Moisture-curable adhesive compositions and various applications thereof

Abstract

Disclosed are moisture-curable adhesive compositions comprising at least a silane-modified polymer, a tackifier, and a crosslinker. Moisture-curing conditions initiate a crosslinking reaction to form a moisture-cured adhesive from the moisture-curable adhesive composition. The moisture-cured adhesive formed from the moisture-curable adhesive composition can be used to form various articles in which the moisture-cured adhesive forms a moisture-cured adhesive layer bonded to a surface of a substrate.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to U.S. Provisional Patent Application Serial No. 63 / 532,241, filed August 11, 2023, the entire contents of which are incorporated herein by reference. Background of the Invention

[0004] A. Field of Invention

[0005] This invention generally relates to moisture-curable adhesives and their various applications. In one aspect, moisture-curable adhesives may comprise specific proportions of components corresponding to a silanized modified polymer, a tackifier, and a crosslinking agent. Compared to other adhesive compositions, such as non-moisture-curable adhesive compositions (e.g., UV-curable acrylic adhesive compositions) or solvent-based adhesive compositions, moisture-curable adhesives offer a variety of advantages. Non-limiting examples of these advantages may include: reduced curing energy consumption, reduced costs (e.g., electricity costs, equipment costs, etc.), reduced carbon dioxide (CO2) emissions associated with reduced electricity demand, reduced CO2 emissions from the combustion of solvents (e.g., for solvent-based adhesive compositions), or combinations thereof (and other possible advantages).

[0006] B. Relevant Technical Description

[0007] Adhesives are used in numerous industries and / or applications. Adhesives requiring curing can consume significant amounts of energy (and correspondingly significant carbon emissions). As an example, some acrylic adhesive compositions can be cured using UV light to initiate a crosslinking reaction. Relatively high electricity costs (and correspondingly high carbon emissions, in the case of power plants generating electricity from fossil fuel combustion) can be associated with the UV curing operation used to initiate crosslinking to form UV-curable acrylic adhesives from such UV-curable acrylic adhesive compositions. As another example, the curing of some solvent-based adhesive compositions can also be associated with relatively high electricity costs (and in some cases, correspondingly high carbon emissions) and CO2 emissions from burning solvents. While attempts have been made to produce high-performance adhesives in ways that reduce energy consumption and / or carbon emissions, current solutions may be complex, costly, and / or still result in poor adhesive performance or relatively limited reductions in energy consumption / carbon emissions. Summary of the Invention

[0008] Solutions have been found to at least one or more problems related to curing adhesive compositions. In one aspect, the solution may include the use of a moisture-curable adhesive composition that can be subjected to moisture-curing conditions to initiate a crosslinking reaction, thereby forming a moisture-curable adhesive from the moisture-curable adhesive composition. In one aspect, the moisture-curable adhesive composition may comprise a combination of multiple components, including at least: a first component corresponding to a hot-melt polymer (e.g., a silanized polymer); a second component corresponding to a crosslinking agent; and a third component corresponding to a tackifier. In a non-limiting aspect, it has been found that moisture-curing conditions correspond to a temperature of at least 100°C to 200°C, preferably 120°C to 160°C, or more preferably 130°C to 150°C, and an absolute humidity of at least 47.5% (e.g., within 50% ± 2.5%). In a non-limiting example, it has been found that moisture-curable adhesive compositions can have improved properties compared to non-moisture-curable adhesive compositions, such as UV-curable acrylic adhesive compositions. A first energy input associated with wet curing conditions was found to be less than a second energy input associated with UV curing conditions for forming a UV-curable acrylic adhesive from a UV-curable acrylic adhesive composition. This finding could be environmentally beneficial, for example, by providing an effective alternative to UV-curable acrylic adhesives that have relatively high electricity costs associated with the UV curing operations required to form a UV-curable acrylic adhesive from a UV-curable acrylic adhesive composition. This finding may also be environmentally beneficial, for example, because the reduction in energy input associated with wet curing can be associated with a reduction in carbon emissions. Specifically, the reduction in energy input represents the difference between the energy inputs associated with the corresponding curing conditions, and a reduction in carbon emissions may be associated with this difference.

[0009] In another aspect of the invention, it has been found that using specific proportions of the components in a moisture-curable adhesive composition can provide the ability to specifically tailor or adjust the material properties of the moisture-curable adhesive composition. It has also been found that the same production line can be used to produce different products (e.g., labels or tapes) with intended end-use applications, and that specific proportions can be easily adjusted on the production line to produce a moisture-curable adhesive designed for a particular application. This allows for the cost-effective and time-efficient switching of a production line from producing one product (e.g., labels) to producing another product (e.g., tapes). It has also been found that specific component proportions determined for a moisture-curable adhesive composition, combined with a specific adhesive thickness, can provide specific characteristic material properties that may be advantageous when the moisture-curable composition is used for a specific end-use application (e.g., articles for a specific application, such as labels for label applications with a moisture-curable adhesive layer bonded to a substrate surface, or tapes for tape applications with a moisture-curable adhesive layer bonded to a substrate surface, etc.).

[0010] In one aspect of the invention, the moisture-curable adhesive composition may comprise various combinations of three components specifically tailored for various end-use applications. It has been found that specific component ratios determined for the moisture-curable adhesive composition provide specific characteristic material properties that may be advantageous when the composition is used for a particular end-use application (e.g., for label applications, for tape applications, etc.).

[0011] In some aspects of the invention, a moisture-curable adhesive composition is described. The moisture-curable adhesive composition may comprise 86% to 94% by weight of a mixture corresponding to part A of the composition, the mixture comprising at least one or more silanized modified polymers, one or more tackifiers, and optionally a first group of additives. The moisture-curable adhesive composition may comprise 6% to 14% by weight of a catalyst package corresponding to part B of the composition, the catalyst package comprising at least one crosslinking agent and optionally a second group of additives. The wet curing conditions for initiating the crosslinking reaction to form a wet-curing adhesive from the wet-curable adhesive composition may correspond to a temperature of at least 100°C to 200°C (or 100°C, 105°C, 110°C, 115°C, 120°C, 125°C, 130°C, 135°C, 140°C, 145°C, 150°C, 155°C, 160°C, 165°C, 170°C, 175°C, 180°C, 185°C, 190°C, 195°C or 200°C or any value or range thereof) and an absolute humidity of 30% to 100% (or 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85%, 90%, 95% or 100%).

[0012] A method for producing a moisture-curing adhesive is also described. The method may include providing a mixture corresponding to part A, wherein the mixture may contain at least one or more silanized modified polymers, one or more tackifiers, and optionally a first group of additives. The method may include adding a catalyst package corresponding to part B to the mixture to form a moisture-curable adhesive composition, wherein the catalyst package may contain at least one crosslinking agent and optionally a second group of additives. In some aspects, 86% to 94% by weight of the moisture-curable adhesive composition corresponds to part A, and 6% to 14% by weight of the moisture-curable adhesive composition corresponds to part B. The method may include subjecting the moisture-curable adhesive composition to moisture-curing conditions to initiate a crosslinking reaction to form a moisture-curable adhesive. The wet curing conditions for initiating the crosslinking reaction to form a wet-curing adhesive from the wet-curable adhesive composition may correspond to a temperature of at least 100°C to 200°C (or 100°C, 105°C, 110°C, 115°C, 120°C, 125°C, 130°C, 135°C, 140°C, 145°C, 150°C, 155°C, 160°C, 165°C, 170°C, 175°C, 180°C, 185°C, 190°C, 195°C or 200°C or any value or range thereof) and an absolute humidity of 30% to 100% (or 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85%, 90%, 95% or 100%).

[0013] A method for producing an article of articles is also described. The method may include forming a moisture-curable adhesive composition comprising 86% to 94% by weight of a mixture corresponding to part A of the composition. The mixture may comprise at least one or more silanized modified polymers, one or more tackifiers, and optionally a first group of additives. The moisture-curable adhesive composition further comprises 6% to 14% by weight of a catalyst package corresponding to part B of the composition, wherein the catalyst package comprises at least one crosslinking agent and optionally a second group of additives. The method may include applying the moisture-curable adhesive composition to a surface of a substrate to form a coated substrate having a moisture-curable adhesive layer on the surface of the substrate. In some aspects, the method may include mixing part A with part B to obtain a mixture and applying the mixture to a substrate. In another aspect, the method may include first applying part A to the substrate, and then subsequently applying part B to the substrate. The method may include subjecting the coated substrate to moisture curing conditions to initiate a crosslinking reaction within the moisture-curable adhesive layer, thereby forming an article having a moisture-curable adhesive layer bonded to the surface of the substrate. Moisture may include water, water vapor, aqueous solutions, or humid air (e.g., air having an absolute humidity of 30% to 100%, preferably 40% to 60%, or more preferably 47% to 53%). The wet curing conditions for initiating the crosslinking reaction to form a wet-curing adhesive from the wet-curable adhesive composition may correspond to a temperature of at least 100°C to 200°C (or 100°C, 105°C, 110°C, 115°C, 120°C, 125°C, 130°C, 135°C, 140°C, 145°C, 150°C, 155°C, 160°C, 165°C, 170°C, 175°C, 180°C, 185°C, 190°C, 195°C or 200°C or any value or range thereof) and an absolute humidity of 30% to 100% (or 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85%, 90%, 95% or 100%).

