Display panel, preparation method thereof and display device

Abstract

The application provides a display panel, a preparation method thereof and a display device, and solves the problem of low yield of display products in the prior art. The display panel comprises a substrate, a pixel definition layer, an isolation structure, a plurality of sub-pixels and a plurality of inorganic packaging portions. The isolation structure comprises a first portion and a second portion, and the second portion encloses a plurality of sub-openings. At least part of the sub-pixel is located in a pixel opening. The inorganic packaging portion is located on a side of the sub-pixel away from the substrate and extends to a side of the isolation structure away from the substrate. The inorganic packaging portion corresponds to the sub-opening. The distance between the opening edge of the orthographic projection of adjacent sub-openings on the substrate and the outer edge of the orthographic projection of the corresponding inorganic packaging portion on the substrate is different.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display panel, its manufacturing method, and a display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) and flat panel displays based on light-emitting diodes (LEDs) are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide range of applications, becoming the mainstream of display devices.

[0003] However, the yield rate of current display products is low. Summary of the Invention

[0004] In view of this, the present application provides a display panel, a method for manufacturing the same, and a display device, which solves the problem of low yield of display products in the prior art.

[0005] The first aspect of this application provides a display panel, including a substrate, a pixel definition layer, an isolation structure, a plurality of sub-pixels, and a plurality of inorganic encapsulation portions. The pixel definition layer is located on one side of the substrate and encloses a plurality of pixel openings. The isolation structure is located on the side of the pixel definition layer away from the substrate and includes a first part and a second part. The first part is located on the side of the second part closer to the substrate, and the second part encloses a plurality of sub-openings. The plurality of sub-openings and the plurality of pixel openings are correspondingly disposed. At least a portion of the sub-pixels is located within the pixel openings. The inorganic encapsulation portions are located on the side of the sub-pixels away from the substrate and extend to the side of the isolation structure away from the substrate. The inorganic encapsulation portions correspond to the sub-openings, and the distance between the opening edge of the orthographic projection of an adjacent sub-opening on the substrate and the outer edge of the orthographic projection of the corresponding inorganic encapsulation portion on the substrate is different.

[0006] In conjunction with the first aspect, in some possible implementations, at least some of the adjacent inorganic package portions have overlapping regions in their orthographic projections on the substrate; preferably, in the overlapping regions, adjacent inorganic package portions are spaced apart in a direction perpendicular to the substrate; preferably, in the direction from the sub-opening to the adjacent sub-opening, the length of the overlapping region is greater than 0 micrometers and less than or equal to 5 micrometers; preferably, the distance between the opening edge of the orthographic projection of the sub-opening on the substrate and the outer edge of the corresponding inorganic package portion's orthographic projection on the substrate is greater than or equal to 1 micrometer and less than or equal to 8 micrometers.

[0007] In conjunction with the first aspect, in some possible implementations, in the overlapping region, the distance between the outer edge of the orthographic projection of the inorganic package portion farther from the substrate and the opening edge of the orthographic projection of the corresponding sub-opening on the substrate is greater than the distance between the outer edge of the orthographic projection of the inorganic package portion closer to the substrate and the opening edge of the orthographic projection of the corresponding sub-opening on the substrate.

[0008] In conjunction with the first aspect, in some possible implementations, the sub-opening includes a first sub-opening and a second sub-opening, wherein the orthographic projection of the inorganic package portion corresponding to the first sub-opening on the substrate and the orthographic projection of the inorganic package portion corresponding to the adjacent second sub-opening on the substrate have a first overlapping region; preferably, within the first overlapping region, the inorganic package portion corresponding to the second sub-opening is located on the side of the inorganic package portion corresponding to the first sub-opening that is away from the substrate; preferably, within the first overlapping region, the distance between the outer edge of the orthographic projection of the inorganic package portion corresponding to the second sub-opening on the substrate and the opening edge of the orthographic projection of the second sub-opening on the substrate is greater than the distance between the outer edge of the orthographic projection of the inorganic package portion corresponding to the first sub-opening on the substrate and the opening edge of the orthographic projection of the first sub-opening on the substrate; preferably, the plurality of sub-pixels includes a first sub-pixel and a second sub-pixel, wherein at least a portion of the orthographic projection of the first sub-pixel on the substrate is located within the orthographic projection of the first sub-opening on the substrate, and at least a portion of the orthographic projection of the second sub-pixel on the substrate is located within the orthographic projection of the second sub-opening on the substrate.

[0009] In conjunction with the first aspect, in some possible implementations, the sub-opening further includes a third sub-opening, wherein the orthographic projection of the inorganic package portion corresponding to the first sub-opening on the substrate and the orthographic projection of the inorganic package portion corresponding to the adjacent third sub-opening on the substrate have a second overlapping region; preferably, within the second overlapping region, the inorganic package portion corresponding to the third sub-opening is located on the side of the inorganic package portion corresponding to the first sub-opening closer to the substrate; preferably, within the second overlapping region, the distance between the outer edge of the orthographic projection of the inorganic package portion corresponding to the third sub-opening on the substrate and the opening edge of the orthographic projection of the third sub-opening on the substrate is greater than the distance between the outer edge of the orthographic projection of the inorganic package portion corresponding to the first sub-opening on the substrate and the opening edge of the orthographic projection of the first sub-opening on the substrate; preferably, the plurality of sub-pixels further includes a third sub-pixel, at least a portion of the orthographic projection of the third sub-pixel on the substrate being located within the orthographic projection of the third sub-opening on the substrate.

[0010] In conjunction with the first aspect, in some possible embodiments, the sub-opening further includes a third sub-opening, wherein the orthographic projection of the inorganic package portion corresponding to the second sub-opening on the substrate and the orthographic projection of the inorganic package portion corresponding to the adjacent third sub-opening on the substrate have a third overlapping region; preferably, within the third overlapping region, the inorganic package portion corresponding to the third sub-opening is located on the side of the inorganic package portion corresponding to the second sub-opening that is away from the substrate; preferably, within the third overlapping region, the distance between the outer edge of the orthographic projection of the inorganic package portion corresponding to the third sub-opening on the substrate and the opening edge of the orthographic projection of the third sub-opening on the substrate is greater than the distance between the outer edge of the orthographic projection of the inorganic package portion corresponding to the second sub-opening on the substrate and the opening edge of the orthographic projection of the second sub-opening on the substrate; preferably, the plurality of sub-pixels further includes a third sub-pixel, at least a portion of the orthographic projection of the third sub-pixel on the substrate being located within the orthographic projection of the third sub-opening on the substrate.

[0011] In conjunction with the first aspect, in some possible implementations, the distance between the orthographic projection of the pixel opening onto the substrate and the orthographic projection of the adjacent pixel opening onto the substrate is different on at least two different sides of the pixel opening.

