A mute switch and vehicle

Abstract

The application discloses a mute switch and a vehicle, and belongs to the field of automobile interior switches. The mute switch comprises a micro switch, a sound-absorbing shell, an outer shell and a button. The micro switch is installed on a PCBA board; the sound-absorbing shell is arranged outside the micro switch, and a sound guide channel is arranged in the sound-absorbing shell; the outer shell is arranged outside the sound-absorbing shell, and a wedge structure is arranged between the inner wall of the outer shell and the outer wall of the sound-absorbing shell; and the button is slidably connected to the outer shell. The sound guide channel of the sound-absorbing shell and the wedge structure of the outer shell cooperate with each other, so that the sound wave generated during the operation of the micro switch is refracted, diffracted and dissipated multiple times during the propagation process, the sound generated during the operation of the switch is significantly reduced, and the quietness in the vehicle and the user interaction experience are improved.

Description

Technical Field

[0001] This invention relates to the field of vehicle interior technology, and in particular to a mute switch and a vehicle. Background Technology

[0002] Interior switches, as core components of in-vehicle human-machine interaction, are widely used in scenarios such as window control, air conditioning adjustment, and seat adjustment. Their quiet operation directly affects the user experience of drivers and passengers. Currently, most existing interior switches use a cavity structure with a smooth inner wall. They typically have microswitches or conductive rubber built-in as triggering components. When pressed or toggled, the sound of the triggering component is directly transmitted to the outside. Furthermore, the sound is amplified after reflection and superposition within the cavity, resulting in a noticeable and abrupt noise during switch operation, indicating poor quietness.

[0003] With the rapid development of the new energy vehicle industry, the overall level of NVH (noise, vibration, and harshness) in vehicles has been improved, and the requirements of drivers and passengers for in-vehicle quietness have become increasingly stringent. Especially in pure electric vehicles, since the operating noise of the drive motor is much lower than that of traditional fuel engines, the switching noise, which was originally masked by engine noise, is further highlighted, becoming one of the shortcomings affecting the driving experience. Therefore, developing a vehicle-grade silent switch structure that can effectively reduce operating noise, improve quietness, and meet the quality requirements of high-end new energy vehicles has become an urgent technical problem to be solved in this field. Summary of the Invention

[0004] Therefore, this invention proposes a mute switch that can be applied to vehicles.

[0005] To address the aforementioned technical problems, the present invention provides the following technical solution: A silent switch includes: a micro switch mounted on a PCBA board; a sound-absorbing housing covering the outside of the micro switch, the sound-absorbing housing having a plurality of sound-conducting channels inside; an outer shell covering the outside of the sound-absorbing housing, the inner wall of the outer shell having a plurality of wedge structures between the inner wall of the outer shell and the outer wall of the sound-absorbing housing; and a button slidably connected to the outer shell, the button having a trigger portion that cooperates with the micro switch.

[0006] In some embodiments of the present invention, the sound-absorbing housing includes a sound-absorbing top wall disposed opposite to the surface of the micro switch and a sound-absorbing peripheral wall surrounding the side wall of the micro switch. The sound-guiding channel is constructed as a plurality of sound-guiding holes disposed on the sound-absorbing top wall and the sound-absorbing peripheral wall, and at least some of the sound-guiding holes are interconnected.

[0007] In some embodiments of the present invention, the sound guiding channel is provided with a spiral pattern or a concave-convex structure.

[0008] In some embodiments of the present invention, at least a portion of the sound guiding channel is a bent channel, wherein the inlet of the sound guiding channel is located on the side of the sound-absorbing housing near the micro switch, and the outlet of the sound guiding channel extends in a direction approximately parallel to the surface of the button.

[0009] In some embodiments of the present invention, the wedge structure includes a wedge-shaped wedge, the root of which is connected to the inner side of the top wall of the housing, and the tip of which extends toward the PCB board side.

[0010] In some embodiments of the present invention, the top wall of the outer casing has a step that divides the top wall into an inner first portion and an outer second portion, the outer contour of the first portion covering the outer contour of the sound-absorbing casing.