[0014] Methods of using the moisture-curable adhesive composition of the present invention are also described. In one aspect, the method may include forming a label (e.g., a durable label) using the moisture-curable adhesive composition according to the present invention. In another aspect, the method may include using a moisture-curable adhesive formed from the moisture-curable adhesive composition according to the present invention on the label (e.g., a durable label). In yet another aspect, a method of labeling an article may include applying the label to the surface of the article. Labels include, but are not limited to, carriers of information / data with an adhesive layer that can be affixed to a product, product packaging, or component. Labels such as durable labels may be designed to resist harsh environments, such as solvents, extreme temperatures, moisture, and / or other environmental factors, when used. This resistance helps reduce or avoid degradation of any printed information (e.g., symbols, images, text, photographs, etc.) present on the label. The adhesive used in the label can be designed to adhere to all types of materials, such as metals (e.g., steel, such as stainless steel, aluminum, etc.), glass, plastics (e.g., thermoplastic / thermosetting polymers, including but not limited to polypropylene (PP) polymers, polyethylene (PE) polymers such as high-density (HD) or low-density (LD) PE polymers, acrylonitrile-butadiene-styrene (ABS) polymers, polyethylene terephthalate (PET) polymers, nylon polymers, acrylic polymers, etc.), and paper. The adhesive can be applied to materials with low or high surface energy.

[0015] In another aspect, a method for forming an adhesive tape using a moisture-curable adhesive composition according to the invention is disclosed. In yet another aspect, the method may include using a moisture-curable adhesive formed from the moisture-curable adhesive composition according to the invention in the tape. In yet another aspect, a method for applying an article with an adhesive tape may include applying the tape to the surface of the article. Adhesive tape can help bond two surfaces together, for sealing containers (e.g., cardboard boxes, envelopes, or other closures), for attaching one article to another, etc. The tape may include information (e.g., symbols, images, text, photographs, etc.) or be able to receive information (e.g., by printing or writing). The adhesive used in the tape may be designed to have adhesive properties to all types of materials (e.g., metals (e.g., steel, such as stainless steel, aluminum, etc.), glass, plastics (e.g., thermoplastic / thermosetting polymers, including but not limited to PP polymers, PE polymers such as HDPE or LDPE polymers, ABS polymers, PET polymers, nylon polymers, acrylic polymers, etc.), paper, etc. The adhesive may be applied to materials with low or high surface energy.

[0016] Other embodiments of the invention are discussed throughout this application. Any embodiment discussed with respect to one aspect of the invention is equally applicable to other aspects of the invention, and vice versa. Each embodiment described herein is to be understood as an embodiment of the invention applicable to other aspects of the invention. It is contemplated that any embodiment or aspect discussed herein may be combined with other embodiments or aspects discussed herein, and / or implemented with respect to any method or composition of the invention, and vice versa. Furthermore, the compositions of the invention may be used to implement the methods of the invention.

[0017] The following includes definitions of various terms and phrases used in this specification.

[0018] As used herein, the term "absolute humidity" refers to a humidity level characterized by at least a certain percentage of water molecules in the atmosphere. As an exemplary and non-limiting example, 50% absolute humidity means a humidity level in which 50% of the molecules in the atmosphere are water molecules.

[0019] The terms “about” or “approximately” are defined as close to as understood by one of ordinary skill in the art. In one non-limiting embodiment, these terms are defined as deviations within 10%, preferably within 5%, more preferably within 1%, and most preferably within 0.5%.

[0020] The terms "weight%", "volume%", or "molar%" refer to the percentage by weight, volume, or mole of a component, respectively, based on the total weight of the component, the total volume of the material, or the total number of moles. In a non-limiting example, 10 grams of component in 100 grams of material is 10% by weight of that component.

[0021] When these terms are used in the claims and / or specification, the terms “suppress” or “reduce” or “prevent” or “avoid” or any variations thereof include any measurable reduction or complete suppression to achieve the desired result.

[0022] The term “effective” as used in the specification and / or claims means sufficient to achieve the desired, anticipated, or desired result.

[0023] When an element is used in conjunction with the terms “comprising,” “including,” “containing,” or “having” in the claims or specification without a quantifier, it may mean “one,” but it is also consistent with the meaning of “one or more,” “at least one,” and “one or more.”

[0024] The words “contain,” “have,” “include,” or “contain” are inclusive or open-ended and do not exclude additional, unlisted elements or methodological steps.

[0025] The moisture-curable adhesive compositions of the present invention may “comprising,” “essentially constitute,” or “compose as” the specific ingredients, components, compositions, etc., disclosed in the entire specification. Regarding the transitional phrase “essentially constitute,” in a non-limiting aspect, the essential and novel characteristic of the moisture-curable adhesive compositions of the present invention lies in their ability to contain, in particular preferred or specific proportions, one or more hot-melt polymers (e.g., one or more silanized polymers); crosslinking agents; and tackifiers. These proportions allow for the tailoring of moisture-curable adhesive compositions specifically for particular end-use applications (e.g., manufacturing labels or tapes). Compared to other non-moisture-curable adhesive compositions (e.g., UV-curable acrylic adhesive compositions), the moisture-curable adhesive compositions, moisture-curing adhesives, articles having a moisture-curing adhesive layer bonded to a substrate surface, and various methods of producing such materials of the present invention offer a variety of advantages. Non-limiting examples of these advantages may include: reduced solid energy consumption, reduced costs (e.g., electricity costs, equipment costs, etc.), reduced carbon emissions associated with reduced electricity demand, or combinations thereof (and other possible advantages).

[0026] Other objects, features, and advantages of the present invention will become apparent from the following accompanying drawings, detailed descriptions, and embodiments. However, it should be understood that while the drawings, detailed descriptions, and embodiments illustrate specific embodiments of the invention, they are given by way of illustration only and are not intended to be limiting. Furthermore, it is anticipated that variations and modifications within the spirit and scope of the invention will become apparent to those skilled in the art from these detailed descriptions. In other embodiments, features from a particular embodiment may be combined with features from other embodiments. For example, a feature from one embodiment may be combined with a feature from any other embodiment. In other embodiments, additional features may be added to the specific embodiments described herein. Attached Figure Description

[0027] The advantages of the present invention will become apparent to those skilled in the art from the following detailed description and with reference to the accompanying drawings.

[0028] Figure 1 This is a flowchart illustrating an example of a method for preparing a moisture-curable adhesive composition according to some aspects of the present invention.

[0029] Figure 2 It is a description of some aspects of the invention. Figure 1 A diagram illustrating a method for subjecting a moisture-curable adhesive composition to moisture-curing conditions to form a moisture-curable adhesive.

[0030] Figure 3AData relating to various examples of articles are shown, wherein examples of the wet-curable adhesive compositions according to the invention have been wet-cured to form a wet-curable adhesive layer that bonds to the surface of various substrates. V-344 represents a comparative example of a curable solvent-based pressure-sensitive adhesive (PSA) composition.

[0031] Figure 3B Comparative data is shown to illustrate the exemplary benefit of an expanded / improved production capacity offered by a wet-curable PSA composition (non-solvent-based) compared to a solvent-based PSA composition.

[0032] Figure 3C Comparative data is shown to illustrate another exemplary benefit of lower energy consumption offered by wet-curable PSA compositions (non-solvent-based) compared to solvent-based PSA compositions.

[0033] Figure 3D Comparative data is shown to illustrate another exemplary benefit of lower carbon dioxide (CO2) emissions from wet-curable PSA compositions compared to solvent-based PSA compositions.

[0034] Figure 3E Comparative data is shown to illustrate various exemplary benefits of cost reductions offered by wet-curable PSA compositions (non-solvent-based) compared to solvent-based PSA compositions.

