An adaptive temperature control system and method for a MEMS pressure sensor

Abstract

The present disclosure provides an adaptive temperature control system and method for a MEMS pressure sensor. The adaptive temperature control system comprises a core, a temperature control module and a socket. The core is mechanically mounted on the socket, and integrates a temperature measuring element, a MEMS chip and a heating and refrigeration device. The temperature control module is directly installed in the internal space of the socket, and is used to collect the temperature signal of the MEMS chip from the temperature measuring element, adjust the current size and direction flowing to the heating and refrigeration device, and drive the heating and refrigeration device to heat or refrigerate the MEMS chip, so as to accurately stabilize the working temperature of the MEMS chip within a preset target range. The socket is used to simultaneously serve as the mechanical support and passive heat dissipation component of the core. The present disclosure solves the problem of thermal characteristic drift caused by temperature change by constructing a laminated high-efficiency heat management structure of "MEMS chip-bonding-intermediate carrier layer-thermal conductive interface material-heating and refrigeration device", and improves the measurement stability and precision of the sensor in a wide temperature range.

Description

Technical Field

[0001] This disclosure relates to the field of sensor temperature control technology, and in particular to an adaptive temperature control system and method for MEMS pressure sensors, which is suitable for pressure sensing applications that need to maintain measurement accuracy in high and low temperature environments. Background Technology

[0002] MEMS pressure sensors, based on microelectromechanical systems technology, are widely used in industrial control, automotive electronics, and aerospace. Their core sensing element is a MEMS chip, which is highly sensitive to changes in external temperature. Temperature fluctuations can cause thermal drift in the chip, leading to measurement errors.

[0003] However, the biggest drawback of MEMS pressure sensors is temperature drift, meaning the sensor's output is affected by temperature. Temperature drift includes zero-point drift and sensitivity drift, which is determined by the temperature sensitivity of semiconductor physics. Temperature drift causes errors in the pressure sensor's output signal, affecting measurement accuracy and is one of the most important factors affecting stability.

[0004] To overcome the effects of temperature drift and improve the measurement accuracy of sensors, there are currently two main methods for temperature compensation: hardware and software. Hardware temperature compensation typically involves constructing compensation circuits and improving material structures. Hardware compensation has advantages such as real-time performance and significant compensation effects, but its compensation accuracy is limited and its flexibility is poor. Software temperature compensation typically uses polynomials, least squares methods, machine learning, etc., to fit the sensor's output data. While software compensation has a certain compensation effect, the compensation process requires a large amount of training data, thus placing high demands on the circuit's computational power and leading to higher production costs.

[0005] Therefore, it is necessary to provide a system that can actively control the temperature of MEMS chips so that they can still work stably in variable temperature environments, suppress thermal drift at the physical level, and reduce the dependence on complex compensation algorithms. Summary of the Invention

[0006] In view of this, the main objective of this disclosure is to provide an adaptive temperature control system and method for MEMS pressure sensors to solve the problem of thermal characteristic drift caused by temperature changes and improve the measurement stability and accuracy of the sensor in a wide temperature range.

[0007] To achieve one aspect of the above objectives, this disclosure provides an adaptive temperature control system for a MEMS pressure sensor. The system includes a core 200, a temperature control module 300, and a mounting base 100. The core 200 is mechanically mounted on the mounting base 100, integrating a temperature sensing element 231, a MEMS chip 230, and a heating / cooling device 290. The temperature control module 300 is directly installed within the mounting base 100 and, based on the temperature signal collected by the temperature sensing element 231 from the MEMS chip 230, adjusts the magnitude and direction of the current flowing to the heating / cooling device 290, driving the heating / cooling device 290 to heat or cool the MEMS chip 230, thereby precisely stabilizing the operating temperature of the MEMS chip 230 within a preset target range. The mounting base 100 simultaneously serves as a mechanical support for the core 200 and a passive heat dissipation component.

