Temperature control device, method and chip processing system for chip testing

Abstract

The application provides a temperature control device, a method and a chip processing system for chip testing. A cold source module outputs cold energy with a preset temperature. A heat source module is connected with the cold source module on one side, and heats the cold energy from the cold source module to perform thermal compensation on the cold energy. A data acquisition module is arranged on a test platform module to acquire real-time temperature data of a test environment temperature. A control module is electrically connected with the heat source module and the data acquisition module, and dynamically controls the heating temperature of the heat source module according to the real-time temperature data and a preset cooling rate, so as to reduce the real-time temperature data to a first target value based on the preset cooling rate. The application can control the temperature of the cold energy output by the cold source module through thermal compensation, so that the cold energy applied to the chip to be tested changes based on the preset cooling rate, and accurate control of the preset cooling rate can be realized.

Description

Technical Field

[0001] This application relates to the technical field of chip testing, and more specifically, to a temperature control device, method, and chip manufacturing system for chip testing. Background Technology

[0002] An infrared detector is a sensor that converts incident infrared radiation signals into measurable electrical signals. It features passive detection, high accuracy, and strong environmental adaptability, and is widely used in critical fields such as military night vision, astronomical observation, aerospace, industrial inspection, and security monitoring. During the fabrication of infrared detector chips, electrical testing is performed on the chip before the packaging process to verify its electrical performance and reliability; this process is commonly referred to as "in-chip testing."

[0003] Traditional chip testing methods mainly rely on liquid nitrogen Dewar testing. For example, the specific testing process is as follows: liquid nitrogen is injected into the Dewar container, and the low temperature characteristics of liquid nitrogen are used to provide the chip under test with the required low temperature testing environment (usually around 77K) to simulate its actual working state and measure its electrical characteristics at low temperature.

[0004] However, the inventors of this application have discovered that the current chip testing method based on liquid nitrogen-based Dewar testing still has problems such as uncontrollable temperature control rate, limited test temperature range, difficulty in guaranteeing cold junction temperature uniformity, stability and temperature control accuracy, and uncontrollable reheating process.

[0005] The content in the background section is merely technology known to the public and does not necessarily represent existing technology in this field. Summary of the Invention

[0006] According to one aspect of this application, a temperature control device for chip testing is provided. The device includes a cold source module, a heat source module, a test platform module, a data acquisition module, and a control module. The cold source module outputs cooling energy at a preset temperature. A heat source module is connected to the cold source module on one side and heats the cooling energy from the cold source module to thermally compensate for the cooling energy. The test platform module is connected to the other side of the heat source module and is used to hold the chip under test (DUT) and receive the thermally compensated cooling energy to control the test environment temperature at the DUT. The data acquisition module is mounted on the test platform module and acquires real-time temperature data of the test environment. The control module, electrically connected to the heat source module and the data acquisition module, dynamically controls the heating temperature of the heat source module based on the real-time temperature data and a preset cooling rate to reduce the real-time temperature data to a first target value based on the preset cooling rate.

[0007] According to some embodiments of this application, the cold source module includes a cold end, which is in contact with one side of the heat source module.

[0008] According to some embodiments of this application, the cold source module is a refrigeration unit.

[0009] According to some embodiments of this application, the heat source module includes: a heat-conducting platform, which is in contact with and connected to the cold source module; and at least one heating unit, which is disposed on the heat-conducting platform.

[0010] According to some embodiments of this application, the test platform module includes at least one mounting hole, through which the chip under test is mounted on the test platform module.

[0011] According to some embodiments of this application, the data acquisition module includes: at least one temperature measuring unit, with each temperature measuring unit corresponding to a heating unit, and the temperature measuring unit collects real-time temperature data at its location.

[0012] According to some embodiments of this application, when the cold source module is off, the control module also dynamically controls the heating temperature of the heat source module based on real-time temperature data and a preset heating rate, so as to raise the real-time temperature data to a second target value based on the preset heating rate.

[0013] According to another aspect of this application, this application also provides a temperature control method for chip testing, comprising: acquiring real-time temperature data of the test environment temperature collected by a data acquisition module; dynamically controlling the heating temperature of a heat source module based on the temperature data and a preset cooling rate, so as to reduce the real-time temperature data to a first target value based on the preset cooling rate.