[0012] In conjunction with the first aspect, in some possible implementations, pixel openings and inorganic encapsulation portions are correspondingly disposed; the pixel opening has a first side and a second side other than the first side, on the side where the first side is located, there is a first distance between the pixel opening and adjacent pixel openings, and on the side where the second side is located, there is a second distance between the pixel opening and adjacent pixel openings, the first distance being greater than the second distance; preferably, the first distance is greater than or equal to 10 micrometers and less than or equal to 25 micrometers; preferably, the second distance is greater than or equal to 8 micrometers and less than or equal to 20 micrometers.

[0013] In conjunction with the first aspect, in some possible implementations, on the side where the first side is located, the orthographic projection of the inorganic package portion corresponding to the pixel opening on the substrate and the orthographic projection of the inorganic package portion corresponding to the adjacent pixel opening on the substrate do not overlap.

[0014] In conjunction with the first aspect, in some possible implementations, on the side where the second side is located, the orthographic projection of the inorganic package portion corresponding to the pixel opening on the substrate overlaps with the orthographic projection of the inorganic package portion corresponding to the adjacent pixel opening on the substrate.

[0015] In conjunction with the first aspect, in some possible implementations, the orthographic projection of the first part on the substrate is located within the orthographic projection of the second part on the substrate; preferably, the material of the first part is aluminum, copper or silver; preferably, the material of the second part is titanium or molybdenum; preferably, the isolation structure encloses a plurality of isolation openings, and the sub-openings are located within the isolation openings.

[0016] In conjunction with the first aspect, in some possible implementations, the isolation structure further includes a third part located on the side of the first part closer to the substrate, wherein the orthographic projection of the first part on the substrate lies within the orthographic projection of the third part on the substrate; preferably, the material of the third part is molybdenum or titanium.

[0017] In conjunction with the first aspect, in some possible implementations, the sub-pixel includes a first electrode and a second electrode stacked together, the second electrode being located on the side of the first electrode facing away from the substrate; preferably, the second electrode overlaps with the first part; preferably, the second electrode overlaps with the third part.

[0018] In conjunction with the first aspect, in some possible implementations, an organic encapsulation layer is also included, located on the side of the inorganic encapsulation portion away from the substrate, wherein the orthographic projection of the organic encapsulation layer on the substrate covers the orthographic projection of the inorganic encapsulation portion on the substrate; preferably, the display panel further includes an inorganic encapsulation layer, located on the side of the organic encapsulation layer away from the substrate, wherein the orthographic projection of the inorganic encapsulation layer on the substrate covers the orthographic projection of the organic encapsulation layer on the substrate.

[0019] A second aspect of this application provides a display panel, including a substrate, a pixel definition layer, an isolation structure, a plurality of sub-pixels, and a plurality of inorganic encapsulation portions. The pixel definition layer is located on one side of the substrate and encloses a plurality of pixel openings. The isolation structure is located on the side of the pixel definition layer away from the substrate and includes a first part and a second part. The first part is located on the side of the second part closer to the substrate, and the second part encloses a plurality of sub-openings. The plurality of sub-openings and the plurality of pixel openings are correspondingly disposed. At least a portion of the sub-pixels is located within the pixel openings. The inorganic encapsulation portions are located on the side of the sub-pixels away from the substrate and extend to the side of the isolation structure away from the substrate. The inorganic encapsulation portions correspond to the sub-openings, and at least a portion of adjacent inorganic encapsulation portions have overlapping regions in their orthographic projections on the substrate. In the overlapping region, the distance between the outer edge of the orthographic projection of the inorganic encapsulation portion farther from the substrate and the opening edge of the orthographic projection of the corresponding sub-opening on the substrate is greater than the distance between the outer edge of the orthographic projection of the inorganic encapsulation portion closer to the substrate and the opening edge of the orthographic projection of the corresponding sub-opening on the substrate.

[0020] A third aspect of this application provides a method for fabricating a display panel, comprising: fabricating a plurality of first electrodes on one side of a substrate, the plurality of first electrodes being spaced apart; fabricating a pixel definition layer and an isolation structure on the side of the first electrodes facing away from the substrate, the isolation structure being located on the side of the pixel definition layer facing away from the substrate, the pixel definition layer enclosing a plurality of pixel openings, the isolation structure comprising a first part and a second part, the first part being located on the side of the second part close to the substrate, the second part enclosing a plurality of sub-openings, the plurality of sub-openings being correspondingly arranged with the plurality of pixel openings, the plurality of sub-openings including a first sub-opening and a second sub-opening; sequentially fabricating a light-emitting layer, a second electrode, and an inorganic encapsulation portion within the pixel openings; the inorganic encapsulation portion and the sub-openings being corresponding, the distance between the opening edge of the orthographic projection of the first sub-opening on the substrate and the outer edge of the orthographic projection of the corresponding inorganic encapsulation portion on the substrate being different from the distance between the opening edge of the orthographic projection of the second sub-opening on the substrate and the outer edge of the orthographic projection of the corresponding inorganic encapsulation portion on the substrate.

[0021] In conjunction with the third aspect, in some possible implementations, a pixel definition layer and an isolation structure are prepared on the side of the first electrode away from the substrate, including: a pixel definition material layer on the side of the first electrode away from the substrate; an isolation material layer is prepared on the side of the pixel definition material layer away from the substrate, and the isolation material layer is patterned to form an isolation structure; the pixel definition layer is patterned to obtain the pixel definition layer.

[0022] In conjunction with the third aspect, in some possible implementations, a light-emitting layer, a second electrode, and an inorganic encapsulation portion are sequentially fabricated within a pixel opening, including: sequentially fabricating a light-emitting material layer, a second electrode material layer, and an inorganic encapsulation material layer, and patterning the inorganic encapsulation material layer, the second electrode material layer, and the light-emitting material layer to obtain the light-emitting layer, the second electrode, and the inorganic encapsulation portion.

[0023] The fourth aspect of this application provides a display device, including the display panel described above, or the display panel obtained by the preparation method described above.

[0024] According to the display panel, its manufacturing method, and display device provided in the embodiments of this application, by setting the distance between the opening edge of the orthographic projection of adjacent sub-openings on the substrate and the outer edge of the orthographic projection of the corresponding inorganic encapsulation part on the substrate to be different, the inorganic encapsulation part can cover the isolation structure as much as possible, avoid the etching solution from invading the sub-pixel, thereby improving the dark spot situation of the display panel and increasing the yield of the display panel. Attached Figure Description

[0025] Figure 1 This is a partial top view of the display panel provided in the first embodiment of this application.

[0026] Figure 2 yes Figure 1The diagram shows a cross-sectional view of the display panel along the A-A' direction.

[0027] Figure 3 yes Figure 1 The diagram shows a cross-sectional view of the display panel along the B-B' direction.