[0035] Figure 4 Data relating to various examples of articles are shown, in which examples of the wet-curable adhesive compositions according to the invention have been wet-cured to form a wet-cured adhesive layer that bonds to the surface of various substrates.

[0036] Figure 5 Data relating to various examples of articles are shown, in which examples of the wet-curable adhesive compositions according to the invention have been wet-cured to form a wet-cured adhesive layer that bonds to the surface of various substrates.

[0037] Figure 6 Data relating to various examples of articles are shown, in which examples of the wet-curable adhesive compositions according to the invention have been wet-cured to form a wet-cured adhesive layer that bonds to the surface of various substrates.

[0038] While the invention is readily adaptable to various modifications and alternatives, specific embodiments thereof are illustrated by way of example in the accompanying drawings. The drawings may not be drawn to scale. Detailed Implementation

[0039] Solutions have been found to address at least one or more problems that may be associated with various adhesive compositions that are curable by means other than moisture curing (e.g., by UV curing). In one aspect, the solution may include using a moisture-curable adhesive composition that can be subjected to moisture curing conditions to initiate a crosslinking reaction, thereby forming a moisture-curable adhesive from the moisture-curable adhesive composition. In another aspect, the moisture-curable adhesive composition may comprise a combination of multiple components, including at least: a first component corresponding to a hot-melt polymer (e.g., one or more “silane-modified” or “silanized” polymers); a second component corresponding to a tackifier; a third component corresponding to a crosslinking agent; and (optionally) a fourth component corresponding to one or more groups of additives. It was found that wet-curing conditions correspond to a temperature of at least 100°C (e.g., 100°C to 200°C, preferably 120°C to 160°C, or more preferably 130°C to 150°C, or even more preferably about 140°C) and an absolute humidity of 30% to 100% (or 40% to 60%, or 45% to 55%, or about 47% to about 53%). In one non-limiting example, it was found that the wet-curable adhesive composition can have improved properties compared to non-wet-curable adhesive compositions, such as UV-curable acrylic adhesive compositions. In another non-limiting example, it was found that the wet-curable adhesive composition has improved properties compared to solvent-based pressure-sensitive adhesive compositions.

[0040] It was also found that a first energy input, associated with wet curing conditions, was less than a second energy input associated with either: (1) UV curing conditions for forming a UV-curable acrylic adhesive from a UV-curable acrylic adhesive composition, or (2) curing conditions for forming a cured pressure-sensitive adhesive composition from a solvent-based pressure-sensitive adhesive composition. This finding is environmentally beneficial, for example, by providing an effective alternative to UV-curable and / or solvent-curable acrylic adhesives, which have relatively high electricity costs associated with UV curing operations of forming UV-curable acrylic adhesives from UV-curable acrylic adhesive compositions. This finding may also be environmentally beneficial, for example, because the reduction in energy input associated with wet curing may be associated with a reduction in carbon emissions. Specifically, the reduction in energy input represents the difference between the energy input amounts associated with the respective curing conditions, and the reduction in carbon emissions may be associated with this difference. It was also found that using specific proportions of the components of a wet-curable adhesive composition can provide the ability to specifically tailor the material properties of the composition.

[0041] In one aspect of the invention, the moisture-curable adhesive composition may comprise various combinations of three components specifically tailored for various end-use applications. It has been found that specific component ratios determined for the moisture-curable adhesive composition provide specific characteristic material properties that may be advantageous when the composition is intended for a particular end-use application (e.g., for label applications, for tape applications, etc.). It has also been found that specific component ratios determined for the moisture-curable adhesive composition, combined with a specific adhesive thickness, can provide specific characteristic material properties that may be advantageous when the moisture-curable composition is used for a particular end-use application (e.g., for articles for a particular application, such as a label for a label application having a moisture-curable adhesive layer bonded to a substrate surface, or a tape for a tape application having a moisture-curable adhesive layer bonded to a substrate surface, etc.).

[0042] These, as well as other non-limiting aspects of the invention, will be discussed in further detail in the following sections.

[0043] A. Moisture-curable adhesive composition

[0044] The wet-curable adhesive composition of the present invention may comprise at least: a first component corresponding to a hot-melt polymer; a second component corresponding to a tackifier; a third component corresponding to a crosslinking agent or a catalyst composition containing a crosslinking agent; and optionally a fourth component corresponding to an additive or an additive package. The wet-curable adhesive composition of the present invention may comprise at least two parts (referred to herein as “Part A” and “Part B”). Part A and Part B may be combined to create a wet-curable adhesive composition. As described below, the first and second components may be included in Part A, and the third component may be included in Part B. The fourth component may be included in Part A or Part B, or in both Part A and Part B.

[0045] In some aspects, the wet-curable adhesive composition may contain 0.1 wt% to 99.9 wt% of a first component corresponding to the hot-melt polymer (or 0.1 wt%, 1 wt%, 2 wt%, 3 wt%, 4 wt%, 5 wt%, 6 wt%, 7 wt%, 8 wt%, 9 wt%, 10 wt%, 11 wt%, 12 wt%, 13 wt%, 14 wt%, 15 wt%, 16 wt%, 17 wt%, 18 wt%, 19 wt%, 20 wt%, 21 wt%, 22 wt%, 23 wt%, 24 wt%, 25 wt%, 26 wt%, 27 wt%, 28 wt%, 29 wt%, 30 wt%, 31 wt%, 32 wt%, 33 wt%, 34 wt%, 35 wt%, 36 wt%, 37 wt%, 38 wt%, 39 wt%, 40 wt%, 41 wt%, 42 wt%, 43 wt%, 44 wt%, 45 wt%, 46 wt%, 47 wt%, 48 wt%). %, 49% by weight, 50% by weight, 51% by weight, 52% by weight, 53% by weight, 54% by weight, 55% by weight, 56% by weight, 57% by weight, 58% by weight, 59% by weight, 60% by weight, 61% by weight, 62% by weight, 63% by weight, 64% by weight, 65% by weight, 66% by weight, 67% by weight, 68% by weight, 69% by weight, 70% by weight, 71% by weight, 72% by weight, 73% by weight, 74% by weight, 75% by weight, 76% by weight, 77% by weight, 78% by weight, 79% by weight, 80% by weight, 81% by weight, 82% by weight, 83% by weight, 84% by weight, 85% by weight, 86% by weight, 87% by weight, 88% by weight, 89% by weight, 90% by weight, 91% by weight, 92% by weight, 93% by weight, 94% by weight, 95% by weight, 96% by weight, 97% by weight, 98% by weight, 99% by weight or 99.9% by weight to 99.9% by weight or any value or range thereof.

[0046] In some aspects, the wet-curable adhesive composition may contain 0.1 wt% to 99.9 wt% of a second component corresponding to the tackifier (or 0.1 wt%, 1 wt%, 2 wt%, 3 wt%, 4 wt%, 5 wt%, 6 wt%, 7 wt%, 8 wt%, 9 wt%, 10 wt%, 11 wt%, 12 wt%, 13 wt%, 14 wt%, 15 wt%, 16 wt%, 17 wt%, 18 wt%, 19 wt%, 20 wt%, 21 wt%, 22 wt%, 23 wt%, 24 wt%, 25 wt%, 26 wt%, 27 wt%, 28 wt%, 29 wt%, 30 wt%, 31 wt%, 32 wt%, 33 wt%, 34 wt%, 35 wt%, 36 wt%, 37 wt%, 38 wt%, 39 wt%, 40 wt%, 41 wt%, 42 wt%, 43 wt%, 44 wt%, 45 wt%, 46 wt%, 47 wt%, 48 wt%). 49% by weight, 50% by weight, 51% by weight, 52% by weight, 53% by weight, 54% by weight, 55% by weight, 56% by weight, 57% by weight, 58% by weight, 59% by weight, 60% by weight, 61% by weight, 62% by weight, 63% by weight, 64% by weight, 65% by weight, 66% by weight, 67% by weight, 68% by weight, 69% by weight, 70% by weight, 71% by weight, 72% by weight, 73% by weight, 74% by weight, 75% by weight, 76% by weight, 77% by weight, 78% by weight, 79% by weight, 80% by weight, 81% by weight, 82% by weight, 83% by weight, 84% by weight, 85% by weight, 86% by weight, 87% by weight, 88% by weight, 89% by weight, 90% by weight, 91% by weight, 92% by weight, 93% by weight, 94% by weight, 95% by weight, 96% by weight, 97% by weight, 98% by weight, 99% by weight or 99.9% by weight to 99.9% by weight or any value or range thereof.