[0014] According to some embodiments of this application, the temperature control method further includes: when the cold source module is turned off, dynamically controlling the heating temperature of the heat source module based on real-time temperature data and a preset heating rate, so as to increase the real-time temperature data to a second target value based on the preset heating rate.

[0015] According to another aspect of this application, a chip manufacturing system is also provided, which includes the temperature control device as described above.

[0016] Beneficial effects

[0017] This application provides a temperature control device for chip testing, comprising a cold source module, a heat source module, a test platform module, a data acquisition module, and a control module. The cold source module outputs cooling energy at a preset temperature. A heat source module is connected to the cold source module on one side and heats the cooling energy from the cold source module to thermally compensate for the cooling energy. The test platform module is connected to the other side of the heat source module and is used to hold the chip under test (DUT) and receive the thermally compensated cooling energy to control the test environment temperature at the DUT. The data acquisition module is mounted on the test platform module and collects real-time temperature data of the test environment. The control module, electrically connected to the heat source module and the data acquisition module, dynamically controls the heating temperature of the heat source module based on the real-time temperature data and a preset cooling rate to reduce the real-time temperature data to a first target value based on the preset cooling rate.

[0018] This application, by configuring a heat source module, can buffer the cooling energy from the cold source module. Compared to traditional testing methods that directly apply cooling energy to the chip under test (DUT), this application can apply cooling energy uniformly and stably to the DUT. This application can avoid the problem of uneven cooling energy applied to the DUT, which could lead to performance damage due to stress.

[0019] Furthermore, this application, through the configuration of a heat source module, a data acquisition module, and a control module, can precisely control the heating temperature of the heat source module, ensuring that the heat output from the heat source module offsets the cooling output from the cold source module. This application can also control the temperature of the cooling output from the cold source module through thermal compensation, ensuring that the cooling applied to the chip under test varies based on a preset cooling rate, and enabling precise control of this preset cooling rate. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This diagram illustrates the structure of a temperature control device according to an embodiment of this application. Figure 2 This diagram illustrates the structure of the cold source module according to an embodiment of this application. Figure 3 This diagram illustrates the structure of a heat source module according to an embodiment of this application. Figure 4 This diagram illustrates the structure of the test platform module according to an embodiment of this application. Figure 5This diagram illustrates the structure of the data acquisition module according to an embodiment of this application. Figure 6 A schematic flowchart of the temperature control method according to an embodiment of this application is shown.

[0022] Explanation of reference numerals in the attached figures: Cold source module 10; heat source module 20; test platform module 30; data acquisition module 40; control module 50; Cold end 11; heat conduction platform 21; heating unit 22; mounting hole 31; temperature measuring unit 41. Detailed Implementation

[0023] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided so that this application will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar parts, and therefore repeated descriptions of them will be omitted.

[0024] The described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a full understanding of embodiments of this disclosure. However, those skilled in the art will recognize that the technical solutions of this disclosure can be practiced without one or more of these specific details, or other methods, components, materials, devices, etc. In these cases, well-known structures, methods, devices, implementations, materials, or operations will not be shown or described in detail.

[0025] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the steps or units listed, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to such process, method, product, or apparatus.

[0026] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order.

[0027] The technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0028] The inventors of this application have discovered that current chip-based measurement methods based on measuring Dewar flares in liquid nitrogen still have at least the following technical problems: 1. The temperature control rate is uncontrollable, and temperature determination relies heavily on subjective human experience: When liquid nitrogen is poured into the test dewar, the cooling process of the cold end platform where the chip under test (DUT) is located is drastic and cannot be precisely controlled. Operators can usually only roughly judge whether the DUT has reached the preset liquid nitrogen temperature range (e.g., 77K) by observing external phenomena such as the boiling state and frost formation of the liquid nitrogen, relying on personal experience. The lack of a real-time, precise temperature feedback and control method may cause stress damage to the DUT due to excessively rapid or uneven impacts, affecting chip performance or even causing irreversible defects.

