A pick-and-place machine for producing LED lamp beads

Abstract

The application discloses a patching machine for producing LED lamp beads, and belongs to the field of LED lamp bead production equipment, and solves the problems of automatic production of patching LED and pin welding and packaging to form LED lamp beads, and the technical scheme for solving the problems is that a clamp overturning device is arranged between a patching LED welding device and a patching LED packaging device, the clamp overturning device drives the clamp to overturn 180 degrees up and down, the patching LED on the clamp faces downward, and the pin faces upward, the patching LED packaging device comprises a packaging glue accommodating cavity and a packaging glue lifting mechanism for driving the packaging glue accommodating cavity to lift, and the clamp is moved to a working position of the patching LED packaging device after being overturned, the packaging glue accommodating cavity is lifted, and the packaging glue wraps the patching LED and the welding position of the patching LED and the pin. The application mainly ensures that the packaging glue uniformly covers the welding position, and significantly improves product yield and production efficiency.

Description

Technical Field

[0001] This invention relates to automated production equipment, and in particular to a chip mounter for producing LED beads. Background Technology

[0002] Existing technology CN119042549A discloses an LED bulb, including a glass lampshade and LED beads. The LED beads are encapsulated within the glass lampshade. Each LED bead includes a first pin, a second pin, an LED light-emitting element, and a package. The first pin and the second pin extend from the bottom of the glass lampshade. The first pin has a first bent section at its tip, and the second pin has a second bent section at its tip. The first and second bent sections are substantially on a first plane forming a mounting platform. The first plane is substantially perpendicular to the axial direction of the glass lampshade. The first and second bent sections are separate and bend in opposite directions. The LED light-emitting element is fixed to the mounting platform and electrically connected to the first and second bent sections respectively. The package encapsulates the LED light-emitting element and the welded joints between the LED light-emitting element and the first and second bent sections. The pin structure is relatively complex, and automated production requires the development of supporting automated equipment to manufacture the LED beads. Meanwhile, in order to ensure the encapsulation effect of the LED light source and the welding joint between the LED light source and the first and second bending sections, it is necessary to design an encapsulation scheme in the automated equipment to achieve uniform light transmission and good light emission effect of the encapsulated LED beads. Summary of the Invention

[0003] The purpose of this invention is to provide a chip mounter for producing LED beads, which solves the problem of automated production of chip LEDs, lead soldering, and encapsulation to form LED beads, ensuring that the encapsulating adhesive evenly covers the soldering area, and significantly improving product yield and production efficiency.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: a chip mounter for producing LED chips, comprising a frame and a material turntable, a lead feeding device, a lead flattening device, a lead forming device, a lead soldering device, a chip LED feeding device, a chip LED soldering device, a chip LED encapsulation device, an encapsulation adhesive curing device, and an LED chip detection and discharge device disposed on the frame. The lead feeding device, lead flattening device, lead forming device, lead soldering device, chip LED feeding device, chip LED soldering device, chip LED encapsulation device, encapsulation adhesive curing device, and LED chip detection and discharge device are arranged sequentially around the material turntable. The material turntable is equipped with multiple clamps for clamping the leads. The turntable drives the fixture to stop sequentially at the stations of the lead feeding device, lead flattening device, lead forming device, lead soldering device, surface mount LED feeding device, surface mount LED welding device, surface mount LED packaging device, and LED bead detection and unloading device. A fixture flipping device is provided between the surface mount LED welding device and the surface mount LED packaging device. The fixture flipping device drives the fixture to rotate 180 degrees up and down, so that the surface mount LED on the fixture faces down and the lead faces up. The surface mount LED packaging device includes a packaging glue receiving cavity and a packaging glue lifting mechanism that drives the packaging glue receiving cavity to rise and fall. After the fixture is flipped, it moves to the station of the surface mount LED packaging device, and the packaging glue receiving cavity rises, so that the packaging glue wraps the surface mount LED and the welding part with the lead.

[0005] By adopting the above technical solution, the present invention has the following advantages: This technical solution effectively solves the problem of automated production of LED beads with complex pin structures by constructing a circular automated production line and combining it with a fixture flipping mechanism. The core lies in optimizing the packaging process to ensure that the encapsulating adhesive can completely wrap the key parts, while achieving continuous and efficient connection between each process. Specifically, the frame provides overall support, ensuring stable operation of each device; the material turntable, as the core transmission component, drives the fixtures to move sequentially in a cyclical manner, achieving continuous production; the lead feeding device, lead flattening device, lead forming device, and lead soldering device sequentially complete the pre-processing of the leads, forming a stable mounting platform; the surface mount LED feeding device supplies LED components; the surface mount LED soldering device precisely solders the LEDs onto the lead mounting platform; the fixture flipping device immediately flips the fixture 180 degrees after soldering, so that the surface mount LEDs face down and the leads face up, creating an ideal orientation for packaging; the encapsulation adhesive receiving cavity of the surface mount LED packaging device rises under the drive of the lifting mechanism, wrapping the surface mount LEDs and soldering parts from below, ensuring uniform coverage of the encapsulation adhesive; the LED bead inspection and unloading device completes the final inspection and unloading; the fixtures set on the material turntable reliably clamp the leads, ensuring the processing stability of each station; the circumferential arrangement of each device allows the material turntable to accurately drive the fixtures to stop at designated stations, forming an efficient production line. These features work together: the material turntable moves the fixture sequentially to complete the entire process from lead unloading to inspection and unloading; the fixture flipping device switches orientations between soldering and encapsulation, allowing the encapsulating adhesive to rise from below and completely wrap the LED and soldering parts, avoiding incomplete wrapping caused by orientation issues in traditional encapsulation, thus adapting to the automated production needs of complex lead structures.

[0006] Furthermore, the clamp flipping device includes a rotating clamp and a drive assembly that drives the rotating clamp to flip 180 degrees, the rotating clamp cooperating with the clamp to drive the clamp to flip.

[0007] By employing the aforementioned technical solution, the stability and accuracy issues during the fixture flipping process are effectively resolved through the coordinated design of the rotating clamp and the drive assembly. The cooperative mechanism between the rotating clamp and the fixture ensures reliable fixation of the fixture during flipping, preventing displacement caused by mechanical vibration or inertia, thereby maintaining the precise position of the surface-mount LED. The drive assembly provides precise 180-degree rotation control, ensuring the repeatability and consistency of the flipping angle, allowing the fixture to be accurately positioned at the packaging station after flipping. The cooperative driving method of the rotating clamp and the fixture makes the entire flipping action smooth and stable, reducing impact on the surface-mount LED, protecting the integrity of the soldering area, and ensuring that the encapsulating adhesive can evenly cover the surface-mount LED and its soldering area with the pins, providing a reliable foundation for subsequent packaging operations. This design not only enhances the reliability of the flipping process but also avoids packaging defects caused by positioning deviations, improving overall production quality.

[0008] Furthermore, the drive assembly includes a clamp flipping driver, a drive gear, and a driven gear. The drive gear is driven to rotate by the clamp flipping driver. The driven gear meshes with the drive gear and is coaxially fixed with the rotating clamp. The clamp includes a clamp body and a clamp base. The clamp body is rotatably connected to the clamp shaft, and the clamp shaft is connected to the clamp base. The clamp base is mounted on the material turntable. There are two clamp bodies, with an intermediate body between them. The two clamp bodies can move closer to each other to clamp the pins or move away from each other to release the pins. The rotating clamp has a slot that mates with the clamp. The clamp shaft has a block that mates with the slot. The block mates with the slot so that the rotation axis of the rotating clamp coincides with the axis of the clamp shaft.

[0009] By adopting the aforementioned technical solution and through the coordinated design of the drive component and the fixture structure, the positioning problem caused by axial misalignment during the flipping process is solved. The fixture flipping driver directly drives the drive gear to rotate, avoiding the accumulation of errors in intermediate transmission links and ensuring the initial accuracy of the rotational action; the meshing motion of the drive gear and the driven gear uses the rigid contact characteristics of the gear pair to maintain transmission stability and prevent slippage or delay; the driven gear is coaxially fixed with the rotating fixture, so that the rotation of the rotating fixture is completely synchronized with the gear system, eliminating the shaking caused by loose connections. The fixture base is mounted on the material turntable, providing a rigid foundation for the entire fixture and resisting vibration interference during turntable operation; the fixture shaft is connected to the fixture base, forming a stable rotation fulcrum; the fixture body is rotatably connected to the fixture shaft, allowing the fixture body to rotate freely during flipping without being constrained by the support. An intermediate body is placed between the two fixture bodies. The pins are clamped and released by moving closer to or further away from the intermediate body. This symmetrical structure ensures that the clamping force is evenly distributed and avoids pin deformation. The slot of the rotating fixture cooperates with the block on the fixture shaft. The key is the precise engagement of the block and the slot, which makes the rotation axis of the rotating fixture strictly coincide with the axis of the fixture shaft. This fundamentally eliminates axial offset and radial runout during the flipping process, ensuring that the LED is precisely facing down and the pin is facing up after the fixture is flipped 180 degrees. This provides a reliable positioning basis for the encapsulation glue to evenly wrap the soldering parts, improving the encapsulation integrity and production efficiency.

[0010] Furthermore, the lead unloading device includes a lead wire unwinding spool, a lead wire ring, a heater, a traction device, and a cutting assembly arranged sequentially from high to low. The unwinding spool is used to mount the wound lead wires. The lead wire ring is arranged laterally in the axial direction and has an annular groove in the circumference to control the spacing between two lead wires. The heater includes a heating cylinder with an inner hole extending vertically through it. The lead wire passes through the inner hole of the heating cylinder. The traction device includes a lead clamping assembly that clamps the lead wires and a wire clamping lifting assembly that moves the lead clamping assembly up and down. The lead unloading device also includes a first push clamping assembly that opens the clamp. The first push clamping assembly moves closer to or away from the clamp. The traction device pulls the lead wires down to the clamp. The first push clamping assembly pushes open the clamp so that the lead wires can be inserted into the clamp and move away from the clamp so that the clamp resets and clamps the lead wires. The cutting assembly cuts the lead wires.

[0011] By adopting the aforementioned technical solution and systematically designing the component layout and functional coordination of the lead wire feeding device, the core defects in lead wire processing are effectively solved. Overall, the lead wire unwinding spool, wire ring, heater, traction device, and cutting assembly, arranged sequentially from high to low, form a continuous feeding process, ensuring that the lead wire is transported smoothly under gravity assistance and avoiding the jamming problem caused by chaotic paths in traditional solutions. The unwinding spool provides a stable source of lead wires, laying the foundation for subsequent processing. The axial and lateral setting of the lead wire ring, combined with the circumferential annular groove, precisely constrains the spacing between two lead wires based on their physical deformation characteristics, solving the problem of asymmetry in the welding platform caused by spacing fluctuations. The through-hole design of the heating cylinder in the heater ensures that the lead wires are uniformly heated as they pass through, and preheated to a suitable temperature based on the thermal conductivity characteristics of the lead wire material, improving the reliability of solder melting. The lead clamping assembly of the traction device is linked with the wire clamping lifting assembly, dynamically pulling down the lead wires according to the position of the clamp, ensuring that the lead wires are accurately positioned at the clamp entry. The movement mechanism of the first push clamping assembly actively triggers the opening and closing action based on the clamp status. When the first push clamping assembly approaches, it pushes the clamp to open to accommodate the lead wire insertion, and when it moves away, it releases the clamp to reset and tighten, overcoming the risk of lead detachment caused by clamp operation lag. The cutting assembly immediately cuts the lead wires after the traction device is pulled down to the position, completing the quantitative feeding. Each feature is optimized to address specific defects: the geometric design of the annular groove directly corresponds to the spacing control requirements, the through-hole structure of the heating cylinder is adapted to the continuous movement characteristics of the pin line, and the timing coordination between the first push clamp assembly and the traction device ensures the synchronization of pin insertion and clamping, thereby improving the overall material feeding accuracy and production continuity.

[0012] Furthermore, the pin forming device includes a first pin bending forming component and a second pin bending forming component. Both the first and second pin bending forming components include two molding parts that clamp the pin to form an inclined bending section. The first pin bending forming component also includes a first stamping part that moves from the inside to the outside. After the molding part of the first pin bending forming component clamps the first pin, the first stamping part moves from the inside to the outside relative to the material turntable to bend the top of the first pin outward to form a horizontal bending section. The second pin bending forming component also includes a second stamping part that moves from the outside to the inside. After the molding part of the second pin bending forming component clamps the second pin, the second stamping part moves from the outside to the inside relative to the material turntable to bend the top of the second pin inward to form a horizontal bending section.

[0013] By employing the aforementioned technical solution, the challenge of bidirectional lead bending is precisely addressed through a discrete component design, ensuring the stable construction of the mounting platform. Specifically, the lead forming device utilizes independent configurations of a first lead bending forming component and a second lead bending forming component. This addresses the differentiated requirements of the first lead needing to bend outwards and the second lead needing to bend inwards, avoiding interference and precision loss in bidirectional bending with a single component, thus laying a structural foundation for subsequent SMD LED mounting. Each component is equipped with two molding parts that clamp the lead to form an inclined bending section. The clamping operation of the molding parts pre-forms the inclined bending section, which serves as the bending starting reference, effectively constraining the lead's displacement freedom during subsequent horizontal bending and reducing forming errors caused by initial positioning deviations. The first pin bending and forming assembly is equipped with a first stamping component that moves from the inside out. After the molding component is clamped, the first stamping component moves from the inside out according to the radial layout of the material turntable, bending the tip of the first pin outward to form a horizontal bending segment. This inward-outward movement direction coordinates with the rotation path of the material turntable, utilizing the spatial extension characteristics to achieve smooth bending, avoiding pin distortion under force, and ensuring precise control of the outward angle of the horizontal bending segment. The second pin bending and forming assembly is equipped with a second stamping component that moves from the outside in. After the molding component clamps the second pin, the second stamping component moves from the outside in in the opposite radial direction of the material turntable, bending the tip of the second pin inward to form a horizontal bending segment. The inward movement direction addresses the inward bending requirement of the second pin, complementing the outward bending of the first pin, and together constructing a symmetrical and stable mounting platform. This allows the surface-mount LED to be firmly fixed on the plane formed by the inclined bending segment and the horizontal bending segment, improving the positioning accuracy and structural reliability of the welding process.

[0014] Furthermore, the pin soldering device includes a first solder container, a second solder container, and a solder lifting assembly that drives both containers to move up and down. The bottom ends of the first solder container and the second solder container are respectively provided with discharge ports. The solder lifting assembly drives the first solder container and the second solder container to descend, so that the discharge port of the first solder container is close to the horizontal bend of the first pin to add solder, and the discharge port of the second solder container is close to the horizontal bend of the second pin to add solder.

[0015] By employing the aforementioned technical solution and utilizing a dual-container independent control mechanism, the challenge of precise solder addition in a dual-pin structure is effectively solved. The design of the first and second solder containers, taking into account the separation of the first and second pins, achieves independent isolation of the solder addition path, avoiding interference to the other pin during single-container operation and ensuring that the solder only acts on the target pin. The design of the discharge ports at the bottom of the first and second solder containers allows solder to flow steadily from the bottom of the containers. This method of directional control of the flow based on the horizontal bending section position of the pin ensures precise solder coverage of the welding area and prevents solder from spreading to non-welding areas. The solder lifting assembly drives the two containers to descend synchronously, causing the discharge port to dynamically approach the pin during solder addition. This mechanism, which adjusts in real time based on the height of the pin after it has formed, reduces solder splashing and oxidation during the descent, improving addition accuracy. Simultaneously, because the horizontal bending sections of the first and second pins are fixed, the synchronous lifting of the dual containers allows for simultaneous solder addition to both pins, significantly shortening the process time. The operation of bringing the discharge port close to the horizontal bending section, combined with the structural features formed by the lead forming device, ensures that the solder acts directly on the key welding parts, providing a uniform and reliable solder base for subsequent surface mount LED welding, thereby ensuring welding strength and electrical connection stability.

[0016] Furthermore, the surface mount LED feeding device includes a surface mount LED tape unwinding rack, a surface mount LED tape conveying track, and a surface mount LED pick-up assembly. The surface mount LED tape unwinding rack is used to place the rolled surface mount LED tape, the surface mount LED tape conveying track is used to guide the surface mount LED tape from the surface mount LED tape unwinding rack to the surface mount LED pick-up assembly, and the surface mount LED pick-up assembly is used to pick up the surface mount LED from the surface mount LED tape and move it to the mounting platform formed by the pins.

[0017] By integrating the unwinding, conveying, and picking processes, the aforementioned technical solution systematically solves the accuracy and stability issues in the surface mount LED (SMD) LED feeding process, ensuring that SMD LEDs are reliably positioned on the mounting platform formed by the leads. The SMD LED strip unwinding rack stably holds the rolled SMD LED strip. Based on the characteristics of the LED strip's rolled structure, the unwinding rack provides uniform tension release, preventing the strip from loosening or tangling, thus maintaining continuous feeding and preventing conveying interruptions or positional drift caused by sudden tension changes. The SMD LED strip conveyor track precisely guides the SMD LED strip from the unwinding rack to the picking assembly. Due to the rigid guide design of the track, the LED strip is constrained to a fixed path during movement, eliminating lateral swaying and ensuring that each SMD LED reaches the picking point at a consistent height, providing a reliable reference for subsequent gripping. The surface mount LED pick-up assembly picks up surface mount LEDs from the LED strip and moves them to the mounting platform. Based on the stable position information provided by the conveyor track, the pick-up assembly can accurately identify and grab individual surface mount LEDs. Its moving mechanism is positioned based on the spatial coordinates of the mounting platform, avoiding placement errors caused by positional deviations and directly improving the alignment accuracy between the surface mount LED and the lead soldering part.

[0018] Furthermore, the surface mount LED welding device includes a hot air pipe, a cooling pipe, and a holding member. The hot air pipe is mounted on a translation assembly, and the outlet of the hot air pipe is lower than the mounting platform formed by the pins. The translation assembly drives the hot air pipe to move inward so that the outlet of the hot air pipe is located below the surface mount LED. The hot air blown out of the outlet of the hot air pipe causes the solder to weld and fix the surface mount LED to the pins. The hot air pipe welds and fixes the surface mount LED on the fixture to the pins. The cooling pipe is used to blow cold air to the surface mount LED to cool the solder quickly. There is at least one cooling pipe and it is located downstream of the hot air pipe. The holding member is used to press the surface mount LED onto the mounting platform to keep it stable during the soldering process. The holding member is connected to the welding lifting assembly and has two holding ends that press against the surface mount LED.

[0019] By employing the aforementioned technical solution, the coordinated design of the hot air duct, cooling duct, and clamping components effectively addresses the issues of slow solder cooling and insufficient stability of surface-mount LEDs during the welding process. The hot air duct outlet is positioned below the mounting platform formed by the leads and is moved inward by a translation component to below the surface-mount LED. This positioning ensures that the hot air directly acts on the solder area at the bottom of the surface-mount LED, preventing energy loss during transmission and thus efficiently melting the solder for a strong weld. Two hot air ducts can be configured to handle two fixture stations simultaneously. Based on the continuous flow of the material turntable, this significantly reduces the waiting time for each weld and increases overall production capacity. The cooling duct is located downstream of the hot air duct and blows cold air onto the surface-mount LED. Utilizing the natural airflow direction after the hot air duct begins operation, the cold air covers the solder joint instantly upon completion of welding. This sequential design accelerates the solder curing process and prevents short circuits or deformation caused by excessive solder flow due to slow cooling. The clamping component connects to the welding lifting assembly and presses the surface-mount LED onto the mounting platform during the welding process. Its dual clamping end design applies pressure to two surface-mount LEDs simultaneously. Based on the structural characteristics of the mounting platform formed by the pins, the clamping end precisely presses against the surface-mount LED, effectively suppressing vibration or displacement caused by hot air impact, ensuring precise alignment of the welding position, and improving the welding yield.

[0020] Furthermore, the LED bead detection and unloading device includes a power-on detection chuck, a transfer arm, and a storage rack. The power-on detection chuck faces the LED beads on the fixture. The transfer arm reciprocates between the power-on detection chuck and the storage rack. The fixture moves the packaged LED beads to the power-on detection chuck. The power-on detection chuck is electrically connected to a detection circuit. The LED beads emit light through the power-on detection chuck. The detection circuit is activated through the LED beads and transmits the generated electrical signal to the control system of the transfer arm. The transfer arm picks up the LED beads from the power-on detection chuck and moves them to the storage rack. The LED bead detection and unloading device also includes a second push-clamp assembly that opens the fixture. The second push-clamp assembly moves closer to the fixture to release the fixture's pins. The power-on detection chuck clamps the LED beads. The second push-clamp assembly moves away from the fixture and resets. After the LED beads light up, the power-on detection chuck releases the LED beads. The transfer arm clamps the LED beads and swings downward to place them flat on the storage rack.

[0021] By adopting the aforementioned technical solution, the reliability problem of the automated LED chip unloading process is effectively solved through the systematic integration of detection, clamping, and material transfer functions. The second push-clamp component moves closer to the clamp, causing it to release the pins. This design is based on the inherent state of the clamp continuously holding the pins on the material turntable. Mechanical pushing achieves automatic clamp release, avoiding the problem of incomplete clamping caused by manual intervention or traditional pneumatic methods, ensuring that the LED chip is completely freed from the clamp constraint before detection. The power-on detection chuck clamps the LED chip and conducts light, using the chuck itself as an electrode to provide stable power, allowing the LED chip to light up in a fixed state. Combined with the detection circuit, which captures the conduction signal in real time and converts it into an electrical signal, it sends it to the control system, realizing closed-loop feedback in the detection process. Subsequent actions are triggered only when the LED chip is normally conducting and emitting light, significantly improving detection accuracy and eliminating the risk of misjudgment. After the transfer arm picks up the LED bead from the power-on detection chuck, it swings downwards to lay it flat on the storage rack. This design is based on the characteristic of LED beads being prone to rolling. By swinging downwards, the posture of the LED bead is changed, allowing it to make stable contact with the surface of the storage rack. This avoids rolling or tipping caused by inertia or vibration during horizontal movement, ensuring stable storage of the LED bead. The timing coordination between the second push-clamp assembly moving away from the fixture and the power-on detection chuck releasing the LED bead forms a continuous process of clamp release-detection-transfer. This ensures that the fixture resets in time to take over the next station's task and prevents the LED bead from being disturbed by external forces during transfer. Overall, this optimizes the production cycle and reduces the probability of LED bead damage.

[0022] Furthermore, a second set of clamp flipping device is provided between the LED bead detection and feeding device and the lead feeding device. The clamp flipping device drives the clamp to rotate 180 degrees to reset.

[0023] By adopting the aforementioned technical solution, the orientation reset problem during the cyclic use of the fixture is specifically solved by adding a second set of fixture flipping devices. Specifically, a second set of fixture flipping devices is installed between the LED bead detection and unloading device and the lead unloading device. This position is set in the workstation gap after detection and unloading and before lead unloading, ensuring that the fixture is immediately reoriented after leaving the detection area, avoiding orientation conflicts caused by the flipped fixture directly entering the lead unloading stage. The fixture flipping device rotates the fixture 180 degrees to reset. This action is based on the fact that the fixture has been flipped 180 degrees by the first set of flipping devices during the packaging and detection process. Through precise rotation, the fixture is restored from the state of the surface-mount LED facing down to the initial posture of the lead facing up. This ensures that when the fixture moves to the lead unloading device, it can accurately cooperate with the first push clamping component and the cutting component, realizing the reliable insertion, clamping and cutting of new lead wires, and maintaining the automated production rhythm of continuous operation of the material turntable. Attached Figure Description

[0024] The present invention will be further described below with reference to the accompanying drawings: Figure 1This is a schematic diagram (isometric view) of a chip mounter for producing LED beads according to the present invention. Figure 2 This is a schematic diagram (top view) of a chip mounter for producing LED beads according to the present invention. Figure 3 This is a schematic diagram (a) of the pin feeding device in this invention; Figure 4 This is a schematic diagram (II) of the pin feeding device in this invention; Figure 5 This is a schematic diagram (III) of the pin feeding device in this invention; Figure 6 This is a schematic diagram of the first push-clamp assembly in the present invention; Figure 7 This is a schematic diagram (a) of the pin clamping device in this invention; Figure 8 This is a schematic diagram (II) of the pin clamping device in this invention; Figure 9 This is a schematic diagram (a) of the first pin bending and forming component in this invention; Figure 10 This is a schematic diagram (II) of the first pin bending and forming component in this invention; Figure 11 This is a schematic diagram (a) of the second pin bending and forming component in this invention; Figure 12 This is a schematic diagram (II) of the second pin bending and forming component in this invention; Figure 13 This is a schematic diagram of the adjustment clip assembly in this invention; Figure 14 A schematic diagram (a) of the pin soldering device in this invention; Figure 15 Schematic diagram (II) of the pin soldering device in this invention; Figure 16 This is a schematic diagram of the surface mount LED feeding device in this invention; Figure 17 This is a schematic diagram (a) of the surface mount LED welding device in this invention; Figure 18 This is a schematic diagram (II) of the surface mount LED welding device in this invention; Figure 19 This is a schematic diagram of the surface mount LED packaging device in this invention; Figure 20 This is a schematic diagram (a) of the clamp flipping device in this invention; Figure 21 This is a schematic diagram showing the clamp flipping device and the corresponding clamp in this invention; Figure 22This is a schematic diagram (II) of the clamp flipping device in this invention; Figure 23 This is a schematic diagram of the encapsulating adhesive curing device in this invention; Figure 24 This is a schematic diagram (outlet side) of a chip mounter for producing LED beads according to the present invention. Figure 25 This is a schematic diagram of the LED bead detection and discharge device in this invention; Figure 26 This is a schematic diagram of the power-on detection chuck and the second push-clamp assembly facing the fixture in this invention; Figure 27 This is a schematic diagram of the power-on detection clamp and the second push clamp assembly in this invention; Figure 28 for Figure 24 Enlarged view at point X; Figure 29 This is a schematic diagram of the storage rack in this invention; Figure 30 This is a schematic diagram of the storage board in this invention; Figure 31 This is a partial schematic diagram of the LED bead detection and discharging device in this invention (the storage rack is not shown). Figure 32 In this invention Figure 31 Enlarged view of point Y in the middle; Figure 33 This is a schematic diagram of the drive motor and camshaft in this invention; Figure 34 This is a schematic diagram of the camshaft and reciprocating rocker arm in this invention.

