Display panel, preparation method thereof and display device

Abstract

The application provides a display panel, a preparation method thereof and a display device, and solves the problem of low yield of display products in the prior art. The display panel comprises a substrate, a plurality of sub-pixels and a plurality of first packaging portions. The substrate has a plurality of transfer holes. The sub-pixels are located on one side of the substrate. The sub-pixels comprise a first electrode, and part of the first electrode is located in the transfer hole. The plurality of sub-pixels comprises a first sub-pixel. The plurality of first packaging portions corresponds to the plurality of sub-pixels. The first packaging portion is located on the side, away from the substrate, of the corresponding sub-pixel. The orthographic projection of the first packaging portion corresponding to the first sub-pixel on the substrate covers the orthographic projection of the transfer hole on the substrate.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display panel, its manufacturing method, and a display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) and flat panel displays based on light-emitting diodes (LEDs) are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers due to their advantages such as high image quality, energy saving, thin body, and wide range of applications, becoming the mainstream of display devices.

[0003] However, the yield rate of current display products is low. Summary of the Invention

[0004] In view of this, the present application provides a display panel, a method for manufacturing the same, and a display device, which solves the problem of low yield of display products in the prior art.

[0005] The first aspect of this application provides a display panel, which includes a substrate, a plurality of sub-pixels, and a plurality of first encapsulation portions. The substrate has a plurality of transition holes. The sub-pixels are located on one side of the substrate and include a first electrode, a portion of which is located within the transition hole. The plurality of sub-pixels each include a first sub-pixel. The plurality of first encapsulation portions correspond to the plurality of sub-pixels and are located on the side of the corresponding sub-pixel away from the substrate. The orthographic projection of the first encapsulation portion corresponding to the first sub-pixel on the substrate covers the orthographic projection of the transition hole on the substrate.

[0006] In conjunction with the first aspect, in some possible implementations, the plurality of sub-pixels further include other sub-pixels with a different emission color than the first sub-pixel. The portions of the first electrode of the first sub-pixel and the other sub-pixels are respectively located within the corresponding adapter holes. The orthographic projection of the first encapsulation portion corresponding to the first sub-pixel on the substrate respectively covers the orthographic projection of the adapter hole corresponding to the first sub-pixel on the substrate and the orthographic projection of the adapter hole corresponding to the other sub-pixels on the substrate. Preferably, the orthographic projection of the first encapsulation portion corresponding to the first sub-pixel on the substrate and the orthographic projection of the first encapsulation portion corresponding to the adjacent other sub-pixels on the substrate have a first overlapping region. Preferably, in the direction from the first sub-pixel to the adjacent other sub-pixels, the length of the first overlapping region is greater than or equal to 1.5 micrometers and less than or equal to 2.5 micrometers. Preferably, the first sub-pixel is a blue sub-pixel.

[0007] In conjunction with the first aspect, in some possible implementations, the orthographic projection of the adapter hole on the substrate is located within the first overlapping region; preferably, in the direction from the first sub-pixel to the adjacent remaining sub-pixels, the length of the adapter hole is less than or equal to the length of the first overlapping region.

[0008] In conjunction with the first aspect, in some possible implementations, within the first overlapping region, the first encapsulation portion corresponding to the first sub-pixel and the first encapsulation portions corresponding to the adjacent remaining sub-pixels are spaced apart in a direction perpendicular to the substrate; preferably, within the first overlapping region, the first encapsulation portion corresponding to the first sub-pixel is located on the side of the first encapsulation portion corresponding to the remaining sub-pixels closer to the substrate.

[0009] In conjunction with the first aspect, in some possible implementations, the remaining sub-pixels include a second sub-pixel and a third sub-pixel, and the orthographic projection of the first encapsulation portion corresponding to the second sub-pixel on the substrate and the orthographic projection of the first encapsulation portion corresponding to the third sub-pixel on the substrate have a second overlapping region; preferably, in the direction from the second sub-pixel to the third sub-pixel, the length of the second overlapping region is greater than or equal to 1.5 micrometers and less than or equal to 2.5 micrometers; preferably, the second sub-pixel is a green sub-pixel and the third sub-pixel is a red sub-pixel.

[0010] In conjunction with the first aspect, in some possible implementations, within the second overlapping region, the first encapsulation portion corresponding to the second sub-pixel and the first encapsulation portion corresponding to the adjacent third sub-pixel are spaced apart in a direction perpendicular to the substrate; preferably, the first encapsulation portion corresponding to the second sub-pixel is located on the side of the first encapsulation portion corresponding to the adjacent third sub-pixel closer to the substrate.

[0011] In conjunction with the first aspect, in some possible implementations, the orthographic projections of the first encapsulation portion corresponding to the first sub-pixel, the first encapsulation portion corresponding to the second sub-pixel, and the first encapsulation portion corresponding to the third sub-pixel on the substrate have a third overlapping region; preferably, the orthographic projection of a portion of the adapter hole on the substrate is located within the third overlapping region; preferably, within the third overlapping region, in a direction perpendicular to the substrate, the first encapsulation portion corresponding to the first sub-pixel, the first encapsulation portion corresponding to the second sub-pixel, and the first encapsulation portion corresponding to the third sub-pixel are sequentially spaced apart.

[0012] In conjunction with the first aspect, in some possible implementations, the third sub-pixels are arranged along a first direction parallel to the substrate; preferably, in the first direction, the orthographic projections of the first encapsulation portions corresponding to adjacent third sub-pixels on the substrate are spaced apart; preferably, in the first direction, the orthographic projections of the first encapsulation portions corresponding to adjacent third sub-pixels on the substrate overlap.

[0013] In conjunction with the first aspect, in some possible implementations, an isolation structure is also included, located on one side of the substrate, the isolation structure enclosing an isolation opening, and at least a portion of the sub-pixel is located within the isolation opening; preferably, a pixel definition layer is also included, located between the isolation structure and the substrate, the pixel definition layer enclosing a pixel opening, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation opening on the substrate.

