A type of solid wood composite flooring with sound-absorbing function

Abstract

This invention discloses a sound-absorbing engineered wood flooring, relating to the field of engineered wood flooring technology. The invention includes a base layer, a sandwich panel, a core material layer, a surface layer, and sound-absorbing pads. Each base layer has grooves for the pads on its lower surface, and each groove contains a sound-absorbing pad. The sandwich panel has uniformly spaced circular holes, and is sandwiched between the base layer and the core material layer. The lower surface of the surface layer and the upper surface of the core material layer are bonded together by hot-pressing with formaldehyde-free adhesive. Multiple slots are uniformly spaced on the primary engineered wood flooring, into which dowels with backlash are inserted. Interlocking structures are cut into the sides and ends of the primary engineered wood flooring. This invention solves the problems of poor sound absorption and weakened sound absorption after prolonged wear in existing engineered wood flooring by uniformly installing sound-absorbing pads on the base layer, reinforcing the flooring with backlash dowels, and improving the sound absorption effect at the joints using adhesive strips.

Description

Technical Field

[0001] This invention belongs to the field of engineered wood flooring technology, and in particular relates to an engineered wood flooring with sound-absorbing function. Background Technology

[0002] Engineered wood flooring, with its beautiful natural wood grain, comfortable feel underfoot, easy installation, strong environmental adaptability, excellent indoor air conditioning function, high environmental performance, moderate price, readily available resources, high effective yield, and low-carbon production process, has seen its market sales grow at a significantly faster rate than impregnated paper laminate flooring and solid wood flooring. However, engineered wood flooring has poor sound insulation, and many sound-absorbing engineered wood floorings fail to achieve optimal sound reduction. Some engineered wood flooring with sound-absorbing panels are prone to cracking and have a short lifespan. Sound absorption at the joints of engineered wood flooring is the most difficult aspect. Generally, a layer of sound-absorbing adhesive is applied, but with prolonged wear and tear, creaking sounds easily appear at the joints after a period of use, reducing the sound absorption effect. Summary of the Invention

[0003] The purpose of this invention is to provide a solid wood composite floor with sound-absorbing function. By uniformly installing sound-absorbing pads on the substrate and reinforcing the composite floor with reinforcing pins, and setting a wear-resistant rubber strip at the joint to improve the sound-absorbing effect at the joint, this invention solves the problems of poor sound absorption effect of existing solid wood composite flooring and the weakening of sound absorption effect after long-term wear.

[0004] To solve the above-mentioned technical problems, the present invention is achieved through the following technical solution: This invention relates to a solid wood composite floor with sound-absorbing function, comprising a base layer, a sandwich panel, a core material layer, a surface layer, and a sound-absorbing rubber pad; Each substrate layer has a rubber pad groove on its lower surface. Each substrate layer has a sound-absorbing rubber pad inserted into the rubber pad groove. The sound-absorbing rubber pad is hot-pressed and bonded into the rubber pad groove using a hot-pressing vulcanizing plate and then vulcanized. The sandwich panel has uniformly spaced circular holes. The sandwich panel is sandwiched between the substrate layer and the core material layer. Both sides of the sandwich panel are coated with formaldehyde-free adhesive. A layer of formaldehyde-free adhesive is applied to the upper surface of the substrate layer and the lower surface of the core material layer. The sandwich panel is pressed onto the substrate layer for bonding. Then the lower surface of the core material layer is pressed onto the sandwich panel. Finally, hot pressing is performed to bond the sandwich panel. The lower surface of the surface layer and the upper surface of the core material layer are coated with formaldehyde-free adhesive and then hot-pressed together to form a primary solid wood composite floor; The primary solid wood composite flooring has multiple slots evenly cut from the bottom of the substrate layer. The slots do not penetrate the core material layer. Formaldehyde-free glue is injected into the slots. The slots are engaged with a pin with a backlash, and the pin with a backlash is fully engaged in the slot. The primary solid wood composite flooring with a snap-fit ​​pin is cut into corresponding snap-fit ​​structures on both sides and both ends, and a sound-absorbing adhesive layer is applied to the snap-fit ​​structures.