[0008] In the above scheme, the core 200 includes: an intermediate carrier layer 240; a MEMS chip 230, which is formed on the upper surface of the intermediate carrier layer 240 by a bonding process, forming a strong connection with electrical isolation characteristics; a heating and cooling device 290, one end of which is thermally coupled to the lower surface of the intermediate carrier layer 240 through a thermally conductive interface material 250, forming an efficient heat conduction path from the MEMS chip 230 to the heating and cooling device 290; the other end is thermally coupled to the inner wall of the metal core base 280 through the thermally conductive interface material 250, realizing a low thermal resistance connection and establishing an outward core active heat dissipation channel; and a temperature sensing element 231, which is disposed on the temperature sensing area of ​​the MEMS chip 230, for real-time monitoring of the temperature of the MEMS chip 230.

[0009] In the above scheme, the intermediate carrier layer 240 is made of any one or more of the following materials: silicon, glass, ceramic, metal alloy, or composite material; the MEMS chip 230 is directly and firmly bonded to the upper surface of the intermediate carrier layer 240 through any one of the following processes: anodic bonding, eutectic bonding, glass powder bonding, adhesive bonding, brazing, or direct bonding; the thermal interface material 250 is made of any one of the following: thermally conductive silver paste, thermally conductive epoxy resin, thermally conductive silicone, modified acrylate thermally conductive adhesive, or low-temperature alloy solder.

[0010] In the above scheme, the heating and cooling device 290 adopts a thermoelectric cooler and has a ceramic substrate 260 on its outer periphery for supporting and protecting the glass sintered pins 270 of the core.

[0011] In the above scheme, the temperature sensing element 231 is a thermistor, which is placed on the fixed support edge of the MEMS chip 230.

[0012] In the above scheme, the electrical connections of the components inside the core 200, including the leads of the MEMS chip 230, the heating and cooling device 290 and the temperature measuring element 231, are all connected to the glass sintered pins 270 of the core through gold wire bonding. The leads are led out from the glass sintered pins 270 of the core and electrically interconnected with the temperature control module 300 in the tube socket 100, thereby completing a complete closed-loop control circuit from sensing, temperature measurement, control to execution.

[0013] In the above scheme, the temperature control module 300 adopts a printed circuit board (PCB) and integrates a signal processing unit 301, a microcontroller 302, and a power drive unit 303. During operation, the temperature sensing element 231 sends the temperature signal of the MEMS chip 230 monitored in real time to the temperature control module 300. The temperature signal is converted into an electrical signal that can be recognized by the microcontroller 302 by the signal processing unit 301. The temperature control module 300 uses the microcontroller 302 as its core, runs a PID control algorithm, and dynamically generates control commands by analyzing the temperature deviation. It controls the power drive unit 303 to adjust the magnitude and direction of the current applied to the heating and cooling device 290 in real time, thereby driving the heating and cooling device 290 to heat or cool the MEMS chip 230.

[0014] In the above scheme, when it is necessary to lower the temperature of the MEMS chip 230, the power drive unit 303 drives the heating and cooling device 290 to cool, pumping the heat of the MEMS chip 230 to the core base 280 and dissipating it through the tube socket 100; when it is necessary to raise the temperature of the MEMS chip 230, the power drive unit 303 reverses the current to drive the heating and cooling device 290 to heat, supplementing the heat of the MEMS chip 230; through this dynamic adjustment, the operating temperature of the MEMS chip 230 is precisely stabilized within the preset target range.

[0015] In another aspect to achieve the above objectives, this disclosure also provides an adaptive temperature control method for MEMS pressure sensors, based on the aforementioned adaptive temperature control system, the method comprising:

[0016] The temperature sensing element sends the real-time temperature signal of the MEMS chip to the temperature control module;

[0017] The signal processing unit in the temperature control module converts the temperature signal from the MEMS chip into an electrical signal that can be recognized by the microcontroller and sends it to the microcontroller.

