Method of separating ceramic substrates

Abstract

The application discloses a ceramic substrate splitting method, and relates to the technical field of ceramic substrate processing. The ceramic substrate splitting method comprises the following steps: firstly, based on the total thickness of the ceramic substrate, the cutting depth, the material bending strength and the force size, the minimum distance between the force position and the cutting groove is calculated through a mechanical model; then, on the two parts of the substrate that need to be separated, a pair of forces or moments with opposite directions and similar sizes are synchronously applied at the determined force position, so that the substrate is turned outwards along the cutting groove until the residual part is broken. Through the synchronous operation of the two sides and the quantitative control of the force distance, the standardization and stabilization of the splitting process are realized, the splitting quality and consistency are significantly improved, the defective rate is reduced, and a scientific basis is provided for process optimization and equipment design.

Description

Technical Field

[0001] This invention relates to the field of ceramic substrate processing technology, specifically to a method for separating ceramic substrates. Background Technology

[0002] Ceramic substrates, with their excellent high-temperature resistance, high insulation, and good thermal conductivity, have become core basic components in fields such as semiconductor power devices, new energy vehicle electronic control modules, and high-end electronic equipment. In the processing of thick ceramic substrates (thickness ≥ 1.0 mm), to avoid problems such as substrate edge damage and internal stress concentration caused by full cutting, the industry generally adopts a semi-cutting process, that is, the cutting depth is less than the total thickness of the substrate, and the remaining part is finally separated by manual breaking.

[0003] Existing technologies typically employ a board separation method where the substrate is fixed on one side and flipped outwards on the other. This method has the following drawbacks: 1. Uneven force leads to slanted edge: During single-sided operation, one side of the substrate is fixed and the other side is subjected to a flipping force, which makes the force on both sides of the substrate asymmetrical. The ceramic material itself is extremely brittle. Under the action of non-uniform torque, the cracks in the remaining uncut part cannot be straight-lined along the cutting groove, which easily produces a slanted fracture, i.e., a slanted edge, which affects the dimensional accuracy and edge quality of the product. 2. Unstable operation leading to edge chipping or breakage: When fixing the substrate on one side, the lack of a stable support structure makes the fixed side prone to shaking or displacement due to fatigue from long-term operation or slight external interference. This can cause the two parts of the substrate to collide during separation, resulting in edge chipping or even complete breakage and scrapping of the substrate. 3. Over-reliance on personal experience leads to large quality fluctuations: The quality of the board separation (such as whether slanted edges or chipped edges are produced) is highly dependent on the operator's feel, strength, and experience; there are significant differences in the quality of board separation between different operators and between different batches of the same operator, resulting in poor consistency and making it difficult to meet the standardized quality requirements of large-scale production. 4. Vague process parameters make scientific control impossible: Existing technologies lack scientific quantitative standards for core operating parameters of plate separation (such as the distance between the force application position and the cutting groove), relying entirely on the operator's experience to make judgments. It is impossible to establish a process window or provide scientific reverse guidance for the preceding cutting process (such as cutting depth).

[0004] In summary, to address the problems existing in the prior art, this invention proposes a method for separating ceramic substrates. Summary of the Invention

[0005] The purpose of this invention is to provide a method for separating ceramic substrates to solve the problems mentioned in the prior art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: A method for separating ceramic substrates includes the following steps: S1: Determine the distance of force application Determine the minimum distance D between the applied force position and the cutting groove. min The calculation formula is as follows: ; S2: The board is separated by a synchronous, symmetrical outward flipping method on both sides. On the two parts of the substrate that need to be separated, at the force application position determined in step S1, a pair of forces or torques with opposite directions and similar magnitudes are applied simultaneously to make the substrate flip outward along the cutting groove until the remaining part breaks.

[0007] Furthermore, let the total thickness of the ceramic substrate be H, the cutting depth be d, and the remaining uncut thickness h be Hd; the effective length of the cutting groove be L; and the bending strength of the ceramic material be σ. b Let F be the unilateral force that can be stably applied by the operator or equipment.

[0008] Furthermore, considering the portion with residual thickness h as a rectangular cross-section beam subjected to bending moment, the critical fracture moment required for ideal fracture of this portion is M. c .

[0009] Furthermore, the critical fracture bending moment M c The calculation formula is: .

[0010] Furthermore, W is the section modulus, calculated using the following formula: .