[0028] Figure 4 yes Figure 1 The diagram shows a cross-sectional view of the display panel along the C-C' direction.

[0029] Figure 5 yes Figure 1 The image shows a partial top view of the display panel.

[0030] Figure 6 This is a cross-sectional structural diagram of the display panel provided in the second embodiment of this application.

[0031] Figure 7 This is a flowchart of the method for manufacturing a display panel provided in the first embodiment of this application.

[0032] Figures 8a-8e This is a schematic diagram of the structure of the intermediate product obtained by executing the preparation method provided in the first embodiment of this application.

[0033] Figure 9 This is a schematic diagram of the structure of a display device provided in an embodiment of this application. Detailed Implementation

[0034] In the process of developing this invention, the inventors discovered the following problems in the related technology: With the rapid development of display technology, panel size is no longer limited by fine metal masks. As one alternative technology, an isolation structure is usually set in the display panel to isolate the film layers deposited on the isolation structure, such as the organic light-emitting functional layer and cathode layer of adjacent light-emitting devices, thereby eliminating the need for a fine metal mask in the display panel manufacturing process. However, because it uses a method of first dry etching to remove the inorganic encapsulation film layer on the surface and then wet etching to remove the deposited film layer, there is always a suspended part on the surface of the inorganic encapsulation overlapping the isolation structure. Subsequent wet etching solutions can easily penetrate and cause pixel failure, affecting the yield of display products.

[0035] In view of this, the display panel, its manufacturing method, and the display device provided in the embodiments of this application, by setting different distances between the opening edges of adjacent sub-openings projected onto the substrate and the outer edges of the corresponding inorganic encapsulation portions projected onto the substrate, enable the inorganic encapsulation portions to cover the isolation structure as much as possible, avoid etching solution from invading the sub-pixels, thereby improving the dark spot situation of the display panel and increasing the yield of the display panel.

[0036] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0037] In the accompanying drawings, the dimensions of layers and regions may be exaggerated for clarity. It is understood that when a structure is referred to as being "on" or "below" another structure, the structure may be directly on or below the other structure, or there may be intermediate structures. The same reference numerals always indicate the same structure. Structures referred to herein include any of the following: membrane, element, device, component, assembly.

[0038] When a structure is referred to as being “connected” to another structure, it can be directly connected to the other structure or indirectly connected to the other structure by means of one or more intermediate structures placed between them.

[0039] Patent CN118251982A, Patent 202410864269.8, Patent PCT / CN2024 / 098407, Patent PCT / CN2024 / 102783, Patent PCT / CN2024 / 098217, Patent PCT / CN2024 / 099419, Patent PCT / CN2024 / 099072, Patent CN117979755A, Patent CN11799890 Patents CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A describe relevant technical solutions for isolation structures and encapsulation layers, the contents of which are incorporated herein by reference.

[0040] Figure 1 This is a partial top view of the display panel provided in the first embodiment of this application. Figure 2 yes Figure 1 The diagram shows a cross-sectional view of the display panel along the A-A' direction. Figure 1 and Figure 2As shown, the display panel includes a substrate 11, a pixel definition layer 12, an isolation structure 13, a plurality of sub-pixels 14, and a plurality of inorganic encapsulation portions 15. The pixel definition layer 12 is located on one side of the substrate 11 and encloses a plurality of pixel openings 121. The isolation structure is located on the side of the pixel definition layer 12 away from the substrate 11. The isolation structure 13 includes a first part 131 and a second part 132. The first part 131 is located on the side of the second part 132 close to the substrate 11 and the second part 132 encloses a plurality of sub-openings P. The plurality of sub-openings P and the pixel openings 121 are correspondingly arranged. At least a portion of the sub-pixel 14 is located within the pixel opening 121. The inorganic encapsulation portion 15 is located on the side of the sub-pixel 14 away from the substrate 11 and extends to the side of the isolation structure 13 away from the substrate 11. The inorganic encapsulation portion 15 and the sub-openings P are corresponding. The distance between the opening edge of the orthographic projection of adjacent sub-openings P on the substrate 11 and the outer edge of the orthographic projection of the corresponding inorganic encapsulation portion 15 on the substrate 11 is different.

[0041] The substrate 11 may be a substrate substrate. In some embodiments, the substrate substrate may be a glass substrate. In some embodiments, the substrate substrate may include organic resin materials such as epoxy resin, triazine, silicone resin, or polyimide. For example, the substrate substrate may be an FR4 type printed circuit board (PCB), or a flexible PCB that is easily deformable. In some embodiments, the substrate substrate may include ceramic materials such as silicon nitride, aluminum nitride, or aluminum oxide, or include metals or metal compounds. For example, the substrate substrate may be a metal core PCB (MCPCB) or a metal copper clad laminate (MCCL).

[0042] Furthermore, in one embodiment, the substrate 11 may have a driving circuit for driving multiple sub-pixels 14 to emit light of corresponding colors. For example, the substrate 11 may include a substrate layer, a barrier layer, a buffer layer, a gate insulator (GI), a capacitance insulator (CI), a gate, a source and drain, an interlayer dielectric (ILD), etc.

[0043] In one embodiment, the sub-pixel 14 includes a first electrode 141 and a second electrode 142 stacked together, and at least one light-emitting functional layer 143 located between the first electrode 141 and the second electrode 142, wherein the second electrode 142 is located on the side of the first electrode 141 facing away from the substrate 11. The first electrode 141 may be an anode, and the second electrode 142 may be a cathode. The at least one light-emitting functional layer 143 includes an emitting layer (EML), and may further include at least one of a hole injection layer (HIL), a hole transport layer (HTL), and an electron-blocking layer (EBL) located between the anode and the emitting layer (EML), and at least one of an electron injection layer (EIL), an electron transport layer (ETL), and a hole-blocking layer (HBL) located between the cathode and the emitting layer (EML).

[0044] The isolation structure 13 can isolate the light-emitting functional layer 143 and the second electrode 142 of multiple sub-pixels 14. In one embodiment, the isolation structure 13 encloses multiple isolation openings Q, and the orthographic projection of the isolation openings Q on the substrate 11 covers the orthographic projection of the pixel openings 121 on the substrate 11.

[0045] In one embodiment, the sub-opening P is located within the isolation opening Q.