[0047] In some aspects, the wet-curable adhesive composition may contain 0.1 wt% to 99.9 wt% of a third component corresponding to the crosslinking agent (or 0.1 wt%, 1 wt%, 2 wt%, 3 wt%, 4 wt%, 5 wt%, 6 wt%, 7 wt%, 8 wt%, 9 wt%, 10 wt%, 11 wt%, 12 wt%, 13 wt%, 14 wt%, 15 wt%, 16 wt%, 17 wt%, 18 wt%, 19 wt%, 20 wt%, 21 wt%, 22 wt%, 23 wt%, 24 wt%, 25 wt%, 26 wt%, 27 wt%, 28 wt%, 29 wt%, 30 wt%, 31 wt%, 32 wt%, 33 wt%, 34 wt%, 35 wt%, 36 wt%, 37 wt%, 38 wt%, 39 wt%, 40 wt%, 41 wt%, 42 wt%, 43 wt%, 44 wt%, 45 wt%, 46 wt%, 47 wt%, 48 wt%). 49% by weight, 50% by weight, 51% by weight, 52% by weight, 53% by weight, 54% by weight, 55% by weight, 56% by weight, 57% by weight, 58% by weight, 59% by weight, 60% by weight, 61% by weight, 62% by weight, 63% by weight, 64% by weight, 65% by weight, 66% by weight, 67% by weight, 68% by weight, 69% by weight, 70% by weight, 71% by weight, 72% by weight, 73% by weight, 74% by weight, 75% by weight, 76% by weight, 77% by weight, 78% by weight, 79% by weight, 80% by weight, 81% by weight, 82% by weight, 83% by weight, 84% by weight, 85% by weight, 86% by weight, 87% by weight, 88% by weight, 89% by weight, 90% by weight, 91% by weight, 92% by weight, 93% by weight, 94% by weight, 95% by weight, 96% by weight, 97% by weight, 98% by weight, 99% by weight or 99.9% by weight to 99.9% by weight or any value or range thereof.

[0048] In some aspects, the wet-curable adhesive composition may contain 0.001 wt% to 99.999 wt% of (optional) fourth component corresponding to the additive group (or 0.001 wt%, 0.01 wt%, 0.1 wt%, 1 wt%, 2 wt%, 3 wt%, 4 wt%, 5 wt%, 6 wt%, 7 wt%, 8 wt%, 9 wt%, 10 wt%, 11 wt%, 12 wt%, 13 wt%, 14 wt%, 15 wt%, 16 wt%, 17 wt%, 18 wt%, 19 wt%, 20 wt%, 21 wt%, 22 wt%, 23 wt%, 24 wt%, 25 wt%, 26 wt%, 27 wt%, 28 wt%, 29 wt%, 30 wt%, 31 wt%, 32 wt%, 33 wt%, 34 wt%, 35 wt%, 36 wt%, 37 wt%, 38 wt%, 39 wt%, 40 wt%, 41 wt%, 42 wt%, 43 wt%, 44 wt%, 45 wt%, 46 wt%, 47 wt%, 48 wt%). 49% by weight, 50% by weight, 51% by weight, 52% by weight, 53% by weight, 54% by weight, 55% by weight, 56% by weight, 57% by weight, 58% by weight, 59% by weight, 60% by weight, 61% by weight, 62% by weight, 63% by weight, 64% by weight, 65% by weight, 66% by weight, 67% by weight, 68% by weight, 69% by weight, 70% by weight, 71% by weight, 72% by weight, 73% by weight, 74% by weight, 75% by weight, 76% by weight, 77% by weight, 78% by weight, 79% by weight, 80% by weight, 81% by weight, 82% by weight, 83% by weight, 84% by weight, 85% by weight, 86% by weight, 87% by weight, 88% by weight, 89% by weight, 90% by weight, 91% by weight, 92% by weight, 93% by weight, 94% by weight, 95% by weight, 96% by weight, 97% by weight, 98% by weight, 99% by weight, 99.9% by weight, or 99.999% by weight or any value or range thereof from 99.999% to 99.999% by weight.

[0049] Figure 1 This is a flowchart 100 illustrating an example of a method for preparing a moisture-curable adhesive composition according to some aspects of the present invention. See also... Figure 1 This method may include creating part A at 110. Figure 1 As shown, creating part A may include forming a mixture comprising a first component (corresponding to one or more hot melt polymers), a second component (corresponding to one or more tackifiers), and (optionally) a first group of additives, at 112. Figure 1 It is also shown that creating Part A may include mixing these components in various proportions in a mixing apparatus to provide specific adhesive properties for a particular industry or application, at point 114. See also Figure 1 This method may include creating part B at 120. Figure 1 As shown, creating Part B may include providing a catalyst package containing a third component (corresponding to a crosslinking agent) and (optionally) a second set of additives, at position 122. See also Figure 1 The method may include forming a moisture-curable adhesive composition at 130. Figure 1 As shown, forming a wet-curable adhesive composition may include adding a catalyst package corresponding to part B to a mixture corresponding to part A (e.g., before subjecting the mixture to wet-curing conditions), at point 132. In one aspect, the first group of additives and the second group of additives are the same additives. In another aspect, the first group of additives and the second group of additives are different additives.

[0050] Once part A and part B are combined to form the previously mentioned... Figure 1 The aforementioned moisture-curable adhesive composition is capable of being subjected to moisture curing conditions (e.g., temperature and humidity) to cure the composition and form a moisture-curable adhesive.

[0051] Comparative data for Part A / Part B alternatives to V-344 (e.g., an example of a curable solvent-based PSA composition, available from FLEXcon); V-606 (e.g., another example of a curable solvent-based PSA composition, available from FLEXcon); and V-778 (e.g., another example of a curable solvent-based PSA composition, available from FLEXcon) are shown below:

[0052]

[0053] Figure 2 This illustrates adhesive compositions that can be wet-cured according to some aspects of the invention (see, for example...). Figure 1 Figure 200 shows a simplified example of a method for forming a wet-curing adhesive by subjecting it to wet curing conditions. Figure 2 The left side depicts the various stages of the method. Figure 2 The right side depicts a side view of a representative artifact corresponding to a specific stage of the method.

[0054] See Figure 2 The method includes providing a substrate at 210. See also Figure 2 On the right, for reference purposes, an example of a substrate 212 having a characteristic thickness value 214 is also depicted. Figure 2 The method also illustrates a method comprising applying a moisture-curable adhesive composition (see example...) Figure 1The adhesive is applied to the surface of substrate 212 to form a coated substrate having a wettable, curable adhesive layer on the surface of substrate 212, at 220. See also Figure 2 On the right, for reference purposes, an example of an applied wettable curable adhesive layer 222 having a characteristic thickness value 224 is also depicted on an example of a coated substrate 226. Figure 2 The method also illustrates a process involving subjecting the coated substrate to moisture-curing conditions to initiate a cross-linking reaction within a moisture-curable adhesive layer, thereby forming a moisture-curable adhesive layer at 230°. See also Figure 2 At point 231, the moisture curing conditions can correspond to a temperature of 100°C to 200°C (e.g., in some cases about 140°C, as otherwise described herein) and an absolute humidity of 30% to 100% (e.g., in some cases 50% ± 2.5%, as otherwise described herein). See also Figure 2 On the right, for reference purposes, an example of a wet-curing adhesive layer 232 with a characteristic thickness value of 234 is also depicted. Figure 2 The result of subjecting the coated substrate 226 to moisture curing conditions 231 is also shown as the formation of an article (identified by reference numeral 236) having a moisture-cured adhesive layer 232 bonded to the surface of the substrate 212.

[0055] In some respects, Figure 2 A simplified example of the curing method described herein can be performed on a substrate during roll-to-roll manufacturing. It is noteworthy that such a method can be tailored to produce a desired product (e.g., tape) such that the thickness of the wet-curable adhesive composition (see example...) Figure 2 The characteristic thickness values ​​(224, 234) depicted on the right, the overall crosslinking degree, and the tack are all designed for the desired product. If needed, the roll-to-roll production line can be switched to produce different products (e.g., labels), and all components of the production line can remain unchanged; the difference lies in the ratio used to produce part A and part B being modified or adjusted to produce different products (e.g., labels). For a given end-use product or application, this convenience of switching adhesive compositions provides cost and manufacturing efficiency for producing the end-use product. In some respects, references... Figure 2 For example, an article 236 having a moisture-curing adhesive layer 232 bonded to the surface of a substrate 212 can be used in one or more of the following industries or applications: durable labels; pharmaceuticals; bonding and mounting; and healthcare industrial applications.