[0011] Furthermore, I represents the moment of inertia of the beam section, calculated using the following formula: .

[0012] Furthermore, when separating the plates manually or using equipment, the torque formed by the applied unilateral force F and the force application distance D is M, and the value of M is F×D.

[0013] Furthermore, to ensure reliable fracture, the following conditions must be met. The calculation formula is derived. .

[0014] Furthermore, when separating panels manually or using equipment, the applicable theoretical minimum application distance D can be calculated based on the typical stable application force value of the operator group or the output force value of the equipment. min During operation, ensure that the actual force application distance on both sides is not less than this calculated value.

[0015] Furthermore, when separating boards manually or using equipment, D is first calculated using the above formula based on the substrate specifications, operator skill, or equipment output force. minThen, when separating the plates, the operator or equipment follows the synchronous flipping method described in step S2, ensuring that the force application positions on both sides are at least D away from the center of the cutting groove. min This allows for an optimized and controllable board splitting operation.

[0016] Furthermore, in actual operation, the distance at which the force is applied should not be less than the calculated D. min Combined with simultaneous flipping operations on both sides, stable and high-quality board separation is achieved.

[0017] In the above technical solution, the operation mode of synchronous symmetrical outward flipping on both sides ensures that the forces on both sides of the substrate are symmetrical and stable during the separation process, avoiding cracks and skewing caused by uneven forces on one side, and also eliminating the risk of collision between the two parts due to unstable fixation on one side.

[0018] Compared with the prior art, the beneficial effects of the present invention are: 1. The present invention describes a method for separating ceramic substrates. The present invention ensures the symmetry of the fracture torque by performing a synchronous symmetrical flipping operation on both sides, so that the force on both sides of the substrate is uniform and the crack is guided to extend in a straight line along the cutting groove, which fundamentally reduces the generation of oblique edges. At the same time, the synchronous movement on both sides avoids the relative shaking and collision of the two parts of the substrate during the separation process, effectively preventing edge chipping and overall breakage, reducing the scrap rate and improving the product yield.

[0019] 2. The present invention describes a method for separating ceramic substrates. When separating substrates manually or with equipment, the present invention introduces a force application distance calculation formula based on a mechanical model, which transforms the operation that originally relied on personal feel and experience into a quantifiable and replicable standardized process. Different operators or equipment only need to operate according to the uniformly calculated force application distance to obtain consistent high-quality separation results, which significantly improves production stability and product consistency.

[0020] 3. The method for separating ceramic substrates described in this invention establishes a quantitative relationship between cutting depth, material bending strength, applied force, and applied force distance through a force-application distance calculation formula. This not only guides on-site operations but also allows for reverse optimization of the cutting process. For example, when the calculated applied force distance exceeds the actual allowable range of the substrate, it can guide the preceding process to increase the cutting depth, achieving cross-process collaborative optimization. Furthermore, this force-application distance calculation formula can also guide the development of specialized tools: providing clear mechanical design targets (the required torque M) for designing force-saving levers, assistive clamps, or automated separating equipment. c This provides a basis for equipment development.

[0021] 4. The method for separating ceramic substrates described in this invention uses the operator's actual force application capacity or the equipment's output force value as input parameters when separating the substrates manually or with equipment. This ensures that the set force application distance is within a safe, comfortable, and continuous operating range, avoiding excessive force or operator fatigue caused by unreasonable parameters, and embodies a human-centered design concept. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the operation of the synchronous symmetrical plate splitting method on both sides. Detailed Implementation

[0023] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] In the following specific implementation: Material bending strength σ b The pressure is 400 MPa; the unilateral force F that the operator or equipment can stably apply is 20 N.