[0005] The present invention is further configured such that the thickness of the substrate layer is 4-6 mm, the depth of the adhesive pad groove is 2-3 mm, and the adhesive pad groove has a plurality of through holes penetrating the substrate layer. The noise-absorbing pad includes a plug pad and an ear body. The thickness of the plug pad is 3.5-4.5mm. The ear body is inserted into the ear canal, and the plug pad is inserted into the groove of the pad. The plug pad protrudes 1.5-2.0mm from the groove of the pad.

[0006] The present invention is further configured such that, after the sound-absorbing pad is inserted into the pad groove of the substrate layer, a layer of adhesive is applied to the lower surface of the substrate layer, and the lower surface of the substrate layer is hot-pressed at 95-105°C for 2-3 minutes to vulcanize the sound-absorbing pad and bond it into the pad groove. After hot pressing, the plug pad protrudes 1.0-1.2 mm from the pad groove.

[0007] The present invention is further configured such that the upper surface of the substrate layer is sanded with a sanding belt, and the upper and lower surfaces of the core material layer are sanded with a sanding belt; The sandwich panel has uniformly opened circular holes with a diameter of 3-5mm, and then honeycomb holes of 0.1-0.2mm are uniformly opened on the sandwich panel using a laser. The thickness of the sandwich panel is 0.8-1.2mm. After the substrate layer, sandwich panel and core material layer are coated with adhesive, they are hot-pressed at 85-90℃ for 60-90 seconds, then cooled to room temperature and pressed under high pressure for 5-10 hours.

[0008] The present invention is further configured such that the temperature of hot-pressing the lower surface of the surface layer and the upper surface of the core material layer is 80-100℃, the surface layer is a wood veneer with a thickness of 2-4mm, and during hot pressing, the surface layer is heated for 60-90s, and then cooled and pressed for 3-5h.

[0009] The present invention is further configured such that the thickness of the core material layer is 6-8 mm, the depth of the pin groove extending into the core material layer is 4-5 mm, and the pin groove is further threaded with a tap; Epoxy resin AB glue is injected into the pin groove, and then the pin with return bar is stuck in the pin groove. The pin with return bar is made of plastic and includes a column and return bar. Multiple rings of return bar are provided at equal intervals on the outer wall of the column, and at least one ring of return bar is stuck in the core material layer. The diameter of the circle formed by the back burr is 1-1.5 mm larger than the inner diameter of the pin groove.

[0010] The present invention is further configured such that the two sides of the primary solid wood composite flooring have a semi-cylindrical protrusion and a semi-cylindrical groove, respectively. The semi-cylindrical groove has a vertically downward rubber strip groove on the lower half of the groove wall. A rubber strip is inserted into the rubber strip groove, and the rubber strip protrudes from the groove wall of the semi-cylindrical groove. The diameter of the semi-cylindrical protrusion is 5-7 mm, the inner diameter of the semi-cylindrical groove is 6-8 mm, and the inner diameter of the semi-cylindrical groove is 10-15% larger than the diameter of the semi-cylindrical protrusion. The side walls of the primary solid wood composite flooring, as well as the semi-cylindrical protrusions and grooves, are all coated with glue. After the glue solidifies, the semi-cylindrical protrusions fit perfectly into the semi-cylindrical grooves and press against the glue strips.

[0011] The present invention is further configured such that, after the adhesive is applied to the sidewalls of the primary solid wood composite flooring and solidifies, the lower surface of the substrate layer of the primary solid wood composite flooring is sanded, and then a 0.3-0.5mm layer of anti-corrosion and moisture-resistant paint is sprayed on. The surface of the surface layer is coated with a 0.2-0.3mm layer of wear-resistant and anti-corrosion paint.