[0018] The microcontroller runs a PID control algorithm to analyze temperature deviations and dynamically generate control commands. It controls the power drive unit to adjust the magnitude and direction of the current applied to the heating and cooling device in real time, driving the heating and cooling device to heat or cool the MEMS chip, and accurately stabilize the operating temperature of the MEMS chip within the preset target range.

[0019] In the above scheme, the driving heating and cooling device heats or cools the MEMS chip to precisely stabilize the operating temperature of the MEMS chip within a preset target range, including:

[0020] When it is necessary to reduce the temperature of the MEMS chip, the power drive unit drives the heating and cooling device to cool down, pumping the heat of the MEMS chip to the core base and dissipating it through the tube socket.

[0021] When it is necessary to raise the temperature of the MEMS chip, the power drive unit reverses the current to drive the heating and cooling device to heat up and replenish the heat of the MEMS chip.

[0022] This dynamic adjustment precisely stabilizes the operating temperature of the MEMS chip within a preset target range.

[0023] As can be seen from the above technical solution, the adaptive temperature control system and method for MEMS pressure sensors provided in this disclosure can actively control the temperature of the MEMS chip, enabling it to operate stably in variable temperature environments. It effectively suppresses thermal drift at the physical level, solves the problem of thermal characteristic drift caused by temperature changes, reduces reliance on complex compensation algorithms, and improves the measurement stability and accuracy of the sensor over a wide temperature range. Compared with existing technologies, it has at least the following beneficial effects:

[0024] 1. The adaptive temperature control system and method for MEMS pressure sensors disclosed herein achieve rapid response and precise control of MEMS chip temperature by constructing a stacked high-efficiency thermal management structure of "MEMS chip-bonding-intermediate carrier layer-thermal conductive interface material-heating and cooling device". This directly and effectively suppresses and solves the thermal characteristic drift caused by temperature fluctuations from a physical level, avoids the complexity of traditional full-temperature compensation, and has the characteristics of high precision, fast response and strong anti-interference ability.

[0025] 2. The adaptive temperature control system and method for MEMS pressure sensors provided in this disclosure employs advanced bonding processes (such as anodic bonding, eutectic bonding, etc.) to ensure both high mechanical strength and reliable electrical isolation between the MEMS chip and the intermediate carrier layer; while the application of thermally conductive interface materials ensures efficient heat exchange from the MEMS chip to the heating and cooling device, thereby improving thermal management efficiency and fully ensuring the integrity of the sensing signal.

[0026] 3. The adaptive temperature control system and method for MEMS pressure sensors disclosed herein directly mounts the temperature control module 300 into the internal space of the tube socket 100, achieving a compact integrated design of the temperature control module and the core in terms of mechanical structure and electrical logic. This integration method does not change the original pressure transmission path and core sensing mechanism of the MEMS pressure sensor, enabling the adaptive temperature control scheme to flexibly adapt to various ranges and types of MEMS pressure sensors, significantly expanding the applicability of the sensor in extreme temperature environments.

[0027] 4. The adaptive temperature control system and method for MEMS pressure sensors disclosed herein replaces complex full-temperature-range software compensation algorithms with physical temperature control, fundamentally reducing the dependence of MEMS pressure sensors on the computational power of back-end control circuits. This not only simplifies system design but also significantly shortens the temperature compensation testing cycle during production, reduces calibration costs, and substantially improves the long-term measurement stability, accuracy, and overall reliability of the sensor in a wide temperature range environment. Attached Figure Description

[0028] The foregoing contents, as well as other objects, features, and advantages of this disclosure, will become clearer from the following description of embodiments with reference to the accompanying drawings, in which:

[0029] Figure 1 This is a schematic diagram of an adaptive temperature control system for a MEMS pressure sensor according to an embodiment of the present disclosure;

[0030] Figure 2 This is a schematic diagram of the closed-loop control principle of an adaptive temperature control system for a MEMS pressure sensor according to an embodiment of this disclosure.