[0046] In one embodiment, the orthographic projection of the second part 132 on the substrate 11 overlaps the orthographic projection of the first part 131 on the substrate 11. Exemplarily, the first part 131 can be designed as an independent film layer, meaning there is no physical interface within the first part 131, and all parts are made of the same material, such as aluminum, copper, or silver. Alternatively, the first part 131 can be designed as being composed of at least two film layers stacked together. For example, the first part 131 is formed by stacking two conductive film layers. The materials of these two conductive film layers can be molybdenum and aluminum, respectively, and the conductive film layer made of molybdenum is located between the substrate 11 and the conductive film layer made of aluminum. Exemplarily, the first part 131 includes a conductive portion, or the first part 131 itself is a conductive structure. The first part 131 overlaps with the second electrode 142 of the sub-pixel 14, so that the second electrodes 142 of adjacent sub-pixels 14 are electrically connected to each other, thereby realizing a full-surface cathode. The material of the second part 132 can be an organic material, an inorganic material, or a metallic material, such as molybdenum or titanium. If the second part 132 is made of a metallic material, the material of the second part 132 can be titanium.

[0047] In one embodiment, the distance between the opening edge of the orthographic projection of the sub-opening P on the substrate 11 and the outer edge of the orthographic projection of the corresponding inorganic encapsulation part 15 on the substrate 11 is greater than or equal to 1 micrometer and less than or equal to 8 micrometers. For example, the distance between the opening edge of the orthographic projection of the sub-opening P on the substrate 11 and the outer edge of the orthographic projection of the corresponding inorganic encapsulation part 15 on the substrate 11 can be 1 micrometer, 5 micrometers, 8 micrometers, etc.

[0048] In one embodiment, at least some of the adjacent inorganic package portions 15 have overlapping regions M in their orthogonal projections onto the substrate.

[0049] In one embodiment, in the overlapping region M, adjacent inorganic encapsulation portions 15 are spaced apart in a direction Z perpendicular to the substrate 11.

[0050] In one embodiment, in the direction from sub-opening P to adjacent sub-opening P, the length of the overlapping region M is greater than 0 micrometers and less than or equal to 5 micrometers. For example, in the direction from sub-opening P to adjacent sub-opening P, the length of the overlapping region M can be 0.1 micrometers, 2 micrometers, 5 micrometers, etc.

[0051] In one embodiment, in the overlapping region M, the distance between the outer edge of the orthographic projection of the inorganic package portion 15 farther from the substrate 11 onto the substrate 11 and the opening edge of the orthographic projection of the corresponding sub-opening P onto the substrate 11 is greater than the distance between the outer edge of the orthographic projection of the inorganic package portion 15 closer to the substrate 11 onto the substrate 11 and the opening edge of the orthographic projection of the corresponding sub-opening P onto the substrate 11.

[0052] In one specific embodiment, the sub-opening P includes a first sub-opening P1 and a second sub-opening P2. The orthographic projection of the inorganic packaging part 15 corresponding to the first sub-opening P1 onto the substrate 11 and the orthographic projection of the inorganic packaging part 15 corresponding to the second sub-opening P2 onto the substrate 11 have a first overlapping region M1.

[0053] In one further embodiment, in the first overlapping region M1, the inorganic packaging portion 15 corresponding to the second sub-opening P2 is located on the side of the inorganic packaging portion 15 corresponding to the first sub-opening P1 that is away from the substrate 11.

[0054] In one further embodiment, in the first overlapping region M1, the distance L2 between the outer edge of the orthographic projection of the inorganic encapsulation portion 15 corresponding to the second sub-opening P2 onto the substrate 11 and the opening edge of the orthographic projection of the second sub-opening P2 onto the substrate 11 is greater than the distance L1 between the outer edge of the orthographic projection of the inorganic encapsulation portion 15 corresponding to the first sub-opening P1 onto the substrate 11 and the opening edge of the orthographic projection of the first sub-opening P1 onto the substrate 11.

[0055] In one embodiment, the plurality of sub-pixels 14 include a first sub-pixel 1401 and a second sub-pixel 1402, at least a portion of the orthographic projection of the first sub-pixel 1401 onto the substrate 11 is located within the orthographic projection of the first sub-opening P1 onto the substrate 11, and at least a portion of the orthographic projection of the second sub-pixel 1402 onto the substrate 11 is located within the orthographic projection of the second sub-opening P2 onto the substrate 11.

[0056] In one embodiment, the first sub-pixel 1401 is a blue sub-pixel, and the second sub-pixel is a green sub-pixel.

[0057] Figure 3 yes Figure 1 The diagram shows a cross-sectional view of the display panel along the B-B' direction. Figure 4 yes Figure 1 The diagram shows a cross-sectional view of the display panel along the C-C' direction. In one embodiment, the plurality of sub-openings P further includes a third sub-opening P3.

[0058] like Figure 3 As shown, in one specific embodiment, the sub-opening P includes a first sub-opening P1 and a third sub-opening P3. The orthographic projection of the inorganic packaging part 15 corresponding to the first sub-opening P1 on the substrate 11 and the orthographic projection of the inorganic packaging part 15 corresponding to the third sub-opening P3 on the substrate 11 have a second overlapping region M2.

[0059] In one further embodiment, in the second overlapping region M2, the inorganic packaging portion 15 corresponding to the third sub-opening P3 is located on the side of the inorganic packaging portion 15 corresponding to the first sub-opening P1 that is away from the substrate 11.

[0060] In one further embodiment, in the second overlapping region M2, the distance L3 between the outer edge of the orthographic projection of the inorganic encapsulation portion 15 corresponding to the third sub-opening P3 on the substrate 11 and the opening edge of the orthographic projection of the third sub-opening P3 on the substrate 11 is greater than the distance L1 between the outer edge of the orthographic projection of the inorganic encapsulation portion 15 corresponding to the first sub-opening P1 on the substrate 11 and the opening edge of the orthographic projection of the first sub-opening P1 on the substrate 11.

[0061] like Figure 4 As shown, in one specific embodiment, the sub-opening P includes a second sub-opening P2 and a third sub-opening P3. The orthographic projection of the inorganic packaging part 15 corresponding to the second sub-opening P2 on the substrate 11 and the orthographic projection of the inorganic packaging part 15 corresponding to the third sub-opening P3 on the substrate 11 have a third overlapping region M3.

[0062] In one further embodiment, in the third overlapping region M3, the inorganic packaging portion 15 corresponding to the third sub-opening P3 is located on the side of the inorganic packaging portion 15 corresponding to the second sub-opening P2 that is away from the substrate 11.

[0063] In one further embodiment, in the third overlapping region M3, the distance L3 between the outer edge of the orthographic projection of the inorganic package portion 15 corresponding to the third sub-opening P3 onto the substrate 11 and the opening edge of the orthographic projection of the third sub-opening P3 onto the substrate 11 is greater than the distance L2 between the outer edge of the orthographic projection of the inorganic package portion 15 corresponding to the second sub-opening P2 onto the substrate 11 and the opening edge of the orthographic projection of the second sub-opening P2 onto the substrate 11.

[0064] In one embodiment, the plurality of sub-pixels 14 further includes a third sub-pixel 1403, at least a portion of the orthographic projection of the third sub-pixel 1403 onto the substrate 11 lies within the orthographic projection of the third sub-opening P3 onto the substrate 11.

