A multi-layer sheet wedge compacting mechanism

By designing a wedge-shaped clamping mechanism, the positioning accuracy and versatility issues of the circuit board clamping mechanism are solved, achieving efficient and reliable clamping of multi-layer thin boards, improving production efficiency and reducing costs.

CN122121084APending Publication Date: 2026-05-29NANTONG XINKE INTELLIGENT TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
NANTONG XINKE INTELLIGENT TECH CO LTD
Filing Date
2026-04-15
Publication Date
2026-05-29

AI Technical Summary

Technical Problem

Existing circuit board clamping mechanisms suffer from insufficient positioning accuracy, poor versatility, slow production cycle, and high cost, especially in multi-layer thin board processing where they struggle to meet the demand for efficient clamping.

Method used

The multi-layer thin plate wedge clamping mechanism utilizes the wedge-shaped inclined surface design to achieve synchronous linkage between the pressure rod and the main slider. The pressure rod is driven to press down through a pair of wedge-shaped inclined surfaces, and the reset function of the elastic element simplifies the drive control. It is suitable for circuit boards of different sizes and thicknesses.

Benefits of technology

It achieves efficient and reliable clamping of circuit boards, reduces system complexity and cost, improves production cycle time, adapts to the processing of multi-layer thin boards of different specifications and sizes, and has a simple and wear-resistant structure.

✦ Generated by Eureka AI based on patent content.

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Abstract

The present application provides a kind of multilayer sheet wedge pressing mechanism, including horizontal slide, main sliding block being slidably arranged in horizontal slide, the auxiliary sliding block for resisting the side of multilayer sheet and the pressing rod for pressing the upper surface of multilayer sheet being vertically slidably connected with main sliding block, a pair of wedge inclined planes being arranged between auxiliary sliding block and pressing rod and being cooperated with each other to make pressing rod press down when auxiliary sliding block and main sliding block move towards each other.The present application makes auxiliary sliding block and pressing rod linkage by the arrangement of a pair of wedge inclined planes, can be suitable for circuit board of different size and thickness, realizes the automatic effective pressing of circuit board, reduces manual operation strength and eliminates manual operation error, and effectively improves production rhythm.
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Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing technology, and in particular to a multilayer thin plate wedge clamping mechanism. Background Technology

[0002] Circuit boards are an indispensable component in electronics manufacturing, and their production often involves scenarios where they need to be clamped before further processing. Therefore, there is an urgent need to design a clamping mechanism to effectively clamp circuit boards, replacing the existing method of manually applying tape for fixation, thus ensuring the stability and reliability of subsequent processing.

[0003] Chinese invention patent CN118413940B discloses a PCB circuit board drilling processing device. It uses a positioning frame and a set of clamping mechanisms installed at both ends of the positioning frame to position and clamp the circuit board, while simultaneously pressing the aluminum foil laid on the circuit board. This invention has a relatively complex structure, employing traditional gear and lead screw transmissions, which are prone to reduced positioning accuracy due to mechanical backlash, failing to meet the PCB board's requirements for interlayer alignment accuracy. Furthermore, this invention is not applicable to PCB boards of different sizes, exhibiting poor versatility.

[0004] Chinese invention patent CN220699804U discloses an auxiliary fixture for drilling PCB boards. A first hydraulic cylinder, via a spring-loaded telescopic component, pushes a movable plate horizontally for clamping, while a second hydraulic cylinder pushes a pressure plate vertically for clamping. While this solution is applicable to PCBs of different sizes, its structure is complex, contains redundant design elements, and requires significant modifications to existing drilling machine platforms, resulting in high costs and making it unsuitable for all commercially available drilling machines. Furthermore, the invention's step-by-step horizontal and vertical clamping using hydraulic cylinders leads to a longer production cycle and requires further efficiency improvement. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide a multi-layer thin plate wedge clamping mechanism that can be applied to circuit boards of different sizes and thicknesses, realize automatic and effective clamping of circuit boards, reduce the intensity of manual operation and eliminate human operation errors, and effectively improve the production cycle.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a multi-layer thin plate wedge clamping mechanism, characterized in that it includes a horizontal slide groove, a main slider slidably disposed in the horizontal slide groove, a secondary slider horizontally slidably connected to the main slider for abutting against the side of the multi-layer thin plate, and a pressure rod vertically slidably connected to the main slider for pressing the upper surface of the multi-layer thin plate, wherein a pair of wedge-shaped inclined surfaces are provided between the secondary slider and the pressure rod, which cooperate with each other to press the pressure rod down when the secondary slider and the main slider move towards each other.