[0025] Frame 100, material turntable 200; Fixture 300, fixture base 301, clamping block 3011, fixture body 302, roller 3021, fixture shaft 303, intermediate body 304, fixture seat 305; Adjusting clamp assembly 400, movable clamp 401, adjusting clamp bracket 402, adjusting rod 403, inclined surface 431; Lead feeding device A, support frame A100, hinge frame A111, lead wire unwinding spool A101, wire ring A102, annular groove A121, heater A103, traction device A104, pulling frame A141, lead clamping assembly A142, wire clamping swing rod A1422, wire clamping block A1423, horizontal lever A1432, wire clamping lifting assembly A143, cutting assembly A105, punch shears A151, first push clamp assembly A16, first push clamp bracket A162, first push clamp slider A163, first push head A1631, first connecting rod A171, intermediate crank arm A172, second connecting rod A173; Pin flattening device B, clamping jaw B100, flattening bracket B101, clamping gap B102, flattening cam B103, clamping lever B104; The device comprises: a lead forming device C; a first lead bending and forming assembly C100; a molding part C11; a first stamping part C12; a second stamping part C13; a first column C101; a first reciprocating rod C102; a second reciprocating rod C103; a first sliding part C131; a third reciprocating rod C104; a second sliding part C141; a first forming gap C105; a first lifting rod C106; a first working groove C161; a second working groove C162; a guide surface C163; a second lead bending and forming assembly C200; a second column C201; a fourth reciprocating rod C202; a fifth reciprocating rod C203; a third sliding part C231; a sixth reciprocating rod C204; a fourth sliding part C241; a second forming gap C205; a second lifting rod C206; a third working groove C261; and a fourth working groove C262. Pin soldering device E, first solder container E100, second solder container E200, solder lifting assembly E300, discharge port E00, linkage bracket E11; SMD LED feeding device F, SMD LED tape conveyor track F100, suction assembly F101, SMD LED tape unwinding rack F102, guide wheel F103, vacuum nozzle F104, reciprocating rod F105, material transfer lifting rod F106; SMD LED welding device G, hot air pipe G100, cooling pipe G200, clamping component G300, clamping end G31, translation slider G41, translation bracket G42, lifting slider G51, welding lifting bracket G52; SMD LED packaging device H, encapsulating adhesive receiving cavity H100, encapsulating adhesive receiving cup H101, inner cup body H11, outer cup body H12, return pipe H13, adhesive delivery pipe H14, encapsulating adhesive lifting mechanism H200, encapsulation lifting rod H21, encapsulation lifting bracket H22, extension arm H23, extrusion pump H24, guide pipe H241; Encapsulating adhesive curing device I, ultraviolet lamp I100, light shield I200; LED bead detection and discharge device J, discharge bracket J100, power-on detection chuck J101, material transfer arm J102, air intake J1021, storage rack J103, support rail J131, storage plate J132, partition rib J1321, receiving groove J1322, support rib J1323, push plate head J133, push plate arm J134, first stacking groove J135, second stacking groove J136, lifting assembly J137, lifting support J1371, elastic support J138, intermittent plate transfer assembly J139, support sliding block J1390, crank J1391, pawl J1392, ratchet J1393, second push clamp assembly J105, second push clamp slider J151, second push head J1511; The fixture flipping device K, the rotary clamp K100, the slot K101, the flipping drive assembly K200, the drive gear K202, the drive shaft K2021, the driven gear K203, the driven shaft K2031, the bushing K2032, the flipping base K001, and the clutch transmission link K002; Second detector L, first detector M; Drive motor 11, reducer 12, camshaft 13, cam 14, reciprocating rocker arm 15. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The following specific embodiments can be selected to be combined or substituted with each other according to the actual situation, and the same or similar concepts or processes may not be described again in some embodiments.

[0027] like Figures 1 to 34As shown, this invention provides a chip mounter for producing LED chips. The structure of the LED chips is based on the structure disclosed in prior art CN119042549A. The chip mounter includes a frame 100 and a material turntable 200 disposed on the frame 100, a lead feeding device A, a lead flattening device B, a lead forming device C, a lead soldering device E, a chip LED feeding device F, a chip LED soldering device G, a chip LED encapsulation device H, an encapsulation adhesive curing device I, and an LED chip detection and discharge device J. The lead feeding device A, lead flattening device B, lead forming device C, lead soldering device E, chip LED feeding device F, chip LED soldering device G, chip LED encapsulation device H, encapsulation adhesive curing device I, and LED chip detection and discharge device J are arranged sequentially around the material turntable 200. The material turntable 200 is provided with multiple clamps for clamping the leads. The fixture 300, driven by the material turntable 200, sequentially stops at the following stations: lead feeding device A, lead flattening device B, lead forming device C, lead soldering device E, surface mount LED feeding device F, surface mount LED welding device G, surface mount LED packaging device H, and LED bead detection and unloading device J. A fixture flipping device K is provided between the surface mount LED welding device G and the surface mount LED packaging device H. The fixture flipping device K rotates the fixture 300 180 degrees up and down, so that the surface mount LEDs on the fixture 300 face down and the leads face up. The surface mount LED packaging device H includes a packaging adhesive cavity H100 and a packaging adhesive lifting mechanism H200 that drives the packaging adhesive cavity H100 to rise and fall. After being flipped, the fixture 300 moves to the station of the surface mount LED packaging device H, and the packaging adhesive cavity H100 rises, causing the packaging adhesive to wrap around the surface mount LEDs and the welding points with the leads.

[0028] The material turntable 200 can be understood as a rotating platform that carries and transfers the workpiece. It achieves circumferential movement via a motor drive, such as a stepper motor or servo motor, to ensure the fixture 300 can accurately stop between workstations. Furthermore, the fixture 300 can be designed with elastic clamping structures, such as spring clamps or pneumatic grippers, to reliably fix the pins and adapt to different size processing requirements. Specifically, the function of the fixture flipping device K can be achieved in various ways, such as using a linear guide rail combined with a rotating arm, or using a cam mechanism to drive the fixture 300 to complete a 180-degree flip, thus meeting the process requirement of surface-mount LEDs facing down and pins facing up. The encapsulating adhesive receiving cavity H100 in the surface-mount LED encapsulation device H can be designed as a heated container to reduce the viscosity of the encapsulating adhesive, facilitating its uniform coverage of critical areas. The encapsulating adhesive lifting mechanism H200 can achieve lifting movement via a screw drive or hydraulic cylinder, such as using a ball screw combined with a servo motor to achieve high-precision position control. In a preferred embodiment, a regulating valve can be installed at the outlet of the encapsulating adhesive receiving cavity H100 to control the flow rate of the encapsulating adhesive, thereby improving the encapsulation quality and reducing the waste of encapsulating adhesive.

[0029] If the LED beads are not flipped and encapsulation is performed by dripping encapsulating adhesive from top to bottom, the adhesive will only cover the upper surface of the surface-mount LEDs due to the obstruction of the surface-mount LEDs. The solder joints between the leads and the surface-mount LEDs will have difficulty contacting the adhesive, resulting in unreliable encapsulation. The innovation of this invention lies in the automatic adjustment of the orientation of the surface-mount LEDs after soldering to the leads by a clamping and flipping device K. Combined with the encapsulating method where the adhesive rises from below, this not only utilizes gravity to form an aesthetically pleasing LED bead structure but also saves on the amount of encapsulating adhesive used, solving the technical problem of insufficient adhesive coverage of solder joints in the automated production of LED beads with complex lead structures. Furthermore, this solution, through a multi-station design with a circular layout, achieves fully automated operation from lead unloading to finished product inspection and unloading, significantly improving production efficiency. Therefore, this embodiment provides an automated device capable of producing LED beads with complex lead structures, offering a practical solution for related technical fields.

[0030] The working principle of this embodiment is as follows: The frame 100 provides a supporting foundation for the entire equipment. The material turntable 200 is mounted on the frame 100 and serves as the core transmission component. Multiple clamps 300 are evenly distributed around the circumference of the material turntable 200 to clamp leads and circulate between stations. Lead feeding device A, lead flattening device B, lead forming device C, and lead soldering device E are arranged sequentially around the material turntable 200, respectively completing the lead feeding, flattening, forming, and soldering operations to form a stable platform suitable for mounting surface-mount LEDs. The surface-mount LED feeding device F supplies surface-mount LEDs to the clamps 300 on the material turntable 200, and the surface-mount LED soldering device G solders the surface-mount LEDs to the leads using hot air heating. Thus, through the sequential transmission of the material turntable 200, the various devices work together to achieve fully automated production from lead feeding to final inspection and discharge. The fixture flipping device K solves the technical problem of incomplete encapsulation caused by orientation issues in traditional packaging, while optimizing the packaging process and ensuring that LED beads with complex pin structures can be produced in an efficient and stable manner in automated production.

[0031] refer to Figures 3 to 6 This application further proposes a lead unloading device A, which includes a lead wire unwinding spool A101, a lead wire ring A102, a heater A103, a traction device A104, and a cutting assembly A105 arranged in descending order. These components can be centrally mounted on a support frame A100, which serves as the foundation of the overall structure and provides a stable mounting platform. The lead wire unwinding spool A101 is used to mount the wound lead wires. The guide wire ring A102 is arranged laterally in the axial direction and has an annular groove A121 in the circumferential direction to control the spacing between two lead wires. The heater A103 includes a heating cylinder with an inner hole that extends vertically through it. The lead wire passes through the inner hole of the heating cylinder. The traction device A104 includes a lead clamping assembly A142 that clamps the lead wires and a wire clamping lifting assembly A143 that drives the lead clamping assembly A142 to move up and down. The lead unloading device A also includes a first push clamping assembly A16 that opens the clamp 300. The first push clamping assembly A16 moves closer to or away from the clamp 300. The traction device A104 pulls the lead wires down to the clamp 300. The first push clamping assembly A16 pushes open the clamp 300 to allow the lead wires to be inserted into the clamp 300 and move away from the clamp 300, causing the clamp 300 to reset and clamp the lead wires. The cutting assembly A105 cuts the lead wires.

[0032] Among them, the lead ring A102 refers to a guide component with a specific geometric structure, which can be made of metal or high-strength plastic. Its purpose is to precisely constrain the spacing between two lead wires through the circumferentially arranged annular groove A121. The heating cylinder can be understood as a heating element with a through-hole, which can achieve uniform preheating of the lead wires through resistance heating or induction heating. The lead clamping assembly A142 is a mechanical structure capable of generating a stable clamping force, which can be achieved by pneumatic or electric grippers. The first push clamping assembly A16 is an actuator with reciprocating motion function, which can be driven by a linear motor or cylinder.

[0033] Specifically, this solution addresses the core defects in lead wire processing through a systematic design of the layout and functional coordination of each component. The lead wire unwinding spool A101 provides a stable source of lead wires, while the lead wire ring A102, through its annular groove A121, ensures precise spacing between two lead wires, avoiding asymmetry in the soldering platform caused by spacing fluctuations. The through-hole design of the heating cylinder ensures sufficient preheating of the lead wires during transport, improving the reliability of lead wire stretching and straightening. The lead clamping assembly A142 of the puller A104 works in conjunction with the wire clamping lifting assembly A143 to ensure precise positioning of the lead wires at the entrance of the clamp 300. The first push clamp assembly A16 actively triggers opening and closing actions based on the state of the clamp 300; when approaching, it pushes the clamp 300 open to accommodate the lead wire insertion, and when moving away, it releases the clamp 300 to reset and tighten, effectively preventing the risk of lead wire detachment. The cutting assembly A105 immediately performs quantitative cutting after the puller A104 is pulled into position. The organic combination of the above components forms a complete pin blanking process, which significantly improves blanking accuracy and production continuity.

[0034] This application further proposes that the first push clamp assembly A16 includes a first push clamp driver, a first push clamp bracket A162 and a first push clamp slider A163. The first push clamp slider A163 is connected to the first push clamp driver and moves towards or away from the clamp 300 to achieve reciprocating motion driven by the first push clamp driver.

[0035] Specifically, the first push-clamp driver refers to the device that provides power to the first push-clamp slider A163, which can be implemented using a cylinder, hydraulic cylinder, or electric push rod, etc. The first push-clamp bracket A162 is a structural component used to support and fix the movement trajectory of the first push-clamp slider A163. It can be implemented using a metal frame, guide rail, or other rigid support structure, with the aim of ensuring the stability and accuracy of the first push-clamp slider A163 during movement. The first push-clamp slider A163 is the component that is connected to the first push-clamp driver and performs reciprocating motion. It can achieve its sliding function through sliding pairs, ball guide rails, or linear bearings, with the aim of opening or closing the clamp 300 through precise reciprocating motion.

[0036] In detail, the first push-clamp driver acts as a power source, directly driving the first push-clamp slider A163 to reciprocate through a transmission connection. This design simplifies the power transmission path and ensures immediate responsiveness of the action. The first push-clamp bracket A162 provides rigid support, fixing the motion reference of the first push-clamp slider A163 and preventing the slider from wobbling or deviating during movement, thus ensuring the repeatability of the action. Driven by the first push-clamp driver, the first push-clamp slider A163 moves closer to or away from the clamp 300. Its movement amplitude and speed are precisely controlled by the first push-clamp driver, forming a closed-loop control for the opening and closing action of the clamp 300, avoiding clamping failure caused by loose structure. In addition, the reciprocating motion characteristics of the first push-clamp slider A163 are closely integrated with the workflow of the traction device A104 and the cutting component A105, reducing waiting time in the production cycle and improving overall production efficiency.

[0037] Through the above technical solution, the specific structural design of the first push clamp assembly A16 effectively solves the problem of unreliable opening action of the clamp 300, ensures stable clamping of the lead wire, and improves the continuity and adaptability of the entire unloading process.

[0038] This application further proposes that the first push-clamp slider A163 is slidably connected to the first push-clamp bracket A162, the outer end of the first push-clamp slider A163 is connected to the first push-clamp driver, and the inner end of the first push-clamp slider A163 is provided with a first push head A1631 that opens the clamp 300.

[0039] In practical applications, the first push-clamp slider A163 refers to an actuator with reciprocating motion function, which can be implemented using structures such as linear guide pairs, dovetail slide rails, or ball screw pairs. The first push-clamp bracket A162 can be understood as a fixed structure used to support and constrain the movement trajectory of the first push-clamp slider A163; it is typically made of metal profiles and has high rigidity. The first push-clamp driver refers to a power device capable of outputting linear motion, which can be an actuator such as a cylinder, hydraulic cylinder, or electric push rod. The first push head A1631 is a key component acting on the clamp 300, which can be implemented using wedge blocks, cams, or push rods to achieve the opening action of the clamp 300.

[0040] Specifically, this technical solution ensures stable movement of the first push-clamp slider A163 along a predetermined trajectory by forming a sliding engagement between the first push-clamp slider A163 and the first push-clamp bracket A162. The outer end of the first push-clamp slider A163 is directly connected to the first push-clamp driver, which effectively reduces energy loss in intermediate links and improves response speed and motion accuracy. When the first push-clamp driver drives the first push-clamp slider A163 to move towards the clamp 300, the first push head A1631 at the inner end of the first push-clamp slider A163 gradually approaches the clamp 300 and eventually acts on a specific part of the clamp 300 to open it. This structural design not only ensures the reliability of the clamp 300's opening action but also achieves precise control of the pin clamping and releasing process.

[0041] Based on this, the sliding connection between the first push-clamp slider A163 and the first push-clamp bracket A162 forms a stable guiding system, avoiding the shaking or offset phenomena that may occur in traditional methods. The first push-clamp driver transmits power to the first push-clamp slider A163 through direct transmission, ensuring effective transmission of driving force. As a key actuator, the first push head A1631 can accurately trigger the opening action of the clamp 300 under the drive of the first push-clamp slider A163, thereby solving the problems of unstable movement and low transmission efficiency of the first push-clamp assembly A16. Through the above technical solution, the automation efficiency and processing quality of the pin feeding device are significantly improved.

[0042] This application further proposes that the outer end of the first push-clamp slider A163 is connected to the push-clamp driver through a linkage mechanism. The support frame A100 is provided with a hinge frame A111. The linkage mechanism includes a first link A171, an intermediate crank arm A172 and a second link A173. The two ends of the first link A171 are respectively hinged to the outer end of the first push-clamp slider A163 and the top end of the intermediate crank arm A172. The intermediate crank arm A172 is rotatably connected to the hinge frame A111. The other end of the intermediate crank arm A172 is hinged to the second link A173. The second link A173 is connected to the first push-clamp driver.

[0043] Specifically, a linkage mechanism refers to a motion transmission system formed by multiple rigid components connected by hinges or rotations. It can be implemented using a four-bar linkage, a crank-slider mechanism, etc. The first linkage A171 is a key component connecting the first push-clamp slider A163 and the intermediate crank arm A172. It can be a straight rod, a curved rod, etc., to adapt to different installation space requirements. The intermediate crank arm A172, as the core component for force transmission, can be designed as a single-arm or double-arm structure, depending on the required torque amplification factor. The hinge frame A111 is a fixing device that provides rotational support for the intermediate crank arm A172. It can be fixed to the support frame A100 by welding, bolting, etc. The second linkage A173 is a transition component connecting the intermediate crank arm A172 and the first push-clamp actuator. Its length and shape can be adjusted according to the actual installation position.

[0044] In detail, this solution achieves smooth reciprocating motion of the first push-clamp slider A163 through a linkage mechanism design. The power output from the first push-clamp driver is first transmitted to the second link A173, and after the lever action of the intermediate crank arm A172, it is converted into linear motion of the first push-clamp slider A163 through the first link A171. This multi-stage transmission method effectively avoids stress concentration problems that may occur with direct connection. The design of the intermediate crank arm A172 rotatably connected to the hinge frame A111 allows the output force of the first push-clamp driver to be reasonably distributed and transmitted, ensuring that the first push-clamp slider A163 maintains a stable trajectory during reciprocating motion. At the same time, the hinged connection between the components allows for a certain degree of angle adjustment, which not only reduces frictional resistance during movement but also automatically compensates for positional offsets caused by manufacturing errors or assembly deviations. Through this structural design, the reliability of the push-clamp action and the stability of equipment operation are significantly improved, making it particularly suitable for automated feeding scenarios of slender Dumex wire leads.

[0045] This application further proposes a puller A104 including a pull frame A141, a pin clamping assembly A142, and a wire clamping lifting assembly A143. The pin clamping assembly A142 includes a wire clamping driver, a wire clamping swing rod A1422, and a wire clamping block A1423. The wire clamping swing rod A1422 is hinged to the pull frame A141. One end of the wire clamping swing rod A1422 is movably connected to the output end of the wire clamping driver. The wire clamping block A1423 is fixed to the other end of the wire clamping swing rod A1422. Under the drive of the wire clamping swing rod A1422, the wire clamping block A1423 moves closer to the pull frame A141 to clamp the pin wire or moves away from the pull frame A141 to release the pin wire. The pull frame A141 is connected to the wire clamping lifting assembly A143 and reciprocates under the drive of the wire clamping lifting assembly A143 to pull the pin wire downward.

[0046] The traction frame A141 is the core component that supports and integrates the entire traction device A104. It can be made of a metal frame structure or high-strength composite material, and its purpose is to provide a stable mounting base for the lead clamping assembly A142 and the wire clamping lifting assembly A143. The wire clamping actuator in the lead clamping assembly A142 provides a controllable and uniform clamping force. The wire clamping lever A1422 is a lever-type transmission component, which can be designed as a straight rod or crank type, and its purpose is to convert the linear motion of the wire clamping actuator into the swinging motion of the wire clamping block A1423. The wire clamping block A1423 is the clamping component that directly acts on the lead wire. Its surface can be provided with anti-slip textures or a flexible pad to accommodate the deformation characteristics of slender and curved lead wires and ensure clamping stability.

[0047] Specifically, this technical solution achieves stable lead wire pulling through the organic cooperation between various components. The pull frame A141, as the foundation of the overall structure, ensures that the lead clamping assembly A142 and the wire clamping lifting assembly A143 maintain a precise relative position during dynamic operation. The output end of the wire clamping driver is connected to one end of the wire clamping lever A1422. This connection allows for a certain degree of freedom of adjustment, thus ensuring smooth motion transmission. The wire clamping lever A1422 is hinged to the pull frame A141, forming a lever system. When the wire clamping driver actuates, the wire clamping lever A1422 rotates around the hinge point, driving the wire clamping block A1423 fixed to its other end to clamp or release. The movement trajectory of the wire clamping block A1423 is precisely designed, enabling it to dynamically adjust the clamping force according to the actual position of the lead wire, avoiding wire damage due to over-clamping or slippage due to insufficient clamping. The wire clamping lifting assembly A143 is connected to the pull frame A141 via a transmission. By precisely controlling the up-and-down reciprocating motion of the pull frame A141, the lead wire is cut to a predetermined length while being clamped. When the aforementioned traction device A104 is used in conjunction with other components on the support frame A100, it can effectively solve the problem of stable transmission of slender, curved lead wires in automated production, significantly improving the accuracy and efficiency of lead wire processing. The wire clamping driver can be a linear drive device such as a cylinder, hydraulic cylinder, or electric push rod, or it can be a servo motor that outputs power through a cam rocker mechanism.

[0048] The above technical solution successfully solved the technical problem of stable clamping and precise movement of slender, curved leads in automated production, ensuring precise control of lead length and continuity of the production process, and providing reliable technical support for the automated production of LED beads.

[0049] This application further proposes a wire clamping lifting assembly A143 including a lifting drive and a horizontal lever A1432. The horizontal lever A1432 is hinged to the support frame A100, the traction frame A141 is movably connected to one end of the horizontal lever A1432, and the other end of the horizontal lever A1432 is connected to the lifting drive.

[0050] Specifically, the horizontal lever A1432 refers to a rigid rod, which can be made of metal materials such as steel or aluminum alloy, and its purpose is to provide a stable lever fulcrum and transmit motion. In practical applications, the length and shape of the horizontal lever A1432 can be adjusted according to the spatial layout of the specific equipment to adapt to different installation requirements. The movable connection of the traction frame A141 means that the traction frame A141 is connected to the horizontal lever A1432 in a rotatable or slidable manner, the purpose of which is to ensure that the traction frame A141 can move smoothly along a predetermined trajectory when the horizontal lever A1432 swings. Furthermore, the lifting actuator can be a linear drive device such as a cylinder, hydraulic cylinder, or electric push rod, the purpose of which is to convert linear motion into rotational motion of the horizontal lever A1432.

[0051] In detail, this technical solution optimizes the motion transmission of the wire clamping lifting assembly A143 through the lever principle of the horizontal lever A1432. The horizontal lever A1432 is hinged to the support frame A100, forming a fixed fulcrum, thus providing a stable motion foundation for the entire mechanism. The pulling frame A141 is movably connected to one end of the horizontal lever A1432, so that the up-and-down movement path of the pulling frame A141 is constrained by the lever's swing, thereby achieving a smoother motion trajectory. The other end of the horizontal lever A1432 is connected to the lifting driver, converting the linear output of the lifting driver into the rotational motion of the lever. This conversion mechanism can effectively buffer the impact force when the driver starts and stops, making the tension distribution on the lead wire more uniform. On this basis, the linear push-pull action of the lifting driver is proportional to the swing amplitude of the horizontal lever A1432 and the stroke of the pulling frame A141, thereby precisely controlling the pulling length and speed of the lead wire, ensuring that the slender lead wire maintains constant tension during the pulling process and avoiding bending deformation.

[0052] The above technical solution solves the problem of bending deformation or local stress concentration caused by large impact and inaccurate stroke control during the pulling process of the lead wire, thus improving the overall reliability of automated feeding.

[0053] This application further proposes a cutting assembly A105 including a punch shear A151 and a cutting driver. The punch shear A151 is located at the end of the downward stroke of the wire clamping block A1423. The cutting driver drives the punch shear A151 to move laterally along the wire clamping block A1423 to form a shearing action to cut the lead wire.

[0054] In practical applications, the punch shears A151 refer to a cutting tool with a sharp blade, which can be made of high-hardness alloy steel or ceramic materials to ensure that the blade remains sharp even under frequent use. The cutting actuator can be a pneumatic, hydraulic, or electric drive device, the purpose of which is to provide sufficient driving force so that the punch shears A151 can complete the cutting action quickly and accurately. Furthermore, the end point of the descent stroke of the wire clamp A1423 refers to the final position of the wire clamp A1423 after the puller A104 has pulled the lead wire to the designated position; its purpose is to provide a stable positioning reference for the cutting operation.

[0055] Specifically, this solution precisely positions the punch shears A151 at the end of the downward stroke of the wire clamping block A1423, and utilizes the characteristic of the traction device A104 to stably fix the lead wire at the end point, ensuring that the wire is straight and without displacement during cutting, thus eliminating length errors caused by wire swaying or residual bending. Simultaneously, the cutting driver drives the punch shears A151 to move laterally along the wire clamping block A1423 to create a cutting action. This lateral movement of the wire clamping block A1423, rather than vertical cutting, effectively avoids the thin wire being squeezed and deformed or producing burrs during the cutting process. The aforementioned cutting component A105, used in conjunction with the traction device A104, ensures that the lead wire is fully straightened and accurately positioned before cutting, thereby guaranteeing the flatness and dimensional consistency of the lead end face, providing a reliable lead foundation for subsequent LED chip soldering and packaging.

[0056] A first detector M, such as a camera, can be added between the lead feeding device A and the lead clamping device B to detect whether there are leads on the fixture 300. The detector can confirm whether there are leads on the fixture 300 by taking pictures and comparing them. Alternatively, a photoelectric sensor can be used. When there are leads, the photoelectric sensor can detect the reflection of the leads, thus confirming that there are leads on the fixture 300. If there are no leads on the fixture 300, the photoelectric sensor will not reflect any light signal, thus alarming the system and allowing the worker to check the specific situation.

