Display device

Abstract

A display device according to one embodiment of the present application can include a first substrate including a plurality of sub-pixels, a second substrate disposed on one side of the first substrate and including a pad portion, a bending portion connecting the first substrate and the second substrate, an etching stop layer disposed in the bending portion, an upper planarization layer disposed on the etching stop layer, a plurality of connection lines disposed on the upper planarization layer, and a first barrier pattern overlapping the plurality of connection lines and disposed between the etching stop layer and the upper planarization layer.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2024-0172476, filed on November 27, 2024, the entire disclosure of which is incorporated herein by reference. Technical Field

[0003] The present invention relates to a display device, and more specifically, to a display device capable of preventing damage to a structure disposed in a curved portion. Background Technology

[0004] As we enter a fully mature information age, the field of display devices that can visually display electrical information signals is developing rapidly. Therefore, continuous research is being conducted on various display devices to develop performance characteristics such as thin form factor, light weight, and low power consumption.

[0005] Specific examples of display devices may include liquid crystal display devices (LCD), organic light-emitting display devices (OLED), quantum dot display devices, etc.

[0006] To enhance aesthetic appeal and usability for users, display devices are being designed in various ways to reduce the area of ​​non-display regions where images are not displayed. Among these approaches, research is underway into using flexible materials to fold or bend various parts of the display device. Summary of the Invention

[0007] An etching process to remove the substrate can be performed in the bent portion of the display device to reduce the stress applied to the substrate during bending. Lines disposed in the bent portion can expand due to fumes or gases generated by the etchant during the etching process, potentially leading to problems such as reduced reliability and short circuits. Therefore, the present invention provides a display device capable of blocking fumes from the etchant that guides the lines.

[0008] The present invention provides a display device that can prevent damage to components disposed in a curved portion of a curved area serving as a display device.

[0009] The present invention provides a display device that can minimize cracks caused by stress at the bonding surface between a first substrate and a second substrate and at the etch stop layer on the first substrate and the second substrate during bending.

[0010] The objectives of the embodiments of the present invention are not limited to those described above, and other objectives not mentioned will be clearly understood by those skilled in the art from the following description.

[0011] A display device according to one embodiment of the present invention includes: a first substrate including a plurality of sub-pixels; a second substrate disposed on one side of the first substrate and including pad portions; a bent portion connecting the first substrate and the second substrate; an etch stop layer disposed in the bent portion; an upper planarization layer disposed on the etch stop layer; a plurality of connecting lines disposed on the upper planarization layer; and a first blocking pattern overlapping the plurality of connecting lines and disposed between the etch stop layer and the upper planarization layer. Attached Figure Description

[0012] The accompanying drawings illustrate preferred embodiments of the invention and, together with the detailed description of the invention provided below, serve to further understand the technical concept of the invention. Therefore, the invention should not be construed as limited to the details described in these drawings, in which:

[0013] Figure 1 This is a schematic diagram of a display device according to an embodiment of the present invention;

[0014] Figure 2 It is according to the first embodiment of the present invention. Figure 1 An enlarged plan view of region A in the image;

[0015] Figure 3 It is along Figure 2 A cross-sectional view taken from line I-I' in the diagram;

[0016] Figure 4 It is along Figure 2 A cross-sectional view taken from line II-II' in the diagram;

[0017] Figure 5 It is shown Figure 3 A cross-sectional view of the modified example;

[0018] Figure 6A and Figure 6B This is a view showing the material structure of the connecting lines and the first blocking pattern of the display device of the present invention;

[0019] Figure 7 It is according to the second embodiment of the present invention. Figure 1 An enlarged plan view of region A in the image;

[0020] Figure 8 It is along Figure 7 A cross-sectional view taken from line III-III' in the diagram;

[0021] Figure 9 This is according to the third embodiment of the present invention. Figure 1 An enlarged plan view of region A in the image;

[0022] Figure 10 It is along Figure 9 A cross-sectional view taken from line IV-IV' in the diagram;

[0023] Figure 11A It is shown Figure 10 A cross-sectional view of the modified example;

[0024] Figure 11B It is shown that it is used for Figure 11A A cross-sectional view of a portion of the etching process of the structure;

[0025] Figure 12 This is according to the fourth embodiment of the present invention. Figure 1 An enlarged plan view of region A in the image;

[0026] Figure 13 It is along Figure 12 A cross-sectional view taken from line V-V' in the diagram;

[0027] Figure 14A It is shown Figure 13 A cross-sectional view of the modified example;

[0028] Figure 14B It is shown that it is used for Figure 14A A cross-sectional view of a portion of the etching process of the structure;

[0029] Figure 15 It is according to the fifth embodiment of the present invention. Figure 1 An enlarged plan view of region A in the image;

[0030] Figure 16 It is along Figure 15 A cross-sectional view taken from line VI-VI' in the diagram;

[0031] Figure 17 It is along Figure 15 A cross-sectional view taken from line VII-VII' in the diagram;

[0032] Figure 18A This is a cross-sectional view of the bent portion according to the sixth embodiment of the present invention;

[0033] Figure 18B This is according to the sixth embodiment of the present invention. Figure 1 A cross-sectional view of region C in the diagram;

[0034] Figures 19A to 19D This is the process diagram for the sixth embodiment;

[0035] Figure 20 This is a schematic cross-sectional view showing the bent state of a display panel according to an embodiment of the present invention. Detailed Implementation

[0036] The advantages and features of the present invention, and its implementation methods, will become clear from the following detailed description of the embodiments with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described below, but can be implemented in various different modifications. The embodiments are provided merely to allow those skilled in the art to fully understand the scope of the invention.

[0037] The shapes, dimensions, ratios, angles, quantities, etc., disclosed in the accompanying drawings used to illustrate embodiments of the present invention are merely examples and are not limited to the details shown in the present invention. Throughout the present invention, similar reference numerals denote similar elements. Furthermore, in describing the present invention, detailed descriptions of well-known technologies are omitted where it is determined that such descriptions would unnecessarily obscure the subject matter of the invention. Terms such as “comprising,” “having,” and “including” as used herein are intended to allow for the addition of additional elements unless these terms are used in conjunction with the term “only.” Unless otherwise expressly stated, any reference to the singular may include the plural.

[0038] The components are interpreted to include a normal error range, even without explicit statements regarding this margin.

[0039] In describing positional relationships, such as when using terms like "on," "above," "below," or "next" to describe the positional relationship between two parts, one or more other parts may be inserted between them, unless the expression uses terms such as "exactly," "directly," or "immediately after."

[0040] When describing time relationships, discontinuous situations may be included when the time relationship is described as "after", "following", "next", "before", etc., unless the terms "immediately" or "directly" are used in the expression.

[0041] This document may use the terms "first," "second," etc., to describe various components, but the components are not limited by these terms. These terms are only used to distinguish components from one another. Therefore, the first component described below may be the second component within the technical scope of this invention.

[0042] When describing the components of the present invention, terms such as first, second, A, B, (a), (b), etc., may be used herein. These terms are used only to distinguish one component from another, but do not limit the nature, order, sequence, number, etc. of the components.

[0043] It will be understood that when a component is described as “connected,” “joined,” “linked,” or “attached” to another component, that component may be directly connected, joined, linked, or attached to the other component, but another component may also be inserted between the two components to make them indirectly connected, joined, linked, or attached, unless otherwise specifically stated.

[0044] It will also be understood that when a component or layer is described as “overlapping” with another component or layer, the component or layer may be in direct contact with or directly overlap with the other component or layer, but another component or layer may also be inserted between the two components or layers so that they overlap indirectly with each other, unless otherwise specifically stated.

[0045] The term "at least one" should be understood to include any and all combinations of one or more of the associated listed components. For example, "at least one of the first, second, and third components" means a combination of all components proposed from two or more of the first, second, and third components, as well as the first, second, or third component.

[0046] The terms “first direction,” “second direction,” “third direction,” “X-axis direction,” “Y-axis direction,” and “Z-axis direction” should not be interpreted as referring only to geometric relationships that are perpendicular to each other, but can represent a wider range of directions within the functional scope of the construction described in this invention.

[0047] Features of the various embodiments of the present invention can be combined partially or completely with each other. The embodiments can be technically connected and operated in various ways, and can be implemented independently or in conjunction with each other.

[0048] In the following, various embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0049] Figure 1 This is a schematic diagram of a display device according to an embodiment of the present invention.

[0050] Reference Figure 1 The display device of the present invention may include a first substrate SUB1 and a second substrate SUB2 spaced apart from each other, wherein the curved portion BA between them is in a flat state (i.e., the state before bending). The first substrate SUB1 may include a first substrate region, and the second substrate SUB2 may include a second substrate region. For example, a flexible display device may include a first substrate region and a second substrate region. The first substrate SUB1 may include a plurality of sub-pixels PXL, and the second substrate SUB2 may include a pad portion PAD.

[0051] According to one embodiment, the display device of the present invention may include: a plurality of sub-pixels disposed in a first substrate region; at least one pad portion PAD disposed in a second substrate region; an etch stop layer 160 disposed in a bending region located between the first substrate region and the second substrate region; a plurality of connecting lines 130 disposed on the etch stop layer 160, wherein at least one of the plurality of sub-pixels is electrically connected to at least one pad portion PAD via at least one of the plurality of connecting lines 130; and a first blocking pattern 125 disposed between at least one of the plurality of connecting lines 130 and the etch stop layer 160.

[0052] According to one embodiment, the display device of the present invention may include: a first substrate SUB1 including a plurality of sub-pixels; a second substrate SUB2 configured to face the first substrate SUB1; a functional member SL disposed between the first substrate SUB1 and the second substrate SUB2; an etch stop layer L1 disposed in a bend for connecting the first substrate SUB1 and the second substrate SUB2; a planarization layer L2 disposed on the etch stop layer L1; a plurality of connection lines ES disposed on the planarization layer L2; and one or more first blocking patterns SD overlapping at least one of the plurality of connection lines ES.

[0053] The first substrate SUB1 can be divided into a display area AA in which an image is displayed and a non-display area NA in which no image is displayed, and a plurality of sub-pixels PXL can be repeatedly disposed in the first substrate SUB1.

[0054] Multiple sub-pixels PXL can be defined by intersecting gate lines and data lines and formed in a matrix on substrate SUB1. Each sub-pixel in the multiple sub-pixels PXL can be formed by a light-emitting portion and a non-light-emitting portion, wherein the light-emitting portion is the area that actually emits light and the non-light-emitting portion is the area that does not emit light around the light-emitting area.