[0011] In some embodiments of the present invention, the wedge-shaped wedge located on the first part of the top wall of the outer casing extends to the sound-absorbing top wall near the sound-absorbing housing, and the wedge-shaped wedge located on the second part of the top wall of the outer casing extends to the PCB board.

[0012] In some embodiments of the present invention, the apex angle of the wedge-shaped wedge located in the first part of the top wall is between 15° and 20°, and the height of the wedge-shaped wedge is between 5mm and 10mm; the apex angle of the wedge-shaped wedge located in the second part of the top wall is between 25° and 30°, and the height of the wedge-shaped wedge is between 7 and 15mm.

[0013] In some embodiments of the present invention, the arrangement density of the wedge-shaped wedges located in the first part of the top wall is less than the arrangement density of the wedge-shaped wedges located in the second part of the top wall.

[0014] The present invention also provides a vehicle including the mute switch described in any of the above embodiments.

[0015] The technical solution of the present invention has the following technical effects compared with the prior art: The silent switch and vehicle provided by this invention utilize a double-layer structure design of a sound-absorbing shell and an outer shell, along with the synergistic effect of a sound-guiding channel and a wedge structure. In terms of sound wave source control, the sound-absorbing shell directly covers the outside of the microswitch, capturing the impact sound generated by the microswitch in the first instance. The sound-guiding channel ensures that the sound waves propagate along a predetermined path, avoiding disordered sound diffusion. Regarding sound wave propagation path control, the wedge structure on the inner wall of the outer shell forms a highly efficient sound-absorbing barrier, forcing the sound waves to enter the wedge gaps for multiple refractions and diffractions. By setting wedges of different angles, heights, and densities in different areas, comprehensive matching of sound wave frequency and spatial distribution is achieved, allowing sound energy to gradually dissipate during propagation. Attached Figure Description

[0016] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, which will help to understand the purpose and advantages of the present invention, wherein: Figure 1 This is a schematic diagram of the structure of a mute switch according to a specific embodiment of the present invention; Figure 2 An exploded view of a mute switch provided in a specific embodiment of the present invention; Figure 3 This is a schematic diagram of a specific embodiment of the housing of the silent switch of the present invention; Figure 4 This is a schematic diagram of a specific embodiment of the sound-absorbing housing in the silent switch of the present invention. Detailed Implementation

[0017] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0019] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0020] Furthermore, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0021] like Figure 1 , Figure 2The embodiment of the present invention provided a silent switch, which mainly includes: a button 10, a housing 20, a sound-absorbing housing 30, a micro switch 40, a PCBA board 50, and a mounting base 60.

[0022] Specifically, the micro switch 40, serving as the sound-generating unit of the entire switch, is soldered and fixed to the PCBA board 50, forming an electrical connection with it. The PCBA board 50 is mounted on the mounting base 60, which provides support and protection for the entire circuit assembly. The mounting base 60 and the outer casing 20 are fixedly connected by clips, screws, or other fastening methods, together forming the complete outer casing structure of the switch.

[0023] The sound-absorbing housing 30 is fitted over the outside of the micro switch 40, completely enclosing the micro switch 40 within its internal space. The sound-absorbing housing 30 is made of a material with good sound-absorbing properties. Several sound-guiding channels 30a are provided inside the sound-absorbing housing 30, penetrating the wall of the housing 30, to guide the sound waves generated when the micro switch 40 is operated along a predetermined path.

[0024] The outer shell 20 covers the outside of the sound-absorbing housing 30, completely housing the sound-absorbing housing 30 within its internal cavity. The outer shell 20 is made of a plastic material with a certain structural strength through injection molding, such as ABS plastic or PC / ABS alloy. Several wedge-shaped structures are provided between the inner wall of the outer shell 20 and the outer wall of the sound-absorbing housing 30. These wedge-shaped structures are integrally formed and connected to the inner wall of the outer shell 20 at their base, while their tips extend towards the sound-absorbing housing 30.

[0025] Button 10 is slidably connected to housing 20 and is typically located at the top opening of housing 20. Button 10 includes a button body 11 and a trigger portion 12 located below the button body 11, which corresponds to the contact position of micro switch 40. When the user presses button body 11, trigger portion 12 moves downward, contacts the contact of micro switch 40, and triggers the switch to operate, producing a knocking sound.