[0029] 2. The testing temperature range is limited, and it cannot meet the requirements for deep cryogenic testing: The boiling point of liquid nitrogen (approximately 77 K) is essentially constant under standard atmospheric pressure, which limits the lowest stable temperature that traditional on-chip measurement methods based on liquid nitrogen measurement dewars can provide to the liquid nitrogen temperature range. With the development of infrared detector technology, especially for high-performance detectors that require operation at even lower temperatures (such as below 20 K) (e.g., detectors for certain astronomical observations and quantum sensing applications), traditional on-chip measurement methods cannot provide the required cryogenic testing environment.

[0030] 3. It is difficult to guarantee the uniformity, stability, and temperature control accuracy of the cold end temperature: In the open cooling process of measuring a Dewar flask in liquid nitrogen, significant temperature differences may occur at different locations on the cold end platform due to the non-uniformity of liquid nitrogen convection and boiling, as well as limitations in the internal thermal design of the Dewar flask, resulting in poor temperature uniformity. Furthermore, the continuous evaporation of liquid nitrogen leads to a drop in liquid level and fluctuations in cooling supply, making it difficult to maintain temperature stability during the test. The lack of a high-precision closed-loop temperature control mechanism results in poor temperature control accuracy.

[0031] 4. The temperature recovery process is uncontrollable, resulting in low testing efficiency: After testing, the chip under test (DUT) needs to recover from its low temperature to room temperature. This recovery process typically relies on natural heating, which is slow and completely uncontrollable. Operators also cannot accurately determine when the DUT has safely and stably recovered to room temperature and must passively wait for a considerable period to ensure the chip is fully warmed before proceeding with subsequent removal or transfer operations. This waiting process prolongs the total time of a single test, reduces overall test throughput and equipment utilization, and decreases test efficiency.

[0032] According to one aspect of this application, a temperature control device for chip testing is provided.

[0033] According to the example embodiment, such as Figure 1As shown, the temperature control device includes a cold source module 10, a heat source module 20, a test platform module 30, a data acquisition module 40, and a control module 50.

[0034] According to the example embodiment, the cold source module 10 outputs cooling capacity at a preset temperature.

[0035] For example, the cold source module 10 is the cold source of the temperature control device, used to respond to user commands and output cooling capacity with a preset temperature.

[0036] According to the example embodiment, such as Figure 1 As shown, one side of the heat source module 20 is connected to the cold source module 10 to heat the cold energy from the cold source module 10, thereby thermally compensating for the cold energy. The test platform module 30 is connected to the other side of the heat source module 20 and is used to carry the chip under test and receive the thermally compensated cold energy, so as to control the test environment temperature at the chip under test through the thermally compensated cold energy.

[0037] For example, the heat source module 20 is positioned between the cold source module 10 and the test platform module 30. The heat source module 20 can receive cooling energy from the cold source module 10, and the heat output by the heat source module 20 can buffer the cooling energy with a preset temperature, thereby reducing the temperature of the cooling energy and controlling the temperature of the cooling energy reaching the test platform module 30.

[0038] The test platform module 30 is equipped with a chip under test. The heat source module 20 can transfer the thermally compensated cold energy to the test platform module 30, thereby controlling the test environment temperature at the chip under test.

[0039] According to the example embodiment, such as Figure 1 As shown, the data acquisition module 40 is installed on the test platform module 30 to collect real-time temperature data of the test environment.

[0040] For example, the data acquisition module 40 can be fixedly installed on the test platform module 30, and can collect real-time temperature data of the test environment.

[0041] According to the example embodiment, such as Figure 1 As shown, the control module 50 is electrically connected to the heat source module 20 and the data acquisition module 40. The control module 50 dynamically controls the heating temperature of the heat source module 20 based on the real-time temperature data and the preset cooling rate, so as to reduce the real-time temperature data to the first target value based on the preset cooling rate.

[0042] For example, during the cooling phase of the chip under test, the control module 50 can receive real-time temperature data collected by the data acquisition module 40. Based on the real-time temperature data and the preset cooling rate, the control module 50 calculates the required output temperature of the heat source module 20, and can then continuously and dynamically control the heating temperature of the heat source module 20. As the heating temperature of the heat source module 20 continuously and dynamically changes, the temperature of the thermally compensated cooling energy also changes dynamically in real time, ensuring that the temperature of the cooling energy applied to the chip under test varies based on the preset cooling rate.