[0057] For details, please refer to Figure 7 and Figure 8The pin flattening device B includes a pair of clamping jaws B100 and a flattening drive assembly that drives the bottom of the clamping jaws B100 to flatten the pins. The pair of clamping jaws B100 are hinged to the flattening bracket B101 and extend vertically. The clamping gap B102 between the pair of clamping jaws B100 faces downward and is located on the pin transport path. That is, the clamping jaws B100 only need to perform clamping or releasing actions and do not need to move. The pin will naturally enter the clamping gap B102 under the movement of the clamp 300, simplifying the control logic. The flattening bracket B101 is fixed on the frame 100 to provide a stable mounting base and ensure that the height of the clamping gap B102 is located on the pin transport path. To allow the paired clamping jaws B100 to clamp the pins, a flattening cam B103 is installed on the flattening bracket B101. The flattening cam B103 is located between the tops of the paired clamping jaws B100. Rotation of the flattening cam B103 opens the tops of the paired clamping jaws B100, allowing their bottoms to move closer together. Rotation of the flattening cam B103 is achieved by a motor driving the clamping lever B104 to swing. Flattening the pin tops using the pin flattening device B not only facilitates subsequent stamping and bending to form a horizontal bending section but also creates a wider mounting platform. This allows for better deposition of fluid solder on the horizontal bending section, making it easier to position the surface mount LED on the mounting platform before soldering and preventing it from falling off during the movement of the fixture 300. To achieve the reset of the paired clamping jaws B100 and release the flattened pins, gravity can be used. As long as the flattening cam B103 resets and no longer acts on the top of the clamping jaws B100, the clamping jaws B100 will be maintained in a vertical state by gravity. That is, the extension line of the center of gravity of the clamping jaws B100 passes through the hinge axis, which widens the clamping gap B102 so that the flattened pins can be moved away with the fixture 300, while waiting for the next pair of pins to enter the clamping gap B102.

[0058] like Figures 9 to 12 As shown, this application further proposes a lead forming device C including a first lead bending forming component C100 and a second lead bending forming component C200. Both the first lead bending forming component C100 and the second lead bending forming component C200 include two molding parts C11 that clamp the lead to form an inclined bending section. The first lead bending forming component C100 also includes a first stamping part C12 that moves from the inside to the outside. After the molding part C11 of the first lead bending forming component C100 clamps the first lead, the first stamping part C12 moves from the inside to the outside relative to the material turntable 200 to bend the top of the first lead outward to form a horizontal bending section. The second lead bending forming component C200 also includes a second stamping part C13 that moves from the outside to the inside. After the molding part C11 of the second lead bending forming component C200 clamps the second lead, the second stamping part C13 moves from the outside to the inside relative to the material turntable 200 to bend the top of the second lead inward to form a horizontal bending section.

[0059] Specifically, the molding component C11 refers to a part used to clamp the pin and shape it into a specific form. It can be implemented using mechanical grippers with clamping function or hydraulically driven pressure blocks. The purpose is to pre-form an inclined bending section through clamping operation, providing a stable reference for subsequent horizontal bending. The first stamping component C12 refers to a part that can move in a specific direction and apply bending force to the pin. It can be implemented using a linear motor-driven punch or a cylinder-driven push rod. The purpose is to bend the tip of the first pin outward to form a horizontal bending section. The second stamping component C13 refers to a part with a similar function to the first stamping component C12 but with the opposite direction of movement. It can also be implemented using a linear motor-driven punch or a cylinder-driven push rod. The purpose is to bend the tip of the second pin inward to form a horizontal bending section.

[0060] In detail, this solution precisely addresses the forming challenge of bidirectional pin bending through a discrete component design, ensuring stable construction of the mounting platform. The first pin bending forming component C100 and the second pin bending forming component C200 are configured independently, respectively addressing the differentiated requirements of outward bending for the first pin and inward bending for the second pin, avoiding interference and precision loss in bidirectional bending with a single component. Each component has two molding parts C11, which pre-form an inclined bending section by clamping the pin. This inclined section serves as the bending starting reference, effectively constraining the pin's displacement freedom during subsequent horizontal bending and reducing forming errors caused by initial positioning deviations. The first stamping part C12 moves from the inside out according to the radial layout of the material turntable 200, bending the tip of the first pin outward to form a horizontal bending section. This inward-outward movement direction coordinates with the rotation path of the material turntable 200, utilizing spatial extension characteristics to achieve smooth bending and ensuring precise control of the outward angle of the horizontal bending section. The second stamping part C13 moves in the opposite radial direction of the material turntable 200 from the outside to the inside, bending the tip of the second pin inward to form a horizontal bending section. This inward movement, aligning with the inward bending requirement of the second pin, complements the outward bending of the first pin, creating a symmetrical and stable mounting platform. This ensures the surface-mount LED is firmly fixed to the plane formed by the inclined and horizontal bending sections, improving the positioning accuracy and structural reliability during the welding process. Furthermore, the design of the pin forming device C is closely integrated with the layout of the material turntable 200, fully utilizing its circumferential arrangement to achieve efficient and precise pin forming operations.

[0061] In some of the solutions described above in this application, a first pin bending forming component C100 is proposed to clamp the pin and press and bend it. However, in its implementation, the specific structure of the mechanism is not clearly defined, which may lead to uncoordinated clamping and pressing actions, affecting forming accuracy and efficiency. For example, insufficient clamping force or misaligned pressing sequence may cause uneven pin bending or reduced equipment reliability.

[0062] In this regard, this application further proposes that the first pin bending forming component C100 of the above-mentioned surface mount LED pin forming device includes a first column C101 and a first reciprocating rod C102, a second reciprocating rod C103 and a third reciprocating rod C104 that are slidably connected to the first column C101 from high to low. The first reciprocating rod C102 is driven by a first driver, and the second reciprocating rod C103 and the third reciprocating rod C104 are driven by a second driver and move in opposite directions to each other. Two molding parts C11 are respectively disposed at the ends of the second reciprocating rod C103 and the third reciprocating rod C104 and cooperate with each other to form a first forming gap C105. A first stamping part C12 is disposed at the end of the first reciprocating rod C102, and the lower edge of the first stamping part C12 reciprocates along the top surface of the molding part C11.

[0063] Specifically, the first column C101 serves as the stable support frame for the entire first pin bending and forming assembly C100. It is typically made of high-strength metal materials, such as steel or aluminum alloy, to ensure the rigidity and stability of the mechanism during pin forming. The first column C101 can be fixed to the frame 100 as a vertical guide rail, or connected to the frame 100 by bolts or other means to form a stable support structure. The first reciprocating rods C102, C103, and C104 are sequentially slidably connected to the first column C101 from high to low. These three reciprocating rods are key actuators for achieving pin clamping and stamping actions; they reciprocate vertically along the first column C101. This sequential connection structure allows each rod to move independently or collaboratively, thereby achieving complex timing control. The sliding connection can be achieved through linear bearings, guide rail sliders, or dovetail grooves, ensuring smooth, low-friction movement of the reciprocating rods in the vertical direction. For example, a guide groove can be opened on the first column C101, and a corresponding guide block can be set on the reciprocating rod to achieve sliding through cooperation; or a ball screw and guide rail can be used to provide more precise positioning and motion control.

[0064] The first reciprocating rod C102 is driven by the first driver and serves as the carrier for the first stamped part C12. Its movement is independently controlled by the first driver to achieve the stamping action. The first driver is responsible for providing the power and precise displacement control required for stamping, and can be equipped with a cylinder, hydraulic cylinder, servo motor with a lead screw transmission mechanism or cam mechanism. The second reciprocating rod C103 and the third reciprocating rod C104 are driven by the second driver and move in opposite directions. The second reciprocating rod C103 and the third reciprocating rod C104 each carry two molded parts C11, and their opposite movements are the core mechanism for clamping and releasing the pins. The second driver is responsible for coordinating the synchronous opposite movements of these two rods, and can be equipped with a double-acting cylinder, a dual-output shaft motor with a gear and rack mechanism, or a linkage mechanism to decompose the movement of one driver into two opposite movements. Two molding parts C11 are respectively located at the ends of the second reciprocating rod C103 and the third reciprocating rod C104, and cooperate to form a first forming gap C105. The molding parts C11 are tools that directly contact the pin and plastically deform it. They cooperate to form a precise first forming gap C105 for clamping the pin and bending it into an inclined bent section. The molding parts C11 are usually made of high-hardness, wear-resistant materials, and their working surfaces have grooves or protrusions that match the shape of the pin. A first stamping part C12 is located at the end of the first reciprocating rod C102. The first stamping part C12 is a tool that directly stamps the pin to form a horizontal bent section. It is installed at the end of the first reciprocating rod C102 and moves horizontally with the movement of the first reciprocating rod C102. The first stamping part C12 is usually made of high-strength, high-hardness materials, and its bottom shape matches the shape of the required horizontal bent section. The lower edge of the first stamping part C12 reciprocates along the top surface of the molded part C11. The lower edge of the first stamping part C12 works in conjunction with the top surface of the molded part C11 to ensure that the stamping action can be performed precisely at the predetermined position after the pin is clamped by the molded part C11, forming a horizontal bending segment. This motion relationship ensures the accuracy and consistency of the bending, which is achieved by precisely designing the relative position and stroke of the first reciprocating rod C102 and the second / third reciprocating rod C104.

[0065] Through the above technical solution, the structure of the first pin bending and forming component C100 is optimized. The first column C101 serves as a stable support foundation, ensuring the stability of the movement of each component. The first reciprocating rod C102, the second reciprocating rod C103, and the third reciprocating rod C104, which are slidably connected from high to low, achieve a layered layout, facilitating independent control of vertical movement and enabling precise coordination of the clamping and stamping sequence. The first reciprocating rod C102 is independently driven by the first driver, ensuring the stamping force and response speed of the first stamping part C12. The second reciprocating rod C103 and the third reciprocating rod C104 are driven by the second driver and move in opposite directions. This reverse drive enables the synchronous clamping or releasing of the molded part C11, improving clamping efficiency and reliability. The two molded parts C11 cooperate at the ends of the second reciprocating rod C103 and the third reciprocating rod C104 to form a first forming gap C105, which can precisely fix the pin position and form a uniform inclined bending section. The first stamping part C12 is located at the end of the first reciprocating rod C102 and is directly controlled by the first driver to perform bending operations. Its lower edge reciprocates along the top surface of the molded part C11, ensuring that the stamping trajectory is aligned with the clamping surface, effectively eliminating positional deviation, thereby significantly improving the accuracy and consistency of pin forming, and solving the problem of incoordination between clamping and stamping actions, which affects forming accuracy and efficiency.

[0066] In some embodiments of this application, a first pin bending forming component C100 is proposed to clamp and bend the pin by driving a reciprocating rod through a driver. However, in this process, the mechanism for controlling the clamping and releasing of the molding component C11 may lack precise guidance and synchronization, resulting in unstable movement or low efficiency, which affects the quality and reliability of pin forming.

[0067] In this regard, this application further proposes that, in the above-mentioned surface mount LED pin forming device, the specific structure of the first pin bending forming component C100 includes: a first column C101 is provided with a first lifting rod C106, the first lifting rod C106 is driven by a second driver, the inner side and outer side of the first lifting rod C106 are respectively provided with a first working groove C161 and a second working groove C162, the second reciprocating rod C103 is provided with a first sliding member C131 that slides along the inner side of the first lifting rod C106, the first sliding member C131 slides into or out of the first working groove C161 to cause the second reciprocating rod C103 to reciprocate, the third reciprocating rod C104 is provided with a second sliding member C141 that slides along the outer side of the first lifting rod C106, the second sliding member C141 slides into or out of the second working groove C162 to cause the third reciprocating rod C104 to reciprocate.

[0068] Specifically, the first lifting rod on the first column C101, as a core moving component, can be a rod with a rack and pinion, moving up and down driven by a motor through gear engagement; alternatively, it can be a threaded rod, raising and lowering by rotating a nut or the threaded rod itself. This first lifting rod provides a stable motion foundation and guide for the subsequent working slot and sliding components. The first lifting rod C106 is driven by a second driver, which can be a stepper motor, servo motor, or DC motor, etc., and can precisely control the position and movement of the first lifting rod C106 through a reduction mechanism or direct connection.

[0069] The inner and outer sides of the first lifting rod C106 are respectively machined with a first working groove C161 and a second working groove C162. These working grooves are precise recessed structures that serve as guide paths for the sliding components. For example, these working grooves can be straight, L-shaped, or have a specific curve, and are formed on the surface of the lifting rod by milling, wire cutting, or casting. Their shape and depth precisely match the sliding components to ensure smooth and jam-free sliding.

[0070] A first sliding member C131 is provided on the second reciprocating rod C103, which slides along the inner side of the first lifting rod C106. This first sliding member C131 can be a roller, a slider, or a guide block with bearings, its shape matching the first working groove C161, and it can be made of a wear-resistant material. When the first lifting rod C106 rises or falls, the first sliding member C131 moves along the path of the first working groove C161. By sliding the first sliding member C131 into or out of the first working groove C161, the second reciprocating rod C103 achieves precise reciprocating motion, thereby controlling the clamping or releasing action of the molded part C11.

[0071] Similarly, a second sliding member C141 is provided on the third reciprocating rod C104, sliding along the outer surface of the first lifting rod C106. This second sliding member C141 can also be a roller, slider, or guide block, its shape matching the second working groove C162, and it is made of a wear-resistant material. The second sliding member C141 slides into or out of the second working groove C162, causing the third reciprocating rod C104 to reciprocate. By carefully designing the shapes of the first working groove C161 and the second working groove C162, it can be ensured that the first sliding member C131 and the second sliding member C141, driven by the first lifting rod C106, achieve synchronous or sequential reciprocating motion of the second reciprocating rod C103 and the third reciprocating rod C104.

[0072] Through the above technical solution, this application effectively solves the problems of inaccurate guidance and insufficient synchronization in the clamping and releasing mechanism of the molded part C11 by the coordinated design of the first lifting rod C106, the working groove, and the sliding member. The first lifting rod C106, as the core driving and guiding component, has a first working groove C161 and a second working groove C162 respectively provided on its inner and outer sides, providing precise movement trajectories for the first sliding member C131 on the second reciprocating rod C103 and the second sliding member C141 on the third reciprocating rod C104. When the first lifting rod C106 is driven by the second driver to perform lifting and lowering movements, the first sliding member C131 and the second sliding member C141 slide along their respective working grooves, thereby converting the single lifting and lowering movement of the first lifting rod C106 into the synchronous reciprocating movement of the second reciprocating rod C103 and the third reciprocating rod C104. This design ensures that the two molded parts C11 move with high synchronization and precision when clamping and releasing the first pin, avoiding pin molding quality problems caused by asynchronous or deviated movements. Therefore, this solution significantly improves the stability and efficiency of the lead forming process, ensuring the quality and reliability of surface mount LED lead forming.

[0073] In some embodiments of this application, a sliding member is proposed to control the molding member C11 for clamping and releasing the pins. However, during its implementation, the movement of the sliding member may be asynchronous, resulting in uncoordinated clamping and releasing actions, which affects molding accuracy and efficiency.

[0074] In this regard, this application further proposes that the first sliding member C131 and the second sliding member C141 simultaneously slide into the first working groove C161 and the second working groove C162, respectively, so that the two molded members C11 release the first pin, and the first sliding member C131 and the second sliding member C141 simultaneously slide out of the first working groove C161 and the second working groove C162, respectively, so that the two molded members C11 clamp the first pin.

[0075] Specifically, the synchronous sliding of the first slider C131 and the second slider C141 means that these two sliders enter their respective working slots at the same time. This can be achieved in several ways. For example, a mechanical linkage mechanism can be used, such as a main drive component driving a connecting rod, with both ends of the connecting rod connected to the first slider C131 and the second slider C141 respectively, thus ensuring the synchronicity of their movements. Alternatively, independent drive units (such as stepper motors or servo motors) can be used to drive the first slider C131 and the second slider C141 respectively, with a central controller performing precise time synchronization control to ensure that they start and complete the sliding action at the same moment. When the first slider C131 and the second slider C141 synchronously slide into the first working slot C161 and the second working slot C162, their positional change will release the constraint on the two molded parts C11. Specifically, the molded part C11 is usually connected to the sliding part through a spring preload or lever mechanism. The sliding part slides in, causing the molded part C11 to move outward, thereby increasing the first molding gap C105 between the molded parts C11, and thus releasing the clamping of the first pin, making it free and convenient for subsequent picking, placing or moving.

[0076] Similarly, the synchronous sliding out of the first slider C131 and the second slider C141 means that these two sliders exit their respective working slots at the same time. Similar to synchronous sliding in, this can also be achieved through precise synchronous control via a mechanical linkage mechanism or an independent drive unit in conjunction with a central controller. For example, when it is necessary to clamp the pin, the controller will simultaneously instruct both sliders to slide out of the working slots. When the first slider C131 and the second slider C141 synchronously slide out of the first working slot C161 and the second working slot C162, their positional change will activate the clamping mechanism of the two molding parts C11. Specifically, after the sliders slide out, the molding parts C11 will move inward through spring force or lever action, reducing the first forming gap C105 between the molding parts C11, thereby firmly clamping the first pin in the first forming gap C105, providing stable support for subsequent bending and forming operations.

[0077] Through the above technical solution, the synchronous movement of the first sliding member C131 and the second sliding member C141 ensures that the two molding parts C11 coordinate their actions when clamping and releasing the first pin. When the first sliding member C131 and the second sliding member C141 simultaneously slide into the first working groove C161 and the second working groove C162, the two molding parts C11 can release the first pin synchronously, avoiding pin bending deviation or damage caused by asynchronous movement of the sliding members, and improving the pin release efficiency and safety. Conversely, when the first sliding member C131 and the second sliding member C141 simultaneously slide out of the first working groove C161 and the second working groove C162, the two molding parts C11 can clamp the first pin synchronously, ensuring uniform distribution of clamping force, thereby improving the stability and reliability of the first pin molding and effectively avoiding molding defects caused by uneven clamping. This synchronous control mechanism optimizes the automated molding process of the first pin bending molding assembly C100, significantly improving the overall molding accuracy and production efficiency.

[0078] In some embodiments described above in this application, a first working groove C161 and a second working groove C162 are proposed to control the sliding of the slider. However, in the process of implementation, the sliding may not be smooth enough, resulting in low operating efficiency or equipment wear.

[0079] To address this, this application further proposes that the bottom ends of both the first working groove C161 and the second working groove C162 are provided with guide surfaces C163 to facilitate sliding in or out. The guide surface C163 refers to a transition surface provided at the edge of the structure or the entrance of the channel, used to guide another component smoothly into or out. Its function is to reduce resistance, friction, and impact during the movement of the component, ensuring smooth movement and accurate positioning. Specifically, the guide surface C163 can be implemented in various forms. For example, it can be designed as a slope with a certain angle, allowing the sliding component to gradually enter or leave the working groove along the slope upon contact; alternatively, the guide surface C163 can also be designed as an arc-shaped transition surface, guiding the movement of the sliding component through a smooth curvature change, avoiding jamming or wear caused by sharp edges. Furthermore, structures such as conical surfaces can also be used to provide a wider guiding range.

[0080] By employing the aforementioned technical solution, a guide surface C163 is provided at the bottom end of the first working groove C161 and the second working groove C162, effectively resolving the potential problem of uneven movement encountered by the sliding member when sliding into or out of the working groove. Specifically, when the first sliding member C131 or the second sliding member C141 contacts the bottom end of the working groove, the guide surface C163 provides a smooth transition area, guiding the sliding member to smoothly enter or leave the working groove, thereby significantly reducing friction and impact between the sliding member and the edge of the working groove. This not only avoids low operating efficiency due to jamming but also reduces wear between components and extends the service life of the device. Therefore, this design ensures that the second reciprocating rod C103 and the third reciprocating rod C104 can reciprocate stably and reliably under the drive of the first lifting rod C106, improving the operating efficiency and stability of the entire SMD LED pin forming device.

[0081] In some embodiments described above in this application, a second pin bending and forming assembly C200 is proposed for bending the second pin. However, during its implementation, the lack of a specific driving and motion control mechanism may lead to uncoordinated bending actions, insufficient clamping force, or low stamping accuracy, thereby affecting the accuracy of pin forming and production efficiency. To address this, this application further proposes that the second pin bending and forming assembly C200 includes a second column C201, a fourth reciprocating rod C202, a fifth reciprocating rod C203, and a sixth reciprocating rod C204. The fourth reciprocating rod C202, the fifth reciprocating rod C203, and the sixth reciprocating rod C204 are slidably connected to the second column C201 from high to low. The fourth reciprocating rod C202 is driven by a third driver, while the fifth reciprocating rod C203 and the sixth reciprocating rod C204 are driven by a fourth driver and move in opposite directions. Two molded parts C11 are respectively located at the ends of the fifth reciprocating rod C203 and the sixth reciprocating rod C204 and cooperate with each other to form the second forming gap C205. The second stamped part C13 is located at the end of the fourth reciprocating rod C202, and the lower edge of the second stamped part C13 reciprocates along the top surface of the molded part C11.

[0082] Specifically, the second column C201 serves as the main support structure of the second pin bending and forming assembly C200, providing a stable installation foundation and rigid support for the entire mechanism. The second column C201 can be made of high-strength metal materials (such as steel or aluminum alloy), and its cross-sectional shape can be circular, square, or irregular to adapt to the installation and movement requirements of internal components, and is firmly fixed to the frame 100 by bolts or welding.

[0083] The fourth reciprocating rod C202, the fifth reciprocating rod C203, and the sixth reciprocating rod C204 are the actuators that realize vertical movement. They are slidably connected to the second column C201, bearing and transmitting driving force, thereby driving the molded part C11 and the second stamped part C13 to perform precise horizontal movement. These reciprocating rods can be linear guide sliders, sleeve structures, or rods with guide grooves. Their surfaces can be precision ground or chrome-plated to reduce friction, and they work with linear bearings or sliding bearings to achieve smooth sliding.

[0084] The design, with each reciprocating rod sliding sequentially from high to low to the second column C201, ensures the accuracy of the relative position and motion trajectory of each rod in the vertical direction, achieving hierarchical motion control. This is achieved by setting multiple guide grooves on the second column C201, with each reciprocating rod sliding in conjunction with its corresponding guide groove via a slider or guide pin.

[0085] The fourth reciprocating rod C202 is driven by the third driver, which provides an independent and controllable horizontal driving force specifically for the second stamped part C13 to achieve precise stamping and bending actions. The third driver can be a stepper motor, a servo motor with a lead screw and nut mechanism, a rack and pinion mechanism, or a cylinder, hydraulic cylinder, etc. For example, a servo motor drives a ball screw through a coupling, and the nut of the ball screw is fixedly connected to the fourth reciprocating rod C202, thereby converting the rotary motion into precise linear reciprocating motion.

[0086] The fifth reciprocating rod C203 and the sixth reciprocating rod C204 are driven by the fourth driver and move in opposite directions to each other. This is designed to achieve synchronous clamping and releasing of the two molded parts C11, and to ensure uniform clamping force and coordinated movement through reverse motion. The fourth driver can be a dual-shaft motor, two independent synchronous motors, or a single motor that uses a linkage mechanism, gear mechanism, or cam mechanism to achieve the reverse movement of the two reciprocating rods. For example, a servo motor can use a rack and pinion mechanism, where one rack is connected to the fifth reciprocating rod C203 and the other rack is connected to the sixth reciprocating rod C204, with the two racks moving in opposite directions.

[0087] Two molding parts C11 are respectively located at the ends of the fifth reciprocating rod C203 and the sixth reciprocating rod C204, and cooperate with each other to form a second forming gap C205. They directly contact the pin, and through precise fit and gap, clamp and initially bend the pin. The molding parts C11 are usually made of high-hardness, wear-resistant materials, such as tool steel or cemented carbide. Their surfaces can be precision machined or coated, and can be designed with bevels or arcs at specific angles to accommodate the bending shape of the pin.

[0088] The second stamping part C13 is located at the end of the fourth reciprocating rod C202 and is used to perform the horizontal bending operation of the pin. The second stamping part C13 is usually made of high-strength, high-hardness material, and its working surface is precision machined to ensure the accuracy and consistency of bending.

[0089] The lower edge of the second stamped part C13 reciprocates along the top surface of the molded part C11, ensuring that the second stamped part C13 maintains a precise relative position with the clamped and initially bent pin during horizontal bending, achieving a smooth and accurate secondary bending. This is typically achieved through the precise guidance and drive of the fourth reciprocating rod C202. For example, the sliding guide mechanism of the fourth reciprocating rod C202 on the second column C201 ensures the straightness of its horizontal movement, thereby ensuring that the lower edge of the second stamped part C13 always maintains a preset parallel relationship or a small gap with the top surface of the molded part C11.

[0090] Through the above technical solution, in the surface mount LED lead forming device, the second column C201 serves as a stable support, ensuring the rigidity and stability of the entire second lead bending forming assembly C200. The hierarchical sliding connection of the fourth reciprocating rod C202, the fifth reciprocating rod C203, and the sixth reciprocating rod C204 allows the movement of each component to be independent yet coordinated. The third driver independently drives the second stamping part C13 on the fourth reciprocating rod C202, which can precisely control the force and stroke of stamping and bending the second lead, avoiding accuracy problems caused by insufficient drive or over-stroke. The fourth driver drives the fifth reciprocating rod C203 and the sixth reciprocating rod C204 to move in opposite directions, so that the two molding parts C11 can synchronously and stably clamp or release the second lead, effectively preventing the lead from shifting or deforming during the forming process, thereby ensuring the forming quality of the inclined bending section. The lower edge of the second stamping part C13 reciprocates along the top surface of the molded part C11, ensuring that the second stamping part C13 maintains a precise relative position with the second pin, which has been clamped and initially bent by the molded part C11, during horizontal bending. This achieves seamless connection between the stamping and clamping actions, significantly improving the forming accuracy and consistency of the horizontal bending section. This design of separate drive and hierarchical motion optimizes the automated forming process of the second pin, significantly improving the reliability and accuracy of pin forming. It effectively solves the problems of uncoordinated bending actions, insufficient clamping force, or low stamping accuracy in existing technologies, thereby improving production efficiency and product quality.