[0026] In this embodiment, the microswitch 40 is sequentially encased by the sound-absorbing housing 30 and the outer housing 20, forming a double-layer sound insulation structure. When the microswitch 40 is triggered and generates an impact sound, the sound wave first enters the sound-absorbing housing 30. Part of the sound wave directly enters the sound-guiding channel 30a on the sound-absorbing housing 30 and propagates within the channel; the other part of the sound wave passes through the wall of the sound-absorbing housing 30 and propagates outward to the inner wall of the outer housing 20. When the sound wave reaches the inner wall of the outer housing 20, it encounters the wedge structure disposed thereon. The wedge structure, through its special wedge geometry, causes the sound wave to undergo multiple refractions and diffractions on its surface, forcing the sound wave to propagate repeatedly inside the outer housing 20, thereby lengthening the propagation path of the sound wave and increasing the chance of sound energy dissipation. At the same time, the sound-guiding channel 30a on the sound-absorbing housing 30 also causes the sound wave to undergo multiple reflections and frictions within the channel, further dissipating sound energy. Through the synergistic effect of the sound-absorbing housing 30 and the outer housing 20, the sound generated by the micro switch 40 is controlled from both the sound source and the propagation path, ultimately achieving a significant reduction in the sound of the switch operation and an optimization of the sound quality.

[0027] Compared with the traditional smooth inner wall cavity structure, the silent switch in this embodiment can effectively avoid the amplification and resonance of sound in the cavity, making the switch operation sound change from crisp and thin to more deep and soft, significantly improving the quietness of the vehicle interior and the user interaction experience.

[0028] Specifically, in one alternative implementation, such as Figure 4 As shown, the sound-absorbing housing 30 includes a sound-absorbing top wall 31 and a sound-absorbing peripheral wall 32. The sound-absorbing top wall 31 is positioned directly opposite the surface of the micro switch 40, i.e., above the micro switch 40, corresponding to the trigger direction of the button 10. The sound-absorbing peripheral wall 32 surrounds the sidewall of the micro switch 40, forming an annular sidewall structure that completely encloses the micro switch 40. The sound-guiding channel 30a is constructed as a plurality of sound-guiding holes on the sound-absorbing top wall 31 and the sound-absorbing peripheral wall 32. The porosity of the sound-guiding holes is between 40% and 70%, and at least some of the sound-guiding holes are interconnected to form a sound-guiding channel, guiding sound waves to propagate in a predetermined direction. Since the sound-absorbing top wall 31 is directly opposite the impact point of the micro switch 40, this is the area where sound wave energy is most concentrated. The strongest sound waves preferentially enter the sound-guiding channel 30a of the sound-absorbing top wall 31, achieving the most efficient sound energy guidance and dissipation.

[0029] Specifically, when the microswitch 40 is triggered, the upward-propagating sound wave first encounters the sound-guiding channel 30a on the sound-absorbing top wall 31. Most of the sound energy is immediately guided into the channel for dissipation, reducing the sound wave energy that diffuses in all directions. Simultaneously, the sound-absorbing peripheral wall 32 absorbs and blocks the lateral sound waves, forming a comprehensive sound energy capture network. This partitioned design allows the sound-absorbing housing 30 to utilize its internal space more efficiently, achieving targeted processing of sound waves from different directions, thereby further improving the overall noise reduction effect.

[0030] Specifically, in one optional embodiment, the sound guiding channel 30a is provided with a spiral pattern or an uneven structure. These microstructures can be formed directly during mold forming, or they can be formed through subsequent machining or laser etching.

[0031] The spiral structure extends in a spiral shape along the inner wall of the sound-conducting channel 30a, resembling a thread. When sound waves propagate within the channel, the spiral pattern causes the sound waves to continuously change their propagation direction, resulting in rotation and diffraction, significantly increasing the actual propagation path length within the channel. Simultaneously, friction between the sound waves and the spiral surface generates viscous loss, converting some sound energy into heat energy. The uneven structure, on the other hand, consists of a series of tiny, irregular protrusions and depressions on the inner wall of the channel 30a, forming a rough surface. These uneven structures cause multiple diffuse reflections of the sound waves within the channel, disrupting the regular propagation pattern and similarly achieving the effects of extending the propagation path and increasing frictional loss.

