device according to claim 4, characterized in that, The shielding cover includes a first plate and a second plate, which are connected by a straight plate. The first plate is attached to the power module, and the second plate is attached to the first circuit board. The first circuit board is provided with a transmission interface, which is located between the second flat plate and the base plate.

6. The power shielding device according to claim 5, characterized in that, The shielding cover also includes a bending portion, which is provided on both the first plate and the second plate, and the bending portion is perpendicular to the plane on which the first plate and the second plate are located.

7. The power supply shielding device according to claim 2, characterized in that, The power shielding device further includes a second circuit board, which is disposed within the accommodating space; The shielding cavity includes a first filter cavity, a second filter cavity, and a third filter cavity. Two first baffles and the sidewall surround to form the first filter cavity and the second filter cavity. Two first baffles, the second baffle, and the sidewall surround to form the third filter cavity. The third filter cavity is located between the first filter cavity and the second filter cavity and is isolated by the first baffles. The second circuit board includes a first filter interface, a second filter interface, and a third filter interface, which are respectively set for the first filter cavity, the second filter cavity, and the third filter cavity.

8. The power supply shielding device according to claim 7, characterized in that, The shielding cavity further includes a fourth filter cavity, a fifth filter cavity, and a sixth filter cavity. The fourth filter cavity and the fifth filter cavity are located on opposite sides of the two first baffles. The fourth filter cavity is adjacent to the first filter cavity, the fifth filter cavity is adjacent to the second filter cavity, and the sixth filter cavity is located between the fourth filter cavity and the fifth filter cavity and is adjacent to the isolation cavity. The second circuit board is provided with an inductor assembly, a transformer assembly, and an auxiliary power supply assembly, which are respectively provided for the fourth filter cavity, the fifth filter cavity, and the sixth filter cavity.

9. The power supply shielding device according to claim 7, characterized in that, The housing includes a cover plate, which is detachably connected to the side wall, and an abutment portion is formed on the cover plate; The second circuit board has corresponding grounding springs formed on both sides of its end face, and the grounding springs abut against the shield and the abutting part.

10. A vehicle-mounted power supply, characterized in that, The vehicle power supply includes the power shielding device as described in any one of claims 1-9.

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