[0007] Furthermore, the auxiliary slider is provided with an upwardly inclined wedge-shaped arm, and the pair of wedge-shaped inclined surfaces include a downwardly inclined first wedge-shaped inclined surface provided on the lower surface of the wedge-shaped inclined arm and an upwardly inclined second wedge-shaped inclined surface provided in the middle of the pressure rod, with the first wedge-shaped inclined surface and the second wedge-shaped inclined surface having the same inclination angle.

[0008] Furthermore, a first elastic element is provided between the pressure rod and the main slider for resetting after the pressure rod and the main slider slide relative to each other.

[0009] Furthermore, a second elastic element is provided between the secondary slider and the main slider for resetting after relative sliding between the secondary slider and the main slider.

[0010] Furthermore, the secondary slider is provided with a horizontal clamping surface in the vertical direction and at the front end of the wedge-shaped inclined arm for abutting against the side of the multilayer thin plate.

[0011] Furthermore, the top of the pressure rod is provided with a vertical pressing surface extending toward the multilayer sheet for pressing the multilayer sheet downward.

[0012] Furthermore, the main slider has a vertical through hole, and the pressure rod passes through the vertical through hole to achieve horizontal synchronous movement and vertical relative movement between the pressure rod and the main slider.

[0013] Furthermore, the angle d between the wedge-shaped inclined arm of the secondary slider and the horizontal line is an acute angle.

[0014] The beneficial effects of this invention are: 1. The clamping processes of this invention are interconnected, simplifying drive and control, reducing system complexity, and requiring only one drive source to complete all actions, which helps reduce costs and maintenance difficulty; the horizontal and vertical clamping actions are performed synchronously and precisely, which helps improve production cycle time, and the clamping positioning reliability and consistency are strong. At the same time, by setting a pair of wedge-shaped inclined surfaces, the clamping stroke of the pressure rod is driven by the reverse pressure of the auxiliary slider, which quickly completes the vertical clamping positioning, which can effectively improve production cycle time.

[0015] 2. This invention is applicable to multi-layer thin plates of different specifications and sizes; at the same time, by adjusting the wedge angle, the clamping stroke of the pressure rod can be precisely controlled, and the clamping and positioning are reliable.

[0016] 3. The present invention has a simple, compact, reliable, and long service life (the wedge-shaped inclined surface has a large force and friction area, is not easily deformed, and is more wear-resistant than the cylindrical-groove friction pair). It does not require modification of the platform on which it is placed, has strong versatility, saves costs, and has a wide application prospect in the field of multilayer board processing (such as the circuit board drilling process). Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings of the embodiments will be briefly described below.

[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0019] Figure 2 This is a schematic diagram of the loosened and clamped states of the present invention.

[0020] Explanation of reference numerals in the attached figures: 1. Secondary slider; 2. First elastic element; 3. Pressure rod; 4. Second elastic element; 5. Main slider; 6. Multilayer thin plate; 7. Horizontal groove; 8. Wedge-shaped inclined arm; 9. Second wedge-shaped inclined surface; 10. First wedge-shaped inclined surface; 11. Vertical pressing surface; 12. Horizontal clamping surface; 13. Vertical through hole. Detailed Implementation

[0021] To make the technical problems to be solved, the technical solutions, and the beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

[0022] Please refer to Figure 1 , Figure 2 As shown, this embodiment of a multilayer thin plate wedge clamping mechanism includes a horizontal groove 7, a main slider 5, a secondary slider 1, a pressure rod 3, a first elastic element 2, and a second elastic element 4. The horizontal groove 7 is disposed below the multilayer thin plate 6, which includes a circuit board copper substrate. The main slider 5 and the secondary slider 1 share the horizontal groove 7 and can slide horizontally within it. The secondary slider 1 is simultaneously horizontally connected to the main slider 5. A second elastic element 4 is disposed between the secondary slider 1 and the main slider 5. The second elastic element 4 is a horizontal compression spring, with one end connected to the rear end of the main slider 5 and the other end connected to the side of the secondary slider 1 away from the multilayer thin plate 6. In another embodiment, the second elastic element 4 can also be a tension spring, with one end connected to the front end of the main slider 5 and the other end connected to the side of the secondary slider 1 closer to the multilayer thin plate 6. In the absence of external force, the secondary slider 1 is positioned close to the clamped multilayer thin plate 6 under the action of the second elastic element 4.