[0091] In some of the solutions described above in this application, a second pin bending and forming assembly C200 is proposed for bending the second pin. However, in this process, the motion control of the reciprocating rod may not be precise enough, resulting in uncoordinated clamping and releasing actions, which affects the stability and efficiency of pin forming. In this application, the second column C201 is provided with a second lifting rod C206, which is driven by a fourth driver. The inner and outer sides of the second lifting rod C206 are respectively provided with a third working groove C261 and a fourth working groove C262. The fifth reciprocating rod C203 is provided with a third sliding member C231 that slides along the inner side of the second lifting rod C206. The third sliding member C231 slides into or out of the third working groove C261 to cause the fifth reciprocating rod C203 to reciprocate. The sixth reciprocating rod C204 is provided with a fourth sliding member C241 that slides along the outer side of the second lifting rod C206. The fourth sliding member C241 slides into or out of the fourth working groove C262 to cause the sixth reciprocating rod C204 to reciprocate.

[0092] The second lifting rod C206 is a rod-shaped component located inside or outside the second column C201, capable of vertically lifting and lowering along the second column C201. As a core transmission component, the vertical movement of this lifting rod is fundamental to driving the horizontal movement of the subsequent reciprocating rod. The second lifting rod C206 can be implemented in various ways. For example, a gear and rack mechanism can be used, where the rotation of the gear drives the rack-shaped second lifting rod C206 to move up and down; alternatively, a screw and nut mechanism can be used, where the rotation of the screw causes the nut-connected second lifting rod C206 to achieve precise vertical displacement.

[0093] The fourth actuator is a device that provides power to the second lifting rod C206 to achieve its lifting and lowering movement. This actuator can be an electric actuator, such as a stepper motor or servo motor, which controls the displacement and movement rhythm of the second lifting rod C206 by precisely controlling the rotation angle and speed of the motor; it can also be a pneumatic or hydraulic actuator, which drives the cylinder by controlling the on / off and magnitude of air or hydraulic pressure, thereby driving the second lifting rod C206 to lift and lower.

[0094] The third working groove C261 and the fourth working groove C262 are guide grooves respectively provided on the inner and outer surfaces of the second lifting rod C206. The shape and depth of these working grooves are precisely designed to define and guide the movement trajectory of the sliding member, thereby converting the vertical movement of the second lifting rod C206 into the horizontal reciprocating motion of the reciprocating rod. For example, the working groove can be designed as an inclined groove with a specific tilt angle, causing the sliding member to generate a horizontal component when sliding within it; or, the working groove can be designed as an irregularly shaped groove with a specific curved shape to achieve more complex reciprocating motion modes.

[0095] The third sliding member C231 and the fourth sliding member C241 are respectively mounted on the fifth reciprocating rod C203 and the sixth reciprocating rod C204, and cooperate with the third working groove C261 and the fourth working groove C262. These sliding members are key components connecting the second lifting rod C206 and the reciprocating rod. They slide within the working grooves, converting the vertical movement of the second lifting rod C206 into the horizontal reciprocating movement of the fifth reciprocating rod C203 and the sixth reciprocating rod C204. The sliding members can take various forms; for example, they can be structures with rollers to reduce frictional resistance and improve the smoothness of movement; they can also be sliders made of wear-resistant materials (such as engineering plastics or hard alloys) that slide directly within the working grooves.

[0096] Through the above technical solution, the second lifting rod C206 performs precise vertical lifting and lowering movements under the drive of the fourth driver. When the second lifting rod C206 rises and falls, the third working groove C261 and the fourth working groove C262 on its inner and outer surfaces respectively drive or guide the third sliding member C231 on the fifth reciprocating rod C203 and the fourth sliding member C241 on the sixth reciprocating rod C204. This linkage mechanism effectively converts the vertical movement of the second lifting rod C206 into the horizontal reciprocating movement of the fifth reciprocating rod C203 and the sixth reciprocating rod C204. Because the working grooves precisely limit the movement trajectory of the sliding members, the coordination and precision of the fifth reciprocating rod C203 and the sixth reciprocating rod C204 in clamping and releasing the second pin are ensured. This effectively solves the deviation problem that may exist in traditional reciprocating rod motion control, significantly improves the stability and efficiency of pin forming, and thus ensures the high quality and high consistency of surface-mount LED pin forming.

[0097] In some embodiments of this application, the sliding action of the third slider C231 and the fourth slider C241 is proposed to control the clamping and loosening of the second pin by the molding part C11. However, in the implementation process, the sliding action of the slider into or out of the working groove may be asynchronous, resulting in a time difference when the molding part C11 clamps or loosens the second pin, causing pin position offset or uneven force, affecting molding accuracy and efficiency.

[0098] In response, this application further proposes that the third slider C231 and the fourth slider C241 simultaneously slide into the third working groove C261 and the fourth working groove C262 respectively, so that the two molding parts C11 release the second pin, and the third slider C231 and the fourth slider C241 simultaneously slide out of the third working groove C261 and the fourth working groove C262 respectively, so that the two molding parts C11 clamp the second pin.

[0099] Specifically, the simultaneous sliding of the third slider C231 and the fourth slider C241 into the third working slot C261 and the fourth working slot C262, respectively, means that when the second pin bending and forming assembly C200 performs the pin release operation, the third slider C231 and the fourth slider C241 enter their respective corresponding third working slot C261 and fourth working slot C262 synchronously. This "simultaneous" synchronization can be achieved in several ways. For example, a mechanical linkage mechanism can be used, with a common drive source (such as a motor or cylinder) driving a linkage or cam system, which then acts on the third slider C231 and the fourth slider C241 respectively, ensuring that their movement trajectories remain consistent over time. Another approach is to use independent drive units, such as equipping each of the third slider C231 and the fourth slider C241 with an independent servo motor or stepper motor, and using a central controller (such as a PLC) for precise synchronous control. The controller monitors the position feedback of the two sliders in real time and adjusts the drive commands to ensure that they slide into the working slots simultaneously. When the third slider C231 and the fourth slider C241 simultaneously slide into the third working groove C261 and the fourth working groove C262, their connection or action mechanism with the molding component C11 changes, thereby separating the two molding components C11 from the clamped state and releasing the second pin. For example, the inward movement of the sliders can release the constraint on the molding component C11, allowing the molding component C11 to open outward under the action of spring force or other reset mechanism, thereby releasing the second pin. Alternatively, the inward movement of the sliders can directly push the molding component C11 outward through a lever or inclined plane mechanism to achieve the release action.

[0100] Correspondingly, the third slider C231 and the fourth slider C241 simultaneously slide out of the third working slot C261 and the fourth working slot C262, respectively. This means that when the second pin bending and forming assembly C200 performs the pin clamping operation, the third slider C231 and the fourth slider C241 move out of their respective third working slot C261 and fourth working slot C262 synchronously. This "simultaneous" implementation can also be achieved using the aforementioned mechanical linkage mechanism or an independent synchronous drive unit. For example, the mechanical linkage mechanism can move in opposite directions, driving the two sliders to slide out synchronously; the independent synchronous drive unit issues a synchronization command through the central controller to ensure that the two sliders move out of the working slots simultaneously. When the third slider C231 and the fourth slider C241 simultaneously slide out of the third working slot C261 and the fourth working slot C262, their connection or action mechanism with the molding component C11 will cause the two molding components C11 to move inward, thereby clamping the second pin. For example, the outward movement of the slider can activate a clamping mechanism, such as by the action of a wedge or by directly pushing the inner side of the molded part C11, so that the molded part C11 fits tightly against both sides of the second pin, applying a uniform clamping force to it. Alternatively, the outward movement of the slider can remove the obstruction to the molded part C11, allowing the molded part C11 to close automatically under the action of a preload (such as spring force), thereby clamping the second pin.

[0101] The above technical solution ensures complete synchronization of the movements of the third slider C231 and the fourth slider C241 when sliding into or out of the third working groove C261 and the fourth working groove C262. This effectively solves the problem of asynchronous movement that may occur when the molding component C11 clamps or releases the second pin, thereby eliminating the risk of second pin position displacement or uneven force due to time difference. When the second pin bending forming assembly C200 performs the forming operation on the second pin, the molding component C11 can clamp and release the second pin in a highly coordinated manner, ensuring the stability and positioning accuracy of the second pin throughout the forming process. This is crucial for forming inclined bending sections and horizontal bending sections, significantly improving the forming accuracy and consistency of the surface mount LED pins, thereby improving overall production efficiency and product quality.

[0102] In some embodiments described above, a third working groove C261 and a fourth working groove C262 are proposed to allow the third sliding member C231 and the fourth sliding member C241 to slide in or out to control the movement of the fifth reciprocating rod C203 and the sixth reciprocating rod C204, thereby achieving the clamping or loosening of the two molded parts C11 on the second pin. However, during its implementation, the sliding members may experience jamming, increased resistance, or accelerated wear when sliding in or out of the working groove due to the lack of a guiding structure at the bottom of the groove, resulting in unsmooth movement, reduced efficiency, or shortened equipment life.

[0103] To address this, this application further proposes that the bottom ends of both the third working groove C261 and the fourth working groove C262 are provided with guide surfaces C163 to facilitate sliding in or out. Specifically, the guide surface C163 is a structure provided at the bottom ends of the third working groove C261 and the fourth working groove C262, and its main function is to guide the third sliding member C231 and the fourth sliding member C241 to smoothly slide in or out of the working groove. The guide surface C163 can be implemented in various forms. For example, the guide surface C163 can be designed as a chamfered structure at the bottom edge of the working groove, forming a sloped transition to effectively reduce the impact and friction between the sliding member and the groove wall when in contact. Alternatively, the guide surface C163 can also be designed as an arc transition structure at the bottom edge of the working groove, providing a smoother contact surface, further reducing sliding resistance, and ensuring smooth movement of the sliding member. In addition, a pad made of wear-resistant material can be used at the bottom end of the working groove, the surface of which is processed into a smooth arc or slope to minimize the wear of the sliding member when entering and exiting the working groove.

[0104] Through the above technical solution, guide surfaces C163 are provided at the bottom ends of the third working slot C261 and the fourth working slot C262. When the third sliding member C231 and the fourth sliding member C241 slide along the inner and outer sides of the second lifting rod C206 and enter or leave the third working slot C261 and the fourth working slot C262 under the drive of the second lifting rod C206, the guide surfaces C163 can provide a smooth transition. This effectively reduces the impact and friction between the sliding members and the edge of the working slot, and avoids the sliding members getting stuck or excessively worn at the bottom edge of the slot, thereby ensuring that the reciprocating motion of the fifth reciprocating rod C203 and the sixth reciprocating rod C204 is more stable, smooth, and efficient. Furthermore, the accuracy and reliability of the clamping and releasing action of the two molding parts C11 on the second pin are significantly improved, ultimately improving the production efficiency and equipment durability of the entire surface mount LED pin forming device.

[0105] To further ensure that the spacing between the first and second pins after molding meets the requirements for supporting the surface-mount LED, an adjusting clamp assembly 400 for adjusting the spacing between the first and second pins can be provided downstream of the second pin bending and forming assembly C200. For example, this adjusting clamp assembly 400 may include a pair of movable jaws, driven by a precision mechanical transmission mechanism (such as a lead screw and nut mechanism or a rack and pinion mechanism) to fine-tune the distance between the jaws, thereby correcting the pin spacing. Alternatively, the adjusting clamp assembly 400 can be pneumatically or hydraulically driven, combined with a vision inspection system or displacement sensor for closed-loop control, automatically adjusting the clamping position based on real-time measurement results to achieve the preset pin spacing. This adjusting clamp assembly 400 is positioned after the second pin bending and forming assembly C200 to perform final calibration of the horizontal bending segment spacing of the pins after two bends. (Reference) Figure 13As shown, the adjusting clamp assembly 400 includes a pair of movable jaws 401, which are hinged to the adjusting clamp bracket 402. The adjusting clamp bracket 402 also has a reciprocating adjusting rod 403. The front end of the adjusting rod 403 is configured with two intersecting inclined surfaces 431. The reciprocating motion of the adjusting rod 403 drives the inclined surfaces 431 to act on the movable jaws 401, causing the rear ends of the movable jaws 401 to open relative to each other, thereby closing the front ends of the movable jaws 401 together. The spacing of the horizontally bent sections on the two pins meets the requirements. The adjusting rod 403 can be driven by a motor and a cam rocker mechanism to achieve linear reciprocating motion.

[0106] By employing the aforementioned technical solution, the first pin bending and forming component C100 is positioned upstream of the second pin bending and forming component C200, allowing the bending operations of the first and second pins to be performed sequentially. This effectively avoids potential pin interference or positional uncertainties that may occur during simultaneous bending, thereby reducing initial errors caused by pin position offset or deformation during the bending process. Furthermore, an adjusting clamp component 400 for adjusting the distance between the first and second pins is positioned downstream of the second pin bending and forming component C200. This allows for precise measurement and real-time adjustment of the actual distance between the first and second pins after all bending operations are completed. This adjusting clamp component 400 compensates for minor deviations that may occur during the bending process, ensuring that the final pin spacing accurately meets design requirements. Therefore, this application, through optimizing the station layout and introducing a precision adjusting device, significantly improves the consistency and accuracy of the distance between the first and second pins after surface-mount LED pin forming, thereby enhancing the precision of the subsequent mounting platform and the reliability of soldering, effectively solving the technical problem of inconsistent pin spacing.

[0107] refer to Figure 14 and Figure 15 This application further proposes a pin-adding solder device E including a first solder container E100, a second solder container E200, and a solder lifting assembly E300 that drives both to rise and fall. The first solder container E100 and the second solder container E200 are respectively provided with a discharge port E00 at their bottom ends. The solder lifting assembly E300 drives the first solder container E100 and the second solder container E200 to fall, so that the discharge port E00 of the first solder container E100 is close to the horizontal bend of the first pin and solder is added, and the discharge port E00 of the second solder container E200 is close to the horizontal bend of the second pin and solder is added.

[0108] In practical applications, the first solder container E100 and the second solder container E200 refer to two independently designed structures for containing solder. These can be cylindrical containers made of metal, and their purpose is to provide independent solder addition paths for the separate first and second leads. The outlet E00 refers to an opening at the bottom of the container used to control the solder flow. It can be a circular orifice with a valve or a slit-like opening, ensuring a stable flow of solder from the bottom of the container and precise coverage of the soldering area. Specifically, the solder lifting assembly E300 is a drive device that can be implemented using an electric actuator or hydraulic cylinder, etc. Its purpose is to adjust the position of the solder container in real time according to the height of the formed leads, reducing solder splashing and oxidation during the descent.

[0109] In detail, this technical solution addresses the challenge of precise solder addition in dual-pin structures through a dual-container independent control mechanism. The first solder container E100 and the second solder container E200 add solder to the horizontal bends of the first and second pins, respectively. This design isolates the solder addition path, preventing interference to the other pin during single-container operation. The solder lifting assembly E300 drives both containers to descend synchronously, dynamically bringing the outlet E00 closer to the pin. This dynamic adjustment mechanism not only improves solder addition accuracy but also reduces process time. Furthermore, combined with the structural features of the pin forming device C, the operation of the outlet E00 near the horizontal bend ensures that the solder directly acts on the critical welding area, providing a uniform and reliable solder base for subsequent surface-mount LED welding, thereby guaranteeing welding strength and electrical connection stability. This technical solution effectively solves the problem of solder addition position deviation caused by pin separation, while simultaneously improving production efficiency and welding quality.

[0110] In some embodiments described above in this application, a solder lifting assembly E300 is proposed to drive the first solder container E100 and the second solder container E200 to lift and lower to add solder. However, during its implementation, asynchronous lifting and lowering may lead to uneven addition of solder, affecting welding quality and efficiency.

[0111] In this regard, this application further proposes that the solder lifting assembly E300 includes a solder lifting driver disposed on the frame 100, and the first solder container E100 and the second solder container E200 are integrated by a linkage bracket E11. The linkage bracket E11 is connected to the solder lifting driver for transmission, and the solder lifting driver drives the first solder container E100 and the second solder container E200 to lift synchronously.

[0112] Specifically, the solder lifting driver is a device that provides lifting power to the first solder container E100 and the second solder container E200. It can be implemented in various forms; for example, it can be a stepper motor or servo motor that drives the linkage bracket E11 for precise vertical displacement via a lead screw transmission mechanism; or it can be a cylinder or hydraulic cylinder that drives the piston rod to extend and retract via pneumatic or hydraulic pressure, directly driving the linkage bracket E11 to lift and lower. The linkage bracket E11 is a mechanical structure that physically connects the first solder container E100 and the second solder container E200, ensuring that they move as a whole. The linkage bracket E11 can be designed as an integral rigid frame, for example, welded, riveted, or integrally formed from metal plates or profiles, firmly fixing the two solder containers to it; or it can be an adjustable connecting rod system that connects the two containers through multiple connecting rods and fixing clamps, allowing adjustment of the container spacing within a certain range while maintaining synchronization. The transmission connection refers to the connection method between the power output end of the solder lifting driver and the linkage bracket E11. This can be achieved by directly connecting the output shaft of the driver to the linkage bracket E11 for direct power transmission; or by indirectly connecting through mechanical transmission components such as linkages, gears, belts, or chains to transmit the motion of the driver to the linkage bracket E11.

[0113] Through the above technical solution, the solder lifting driver, acting as a unified power source, connects the first solder container E100 and the second solder container E200 into a single unit via the linkage bracket E11, achieving a transmission connection. This ensures that the first solder container E100 and the second solder container E200 can rise and fall synchronously during solder addition. This synchronous movement effectively avoids uneven solder addition caused by asynchronous container lifting, guaranteeing precise and consistent solder deposition on the horizontal bending sections of the first and second leads. This not only significantly improves the quality and stability of welding and reduces welding defects caused by uneven solder quantity, but also optimizes the efficiency of the entire welding process, providing a more reliable foundation for the automated production of LED beads.

[0114] like Figure 16 As shown, this application further proposes a surface mount LED feeding device F, including a surface mount LED tape unwinding rack F102, a surface mount LED tape conveying track F100, and a surface mount LED pick-up assembly F101. The surface mount LED tape unwinding rack F102 is used to place the rolled surface mount LED tape, the surface mount LED tape conveying track F100 is used to guide the surface mount LED tape from the surface mount LED tape unwinding rack F102 to the surface mount LED pick-up assembly F101, and the surface mount LED pick-up assembly F101 is used to pick up the surface mount LED from the surface mount LED tape and move it to the mounting platform formed by the pins.

[0115] In practical applications, the SMD LED tape unwinding rack F102 refers to a structure capable of stably releasing rolled materials. It can be implemented using a rotating shaft with damping adjustment or a bracket equipped with a tension control system. The purpose is to ensure uniform tension of the SMD LED tape during unwinding, avoiding conveying interruptions or positional drift caused by sudden tension changes. The SMD LED tape conveyor track F100 can be understood as a structure with rigid guiding function. It can precisely constrain the SMD LED tape through limiting grooves, guide wheels F103, or elastic pressure strips, aiming to eliminate lateral swaying during conveying and ensure that each SMD LED reaches the pick-up point at a consistent height. Specifically, the SMD LED pick-up component F101 is a mechanism capable of precisely positioning and gripping individual SMD LEDs. It can be implemented using a vacuum nozzle F104 in conjunction with a vision positioning system or a mechanical gripper in conjunction with sensor feedback, aiming to improve the alignment accuracy between the SMD LED and the lead soldering area. In order to move a single surface-mount LED from the surface-mount LED strip to the mounting platform formed by the leads, the surface-mount LED picking assembly F101 also includes a reciprocating rod F105 for translating the vacuum nozzle F104 and a material transfer lifting rod F106 for driving the vacuum nozzle F104 to move up and down. The reciprocating rod F105 and the material transfer lifting rod F106 are driven to reciprocate by a corresponding motor or other driver, thereby placing the surface-mount LED picked up by the vacuum nozzle F104 onto the mounting platform.

[0116] In detail, the aforementioned SMD LED feeding device F integrates unwinding, conveying, and picking processes to form a complete automated feeding system. The SMD LED strip unwinding rack F102 provides a stable material supply foundation, and its damping adjustment or tension control system ensures the continuity and stability of the SMD LED strip during conveying. The SMD LED strip conveyor track F100, as an intermediate connecting link, uses a rigid guide design to precisely guide the SMD LED strip to the picking station, providing a reliable positional reference for subsequent picking operations. Based on the stable positional information provided by the conveyor track, the SMD LED picking assembly F101 reliably transfers individual SMD LEDs to the mounting platform formed by the pins through precise positioning and gripping actions. This systematic solution not only solves the problem of positional deviation caused by unstable LED strip conveying paths but also significantly improves the accuracy of SMD LED placement, thereby ensuring the quality of subsequent soldering and packaging processes. Simultaneously, the use of this solution in conjunction with the material turntable 200 and fixture 300 further enhances the automation level and processing accuracy of the entire production process.

[0117] refer to Figure 17 and Figure 18This application further proposes a surface mount LED soldering device G including a hot air pipe G100, a cooling pipe G200, and a holding member G300. The hot air pipe G100 is mounted on a translation assembly, and the outlet of the hot air pipe G100 is lower than the mounting platform formed by the pins. The translation assembly drives the hot air pipe G100 to move inward so that the outlet of the hot air pipe G100 is located below the surface mount LED. The hot air blown from the outlet of the hot air pipe G100 causes solder to solder and fix the surface mount LED to the pins. The hot air pipe G100 can be adjusted according to the following parameters: Two fixtures are required to simultaneously solder the surface-mount LEDs on the two fixtures 300 to the pins. Cooling pipes G200 are used to blow cold air onto the surface-mount LEDs to cool the solder quickly. At least one cooling pipe G200 is provided and located downstream of the hot air pipe G100. A holding member G300 is used to press the surface-mount LEDs onto the mounting platform to keep them stable during the soldering process. The holding member G300 is connected to the soldering lifting assembly and has two holding ends G31 that press against the surface-mount LEDs.

[0118] Specifically, the hot air duct G100 refers to a device that blows out a high-temperature airflow to melt the solder. This can be achieved using an electrically heated or gas-fired hot air generator, and its purpose is to provide the necessary heat for welding. The cooling duct G200 can be understood as a device that blows out a low-temperature airflow to accelerate the cooling of the solder. This can be achieved using compressed air cooling or liquid nitrogen cooling, and its purpose is to improve production efficiency. The pressure holder G300 refers to a device that applies pressure to the surface-mount LED during the welding process. This can be achieved using a spring-loaded or pneumatically driven pressure holder structure, and its purpose is to ensure welding accuracy.

[0119] In detail, the key components of this solution have clear structural and positional relationships. The hot air duct G100 is mounted on the translation assembly, with its outlet lower than the mounting platform formed by the pins. This design ensures that hot air can directly act on the solder area, preventing heat loss. The arrangement of two hot air ducts G100 allows for simultaneous processing of soldering tasks at two fixture 300 stations, significantly improving production efficiency. The cooling duct G200 is located downstream of the hot air duct G100. This layout fully utilizes the airflow direction generated after the hot air duct G100 operates, allowing cold air to immediately cover the solder joint after soldering, thereby accelerating the solder solidification process. The holding component G300 is connected to the welding lifting assembly and has two holding ends G31, which can simultaneously apply pressure to the two surface-mount LEDs during welding, ensuring their stability on the mounting platform. Based on the overall structure of the surface-mount machine described above, this welding device effectively solves the problems of slow solder cooling and insufficient stability of surface-mount LEDs through the rational layout and coordinated operation of its components, achieving efficient and precise welding results.

[0120] In some of the solutions described above in this application, a hot air duct G100 is installed on a translation component to move the hot air duct G100. However, in its implementation, the structure of the translation component may not be stable or precise enough, causing the hot air duct G100 to shake or deviate in positioning when it moves, which affects the reliability of the welding process and the welding quality of the surface mount LEDs.

[0121] In this regard, this application further proposes a translation component including a translation slider G41 and a translation driver, a hot air duct G100 fixed on the translation slider G41, the translation slider G41 slidably connected to the translation bracket G42, the translation bracket G42 fixed to the frame 100, and the translation driver being drivenly connected to the translation slider G41 to drive the translation slider G41 to reciprocate.

[0122] The translation slider G41 is a mechanical component that provides linear motion support and guidance. Its function is to support the hot air duct G100 and enable it to move smoothly along a preset path. For example, the translation slider G41 can be a linear guide slider, which typically contains balls or rollers and works in conjunction with a linear guide to provide low-friction, high-precision linear motion; alternatively, it can be a dovetail slider, which uses a dovetail cross-section to engage with a dovetail groove to achieve tight and stable sliding. The translation actuator is a device that provides power to drive the translation slider G41 to perform linear motion. Its function is to precisely control the moving position and speed of the hot air duct G100. For example, the translation actuator can be a stepper motor or a servo motor, which drives the slider through a transmission mechanism such as a lead screw, cam linkage, gear rack, or synchronous belt; alternatively, it can be a cylinder or a hydraulic cylinder, which uses pneumatic or hydraulic pressure to push a piston rod, thereby moving the slider.

[0123] The hot air duct G100 is a component used to blow hot air to melt the solder. It is fixed to the translation slider G41 to ensure that the hot air duct G100 remains synchronized with the translation slider G41 during movement, avoiding relative displacement and thus ensuring the positioning accuracy of the hot air outlet. For example, the body of the hot air duct G100 or its connector can be directly fixed to the mounting surface of the translation slider G41 using fasteners such as bolts and screws; alternatively, the hot air duct G100 can be securely clamped to the translation slider G41 using clamps or clamps, which facilitates disassembly and adjustment.

[0124] The translation bracket G42 is a structural component that provides support and guidance for the translation slider G41. The translation slider G41 is connected to the translation bracket G42 by sliding, allowing the translation slider G41 to move linearly along a specific direction on the translation bracket G42. For example, the bottom or side of the translation slider G41 may be provided with guide grooves, which cooperate with corresponding guide rails or guide rods on the translation bracket G42 to achieve low-friction sliding; alternatively, linear bearings or sliding bearings may be provided between the translation slider G41 and the translation bracket G42 to reduce friction and improve motion accuracy.

[0125] The frame 100 is the basic support structure for the entire LED bead welding device. Fixing the translation bracket G42 to the frame 100 provides a stable and reliable mounting base for the translation components, ensuring the rigidity and stability of the entire translation system and thus avoiding positioning errors caused by base swaying during the movement of the hot air duct G100. For example, the translation bracket G42 can be securely connected to the corresponding position on the frame 100 by bolts, welding, or riveting; alternatively, the translation bracket G42 can be designed as an adjustable mounting structure, fixed to the frame 100 by a locking mechanism for easy alignment and calibration during initial installation.