[0014] In conjunction with the first aspect, in some possible implementations, the isolation structure includes a first part and a second part, the first part being located on the side of the second part closer to the substrate, and the orthographic projection of the first part on the substrate being located within the orthographic projection of the second part on the substrate; preferably, the sub-pixel further includes a light-emitting functional layer and a second electrode, the light-emitting functional layer being located on the side of the first electrode facing away from the substrate, and the second electrode being located on the side of the light-emitting functional layer facing away from the substrate; preferably, the second electrode and the first part overlap; preferably, the material of the first part is aluminum, copper, or silver; preferably, the material of the second part is titanium or molybdenum; preferably, a portion of the first part is deposited in the adapter hole.

[0015] In conjunction with the first aspect, in some possible implementations, the isolation structure further includes a third part located on the side of the second part closer to the substrate, with the orthographic projection of the first part on the substrate located within the orthographic projection of the third part on the substrate; preferably, the material of the third part is molybdenum or titanium; preferably, a portion of the third part is deposited within the adapter hole.

[0016] In conjunction with the first aspect, in some possible implementations, the substrate includes a substrate, a conductive layer and a planarization layer disposed sequentially, with a transition hole located in the planarization layer, and the first electrode electrically connected to the conductive layer through the transition hole.

[0017] In conjunction with the first aspect, in some possible implementations, a pixel definition layer is also included, located on one side of the substrate, the pixel definition layer enclosing a pixel opening, the pixel opening exposing at least a portion of the first electrode; preferably, the pixel definition layer is made of an inorganic material; preferably, a portion of the pixel definition layer is deposited within the adapter hole.

[0018] In conjunction with the first aspect, in some possible implementations, an organic encapsulation layer is further included, located on the side of the first encapsulation portion away from the substrate, wherein the orthographic projection of the organic encapsulation layer on the substrate covers the orthographic projection of the first encapsulation portion on the substrate; preferably, an inorganic encapsulation layer is further included, located on the side of the organic encapsulation layer away from the substrate, wherein the orthographic projection of the inorganic encapsulation layer on the substrate covers the orthographic projection of the organic encapsulation layer on the substrate.

[0019] A second aspect of this application provides a display panel, which includes a substrate, a plurality of sub-pixels, and a plurality of first encapsulation portions. The substrate has a plurality of transfer holes, the sub-pixels are located on one side of the substrate, and each sub-pixel includes a first electrode, a portion of which is located within the transfer hole. The first encapsulation portions correspond to the sub-pixels, and at least some adjacent first encapsulation portions have overlapping regions in their orthographic projections on the substrate. The orthographic projections of the transfer holes on the substrate are located within the overlapping regions.

[0020] A third aspect of this application provides a method for manufacturing a display panel, comprising providing a substrate having a plurality of transfer holes; fabricating a plurality of first electrodes on one side of the substrate, portions of the first electrodes being located within the transfer holes; sequentially fabricating a first light-emitting material layer, a first sub-pixel second electrode material layer, and a first inorganic encapsulation material layer on the side of the first electrodes facing away from the substrate, and patterning the first inorganic encapsulation material layer, the first sub-pixel second electrode material layer, and the first light-emitting material layer to obtain a first sub-pixel and a first encapsulation portion corresponding to the first sub-pixel, wherein the orthographic projection of the first encapsulation portion corresponding to the first sub-pixel on the substrate covers the orthographic projection of the transfer holes on the substrate.

[0021] In conjunction with the third aspect, in some possible implementations, the method further includes: sequentially preparing a second light-emitting material layer, a second electrode material layer of the second sub-pixel, and a second inorganic encapsulation material layer on the side of the first encapsulation portion corresponding to the first sub-pixel away from the substrate, and patterning the second inorganic encapsulation material layer, the second electrode material layer of the second sub-pixel, and the second light-emitting material layer to obtain the second sub-pixel and the first encapsulation portion corresponding to the second sub-pixel, wherein the orthographic projection of the first encapsulation portion corresponding to the second sub-pixel on the substrate and the orthographic projection of the first encapsulation portion corresponding to the first sub-pixel on the substrate have an overlapping area, and the orthographic projection of a portion of the transition hole on the substrate is located within the overlapping area.

[0022] In conjunction with the third aspect, in some possible implementations, the method further includes: sequentially preparing a third light-emitting material layer, a third sub-pixel second electrode material layer, and a third inorganic encapsulation material layer on the side of the first encapsulation portion corresponding to the second sub-pixel away from the substrate, and patterning the third inorganic encapsulation material layer, the third sub-pixel second electrode material layer, and the third light-emitting material layer to obtain a third sub-pixel and a first encapsulation portion corresponding to the third sub-pixel, wherein the orthographic projection of the first encapsulation portion corresponding to the third sub-pixel on the substrate and the orthographic projection of the first encapsulation portion corresponding to the first sub-pixel on the substrate have an overlapping area, and the orthographic projection of a portion of the transition hole on the substrate is located within the overlapping area.

[0023] In conjunction with the third aspect, in some possible implementations, before sequentially preparing a first light-emitting material layer, a first sub-pixel second electrode material layer, and a first inorganic encapsulation material layer on the side of the first electrode away from the substrate, and patterning the first inorganic encapsulation material layer, the first sub-pixel second electrode material layer, and the first light-emitting material layer to obtain the first sub-pixel and the first encapsulation portion corresponding to the first sub-pixel, the method further includes: preparing an isolation material layer on the side of the first electrode away from the substrate, and patterning the isolation material layer to obtain an isolation structure and an isolation opening formed by the isolation structure.

[0024] The fourth aspect of this application provides a display device, including the display panel described above, or the display panel obtained by the preparation method described above.

[0025] The display panel, its manufacturing method, and the display device provided in this application embodiment, by setting the transition hole within the orthographic projection of the first encapsulation part corresponding to the first sub-pixel on the substrate, ensure that the first encapsulation part corresponding to the first sub-pixel covers the transition hole, thereby avoiding the film layer above the transition hole being eroded by the etching solution in subsequent processes, which would damage the structure of the display panel and improve the yield of the display panel. Attached Figure Description

[0026] Figure 1 This is a top view of the display panel provided in the embodiments of this application.

[0027] Figure 2 yes Figure 1 The diagram shows a cross-sectional view of the display panel along the A-A' direction.