[0056] Part A

[0057] i. Part A.1 (First Component)

[0058] In some respects, one or more silanized polymers may correspond to one or more monosilylated polymers, one or more polysilylated polymers, or combinations thereof. Illustrative and non-limiting examples of polysilylated polymers and monosilylated polymers (including various combinations thereof) are described herein.

[0059] An example of a polysilylated polymer is a disilylated polymer with a number-average molecular weight of about 16,000 g / mol (or 20 kDa if determined by GPC, with a PI of about 1.6), comprising a main polyurethane chain and two hydrolyzable propylene trimethoxysilane end groups, which are attached to the main polymer chain via urethane functional groups. Another example of a polysilylated polymer is a disilylated polymer with a number-average molecular weight of about 37,000 g / mol (or 38 kDa if determined by GPC, with a PI of about 1.9), comprising a main polyurethane chain and two hydrolyzable propylene trimethoxysilane end groups, which are attached to the main polymer chain via urethane functional groups. Another example of a polysilanized polymer is a bissilanized polymer with a number-average molecular weight (Mn) of at least 20,000 g / mol, comprising a polyether and / or polyurethane backbone and at least two hydrolyzable silanized end groups, which are attached to the backbone of the polymer via urethane or ether functional groups (referred to as linking groups).

[0060] According to some aspects, the polysilanized polymer can correspond to GENIOSIL® STP-E 30 (available from Wacker), which is a bissilanized polymer with a number-average molecular weight of about 18,500 g / mol (or 22 kDa if determined by GPC, with a PI of about 1.2), comprising a main polyurethane chain and two hydrolyzable methylenetrimethoxysilane end groups, which are connected to the main polymer chain via urethane functional groups.

[0061] According to some aspects, the polysilanized polymer can correspond to GENIOSIL® STP-E 35 (available from Wacker), which is a bissilanized polymer with a number-average molecular weight of about 18,600 g / mol (or 22 kDa if determined by GPC, with a PI of about 1.2), comprising a main polyurethane chain and two hydrolyzable propyltrimethoxysilane end groups, which are connected to the main polymer chain via urethane functional groups.

[0062] According to some aspects, the monosilanized polymer can correspond to GENIOSIL® XM20 (available from Wacker), which is a monosilanized polymer with an average molecular weight of about 6000 g / mol (or 8 kDa if determined by GPC) and a PI of about 1.1. It comprises a polyether backbone and hydrolyzable methylene-methyldimethoxysilane end groups, which are attached to the backbone via urethane functional groups.

[0063] According to some aspects, the monosilanized polymer can correspond to GENIOSIL® XM25 (available from Wacker), which is a monosilanized polymer with an average molecular weight of about 6000 g / mol (or 8 kDa if determined by GPC) and a PI of about 1.1. It comprises a polyether backbone and hydrolyzable methylene-methyltrimethoxysilane end groups, which are attached to the backbone via urethane functional groups.

[0064] ii. Part A.2 (Second Component)

[0065] In some respects, the tackifier can correspond to Sylvalite® RE 100 (available from Arizona Chemical), which is a pentaerythritol rosin resin with an OHI of about 50 mg KOH / g, a number-average molecular weight of about 974 g / mol (e.g., a molecular weight Mn of about 1700 Da), and a softening point of 100°C.

[0066] In some respects, the tackifier can correspond to DERTOPHENE® H150 (available from DRT), which is a terpene phenolic resin with an OHI of about 150 mg KOH / g, a number-average molecular weight of about 700 g / mol (e.g., a molecular weight Mn of about 630 Da), and a softening point of 120°C.

[0067] In some respects, the tackifier can correspond to NORSOLENE® W85 (available from CRAY VALLEY), which is an α-methylstyrene resin with an OHI of 0, a number-average molecular weight of approximately 600 g / mol, and a softening point of 85°C.

[0068] In some respects, the tackifier can correspond to NORSOLENE® W10 (available from CRAY VALLEY), which is an α-methylstyrene resin with an OHI of 0, a number-average molecular weight of approximately 750 g / mol, and a softening point of 110°C.

[0069] In some respects, the tackifier can correspond to PICCO®AR 100 (available from EASTMAN), which is a resin obtained by polymerizing a mixture of aromatics containing mainly nine carbon atoms, with an OHI of 0, a number-average molecular weight of 550 g / mol, and a softening point of 100°C.

[0070] In some respects, the tackifier can correspond to DERTOPHENE® 1510 (available from DRT) with a molecular weight Mn of approximately 870 Da.

[0071] In some respects, the tackifier may correspond to Sylvarez® TP240HME (available from Arizona Chemical). In other respects, the tackifier may correspond to Sylvarez® TP95 (available from Arizona Chemical) with a molecular weight Mn of approximately 1200 Da.

[0072] In some respects, the tackifier can correspond to NORSOLENE® W100 (available from CRAY VALLEY) with a molecular weight Mn of approximately 1200 Da. In other respects, the tackifier can correspond to Sylvarez® 510 (available from Arizona Chemical) with a molecular weight Mn of approximately 1740 Da.

[0073] iii. Mixture

[0074] In some aspects, “Part A” of the wet-curable adhesive composition disclosed in this invention may comprise a mixture of at least the following substances: (A.1) one or more silanized modified polymers (also referred to herein as “hot melt” polymers); and (A.2) one or more tackifiers. In some aspects, the mixture may optionally comprise a first group of additives. Examples of such mixtures are shown in Table 1.

[0075]

[0076] 2. Part B

[0077] In some respects, one or more crosslinking catalysts that can be used in the compositions according to the invention can be any catalyst known to those skilled in the art for silanol condensation. Examples of such catalysts include organic derivatives of titanium, such as titanium acetylacetonate; organic derivatives of aluminum, such as aluminum chelates; or amines, such as 1,8-diazabicyclo[5.4.0]undec-7-ene or DBU.

[0078] In some respects, the crosslinking agent can correspond to TYZOR®AA75 (available from DuPont), which contains titanium acetylacetonate.

[0079] In some respects, the crosslinking agent can correspond to TIB-KAT®223 (available from King Industries).

[0080] In some respects, the crosslinking agent can correspond to K-KAT®5218 (available from King Industries), which contains aluminum chelates.

[0081] In some aspects, "Part B" of the wet-curable adhesive composition disclosed in this invention may comprise a catalyst package, which may at least comprise a crosslinking agent and optionally a second group of additives. Examples of such catalyst packages are shown in Table 2.

[0082]

[0083] 3. Additives

[0084] The wet-curable adhesive composition of the present invention may contain additional tackifiers, additives or multiple additives, one or more liquid resins for altering the glass transition temperature (Tg), etc. The wet-curable adhesive composition of the present invention may contain additives in an amount of 0% to 1% by weight based on the total weight of the composition, preferably 0.01% by weight and less than 1% by weight, or 0.5% by weight and less than 1% by weight, or 0% by weight, 0.1% by weight, 0.2% by weight, 0.3% by weight, 0.4% by weight, 0.5% by weight, 0.6% by weight, 0.7% by weight, 0.8% by weight, 0.9% by weight, or 1% by weight, or any range or value between these values. The additives may be present in part A and / or part B of the wet-curable adhesive composition.

[0085] Non-limiting examples of additives include, but are not limited to, fillers, solvents, hygroscopic agents, plasticizers, antioxidants, pigments, colorants, adhesion promoters, UV stabilizers, flame retardant additives, rheology modifiers, waxes, or combinations thereof.

[0086] Non-limiting examples of fillers include organic fillers, inorganic fillers, and mixtures thereof. Regarding organic fillers, any organic filler commonly used in the adhesive field can be used, particularly polymeric fillers. Examples include polyvinyl chloride (PVC), polyolefins, rubber, ethylene vinyl acetate (EVA), aramid fibers such as KEVLAR®, expandable or non-expandable thermoplastic polymer hollow microspheres (e.g., hollow microspheres made of vinylidene chloride / acrylonitrile), one or more thermoplastic polymers selected from those used to prepare HMPSA, such as ethylene vinyl acetate (EVA), or styrene block copolymers (e.g., SIS, SBS, SIBS, SEBS, SEPS, and derivatives thereof, derivatives of which are grafted with, for example, maleic anhydride).

[0087] Non-limiting examples of solvents include hydrophilic solvents (e.g., water) or hydrophobic solvents (e.g., organic liquids such as dimethyl sulfoxide).

