Display device and electronic device

Abstract

A display device and an electronic device are disclosed. The display device includes a substrate, a plurality of pixels disposed on the substrate in a display area, a through-hole penetrating the substrate, a plurality of first grooves surrounding the through-hole, a plurality of block structures disposed between the plurality of first grooves and the through-hole, and a second groove surrounding the plurality of block structures.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2024-0173201, filed on November 28, 2024, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] This disclosure relates to display devices and electronic devices comprising such display devices. Background Technology

[0004] As our information-driven society develops, the demand for display devices capable of displaying images in various ways is constantly increasing. For example, display devices can be included in a variety of electronic devices such as smartphones, digital cameras, laptops, navigation devices, and smart TVs.

[0005] Many modern display devices include light-emitting display devices such as liquid crystal displays, field emission displays, or light-emitting displays. Light-emitting display devices can be, for example, organic light-emitting display devices that include organic light-emitting elements, inorganic light-emitting display devices that include inorganic light-emitting elements such as inorganic semiconductors, or ultra-miniature light-emitting display devices that include ultra-miniature light-emitting elements.

[0006] While the display devices mentioned above and other similar types are generally desirable, existing devices may suffer from insufficient durability. Therefore, there is a need for display devices with improved durability. Summary of the Invention

[0007] One aspect of this disclosure provides a display device with improved durability.

[0008] However, the scope of this disclosure is not limited to those set forth herein. These and other aspects of this disclosure will become more apparent to those skilled in the art upon reference to the detailed description of this disclosure given below.

[0009] The display device according to various embodiments of the present disclosure includes: a substrate; a plurality of pixels disposed on the substrate in a display area; a through-hole penetrating the substrate; a plurality of first grooves surrounding the through-hole; a plurality of block structures disposed between the plurality of first grooves and the through-hole; and a second groove surrounding the plurality of block structures.

[0010] In some examples of the display device, each of a plurality of pixels may include: a first electrode; a light-emitting layer disposed on the first electrode; and a second electrode disposed on the light-emitting layer. In at least a subset of these examples, the second recess may accommodate: a first residue comprising the same material as the light-emitting layer; and a second residue disposed on the first residue and comprising the same material as the second electrode. In some variations of the above examples of the display device, the second recess may also accommodate an encapsulation layer disposed on the second residue. In a further example, the encapsulation layer may include an inorganic film.

[0011] In some examples, the display device may include a first organic film disposed on a substrate, and a plurality of block structures may be disposed on the first organic film and include a first block structure and a second block structure adjacent to each other along one direction. In a subset of these examples, the first block structure may include a first sub-block structure and a second sub-block structure disposed on the first sub-block structure. In another subset of these examples, a second recess is positioned between the first block structure and the second structure. In some of these examples, in the second recess, the first organic film may include: a pair of opposing surfaces; and a raised portion between the pair of opposing surfaces. The raised portion may have a convex curved portion having a convex surface facing the open space defined by the second recess. In some variations, the pair of opposing surfaces may be a pair of opposing inclined surfaces. In another subset of the examples of the display device, the second recess may also accommodate an encapsulation layer comprising an encapsulated inorganic film. The elastic modulus of the encapsulated inorganic film may be greater than the elastic modulus of the first organic film.

[0012] In some examples of the display device, the first recess may have a closed shape in the plan view of the substrate. In a subset of these examples, the closed shape may be a closed curved shape. In another subset of these examples, the closed shape may be a circular shape.

[0013] In some examples of the display device, the second recess may be one of a plurality of second recesses, wherein the plurality of second recesses are arranged such that two or more of the plurality of second recesses surround each of a plurality of block structures.

[0014] The electronic device according to various embodiments of this specification includes: a display device; and a power module configured to supply power to the display device. The display device includes: a substrate; a plurality of pixels disposed on the substrate in a display area; a through-hole penetrating the substrate; a plurality of first recesses surrounding the through-hole; a plurality of block structures disposed between the plurality of first recesses and the through-hole; and a second recess surrounding the plurality of block structures.

[0015] A display device according to various embodiments of this specification includes: a substrate; a plurality of pixels disposed on the substrate in a display area; a through-hole penetrating the substrate; a first recess surrounding the through-hole; a plurality of block structures disposed between the first recess and the through-hole; and a second recess surrounding the plurality of block structures. The plurality of block structures includes a first block structure and a second block structure. The first recess is disposed between a first dam and a second dam and has a first width. The second recess is disposed between the first block structure and the second block structure and has a second width. In this arrangement, the first width is greater than the second width. In variations, the display device may include a plurality of first recesses, the plurality of first recesses including the aforementioned first recess.

[0016] In some examples, each of the plurality of pixels may include: a first electrode; a light-emitting layer disposed on the first electrode; and a second electrode disposed on the light-emitting layer. In at least a subset of these examples, the second recess may accommodate: a first residue comprising the same material as the light-emitting layer; and a second residue disposed on the first residue and comprising the same material as the second electrode. In some variations of the above examples of the display device, the second recess may also accommodate an encapsulation layer disposed on the second residue. In a further example, the encapsulation layer may include an inorganic film.

[0017] In some examples, the display device may include a first organic film disposed on a substrate, and a plurality of block structures may be disposed on the first organic film and include a first block structure and a second block structure adjacent to each other along one direction. In a subset of these examples, the first block structure may include a first sub-block structure and a second sub-block structure disposed on the first sub-block structure. In another subset of these examples, a second recess may be positioned between the first block structure and the second structure. In some of these examples, in the second recess, the first organic film may include: a pair of opposing surfaces; and a raised portion between the pair of opposing surfaces. The raised portion may have a convex curved portion having a convex surface facing the open space defined by the second recess. In some variations, the pair of opposing surfaces may be a pair of opposing inclined surfaces. In another subset of the examples of the display device, the second recess may also accommodate an encapsulation layer comprising an encapsulated inorganic film. The elastic modulus of the encapsulated inorganic film may be greater than the elastic modulus of the first organic film.

[0018] In some examples, the first groove in the planar view of the base may have a closed shape. In a subset of these examples, the closed shape may be a closed curve. In another subset of these examples, the closed shape may be a circular shape.

[0019] An electronic device according to various embodiments of this specification includes: a display device; and a power module configured to supply power to the display device. The display device includes: a substrate; a plurality of pixels disposed on the substrate in a display area; a through-hole penetrating the substrate; a first recess surrounding the through-hole; a plurality of block structures disposed between the plurality of first recesses and the through-hole; and a second recess surrounding the plurality of block structures. The plurality of block structures includes a first block structure and a second block structure. The first recess is disposed between a first dam and a second dam and has a first width. The second recess is disposed between the first block structure and the second structure and has a second width. Furthermore, the first width is greater than the second width. In variations, the display device of the electronic device may include a plurality of first recesses, the plurality of first recesses including the first recess mentioned above.

[0020] According to this disclosure, by arranging a block structure surrounded by a groove with a relatively narrow width at a position adjacent to the through hole in the display device, damage caused by the protective film peeling off from the display device can be prevented. Attached Figure Description

[0021] The above and other aspects and features of this disclosure will become more apparent from the following detailed description of non-limiting embodiments and from the accompanying drawings, in which:

[0022] Figure 1 This is a plan view illustrating a display panel and a driver integrated circuit according to an embodiment of the present disclosure;

[0023] Figure 2 This is a cross-sectional view illustrating an example of a display device having a bent circuit board according to an embodiment of the present disclosure;

[0024] Figure 3 This is a cross-sectional view showing an example of the display area of ​​a display panel according to an embodiment of the present disclosure;

[0025] Figure 4 and Figure 5 This is a cross-sectional view illustrating a process step in a manufacturing process for manufacturing a display device according to an embodiment of the present disclosure;

[0026] Figure 6 This is a schematic cross-sectional view of a portion of a display device according to an embodiment of the present disclosure;

[0027] Figure 7 yes Figure 1 A close-up view of area I;

[0028] Figure 8 yes Figure 7 A close-up view of area J;

[0029] Figure 9 yes Figure 8 A close-up view of region K;

[0030] Figure 10 It shows along Figure 9 A cross-sectional view of an example display panel taken by line X-X';

[0031] Figure 11 yes Figure 8 A close-up view of area L;

[0032] Figure 12 It shows along Figure 11 A cross-sectional view of an example display panel taken by line Y-Y';

[0033] Figure 13 It is based on an example Figure 12 A close-up view of region N;

[0034] Figure 14 and Figure 15 It is based on relative to Figure 13 Modified example Figure 12 A close-up view of the corresponding region N;

[0035] Figure 16 It is based on an example Figure 8 A close-up view of area M;

[0036] Figure 17 , Figure 18 , Figure 19 , Figure 20 , Figure 21 and Figure 22 It is based on relative to Figure 16 Modified example Figure 8 A close-up view of the corresponding area M;

[0037] Figure 23 , Figure 24 , Figure 25 and Figure 26 This is a cross-sectional view showing the process of a fixing block structure according to an embodiment of the present disclosure;

[0038] Figure 27 This is a block diagram of an electronic device according to an embodiment of the present disclosure; and

[0039] Figure 28 These are schematic diagrams of various electronic devices according to various embodiments of the present disclosure. Detailed Implementation

[0040] The advantages and features of the embodiments disclosed herein, as well as the methods for implementing the advantages and features of the embodiments disclosed herein, will become apparent from the embodiments described in detail herein in conjunction with the accompanying drawings. However, this disclosure is not limited to the exemplary embodiments disclosed herein and can be implemented in many ways. Exemplary embodiments are provided for illustrative purposes and to fully convey the scope of this disclosure to those skilled in the art.

[0041] As used herein, the terms “substantially,” “generally,” “approximately,” and “about” are intended to mean that minor deviations from absolute values ​​are included within the scope of such modified terminology. Referring to an element or layer “on” another element or layer includes examples where the element or layer is directly on said other element or layer, or examples where an intervening layer may also be present. Throughout this disclosure, the same reference numerals refer to the same elements. The shapes, dimensions, scales, angles, numbers, etc., disclosed in the drawings to illustrate embodiments are exemplary and are not intended to limit us to the shapes, dimensions, scales, angles, numbers, etc., shown.

[0042] Although terms such as first and second are used to describe the various components of this disclosure, these components are not limited by these terms. Rather, these terms are used only to distinguish one component from another. Thus, in some examples, a first component referred to herein may be a second component within the technical scope of this disclosure.

[0043] Each of the various features of the embodiments disclosed herein can be combined, either partially or entirely, or can be combined with each other, and can be interlocked and operated in various ways. Furthermore, each embodiment can be practiced independently of or in combination with one or more other embodiments contemplated herein.

[0044] Hereinafter, examples of embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0045] Figure 1 This is a plan view illustrating a display panel and a driver integrated circuit (driver IC) according to an embodiment of the present disclosure. Figure 2 This is a cross-sectional view illustrating an example of a display device with a bent circuit board according to an embodiment of the present disclosure.