[0028] Figure 3 yes Figure 1 The diagram shows a cross-sectional view of the display panel along the B-B' direction.

[0029] Figure 4 This is a top view of the display panel provided in the second embodiment of this application.

[0030] Figure 5 This is a cross-sectional structural diagram of the display panel provided in the third embodiment of this application.

[0031] Figure 6 This is a flowchart of the method for manufacturing a display panel provided in the first embodiment of this application.

[0032] Figures 7a-7c This is a schematic diagram of the structure of the intermediate product obtained by executing the preparation method provided in the first embodiment of this application.

[0033] Figure 8 This is a flowchart of the method for manufacturing a display panel provided in the second embodiment of this application.

[0034] Figures 9a to 9bThis is a schematic diagram of the structure of the intermediate product obtained by executing the preparation method provided in the second embodiment of this application.

[0035] Figure 10 This is a schematic diagram of the structure of a display device provided in an embodiment of this application. Detailed Implementation

[0036] In the process of developing this invention, the inventors discovered the following problems in the related technology: With the rapid development of display technology, panel size is no longer limited by fine metal masks. As an alternative technical means, an isolation structure is usually set in the display panel to isolate the film layers deposited on the isolation structure, such as the organic light-emitting functional layer and cathode layer of adjacent light-emitting devices, thereby eliminating the need for a fine metal mask in the display panel manufacturing process. However, because the isolation structure sinks into the anode hole, there is a step difference in the metal at the top of the isolation structure. During subsequent etching, over-etching is prone to occur, leading to chemical intrusion, damage to the isolation structure, and the generation of dark spots, affecting the yield of display products.

[0037] In view of this, the display panel, its manufacturing method, and the display device provided in the embodiments of this application, by setting the adapter hole within the orthographic projection of the first encapsulation part corresponding to the first sub-pixel on the substrate, ensure that the first encapsulation part corresponding to the first sub-pixel covers the adapter hole, thereby avoiding the film layer above the adapter hole being eroded by the etching solution in subsequent processes, which would damage the structure of the display panel and improve the yield of the display panel.

[0038] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0039] In the accompanying drawings, the dimensions of layers and regions may be exaggerated for clarity. It is understood that when a structure is referred to as being "on" or "below" another structure, the structure may be directly on or below the other structure, or there may be intermediate structures. The same reference numerals always indicate the same structure. Structures referred to herein include any of the following: membrane, element, device, component, assembly.

[0040] When a structure is referred to as being “connected” to another structure, it can be directly connected to the other structure or indirectly connected to the other structure by means of one or more intermediate structures placed between them.

[0041] Patent CN118251982A, Patent 202410864269.8, Patent PCT / CN2024 / 098407, Patent PCT / CN2024 / 102783, Patent PCT / CN2024 / 098217, Patent PCT / CN2024 / 099419, Patent PCT / CN2024 / 099072, Patent CN117979755A, Patent CN11799890 Patents CN117062489A, CN117580403A, CN116583155A, CN116669477A, ​​CN117396039A, CN116669480A, CN116600606A, and CN117500332A describe relevant technical solutions for isolation structures and encapsulation layers, the contents of which are incorporated herein by reference.

[0042] Figure 1 This is a top view of the display panel provided in an embodiment of this application. For example... Figure 1 As shown, the display panel includes a substrate 11, a plurality of sub-pixels 12, and a plurality of first encapsulation portions 13. The substrate 11 has a plurality of transition holes 111. The plurality of sub-pixels 12 are located on one side of the substrate 11. Each sub-pixel 12 includes a first electrode 121, a portion of which is located within the transition hole 111. Each sub-pixel 12 includes a first sub-pixel 1201. The plurality of first encapsulation portions 13 correspond to the plurality of sub-pixels 12. The first encapsulation portions 13 are located on the side of the corresponding sub-pixel 12 facing away from the substrate 11. The orthographic projection of the first encapsulation portion 13 corresponding to the first sub-pixel 1201 on the substrate 11 covers the orthographic projection of the transition hole 111 on the substrate 11.

[0043] In one embodiment, the correspondence between a plurality of first encapsulation parts 13 and a plurality of sub-pixels 12 can be understood as one first encapsulation part 13 corresponding to one sub-pixel 12, or it can be understood as one first encapsulation part 13 corresponding to a plurality of sub-pixels 12 with the same emission color.

[0044] The substrate 11 may be a substrate substrate. In some embodiments, the substrate substrate may be a glass substrate. In some embodiments, the substrate substrate may include organic resin materials such as epoxy resin, triazine, silicone resin, or polyimide. For example, the substrate substrate may be an FR4 type printed circuit board (PCB), or a flexible PCB that is easily deformable. In some embodiments, the substrate substrate may include ceramic materials such as silicon nitride, aluminum nitride, or aluminum oxide, or include metals or metal compounds. For example, the substrate substrate may be a metal core PCB (MCPCB) or a metal copper clad laminate (MCCL).

[0045] Furthermore, in one embodiment, the substrate 11 may have a driving circuit for driving multiple light-emitting devices to emit light of corresponding colors. For example, the substrate 11 may include a substrate layer, a barrier layer, a buffer layer, a gate insulator (GI), a capacitance insulator (CI), a gate, a source and drain, an interlayer dielectric (ILD), etc.

[0046] Figure 2 yes Figure 1 The diagram shows a cross-sectional view of the display panel along the A-A' direction. Figure 2 As shown, in one specific embodiment, the substrate 11 includes a substrate 112, a conductive layer 113 and a planarization layer 114 disposed sequentially, with a transition hole 111 located in the planarization layer 114, and the first electrode 121 electrically connected to the conductive layer 113 through the transition hole 111.