[0025] Example 1: A method for separating ceramic substrates, which provides a stable and easy-to-operate separation process for substrates with a thickness of 0.38mm; Includes the following steps: S1: Determine the distance of force application Given fixed parameters: the unilateral stabilizing force F on the equipment is 20N, and the material's bending strength σ b The strength is 400MPa, the total thickness H of the ceramic substrate is 0.38mm, and the effective length L of the cutting groove is 8mm. Initial setting of auxiliary parameters: The initial cutting depth d is set to 35%H, which is 0.133mm, then the remaining uncut thickness h is 0.247mm; Core parameter calculation: according to the formula Calculate the minimum distance D between the point where the force is applied by the calculation device and the cutting groove. min Approximately 1.63 mm; Operational feasibility assessment: The minimum safe force application distance D allowed by the physical properties of this substrate. practical min It is 5.0mm, due to D practical min (5.0mm)>D min (1.63mm), the process is feasible; Parameters determined: The core operating parameter, force application distance, is set to 6.0 mm, and the auxiliary parameter, cutting depth, is set to 0.133 mm. S2: The board is separated by a synchronous, symmetrical outward flipping method on both sides. S2-1: The equipment clamps the two parts of the partially cut substrate that need to be separated; S2-2: With the cutting groove as the boundary, the distance between the force application position of the equipment and the cutting groove is 6.0mm. At the same time, a pair of opposite forces with a magnitude of 20N are applied simultaneously to make the substrate flip outward along the cutting groove until the remaining part breaks.

[0026] Example 2: A method for separating ceramic substrates, which provides a stable and easy-to-operate separation process for substrates with a thickness of 0.635mm; Includes the following steps: S1: Determine the distance of force application Given fixed parameters: the unilateral stabilizing force F on the equipment is 20N, and the material's bending strength σ b The strength is 400MPa, the total thickness H of the ceramic substrate is 0.635mm, and the effective length L of the cutting groove is 10mm. Initial setting of auxiliary parameters: The initial cutting depth d is set to 40%H, which is 0.254mm, then the remaining uncut thickness h is 0.381mm; Core parameter calculation: according to the formula Calculate the minimum distance D between the point where the force is applied by the calculation device and the cutting groove. min Approximately 4.84 mm; Operational feasibility assessment: The feasible force application distance for this substrate is 5-15mm. Since the feasible force application distance (5-15mm) > D min (4.84mm), the process is feasible; Parameters determined: The core operating parameter, force application distance, is set to 8.0 mm, and the auxiliary parameter, cutting depth, is set to 0.254 mm. S2: The board is separated by a synchronous, symmetrical outward flipping method on both sides. S2-1: The equipment clamps the two parts of the partially cut substrate that need to be separated; S2-2: With the cutting groove as the boundary, the distance between the force application position of the equipment and the cutting groove is 8.0mm. At the same time, a pair of opposite forces with a magnitude of 20N are applied simultaneously to make the substrate flip outward along the cutting groove until the remaining part breaks.

[0027] Example 3: A method for separating ceramic substrates, which provides a stable and easy-to-operate separation process for substrates with a thickness of 1.0 mm; Includes the following steps: S1: Determine the distance of force application Given fixed parameters: By training the operator to master a constant 20N force and fixed hand gestures, the operator can stably apply a force F of 20N with one hand. The material's bending strength σ bThe strength is 400MPa, the total thickness H of the ceramic substrate is 1.0mm, and the effective length L of the cutting groove is 12mm. Initial setting of auxiliary parameters: The initial cutting depth d is set to 50%H, which is 0.50mm, then the remaining uncut thickness h is Hd and 0.50mm; Core parameter calculation: according to the formula Calculate the minimum distance D between the operator's hands applying force and the cutting groove. min It is 10.00mm; Operational feasibility assessment: The maximum allowable force application distance D of this substrate max The theoretical minimum force application distance is 12mm. min (10.00mm), close to the maximum allowable force distance D of the substrate. max (12mm), the process is barely feasible, but it results in limited tolerance for errors in actual operation (only 2mm), which poses a quality risk; Parameter optimization: To broaden the tolerance for errors in actual operation, the preceding cutting process is co-optimized: Assuming the cutting depth d is 55%H, which is 0.55mm, the remaining uncut thickness h is 0.45mm. Recalculation is then performed to obtain the minimum distance D between the operator's hands applying force and the cutting groove. min It is 8.10mm, due to the maximum force application distance D max (12mm)>D min (8.10mm), the process is feasible; Parameters determined: The core operating parameter, force application distance, is set to 10.0 mm, and the auxiliary parameter, cutting depth, is set to 0.55 mm. S2: The board is separated by a synchronous, symmetrical outward flipping method on both sides. S2-1: The operator holds the two parts of the partially cut substrate that need to be separated with both hands; S2-2: With the cutting groove as the boundary, the distance between the position of both hands applying force and the cutting groove is 10.0mm. Both hands simultaneously and synchronously apply a pair of opposite forces of 20N each, causing the substrate to flip outward along the cutting groove until the remaining part breaks.