[0088] Non-limiting examples of hygroscopic agents (or desiccants) include non-polymerizable hydrolyzable alkoxysilane derivatives with a molecular weight of less than 500 g / mol, preferably selected from trimethoxysilane derivatives and triethoxysilane derivatives. Such agents generally extend the shelf life of the composition during storage before use and during transport. For example, references may be made to γ-methacryloyloxypropyltrimethoxysilane (e.g., available from Momentive under the trade name Silquest® A-174), methacryloxymethyltrimethoxysilane (e.g., available from Wacker under the trade name Geniosil® XL33), vinyltrimethoxysilane, isooctyltrimethoxysilane, or phenyltrimethoxysilane.

[0089] Non-limiting examples of plasticizers include phthalates, benzoates, trimethylolpropane esters, trimethylolethane esters, trimethylolmethane esters, glycerides, pentaerythritol esters, naphthenic mineral oils, adipates, cyclohexyldicarboxylates, liquid paraffin, natural oils (optionally epoxidized), polypropylene, polybutene, hydrogenated polyisoprene, and mixtures thereof. Examples of phthalates include diisononyl phthalate, diisobutyl phthalate, dioctyl phthalate, dicyclohexyl phthalate, diisooctyl phthalate, diisododecyl phthalate, dibenzyl phthalate, or butyl benzyl phthalate. Examples of benzoate esters include neopentyl glycol dibenzoate (e.g., available under the trade name Uniplex® 512 from Lanxess), dipropylene glycol dibenzoate (e.g., available under the trade name Benzoflex® 9-88SG from Eastman), mixtures of diethylene glycol dibenzoate and dipropylene glycol dibenzoate (e.g., available under the trade name K-Flex® 850 S from Kalama Chemical), or mixtures of diethylene glycol dibenzoate, dipropylene glycol dibenzoate, and triethylene glycol dibenzoate (e.g., available under the trade name Benzoflex® 2088 from Eastman). Examples of pentaerythritol esters include pentaerythritol tetrapentarate (e.g., available under the trade name Pevalen). TM (Available from Perstorp). Examples of cyclohexane dicarboxylates include diisononyl cyclohexane-1,2-dicarboxylate (e.g., available from BASF under the trade name HexamoLlDinch®).

[0090] Antioxidants may include compounds that can be introduced to protect the composition from degradation by reaction with oxygen, which may be formed by the action of heat or light. These compounds may include primary antioxidants that scavenge free radicals. Primary antioxidants may be used alone or in combination with other auxiliary antioxidants or UV stabilizers. Non-limiting examples of antioxidants include Irganox® 1010, Irganox® B561, Irganox® 245, Irganox® 1076, and Irgafos® 168, sold by BASF.

[0091] Non-limiting examples of pigments include organic or inorganic pigments (e.g., titanium dioxide), such as Kronos® 2059 sold by Kronos.

[0092] Non-limiting examples of rheology modifiers include thixotropic agents, PVC plastisols (corresponding to a suspension of PVC in a plasticizer miscible with PVC, obtained in situ by heating at a temperature of 60°C to 80°C. These plastisols can be, for example, those specifically described in the book "Polyurethane Sealants", Robert M. Evans, ISBN 087762-998-6, fumed silica, and / or urea derivatives obtained by reacting aromatic diisocyanate monomers, such as 4,4'-MDI, with aliphatic amines, such as butylamine (the preparation of such urea derivatives is specifically described in French patent application FR 1591172).

[0093] Non-limiting examples of micronized amide waxes include CRAYVALLAC® SL, CRAYVALLAC® SLX, and CRAYVALLAC® SLT, sold by ARKEMA.

[0094] 4. Moist curing conditions

[0095] On the other hand, the wet curing conditions for initiating the crosslinking reaction to form a wet-curing adhesive from the wet-curable adhesive composition of the present invention can correspond to a temperature of at least 100°C and an absolute humidity of about 50%. In some respects, the wet curing conditions may correspond to a temperature of at least 100°C to 200°C (or 100°C, 105°C, 110°C, 115°C, 120°C, 125°C, 130°C, 135°C, 140°C, 145°C, 150°C, 155°C, 160°C, 165°C, 170°C, 175°C, 180°C, 185°C, 190°C, 195°C or 200°C or any value or range thereof) and an absolute humidity of 30% to 100% (or 30%, 35%, 40%, 45%, 50%, 55%, 60%, 65%, 70%, 75%, 80%, 85%, 90%, 95% or 100%).

[0096] In some respects, the wet curing conditions for curing the wet-curable adhesive composition of the present invention can provide various advantages compared to the curing operations associated with other types of non-wet-curable adhesive compositions. In a non-limiting example, the minimum temperature of 100°C required by the wet-curable adhesive composition of the present invention to initiate a crosslinking reaction to form a wet-curable adhesive may be relatively low compared to the minimum temperature required for other types of non-wet-curable adhesive compositions.

[0097] As a non-limiting example, for the wet curing of the wet-curable adhesive compositions of the present invention, some solvent-based acrylic adhesive coatings may require curing temperatures higher than a minimum of 100°C. For example, V-344, V-606, and V-778 (available from FLEXcon Company, Inc.) are all solvent-based acrylic adhesive coatings, and their minimum curing temperatures all exceed 100°C. Therefore, the amount of energy required to raise the temperature of the wet-curable adhesive compositions of the present invention (e.g., from room temperature) to the minimum curing temperature of 100°C may be relatively low compared to the amount of energy required to raise the temperature of other non-wet-curable adhesive compositions to their respective required minimum curing temperatures.

[0098] In some respects, the wet-curable properties of the adhesive compositions of the present invention offer various advantages compared to other types of non-wet-curable adhesive compositions. These advantages may include reduced energy consumption associated with curing the wet-curable adhesive composition to form a wet-curable adhesive, reduced curing-related costs, reduced carbon emissions corresponding to reduced energy and electricity demand, or combinations thereof (and other possible advantages). As a non-limiting example, UV-curable acrylic compositions require UV light (possibly provided by one or more power-consuming UV lamps) to initiate a crosslinking reaction to form a UV-curable acrylic adhesive. The wet curing of the wet-curable adhesive compositions of the present invention does not require such power-consuming UV lamps. Therefore, the energy consumption associated with UV curing using such power-consuming UV lamps is eliminated. Furthermore, eliminating such UV lamps may result in reduced electricity costs and may lead to other possible cost reductions (e.g., reduced equipment / operating costs, etc.). Moreover, in cases where such UV lamps are powered by carbon-emitting energy sources, the reduced electricity demand associated with eliminating such UV lamps may lead to a corresponding reduction in carbon emissions. In the case of solvent-based curable pressure-sensitive adhesive compositions, carbon dioxide emissions related to the combustion of solvents during the curing process may be reduced accordingly.

[0099] B. A method for preparing a moisture-curable adhesive composition.

[0100] 1. Forming a mixture of hot melt polymer and tackifier.

[0101] Prior to the wet curing operation, a mixture is formed comprising at least: one component corresponding to one or more hot melt polymers (e.g., one or more silanized polymers); and another component corresponding to one or more tackifiers. In some aspects, the mixture may optionally contain a first group of additives. The components can be mixed in various proportions in suitable mixing equipment (e.g., using a mixer provided by Bostik®, before the mixture enters the slot coater) to set specific adhesive properties for an industry or application. This mixture of components may constitute part A (see, for example...) Figure 1 (as previously stated in this article).

[0102] In some aspects, one or more silanized polymers may correspond to a mixture of at least 35% to 55% by weight of the components corresponding to part A of the composition (or 35%, 36%, 37%, 38%, 39%, 40%, 41%, 42%, 43%, 44%, 45%, 46%, 47%, 48%, 49%, 50%, 51%, 52%, 53%, 54%, or 55% to 55% or any value or range thereof).

[0103] In some aspects, one or more tackifiers may correspond to at least 35% to 65% of a mixture of components corresponding to part A of the composition (or 35%, 36%, 37%, 38%, 39%, 40%, 41%, 42%, 43%, 44%, 45%, 46%, 47%, 48%, 49%, 50%, 51%, 52%, 53%, 54%, 55%, 56%, 57%, 58%, 59%, 60%, 61%, 62%, 63%, 64%, or 65% to 65% or any value or range thereof).

[0104] In some respects, the (optional) first group of additives may correspond to a mixture of 0.1 wt% to 2.0 wt% of the components corresponding to part A of the composition (or 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1.0 wt%, 1.1 wt%, 1.2 wt%, 1.3 wt%, 1.4 wt%, 1.5 wt%, 1.6 wt%, 1.7 wt%, 1.8 wt%, 1.9 wt%, or 2.0 wt% to 2.0 wt% or any value or range therebetween).