[0047] In one embodiment, the sub-pixel 12 includes a first electrode 121 and a second electrode 122, and at least one light-emitting functional layer 123 located between the first electrode 121 and the second electrode 122. The light-emitting functional layer 123 is located on the side of the first electrode 121 facing away from the substrate 11, and the second electrode 122 is located on the side of the light-emitting functional layer 123 facing away from the substrate 11. The first electrode 121 may be an anode, and the second electrode 122 may be a cathode. The at least one light-emitting functional layer 123 includes an emitting layer (EML), and may further include at least one of a hole injection layer (HIL), a hole transport layer (HTL), and an electron-blocking layer (EBL) located between the anode and the emitting layer (EML), and at least one of an electron injection layer (EIL), an electron transport layer (ETL), and a hole-blocking layer (HBL) located between the cathode and the emitting layer (EML).

[0048] In one embodiment, the first sub-pixel 1201 is a blue sub-pixel.

[0049] In one embodiment, the plurality of sub-pixels also include other sub-pixels whose emission color is different from that of the first sub-pixel 1201. The first electrode 121 of the first sub-pixel 1201 and the remaining sub-pixels are respectively located in the corresponding adapter hole 111. The orthographic projection of the first encapsulation part 13 corresponding to the first sub-pixel 1201 on the substrate 11 covers the orthographic projection of the adapter hole 111 corresponding to the first sub-pixel 1201 on the substrate 11, and the orthographic projection of the adapter hole 111 corresponding to the remaining sub-pixels on the substrate 11.

[0050] In one embodiment, the orthographic projection of the first encapsulation portion 13 corresponding to the first sub-pixel 1201 on the substrate 11 and the orthographic projection of the first encapsulation portion 13 corresponding to the adjacent remaining sub-pixels on the substrate 11 have a first overlapping area M1, so as to avoid the first encapsulation portion 13 breaking and causing dark spots.

[0051] In one embodiment, in the direction from the first sub-pixel 1201 to the remaining sub-pixels, the length L1 of the first overlapping region is greater than or equal to 1.5 micrometers and less than or equal to 2.5 micrometers. For example, the length L1 of the first overlapping region can be 1.5 micrometers, 2 micrometers, 2.5 micrometers, etc.

[0052] In one embodiment, within the first overlapping region M1, the first encapsulation portion 13 corresponding to the first sub-pixel 1201 and the first encapsulation portion 13 corresponding to the adjacent remaining sub-pixels are spaced apart in the direction Z perpendicular to the substrate 11.

[0053] In one further embodiment, within the first overlapping region M1, the first encapsulation portion 13 corresponding to the first sub-pixel 1201 is located on the side of the first encapsulation portion 13 corresponding to the adjacent remaining sub-pixels that is closer to the substrate 11.

[0054] In one embodiment, the orthographic projection of the adapter hole 111 on the substrate 11 is located within the first overlapping region M1, that is, two first encapsulation portions 13 are provided above the adapter hole 111, which can prevent the first encapsulation portion 13 from being over-etched in subsequent processes, and the etching solution from damaging the underlying film layer from the over-etched area.

[0055] In one further embodiment, in the direction from the first sub-pixel 1201 to the adjacent remaining sub-pixels, the length of the transition hole 111 is less than or equal to the length L1 of the first overlapping region M1.

[0056] Please refer to it again. Figure 1 In one embodiment, the remaining sub-pixels include a second sub-pixel 1202 and a third sub-pixel 1203. The orthographic projection of the first encapsulation portion 13 corresponding to the second sub-pixel 1202 on the substrate 11 and the orthographic projection of the first encapsulation portion 13 corresponding to the third sub-pixel 1203 on the substrate 11 have a second overlapping area M2, which avoids the first encapsulation portion 13 breaking and causing dark spots.

[0057] In one embodiment, the second sub-pixel 1202 is a green sub-pixel, and the third sub-pixel 1203 is a red sub-pixel.

[0058] Figure 3 yes Figure 1 The diagram shows a cross-sectional view of the display panel along the B-B' direction. Figure 3 As shown, in one embodiment, in the direction from the second sub-pixel 1202 to the third sub-pixel 1203, the length L2 of the second overlapping region M2 is greater than or equal to 1.5 micrometers and less than or equal to 2.5 micrometers. For example, the length L2 of the second overlapping region M2 can be 1.5 micrometers, 2 micrometers, 2.5 micrometers, etc.

[0059] In one embodiment, within the second overlapping region M2, the first encapsulation portion 13 corresponding to the second sub-pixel 1202 and the first encapsulation portion 13 corresponding to the adjacent third sub-pixel 1203 are spaced apart in the direction Z perpendicular to the substrate 11.

[0060] In one further embodiment, the first encapsulation portion 13 corresponding to the second sub-pixel 1202 is located on the side of the first encapsulation portion 13 corresponding to the adjacent third sub-pixel that is close to the substrate 11.

[0061] Please refer to it again. Figure 1 In one embodiment, the first encapsulation portion 13 corresponding to the first sub-pixel 1201, the first encapsulation portion 13 corresponding to the second sub-pixel 1202, and the first encapsulation portion 13 corresponding to the third sub-pixel 1203 have a third overlapping region M3 on the substrate 11 to avoid the first encapsulation portion 13 breaking and causing dark spots.

[0062] In one embodiment, the orthographic projection of a portion of the adapter hole 111 onto the substrate 11 is located within the third overlapping region M3.

[0063] In one further embodiment, within the third overlapping region M3, in a direction perpendicular to the substrate 11, the first encapsulation portion 13 corresponding to the first sub-pixel 1201, the first encapsulation portion 13 corresponding to the second sub-pixel 1202, and the first encapsulation portion 13 corresponding to the third sub-pixel 1203 are sequentially spaced apart.

[0064] Please refer to it again. Figure 1 In one embodiment, the third sub-pixel 1203 is arranged along a first direction X parallel to the substrate.

[0065] In one manner, in the first direction X, the orthographic projections of the first encapsulation portion 13 corresponding to the adjacent third sub-pixel 1203 on the substrate 11 are spaced apart.

[0066] Figure 4 This is a top view of the display panel provided in the second embodiment of this application. Figure 4 As shown, in one manner, in the first direction X, the orthographic projection portions of the first encapsulation portion 13 corresponding to the adjacent third sub-pixel 1203 on the substrate 11 overlap.

[0067] Please refer to it again. Figure 2 In one embodiment, the display panel further includes a pixel definition layer 14 located on one side of the substrate 11, the pixel definition layer 14 enclosing a pixel opening 141. The pixel opening 141 exposes at least a portion of the first electrode 121.