[0031] [Explanation of Labels in the Attached Image]

[0032] 100-tube seat;

[0033] 200-core;

[0034] 230-MEMS chip;

[0035] 231 - Temperature sensing element;

[0036] 240 - Intermediate carrier;

[0037] 250 - High thermal conductivity adhesive layer;

[0038] 290-Heating and Refrigeration Device

[0039] 260 - Ceramic matrix;

[0040] 270-pin

[0041] 280-Core base;

[0042] 300-Temperature control module. Detailed Implementation

[0043] The embodiments of the present disclosure will now be described with reference to the accompanying drawings. However, it should be understood that these descriptions are exemplary only and are not intended to limit the scope of the disclosure. In the following detailed description, numerous specific details are set forth to provide a thorough understanding of the embodiments of the present disclosure for ease of explanation. However, it will be apparent that one or more embodiments may be practiced without these specific details. Furthermore, descriptions of well-known structures and techniques are omitted in the following description to avoid unnecessarily obscuring the concepts of the present disclosure.

[0044] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit this disclosure. The terms “comprising,” “including,” etc., as used herein indicate the presence of the stated features, steps, operations, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, or components.

[0045] All terms used herein (including technical and scientific terms) have the meanings commonly understood by those skilled in the art, unless otherwise defined. It should be noted that the terms used herein are to be interpreted in a manner consistent with the context of this specification, and not in an idealized or overly rigid way.

[0046] Furthermore, the technical features involved in the different embodiments of this application described below can be combined with each other as long as they do not conflict with each other.

[0047] To address the thermal characteristic drift caused by temperature changes and improve the measurement stability and accuracy of sensors over a wide temperature range, this disclosure provides an adaptive temperature control system and method for MEMS pressure sensors. By constructing a layered, high-efficiency thermal management structure consisting of a MEMS chip, bonding layer, intermediate carrier layer, thermally conductive interface material, and heating / cooling device, the pressure sensor can achieve stable operation with high accuracy and low temperature drift even under extreme ambient temperatures. Therefore, it expands the applicable environment of the pressure sensor, improves its measurement accuracy, reduces the sensor's susceptibility to temperature effects, and is thus more suitable for practical applications.

[0048] like Figure 1 As shown, Figure 1This is a schematic diagram of an adaptive temperature control system for a MEMS pressure sensor according to an embodiment of the present disclosure. The system includes a core 200, a temperature control module 300, and a mounting base 100. The core 200 is mechanically mounted on the mounting base 100, integrating a temperature sensing element 231, a MEMS chip 230, and a heating / cooling device 290. The temperature control module 300 is directly installed inside the mounting base 100 and adjusts the magnitude and direction of the current flowing to the heating / cooling device 290 based on the temperature signal collected by the temperature sensing element 231 from the MEMS chip 230. This drives the heating / cooling device 290 to heat or cool the MEMS chip 230, precisely stabilizing the operating temperature of the MEMS chip 230 within a preset target range. The mounting base 100 simultaneously serves as a mechanical support for the core 200 and a passive heat dissipation component.

[0049] The core 200 is described in detail below. Figure 1 As shown, the core 200 includes: an intermediate carrier layer 240; a MEMS chip 230, which is formed on the upper surface of the intermediate carrier layer 240 through a bonding process, forming a robust connection with electrical isolation characteristics; a heating and cooling device 290, one end of which is thermally coupled to the lower surface of the intermediate carrier layer 240 through a thermally conductive interface material 250, forming an efficient heat conduction path from the MEMS chip 230 to the heating and cooling device 290; the other end of which is thermally coupled to the inner wall of the metal core base 280 through the thermally conductive interface material 250, achieving a low thermal resistance connection and establishing an outward core active heat dissipation channel; and a temperature sensing element 231, which is disposed on the temperature sensing area of ​​the MEMS chip 230, for real-time monitoring of the temperature of the MEMS chip 230. The adaptive temperature control system for MEMS pressure sensors disclosed herein achieves rapid response and precise control of MEMS chip temperature by constructing a stacked high-efficiency thermal management structure of "MEMS chip-bonding-intermediate carrier layer-thermal conductive interface material-heating and cooling device". This directly and effectively suppresses and solves the thermal characteristic drift caused by temperature fluctuations from a physical level, avoids the complexity of traditional full-temperature compensation, and has the characteristics of high precision, fast response and strong anti-interference ability.