[0046] refer to Figure 1 and Figure 2In a display device 10 according to one embodiment of the present disclosure, a through-hole TH can be formed. The through-hole TH can be a light-transmitting hole that can penetrate the substrate SUB, display layer DISL, encapsulation layer ENC, and sensor electrode layer SENL of the display panel 100. The through-hole TH can be a physical hole that penetrates not only the display panel 100 but also the lower panel cover PB and the polarizing film PF. However, the embodiments contemplated in this disclosure are not limited to this, and in some embodiments, the through-hole TH can penetrate the lower panel cover PB but not the display panel 100 and the polarizing film PF. Figure 2 As shown, the cover window CW can be configured to cover the through hole TH. According to some embodiments, the display panel 100 of the display device 10 includes a display area DA and a non-display area NDA surrounding the display area DA. A plurality of sub-pixels SP are positioned at the display area DA.

[0047] According to some embodiments, and as Figure 2 As shown, the display device 10 included in the electronic device may further include an optical device OPD disposed in the through-hole TH. According to one embodiment, the electronic device may be a portable electronic device such as a mobile phone, smartphone, tablet PC, smartwatch, watch phone, mobile communication terminal, e-notebook, e-reader, portable multimedia player (PMP), navigation device, or ultra-mobile PC (UMPC), as well as a television set, laptop computer, monitor, billboard, or Internet of Things (IoT) device. However, embodiments of this disclosure are not limited thereto.

[0048] The optical device OPD can be spaced apart from the display panel 100, the lower cover PB, and the polarizing film PF. The optical device OPD can be an optical sensor that senses light incident through the through-hole TH, wherein the optical sensor can be, for example, a proximity sensor, an illuminance sensor, or a camera sensor.

[0049] refer to Figure 2 According to one embodiment of the present disclosure, the display device 10 may include a display panel 100, a polarizing film PF, a cover window CW, and a lower cover PB. The display panel 100 may include a substrate SUB, a display layer DISL, an encapsulation layer ENC, and a sensor electrode layer SENL.

[0050] In some embodiments, the substrate SUB can be made of a rigid material. For example, the substrate SUB can be made of glass. In some examples, the substrate SUB can be formed from ultrathin glass (UTG) having a thickness of approximately 200 μm or less. In some embodiments, the substrate SUB can be made of a flexible material. For example, the substrate SUB can be formed from polyimide.

[0051] The Display Layer (DISL) can be set on the first surface of the substrate (SUB). The Display Layer (DISL) can be a layer for displaying images. For example... Figure 3 As shown, the display layer DISL may include a thin-film transistor layer TFTL in which thin-film transistors are formed and a light-emitting element layer EML in which light-emitting elements LEL are disposed in the emission region EA. The light-emitting elements LEL (e.g., pixels) may be located in the display region DA (see [reference]). Figure 1 It is set on the base SUB.

[0052] In the Display Layer DISL within the Display Area DA, scan lines, data lines, or power lines can be configured to enable the Emitting Area EA to emit light. In the Display Layer DISL within the Non-Display Area NDA, scan drive circuit units that output scan signals to the scan lines and fan-out lines that connect data lines and the driver IC 200 can be configured. The driver IC 200 is electrically connected to the pad portion PD, which includes data pads, power pads, etc.

[0053] The encapsulation layer ENC prevents oxygen and / or moisture from penetrating into the light-emitting element layer (EML) of the display layer (DISL). The encapsulation layer ENC can be a layer used to encapsulate the EML of the display layer (DISL). The encapsulation layer ENC can be disposed on the display layer (DISL). In some examples, the encapsulation layer ENC can be disposed on the top and side surfaces of the display layer (DISL). The encapsulation layer ENC can be configured to cover the display layer (DISL).

[0054] A sensor electrode layer (SENL) can be disposed on a display layer (DISL). The SENL can include sensor electrodes. The SENL can sense user touch by including these sensor electrodes.

[0055] A polarizing film PF can be disposed on the display panel 100 to reduce the reflection of external light. The polarizing film PF may include a first substrate component, a linear polarizer, a phase retardation film (such as a quarter-wave plate (λ / 4 plate)), and a second substrate component. The first substrate component, the phase retardation film, the linear polarizer, and the second substrate component of the polarizing film PF may be stacked sequentially on the display panel 100.

[0056] The cover window (CW) can be placed on the polarizing film (PF). The cover window (CW) can be attached to the polarizing film (PF) using a transparent adhesive component such as an optically clear adhesive (OCA) film.

[0057] The panel bottom cover PB can be disposed on the second surface of the base SUB of the display panel 100. The second surface of the base SUB can be the surface opposite to the first surface. The panel bottom cover PB can be attached to the second surface of the base SUB of the display panel 100 by an adhesive component. The adhesive component may include pressure-sensitive adhesive (PSA).

[0058] The lower cover PB may include one or more of the following: a light-blocking member for absorbing light incident from the outside, a buffer member for absorbing impacts from the outside, and a heat dissipation member for effectively dissipating heat from the display panel 100.

[0059] A light-blocking component may be disposed beneath the display panel 100. The light-blocking component blocks light transmission, thereby preventing components disposed beneath the light-blocking component (e.g., circuit board 300, etc.) from being observed from the top of the display panel 100. The light-blocking component may comprise a light-absorbing material such as black pigment or black dye.

[0060] A buffer member can be disposed below the light-blocking member. The buffer member can absorb external impacts to prevent damage to the display panel 100. The buffer member can be formed of a single layer or multiple layers. For example, the buffer member can be formed of a polymer resin such as polyurethane (PU), polycarbonate (PC), polypropylene (PP), or polyethylene (PE), or can include an elastic material such as a foam sponge obtained from rubber, urethane materials, or acrylic materials.

[0061] The heat dissipation component can be disposed below the buffer component. The heat dissipation component may include a first heat dissipation layer containing graphite or carbon nanotubes, and a second heat dissipation layer formed of a metal thin film containing, for example, copper, nickel, ferrite or silver, wherein the metal thin film can shield electromagnetic waves and has excellent thermal conductivity.

[0062] like Figure 2 As shown, the circuit board 300, which is mounted on the substrate SUB at one end, can be bent toward the bottom of the display panel 100. The circuit board 300 can be attached to the bottom surface of the panel cover PB via an adhesive member 310. The adhesive member 310 may include a pressure-sensitive adhesive.

[0063] Figure 3 This is a cross-sectional view showing an example of the display area of ​​a display panel according to an embodiment of the present disclosure. Figure 3 The view in the middle is based on along Figure 1 The cross section intercepted by line Z-Z'.

[0064] refer to Figure 3 According to one embodiment of the present disclosure, the display panel 100 may be an organic light-emitting display panel having a light-emitting element LEL including an organic light-emitting layer (hereinafter also referred to as a light-emitting layer) 172.

[0065] The display layer DISL may include a thin film transistor layer (TFTL) containing multiple thin film transistors and a light-emitting element layer (EML) containing multiple light-emitting elements (LELs).

[0066] The first buffer film BF1 can be disposed on the substrate SUB. The first buffer film BF1 can be formed of an inorganic material such as silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, and aluminum oxide. Alternatively, the first buffer film BF1 can be formed as a multilayer structure comprising multiple layers, said multiple layers including silicon nitride layers, silicon oxynitride layers, silicon oxide layers, titanium oxide layers, and aluminum oxide layers stacked alternately relative to each other. In variations, other combinations of two or more of the mentioned components can be included in the multiple layers of the multilayer structure.

[0067] An active layer comprising the channel region TCH, source region TS, and drain region TD of a thin-film transistor (TFT) can be disposed on a first buffer film BF1. The active layer can be formed of polycrystalline silicon, monocrystalline silicon, low-temperature polycrystalline silicon, amorphous silicon, or oxide semiconductor materials. When the active layer comprises polycrystalline silicon or oxide semiconductor materials, the source region TS and drain region TD of the active layer can be conductive regions doped with ions or impurities and possessing conductivity.

[0068] The gate insulating film 130 can be disposed on the active layer of the thin-film transistor TFT. The gate insulating film 130 can be formed of an inorganic film (e.g., silicon nitride film, silicon oxynitride film, silicon oxide film, titanium oxide film, or aluminum oxide film).

[0069] The gate electrode TG of the thin-film transistor TFT, the first capacitor electrode CAE1 of the capacitor Cst, and the first gate metal layer of the scan line can be disposed on the gate insulating film 130. The gate electrode TG of the thin-film transistor TFT can overlap with the channel region TCH in a third direction (e.g., the Z-axis direction). The first gate metal layer can be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or alloys thereof.

[0070] The first interlayer insulating film 141 may be disposed on the first gate metal layer. The first interlayer insulating film 141 may be formed of an inorganic film (e.g., a silicon nitride film, a silicon oxynitride film, a silicon oxide film, a titanium oxide film, or an aluminum oxide film). The first interlayer insulating film 141 may include multiple inorganic films.

[0071] A second gate metal layer, including a second capacitor electrode CAE2 (Cst), can be disposed on the first interlayer insulating film 141. The second capacitor electrode CAE2 can overlap with the first capacitor electrode CAE1 in a third direction (e.g., the Z-axis direction). Therefore, the capacitor Cst can be formed from the first capacitor electrode CAE1, the second capacitor electrode CAE2, and an inorganic insulating dielectric layer disposed between the first capacitor electrode CAE1 and the second capacitor electrode CAE2 to serve as a dielectric layer. The second gate metal layer can be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or alloys thereof.

[0072] The second interlayer insulating film 142 may be disposed on the second gate metal layer. The second interlayer insulating film 142 may be formed of an inorganic film (e.g., a silicon nitride film, a silicon oxynitride film, a silicon oxide film, a titanium oxide film, or an aluminum oxide film). The second interlayer insulating film 142 may include multiple inorganic films.

[0073] A first data metal layer, including the first connection electrode CE1 and the data line, can be disposed on the second interlayer insulating film 142. The first connection electrode CE1 can be connected to the drain region TD through a first contact hole CT1 penetrating the gate insulating film 130, the first interlayer insulating film 141, and the second interlayer insulating film 142. The first data metal layer can be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or alloys thereof.

[0074] A first organic film 160 for flattening the stepped portion caused by the thin-film transistor (TFT) can be disposed on the first data metal layer. The first organic film 160 can be formed of an organic film such as an acrylic resin film, an epoxy resin film, a phenolic resin film, a polyamide resin film, and a polyimide resin film.

[0075] A second data metal layer, including the second connecting electrode CE2, can be disposed on the first organic film 160. The second data metal layer can be connected to the first connecting electrode CE1 through a second contact hole CT2 penetrating the first organic film 160. The second data metal layer can be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or alloys thereof.

[0076] The second organic film 180 can be disposed on the second data metal layer. The second organic film 180 can be formed of an organic film such as an acrylic resin film, an epoxy resin film, a phenolic resin film, a polyamide resin film, and a polyimide resin film.

[0077] In some examples, the second data metal layer and the second organic film 180, including the second connecting electrode CE2, may be omitted.