[0065] In one embodiment, the third sub-pixel 1403 is a red sub-pixel.

[0066] In one embodiment, the isolation structure 13 further includes a third portion 133 located on the side of the first portion 131 near the substrate 11, wherein the orthographic projection of the first portion 131 onto the substrate 11 falls within the orthographic projection range of the third portion 133 onto the substrate 11. The material of the third portion 133 is molybdenum or titanium. For example, the first portion 131 is a conductive film layer made of aluminum, and the third portion 133 is a conductive film layer made of molybdenum. In this case, the cross-section of the isolation structure 13 is I-shaped. Of course, in other embodiments, the third portion 133 is a conductive film layer made of titanium.

[0067] In one embodiment, the third part 133 and the second electrode 142 of the sub-pixel 14 are connected.

[0068] In one embodiment, the pixel definition layer 12 can be a light-transmitting material to allow light from the sub-pixels 14 to pass through the pixel definition layer more effectively. Optionally, the pixel definition layer 12 can be an opaque material, which can improve the light absorption of the pixel definition layer 12, reduce the reflectivity of the display panel, further reduce optical crosstalk between adjacent sub-pixels 14, and improve the display effect of the display panel. In one embodiment, the pixel opening 121 and the inorganic encapsulation portion 15 are correspondingly provided.

[0069] Figure 5 yes Figure 1 The image shows a partial top view of the display panel. (See image.) Figure 5 As shown, in one embodiment, the distance between the orthographic projection of the pixel opening 121 on the substrate 11 and the orthographic projection of the adjacent pixel opening 121 on the substrate 11 are different on at least two different sides of the pixel opening 121.

[0070] In one embodiment, the pixel opening 121 has a first side 1211 and a second side 1212 other than the first side 1211. On the side where the first side 1211 is located, there is a first distance L4 between the pixel opening 121 and the adjacent pixel opening 121. On the side where the second side 1212 is located, there is a second distance L5 between the pixel opening 121 and the adjacent pixel opening 121. The first distance L4 is greater than the second distance L5.

[0071] In one embodiment, the first distance L4 is greater than or equal to 10 micrometers and less than or equal to 25 micrometers. For example, the first distance L4 can be 10 micrometers, 15 micrometers, 20 micrometers, 25 micrometers, etc.

[0072] In one embodiment, the second distance L5 is greater than or equal to 8 micrometers and less than or equal to 20 micrometers. For example, the second distance L5 can be 8 micrometers, 12 micrometers, 16 micrometers, 20 micrometers, etc.

[0073] In one embodiment, multiple sub-pixels 14 form multiple pixel groups 140, and the multiple pixel groups 140 are arranged in an array.

[0074] In one embodiment, the pixel group 140 includes at least one first sub-pixel 1401, at least one second sub-pixel 1402 and at least one third sub-pixel 1403, arranged in an array.

[0075] In one embodiment, along a first direction X parallel to the substrate 11, the distance between the orthographic projections of the pixel openings 121 corresponding to adjacent sub-pixels 14 onto the substrate 11 is a second distance L5.

[0076] In one embodiment, along the second direction Y parallel to the substrate 11, the distance between the orthographic projections of the pixel openings 121 corresponding to adjacent sub-pixels 14 in the same pixel group 140 onto the substrate 11 is a first distance L4, and the distance between the orthographic projections of the pixel openings 121 corresponding to adjacent sub-pixels 14 in different pixel groups 140 onto the substrate 11 is a second distance L5.

[0077] In this case, the second direction Y is perpendicular to the first direction X.

[0078] In one embodiment, the orthographic projection of the inorganic package 15 onto the substrate 11 overlaps the orthographic projection of the second electrode 142 onto the substrate 11. Exemplarily, the material of the inorganic package 15 is silicon oxide, silicon oxynitride, or silicon nitride, etc. The inorganic package 15 can be a single layer, multiple layers, composite layers, etc.

[0079] In one embodiment, a plurality of inorganic encapsulation portions 15 are spaced apart.

[0080] In one embodiment, at least some of the adjacent inorganic encapsulation portions 15 have their orthographic projections on the substrate 11 overlapping.

[0081] In one further embodiment, adjacent inorganic package portions 15 are spaced apart in the overlapping area of ​​their orthographic projections onto the substrate 11.

[0082] In one embodiment, in the overlapping region of the orthographic projections of adjacent inorganic encapsulation portions 15 onto the substrate 11, a portion of the inorganic encapsulation portion 15 corresponding to the later-prepared sub-pixel 14 is located on the side of the inorganic encapsulation portion 15 corresponding to the previously-prepared sub-pixel 14 that faces away from the substrate 11. For example, as... Figure 2 and Figure 3 As shown, the order of fabrication is first sub-pixel 1401, second sub-pixel 1402 and third sub-pixel 1403. The portion of the inorganic encapsulation part 15 corresponding to the third sub-pixel 1403 is located on the side of the inorganic encapsulation part 15 corresponding to the first sub-pixel 1401 away from the substrate 11, and the portion of the inorganic encapsulation part 15 corresponding to the second sub-pixel 1402 is located on the side of the first sub-pixel 1401 away from the substrate 11.

[0083] In one embodiment, in the direction X from pixel opening 121 to adjacent pixel opening 121, the length L6 of the overlapping region is greater than 0 micrometers and less than or equal to 5 micrometers. For example, the length L6 of the overlapping region can be 0.1 micrometers, 2 micrometers, 5 micrometers, etc.

[0084] Please refer to it again. Figure 5 In one embodiment, on the side where the first side 1211 is located, the orthographic projection of the inorganic encapsulation portion 15 corresponding to the pixel opening 121 on the substrate 11 and the orthographic projection of the inorganic encapsulation portion 15 corresponding to the adjacent pixel opening 121 on the substrate 11 do not overlap.

[0085] In one embodiment, on the side where the second side 1212 is located, the orthographic projection of the inorganic encapsulation portion 15 corresponding to the pixel opening 121 on the substrate 11 overlaps with the orthographic projection of the inorganic encapsulation portion 15 corresponding to the adjacent pixel opening 121 on the substrate 11.

[0086] That is, when the distance between pixel opening 121 and adjacent pixel opening 121 is long, the orthographic projection of the inorganic package portion 15 corresponding to pixel opening 121 on the substrate 11 and the orthographic projection of the inorganic package portion 15 corresponding to adjacent pixel opening 121 on the substrate 11 do not overlap. When the distance between pixel opening 121 and adjacent pixel opening 121 is short, the orthographic projection of the inorganic package portion 15 corresponding to pixel opening 121 on the substrate 11 and the orthographic projection of the inorganic package portion 15 corresponding to adjacent pixel opening 121 on the substrate 11 overlap.