[0068] In one embodiment, the material of the pixel definition layer 14 can be an inorganic material.

[0069] In one embodiment, the pixel definition layer 14 can be a light-transmitting material to allow light from the sub-pixels 12 to pass through the pixel definition layer more effectively. Optionally, the pixel definition layer 14 can be an opaque material, which can improve the light absorption of the pixel definition layer 14, reduce the reflectivity of the display panel, further reduce optical crosstalk between adjacent sub-pixels 12, and improve the display effect of the display panel.

[0070] In one specific embodiment, a portion of the pixel definition layer 14 is deposited within the adapter hole 111.

[0071] In one embodiment, the display panel further includes an isolation structure 15, which can isolate the light-emitting functional layer 123 and the second electrode 122 of a plurality of sub-pixels 12. The isolation structure 15 is located on one side of the substrate 11. Specifically, the isolation structure 15 is located on the side of the pixel definition layer 14 away from the substrate 11. The isolation structure 15 encloses an isolation opening Q, and at least a portion of the sub-pixels 12 is located within the isolation opening Q.

[0072] In one embodiment, the orthographic projection of the pixel opening 141 on the substrate 11 is located within the orthographic projection of the isolation opening Q on the substrate 11.

[0073] In one embodiment, the isolation structure 15 includes a first part 151 and a second part 152 stacked together. The first part 151 is located on the side of the second part 152 closer to the substrate 11, and the orthographic projection of the second part 152 on the substrate 11 covers the orthographic projection of the first part 151 on the substrate 11. Exemplarily, the first part 151 can be designed as an independent film layer, meaning there is no physical interface within the first part 151, and all parts are made of the same material, such as aluminum, copper, or silver. Alternatively, the first part 151 can be designed as being composed of at least two film layers stacked together. For example, the first part 151 is formed by stacking two conductive film layers. The materials of the two conductive film layers can be molybdenum and aluminum, respectively, and the conductive film layer made of molybdenum is located between the substrate 11 and the conductive film layer made of aluminum. Exemplarily, the first part 151 includes a conductive portion, or the first part 151 itself is a conductive structure. The first part 151 and the second electrode 122 of the sub-pixel 12 are connected to each other so that the second electrodes 122 of adjacent sub-pixels 12 are electrically connected to each other, thereby realizing a full-surface cathode. The material of the second part 152 can be an organic material, an inorganic material, or a metallic material, such as molybdenum or titanium. If the second part 152 is a metallic material, the material of the second part 152 can be titanium.

[0074] In one embodiment, a portion of the first part 151 is deposited within the adapter hole 111.

[0075] In one embodiment, the isolation structure 15 further includes a third portion 153 located on the side of the first portion 151 near the substrate 11, wherein the orthographic projection of the first portion 151 onto the substrate 11 falls within the orthographic projection range of the third portion 153 onto the substrate 11. The material of the third portion 153 is molybdenum or titanium. For example, the first portion 151 is a conductive film layer made of aluminum, and the third portion 153 is a conductive film layer made of molybdenum. In this case, the cross-section of the isolation structure 15 is I-shaped. Of course, in other embodiments, the third portion 153 is a conductive film layer made of titanium.

[0076] In one embodiment, a portion of the third part 153 is deposited within the adapter hole 111.

[0077] The display panel provided in this application embodiment ensures that the first encapsulation part corresponding to the first sub-pixel is covered by the first encapsulation part on the substrate by setting the adapter hole. This avoids the film layer above the adapter hole being eroded by the etching solution in subsequent processes, which would damage the structure of the display panel and improve the yield of the display panel.

[0078] Figure 5 This is a schematic cross-sectional view of the display panel provided in the third embodiment of this application. Figure 5 As shown, in one embodiment, the display panel further includes an organic encapsulation layer 16, which is located on the side of the first encapsulation portion 13 facing away from the substrate 11. The orthographic projection of the organic encapsulation layer 16 on the substrate 11 covers the orthographic projection of the first encapsulation portion 13 on the substrate 11. Exemplarily, the material of the organic encapsulation layer 16 is a fiber material, a resin material, or a multilayer board material, etc. The organic encapsulation layer 16 can be a single layer, a multilayer, a composite layer, etc.

[0079] The display panel also includes an inorganic encapsulation layer 17, which is located on the side of the organic encapsulation layer 16 facing away from the substrate 11. The orthographic projection of the inorganic encapsulation layer 17 onto the substrate 11 covers the orthographic projection of the organic encapsulation layer 16 onto the substrate 11. For example, the material of the inorganic encapsulation layer 17 is silicon oxide, silicon oxynitride, or silicon nitride, etc. The inorganic encapsulation layer 17 can be a single layer, multiple layers, composite layers, etc.

[0080] Please refer to it again. Figure 1 This application embodiment also provides a display panel, which includes a substrate 11, a plurality of sub-pixels 12 and a plurality of first encapsulation portions 13. The substrate 11 has a plurality of transfer holes 111. The sub-pixels 12 are located on one side of the substrate 11. The sub-pixels 12 include a first electrode 121. A portion of the first electrode 121 is located in the transfer hole 111. The first encapsulation portions 13 correspond to the sub-pixels 12. At least a portion of the orthographic projections of adjacent first encapsulation portions on the substrate 11 have overlapping areas. The orthographic projections of the transfer holes 111 on the substrate 11 are located within the overlapping areas.

[0081] The display panel provided according to the embodiments of this application belongs to the same inventive concept as the display panel provided in the foregoing embodiments of this application, and has corresponding film layer structures and beneficial effects. Details not described in detail in the embodiments of this display panel can be found in the embodiments section of the foregoing display panel, and will not be repeated here.

[0082] This application also provides a method for manufacturing a display panel. Figure 6 This is a flowchart illustrating a method for fabricating a display panel according to the first embodiment of this application. This fabrication method is used to fabricate the display panel provided in any of the above embodiments. Figure 6 As shown, the preparation method includes:

[0083] Step S610: Provide a substrate having a plurality of adapter holes.