[0078] The light-emitting element layer (EML) can be disposed on the thin-film transistor layer (TFTL). The light-emitting element layer (EML) may include a light-emitting element (LEL) and a diaphragm (190).

[0079] Each of the plurality of light-emitting elements (LELs) may include a pixel electrode 171, a light-emitting layer 172, and a common electrode 173. Each of the plurality of emitting regions (EAs) may be a region in which the pixel electrode 171, the light-emitting layer 172, and the common electrode 173 are sequentially stacked such that holes from the pixel electrode 171 and electrons from the common electrode 173 recombine with each other to emit light. In this case, the pixel electrode 171 may be an anode electrode, and the common electrode 173 may be a cathode electrode.

[0080] A pixel electrode layer, including pixel electrode 171, can be formed on the second organic film 180. Pixel electrode 171 can be connected to the second connection electrode CE2 through a third contact hole CT3 penetrating the second organic film 180. The pixel electrode layer can be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or alloys thereof.

[0081] In the top-emitting structure that emits light toward the common electrode 173 relative to the light-emitting layer 172, the pixel electrode 171 can be formed as a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), or aluminum (Al), or it can be formed as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and indium tin oxide (ITO) (ITO / Al / ITO), or a stacked structure of APC alloy and ITO (ITO / APC / ITO) to improve reflectivity. The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

[0082] The dam 190 is used to define the emission region EA of the pixel. For this purpose, the dam 190 can be formed on the second organic film 180 to expose a portion of the pixel electrode 171. The dam 190 can cover the edge of the pixel electrode 171. The dam 190 can be disposed in the third contact hole CT3. In other words, the third contact hole CT3 can be filled with the dam 190. The dam 190 can be formed of an organic film such as an acrylic resin film, an epoxy resin film, a phenolic resin film, a polyamide resin film, and a polyimide resin film.

[0083] Spacer 191 may be disposed on dam 190. Spacer 191 may be used to support the mask during the process of manufacturing the light-emitting layer 172. Spacer 191 may be formed of an organic film such as an acrylic resin film, epoxy resin film, phenolic resin film, polyamide resin film, and polyimide resin film.

[0084] A light-emitting layer 172 may be formed on the pixel electrode 171. The light-emitting layer 172 may include an organic material for emitting light of a predetermined color. For example, the light-emitting layer 172 may include a hole transport layer, an organic material layer, and an electron transport layer. The organic material layer may include a host and a dopant. The organic material layer may include a material configured to emit predetermined light and may be formed using phosphorescent or fluorescent materials.

[0085] A common electrode 173 may be formed on the light-emitting layer 172. The common electrode 173 may be formed to cover the light-emitting layer 172. The common electrode 173 may be a common layer formed on the emission region EA. A capping layer may be formed on the common electrode 173.

[0086] In the top-emitting structure, the common electrode 173 can be formed of a transparent conductive oxide (TCO) capable of transmitting light (such as ITO or indium zinc oxide (IZO)) or a semi-transmissive conductive material (such as magnesium (Mg), silver (Ag), or an alloy of magnesium (Mg) and silver (Ag)). When the common electrode 173 is formed of a semi-transmissive conductive material, the luminous efficiency can be improved due to the microcavity effect.

[0087] An encapsulation layer ENC can be formed on the light-emitting element layer EML. The encapsulation layer ENC may include at least one inorganic film TFE1 and TFE3 to prevent oxygen or moisture from penetrating into the light-emitting element layer EML. Furthermore, the encapsulation layer ENC may include at least one organic film to protect the light-emitting element layer EML from foreign matter such as dust. For example, the encapsulation layer ENC may include a first encapsulation inorganic film TFE1, an encapsulation organic film TFE2, and a second encapsulation inorganic film TFE3.

[0088] A first encapsulating inorganic film TFE1 can be disposed on the common electrode 173, an encapsulating organic film TFE2 can be disposed on the first encapsulating inorganic film TFE1, and a second encapsulating inorganic film TFE3 can be disposed on the encapsulating organic film TFE2. The first encapsulating inorganic film TFE1 and the second encapsulating inorganic film TFE3 can each be formed from multiple films formed by alternately stacking one or more inorganic films selected from silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, and aluminum oxide. In other examples, the multiple film configuration may include other arrangements containing one or more of the components mentioned above. The encapsulating organic film TFE2 can be an organic film such as an acrylic resin film, an epoxy resin film, a phenolic resin film, a polyamide resin film, or a polyimide resin film.

[0089] The sensor electrode layer SENL is disposed on the encapsulation layer ENC. The sensor electrode layer SENL may include sensor electrodes TE and RE.

[0090] The second buffer film BF2 may be disposed on the encapsulation layer ENC. The second buffer film BF2 may include at least one inorganic film. For example, the second buffer film BF2 may be formed from a plurality of films in which one or more inorganic films selected from silicon nitride, silicon oxynitride, silicon oxide, titanium oxide, and aluminum oxide are alternately stacked. In other examples, the plurality of film configurations may include other arrangements comprising one or more of the components mentioned above. In some examples, the second buffer film BF2 may be omitted.

[0091] The first connecting portion BE1 can be disposed on the second buffer film BF2. The first connecting portion BE1 can be formed from a single layer containing molybdenum (Mo), titanium (Ti), copper (Cu) or aluminum (Al), or it can be formed as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and indium tin oxide (ITO) (ITO / Al / ITO), an Ag-Pd-Cu (APC) alloy or a stacked structure of APC alloy and ITO (ITO / APC / ITO).

[0092] The first sensor insulating film TINS1 can be disposed on the first connection portion BE1. The first sensor insulating film TINS1 can be formed of an inorganic film (e.g., silicon nitride film, silicon oxynitride film, silicon oxide film, titanium oxide film, or aluminum oxide film).

[0093] Sensor electrodes (i.e., driving electrode TE and sensing electrode RE) can be disposed on the first sensor insulating film TINS1. Furthermore, a dummy pattern can be disposed on the first sensor insulating film TINS1. The driving electrode TE, sensing electrode RE, and dummy pattern do not overlap with the emission region EA. The driving electrode TE, sensing electrode RE, and dummy pattern can be formed from a single layer comprising molybdenum (Mo), titanium (Ti), copper (Cu), or aluminum (Al), or can be formed as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and indium tin oxide (ITO) (ITO / Al / ITO), an Ag-Pd-Cu (APC) alloy, or a stacked structure of APC alloy and ITO (ITO / APC / ITO).

[0094] The second sensor insulating film TINS2 can be disposed on the driving electrode TE, the sensing electrode RE, and the dummy pattern. The second sensor insulating film TINS2 can include at least one of inorganic and organic films. The inorganic film can be a silicon nitride film, a silicon oxynitride film, a silicon oxide film, a titanium oxide film, or an aluminum oxide film. The organic film can be an acrylic resin film, an epoxy resin film, a phenolic resin film, a polyamide resin film, or a polyimide resin film.

[0095] Figure 4 and Figure 5 This is a cross-sectional view illustrating a manufacturing process step for manufacturing a display device according to an embodiment of the present disclosure. In some examples, the manufacturing process may include multiple steps.

[0096] In one step, multiple display units can be formed on the first surface of the mother substrate MSUB.

[0097] In subsequent steps, multiple first protective films (PRF1) can be attached to multiple display units. Each of the multiple first protective films (PRF1) can be a buffer film used to protect the multiple display units from external impacts. In some examples, the multiple first protective films (PRF1) can be made of a transparent material. Furthermore, in some examples, the multiple display units can be inspected.

[0098] In a subsequent step, the first laser can be irradiated onto a second surface of the mother substrate MSUB that is opposite to the first surface. Multiple first laser irradiation areas can be formed along the edges of the multiple display units. Various lasers can be used according to some embodiments.

[0099] The laser used to form the first laser irradiation area can be used for irradiation with a repetition rate in the range of 10 kHz to 250 kHz, a processing speed in the range of 10 mm / s to 250 mm / s, and a pulse energy in the range of 10 μJ to 300 μJ. However, in order to achieve a laser depth of approximately 225 μm from the first surface of the mother substrate MSUB, irradiation can preferably be performed with a repetition rate in the range of approximately 17.5 kHz to 125 kHz, a processing speed in the range of 17.5 mm / s to 125 mm / s, and a pulse energy in the range of 25 μJ to 178 μJ.

[0100] In a subsequent step, a second laser can be applied to the second surface of the mother substrate MSUB. This allows for the formation of vias TH in each of the multiple display cells (see [link to documentation]). Figure 2 Multiple second laser irradiation areas CH2. In one embodiment, the first and second lasers can be irradiated simultaneously by multiple laser devices to shorten the process time.

[0101] The second cutting line can be defined as an imaginary line connecting multiple second laser irradiation areas CH2 in a planar view. The second cutting line can be formed by irradiating the via TH with a second laser to create multiple second laser irradiation areas CH2 along the edge of the via TH. The second cutting line can depend on the form and / or shape of the via TH. For example, when the via TH has a circular shape in the planar view, the second cutting line can be formed in a circular shape.

[0102] Although various lasers can be used as the first and second lasers in the embodiments contemplated according to this disclosure, the accompanying drawings of this disclosure show the case where the first and second lasers are infrared Bessel beams with a wavelength of approximately 1030 nm.

[0103] The depth of each of the plurality of first laser irradiation regions formed by the first laser and the depth of each of the plurality of second laser irradiation regions CH2 formed by the second laser can be different. The depth of the first laser irradiation region can be defined as the line length in the sketch of the first laser irradiation region, and the depth of the second laser irradiation region CH2 can be defined as the line length in the sketch of the second laser irradiation region CH2.

[0104] In the following steps, and referring to Figure 4 The second protective film PRF2 can be attached to each of the multiple first protective films PRF1.

[0105] The second protective film PRF2 can be attached to each of the plurality of first protective films PRF1 and to the exposed parent substrate MSUB not covered by the plurality of first protective films PRF1. The second protective film PRF2 can cover the plurality of first laser irradiation areas and the plurality of second laser irradiation areas CH2. The second protective film PRF2 can be an acid-resistant film used to protect the plurality of display units from the etchant during an etching process performed on the parent substrate MSUB, wherein the etching process can be performed in subsequent steps as described below.

[0106] In the following steps, and continue to refer to Figure 4 This allows the etchant to be sprayed onto the second surface of the parent MSUB without a separate mask. Therefore, the thickness of the parent MSUB can be reduced.

[0107] In addition, the mother substrate MSUB can be cut along multiple first laser irradiation areas and second laser irradiation areas CH2.

[0108] When the etchant is sprayed onto the second surface of the mother substrate MSUB, the thickness of the mother substrate MSUB can be reduced from a first thickness to a second thickness. Since the mother substrate MSUB is etched without a separate mask, the mother substrate MSUB can be etched uniformly over the entire area of ​​the second surface of the mother substrate MSUB.