[0012] The present invention is further configured such that the raw material ratio of the sound-absorbing rubber pad includes, by weight, 40-55 parts of EPDM rubber, 15-25 parts of light calcium carbonate, 8-10 parts of paraffin oil, 3-5 parts of silica, 2-3 parts of vulcanizing agent, 1-2 parts of accelerator, 0.5-1.0 parts of foaming agent and 0.5-1.0 parts of silane coupling agent; The sum of the areas of the supporting surfaces of all the sound-absorbing pads inserted into each of the substrate layers is 15-20% of the bottom area of ​​the substrate layer.

[0013] The present invention has the following beneficial effects: 1. In this invention, the sound-absorbing rubber pad is inserted into the rubber pad groove and then vulcanized by hot pressing, so that the sound-absorbing rubber pad is tightly bonded to the rubber pad groove, while the bottom of the sound-absorbing rubber pad is exposed and in contact with the ground. When stepped on, it can achieve a good effect. Moreover, the sound-absorbing rubber pad is tightly bonded to the rubber pad groove and will not fall off, so it can play a sound-absorbing role for a long time.

[0014] 2. In this invention, a rubber strip is inserted into the rubber groove. The rubber strip can withstand the wear of the semi-cylindrical protrusion of the connection for a long time. When stepping on it, it can eliminate the friction generated by the downward pressure, reduce the noise caused by stepping on it, and improve the noise reduction time of the connection.

[0015] 3. After installing sound-absorbing rubber pads, the adhesion requirements between multi-layer composite panels are higher, and delamination or warping is prone to occur. However, this application features a unique design with a locking pin to prevent delamination of the multi-layer composite panels, improving the pressing effect and reducing the risk of delamination. Of course, any product implementing this invention does not necessarily need to achieve all the advantages described above simultaneously. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the splicing and assembly of a solid wood composite floor with sound-absorbing function.

[0018] Figure 2 This is a schematic diagram showing several pieces of solid wood composite flooring removed from a type of sound-absorbing composite flooring.

[0019] Figure 3 This is an enlarged schematic diagram of a solid wood composite floor in the semi-cylindrical groove.

[0020] Figure 4 This is an exploded view of the various structural layers of a solid wood composite floor.

[0021] Figure 5 This is a schematic diagram of the substrate layer.

[0022] Figure 6 This is a schematic diagram of the sandwich panel structure.

[0023] Figure 7 This is a schematic diagram of the sound-absorbing rubber pad.

[0024] Figure 8 This is a schematic diagram of the structure of the return pin.

[0025] The components represented by each number in the attached diagram are listed below: 1. Solid wood composite flooring; 11. Semi-cylindrical groove; 111. Rubber strip groove; 12. Semi-cylindrical protrusion; 2. Rubber strip; 3. Substrate layer; 31. Rubber pad groove; 311. Ear hole; 32. Pin groove; 4. Sound-absorbing rubber pad; 41. Plug pad; 42. Ear body; 5. Sandwich board; 6. Core material layer; 7. Surface layer; 8. Pin with backlash; 81. Column; 82. Backlash. Detailed Implementation

[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] Please see Figure 1-8The present invention is a solid wood composite floor with sound-absorbing function, comprising a base layer 3, a sandwich panel 5, a core material layer 6, a surface layer 7, and a sound-absorbing pad 4. Each substrate layer 3 has a rubber pad groove 31 on its lower surface. Each substrate layer 3 has a sound-absorbing rubber pad 4 inserted into the rubber pad groove. The sound-absorbing rubber pad 4 is hot-pressed and bonded into the rubber pad groove 31 by a hot-press vulcanizing plate and then vulcanized. The adhesive pad groove 31 is formed by using a grooving device to evenly cut multiple adhesive pad grooves 31 at the bottom of the substrate layer 3 after the substrate layer 3 is cut (the thickness of the substrate layer 3 is about 6mm). The depth of the adhesive pad groove 31 does not exceed 4mm. The adhesive pad groove 31 is not completely opened so that the sound-absorbing adhesive pad 4 can be inserted. During the subsequent hot pressing and vulcanization, part of the sound-absorbing adhesive pad 4 will always be exposed on the lower surface of the substrate layer 3.