[0084] Step S620: A plurality of first electrodes are fabricated on one side of the substrate, with portions of the first electrodes located within the adapter hole.

[0085] In step S630, a first light-emitting material layer, a first sub-pixel second electrode material layer, and a first inorganic encapsulation material layer are sequentially prepared on the side of the first electrode away from the substrate. The first inorganic encapsulation material layer, the first sub-pixel second electrode material layer, and the first light-emitting material layer are patterned to obtain the first sub-pixel and the first encapsulation part corresponding to the first sub-pixel. The orthographic projection of the first encapsulation part corresponding to the first sub-pixel on the substrate covers the orthographic projection of the adapter hole on the substrate.

[0086] Figures 7a-7c This is a schematic diagram of the structure of the intermediate product obtained by executing the preparation method provided in the first embodiment of this application. The preparation method specifically includes:

[0087] Please refer to step S610. Figure 7a The substrate 11 has multiple adapter holes 111.

[0088] In one specific embodiment, the substrate 11 includes a substrate 112, a conductive layer 113 and a planarization layer 114 disposed sequentially, with the adapter hole 111 located in the planarization layer 114.

[0089] Please refer to step S620. Figure 7b A plurality of first electrodes 121 are formed on one side of the substrate 11, and a portion of the plurality of first electrodes 121 is located within the adapter hole 111.

[0090] In one embodiment, the first electrode 121 is electrically connected to the conductive layer 113 via a transition hole 111.

[0091] Please refer to step S630. Figure 7c A first light-emitting material layer, a first sub-pixel second electrode material layer, and a first inorganic encapsulation material layer are sequentially prepared on the side of the first encapsulation portion 13 corresponding to the first sub-pixel 1201 away from the substrate 11. The first inorganic encapsulation material layer, the first sub-pixel second electrode material layer, and the first light-emitting material layer are patterned to obtain the first sub-pixel 1201 and the first encapsulation portion 13 corresponding to the first sub-pixel 1201. The orthographic projection of the first encapsulation portion 13 corresponding to the first sub-pixel 1201 on the substrate 11 covers the orthographic projection of the adapter hole 111 on the substrate 11.

[0092] In one embodiment, before the first electrode 121 is fabricated on the side facing away from the substrate 11, a first light-emitting material layer, a first sub-pixel second electrode material layer, and a first inorganic encapsulation material layer are sequentially fabricated, and before the first inorganic encapsulation material layer, the first sub-pixel second electrode material layer, and the first light-emitting material layer are patterned to obtain the first sub-pixel 1201 and the first encapsulation portion 13 corresponding to the first sub-pixel 1201, the fabrication method further includes:

[0093] An isolation material layer is prepared on the side of the first electrode 121 away from the substrate 11, and the isolation material layer is patterned to obtain the isolation structure 15 and the isolation opening Q formed by the isolation structure.

[0094] In one embodiment, an isolation material layer is prepared using a film-forming process, and then the isolation material layer is patterned to obtain the isolation structure 15. For example, a groove can first be formed on the isolation material layer using a dry etching process, and then the sidewalls of the groove can be further etched using a wet etching process to form an undercut structure.

[0095] In one embodiment, the preparation method may further include: preparing an organic encapsulation layer and an inorganic encapsulation layer on the side of the first encapsulation portion 13 away from the substrate 11.

[0096] Figure 8 This is a flowchart illustrating a method for fabricating a display panel according to a second embodiment of this application. This fabrication method is used to fabricate the display panel provided in any of the above embodiments. Figure 8 As shown, the preparation method includes:

[0097] In step S640, a second light-emitting material layer, a second electrode material layer for the second sub-pixel, and a second inorganic encapsulation material layer are sequentially prepared on the side of the first encapsulation portion away from the substrate. The second inorganic encapsulation material layer, the second electrode material layer for the second sub-pixel, and the second light-emitting material layer are patterned to obtain the first encapsulation portion corresponding to the second sub-pixel. The orthographic projection of the first encapsulation portion corresponding to the second sub-pixel on the substrate and the orthographic projection of the first sub-pixel on the substrate have an overlapping area. The orthographic projection of some of the transition holes on the substrate is located in the overlapping area.

[0098] In step S650, a third light-emitting material layer, a third sub-pixel second electrode material layer, and a third inorganic encapsulation material layer are sequentially prepared on the side of the first encapsulation portion corresponding to the second sub-pixel away from the substrate. The third inorganic encapsulation material layer, the third sub-pixel second electrode material layer, and the third light-emitting material layer are patterned to obtain the third sub-pixel and the first encapsulation portion corresponding to the third sub-pixel. The orthographic projection of the first encapsulation portion corresponding to the third sub-pixel on the substrate and the orthographic projection of the first encapsulation portion corresponding to the first sub-pixel on the substrate have an overlapping area. The orthographic projection of some of the transition holes on the substrate is located in the overlapping area.

[0099] Figures 9a to 9bThis is a schematic diagram of the structure of the intermediate product obtained by executing the preparation method provided in the second embodiment of this application. The preparation method specifically includes:

[0100] Please refer to step S640. Figure 9a A second light-emitting material layer, a second electrode material layer, and a second inorganic encapsulation material layer are sequentially prepared on the side of the first encapsulation portion 13 corresponding to the first sub-pixel 1201 away from the substrate 11. The second inorganic encapsulation material layer, the second electrode material layer, and the second light-emitting material layer are patterned to obtain the second sub-pixel 1202 and the first encapsulation portion 13 corresponding to the second sub-pixel 1202. The orthographic projection of the first encapsulation portion 13 corresponding to the second sub-pixel 1202 on the substrate 11 and the orthographic projection of the first encapsulation portion 13 corresponding to the first sub-pixel 1201 on the substrate 11 have an overlapping area. The orthographic projection of part of the transition hole 111 on the substrate 11 is located in the overlapping area.