[0109] Each of the multiple second laser irradiation areas CH2 may include a physical aperture formed by the second laser and a region surrounding the physical aperture having physical properties altered by the second laser. Alternatively, each of the multiple second laser irradiation areas CH2 may be a region having physical properties altered by the second laser without forming a physical aperture. Therefore, the etching rate of the etchant in each of the multiple second laser irradiation areas CH2 may be higher than the etching rate in other areas of the mother substrate MSUB not irradiated by the laser.

[0110] Because the depth of each of the multiple second laser-irradiated regions CH2 is greater than the depth of each of the multiple first laser-irradiated regions, the etchant can penetrate into the multiple second laser-irradiated regions CH2 before penetrating into the multiple first laser-irradiated regions. That is, since the multiple second laser-irradiated regions CH2 are also etched in a thinning process in which the thickness of the parent substrate MSUB is reduced by the etchant, a tapered cross-section can be formed on the substrate SUB through isotropic etching in the vias TH formed by the second laser-irradiated regions CH2. In contrast, the multiple first laser-irradiated regions can remain unaffected by any etching; that is, the multiple first laser-irradiated regions can remain unetched during the thinning of the parent substrate MSUB.

[0111] In the following steps, refer to Figure 5 After the etching process is completed, the second protective film PRF2 can be peeled off. During the peeling process of the second protective film PRF2, one cut side of the second protective film PRF2 can be removed. This side can be adjacent to the via TH. Furthermore, the driver IC 200 (see...) Figure 2 ) and circuit board 300 (see Figure 2 It is attached to each of the plurality of display units, and in each of the plurality of display units, the first protective film PRF1 can be peeled off.

[0112] When peeling one side of the second protective film PRF2, the adhesive strength between the second protective film PRF2 and the display layer DISL can affect the components disposed beneath the second protective film PRF2. For example, during the process of peeling off the second protective film PRF2 disposed above the light-emitting element layer EML, the light-emitting element layer EML disposed beneath the second protective film PRF2 may be damaged. The length of the light-emitting element layer EML in the thickness direction (e.g., the Z-axis direction) may be smaller than the lengths of other components (e.g., the sensor electrode layer SENL and the encapsulation layer ENC) in the thickness direction. For example, the light-emitting layer disposed in the light-emitting element layer EML may be very thin. Therefore, damage due to the force required to overcome the adhesive strength of the second protective film PRF2 to peel it off may occur relatively frequently.

[0113] refer to Figure 5 The enlarged view included shows that when one side of the light-emitting element layer (EML) is separated into an upper and lower portion, one side of the sensor electrode layer (SENL) and the encapsulation layer (ENC) may be lifted towards the upper side of the display device together with the upper portion of the separated EML. As a result, a gap may be formed between the upper and lower portions of the EML.

[0114] When gaps are formed in the light-emitting element layer EML during the peeling process of the second protective film PRF2, moisture and / or oxygen may penetrate into the gaps, which may even affect the display area DA (see...). Figure 1 This has an impact. Therefore, in this situation, the durability of the display device may be reduced and weakened in other ways.

[0115] Figure 6 This is a schematic cross-sectional view of a portion of a display device according to an embodiment of the present disclosure.

[0116] refer to Figure 6A display device according to one embodiment of the present disclosure may include inorganic encapsulation regions IEA1 and IEA2. Inorganic encapsulation regions IEA1 and IEA2 may include a first inorganic encapsulation region IEA1 and a second inorganic encapsulation region IEA2. The first inorganic encapsulation region IEA1 may include a substrate SUB and a light-emitting element layer EML and an encapsulation layer ENC disposed on the substrate SUB. The light-emitting element layer EML may include a light-emitting layer. The light-emitting layer disposed in the first inorganic encapsulation region IEA1 may be arranged such that the light-emitting layer does not actually emit light. In some examples, the light-emitting layer may be a light-emitting layer residue (or a first residue) remaining from the process of arranging the light-emitting layer throughout the entire display panel. The second inorganic encapsulation region IEA2 may include a substrate SUB and a block structure BS and an encapsulation layer ENC disposed on the substrate SUB. The substrate SUB may be obtained from the aforementioned parent substrate MSUB.

[0117] A display device according to some embodiments of the present disclosure includes a block structure BS provided in a second inorganic encapsulation region IEA2. In this way, in such embodiments, the effects that may be applied to the light-emitting element layer EML during the process of peeling off the second protective film PRF2 can be reduced. For example, the block structure BS can prevent the light-emitting element layer EML disposed in the first inorganic encapsulation region IEA1 from being separated by enhancing the adhesion strength between the encapsulation layer ENC and the underlying components (i.e., the thin-film transistor layer TFTL and the substrate SUB). Therefore, moisture (or oxygen) from the outside can be prevented from penetrating into the display device, and the pixels disposed in the display area can be protected.

[0118] Figure 7 yes Figure 1 A close-up view of area I.

[0119] refer to Figure 7 The display panel 100 according to some embodiments of the present disclosure (see...) Figure 1 It may include the inorganic package area IEA surrounding the through-hole TH and the wiring area WLA surrounding the inorganic package area IEA.

[0120] Let's refer to each other. Figure 3 and Figure 7 The inorganic encapsulation area (IEA) can be arranged to prevent oxygen or moisture from penetrating into the light-emitting element layer (EML) of the display layer (DISL) through the via (TH). For example, the first encapsulation inorganic film (TFE1) and the second encapsulation inorganic film (TFE3) of the encapsulation layer (ENC) can be in contact with each other to prevent the penetration of oxygen or moisture.

[0121] In a display device according to some embodiments of the present disclosure, the inorganic encapsulation region IEA may include a first inorganic encapsulation region IEA1 and a second inorganic encapsulation region IEA2. The first inorganic encapsulation region IEA1 and the second inorganic encapsulation region IEA2 may be connected to... Figure 6 The inorganic packaging regions IEA1 and IEA2 shown in the schematic cross section described above correspond to each other.

[0122] In some examples, the inorganic encapsulation region IEA may include at least one dam (e.g., as shown in the image). Figure 10 The dams HDAM1 and HDAM2 shown in the diagram), and at least one tip (e.g., as shown in the diagram). Figure 10 The tips T1 to T8 shown in the figure) and at least one groove (e.g., as shown in the figure) Figure 8 The grooves GR1 and GR2 shown in the diagram.

[0123] The wiring area WLA can be an area where bypass lines are installed, surrounding the via TH. Some of the multiple bypass lines can be connected to data lines, and others can be connected to second power lines applied by a second power supply voltage higher than the first power supply voltage. Additionally, other bypass lines can be connected to scan lines. Figure 7 As shown, the wiring area WLA can be surrounded by the display area DA.

[0124] Figure 8 yes Figure 7 A close-up view of area J.

[0125] refer to Figure 7 and Figure 8 The first inorganic package region IEA1 may include a first recess GR1. The first recess GR1 may have a first width GRW1. The first recess GR1 may be formed to surround the via TH in a closed curve shape. In some examples, and as... Figure 8 As shown, a plurality of first grooves GR1 may be formed in the first inorganic package region IEA1. Since any one of the plurality of first grooves GR1 surrounds the via TH in a closed curve shape (e.g., a closed loop), the plurality of first grooves GR1 may be arranged such that none of the first grooves GR1 include a point of intersection with another first groove GR1.

[0126] Continue to refer to Figure 8The close-up view shown shows that when the through-hole TH is formed in a circular shape (a circle when viewed in a plan view), the magnified view of the first groove GR1 can be approximated as a straight line. For example, a plurality of first grooves GR1 can be configured to extend in a second direction (e.g., the Y-axis direction) and can not intersect each other. In some examples, a dam can be provided between two of the plurality of first grooves GR1, and this will be described in detail below. In further examples, two or more dams can be provided such that each dam separates a pair of first grooves.

[0127] The second inorganic package region IEA2 may include a second recess GR2 and a block structure BS surrounded by the second recess GR2. The second recess GR2 may have a second width GRW2. In some examples, and as shown... Figure 8 As shown, the plurality of second grooves GR2 can be formed to intersect each other. In some of these examples, the plurality of block structures BS can be arranged such that each block structure in the plurality of block structures BS is surrounded by a second groove GR2 in the plurality of second grooves GR2. For example, as Figure 6 As shown, multiple block structures BS can be disposed within the second inorganic packaging region IEA2. Therefore, the adhesion strength between the block structures BS and the underlying components (e.g., thin-film transistor layer TFTL, substrate SUB) can be enhanced, and damage due to peeling of the second protective film PRF2 during the manufacturing process can be prevented. In the example where the packaging layer ENC is disposed throughout the block structures BS, the adhesion strength between the packaging layer ENC and the underlying components can be enhanced.

[0128] In some embodiments, the first width GRW1 of the first groove GR1 may be greater than the second width GRW2 of the second groove GR2. Similarly, the first width GRW1 of each of the plurality of first grooves GR1 may be greater than the second width GRW2 of each of the plurality of second grooves GR2. In some examples, the first width GRW1 may be in the range of 20 μm to 30 μm, and the second width GRW2 may be in the range of 0.1 μm to 8 μm. Since the second width GRW2 is sufficiently small relative to the surface area of ​​the second inorganic packaging region IEA2, the adhesive strength between the block structure BS and the underlying assembly can be enhanced. The process for enhancing the adhesive strength when the second width GRW2 is sufficiently small is described below.

[0129] Figure 9 yes Figure 8 A close-up view of region K. Figure 10 It shows along Figure 9 A cross-sectional view of an example display panel taken by line X-X'.

[0130] like Figure 10As shown, the cross-sectional view taken along line X-X' includes the light-emitting layer 172, the common electrode 173, the second organic film 180, and the embankment 190, etc. Since the magnified region K is located in the display region DA (see...), Figure 7 ) and through-hole TH (see Figure 7 Therefore, the above components can be used in addition to, as shown in, Figure 10 Various arrangements other than those shown. However, Figure 10 The arrangement shown is helpful for understanding Figure 8 The inorganic packaging region IEA1 is cut along line Z-Z' and in Figure 3 The correlation between the cross-sectional diagrams shown above is instructive.

[0131] For example, specifically, the second organic film 180 shown in the cross-sectional view can be any one of the sub-dams, the dam 190 can be another sub-dam, and the luminescent layer 172 can be a luminescent layer residue (or first residue) 172_D disposed in the extension of the fractured area that does not actually emit light, and the public

[0132] The common electrode 173 can be a common electrode residue (or a second residue) 173_D disposed in the extension of the fractured region but not actually performing the function of an electrode. That is, the light-emitting layer 172 can contain the same material as the light-emitting layer residue 172_D, and the common electrode 173 can contain the same material as the common electrode residue 173_D.

[0133] It should be understood that, Figure 10 The reference numerals in the figures are specified as shown to directly indicate their relevance to the light-emitting elements arranged in the display area DA as shown in the figures, and are not limiting.