[0023] The main slider 5 has a vertical through hole 13 at its rear end. The pressure rod 3 passes through the vertical through hole 13 and slides vertically with the main slider 5, simultaneously enabling the pressure rod 3 and the main slider 5 to move horizontally synchronously. A pair of wedge-shaped inclined surfaces are provided between the auxiliary slider 1 and the pressure rod 3, which cooperate to press the pressure rod 3 down when the auxiliary slider 1 and the main slider 5 move towards each other. The auxiliary slider 1 is provided with an upwardly inclined wedge-shaped arm 8. The pair of wedge-shaped inclined surfaces includes a downwardly inclined first wedge-shaped inclined surface 10 on the lower surface of the wedge-shaped inclined arm 8 and an upwardly inclined second wedge-shaped inclined surface 9 in the middle of the pressure rod 3. The angle d between the wedge-shaped inclined arm 8 of the auxiliary slider 1 and the horizontal line is an acute angle. When the angle d is less than 45°, the vertical stroke of the pressure rod 3 is less than the horizontal stroke of the main slider 5 (the size of the vertical stroke corresponds to the range of thickness variation of the multi-layer thin plate 6 that the device can adapt to); conversely, the vertical stroke of the pressure rod 3 will be greater than the horizontal stroke of the main slider 5, which can achieve rapid pressing, improve transmission efficiency, and increase production cycle time. The auxiliary slider 1 is provided with a horizontal clamping surface 12 in the vertical direction and at the front end of the wedge-shaped inclined arm 8. The horizontal clamping surface 12 is used to abut against the side of the multilayer thin plate 6.

[0024] A first elastic element 2 is provided between the pressure rod 3 and the main slider 5 to drive the pressure rod 3 and the main slider 5 to slide relative to each other and then reset. The first elastic element 2 is a vertical compression spring, with one end connected to the upper end face of the vertical through hole 13 and the other end fixedly connected to the middle of the pressure rod 3. In the absence of external force, the pressure rod 3 is at its highest point under the action of the vertical compression spring, and the high point is limited by the first wedge-shaped inclined surface 10. When a force is applied to the main slider 5 to push the clamping mechanism toward the side of the multilayer thin plate 6, the auxiliary slider 1 is blocked by the side of the multilayer thin plate 6, and the pressure rod 3 can automatically press the upper surface of the multilayer thin plate 6. The top of the pressure rod 3 is provided with a vertical clamping surface 11 extending toward the multilayer thin plate 6 for pressing the multilayer thin plate 6 downward.

[0025] The entire clamping mechanism can move to the right under the action of the main slider 5's motion force I. After the secondary slider 1 is blocked by the side of the multi-layer thin plate 6, the pressure rod 3 begins to move vertically downward to clamp the multi-layer thin plate 6, thereby achieving the clamping function requirement. In this embodiment, multiple clamping mechanisms can be set up, symmetrically distributed on both sides of the multi-layer thin plate 6 for clamping.

[0026] In the absence of any external force, the clamping mechanism is in the released state. Both the main slider 5 and the auxiliary slider 1 are confined within the horizontal groove 7. Under the action of the second elastic element 4, the auxiliary slider 1 is relatively stationary to the right of the inside of the main slider 5. The pressure rod 3 is pushed upward under the action of the first elastic element 2, and its highest position is restricted by the wedge-shaped inclined arm 8 of the auxiliary slider 1.

[0027] After an external force (the motion force I of the main slider 5) is applied, the entire clamping mechanism begins to move to the right from its relatively open position until it is blocked by the multi-layer thin plate 6. The motion force I of the main slider 5 can be, but is not limited to, power provided by a cylinder; for example, it could be provided by a linear electric cylinder or other actuator. Two motion friction pairs are in operation: one is the main slider motion horizontal friction pair B between the main slider 5 and the horizontal slide groove 7, and the other is the auxiliary slider motion horizontal friction pair A between the auxiliary slider 1 and the horizontal slide groove 7.