[0055] The second substrate SUB2 can be classified as a non-display area NA and may include pads (PADs). Various lines and drive circuits can be provided on the second substrate SUB2, and pads (PADs) that connect to integrated circuits, printed circuits, etc., can be provided.

[0056] The pad portion PAD can be electrically connected to the connection line ES connected to the first substrate SUB1. Furthermore, the pad portion PAD can be connected to a flexible printed circuit board (FPCB) outside the second substrate SUB2. However, the display device of the present invention is not limited thereto.

[0057] The display panel of the present invention can be manufactured based on a glass substrate. The first substrate SUB1 and the second substrate SUB2 can be formed of insulating or flexible materials, but the present invention is not limited thereto. For example, the first substrate SUB1 and the second substrate SUB2 can be made of glass, metal, plastic, etc. For example, a glass substrate with a certain strength can be used as the first substrate SUB1 and the second substrate SUB2. Since the first substrate SUB1 and the second substrate SUB2 are made of glass substrates, and various etched patterns can be formed simultaneously using a mask, the process can be simplified.

[0058] A bend BA may be disposed between a first substrate SUB1 and a second substrate SUB2. The first substrate SUB1 and the second substrate SUB2 may be disposed on opposite sides of the bend BA relative to the bending direction. The edge of the bend BA may overlap with a portion of each of the first substrate SUB1 and the second substrate SUB2. Therefore, the first substrate SUB1 may include a front surface portion FA of a region that does not overlap with the bend BA. The second substrate SUB2 may include a rear surface portion RFA of a region that does not overlap with the bend BA.

[0059] The second substrate SUB2 may be disposed on one side of the first substrate SUB1 and may be connected to the first substrate SUB1 via the bending portion BA. The rear surface portion RFA may be disposed on one side of the front surface portion FA and may be connected to the front surface portion FA via the bending portion BA.

[0060] When the panel is bent, since the front surface portion FA and the rear surface portion RFA can overlap each other, the first substrate SUB1 and the second substrate SUB2 can be configured to face each other with a bend BA between them. However, the invention is not limited to this. For example, when the panel is bent, the front surface portion FA and the rear surface portion RFA may not face each other, and the first substrate SUB1 and the second substrate SUB2 may be configured to face each other without having a bend BA between them.

[0061] Multiple connection lines ES can be disposed in the bend BA. The multiple connection lines ES can be configured to transmit signals from the pad portion PAD of the second substrate SUB2 to multiple sub-pixels PXL of the first substrate SUB1. In the figures, each connection line ES is shown as a straight line in the bending direction of the bend BA, but the invention is not limited thereto. For example, the multiple connection lines ES can be formed as a partial bend or an oblique line in the bending direction of the bend BA.

[0062] Figure 2 It is according to the first embodiment of the present invention. Figure 1 An enlarged plan view of region A in the image. Figure 3 It is along Figure 2 A cross-sectional view taken from line I-I' in the diagram. Figure 4 It is along Figure 2 The cross-sectional view taken from line II-II' in the diagram.

[0063] A display device according to one embodiment includes: a first substrate 11 including a plurality of sub-pixels PXL; a second substrate 12 disposed on one side of the first substrate 11 or facing the first substrate 11 and including pad portions 20; a bending portion BA connecting the first substrate 11 and the second substrate 12; an etch stop layer 160 disposed in the bending portion BA; a planarization layer (upper planarization layer 170) disposed on the etch stop layer 160; a plurality of connecting lines 130 disposed on the planarization layer (upper planarization layer 170); and a first blocking pattern 125 overlapping the plurality of connecting lines 130 and disposed between the etch stop layer 160 and the planarization layer 170.

[0064] Reference Figure 2 A display device according to the first embodiment can be configured such that each first blocking pattern 125 overlaps with at least one connecting line 130. (See also...) Figure 4 The first blocking pattern 125 can be configured to correspond one-to-one with the connecting lines 130. The first blocking pattern 125 can overlap with multiple connecting lines 130 and can be spaced apart between the multiple connecting lines 130. The first blocking pattern 125 can overlap with the connecting lines 130 in the regions of at least the contact holes NCH1, NCH2, NCH3, and NCH4 that do not include the connecting lines 130. For example, the first blocking pattern 125 does not overlap with the contact holes NCH1, NCH2, NCH3, and NCH4, and can therefore be formed to be shorter than the length of the connecting lines 130 in the bending direction and wider than the width of the connecting lines 130. The first contact hole NCH1 and the second contact hole NCH2 can be provided on the first substrate SUB1, and the third contact hole NCH3 and the fourth contact hole NCH4 can be provided on the second substrate SUB2. For example, the first blocking pattern 125 can be spaced apart from the corresponding contact holes by a certain distance. For example, one or more first blocking patterns 125 may be disposed on the first substrate 11 between the first contact hole NCH1 and the second contact hole NCH2 and on the second substrate 12 between the third contact hole NCH3 and the fourth contact hole NCH4.

[0065] Reference Figure 3 In this invention, examples of organic light-emitting display devices (OLEDs) in various types of display devices are described. However, the invention is not limited thereto.

[0066] Reference Figure 3The display area AA may include a light-emitting element 90 in each of a plurality of sub-pixels PXL disposed on the first substrate 11 and at least one transistor Tr driving the light-emitting element 90. On the first substrate 11, various signal lines such as data signal lines and gate signal lines, as well as circuit elements including transistors such as switching thin-film transistors and driving thin-film transistors, capacitors, etc., may be formed for each sub-pixel. In this invention, for ease of description, only one arbitrary transistor Tr driving one light-emitting element 90 is shown; the display device of this invention may include at least one transistor Tr and / or more transistors, etc.

[0067] At least one transistor Tr may include: an active layer 30; a gate 41 overlapping with a channel region 35 of the active layer 30, with a gate insulating film inserted therebetween; and a source 51 and a drain 53 respectively connected to the source region 31 and the drain region 33 on both sides of the active layer 30.

[0068] The active layer 30 of transistor Tr may have source regions 31 and drain regions 33 on both sides, with a channel region 35 between them. Each of the source region 31 and drain region 33 may be formed of a semiconductor material implanted with n-type or p-type impurities. The channel region 35 overlapping with the gate 41 may be formed of a semiconductor material not implanted with n-type or p-type impurities.

[0069] The gate 41 of transistor Tr can overlap with the channel region 35 of active layer 30 of the same width, with a gate insulating film in between. For example, the gate 41 can be a single layer or multiple layers made of any one or more of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) and their alloys. Meanwhile, the gate insulating film can be made of inorganic insulating materials such as silicon oxide (SiOx) film, silicon nitride (SiNx) film, silicon nitride oxide (SiOxNy) film, or multiple films thereof.

[0070] Simultaneously, the light-blocking layer 21 on the first substrate 11 may overlap at least with the channel region 35 of the active layer 30 of the transistor Tr, and may be disposed below the active layer 30. The light-blocking layer 21 prevents external light from passing through the first substrate 11 and being transmitted to the transistor Tr. For example, the light-blocking layer 21 may be made of a single layer of a metallic material such as molybdenum (Mo), titanium (Ti), aluminum neodymium (AlNd), aluminum (Al), chromium (Cr), or alloys thereof, or may be formed into a multilayer structure using the aforementioned metallic materials.

[0071] The buffer film 30 on the light blocking layer 21 may cover the light blocking layer 21. For example, the buffer film 30 may be formed as a single-layer structure or a multi-layer structure of silicon oxide (SiOx) and / or silicon nitride (SiNx).

[0072] The interlayer insulating film 40 on the buffer film 30 may include source contact holes ACH3 and drain contact holes ACH4 that expose the source region 31 and drain region 33 of the active layer 30, respectively, and may cover the gate 41. For example, the interlayer insulating film 40 may be made of an inorganic insulating material. In this case, the interlayer insulating film 40 may be made of a single layer or multiple layers of silicon oxide (SiOx) film, silicon nitride (SiNx) film, and / or silicon nitride oxide (SiOxNy) film.

[0073] The source electrode 51 and drain electrode 53 may be disposed on the same layer as the interlayer insulating film 40. The source electrode 51 and drain electrode 53 are connected to the source region 31 and drain region 33 of the active layer 30 through source contact holes ACH3 and drain contact holes ACH4, respectively. For example, the source electrode 51 and drain electrode 53 may be made of a single layer of a metallic material such as molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), or alloys thereof, or may be formed into a multilayer structure using the aforementioned metallic materials.

[0074] The passivation layer 50 on the interlayer insulating film 40 can cover the transistor Tr. Therefore, the transistor Tr can be protected by the passivation layer 50. When the first lower planarization layer 161a is also used to protect the transistor Tr, the passivation layer 50 can be omitted. For example, the passivation layer 50 is an inorganic insulating film and can be made of a single layer or multiple layers of silicon oxide (SiOx) film, silicon nitride (SiNx) film and / or silicon nitride oxide (SiOxNx) film.

[0075] At least one planarization layer may be disposed on the passivation layer 50. At least one planarization layer may include one, two or more planarization layers. A display device according to one embodiment of the present invention may include a first lower planarization layer 161a, an etch stop layer 160 and a second lower planarization layer 161b as at least one planarization layer.

[0076] The first lower planarization layer 161a, the etch stop layer 160, and the second lower planarization layer 161b can be formed using the same mask and can be disposed on the same layer. The first lower planarization layer 161a, the etch stop layer 160, and the second lower planarization layer 161b can be formed to a thickness sufficient to planarize the surface steps of the upper portion of the transistor Tr, and can be formed of an organic insulating film. However, the invention is not limited thereto. For example, the first lower planarization layer 161a, the etch stop layer 160, and the second lower planarization layer 161b are organic insulating films and can be made of any of photo acrylic, polyimide, benzocyclobutene series resins, and acrylate series resins, and in some cases, can be formed of multiple layers.

[0077] The upper planarization layer 170 may be disposed on the first lower planarization layer 161a, the second lower planarization layer 161b, and the etch stop layer 160. The upper planarization layer 170 may be disposed on the first substrate 11, the bent portion BA, and the second substrate 12. That is, the upper planarization layer 170 may cover the first connecting electrode 61, the second connecting electrode 121, the third connecting electrode 123, and the first blocking pattern 125. The upper planarization layer 170 is an organic insulating film and may be made of any one of optical acrylic, polyimide, benzocyclobutene series resins, acrylate series resins, etc.