[0043] For example, the control module 50 can be a host computer. The preset cooling rate and the first target value can be customized according to user needs.

[0044] According to the example embodiment, the control module 50 can control the heating temperature at the mK level to ensure the temperature control accuracy of the temperature control device provided in this application.

[0045] It is understood that the control module 50 can calculate the required output temperature of the heat source module 20 based on real-time temperature data and preset cooling rate, which can be achieved based on a preset program. This application will not elaborate on this in detail.

[0046] For example, as an embodiment, if the preset cooling rate is 0.8K / min, the control module 50 can control the heating temperature of the heat source module 20 so that the temperature of the cooling applied to the chip under test decreases at a rate of 0.8K per minute, so as to gradually reduce the test environment temperature at the chip under test to the first target value.

[0047] Through the above embodiments, this application provides a temperature control device for chip testing. The temperature control device includes a cold source module, a heat source module, a test platform module, a data acquisition module, and a control module. The cold source module outputs cooling energy at a preset temperature. One side of the heat source module is connected to the cold source module to heat the cooling energy from the cold source module, thereby thermally compensating for the cooling energy. The test platform module is connected to the other side of the heat source module and is used to carry the chip under test and receive the thermally compensated cooling energy, so as to control the test environment temperature at the chip under test through the thermally compensated cooling energy. The data acquisition module is disposed on the test platform module and collects real-time temperature data of the test environment. The control module, electrically connected to the heat source module and the data acquisition module, dynamically controls the heating temperature of the heat source module according to the real-time temperature data and a preset cooling rate, so as to reduce the real-time temperature data to a first target value based on the preset cooling rate.

[0048] This application, by configuring a heat source module, can buffer the cooling energy from the cold source module. Compared to traditional testing methods that directly apply cooling energy to the chip under test (DUT), this application can apply cooling energy uniformly and stably to the DUT. This application can avoid the problem of uneven cooling energy applied to the DUT, which could lead to performance damage due to stress.

[0049] Furthermore, this application, through the configuration of a heat source module, a data acquisition module, and a control module, can precisely control the heating temperature of the heat source module, ensuring that the heat output from the heat source module offsets the cooling output from the cold source module. This application can also control the temperature of the cooling output from the cold source module through thermal compensation, ensuring that the cooling applied to the chip under test varies based on a preset cooling rate, and enabling precise control of this preset cooling rate.

[0050] Optionally, such as Figure 1 or Figure 2 As shown, the cold source module 10 includes a cold end 11, which is in contact with one side of the heat source module 20.

[0051] For example, cold end 11 is the output end of the cooling capacity of the cooling source module 10. By directly and physically contacting the heat source module 20, cold end 11 can better transfer the cooling capacity to the heat source module 20, thereby reducing the loss of cooling capacity during the transmission process.

[0052] Optionally, the cold source module 10 is a refrigeration unit.

[0053] For example, the cold source module 10 can be a gas regenerative refrigeration unit, which has the characteristics of simple structure, convenient use and reliable operation. It can provide a stable cold source and has the feature of visualizing the cold end temperature.

[0054] For example, the cold source module 10 may include, but is not limited to, a Stirling refrigerator, a pulse tube refrigerator, a throttling refrigerator, and a Solvin refrigerator, etc., and this application does not limit it.

[0055] This application utilizes a refrigerator as the cold source, providing a minimum cooling capacity of 15K. The temperature control device provided in this application replaces the liquid nitrogen-based Dewar flask in the prior art with a refrigerator, overcoming the limitation of the liquid nitrogen temperature range (minimum 77K) and at least compensating for the need for a deep cryogenic testing environment of 15K-77K, thus solving the problem of limited testing temperature range.

[0056] Optionally, such as Figure 3 As shown, the heat source module 20 includes a heat-conducting platform 21 and at least one heating unit 22. The heat-conducting platform 21 is in contact with the cold source module 10, and at least one heating unit 22 is disposed on the heat-conducting platform 21.