[0032] By incorporating a spiral or uneven structure within the sound-conducting channel 30a, the originally smooth inner wall of the channel is transformed into a rough surface with acoustic properties. When sound waves enter the sound-conducting channel 30a, they no longer pass directly in a straight line, but instead undergo complex refraction, diffraction, and reflection phenomena within the channel. This design effectively extends the actual propagation path of the sound waves without increasing the channel length, while simultaneously increasing the contact area and friction opportunities between the sound energy and the channel wall, thereby significantly improving the sound energy dissipation efficiency.

[0033] Specifically, in one optional embodiment, at least a portion of the sound-conducting channel 30a is designed as a bent channel, meaning the channel's extension path is not straight but has one or more bends. The inlet of the bent channel is located on the side of the sound-absorbing housing 30 near the micro switch 40, specifically on the inner surface of the sound-absorbing top wall 31, directly facing the impact point of the micro switch 40. The outlet of the bent channel extends approximately parallel to the surface of the button 10, meaning the channel outlet faces to the side rather than upwards. This significantly increases the propagation path length of sound waves within the channel. Compared to a straight channel, sound waves in a bent channel require multiple directional changes to reach the outlet, each resulting in energy loss. Furthermore, the side-facing outlet ensures that the sound waves exiting the channel no longer propagate directly towards the button 10 but are guided to the lateral spaces inside the switch. These lateral spaces typically contain more sound-absorbing structures, such as the sound-absorbing peripheral wall 32 or wedge structures on the side walls of the housing 20, which further absorb residual sound energy.

[0034] This embodiment achieves precise control over the direction of sound wave propagation by designing the sound guiding channel 30a as a bent structure and changing its exit direction. The sound waves no longer simply propagate vertically upwards to the button area, but are forcibly guided to the lateral sound-absorbing area, effectively preventing sound from directly reaching the user's ear. This directional sound guiding design, combined with bending losses within the channel, reduces the perceptibility of the switch operation sound from both the propagation path and direction control dimensions. In practical implementation, the bending angle and number of bends in the bent channel can be adjusted according to the actual spatial layout and acoustic requirements. For example, various forms such as 90-degree bends, U-shaped bends, or S-shaped bends can be used to achieve optimal sound wave guidance and dissipation effects.

[0035] Specifically, in one optional embodiment, the wedge structure disposed on the inner wall of the outer casing 20 is a wedge-shaped wedge 22. The wedge-shaped wedge 22 is shaped like a gradually tapering wedge with a triangular cross-section. The root of the wedge-shaped wedge 22 is connected to the inner side of the top wall of the outer casing 20, that is, integrally formed and connected with the top wall of the outer casing 20. The tip of the wedge-shaped wedge 22 extends towards the PCBA board 50, that is, it extends downward from the top wall, pointing towards the internal space of the switch. When sound waves propagate to the wedge-shaped wedge 22 region, the impedance of the sound wave propagation medium also gradually changes due to the gradual decrease in the cross-section of the wedge from the root to the tip. This gradual impedance characteristic allows the sound waves to smoothly enter the interior of the wedge structure, reducing the reflection of sound waves on the wedge surface. The sound waves entering the wedge gap will be repeatedly reflected between adjacent wedges, and each reflection will consume some energy until the sound energy is completely dissipated.

[0036] By placing a wedge-shaped wedge 22 on the top wall of the housing 20 with its tip extending towards the PCBA board 50, a vertical sound-absorbing barrier is formed. This arrangement makes full use of the space at the top of the housing 20, ensuring that sound waves inevitably encounter the wedge-shaped wedge 22 when propagating upwards to the top wall of the housing 20. The gradually varying impedance characteristics of the wedge-shaped wedge 22 effectively reduce the reflection of sound waves at the top wall, forcing the sound waves to enter the wedge gaps for multiple reflections and dissipation. Compared with a traditional flat top wall, this wedge-shaped wedge 22 structure can significantly reduce the reflection intensity of sound waves at the top, thereby reducing the formation and amplification effect of standing waves in the cavity. At the same time, the extension direction of the wedge-shaped wedge 22 towards the PCBA board 50 is also consistent with the main propagation direction of the sound waves, allowing the sound waves to penetrate deeper into the wedge structure and achieve more complete energy dissipation.