[0134] refer to Figure 9 and Figure 10 In the first inorganic packaging region IEA1 (see Figure 8 In this process, the first dummy pattern DP1 may be made of the same material as the second gate metal layer of the second capacitor electrode CAE2, which includes the capacitor Cst, and may be disposed on the same layer. For example, the first dummy pattern DP1 may be disposed on the first interlayer insulating film 141. The first dummy pattern DP1 may be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or alloys thereof.

[0135] The second dummy pattern DP2 may be made of the same material as the first data metal layer including the first connecting electrode CE1 and the data line, and may be disposed on the same layer. For example, the second dummy pattern DP2 may be disposed on the second interlayer insulating film 142. The second dummy pattern DP2 may be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or alloys thereof.

[0136] The second dummy pattern DP2 can overlap with the first dummy pattern DP1 in a third direction (e.g., the Z-axis direction).

[0137] The first tip T1 to the eighth tip T8 may be made of the same material as the second data metal layer including the second connecting electrode CE2, and may be disposed on the same layer. For example, the first tip T1 to the eighth tip T8 may be disposed on the first organic film 160. The first tip T1 to the eighth tip T8 may be formed as a single layer or multiple layers made of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd) and copper (Cu) or alloys thereof.

[0138] Each of the first tip T1 to the eighth tip T8 can be connected to the second dummy pattern DP2 through a contact hole penetrating the first organic film 160. Each of the first tip T1 to the eighth tip T8 may include an overhang structure in which the top and bottom surfaces are exposed and not covered by the first organic film 160, the second organic film 180, the first dam HDAM1, and the second dam HDAM2. For example, the plurality of tips may be integrally formed similarly to the fourth tip T4 and the fifth tip T5. Each of the first tip T1 to the eighth tip T8 may be a protruding pattern or groove pattern for forming a recess (or trench).

[0139] Multiple first grooves GR1 can be disposed in the first inorganic packaging region IEA1. A first-first groove GR11 can be formed between a first tip T1 and a second tip T2, a first-second groove GR12 can be formed between a third tip T3 and a fourth tip T4, a first-third groove GR13 can be formed between a fifth tip T5 and a sixth tip T6, and a first-fourth groove GR14 can be formed between a seventh tip T7 and an eighth tip T8. The first-first groove GR11 can have an overhang structure formed by the first tip T1 and the second tip T2, the first-second groove GR12 can have an overhang structure formed by the third tip T3 and the fourth tip T4, the first-third groove GR13 can have an overhang structure formed by the fifth tip T5 and the sixth tip T6, and the first-fourth groove GR14 can have an overhang structure formed by the seventh tip T7 and the eighth tip T8.

[0140] Since the light-emitting layer 172 is deposited by evaporation and the common electrode 173 is deposited by sputtering, the light-emitting layer 172 and the common electrode 173 can be configured to break at each of the first-first groove GR11, the first-second groove GR12, the first-third groove GR13, and the first-fourth groove GR14 because of the low step coverage. In contrast, the first encapsulated inorganic film TFE1 and the second encapsulated inorganic film TFE3 can be deposited by chemical vapor deposition or atomic layer deposition, and therefore can be formed as continuous without breaking at each of the first-first groove GR11, the first-second groove GR12, the first-third groove GR13, and the first-fourth groove GR14 because of the high step coverage. Step coverage refers to the ratio of the thickness of the film coated on the inclined portion to the thickness of the film coated on the flat portion. The light-emitting layer 172, the broken light-emitting layer residue 172_D, the common electrode 173 and the broken common electrode residue 173_D can be disposed in each of the first-first groove GR11, the first-second groove GR12, the first-third groove GR13 and the first-fourth groove GR14.

[0141] The first dam HDAM1 may include multiple subdams, including a first subdam HDA1, a second subdam HDA2, a third subdam HDA3, and a fourth subdam HDA4. Although the first dam HDAM1 is shown to include only four subdams HDA1, HDA2, HDA3, and HDA4, embodiments of this disclosure are not limited thereto. For example, the first dam HDAM1 may include three subdams, similar to the second dam HDAM2.

[0142] The first sub-dam HDA1 can be disposed on the first organic membrane 160 and can comprise the same material as the second organic membrane 180. The first sub-dam HDA1 can be disposed on the second tip T2 and the third tip T3. The second sub-dam HDA2 can be disposed on the first sub-dam HDA1 and can comprise the same material as the dam 190. The third sub-dam HDA3 and the fourth sub-dam HDA4 can be disposed on the second sub-dam HDA2 and can be disposed with the spacer 191 (see...). Figure 3 The materials used may include the same materials, but are not limited to them. The thickness of the fourth sub-dam HDA4 may be greater than the thickness of the third sub-dam HDA3, but the embodiments disclosed herein are not limited to this.

[0143] The second dam, HDAM2, may include a fifth sub-dam, HDA5, a sixth sub-dam, HDA6, and a seventh sub-dam, HDA7. The second dam, HDAM2, may similarly include four sub-dams as the first dam, HDAM1.

[0144] The fifth sub-dam HDA5 can be disposed on the first organic membrane 160 and can comprise the same material as the second organic membrane 180. The fifth sub-dam HDA5 can be disposed on the seventh tip T7. The sixth sub-dam HDA6 can be disposed on the fifth sub-dam HDA5 and can comprise the same material as the dam 190. The seventh sub-dam HDA7 can be disposed on the sixth sub-dam HDA6 and can comprise the same material as the spacer 191, but the material is not limited thereto.

[0145] Since the light-emitting layer 172 and the common electrode 173 break in each of the first-first groove GR11, the first-second groove GR12, the first-third groove GR13 and the first-fourth groove GR14 formed from the first tip T1 to the eighth tip T8, the light-emitting layer 172 and the common electrode 173 can be prevented from becoming a path for oxygen or moisture to permeate through them.

[0146] Let's refer to each other. Figure 3 In one embodiment, the organic planarization layer may be disposed on the encapsulation layer ENC. By including the organic planarization layer, the polarizing film PF can be easily attached to the display device 10 via the organic planarization layer (see...). Figure 1 On the surface of ).

[0147] The organic planarization layer can be formed from organic layers such as acrylic resin layers, epoxy resin layers, phenolic resin layers, polyamide resin layers, and polyimide resin layers. For example, the organic planarization layer can comprise the same materials as the second sensor insulating film TINS2 described above, and can be formed simultaneously using the same process.

[0148] Figure 11 yes Figure 8 A close-up view of area L. Figure 12 It shows along Figure 11 A cross-sectional view of an example display panel taken by line Y-Y'. The same reference numerals are used for the same components having substantially the same function as those in the above embodiments, and redundant descriptions thereof are omitted.

[0149] refer to Figure 11 and Figure 12 Multiple block structures BS can be set in the second inorganic packaging region IEA2. Each block structure in the multiple block structures BS can be surrounded by one or more second recesses GR2. For example, in Figure 11 In the example shown, each block structure BS is surrounded by a second groove GR2 on all four sides, with the second groove GR2 located on one of the four sides. Various embodiments and modifications relating to the shape of the second groove GR2 and the shape of the block structure BS will be described below.

[0150] refer to Figure 12 The first dummy pattern DP1 may contain the same material as the second gate metal layer including the second capacitor electrode CAE2 (including capacitor Cst) and may be disposed on the same layer. The second dummy pattern DP2 may contain the same material as the first data metal layer including the first connection electrode CE1 and the data line and may be disposed on the same layer. The second dummy pattern DP2 may overlap with the first dummy pattern DP1 in a third direction (e.g., the Z-axis direction).

[0151] The first tip BT1 to the sixth tip BT6 may contain the same material as the second data metal layer including the second connecting electrode CE2, and may be disposed on the same layer. For example, the first tip BT1 to the sixth tip BT6 may be disposed on the first organic film 160. Each of the first tip BT1 to the sixth tip BT6 may be connected to the second dummy pattern DP2 through a contact hole penetrating the first organic film 160.

[0152] Each of the first tip BT1 to the sixth tip BT6 may include an overhanging structure in which the top and bottom surfaces of each of the first tip BT1 to the sixth tip BT6 are exposed and not covered by the first organic film 160, the second organic film 180, and the plurality of block structures BS2 and BS3. For example, the plurality of block tips may be integrally formed. Each of the first tip BT1 to the sixth tip BT6 may be a protruding pattern or groove pattern for forming a recess (or trench). The sixth tip BT6 may be the outermost structure adjacent to the edge TEG of the via TH. As illustrated, the sixth tip BT6 is exemplified as the outermost structure adjacent to the edge TEG of the via TH, but embodiments of the present disclosure are not limited thereto. For example, when the fifth tip BT5 and the sixth tip BT6 are omitted, the outermost structure adjacent to the edge TEG of the via TH may be the fourth tip BT4. Alternatively, the outermost structure may be a recess (e.g., a second-second recess GR22 or a second-third recess GR23) for breaking the light-emitting layer residue 172_D and the common electrode residue 173_D.

[0153] In some examples, the distance from the sixth tip BT6 to the edge TEG of the via TH can be approximately 300 μm.

[0154] The second-first groove GR21 can be formed between the first tip BT1 and the second tip BT2; the second-second groove GR22 can be formed between the third tip BT3 and the fourth tip BT4; the second-third groove GR23 can be formed between the fifth tip BT5 and the sixth tip BT6; and the second-fourth groove GR24 can be formed between the sixth tip BT6 and the through hole TH. The second-first groove GR21 can have an eave structure formed by the first tip BT1 and the second tip BT2; the second-second groove GR22 can have an eave structure formed by the third tip BT3 and the fourth tip BT4; and the second-third groove GR23 can have an eave structure formed by the fifth tip BT5 and the sixth tip BT6.

[0155] Since the light-emitting layer residue 172_D is deposited by evaporation and the common electrode residue 173_D is deposited by sputtering, the light-emitting layer residue 172_D and the common electrode residue 173_D can be configured to break at each of the second-first groove GR21, the second-second groove GR22, and the second-third groove GR23 due to low step coverage. In contrast, the first encapsulating inorganic film TFE1 and the second encapsulating inorganic film TFE3 can be deposited by chemical vapor deposition or atomic layer deposition, and therefore can be formed as continuous without breaking at each of the second-first groove GR21, the second-second groove GR22, and the second-third groove GR23 due to high step coverage. Step coverage refers to the ratio of the thickness of the film coated on the inclined portion to the thickness of the film coated on the flat portion. The broken light-emitting layer residue (or first residue) 172_D and the broken common electrode residue (or second residue) 173_D can be disposed in each of the second-first groove GR21, the second-second groove GR22, the second-third groove GR23, and the second-fourth groove GR24. The second groove GR2 can accommodate the light-emitting layer residue (or first residue) 172_D and the common electrode residue (or second residue) 173_D disposed on the light-emitting layer residue (or first residue) 172_D. The second groove GR2 can also accommodate the encapsulation layer ENC disposed on the common electrode residue (or second residue) 173_D (see Figure 3 ).