[0078] The first connecting electrode 61 may be disposed between the first lower planarization layer 161a and the upper planarization layer 170. The first connecting electrode 61 may be an electrode connecting at least one transistor Tr and the first electrode 91. For example, the first electrode 91 may contact the first connecting electrode 61 through a first contact hole ACH1 in the display area AA, and the first connecting electrode 61 may contact at least one transistor Tr through a second contact hole ACH2 in the display area AA. However, the display device of the present invention is not limited thereto. For example, two or more planarization layers may be disposed between the first electrode 91 and at least one transistor Tr, thus multiple connecting electrodes for connecting the first electrode 91 and at least one transistor Tr may be provided.

[0079] For example, the first connecting electrode 61 may be made of a single layer of a metallic material such as molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu) or alloys thereof, or may be formed as a multilayer structure using the aforementioned metallic materials.

[0080] A light-emitting element 90, comprising a stacked structure including a first electrode 91, an intermediate layer 93, and a second electrode 95, may be disposed on an upper planarization layer 170. When current supplied from a power supply line flows to the second electrode 95 and a high-voltage current is supplied from the transistor Tr to the first electrode 91, an electric field is formed between the first electrode 91 and the second electrode 95, and the light-emitting element 90 is driven to emit light from the intermediate layer 93. The light-emitting portion, which is the area from which light is emitted from the light-emitting element 90, may be the area exposed from the embankment 180, but the display device of the present invention is not limited thereto; the light-emitting portion may include the side surface and the top surface of the embankment 180 on which the intermediate layer 93 may be disposed.

[0081] The first electrode 91 may be disposed in each of the plurality of sub-pixels PXL and may be electrically connected to each transistor Tr. When the display device of the present invention is a top-emitting type, the first electrode 91 may be formed to have a higher reflectivity than the second electrode 95 in order to reflect light generated from the intermediate layer 93.

[0082] For example, the first electrode 91 may be formed as a multilayer structure comprising a transparent conductive film and an opaque conductive film with high reflectivity. The transparent conductive film of the first electrode 91 may be made of a material with a relatively high work function value (such as indium tin oxide (ITO) or indium zinc oxide (IZO)), and the opaque conductive film may be made of any one or more single layers or multiple layers of a material selected from the group consisting of silver (Ag), aluminum (Al), copper (Cu), molybdenum (Mo), titanium (Ti), nickel (Ni), chromium (Cr), tungsten (W), and their alloys. For example, the first electrode 91 may be formed as a structure in which a transparent conductive film, an opaque conductive film, and a transparent conductive film are stacked sequentially, or as a structure in which a transparent conductive film and an opaque conductive film are stacked sequentially.

[0083] The intermediate layer 93 on the first electrode 91 can be disposed on the entire display area AA of the first substrate 11. The intermediate layer 93 can be disposed on the first electrode 91 not covered by the embankment 180, as well as on the side surface and the top surface of the embankment 180. However, the present invention is not limited thereto.

[0084] Intermediate layer 93 may also represent a single stack of organic layers formed by multiple layers including a hole injection layer HIL, a hole transport layer HTL, a light-emitting layer EML, an electron transport layer ETL, and an electron injection layer EIL. In some cases, intermediate layer 93 may have a series structure comprising multiple stacks (a first stack and a second stack) and a charge generation layer CGL located between the stacks, each stack including a light-emitting layer. Furthermore, the series structure of intermediate layer 93 is not limited to a two-stack structure, and may be formed by multiple stacks such as three or more stacks.

[0085] The second electrode 95 on the intermediate layer 93 can be entirely disposed within the display area AA and facing the first electrode 91 (e.g., the intermediate layer 93 can be placed as a common layer spanning multiple sub-pixels). In some cases, the second electrode 95 can also be disposed in the non-display area NA to contact the circuitry portion in the non-display area NA. See reference. Figure 3 The second electrode 95 can contact the connecting line 130 through the opening of the embankment 180 in the non-display area NA.

[0086] When the display device of the present invention is a top-emitting type, the second electrode 95 may be made of a conductive layer of a transparent material. For example, the second electrode 95 may be made of a transparent conductive material such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0087] Simultaneously, the dam portion 180 may cover the edge of the first electrode 91 and may be disposed on the upper planarization layer 170. The dam portion 180 may include an opening exposing the first electrode 91 to a region for emitting light for the light-emitting element 90, and an opening or contact hole exposing the connecting wire 130 to a region for contact with the connecting wire 130. For example, the dam portion 180 may be made of organic materials such as polyimide, acrylate, benzocyclobutene series resins, etc.

[0088] Although not shown, the display device according to one embodiment of the present invention may further include an encapsulation layer on the embankment 180. The encapsulation layer may be formed of multiple layers. For example, the encapsulation layer may be formed in a structure in which inorganic films and organic films are alternately stacked. The inorganic films may consist of metal oxides, metal nitrides, metal carbides, and compounds thereof. For example, the inorganic films may include inorganic materials such as AlOx, TiO2, ZrO, SiOx, AlON, AlN, SiNx, SiOxNy, InOx, YbOx, etc. The organic films may include polymer-based materials. Polymer-based materials may include acrylic resins, epoxy resins, silicone resins, allyl resins, polyimides, and polyethylene.

[0089] The bend BA may be included in the non-display area NA. The bend BA may be any region of bending in the display device and may include one or more or fewer separation spaces between the first substrate 11 and the second substrate 12. In this invention, the bend BA may include all separation spaces between the first substrate 11 and the second substrate 12 that were in a flat state before bending. For example, the first substrate 11 and the second substrate 12 may be spaced apart from each other with the bend BA therebetween. However, the display device of this invention is not limited thereto. For example, according to another embodiment, the first substrate 11 and the second substrate 12 may be different regions of the same flexible substrate.

[0090] In one embodiment of the present invention, the curved portion BA may include a coating 101, an etch stop layer 160, a first blocking pattern 125, an upper planarization layer 170, a connecting line 130, and a dam 180. In one embodiment of the present invention, the non-display area NA located outside the curved portion BA, i.e., the non-display area NA adjacent to the curved portion BA, may include a first pad layer 111, a first lower planarization layer 161a, a second connecting electrode 121, an upper planarization layer 170, a dam 180, a connecting line 130, a first contact hole NCH1, and a second contact hole NCH2 located on the first substrate 11, and may include a second pad layer 113, a second lower planarization layer 161b, a third connecting electrode 123, an upper planarization layer 170, a dam 180, a connecting line 130, a third contact hole NCH3, and a fourth contact hole NCH4 located on the second substrate 12. For example, a conductive bridging structure may be formed above and around the side of the first blocking pattern 125. However, the display device of the present invention is not limited thereto.

[0091] The first pad layer 111 and the second pad layer 113 may be disposed in the region adjacent to the bent portion BA. The first pad layer 111 may be disposed on the first substrate 11, and the second pad layer 113 may be disposed on the second substrate 12. Specifically, the first pad layer 111 may be disposed between the first substrate 11 and the first lower planarization layer 161a, and the second pad layer 113 may be disposed between the second substrate 12 and the second lower planarization layer 161b.

[0092] The first pad layer 111 and the second pad layer 113 can be electrically connected via a connecting line 130. The second pad layer 113 can be electrically connected to the pad portion 20. Therefore, the first pad layer 111 and the second pad layer 113 can transmit signals or voltages from an external module bonded to the pad portion 20 to the display area AA or a circuit portion such as a gate driver.

[0093] The pad portion 20 may be provided on the side of the non-display area NA. However, in the display device of the present invention, the shape and arrangement of the pad portion 20 are not limited to those shown. The pad portion 20 may be a metal pattern that is bonded to an external module (e.g., a flexible printed circuit board (FPCB), a chip on film (COF), etc.).

[0094] The pad portion 20 may include a signal pad 25 and a pad electrode 27 connected to the signal pad 25. The signal pad 25 may be formed in the same process as the source 51 and drain 53 of the transistor Tr. Therefore, the signal pad 25 may be made of the same material as the source 51 and drain 53, but the display device of the present invention is not limited thereto. The pad electrode 27 may be formed in the same process as the first connection electrode 61. Therefore, the pad electrode 27 may be made of the same material as the first connection electrode 61, but the display device of the present invention is not limited thereto.

[0095] The second connecting electrode 121 and the third connecting electrode 123 may be disposed on the same layer as the first connecting electrode 61. The second connecting electrode 121 may be disposed on the first lower planarization layer 161a, and the third connecting electrode 123 may be disposed on the second lower planarization layer 161b. The first pad layer 111 may be disposed between the first substrate 11 and the first lower planarization layer 161a, and the second pad layer 113 may be disposed between the second substrate 12 and the second lower planarization layer 161b. The second connecting electrode 121 and the third connecting electrode 123 may electrically connect the connecting line 130 to the first pad layer 111 and the second pad layer 113, respectively.

[0096] The second connecting electrode 121 may be disposed on the first lower planarization layer 161a of the first substrate 11 adjacent to the bend portion, and the third connecting electrode 123 may be disposed on the second lower planarization layer 161b of the second substrate 12 adjacent to the bend portion BA. The second connecting electrode 121 and the third connecting electrode 123 can electrically connect the connecting line 130 to the first pad layer 111 and the second pad layer 113, respectively.

[0097] A connecting line 130 can be disposed from the first substrate 11 to the bend BA and the second substrate 12. The connecting line 130 can contact the second connecting electrode 121 through a first contact hole NCH1 on one side. The second connecting electrode 121 can contact the first pad layer 111 through a second contact hole NCH2. Therefore, the connecting line 130 and the first pad layer 111 can be electrically connected to each other on the first substrate 11 through the second connecting electrode 121.

[0098] The connecting line 130 can contact the third connecting electrode 123 through the third contact hole NCH3 on the other side. The third connecting electrode 123 can contact the second pad layer 113 through the fourth contact hole NCH4. Therefore, the connecting line 130 and the second pad layer 113 can be electrically connected to each other on the second substrate 12.

[0099] However, the display device of the present invention is not limited thereto. The second connecting electrode 121 and the third connecting electrode 123 may not be provided, and the connecting line 130 may be in direct contact with the first pad layer 111 and the second pad layer 113.