[0050] For the assembly of the core structure inside the core 200, according to the embodiments of this disclosure, the MEMS chip 230 is first directly and firmly bonded to the upper surface of the intermediate carrier layer 240 through a bonding process, forming a strong connection with electrical isolation characteristics. This disclosure employs advanced bonding processes, such as anodic bonding and eutectic bonding, to ensure both high mechanical strength and reliable electrical isolation between the MEMS chip 230 and the intermediate carrier layer 240. Subsequently, a thermally conductive interface material 250 is used to bond the bottom of the intermediate carrier layer 240 to the working end of the heating and cooling device 290, thereby completing an efficient thermal connection between the sensing unit and the temperature control execution unit. The hot end of the heating and cooling device 290 is attached to the inner wall of the metal core base 280 through another layer of thermally conductive interface material 250, thereby constructing an outward core heat dissipation channel. The application of the thermally conductive interface material 250 ensures efficient heat exchange from the MEMS chip 230 to the heating and cooling device 290, improving thermal management efficiency while fully ensuring the integrity of the sensing signal.

[0051] According to an embodiment of this disclosure, a ceramic substrate 260 is provided on the outer periphery of the heating and cooling device 290 to support and protect the glass sintered pins 270 of the core. In order to sense the temperature of the controlled object (i.e., the MEMS chip 230) in real time and accurately, a temperature sensing element 231 for real-time temperature monitoring is placed on the fixed support edge of the MEMS chip 230.

[0052] According to the embodiments of this disclosure, the electrical connections of the components inside the core 200, including the leads of the MEMS chip 230, the heating and cooling device 290, and the temperature sensing element 231, are all connected to the glass sintered pins 270 of the core through gold wire bonding. The glass sintered pins 270 of the core are led out and electrically interconnected with the temperature control module 300 (e.g., PCB board) inside the socket 100 through soldering or connectors, thereby completing the physical structure construction of a complete closed-loop control circuit from sensing, temperature measurement, control to execution.

[0053] According to embodiments of this disclosure, the intermediate carrier layer 240 is made of any one or more of the following materials: silicon, glass, ceramic, metal alloy, or composite material.

[0054] According to embodiments of this disclosure, the MEMS chip 230 is directly and firmly bonded to the upper surface of the intermediate carrier layer 240 by any one of the following processes: anodic bonding, eutectic bonding, glass powder bonding, adhesive bonding, brazing, or direct bonding.

[0055] According to embodiments of this disclosure, the thermally conductive interface material 250 is any one of thermally conductive silver paste, thermally conductive epoxy resin, thermally conductive silicone, modified acrylate thermally conductive adhesive, or low-temperature alloy solder.

[0056] According to an embodiment of this disclosure, the heating and cooling device 290 employs a thermoelectric cooler and has a ceramic substrate 260 on its outer periphery for supporting and protecting the glass sintered pins 270 of the core.

[0057] According to an embodiment of this disclosure, the temperature sensing element 231 is a thermistor and is mounted on the fixed edge of the MEMS chip 230.

[0058] According to an embodiment of this disclosure, the temperature control module 300 is a printed circuit board (PCB) and integrates a signal processing unit 301, a microcontroller 302, and a power drive unit 303, which is directly installed in the internal space of the tube socket 100.

[0059] During operation, the temperature sensing element 231 sends the real-time temperature signal of the MEMS chip 230 to the temperature control module 300. This temperature signal is converted into an electrical signal that can be recognized by the microcontroller 302 by the signal processing unit 301. The temperature control module 300, with the microcontroller 302 as its core, runs a PID control algorithm and dynamically generates control commands by analyzing temperature deviations. It controls the power drive unit 303 to adjust the magnitude and direction of the current applied to the heating and cooling device 290 in real time, thereby driving the heating and cooling device 290 to heat or cool the MEMS chip 230.