[0037] Specifically, in one alternative implementation, such as Figure 3As shown, the top wall 21 of the outer casing 20 has a stepped structure, which divides the top wall 21 into an inner first part 21a and an outer second part 21b. The first part 21a is located in the central region of the top wall 21, and its outer contour covers the outer contour of the sound-absorbing housing 30. That is, the projected area of ​​the first part 21a is approximately equal to or slightly larger than the top projected area of ​​the sound-absorbing housing 30, ensuring that the sound-absorbing housing 30 can be completely covered by the first part 21a. The second part 21b is located around the first part 21a and is the annular outer peripheral region of the top wall 21.

[0038] This stepped structure creates two distinct areas on the top wall 21 of the outer casing 20. The first part 21a is relatively higher and closer to the sound-absorbing top wall 31 of the sound-absorbing housing 30; the second part 21b is relatively lower and farther from the top wall of the sound-absorbing housing 30. The transition area of ​​the steps can be a vertical wall or an inclined slope.

[0039] This embodiment divides the top wall of the outer shell 20 into two functional areas by setting a stepped structure. The first part 21a is opposite to the top wall of the sound-absorbing shell 30, forming a relatively small gap between them, and mainly handles sound waves directly transmitted from the top of the sound-absorbing shell 30. The second part 21b mainly handles sound waves propagating laterally from the sound-absorbing shell 30 and sound waves that continue to propagate after being reflected by the first part 21a. This partitioned design allows the outer shell 20 to adopt more targeted sound absorption strategies according to different paths and directions of sound wave propagation, improving the acoustic adaptability of the overall structure. At the same time, the stepped structure itself also increases the three-dimensionality and structural complexity of the top wall of the outer shell 20, which helps to break the regular reflection path of sound waves and further suppress resonance phenomena.

[0040] Specifically, the wedge-shaped wedge 22 located in the first part 21a of the top wall extends to a position close to the sound-absorbing top wall 31 of the sound-absorbing housing 30. That is, the distance between the tip of the wedge-shaped wedge 22 extending downwards from the first part 21a and the sound-absorbing top wall 31 of the sound-absorbing housing 30 is small, leaving only a necessary assembly gap to ensure that they do not interfere with each other during assembly. The wedge-shaped wedge 22 located in the second part 21b of the top wall extends to a position close to the PCBA board 50. Because the wedge extending downwards from the second part 21b has a longer extension path, its tip can reach a position closer to the bottom of the switch, i.e., close to the height of the PCBA board 50.

[0041] The first wedge, 21a, primarily covers the upper space of the switch, near the sound-absorbing top wall 21 of the sound-absorbing housing 30, effectively capturing and processing sound waves emitted from the top of the sound-absorbing housing 30. The second wedge, 21b, covers the lower middle space of the switch, extending to the area near the PCBA board 50, capturing sound waves emitted from the sound-absorbing side wall 32 of the sound-absorbing housing 30, as well as sound waves that continue to propagate downwards after multiple reflections within the switch. This full vertical coverage design effectively covers the entire internal space of the switch with the wedge structure, ensuring that sound waves, regardless of their propagation height, encounter the wedge structure and dissipate energy. Simultaneously, a height difference is formed between the wedge-shaped wedge 22 near the first part 21a of the sound-absorbing housing 30 and the wedge-shaped wedge 22 near the second part 21b of the PCBA board 50. This staggered arrangement helps break the standing wave pattern that may form in the vertical direction, further suppressing resonance.

[0042] The apex angle of the wedge-shaped wedge 22 is a key parameter affecting its sound absorption performance. A wedge with a smaller apex angle has a gentler cross-sectional change and a smoother impedance change, which can more effectively reduce sound wave reflection and is suitable for handling higher frequency sound waves. Although a wedge with a larger apex angle has a relatively more drastic impedance change, it can cover a wider frequency range and has a better absorption effect on low frequency sound waves. Specifically, in an optional embodiment, the apex angle of the wedge-shaped wedge 22 located in the first part 21a of the top wall is controlled between 15° and 20°. The apex angle of the wedge-shaped wedge 22 located in the second part 21b of the top wall is controlled between 25° and 30°.