[0126] The transmission connection refers to the translation actuator transmitting its generated power to the translation slider G41, enabling it to achieve the desired reciprocating linear motion. This connection method ensures the effective transmission of driving force and precise control of motion. For example, a lead screw and nut drive can be used, where the translation actuator drives the lead screw to rotate, and the thread on the lead screw engages with the nut on the translation slider G41, converting rotational motion into linear motion; alternatively, a gear and rack drive can be used, where the translation actuator drives the gear to rotate, and the gear meshes with the rack fixed on the translation slider G41, thereby driving the translation slider G41 to reciprocate; still another option is a synchronous belt drive, where the translation actuator drives the synchronous pulley to rotate, and the synchronous belt connects to the translation slider G41, achieving smooth linear motion.

[0127] Through the above technical solution, the hot air duct G100 is mounted on a translation assembly consisting of a translation slider G41, a translation driver, and a translation bracket G42, and the translation bracket G42 is securely fixed to the frame 100, thus providing solid and precise support for the movement of the hot air duct G100. The sliding connection between the translation slider G41 and the translation bracket G42 ensures the stability of the hot air duct G100 during movement, effectively avoiding positioning deviations caused by shaking or vibration. The transmission connection between the translation driver and the translation slider G41 enables precise control of the position and speed of the hot air duct G100, allowing it to be quickly and accurately positioned below the surface-mount LED. The direct fixation of the hot air duct G100 to the translation slider G41 further enhances the overall rigidity and reduces the risk of loosening that may occur in the connection links. These synergistic structural designs significantly improve the stability and precision of the hot air duct G100's movement, ensuring that the outlet of the hot air duct G100 can be accurately aligned with the surface mount LED, thereby improving the reliability of solder melting and welding fixation, and ultimately effectively improving the quality and production efficiency of surface mount LED and pin soldering.

[0128] In some of the solutions described above in this application, a translation component is proposed to move the hot air pipe G100 for welding. However, in its implementation, the height of the hot air pipe G100 is fixed, which cannot be adapted to different types of LED beads with different pin lengths, resulting in inaccurate welding position, low efficiency or unstable quality.

[0129] In this regard, this application further proposes that the hot air duct G100 is fixed to the translation slider G41 by an adjustment assembly. The adjustment assembly includes a support shaft and an adjustment clamp. The hot air duct G100 is fixed to the adjustment clamp as a whole. The adjustment clamp clamps the support shaft to fix the hot air duct G100. The outlet height of the hot air duct G100 is adjusted by releasing the adjustment clamp and rotating it relative to the support shaft to adapt to different models of LED beads with different pin lengths.

[0130] Specifically, the adjustment assembly securely mounts the hot air duct G100 onto the translation slider G41, while providing an adjustable connection. For example, the adjustment assembly can be a translation bracket G42 with threaded fasteners, allowing the hot air duct G100 to be fixed or released by screwing in or out of the threads; alternatively, it can be a clamp with a quick-locking mechanism, allowing for quick installation and removal of the hot air duct G100 by turning a locking lever. The support shaft is the core component of the adjustment assembly, providing a stable reference for the adjustment of the hot air duct G100. The support shaft can be a cylindrical rod, with one or both ends fixed to the translation slider G41, providing rotational or sliding support for the adjustment clamp. The adjustment clamp is a component that mates with the support shaft and clamps the hot air duct G100. For example, the adjustment clamp can be designed with a hole that matches the shape of the support shaft, and clamp the support shaft using bolts or a spring mechanism. The fixed connection between the hot air duct G100 and the adjusting clamp ensures that the hot air duct G100 moves synchronously with the adjusting clamp during adjustment, maintaining its relative position. This integrated fixing can be achieved through welding, riveting, threaded connection, or adhesive. For example, the hot air duct G100 can have a fixing boss on its exterior, which mates with a groove on the adjusting clamp and is secured with bolts; or, the hot air duct G100 can be directly embedded into a preset hole in the adjusting clamp and fused together. The adjusting clamp locks the position of the hot air duct G100 by clamping the support shaft, preventing displacement during welding. Clamping can be achieved in various ways; for example, the adjusting clamp can be designed with an openable structure, tightening the bolts to close the two parts and clamp the support shaft; or, the adjusting clamp can have an internal elastic element that deforms under external pressure to clamp the support shaft. This adjustment mechanism allows the operator to change the outlet height of the hot air duct G100 as needed. Specifically, after the adjusting clamp is released from its grip on the support shaft, the adjusting clamp (along with the hot air duct G100) can rotate around the support shaft. For example, if the connection point between the hot air duct G100 and the adjusting clamp has a certain eccentricity relative to the support shaft, the rotation of the adjusting clamp will cause the outlet of the hot air duct G100 to shift vertically, thereby achieving height adjustment. Alternatively, the support shaft can be provided with a spiral groove, and the adjusting clamp has a pin inside that engages with the spiral groove. By rotating the adjusting clamp, the pin moves along the spiral groove, causing the hot air duct G100 to rise or fall in height.

[0131] Through the above technical solution, this application achieves flexible adjustment of the outlet height of the hot air duct G100 by introducing an adjustment component, thereby effectively solving the problem of adapting to different types of LED beads. Specifically, the hot air duct G100 is fixed to the translation slider G41 by the adjustment component, allowing the height of the hot air duct G100 to be adjusted while it is moving, avoiding welding deviations caused by a fixed position. The adjustment component includes a support shaft and an adjustment clamp. The support shaft provides a stable rotation axis, while the adjustment clamp serves as an operating component, simplifying the adjustment process. The hot air duct G100 and the adjustment clamp are fixed together, ensuring that the hot air duct G100 moves synchronously during adjustment, maintaining overall structural coordination. After welding is completed, the hot air duct G100 is removed without affecting the subsequent delivery of LED beads to the welding station. The adjustment clamp clamps the support shaft to fix the hot air duct G100, maintaining the stability of the hot air duct G100's position during welding and preventing vibration from affecting the welding quality. The outlet height of the hot air duct G100 is adjusted by rotating the adjusting clamp relative to the support shaft. This rotational action allows for fine-tuning of the height, making operation simple and precise. This design allows direct adjustment of the hot air duct G100's outlet height for different pin lengths, ensuring that the hot air accurately reaches the solder position and preventing soldering defects caused by improper G100 height, such as insufficient solder melting or overheating. This significantly improves the adaptability and reliability of soldering, making the device compatible with different types of LED chips, thus improving production efficiency and product quality.

[0132] In some of the embodiments described above in this application, a welding lifting assembly is proposed to connect the holding member G300 and achieve lifting. However, in its implementation, the structure of the welding lifting assembly may lack a specific driving and support mechanism, which may cause the holding member G300 to move unsteadily or be inaccurately positioned during the lifting process, making it impossible to reliably press the surface-mount LED onto the mounting platform formed by the pins, thus affecting the welding stability and quality.

[0133] In this regard, this application further proposes a welding lifting assembly including a lifting slider G51 and a lifting driver, a holding member G300 fixed to the top of the lifting slider G51, the lifting slider G51 slidably connected to the welding lifting bracket G52, the welding lifting bracket G52 fixed to the frame 100, and the bottom end of the lifting slider G51 being drivenly connected to the lifting driver.

[0134] Specifically, this welding lifting assembly is designed to provide precise and stable vertical movement for the holding member G300. It can be an integrated linear motion unit comprising a guiding mechanism and a drive mechanism; or it can be a combination of independent guiding and drive components. The lifting slider G51 is the core moving component of the welding lifting assembly, its main function being to support the holding member G300 and move it vertically along a preset path. For example, the lifting slider G51 can be designed as a slider with linear bearings, used in conjunction with a linear guide rail; or it can be a slider with dovetail grooves, sliding on a corresponding dovetail guide rail. The lifting driver is responsible for providing precise power to the lifting slider G51 to achieve the lifting movement of the holding member G300. For example, the lifting driver can be a stepper motor or servo motor, driving the lifting slider G51 through a lead screw and nut mechanism; or it can be a cylinder or hydraulic cylinder, directly or indirectly driving the lifting slider G51 through a piston rod. The holding component G300 is fixed to the top of the lifting slider G51. This fixing method ensures that the holding component G300 and the lifting slider G51 form a stable whole, thus maintaining synchronous movement during lifting and effectively transmitting driving force to the holding component G300. The fixing method can be through bolt connection, snap-fit ​​connection, or integrated casting. The lifting slider G51 is slidably connected to the welded lifting bracket G52. The welded lifting bracket G52 provides stable guidance and support for the lifting slider G51, ensuring smooth and wobbly movement of the lifting slider G51 in the vertical direction. This sliding connection can be in the form of linear guide pairs, sliding bearings with guide rods, or ball screw pairs. The welded lifting bracket G52, as the base of the entire welding lifting assembly, is fixed to the frame 100, providing a robust and stable reference platform for the lifting movement of the holding component G300. The fixing method can be through bolt fastening, welding, or riveting. The bottom end of the lifting slider G51 is connected to the lifting drive via a transmission mechanism. This transmission mechanism precisely transmits the power generated by the lifting drive to the lifting slider G51, thereby achieving precise control over the position and speed of the holding member G300. The transmission connection can be achieved through a lead screw and nut pair, a gear and rack pair, a synchronous pulley, or a linkage mechanism, etc.

[0135] Through the above technical solution, this application provides a welding lifting assembly with a well-defined structure and stable operation. Specifically, the lifting slider G51, as the main moving body supporting the holding component G300, moves precisely vertically under the stable guidance of the welding lifting bracket G52, effectively avoiding the problems of unstable movement or inaccurate positioning that may occur in traditional solutions. The transmission connection between the lifting driver and the lifting slider G51 ensures that the holding component G300 can obtain reliable and controllable lifting power, thereby achieving precise holding of the surface-mount LED. The holding component G300 is directly fixed to the top of the lifting slider G51, ensuring that the holding force can be applied stably and evenly to the surface-mount LED, preventing displacement or loosening during the welding process. At the same time, the welding lifting bracket G52 is firmly fixed to the frame 100, providing solid support for the entire lifting mechanism, further enhancing the overall stability and reliability of the system. Therefore, this solution ensures that during the soldering process, the G300 holder can always stably press the surface-mount LED onto the mounting platform formed by the leads, significantly improving the stability and quality of the soldering, thereby increasing the production efficiency and yield of LED chips.

[0136] In some of the solutions described above in this application, a cooling pipe G200 is proposed to blow cold air onto the surface mount LED to cool the solder quickly. However, in its implementation, the fixed position of the cooling pipe G200 may be unstable, and the outlet position may not be accurately aligned with the bottom of the surface mount LED, resulting in low cooling efficiency and unstable soldering quality.

[0137] In this regard, this application further proposes that the cooling pipe G200 is fixed to the top of the welding lifting bracket G52, and the outlet of the cooling pipe G200 bends and extends to the bottom of the surface-mount LED.

[0138] Specifically, the fixing method of the cooling pipe G200 is designed to ensure its positional stability and reliability during operation. This fixing can be achieved using various structures. For example, the cooling pipe G200 can be directly connected using fasteners such as bolts and screws, or fixed to the top of the welding lifting bracket G52 using auxiliary components such as clamps and clamps. Alternatively, the cooling pipe G200 can be integrally connected to the top of the welding lifting bracket G52 through welding, bonding, or other methods. This fixing method allows the cooling pipe G200 to move with the welding lifting bracket G52 and maintain its precise position relative to the welding area, preventing displacement due to equipment vibration or impacts during operation. Simultaneously, the outlet design of the cooling pipe G200 is designed to precisely guide the cold air to the welding area of ​​the surface-mount LED for efficient solder cooling. The curved extension structure of the outlet can take various forms; for example, the end of the cooling pipe G200 can be designed as an L-shaped, U-shaped, or S-shaped bend, allowing its outlet to bypass other components from the side or top, ultimately positioning the cold air nozzle directly below the surface-mount LED. Another implementation is that the main body of the cooling pipe G200 remains straight, but a nozzle or shroud with a curved channel is connected to its end, with the outlet of the nozzle or shroud facing downwards towards the surface-mount LED.

[0139] Through the above technical solution, the cooling pipe G200 is fixed to the top of the welding lifting bracket G52, ensuring that the cooling pipe G200 remains stably installed during the welding process and avoiding displacement caused by vibration or movement. Simultaneously, the outlet of the cooling pipe G200 extends downwards to the underside of the surface-mount LED, allowing cold air to blow directly and precisely onto the welding point of the surface-mount LED, accelerating the solder cooling process. This precise and stable cooling method effectively solves the problems of unstable position and inaccurate cooling of the cooling pipe G200, thereby significantly improving the solder cooling efficiency and welding quality, ensuring the stability and reliability of the LED chips. In the entire workflow of the surface-mount LED welding device G, after the hot air pipe G100 completes welding, the cooling pipe G200 can quickly and accurately cool the welding point. Its synergistic effect with the holding component G300 on the welding lifting assembly further ensures the stability of the welding process and the quality of the final product.

[0140] After the surface mount LEDs are soldered, the fixture flipping device K is activated, which drives the fixture 300 to flip 180 degrees up and down, so that the surface mount LEDs on the fixture 300 face down and the leads face up, thus creating an ideal orientation for subsequent packaging processes.

[0141] The surface mount LED encapsulation device H is the core component for applying encapsulating adhesive. (Reference) Figure 19As shown, the surface mount LED packaging device H includes an encapsulant receiving cavity H100 and an encapsulant lifting mechanism H200. The encapsulant receiving cavity H100 stores the encapsulant to be applied, while the encapsulant lifting mechanism H200 is responsible for precisely controlling the vertical movement of the encapsulant receiving cavity H100. When the fixture 300 is flipped and moved to the packaging station, the encapsulant lifting mechanism H200 drives the encapsulant receiving cavity H100 to rise, wrapping the surface mount LED and its soldering points with the leads from below, ensuring that the encapsulant can evenly cover the critical areas. For example, the encapsulant receiving cavity H100 can be an open container containing liquid encapsulant. The encapsulant lifting mechanism H200 can be composed of a lead screw mechanism driven by a stepper motor. The rotation of the lead screw drives the platform connected to the lead screw to move up and down, thereby realizing the lifting and lowering of the encapsulant receiving cavity H100. The rising of the encapsulant receiving cavity H100 allows the encapsulant inside to contact and wrap the downward-facing surface mount LED and its upward-facing soldering points with the leads. This upward wrapping method helps ensure that the encapsulating adhesive can evenly and completely cover the target area, reducing the formation of voids and air bubbles. For example, the encapsulating adhesive cavity H100 can rise to a preset height, completely immersing the bottom of the surface-mount LED and the solder joints of the leads in the encapsulating adhesive, and then remain there for a period of time to ensure full coverage. After encapsulation, the material turntable 200 continues to move the fixture 300 to the station where the LED bead detection and unloading device J is located, completing the functional testing and unloading operation of the encapsulated LED beads.

[0142] In some embodiments described above in this application, an encapsulant cavity H100 is proposed to contain encapsulant and lift and wrap the surface-mount LED. However, during its implementation, the encapsulant may overflow, causing waste and requiring cleaning, which affects efficiency and environmental protection.

[0143] In this regard, this application further proposes that the encapsulating adhesive receiving cavity H100 is provided in the encapsulating adhesive receiving cup H101. The encapsulating adhesive receiving cup H101 has an inner cup body H11 and an outer cup body H12. The outer cup body H12 surrounds the outer periphery of the inner cup body H11. The inner cup body H11 is higher than the outer cup body H12. The outer cup body H12 is provided with a return port. The return port is connected to a return pipe H13. The encapsulating cavity storage container is connected to the inner cup body H11 through the adhesive delivery pipe H14. The encapsulating adhesive overflowing from the inner cup body H11 flows into the outer cup body H12 and is transported to the recycling container through the return pipe H13.

[0144] Specifically, the encapsulant receiving cavity H100 is disposed inside the encapsulant receiving cup H101, which is a container structure specifically designed to hold encapsulant, aiming to optimize the storage, supply, and recycling process of encapsulant. The encapsulant receiving cup H101 can be a one-piece molded structure, with its internal space naturally forming the encapsulant receiving cavity H100; alternatively, the encapsulant receiving cup H101 can be assembled from multiple components, one of which forms the encapsulant receiving cavity H100 and fits tightly with the other parts of the cup body. The encapsulant receiving cup H101 further includes an inner cup body H11 and an outer cup body H12. The inner cup body H11 is the container part that directly contacts the encapsulant and is used for encapsulation operations, while the outer cup body H12 is an annular space formed outside the inner cup body H11, primarily used to collect spilled encapsulant. The inner cup H11 and outer cup H12 can be integrally injection molded or welded from the same corrosion-resistant material (such as stainless steel or special plastic), or they can be made of different materials. For example, the inner cup H11 can be made of a highly corrosion-resistant material, while the outer cup H12 can be made of a lower-cost structural material, combined through nesting or fixing. The outer cup H12 surrounds the outer periphery of the inner cup H11, meaning that the outer cup H12 completely or partially surrounds the inner cup H11 in the horizontal direction, forming a channel or space around the inner cup H11. This ensures that any overflowing encapsulating adhesive from the inner cup H11 can be effectively captured, preventing it from spreading outwards. The outer cup H12 can be designed as a circular or square ring structure, matching the shape of the inner cup H11 to ensure that the overflowing adhesive flows in evenly; alternatively, the outer cup H12 can consist of multiple independent collection grooves distributed along the periphery of the inner cup H11, collectively forming a surrounding effect.

[0145] To effectively guide overflow, the inner cup H11 is higher than the outer cup H12. Specifically, the top edge of the inner cup H11, or the level of the encapsulating adhesive, is higher than the top edge of the outer cup H12 under normal operating conditions. This height difference can be achieved through precise mold design or machining, or by adding a raised structure to the bottom of the inner cup H11 or a groove to the bottom of the outer cup H12. When the level of the encapsulating adhesive in the inner cup H11 exceeds a certain height, the adhesive will preferentially overflow into the outer cup H12 instead of directly spilling into the external environment. The outer cup H12 is equipped with a return port, which is an opening located at the bottom or side wall of the outer cup H12, used to guide the collected overflowing encapsulating adhesive out of the outer cup H12. The return port can be a simple hole, its size and position optimized to ensure smooth adhesive flow; it can also be designed with a filter or valve to prevent impurities from entering the return pipe H13 or to control the adhesive return rate. The return port is connected to a return pipe H13, which connects to the return port and is used to deliver overflowing encapsulating adhesive. The return pipe H13 can be a flexible hose for easy installation and adjustment, and can adapt to the equipment layout; alternatively, it can be a rigid pipe, such as stainless steel or PVC, offering better structural stability and corrosion resistance. Furthermore, the encapsulation cavity storage container is connected to the inner cup H11 via a dispensing pipe H14. The encapsulation cavity storage container is the source container for storing large quantities of encapsulating adhesive, and the dispensing pipe H14 connects the storage container and the inner cup H11, replenishing the inner cup H11 with encapsulating adhesive. The encapsulation cavity storage container can be a pressure tank with a pump, actively delivering the encapsulating adhesive to the inner cup H11 via the dispensing pipe H14; or it can be a gravity-fed storage tank, using gravity to deliver the encapsulating adhesive to the inner cup H11 via the dispensing pipe H14, controlled by a level sensor.

[0146] Through the above technical solution, when the encapsulant cavity H100 rises to encapsulate the surface-mount LED, even if the encapsulant overflows due to liquid level fluctuations or operational errors, the overflowing encapsulant will naturally flow into the outer cavity H12 because the inner cavity H11 is higher than the outer cavity H12 and the outer cavity H12 surrounds the inner cavity H11. Subsequently, this collected encapsulant is safely and efficiently transported to the recycling container through the return port on the outer cavity H12 and the connected return pipe H13, ensuring a clean working environment. Simultaneously, the encapsulation cavity storage container continuously replenishes the encapsulant to the inner cavity H11 through the encapsulation delivery pipe H14, ensuring the continuity of the encapsulation process. This design effectively prevents encapsulant from directly overflowing outside the equipment, thus solving the waste and cleanup problems caused by encapsulant overflow. By recycling and reusing the overflowing encapsulant, not only is encapsulant consumption significantly reduced, production costs are lowered, but the cleaning and maintenance of the equipment is simplified, production efficiency is improved, and environmental protection requirements are met.

[0147] In some of the embodiments described above in this application, a sealing adhesive lifting mechanism H200 is proposed to drive the sealing adhesive receiving cup H101 to lift. However, in its implementation, the structure of the lifting mechanism lacks specific implementation details, which may lead to instability in the lifting process, insufficient motion accuracy, or low driving efficiency, affecting the accurate positioning and sealing effect of the sealing adhesive receiving cup H101.

[0148] In this regard, this application further proposes a sealing adhesive lifting mechanism H200 including a sealing lifting rod H21 and a lifting driver. The sealing lifting rod H21 is slidably connected to the sealing lifting bracket H22, the sealing lifting bracket H22 is fixed to the frame 100, the bottom end of the sealing lifting rod H21 is connected to the lifting driver, and the top end of the sealing lifting rod H21 is fixedly connected to the sealing adhesive receiving cup H101.

[0149] The encapsulation lifting rod H21, as a linear motion component, primarily functions to provide precise guidance and support, ensuring the smooth vertical movement of the encapsulation adhesive receiving cup H101. Specifically, the encapsulation lifting rod H21 can employ a precision-ground cylindrical guide rod with linear bearings for low-friction sliding; alternatively, it can use a ball screw lever, achieving precise linear displacement through the rotation of a nut. The lifting driver is the core component providing power to the entire lifting mechanism, driving the encapsulation lifting rod H21 in controllable lifting motion. For example, a stepper motor or servo motor can be used, achieving precise adjustment of position and speed through precise pulse control; alternatively, a hydraulic cylinder or pneumatic cylinder can be used, driving the piston rod through fluid pressure to achieve lifting.

[0150] The sliding connection between the encapsulation lifting rod H21 and the encapsulation lifting bracket H22 is designed to ensure that the encapsulation lifting rod H21 can move smoothly and steadily during lifting, while bearing vertical loads. This connection can be achieved by setting guide grooves on the encapsulation lifting bracket H22 and allowing the encapsulation lifting rod H21 to move within the guide grooves via sliding bearings or rollers; alternatively, a combination of linear guides and sliders can be used to provide high-precision linear guidance. The encapsulation lifting bracket H22 is fixed to the frame 100 to provide a stable reference and support for the entire lifting mechanism, preventing swaying or displacement during lifting, thereby ensuring the positioning accuracy of the encapsulation adhesive receiving cup H101. This fixing method can be achieved by bolting, using multiple bolts to firmly fix the encapsulation lifting bracket H22 to the preset position on the frame 100; alternatively, the encapsulation lifting bracket H22 can be integrally connected to the frame 100 by welding to achieve higher rigidity.

[0151] The bottom end of the encapsulation lifting rod H21 is connected to the lifting driver, the purpose of which is to effectively convert the rotational or linear motion of the driver into the vertical lifting motion of the encapsulation lifting rod H21. For example, the rotational motion of the driver can be converted into the linear motion of the rack through a gear and rack mechanism, thereby driving the encapsulation lifting rod H21; or, the rotational power of the driver can be transmitted to the drive shaft connected to the encapsulation lifting rod H21 through a synchronous pulley and synchronous belt, thus achieving lifting. The top end of the encapsulation lifting rod H21 is fixedly connected to the encapsulation adhesive container H101, ensuring that the encapsulation adhesive container H101 can rise and fall synchronously and precisely with the movement of the encapsulation lifting rod H21, thereby achieving precise control of the encapsulation adhesive level. This fixed connection can be achieved by connecting the bottom of the encapsulation adhesive container H101 to the top end of the encapsulation lifting rod H21 through a flange and bolts; or, the encapsulation adhesive container H101 can be securely installed on the top end of the encapsulation lifting rod H21 through an integrated clamp 300 or snap-fit ​​structure.

[0152] Through the above technical solution, the structure of the encapsulating adhesive lifting mechanism H200 has been specified and optimized. The encapsulating lifting rod H21, as a linear motion component, provides stable guidance, and together with the stable support of the encapsulating lifting bracket H22, effectively prevents the encapsulating adhesive container H101 from shaking or shifting during the lifting process. The lifting driver, as the power source, ensures efficient power transmission and reliable lifting action through its transmission connection with the bottom of the encapsulating lifting rod H21, avoiding jamming or failure due to insufficient power. The fixed connection between the top of the encapsulating lifting rod H21 and the encapsulating adhesive container H101 ensures that the container can rise and fall synchronously and precisely with the encapsulating lifting rod H21, thereby achieving accurate control of the encapsulating adhesive level. These features work synergistically to significantly improve the stability, motion accuracy, and driving efficiency of the encapsulating adhesive container H101 during the lifting process, ensuring that the encapsulating adhesive can accurately and evenly wrap the surface-mount LED and its soldering points with the pins, thus guaranteeing the encapsulation quality and luminous effect of the LED chips.

[0153] In some embodiments of this application, a sealing adhesive lifting mechanism H200 is proposed to lift the sealing adhesive receiving cup H101. However, in its implementation, the supply of sealing adhesive lacks precise control, which can easily lead to oversupply, resulting in waste and unstable sealing quality.

[0154] In this regard, this application further proposes that the top end of the packaging lifting rod H21 is provided with an extension arm H23, and an extrusion pump H24 for quantitatively extruding packaging adhesive is installed on the extension arm H23. The adhesive delivery pipe H14 is connected to the inlet of the extrusion pump H24, and the outlet of the extrusion pump H24 is aligned with the inner cup body H11.

[0155] Specifically, the top end of the packaging lifting rod H21 is provided with an extension arm H23. This extension arm H23 can be understood as a structure extending outward from the top end of the packaging lifting rod H21, its main function being to provide a stable mounting platform for other components. For example, the extension arm H23 can be designed as a lateral protrusion integrally formed with the packaging lifting rod H21, directly forming one or more support surfaces on the top of the packaging lifting rod H21 through machining; alternatively, the extension arm H23 can also be a separately manufactured component, securely fixed to the top end of the packaging lifting rod H21 by bolts, riveting, or welding. By providing the extension arm H23, stable support can be provided for subsequently installed components, ensuring that they can rise and fall synchronously with the movement of the packaging lifting rod H21, avoiding relative displacement or swaying during movement.

