A LED lamp bead internal edge light absorption type source light control high light efficiency illumination control method
By setting a coaxial closed-loop light-absorbing unit at the light source of the LED chip, stray light is directly absorbed, solving the problem of stray light being difficult to eliminate in LED lighting, achieving high luminous efficiency and high purity lighting effects, simplifying the optical structure and reducing costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- CENTRAL CORE LIGHTING TECHNOLOGY (GUANGDONG) CO LTD
- Filing Date
- 2026-04-11
- Publication Date
- 2026-06-05
AI Technical Summary
In existing LED lighting technologies, stray light generated at the edge of the chip is difficult to eliminate effectively, leading to problems such as glare, ghosting, and blurry edges. Furthermore, traditional light control modes are complex, costly, and have low luminous efficiency, making it difficult to achieve a comprehensive improvement in both luminous efficiency and purity.
A coaxial closed-loop edge light-absorbing unit is set at the light source of the LED chip to directly absorb stray light, prevent stray light from entering the main optical path, simplify the optical structure, reduce light efficiency loss, and achieve high-precision, coaxial optical path purification.
Significantly reduces stray light interference, improves luminous efficacy by 5%–15%, increases illuminance by 10%–40%, and provides excellent light spot quality. It is suitable for various lighting scenarios, reducing costs and assembly complexity.
Smart Images
Figure CN122161242A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of LED lighting optical technology, specifically relating to a high-efficiency lighting control method for source light control by edge light absorption inside LED beads, which is particularly suitable for improving the optical light control and light spot purity of LED beads. Background Technology
[0002] As LED lighting technology has developed to this point, the industry has formed relatively fixed technical ideas and common technical biases. The common approach is to adopt a light control mode of "pollute first, then treat," which means that after the LED chip emits light, it generates a lot of stray light, which is then corrected and blocked by optical components.
[0003] Existing technologies all focus on secondary control of light after it leaves the chip: forcibly converging, amplifying, and passively correcting already dispersed and stray light through methods such as lens refraction, reflector reflection, and external light-blocking. The core idea is to manage the stray light that has already been generated, rather than preventing stray light from being generated at the source.
[0004] This model has a number of inherent flaws: Stray light is generated at the edge of the chip and cannot be eliminated at the source by external structures, which can easily lead to problems such as glare, ghosting, blurry edges, and unclean light spots. It requires complex structures such as multi-layer lenses and reflectors, resulting in high cost, complex assembly, and significant light loss. Stray light undergoes multiple reflections and refractions internally, resulting in reduced luminous efficiency, color temperature drift, and poor color rendering consistency. Traditional structures can only improve certain indicators individually, making it difficult to achieve a comprehensive improvement in high luminous efficiency, high purity, and high uniformity simultaneously. In summary, the industry has long been trapped in traditional technological approaches, generally focusing on optimizing and correcting the emitted light while neglecting the direct suppression and absorption of stray light at the chip's light source. This has resulted in LED optical systems failing to achieve breakthrough improvements in optical path purity. Summary of the Invention
[0005] Technical problems to be solved In response to the industry's widespread technological bias of "pollute first, clean up later," this invention aims to: Breaking away from the traditional post-processing approach to light control, stray light is directly absorbed at the source of LED chip light emission, achieving source-level light control. Eliminate stray light generated at the edge of the chip at its source, eliminate glare, ghosting, and blurry edges, and improve the purity of the light spot; Simplify the optical structure, reduce dependence on lenses and reflectors, reduce light loss, and improve overall light efficiency; Achieve high-precision, coaxial, and fully enclosed stray light absorption while ensuring that the central main optical path is not blocked; It improves the illuminance, light spot uniformity and optical consistency of lamps, and is suitable for various high-light quality requirements such as lamp tubes, bulbs, downlights, panel lights, linear lights, spotlights, industrial and mining lights, ceiling lights, floodlights, streetlights and other scenarios. Technical solution
[0006] A method for controlling light and providing high-efficiency illumination from an LED edge-absorbing light source, applied to LED beads, includes an LED chip, a substrate, an encapsulation layer, and a coaxial edge-absorbing unit; The edge light-absorbing unit is directly disposed in the edge area of the LED chip's light-emitting surface, absorbing only stray light generated at the chip edge without blocking the central main light path; The edge light-absorbing unit is a continuous closed ring structure with a coaxiality error of ≤0.05mm with the chip and a tight fit with the chip's light-emitting surface with a spacing of ≤0.005mm. The edge light-absorbing unit has a light-blocking rate of ≥95%, which can directly absorb stray light from the edge during the initial stage of chip light emission and prevent stray light from entering the main optical path and causing interference. After being purified at the source, the central direct light is output along an interference-free path, forming a pure, concentrated, and efficient lighting beam.