[0100] Coating 101 may be disposed in the bend BA between the first substrate 11 and the second substrate 12. Coating 101 may be configured to prevent cracking and short circuits of various lines located in the bend BA. Furthermore, coating 101 may also have physical and chemical protective functions, protecting various lines disposed on the flexible substrate from external impacts, moisture, or dust during the manufacturing process. For example, coating 101 may be a microcoating (MCL). Furthermore, coating 101 may be deposited in holes or recesses of the first substrate 11 and / or the second substrate 12 that extend into or through the substrate, but the implementation is not limited thereto. Coating 101 may be thinner than the first substrate 11, but the implementation is not limited thereto.

[0101] An etch stop layer 160 may be disposed on the coating 101. The etch stop layer 160 may be configured to prevent the etching of components on the substrate during the etching process of the substrate. The etch stop layer 160 may comprise a material with chemical resistance to the etchant (glass etching fluid (GEF)). For example, the etch stop layer 160 may be formed in the same process as the first and second lower planarization layers 161a and 161b, and may be formed from an organic insulating film. Therefore, even when the etchant etches the substrate of the bend BA and thus the etch stop layer 160 is exposed, the organic film etch stop layer 160 can prevent the etchant from directly penetrating into the panel. Simultaneously, fumes penetrating the etch stop layer 160 may be blocked by a structure such as the first barrier pattern 125.

[0102] A first blocking pattern 125 may be disposed on the etch stop layer 160. The first blocking pattern 125 may overlap at least with the bend BA. Furthermore, the first blocking pattern 125 may overlap at least with the connecting line 130. (See reference...) Figure 4 According to the first embodiment, the plurality of first blocking patterns 125 may be spaced apart from each other and overlap with the connecting line 130 respectively. In addition, the width of the first blocking pattern 125 may be greater than or equal to the width of the connecting line 130, but the embodiment is not limited thereto.

[0103] The first blocking pattern 125 may be formed in the same layer as the first to third connecting electrodes 61, 121, and 123. For example, the first blocking pattern 125 may be disposed between the second connecting electrode 121 and the third connecting electrode 123, which are connected to a connecting line 130. The connecting line 130 may be electrically connected to another electrode, while the first blocking pattern 125 may not be connected to any electrode or line.

[0104] Conventionally, when electrically connected lines are disposed on the upper surface of the etch stop layer 160, short circuits may occur between adjacent electrodes on the left and right sides due to line propagation caused by smoke generated during substrate etching. Accordingly, the display device of the present invention can effectively prevent corrosion and deformation of the connecting lines 130 due to smoke by providing a first barrier pattern 125 between the etch stop layer 160 and the electrically connected connecting lines 130.

[0105] The shape, thickness, etc. of the first blocking pattern 125 can be determined according to the etching process time (i.e., etching amount) of the substrate.

[0106] The first barrier pattern 125 may include a material different from the etch stop layer 160. The first barrier pattern 125 may include a metal. In some cases, in the first barrier pattern 125, the surface in contact with the etch stop layer 160 may be made of a metal oxide by a reaction caused by fumes (or ions).

[0107] For example, the etchant can be GEF. A mixed acid material of hydrogen fluoride (HF) and nitric acid (HNO3) can be used as an etchant. As a result of the reaction of the fluoride (F) component of the smoke during exposure to the smoke for a certain period of time or longer, the metal component (e.g., Al or Ti) of the first barrier pattern 125 can diffuse to the portion of the first barrier pattern 125 that contacts the etch stop layer 160. Therefore, the lower side of the first barrier pattern 125 can be made of a metal oxide film containing the F component while the oxygen (O) component increases. In other words, the lower surface of the first barrier pattern 125 can have a protective patina-like film formed due to the reaction with the smoke (e.g., a thin passivation oxide layer that may include some fluoride and oxygen).

[0108] Meanwhile, the F component, which is likely the main cause of metal corrosion, is almost not found in the upper planarization layer 170. That is, since the first barrier pattern 125 prevents smoke from penetrating into the upper planarization layer 170 and the connecting line 130, deformation, expansion, and corrosion of the connecting line 130, which is used as a line, can be prevented.

[0109] Reference Figure 5 The first barrier pattern 125 may include a first layer 125a and a second layer 125b. The first barrier pattern 125 may include a first layer 125a located below the upper surface of the etch stop layer 160 and a second layer 125b located above the upper surface of the etch stop layer 160, wherein the upper surface of the etch stop layer 160 (the surface where the etch stop layer 160 and the upper planarization layer 170 are in contact with each other) serves as the boundary.

[0110] like Figure 5As shown, in the first blocking pattern 125, the surface of the first layer 125a that contacts the etch stop layer 160 and the surface of the second layer 125b that contacts the upper planarization layer 170 can be formed with different shapes. For example, the surface of the first blocking pattern 125 that contacts the etch stop layer 160 can be formed with a curved shape, and the surface of the second layer 125b that contacts the upper planarization layer 170 can be formed with a flat shape, but the invention is not limited thereto. For example, when the display device is not in a bent state, the first blocking pattern 125 may have a curved bottom surface and a flat top surface. Furthermore, when the display device is in a bent state, the lower surface of the coating may have a smaller radius of curvature than the upper surface of the coating.

[0111] The first barrier pattern 125 can have sufficient time for the metallic components of the smoke to react as the etching amount of the substrate increases (i.e., as the substrate is exposed to the smoke for a longer period of time). As a result, the first layer 125a of the first barrier pattern 125 can have a greater thickness as the etching amount of the substrate increases. Furthermore, when the first layer 125a is exposed to the smoke for a longer time than the second layer 125b, the first layer 125a of the first barrier pattern 125 can contain a greater amount of O (oxygen) components. For example, the first layer 125a of the first barrier pattern 125 can have a higher oxygen content than the second layer 125b of the first barrier pattern 125.

[0112] The first blocking pattern 125 may include a multi-layered structure. (See reference...) Figure 6A The material structure of each layer in the curved section BA may sequentially include, from bottom to top, an etch stop layer L1 ( Figure 3 160 in the middle), the first blocking pattern SD ( Figure 3 125 in the middle), upper planarization layer L2 ( Figure 3 170 in the middle), connecting line ES ( Figure 3 130 in the middle), and the embankment L3 ( Figure 3 (180 in the middle). The etch stop layer L1 may include a first material layer m1. The first blocking pattern SD ( Figure 3 The first functional layer (m1) in the multilayer structure of the first barrier pattern SD (m1, m2, and m3) may include a first functional layer (m1), a second material layer (m2), and a third material layer (m3). The upper planarization layer (L2) may include a fourth material layer (m4). The connecting line (ES) may include a fifth material layer (m5), a sixth material layer (m6), and a seventh material layer (m7). The embankment (L3) may include an eighth material layer (m8). Due to the characteristics of the etchant used to etch the substrate, the first functional layer (m1) closest to the substrate in the multilayer structure of the first barrier pattern SD may include a specific material.

[0113] The first functional layer cm1 of the first barrier pattern SD may include a material that blocks fumes generated from the etchant. Furthermore, the first functional layer cm1 may include a material with higher chemical resistance to the etchant compared to the other layers of the first barrier pattern SD. Therefore, the first barrier pattern SD can minimize changes caused by fumes (or ions). For example, minimizing changes can be achieved by setting the first functional layer cm1. Figure 5 The thickness variation of the first layer 125a of the first blocking pattern 125 in the first blocking pattern 125.

[0114] Since the etchant used for the glass substrate includes a mixed acid solution of hydrogen fluoride (HF) and nitric acid (HNO3), the first functional layer cm1 can comprise a material with high chemical resistance to fumes or ions generated from the etchant. For example, the first functional layer cm1 can comprise any one of Mo, Cr, p-Si, and ITO. As another example, the first functional layer cm1 can comprise Mo or Cr as a corrosion-resistant metal. Furthermore, considering that the first barrier pattern SD is disposed in the bend BA, the first barrier pattern SD can be formed with a minimum thickness to minimize cracking and can be made of a flexible material.

[0115] Due to the properties of the etchant used to etch the substrate, the layer closest to the first substrate 11 in the connection line 130 may include a specific material.

[0116] Reference Figure 6B The material structure of each layer in the curved section BA may, from bottom to top, include an etch stop layer L1, a first blocking pattern SD, an upper planarization layer L2, a connecting line ES, and a dam L3. The etch stop layer L1 may include a first material layer m1. The first blocking pattern SD may include a first functional layer cm1, a second material layer m2, and a third material layer m3. The upper planarization layer L2 may include a fourth material layer m4. The connecting line ES may include a fifth material layer m5, a second functional layer cm2, and a seventh material layer m7. The dam L3 may include an eighth material layer m8.

[0117] Due to the properties of the etchant used to etch the substrate, the second functional layer cm2, which is closest to the substrate in the multilayer structure cm2, m5, and m7 of the interconnect ES, can include a specific material. Therefore, a second functional layer cm2 can be provided in the interconnect ES to provide secondary protection against corrosion and deformation caused by fumes.

[0118] The second functional layer cm2 of the connecting line ES can be formed in the same process as the first electrode 91. For example, the second functional layer cm2 may include any one of silver (Ag), aluminum (Al), copper (Cu), molybdenum (Mo), titanium (Ti), nickel (Ni), chromium (Cr), and tungsten (W).

[0119] For example, since the etchant includes a mixed acid solution of hydrogen fluoride (HF) and nitric acid (HNO3), the second functional layer cm2 of the connector ES can comprise a material with higher chemical resistance to fumes or ions generated from the etchant compared to the other layers of the connector ES. For example, the second functional layer cm2 can be made of molybdenum (Mo), which has excellent resistance to fumes. Considering that the connector ES is disposed in the bend BA, the connector ES can be formed with a minimum thickness to minimize cracking and can be made of a flexible material.

[0120] Figure 6A It is shown that only the first blocking pattern SD has a functional layer cm1, or Figure 6B The diagram shows a first blocking pattern SD and a connecting line ES, each having functional layers cm1 and cm2, respectively; however, the invention is not limited thereto. For example, the functional layers may be provided only in the connecting line ES, or they may be provided in a second blocking pattern included in the following embodiments.

[0121] Other implementation methods to be carried out, as described below, may include Figure 5 And all the structures of the first layer 125a and the second layer 125b of the first blocking pattern 125 in FIG6, and may include based on Figure 6A and Figure 6B The first blocking pattern SD has a multi-layered structure and the connecting line ES has a multi-layered structure, and can also have its effects.

[0122] Figure 6A and Figure 6B The material structure of the bending portion BA shown may correspond to and / or be implemented as any of the first to sixth embodiments of the present invention and their modifications.