[0028] The sandwich panel 5 has uniformly spaced circular holes. The sandwich panel 5 is sandwiched between the substrate layer 3 and the core material layer 6. Both sides of the sandwich panel 5 are coated with formaldehyde-free adhesive. A layer of formaldehyde-free adhesive is applied to the upper surface of the substrate layer 3 and the lower surface of the core material layer 6. The sandwich panel 5 is pressed onto the substrate layer 3 for bonding. Then the lower surface of the core material layer 6 is pressed onto the sandwich panel 5. Finally, hot pressing is performed to bond the sandwich panel 5. The sandwich panel 5 is made of wood with a relatively small thickness (1-1.5mm, adjustable as needed). Its design serves a supporting function. If the substrate layer 3 and core layer 6 are directly glued together, the glue must be pressed out as much as possible to ensure adhesion. However, this reduces the glue content within the sandwich panel, causing it to dry and easily separate over time. While there is a larger amount of glue at the round holes, the sandwich panel 5 prevents deformation, allowing the glue to maintain a strong adhesive force, much like a spider web. This significantly increases the bonding strength and prevents deformation from being stepped on.

[0029] The lower surface of the surface layer 7 and the upper surface of the core layer 6 are coated with formaldehyde-free adhesive (polyurethane adhesive, PUR adhesive) and then hot-pressed together to form a primary solid wood composite floor. The primary solid wood composite flooring has multiple slots 32 evenly cut from the bottom of the substrate layer 3. The slots 32 do not penetrate the core material layer 6. Formaldehyde-free glue is injected into the slots 32. The slots 32 are engaged with the pins 8 with backlash, and the pins 8 with backlash are fully engaged in the slots 32. After the return pin 8 is fully inserted into the pin groove 32, the return pin is stuck on each layer board and integrated with each layer board position. With the addition of glue, it is bonded in the pin groove 32, so that each layer board achieves an integrated structure at the pin groove 32 position, which greatly reduces the phenomenon of glue separation.

[0030] The primary solid wood composite flooring with the snap-back pin 8 has corresponding snap-fit ​​structures cut out on both sides and both ends, and a sound-absorbing adhesive layer is applied to the snap-fit ​​structures.

[0031] The thickness of the substrate layer 3 is 4-6 mm, the depth of the adhesive groove 31 is 2-3 mm, and the adhesive groove 31 has a plurality of ear holes 311 that penetrate the substrate layer 3. The noise-absorbing pad 4 includes a plug pad 41 and an ear body 42. The thickness of the plug pad 41 is 3.5-4.5mm. The ear body 42 is inserted into the ear canal 311. The plug pad 41 is inserted into the pad groove 31. The plug pad 41 protrudes from the pad groove 31 by 1.5-2.0mm.

[0032] The earpiece 42 is inserted into the ear hole 311. The top of the earpiece 42 should be basically flush with the upper surface of the substrate layer 3. During the hot pressing and vulcanization process, when the upper platen is pressed on the upper surface of the substrate layer 3, the earpiece 42 will not flow upward or creep. The sound-absorbing pad 4 will creep during the vulcanization process and will be more tightly bonded to the pad groove 31. After hot pressing and vulcanization, it is not easy to fall out of the sound-absorbing pad 4. The plug pad 41 still protrudes from the lower surface of the substrate layer 3 after hot pressing. After hot pressing, it is basically in the same plane, which is convenient for later laying on the ground.