[0007] Accordingly, this invention proposes a high-efficiency, pure-light illumination method: Instead of forcibly focusing and reflecting the light after it is emitted, stray light is directly absorbed at the light source of the LED chip, purifying the light path and ensuring that the central main light is undisturbed, without stray light loss or glare diffusion, thus achieving stable lighting output with high luminous efficiency, high purity, and low glare. Beneficial effects
[0008] Abandoning traditional light control logic: Abandoning the post-treatment approach, adopting a source-based light absorption mode, overcoming long-standing technical biases in the industry, and demonstrating outstanding creativity; Extremely pure optical path: The 360° closed ring light-absorbing structure eliminates stray light from the edges at the source, significantly reducing glare, ghosting, and blurry edges; Higher and more stable luminous efficacy: Reduces stray light reflection loss and optical component loss, resulting in an overall luminous efficacy increase of 5%–15% and an illuminance increase of 10%–40%; Simple structure and low cost: Reduced complexity of external lenses and light-shielding components, simpler assembly, and higher reliability; Excellent light spot quality: unobstructed central main light, uniform light pattern, and clean edges, suitable for high-end indoor lighting, industrial lighting, commercial lighting, road lighting and other scenarios; High versatility: The structure is compatible with various LED lamp bead forms such as single-chip and multi-chip integration, and is suitable for all types of lighting fixtures. Attached Figure Description
[0009] Figure 1This is a schematic diagram of the internal cross-sectional structure of the LED lamp bead of the present invention. Figure 2 This is a top view of the chip and the coaxial closed ring light-absorbing unit of the present invention. Figure 3 This is a schematic diagram of the multi-chip integrated light source structure of the present invention. Explanation of reference numerals in the attached figures: 1—Substrate; 2—LED chip; 3—Edge light-absorbing unit; 4—Encapsulation layer Detailed Implementation
[0010] Example 1: A single-chip high-brightness LED bead features a coaxial, continuous, closed-loop edge-absorbing unit at the edge of the LED chip's emitting surface. The material used is nano-carbon black light-absorbing ink with a 96% light-blocking rate. The light-absorbing unit is 0.2mm wide and 2μm thick, with a coaxiality error ≤0.02mm and a bonding distance ≤0.003mm with the chip surface. This light-absorbing unit only absorbs stray light from the chip's edge, without obstructing the central main light path. The bead is externally encapsulated with transparent silicone to form a complete LED bead. Actual results: The light spot edge is clean and free of blurriness; glare is significantly reduced; luminous efficacy is increased by 12%; and illuminance is increased by 28%.
[0011] Example 2: A multi-chip integrated LED module substrate is equipped with an array of multiple LED chips. Each chip's emitting surface edge is equipped with an independent coaxial closed-loop light-absorbing unit. The light-absorbing unit uses a metal oxide light-absorbing material with a light-blocking rate of ≥95%, and the overall coaxial precision is uniformly controlled. The multiple chips synchronously absorb stray light from the source, resulting in uniform light output from the module, with no color difference or stray light interference. Actual test results: The multi-chip combination produces a pure light pattern, free from crosstalk stray light, and exhibits excellent luminous efficacy consistency.
[0012] Example 3: For low-power, Mini LED lamp beads, this example adopts a miniature closed-loop edge light-absorbing structure. The width of the light-absorbing unit is set to 0.1mm and the thickness to 1μm according to the size of the light-emitting surface of the micro chip. Through precision assembly, the coaxiality between the light-absorbing structure and the chip light-emitting surface is ensured to be less than 0.03mm, so that the light-absorbing structure fits seamlessly with the chip edge. The light-emitting head of the chip emits light from the edge and achieves full circumferential absorption, further suppressing side leakage light and interference stray light. The structure is compact, highly versatile, and can be adapted to various indoor and outdoor lighting fixtures.
Claims
1. A high-efficiency lighting control method for LED lamp beads with edge-absorbing light source control, applied to LED lamp beads, comprising an LED chip (2), a substrate (1), and a packaging layer (4), characterized in that: A coaxial, continuous closed edge light-absorbing unit (3) is directly set on the edge area of the light-emitting surface of the LED chip (2). The light-absorbing unit absorbs only the stray light generated at the edge of the chip and does not block the central main light path. The edge light-absorbing unit (3) is closely attached to the light-emitting surface of the chip with a spacing ≤0.005mm, a coaxiality error ≤0.05mm, and a light-blocking rate ≥95%. It is used to absorb stray light and spill light at the light source so that the direct light is pure and directionally output.
2. The structure according to claim 1, characterized in that, The edge light-absorbing unit (3) is annular, with a width of 0.1–0.3 mm and a thickness of 1–3 μm.
3. The structure according to claim 1, characterized in that, The edge light-absorbing unit (3) is made of nano carbon black light-absorbing ink or metal oxide light-absorbing material.
4. The structure according to claim 1, characterized in that, The encapsulation layer (4) and the substrate (1) adopt an irreversible sealing structure. Forcible disassembly will cause damage to the internal structure.
5. A high-efficiency, light-reducing illumination method, applied to LED chips, implemented based on the structure described in any one of claims 1–4, characterized in that: By absorbing stray light from the edge through a coaxial closed-ring light-absorbing unit at the light source of the LED chip, the light path is purified, thereby achieving an increase in illuminance of 10%–40%, an increase in luminous efficacy of 5%–15%, and improving problems such as glare, ghosting, and blurry edges of light spots.
6. The control method according to claim 1, characterized in that, The edge light-absorbing unit (3) is a multi-layer nested light-absorbing structure.
7. The control method according to claim 1, characterized in that, The edge light-absorbing unit (3) and the LED chip (2) are integrated into one structure.
8. The control method according to claim 1, characterized in that, The irreversible sealing structure is at least one of potting sealant and ultrasonic welding.
9. The control method according to claim 1, characterized in that, The height of the edge light-absorbing unit (3) does not exceed the height of the light-emitting surface of the LED chip (2).
10. The control method according to claim 1, characterized in that, The substrate (1) is any one of an aluminum substrate, a ceramic substrate, or a PCB substrate.