[0087] Figure 6This is a schematic cross-sectional view of the display panel provided in the second embodiment of this application. Figure 6 As shown, in one embodiment, the display panel further includes an organic encapsulation layer 16, which is located on the side of the inorganic encapsulation portion 15 facing away from the substrate 11. The orthographic projection of the organic encapsulation layer 16 on the substrate 11 covers the orthographic projection of the inorganic encapsulation portion 15 on the substrate 11. Exemplarily, the material of the organic encapsulation layer 16 is a fiber material, a resin material, or a multilayer board material, etc. The organic encapsulation layer 16 can be a single layer, a multilayer, a composite layer, etc.

[0088] The display panel also includes an inorganic encapsulation layer 17, which is located on the side of the organic encapsulation layer 16 facing away from the substrate 11. The orthographic projection of the inorganic encapsulation layer 17 onto the substrate 11 covers the orthographic projection of the organic encapsulation layer 16 onto the substrate 11. For example, the material of the inorganic encapsulation layer 17 is silicon oxide, silicon oxynitride, or silicon nitride, etc. The inorganic encapsulation layer 17 can be a single layer, multiple layers, composite layers, etc.

[0089] The display panel provided in this application embodiment improves the dark spot situation of the display panel and increases the yield of the display panel by setting different distances between the opening edge of the orthographic projection of adjacent sub-openings on the substrate and the outer edge of the orthographic projection of the corresponding inorganic encapsulation part on the substrate. This allows the inorganic encapsulation part to cover the pixel definition layer as much as possible, avoids the etching solution from invading the sub-pixels, and improves the dark spot situation of the display panel.

[0090] Please refer to it again. Figures 2-4 This application also provides a display panel, which includes a substrate 11, a pixel definition layer 12, an isolation structure 13, a plurality of sub-pixels 14, and a plurality of inorganic encapsulation portions 15. The pixel definition layer 12 is located on one side of the substrate 11 and encloses a plurality of pixel openings 121. The isolation structure is located on the side of the pixel definition layer 12 away from the substrate 11. The isolation structure 13 includes a first part 131 and a second part 132. The first part 131 is located on the side of the second part 132 closer to the substrate 11, and the second part 132 encloses a plurality of sub-openings P. The plurality of sub-openings P are correspondingly disposed with the pixel openings 121. At least a portion of the sub-pixels 14 is located in the pixel openings 121. Within 1, the inorganic encapsulation portion 15 is located on the side of the sub-pixel 14 away from the substrate 11 and extends to the side of the isolation structure 13 away from the substrate 11. The inorganic encapsulation portion 15 corresponds to the sub-opening P. At least some of the adjacent inorganic encapsulation portions 15 have overlapping regions M on the substrate. In the overlapping region M, the distance between the outer edge of the orthogonal projection of the inorganic encapsulation portion 15 far from the substrate 11 and the opening edge of the orthogonal projection of the corresponding sub-opening P on the substrate 11 is greater than the distance between the outer edge of the orthogonal projection of the inorganic encapsulation portion 15 close to the substrate 11 and the opening edge of the orthogonal projection of the corresponding sub-opening P on the substrate 11.

[0091] The display panel provided in this application embodiment belongs to the same inventive concept as the display panel provided in the foregoing embodiments of this application, and has the corresponding film layer structure and beneficial effects. Details not described in detail in the embodiments of this display panel can be found in the embodiments section of the foregoing display panel, and will not be repeated here.

[0092] This application also provides a method for manufacturing a display panel. Figure 7 This is a flowchart illustrating a method for fabricating a display panel according to the first embodiment of this application. This fabrication method is used to fabricate the display panel provided in any of the above embodiments. Figure 7 As shown, the preparation method includes:

[0093] Step S710: A plurality of first electrodes are prepared on one side of the substrate, and the plurality of first electrodes are spaced apart.

[0094] In step S720, a pixel definition layer and an isolation structure are prepared on the side of the first electrode away from the substrate. The isolation structure is located on the side of the pixel definition layer away from the substrate. The pixel definition layer encloses multiple pixel openings. The isolation structure includes a first part and a second part. The first part is located on the side of the second part close to the substrate. The second part encloses multiple sub-openings. The multiple sub-openings and multiple pixel openings are correspondingly set.

[0095] In step S730, a light-emitting functional layer, a second electrode, and an inorganic encapsulation part are sequentially prepared on the side of the isolation structure away from the substrate. The inorganic encapsulation part corresponds to the sub-opening, and the distance between the opening edge of the orthographic projection of the adjacent sub-opening on the substrate and the outer edge of the orthographic projection of the corresponding inorganic encapsulation part on the substrate is different.

[0096] Figures 8a-8e This is a schematic diagram of the structure of the intermediate product obtained by executing the preparation method provided in the first embodiment of this application. The preparation method specifically includes:

[0097] According to step S710, refer to Figure 8a A plurality of first electrodes 141 are prepared on one side of the substrate 11, and the plurality of first electrodes 141 are arranged at intervals.

[0098] According to step S720, a pixel definition layer 12 and an isolation structure 13 are prepared on the side of the first electrode 141 away from the substrate 11. The isolation structure 13 is located on the side of the pixel definition layer 12 away from the substrate 11. The pixel definition layer 12 encloses a plurality of pixel openings 121. The isolation structure 13 includes a first part 131 and a second part 132. The first part 131 is located on the side of the second part 132 close to the substrate 11. The second part 132 encloses a plurality of sub-openings P. The plurality of sub-openings P and the pixel openings 121 are correspondingly arranged.

[0099] First, refer to Figure 8bA pixel definition material layer 120 is prepared on the side of the first electrode 141 away from the substrate 11. The pixel definition material can be an inorganic material.

[0100] Secondly, see Figure 8c An isolation material layer is prepared on the side of the pixel definition material layer 120 away from the substrate 11, and the isolation material layer is patterned to form an isolation structure 13, which encloses an isolation opening Q.

[0101] In one embodiment, an isolation material layer is prepared using a film-forming process, and then the isolation material layer is patterned to obtain the isolation structure 13. For example, a groove can first be formed on the isolation material layer using a dry etching process, and then the sidewalls of the groove can be further etched using a wet etching process to form an undercut structure.

[0102] Finally, see Figure 8d The pixel definition material layer 120 is patterned to obtain the pixel definition layer 12. The pixel definition layer 12 encloses the pixel opening 121. The orthogonal projection of the pixel opening 121 on the substrate 11 is located within the orthogonal projection of the isolation opening Q on the substrate 11.