[0033] After the sound-absorbing pad 4 is inserted into the pad groove 31 of the substrate layer 3, a layer of glue is applied to the lower surface of the substrate layer 3, and the lower surface of the substrate layer 3 is hot-pressed at 95-105°C for 2-3 minutes to vulcanize the sound-absorbing pad 4 and bond it into the pad groove 31. After hot pressing, the plug pad 41 protrudes from the pad groove 31 by 1.0-1.2 mm.

[0034] To prevent carbonization of the lower surface of substrate layer 3 during hot pressing, a layer of adhesive can be applied. During hot pressing, the hot press plate does not directly contact substrate layer 3, making surface carbonization less likely. However, the sound-absorbing pad 4 is in direct contact with the hot press plate and will undergo vulcanization at around 100℃. Applying adhesive can increase the hot pressing time and improve the vulcanization effect. After hot pressing and vulcanization, the sound-absorbing pad 4 will deform, but a portion will still be exposed outside the lower surface of substrate layer 3. This portion is in contact with the ground. Since substrate layer 3 is not in contact with the ground, there is no friction noise. Because the exposed thickness of the sound-absorbing pad 4 is 1.0-1.2mm, it will not deform after being stepped on, and the feel underfoot is still like that of wood flooring, greatly enhancing the sound absorption effect.

[0035] The upper surface of the substrate layer 3 is sanded with sanding tape, and the upper and lower surfaces of the core material layer 6 are sanded with sanding tape. The sandwich panel 5 has uniformly opened circular holes with a diameter of 3-5 mm, and then honeycomb holes of 0.1-0.2 mm are uniformly opened on the sandwich panel 5 using a laser. The thickness of the sandwich panel 5 is 0.8-1.2 mm. After the substrate layer 3, sandwich panel 5 and core material layer 6 are coated with adhesive, they are hot-pressed at 85-90℃ for 60-90 seconds, then cooled to room temperature and pressed under high pressure for 5-10 hours.

[0036] The honeycomb structure allows the adhesive to penetrate into the pores, facilitating bonding between the adhesive and the sandwich panel 5 and preventing delamination. The thickness of the sandwich panel 5 should not be too large; its main function is support, allowing for a higher adhesive content between the layers and preventing the adhesive from drying out over time. Hot-press bonding is used, followed by low-temperature pressing for at least 5 hours after bonding to enhance adhesion.

[0037] The temperature for hot-pressing the lower surface of the surface layer 7 and the upper surface of the core layer 6 is 80-100℃. The surface layer 7 is a wood veneer with a thickness of 2-4mm. During hot pressing, the surface layer 7 is heated for 60-90 seconds and then cooled and pressed for 3-5 hours.

[0038] Temperatures of 80-100℃ cause minimal damage to the wood veneer and effectively heat-bond the adhesive. Continue pressing to ensure that no air gets in after pressing, thus preventing the glue from coming unglued.

[0039] The core material layer 6 has a thickness of 6-8 mm, the pin groove 32 extends to a depth of 4-5 mm into the core material layer 6, and the pin groove 32 is further threaded with a tap. Epoxy resin AB glue is injected into the pin groove 32, and then the pin rod 8 with return bar is clamped in the pin groove 32. The pin rod 8 with return bar is made of plastic. The pin rod 8 with return bar includes a column 81 and return bar 82. Multiple rings of return bar 82 are provided at equal intervals on the outer wall of the column 81, and at least one ring of return bar 82 is clamped in the core material layer 6. The diameter of the circle formed by the back burr 82 is 1-1.5 mm larger than the inner diameter of the pin groove 32.

[0040] like Figure 8 The pin 8 shown has a barb 82 on its side wall, which can fit tightly into the pin groove 32 when squeezed. It is relatively difficult to pull in the reverse direction and also difficult to pull in the forward direction. Therefore, after the pin 8 is fully inserted into the pin groove 32 with force, it can connect the layers together. With the glue, it is bonded to the pin groove 32. The glue adheres to the inner wall of the pin groove 32 and forms a column. After solidification, it also serves to bond the layers together and prevent the glue from coming off.