[0156] Continue to refer to Figure 12Multiple block structures BS may include a first block structure BS1, a second block structure BS2, a third block structure BS3, and a fourth block structure BS4. The first block structure BS1 may include multiple sub-block structures SBS. The second block structure BS2 may include multiple sub-block structures comprising the first sub-block structure SBS1, the second sub-block structure SBS2, the third sub-block structure SBS3, and the fourth sub-block structure SBS4. Although the second block structure BS2 in the depicted embodiment includes only four sub-block structures SBS1, SBS2, SBS3, and SBS4, the embodiments of this disclosure are not limited thereto. For example, the second block structure BS2 may include two sub-block structures, similar to the fourth block structure BS4.

[0157] The first sub-block structure SBS1 can be disposed on the first organic membrane 160, and can be disposed with the second organic membrane 180 (see [link]). Figure 10 The same material is included. The first sub-block structure SBS1 can be disposed on the second tip BT2 and the third tip BT3. The second sub-block structure SBS2 can be disposed on the first sub-block structure SBS1 and can be connected to the embankment 190 (see...). Figure 10 The same materials are included. The third sub-block structure SBS3 and the fourth sub-block structure SBS4 can be disposed on the second sub-block structure SBS2 and can be used with the spacer 191 described above (see...). Figure 10 The fourth sub-block structure SBS4 may be configured to be closer to the through-hole TH than the third sub-block structure SBS3. The thickness of the fourth sub-block structure SBS4 may be the same as the thickness of the third sub-block structure SBS3, but the embodiments contemplated in this disclosure are not limited thereto.

[0158] The fourth block structure BS4 may include multiple sub-block structures, including a fifth sub-block structure SBS5 and a sixth sub-block structure SBS6. Although the fourth block structure BS4 in the depicted embodiment includes only two sub-block structures SBS5 and SBS6, the embodiments contemplated in this disclosure are not limited thereto. For example, the fourth block structure BS4 may include four sub-block structures, similar to the second block structure BS2.

[0159] The fifth sub-block structure SBS5 can be disposed on the first organic membrane 160 and can comprise the same material as the second organic membrane 180. The fifth sub-block structure SBS5 can be disposed on the sixth tip BT6. The sixth sub-block structure SBS6 can be disposed on the fifth sub-block structure SBS5 and can comprise the same material as the embankment 190.

[0160] The second width GRW2 of the second grooves GR21, GR22, GR23, and GR24 can be determined by the width and shape of the sub-block structures included in the block structure BS. As described above, when the second width GRW2 is sufficiently small, the adhesive strength between the first encapsulation inorganic film TFE1 and the underlying assembly (e.g., the first organic film 160 and the interlayer insulating films 141 and 142) can be enhanced. The process for enhancing the adhesive strength will be described below.

[0161] When the width between the block structures BS is small enough, it can prevent the encapsulated inorganic films TFE1 and TFE3 from peeling off the second protective film PRF2 (see...). Figure 4 The process is separated from the underlying components during the stripping process. Furthermore, the first inorganic packaging region IEA1 (see [link to IEA1]) has a relatively low priority during the stripping process. Figure 8 Components set in the display area DA (see [reference]) can remain unaffected. Therefore, the advantage of these features is that they enhance the protection of components set in the display area DA (see [reference]). Figure 7 Protection of pixels in ).

[0162] The light-emitting layer residue 172_D, the common electrode residue 173_D, the first encapsulation inorganic film TFE1, and the second encapsulation inorganic film TFE3 can extend to the edge TEG of the through-hole TH. For example... Figure 12 As shown, the ends of the light-emitting layer residue 172_D, the ends of the common electrode residue 173_D, the ends of the first encapsulated inorganic film TFE1, and the ends of the second encapsulated inorganic film TFE3 can coincide with the edge TEG of the through hole TH.

[0163] Since the light-emitting layer residue 172_D and the common electrode residue 173_D break in each of the second-first groove GR21, the second-second groove GR22, and the second-third groove GR23 formed by the first tip BT1 to the sixth tip BT6, it is possible to prevent the light-emitting layer residue 172_D and the common electrode residue 173_D exposed to the through hole TH from becoming suitable for the oxygen and moisture permeation display device 10 (see...). Figure 1 The path of ).

[0164] In one embodiment, the encapsulated organic membrane TFE2 (see...) Figure 3 It may not exist in the second inorganic package region IEA2 (see...). Figure 8 In this arrangement, due to the dam configuration of the first inorganic encapsulation region IEA1, the encapsulation organic film TFE2 disposed in the first inorganic encapsulation region IEA1 can be prevented from overflowing toward the through-hole TH. Therefore, according to this embodiment, the encapsulation organic film TFE2 can be disposed only outside the second inorganic encapsulation region IEA2.

[0165] In one embodiment, refer to together Figure 3An organic planarization layer can be disposed on the encapsulation layer ENC. Due to the inclusion of the organic planarization layer, the polarizing film PF can be easily attached to the encapsulation layer ENC via the organic planarization layer. The organic planarization layer can be formed of organic layers such as acrylic resin layers, epoxy resin layers, phenolic resin layers, polyamide resin layers, and polyimide resin layers. For example, the organic planarization layer and the second sensor insulating film TINS2 described above (see...) Figure 3 They can include the same materials and can be formed simultaneously using the same process.

[0166] Figure 13 It is based on an example Figure 12 A close-up view of region N. Figure 14 and Figure 15 It is based on relative to Figure 13 Modified example Figure 12 A close-up view of region N. The reasons for enhancing the adhesive strength of the encapsulated inorganic films TFE1 and TFE3 using the described embodiments are explained below.

[0167] exist Figure 14 and Figure 15 In the second inorganic packaging region IEA2 (see...) Figure 8 The encapsulating organic membrane TFE2 is not set in the (see) Figure 3 Therefore, the second encapsulating inorganic film TFE3 can be directly disposed on the first encapsulating inorganic film TFE1. Thus, it can be referenced... Figure 13 The arrangement shape of the second encapsulated inorganic membrane TFE3 was obtained.

[0168] refer to Figure 13 A first-first organic film 161, a first-second organic film 162, and a first residue 172_D and a second residue 173_D disposed between the first-first organic film 161 and the first-second organic film 162 can be formed. Subsequently, encapsulating inorganic films TFE1 and TFE3 can be deposited on the residues 172_D and 173_D by chemical vapor deposition (CVD). In this step, the encapsulating inorganic films TFE1 and TFE3 can be formed to conform to the surface shape of the residues 172_D and 173_D, each having a thin thickness.

[0169] The encapsulation inorganic films TFE1 and TFE3 deposited on residues 172_D and 173_D are deposited such that the encapsulation inorganic films TFE1 and TFE3 have compressive stress, and preferably, have compressive stress values ​​in the range of about -500 MPa to 0 MPa, but in any case less than 0 MPa. At this time, for example, as... Figure 15As shown, compressive stress is used as a force in the direction of pushing the encapsulated inorganic films TFE1 and TFE3 toward the residues 172_D and 173_D, and in the direction of bending the encapsulated inorganic films TFE1 and TFE3 downward and away from the residues 172_D and 173_D on the respective opposite sides of the residues 172_D and 173_D (also referred to as horizontal pushing force) Fc below.

[0170] Under compressive stress outside the corresponding numerical range, the display device 10 (see...) Figure 1 The electrical properties of the encapsulated inorganic films TFE1 and TFE3 may be degraded due to the deterioration of the film quality, or dislocations due to excessive stress may occur at the interface between the upper part of the encapsulated inorganic films TFE1 and TFE3 and another film formed thereon. Furthermore, it may be difficult to form, for example, between the first organic film 161 and the first organic film 162 using only the deposition process of the encapsulated inorganic films TFE1 and TFE3. Figure 14 The raised portion indicated in the text is UP.

[0171] Furthermore, when the modulus (e.g., elastic modulus) of the encapsulated inorganic films TFE1 and TFE3 is less than the modulus of the first organic film 160, which includes the first organic film 161 and the first organic film 162, the first organic film 160 may have a greater stiffness or strength than the encapsulated inorganic films TFE1 and TFE3. Therefore, it may be difficult to generate compressive stress, repulsive force, or bulging by depositing only the encapsulated inorganic films TFE1 and TFE3. Thus, in this case, it is necessary to adjust the modulus values ​​so that the encapsulated inorganic films TFE1 and TFE3 have a greater modulus than the first organic films 161 and 162. The desired compressive stress or bulging phenomenon can be achieved between the first organic film 161 and the first organic film 162 by depositing only the encapsulated inorganic films TFE1 and TFE3.

[0172] When compressive stress is applied, a pushing (or repulsive) force is generated between inorganic materials as horizontally as possible, and as... Figure 13 As shown, the repulsive force Fs that pushes the lower regions of the first-first organic membrane 161 and the first-second organic membrane 162 (i.e., the lower regions of the relatively inclined surfaces 161a and 162a of the first-first organic membrane 161 and the first-second organic membrane 162) in the horizontal direction can be generated by the horizontal pushing force Fc at the two edges of the encapsulated inorganic membranes TFE1 and TFE3 deposited on the residues 172_D and 173_D.

[0173] In this way, when a repulsive force Fs is generated that horizontally pushes the lower regions of the relatively inclined surfaces 161a and 162a of the first-first organic film 161 and the first-second organic film 162, the encapsulation of inorganic films TFE1 and TFE3 relative to the first organic films 161 and 162 or the components arranged below them (e.g., interlayer insulating films 141 and 142, see below) can be enhanced. Figure 12 )) adhesive strength.

[0174] In one embodiment, the generation of the raised portion UP can be based on the display device 10 (see [reference]). Figure 1 The base SUB (see) Figure 12 The material of the substrate SUB varies. For example, when the substrate SUB is made of a rigid material, only repulsive forces may be generated. In other examples, when the substrate SUB is made of a flexible material, bulging may occur as will be described below, and raised portions UP and / or recessed portions DP may be generated. The following will describe the case where the substrate SUB is made of a flexible material and raised portions UP and / or recessed portions DP are generated, but the embodiments contemplated in this disclosure are not limited thereto.

[0175] refer to Figure 14 A counterclockwise torque can be generated in the lower region of the first organic membrane 161, and a clockwise torque can be generated in the lower region of the second organic membrane 162. Therefore, a raised portion UP can be formed.

[0176] Both the relatively inclined surfaces 161a of the first organic film 161 and the relatively inclined surfaces 162a of the first organic film 162 may include partially curved surfaces, and the portion of the first organic film 160 between the first organic film 161 and the first organic film 162 may include a raised portion UP having a convex curved surface in the thickness direction (e.g., the Z-axis direction).

[0177] like Figure 14 As shown, the recessed portion DP can be formed in the area where the lower region of the relatively inclined surface 161a of the first-first organic film 161 and the lower region of the relatively inclined surface 162a of the first-second organic film 162 meet the top surface of the raised portion UP existing between the first-first organic film 161 and the first-second organic film 162.