[0123] Figure 7 It is according to the second embodiment of the present invention. Figure 1 A magnified plan view of region A in the diagram. Figure 8 It is along Figure 7 The cross-sectional view taken from line Ⅲ-Ⅲ' in the figure. In the following text, the description of the same structure as the first embodiment will be omitted.

[0124] Reference Figure 7 and Figure 8 The display device according to a second embodiment of the present invention may include a first blocking pattern 225 overlapping with a plurality of connecting lines 230. For example, a first blocking pattern 225 may overlap with two, three or more connecting lines 230, or may overlap with all the connecting lines of the plurality of connecting lines 230. The display device according to the second embodiment of the present invention will be described by way of an example of a first blocking pattern 225 overlapping with three connecting lines 230.

[0125] Reference Figure 7 , Figure 5The connecting line 130 shown is connected to the electrode ( Figure 3 (121 and 123) are in contact, and also with the first and second pad layers ( Figure 3 111 and 113 in the middle are in contact, and in the same way, Figure 7 The connecting line 230 shown can be connected to the electrode ( Figure 3 Contacts with 121 and 123 in the middle, and can also contact the first and second pad layers ( Figure 3 (111 and 113 in the middle) contact.

[0126] The first blocking pattern 225 may be provided at least between the first contact hole NCH1 and the second contact hole NCH2, and the third contact hole NCH3 and the fourth contact hole NCH4 in the curved portion BA. The first blocking pattern 225 may overlap with the connecting line 230 in a region that does not include the first to fourth contact holes NCH1, NCH2, NCH3 and NCH4. Overlapping may mean overlapping in the thickness, length and width directions. Therefore, by providing the first blocking pattern 225 between the etch stop layer 260 and the connecting line 230 with electrical connection, the display device of the present invention can effectively prevent corrosion and deformation due to smoke and prevent etching of the connecting line 230.

[0127] The display device and its modifications according to the third to fifth embodiments of the present invention, which will be implemented below, may include an insulating layer on the upper part of each of the coating, the first blocking pattern and the connecting line, and the plurality of insulating layers may include trenches corresponding to the regions between the connecting lines in at least one layer.

[0128] According to one embodiment, the display device may include at least one insulating layer disposed on an etch stop layer and at least one trench extending through the at least one insulating layer. The at least one trench is located between two adjacent interconnects among a plurality of interconnects.

[0129] A display device according to one embodiment of the present invention may include a trench in at least one of an etch stop layer, an upper planarization layer 270, and a dam portion 280. The display device of the present invention is not limited to the trench structure described above; various trench structures described in the present invention can be applied to all embodiments of the present invention.

[0130] For example, trenches may be formed only in the etch stop layer, formed as continuous in the etch stop layer and the upper planarization layer, formed only in the upper planarization layer, formed as continuous in the upper planarization layer and the embankment, or formed only in the embankment. Optionally, trenches may be formed throughout the etch stop layer, the upper planarization layer, and the embankment, and the trenches may overlap each other. However, the trenches of the present invention may be configured to correspond to the region between multiple connecting lines ES. Furthermore, since the effect of the trenches can be maximized or the process can be simplified due to the interaction between the first and second blocking patterns, the trenches may be formed as shown in the embodiments described below.

[0131] Figure 9 This is according to the third embodiment of the present invention. Figure 1 A magnified plan view of region A in the diagram. Figure 10 It is along Figure 9 The cross-sectional view taken from line IV to IV' in the diagram.

[0132] Reference Figure 9 and Figure 10 A display device according to a third embodiment of the present invention may include a first blocking pattern 325 overlapping with a plurality of connecting lines 330. The first blocking pattern 325 and the connecting lines 330 according to the third embodiment may be configured in a one-to-one correspondence, but one first blocking pattern 325 may overlap with a plurality of connecting lines 330. Furthermore, the display device according to the third embodiment may also include a trench TC1 in the etch stop layer 360 and the upper planarization layer 370 as a separation space between the first blocking pattern 325. According to one embodiment, the trench TC1 may be provided from the planarization layer 370 to the etch stop layer 360.

[0133] Similar to the previous reference Figure 5 The described connecting line 130 and the previous reference Figure 7 The described connecting line 230 (which is connected to the connecting electrode) Figure 3 (121 and 123) are in contact with and also with the first and second pad layers ( Figure 3 (111 and 113 in the middle) contact), Figure 9 The connecting line 330 shown can be connected to the electrode ( Figure 3 Contacts with 121 and 123 in the middle, and can also contact the first and second pad layers ( Figure 3 (111 and 113 in the middle) contact.

[0134] The first blocking pattern 325 may be disposed at least between the first contact hole NCH1 and the second contact hole NCH2, and the third contact hole NCH3 and the fourth contact hole NCH4 in the curved portion BA. The first blocking pattern 325 may overlap with the connecting line 330 in a region that does not include the first to fourth contact holes NCH1, NCH2, NCH3 and NCH4. Therefore, by providing the first blocking pattern 325 between the etch stop layer 360 and the connecting line 330 having electrical connection, the display device of the present invention can effectively prevent corrosion and deformation caused by smoke and prevent etching of the connecting line 330.

[0135] According to the third embodiment, the etch stop layer 360 and the upper planarization layer 370 may include a trench TC1. The trench TC1 may be continuously disposed in the etch stop layer 360 and the upper planarization layer 370. Specifically, the trench TC1 may be formed in such a manner that the thickness of the upper planarization layer 370 is removed from the upper surface of the upper planarization layer 370, and then the thickness of the etch stop layer 360 is removed from the upper surface of the etch stop layer 360. For example, the trench TC1 may be wider at the top and narrower at the bottom adjacent to the coating.

[0136] The trench TC1 can be disposed in the separation space between the first barrier patterns 325. Some of the fumes generated during the substrate etching process can flow into the trench TC1 in the separation space between the first barrier patterns 325. The fumes flowing into the trench TC1 can be discharged along the embankment 380 in the trench TC1.

[0137] The side surface of the upper planarization layer 370 that overlaps with the connecting line 330 can form an interface that contacts the embankment 380 through the trench TC1. For example, the trench TC1 can create a vertical or slightly inclined interface between the upper planarization layer 370 and the embankment 380 along the connecting line 330, which can prevent the lateral diffusion of corrosive fumes and effectively block them from reaching and damaging the connecting line 330. Therefore, due to the interface between the upper planarization layer 370 and the embankment 380, fumes flowing into the trench TC1 have difficulty advancing to the lower surface of the connecting line 330 that contacts the upper planarization layer 370. Therefore, the display device according to the third embodiment can more effectively prevent fumes from traveling toward the connecting line 330 by further including the trench TC1.

[0138] Simultaneously, a dam 380 covering the connecting line 330 can be provided to fill the trench TC1. When the trench TC1 exposes the upper surface of the first coating 101, the side surface of the etch stop layer 360, and the side surface of the upper planarization layer 370, the dam 380 can contact the upper surface of the first coating 101, the side surface of the etch stop layer 360, and the side surface of the upper planarization layer 370.

[0139] Figure 11A and11B It is shown Figure 10 A cross-sectional view of the modified example. Figure 11B It is shown that it is used for Figure 11A A cross-sectional view of a portion of the etching process of the structure.

[0140] Reference Figure 11A According to a modification of the third embodiment, the trench TC2 can be disposed in the separation space between the first blocking patterns 425, and can be formed in the upper planarization layer 470 and the embankment 480. That is, the trench TC2 can be disposed from the embankment 480 to the upper planarization layer 470. Compared with the previous embodiment, the trench TC2 can be formed in the embankment 480 instead of the etch stop layer 460. Therefore, in the embodiment, a second coating 103 filling the trench TC2 may be further included.

[0141] Since the trench TC2 is included in the embankment 480, a second coating 103 may further be included to fill the trench TC2. The second coating 103 may include the same material as the first coating 101 disposed between the first substrate 11 and the second substrate 12. Similar to the first coating 101, the second coating 103 may also have physical and chemical protective functions that prevent cracking and short circuits of various wires located in the bend BA and protect various wires from external impacts, moisture or dust.

[0142] Furthermore, the second coating 103 can be applied to various lines formed on the bent portion BA, such as data lines, high-potential voltage lines, low-potential voltage lines, etc., and the position of the lines can be adjusted so that the lines become closer to the neutral line during bending. Therefore, the tensile stress formed above the neutral line and the contractile stress formed below the neutral line can be applied to the lines as little as possible, thereby enhancing the line's durability. For example, by positioning the lines near this neutral plane, the lines are subjected to significantly less tension (e.g., tensile stress) and compression (e.g., contractile stress), which greatly improves the durability and reliability of the lines when the device bends.

[0143] Refer to together Figure 11B It can be used to form the first coating and the second coating. Figure 11A The etching process of substrate 100 is performed before 101 and 103 in the process. The etchant can be incident in a direction toward substrate 100. The fumes generated by the etchant can pass through substrate 100 and etch stop layer 460, and advance in a first direction (a), a second direction (b and b'), and a third direction (c). In the first direction (a) incident on the underside of the first barrier pattern 425, some of the fumes can react with the lower surface of the first barrier pattern 425 to form a first layer ( Figure 5 In 125a), some smoke can be dispersed on both sides of the first blocking pattern 425 in the second direction (b and b').

[0144] Smoke in the third direction (c) can enter the groove TC2 between the first blocking patterns 425. Smoke in the second directions (b and b') dispersed on both sides of the first blocking patterns 425 can enter the groove TC2. The display device of the present invention includes the groove TC2, so smoke in the second and third directions (b, b' and c) that are not blocked by the first blocking patterns 425 can be discharged into the groove TC2. In other words, smoke can be safely bypassed from around the connecting line 430. Therefore, the display device of the present invention can effectively prevent smoke from damaging the connecting line 430.

[0145] Figure 12 This is according to the fourth embodiment of the present invention. Figure 1 A magnified plan view of region A in the diagram. Figure 13 It is along Figure 12 The cross-sectional view taken from line V-V' in the diagram. Figure 14A It is shown Figure 13 The modified example's cross-sectional view, and Figure 14B It is shown that it is used for Figure 14A A cross-sectional view of a portion of the etching process of the structure.

[0146] Reference Figure 12 and Figure 13 According to a fourth embodiment of the display device of the present invention, the first blocking pattern 525 and the connecting line 530 may overlap at least in the bend BA. In the embodiment, an example of a one-to-one correspondence between the first blocking pattern 525 and the connecting line 530 is described.