[0028] Example 4: A method for separating ceramic substrates, which provides a stable and easy-to-operate separation process for substrates with a thickness of 0.8mm; Includes the following steps: S1: Employ an automated decision-making system and design parameters. Given fixed parameters: the unilateral stabilizing force F on the equipment is 20N, and the material's bending strength σ b The strength is 400MPa, the total thickness H of the ceramic substrate is 0.8mm, and the effective length L of the cutting groove is 9mm. Input parameters: H is 0.8mm, D max It is 7mm; Initial setting of auxiliary parameters: The initial cutting depth d is set to 40%H, which is 0.32mm, then the remaining uncut thickness h is 0.48mm; Core parameter calculation: according to the formula Calculate the minimum distance D between the point where the force is applied by the calculation device and the cutting groove. min Approximately 6.91 mm; Automatic Diagnosis: System Comparison D min (6.91mm) and D max (7mm), due to D min Very close to D max The process is in a critical state, and the system judgment risk is high; Automatic optimization suggestions for auxiliary parameters: The system calculates in reverse according to the formula to optimize D. min To reduce the cutting depth to a safe value (e.g., 6.0 mm), the h value needs to be decreased. It is recommended to increase the cutting depth d to 0.38 mm (47.5% H), making h 0.42 mm. Then, recalculate to obtain the minimum distance D between the force application position of the equipment and the cutting groove. min Approximately 5.29 mm; Output the final process parameters: the auxiliary parameter cutting depth d is 0.38mm, and the core operation parameter force application distance is set to 6.0mm; S2: The board is separated by a synchronous, symmetrical outward flipping method on both sides. S2-1: The equipment clamps the two parts of the partially cut substrate that need to be separated; S2-2: With the cutting groove as the boundary, the distance between the force application position of the equipment and the cutting groove is 6.0mm. At the same time, a pair of opposite forces with a magnitude of 20N are applied simultaneously to make the substrate flip outward along the cutting groove until the remaining part breaks.

[0029] Example 5: A method for separating ceramic substrates, and the standardization benefits across a full range of applications; Includes the following steps: (1) Process design flow: For any new specification product, the flow is as follows: Determine the total thickness H of the ceramic substrate and the bending strength σ of the ceramic material. b The effective length of the cutting groove is L, and the maximum force application distance on the substrate is D. max ; (2) Initial setting of auxiliary parameters: The cutting depth d is initially set according to the empirical formula (e.g., the total thickness of thin plate is 35%H, and the total thickness of thick plate is 50%H), and h is calculated. (3) Calculation of core parameters: Calculate the minimum distance D between the force application position and the cutting groove. min ; (4) Decision: If D min ≤D max Then set the standard force application distance D.std D min +Δ (Δ is the safety margin); if D min >D max If the system automatically suggests increasing d, return to step (2) for iteration until the condition is met.

[0030] Comparative Example 1: Based on Example 1, the board is separated by fixing one side and flipping the other side outward, including the following steps: S1: Determine the distance of force application Given fixed parameters: the unilateral stabilizing force F on the equipment is 20N, and the material's bending strength σ b The strength is 400MPa, the total thickness H of the ceramic substrate is 0.38mm, and the effective length L of the cutting groove is 8mm. Initial setting of auxiliary parameters: The initial cutting depth d is set to 35%H, which is 0.133mm, then the remaining uncut thickness h is 0.247mm; Core parameter calculation: according to the formula Calculate the minimum distance D between the point where the force is applied by the calculation device and the cutting groove. min Approximately 1.63 mm; Operational feasibility assessment: The minimum safe force application distance D allowed by the physical properties of this substrate. practical min It is 5.0mm, due to D practical min (5.0mm)>D min (1.63mm), the process is feasible; Parameters determined: The core operating parameter, force application distance, is set to 6.0 mm, and the auxiliary parameter, cutting depth, is set to 0.133 mm. S2: The separation process is performed by fixing one side and flipping the other side outward. S2-1: The equipment clamps the two parts of the partially cut substrate that need to be separated; S2-2: With the cutting groove as the boundary, the distance between the force application position of the equipment and the cutting groove is 6.0mm. One side is fixed and the other side is flipped outward with a force of 20N, so that the substrate is flipped outward along the cutting groove.