[0103] According to step S730, refer to Figure 8e A light-emitting material layer, a second electrode material layer, and an inorganic encapsulation material layer are sequentially prepared on the side of the isolation structure 13 away from the substrate 11. The inorganic encapsulation material layer, the second electrode material layer, and the light-emitting material layer are then patterned to obtain a light-emitting functional layer 143, a second electrode 142, and an inorganic encapsulation part 15.

[0104] In this case, the inorganic encapsulation part 15 corresponds to the sub-opening P, and the distance between the opening edge of the orthographic projection of the adjacent sub-opening P on the substrate 11 and the outer edge of the orthographic projection of the corresponding inorganic encapsulation part 15 on the substrate 11 is different.

[0105] In one embodiment, at least some of the adjacent inorganic package portions 15 have overlapping regions M in their orthogonal projections onto the substrate.

[0106] In one embodiment, in the overlapping region M, the distance between the outer edge of the orthographic projection of the inorganic package portion 15 farther from the substrate 11 onto the substrate 11 and the opening edge of the orthographic projection of the corresponding sub-opening P onto the substrate 11 is greater than the distance between the outer edge of the orthographic projection of the inorganic package portion 15 closer to the substrate 11 onto the substrate 11 and the opening edge of the orthographic projection of the corresponding sub-opening P onto the substrate 11.

[0107] In one embodiment, the preparation method may further include: preparing an organic encapsulation layer and an inorganic encapsulation layer on the side of the inorganic encapsulation portion 15 away from the substrate 11.

[0108] Figure 9This is a schematic diagram of the structure of a display device provided in an embodiment of this application. Figure 9 As shown, the display device is a product with image display capabilities. For example, the display device can be used to display static images, such as pictures or photographs. The display device can also be used to display dynamic images, such as videos.

[0109] Display devices can be laptops, mobile phones, handheld or portable computers, cameras, camcorders, in-vehicle smart central control screens, calculators, smartwatches, GPS navigators, electronic photographs, electronic billboards or signs, projectors, etc.

[0110] The display device includes the display panel 100 provided in any of the above embodiments or the display panel 100 obtained by the manufacturing method provided in any of the above embodiments. The display panel 100 may be an organic light-emitting diode display substrate or a quantum dot electroluminescent display substrate.

[0111] In addition, the display device can also perform functions such as taking photos, recording videos, fingerprint recognition, and facial recognition. Accordingly, the display device also includes at least one functional module for implementing the above functions, such as an under-display camera or an under-display fingerprint recognition sensor.

[0112] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0113] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A display panel, characterized in that, include: substrate; A pixel definition layer is located on one side of the substrate, and the pixel definition layer encloses a plurality of pixel openings; An isolation structure is located on the side of the pixel definition layer opposite to the substrate; The isolation structure includes a first part and a second part. The first part is located on the side of the second part closer to the substrate. The second part encloses a plurality of sub-openings. The plurality of sub-openings and the plurality of pixel openings are correspondingly arranged. Multiple sub-pixels, at least a portion of which are located within the pixel opening; Multiple inorganic encapsulation portions are located on the side of the sub-pixel away from the substrate and extend to the side of the isolation structure away from the substrate; the inorganic encapsulation portions and the sub-openings correspond to each other, and the distance between the opening edge of the orthographic projection of the adjacent sub-openings on the substrate and the outer edge of the orthographic projection of the corresponding inorganic encapsulation portion on the substrate is different.

2. The display panel according to claim 1, characterized in that, At least some of the adjacent inorganic packaging portions have overlapping regions in their orthographic projections onto the substrate; Preferably, in the overlapping area, adjacent inorganic encapsulation portions are spaced apart in a direction perpendicular to the substrate; Preferably, in the direction from which the sub-opening points to the adjacent sub-opening, the length of the overlapping region is greater than 0 micrometers and less than or equal to 5 micrometers; preferably, the distance between the opening edge of the orthographic projection of the sub-opening on the substrate and the outer edge of the orthographic projection of the corresponding inorganic encapsulation portion on the substrate is greater than or equal to 1 micrometer and less than or equal to 8 micrometers.

3. The display panel according to claim 2, characterized in that, In the overlapping region, the distance between the outer edge of the orthographic projection of the inorganic package portion farther from the substrate and the opening edge of the orthographic projection of the corresponding sub-opening on the substrate is greater than the distance between the outer edge of the orthographic projection of the inorganic package portion closer to the substrate and the opening edge of the orthographic projection of the corresponding sub-opening on the substrate.

4. The display panel according to claim 1, characterized in that, The sub-opening includes a first sub-opening and a second sub-opening. The orthographic projection of the inorganic packaging part corresponding to the first sub-opening on the substrate and the orthographic projection of the inorganic packaging part corresponding to the adjacent second sub-opening on the substrate have a first overlapping area. Preferably, within the first overlapping area, the inorganic packaging portion corresponding to the second sub-opening is located on the side of the inorganic packaging portion corresponding to the first sub-opening that is away from the substrate; Preferably, within the first overlapping region, the distance between the outer edge of the orthographic projection of the inorganic encapsulation portion corresponding to the second sub-opening on the substrate and the opening edge of the orthographic projection of the second sub-opening on the substrate is greater than the distance between the outer edge of the orthographic projection of the inorganic encapsulation portion corresponding to the first sub-opening on the substrate and the opening edge of the orthographic projection of the first sub-opening on the substrate. Preferably, the plurality of sub-pixels includes a first sub-pixel and a second sub-pixel, wherein at least a portion of the orthographic projection of the first sub-pixel on the substrate is located within the orthographic projection of the first sub-opening on the substrate, and at least a portion of the orthographic projection of the second sub-pixel on the substrate is located within the orthographic projection of the second sub-opening on the substrate.

5. The display panel according to claim 4, characterized in that, The sub-opening further includes a third sub-opening, and the orthographic projection of the inorganic packaging part corresponding to the first sub-opening on the substrate and the orthographic projection of the inorganic packaging part corresponding to the adjacent third sub-opening on the substrate have a second overlapping area. Preferably, in the second overlapping region, the inorganic packaging portion corresponding to the third sub-opening is located on the side of the inorganic packaging portion corresponding to the first sub-opening that is away from the substrate; Preferably, in the second overlapping region, the distance between the outer edge of the orthographic projection of the inorganic encapsulation part corresponding to the third sub-opening on the substrate and the opening edge of the orthographic projection of the third sub-opening on the substrate is greater than the distance between the outer edge of the orthographic projection of the inorganic encapsulation part corresponding to the first sub-opening on the substrate and the opening edge of the orthographic projection of the first sub-opening on the substrate. Preferably, the plurality of sub-pixels further includes a third sub-pixel, at least a portion of which is located within the orthographic projection of the third sub-opening onto the substrate.