[0147] In the fourth embodiment, the curved portion BA may further include a second blocking pattern 515. A groove TC3 may be provided in the embankment 580. The second blocking pattern 515 may be provided in the region between the connecting lines 530. That is, one or more second blocking patterns 515 may be provided in the space between multiple connecting lines 530. Furthermore, when the connecting lines 530 and the first blocking pattern 525 overlap, it can be seen that the second blocking pattern 515 is provided in the region between the first blocking patterns 525.

[0148] Reference Figure 12 The diagram shows the first blocking pattern 525 and the second blocking pattern 515 spaced apart from each other in a plan view, but the invention is not limited thereto. For example, the first blocking pattern 525 and the second blocking pattern 515 may be configured such that their edges partially overlap or their edge boundaries coincide in a plan view.

[0149] Figure 12 and Figure 13 The connecting line 530 shown can be connected to the electrode in the same or similar manner as the connecting lines 130, 230, 330 and 430 described above. Figure 3(121 and 123 in the middle) and the first pad layer and the second pad layer ( Figure 3 (111 and 113 in the middle) contact.

[0150] The first blocking pattern 525 may be provided at least between the first contact hole NCH1 and the second contact hole NCH2, and the third contact hole NCH3 and the fourth contact hole NCH4 in the bent portion BA. The first blocking pattern 525 may overlap with the connecting line 530 in a region that does not include the first to fourth contact holes NCH1, NCH2, NCH3 and NCH4. Therefore, by providing the first blocking pattern 525 between the etch stop layer 560 and the connecting line 530 having electrical connection, the display device of the present invention can effectively prevent corrosion and deformation caused by smoke and prevent etching of the connecting line 530.

[0151] The second blocking pattern 515 may be disposed in the area of ​​the bend BA that does not overlap with the first blocking pattern 525. The second blocking pattern 515 may be disposed on the first coating 101. The second blocking pattern 515 may be disposed on the first pad layer and the second pad layer (…). Figure 3 The 111 and 113 patterns are disposed on the same layer and formed in the same process. Since the second barrier pattern 515 is disposed in an area that does not overlap with the connecting line 530, it can physically prevent smoke from penetrating into the area between the connecting lines 530.

[0152] By providing both the first blocking pattern 525 and the second blocking pattern 515 in areas overlapping with and not overlapping with the connecting line 530, smoke can be effectively blocked from reaching the connecting line 530. Therefore, the display device according to an embodiment of the present invention can effectively prevent etching, corrosion, and deformation of the connecting line 530. Furthermore, since the first blocking pattern 525 and the second blocking pattern 515 are alternately arranged in different layers in areas overlapping with and not overlapping with the connecting line 530, this arrangement is more effective in increasing flexibility compared to when the blocking pattern is arranged as a continuous pattern in a single layer. For example, by arranging the first blocking pattern 525 and the second blocking pattern 515 in an interlaced multilayer structure, a robust barrier can be created. This arrangement, with patterns that both overlap with and are located between the connecting lines 530, effectively blocks corrosive smoke and prevents damage. Moreover, since the blocking patterns are partitioned and distributed across different layers rather than as a continuous sheet, this construction improves the flexibility of bends.

[0153] Meanwhile, the embankment 580 may include a groove TC3 located in the separation space between the connecting lines 530. The groove TC3 may not be formed in the upper planarization layer 570. When the display device of the present invention includes the groove TC3, since fumes not blocked by the first blocking pattern 525 and the second blocking pattern 515 during the manufacturing process can be discharged through the groove TC3, damage to the connecting lines 530 due to fumes generated during the manufacturing process can be effectively prevented.

[0154] Since the trench TC3 is included in the embankment 580, a second coating 203 filling the trench TC3 may be further included. The second coating 203 may include the same material as the first coating 101 disposed between the first substrate 11 and the second substrate 12.

[0155] Reference Figure 14A ,according to Figure 13 In the modified example, the groove TC4 can be disposed in the separation space between the first blocking patterns 625, and can be formed in the upper planarization layer 670 and the embankment 680. The groove TC4 can be continuously disposed in the upper planarization layer 670 and the embankment 680. In other words, the groove TC4 can be disposed from the embankment 680 to the upper planarization layer 670. For example, the groove TC4 can extend through both the upper planarization layer 670 and the embankment 680, but the implementation is not limited to this.

[0156] Refer to together Figure 14B It can form a coating ( Figure 14A The etching process of substrate 100 is performed before 101 and 303 in the process. The etchant can be incident in a direction toward substrate 100. The fumes generated by the etchant can pass through substrate 100 and etch stop layer 660, and advance in a first direction (d), a second direction, a third direction (e), a fourth direction (f and f'), and a fifth direction (g). In the first direction (d) incident on the underside of the second barrier pattern 615, some of the fumes can react with the lower surface of the second barrier pattern 615 to form a first layer ( Figure 5 (125a in the middle). The second direction may correspond to the dispersion of some smoke toward the side of the second blocking pattern 615.

[0157] On a third direction (e) incident on the lower side of the first blocking pattern 625, some smoke can react with the lower surface of the first blocking pattern 625 to form a first layer. Figure 5 (125a) and some smoke can be dispersed on both sides of the first blocking pattern 625 in the fourth direction (f and f').

[0158] Smoke in the fifth direction (g) can enter the groove TC4 between the first blocking patterns 625. Smoke in the fourth direction (f and f') dispersed on both sides of the first blocking patterns 625 can enter the groove TC4. The display device of the present invention includes the groove TC4, so smoke that is not blocked by the first blocking pattern 625 and the second blocking pattern 615 can be discharged into the groove TC4. Therefore, the display device of the present invention can more effectively prevent smoke from damaging the connecting line 630.

[0159] Furthermore, since the trench TC4 is included in the embankment 680, a second coating 303 may be included to fill the trench TC4. The second coating 303 may include the same material as the first coating 101 disposed between the first substrate and the second substrate.

[0160] Figure 15 It is according to the fifth embodiment of the present invention. Figure 1 An enlarged plan view of region A in the image. Figure 16 It is along Figure 15 The cross-sectional view taken from line VI-VI' in the diagram. Figure 17 It is along Figure 15 The cross-sectional view taken from line VII-VII' in the diagram.

[0161] Reference Figures 15 to 17 According to a fifth embodiment of the display device of the present invention, the first blocking pattern 825 and the connecting line 830 may overlap at least in the bend BA. In this embodiment, an example of a one-to-one correspondence between the first blocking pattern 825 and the connecting line 830 is described. In the fifth embodiment, the bend BA may further include a second blocking pattern 815a and a third blocking pattern 815b.

[0162] The connecting wire 830 can be connected to the connecting electrodes 821 and 823 (corresponding to) through the first and third contact holes NCH1 and NCH3 provided in the upper planarization layer 870. Figure 3 Contacts (121 and 123) are made, and can be achieved by setting the first and second lower planarization layers ( Figure 3 In 161a and 161b) and the second and fourth contact holes NCH2 and NCH4 in etch stop layer 860 with the first and second pad layers 811 and 813 (corresponding to Figure 3 (111 and 113 in the middle) contact.

[0163] The first blocking pattern 825 may be provided at least between the first contact hole NCH1 and the second contact hole NCH2, as well as the third contact hole NCH3 and the fourth contact hole NCH4 in the curved portion BA. The first blocking pattern 825 may overlap with the connecting line 830 in a region that does not include the first to fourth contact holes NCH1, NCH2, NCH3 and NCH4.

[0164] The second barrier pattern 815a and the third barrier pattern 815b may be disposed on the first coating 101. The second barrier pattern 815a and the third barrier pattern 815b may be spaced apart from each other on the same layer. The first barrier pattern 825 may be disposed between the third barrier pattern 815b and the connecting line 830. The second barrier pattern 815a and the third barrier pattern 815b may be disposed with respect to the first pad layer and the second pad layer. Figure 3 111 and 113 in the model are set on the same layer and formed in the same process.

[0165] The second blocking pattern 815a can be disposed in the area between the connecting lines 830. Furthermore, when the connecting lines 830 and the first blocking pattern 825 overlap one-to-one, it can be seen that the second blocking pattern 815a is disposed in the area between the first blocking patterns 825. Additionally, a third blocking pattern 815b can be disposed between the second blocking patterns 815a and overlap with the first blocking pattern 825 and the connecting lines 830. Since the second blocking pattern 815a is disposed in an area that does not overlap with the connecting lines 830, it can physically prevent smoke from penetrating into the area between the connecting lines 830.

[0166] By providing second blocking patterns 815a and third blocking patterns 815b in both the areas overlapping with and not overlapping with the connecting line 830, smoke can be effectively blocked from reaching the connecting line 830, and the segmented configuration further improves bending and flexibility. Therefore, the display device according to an embodiment of the present invention can effectively prevent etching, corrosion, and deformation of the connecting line 830. Furthermore, since the second blocking patterns 815a and third blocking patterns 815b are spaced apart from each other, it is more effective in increasing flexibility compared to when the second blocking patterns 815a and third blocking patterns 815b are set as a single pattern across the entire bend BA. Moreover, in this embodiment, since the first blocking pattern 825 is provided between the third blocking pattern 815a and the connecting line 830, smoke can be blocked a second time by the first blocking pattern 825.

[0167] Simultaneously, the embankment 880 may include a groove TC5 in the separation space between the connecting lines 830. That is, the groove TC5 may be provided in the embankment 880. When the display device of the present invention includes the groove TC5, since fumes not blocked by the first blocking pattern 825, the second blocking pattern 815a, and the third blocking pattern 815b can be discharged into the groove TC5, damage to the connecting lines 830 by fumes generated during the manufacturing process can be prevented more effectively. In this way, multiple protective lines can be provided to protect the connecting lines 830.

[0168] Since the trench TC5 is included in the embankment 880, a second coating 803 may be further included to fill the trench TC5. The second coating 803 may include the same material as the first coating 101 disposed between the first substrate 11 and the second substrate 12.

[0169] Figure 18A This is a cross-sectional view of the curved portion according to the sixth embodiment of the present invention.

[0170] Reference Figure 18A The display device according to the sixth embodiment of the present invention may include a first coating 201, which includes a protrusion PT. The protrusion PT of the first coating 201 may be disposed between a first substrate region of the first substrate 110 and a second substrate region of the second substrate 120, and the protrusion PT protrudes toward the etch stop layer 760. Furthermore, the first coating 201 according to the embodiment may include a first surface S1 and a second surface S2, wherein the surfaces in contact with the first substrate 110 and the second substrate 120 are curved.