[0031] Comparative Example 2: Based on Example 1, with step S1 unchanged, the force applied in step S2 is adjusted from 20N to 30N, including the following steps: S1: Determine the distance of force application Given fixed parameters: the unilateral stabilizing force F on the equipment is 20N, and the material's bending strength σ b The strength is 400MPa, the total thickness H of the ceramic substrate is 0.38mm, and the effective length L of the cutting groove is 8mm. Initial setting of auxiliary parameters: The initial cutting depth d is set to 35%H, which is 0.133mm, then the remaining uncut thickness h is 0.247mm; Core parameter calculation: according to the formula Calculate the minimum distance D between the point where the force is applied by the calculation device and the cutting groove. min Approximately 1.63 mm; Operational feasibility assessment: The minimum safe force application distance D allowed by the physical properties of this substrate. practical min It is 5.0mm, due to D practical min (5.0mm)>D min (1.63mm), the process is feasible; Parameters determined: The core operating parameter, force application distance, is set to 6.0 mm, and the auxiliary parameter, cutting depth, is set to 0.133 mm. S2: The board is separated by a synchronous, symmetrical outward flipping method on both sides. S2-1: The equipment clamps the two parts of the partially cut substrate that need to be separated; S2-2: With the cutting groove as the boundary, the distance between the force application position of the equipment and the cutting groove is 6.0mm. At the same time, a pair of forces with opposite directions and a magnitude of 30N are applied simultaneously to make the substrate flip outward along the cutting groove until the remaining part breaks.

[0032] Comparative Example 3: Based on Example 1, with step S1 unchanged, the force applied in step S2 is adjusted from 20N to 10N, including the following steps: S1: Determine the distance of force application Given fixed parameters: the unilateral stabilizing force F on the equipment is 20N, and the material's bending strength σ b The strength is 400MPa, the total thickness H of the ceramic substrate is 0.38mm, and the effective length L of the cutting groove is 8mm. Initial setting of auxiliary parameters: The initial cutting depth d is set to 35%H, which is 0.133mm, then the remaining uncut thickness h is 0.247mm; Core parameter calculation: according to the formula Calculate the minimum distance D between the point where the force is applied by the calculation device and the cutting groove. min Approximately 1.63 mm; Operational feasibility assessment: The minimum safe force application distance D allowed by the physical properties of this substrate. practical min It is 5.0mm, due to D practical min (5.0mm)>D min (1.63mm), the process is feasible; Parameters determined: The core operating parameter, force application distance, is set to 6.0 mm, and the auxiliary parameter, cutting depth, is set to 0.133 mm. S2: The board is separated by a synchronous, symmetrical outward flipping method on both sides. S2-1: The equipment clamps the two parts of the partially cut substrate that need to be separated; S2-2: With the cutting groove as the boundary, the distance between the force application position of the equipment and the cutting groove is 6.0mm. At the same time, a pair of forces with opposite directions and a magnitude of 10N are applied simultaneously to make the substrate flip outward along the cutting groove until the remaining part breaks.

[0033] Experiment: The defect rate of beveled edges and the chipping rate of the substrates prepared using the separation methods of Examples 1-5 and Comparative Examples 1-3 were tested. Bevel defect rate detection method: Use a microscope to measure the maximum offset of the actual fracture surface relative to the reference, and calculate the tilt angle. The judgment standard is that the bevel angle θ≤2°. Statistically count the proportion of samples with angles exceeding the standard in 10,000 samples, which is the bevel defect rate. Method for detecting edge chipping rate: Use a microscope to measure the maximum chord length (straight line length) of the edge notch (chipping). The criterion is that the chord length of a single chipping edge does not exceed 0.1 mm. The proportion of samples with chipping edges exceeding the size limit in 10,000 samples is the edge chipping rate.

[0034]

[0035] Conclusion: Based on the above experimental data, the following conclusions can be drawn: The experimental data in Table 1 show that in all embodiments using the plate-separation method of the present invention, the defect rate of slanted edges and the occurrence rate of edge breakage are lower than those of Comparative Example 1, which uses single-sided plate-separation, and Comparative Examples 2-3, which use simultaneous operation on both sides but with deviation of force parameters. This fully demonstrates that the present invention, by combining the operation mode of simultaneous symmetrical flipping on both sides with parameter control based on quantitative calculation of force distance, fundamentally solves the core defects such as slanted edges and edge breakage caused by uneven force and unstable operation in traditional plate-separation processes, and greatly improves product consistency and reliability.