[0057] For example, such as Figure 3As shown, the heat-conducting platform 21 is in physical contact with the cold source module 10 and can receive cooling energy from the cold source module 10. Figure 3 As shown, the heat conduction platform 21 has a platform structure, which can evenly diffuse the cold energy so that the heat conduction platform 21 can evenly transfer the cold energy to the test platform module 30.

[0058] For example, such as Figure 3 As shown, the heat source module 20 includes four heating units 22, which are evenly arranged on the heat-conducting platform 21 (e.g., Figure 3 As shown, each heating unit 22 can be spaced 90° apart. This arrangement makes the heat generated by the heat source module 20 more uniform.

[0059] Optionally, the heating unit 22 is a heating resistor.

[0060] For example, the heating unit 22 may include, but is not limited to, alloy heating resistors, ceramic heating resistors, and semiconductor heating resistors, etc., and this application does not limit it.

[0061] Optionally, the heat-conducting platform 21 is made of metal. Metal has good thermal conductivity, which can evenly diffuse the heat output from the heating unit 22 onto the heat-conducting platform 21.

[0062] Through the above embodiments, on the one hand, by setting up a heat-conducting platform, this application can uniformly and stably diffuse the cold energy output from the cold source module and the heat output from the heat source module on the heat-conducting platform, thereby enabling the cold and heat to form a uniform and stable offset, thus providing uniform and stable thermal compensation for the cold energy. On the other hand, by setting up a heat-conducting platform between the cold source module and the test platform module, this application enables the cold energy to be uniformly and stably transferred to the test platform module, avoiding the problem of performance damage caused by uneven application of cold energy to the chip under test due to stress.

[0063] Optionally, such as Figure 4 As shown, the test platform module 30 includes at least one mounting hole 31, through which the chip under test is mounted on the test platform module 30.

[0064] For example, the specific dimensions of the test platform module 30 can be customized according to user requirements. Figure 4 As shown, multiple mounting holes 31 can be evenly arranged on the test platform module 30, which can accommodate multiple chips under test of different mounting sizes (or a single-module infrared detector with chips under test) to meet various testing requirements.

[0065] Optionally, such as Figure 5As shown, the data acquisition module 40 includes at least one temperature measuring unit 41, which is set up in a one-to-one correspondence with the heating unit 22. The temperature measuring unit 41 collects real-time temperature data at its location.

[0066] For example, such as Figure 5 As shown, the data acquisition module 40 may include four temperature measurement units 41. The temperature measurement units 41 are used to test the real-time temperature data at their location and send the collected real-time temperature data to the control module 50.

[0067] For example, the temperature measuring unit 41 can measure the temperature resistance.

[0068] Optionally, the control module 50 can also receive real-time temperature data collected by all temperature measuring units 41, and control the heating temperature of the heating unit 22 corresponding to the temperature measuring unit 41 according to the real-time temperature data and the preset cooling rate. With this setting, this application can ensure the temperature uniformity at multiple locations on the test platform module.

[0069] Optionally, when the cold source module 10 is off, the control module 50 also dynamically controls the heating temperature of the heat source module based on the real-time temperature data and the preset heating rate, so as to raise the real-time temperature data to the second target value based on the preset heating rate.

[0070] For example, during the heating phase of the chip under test, with the cold source module 10 off, the control module 50 can receive real-time temperature data collected by the data acquisition module 40. Based on the real-time temperature data and the preset heating rate, the control module 50 calculates the required output temperature of the heat source module 20, and can then continuously and dynamically control the heating temperature of the heat source module 20. When the heating temperature of the heat source module 20 continuously and dynamically changes, the heat applied to the chip under test varies based on this preset heating rate.

[0071] It is understood that the control module 50 can calculate the required output temperature of the heat source module 20 based on real-time temperature data and preset heating rate, which can be achieved based on a preset program. This application will not elaborate on this in detail.

[0072] For example, as an embodiment, if the preset heating rate is 0.8K / min, the control module 50 can control the heating temperature of the heat source module 20 so that the temperature of the heat applied to the chip under test increases at a rate of 0.8K per minute, so as to gradually raise the test environment temperature of the chip under test to the second target value.