[0060] Optionally, when it is necessary to lower the temperature of the MEMS chip 230, the power drive unit 303 drives the heating and cooling device 290 to cool, pumping the heat from the MEMS chip 230 to the core base 280 and dissipating it through the tube socket 100. When it is necessary to raise the temperature of the MEMS chip 230, the power drive unit 303 reverses the current to drive the heating and cooling device 290 to heat, supplementing the MEMS chip 230 with heat. Through this dynamic adjustment, the operating temperature of the MEMS chip 230 is precisely stabilized within a preset target range. Optionally, the preset target temperature is 25°C.

[0061] According to embodiments of this disclosure, during the structural integration stage, the assembled core 200 is screwed into and fixed within the tube socket 100 via its clamping threads. Simultaneously, the temperature control module 300, integrating components such as the signal processing unit 301, microcontroller 302, and power drive unit 303, is pre-installed in the internal space of the tube socket 100 using a printed circuit board (PCB), achieving compact integration of the electronic control components. This disclosure directly installs the temperature control module 300 within the internal space of the tube socket 100, achieving a compact, integrated design of the temperature control module and the core in terms of both mechanical structure and electrical logic. This integration method does not alter the original pressure transmission path and core sensing mechanism of the MEMS pressure sensor, enabling this adaptive temperature control scheme to flexibly adapt to various ranges and types of MEMS pressure sensors, significantly expanding the sensor's applicability in extreme temperature environments.

[0062] Figure 2 This is a schematic diagram illustrating the closed-loop control principle of an adaptive temperature control system for a MEMS pressure sensor according to an embodiment of this disclosure. Specifically, in operation, the adaptive temperature control system for a MEMS pressure sensor provided in this embodiment of the disclosure transmits external pressure to the MEMS chip 230 via the original path of the sensor, causing a change in the temperature of the MEMS chip 230. Simultaneously, the temperature sensing element 231 sends the real-time monitored temperature signal of the MEMS chip 230 to the temperature control module 300. This temperature signal is converted into an electrical signal by the signal processing unit 301, which can be recognized by the microcontroller 302 (e.g., ESP32). The temperature control module 300, with the microcontroller 302 as its core, runs a PID control algorithm and dynamically generates control commands by analyzing temperature deviations. It then controls the power drive unit 303 (e.g., DRV8838) to adjust the magnitude and direction of the current applied to the heating / cooling device 290 in real time, driving the heating / cooling device 290 to heat or cool the MEMS chip 230. When the detected temperature is higher than the set value, the heating and cooling device 290 is driven to cool and extract heat; when the detected temperature is lower than the set value, the current is reversed to heat the heating and cooling device 290. Through this real-time and dynamic adjustment, the operating temperature of the MEMS chip 230 is ultimately stabilized precisely at the preset value (e.g., 25°C), thereby effectively suppressing thermal characteristic drift caused by temperature changes at the physical level.

[0063] This disclosure replaces complex full-temperature-range software compensation algorithms with physical isothermal control, fundamentally reducing the dependence of MEMS pressure sensors on the computational power of back-end control circuits. This not only simplifies system design but also significantly shortens the temperature compensation testing cycle during production, reduces calibration costs, and substantially improves the long-term measurement stability, accuracy, and overall reliability of MEMS pressure sensors in a wide temperature range environment.