[0028] Even after the entire mechanism is blocked by the multi-layer thin plate 6, the intervention of external force (the main slider's motion force I) does not stop. The main slider 5 continues to move to the right along the horizontal slide 7, while the auxiliary slider 1 stops moving due to the blockage of the multi-layer thin plate 6. At this time, the second elastic element 4 is compressed by the auxiliary slider 1, and the horizontal clamping surface 12 clamps the side of the multi-layer thin plate 6. In addition to continuing to move to the right with the main slider 5, the pressure rod 3 also moves downward continuously under the drive of the first wedge-shaped inclined surface 10 and the second wedge-shaped inclined surface 9 until its vertical pressing surface 11 contacts the upper surface of the multi-layer thin plate 6, thus achieving the pressing function. During this process, the main slider's motion force I is converted into the spring compression force of the second elastic element 4 and acts on the auxiliary slider 1. The auxiliary slider 1 is blocked by the multi-layer thin plate 6, generating a reaction force. This reaction force acts on the second wedge-shaped inclined surface 9 of the pressure rod 3 through the first wedge-shaped inclined surface 10 of the auxiliary slider 1. Its vertical component is the pressure rod 3's motion force II, which is downward in direction and is the pressing force. During this process, three friction pairs are in operation: one is the horizontal friction pair B between the main slider 5 and the horizontal slide 7; one is the vertical friction pair C between the pressure rod 3 and the main slider 5; and one is the angled friction pair D between the first wedge-shaped inclined surface 10 and the second wedge-shaped inclined surface 9.

[0029] Among them, the clamping force F applied by the pressure bar 3 to the multilayer thin plate 6 压紧 :F 压紧 ≈Ⅰ tg(d).

[0030] When the secondary slider 1 is blocked, the main slider 5 continues to move to the right, while the pressure rod 3 begins to move downwards until it contacts the multi-layer thin plate 6. At this time, the motion stroke of the main slider 5 relative to the multi-layer thin plate 6 is b; the motion stroke of the secondary slider 1 relative to the main slider 5 is a, and the motion stroke of the secondary slider 1 relative to the multi-layer thin plate 6 is ba; the following relationship exists between b and c: b = c / tg(d).

[0031] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A multi-layer thin plate wedge-shaped clamping mechanism, characterized in that, It includes a horizontal slide groove (7), a main slider (5) slidably disposed in the horizontal slide groove (7), a secondary slider (1) slidably connected to the main slider (5) for abutting against the side of the multilayer thin plate (6), and a pressure rod (3) slidably connected to the main slider (5) for pressing the upper surface of the multilayer thin plate (6). A pair of wedge-shaped inclined surfaces are provided between the secondary slider (1) and the pressure rod (3) to cooperate with each other to press the pressure rod (3) down when the secondary slider (1) and the main slider (5) move towards each other.

2. The multi-layer thin plate wedge clamping mechanism according to claim 1, characterized in that: The auxiliary slider (1) is provided with an upwardly inclined wedge-shaped arm (8), and the pair of wedge-shaped inclined surfaces include a downwardly inclined first wedge-shaped inclined surface (10) provided on the lower surface of the wedge-shaped inclined arm (8) and an upwardly inclined second wedge-shaped inclined surface (9) provided in the middle of the pressure rod (3).

3. The multi-layer thin plate wedge clamping mechanism according to claim 1, characterized in that: A first elastic element (2) is provided between the pressure rod (3) and the main slider (5) for resetting after relative sliding.

4. The multi-layer thin plate wedge clamping mechanism according to claim 1, characterized in that: A second elastic element (4) is provided between the secondary slider (1) and the main slider (5) for resetting after relative sliding.

5. The multi-layer thin plate wedge clamping mechanism according to claim 1, characterized in that: The secondary slider (1) is provided with a horizontal clamping surface (12) for abutting against the side of the multilayer thin plate (6) in the vertical direction and at the front end of the wedge-shaped inclined arm (8).

6. The multi-layer thin plate wedge clamping mechanism according to claim 1, characterized in that: The top of the pressure bar (3) is provided with a vertical pressing surface (11) extending toward the multilayer sheet (6) for pressing the multilayer sheet (6) downward.

7. The multi-layer thin plate wedge clamping mechanism according to claim 1, characterized in that: The main slider (5) has a vertical through hole (13), and the pressure rod (3) passes through the vertical through hole (13).

8. The multi-layer thin plate wedge clamping mechanism according to claim 1, characterized in that: The angle d between the wedge-shaped inclined arm (8) of the secondary slider (1) and the horizontal line is an acute angle.