[0073] For example, the preset heating rate and the second target value can be customized according to user needs.

[0074] This application, through the configuration of a heat source module, a data acquisition module, and a control module, can precisely control the heating temperature of the heat source module, so that the heat applied to the chip under test varies based on a preset heating rate, and can achieve precise control of the preset heating rate.

[0075] As an example, assuming a first target value of 50K and a preset cooling rate of 0.8K / min, and a second target value of 300K and a preset heating rate of 0.8K / min, the working process of the temperature control device provided in this application can be as follows: In response to user commands, the heating temperature of the heat source module is set to 300K, the heat source module is turned on, and the cold source module is turned off. The real-time temperature data of the test platform module is initialized to the initial value (such as 300K) through the heat source module.

[0076] During the cooling phase, after the real-time temperature data of the test platform module is initialized to its initial value, the cold source module is activated, outputting cooling energy at a preset temperature (below 50K). At this time, the control module, using the real-time temperature data acquired by the data acquisition module and the preset cooling rate, controls the heating temperature of the heat source module, ensuring it outputs heat at a certain temperature. The heat output from the heat source module offsets the cooling energy from the cold source module, allowing the cooling energy output from the cold source module to gradually decrease based on the preset cooling rate until the real-time temperature data stabilizes at the first target value (e.g., 50K), completing the cooling process. At this point, the operator can begin testing the chip under test.

[0077] During the heating phase, after the operator completes the testing of the chip under test, the cold source module is turned off. At this time, the control module dynamically controls the heating temperature of the heat source module based on the real-time temperature data collected by the data acquisition module and the preset heating rate, so that the heat source module outputs heat with a certain temperature. This allows the temperature at the test platform module to gradually increase based on the preset heating rate until the real-time temperature data stabilizes at the second target value (e.g., 300K), at which point the heating process is complete.

[0078] According to another aspect of this application, a temperature control method is provided, which can be executed based on the temperature control device described above. Specifically, the temperature control method can be executed based on the control module described above.

[0079] According to the example embodiment, such as Figure 6 As shown, the temperature control method may include steps S100-S200.

[0080] In step S100, the control module acquires the real-time temperature data of the test environment collected by the data acquisition module.

[0081] In step S200, the control module dynamically controls the heating temperature of the heat source module based on the temperature data and the preset cooling rate, so as to reduce the real-time temperature data to the first target value based on the preset cooling rate.

[0082] For example, during the cooling phase of the chip under test, the control module can receive real-time temperature data collected by the data acquisition module. Based on the real-time temperature data and the preset cooling rate, the control module calculates the required output temperature of the heat source module, and can then continuously and dynamically control the heating temperature of the heat source module. While the heating temperature of the heat source module continuously and dynamically changes, the temperature of the thermally compensated cooling energy also changes dynamically in real time, ensuring that the temperature of the cooling energy applied to the chip under test varies based on the preset cooling rate.

[0083] It is understood that the control module can calculate the required output temperature of the heat source module based on real-time temperature data and preset cooling rate, which can be achieved based on a preset program. This application will not elaborate on this in detail.

[0084] For example, as an embodiment, if the preset cooling rate is 0.8K / min, the control module can control the heating temperature of the heat source module so that the temperature of the cooling applied to the chip under test decreases at a rate of 0.8K per minute, thereby gradually reducing the test environment temperature at the chip under test to the first target value.

[0085] This application, by configuring a heat source module, can buffer the cooling energy from the cold source module. Compared to traditional testing methods that directly apply cooling energy to the chip under test (DUT), this application can apply cooling energy uniformly and stably to the DUT. This application can avoid the problem of uneven cooling energy applied to the DUT, which could lead to performance damage due to stress.

[0086] Furthermore, this application, through the configuration of a heat source module, a data acquisition module, and a control module, can precisely control the heating temperature of the heat source module, ensuring that the heat output from the heat source module offsets the cooling output from the cold source module. This application can also control the temperature of the cooling output from the cold source module through thermal compensation, ensuring that the cooling applied to the chip under test varies based on a preset cooling rate, and enabling precise control of this preset cooling rate.