[0101] Please refer to step S650. Figure 9b A third light-emitting material layer, a third sub-pixel second electrode material layer, and a third inorganic encapsulation material layer are sequentially prepared on the side of the first encapsulation portion 13 corresponding to the second sub-pixel 1202 away from the substrate 11. The third inorganic encapsulation material layer, the third sub-pixel second electrode material layer, and the third light-emitting material layer are patterned to obtain the third sub-pixel 1203 and the first encapsulation portion 13 corresponding to the third sub-pixel 1203. The orthographic projection of the first encapsulation portion 13 corresponding to the third sub-pixel 1203 on the substrate 11 and the orthographic projection of the first encapsulation portion 13 corresponding to the first sub-pixel 1201 on the substrate 11 have an overlapping area. The orthographic projection of part of the transition hole 111 on the substrate 11 is located in the overlapping area.

[0102] Figure 10 This is a schematic diagram of the structure of a display device provided in an embodiment of this application. Figure 10 As shown, the display device is a product with image display capabilities. For example, the display device can be used to display static images, such as pictures or photographs. The display device can also be used to display dynamic images, such as videos.

[0103] Display devices can be laptops, mobile phones, handheld or portable computers, cameras, camcorders, in-vehicle smart central control screens, calculators, smartwatches, GPS navigators, electronic photographs, electronic billboards or signs, projectors, etc.

[0104] The display device includes the display panel 100 provided in any of the above embodiments or the display panel 100 obtained by the manufacturing method provided in any of the above embodiments. The display panel 100 may be an organic light-emitting diode display substrate or a quantum dot electroluminescent display substrate.

[0105] In addition, the display device can also perform functions such as taking photos, recording videos, fingerprint recognition, and facial recognition. Accordingly, the display device also includes at least one functional module for implementing the above functions, such as an under-display camera or an under-display fingerprint recognition sensor.

[0106] The basic principles of this application have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this application are merely examples and not limitations, and should not be considered as essential features of each embodiment of this application. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the application to the necessity of employing the aforementioned specific details for implementation.

[0107] The above description has been given for purposes of illustration and description. Furthermore, this description is not intended to limit the embodiments of this application to the forms disclosed herein. Although numerous exemplary aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, alterations, additions, and sub-combinations thereof.

Claims

1. A display panel, characterized in that, include: The substrate has multiple adapter holes; Multiple sub-pixels are located on one side of the substrate, each sub-pixel including a first electrode, a portion of which is located within the adapter hole; the multiple sub-pixels include the first sub-pixel; and A plurality of first encapsulation portions, each of the plurality of first encapsulation portions corresponding to a plurality of the sub-pixels, wherein the first encapsulation portion is located on the side of the corresponding sub-pixel away from the substrate; The orthographic projection of the first encapsulation portion corresponding to the first sub-pixel on the substrate covers the orthographic projection of the adapter hole on the substrate.

2. The display panel according to claim 1, characterized in that, The plurality of sub-pixels also include other sub-pixels with different emission colors from the first sub-pixel. The portions of the first electrodes of the first sub-pixel and the other sub-pixels are respectively located in the corresponding adapter holes. The orthographic projection of the first package portion corresponding to the first sub-pixel on the substrate covers the orthographic projection of the adapter hole corresponding to the first sub-pixel on the substrate and the orthographic projection of the adapter hole corresponding to the other sub-pixels on the substrate. Preferably, the orthographic projection of the first encapsulation portion corresponding to the first sub-pixel on the substrate and the orthographic projection of the first encapsulation portion corresponding to the adjacent remaining sub-pixels on the substrate have a first overlapping area; Preferably, in the direction from the first sub-pixel to the adjacent remaining sub-pixels, the length of the first overlapping region is greater than or equal to 1.5 micrometers and less than or equal to 2.5 micrometers. Preferably, the first sub-pixel is a blue sub-pixel.

3. The display panel according to claim 2, characterized in that, The orthographic projection of the adapter hole on the substrate is located within the first overlapping area; Preferably, in the direction from the first sub-pixel to the adjacent remaining sub-pixels, the length of the transition hole is less than or equal to the length of the first overlapping region.

4. The display panel according to claim 2, characterized in that, Within the first overlapping region, the first encapsulation portion corresponding to the first sub-pixel and the first encapsulation portions corresponding to the adjacent remaining sub-pixels are spaced apart in a direction perpendicular to the substrate. Preferably, within the first overlapping region, the first encapsulation portion corresponding to the first sub-pixel is located on the side of the first encapsulation portion corresponding to the remaining sub-pixels closer to the substrate.

5. The display panel according to claim 2, characterized in that, The remaining sub-pixels include a second sub-pixel and / or a third sub-pixel, and the orthographic projection of the first encapsulation portion corresponding to the second sub-pixel on the substrate and the orthographic projection of the first encapsulation portion corresponding to the third sub-pixel on the substrate have a second overlapping area; Preferably, in the direction from the second sub-pixel to the third sub-pixel, the length of the second overlapping region is greater than or equal to 1.5 micrometers and less than or equal to 2.5 micrometers. Preferably, the second sub-pixel is a green sub-pixel, and the third sub-pixel is a red sub-pixel.

6. The display panel according to claim 5, characterized in that, In the second overlapping region, the first encapsulation portion corresponding to the second sub-pixel and the first encapsulation portion corresponding to the adjacent third sub-pixel are spaced apart in a direction perpendicular to the substrate; Preferably, the first encapsulation portion corresponding to the second sub-pixel is located on the side of the first encapsulation portion corresponding to the adjacent third sub-pixel that is closer to the substrate.

7. The display panel according to claim 5, characterized in that, The first encapsulation portion corresponding to the first sub-pixel, the first encapsulation portion corresponding to the second sub-pixel, and the first encapsulation portion corresponding to the third sub-pixel have a third overlapping region on the substrate; Preferably, the orthographic projection of a portion of the adapter hole on the substrate is located within the third overlapping region; Preferably, in the third overlapping region, in a direction perpendicular to the substrate, the first encapsulation portion corresponding to the first sub-pixel, the first encapsulation portion corresponding to the second sub-pixel, and the first encapsulation portion corresponding to the third sub-pixel are sequentially spaced apart.