[0171] The protrusion PT of the first coating 201 may be formed on the upper part of the edge of the first coating 201 that contacts each of the first substrate 110 and the second substrate 120. In other words, the protrusion PT may be located at each corner of the first substrate 110 and the second substrate 120 that contacts the etch stop layer 760 and faces each other.

[0172] refer to Figure 18A In region B, the protrusion PT of the first coating 201 can be formed in a manner that protrudes from the upper surfaces of the first substrate 110 and the second substrate 120 toward the etch stop layer 760. The protrusion PT can protrude from the second surface S2 to the etch stop layer 760. In this way, multiple guard lines can be provided to protect the connecting line 830. In the drawings, the protrusion PT is shown as a trapezoidal shape, but the invention is not limited thereto. For example, the cross-section of the protrusion PT can be formed as a semicircle, rectangle, or polygon.

[0173] For each surface in contact with the first substrate 110 and the second substrate 120, the first coating 201 may include a first surface S1 and a second surface S2. In the first coating 201, the first surface S1 may be connected to the lower surface of the first coating 201, and the second surface S2 may be bent from the first surface S1 and disposed adjacent to the etch stop layer 760.

[0174] The second surface S2 of the first coating 201 can be bent toward the center of the bent portion BA. The second surface S2 of the first coating 201 can be formed in the form of a surface that is bent from the flat upper surface of each of the first substrate 110 and the second substrate 120 into contact with the etch stop layer 760. Compared with the first surface S1 and the second surface S2 of the first coating 201 having a single bend, the corners of the surfaces of the first coating 201 that contact each of the first substrate 110 and the second substrate 120 can have a gentler shape. Therefore, the display device of the present invention can prevent cracks from appearing at the corners of the first coating 201 that contact each of the first substrate 110 and the second substrate 120 during bending. Furthermore, in the display device of the present invention, the protrusion PT of the first coating 201 can be formed in the form of surrounding the corners of each of the first substrate 110 and the second substrate 120, thereby effectively preventing cracks from appearing during bending. For example, the first coating 210 can have a specific convex or raised (outwardly bent) shape that meets the edge of the substrate (e.g., the first substrate 110 and the second substrate 120). This rounded or raised design can wrap around sharp corners to reduce stress concentration when the device bends and effectively prevent crack formation.

[0175] Figure 18B This is according to the sixth embodiment of the present invention. Figure 1 A cross-sectional view of region C in the diagram. Figure 1 Region C is the boundary portion EG of the end of the non-display area NA of the first substrate 110.

[0176] Reference Figure 18B In the display device according to the embodiment, the first substrate 110, the etch stop layer 760, the upper planarization layer 770 and the embankment 780 may be sequentially disposed in the non-display area NA, and the first coating layer 201 may be disposed on the same layer as the first substrate 110.

[0177] The boundary portion EG is the end of the panel and may have a cut cross-section. Except for the first substrate 110 which contacts the bend BA, the boundary portion EG may be located at the edge of the front surface portion FA of the first substrate 110. Furthermore, except for the second substrate 120 which contacts the bend BA, the boundary portion EG may be located at the edge of the rear surface portion RFA of the second substrate 120. The boundary portion EG may be cut by a cutting member. For example, the cutting member may include a cutting wheel, a laser, etc. However, the display device of the present invention is not limited thereto.

[0178] The first coating 201 of the non-display area NA may be spaced apart from the boundary portion EG and may include a protrusion PT in the direction toward the display area AA. Therefore, in addition to the curved portion BA, the protrusion PT of the first coating 201 may also be formed along the boundary portion EG of the first substrate 110 and the second substrate 120. In other words, the protrusion PT of the first coating 201 may be formed in a manner surrounding each of the first substrate 110 and the second substrate 120. The protrusion PT included in the first coating 201 of the first substrate 110 may be formed in the same process as the protrusion PT included in the first coating 201 of the curved portion BA.

[0179] Figures 19A to 19D This is the process diagram for the sixth embodiment.

[0180] Reference Figure 19A The display device of the present invention may include: a substrate 100; a first pad layer 711, a second pad layer 713 and a raised pattern CVP disposed on the substrate 100; a second connection electrode 721, a third connection electrode 723 and a first blocking pattern 725 disposed on a 1-1 etch stop layer 760a; a connection line 730 disposed on an upper planarization layer 770; and a dam 780 disposed on the connection line 730.

[0181] For example, substrate 100 can be a glass substrate.

[0182] The raised pattern CVP can be disposed on the same layer as the first pad layer 711 and the second pad layer 713. The raised pattern CVP can be disposed in any region of the bend BA. Specifically, the raised pattern CVP can be disposed in the bend BA at the interface between the bend BA and each of the front surface portion FA and the rear surface portion RFA.

[0183] The raised pattern CVP may be formed in a different process from the first pad layer 711 and the second pad layer 713, and may include a different material than the first pad layer 711 and the second pad layer 713. Alternatively, the raised pattern CVP may be formed in the same process as the first pad layer 711 and the second pad layer 713, and may include the same material as the first pad layer 711 and the second pad layer 713.

[0184] The raised pattern CVP can be etched together with the etching substrate 100 in the process of etching the substrate 100. The raised pattern CVP may include a material that can be etched by the etchant of the substrate 100. The raised pattern CVP may include inorganic materials or metals. For example, when the etchant is a mixed acid solution of hydrogen fluoride (HF) and nitric acid (HNO3), the raised pattern CVP may include inorganic materials or metals that can be etched by HF.

[0185] For example, the raised pattern CVP made of inorganic material can be formed in different processes with the first pad layer 711 and the second pad layer 713, and can be made of silicon oxide (SiOx) film, silicon nitride (SiNx) film, silicon nitride oxide (SiOxNy) film or multiple layers thereof.

[0186] For example, the raised pattern CVP made of metal can be formed in the same process as the first pad layer 711 and the second pad layer 713, and can be made of a single layer of metal material such as molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), or alloys thereof, or can be formed as a multilayer structure using the aforementioned metal materials. In this case, the raised pattern CVP can be made of materials that can be easily etched by F, such as Ti, Al, Cu, Ag, Ti / Al / Ti, MoTi / Cu / MoTi, MoTi / Cu, and Cu / MoTi. For example, when the raised pattern CVP is etched away, blank spaces or cut-out areas can be left, which can be filled with different materials such as the first coating 201.

[0187] For example, a raised pattern CVP made of metal can be made of one or more single or multiple layers selected from the group consisting of indium tin oxide (ITO), indium zinc oxide (IZO), silver (Ag), aluminum (Al), copper (Cu), molybdenum (Mo), titanium (Ti), nickel (Ni), chromium (Cr) and tungsten (W) and their alloys.

[0188] For example, raised CVP patterns can be made of materials that can be easily etched by F, such as Cu / ITO and ITO / Ag / ITO.

[0189] Next, refer to Figure 19B The etching process of substrate 100 can be performed. In one embodiment of the invention, wet etching can be performed. The etchant is a solution containing F, and a mixed acid material of hydrogen fluoride (HF) and nitric acid (HNO3) can be used.

[0190] Although not shown in the accompanying drawings, an etching process can be performed using a mask with an opening corresponding to the bend BA. Simultaneously with the mask, the substrate 100 can be etched by spraying an etchant or by a deepening method.

[0191] As the substrate 100 exposed to the etchant is etched, openings can be formed in the substrate 100, and the depth of the openings can increase as the etching process time progresses. A tapered surface can be formed by controlling the etching process time (e.g., the time the substrate 100 is exposed to the etchant).

[0192] As the etching process proceeds, the etchant penetrates into the substrate 100 and the mask ( Figure 19B Between ect1 and ect1' in the middle, a tapered surface of the sidewall of the 1-1 substrate 110a and the 1-2 substrate 120a can be formed.

[0193] In the etching process, the 1-2 etch stop layer 760b can be used as an etching stop element. As the etching process of the substrate 100 proceeds, the lower surface of the 1-2 etch stop layer 760b can be exposed.

[0194] In the etching process of substrate 100, the raised pattern CVP can be etched together. Figure 19B (ect2 and ect2' in the text). The groove CVP' of the etch stop layer 760 can be formed in the space where the convex pattern CVP is removed, such as... Figure 19C As shown.

[0195] Reference Figure 19C Because the etching process continues even after the formation of the etch stop layer 760 groove CVP', the etchant penetrates ( Figure 19C (ect3 and ect3') to the groove CVP' and tapered tip of substrate 1-1 110a and substrate 1-2 120a Figure 19B The curved side surfaces of the first substrate 110 and the second substrate 120 can be formed between the tapered tips of the substrates.

[0196] Reference Figure 19D It can complete the substrate etching process and form a first coating 201 between the first substrate 110, the second substrate 120 and the etching stop layer 760.

[0197] Figure 20 This is a schematic cross-sectional view showing the bent state of a display panel according to an embodiment of the present invention.

[0198] Reference Figure 20 The first substrate SUB1 and the second substrate SUB2 can be configured to face each other and have a bend BA between them.

[0199] The first substrate SUB1 and the second substrate SUB2 may each include a front surface portion FA and a rear surface portion RFA.

[0200] On the first substrate SUB1, a pixel array PL may be included in the display area, and a package array ECL covering the pixel array PL may be included. A touch sensor array TCL, a color filter array CFL, and an adhesive layer AHL may be sequentially included on the package array ECL.

[0201] The pixel array PL may include a circuit layer TL disposed on the first substrate SUB1 and a light-emitting element layer DL disposed on the circuit layer TL.

[0202] An encapsulation array (ECL) can cover the light-emitting element layer (DL) to seal the DL. The ECL can be disposed on a first substrate (SUB1). The ECL can have a multi-insulating film structure, in which organic and inorganic films are stacked alternately. The inorganic films can block the permeation of moisture or oxygen. The organic films can planarize the surface of the inorganic films. When organic and inorganic films are stacked in multiple layers, the permeation of moisture / oxygen affecting the light-emitting element layer DL is effectively blocked because the movement path of moisture or oxygen becomes longer compared to a single layer.

[0203] A touch sensor array (TCL) may include a capacitive touch sensor that senses touch input based on capacitance changes before and after the touch input. The TCL may include a metal wire pattern forming the capacitance of the touch sensor and an insulating film. The insulating film insulates intersecting portions of the metal wire pattern and planarizes the surface of the touch sensor layer.