6. The display panel according to claim 4, characterized in that, The sub-opening further includes a third sub-opening, and the orthographic projection of the inorganic packaging part corresponding to the second sub-opening on the substrate and the orthographic projection of the inorganic packaging part corresponding to the adjacent third sub-opening on the substrate have a third overlapping area. Preferably, in the third overlapping region, the inorganic packaging portion corresponding to the second sub-opening is located on the side of the inorganic packaging portion corresponding to the third sub-opening that is away from the substrate; Preferably, in the third overlapping region, the distance between the outer edge of the orthographic projection of the inorganic encapsulation part corresponding to the third sub-opening on the substrate and the opening edge of the orthographic projection of the third sub-opening on the substrate is greater than the distance between the outer edge of the orthographic projection of the inorganic encapsulation part corresponding to the second sub-opening on the substrate and the opening edge of the orthographic projection of the second sub-opening on the substrate. Preferably, the plurality of sub-pixels further includes a third sub-pixel, at least a portion of which is located within the orthographic projection of the third sub-opening onto the substrate.

7. The display panel according to claim 1, characterized in that, On at least two different sides of the pixel opening, the distance between the orthographic projection of the pixel opening on the substrate and the orthographic projection of the adjacent pixel opening on the substrate are different.

8. The display panel according to claim 7, characterized in that, The pixel opening and the inorganic encapsulation part are correspondingly provided; the pixel opening has a first side and a second side other than the first side, on the side where the first side is located, the pixel opening and the adjacent pixel opening are at a first distance, on the side where the second side is located, the pixel opening and the adjacent pixel opening are at a second distance, and the first distance is greater than the second distance; Preferably, the first distance is greater than or equal to 10 micrometers and less than or equal to 25 micrometers; Preferably, the second distance is greater than or equal to 8 micrometers and less than or equal to 20 micrometers.

9. The display panel according to claim 8, characterized in that, On the first side, the orthographic projection of the inorganic encapsulation portion corresponding to the pixel opening on the substrate and the orthographic projection of the inorganic encapsulation portion corresponding to the adjacent pixel opening on the substrate do not overlap.

10. The display panel according to claim 8, characterized in that, On the second side, the orthographic projection of the inorganic encapsulation portion corresponding to the pixel opening on the substrate overlaps with the orthographic projection of the inorganic encapsulation portion corresponding to the adjacent pixel opening on the substrate.

11. The display panel according to claim 1, characterized in that, The orthographic projection of the first part on the substrate is located within the orthographic projection of the second part on the substrate; Preferably, the material of the first part is aluminum, copper or silver; Preferably, the material of the second part is titanium or molybdenum; Preferably, the isolation structure encloses multiple isolation openings, and the sub-openings are located within the isolation openings.

12. The display panel according to claim 9, characterized in that, The isolation structure further includes a third part, which is located on the side of the first part closer to the substrate, and the orthographic projection of the first part on the substrate is located within the orthographic projection of the third part on the substrate; Preferably, the material of the third part is molybdenum or titanium.

13. The display panel according to claim 12, characterized in that, The sub-pixel includes a first electrode and a second electrode stacked together, with the second electrode located on the side of the first electrode away from the substrate. Preferably, the second electrode and the first part overlap; Preferably, the second electrode and the third part overlap.

14. The display panel according to claim 1, characterized in that, It also includes an organic encapsulation layer located on the side of the inorganic encapsulation portion away from the substrate, wherein the orthogonal projection of the organic encapsulation layer on the substrate covers the orthogonal projection of the inorganic encapsulation portion on the substrate; Preferably, the display panel further includes an inorganic encapsulation layer located on the side of the organic encapsulation layer opposite to the substrate, wherein the orthographic projection of the inorganic encapsulation layer on the substrate covers the orthographic projection of the organic encapsulation layer on the substrate.

15. A display panel, characterized in that, include: substrate; A pixel definition layer is located on one side of the substrate, and the pixel definition layer encloses a plurality of pixel openings; An isolation structure is located on the side of the pixel definition layer opposite to the substrate; The isolation structure includes a first part and a second part. The first part is located on the side of the second part closer to the substrate. The second part encloses a plurality of sub-openings. The plurality of sub-openings and the plurality of pixel openings are correspondingly arranged. Multiple sub-pixels, at least a portion of which are located within the pixel opening; Multiple inorganic encapsulation portions are located on the side of the sub-pixel facing away from the substrate and extend to the side of the isolation structure facing away from the substrate; the inorganic encapsulation portions and the sub-openings correspond to each other, and at least some of the orthographic projections of the inorganic encapsulation portions on the substrate have overlapping areas; in the overlapping area, the distance between the outer edge of the orthographic projection of the inorganic encapsulation portion farther from the substrate and the opening edge of the orthographic projection of the corresponding sub-opening on the substrate is greater than the distance between the outer edge of the orthographic projection of the inorganic encapsulation portion closer to the substrate and the opening edge of the orthographic projection of the corresponding sub-opening on the substrate.

16. A method for manufacturing a display panel, characterized in that, include: Multiple first electrodes are fabricated on one side of the substrate, and the multiple first electrodes are arranged at intervals. A pixel definition layer and an isolation structure are prepared on the side of the first electrode away from the substrate. The isolation structure is located on the side of the pixel definition layer away from the substrate. The pixel definition layer encloses a plurality of pixel openings. The isolation structure includes a first part and a second part. The first part is located on the side of the second part closer to the substrate. The second part encloses a plurality of sub-openings. The plurality of sub-openings and the plurality of pixel openings are correspondingly arranged. A light-emitting layer, a second electrode, and an inorganic encapsulation portion are sequentially fabricated within the pixel opening; the inorganic encapsulation portion corresponds to the sub-opening, and the distance between the opening edge of the orthographic projection of the adjacent sub-opening on the substrate and the outer edge of the orthographic projection of the corresponding inorganic encapsulation portion on the substrate is different.

17. The preparation method according to claim 16, characterized in that, The step of fabricating a pixel definition layer and an isolation structure on the side of the first electrode away from the substrate includes: A pixel-defined material layer is defined on the side of the first electrode opposite to the substrate; An isolation material layer is prepared on the side of the pixel definition material layer opposite to the substrate, and the isolation material layer is patterned to form an isolation structure; The pixel definition layer is graphically represented to obtain the pixel definition layer.

18. The preparation method according to claim 16, characterized in that, The step of sequentially fabricating a light-emitting layer, a second electrode, and an inorganic encapsulation portion within the pixel opening includes: sequentially fabricating a light-emitting material layer, a second electrode material layer, and an inorganic encapsulation material layer, and patterning the inorganic encapsulation material layer, the second electrode material layer, and the light-emitting material layer to obtain the light-emitting layer, the second electrode, and the inorganic encapsulation portion.

19. A display device, characterized in that, The display panel includes any one of the display panels described in claims 1-15, or the display panel obtained by the preparation method described in any one of claims 16-18.

Images