[0041] The diameter of the return pin 82 is 1-1.5mm larger than the inner diameter of the pin groove 32. Because the return pin 8 is made of injection-molded plastic, it has a certain degree of deformation. After being inserted and pressed in, the return pin 82 can deform and tightly fit into the pin groove 32, adhering to the wall of the pin groove 32. The pin groove 32 is then tapped with internal threads, which makes the return pin 82 fit within the internal threads, preventing it from slipping or shifting. This makes it more securely fitted into the pin groove 32.

[0042] After the epoxy resin AB glue is injected and solidified, it will harden and become stuck in the internal thread, making it less prone to displacement and reducing the risk of delamination later.

[0043] The two sides of the primary solid wood composite flooring have a semi-cylindrical protrusion 12 and a semi-cylindrical groove 11, respectively. The semi-cylindrical groove 11 has a vertically downward rubber strip groove 111 on the lower half of the groove wall. A rubber strip 2 is inserted into the rubber strip groove 111, and the rubber strip 2 protrudes from the groove wall of the semi-cylindrical groove 11. The diameter of the semi-cylindrical protrusion 12 is 5-7 mm, the inner diameter of the semi-cylindrical groove 11 is 6-8 mm, and the inner diameter of the semi-cylindrical groove 11 is 10-15% larger than the diameter of the semi-cylindrical protrusion 12. The side walls of the primary solid wood composite flooring, as well as the semi-cylindrical protrusions 12 and semi-cylindrical grooves 11, are all coated with glue. After the glue solidifies, the semi-cylindrical protrusions 12 fit perfectly into the semi-cylindrical grooves 11 and press against the adhesive strip 2.

[0044] The inner diameter of the semi-cylindrical groove 11 is slightly larger than the diameter of the semi-cylindrical protrusion 12. This is because the semi-cylindrical protrusion 12 will become thicker after applying adhesive, while the inner diameter of the semi-cylindrical groove 11 will become slightly smaller. After the adhesive is applied and dried, it fits perfectly into the semi-cylindrical groove 11. The rubber strip 2 protrudes slightly from the rubber strip groove 111 and contacts and adheres to the semi-cylindrical protrusion 12. When the floor is stepped on, it will move slightly downward, and the semi-cylindrical protrusion 12 will slightly squeeze the rubber strip 2. The rubber strip 2 will not make any noise and can also protect the applied adhesive from wear. The sound insulation effect is significantly increased, and the sound insulation effect will not weaken even after long-term stepping. The sound insulation effect is long-lasting.

[0045] If the rubber strip is damaged later, it can be replaced after the floor is removed. Replacement is convenient and only needs to be done in the area where there is abnormal noise.

[0046] After the adhesive on the sidewalls of the primary solid wood composite flooring has cured, the lower surface of the substrate layer 3 of the primary solid wood composite flooring is sanded, and then a 0.3-0.5mm layer of anti-corrosion and moisture-resistant paint is sprayed on. The surface of the surface layer 7 is coated with a 0.2-0.3mm layer of wear-resistant and anti-corrosion paint.

[0047] The lower surface of substrate layer 3 has an adhesive layer from the previous processing. It is then simply sanded and sprayed with anti-corrosion and moisture-resistant paint, applied in a slightly thicker layer, but not thicker than the exposed thickness of plug pad 41. The upper surface of surface layer 7 is sprayed with a 0.2-0.3mm layer of wear-resistant and anti-corrosion paint, applied according to the protection requirements.

[0048] The raw material composition of the sound-absorbing pad 4, by weight, includes 40-55 parts of EPDM rubber, 15-25 parts of light calcium carbonate, 8-10 parts of paraffin oil, 3-5 parts of silica, 2-3 parts of vulcanizing agent, 1-2 parts of accelerator, 0.5-1.0 parts of foaming agent, and 0.5-1.0 parts of silane coupling agent. The sum of the areas of the supporting surfaces of all the sound-absorbing pads 4 inserted into each of the substrate layers 3 is 15-20% of the bottom area of ​​the substrate layer 3.