[0087] Optionally, such as Figure 6 As shown, the temperature control method may also include step S300.

[0088] In step S300, while the cold source module is off, the control module also dynamically controls the heating temperature of the heat source module based on the real-time temperature data and the preset heating rate, so as to raise the real-time temperature data to the second target value based on the preset heating rate.

[0089] For example, during the heating phase of the chip under test (DUT), with the cold source module off, the control module can receive real-time temperature data collected by the data acquisition module. Based on the real-time temperature data and the preset heating rate, the control module calculates the required output temperature of the heat source module, and can then continuously and dynamically control the heating temperature of the heat source module. With the heating temperature of the heat source module constantly changing dynamically, the heat applied to the DUT varies based on this preset heating rate.

[0090] It is understood that the control module can calculate the required output temperature of the heat source module based on real-time temperature data and preset heating rate, which can be achieved based on a preset program. This application will not elaborate on this in detail.

[0091] For example, as an embodiment, if the preset heating rate is 0.8K / min, the control module can control the heating temperature of the heat source module 20 so that the temperature of the heat applied to the chip under test increases at a rate of 0.8K per minute, so as to gradually raise the test environment temperature of the chip under test to the second target value.

[0092] For example, the preset heating rate and the second target value can be customized according to user needs.

[0093] This application, through the configuration of a heat source module, a data acquisition module, and a control module, can precisely control the heating temperature of the heat source module, so that the heat applied to the chip under test varies based on a preset heating rate, and can achieve precise control of the preset heating rate.

[0094] Finally, it should be noted that the above description is merely a preferred embodiment of this application and is not intended to limit this application. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions of the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A temperature control device for chip testing, characterized in that, include: The cold source module outputs cooling capacity at a preset temperature. A heat source module is connected to the cold source module on one side to heat the cold energy from the cold source module in order to provide thermal compensation for the cold energy. The test platform module is connected to the other side of the heat source module and is used to carry the chip under test and receive thermally compensated cold energy so as to control the test environment temperature at the chip under test through the thermally compensated cold energy. A data acquisition module, installed on the test platform module, acquires real-time temperature data of the test environment. The control module is electrically connected to the heat source module and the data acquisition module. Based on the real-time temperature data and the preset cooling rate, it dynamically controls the heating temperature of the heat source module to reduce the real-time temperature data to a first target value based on the preset cooling rate.

2. The temperature control device according to claim 1, characterized in that, The cold source module includes: The cold end is in contact with one side of the heat source module.

3. The temperature control device according to claim 1, characterized in that, The cold source module is a refrigeration unit.

4. The temperature control device according to claim 1, characterized in that, The heat source module includes: The heat-conducting platform is in contact with and connected to the cold source module; At least one heating unit is disposed on the heat-conducting platform.

5. The temperature control device according to claim 1, characterized in that, The test platform module includes: At least one mounting hole is provided, through which the chip under test is mounted on the test platform module.

6. The temperature control device according to claim 4, characterized in that, The data acquisition module includes: At least one temperature measuring unit is provided, and the temperature measuring unit is set up in a one-to-one correspondence with the heating unit. The temperature measuring unit collects real-time temperature data at its location.

7. The temperature control device according to claim 1, characterized in that, When the cold source module is off, the control module also dynamically controls the heating temperature of the heat source module based on the real-time temperature data and the preset heating rate, so as to increase the real-time temperature data to a second target value based on the preset heating rate.

8. A temperature control method for chip testing, characterized in that, The temperature control method is performed by the temperature control device according to any one of claims 1-7, and the temperature control method includes: Acquire the real-time temperature data of the test environment temperature collected by the data acquisition module; Based on the temperature data and the preset cooling rate, the heating temperature of the heat source module is dynamically controlled to reduce the real-time temperature data to a first target value based on the preset cooling rate.

9. The temperature control method according to claim 8, characterized in that, The temperature control method also includes: With the cold source module off, the heating temperature of the heat source module is dynamically controlled based on the real-time temperature data and the preset heating rate, so as to raise the real-time temperature data to a second target value based on the preset heating rate.

10. A chip manufacturing process system, characterized in that, Includes the temperature control device as described in any one of claims 1-7.

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