[0178] In one embodiment, the recessed portion DP may be defined by the opposing inclined surfaces 161a and 162a of the first organic films 161 and 162 and the top surface of the raised portion UP. Specifically, the recessed portion DP may be formed in the region where the lower regions of the opposing inclined surfaces 161a of the first organic film 161 and 162a of the first organic film 162 meet the respective ends of the top surface of the raised portion UP, and the recessed portion DP may include one side surface formed by the opposing inclined surfaces 161a and 162a of the first organic films 161 and 162 and another side surface formed by the top surface of the raised portion UP. The width between the one side surface and the other side surface of the recessed portion DP may decrease from the upper region of the recessed portion DP toward the lower region (i.e., toward the substrate SUB), and the one side surface and the other side surface of the recessed portion DP may overlap at the ends of the recessed portion DP.

[0179] Furthermore, the end of the recessed portion DP can be positioned at the same level as the top surface of the first organic film 160 outside the first organic films 161 and 162. However, the embodiments contemplated in this disclosure are not limited thereto.

[0180] The top surface of the raised portion UP can be positioned higher than the top surface of the first organic film 160 located outside the first organic films 161 and 162. Specifically, and as... Figure 14 As shown, for example, relative to the top surface of the first organic film 160 positioned outside the first organic films 161 and 162, the central portion of the top surface of the raised portion UP can be positioned at a first height h1, and the top surface of the raised portion UP adjacent to the recessed portion DP can be positioned at a second height h2. The first height h1 can be higher than the second height h2, and the first height h1 can be in the range of about 31.5 μm to about 52 μm, but the embodiments contemplated in this disclosure are not limited thereto. The raised portion UP may include a convex curved portion having a face facing one of the second groove GR2 (e.g., a second-first groove GR21, a second-second groove GR22, a second-third groove GR23, and a second-fourth groove GR24) (see...). Figure 12 A convex surface in an open space that is defined by the boundary.

[0181] Residues 172_D and 173_D, first encapsulation inorganic film TFE1 and second encapsulation inorganic film TFE3 (reference) Figure 13 They can be sequentially disposed on the surface of the first organic film 161, the surface of the first organic film 162, the surface of the raised portion UP, and in the recessed portion DP.

[0182] Residues 172_D and 173_D can be arranged along the surfaces of the first organic films 161 and 162 and the top surface of the raised portion UP. In this case, residues 172_D and 173_D can directly contact the top surface of the raised portion UP disposed between the first organic film 161 and the first organic film 162, and the residues 172_D and 173_D disposed on the top surface of the raised portion UP can include convex curved surfaces in the thickness direction.

[0183] The first encapsulation inorganic film TFE1 disposed on the top surface of the raised portion UP may include a top surface in contact with the second encapsulation inorganic film TFE3 and a bottom surface in contact with the residues 172_D and 173_D. The curvature of the top surface of the first encapsulation inorganic film TFE1 may be greater than the curvature of the bottom surface of the first encapsulation inorganic film TFE1, and the radius of curvature of the top surface of the first encapsulation inorganic film TFE1 may be smaller than the radius of curvature of the bottom surface of the first encapsulation inorganic film TFE1.

[0184] The first encapsulating inorganic membrane TFE1 can be disposed on the residues 172_D and 173_D. Specifically, the first encapsulating inorganic membrane TFE1 can be disposed on the top surface of the first organic membrane 160 and the relatively inclined surfaces 161a and 162a.

[0185] In some embodiments, residues 172_D and 173_D may not be present in the raised portion UP and at least a portion of the first organic membranes 161 and 162. In these arrangements, the first encapsulating inorganic membrane TFE1 may be in direct contact with at least one of the raised portion UP and the first organic membranes 161 and 162.

[0186] The second encapsulation inorganic film TFE3 can be disposed on the first encapsulation inorganic film TFE1, and a pointed portion protruding toward the recessed portion DP can be formed in the separation space between the first organic film 161 and the first organic film 162.

[0187] refer to Figure 15 The second groove GR2 will be described in more detail (see [link]). Figure 12 The behavior of the first encapsulated inorganic film TFE1 and the second encapsulated inorganic film TFE3 under bending stress. When bending stress is applied, a force causes the first encapsulated inorganic film TFE1 and the second encapsulated inorganic film TFE3 to be peeled off from the first organic films 161 and 162 and the raised portion UP, and this peeling force Fb is generally oriented in the vertical direction.

[0188] The horizontal pushing force Fc is typically generated by compressive stress between inorganic materials in the first encapsulation inorganic membrane TFE1 disposed on the top surface of the raised portion UP, and this in turn results in a repulsive force Fs pushing horizontally in opposite directions in the lower region between the first organic membrane 161 and the first organic membrane 162. For compressive stress to occur, the distance between the first organic membranes 161 and 162 can be sufficiently small.

[0189] In this way, a shear force caused by a strong repulsive force Fs can occur in the lower region of the relatively inclined surfaces 161a and 162a of the respective first-first organic film 161 and first-second organic film 162, thereby weakening the vertical peel force Fb. The shear force can be a resistance to the peel force Fb. For example, the shear force can enhance the adhesive strength of the first encapsulating inorganic film TFE1 relative to the first organic film 160.

[0190] In one embodiment, the outer inclined surface of the first encapsulating inorganic film TFE1 disposed on the relatively inclined surfaces 161a and 162a of the first organic films 161 and 162 covers the residues 172_D and 173_D, and the first encapsulating inorganic film TFE1 and the second encapsulating inorganic film TFE3 are positioned in the recessed portion DP disposed below the residues 172_D and 173_D, and can therefore be used as direct resistance to the peeling force Fb.

[0191] The residues 172_D and 173_D, the first encapsulation inorganic film TFE1 and the second encapsulation inorganic film TFE3 disposed in the recessed portion DP have a width in the thickness direction that decreases toward the lower region of the recessed portion DP (i.e., in the direction toward the substrate SUB), which can improve the adhesive strength between the residues 172_D and 173_D, the first encapsulation inorganic film TFE1 and the second encapsulation inorganic film TFE3, thereby inhibiting or preventing the encapsulation layer ENC from being peeled off from the recessed portion DP.

[0192] As a result, the peel force Fb can be weakened by increasing the resistance to the peel force Fb acting in the vertical direction, and the adhesive strength of the first encapsulation inorganic film TFE1 can be improved. Specifically, the adhesive strength between the first encapsulation inorganic film TFE1 and the residues 172_D and 173_D, as well as the adhesive strength between the first encapsulation inorganic film TFE1 and the second encapsulation inorganic film TFE3, can be improved.

[0193] Figure 16 It is based on an example Figure 8 A close-up view of area M. Figures 17 to 22 It is based on relative to Figure 16 Modified example Figure 8 A close-up view of the corresponding area M.

[0194] refer to Figure 16 Each block structure in the plurality of block structures BS may be surrounded by a plurality of second grooves GR2. In one embodiment, the plurality of second grooves GR2 may include second-fifth grooves GR25, second-sixth grooves GR26 and second-seventh grooves GR27 configured to extend in a second direction (e.g., the Y-axis direction) and second-eighth grooves GR28, second-ninth grooves GR29 and second-tenth grooves GR210 configured to extend in a first direction (e.g., the X-axis direction).

[0195] In one example of how a block structure BS is surrounded by a plurality of second grooves GR2, a block structure BS may be disposed between at least a portion of the second-fifth groove GR25 and at least a portion of the second-sixth groove GR26, which are opposite to each other. Furthermore, the same block structure BS may be disposed between at least a portion of the second-eighth groove GR28 and at least a portion of the second-ninth groove GR29, which are opposite to each other. Therefore, the block structure BS may be surrounded by the second-fifth groove GR25, the second-sixth groove GR26, the second-eighth groove GR28, and the second-ninth groove GR29.

[0196] In one embodiment, since a plurality of second grooves GR2 surround each of a plurality of block structures BS, the second-fifth grooves GR25, the second-sixth grooves GR26 and the second-seventh grooves GR27, which are configured to extend in a second direction (e.g., the Y-axis direction), can form second groove intersections with the second-eighth grooves GR28, the second-ninth grooves GR29 and the second-tenth grooves GR210, which are configured to extend in a first direction (e.g., the X-axis direction).

[0197] As described above, the first encapsulating inorganic film TFE1 with enhanced adhesive strength (see above) Figure 3 It can be set in the second groove GR2. Assuming that the combined area of ​​all the second grooves from the plurality of second grooves GR2 in the plan view is the same, as shown, since the block structure BS is divided into multiple smaller individuals, it can include a larger number of block structures BS with enhanced adhesive strength.

[0198] The principles of the described embodiments can be further applied as follows. With the second inorganic packaging region IEA2 (see...) Figure 8 The total number of block structures BS in ) increases, and the second width GRW2 of the second groove GR2 (see Figure 8 The size can be reduced, and the adhesive strength of the first encapsulated inorganic film TFE1 can be further enhanced.

[0199] refer to Figure 17The plurality of second grooves GR2 may include a second-eleventh groove GR211, a second-twelfth groove GR212, and a second-thirteenth groove GR213. Each of these grooves is configured to extend in a first-second direction D2 on the XY plane, but at an angle to both the first direction (e.g., the X-axis direction) and the second direction (e.g., the Y-axis direction). Furthermore, the second grooves GR2 may include a second-fourteenth groove GR214, a second-fifteenth groove GR215, and a second-sixteenth groove GR216. These grooves are configured to extend in a first-first direction D1, which is neither the first nor the second direction, among the directions intersecting the first-second direction D2.

[0200] refer to Figures 18 to 20 Each block structure in the multiple block structures BS can be formed as a combination of hexagonal, banana-shaped, or polygonal shapes (e.g., triangular, quadrilateral, or hexagonal shapes, etc.). The second recess GR2 can be formed to extend in various directions within the second inorganic packaging region IEA2.

[0201] refer to Figure 21 and Figure 22 The above embodiments can be combined or modified in various ways within the scope contemplated in this disclosure. For example, the second width GRW2 of the second groove GR2 surrounding one or more block structures BS can vary around a single block structure BS or between different block structures BS. The second width GRW2 may include a relatively small second-first width GRW21 and a relatively large second-first width GRW21. In some embodiments that include second grooves GR2 of different widths, a first encapsulating inorganic film TFE1 (see [link to documentation]) is disposed between the block structures BS having a second-first width GRW21. Figure 3 The adhesive strength of the first encapsulated inorganic film TFE1 disposed between the block structure BS having a second-second width GRW22 can be relatively enhanced. Conversely, the adhesive strength of the first encapsulated inorganic film TFE1 disposed between the block structure BS having a second-second width GRW22 may be relatively weakened.

[0202] In one embodiment, the block structure BS may be surrounded by a second groove GR2 having a second-first width GRW21 or a second-second width GRW22. The second-first width GRW21 may be smaller than the first groove GR1 (see...). Figure 8 The first width GRW1 (see) Figure 8In some examples, the second-second width GRW22 may be less than or equal to the first width GRW1 of the first groove GR1. In a subset of these examples, the second-second width GRW22 may be less than or equal to the first width GRW1 of each first groove GR1, wherein the first groove GR1 comprises a plurality of first grooves GR1. Any ranges that can be combined, joined, or derived based on this disclosure (such as the shape and width of the grooves and combinations thereof) are all included within the scope of this disclosure.