[0204] The polarizer, omitted in the diagram, can be bonded to the touch sensor array TCL. The polarizer improves visibility and contrast by converting the polarization of external light reflected from the metallic pattern of the circuit layer TL. The polarizer can be implemented as a polarizer in which a linear polarizer and a phase retardation film are bonded, or as a circular polarizer.

[0205] A color filter array (CFL) can be formed on a touch sensor array (TCL). The CFL may include red, green, and blue color filters. Additionally, the CFL may include a black matrix pattern. The CFL can replace the function of a polarizer and increases color purity by absorbing some wavelengths of light reflected from the circuit layer (TL). By applying a CFL with a higher light transmittance than a polarizer to a display panel, the display panel with the CFL can have enhanced light transmittance as well as improved thickness and flexibility. The CFL may include an organic film covering the color filters and the black matrix pattern. An extended portion of the organic film may cover inorganic film residues or the first substrate (SUB1) in the bezel area (i.e., edge area) of the display panel.

[0206] The cover glass CVR can be bonded to the color filter array CFL using an adhesive layer AHL.

[0207] In the curved section BA, the first coating CTL1, the etch stop layer L1, the first blocking pattern SD, the upper planarization layer L2, the connecting line ES, the embankment L3, the encapsulation layer, and the second coating CTL2 can be sequentially arranged from the inside of the display device in the thickness direction.

[0208] In the curved portion BA, the second blocking pattern may be further disposed between the first blocking pattern SD and the first coating CTL1, and the groove may be further included in the upper planarization layer L2 and / or the embankment L3.

[0209] Meanwhile, the encapsulation layer disposed in the curved portion BA can be disposed on the same layer as at least one layer of the multilayer structure of the encapsulation array ECL disposed in the display area on the first substrate SUB.

[0210] The pad portion PAD, which is electrically connected to the connection line ES, can be disposed on the second substrate SUB2, and the printed circuit board PCB can be disposed outside the second substrate SUB2. For example, the pad portion PAD can face the first substrate SUB1.

[0211] The printed circuit board (PCB) can transmit various signals to the connection line (ES) via the pads (PAD). The PCB can be a flexible printed circuit board (FBCB), but this invention is not limited to this.

[0212] The display panel according to an embodiment of the present invention may further include a functional member SL disposed between the lower surface of the first substrate SUB1 and the lower surface of the second substrate SUB2. The functional member SL may be configured to contact the first substrate SUB1 and the second substrate SUB2 to support the first substrate SUB1 and the second substrate SUB2. Therefore, the functional member SL can be used as a support member to allow the first substrate SUB1 and the second substrate SUB2 to maintain a predetermined interval.

[0213] A display device according to one embodiment of the present invention can prevent the connecting lines from being corroded and deformed by fumes generated during substrate etching.

[0214] The display device according to one embodiment of the present invention can have the effect of minimizing damage caused by stress at the bonding surface between the first substrate and the second substrate and at the etch stop layer on the first substrate and the second substrate.

[0215] The effects of the present invention are not limited to those described above, and those skilled in the art will clearly understand from the above description other effects not mentioned.

[0216] The effects of the present invention are not limited to those described above. Those skilled in the art to which the technical concept of the present invention pertains can clearly understand other effects not mentioned above based on the above description.

[0217] Although the embodiments of the present invention have been described in detail above with reference to the accompanying drawings, the present invention is not limited to these embodiments, and various changes and modifications can be made without departing from the technical spirit of the present invention.

[0218] Therefore, the embodiments disclosed herein are considered descriptive rather than limiting of the technical spirit of the invention, and the scope of the technical spirit of the invention is not limited by these embodiments.

[0219] Therefore, the above embodiments should be understood as exemplary rather than limiting in any respect.

[0220] The scope of this invention should be interpreted by the appended claims, and all technical ideas within its equivalent scope should be interpreted as being included within the scope of this invention.

Claims

1. A display device, comprising: A first substrate comprising multiple sub-pixels; The second substrate is disposed on one side of the first substrate and includes a pad portion; A curved portion, wherein the curved portion connects the first substrate and the second substrate; An etching stop layer is provided in the curved portion; An upper planarization layer is disposed on the etch stop layer; Multiple connecting lines are disposed on the upper planarization layer; as well as A first blocking pattern is provided, which overlaps with the plurality of connecting lines and is disposed between the etch stop layer and the upper planarization layer.

2. The display device according to claim 1, wherein, At least one of the etch stop layer and the upper planarization layer includes a first trench disposed in the region between the plurality of interconnect lines.

3. The display device according to claim 1 further includes a dam portion disposed on the upper planarization layer. The embankment includes a second trench disposed in the area between the plurality of connecting lines. The first groove and the second groove overlap each other.

4. The display device according to claim 1, wherein the first blocking pattern comprises metal, The etch stop layer comprises an organic insulating material.

5. The display device according to claim 1, further comprising: A coating is disposed between the first substrate, the second substrate, and the etch stop layer; as well as A second barrier pattern is disposed between the etch stop layer and the coating layer. The second blocking pattern is disposed in the area between the connecting lines.

6. The display device according to claim 5, further comprising a first electrode corresponding to each of the plurality of sub-pixels, The connecting wire is disposed on the same layer as the first electrode.

7. The display device according to claim 6, further comprising: At least one transistor, the at least one transistor being disposed on the first substrate and corresponding to each first electrode; as well as A first connecting electrode is electrically connected to the first electrode and the drain of the at least one transistor. The first blocking pattern and the first connecting electrode are disposed on the same layer.

8. The display device according to claim 7, further comprising a first pad layer, the first pad layer being disposed on the same layer as the source or drain of the at least one transistor and electrically connected to the connection line. The second blocking pattern is disposed on the same layer as the first pad layer.

9. The display device according to claim 1, further comprising a coating disposed between the first substrate, the second substrate and the etch stop layer. The coating comprises: A first surface, the first surface being in contact with each of the first substrate and the second substrate; as well as A second surface, which curves from the first surface and is adjacent to the etch stop layer. The second surface of the coating is curved from the surface used to bring the flat upper surface of each of the first and second substrates into contact with the etch stop layer.

10. The display device of claim 9, wherein the coating includes a protrusion extending from the second surface into the etch stop layer.

11. The display device according to claim 1, wherein the first blocking pattern comprises: The first layer is closest to the first substrate and the second substrate; as well as Multiple layers above the first layer The first layer of the first blocking pattern has higher chemical resistance to etchants compared to the plurality of layers.

12. The display device according to claim 1, wherein the connecting line comprises: The first layer is closest to the first substrate and the second substrate; as well as Multiple layers above the first layer The first layer of the connecting line has higher chemical resistance to etchants compared to the plurality of layers.

13. The display device according to claim 8, further comprising a second pad layer disposed on the second substrate, The first pad layer and the second pad layer are electrically connected via the connecting line.

14. The display device according to claim 13, further comprising: A first lower planarization layer and a second lower planarization layer disposed on the same layer as the etch stop layer; as well as A second connecting electrode is disposed on the first lower planarization layer, and a third connecting electrode is disposed on the second lower planarization layer. The first pad layer is disposed between the first substrate and the first lower planarization layer, and the second pad layer is disposed between the second substrate and the second lower planarization layer. The second and third connecting electrodes electrically connect the connecting lines to the first pad layer and the second pad layer, respectively.

15. The display device according to claim 8, further comprising a third blocking pattern, The third blocking pattern is disposed on the same layer as the second blocking pattern and is spaced apart from each other. The first blocking pattern is disposed between the third blocking pattern and the connecting line.

16. The display device of claim 10, wherein the protrusion is configured as a corner surrounding each of the first substrate and the second substrate.

17. A display device, comprising: A first substrate comprising multiple sub-pixels; The second substrate is disposed on one side of the first substrate and includes a pad portion, and a coating is provided between the first substrate and the second substrate; Multiple insulating layers are disposed on the coating; Multiple connecting lines are disposed between the multiple insulating layers; as well as At least one layer of barrier pattern, the barrier pattern overlapping the plurality of connecting lines and disposed between the coating layer and the plurality of connecting lines. At least one of the plurality of insulating layers includes a groove disposed in the region between the plurality of connecting lines.

18. The display device according to claim 17, wherein the at least one layer of the blocking pattern includes a first blocking pattern. The first blocking pattern comprises metal.

19. The display device according to claim 18, wherein the plurality of insulating layers comprises: An etch stop layer is disposed between the first barrier pattern and the coating. as well as An upper planarization layer is disposed between the first blocking pattern and the connecting line.

20. The display device of claim 19, wherein the trench comprises a first trench in at least one of the etch stop layer and the upper planarization layer.

21. The display device of claim 20, wherein the plurality of insulating layers further comprises a dam provided on the upper planarization layer. The embankment includes a second ditch disposed in the area between the plurality of connecting lines. The first groove and the second groove overlap each other.

22. The display device of claim 18, wherein the blocking pattern of the at least one layer further comprises a second blocking pattern located between the first blocking pattern and the coating.

23. The display device according to claim 22, further comprising: At least one transistor, the at least one transistor being disposed on the first substrate and corresponding to each first electrode; as well as A first connecting electrode is electrically connected to the first electrode and the drain of the at least one transistor. The first blocking pattern and the first connecting electrode are disposed on the same layer.

24. The display device of claim 23, further comprising a first pad layer, the first pad layer being disposed on the same layer as the source or drain of the at least one transistor and electrically connected to the connection line. The second blocking pattern is disposed on the same layer as the first pad layer.

25. The display device according to claim 19, wherein the coating comprises: A first surface, the first surface being in contact with each of the first substrate and the second substrate; as well as A second surface, which curves from the first surface and is adjacent to the etch stop layer. The second surface of the coating is curved from the surface used to bring the flat upper surface of each of the first and second substrates into contact with the etch stop layer.

26. The display device of claim 25, wherein the coating includes a protrusion extending from the second surface into the etch stop layer.

27. The display device of claim 17, wherein the blocking pattern of the at least one layer comprises: The first layer is closest to the first substrate and the second substrate; as well as Multiple layers above the first layer The first layer of the first blocking pattern has higher chemical resistance to etchants compared to the plurality of layers.

28. The display device according to claim 17, wherein the connecting wire comprises: The first layer is closest to the first substrate and the second substrate; as well as Multiple layers above the first layer The first layer of the connecting line has higher chemical resistance to etchants compared to the plurality of layers.

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