[0049] EPDM rubber is first internally mixed at 80-100℃, then light calcium carbonate, paraffin oil, silica, accelerator, foaming agent, and silane coupling agent are added and mixed at 100-110℃. The mixture is then cooled to 80-90℃, and a vulcanizing agent is introduced for further mixing. However, at this temperature, the vulcanizing agent will not vulcanize. The shape of the sound-absorbing pad 4 is then pressed using a mold, trimmed, and inserted into the pad groove 31, followed by subsequent hot-press vulcanization. To ensure both support and sound absorption, the sound-absorbing pad 4 needs sufficient contact surface with the ground. Each sound-absorbing pad 4 has a length of 5-8cm and a width of 1.5-2.5cm to ensure adequate contact surface.

[0050] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0051] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A solid wood composite floor with sound-absorbing function, characterized in that: It includes a substrate layer (3), a sandwich panel (5), a core material layer (6), a surface layer (7), and a sound-absorbing pad (4); Each substrate layer (3) has a rubber pad groove (31) on its lower surface. Each substrate layer (3) has a sound-absorbing rubber pad (4) in the rubber pad groove. The sound-absorbing rubber pad (4) is hot-pressed and bonded to the rubber pad groove (31) and vulcanized using a hot-press vulcanizing plate. The sandwich panel (5) has uniformly round holes. The sandwich panel (5) is sandwiched between the substrate layer (3) and the core material layer (6). The sandwich panel (5) is coated with formaldehyde-free adhesive on both sides. A layer of formaldehyde-free adhesive is coated on the upper surface of the substrate layer (3) and the lower surface of the core material layer (6). The sandwich panel (5) is pressed onto the substrate layer (3) for bonding. Then the lower surface of the core material layer (6) is pressed onto the sandwich panel (5). Finally, hot pressing is performed to bond the sandwich panel (5). The lower surface of the surface layer (7) and the upper surface of the core material layer (6) are coated with formaldehyde-free adhesive and then hot-pressed together to form a primary solid wood composite floor; The primary solid wood composite flooring has multiple slots (32) evenly opened from the bottom of the substrate layer (3). The slots (32) do not penetrate the core material layer (6). Formaldehyde-free glue is injected into the slots (32). The slots (32) are engaged with the pins (8) with the back bar. The pins (8) with the back bar are fully engaged in the slots (32). The primary solid wood composite floor with the snap-back pin (8) is cut into the corresponding snap-fit ​​structure on both sides and both ends, and a sound-absorbing adhesive layer is applied to the snap-fit ​​structure.

2. The solid wood composite flooring with sound-absorbing function according to claim 1, characterized in that, The thickness of the substrate layer (3) is 4-6 mm, the depth of the adhesive groove (31) is 2-3 mm, and the adhesive groove (31) has a plurality of ear holes (311) that penetrate the substrate layer (3). The noise-absorbing pad (4) includes a plug pad (41) and an ear body (42). The thickness of the plug pad (41) is 3.5-4.5 mm. The ear body (42) is inserted into the ear canal (311). The plug pad (41) is inserted into the pad groove (31). The plug pad (41) protrudes 1.5-2.0 mm from the pad groove (31).

3. A solid wood composite floor with sound-absorbing function according to claim 2, characterized in that, After the sound-absorbing pad (4) is inserted into the pad groove (31) of the substrate layer (3), a layer of glue is applied to the lower surface of the substrate layer (3), and the lower surface of the substrate layer (3) is hot-pressed at 95-105°C for 2-3 minutes to vulcanize the sound-absorbing pad (4) and bond it into the pad groove (31). After hot pressing, the plug pad (41) is exposed in the pad groove (31) by 1.0-1.2 mm after being deformed by hot pressing.