[0203] Figures 23 to 26 This is a cross-sectional view showing the process of a fixed block structure according to an embodiment of the present disclosure.

[0204] In one step, refer to Figure 23 Each of the first organic membrane 161, which is a portion protruding from the first organic membrane 160, and the first organic membrane 162 adjacent to the first organic membrane 161, can be configured to be spaced apart from each other. Since there is no external force in the lower region between the first organic membrane 161 and the first organic membrane 162, the first organic membrane 160 disposed between the first organic membrane 161 and the first organic membrane 162 can have a flat surface.

[0205] In some examples, the separation distance between the first organic membrane 161 and the first organic membrane 162 can be in the range of 0.1 μm to 10 μm. In a subset of these examples, the separation distance can be in the range of about 0.1 μm to about 8 μm. When the separation distance between the first organic membrane 161 and the first organic membrane 162 is not within the above range, no horizontal force is generated due to the compressive stress between the inorganic materials laminated between the first organic membrane 161 and the first organic membrane 162, and in this way, there is no external force that would otherwise act in the lower region of the first organic membrane 161 and the first organic membrane 162. In the absence of external force, the top surface of the first organic membrane 160 disposed between the first organic membrane 161 and the first organic membrane 162 remains unchanged and is in a flat state. However, in this case, repulsive forces, etc., also act, causing the first encapsulated inorganic membrane TFE1 (see Figure 26 The adhesive strength can still be relatively high.

[0206] In the following steps, refer to Figure 24 and Figure 25In one embodiment, after residues 172_D and 173_D are formed on the top surface between the first organic film 161 and the first organic film 162, and the first organic film 160, a first encapsulation inorganic film TFE1 is deposited on the residues 172_D and 173_D by chemical vapor deposition (CVD). In this step, the first encapsulation inorganic film TFE1 is formed with a small thickness to conform to the surface shape of the residues 172_D and 173_D.

[0207] The first encapsulating inorganic film TFE1 deposited on residues 172_D and 173_D has compressive stress when set, and preferably has a compressive stress value in the range of about -500 MPa to slightly below 0 MPa. Here, the compressive stress acts as a force Fc in the direction that pushes the first encapsulating inorganic film TFE1 in opposite directions along a portion of the first encapsulating inorganic film TFE1 between the first-first organic film 161 and the first-second organic film 162, and includes a force Fc in the direction that causes the first encapsulating inorganic film TFE1 to bend downwards.

[0208] When compressive stress acts in this manner, a force is generated between the inorganic materials that pushes as horizontally as possible, and this includes a repulsive force Fs that pushes the lower regions of the first-first organic film 161 and the first-second organic film 162 (i.e., the lower regions of the relatively inclined surfaces 161a and 162a of the first-first organic film 161 and the first-second organic film 162) in the horizontal direction. The repulsive force Fs can be generated by a horizontal pushing force Fc at the relative edges of the first encapsulated inorganic film TFE1 deposited on the residues 172_D and 173_D, and can act in opposite directions.

[0209] In this way, and as Figure 25 As shown, when a repulsive force Fs is generated that horizontally pushes the lower regions of the relatively inclined surfaces 161a and 162a of the first-first organic membrane 161 and the first-second organic membrane 162, a counterclockwise torque Fq_1 can be generated in the lower region of the first-first organic membrane 161, and a clockwise torque Fq_2 can be generated in the lower region of the first-second organic membrane 162.

[0210] In the following steps, refer to Figure 26The counterclockwise torque Fq_1 generated in the lower region of the first organic film 161 and the clockwise torque Fq_2 generated in the lower region of the first organic film 162 can be used as a force Fu. Force Fu causes the central portion of the top surface of the first organic film 160 disposed between the first organic film 161 and the first organic film 162 to bulge in the thickness direction, while simultaneously overlapping with the central portion of the top surface of the first organic film 160 disposed between the first organic film 161 and the first organic film 162. Therefore, by generating these forces, the bulge UP can be formed.

[0211] As described above, the resulting raised portion UP, recessed portion DP, and shear force can help improve the adhesion strength between the first encapsulated inorganic film TFE1 and the residues 172_D and 173_D, as well as the adhesion between the first encapsulated inorganic film TFE1 and the second encapsulated inorganic film TFE3 (see above). Figure 13 The adhesive strength between )

[0212] The display device contemplated in this disclosure according to embodiments can be applied to various electronic devices. An electronic device according to one embodiment may include any of the display devices described above or otherwise contemplated, and may include modules or devices with additional functions in addition to the display device.

[0213] Figure 27 This is a block diagram of an electronic device according to an embodiment of the present disclosure. Figure 28 These are schematic diagrams of various electronic devices according to various embodiments of the present disclosure.

[0214] refer to Figure 27 According to some embodiments, the electronic device 10A may include a display module 11, a processor 12, a memory 13, and a power module 14.

[0215] The processor 12 may include at least one of a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller.

[0216] The memory 13 can store the data information required for the operation of the processor 12 or the display module 11. When the processor 12 executes the application program stored in the memory 13, image data signals and / or input control signals are transmitted to the display module 11, and the display module 11 can process the received signals and output image information through the display screen.

[0217] The power module 14 may include a power module such as a power adapter or battery device. The power module 14 may also include a power conversion module. The power conversion module can convert the power supplied by the power module to generate the power required for the operation of the electronic device 10A.

[0218] At least one of the components of the electronic device 10A described above may be included in the display device according to the embodiment described above. Furthermore, some modules that are functionally included in a single module may be included in the display device, and some other modules may be provided separately from the display device. For example, the display device may include a display module 11, while the processor 12, memory 13, and power module 14 may be provided as other devices in the electronic device 10A besides the display device.

[0219] refer to Figure 28 The display device according to the embodiments of the present disclosure (e.g., Figure 1 The display device 10 can be applied to various electronic devices, including electronic devices for displaying images such as smartphones 10_1a, tablet PCs 10_1b, laptop computers 10_1c, televisions (TVs) 10_1d, and desktop monitors 10_1e. Furthermore, the display device according to embodiments of this disclosure can be applied to various electronic devices, including wearable electronic devices including display modules such as smart glasses 10_2a, head-mounted displays 10_2b, or smartwatches 10_2c, or vehicle electronic devices including display modules such as central information displays (CIDs) placed on the dashboard, center console, and instrument panel of a car, and rearview mirror displays.

[0220] Although embodiments of the present disclosure have been described above with reference to the accompanying drawings, it will be understood by those skilled in the art to which this disclosure pertains that the present disclosure may be practiced in other specific forms without altering the technical concept or essential characteristics of the present disclosure. Therefore, it should be understood that the embodiments described above are exemplary in all respects and are not intended to be limiting.

Claims

1. A display device, wherein, The display device includes: Base; Multiple pixels are disposed on the substrate in the display area; Through-hole, penetrating the substrate; Multiple first grooves surround the through hole; Multiple block structures are disposed between the multiple first grooves and the through holes; and The second groove surrounds the plurality of block structures.

2. The display device according to claim 1, wherein, Each of the plurality of pixels includes: First electrode; A light-emitting layer is disposed on the first electrode; and The second electrode is disposed on the light-emitting layer, and The second groove accommodates: The first residue, which contains the same material as the light-emitting layer; and A second residue is disposed on the first residue, and the second residue contains the same material as the second electrode.

3. The display device according to claim 2, wherein, The second groove also accommodates an encapsulation layer disposed on the second residue.

4. The display device according to claim 3, wherein, The encapsulation layer comprises an inorganic film.

5. The display device according to any one of claims 1 to 4, wherein, The display device further includes a first organic film disposed on the substrate. The plurality of block structures are disposed on the first organic membrane and include a first block structure and a second block structure that are adjacent to each other along one direction.

6. The display device according to claim 5, wherein, The first block structure includes a first sub-block structure and a second sub-block structure disposed on the first sub-block structure.

7. The display device according to claim 5, wherein, The second groove is located between the first structure and the second structure, and In the second groove, the first organic membrane comprises: A pair of relatively inclined surfaces; and The raised portion, between the pair of opposing inclined surfaces, has a convex curved portion having a convex surface facing the open space defined by the second groove.

8. The display device according to claim 5, wherein, The second groove also accommodates an encapsulation layer, the encapsulation layer comprising an encapsulating inorganic film, and The elastic modulus of the encapsulated inorganic film is greater than that of the first organic film.

9. The display device according to claim 1, wherein, In the plan view of the substrate, each of the plurality of first grooves has a closed shape, which is a closed curve shape.

10. A display device, wherein, The display device includes: Base; Multiple pixels are disposed on the substrate in the display area; Through-hole, penetrating the substrate; A first groove surrounds the through hole, the first groove being arranged between the first dam and the second dam and having a first width; Multiple block structures are disposed between the first groove and the through hole, the multiple block structures including a first block structure and a second block structure; and The second groove is arranged between the first structure and the second structure and has a second width. Wherein, the first width is greater than the second width.

11. The display device according to claim 10, wherein, Each of the plurality of pixels includes: First electrode; A light-emitting layer is disposed on the first electrode; and The second electrode is disposed on the light-emitting layer, and The second groove accommodates: The first residue, which contains the same material as the light-emitting layer; and A second residue is disposed on the first residue, and the second residue contains the same material as the second electrode.

12. The display device according to claim 11, wherein, The second groove also accommodates an encapsulation layer disposed on the second residue.

13. The display device according to claim 12, wherein, The encapsulation layer includes an inorganic film.

14. The display device according to any one of claims 10 to 13, wherein, The display device further includes a first organic film disposed on the substrate. The plurality of block structures are disposed on the first organic membrane and include a first block structure and a second block structure that are adjacent to each other along one direction.

15. The display device according to claim 14, wherein, The first block structure includes a first sub-block structure and a second sub-block structure disposed on the first sub-block structure.

16. The display device according to claim 14, wherein, The second groove is located between the first structure and the second structure, and In the second groove, the first organic membrane comprises: A pair of relatively inclined surfaces; and The raised portion, between the pair of opposing inclined surfaces, has a convex curved portion having a convex surface facing the open space defined by the second groove.

17. The display device according to claim 14, wherein, The second groove also accommodates an encapsulation layer, the encapsulation layer comprising an encapsulating inorganic film, and The elastic modulus of the encapsulated inorganic film is greater than that of the first organic film.

18. The display device according to claim 10, wherein, In the plan view of the substrate, the first groove has a closed shape, which is a closed curve shape.

19. The display device according to claim 10, wherein, The second groove is one of a plurality of second grooves arranged such that two or more of the plurality of second grooves surround each of the plurality of block structures.

20. An electronic device, wherein, The electronic device includes: The display device according to any one of claims 1 to 19; and A power module is configured to supply power to the display device.

Images