[0156] Based on this, an extrusion pump H24 for metering encapsulating adhesive is installed on the extension arm H23. This extrusion pump H24 is a device capable of precisely controlling the output of the fluid (i.e., the encapsulating adhesive). For example, the extrusion pump H24 can adopt a screw pump structure, controlling the volume of encapsulating adhesive extruded each time through the precise rotation of the screw, thereby achieving a high degree of metering control; alternatively, the extrusion pump H24 can also adopt a plunger pump structure, ensuring consistent encapsulating adhesive quantity extruded each time through the reciprocating motion of the plunger and precise volume measurement. By installing a metering extrusion pump H24 on the extension arm H23, the supply of encapsulating adhesive no longer relies on simple gravity flow or pressure difference, but is precisely metered mechanically, thus effectively solving the problem of uncontrollable encapsulating adhesive supply.

[0157] Simultaneously, the adhesive delivery pipe H14 is connected to the inlet of the extrusion pump H24. The adhesive delivery pipe H14 is used to transport the encapsulating adhesive from the storage container to the extrusion pump H24. Its connection to the inlet of the extrusion pump H24 can be varied; for example, a quick-connect coupling can be used for easy disassembly and installation during maintenance or adhesive replacement; a threaded connection or clamp connection can also be used to ensure a tight and airtight connection, preventing leakage or contamination of the encapsulating adhesive during transport. This connection method ensures that the encapsulating adhesive can stably and reliably enter the extrusion pump H24 from the storage container, providing a stable adhesive source for subsequent quantitative extrusion.

[0158] Furthermore, the outlet of the extrusion pump H24 is aligned with the inner cup H11. The outlet of the extrusion pump H24 is the release point after the encapsulating adhesive is precisely extruded, while the inner cup H11 is the core part of the encapsulating adhesive receiving cup H101, used to directly contain the encapsulating adhesive and contact the surface-mount LED. Aligning the outlet of the extrusion pump H24 with the inner cup H11 means that the adhesive outlet position of the extrusion pump H24 is spatially precisely aligned with the inlet area of ​​the inner cup H11. For example, the outlet of the extrusion pump H24 can be located directly above the inner cup H11, ensuring that the extruded encapsulating adhesive falls vertically into the inner cup H11; or, a short guide tube H241 can extend the outlet of the extrusion pump H24 into the interior of the inner cup H11 to further reduce the possibility of adhesive splashing or deviating from the target area. This precise alignment ensures that the metered extruded encapsulating adhesive can be accurately injected into the inner cup H11, avoiding waste or contamination of the adhesive during the injection process.

[0159] Through the above technical solution, during the lifting of the encapsulating adhesive receiving cup H101 by the encapsulating adhesive lifting mechanism H200, the extension arm H23 at the top of the encapsulating lifting rod H21 provides a stable mounting platform for the quantitative extrusion pump H24, allowing the extrusion pump H24 to move synchronously with the encapsulating lifting rod H21, ensuring the stability of the encapsulating adhesive supply. The quantitative extrusion pump H24 can precisely control the amount of encapsulating adhesive extruded each time, avoiding over-supply of encapsulating adhesive from the source, thereby significantly reducing encapsulating adhesive waste. Simultaneously, the reliable connection between the adhesive delivery tube H14 and the inlet of the extrusion pump H24, and the design of aligning the outlet of the extrusion pump H24 with the inner cup H11, ensure that the encapsulating adhesive can be stably and accurately injected into the inner cup H11, avoiding overflow or inaccurate injection, thus ensuring the stability and uniformity of the encapsulating adhesive level in the inner cup H11. This allows for a more uniform and consistent encapsulation effect when the encapsulating adhesive receiving cavity H100 rises to wrap the surface-mount LED and its soldering points with the leads, effectively improving the encapsulation quality and production efficiency of LED chips.

[0160] In some of the solutions described above in this application, a fixture flipping device K is proposed to drive the fixture 300 to flip up and down by 180 degrees, so that the surface-mount LEDs on the fixture 300 face down and the pins face up. However, in this process, the flipping mechanism may lack a reliable driving mechanism, resulting in unstable or inaccurate flipping action, which affects the positioning of the fixture 300 and the accuracy of subsequent packaging steps.

[0161] In this regard, refer to Figures 20 to 22 This application further proposes a fixture flipping device K, which includes a rotating clamp K100 and a flipping drive assembly K200 that drives the rotating clamp K100 to flip 180 degrees. The rotating clamp K100 cooperates with the fixture 300 to drive the fixture 300 to flip.

[0162] The rotating clamp K100 is a mechanical component that engages with the fixture 300 and drives it to perform precise angular rotation. It can be connected to the fixture 300 through gear engagement, slot nesting, or magnetic adsorption. The rotation drive assembly K200 provides power to the rotating clamp K100 and controls its rotation angle. This can be achieved through motor drive, cylinder propulsion, or hydraulic transmission. The purpose of introducing the rotating clamp K100 and the rotation drive assembly K200 is to ensure the stability and positioning accuracy of the fixture 300 during rotation, thereby avoiding the problem of insufficient coverage of critical areas by the encapsulating adhesive due to shaking or displacement.

[0163] Specifically, this solution ensures the stability of the clamp 300 during the flipping process through the tight cooperation between the rotating clamp K100 and the fixture 300. The design of the rotating clamp K100 allows the fixture 300 to be reliably fixed during flipping, avoiding displacement caused by mechanical vibration or inertia. Simultaneously, the flipping drive assembly K200 provides precise 180-degree rotation control, ensuring the consistency and repeatability of the flipping angle. This structural design not only ensures that the fixture 300 is accurately positioned at the packaging station after flipping, but also reduces impact on the surface-mount LEDs and their soldering areas, protecting the integrity of the soldering area. Furthermore, the cooperation mechanism between the rotating clamp K100 and the fixture 300, along with the power output of the flipping drive assembly K200, forms an organic whole, working together to achieve a smooth and stable flipping action, laying a reliable foundation for subsequent packaging operations. This design significantly improves product yield and efficiency in the production process and solves the problem of packaging defects caused by positioning deviations.

[0164] This application further proposes a flip drive assembly K200 including a clamp flip drive, a drive gear K202, and a driven gear K203. The drive gear K202 is driven to rotate by the clamp flip drive. The driven gear K203 meshes with the drive gear K202 and is coaxially fixed to the rotating clamp K100. The clamp 300 includes a clamp body 302 and a clamp base 301. The clamp body 302 is rotatably connected to the clamp base 301. The clamp shaft 303 is connected to the clamp base 301 and installed in the clamp seat 305. The seat 305 is installed on the material turntable 200. The clamp body 302 includes two clamp bodies, and an intermediate body 304 is provided between the two clamp bodies 302. The two clamp bodies 302 can approach each other to clamp the pins or move away from each other to release the pins. The rotating clamp K100 is provided with a slot K101 that cooperates with the clamp 300. The clamp base 301 is provided with a block 3011 that cooperates with the slot K101. The block 3011 cooperates with the slot K101 so that the rotation axis of the rotating clamp K100 coincides with the axis of the clamp rotation shaft 303.

[0165] Specifically, the clamp tilting driver refers to the device used to provide rotational power, which can be implemented using a servo motor, stepper motor, etc. In practical applications, the driving gear K202 is the key component that directly receives the driving force. It can be implemented using a metal gear or a high-strength plastic gear to ensure transmission accuracy and durability. The meshing design of the driven gear K203 with the driving gear K202 can effectively transmit motion, and its tooth profile can be selected as a spur gear or a helical gear. The rotating clamp K100, through precise engagement with the clamp block 3011 on the clamp base 301, ensures strict alignment of the rotation axis. This design can eliminate axial offset and radial runout during the tilting process.

[0166] In detail, this solution achieves precise flipping functionality through the organic coordination of several key components. The fixture flipping driver directly drives the active gear K202 to rotate, avoiding the error accumulation problem in traditional transmission methods. The rigid meshing of the active gear K202 and the passive gear K203 ensures the stability of motion transmission, while the coaxial fixing design of the passive gear K203 and the rotating fixture K100 ensures rotational synchronization. The fixture base 301 provides a stable foundation for the entire structure, while the fixture shaft 303 forms a reliable rotation fulcrum. The two fixture bodies 302 achieve symmetrical clamping through the intermediate body 304. This structure not only evenly distributes the clamping force but also prevents pin deformation. In particular, the slot K101 of the rotating fixture K100 precisely engages with the locking block 3011 on the fixture base 301, fundamentally solving the problem of axial misalignment that may occur during flipping, ensuring that the surface-mount LED is precisely facing down after a 180-degree flip, providing a reliable guarantee for subsequent packaging processes. This design, combined with the overall structure of the aforementioned pick-and-place machine, significantly improves production efficiency and product yield.

[0167] In some embodiments described above in this application, a clutch assembly is proposed to engage and disengage the rotary clamp K100 and the clamp block 3011, thereby controlling the approach or departure of the fixture flipping mechanism K. However, in its implementation, the driving mechanism of the clutch action is not specific enough, which may lead to unstable or unreliable movement of the passive shaft, affecting the precise engagement or disengagement of the rotary clamp K100 and the clamp block 3011, and thus reducing the efficiency of automated packaging.

[0168] In response, this application further proposes an improved clutch assembly, which includes a clutch driver and a clutch transmission link K002. The clamp tilting mechanism K includes a tilting base K001, with a drive shaft K2021 mounting a drive gear K202 and a driven shaft K2031 mounting a driven gear K203 both slidably connected to the tilting base K001. The drive shaft K2021 and the driven shaft K2031 are axially fixed to each other, and a bushing K2032 is axially positioned on the driven shaft K2031. The clutch transmission link K002 is movably connected to the bushing K2032. The clutch driver drives the clutch transmission link K002 to swing, causing the driven shaft K2031 to reciprocate, thereby engaging / disengaging the rotating clamp K100 with the clamp block 3011.

[0169] Specifically, a clutch assembly is a mechanism used to connect and disconnect mechanical components. Its core function is to enable two originally independent components to engage and transmit motion or force, or to separate them to interrupt the transmission of motion or force, based on a control signal. In this application, it serves as a key actuator for controlling the approach or departure of the clamp flipping mechanism K. This clutch assembly can take various forms; for example, it can be an electromagnetic clutch, using the switching of an electromagnetic coil to generate magnetic force to control engagement and disengagement; or it can be a mechanical clutch, such as one using a cam mechanism or lever mechanism to achieve physical engagement and disengagement. The clutch actuator is a device that provides the power source for the clutch assembly, responsible for generating driving force or motion to initiate the engagement or disengagement of the clutch assembly. It is the power output unit for the entire clutch process. Specifically, the clutch actuator can be a stepper motor or servo motor, providing driving force by precisely controlling the rotation angle or position; or it can be a cylinder or hydraulic cylinder, using pneumatic or hydraulic pressure to drive a piston rod in linear reciprocating motion. The clutch transmission link K002 is a mechanical component connecting the clutch actuator and the driven shaft K2031 (via the bushing K2032). Its function is to convert the motion generated by the clutch actuator into the reciprocating motion required by the driven shaft K2031, thereby realizing the engagement and disengagement of the rotary clamp K100 and the clamp block 3011. It plays a crucial role in motion transmission and conversion. For example, the clutch transmission link K002 can be designed as a connecting rod in a crank-connecting rod mechanism, converting the rotational motion of the actuator into the linear reciprocating motion of the driven shaft K2031; or it can be a rocker arm in a rocker arm mechanism, transmitting the motion of the actuator to the driven shaft K2031 through swinging.

[0170] The tilting base K001 is a structural support component of the clamp tilting mechanism K, providing a stable mounting and sliding guide platform for the drive shaft K2021 and the driven shaft K2031. It ensures the accuracy of the shaft's motion trajectory and the overall stability of the mechanism. For example, the tilting base K001 can be a box structure machined from high-strength aluminum alloy or steel, with internal precision guide rails; alternatively, it can be a cast or welded frame structure, bolted to the frame 100, and integrated with bearing seats and sliding bushings. Both the drive shaft K2021 and the driven shaft K2031 are slidably connected to the tilting base K001, meaning that the drive shaft K2021 and the driven shaft K2031 can move relative to each other along their axial direction on the tilting base K001. This sliding connection is typically achieved through guide rails, linear bearings, or sliding bushings to ensure the smoothness and accuracy of the shafts during reciprocating motion. Specifically, a sliding connection can be achieved by installing linear guides on the flip base K001 and linear bearing sliders on the drive shaft K2021 and driven shaft K2031; alternatively, a sliding connection can be achieved by machining precision holes in the flip base K001 and installing sliding bushings (such as self-lubricating bearings) on the drive shaft K2021 and driven shaft K2031. The drive shaft K2021 and driven shaft K2031 are axially fixed to each other, meaning they are locked together in the axial direction. They move axially as a whole but can still rotate relative to each other. This fixing ensures that they move synchronously during clutch engagement, avoiding relative axial displacement. For example, the drive shaft K2021 and driven shaft K2031 can be kept relatively fixed in the axial direction while allowing relative rotation through key connections, spline connections, or pin connections; alternatively, an axial limiting ring or flange can be installed between the two shafts and secured with bolts to ensure axial separation. A bushing K2032 is axially positioned on the driven shaft K2031. The bushing K2032 is an annular or cylindrical component mounted on the driven shaft K2031. Its function is to provide a stable connection point for the clutch transmission link K002 and ensure that the movement of the clutch transmission link K002 can be accurately transmitted to the driven shaft K2031, while also providing axial positioning for the driven shaft K2031. For example, the bushing K2032 can be made of a highly wear-resistant material (such as bronze, engineering plastics, or hardened steel) and fixed to the driven shaft K2031 by an interference fit or key connection; alternatively, the bushing K2032 can also be a flanged structure, fixed to a specific position on the driven shaft K2031 by screws, and providing lugs or pin holes for connection with the link. The clutch transmission link K002 is movably connected to the bushing K2032. This movable connection allows the clutch transmission link K002 to flexibly drive the bushing K2032 and the driven shaft K2031 to reciprocate during oscillation, while avoiding unnecessary stress or jamming. The movable connection is usually achieved by means of a pin, ball joint, or universal joint.Specifically, a pin connection can be used, with pin holes provided on one end of the clutch transmission link K002 and the bushing K2032 respectively, allowing relative rotation; or a ball joint connection can be used to provide multiple degrees of freedom to accommodate the complex motion of the link swinging.

[0171] In actual operation, the clutch actuator drives the clutch transmission link K002 to swing, causing the driven shaft K2031 to reciprocate, thereby engaging or disengaging the rotating clamp K100 and the clamp block 3011. This is the entire clutch action execution process. The clutch actuator generates an initial motion, which is converted into a linear reciprocating motion of the driven shaft K2031 through the clutch transmission link K002. Since the driven shaft K2031 is coaxially fixed with the rotating clamp K100, and the rotating clamp K100 cooperates with the clamp block 3011, the reciprocating motion of the driven shaft K2031 directly causes the engagement or disengagement of the rotating clamp K100 and the clamp block 3011, thus realizing the clutch function. For example, when the clutch actuator (such as a servo motor) drives the clutch transmission link K002 (such as a rocker arm) to swing, the other end of the link drives the bushing K2032 through a movable connection, thereby causing the driven shaft K2031 to perform a linear reciprocating motion along its axial direction. When the driven shaft K2031 moves in one direction, the rotating clamp K100 approaches the clamp block 3011, engaging it; when the driven shaft K2031 moves in another direction, the rotating clamp K100 moves away from the clamp block 3011, disengaging it.

[0172] Through the above technical solution, the clutch actuator provides initial driving force as a power source to ensure the start of the action; the clutch transmission link K002, as an intermediate transmission component, converts the oscillation of the actuator into linear motion; the flip base K001 provides stable support for the entire mechanism to ensure motion stability; the drive shaft K2021 and the driven shaft K2031 are slidably connected to the flip base K001, allowing free axial movement and creating conditions for reciprocating motion; the drive shaft K2021 and the driven shaft K2031 are axially fixed to each other to ensure synchronous movement and avoid displacement deviation; the bushing K2032 axially positioned on the driven shaft K2031 serves as a fixed connection point to enhance structural rigidity; the clutch transmission link K002 is movably connected to the bushing K2032 to achieve effective conversion from oscillation to linear motion; the clutch actuator drives the clutch transmission link K002 to oscillate, driving the driven shaft K2031 to reciprocate, ultimately driving the rotating clamp K100 and the clamp block 3011 to achieve precise engagement and disengagement. This design optimizes the structure of the clutch assembly, solves the problems of smoothness and reliability of clutch action, and ensures the precise engagement or disengagement of the rotating clamp K100 and the clamp block 3011, thereby significantly improving the efficiency and reliability of the automated packaging process.

[0173] After the encapsulating adhesive has completely wrapped the surface-mount LED and its soldering points, and has initially formed the shape of the LED bead, the fixture 300 moves again. This movement transports the encapsulated LED bead to the station where the encapsulating adhesive curing device I is located. At the curing station, the encapsulating adhesive will harden through a specific method (such as heating or ultraviolet light irradiation) to form a stable LED bead. For example, the fixture 300 can smoothly feed the LED bead into the curing area using the same conveyor as the encapsulation station, and wait for the curing process to complete.

[0174] In some of the embodiments described above in this application, an encapsulant curing apparatus I is proposed to cure encapsulant to form LED beads. However, in its implementation, if a general curing mechanism is used, it may not be able to provide efficient and uniform light curing for the characteristics of UV adhesive, resulting in insufficient curing, light leakage affecting other workstations, or a decrease in encapsulation quality.

[0175] In this regard, combined with Figure 23 See, this application further proposes that the encapsulating adhesive is a UV adhesive, and the encapsulating adhesive curing device I includes a UV lamp I100 and a light shield I200. The UV lamp I100 is located on one side of the LED lamp bead conveying path, and the light shield I200 is located above the LED lamp bead conveying path.

[0176] Specifically, UV adhesives, or ultraviolet light curable adhesives, are used for encapsulation. UV adhesives are adhesives that undergo a polymerization reaction by absorbing ultraviolet energy of a specific wavelength, thus achieving rapid curing. Their characteristics include fast curing speed, high bonding strength, good transparency, and environmental friendliness without solvents. In LED chip encapsulation, using UV adhesives can significantly shorten curing time, improve production efficiency, and form a transparent and stable encapsulation layer, ensuring the optical performance of the LED chips. There are many types of UV adhesives, and the appropriate model can be selected according to the encapsulation requirements of the LED chips (such as viscosity, refractive index, hardness, heat resistance, and yellowing resistance). For example, epoxy acrylate UV adhesives, polyurethane acrylate UV adhesives, or silicone-modified UV adhesives can be used.

[0177] The encapsulant curing device I is used to cure encapsulants. Its core components are the ultraviolet lamp I100 and the light shield I200. The ultraviolet lamp I100 provides the ultraviolet energy required for curing and can be a high-pressure mercury lamp, an LED ultraviolet light source (such as a UV-LED array), or a xenon lamp. Among these, the UV-LED light source has advantages such as long lifespan, low energy consumption, low heat generation, and instantaneous switching capability. Furthermore, specific wavelengths of LEDs can be selected based on the absorption spectrum of the UV adhesive. The light shield I200 is used to control the irradiation range of the ultraviolet light, preventing light leakage into non-cured areas and protecting operators and surrounding equipment. The light shield I200 can be made of opaque metal plates (such as aluminum alloy or stainless steel), engineering plastic plates, or materials with ultraviolet absorption capabilities. Its design should ensure effective blocking of ultraviolet light and can be designed as fixed or adjustable according to actual needs.

[0178] To achieve efficient and uniform curing, the UV lamp I100 is positioned on one side of the LED chip transport path, such as the outer side, depending on the available space. Positioning the UV lamp I100 on the outer side of the LED chip transport path ensures uniform illumination of the sides of the LED chips. This arrangement avoids shadow areas caused by the chips themselves, ensuring that the encapsulating adhesive receives sufficient UV light on all sides of the chips, thus achieving comprehensive and uniform curing and preventing encapsulation defects caused by incomplete local curing. The UV lamp I100 can be arranged symmetrically along both sides of the transport path, or, depending on the shape of the chips and the distribution of the encapsulating adhesive, in a multi-angle, multi-source arrangement. For example, multiple UV-LED modules can be installed at an angle on both sides of the transport path to create a surround illumination effect.

[0179] Meanwhile, the light-shielding plate I200 is located above the LED bead conveying path. The primary purpose of placing the light-shielding plate I200 above the LED bead conveying path is to block upward-scattered ultraviolet (UV) light. During the curing process, UV light may be reflected or scattered upwards, affecting the working environment or operators above. The light-shielding plate I200 effectively absorbs or reflects this scattered light, preventing UV leakage, improving equipment safety, and avoiding light pollution to other workstations or sensitive components. The light-shielding plate I200 can be designed as a structure fixed above the frame 100, or it can be an openable or height-adjustable structure for easy maintenance and adjustment. Its material should have good UV-blocking properties and can be surface-treated to reduce reflection.

[0180] Through the above technical solution, using UV adhesive in conjunction with a specially designed encapsulation adhesive curing device I, rapid and efficient curing of LED chip encapsulation adhesive can be achieved. The UV lamp I100 is located outside the LED chip transport path, ensuring uniform irradiation of the LED chips from the side, effectively avoiding curing blind spots caused by chip obstruction, thus guaranteeing full curing of the encapsulation adhesive and improving encapsulation quality. Simultaneously, the light-shielding plate I200 is located above the LED chip transport path, effectively blocking upward-scattered UV rays, preventing light leakage to other workstations or affecting operators, significantly improving equipment safety and avoiding light pollution problems. Overall, this solution optimizes the curing process, ensuring both the encapsulation effect and production efficiency of the LED chips.

[0181] Combination Figures 24 to 29 See, this application further proposes an LED bead detection and unloading device J, including an unloading bracket J100, an energized detection chuck J101, a transfer arm J102, and a storage rack J103. The energized detection chuck J101 faces the LED beads on the fixture 300. The transfer arm J102 reciprocates between the energized detection chuck J101 and the storage rack J103. The fixture 300 moves the packaged LED beads to the energized detection chuck J101. The energized detection chuck J101 is electrically connected to a detection circuit. The LED beads emit light through the energized detection chuck J101, and the detection circuit transmits the generated electrical signal through the LED beads. The control system of the transfer arm J102 picks up the LED beads from the power-on detection chuck J101 and moves them to the storage rack J103. The LED bead detection and discharge device J also includes a second push-clamp assembly J105 that opens the clamp 300. The second push-clamp assembly J105 moves closer to the clamp 300, causing the clamp 300 to release the pins. The power-on detection chuck J101 clamps the LED beads. The second push-clamp assembly J105 moves away from the clamp 300 and resets. After the LED beads are lit, the power-on detection chuck J101 releases the LED beads. The transfer arm clamps the LED beads and swings downward to place the LED beads flat on the storage rack J103.

[0182] The discharge bracket J100 can be designed as a flat plate, a column, or a frame structure to provide a stable mounting platform. An energized detection chuck J101 is mounted on the discharge bracket J100; it can be a two-piece clamp driven by a spring or pneumatic mechanism, and contains internal conductive contacts. A transfer arm J102 is also mounted on the discharge bracket J100; it can be a simple robotic arm driven by a stepper motor or servo motor to achieve linear or rotary motion. A storage rack J103 can be a simple tray or a box with multiple slots, placed at a specific location on the discharge bracket J100.

[0183] Specifically, the second push-clamp assembly J105 refers to a mechanism that can automatically release the clamp 300 through mechanical pushing, which can be achieved by means of cylinder drive, motor drive, or cam drive. In practical applications, the power-on detection chuck J101 can be understood as a clamping mechanism with conductive function. It can not only fix the LED beads, but also act as an electrode to provide stable power, so that the beads light up in the fixed state. The power-on detection chuck J101 is configured to face the LED beads on the clamp 300. Specifically, the positions of the clamp 300 and the power-on detection chuck J101 can be manually adjusted to ensure precise alignment during operation. For example, mechanical limit blocks or guide grooves can be set to ensure that the clamp 300 accurately delivers the LED beads to the center of the power-on detection chuck J101. The purpose of the detection circuit is to capture the conduction state of the LED beads in real time and convert it into a processable electrical signal. In addition, the transfer arm J102 is a mechanical structure for transferring materials, which can achieve precise material transfer through multi-axis linkage, flexible clamping, etc. The transfer arm J102 reciprocates between the power-on detection chuck J101 and the storage rack J103. In one embodiment, the transfer arm J102 can reciprocate along a linear track, achieving smooth movement via guide rails and sliders. In another embodiment, the transfer arm J102 can achieve a swing-like reciprocating motion via a rotary joint, thereby covering the area between the power-on detection chuck J101 and the storage rack J103.

[0184] In detail, this solution uses the second push-clamp assembly J105 to approach the fixture 300, mechanically pushing it to reliably release the pins of the fixture 300, ensuring that the LED bead is completely freed from the constraint of the fixture 300 before testing. After the power-on detection chuck J101 clamps the LED bead, its own conductivity illuminates the bead, and the detection circuit simultaneously enters a conducting state, transmitting an electrical signal to the control system, thus forming a closed-loop feedback mechanism. Subsequent actions are only triggered when the LED bead is emitting light normally. After the transfer arm picks up the bead from the power-on detection chuck J101, it swings downward to change the LED bead's posture, allowing it to smoothly contact the surface of the storage rack J103, avoiding rolling or tipping due to inertia or vibration during horizontal movement. Throughout the process, the reset action of the second push-clamp assembly J105 and the release action of the power-on detection chuck J101 form a close timing coordination, ensuring that the fixture 300 resets in time to accept the next station's task and preventing the bead from being interfered with by external forces during transfer.

[0185] Based on the above technical solutions, the design of the second push-clamp assembly J105 effectively solves the problem of the clamp 300 being unable to reliably release the pins. The combination of the power-on detection chuck J101 and the detection circuit enables real-time feedback during the detection process, significantly improving detection accuracy. The downward swing design of the transfer arm addresses the tendency of LED beads to roll, adjusting the LED beads for horizontal storage and optimizing the stability of the transfer process. These improvements work together to effectively improve production efficiency and product yield, providing reliable technical support for the automated production of LED beads.