[0105] 2. Add the catalyst packet to the mixture to form a moisture-curable adhesive composition.

[0106] A catalyst package is added to the mixture of the hot melt polymer and tackifier before subjecting it to wet curing conditions. This catalyst package may contain at least a crosslinking agent and an optional second group of additives. This catalyst package may constitute Part B. (See example...) Figure 1 (as previously stated in this article).

[0107] In some aspects, the crosslinking agent may correspond to at least 98.0% to 99.9% by weight of a catalyst package corresponding to part B of the composition (or 0.1% by weight, 1% by weight, 5% by weight, 10% by weight, 15% by weight, 20% by weight, 25% by weight, 30% by weight, 35% by weight, 40% by weight, 45% by weight, 50% by weight, 55% by weight, 60% by weight, 65% by weight, 70% by weight, 75% by weight, 80% by weight, 85% by weight, 90% by weight, 95% by weight, 99% by weight or 99.9% by weight or any value or range thereof).

[0108] In some respects, the (optional) second group of additives may correspond to 0.1 wt% to 2.0 wt% of the catalyst package corresponding to part B of the composition (or 0 wt%, 0.1 wt%, 0.2 wt%, 0.3 wt%, 0.4 wt%, 0.5 wt%, 0.6 wt%, 0.7 wt%, 0.8 wt%, 0.9 wt%, 1.0 wt%, 1.1 wt%, 1.2 wt%, 1.3 wt%, 1.4 wt%, 1.5 wt%, 1.6 wt%, 1.7 wt%, 1.8 wt%, 1.9 wt%, or 2.0 wt% to 2.0 wt% or any value or range therebetween).

[0109] 3. Apply the moisture-curable adhesive composition to the substrate surface.

[0110] A moisture-curable adhesive composition can be applied to the surface of a substrate (and optionally a liner) to form a coated substrate having a moisture-curable adhesive layer on the surface of the substrate (see example...). Figure 2 (As previously described herein). In one aspect, part A and part B are first mixed together and then applied to the surface of the substrate before being subjected to moisture curing conditions. In another aspect, part A is first applied to the surface of the substrate, followed by part B being applied to the surface of the substrate before being subjected to moisture curing conditions.

[0111] C. Method for curing moisture-curable adhesive compositions

[0112] The wet-curable adhesive composition can then be subjected to wet-curing conditions to initiate a crosslinking reaction, thereby forming a wet-curable adhesive from the wet-curable adhesive composition. For a substrate (and optionally a gasket), if such a wet-curable adhesive composition has been applied as a wet-curable adhesive layer to the surface of the substrate / gasket, such wet-curing conditions will initiate a crosslinking reaction within the wet-curable adhesive layer, thereby forming an article having a wet-curable adhesive layer bonded to the surface of the substrate (see, for example...). Figure 2 (as previously stated in this article).

[0113] D. Products

[0114] In aspects of this disclosure, the moisture-curable adhesive compositions and the moisture-curing adhesive compositions have the aforementioned properties. Such compositions are suitable for specific applications. Therefore, the compositions of this disclosure can be included in articles of manufacture, and aspects of this disclosure also relate to articles comprising the moisture-curing adhesive compositions described herein. For example, such articles can be used in one or more of the following industries or applications: durable labels; pharmaceuticals; bonding and mounting; and healthcare industrial applications.

[0115] The compositions described herein are suitable for a wide range of labeling and / or tape applications. Furthermore, the compositions described herein can be used to manufacture a variety of articles or components thereof. In some aspects, the article may be a label and / or tape, which can be used in one or more of the following industries or applications: durable labels; pharmaceuticals; bonding and mounting; and healthcare industrial applications.

[0116] Example

[0117] The present invention will be described in more detail through specific embodiments. The following embodiments are for illustrative purposes only and are not intended to limit the invention in any way. Those skilled in the art will readily recognize that various non-critical parameters can be changed or modified to produce substantially the same results.

[0118] Table 3 shows different embodiments, specifically illustrating the components of the mixture before the addition of the crosslinking agent, such as hot melt polymer and tackifier.

[0119]

[0120] Table 4 shows different working examples, specifically illustrating the components of the wet-curable adhesive composition, such as a specific mixture of hot melt polymer and tackifier (“Part A”), a specific catalyst package (“Part B”), and a specific ratio of Part A to Part B.

[0121]

[0122] The substrates used in the tests are shown in Table 5. The gaskets used in the tests are shown in Table 6.

[0123]

[0124]

[0125] Table 7 illustrates different working embodiments, specifically illustrating the components of a moisture-curable adhesive composition (e.g., a hot melt polymer, tackifier, and crosslinking agent package), and a substrate to which a moisture-curable adhesive composition is applied to form a coated substrate having a moisture-curable adhesive layer on the surface of the substrate.

[0126]

[0127] The wet curing conditions used in the experiment are shown in Table 8.

[0128]

[0129] 1. Example 1

[0130] In some specific aspects, the wet-curable adhesive composition of the present invention may comprise: 94% by weight of a mixture corresponding to part A (HM2 / TK2) of the composition; and 6% by weight of a catalyst packet (CP2) corresponding to part B of the composition. This particular version of the wet-curable adhesive composition according to the invention is manufactured using a 50-micron polyester and a 55-micron glassine backing. The target coating thickness is 22 microns, although the actual thickness is 20 microns over approximately 75% of the width of the roll, with the remainder closer to 30 microns.

[0131] 2. Example 2

[0132] In some specific aspects, the wet-curable adhesive composition of the present invention may comprise: 94% by weight of a mixture corresponding to part A (HM2 / TK2) of the composition; and 6% by weight of a catalyst packet (CP2) corresponding to part B of the composition. This particular version of the wet-curable adhesive composition according to the invention was prepared using a TRT laboratory. Transfer tape (HM2 / TK2) was supplied at 50 GSM (40 microns), which was transferred onto a corona-treated 50-micron transparent polyester film and allowed to stand for 72 hours prior to testing.

[0133] 3. Example 3

[0134] In some specific aspects, the wet-curable adhesive composition of the present invention may comprise: 86.6% by weight of a mixture corresponding to part A (HM1 / TK1) of the composition; and 13.4% by weight of a catalyst packet (CP1) corresponding to part B of the composition. This particular version of the wet-curable adhesive composition according to the invention was prepared using a TRT laboratory. Transfer tape (HM1 / TK1) was supplied at 50 GSM (45 microns), which was transferred onto a corona-treated 50-micron transparent polyester film and allowed to stand for 72 hours prior to testing.

[0135] 4. Example 4

[0136] In some specific aspects, the wet-curable adhesive composition of the present invention may comprise: 86.6% by weight of a mixture corresponding to part A (HM1 / TK1) of the composition; and 13.4% by weight of a catalyst packet (CP1) corresponding to part B of the composition. This particular version of the wet-curable adhesive composition according to the invention was prepared using a TRT laboratory. Transfer tape (HM1 / TK1) was supplied at 100 GSM, which was transferred onto a corona-treated 50-micron transparent polyester film and allowed to stand for 72 hours prior to testing.

[0137] E. Result

[0138] The results of subsequent tests performed on the structures corresponding to each of Examples 1 to 4 above are shown in the accompanying drawings.

[0139] Figure 3A Data relating to various examples of articles are shown, in which a moisture-cured adhesive layer (see Example 1, as previously described herein) bonds to the surface of various substrates (in... Figure 3A (Identified as "Structure 1" in the text). V-344 (available from FLEXcon®) represents a comparative example of a curable solvent-based pressure-sensitive adhesive (PSA) composition.

[0140] Figure 3BComparative data is shown, illustrating an exemplary benefit of expanded / improved production capacity offered by a wet-curable PSA composition (non-solvent-based) compared to a solvent-based PSA composition.

[0141] Figure 3C Comparative data is shown, illustrating another exemplary benefit of reduced energy consumption from wet-curable PSA compositions (non-solvent-based) compared to solvent-based PSA compositions.

[0142] Figure 3D Comparative data is shown, illustrating another exemplary benefit of reducing carbon dioxide (CO2) emissions from wet-curable PSA compositions (non-solvent-based) compared to solvent-based PSA compositions.

[0143] Figure 3E Comparative data is presented, illustrating other exemplary benefits of various cost reductions associated with wet-curable PSA compositions (non-solvent-based) compared to solvent-based PSA compositions.