8. The display panel according to claim 5, characterized in that, The third sub-pixel is arranged along a first direction parallel to the substrate; Preferably, in the first direction, the orthographic projections of the first encapsulation portions corresponding to adjacent third sub-pixels on the substrate are spaced apart; Preferably, in the first direction, the orthographic projection portions of the first encapsulation portions corresponding to adjacent third sub-pixels overlap on the substrate.

9. The display panel according to claim 1, characterized in that, It also includes an isolation structure located on one side of the substrate, the isolation structure enclosing an isolation opening, and at least a portion of the sub-pixel being located within the isolation opening; Preferably, it further includes a pixel definition layer, which is located between the isolation structure and the substrate. The pixel definition layer encloses a pixel opening, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation opening on the substrate.

10. The display panel according to claim 9, characterized in that, The isolation structure includes a first part and a second part, the first part being located on the side of the second part closer to the substrate, and the orthographic projection of the first part on the substrate being located within the orthographic projection of the second part on the substrate; Preferably, the sub-pixel further includes a light-emitting functional layer and a second electrode, wherein the light-emitting functional layer is located on the side of the first electrode opposite to the substrate, and the second electrode is located on the side of the light-emitting functional layer opposite to the substrate; Preferably, the second electrode and the first part overlap; Preferably, the material of the first part is aluminum, copper or silver; Preferably, the material of the second part is titanium or molybdenum; Preferably, a portion of the first part is deposited within the adapter hole.

11. The display panel according to claim 10, characterized in that, The isolation structure further includes a third part, which is located on the side of the second part closer to the substrate, and the orthographic projection of the first part on the substrate is located within the orthographic projection of the third part on the substrate; Preferably, the material of the third part is molybdenum or titanium; Preferably, a portion of the third part is deposited within the adapter hole.

12. The display panel according to claim 1, characterized in that, The substrate includes a substrate, a conductive layer and a planarization layer arranged sequentially, the adapter hole is located in the planarization layer, and the first electrode is electrically connected to the conductive layer through the adapter hole.

13. The display panel according to claim 12, characterized in that, It also includes a pixel definition layer located on one side of the substrate, the pixel definition layer enclosing a pixel opening, the pixel opening exposing at least a portion of the first electrode; Preferably, the pixel definition layer is made of an inorganic material; Preferably, a portion of the pixel definition layer is deposited within the adapter hole.

14. The display panel according to claim 1, characterized in that, It also includes an organic encapsulation layer located on the side of the first encapsulation portion away from the substrate, wherein the orthogonal projection of the organic encapsulation layer on the substrate covers the orthogonal projection of the first encapsulation portion on the substrate; Preferably, it further includes an inorganic encapsulation layer located on the side of the organic encapsulation layer opposite to the substrate, wherein the orthographic projection of the inorganic encapsulation layer on the substrate covers the orthographic projection of the organic encapsulation layer on the substrate.

15. A display panel, characterized in that, include: The substrate has multiple adapter holes; Multiple sub-pixels are located on one side of the substrate, and each sub-pixel includes a first electrode, a portion of which is located within the adapter hole; as well as A plurality of first encapsulation portions, each corresponding to the sub-pixel, wherein at least some adjacent first encapsulation portions have overlapping regions in their orthographic projections on the substrate, and the orthographic projection of the adapter hole on the substrate is located within the overlapping region.

16. A method for manufacturing a display panel, characterized in that, include: A substrate is provided, the substrate having a plurality of adapter holes; A plurality of first electrodes are fabricated on one side of the substrate, and portions of the first electrodes are located within the transition hole; A first light-emitting material layer, a first sub-pixel second electrode material layer, and a first inorganic encapsulation material layer are sequentially prepared on the side of the first electrode away from the substrate. The first inorganic encapsulation material layer, the first sub-pixel second electrode material layer, and the first light-emitting material layer are patterned to obtain a first sub-pixel and a first encapsulation part corresponding to the first sub-pixel. The orthographic projection of the first encapsulation part corresponding to the first sub-pixel on the substrate covers the orthographic projection of the adapter hole on the substrate.

17. The preparation method according to claim 16, characterized in that, The method further includes: A second light-emitting material layer, a second electrode material layer, and a second inorganic encapsulation material layer are sequentially prepared on the side of the first encapsulation portion corresponding to the first sub-pixel away from the substrate. The second inorganic encapsulation material layer, the second electrode material layer, and the second light-emitting material layer are patterned to obtain the second sub-pixel and the first encapsulation portion corresponding to the second sub-pixel. The orthographic projection of the first encapsulation portion corresponding to the second sub-pixel on the substrate and the orthographic projection of the first encapsulation portion corresponding to the first sub-pixel on the substrate have an overlapping area. The orthographic projection of part of the adapter hole on the substrate is located in the overlapping area.

18. The preparation method according to claim 17, characterized in that, The method further includes: A third light-emitting material layer, a third sub-pixel second electrode material layer, and a third inorganic encapsulation material layer are sequentially prepared on the side of the first encapsulation portion corresponding to the second sub-pixel away from the substrate. The third inorganic encapsulation material layer, the third sub-pixel second electrode material layer, and the third light-emitting material layer are patterned to obtain the third sub-pixel and the first encapsulation portion corresponding to the third sub-pixel. The orthographic projection of the first encapsulation portion corresponding to the third sub-pixel on the substrate and the orthographic projection of the first encapsulation portion corresponding to the first sub-pixel on the substrate have an overlapping area. The orthographic projection of part of the adapter hole on the substrate is located in the overlapping area.

19. The preparation method according to claim 16, characterized in that, Before sequentially fabricating a first light-emitting material layer, a first sub-pixel second electrode material layer, and a first inorganic encapsulation material layer on the side of the first electrode away from the substrate, and patterning the first inorganic encapsulation material layer, the first sub-pixel second electrode material layer, and the first light-emitting material layer to obtain the first sub-pixel and the first encapsulation portion corresponding to the first sub-pixel, the method further includes: An isolation material layer is prepared on the side of the first electrode away from the substrate, and the isolation material layer is patterned to obtain an isolation structure and an isolation opening formed by the isolation structure.

20. A display device, characterized in that, The display panel includes any one of the display panels described in claims 1-15, or the display panel obtained by the preparation method described in claims 16-19.

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