[0043] By setting wedges with different apex angles in different areas, differentiated processing of sound wave frequencies is achieved. The first wedge, 21a, is located near the top wall of the sound-absorbing housing 30 and mainly processes the sound waves propagating directly upwards from the microswitch 40. This part of the sound wave has the strongest energy and is mainly composed of mid-to-high frequency components. Therefore, a wedge with a smaller apex angle (15°-20°) is used to minimize reflection and allow the sound waves to smoothly enter the wedge gap for dissipation. The second wedge, 21b, is located in the lower middle part of the switch and mainly processes the residual sound waves after multiple reflections. The energy of this part of the sound wave has been attenuated, and the frequency components may be more complex. Therefore, a wedge with a larger apex angle (25°-30°) is used to cover a wider frequency range and comprehensively absorb the residual sound waves. This zoned design based on the sound wave frequency characteristics allows the wedge structure to adopt the optimal absorption strategy for the sound wave characteristics of different areas, thereby comprehensively improving the overall sound absorption effect.

[0044] The height of the wedge-shaped wedge 22 is also an important parameter affecting its sound absorption performance. Generally speaking, the larger the wedge height, the lower the effective absorption frequency limit, and the better the absorption effect for lower frequency sound waves. At the same time, a larger wedge also provides a longer sound wave propagation path, increasing the chance of sound energy dissipation. Specifically, in one embodiment, the height of the wedge-shaped wedge 22 located in the first part 21a of the top wall is controlled between 5mm and 10mm. The height of the wedge-shaped wedge 22 located in the second part 21b of the top wall is controlled between 7mm and 15mm.

[0045] The wedge height of the first part 21a is relatively small (5mm-10mm), mainly because the distance between the first part 21a and the top wall of the sound-absorbing shell 30 is relatively small, resulting in limited space. Simultaneously, the sound waves processed by the first part 21a are primarily mid-to-high frequencies, and the relatively small wedge height is sufficient to meet the absorption requirements of these frequencies. The wedge height of the second part 21b is relatively large (7mm-15mm). This is partly because the space in the location of the second part 21b is more ample, allowing for a taller wedge structure; and partly because the second part 21b needs to process residual sound waves after multiple reflections, which may contain some relatively low-frequency components. The larger wedge height helps to effectively absorb these sound waves. This highly differentiated design based on spatial conditions and sound wave characteristics allows the wedge structure to achieve optimal sound absorption performance within a limited space.

[0046] Specifically, the arrangement of the wedge-shaped wedges 22 matches the shape of the outer casing 20. In one optional embodiment, when the inner top wall of the outer casing 20 is a circular structure, the wedge-shaped wedges 22 are arranged concentrically. That is, with the center of the top wall of the outer casing 20 as the center, the wedge-shaped wedges 22 are arranged in a ring along circles of different radii. In the first part 21a and the second part 21b of the top wall, the wedge-shaped wedges 22 are arranged in a concentric circle manner. The concentric circle arrangement enables the wedge structure to achieve uniform omnidirectional coverage in the planar direction. No matter which direction the sound wave is incident from, it can meet the radially arranged wedges, avoiding directional blind spots. At the same time, the concentric circle arrangement also matches the propagation characteristics of the sound wave spreading from the central microswitch 40 to the surrounding areas, allowing the sound wave to smoothly enter the wedge gaps in each radial direction. In another embodiment, when the inner top wall of the outer shell 20 is a square structure, a number of wedge-shaped wedges 22 are arranged symmetrically in four groups with the center line of the square top wall as the central axis, and each group of wedge-shaped wedges 22 is arranged in a straight line.