4. A solid wood composite floor with sound-absorbing function according to claim 3, characterized in that, The upper surface of the substrate layer (3) is sanded with sanding belt, and the upper and lower surfaces of the core material layer (6) are sanded with sanding belt; The sandwich panel (5) has uniformly opened circular holes with a diameter of 3-5 mm, and then honeycomb holes of 0.1-0.2 mm are uniformly opened on the sandwich panel (5) using a laser. The thickness of the sandwich panel (5) is 0.8-1.2 mm. After the substrate layer (3), sandwich panel (5) and core material layer (6) are coated with adhesive, they are hot-pressed at 85-90℃ for 60-90s, then cooled to room temperature and pressed under high pressure for 5-10h.

5. A solid wood composite floor with sound-absorbing function according to claim 1, characterized in that, The temperature for hot-pressing the lower surface of the surface layer (7) and the upper surface of the core material layer (6) is 80-100℃. The surface layer (7) is a wood veneer with a thickness of 2-4mm. During hot pressing, the surface layer (7) is heated and hot-pressed for 60-90s, and then cooled and pressed for 3-5h.

6. A solid wood composite floor with sound-absorbing function according to claim 1, characterized in that, The thickness of the core material layer (6) is 6-8 mm, the depth of the pin groove (32) extending to the core material layer (6) is 4-5 mm, and the pin groove (32) is further threaded with a tap. Epoxy resin AB glue is injected into the pin groove (32), and then the pin rod (8) with return bar is clamped in the pin groove (32). The pin rod (8) with return bar is made of plastic. The pin rod (8) with return bar includes a column (81) and return bar (82). Multiple rings of return bar (82) are provided at equal intervals on the outer wall of the column (81), and at least one ring of return bar (82) is clamped in the core material layer (6). The diameter of the circle formed by the back burr (82) is 1-1.5 mm larger than the inner diameter of the pin groove (32).

7. A solid wood composite floor with sound-absorbing function according to claim 1, characterized in that, The two sides of the primary solid wood composite flooring have a semi-cylindrical protrusion (12) and a semi-cylindrical groove (11), respectively. The semi-cylindrical groove (11) has a vertically downward rubber strip groove (111) on the lower half of the groove wall. A rubber strip (2) is inserted into the rubber strip groove (111), and the rubber strip (2) protrudes from the groove wall of the semi-cylindrical groove (11). The diameter of the semi-cylindrical protrusion (12) is 5-7 mm, the inner diameter of the semi-cylindrical groove (11) is 6-8 mm, and the inner diameter of the semi-cylindrical groove (11) is 10-15% larger than the diameter of the semi-cylindrical protrusion (12). The side walls of the primary solid wood composite flooring, as well as the semi-cylindrical protrusions (12) and semi-cylindrical grooves (11), are coated with glue. After the glue solidifies, the semi-cylindrical protrusions (12) fit perfectly into the semi-cylindrical grooves (11) and press against the adhesive strips (2).

8. A solid wood composite floor with sound-absorbing function according to claim 7, characterized in that, After the adhesive on the sidewalls of the primary engineered wood flooring has cured, the lower surface of the substrate layer is sanded, and then a 0.3-0.5mm layer of anti-corrosion and moisture-resistant paint is sprayed on. The surface of the surface layer (7) is coated with a 0.2-0.3 mm layer of wear-resistant and anti-corrosion paint.

9. A solid wood composite floor with sound-absorbing function according to claim 1, characterized in that, The sound-absorbing rubber pad (4) contains, by weight, 40-55 parts of EPDM rubber, 15-25 parts of light calcium carbonate, 8-10 parts of paraffin oil, 3-5 parts of silica, 2-3 parts of vulcanizing agent, 1-2 parts of accelerator, 0.5-1.0 parts of foaming agent and 0.5-1.0 parts of silane coupling agent; The sum of the areas of the supporting surfaces of all the sound-absorbing pads (4) inserted into each of the substrate layers (3) is 15-20% of the bottom area of ​​the substrate layer (3).

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