[0064] based on Figure 1 The adaptive temperature control system shown is for MEMS pressure sensors, and Figure 2 The closed-loop control principle of the adaptive temperature control system for MEMS pressure sensors is described above. This disclosure also provides an adaptive temperature control method for MEMS pressure sensors, which includes the following steps:

[0065] Step 1: The temperature sensing element sends the real-time temperature signal of the MEMS chip to the temperature control module;

[0066] Step 2: The signal processing unit in the temperature control module converts the temperature signal from the MEMS chip into an electrical signal that can be recognized by the microcontroller and sends it to the microcontroller;

[0067] Step 3: The microcontroller runs the PID control algorithm, analyzes the temperature deviation, dynamically generates control commands, and controls the power drive unit to adjust the magnitude and direction of the current applied to the heating and cooling device in real time, driving the heating and cooling device to heat or cool the MEMS chip, and accurately stabilizes the operating temperature of the MEMS chip within the preset target range.

[0068] According to embodiments of this disclosure, step 3, which involves driving the heating and cooling device to heat or cool the MEMS chip and precisely stabilize the operating temperature of the MEMS chip within a preset target range, includes:

[0069] When it is necessary to reduce the temperature of the MEMS chip, the power drive unit drives the heating and cooling device to cool down, pumping the heat of the MEMS chip to the core base and dissipating it through the tube socket.

[0070] When it is necessary to raise the temperature of the MEMS chip, the power drive unit reverses the current to drive the heating and cooling device to heat up and replenish the heat of the MEMS chip.

[0071] This dynamic adjustment precisely stabilizes the operating temperature of the MEMS chip within a preset target range.

[0072] Those skilled in the art will understand that the features described in the various embodiments of this disclosure can be combined and / or combined in various ways, even if such combinations or combinations are not explicitly described in this disclosure. In particular, the features described in the various embodiments of this disclosure can be combined and / or combined in various ways without departing from the spirit and teachings of this disclosure. All such combinations and / or combinations fall within the scope of this disclosure.

[0073] The embodiments of this disclosure have been described above. However, these embodiments are for illustrative purposes only and are not intended to limit the scope of this disclosure. Although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be used advantageously in combination. Various substitutions and modifications can be made by those skilled in the art without departing from the scope of this disclosure, and all such substitutions and modifications should fall within the scope of this disclosure.

Claims

1. An adaptive temperature control system for MEMS pressure sensors, characterized in that, The system includes a core (200), a temperature control module (300), and a tube socket (100), wherein: The core (200) is mechanically mounted on the tube base (100), integrating the temperature sensing element (231), MEMS chip (230) and heating and cooling device (290) into one unit; The temperature control module (300) is directly installed in the internal space of the tube socket (100). It is used to adjust the magnitude and direction of the current flowing to the heating and cooling device (290) according to the temperature signal collected from the MEMS chip (230) by the temperature sensing element (231), and drive the heating and cooling device (290) to heat or cool the MEMS chip (230) so as to accurately stabilize the working temperature of the MEMS chip (230) within the preset target range. The tube base (100) serves as both a mechanical support and a passive heat dissipation component for the core (200).

2. The adaptive temperature control system for MEMS pressure sensors according to claim 1, characterized in that, The core (200) includes: Intermediate carrier layer (240); The MEMS chip (230) is formed on the upper surface of the intermediate carrier layer (240) by bonding process, forming a strong connection with electrical isolation characteristics; The heating and cooling device (290) is thermally coupled to the lower surface of the intermediate carrier layer (240) at one end through a thermally conductive interface material (250), forming an efficient heat conduction path from the MEMS chip (230) to the heating and cooling device (290); the other end is thermally coupled to the inner wall of the metal core base (280) through a thermally conductive interface material (250), achieving a low thermal resistance connection and establishing an outward core active heat dissipation channel; Temperature sensing element (231) is disposed on the temperature sensing area of ​​the MEMS chip (230) and is used to monitor the temperature of the MEMS chip (230) in real time.

3. The adaptive temperature control system for MEMS pressure sensors according to claim 2, characterized in that, The intermediate carrier layer (240) is made of any one or more of the following materials: silicon, glass, ceramic, metal alloy, or composite material. The MEMS chip (230) is directly and firmly bonded to the upper surface of the intermediate carrier layer (240) by any one of the following processes: anodic bonding, eutectic bonding, glass powder bonding, adhesive bonding, brazing or direct bonding. The thermal interface material (250) is any one of thermally conductive silver paste, thermally conductive epoxy resin, thermally conductive silicone, modified acrylate thermally conductive adhesive, or low-temperature alloy solder.