[0186] The fixture 300 is responsible for moving the packaged LED beads to the power-on testing chuck J101. Specifically, the fixture 300 can be a simple robotic arm that uses pneumatic or electric power to grip the LED beads and move them to the testing position via a simple conveyor belt or manually. For example, the fixture 300 can be an end-of-line gripping mechanism in the upstream process of a production line, directly delivering the packaged LED beads to the testing position. After the power-on testing chuck J101 clamps the LED bead's pins, the fixture 300 releases the LED bead's pins. The power-on testing chuck J101 then actuates, precisely gripping the LED bead. The power-on testing chuck J101 typically has conductive contact surfaces, equivalent to having two pairs of grippers (positive and negative terminals), each simultaneously contacting one pin to conduct electricity, establishing a reliable electrical connection with the LED bead's pins, and providing a stable electrical path for subsequent power-on light emission testing. The gripping method can be through the closing of mechanical jaws, or it can utilize vacuum adsorption combined with electrode contact, etc.

[0187] The transfer arm J102 picks up an LED bead from the power-on detection chuck J101 and moves it to the storage rack J103. Specifically, the transfer arm can be equipped with a simple suction cup or two-finger gripper to pick up the LED bead pneumatically or electrically. After picking up the LED bead, the transfer arm moves along a preset path above the storage rack J103 and then releases the LED bead, allowing it to fall into the storage rack J103. (Reference) Figure 31 and Figure 32 The transfer arm J102 can also use vacuum adsorption to pick up LED beads. For example, the transfer arm J102 can be designed as a hollow structure, with an air intake J1021 on one side for picking up LED beads. The air intake J1021 is designed as a groove structure so that the leads of the LED beads can be attracted into it. Two air intakes J1021 correspond to two leads. If the LED beads light up normally, the transfer arm J102 places the LED beads on the collection plate. If the LED beads do not light up, it means that they are defective. After the transfer arm J102 picks up the LED beads from the fixture 300, it discards them into the recycling device for easy recycling of defective LED beads.

[0188] The LED bead detection and unloading device of this application integrates the power-on detection of LED beads with the material transfer function, realizing automated good product detection in the LED bead unloading process. This device can automatically trigger the LED beads to conduct and emit light, and intelligently control the movement of the material transfer arm J102 based on the electrical signal generated by the detection circuit, thereby effectively identifying and sorting qualified LED beads. This solves the problems of low LED bead detection efficiency, excessive manual intervention, and inability to screen good products in real time in traditional automated production, ensuring that all LED beads entering subsequent processes are qualified products, thus improving the automation level of the production line and product quality.

[0189] Once the LED bead successfully conducts and emits light under the grip of the power-on detection chuck J101, and the detection circuit completes the continuity test, the power-on detection chuck J101 releases the LED bead. The release can be achieved by opening the grippers or releasing the vacuum suction. This step prepares the transfer arm J102 to pick up the LED bead, ensuring its smooth transfer after the detection is completed.

[0190] Subsequently, the transfer arm clamps the LED and swings downward to lay it flat on the storage rack J103. After the power-on detection chuck J101 releases the LED, the transfer arm J102 precisely moves into position to grip the LED. The transfer arm J102 is typically equipped with a precision gripping mechanism that can stably hold the LED. Then, the transfer arm J102 performs a downward swing motion, smoothly and accurately placing the LED into the designated position on the storage rack J103. This "downward swing" and "flat placement" motion design helps protect the LED from impact and ensures its neat arrangement in the storage rack J103 for easy subsequent processing.

[0191] Through the above technical solution, this application effectively solves the problem of insufficient automation in the existing clamp 300 opening mechanism. The introduction of the second push-clamp component J105 realizes the automatic release of the clamp 300, avoiding manual intervention and significantly improving the continuity and efficiency of operation. The movement of the second push-clamp component J105 closes to the clamp 300, causing the clamp 300 to release its pins, creating conditions for the power-on detection chuck J101 to clamp the LED bead, ensuring that the LED bead can be stably tested for power-on. After the test is completed, the second push-clamp component J105 moves away from the clamp 300 and resets, avoiding interference with subsequent operations. After the power-on detection chuck J101 releases the LED bead, the transfer arm clamps the LED bead and swings it downward to place it flat on the storage rack J103. This series of coordinated actions ensures a fully automated and seamless process of LED bead release from the clamp 300, detection, and final storage. Overall, this application, through the coordinated operation of the second push clamp assembly J105 with the power-on detection chuck J101 and the transfer arm J102, greatly improves the automation level and work efficiency of LED lamp bead detection and discharge, reduces labor costs and potential operational errors, and ensures the smoothness of the detection process and the integrity of the LED lamp beads.

[0192] The second push-clamp slider J151 is the actuator in the second push-clamp assembly J105 that directly interacts with the clamp 300. Its main function is to convert the power provided by the second push-clamp driver into linear reciprocating motion, thereby realizing the push-opening or reset operation of the clamp 300. The second push-clamp slider J151 can be designed as a sliding block, a push rod, or a connecting rod. For example, it can be a slider mounted on a linear guide rail to ensure the smoothness and accuracy of its movement; it can also be a push rod directly pushed by the driver piston rod, with a relatively simple structure.

[0193] The second pusher slider J151 is connected to the second pusher driver via a transmission mechanism, meaning that the power generated by the second pusher driver is transmitted to the second pusher slider J151 through a mechanical connection to drive its movement. This transmission connection method ensures the effectiveness and reliability of power transmission. For example, the piston rod of the second pusher driver (such as a cylinder or hydraulic cylinder) can be directly connected to the second pusher slider J151 to form a direct drive; or, if the second pusher driver is a rotary motor, the rotary motion can be converted into the linear reciprocating motion of the second pusher slider J151 through a screw and nut mechanism, a gear and rack mechanism, or a cam mechanism. All these transmission methods ensure the accuracy and synchronization of the motion.

[0194] Through the above technical solution, the structure of the second push-clamp assembly J105 has been clarified and optimized. The second push-clamp driver, as a power source, provides a stable and reliable driving force, while the second push-clamp slider J151, as an actuator, effectively converts the driving force into linear reciprocating motion. The transmission connection between the second push-clamp slider J151 and the second push-clamp driver ensures the efficiency and accuracy of power transmission, avoiding instability or disengagement during movement. Therefore, under the precise drive of the second push-clamp driver, the second push-clamp slider J151 can stably approach or move away from the clamp 300, achieving precise opening and resetting of the clamp 300. This significantly improves the reliability, stability, and efficiency of the clamp 300 operation during LED bead detection and unloading, effectively solving the problem in the prior art where the second push-clamp assembly J105 may lack a stable and reliable transmission mechanism, leading to insufficient motion accuracy or low efficiency.

[0195] In some of the solutions described above in this application, a second push-clamp slider J151 is proposed to reciprocate under the drive of a second push-clamp driver to operate the clamp 300. However, in its implementation, the motion stability and operation accuracy of the second push-clamp slider J151 may be insufficient, resulting in inaccurate operation or low efficiency of the clamp 300.

[0196] In this regard, this application further proposes that the second push-clamp slider J151 is slidably connected to the discharge bracket J100, the outer end of the second push-clamp slider J151 is connected to the second push-clamp driver, and the inner end of the second push-clamp slider J151 is provided with a second push head J1511 that opens the clamp 300.

[0197] Specifically, the second push-clamp slider J151 is slidably connected to the discharge bracket J100, meaning that the second push-clamp slider J151 can move smoothly in a straight line along a preset path on the discharge bracket J100. This sliding connection can be achieved in several ways. For example, a linear guide rail can be set on the discharge bracket J100, and the second push-clamp slider J151 has a slider body that cooperates with the guide rail, achieving low-friction sliding through ball bearings or sliding bearings; alternatively, a dovetail groove can be machined on the discharge bracket J100, and the corresponding part of the second push-clamp slider J151 can be machined into a dovetail shape, with the two sliding together to provide high-precision and high-rigidity guidance; still another option is to fix one or more precision cylindrical guide rods on the discharge bracket J100, and install linear bearings on the second push-clamp slider J151, which slide on the guide rods. Through this connection method, the movement of the second push-clamp slider J151 is stably supported and precisely guided, effectively reducing swaying and deviation during movement.

[0198] Meanwhile, the outer end of the second push-clamp slider J151 is connected to the second push-clamp driver, ensuring that the power generated by the second push-clamp driver can be efficiently and reliably transmitted to the second push-clamp slider J151, driving it to perform precise reciprocating motion. This transmission connection can be achieved using a lead screw and nut drive, where the second push-clamp driver is connected to the lead screw via a coupling, and the lead screw engages with the nut on the second push-clamp slider J151. The driver's rotation drives the lead screw to rotate, thereby causing the nut and the second push-clamp slider J151 to move along the lead screw axis. Alternatively, a gear and rack drive can be used, where the second push-clamp driver drives a pinion to rotate, and the pinion meshes with a rack fixed on the second push-clamp slider J151, converting the rotational motion into linear reciprocating motion. A linkage mechanism can also be used to convert the driver's rotational motion into the linear reciprocating motion of the second push-clamp slider J151.

[0199] Furthermore, the inner end of the second push-clamp slider J151 is provided with a second push head J1511 for opening the clamp 300. This second push head J1511 is a component on the second push-clamp slider J151 that directly contacts and acts on the clamp 300. Its shape and position are carefully designed so that it can effectively push the clamp 300 from a clamped state to an open state when the second push-clamp slider J151 moves. For example, the second push head J1511 can be designed as a wedge, which, when inserted into a specific part of the clamp 300, opens the clamp 300 through a wedging action; or, the second push head J1511 can be designed as a cylinder or square prism, directly pressing against a specific part of the clamp 300 to open it outwards; or, the second push head J1511 can act on the clamp 300 through a lever principle, achieving a larger opening effect with a smaller force. The second pusher J1511 serves as the interface between the second pusher slider J151 and the clamp 300, converting the linear motion of the second pusher slider J151 into a pushing force on the clamp 300, thereby achieving the precise opening operation of the clamp 300.

[0200] Through the above technical solution, the second push-clamp slider J151 is slidably connected to the discharge bracket J100, providing stable guidance and support for its movement, significantly reducing swaying and deviation during movement, thereby ensuring the accuracy of the movement trajectory of the second push-clamp slider J151. The outer end of the second push-clamp slider J151 is connected to the second push-clamp driver, ensuring that the driver's power can be efficiently and directly transmitted to the second push-clamp slider J151, avoiding energy loss and gap accumulation during transmission, making the reciprocating motion of the second push-clamp slider J151 more reliable and responsive. The second push head J1511 provided at the inner end of the second push-clamp slider J151, as a component that directly acts on the clamp 300, is precisely designed and positioned so that the movement of the second push-clamp slider J151 can be directly and effectively converted into the opening action of the clamp 300, avoiding errors that may be caused by indirect transmission. Therefore, this solution effectively solves the problems of insufficient motion stability and operational accuracy of the second pusher slider J151, ensuring the precise opening of the clamp 300 during the LED bead detection and unloading process, thereby improving the automation level and work efficiency of the entire detection device.

[0201] In some of the solutions described above in this application, a clamp 300 is proposed for clamping the pins of LED beads. However, in its implementation, the structural design of the clamp 300 may not be stable enough or the operation may be inconvenient, resulting in loose clamping or difficulty in releasing, which affects the accuracy and automation efficiency of the detection process.

[0202] In this regard, this application further proposes that the fixture 300 includes a fixture base 301, two fixture bodies 302 and an intermediate body 304. The intermediate body 304 is located between the two fixture bodies 302. The two fixture bodies 302 are hinged to the fixture base 301. The intermediate body 304 is fixed to the fixture base 301. The two fixture bodies 302 are relatively close to the intermediate body 304 to clamp the pin or relatively far away from the intermediate body 304 to release the pin. The second pusher J1511 acts on the inner end of the fixture body 302 to make the fixture body 302 relatively far away from the intermediate body 304.

[0203] Specifically, the clamp base 301 is the supporting structure of the clamp 300, providing a stable mounting platform for other components of the clamp 300. For example, the clamp base 301 can be a sturdy metal plate or frame, fixed to the discharge bracket J100 by bolts; or, the clamp base 301 can be a fixed part integrated into the discharge bracket J100, providing support through an integrated design. The clamp body 302 is the component that directly contacts the LED bead pins and applies clamping force, while the intermediate body 304 is located between the two clamp bodies 302, serving as a reference point or support for clamping. For example, the clamp body 302 can be a rod-shaped or block-shaped structure with a certain rigidity, and its inner surface is designed with a clamping surface matching the shape of the LED bead pins; the intermediate body 304 can be a protrusion or block-shaped structure fixed to the clamp base 301. The intermediate body 304 is located between the two clamping bodies 302 to ensure the symmetry and balance of the clamping action, preventing the LED beads from tilting or experiencing uneven force during clamping. For example, the two clamping bodies 302 can be symmetrically distributed on both sides of the intermediate body 304, forming a "U"-shaped or "V"-shaped clamping space; or, the intermediate body 304 can serve as a central axis, with the two clamping bodies 302 moving around its sides. The two clamping bodies 302 are hinged to the clamping base 301, allowing the clamping bodies 302 to rotate around the hinge point, thereby achieving the clamping and releasing of the LED bead pins. For example, one end of the clamping body 302 can be connected to the clamping base 301 by a pin, forming a rotating pair; or, the clamping bodies 302 and the clamping base 301 can be connected by a flexible connector (such as an elastic sheet), achieving a hinge-like rotation within a certain range. The intermediate body 304 is fixed to the fixture base 301, providing a stable reference point and support for the movement of the fixture body 302, ensuring the accuracy and repeatability of the clamping position. For example, the intermediate body 304 can be firmly fixed to the fixture base 301 by bolts, welding, or riveting; or, the intermediate body 304 and the fixture base 301 can be integrally formed. The two fixture bodies 302 clamp the pin by being relatively close to the intermediate body 304, or release the pin by being relatively far away from the intermediate body 304. This is the core working principle of the fixture 300. For example, the fixture body 302 can be driven to move closer to or away from the intermediate body 304 by an external drive mechanism (such as a cylinder or motor); or, the fixture body 302 itself is elastic and is in a loose state when there is no external force, and is clamped closer to the intermediate body 304 by external force. The second pusher J1511 acts on the inner end of the fixture body 302 to move the fixture body 302 relatively away from the intermediate body 304, providing an active release mechanism. For example, the second pusher J1511 can be a mechanical push rod that directly presses against the inner end of the clamp body 302, causing it to rotate outward; or, the second pusher J1511 can be a pneumatically or hydraulically driven piston rod that applies a thrust to the inner end of the clamp body 302 through its telescopic movement.

[0204] Through the above technical solution, the clamp base 301 of the clamp 300 provides stable support for the entire clamping mechanism, avoiding possible shaking during clamping and releasing. Two clamp bodies 302 are hinged to the clamp base 301 and move precisely around the fixed intermediate body 304. This structural design allows the clamp 300 to reliably clamp the LED bead pins, effectively solving the problem of insecure clamping. Simultaneously, the second pusher J1511 acts on the inner end of the clamp body 302, forcing the clamp body 302 relatively away from the intermediate body 304, thereby achieving rapid and reliable release of the LED bead pins and solving the problem of difficult release. This optimized clamp 300 structure not only improves the clamping stability of the LED bead during power-on testing, ensuring the accuracy of the test results, but its active release mechanism also significantly improves the efficiency and reliability of automated operation, thus guaranteeing the overall performance of the LED bead testing and discharging device.

[0205] In some of the embodiments described above in this application, a second pusher J1511 is proposed to open the clamp 300. However, in its implementation, the second pusher J1511 directly acts on the clamp body 302, which may lead to unstable force transmission, operation jamming or increased wear of components. A more reliable structure is needed to achieve precise and efficient control of the clamp 300.

[0206] In this regard, this application further proposes that the second push head J1511 is located below the clamp body 302, and rollers 3021 are rotatably connected to the lower parts of the two clamp bodies 302 respectively. The second push head J1511 includes two pressing columns, the distance between the pressing columns is less than the sum of the radius and center distance of the two rollers 3021, and the pressing columns act on the rollers to bring the two rollers closer to each other.

[0207] Specifically, the second pusher J1511 is located below the clamp body 302, ensuring correct alignment between the second pusher J1511 and the clamp body 302 of the clamp 300, facilitating direct application of force. For example, the second pusher J1511 can be mounted on the inner end of the second pusher slider J151 via an adjustable-height bracket. This bracket ensures that the second pusher J1511 is located below the clamp body 302 of the clamp 300 and can be finely adjusted according to different heights of the clamp body 302 of the clamp 300. Alternatively, the second pusher J1511 can be directly integrated into the inner end of the second pusher slider J151. Its structural design allows the second pusher J1511 to be precisely positioned below the clamp body 302 of the clamp 300 when the second pusher slider J151 moves closer to the clamp 300, thereby achieving effective pushing.

[0208] Two rollers 3021 are rotatably connected to the lower part of each of the two clamp bodies 302. These rollers 3021 act as an intermediate medium for force transmission, reducing friction, making movement smoother, and avoiding wear caused by direct contact. For example, the rollers 3021 can be connected to the lower part of the clamp body 302 via pins or bearings, which are fixed to the clamp body 302 to ensure free rotation of the rollers 3021. The rollers 3021 can be made of high-strength, wear-resistant plastics (such as polyoxymethylene POM) or hardened metal materials to reduce friction and wear. Alternatively, the rollers 3021 can be detachable, fixed to the lower part of the clamp body 302 by screws or clips for easy maintenance and replacement. The surface of the rollers 3021 can be polished to further reduce rolling friction.

[0209] The second pusher J1511 includes two independently designed pressure posts, allowing for precise control of each roller 3021. For example, the two pressure posts are cylindrical or prismatic and are fixed to the second pusher J1511 via threaded connection or press-fit. They can be made of high-hardness alloy steel to withstand the pushing force. Alternatively, the ends of the pressure posts can be designed as curved or spherical surfaces to better contact the surface of the roller 3021, reduce stress concentration, and accommodate minor changes in the roller 3021's posture during rotation.

[0210] The spacing between the pressure posts is less than the sum of the radii and center distance of the two rollers 3021. This specific spacing ensures that the pressure posts reliably contact and push the rollers 3021, preventing slippage or failure. For example, during the design phase, precise calculations and 3D modeling determine the dimensions and relative positions of the pressure posts and rollers 3021, ensuring this spacing condition is met. Alternatively, during actual assembly, specialized measuring tools can be used to measure and adjust the spacing of the pressure posts, ensuring it is less than the sum of the radii and center distance of the rollers 3021, thereby guaranteeing that the pressure posts reliably act on the rollers 3021.

[0211] The pressure columns act on the rollers 3021, bringing the two rollers 3021 closer together. Through an indirect action mechanism, this causes the clamp body 302 to move relative to each other, thereby efficiently opening the clamp 300. For example, when the second push clamp driver drives the second push clamp slider J151 to move, the two pressure columns on the second push head J1511 move forward, simultaneously pressing and pushing the two rollers 3021. Since the rollers 3021 are rotatably connected to the clamp body 302, when the rollers 3021 are pushed closer, they will cause the clamp body 302 connected to them to move towards the intermediate body 304, thereby causing the two clamp bodies 302 to move away from the intermediate body 304, thus opening the clamp 300. Alternatively, the contact surface between the pressure columns and the rollers 3021 can be designed with a material with a certain coefficient of friction to ensure the stability of force transmission during the pushing process and avoid slippage. At the same time, the rotational characteristics of the rollers 3021 further ensure the smoothness of the movement of the clamp body 302.

[0212] Through the above technical solution, the second pusher J1511 acts on the roller 3021 through the pressure column, smoothly transmitting the thrust to the fixture body 302 of the fixture 300. This effectively avoids the problems of unstable force transmission, operational jamming, or accelerated component wear that might occur if the second pusher J1511 acts directly on the fixture body 302. The introduction of the roller 3021 significantly reduces friction, making the opening process of the fixture 300 smoother and more reliable. The precise spacing design of the pressure column ensures the effectiveness and stability of the force application, preventing slippage or failure. This indirect action mechanism not only improves the smoothness and reliability of the fixture 300 operation but also extends the service life of the components, thereby significantly improving the stability and efficiency of automated LED bead detection.

[0213] In some of the solutions mentioned above in this application, a storage rack J103 is proposed to store qualified LED beads. However, in this process, there are shortcomings in how to achieve efficient and orderly storage of LED beads and facilitate subsequent stacking. Specifically, the storage process lacks an automated movement mechanism, resulting in low efficiency in placing LED beads and difficulty in batch management.

[0214] In this regard, the present application further proposes that the storage rack J103 includes a support rail J131 and a storage plate J132 placed on the support rail J131, as well as a push plate assembly that pushes the storage plate J132 to move intermittently on the support rail J131, wherein the support rail J131 is located at the end of the movement stroke of the transfer arm.

[0215] Specifically, the storage rack J103 serves as the final storage area for LED beads after they are transferred from the testing station. Its structure is optimized for automation and batch management. The support rail J131 provides stable guidance and support for the storage plate J132, ensuring that the storage plate J132 moves smoothly and accurately along a preset path during movement, effectively preventing deviation or jamming. The support rail J131 can consist of two parallel guide rails, with the storage plate J132 sliding along its edge or bottom; alternatively, it can be designed as a rail system with rollers or ball bearings to further reduce friction during movement and improve operational smoothness.

[0216] The storage plate J132, placed on the support rail J131, is the component that directly supports the LED beads. Its function is to provide a surface for placing the LED beads and can be moved as needed to achieve batch storage and management. The storage plate J132 can be designed as a plate with a flat surface on which the LED beads are placed directly; or, to better fix the LED beads, the storage plate J132 can also be designed as a plate with pre-set grooves or holes.

[0217] To achieve automated movement of the storage plate J132, this application also includes a pusher assembly that intermittently moves the storage plate J132 along the support rail J131. This pusher assembly periodically pushes the storage plate J132 along the support rail J131, thereby achieving step-by-step translation of the storage plate J132. This allows the aforementioned transfer arm to continuously place LED beads at a fixed position without frequent adjustments to its own position, significantly improving the placement efficiency and automation level of the LED beads. The pusher assembly can be implemented in various ways; for example, it can be a pusher driven by a cylinder or electric push rod, pushing the storage plate J132 through reciprocating motion; or it can be a push rod driven by a cam mechanism, achieving intermittent pushing through rotational motion.

[0218] In addition, the support rail J131 is located at the end of the movement stroke of the aforementioned transfer arm. This arrangement ensures that the transfer arm can accurately place the qualified LED beads into the predetermined position on the storage plate J132, reducing placement errors and improving the coordination and reliability of the entire inspection and discharge device.

[0219] Through the aforementioned technical solution, the cooperation between the support rail J131 of the storage rack J103 and the storage plate J132 provides a stable platform for the LED beads to be supported and moved, ensuring that the beads do not scatter during storage. The pusher assembly enables the intermittent translation of the storage plate J132, allowing the transfer arm to continuously place LED beads in a fixed position without frequent adjustments, significantly improving the placement efficiency and automation level. When a storage plate J132 is full, the pusher assembly automatically pushes it away and introduces a new storage plate J132, achieving continuous, batch storage of LED beads, facilitating subsequent stacking and management. Overall, this solution effectively solves the problems of low LED bead storage efficiency and difficulty in batch management through an automated and orderly storage mechanism, providing neat and easily processed batches of qualified LED beads for subsequent processes.

[0220] In some embodiments of this application, the storage plate J132 is used to place LED beads. However, in its implementation, due to the lack of an effective separation mechanism, the LED beads are prone to collision or displacement during storage, thereby affecting the integrity of the beads and the efficiency of subsequent processing.

[0221] In this regard, this application further proposes that the upper surface of the storage plate J132 is provided with a plurality of partition ribs J1321, and an accommodating groove J1322 for storing LED beads is formed between two adjacent partition ribs J1321, and the length direction of the accommodating groove J1322 is perpendicular to the length direction of the storage plate J132.

[0222] Specifically, the partition rib J1321 is a raised structure on the upper surface of the storage plate J132. Its main function is to divide the surface of the storage plate J132 into multiple independent areas, thus acting as a physical barrier to effectively prevent LED beads from moving freely or contacting each other on the storage plate J132. Specifically, the partition rib J1321 can be manufactured integrally with the storage plate J132, for example, through injection molding or compression molding processes, to obtain a structurally stable and highly efficient storage plate J132. Alternatively, the partition rib J1321 can also be a separate component, installed onto the storage plate J132 after manufacturing through methods such as bonding, welding, snap-fit ​​connection, or mechanical fixation. This method facilitates adjusting the layout of the partition rib J1321 or replacing damaged partition ribs J1321 as needed.

[0223] Between two adjacent separating ribs J1321, a receiving groove J1322 is formed to accommodate LED beads. The receiving groove J1322 is a recessed area enclosed by the surfaces of the two adjacent separating ribs J1321 and the receiving plate J132. Its core function is to provide each LED bead with a dedicated space that restricts its movement, ensuring accurate and stable positioning. For example, the size and shape of the receiving groove J1322 can be precisely designed according to the specific geometric characteristics of the LED beads to be accommodated, achieving a tight fit. For square or rectangular LED beads, the receiving groove J1322 can be designed as a corresponding square or rectangular shape; for round or elliptical LED beads, the receiving groove J1322 can be designed as a U-shape or V-shape to provide good support and restraint. Furthermore, the depth of the receiving groove J1322 can be designed to be slightly greater than the height of the LED bead to ensure that the LED bead can be stably embedded within it, while effectively preventing the LED bead from jumping out of the receiving groove J1322 when the receiving plate J132 moves or is subjected to slight vibrations.

[0224] The length direction of the receiving groove J1322 is perpendicular to the length direction of the storage plate J132. The length direction of the storage plate J132 generally refers to the direction of its translational movement on the support rail J131. The length direction of the receiving groove J1322 refers to the direction in which the receiving groove J1322 extends along its longest dimension. Designing the length direction of the receiving groove J1322 to be perpendicular to the length direction of the storage plate J132 aims to ensure that when the storage plate J132 translates on the support rail J131, the LED beads can maintain their predetermined position within the receiving groove J1322 and will not roll or slide along the direction of movement of the storage plate J132. In practice, this can be achieved by orthogonally setting the arrangement direction of the partition ribs J1321 to the expected direction of movement of the storage plate J132 during the mold design stage of the storage plate J132. Alternatively, during the assembly of the storage plate J132, ensure that the prefabricated partition ribs J1321 or receiving grooves J1322 array are installed and fixed in a manner perpendicular to the moving direction of the storage plate J132.