[0036] This invention can significantly and stably improve the quality of sheet metal separation: in comparison of all thickness specifications, the defect rate of beveled edges and the occurrence rate of edge breakage using the method of this invention (Examples 1-5) are significantly lower than those of traditional single-sided sheet metal separation or sheet metal separation methods with incorrect parameters, which proves the core advantages of this invention in eliminating beveled edges and preventing edge breakage.

[0037] This invention simplifies the process documentation into a single table, listing product codes, corresponding standard force application distances, and recommended cutting depths, enabling highly standardized management. Simultaneously, it minimizes the impact of human error by training operators to maintain a constant 20N force and fixed hand gestures, or by setting the equipment output force to 20N, thus increasing the consistency of panel separation quality. This truly embodies modern manufacturing principles, completing parameter calculations and process optimization for panel separation during the engineering development phase, requiring only standardized and simplified operating procedures on the production line.

[0038] The effects of this invention are universal: from thin plates (0.38 mm) to thick plates (1.0 mm), the core formula derived by this invention through a mechanical model ( ), can be based on substrate specifications (total thickness H, cutting depth d), substrate material properties (bending strength σ) b The parameters (F) and the applied force can be flexibly adjusted to maintain excellent and consistent quality performance in different application scenarios. In particular, the cutting depth of the thick plate (1.0mm) has been optimized by reverse optimization, which has successfully broadened the process tolerance space, verified the scientific nature of the parameter quantification and cross-process collaborative design of the present invention, and showed that it can adapt to the plate separation needs of ceramic substrates of different thicknesses and specifications, and has a wide range of application scenarios.

[0039] This invention represents a leap from experiential craftsmanship to standardized processes: Comparative examples 2-3 (simultaneous operation on both sides but with incorrect parameters) show that the lack of quantitative parameter guidance still leads to a decline in quality. However, this invention establishes a quantitative relationship between the force application distance, cutting depth, material properties, and the magnitude of the applied force. By training operators to master a constant 20N force feel and fixed hand gestures, or by setting the equipment output force value to 20N, this invention transforms the traditional craftsmanship that relies on operator feel and experience into a replicable and scalable standardized process. This ensures that different operators or equipment can obtain stable and high-quality results, fundamentally solving the industry problem of traditional methods relying on personal experience and resulting in large quality fluctuations.

[0040] In summary, the ceramic substrate separation method provided by this invention is an advanced process that can systematically solve edge bevel and chipping defects, significantly improve product yield and consistency, and achieve standardized operations.

[0041] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A method for separating ceramic substrates, characterized in that: Includes the following steps: S1: Determine the distance of force application Determine the minimum distance D between the applied force position and the cutting groove. min The calculation formula is as follows: ; S2: The board is separated by a synchronous, symmetrical outward flipping method on both sides. On the two parts of the substrate that need to be separated, at the force application position determined in step S1, a pair of forces or torques with opposite directions and similar magnitudes are applied simultaneously to make the substrate flip outward along the cutting groove until the remaining part breaks.

2. The method for separating a ceramic substrate according to claim 1, characterized in that: In step S1, the flexural strength of the ceramic material is σ. b Let the effective length of the cutting groove be L.

3. The method for separating ceramic substrates according to claim 1, characterized in that: In step S1, the total thickness of the ceramic substrate is H, the cutting depth is d, and the remaining uncut thickness h is Hd.

4. The method for separating ceramic substrates according to claim 1, characterized in that: In step S1, let F be the unilateral force that the operator or equipment can stably apply.

5. The method for separating a ceramic substrate according to claim 1, characterized in that: The remaining uncutable thickness h represents a rectangular cross-section beam subjected to bending moment. For this portion to undergo ideal fracture, the required critical fracture moment is M. c .

6. The method for separating a ceramic substrate according to claim 5, characterized in that: The critical fracture bending moment M c The calculation formula is .

7. The method for separating a ceramic substrate according to claim 6, characterized in that: W is the section modulus, calculated using the following formula: .

8. The method for separating a ceramic substrate according to claim 7, characterized in that: I represents the moment of inertia of the beam section, calculated using the following formula: .

9. A method for separating ceramic substrates according to claim 5, characterized in that: The D min The calculation formula is derived from the following formula: .

10. A method for separating ceramic substrates according to claim 1, characterized in that: In step S2, the torque formed by the applied unilateral force F and the force application distance D is M, and the value of M is F×D.

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