4. The adaptive temperature control system for MEMS pressure sensors according to claim 2, characterized in that, The heating and cooling device (290) adopts a thermoelectric cooler and has a ceramic substrate (260) on its outer periphery for supporting and protecting the glass sintered pins (270) of the core.

5. The adaptive temperature control system for MEMS pressure sensors according to claim 2, characterized in that, The temperature sensing element (231) is a thermistor and is placed on the fixed side of the MEMS chip (230).

6. The adaptive temperature control system for MEMS pressure sensors according to claim 2, characterized in that, The electrical connections of the components inside the core (200), including the leads of the MEMS chip (230), the heating and cooling device (290) and the temperature measuring element (231), are all connected to the glass sintered pins (270) of the core through gold wire bonding. The leads are led out from the glass sintered pins (270) of the core and electrically interconnected with the temperature control module (300) in the tube socket (100), thereby completing a complete closed-loop control circuit from sensing, temperature measurement, control to execution.

7. The adaptive temperature control system for MEMS pressure sensors according to claim 1, characterized in that, The temperature control module (300) adopts a printed circuit board (PCB) and integrates a signal processing unit (301), a microcontroller (302) and a power drive unit (303). During operation, the temperature sensing element (231) sends the temperature signal of the MEMS chip (230) monitored in real time to the temperature control module (300). The temperature signal is converted into an electrical signal that can be recognized by the microcontroller (302) by the signal processing unit (301). The temperature control module (300) uses the microcontroller (302) as its core, runs a PID control algorithm, and dynamically generates control commands by analyzing temperature deviations. It controls the power drive unit (303) to adjust the magnitude and direction of the current applied to the heating and cooling device (290) in real time, thereby driving the heating and cooling device (290) to heat or cool the MEMS chip (230).

8. The adaptive temperature control system for MEMS pressure sensors according to claim 7, characterized in that, When it is necessary to reduce the temperature of the MEMS chip (230), the power drive unit (303) drives the heating and cooling device (290) to cool, pumping the heat of the MEMS chip (230) to the core base (280) and dissipating it through the tube socket (100); When it is necessary to raise the temperature of the MEMS chip (230), the power drive unit (303) reverses the current to drive the heating and cooling device (290) to heat up and supplement the heat of the MEMS chip (230); This dynamic adjustment precisely stabilizes the operating temperature of the MEMS chip (230) within the preset target range.

9. An adaptive temperature control method for MEMS pressure sensors, based on the adaptive temperature control system according to any one of claims 1 to 8, characterized in that, include: The temperature sensing element sends the real-time temperature signal of the MEMS chip to the temperature control module; The signal processing unit in the temperature control module converts the temperature signal from the MEMS chip into an electrical signal that can be recognized by the microcontroller and sends it to the microcontroller. The microcontroller runs a PID control algorithm to analyze temperature deviations and dynamically generate control commands. It controls the power drive unit to adjust the magnitude and direction of the current applied to the heating and cooling device in real time, driving the heating and cooling device to heat or cool the MEMS chip, and accurately stabilize the operating temperature of the MEMS chip within the preset target range.

10. The adaptive temperature control method for MEMS pressure sensors according to claim 9, characterized in that, The driving heating and cooling device heats or cools the MEMS chip to precisely stabilize its operating temperature within a preset target range, including: When it is necessary to reduce the temperature of the MEMS chip, the power drive unit drives the heating and cooling device to cool down, pumping the heat of the MEMS chip to the core base and dissipating it through the tube socket. When it is necessary to raise the temperature of the MEMS chip, the power drive unit reverses the current to drive the heating and cooling device to heat up and replenish the heat of the MEMS chip. This dynamic adjustment precisely stabilizes the operating temperature of the MEMS chip within a preset target range.

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