[0225] By setting multiple dividing ribs J1321 on the upper surface of the storage plate J132, and forming receiving grooves J1322 between adjacent dividing ribs J1321 for storing LED beads, each LED bead is independently placed in its respective receiving groove J1322, effectively preventing the LED beads from colliding and shifting during storage. Furthermore, the length direction of the receiving grooves J1322 is designed to be perpendicular to the length direction of the storage plate J132. When the pusher assembly pushes the storage plate J132 to intermittently translate on the support rail J131, the LED beads can maintain their original position within the receiving grooves J1322 and will not roll or slide along the moving direction of the storage plate J132. This design significantly enhances the stability and reliability of the LED beads during storage, ensures the integrity of the LED beads, and improves the efficiency of subsequent processing, thus solving the problem of LED beads easily becoming disordered during storage and achieving orderly and stable placement of the LED beads.

[0226] In some of the embodiments described above in this application, a pusher assembly is proposed to push the storage plate J132 to move intermittently. However, in its implementation, the structure of the pusher assembly may not be compact enough or the operation may not be precise enough, resulting in low pushing efficiency or insufficient reliability, which affects the overall smoothness of automated material detection and discharge.

[0227] In this regard, this application further proposes that the push plate assembly includes a push plate head J133, a push plate arm J134, and a push plate driver. The push plate head J133 is located at the top of the push plate arm J134. The push plate arm J134 is hinged to one side of the support rail J131. The bottom of the push plate arm J134 is connected to the push plate driver. The push plate driver drives the push plate arm J134 to swing, so that the push plate head J133 intermittently acts on the storage plate J132, thereby pushing the storage plate J132 to move intermittently.

[0228] The pusher assembly is the core mechanism for intermittently translating the storage plate J132. Its overall design aims to provide stable and precise pushing force to ensure the orderly storage of LED beads after detection. The pusher head J133 is the component in the pusher assembly that directly contacts the storage plate J132 and applies pushing force. Specifically, the pusher head J133 can be designed as a block structure with a flat contact surface to ensure stable contact with the storage plate J132 and prevent slippage; alternatively, the pusher head J133 can be designed with a roller structure to reduce friction through rolling contact, making the pushing process smoother and reducing wear on the storage plate J132. The pusher arm J134 is a rod-shaped or plate-shaped component connecting the pusher head J133 and the pusher driver, responsible for transmitting driving force and realizing the swinging motion. Specifically, the pusher arm J134 can adopt a rigid linkage structure, such as a solid rod made of metal, to ensure the accuracy of force transmission and the stability of the motion trajectory; or, the pusher arm J134 can adopt a lightweight structure made of composite materials, reducing its weight while ensuring strength and improving response speed. The pusher driver is the device that provides the power source for the pusher arm J134, enabling it to swing. Specifically, the pusher driver can be a stepper motor or a servo motor, which drives the pusher arm J134 to swing by precisely controlling its rotation angle, thereby achieving precise intermittent pushing of the storage plate J132; or, the pusher driver can be a cylinder or an electromagnet, which drives the pusher arm J134 to swing through its extension or retraction action, achieving simple and reliable intermittent pushing.

[0229] The pusher head J133 is connected to the top of the pusher arm J134. This arrangement ensures that the pusher head J133 acts on the storage plate J132 at the appropriate angle and position when the pusher arm J134 swings, thereby achieving effective pushing. This layout allows the swing of the pusher arm J134 to be efficiently converted into a horizontal pushing force on the storage plate J132. The pusher arm J134 is hinged to one side of the support rail J131. The hinged connection allows the pusher arm J134 to swing around a fixed axis. This structure is compact and has a clear motion trajectory, facilitating precise control. Specifically, the hinge point can be a pin connection, fixing the pusher arm J134 to the bracket on the side of the support rail J131; or it can be a pivot connection with a bearing to ensure the smoothness and durability of the swing process and reduce frictional resistance. The bottom of the pusher arm J134 is drivenly connected to the pusher driver. This drive connection effectively transmits the power of the pusher driver to the pusher arm J134, causing it to produce the expected swing. Specifically, the transmission connection can be achieved through a linkage mechanism, for example, converting the linear motion of the pusher driver into the swinging motion of the pusher arm J134 via a linkage; or, it can be achieved through a cam mechanism, using the rotational motion of the cam to precisely control the swing angle and timing of the pusher arm J134. The pusher driver drives the pusher arm J134 to swing, and this driving method allows the pusher arm J134 to swing periodically, providing intermittent power to the pusher head J133 on the storage plate J132. The period and amplitude of the swinging motion can be precisely adjusted according to the movement requirements of the storage plate J132. The pusher head J133 intermittently acts on the storage plate J132, meaning that after each push, the pusher head J133 briefly disengages from the storage plate J132 or stops applying force, waiting for the next push cycle. This intermittent pushing ensures that the storage plate J132 moves a preset distance each time, avoiding slippage or positional deviation that may be caused by continuous pushing, thereby improving the accuracy of storage. This causes the storage plate J132 to move intermittently. This is the final result of the synergistic effect of all the above features, ensuring that the storage plate J132 can move in a controlled manner, one fixed step at a time, providing a stable platform for the subsequent LED bead storage and highly compatible with the automated process of the LED bead detection and unloading device.

[0230] Through the above technical solution, the structure of the pusher assembly is optimized. It includes a pusher head J133, a pusher arm J134, and a pusher driver, which work together to form a compact and efficient pushing mechanism. The pusher head J133 is located at the top of the pusher arm J134, ensuring direct application and precise positioning of the pushing force. The pusher arm J134 is hinged to one side of the support rail J131. This hinged design allows the pusher arm J134 to move in a swinging manner, resulting in a compact structure and controllable movement trajectory, effectively avoiding the jamming or inaccuracy problems that may exist in traditional linear push mechanisms. The bottom of the pusher arm J134 is connected to the pusher driver for transmission, ensuring the reliability and efficiency of power transmission. The pusher driver drives the pusher arm J134 to swing, allowing the pusher head J133 to intermittently act on the storage plate J132, thereby realizing the intermittent translation of the storage plate J132. This intermittent pushing method precisely controls the movement distance of the receiving plate J132 each time, avoiding displacement errors and impacts that may occur with continuous pushing, and significantly improving the accuracy and stability of the receiving plate J132's positioning. Therefore, this solution effectively solves the problems of insufficiently compact structure, imprecise operation, low pushing efficiency, and insufficient reliability of the pusher assembly, ensuring the smoothness and automation level of the receiving stage during LED bead detection and unloading, thereby improving the overall operating efficiency and yield of the detection device.

[0231] In some of the solutions mentioned above in this application, a storage rack J103 is proposed for storing LED beads. However, in this process, there are shortcomings in how to efficiently stack empty storage plates J132 and storage plates J132 filled with LED beads to achieve continuous automated production.

[0232] In response, this application further proposes an improved solution for the storage rack J103, wherein the storage rack J103 includes a first stacking groove J135 located at the first end of the support rail J131 and a second stacking groove J136 located at the end of the support rail J131. The first stacking groove J135 is used to stack empty storage boards J132. Empty storage boards J132 can be inserted from the top of the first stacking groove J135. The bottom of the first stacking groove J135 is open on one side facing the support rail J131 to allow the storage boards J132 to move onto the support rail J131. The bottom of the second stacking groove J136 is open on one side facing the support rail J131 to allow the storage boards J132 to be inserted into the stacking groove. Storage boards J132 containing LED beads are stacked in the second stacking groove. Storage boards J132 containing LED beads can be removed from the top of the second stacking groove J136.

[0233] Specifically, the storage rack J103 is a structure used to support, organize, and manage the storage board J132. It can take various forms; for example, it can be a frame structure made of metal profiles or plastic, or a functional module integrated into the main body of the device. The support rail J131 is part of the storage rack J103, and its main function is to provide a movement path and support for the storage board J132. The support rail J131 can consist of a pair of parallel guide rails, allowing the storage board J132 to slide smoothly on it; alternatively, it can use a rail design with rollers or ball bearings to reduce frictional resistance and facilitate the movement of the storage board J132.

[0234] The first stacking trough J135 is located at the first end of the support rail J131, and its main function is to centrally store empty storage boards J132 to be used. This trough can be designed as a vertically stacked magazine-like structure, automatically conveying the storage boards J132 downwards by gravity or a spring mechanism; alternatively, it can be a stacking device with a lifting mechanism to facilitate the replenishment and removal of empty storage boards J132. The second stacking trough J136 is located at the end of the support rail J131, and its main function is to collect storage boards J132 loaded with LED beads. This trough can be designed as a receiving stacking structure, allowing the storage boards J132 to be stacked layer by layer; alternatively, it can be a collection box with a buffer or positioning mechanism to ensure the stability and order of the storage boards J132 during the stacking process.

[0235] To facilitate the smooth transfer of storage plates J132, the bottom of the first stacking trough J135 has an opening facing the support rail J131. This opening serves as a connection channel between the first stacking trough J135 and the support rail J131, allowing the stacked empty storage plates J132 to be smoothly transported onto the support rail J131. This opening can be a simple opening allowing the storage plates J132 to move horizontally onto the rail under gravity or through a pusher mechanism; alternatively, it can be equipped with a controllable baffle or gate that opens when needed to release the storage plates J132. Similarly, the bottom of the second stacking trough J136 also has an opening facing the support rail J131. This opening serves as a connection channel between the support rail J131 and the second stacking trough J136, allowing storage plates J132 loaded with LED beads to be imported from the support rail J131 into the second stacking trough J136 for stacking. The opening can be designed with a guide ramp or guide groove to guide the storage plate J132 smoothly into the stacking slot; alternatively, it can be an entrance flush with the support rail J131, where the storage plate J132 is pushed in by external force. The storage plate J132 is a carrier for holding and sorting LED beads. The storage plate J132 can be made of plastic, metal, or composite materials, and its surface can have grooves or partitions for separating and fixing the LED beads to prevent collisions or confusion during movement.

[0236] Through the above technical solution, this application effectively solves the problem of continuous and efficient management of empty storage boards J132 and LED-loaded storage boards J132 in automated production. Specifically, the first stacking slot J135 centrally stores empty storage boards J132, and its open bottom design allows the empty storage boards J132 to smoothly move from the stacked state to the support rail J131, providing a continuous supply of empty boards for subsequent LED loading and avoiding manual intervention and interruptions. Simultaneously, the second stacking slot J136 is located at the end of the support rail J131, and its open bottom allows the LED-loaded storage boards J132 to be automatically and orderly inserted into and stacked from the support rail J131, realizing the batch collection and storage of good LEDs and greatly improving the automation level and production efficiency of the inspection and unloading process. This design enables a seamless connection between the entire LED inspection and unloading process, from empty board supply to finished product collection, ensuring continuous operation and high-efficiency output of the production line.

[0237] To ensure smooth stacking of the LED-loaded storage plate J132 within the second stacking slot J136, a lifting assembly J137 is provided on one side of the support rail J131. The lifting assembly J137 includes a lifting support J1371 and a lifting actuator. A clearance hole is provided below the second stacking slot J136 on the support rail J131. The lifting support J1371 passes through the clearance hole and rests against the already stacked storage plate J132 within the second stacking slot J136. The lifting actuator pushes the lifting support... J1371 pushes upward, widening the gap between the lowest-positioned storage plate J132 and the support rail J131. This allows the storage plate J132 outside the second stacking slot J136 to be pushed in unimpeded. After the lifting support J1371 descends, even if the upper storage plate J132 falls onto the pushed-in storage plate J132, it will not affect the subsequent pushing of the storage plate J132, thus enabling the storage plates J132 loaded with LED beads to be smoothly stacked in the second stacking slot J136. The lifting support J1371 can adopt a slider structure with a large end face at the top, resulting in more stable contact with the storage plate J132. To minimize obstruction when the storage plate J132 outside the second stacking slot J136 is pushed in, at least two pairs of elastic supports J138 can be installed at the bottom of the second stacking slot J136. The bottom of the elastic supports J138 is fixed below the support rail J131, and the tops of the pairs of elastic supports J138 extend into the second stacking slot J136, with the distance between them slightly less than the width of the storage plate J132. When the lifting support J1371 pushes the stacked storage plate J132, the pairs of elastic supports J138 will be stretched open by the storage plate J132, that is, the elastic supports J138 will expand and deform. The gap at the top of the elastic supports J138 increases to allow the storage plate J132 to pass upwards. Once the stacked storage plate J132 has passed the elastic supports J138, the paired elastic supports J138 return to their original position, and the gap between them returns to a state smaller than the width of the storage plate J132. At this time, after the lifting support J1371 descends, the stacked storage plate J132 will also be supported by the elastic supports J138 and will not fall onto the support rail J131. The top of the elastic support J138 and the support rail J131 form a space large enough to accommodate the storage plate J132, thereby reducing the resistance when the storage plate J132 is pushed in. The elastic supports J138 can utilize their own elasticity or be hinged to the bottom of the support rail J131 and obtain elasticity through a torsion spring.

[0238] To improve the stacking stability of storage boards J132, the structure of storage boards J132 can be designed, specifically as follows: Figure 30As shown, the lower edge of the storage plate J132 has support ribs J1323 extending along the length direction on both sides. The distance between the two support ribs J1323 is slightly greater than the length of the partition rib J1321. When stacked, the partition rib J1321 can extend between the two support ribs J1323, and the bottom surface of the two support ribs J1323 can rest on the storage plate J132 below. When the storage plates J132 are stacked, they are supported by the support ribs J1323 to prevent the partition rib J1321 from bearing the weight and causing the stored LED beads to be crushed.

[0239] Considering that the pusher arm J134 cannot extend into the first stacking slot J135 to pull out the storage plate J132, in order to remove the storage plate J132 stacked in the first stacking slot J135, an intermittent plate moving assembly J139 can be set at the bottom of the first stacking slot J135, combined with... Figure 29 See, the intermittent plate shifting assembly J139 includes a support sliding block J1390 for supporting the storage plate J132, and a transmission assembly that drives the support sliding block J1390 to intermittently translate in the direction of the pusher head J133. The transmission assembly can use common actuators, or it can use the power source of the pusher arm J134, matching the movement of the pusher arm J134, and driving the support sliding block J1390 to move through the crank J1391. A through groove is provided below the first stacking slot J135 on the support rail. The support sliding block J1390 passes through the through groove and abuts against the storage plate J132, using the friction between the two to drive the storage plate J132 to intermittently translate. To achieve intermittent translational motion, a pawl J1392 can be installed at the bottom of the pusher arm J134, and a ratchet J1393 can be installed on the side corresponding to the support rail. The pawl J1392 acts on the ratchet J1393. Each time the pusher arm J134 moves, the pawl J1392 will push the ratchet J1393 to rotate a certain angle. Correspondingly, the crank J1391 will drive the support sliding block J1390 to translate a certain distance, thereby gradually moving the bottommost storage plate J132 of the storage plates J132 stacked in the first stacking slot J135 out of the first stacking slot J135. The ratchet J1393 and pawl J1392 cooperation structure can effectively prevent the storage plate J132 from moving in the opposite direction due to the gravity of the storage plate J132 above when it is moved out of the first stacking slot J135, ensuring that the storage plate J132 moves out of the first stacking slot J135 continuously and without interruption.

[0240] This application further proposes that in the above-mentioned chip mounter for producing LED beads, a second set of clamping and flipping device K is provided between the LED bead detection and feeding device J and the lead feeding device A. The clamping and flipping device K drives the clamp 300 to rotate 180 degrees and reset.

[0241] Specifically, the second set of fixture flipping device K refers to an additional mechanism in the pick-and-place machine that enables the orientation adjustment of fixture 300. It can be implemented with a structure similar to the first set of fixture flipping device K, for example, including a combination of a rotating clamp K100 and a flipping drive assembly K200. However, its specific implementation can be adjusted according to actual needs. Its purpose is to ensure that fixture 300 can return to its initial state after completing the inspection and unloading process, thereby providing correct posture support for subsequent pin unloading operations.

[0242] In detail, this technical solution effectively solves the problem of misalignment of the fixture 300 by adding a second set of fixture flipping devices K between the LED bead detection and unloading device J and the lead unloading device A. During the packaging and detection process, the fixture 300 has already been flipped 180 degrees by the first set of flipping devices, with the surface-mount LED facing down and the leads facing up. When the fixture 300 moves to the station of the second set of fixture flipping devices K, the fixture flipping devices K precisely drive the fixture 300 to rotate another 180 degrees, restoring it to its initial position with the leads facing up. This process ensures that the fixture 300 can accurately cooperate with the first push-clamp assembly A16 and the cutting assembly A105 when entering the lead unloading device A, thereby achieving reliable insertion, clamping, and cutting of new lead wires. Furthermore, this setup fully utilizes the station gap between detection and unloading and before lead unloading, avoiding production interruptions caused by fixture 300 orientation conflicts and maintaining the automated production rhythm of the material turntable 200's continuous operation. The above technical solution not only enables the cyclical use of fixture 300, but also significantly improves the overall production efficiency and stability of the pick-and-place machine.

[0243] To ensure that the second set of fixture flipping devices K completes the flipping of fixture 300, a second detector L, such as a microswitch, can be installed downstream of the second set of fixture flipping devices K. If fixture 300 has completed the flipping, it can move normally with the material turntable without triggering the microswitch. If fixture 300 has not completed the flipping, it will interfere with the microswitch while moving with the material turntable, causing the microswitch to be triggered, thus triggering a stop alarm. Understandably, in addition to microswitches, common methods such as photoelectric sensors or camera image comparison can also be used to determine whether fixture 300 has completed the flipping and reset. The second detector L can be installed on the support frame A100.

[0244] In this invention, the reciprocating motion components in each device can all be achieved using a cam transmission mechanism. Therefore, to ensure reliable reciprocating motion of the components in each device, a few motors can be used to drive the camshafts uniformly. For example... Figure 33 and Figure 34As shown, in one embodiment, a drive motor 11 is used to drive two camshafts 13 simultaneously through a reducer 12. Each of the two camshafts 13 is provided with a number of cams 14. Each cam 14 is designed according to the reciprocating motion time and stroke of the component it is to drive. The cams 14 act on the reciprocating rocker arm 15 to drive the lifting linkage to achieve power output, thereby reducing the number of motors, reducing the cost and energy consumption of the chip mounter, reducing noise during operation, and optimizing the working environment.

[0245] Understandably, in addition to using an electric motor to drive the reciprocating motion of the components, common actuators such as cylinders can also be used as the power source.

[0246] In addition to the preferred embodiments described above, there are other embodiments of the present invention. Based on the embodiments of the present invention, all other technical solutions obtained by those skilled in the art without creative effort are within the scope of protection claimed by the present invention.

Claims

1. A chip mounter for producing LED chips, comprising a frame and a material turntable, a lead feeding device, a lead flattening device, a lead forming device, a lead soldering device, a chip LED feeding device, a chip LED soldering device, a chip LED encapsulation device, an encapsulation adhesive curing device, and an LED chip inspection and discharge device disposed on the frame. The lead feeding device, lead flattening device, lead forming device, lead soldering device, chip LED feeding device, chip LED soldering device, chip LED encapsulation device, encapsulation adhesive curing device, and LED chip inspection and discharge device are arranged sequentially around the material turntable. The material turntable is equipped with multiple clamps for clamping the leads. The material turntable drives the clamps to sequentially stop at the stations of the lead feeding device, lead flattening device, lead forming device, lead soldering device, chip LED feeding device, chip LED soldering device, chip LED encapsulation device, and LED chip inspection and discharge device. The characteristic feature is that... A fixture flipping device is provided between the surface mount LED welding device and the surface mount LED packaging device. The fixture flipping device drives the fixture to flip up and down 180 degrees, so that the surface mount LED on the fixture faces down and the pins face up. The surface mount LED packaging device includes a packaging adhesive receiving cavity and a packaging adhesive lifting mechanism that drives the packaging adhesive receiving cavity to rise and fall. After the fixture is flipped, it moves to the work position of the surface mount LED packaging device, and the packaging adhesive receiving cavity rises, so that the packaging adhesive wraps the surface mount LED and the welding part with the pins.

2. The chip mounter for producing LED beads according to claim 1, characterized in that, The clamp flipping device includes a rotating clamp and a drive assembly that drives the rotating clamp to flip 180 degrees. The rotating clamp cooperates with the clamp to drive the clamp to flip.

3. The chip mounter for producing LED beads according to claim 2, characterized in that, The drive assembly includes a clamp flipping driver, a drive gear, and a driven gear. The drive gear is driven to rotate by the clamp flipping driver. The driven gear meshes with the drive gear and is coaxially fixed with the rotating clamp. The clamp includes a clamp body and a clamp support. The clamp body is rotatably connected to the clamp shaft, and the clamp shaft is connected to the clamp support. The clamp support is mounted on the material turntable. There are two clamp bodies with an intermediate body between them. The two clamp bodies can move closer to each other to clamp the pins or move away from each other to release the pins. The rotating clamp has a slot that mates with the clamp. The clamp shaft has a block that mates with the slot. The block mates with the slot so that the rotation axis of the rotating clamp coincides with the axis of the clamp shaft.

4. The chip mounter for producing LED beads according to claim 1, characterized in that, The lead unloading device includes a lead wire unwinding spool, a lead wire ring, a heater, a traction device, and a cutting assembly arranged sequentially from high to low. The unwinding spool is used to mount the wound lead wires. The lead wire ring is arranged laterally in the axial direction and has an annular groove in the circumference to control the spacing between two lead wires. The heater includes a heating cylinder with an inner hole extending vertically through it. The lead wire passes through the inner hole of the heating cylinder. The traction device includes a clamping assembly for clamping the lead wires and a wire-clamping lifting assembly that moves the clamping assembly up and down. The lead unloading device also includes a first push-clamp assembly that opens the clamp. The first push-clamp assembly moves closer to or away from the clamp. The traction device pulls the lead wires down to the clamp. The first push-clamp assembly pushes open the clamp to allow the lead wires to be inserted into the clamp and move away from the clamp so that the clamp resets and clamps the lead wires. The cutting assembly cuts the lead wires.

5. The chip mounter for producing LED beads according to claim 1, characterized in that, The pin forming device includes a first pin bending forming component and a second pin bending forming component. Both the first and second pin bending forming components include two molding parts that clamp the pin to form an inclined bending section. The first pin bending forming component also includes a first stamping part that moves from the inside to the outside. After the molding part of the first pin bending forming component clamps the first pin, the first stamping part moves from the inside to the outside relative to the material turntable to bend the top of the first pin outward to form a horizontal bending section. The second pin bending forming component also includes a second stamping part that moves from the outside to the inside. After the molding part of the second pin bending forming component clamps the second pin, the second stamping part moves from the outside to the inside relative to the material turntable to bend the top of the second pin inward to form a horizontal bending section.

6. The chip mounter for producing LED beads according to claim 1, characterized in that, The pin soldering device includes a first solder container, a second solder container, and a solder lifting assembly that drives both containers to move up and down. The first solder container and the second solder container are respectively provided with outlets at their bottom ends. The solder lifting assembly drives the first solder container and the second solder container to descend, so that the outlet of the first solder container is close to the horizontal bend of the first pin to add solder, and the outlet of the second solder container is close to the horizontal bend of the second pin to add solder.

7. The chip mounter for producing LED beads according to claim 1, characterized in that, The chip LED feeding device includes a chip LED tape unwinding rack, a chip LED tape conveying track, and a chip LED pick-up assembly. The chip LED tape unwinding rack is used to place the rolled chip LED tape. The chip LED tape conveying track is used to guide the chip LED tape from the chip LED tape unwinding rack to the chip LED pick-up assembly. The chip LED pick-up assembly is used to pick up the chip LED from the chip LED tape and move it to the mounting platform formed by the pins.

8. The chip mounter for producing LED beads according to claim 1, characterized in that, The surface mount LED welding device includes a hot air pipe, a cooling pipe, and a holding component. The hot air pipe is mounted on a translation assembly, and the outlet of the hot air pipe is lower than the mounting platform formed by the pins. The translation assembly drives the hot air pipe to move inward so that the outlet of the hot air pipe is located below the surface mount LED. The hot air blown out of the outlet of the hot air pipe causes the solder to weld and fix the surface mount LED to the pins. The hot air pipe welds and fixes the surface mount LED on the fixture to the pins. The cooling pipe is used to blow cold air to the surface mount LED to cool the solder quickly. There is at least one cooling pipe and it is located downstream of the hot air pipe. The holding component is used to press the surface mount LED onto the mounting platform to keep it stable during the soldering process. The holding component is connected to the welding lifting assembly and has two holding ends that press against the surface mount LED.

9. The chip mounter for producing LED beads according to claim 1, characterized in that, The LED bead detection and dispensing device includes a power-on detection chuck, a transfer arm, and a storage rack. The power-on detection chuck faces the LED beads on the fixture. The transfer arm reciprocates between the power-on detection chuck and the storage rack. The fixture moves the packaged LED beads to the power-on detection chuck. The power-on detection chuck is electrically connected to a detection circuit. The LED beads emit light through the power-on detection chuck. The detection circuit transmits the generated electrical signal to the control system of the transfer arm through the LED beads. The transfer arm picks up the LED beads from the power-on detection chuck and moves them to the storage rack. The LED bead detection and dispensing device also includes a second push-clamp assembly that opens the fixture. The second push-clamp assembly moves closer to the fixture, causing the fixture to release its pins. The power-on detection chuck clamps the LED beads. The second push-clamp assembly moves away from the fixture and resets. After the LED beads light up, the power-on detection chuck releases the LED beads. The transfer arm clamps the LED beads and swings downward to lay them flat on the storage rack.

10. The chip mounter for producing LED beads according to claim 1, characterized in that, A second set of clamp flipping device is provided between the LED lamp bead detection and feeding device and the lead feeding device. The clamp flipping device drives the clamp to rotate 180 degrees to reset.

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