[0144] Figure 4 Data related to various examples of articles are shown, in which a moisture-curing adhesive layer (see Example 2, as previously described herein) bonds to the surface of various substrates (in... Figure 4 (Identified as "Structure 2" in the text).

[0145] Figure 5 Data related to various examples of articles are shown, in which a moisture-curing adhesive layer (see Example 3, as previously described herein) bonds to the surface of various substrates (in... Figure 5 (Identified as "Structure 3" in the text).

[0146] Figure 6 Data related to various examples of articles are shown, in which a moisture-curing adhesive layer (see Example 4, as previously described herein) bonds to the surface of various substrates (in... Figure 6 (Identified as "Structure 4" in the text).

[0147] ******

[0148] Although the embodiments and advantages of this application have been described in detail, it should be understood that various changes, substitutions, and modifications may be made herein without departing from the spirit and scope of the embodiments as defined by the appended claims. Furthermore, the scope of this application is not intended to be limited to the specific embodiments of the processes, machines, articles, compositions of matter, means, methods, and steps described in the specification. As will be readily understood by those skilled in the art from the above disclosure, existing or later-developed processes, machines, articles of matter, compositions of matter, means, methods, or steps that perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein can be utilized. Therefore, the appended claims are intended to include such processes, machines, articles of matter, compositions of matter, means, methods, or steps within their scope.

Claims

1. A moisture-curable adhesive composition comprising: 86% to 94% by weight of a mixture corresponding to part A of the composition, said mixture comprising at least: One or more silanized polymers; One or more tackifiers; and The first group of additives may be selected; and From 6% to 14% by weight of a catalyst packet corresponding to part B of the composition, wherein the catalyst packet contains at least a crosslinking agent and optionally a second group of additives. in, The wet curing conditions for initiating the crosslinking reaction to form a wet-curing adhesive from the said wet-curable adhesive composition correspond to: Temperatures ranging from 100°C to 200°C; and 30% to 100% absolute humidity.

2. The moisture-curable adhesive composition of claim 1, wherein one or more of the silanized polymers in part A comprise at least a first hot-melt polymer, and wherein the moisture-curable adhesive composition comprises: At least 86% by weight of the mixture corresponding to Part A; and At least 13% by weight of the catalyst package corresponding to Part B.

3. The moisture-curable adhesive composition according to claim 2, wherein the moisture-curable adhesive composition comprises: 86.6% by weight of the mixture corresponding to part A; and 13.4% by weight of the catalyst package corresponding to Part B.

4. The moisture-curable adhesive composition of claim 1, wherein one or more of the silanized polymers in part A comprise at least a second hot-melt polymer, and wherein the moisture-curable adhesive composition comprises: 89% to 94% by weight of the mixture corresponding to Part A; and 6% to 11% by weight of the catalyst package corresponding to Part B.

5. The moisture-curable adhesive composition according to claim 4, wherein the moisture-curable adhesive composition comprises: 91.5% by weight of the mixture corresponding to part A; and 8.5% by weight of the catalyst package corresponding to Part B.

6. The moisture-curable adhesive composition of claim 4, wherein the moisture-curable adhesive composition comprises: 89% by weight of the mixture corresponding to part A; and 11% by weight of the catalyst package corresponding to Part B.

7. The wet-curable adhesive composition of claim 1, further comprising an additional package containing one or more of the following substances: at least one additional tackifier; a third group of additives; a liquid resin that alters the glass transition temperature (Tg) of the composition; or a combination thereof.

8. The wet-curable adhesive composition according to any one of claims 1 to 7, wherein a first energy input is associated with wet curing conditions to initiate a crosslinking reaction to form a wet-curable adhesive from the wet-curable adhesive composition, and wherein the first energy input is less than a second energy input associated with ultraviolet (UV) curing conditions for forming a UV-curable acrylic adhesive from the UV-curable acrylic adhesive composition.

9. The wet-curable adhesive composition of claim 8, wherein the reduction in energy input, representing the difference between the second energy input and the first energy input, is associated with a reduction in carbon emissions, and wherein the reduction in carbon emissions is associated with the difference between the second energy input and the first energy input.

10. A method for producing a moisture-curing adhesive, the method comprising: A mixture corresponding to part A is provided, the mixture comprising at least: One or more silanized polymers; One or more tackifiers; as well as The first group of additives can be selected arbitrarily; The catalyst package corresponding to part B is added to the mixture to form a wet-curable adhesive composition, wherein the catalyst package contains at least a crosslinking agent and optionally a second group of additives; Of which, 86% to 94% by weight of the moisture-curable adhesive composition corresponds to part A, and 6% to 14% by weight of the moisture-curable adhesive composition corresponds to part B; and The wet-curable adhesive composition is subjected to wet curing conditions to initiate a crosslinking reaction to form a wet-curable adhesive, wherein the wet curing conditions correspond to: Temperatures ranging from 100°C to 200°C; and 30% to 100% absolute humidity.

11. The method of claim 10, wherein the catalyst package is added to the mixture before subjecting the mixture to wet curing conditions.

12. The method of claim 10, wherein the mixture corresponding to part A is melted at a temperature of about 80°C before the catalyst package corresponding to part B is added to the mixture.

13. The method of claim 12, wherein the catalyst package corresponding to part B is kept at room temperature before being added to the mixture.

14. The method of claim 10, wherein the wet curing conditions correspond to a temperature of about 140°C, and wherein the absolute humidity is 47.5% to 52.5%.

15. A method for producing an article of article, the method comprising: A moisture-curable adhesive composition comprising: 86% to 94% by weight of a mixture corresponding to part A of the composition, said mixture comprising at least: One or more silanized polymers; One or more tackifiers; and The first group of additives may be selected; and From 6% to 14% by weight of a catalyst package corresponding to part B of the composition, wherein the catalyst package contains at least a crosslinking agent and optionally a second group of additives; The moisture-curable adhesive composition is applied to the surface of a substrate to form a coated substrate having a moisture-curable adhesive layer on the surface of the substrate. as well as Exposing a coated substrate to moisture curing conditions to initiate a crosslinking reaction within a moisture-curable adhesive layer to form an article having a moisture-curable adhesive layer bonded to the surface of the substrate, said moisture curing conditions including: Temperatures ranging from 100℃ to 200℃; as well as 30% to 100% absolute humidity.

16. The method of claim 15, wherein the wet-curing adhesive layer has an adhesive thickness of 20 µm to 100 µm.

17. The method of claim 15, wherein: Part A comprises one or more silanized modified polymers, including at least a second hot-melt polymer, and the wet-curable adhesive composition comprises: 89% to 94% by weight of the mixture corresponding to Part A; and 6% to 11% by weight of the catalyst package corresponding to Part B; and The moisture-curing adhesive layer has an adhesive thickness of 20µm to 30µm.

18. The method of claim 17, wherein the substrate comprises a corona-treated transparent polyester film, and wherein, Applying a moisture-curable adhesive composition involves transferring a transfer tape of a second hot-melt polymer supplied at 50 GSM onto the transparent polyester film.

19. The method of claim 15, wherein: Part A comprises one or more silanized modified polymers, including at least a first hot melt polymer, and the wet-curable adhesive composition comprises: At least 86% by weight of the mixture corresponding to Part A; and At least 13% by weight of the catalyst package corresponding to Part B; and The moisture-curing adhesive layer has an adhesive thickness of 45µm to 80µm.

20. The method of claim 15, wherein the article having a moisture-curing adhesive layer bonded to the surface of the substrate is capable of being used in one or more of the following industries or applications: durable labels; pharmaceuticals; bonding and mounting; and healthcare industry applications.

21. A method for forming a durable label using a moisture-curable adhesive composition according to any one of claims 1 to 9.

22. A method for using a wet-curing adhesive formed from a wet-curable adhesive composition according to any one of claims 1 to 9 in a durable label.

23. A method of marking an article by applying a durable label to the surface of the article, wherein a wet-curing adhesive formed from a wet-curable adhesive composition according to any one of claims 1 to 9 is used in the durable label.

24. A method for forming an adhesive tape using a moisture-curable adhesive composition according to any one of claims 1 to 9.

25. A method for using a wet-curing adhesive formed from a wet-curable adhesive composition according to any one of claims 1 to 9 in an adhesive tape.

26. A method for tape bonding of an article by applying tape to the surface of the article, wherein a moisture-curing adhesive formed from a moisture-curable adhesive composition according to any one of claims 1 to 9 is used in the tape.

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