[0047] Meanwhile, the wedge-shaped wedges 22 located in the first part 21a of the top wall have a lower arrangement density than those located in the second part 21b of the top wall. Arrangement density refers to the number of wedges per unit area or the spacing between wedges. The lower the density, the larger the spacing between wedges; the higher the density, the smaller the spacing between wedges, resulting in a more compact arrangement. The first part 21a has a lower wedge density and a relatively larger spacing, mainly because the first part 21a is close to the top wall of the sound-absorbing housing 30, and the gap between them is small. An excessively high density may lead to poor airflow or assembly difficulties. At the same time, sound waves still have strong directionality when propagating in the first part 21a, and an appropriate spacing helps guide the sound waves smoothly into the subsequent sound-absorbing area. The second part 21b has a higher wedge density and a more compact arrangement because the second part 21b has more space to arrange more wedges. Also, because the sound waves that the second part 21b needs to process are residual sound waves after multiple reflections, and their propagation directions are already relatively chaotic, the dense wedge arrangement ensures that no matter which direction the sound waves propagate from, they can quickly encounter and be absorbed by the wedges. This density gradient design allows the wedge structure to achieve optimal space utilization and sound wave capture efficiency in different areas.

[0048] This invention also provides a specific embodiment of a vehicle, which includes the mute switch described in any of the above embodiments. The mute switch can be applied to various interior switch locations in a vehicle, such as window control switches, seat adjustment switches, door lock switches, center console buttons, etc. By using the mute switch of this application in a vehicle, the acoustic quality of the vehicle interior can be significantly improved, the auditory interference of switch sounds to passengers can be reduced, and a more comfortable in-vehicle atmosphere can be created.

[0049] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the scope of protection of this invention.

Claims

1. A mute switch, characterized in that, include: Micro switches are mounted on PCBA boards; A sound-absorbing housing is provided on the outside of the micro switch, and the sound-absorbing housing is provided with several sound-conducting channels. An outer shell is provided on the outside of the sound-absorbing housing, and a number of wedge structures are provided between the inner wall of the outer shell and the outer wall of the sound-absorbing housing; A button is slidably connected to the housing, and the button has a trigger part that cooperates with the micro switch.

2. A mute switch according to claim 1, characterized in that, The sound-absorbing housing includes a sound-absorbing top wall facing the surface of the micro switch and a sound-absorbing peripheral wall surrounding the side wall of the micro switch. The sound-guiding channel is constructed as a plurality of sound-guiding holes provided on the sound-absorbing top wall and the sound-absorbing peripheral wall, and at least some of the sound-guiding holes are interconnected.

3. A mute switch according to claim 1, characterized in that, The sound guiding channel is provided with a spiral pattern or a concave-convex structure.

4. A mute switch according to claim 1, characterized in that, At least part of the sound guiding channel is a bent channel, wherein the entrance of the sound guiding channel is located on the side of the sound-absorbing housing near the micro switch, and the outlet of the sound guiding channel extends in a direction that is approximately parallel to the surface of the button.

5. A mute switch according to claim 1, characterized in that, The wedge structure includes a wedge-shaped wedge, the root of which is connected to the inner side of the top wall of the housing, and the tip of which extends toward the PCB board side.

6. A mute switch according to claim 5, characterized in that, The top wall of the outer casing has a step that divides the top wall into an inner first part and an outer second part, the outer contour of the first part covering the outer contour of the sound-absorbing housing.

7. A mute switch according to claim 6, characterized in that, The wedge-shaped wedge located on the first part of the top wall of the outer casing extends to the sound-absorbing top wall near the sound-absorbing housing, and the wedge-shaped wedge located on the second part of the top wall of the outer casing extends to the PCB board.

8. A mute switch according to claim 7, characterized in that, The wedge-shaped wedge located in the first part of the top wall has an apex angle between 15° and 20° and a wedge-shaped wedge height between 5mm and 10mm; the wedge-shaped wedge located in the second part of the top wall has an apex angle between 25° and 30° and a wedge-shaped wedge height between 7 and 15mm.

9. A mute switch according to claim 7, characterized in that, The arrangement density of the wedge-shaped wedges located in the first part of the top wall is less than the arrangement density of the wedge-shaped wedges located in the second part of the top wall.

10. A vehicle, characterized in that, Includes the mute switch as described in any one of claims 1-9.

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